Display device and manufacturing method thereof

Abstract

The invention discloses a display device and a manufacturing method thereof. The manufacturing method of the display device includes the steps of: preparing a substrate including a first region in which a display layer including a plurality of light emitting elements is arranged and a second region surrounding the first region; and arranging an optical functional layer on the display layer, the optical functional layer comprises a light-transmitting part which is at least partially overlapped with the plurality of light-emitting elements, and a light-blocking part which at least partially surrounds the light-transmitting part; the alignment mark is formed on the light blocking part and is adjacent to the boundary of the first region and the second region; and the groove extends along the boundary of the first region and the second region.

Description

Technical Field

[0001] Embodiments of the present invention relate to a display device and a method for manufacturing the display device, and more particularly, to a display device including a structure capable of preventing an alignment mark from being blocked during cutting and a method for manufacturing the display device. Background Art

[0002] A display device is a device that visually displays data. The display device can be used as a display for small products such as mobile phones, or as a display for large products such as televisions. The display device includes a plurality of pixels that receive electrical signals and emit light to display an image to the outside. Each pixel includes a display element, for example, in the case of an organic light-emitting display device, an organic light-emitting diode (OLED) is included as a display element.

[0003] In order to manufacture a display device, a plurality of layers constituting the display device may be stacked on a substrate and then cut into a predetermined shape to be manufactured. The cutting process may utilize a laser. In order to cut into a desired shape, one of the plurality of layers arranged on the substrate may form an alignment mark for guiding the laser. Summary of the invention

[0004] When laser cutting is performed, fume may be generated in a part of the layer, and these fume particles may move along the bubble layer formed between the layers arranged on the display device and cover the alignment mark.

[0005] An object of the embodiments of the present invention is to provide a display device including a structure capable of blocking the phenomenon that an alignment mark is blocked by smoke and a method for manufacturing the display device. However, these technical issues are exemplary and the scope of the present invention is not limited thereto.

[0006] According to one aspect of the present invention, there is provided a method for manufacturing a display device, the method comprising the following steps: preparing a substrate, the substrate comprising a first area and a second area surrounding the first area, wherein a display layer comprising a plurality of light-emitting elements is arranged on the first area of ​​the substrate; and arranging an optical functional layer on the display layer, the optical functional layer comprising a light-transmitting portion at least partially overlapping with the plurality of light-emitting elements, a light-blocking portion at least partially surrounding the light-transmitting portion, an alignment mark formed on the light-blocking portion adjacent to a boundary between the first area and the second area, and a groove extending along the boundary between the first area and the second area.

[0007] In one embodiment, the light blocking portion of the optical functional layer may include a light blocking layer including a plurality of openings overlapping the plurality of light emitting elements, and the light transmitting portion of the optical functional layer may include a plurality of color filters arranged in the plurality of openings of the light blocking layer.

[0008] In one embodiment, the optical function layer may include a plurality of color filters that transmit light of different colors from each other, and the light blocking portion may include at least two overlapping portions of the plurality of color filters.

[0009] In an embodiment, the alignment mark may include a plurality of openings arranged to be spaced apart from each other in a direction, and a shape of one of the plurality of openings may be different from a shape of another of the plurality of openings on a plane.

[0010] In one embodiment, the plurality of openings of the alignment mark may penetrate the optical function layer.

[0011] In one embodiment, the method for manufacturing the display device may further include the following step: forming a reflective pattern at least partially overlapping with the plurality of openings of the alignment mark.

[0012] In one embodiment, the manufacturing method of the display device may further include the following steps: arranging a first adhesive layer, an impact absorbing layer and a second adhesive layer in sequence on the optical functional layer; and cutting the second adhesive layer, the impact absorbing layer, the first adhesive layer, the display layer and the substrate along a path adjacent to the alignment mark of the optical functional layer.

[0013] In one embodiment, a portion of the first adhesive layer may be disposed in the groove of the optical function layer, and a bubble layer may be formed under the portion of the first adhesive layer.

[0014] In one embodiment, in the cutting step, the path may overlap with the boundaries of the first area and the second area.

[0015] In one embodiment, the cutting step may include the following step: making a laser incident on the second adhesive layer, the impact absorbing layer, the first adhesive layer, the display layer, and the substrate in this order.

[0016] In one embodiment, in the cutting step, the impact absorbing layer may be cut before the second adhesive layer is cut and before the first adhesive layer is cut.

[0017] In one embodiment, at least a portion of the smoke generated during the cutting of the impact absorbing layer may be located in the groove of the optical functional layer.

[0018] According to one aspect of the present invention, a display device is provided, comprising: a substrate, comprising a display area on which a plurality of light-emitting elements are arranged and a non-display area surrounding the display area; a touch layer arranged on the substrate; and an optical functional layer arranged on the touch layer and comprising a light-transmitting portion at least partially overlapping with the plurality of light-emitting elements, a light-blocking portion at least partially surrounding the light-transmitting portion, a step difference portion arranged at an edge of the non-display area, and an alignment mark arranged in the non-display area adjacent to the step difference portion.

[0019] In one embodiment, the light blocking portion of the optical functional layer may include a light blocking layer including a plurality of openings overlapping the plurality of light emitting elements, and the light transmitting portion of the optical functional layer may include a plurality of color filters arranged in the plurality of openings of the light blocking layer.

[0020] In one embodiment, the optical function layer may include a plurality of color filters that transmit light of different colors from each other, and the light blocking portion may include at least two overlapping portions of the plurality of color filters.

[0021] In one embodiment, the alignment mark may include a plurality of openings arranged in the light blocking portion and spaced apart from each other along a direction, and a shape of one of the plurality of openings may be different from another shape of the other openings on a plane.

[0022] In one embodiment, the plurality of openings of the alignment mark may penetrate the optical function layer.

[0023] In one embodiment, the display device may further include: a reflective pattern at least partially overlapping the plurality of openings of the alignment mark.

[0024] In one embodiment, the display device may further include: a first adhesive layer arranged on the optical function layer in a manner of covering an edge of the optical function layer adjacent to the step difference portion, and a portion of the first adhesive layer is located within the step difference portion.

[0025] In one embodiment, at the step difference portion, the first adhesive layer and the touch layer may be separated from each other.

[0026] According to an embodiment of the present invention constructed as described above, a display device and a method for manufacturing the display device can be provided in which smoke is located in a groove formed in a light blocking layer and an alignment mark is formed at a position separated from the groove so that the alignment mark is not blocked by the smoke. Of course, the scope of the present invention is not limited to this effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Figure 1 FIG. 1 is a plan view schematically showing a mother substrate of a display device according to an embodiment of the present invention.

[0028] Figure 2 is a cross-sectional view schematically showing a display device according to an embodiment of the present invention, along Figure 1 Cross-sectional view along line II-II'.

[0029] Figure 3 is a plan view showing a portion of a mother substrate of a display device according to an embodiment of the present invention, and is an enlarged view showing Figure 1 Floor plan of Area III.

[0030] Figure 4 is a cross-sectional view showing a portion of a mother substrate of a display device according to an embodiment of the present invention, taken along Figure 3 Cross-sectional view of line IV-IV'.

[0031] Figure 5a to Figure 5f 1 is a cross-sectional view showing states in process steps of a method for manufacturing a display device according to an embodiment of the present invention.

[0032] Figures 6a to 6e It is a perspective view showing states in process steps of a method for manufacturing a display device according to an embodiment of the present invention.

[0033] Figure 7 1 is a plan view showing states in process steps of a method for manufacturing a display device according to an embodiment of the present invention.

[0034] Figure 8 FIG. 1 is a plan view schematically showing a display device manufactured by using a method for manufacturing a display device according to an embodiment of the present invention.

[0035] Fig. 9 is a cross-sectional view showing a portion of a display device manufactured by using a method for manufacturing a display device according to an embodiment of the present invention.

[0036] Fig.10 This is a perspective view showing an enlarged portion of a display device manufactured by using a method for manufacturing a display device according to an embodiment of the present invention.

[0037] Fig.11 is a plan view showing a portion of a mother substrate of a display device according to an embodiment of the present invention, and is an enlarged view showing Figure 1 An example of a floor plan of Region III.

[0038] Fig.12a is a cross-sectional view showing a portion of a mother substrate of a display device according to an embodiment of the present invention, taken along Fig.11 A cross-sectional view of the mother substrate taken along line XII-XII'.

[0039] Figure 12b is a cross-sectional view showing a portion of a mother substrate of a display device according to an embodiment of the present invention, taken along Fig.11 FIG. 1 is a cross-sectional view of another example of the mother substrate taken along line XII-XII'.

[0040] Fig.13 1 is a plan view showing states in process steps of a method for manufacturing a display device according to an embodiment of the present invention.

[0041] Fig.14 is a cross-sectional view showing a portion of a display device according to an embodiment of the present invention.

[0042] Fig.15 is a plan view showing a portion of a mother substrate of a display device according to an embodiment of the present invention, and is an enlarged view showing Figure 1 An example plan view of region III.

[0043] Fig.16 is a cross-sectional view showing a portion of a mother substrate of a display device according to an embodiment of the present invention, taken along Fig.15 A cross-sectional view of the mother substrate taken along line XVI-XVI'.

[0044] Fig.17 1 is a plan view showing states in process steps of a method for manufacturing a display device according to an embodiment of the present invention.

[0045] Fig.18 is a cross-sectional view showing a portion of a display device according to an embodiment of the present invention.

[0046] Description of Reference Numerals 1: Display device 10: Motherboard of display device 20: Detector 100: Substrate CA: First Region DA: Display Area NDA: Non-Display Area PA: Second Region 200: Display layer 300: Encapsulation layer 400: Touch layer 500: Optical functional layer 510: Light blocking layer 511: First Opening 512: Second opening 513: Groove 520: Color Filter 600: Physical Function Layer 610: First adhesive layer 620: Impact absorbing layer 630: Second adhesive layer DETAILED DESCRIPTION

[0047] The invention can be subjected to various transformations and can have various embodiments, specific embodiments are exemplified in the drawings and described in detail in the detailed description. The effects and features of the invention and the methods for achieving these will become clear with reference to the embodiments described in detail below in conjunction with the drawings. However, the invention is not limited to the embodiments disclosed below, but can be implemented in various forms.

[0048] Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. When describing with reference to the accompanying drawings, the same or corresponding components are denoted by the same reference numerals and repeated description thereof will be omitted.

[0049] In the following embodiments, the terms “first”, “second”, etc. do not have a restrictive meaning, but are used to distinguish one constituent element from another constituent element.

[0050] In the following embodiments, as long as other meanings are not clearly indicated in the context, expressions in the singular include expressions in the plural.

[0051] In the following embodiments, terms such as “including” or “having” indicate the presence of features or components described in the specification, and do not preclude the possibility of adding one or more other features or components.

[0052] In the following embodiments, when it is mentioned that films, regions, components, etc. are connected, it includes not only the case where the films, regions, components, etc. are directly connected, but also the case where other films, regions, components, etc. are sandwiched between them and they are indirectly connected. For example, in this specification, when it is mentioned that films, regions, components, etc. are electrically connected, it includes not only the case where films, regions, components, etc. are directly electrically connected, but also the case where other films, regions, components, etc. are sandwiched between them and they are indirectly electrically connected.

[0053] In the following embodiments, when a film, region, component, etc. is described as being on or above other parts, it includes not only the case where it is located immediately above other parts, but also the case where other films, regions, components, etc. are sandwiched between them.

[0054] In the drawings, the size of the components may be enlarged or reduced for the convenience of description. For example, the size and thickness of each component shown in the drawings are arbitrarily shown for the convenience of description, and therefore the present invention is not limited to the size and thickness shown in the drawings.

[0055] When a certain embodiment can be implemented in different ways, a specific process sequence can also be performed differently from the described sequence. For example, two processes described in succession can be performed substantially simultaneously, or in a sequence opposite to the described sequence.

[0056] Figure 1 FIG. 1 is a plan view schematically showing a mother substrate of a display device according to an embodiment of the present invention.

[0057] Reference Figure 1 , a mother substrate 10 of a display device according to an embodiment of the present invention may include a plurality of unit display devices 1 .

[0058] In one embodiment, the display device 1 is a device for displaying moving images or still images, and can be used not only as a display screen of portable devices such as mobile phones, smart phones, tablet personal computers, mobile communication terminals, electronic notepads, electronic books, portable multimedia players (PMP: portable multimedia player), navigators, ultra mobile PCs (UMPC: Ultra Mobile PC), etc., but also as a display screen of various products such as televisions, notebook computers, monitors, billboards, Internet of Things (IOT) devices, etc.

[0059] Furthermore, in one embodiment, the display device 1 can be used in wearable devices such as smart watches, watch phones, glasses-type displays, and head mounted displays (HMD). Furthermore, in one embodiment, the display device 1 can be used in a vehicle dashboard, a center information display (CID) arranged on a center fascia or dashboard of a vehicle, a room mirror display replacing a side mirror of a vehicle, or a display arranged on the back of a front seat as a rear seat entertainment device of a vehicle.

[0060] The mother substrate 10 may include a first area CA and a second area PA. The first area CA may be a portion where constituent elements of the display device 1 (e.g., sub-pixels including light-emitting elements) are arranged. The second area PA may surround the first area CA. In the manufacturing process of the display device 1, the mother substrate 10 may be cut along the boundary between the first area CA and the second area PA. After cutting, a portion corresponding to the second area PA of the mother substrate 10 may be removed. After cutting, a portion corresponding to the first area CA of the mother substrate 10 or the display device 1 may be taken out and moved toward a subsequent process.

[0061] The first area CA may include a display area DA and a non-display area NDA outside the display area DA.

[0062] The display area DA is a portion where an image is displayed, and a plurality of sub-pixels may be arranged in the display area DA. Each sub-pixel may include a light-emitting element such as an organic light-emitting diode. Each sub-pixel may emit, for example, red light, green light, blue light, or white light. The display area DA may provide a predetermined image by light emitted from the sub-pixels.

[0063] The non-display area NDA is an area where sub-pixels are not arranged and may be an area where no image is provided. In the non-display area NDA, a printed circuit board including power supply wiring and a driving circuit part for driving sub-pixels or a terminal part connected to a driving IC may be arranged.

[0064] exist Figure 1 In the embodiment, the first area CA and the display area DA are shown as being substantially quadrilateral with rounded corners, but the present invention is not limited thereto. The first area CA and / or the display area DA may be configured in various shapes such as a circle, an ellipse, a polygon, etc.

[0065] Figure 2 is a cross-sectional view schematically showing a display device according to an embodiment of the present invention, along Figure 1 Cross-sectional view along line II-II'.

[0066] Figure 2 The embodiment shown may be an embodiment showing a cross section of a mother substrate of a display device, or an embodiment showing a cross section of a unit display device.

[0067] Reference Figure 2 , a display device 1 according to an embodiment of the present invention may include a substrate 100 , a display layer 200 , an encapsulation layer 300 , a touch layer 400 , an optical function layer 500 and a physical function layer 600 .

[0068] The substrate 100 may include glass or a polymer resin. For example, the polymer resin may include polyethersulfone, polyacrylate, polyetherimide, polyethylene naphthalate, polyethylene terephthalate, polyphenylene sulfide, polyarylate, polyimide, polycarbonate, or cellulose acetate propionate. The substrate 100 including the polymer resin may have flexible, rollable, or bendable properties. The substrate 100 may have a multilayer structure including a layer including a polymer resin and an inorganic layer (not shown).

[0069] The display layer 200 may include a light emitting diode as a display element, a thin film transistor electrically connected to the light emitting diode, and an insulating layer interposed therebetween.

[0070] The encapsulation layer 300 may be disposed on the display layer 200. Alternatively, the display layer 200 may be covered and sealed by the encapsulation layer 300. The encapsulation layer 300 may include at least one inorganic encapsulation layer and at least one organic encapsulation layer.

[0071] In some embodiments, the display device 1 may be equipped with a packaging substrate (not shown) formed of a glass material instead of the packaging layer 300. The packaging substrate may be arranged on the display layer 200, and the display layer 200 may be sandwiched between the substrate 100 and the packaging substrate. There may be a gap between the packaging substrate and the display layer 200, and this gap may be filled with a filling material.

[0072] The touch layer 400 may be disposed on the encapsulation layer 300. The touch layer 400 may enable the display device 1 to acquire coordinate information corresponding to a touch position by sensing an external input (e.g., a touch of an object such as a finger or a touch pen). The touch layer 400 may include a touch electrode and a trace connected to the touch electrode. The touch layer 400 may sense an external input in a mutual capacitance manner or a self-capacitance manner.

[0073] In one embodiment, the touch layer 400 may be directly formed on the encapsulation layer 300. Alternatively, the touch layer 400 may be formed separately and then bonded to the encapsulation layer 300 via an adhesive layer such as an optically clear adhesive (OCA).

[0074] The optical function layer 500 may be disposed on the touch layer 400. The optical function layer 500 may include a light blocking layer and / or a color filter described later. The color filter may have a color corresponding to light emitted from a light emitting element located at a lower portion of each color filter.

[0075] The physical function layer 600 may be disposed on the optical function layer 500. A portion of the physical function layer 600 may function as an outer coating layer that flattens the optical function layer 500. Also, the physical function layer 600 may include a layer capable of absorbing impact to protect layers disposed below the physical function layer 600 from external impact.

[0076] Figure 3 is a plan view showing a portion of a mother substrate of a display device according to an embodiment of the present invention, and is an enlarged view showing Figure 1 Floor plan of Area III.

[0077] Reference Figure 3 , a plurality of sub-pixels each emitting light of a specific color may be arranged in the first area CA.

[0078] The sub-pixels may include a first sub-pixel P1, a second sub-pixel P2, and a third sub-pixel P3 that emit light of different colors. For example, the first sub-pixel P1 may emit red light, the second sub-pixel P2 may emit green light, and the third sub-pixel P3 may emit blue light. Each sub-pixel may be equipped with a light-emitting element that emits light of a corresponding color.

[0079] Reference Figure 2 , Figure 3 2 shows the components of the aforementioned optical functional layer 500. For example, Figure 3 The light-blocking layer 510 and the color filter 520 of the optical functional layer 500 are shown. The optical functional layer 500 may include a light-transmitting portion that transmits light and a light-blocking portion that blocks light. The light-transmitting portion of the optical functional layer 500 may be a portion that transmits light emitted from the light-emitting element of each sub-pixel. Therefore, the light-transmitting portion may overlap with each sub-pixel (e.g., the first sub-pixel P1, the second sub-pixel P2, and the third sub-pixel P3). For example, in the present embodiment, the light-transmitting portion of the optical functional layer 500 may include a first opening 511 of the light-blocking layer 510 and a color filter 520 arranged in the first opening 511 of the light-blocking layer 510. The light-blocking portion of the optical functional layer 500 may be a portion that blocks light emitted from the light-emitting element of each sub-pixel. For example, in the present embodiment, the light-blocking portion of the optical functional layer 500 may include a light-blocking layer 510.

[0080] The light blocking layer 510 may be arranged throughout the first area CA and the second area PA. For example, the light blocking layer 510 may include a portion overlapping the first area CA and a portion overlapping the second area PA.

[0081] The light blocking layer 510 may include a first opening 511 arranged in the display area DA in the first area CA. The first opening 511 may be provided in plurality. For example, the light blocking layer 510 may include a 1-1 opening 1511, a 1-2 opening 2511, and a 1-3 opening 3511 arranged in the display area DA.

[0082] The first openings 511 may be arranged to overlap with the corresponding sub-pixels, respectively. For example, the 1-1 opening 1511 may be arranged to overlap with the first sub-pixel P1 in the light blocking layer 510. The 1-2 opening 2511 may be arranged to overlap with the second sub-pixel P2 in the light blocking layer 510. The 1-3 opening 3511 may be arranged to overlap with the third sub-pixel P3 in the light blocking layer 510.

[0083] The color filter 520 may be arranged on the light blocking layer 510. The color filter 520 may be provided in plurality and may be arranged on the light blocking layer 510 to overlap with each sub-pixel (or the first opening 511). For example, the first color filter 1520 may be arranged on the light blocking layer 510 to overlap with the first sub-pixel P1 or the 1-1 opening 1511. The second color filter 2520 may be arranged on the light blocking layer 510 to overlap with the second sub-pixel P2 or the 1-2 opening 2511. The third color filter 3520 may be arranged on the light blocking layer 510 to overlap with the third sub-pixel P3 or the 1-3 opening 3511.

[0084] Each color filter 520 can transmit light of the same color as the light emitted from the corresponding sub-pixel. As an embodiment, the first sub-pixel P1 can emit red light, and the first color filter 1520 can transmit the red light. The second sub-pixel P2 can emit green light, and the second color filter 2520 can transmit the green light. The third sub-pixel P3 can emit blue light, and the third color filter 3520 can transmit the blue light.

[0085] The size of each color filter 520 may be larger than the size of the corresponding first opening 511. As an embodiment, the size of the first color filter 1520 may be larger than the size of the 1-1 opening 1511. The size of the second color filter 2520 may be larger than the size of the 1-2 opening 2511. The size of the third color filter 3520 may be larger than the size of the 1-3 opening 3511. Therefore, the corresponding first opening 511 may be completely filled by each color filter 520.

[0086] exist Figure 3 In the embodiment, the first opening 511 and the color filter 520 are shown as a substantially quadrilateral with rounded corners, but the present invention is not limited thereto. Each first opening 511 and / or each color filter 520 may be configured in various shapes such as a circle, an ellipse, a polygon, etc.

[0087] The light blocking layer 510 may include an alignment mark, for example, a second opening 512 , arranged in the non-display area NDA in the first area CA.

[0088] The second opening 512 may include a plurality of openings. For example, the second opening 512 may include a 2-1st opening 512-1, a 2-2nd opening 512-2, and a 2-3rd opening 512-3.

[0089] The 2-1st opening 512-1, the 2-2nd opening 512-2, and the 2-3rd opening 512-3 may be arranged in one direction. For example, the 2-1st opening 512-1, the 2-2nd opening 512-2, and the 2-3rd opening 512-3 may be arranged in the ±y direction. As an embodiment, the 2-2nd opening 512-2 may be arranged in the +y direction of the 2-3rd opening 512-3, and the 2-1st opening 512-1 may be arranged in the +y direction of the 2-2nd opening 512-2.

[0090] The second opening 512 may be arranged adjacent to a boundary Bd between the first area CA and the second area PA. As an embodiment, the boundary Bd between the first area CA and the second area PA may extend along the ±y direction, and the second opening 512 may include a 2-1st opening 512-1, a 2-2nd opening 512-2, and a 2-3rd opening 512-3 adjacent to the boundary Bd between the first area CA and the second area PA and arranged along the ±y direction.

[0091] When laser cutting the mother substrate 10 of the display device, cutting can be achieved along the boundary Bd between the first area CA and the second area PA. At this time, the second opening 512 can be arranged adjacent to the boundary Bd between the first area CA and the second area PA to indicate the boundary Bd, thereby serving as an alignment mark.

[0092] The planar shape of a portion of the 2-1 opening 512-1, the 2-2 opening 512-2, and the 2-3 opening 512-3 may be different from the planar shape of another portion. Figure 3 As shown, the 2-1 opening 512-1 and the 2-2 opening 512-2 may have a substantially rectangular shape with a length in the ±y direction greater than a length in the ±x direction, and the 2-3 opening 512-3 may have a substantially rhombus shape with a length in the ±y direction greater than a length in the ±x direction.

[0093] By making the shape of a part of the 2-1 opening 512-1, the 2-2 opening 512-2, and the 2-3 opening 512-3 different from the rest, the directionality of the second opening 512 can be expressed. As one embodiment, the laser can be set to pass in the order of rectangle-rectangle-diamond to cut the mother substrate 10 along the -y direction. As another embodiment, the laser can be set to pass in the order of diamond-rectangle-rectangle to cut the mother substrate 10 along the +y direction. Of course, the present invention is not limited to this, and the number, arrangement, and shape of each opening of the second opening 512 can be variously deformed.

[0094] The light blocking layer 510 may include a groove 513 disposed between the first area CA and the second area PA.

[0095] The trench 513 may overlap a boundary Bd between the first area CA and the second area PA. Meanwhile, the trench 513 may overlap a portion of the first area CA and a portion of the second area PA.

[0096] In other words, the trench 513 may extend along the boundary Bd between the first area CA and the second area PA. Figure 3 In the embodiment, the groove 513 may extend in the ±y direction along the boundary Bd between the first area CA and the second area PA. Figure 1 When the entire unit display device shown is viewed as a reference, the groove 513 may be in a shape extending along a boundary Bd between the first area CA and the second area PA and surrounding the first area CA.

[0097] The groove 513 may overlap with the boundary Bd between the first area CA and the second area PA, and the second opening 512 may be arranged adjacent to the boundary Bd between the first area CA and the second area PA. At this time, the second opening 512 and the groove 513 may be separated from each other. For example, the side surface of the groove 513 located in the first area CA (or the non-display area NDA) and the side surface of the second opening 512 may be separated from each other. Alternatively, a portion of the light blocking layer 510 may be interposed between the second opening 512 and the groove 513.

[0098] exist Figure 3 In the figure, the groove 513 is shown to be bilaterally symmetrical with respect to the boundary Bd between the first area CA and the second area PA, but the present invention is not necessarily limited thereto.

[0099] Figure 4 is a cross-sectional view showing a portion of a mother substrate of a display device according to an embodiment of the present invention, taken along Figure 3 Cross-sectional view of line IV-IV'.

[0100] Reference Figure 4, a display layer 200 including a plurality of sub-pixels may be arranged on a substrate 100. As an embodiment, a first sub-pixel P1, a second sub-pixel P2, and a third sub-pixel P3 may be arranged on the substrate 100. The first sub-pixel P1, the second sub-pixel P2, and the third sub-pixel P3 may include a first light emitting diode LED1, a second light emitting diode LED2, and a third light emitting diode LED3 that emit light of a predetermined color.

[0101] The first light emitting diode LED1 , the second light emitting diode LED2 , and the third light emitting diode LED3 may include corresponding first sub-pixel electrodes 1210 , second sub-pixel electrodes 2210 , and third sub-pixel electrodes 3210 and first intermediate layers 1220 , second intermediate layers 2220 , and third intermediate layers 3220 , respectively.

[0102] The substrate 100 may include a glass material or a plastic material polymer resin. The substrate 100 including the polymer resin may have flexible, rollable or bendable properties. The substrate 100 may have a multilayer structure including a layer including a polymer resin and an inorganic layer (not shown).

[0103] The first intermediate layer 1220 , the second intermediate layer 2220 , and the third intermediate layer 3220 corresponding to the first subpixel P1 , the second subpixel P2 , and the third subpixel P3 , respectively, may be electrically connected to the first thin film transistor TFT1 , the second thin film transistor TFT2 , and the third thin film transistor TFT3 on the substrate 100 , respectively.

[0104] The first intermediate layer 1220 corresponding to the first subpixel P1 may be electrically connected to the first thin film transistor TFT1 through the first subpixel electrode 1210. The first thin film transistor TFT1 may include a first active layer A1, a first gate electrode G1 overlapping a portion of the first active layer A1, and a first source electrode S1 and a first drain electrode D1 directly contacting a portion of the first active layer A1, respectively.

[0105] The second intermediate layer 2220 corresponding to the second subpixel P2 may be electrically connected to the second thin film transistor TFT2 through the second subpixel electrode 2210. The second thin film transistor TFT2 may include a second active layer A2, a second gate electrode G2 overlapping a portion of the second active layer A2, and a second source electrode S2 and a second drain electrode D2 directly contacting a portion of the second active layer A2, respectively.

[0106] The third intermediate layer 3220 corresponding to the third subpixel P3 may be electrically connected to the third thin film transistor TFT3 through the third subpixel electrode 3210. The third thin film transistor TFT3 may include a third active layer A3, a third gate electrode G3 overlapping a portion of the third active layer A3, and a third source electrode S3 and a third drain electrode D3 directly contacting a portion of the third active layer A3, respectively.

[0107] The first gate electrode G1, the second gate electrode G2 and the third gate electrode G3 may include at least one substance selected from aluminum (Al), platinum (Pt), palladium (Pd), silver (Ag), magnesium (Mg), gold (Au), nickel (Ni), neodymium (Nd), iridium (Ir), chromium (Cr), lithium (Li), calcium (Ca), molybdenum (Mo), titanium (Ti), tungsten (W) and copper (Cu), and may be a single-layer or multi-layer structure containing the aforementioned substances.

[0108] A buffer layer 201 for preventing the penetration of impurities may be interposed between the first active layer A1, the second active layer A2, and the third active layer A3 and the substrate 100. A gate insulating layer 203 may be interposed between the first active layer A1, the second active layer A2, and the third active layer A3 and the first gate electrode G1, the second gate electrode G2, and the third gate electrode G3. An interlayer insulating layer 205 may be arranged on the first gate electrode G1, the second gate electrode G2, and the third gate electrode G3. The buffer layer 201, the gate insulating layer 203, and the interlayer insulating layer 205 may include silicon oxide (SiO x ), silicon nitride (SiN x ), silicon oxynitride (SiON), aluminum oxide (AlO x ), aluminum nitride (AlN x ), titanium oxide (TiO x ) or titanium nitride (TiN x ) and other inorganic insulators.

[0109] The first source electrode S1, the second source electrode S2, and the third source electrode S3 may be arranged on the interlayer insulating layer 205, and may be connected to the first active layer A1, the second active layer A2, and the third active layer A3, respectively, through contact holes formed in the interlayer insulating layer 205 and the gate insulating layer 203. The first source electrode S1, the second source electrode S2, and the third source electrode S3 may include aluminum (Al), platinum (Pt), palladium (Pd), silver (Ag), magnesium (Mg), gold (Au), nickel (Ni), neodymium (Nd), iridium (Ir), chromium (Cr), lithium (Li), calcium (Ca), molybdenum (Mo), titanium (Ti), tungsten (W), or copper (Cu), etc., and may be formed as a single layer or multiple layers.

[0110] The first drain electrode D1, the second drain electrode D2 and the third drain electrode D3 may be arranged on the interlayer insulating layer 205, and may be connected to the first active layer A1, the second active layer A2 and the third active layer A3 respectively through contact holes formed in the interlayer insulating layer 205 and the gate insulating layer 203. The first drain electrode D1, the second drain electrode D2 and the third drain electrode D3 may include aluminum (Al), platinum (Pt), palladium (Pd), silver (Ag), magnesium (Mg), gold (Au), nickel (Ni), neodymium (Nd), iridium (Ir), chromium (Cr), lithium (Li), calcium (Ca), molybdenum (Mo), titanium (Ti), tungsten (W) or copper (Cu), etc., and may be formed as a single layer or multiple layers. In some embodiments, the first source electrode S1, the second source electrode S2 and the third source electrode S3 and the first drain electrode D1, the second drain electrode D2 and the third drain electrode D3 may include the same material.

[0111] The first organic insulating layer 207 may be arranged on the first thin film transistor TFT1, the second thin film transistor TFT2, and the third thin film transistor TFT3. For example, the first organic insulating layer 207 may be arranged in a manner covering the first source electrode S1, the second source electrode S2, and the third source electrode S3, and the first drain electrode D1, the second drain electrode D2, and the third drain electrode D3. The first organic insulating layer 207 may include an organic insulating material such as acrylic acid, benzocyclobutene, polyimide, or hexamethyldisiloxane. The first organic insulating layer 207 may be provided with a plurality of contact holes. For example, the first organic insulating layer 207 may be provided with a plurality of contact holes that overlap with the first drain electrode D1, the second drain electrode D2, and the third drain electrode D3, respectively.

[0112] The connection metal CM may be arranged on the first organic insulating layer 207. The connection metal CM may include aluminum (Al), copper (Cu) and / or titanium (Ti), etc., and may be configured as a single layer or multiple layers including the aforementioned substances. The connection metal CM may be provided in plurality and may be arranged overlapping with the first drain electrode D1, the second drain electrode D2, and the third drain electrode D3, respectively. A portion of each of the connection metals CM may be arranged in a contact hole formed in the first organic insulating layer 207. For example, the connection metal CM may be directly in contact with the first drain electrode D1, the second drain electrode D2, and the third drain electrode D3, respectively, through the contact hole formed in the first organic insulating layer 207.

[0113] The second organic insulating layer 209 may be disposed between the first organic insulating layer 207 and the first sub-pixel electrode 1210, the second sub-pixel electrode 2210, and the third sub-pixel electrode 3210. The second organic insulating layer 209 may include an organic insulator such as acrylic acid, benzocyclobutene, polyimide, or hexamethyldisiloxane. The second organic insulating layer 209 may be provided with a contact hole overlapping each of the connection metals CM.

[0114] The first sub-pixel electrode 1210, the second sub-pixel electrode 2210, and the third sub-pixel electrode 3210 may be arranged on the second organic insulating layer 209. The first sub-pixel electrode 1210, the second sub-pixel electrode 2210, and the third sub-pixel electrode 3210 may be formed as reflective electrodes. The first sub-pixel electrode 1210, the second sub-pixel electrode 2210, and the third sub-pixel electrode 3210 may be formed by forming a reflective film using silver (Ag), magnesium (Mg), aluminum (Al), platinum (Pt), palladium (Pd), gold (Au), nickel (Ni), neodymium (Nd), iridium (Ir), chromium (Cr), or compounds thereof, and arranging a reflective film using ITO, IZO, ZnO, or In on the reflective film. 2 O 3 As an embodiment, the first sub-pixel electrode 1210, the second sub-pixel electrode 2210 and the third sub-pixel electrode 3210 may be a structure in which an ITO layer, an Ag layer and an ITO layer are stacked in sequence. Of course, the present invention is not limited thereto, and the first sub-pixel electrode 1210, the second sub-pixel electrode 2210 and the third sub-pixel electrode 3210 may be formed of various materials, and their structures may also be formed into a single layer or multiple layers, and various deformations may be performed.

[0115] The first sub-pixel electrode 1210 , the second sub-pixel electrode 2210 , and the third sub-pixel electrode 3210 may be electrically connected to the overlapping connection metal CM through contact holes formed in the second organic insulating layer 209 , respectively.

[0116] According to reference Figure 4In the illustrated embodiment, the first thin film transistor TFT1, the second thin film transistor TFT2 and the third thin film transistor TFT3 are respectively electrically connected to the first sub-pixel electrode 1210, the second sub-pixel electrode 2210 and the third sub-pixel electrode 3210 through the connection metal CM, but the present invention is not limited thereto. As another embodiment, the connection metal CM may be omitted, and an organic insulating layer may be located between the first thin film transistor TFT1, the second thin film transistor TFT2 and the third thin film transistor TFT3 and the first sub-pixel electrode 1210, the second sub-pixel electrode 2210 and the third sub-pixel electrode 3210. Alternatively, more than three organic insulating layers may be located between the first thin film transistor TFT1, the second thin film transistor TFT2 and the third thin film transistor TFT3 and the first sub-pixel electrode 1210, the second sub-pixel electrode 2210 and the third sub-pixel electrode 3210, and the first thin film transistor TFT1, the second thin film transistor TFT2 and the third thin film transistor TFT3 and the first sub-pixel electrode 1210, the second sub-pixel electrode 2210 and the third sub-pixel electrode 3210 may be electrically connected through a plurality of connection metals.

[0117] The sub-pixel definition layer 211 may cover the edge regions (or edges) of the first sub-pixel electrode 1210, the second sub-pixel electrode 2210, and the third sub-pixel electrode 3210. In other words, the sub-pixel definition layer 211 may include a plurality of openings that respectively expose the center portions of the first sub-pixel electrode 1210, the second sub-pixel electrode 2210, and the third sub-pixel electrode 3210. Each opening of the sub-pixel definition layer 211 may define the light emitting regions of the first sub-pixel P1, the second sub-pixel P2, and the third sub-pixel P3.

[0118] The first intermediate layer 1220, the second intermediate layer 2220, and the third intermediate layer 3220 may be disposed on the first sub-pixel electrode 1210, the second sub-pixel electrode 2210, and the third sub-pixel electrode 3210. For example, the first intermediate layer 1220 may be disposed on the first sub-pixel electrode 1210 within the opening of the sub-pixel definition layer 211. The second intermediate layer 2220 may be disposed on the second sub-pixel electrode 2210 within the opening of the sub-pixel definition layer 211. The third intermediate layer 3220 may be disposed on the third sub-pixel electrode 3210 within the opening of the sub-pixel definition layer 211.

[0119] The first intermediate layer 1220, the second intermediate layer 2220, and the third intermediate layer 3220 may include an organic light-emitting layer (Emission Layer) containing a low-molecular or high-molecular substance. The first intermediate layer 1220, the second intermediate layer 2220, and the third intermediate layer 3220 may have a single-layer or multi-layer structure including a hole injection layer (Hole Injection Layer), a hole transport layer (Hole Transport Layer), an organic light-emitting layer (Emission Layer), an electron transport layer (Electron Transport Layer) and / or an electron injection layer (Electron Injection Layer).

[0120] The counter electrode 230 may be arranged on the first intermediate layer 1220, the second intermediate layer 2220, and the third intermediate layer 3220. The counter electrode 230 may be formed as a whole to cover the first intermediate layer 1220, the second intermediate layer 2220, and the third intermediate layer 3220. The counter electrode 230 may be formed as a (semi) transparent electrode. When the counter electrode 230 is formed as a (semi) transparent electrode, it may include one or more substances selected from Ag, Al, Mg, Li, Ca, Cu, LiF / Ca, LiF / Al, MgAg, and CaAg, and may be formed into a thin film form having a thickness of several nanometers (nm) to tens of nanometers (nm). Of course, the composition and material of the counter electrode 230 are not limited thereto, and various deformations are obviously possible.

[0121] The encapsulation layer 300 may be disposed on the counter electrode 230. The encapsulation layer 300 may include at least one inorganic encapsulation layer and at least one organic encapsulation layer. Figure 4 As shown, the encapsulation layer 300 may include a first inorganic encapsulation layer 310 , an organic encapsulation layer 320 , and a second inorganic encapsulation layer 330 which are sequentially stacked.

[0122] The first inorganic encapsulation layer 310 and the second inorganic encapsulation layer 330 may include silicon oxide (SiO x ), silicon nitride (SiN x ), silicon oxynitride (SiON), aluminum oxide (AlO x ), titanium oxide (TiO x )、Tantalum oxide(Ta 2 O 5 ), hafnium oxide (HfO 2 ) or zinc oxide (ZnO) and the like. The first inorganic encapsulating layer 310 and the second inorganic encapsulating layer 330 may include a single layer or a multi-layer structure including the aforementioned inorganic insulator.

[0123] The organic encapsulation layer 320 can relieve the internal stress of the first inorganic encapsulation layer 310 and / or the second inorganic encapsulation layer 330. The organic encapsulation layer 320 may include a polymer-based substance. For example, the organic encapsulation layer 320 may include polyethylene terephthalate, polyethylene naphthalate, polycarbonate, polyimide, polyethylene sulfonate, polyoxymethylene, polyarylate, hexamethyldisiloxane, acrylic resin (e.g., polymethyl methacrylate, polyacrylic acid, etc.), or any combination thereof.

[0124] The encapsulation layer 300 may have a multi-layer structure of a first inorganic encapsulation layer 310, an organic encapsulation layer 320, and a second inorganic encapsulation layer 330. In this case, even if cracks are generated in the encapsulation layer 300, the cracks do not propagate between the first inorganic encapsulation layer 310 and the organic encapsulation layer 320 or between the organic encapsulation layer 320 and the second inorganic encapsulation layer 330. The encapsulation layer 300 may prevent or minimize external moisture or oxygen from penetrating into the display layer 200.

[0125] although Figure 4 Although not shown in the figure, another embodiment of the present invention may further include a covering layer disposed between the encapsulation layer 300 and the counter electrode 230. For example, according to another embodiment of the present invention, a covering layer (not shown) sandwiched between the first inorganic encapsulation layer 310 and the counter electrode 230 may be included. The covering layer may improve the luminous efficiency of the first light emitting diode LED1, the second light emitting diode LED2, and the third light emitting diode LED3 through the principle of constructive interference.

[0126] The second inorganic encapsulating layer 330 may directly contact the first inorganic encapsulating layer 310 in the non-display area NDA. For example, the second inorganic encapsulating layer 330 may surround the side surface of the organic encapsulating layer 320 in the non-display area NDA and may be in contact with the first inorganic encapsulating layer 310 in the non-display area NDA.

[0127] In the non-display area NDA and the second area PA, a planarization layer 401 may be arranged between the touch layer 400 and the encapsulation layer 300. For example, the planarization layer 401 may be arranged over a portion of the non-display area NDA and the second area PA, and may be sandwiched between the second inorganic encapsulation layer 330 and the first touch insulation layer 410. A portion of the planarization layer 401 may cover a portion of the second inorganic encapsulation layer 330. The planarization layer 401 may provide a flat surface on which the touch layer 400 may be arranged.

[0128] although Figure 4 Although not shown, in another embodiment of the present invention, a spacer which is arranged in the non-display area NDA and prevents the organic encapsulation layer 320 from moving in one direction may be arranged.

[0129] The touch layer 400 may be disposed on the encapsulation layer 300. The touch layer 400 may include a first touch insulation layer 410, a first conductive layer 420, a second touch insulation layer 430, a second conductive layer 440, and a third touch insulation layer 450.

[0130] The first touch insulating layer 410 may be disposed on the second inorganic encapsulation layer 330 of the encapsulation layer 300 to planarize the surface on which the first conductive layer 420 and the like are disposed. The first touch insulating layer 410 may include silicon oxide (SiO x ), silicon nitride (SiN x ), silicon oxynitride (SiON), etc. In some embodiments, the first touch insulating layer 410 may also include an organic insulating material. As another embodiment, the first touch insulating layer 410 may be omitted, and the first conductive layer 420 may be arranged on the second inorganic encapsulation layer 330 of the encapsulation layer 300 or on the planarization layer 401.

[0131] A second touch insulating layer 430 may be disposed on the first conductive layer 420. The second touch insulating layer 430 may be made of an inorganic substance or an organic substance. In the case where the second touch insulating layer 430 is made of an inorganic substance, the second touch insulating layer 430 may include a material selected from silicon nitride (SiN x ), aluminum nitride (AlN x ), zirconium oxide (ZrN x )、TiN x ), Hafnium Nitride (HfN x )、Tantalum nitride(TaN x ), silicon oxide (SiO x ), aluminum oxide (AlO x ), titanium oxide (TiO x ), tin oxide (SnO x ), cerium oxide (CeO x ) and silicon oxynitride (SiON). When the second touch insulating layer 430 is made of an organic material, the second touch insulating layer 430 may include at least one material selected from the group consisting of acrylic resin, methacrylic resin, polyisoprene, vinyl resin, epoxy resin, urethane resin, cellulose resin and perylene resin.

[0132] A second conductive layer 440 may be arranged on the second touch insulating layer 430. The second conductive layer 440 may function as a sensor for sensing a user's touch input. The first conductive layer 420 may function as a connection portion connecting the patterned second conductive layer 440 in one direction. In one embodiment, both the first conductive layer 420 and the second conductive layer 440 may function as sensors. In this case, the first conductive layer 420 and the second conductive layer 440 may be electrically connected through a contact hole. In the case where both the first conductive layer 420 and the second conductive layer 440 function as sensors, since the resistance of the touch electrode is reduced, the user's touch input may be sensed quickly.

[0133] In one embodiment, the first conductive layer 420 and the second conductive layer 440 may have a structure that allows light emitted from the light emitting diode to pass therethrough, for example, a mesh structure. In this case, the first conductive layer 420 and the second conductive layer 440 may be arranged so as not to overlap with the light emitting region of the light emitting diode.

[0134] The first conductive layer 420 and the second conductive layer 440 may include a metal layer or a transparent conductive layer. The metal layer may include molybdenum (Mo), silver (Ag), titanium (Ti), copper (Cu), aluminum (Al) and alloys thereof. The transparent conductive layer may include transparent conductive oxides such as indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO), indium tin zinc oxide (ITZO), etc., conductive polymers such as PEDOT, metal nanowires, carbon nanotubes or graphene, etc.

[0135] A third touch insulating layer 450 may be disposed on the second conductive layer 440. The third touch insulating layer 450 may be provided with an inorganic substance or an organic substance. In the case where the third touch insulating layer 450 is provided with an inorganic substance, the third touch insulating layer 450 may include a material selected from silicon nitride (SiN x ), aluminum nitride (AlN x ), zirconium oxide (ZrN x )、TiN x ), Hafnium Nitride (HfN x )、Tantalum nitride(TaN x ), silicon oxide (SiO x ), aluminum oxide (AlO x ), titanium oxide (TiO x ), tin oxide (SnO x ), cerium oxide (CeO x) and silicon oxynitride (SiON). In the case where the third touch insulating layer 450 is provided with an organic substance, the third touch insulating layer 450 may include at least one substance selected from the group consisting of acrylic resin, methacrylic resin, polyisoprene, vinyl resin, epoxy resin, urethane resin, cellulose resin and perylene resin.

[0136] The optical function layer 500 may be disposed on the touch layer 400. The optical function layer 500 may include a light blocking layer 510 and a color filter 520. The light blocking layer 510 may include a substance that absorbs external light, thereby improving visibility of the display device 1.

[0137] The light blocking layer 510 may also include a first opening 511 overlapping the first sub-pixel P1, the second sub-pixel P2, and the third sub-pixel P3. The first opening 511 may be provided in plurality. For example, the first opening 511 may include a 1-1 opening 1511 overlapping the first sub-pixel P1, a 1-2 opening 2511 overlapping the second sub-pixel P2, and a 1-3 opening 3511 overlapping the third sub-pixel P3. The 1-1 opening 1511, the 1-2 opening 2511, and the 1-3 opening 3511 may overlap with the openings formed in the sub-pixel definition layer 211 corresponding to the first sub-pixel P1, the second sub-pixel P2, and the third sub-pixel P3, respectively, and their sizes may be equal to or larger than the openings formed in the sub-pixel definition layer 211. In other words, the sizes of the 1-1 opening 1511, the 1-2 opening 2511, and the 1-3 opening 3511 may be equal to or larger than the sizes of the light emitting regions of the first sub-pixel P1, the second sub-pixel P2, and the third sub-pixel P3, respectively.

[0138] The color filter 520 may be arranged on the light blocking layer 510 to overlap with the first opening 511. For example, the color filter 520 may include a first color filter 1520, a second color filter 2520, and a third color filter 3520, and the first color filter 1520, the second color filter 2520, and the third color filter 3520 may be arranged on the light blocking layer 510 to overlap with the 1-1 opening 1511, the 1-2 opening 2511, and the 1-3 opening 3511, respectively.

[0139] A portion of the color filter 520 may be arranged in the first opening 511. For example, a portion of the first color filter 1520 may be arranged in the 1-1 opening 1511, and another portion may protrude from the upper surface of the 1-1 opening 1511 and be arranged on the light blocking layer 510. A portion of the second color filter 2520 may be arranged in the 1-2 opening 2511, and another portion may protrude from the upper surface of the 1-2 opening 2511 and be arranged on the light blocking layer 510. A portion of the third color filter 3520 may be arranged in the 1-3 opening 3511, and another portion may protrude from the upper surface of the 1-3 opening 3511 and be arranged on the light blocking layer 510.

[0140] The width of the color filter 520 may be greater than the width of the first opening 511. For example, the width of the first color filter 1520 may be greater than the width of the 1-1 opening 1511. The width of the second color filter 2520 may be greater than the width of the 1-2 opening 2511. The width of the third color filter 3520 may be greater than the width of the 1-3 opening 3511. Figure 3 As shown, the size of each color filter 520 may be larger than the size of each first opening 511 .

[0141] The color filters 520 can transmit light of the same color as the corresponding sub-pixels. For example, the first sub-pixel P1 can emit red light, and the first color filter 1520 can transmit the red light. The second sub-pixel P2 can emit green light, and the second color filter 2520 can transmit the green light. The third sub-pixel P3 can emit blue light, and the third color filter 3520 can transmit the blue light. Thus, the visibility of the display device can be further improved.

[0142] The following description will focus on the 2-3 opening 512-3, but the features of the 2-3 opening 512-3 can be applied to the 2-1 opening 512-1 and the 2-2 opening 512-2 ( Figure 3 ) including all the second openings 512 ( Figure 3 ).

[0143] The 2-3 opening 512-3 of the light blocking layer 510 may be arranged adjacent to the boundary Bd between the first area CA and the second area PA. As one embodiment, the 2-3 opening 512-3 may be arranged adjacent to the boundary Bd between the first area CA and the second area PA in the first area CA (or the non-display area NDA). As another embodiment, the 2-3 opening 512-3 may also be arranged adjacent to the boundary Bd between the first area CA and the second area PA in the second area PA.

[0144] The 2-3rd opening 512-3 may penetrate the light blocking layer 510. In other words, the 2-3rd opening 512-3 may be a penetration hole. Therefore, a portion of the upper surface of the third touch insulation layer 450 may be exposed through the 2-3rd opening 512-3.

[0145] The light blocking layer 510 may include a groove 513 arranged to overlap the boundary Bd between the first area CA and the second area PA. The groove 513 and the 2-3 opening 512-3 may be arranged adjacent to each other and may be spaced apart from each other. For example, a portion of the light blocking layer 510 may be arranged between the 2-3 opening 512-3 and the groove 513.

[0146] The groove 513 may penetrate the light blocking layer 510. Therefore, a portion of the upper surface of the third touch insulation layer 450 may be exposed through the groove 513.

[0147] The physical function layer 600 may be disposed on the optical function layer 500. The physical function layer 600 may include a first adhesive layer 610, a second adhesive layer 630, and a shock absorbing layer 620 interposed between the first adhesive layer 610 and the second adhesive layer 630.

[0148] The first adhesive layer 610 may be disposed on the light blocking layer 510 and cover the light blocking layer 510 and the color filter 520. The first adhesive layer 610 may have an adhesive force that changes due to applied pressure and has high transmittance. As an embodiment, the first adhesive layer 610 may include a pressure sensitive adhesive.

[0149] The first adhesive layer 610 may cover the light blocking layer 510 and the color filter 520 and also function as an outer coating layer for planarizing the light blocking layer 510 and the color filter 520 .

[0150] The first adhesive layer 610 may have fluidity. Therefore, a portion of the first adhesive layer 610 may be disposed in the 2 - 3 nd opening 512 - 3 and / or the groove 513 of the light blocking layer 510 .

[0151] A bubble layer AB may be formed between a portion of the first adhesive layer 610 disposed in the groove 513 and the upper surface of the third touch insulating layer 450 exposed by the groove 513. In other words, the bubble layer AB is disposed in the groove 513 of the light blocking layer 510 and may be interposed between the first adhesive layer 610 and the third touch insulating layer 450.

[0152] Although in Figure 4Although not shown, as another embodiment, in the 2-3 opening 512-3, another bubble layer may be interposed between the first adhesive layer 610 and the third touch insulating layer 450. Alternatively, as another embodiment, the first adhesive layer 610 and the third touch insulating layer 450 may not be in direct contact in the 2-3 opening 512-3.

[0153] The impact absorbing layer 620 may be disposed on the first adhesive layer 610. The impact absorbing layer 620 may absorb impact that may be applied to a layer disposed at a lower portion (e.g., the display layer 200 or the touch layer 400). The impact absorbing layer 620 may include a highly flexible resin (e.g., polyethylene terephthalate (PET)). By including the impact absorbing layer 620, the bendability and foldability of the display device may be improved.

[0154] The second adhesive layer 630 may be disposed on the impact absorbing layer 620. The second adhesive layer 630 may include the same substance as the first adhesive layer 610.

[0155] Figure 5a to Figure 5f 1 is a cross-sectional view showing states in process steps of a method for manufacturing a display device according to an embodiment of the present invention.

[0156] For example, Figure 5a to Figure 5f It may be a cross-sectional view showing, in an enlarged manner, a portion of a process of cutting a mother substrate of a display device using laser.

[0157] Reference Figure 5a , the laser L may be incident toward the upper surface of the second adhesive layer 630 .

[0158] The laser light L may be incident in a direction (eg, −z direction) perpendicular to the upper surface of the second adhesive layer 630. The incident path of the laser light L may coincide with a boundary Bd between the first area CA and the second area PA.

[0159] Reference Figure 5b , the laser light L can pass through the second adhesive layer 630. The first adhesive layer 610 and the second adhesive layer 630 may include a material with high transmittance. Therefore, the laser light L may not cut the second adhesive layer 630 while being incident on the second adhesive layer 630. The laser light L incident on the second adhesive layer 630 may first pass through the second adhesive layer 630 and then be directed toward the impact absorbing layer 620 disposed thereunder.

[0160] Reference Figure 5c , the laser light L may completely pass through the second adhesive layer 630 and then be incident on the impact absorbing layer 620 .

[0161] The impact absorbing layer 620 is a layer having lower transmittance than the second adhesive layer 630 , and may be cut while incident with the laser L. That is, the incident with the laser L may first occur at the second adhesive layer 630 , and the cutting may first occur at the impact absorbing layer 620 .

[0162] A hole 620-H may be formed at a location where the laser light L is incident in the shock absorbing layer 620. A portion of the shock absorbing layer 620 is removed by the laser light L, and smoke F may be generated. In the current step of the process, the hole 620-H of the shock absorbing layer 620 may be a blind hole. Therefore, smoke F particles may be located in the hole 620-H of the shock absorbing layer 620 because there is no space to move.

[0163] Reference Figure 5d , the laser L can penetrate the impact absorbing layer 620 and pass through the first adhesive layer 610 .

[0164] When the laser L penetrates the shock absorbing layer 620, the hole 620-H of the shock absorbing layer 620 may become a through hole. Compared with the blind hole of the shock absorbing layer 620 (for example, before the laser L penetrates the shock absorbing layer 620), the amount of smoke F generated may increase.

[0165] When the laser L passes through the second adhesive layer 630 and is irradiated for a sufficiently long time, the second adhesive layer 630 may also be cut by the laser L. Therefore, a hole 630-H may also begin to be formed in the second adhesive layer 630. The hole 630-H of the second adhesive layer 630 may be a through hole.

[0166] Since the laser light L is incident from the upper surface of the second adhesive layer 630 in the -z direction, the upper portion (or a portion in the +z direction) of the second adhesive layer 630 may be exposed to the laser light L for a longer time than the lower portion (or a portion in the -z direction) of the second adhesive layer 630. Therefore, the width of the hole 630-H in the upper portion (or a portion in the +z direction) of the second adhesive layer 630 may be greater than the width in the lower portion (or a portion in the -z direction). In other words, in the current step in the process, the hole 630-H of the second adhesive layer 630 may have a shape in which the width becomes narrower in the -z direction.

[0167] The first adhesive layer 610 may include a substance having high transmittance, which is the same as the second adhesive layer 630. Therefore, in the current step in which the laser light L penetrates the impact absorbing layer 620 and just enters the first adhesive layer 610, the laser light L may pass through the first adhesive layer 610.

[0168] Laser light L can pass through the bubble layer AB.

[0169] Reference Figure 5e, the laser L may pass through the first adhesive layer 610 and cut the third touch insulation layer 450 .

[0170] Since sufficient time has passed for the laser light L to penetrate the second adhesive layer 630 , the hole 630 -H of the second adhesive layer 630 may be a through hole having a constant width, similar to the hole 620 -H of the impact absorbing layer 620 .

[0171] Since the laser L has been irradiated through the first adhesive layer 610 for a sufficiently long time, the first adhesive layer 610 may also be thermally cut by the laser L. Therefore, a hole 610-H may also begin to be formed in the first adhesive layer 610. The hole 610-H of the first adhesive layer 610 may also be a through hole.

[0172] Similar to the case of the second adhesive layer 630, the laser light L is incident from the upper surface of the first adhesive layer 610 in the -z direction, so the upper portion (or a portion in the +z direction) of the first adhesive layer 610 may be exposed to the laser light L for a longer time than the lower portion (or a portion in the -z direction) of the first adhesive layer 610. Therefore, the width of the hole 610-H in the upper portion (or a portion in the +z direction) of the first adhesive layer 610 may be greater than the width in the lower portion (or a portion in the -z direction). In other words, in the current step in the process, the hole 610-H of the first adhesive layer 610 may have a shape in which the width becomes narrower in the -z direction.

[0173] The third touch insulation layer 450 may be cut simultaneously with the incidence of the laser L. Therefore, a hole 450-H may be formed in the third touch insulation layer 450. The hole 450-H of the third touch insulation layer 450 may be a blind hole.

[0174] Particles of smoke F generated in the cutting of the impact absorbing layer 620 may move in the -z direction along the holes 610-H of the first adhesive layer 610. For example, particles of smoke F may move in the -z direction (or gravity direction) along the holes 610-H of the first adhesive layer 610 under the influence of gravity.

[0175] A portion of the smoke F particles moving in the −z direction may change the direction of movement and spread into the bubble layer AB, while another portion of the smoke F particles may move into the holes 450 -H of the third touch insulating layer 450 .

[0176] Reference Figure 5f Since it has been a sufficient time for the laser L to penetrate the first adhesive layer 610 , the hole 610 -H of the first adhesive layer 610 may be a through hole having a constant width, similar to the hole 620 -H of the impact absorbing layer 620 .

[0177] The laser L may penetrate the third touch insulating layer 450. Therefore, the hole 450-H of the third touch insulating layer 450 may become a through hole. Thereafter, the laser L may continue to travel along the -z direction to cut the Figure 4 The layers below the third touch insulating layer 450 (or the layers arranged in the -z direction) are shown.

[0178] Smoke F particles can move further in the -z direction. Figure 5e Compared with the steps shown, the smoke F particles can move further in the -z direction, and more smoke F particles can be dispersed into the bubble layer AB.

[0179] At this time, the smoke F particles dispersed into the bubble layer AB can be collected in the bubble layer AB. Therefore, when observed in the +z direction, it can be confirmed that the smoke F particles are collected in the groove 513 where the bubble layer AB is arranged (refer to Figure 7 ).

[0180] Figures 6a to 6e It is a perspective view showing states in process steps of a method for manufacturing a display device according to an embodiment of the present invention.

[0181] Figures 6a to 6e Solid and dotted lines are used for illustration purposes only. Figures 6a to 6e The illustrated embodiment does not represent the entire display device, but should be understood as an enlarged view of a portion of a mother substrate of the display device.

[0182] Reference Figure 6a , a light blocking layer 510 may be disposed on the touch layer (eg, the third touch insulating layer 450 ).

[0183] The light blocking layer 510 may include a groove 513 overlapping a boundary Bd between the first area CA and the second area PA. In other words, a portion of the light blocking layer 510 may be disposed in the first area CA, and another portion may be disposed in the second area PA.

[0184] The groove 513 may penetrate the light blocking layer 510. Therefore, in a region overlapping with the groove 513, a portion of the third touch insulation layer 450 may be exposed.

[0185] The light blocking layer 510 may include a second opening 512 arranged in the first area CA adjacent to the groove 513. The groove 513 and the second opening 512 may be adjacent to each other and spaced apart. The second opening 512 may include a 2-1st opening 512-1, a 2-2nd opening 512-2, and a 2-3rd opening 512-3 arranged in a direction (e.g., ±y direction). The shape of one of the 2-1st opening 512-1, the 2-2nd opening 512-2, and the 2-3rd opening 512-3 may be different from the other. For example, the shape of the 2-3rd opening 512-3 may be different from the shapes of the 2-1st opening 512-1 and the 2-2nd opening 512-2.

[0186] The second opening 512 may penetrate the light blocking layer 510 . Therefore, a portion of the third touch insulation layer 450 may be exposed through the second opening 512 .

[0187] Reference Figure 6b , a first adhesive layer 610 , a shock absorbing layer 620 , and a second adhesive layer 630 may be sequentially formed on the light blocking layer 510 .

[0188] A portion of the first adhesive layer 610 may be disposed in the groove 513 of the light blocking layer 510. The first adhesive layer 610 may include a pressure-sensitive adhesive. Therefore, when the first adhesive layer 610 is disposed on the light blocking layer 510, the groove 513 of the light blocking layer 510 may not be completely filled due to the viscosity of the first adhesive layer 610. For example, a bubble layer AB may be formed below the first adhesive layer 610 in the groove 513.

[0189] The bubble layer AB is interposed between the first adhesive layer 610 and the third touch insulating layer 450 and may be located in the groove 513 of the light blocking layer 510. In other words, the first adhesive layer 610 and the third touch insulating layer 450 may be spaced apart from each other in a region overlapping the groove 513 of the light blocking layer 510.

[0190] A portion of the first adhesive layer 610 may be disposed in the second opening 512 of the light blocking layer 510. For example, a portion of the first adhesive layer 610 may be disposed in the 2-1 opening 512-1, the 2-2 opening 512-2, and the 2-3 opening 512-3, respectively. Although not shown in the following drawings, similar to the case of the groove 513, in the second opening 512, a bubble layer may also be interposed between the first adhesive layer 610 and the third touch insulating layer 450.

[0191] The first adhesive layer 610 may play a role in providing a flat surface on which the impact absorbing layer 620 may be disposed. The impact absorbing layer 620 and the second adhesive layer 630 may be sequentially disposed on the flat surface of the first adhesive layer 610.

[0192] Figure 6cIt can be shown Figure 5c A perspective view of the process steps shown.

[0193] Reference Figure 6c The laser L may be incident from above the second adhesive layer 630 toward the upper surface of the second adhesive layer 630 , or may be incident along the −z direction from a point in the +z direction with respect to the second adhesive layer 630 as a reference.

[0194] The laser light L may first pass through the second adhesive layer 630 including a substance with high transmittance.

[0195] Then, the laser L may be incident to the shock absorbing layer 620 to remove a portion of the shock absorbing layer 620. Therefore, the shock absorbing layer 620 may be removed before the second adhesive layer 630.

[0196] Holes 620-H may be formed in the shock absorbing layer 620. In the process of removing a portion of the shock absorbing layer 620 by the laser L, smoke F may be generated. In the current step in the process, smoke F particles may be located in the holes 620-H of the shock absorbing layer 620 because there is no space for them to move independently.

[0197] Reference Figure 6d , holes corresponding to the third touch insulation layer 450 , the first adhesive layer 610 , the impact absorbing layer 620 , and the second adhesive layer 630 , respectively, may be formed.

[0198] Figure 6d It can be shown that Figure 5d and Figure 5e After the process steps shown Figure 5f A perspective view of the process steps shown.

[0199] The second adhesive layer 630 may be formed with a hole 630-H. The impact absorbing layer 620 may be formed with a hole 620-H. The first adhesive layer 610 may be formed with a hole 610-H. The third touch insulating layer 450 may be formed with a hole 450-H. Figure 6d As shown in FIG. 1 , the hole may extend to a layer arranged below the third touch insulating layer 450. As an embodiment, the hole may extend to the substrate 100 ( Figure 4 )'s lower surface and penetrates the mother substrate of the display device.

[0200] The smoke F generated in the shock absorbing layer 620 may move in the -z direction along the holes 620-H of the shock absorbing layer 620 and the holes 610-H of the first adhesive layer 610. For example, smoke F particles may move in the -z direction due to the influence of gravity.

[0201] A portion of the smoke F particles may be collected in the bubble layer AB. In other words, a portion of the smoke F particles may be sandwiched between the first adhesive layer 610 and the third touch insulating layer 450 and may be located in the groove 513 of the light blocking layer 510 .

[0202] Another portion of the smoke F particles may move in the −z direction through the holes 450 -H of the third touch insulation layer 450 .

[0203] Reference Figure 6e , the laser L can be moved along a path to cut the mother substrate 10 of the display device.

[0204] The laser light L may move along the boundary Bd between the first area CA and the second area PA. As one embodiment, the laser light L may move in the -y direction along the boundary Bd between the first area CA and the second area PA. Figure 6e The laser L is shown to move in a straight line, but the present invention is not limited thereto. As another embodiment, in order to cut the mother substrate 10 of the display device in a curved line (eg, to form a corner of the display device), the laser L may move along a curved path.

[0205] The mother substrate 10 of the display device may be cut along the path where the laser L moves. For example, the hole 610 -H of the first adhesive layer 610 , the hole 620 -H of the impact absorbing layer 620 , the hole 630 -H of the second adhesive layer 630 , and the hole 450 -H of the third touch insulating layer 450 may extend along the path where the laser L moves.

[0206] The holes of each layer extending along the path of the laser L can be regarded as the parts cut by the laser L. Figure 6e Although not shown in the figure, the portion cut by the laser L may extend to a layer arranged below the third touch insulating layer 450. As an embodiment, the portion cut by the laser L may extend to the substrate 100 ( Figure 4 )'s lower surface and penetrates the mother substrate 10 of the display device.

[0207] As the laser L moves, the impact absorbing layer 620 is cut, and smoke F may be further generated. Figure 6d Similar to the illustrated situation, smoke F particles may move along the holes 620 -H of the impact absorbing layer 620 and the holes 610 -H of the first adhesive layer 610 in the −z direction and may be collected in the bubble layer AB.

[0208] The second opening 512 may function as an alignment mark to confirm whether the laser light L moves along an expected path. As an embodiment, the detector 20 may be aligned with the second opening 512, and a cutting process may be performed by moving the laser light L based on the position of the second opening 512 confirmed by the detector 20. During the cutting process, the detector 20 may continuously confirm the position of the second opening 512 to guide the laser light L. The detector 20 may be located in the +z direction with the second opening 512 as a reference.

[0209] At this time, if the upper end of the second opening 512 is blocked, the detector 20 cannot accurately determine the position of the second opening 512, and an error may occur in the path of the laser L. For example, if the smoke F generated by the shock absorbing layer 620 moves onto the second opening 512 and blocks the second opening 512 from the detector 20, the detector 20 may not accurately confirm the position of the second opening 512, and an error may occur in the path of the laser L.

[0210] The structure of the mother substrate 10 of the display device according to an embodiment of the present invention can prevent this situation. For example, the structure of the mother substrate 10 of the display device can prevent the smoke F generated during the cutting of the impact absorbing layer 620 from moving to the upper end of the second opening 512, thereby preventing the second opening 512 from being blocked by the smoke F.

[0211] The smoke F generated in the shock absorbing layer 620 may move along the holes 620 -H of the shock absorbing layer 620 and the holes 610 -H of the first adhesive layer 610 , and then may be collected in the bubble layer AB.

[0212] The bubble layer AB may be located in the groove 513 of the light blocking layer 510 and may be separated from the second opening 512. Since the second opening 512 and the groove 513 are separated from each other, the smoke F cannot move from the bubble layer AB located in the groove 513 to the second opening 512. Alternatively, the smoke F is blocked by a portion of the light blocking layer 510 sandwiched between the second opening 512 and the groove 513, so the smoke F cannot move to the second opening 512. Therefore, there may be no path for the smoke F to move to the upper end of the second opening 512.

[0213] Accordingly, it is possible to prevent the smoke F generated in the shock absorbing layer 620 from blocking the second opening 512 .

[0214] Figure 7 1 is a plan view showing states in process steps of a method for manufacturing a display device according to an embodiment of the present invention. Figure 7 It can be viewed from the +z direction Figure 6e A plan view of the embodiment shown.

[0215] Reference Figure 7 , Figure 7 The embodiment shown may be Figure 6e Detector 20 ( Figure 6e ) is the view observed by the reference.

[0216] The laser L may cut the mother substrate 10 of the display device while moving along the boundary Bd of the first area CA and the second area PA.

[0217] The second opening 512 may function as an alignment mark for guiding the moving direction of the laser L.

[0218] The smoke F particles may be collected in the grooves 513 of the light blocking layer 510. The smoke F particles may not be able to move across the grooves 513 to cover the second openings 512 in the +x direction.

[0219] Figure 8 FIG. 1 is a plan view schematically showing a display device manufactured by using a method for manufacturing a display device according to an embodiment of the present invention.

[0220] Reference Figure 8 The display device 1 may be a mother substrate 10 ( Figure 1 ) and cut off the first area CA (or, remove the second area PA ( Figure 1 )) of display device 1.

[0221] The display device 1 may include a display area DA and a non-display area NDA surrounding the display area DA.

[0222] A plurality of sub-pixels may be arranged in the display area DA to display an image, and each sub-pixel may include a light emitting element such as an organic light emitting diode.

[0223] The non-display area NDA is an area where no sub-pixels are arranged, and a power supply wiring for driving the sub-pixels and a printed circuit board including a driving circuit part or a terminal part, etc. may be arranged.

[0224] Fig. 9 is a cross-sectional view showing a portion of a display device manufactured by using a method for manufacturing a display device according to an embodiment of the present invention.

[0225] Reference Fig. 9 The display device 1 may be along the first area CA and the second area PA ( Figure 4 ) of the boundary Bd ( Figure 4 ) Cutting Figure 4 The mother substrate 10 ( Figure 4 ) and cut off the first area CA (or, remove the second area PA ( Figure 2 )) of display device 1.

[0226] Cutting can be performed not only on the second adhesive layer 630 , the impact absorbing layer 620 , the first adhesive layer 610 , and the third touch insulating layer 450 , but also on the layers below them. For example, cutting can be performed on the touch layer 400 , the encapsulation layer 300 , the display layer 200 , and the substrate 100 .

[0227] The light blocking layer 510 may include a step difference portion 510-G arranged at the edge of the non-display area NDA. Figure 4 ) in the light blocking layer 510. Therefore, the groove 513 ( Figure 4 ) is no longer in the shape of a groove, but may be in the shape of a step difference between the light blocking layer 510 and the third touch insulation layer 450.

[0228] The second opening 512 may be disposed adjacent to the step difference portion 510 -G. For example, the second opening 512 may be disposed between the step difference portion 510 -G and the display area DA.

[0229] The first adhesive layer 610 and the third touch insulating layer 450 may be separated from each other at the step difference portion 510-G of the light blocking layer 510. As an embodiment, a bubble layer AB sandwiched between the first adhesive layer 610 and the third touch insulating layer 450 may be arranged at the step difference portion 510-G of the light blocking layer 510. As another embodiment, the bubble layer AB is removed after the cutting process and then sealed, so that the space between the first adhesive layer 610 and the third touch insulating layer 450 may also be in a vacuum state.

[0230] Fig.10 This is a perspective view showing an enlarged portion of a display device manufactured by using a method for manufacturing a display device according to an embodiment of the present invention.

[0231] Fig.10 The embodiment shown may be in accordance with Figure 6e The second area PA is removed after the cutting is completed in the embodiment shown. Figure 6e ) situation.

[0232] Fig.10 Solid and dotted lines are used for illustration purposes only. Fig.10 The illustrated embodiment does not represent the entire display device, and it should be understood that a portion of the display device is shown in an enlarged manner.

[0233] Reference Fig.10 , the light blocking layer 510 may include a step difference portion 510 -G arranged at an edge of the non-display area NDA.

[0234] The first adhesive layer 610 may cover the edge of the light blocking layer 510 and be disposed on the light blocking layer 510. A portion of the first adhesive layer 610 may be disposed within the step difference portion 510-G of the light blocking layer 510. A portion of a side surface of the light blocking layer 510 facing the step difference portion 510-G (e.g., a side surface of the light blocking layer 510 facing the −x direction) may be covered by the first adhesive layer 610.

[0235] In the step difference portion 510-G, the first adhesive layer 610 and the third touch insulating layer 450 may be separated from each other. As one embodiment, in the step difference portion 510-G, a bubble layer AB may be interposed between the first adhesive layer 610 and the third touch insulating layer 450. As another embodiment, in the step difference portion 510-G, the space interposed between the first adhesive layer 610 and the third touch insulating layer 450 may be in a vacuum state.

[0236] Fig.11 is a plan view showing a portion of a mother substrate of a display device according to an embodiment of the present invention, and is an enlarged view showing Figure 1 An example of a floor plan of Region III.

[0237] Fig.12a is a cross-sectional view showing a portion of a mother substrate of a display device according to an embodiment of the present invention, taken along Fig.11 A cross-sectional view of the mother substrate taken along line XII-XII'.

[0238] Figure 12b is a cross-sectional view showing a portion of a mother substrate of a display device according to an embodiment of the present invention, taken along Fig.11 FIG. 1 is a cross-sectional view of another example of the mother substrate taken along line XII-XII'.

[0239] Reference Fig.11 and Fig.12a , a reflection pattern REF may be arranged in the second opening 512. In one embodiment, the reflection pattern REF may be arranged in at least one of the 2-1st opening 512-1, the 2-2nd opening 512-2, and the 2-3rd opening 512-3. In one embodiment, the reflection pattern REF may be arranged in all of the 2-1st opening 512-1, the 2-2nd opening 512-2, and the 2-3rd opening 512-3.

[0240] In one embodiment, the reflective pattern REF may completely fill the second opening 512. Fig.12a As shown, the reflective pattern REF may completely fill the 2-3 opening 512-3. In one embodiment, the upper surface of the reflective pattern REF and the upper surface of the light blocking layer 510 may be flat. In other words, the upper surface of the reflective pattern REF and the upper surface of the light blocking layer 510 may be located on the same plane. Fig.12a Different from the illustration, the upper surface of the reflection pattern REF may also be protruded or recessed from the upper surface of the light blocking layer 510 .

[0241] In one embodiment, the reflective pattern REF may include a material capable of reflecting light. In one embodiment, the reflective pattern REF may include a metal. In one embodiment, the reflective pattern REF may include a metal such as titanium (Ti), aluminum (Al), silver (Ag), or molybdenum (Mo).

[0242] Reference Fig.11 and Figure 12b , the reflection pattern REF may not be arranged in the second opening 512, but may be arranged in another layer in a manner overlapping with the second opening 512. Figure 12b As shown, the reflection pattern REF may be arranged in the same layer as the second conductive layer 440. In one embodiment, the reflection pattern REF may be formed simultaneously with the second conductive layer 440. As another embodiment, the reflection pattern REF may also be arranged in the same layer as the first conductive layer 420. In this case, the reflection pattern REF may be formed simultaneously with the first conductive layer 420. In this way, the reflection pattern REF may overlap with the second opening 512 and be arranged in various layers so that the aforementioned detector 20 ( Figure 6e ) can be identified.

[0243] Below, with Fig.12a The embodiment shown in FIG. 5 (i.e., the embodiment in which the reflection pattern REF is arranged in the second opening 512) is used as a reference for description, but this is only for the convenience of description. Therefore, it should be understood that the present invention is not limited to the case in which the reflection pattern REF is arranged in the second opening 512, but includes the case in which the reflection pattern REF overlaps with the second opening 512 and is arranged in any layer.

[0244] Fig.13 1 is a plan view showing states in process steps of a method for manufacturing a display device according to an embodiment of the present invention.

[0245] Reference Figures 6a to 6e , Figure 7 and Fig.13 ,and Fig.11 and Fig.12a Similarly, a reflection pattern REF may be arranged in the second opening 512. Figures 6a to 6e and Figure 7 The second opening 512 of the embodiment shown may also be provided with a reflection pattern REF. For example, the reflection pattern REF may be provided in the 2-1st opening 512-1, the 2-2nd opening 512-2, and the 2-3rd opening 512-3. The plan view of the embodiment in which the reflection pattern REF is provided in the second opening 512 is shown in FIG. Fig.13 .

[0246] In this case, the reflection pattern REF may perform the role of an alignment mark for guiding the moving direction of the laser L. For example, referring to Figure 6e , Figure 7 and Fig.13 , the detector 20 can be aligned with the reflection pattern REF, and the laser L can be moved based on the position of the reflection pattern REF confirmed by the detector 20 to perform the cutting process. During the cutting process, the detector 20 can also continuously confirm the position of the reflection pattern REF and guide the laser L. In an embodiment, the detector 20 can irradiate light toward the reflection pattern REF, and can determine its position by identifying the light reflected from the reflection pattern REF.

[0247] Fig.14 is a cross-sectional view showing a portion of a display device according to an embodiment of the present invention.

[0248] Reference Fig.14 The display device 1 may be along the first area CA and the second area PA ( Fig.12a ) of the boundary Bd ( Fig.12a ) Cutting Fig.12a The mother substrate 10 ( Fig.12a ) and cut off the first area CA (or, remove the second area PA ( Fig.12a )) of display device 1.

[0249] Therefore, the display device 1 may include a Fig.11 ) (eg, the 2-3 th opening 512 - 3 ) within the reflection pattern REF.

[0250] A person having ordinary knowledge in the technical field of the present invention will understand that it is possible to cut Figure 12b The mother substrate 10 ( Figure 12b ) to manufacture a display device.

[0251] Fig.15 is a plan view showing a portion of a mother substrate of a display device according to an embodiment of the present invention, and is an enlarged view showing Figure 1 An example plan view of region III.

[0252] Fig.16 is a cross-sectional view showing a portion of a mother substrate of a display device according to an embodiment of the present invention, taken along Fig.15 A cross-sectional view of the mother substrate taken along line XVI-XVI'.

[0253] Reference Fig.15 and Fig.16, the mother substrate 10 of the display device may not include a light blocking layer. Instead, the color filter 520 may be arranged on the touch layer 400. For example, the first color filter 1520, the second color filter 2520, and the third color filter 3520 may be arranged on the third touch insulating layer 450. In one embodiment, the third color filter 3520 may be arranged on the upper surface of the third touch insulating layer 450. In one embodiment, the first color filter 1520 may be arranged on the third color filter 3520. In one embodiment, the second color filter 2520 may be arranged on the first color filter 1520.

[0254] Each color filter may include an opening overlapping other sub-pixels except for the corresponding sub-pixel.

[0255] The first color filter 1520 may include an opening overlapping the second subpixel P2 and the third subpixel P3. In one embodiment, the first color filter 1520 may include a 1-1 opening 1521-1 overlapping the second subpixel P2. In one embodiment, the first color filter 1520 may include a 1-2 opening 1521-2 overlapping the third subpixel P3.

[0256] The second color filter 2520 may include openings overlapping the first subpixel P1 and the third subpixel P3. In one embodiment, the second color filter 2520 may include a 1-3 opening 2521-1 overlapping the first subpixel P1. In one embodiment, the second color filter 2520 may include a 1-4 opening 2521-2 overlapping the third subpixel P3.

[0257] The third color filter 3520 may include openings overlapping the first subpixel P1 and the second subpixel P2. In one embodiment, the third color filter 3520 may include openings 1-5 3521-1 overlapping the first subpixel P1. In one embodiment, the third color filter 3520 may include openings 1-6 3521-2 overlapping the second subpixel P2.

[0258] In one embodiment, the 1-1 opening 1521-1 of the first color filter 1520 and the 1-6 opening 3521-2 of the third color filter 3520 may overlap each other. In one embodiment, the 1-2 opening 1521-2 of the first color filter 1520 and the 1-4 opening 2521-2 of the second color filter 2520 may overlap each other. In one embodiment, the 1-3 opening 2521-1 of the second color filter 2520 and the 1-5 opening 3521-1 of the third color filter may overlap each other.

[0259] In one embodiment, a portion of the first color filter 1520 may fill the 1-5 opening 3521-1 of the third color filter 3520. In one embodiment, a portion of the second color filter 2520 may fill the 1-1 opening 1521-1 of the first color filter 1520 and the 1-6 opening 3521-2 of the third color filter 3520.

[0260] In one embodiment, the first sub-pixel P1 may emit red light. In one embodiment, the second sub-pixel P2 may emit green light. In one embodiment, the third sub-pixel P3 may emit blue light. In one embodiment, the first color filter 1520 may transmit red light. In one embodiment, the second color filter 2520 may transmit green light. In one embodiment, the third color filter 3520 may transmit blue light.

[0261] In one embodiment, light (eg, red light) emitted from the first subpixel P1 may pass through the first color filter 1520 while passing through the 1-5 opening 3521 - 1 of the third color filter 3520 , and then may pass through the 1-3 opening 2521 - 1 of the second color filter 2520 .

[0262] In one embodiment, light emitted from the second subpixel P2 (eg, green light) may pass through the second color filter 2520 while passing through the 1-1 opening 1521 - 1 of the first color filter 1520 and the 1-6 opening 3521 - 2 of the third color filter 3520 .

[0263] In one embodiment, light (eg, blue light) emitted from the third subpixel P3 passes through the third color filter 3520 , passes through the 1 - 2 opening 1521 - 2 of the first color filter 1520 , and then may pass through the 1 - 4 opening 2521 - 2 of the second color filter 2520 .

[0264] In the area where two or more overlapping color filters are formed, the overlapping color filters may perform the same operation as the aforementioned light blocking layer 510 ( Figure 4 ) is similar to the color filter. Each color filter can only transmit light of different colors. In the case of overlapping two or more color filters, light transmitted from one color filter cannot pass through other color filters. Therefore, in the case of overlapping color filters, there may be no light that passes through the overlapping color filters. Accordingly, the area where the color filters overlap is recognized by the user as black, which can play a role similar to the light blocking layer 510 ( Figure 4 ) have similar effects.

[0265] In one embodiment, the color filters 520 may overlap each other in the area between the sub-pixels in the display area DA. For example, in the area overlapping with the sub-pixel definition layer 211, the first color filter 1520, the second color filter 2520, and the third color filter 3520 may overlap each other. In one embodiment, in the area overlapping with the sub-pixel definition layer 211, the first color filter 1520 and the second color filter 2520 may be arranged in sequence on the third color filter 3520 in an overlapping manner. The area where the first color filter 1520, the second color filter 2520, and the third color filter 3520 overlap may be recognized by the user as black. Accordingly, the first conductive layer 420 and the second conductive layer 440 of the touch layer 400 may be blocked and thus not recognized by the user.

[0266] In one embodiment, a portion of the color filter may extend across the display area DA to the non-display area NDA. In one embodiment, a portion of the color filter may extend across the boundary Bd between the first area CA and the second area PA to the second area PA. In one embodiment, the first color filter 1520 and the third color filter 3520 may extend to the non-display area NDA and the second area PA. In other words, the first color filter 1520 and the third color filter 3520 may be arranged in both the first area CA and the second area PA. The first color filter 1520 and the third color filter 3520 may be recognized as black in the non-display area NDA and the second area PA. Therefore, the overlapping structure of the first color filter 1520 and the third color filter 3520 may also function as a light blocking layer 510 ( Figure 4 ) have similar effects.

[0267] In other words, refer to Figure 2 , Fig.15 and Fig.16 The mother substrate 10 of the display device of the embodiment shown may include an optical function layer 500. The optical function layer 500 of this embodiment may include a color filter 520 and may not include a light blocking layer. Furthermore, the optical function layer 500 of this embodiment may include a light-transmitting portion and a light-blocking portion.

[0268] In the present embodiment, the light-transmitting portion of the optical functional layer 500 may be understood as including the openings of each color filter overlapping with the light-emitting element of each sub-pixel and a portion of a color filter of other colors overlapping with the opening of the color filter. As an example, the 1-2 opening 1521-2, the 1-4 opening 2521-2, and a portion of the third color filter 3520 overlapping with them may be included in the light-transmitting portion of the optical functional layer 500. As another example, the 1-3 opening 2521-1, the 1-5 opening 3521-1, and a portion of the first color filter 1520 overlapping with them may be included in the light-transmitting portion of the optical functional layer 500. As another example, the 1-1 opening 1521-1, the 1-6 opening 3521-2, and a portion of the second color filter 2520 overlapping with them may be included in the light-transmitting portion of the optical functional layer 500.

[0269] In the present embodiment, the light blocking portion of the optical functional layer 500 may include the overlapped portion of each color filter 520. As an example, the overlapped portion of the color filters 520 in the region between each sub-pixel in the display area DA may be included in the light blocking portion of the optical functional layer 500. As another example, the overlapped portion of the first color filter 1520 and the third color filter 3520 in the non-display area NDA and the second area PA may be included in the light blocking portion of the optical functional layer 500.

[0270] The color filter 520 may include an alignment mark, such as a second opening 522, arranged in the non-display area NDA. The second opening 522 of the color filter 520 may include a 2-1 opening 522-1, a 2-2 opening 522-2, and a 2-3 opening 522-3 aligned along an axis (e.g., a y-axis). The second opening 522 of the color filter 520 may be formed in the first color filter 1520 and the third color filter 3520. The second opening 522 of the color filter 520 may pass through the first color filter 1520 and the third color filter 3520. The second opening 522 of the color filter 520 and the aforementioned light blocking layer 510 ( Figure 3 ) of the second opening 512 ( Figure 3 ) can be similar to each other.

[0271] The color filter 520 may include a groove 523 overlapping the boundary Bd of the first area CA and the second area PA. The groove 523 of the color filter 520 may extend along an axis (e.g., the y-axis). The groove 523 of the color filter 520 may be formed in the first color filter 1520 and the third color filter 3520. The groove 523 of the color filter 520 may penetrate the first color filter 1520 and the third color filter 3520. The groove 523 of the color filter 520 and the aforementioned light blocking layer 510 ( Figure 3 ) of the groove 513 ( Figure 3 ) can be similar to each other.

[0272] A first adhesive layer 610, an impact absorbing layer 620, and a second adhesive layer 630 may be sequentially arranged on the color filter 520. A portion of the first adhesive layer 610 may be arranged in the groove 523 of the color filter 520. A bubble layer AB may be interposed between a portion of the first adhesive layer 610 arranged in the groove 523 of the color filter 520 and the upper surface of the third touch insulating layer 450.

[0273] Although in Fig.15 and Fig.16 , but in one embodiment, a reflective pattern REF ( Fig.11 ).

[0274] Fig.17 1 is a plan view showing states in process steps of a method for manufacturing a display device according to an embodiment of the present invention.

[0275] Reference Figure 7 and Fig.17 , Fig.17 The color filter 520 may perform the same Figure 7 The light blocking layer 510 has a similar function.

[0276] Fig.17 The second opening 522 of the color filter 520 may perform Figure 7 In one embodiment, the laser L can cut the mother substrate 10 of the display device while moving along the boundary Bd between the first area CA and the second area PA. At this time, the second opening 522 of the color filter 520 can perform the role of an alignment mark for guiding the moving direction of the laser L.

[0277] Fig.17 The groove 523 of the color filter 520 may be performed with Figure 7 The second opening 522 of the color filter 520 may be blocked by the second opening 523 of the light blocking layer 510. In one embodiment, the smoke F particles may be collected in the groove 523 of the color filter 520. The smoke F particles may not move across the groove 523 of the color filter 520 along the +x direction, and thus may not block the second opening 522 of the color filter 520.

[0278] Fig.18 is a cross-sectional view showing a portion of a display device according to an embodiment of the present invention.

[0279] Reference Fig.18 The display device 1 may be along the first area CA and the second area PA ( Fig.16 ) of the boundary Bd ( Fig.16 ) Cutting Fig.16 The mother substrate 10 ( Fig.16 ) and cut off the first area CA (or, remove the second area PA ( Fig.16 )) of display device 1.

[0280] Reference Figure 8 and Fig.18 ,and Figure 8 Similarly, the color filter 520 may include a step difference portion 520-G arranged at the edge of the non-display area NDA. Fig.16 ) may be removed. Therefore, the groove 523 ( Fig.16 ) may no longer be in the shape of a groove, but may be in a step difference shape. For example, the space may be in the shape of a step difference between the first color filter 1520, the third color filter 3520, and the third touch insulating layer 450.

[0281] A portion of the first adhesive layer 610 may be disposed within the step difference portion 520-G of the color filter 520. At this time, the portion of the first adhesive layer 610 and the upper surface of the touch layer 400 (e.g., the upper surface of the third touch insulating layer 450) may be separated from each other. A bubble layer AB may be interposed between the portion of the first adhesive layer 610 and the upper surface of the touch layer 400 (e.g., the upper surface of the third touch insulating layer 450).

[0282] Although in Fig.17 and Fig.18 , but in one embodiment, a reflective pattern REF ( Fig.11 ).

[0283] The present invention as described above is described with reference to an embodiment shown in the accompanying drawings, but this is only an example, and anyone with ordinary knowledge in the art will understand that various modifications and other equivalent embodiments can be made. Therefore, the true technical protection scope of the present invention should be determined by the technical ideas of the attached claims.

Claims

1. A method for manufacturing a display device, comprising the following steps: preparing a substrate including a first area and a second area surrounding the first area, wherein a display layer including a plurality of light emitting elements is arranged on the first area of ​​the substrate; and An optical functional layer is arranged on the display layer, and the optical functional layer includes a light-transmitting portion that at least partially overlaps with the multiple light-emitting elements, a light-blocking portion that at least partially surrounds the light-transmitting portion, an alignment mark formed on the light-blocking portion adjacent to a boundary between the first area and the second area, and a groove extending along the boundary between the first area and the second area.

2. The method for manufacturing a display device according to claim 1, wherein: The light-blocking portion of the optical function layer includes a light-blocking layer including a plurality of openings overlapping with the plurality of light-emitting elements, The light-transmitting portion of the optical function layer includes a plurality of color filters arranged in the plurality of openings of the light-blocking layer.

3. The method for manufacturing a display device according to claim 1, wherein: The optical function layer includes a plurality of color filters that transmit light of colors different from each other, The light blocking portion includes at least two overlapping portions of the plurality of color filters.

4. The method for manufacturing a display device according to claim 1, wherein: The alignment mark includes a plurality of openings arranged spaced apart from each other along a direction, In a plan view, a shape of one of the plurality of openings is different from a shape of another of the plurality of openings.

5. The method for manufacturing a display device according to claim 4, wherein: The plurality of openings of the alignment mark penetrate through the optical function layer.

6. The method for manufacturing a display device according to claim 4, further comprising the following steps: A reflective pattern is formed to at least partially overlap the plurality of openings of the alignment mark.

7. The method for manufacturing a display device according to claim 1, further comprising the following steps: sequentially arranging a first adhesive layer, an impact absorbing layer and a second adhesive layer on the optical functional layer; and The second adhesive layer, the impact absorbing layer, the first adhesive layer, the display layer, and the substrate are cut along a path adjacent to the alignment mark of the optical function layer.

8. The method for manufacturing a display device according to claim 7, wherein: A portion of the first adhesive layer is disposed in the groove of the optical function layer, and a bubble layer is formed below the portion of the first adhesive layer.

9. The method for manufacturing a display device according to claim 7, wherein: In the cutting step, the path overlaps with the boundary between the first area and the second area.

10. The method for manufacturing a display device according to claim 7, wherein: The cutting step comprises the following steps: A laser is incident on the second adhesive layer in the order of the second adhesive layer, the impact absorbing layer, the first adhesive layer, the display layer, and the substrate.

11. The method for manufacturing a display device according to claim 7, wherein: In the step of cutting, the impact absorbing layer is cut before the second adhesive layer is cut and before the first adhesive layer is cut.

12. The method for manufacturing a display device according to claim 7, wherein: At least a portion of the smoke generated during the cutting of the impact absorbing layer is located in the grooves of the optical functional layer.

13. A display device, comprising: A substrate, comprising a display area where a plurality of light emitting elements are arranged and a non-display area surrounding the display area; A touch layer, arranged on the substrate; as well as An optical functional layer is arranged on the touch layer and includes a light-transmitting portion at least partially overlapping the plurality of light-emitting elements, a light-blocking portion at least partially surrounding the light-transmitting portion, a step difference portion arranged at an edge of the non-display area, and an alignment mark arranged in the non-display area adjacent to the step difference portion.

14. The display device according to claim 13, wherein: The light-blocking portion of the optical function layer includes a light-blocking layer including a plurality of openings overlapping with the plurality of light-emitting elements, The light-transmitting portion of the optical function layer includes a plurality of color filters arranged in the plurality of openings of the light-blocking layer.

15. The display device according to claim 13, wherein: The optical function layer includes a plurality of color filters that transmit light of colors different from each other, The light blocking portion includes at least two overlapping portions of the plurality of color filters.

16. The display device according to claim 13, wherein: The alignment mark includes a plurality of openings arranged in the light blocking portion and spaced apart from each other along a direction, In a plan view, a shape of one of the plurality of openings is different from a shape of another of the plurality of openings.

17. The display device according to claim 16, wherein: The plurality of openings of the alignment mark penetrate through the optical function layer.

18. The display device according to claim 16, further comprising: The reflective pattern at least partially overlaps the plurality of openings of the alignment mark.

19. The display device according to claim 13, further comprising: The first adhesive layer is arranged on the optical function layer so as to cover an edge of the optical function layer adjacent to the step portion, and a portion of the first adhesive layer is located in the step portion.

20. The display device according to claim 19, wherein: The first adhesive layer and the touch layer are spaced apart from each other at the step difference portion.

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