Broken wire post-processing device, wire cutting equipment and wire cutting method

Abstract

The invention provides a broken wire post-processing device, wire cutting equipment and a wire cutting method.The broken wire post-processing device comprises a separating assembly and a wire cutting assembly, the separating assembly comprises a plurality of first separating parts and a plurality of second separating parts, and the first separating parts are sequentially arranged at intervals in the first direction; the plurality of first separation parts are used for being clamped into a first gap between cut adjacent silicon wafers in a silicon rod to be cut so as to separate the adjacent silicon wafers; the second separating parts are sequentially arranged at intervals in the first direction and used for being clamped into second gaps between the repaired adjacent cutting lines so as to isolate the adjacent cutting lines; and the moving assembly is connected to the separating assembly, and the moving assembly can drive the first separating part to be clamped into or separated from the first gap and drive the second separating part to be clamped into or separated from the second gap. According to the wire breakage post-processing device, the wire cutting equipment and the wire cutting method, the silicon rod can be quickly recovered to the pre-wire-breakage processing position after wire breakage.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor processing technology, and in particular to a wire-break post-processing device, a wire cutting device and a wire cutting method. Background Art

[0002] As the carrier of semiconductor circuit manufacturing process, the quality of silicon wafer has a decisive influence on the formation of integrated circuits. At present, the main processes in the initial forming process of silicon wafers include: silicon rod cutting, physical and chemical grinding, chemical etching, physical and chemical polishing, etc. Silicon rod cutting is one of the core processes in the silicon wafer forming process, which mainly includes multi-wire slurry (SiC) cutting and inner circle cutting. The mainstream process currently used is multi-wire cutting, because compared with inner circle cutting, multi-wire cutting has the advantages of high efficiency, good quality and high wafer output rate.

[0003] Multi-wire cutting is an advanced slicing processing technology. Its principle is to wind the cutting wires in the guide grooves formed on the circumferential surface of the bobbin 11a at intervals so that the cutting wires form a cutting wire segment array. In the cutting operation of the silicon rod, the mortar is sprayed onto the cutting wire at a certain pressure, and the cutting wire and the mortar are carried out through reciprocating motion to cut the silicon rod. In addition to cutting the silicon rod, the mortar also plays the role of lubricating and cleaning the debris generated by cutting, and can also take away the heat generated by cutting.

[0004] During the wire cutting process, the cutting wire will be worn by the mortar and the silicon rod, and in severe cases, the wire may break (WireBroken). After the wire breaks, the silicon rod needs to be lifted, the broken wire needs to be reconnected or replaced with a new cutting wire, and after the cutting wire is repaired, the silicon rod needs to be lowered to the position when the wire broke.

[0005] However, since the distance between adjacent silicon wafers that have been cut from the silicon rod is small and they are attracted to each other, it is necessary to ensure that the cutting line can enter between the silicon wafers when the silicon rod is lowered. However, since the gap between adjacent silicon wafers that have been cut when the silicon rod is lowered is too small, it is difficult to lower the silicon rod. If the silicon rod cannot be restored to the processing position when the wire is broken, the silicon rod cannot continue to be cut, resulting in product loss.

[0006] At present, the method of handling wire breakage in wire cutting equipment is to use air gun to separate the cut silicon wafers so that the cutting wire can enter the silicon rod and continue cutting. However, this method is time-consuming. The longer the recovery time after wire breakage, the greater the impact of thermal deformation on the surface of silicon wafer, which will eventually lead to the deterioration of silicon wafer flatness parameters and yield loss. Summary of the invention

[0007] In order to solve at least one technical problem in the above-mentioned prior art, the embodiments of the present disclosure provide a wire break post-processing device, a wire cutting device and a wire cutting method.

[0008] The technical solutions provided by the embodiments of the present disclosure are as follows:

[0009] In a first aspect, an embodiment of the present disclosure provides a post-broken wire processing device, which is applied to a wire cutting device capable of cutting silicon rods; the post-broken wire processing device comprises:

[0010] A separation assembly, comprising a plurality of first separation components and a plurality of second separation components, wherein the plurality of first separation components are sequentially spaced apart along a first direction, and the plurality of first separation components are configured to be inserted into first gaps between adjacent silicon wafers that have been cut in a silicon rod to be cut, so as to separate the adjacent silicon wafers; a plurality of second separation components are sequentially spaced apart along the first direction, and the plurality of second separation components are configured to be inserted into second gaps between adjacent cutting lines that have been repaired, so as to separate the adjacent cutting lines; wherein the first direction is the axial direction of the silicon rod to be cut; and

[0011] A moving component is connected to the separation component, and the moving component can drive the first separation component to be inserted into or separated from the first gap, and drive the second separation component to be inserted into or separated from the second gap.

[0012] Exemplarily, the separation assembly includes at least one group of separation units, each group of separation units includes a connecting rod extending axially along the first direction, and a plurality of comb tooth structures arranged in sequence and at intervals along the axial direction of the connecting rod, each of the comb tooth structures includes a comb body portion, a first comb tooth portion and a second comb tooth portion, the comb body portion extends perpendicular to the axial direction of the connecting rod, the first comb tooth portion and the second comb tooth portion are connected to the comb body portion and are arranged at intervals; wherein, the first comb tooth portions in a plurality of the comb tooth structures cooperate together to form a plurality of the first separation components, and the second comb tooth portions in a plurality of the comb tooth structures cooperate together to form a plurality of the second separation components.

[0013] Exemplarily, the moving assembly includes a rotating mechanism, which includes a rotating shaft, the axial direction of the rotating shaft extending along the first direction, wherein the connecting rod is connected to the rotating shaft, and a plurality of the comb tooth structures can rotate around the rotating shaft so that a plurality of the first comb tooth portions can be inserted into or disengaged from the first gap, and a plurality of the second comb tooth portions can be inserted into or disengaged from the second gap.

[0014] Exemplarily, the moving assembly also includes a lifting mechanism, the rotating mechanism and one of the connecting rods are connected to the lifting mechanism, and the lifting mechanism is configured to drive the connecting rod to move along a second direction toward or away from the silicon rod to be cut, wherein the second direction is a direction from the silicon rod to be cut toward the cutting line.

[0015] Exemplarily, the lifting mechanism includes a guide rail and a slider, the slider is slidably matched with the guide rail, and the rotating mechanism and the connecting rod are installed on the slider.

[0016] Exemplarily, the separation assembly includes two groups of separation units, which are located on opposite sides of the silicon rod to be cut in a third direction, and the third direction is perpendicular to the first direction and parallel to the silicon wafer, wherein a comb tooth groove is formed between the first comb tooth portion and the second comb tooth portion, and the openings of the comb tooth grooves in the two groups of separation units are arranged facing each other.

[0017] Exemplarily, in each group of the separation units, a spacing between two adjacent comb-tooth structures along the extending direction of the connecting rod is 1.035-1.060 mm.

[0018] Exemplarily, in each group of the separation units, the distance between two adjacent comb-tooth structures along the extending direction of the connecting rod is adjustable.

[0019] In a second aspect, an embodiment of the present disclosure provides a wire cutting device, comprising the wire break post-processing device as described above.

[0020] In a third aspect, an embodiment of the present disclosure provides a wire cutting method, which is applied to the wire cutting device as described above, and the wire cutting method comprises the following steps:

[0021] After the cutting line breaks during the wire cutting process, the silicon rod is moved away from the cutting line so that the silicon rod is separated from the cutting line;

[0022] The separation component is moved by the moving component, so that the first separation components are inserted into the first gaps between adjacent silicon wafers that have been cut in the silicon rod to be cut, so as to separate the adjacent silicon wafers;

[0023] Move the silicon rod toward the direction close to the repaired cutting line, so that the plurality of the second separation components are inserted into the second gaps between the repaired adjacent cutting lines, and separate the adjacent cutting lines, until the repaired cutting line enters the second gaps between the adjacent silicon wafers;

[0024] The separation component is moved by the moving component so that the first separation component is separated from the first gap and the second separation component is separated from the second gap.

[0025] The beneficial effects brought by the embodiments of the present disclosure are as follows:

[0026] In the wire break post-processing device, wire cutting equipment and wire cutting method provided in the embodiments of the present disclosure, the wire break post-processing device includes a separation component and a moving component. After the cutting line breaks during the wire cutting process, the silicon rod can be moved in a direction away from the cutting line to make the silicon rod detach from the cutting line; the separation component is moved by the moving component to make several first separation components snap into the first gap between the adjacent silicon wafers that have been cut in the silicon rod to be cut to isolate the adjacent silicon wafers; the silicon rod is moved in a direction close to the repaired cutting line to make several second separation components snap into the second gap between the adjacent cutting lines that have been repaired to isolate the adjacent cutting lines until the repaired cutting line enters the second gap between the adjacent silicon wafers; the separation component is moved by the moving component to make the first separation component detach from the first gap and the second separation component detach from the second gap. In this way, the post-breakage processing device can ensure that the first gap between adjacent silicon wafers that have been cut after the cutting line breaks is separated by the first separation component, so that the repaired cutting line can smoothly enter the silicon rod to continue cutting, and the silicon rod can be quickly restored to the processing position before the breakage, and the wire cutting can continue, thereby solving the problem of long recovery time after breakage in the prior art, improving production capacity, reducing the impact of thermal deformation of silicon wafers, and improving product yield. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Figure 1 A schematic diagram showing the structure of a wire cutting device in the prior art;

[0028] Figure 2 A schematic diagram showing the structure of the silicon rod to be cut after the cutting line is broken;

[0029] Figure 3 One of the structural schematic diagrams of the wire cutting device in the embodiment of the present disclosure is shown;

[0030] Figure 4 A second structural schematic diagram showing a wire cutting device according to an embodiment of the present disclosure;

[0031] Figure 5 A schematic diagram showing the structure of a group of separation units in a wire cutting device according to an embodiment of the present disclosure. DETAILED DESCRIPTION

[0032] In order to make the purpose, technical solution and advantages of the embodiments of the present disclosure clearer, the technical solution of the embodiments of the present disclosure will be clearly and completely described below in conjunction with the drawings of the embodiments of the present disclosure. Obviously, the described embodiments are part of the embodiments of the present disclosure, not all of the embodiments. Based on the described embodiments of the present disclosure, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present disclosure.

[0033] Unless otherwise defined, the technical terms or scientific terms used in the present disclosure should be understood by people with ordinary skills in the field to which the present disclosure belongs. The "first", "second" and similar words used in the present disclosure do not indicate any order, quantity or importance, but are only used to distinguish different components. Similarly, similar words such as "one", "one" or "the" do not indicate quantity restrictions, but indicate that there is at least one. Similar words such as "include" or "comprise" mean that the elements or objects appearing before the word cover the elements or objects listed after the word and their equivalents, without excluding other elements or objects. Similar words such as "connect" or "connected" are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect. "Up", "down", "left", "right" and the like are only used to indicate relative positional relationships. When the absolute position of the described object changes, the relative positional relationship may also change accordingly.

[0034] The features such as "parallel", "perpendicular", and "same" used in the embodiments of the present disclosure include the features such as "parallel", "perpendicular", and "same" in a strict sense, as well as the cases where "approximately parallel", "approximately perpendicular", "approximately the same", etc. include certain tolerances, taking into account the tolerances associated with the measurement of specific quantities (e.g., the limitations of the measurement system), and represent the acceptable deviation range for a specific value determined by ordinary technicians in the field. For example, "approximately" can mean within one or more standard deviations, or within 3% or 5% of the value.

[0035] In addition, in this document, unless otherwise defined, the terms "substantially", "substantially", "approximately" and "about" are used to describe and explain small changes. When used with an event or situation, these terms can cover situations where the event or situation occurs exactly, and can also cover situations where the event or situation occurs approximately. For example, when used with a numerical value, these terms can include a range of variation of less than or equal to 10% of the numerical value, such as less than or equal to ±5%, less than or equal to ±4%, less than or equal to ±3%, less than or equal to ±2%, less than or equal to ±1%, less than or equal to ±0.5%, less than or equal to ±0.1%, less than or equal to ±0.05%. The term "substantially coplanar" can refer to two surfaces being arranged along the same plane in the micrometer range, for example, arranged along the same plane within 40μm, 30μm, 20μm, 10μm or 1μm.

[0036] See also Figure 1 , which shows a schematic diagram of a conventional wire cutting device, it can be understood that Figure 1 The structure shown is only for the purpose of illustrating the principle, and does not mean that those skilled in the art will not be able to Figure 1The embodiments of the present invention do not impose any specific limitation on the addition or reduction of components in the illustrated structure.

[0037] like Figure 1 As shown, the wire cutting device may include a wire cutting unit 11 and a carrying unit 12 ; the wire cutting unit 11 may be placed vertically below the carrying unit 12 in some examples, or may be placed vertically above the carrying unit 12 in some examples.

[0038] Specifically, the wire cutting unit 11 may include a plurality of wire reels 11a and a cutting wire 30, wherein the cutting wire 30 is wound around the wire reels 11a to form an array of cutting wire segments parallel to each other; Figure 1 In the embodiment, the number of the bobbins 11a is 2 as an example, and the reciprocating motion directions of the bobbins 11a and the cutting wire 30 toward and away from the carrying unit 12 are as follows: Figure 1 As shown by the solid arrow in FIG. 1 , the reciprocating speed may be 10 m / s to 15 m / s. The carrying unit 12 is used to load and fix the silicon rod 20 to be cut. Figure 1 In the example shown, the carrying unit 12 may include a base 121 and an intermediate piece 122. The intermediate piece 122 may fix the silicon rod to be cut to the base 121. For example, the silicon rod to be cut may be fixed to the base 121 by bonding its circumferential surface to the lower surface or upper surface of the base using resin.

[0039] for Figure 1 The wire cutting device shown in the figure can move the wire cutting unit 11 or the carrying unit 12 to make the cutting wire 30 and the silicon rod 20 to be cut move toward each other in the vertical direction. After the cutting wire 30 and the silicon rod 20 to be cut come into contact with each other, the silicon rod 20 to be cut is cut by using the movement of the cutting wire 30 along its extension direction.

[0040] In such Figure 1 In the example shown, the wire cutting unit 11 can be moved in the direction indicated by the arrow to achieve vertical movement of the cutting wire 30 and the silicon rod 20 to be cut toward each other.

[0041] It should be noted that the embodiment of the present invention realizes the relative movement between the wire cutting unit 11 or the carrying unit 12 by installing a lifting device (not shown in the figure). It can be understood that those skilled in the art can also realize the movement of the wire cutting unit 11 or the carrying unit 12 in other ways according to actual needs and implementation scenarios.

[0042] It should be noted that during the wire cutting operation, the diameter of the wire spool 11a is larger than the diameter of the silicon rod, so that the distance between the cutting wire segment arrays located on the upper and lower sides of the wire spool 11a is larger than the diameter of the silicon rod. In this way, only the cutting wire segment array located on one side of the wire spool 11a will cut the silicon rod, while the cutting wire segment array located on the other side of the wire spool 11a will not contact the silicon rod, so that Figure 1 For example, the cutting wire is wound around the bobbin 11a, where only the cutting wire segment array located above the bobbin 11a will cut the silicon wafer, so the wire cutting area is also located on the upper side of the bobbin 11a, and the cutting wire segment leaving the wire cutting area will move to the lower side of the bobbin 11a. After traveling a certain distance without load, the bobbin 11a returns to the upper side of the bobbin 11a and enters the wire cutting area again to participate in the cutting operation, and so on, until it leaves the bobbin 11a and is taken up by the take-up wheel. During the wire cutting process, the cutting wire brings the mortar to the cutting position through reciprocating motion, so it will continue to be worn by the mortar and the silicon rod, and the cutting wire is always under a certain tension.

[0043] For the above reasons, the cutting wire may break during the cutting process. If the cutting wire breaks at one point, the entire cutting wire cannot be used any further and the cutting operation must be interrupted. It is particularly noted here that since the entire cutting wire is subjected to a certain tension during the wire cutting process, any part of the cutting wire that has undergone the wire cutting operation may break, for example, the wire break may occur in the cutting area or outside the cutting area, that is, the location of the wire break point is uncertain.

[0044] After the wire breaks, the cutting wire needs to be repaired by replacing the cutting wire or the like. Before starting the cutting operation again, the cutting wire needs to be restored to the position in the silicon rod before the wire breaks.

[0045] However, in the prior art, during the wire cutting process, the cutting wire will be worn by the mortar and the silicon rod, and in severe cases, the wire may break. After the wire breaks, the silicon rod needs to be lifted, the broken wire is reconnected or replaced with a new cutting wire, and after the cutting wire is repaired, the silicon rod is lowered to the position when the wire breaks.

[0046] However, see Figure 2 As shown, since the spacing between adjacent silicon wafers 21 of the cut portions of the silicon rod 10 is small and mutually attracted, it is necessary to ensure that the cutting line can enter between the silicon wafers 21 when the silicon rod 20 to be cut is lowered. However, since the first gap A between the adjacent silicon wafers 21 that have been cut when the silicon rod 20 to be cut is lowered is too small, it is difficult for the silicon rod 20 to be cut to be lowered. If the silicon rod 20 to be cut cannot be restored to the processing position when the line is broken, the cutting cannot be completed, resulting in product loss.

[0047] At present, the method of handling wire breakage in wire cutting equipment is to use air gun to separate the cut silicon wafers so that the cutting wire can enter the silicon rod and continue cutting. However, this method is time-consuming. The longer the recovery time after wire breakage, the greater the impact of thermal deformation on the surface of silicon wafer, which will eventually lead to the deterioration of silicon wafer flatness parameters and yield loss.

[0048] In view of this, a post-wire break processing device is provided in an embodiment of the present disclosure, which can be applied to wire cutting equipment that can cut silicon rods. It can solve the problem of long recovery time after wire break in the prior art, improve production capacity, reduce the impact of thermal deformation of silicon wafers, and improve product yield.

[0049] See also Figure 3 and Figure 4 As shown, the post-broken wire processing device provided by the embodiment of the present disclosure includes a separation component 100 and a moving component 200 .

[0050] Please combine Figures 2 to 5 As shown, the separation assembly 100 includes a plurality of first separation components 110 and a plurality of second separation components 120, wherein the plurality of first separation components 110 are sequentially spaced apart along a first direction X, and the plurality of first separation components 110 are configured to be inserted into a first gap A between adjacent silicon wafers 21 that have been cut in a silicon rod 20 to be cut, so as to separate the adjacent silicon wafers 21; the plurality of second separation components 120 are sequentially spaced apart along the first direction X, and the plurality of second separation components 120 are configured to be inserted into a second gap between adjacent repaired cutting lines 30, so as to separate the adjacent cutting lines 30; wherein the first direction X is the axial direction of the silicon rod 20 to be cut.

[0051] The moving component 200 is connected to the separating component 100 , and the moving component 200 can drive the first separating component 110 to be inserted into or separated from the first gap A, and drive the second separating component 120 to be inserted into or separated from the second gap.

[0052] After the cutting line 30 breaks during the online cutting process, the silicon rod 20 to be cut can be moved away from the cutting line 30 to make the silicon rod 20 to be cut detached from the cutting line 30; the separation component 100 is moved by the moving component 200 to make several of the first separation components 110 snap into the first gap A between the adjacent silicon wafers 21 that have been cut in the silicon rod 20 to be cut, so as to isolate the adjacent silicon wafers 21; the silicon rod 20 to be cut is moved toward the direction close to the repaired cutting line 30, so as to make several of the second separation components 120 snap into the second gap between the adjacent cutting lines 30 that have been repaired, so as to isolate the adjacent cutting lines 30, until the repaired cutting line 30 enters the second gap between the adjacent silicon wafers 21; the separation component 100 is moved by the moving component 200 to make the first separation component 110 detach from the first gap A, and the second separation component 120 detach from the second gap.

[0053] In this way, the post-breakage processing device can ensure that the first gap A between the adjacent silicon wafers 21 that have been cut after the cutting line 30 breaks is separated by the first separation component 110, so that the repaired cutting line 30 can smoothly enter the silicon rod 20 to be cut and continue cutting. The silicon rod 20 to be cut can be quickly restored to the processing position before the breakage, and the wire cutting can continue, which solves the problem of long recovery time after breakage in the prior art, improves production capacity, reduces the influence of thermal deformation of the silicon wafer 21, and improves product yield.

[0054] As an exemplary embodiment, Figures 2 to 5 As shown, the separation component 100 includes at least one group of separation units 100A, each group of separation units 100A includes a connecting rod 101 extending axially along the first direction X, and a plurality of comb tooth structures 102 arranged in sequence along the axial direction of the connecting rod 101, each of the comb tooth structures 102 includes a comb body 1021, a first comb tooth portion 1022 and a second comb tooth portion 1023, the comb body 1021 extends perpendicular to the axial direction of the connecting rod 101, the first comb tooth portion 1022 and the second comb tooth portion 1023 are connected to the comb body 1021 and are arranged at intervals; wherein, the first comb tooth portions 1022 in a plurality of the comb tooth structures 102 cooperate together to form a plurality of the first separation components 110, and the second comb tooth portions 1023 in a plurality of the comb tooth structures 102 cooperate together to form a plurality of the second separation components 120.

[0055] By adopting the above scheme, the separation component 100 is implemented by a comb tooth structure 102 in a comb tooth shape, and the first comb tooth portion 1022 and the second comb tooth portion 1023 in the comb tooth structure 102 can move synchronously with the comb body portion 1021, and a plurality of the comb tooth structures 102 can move synchronously driven by the connecting rod 101. The structure is simple, and by synchronously moving a plurality of the comb tooth structures 102, the first comb tooth portion 1022 and the second comb tooth portion 1023 can be synchronously moved to a position where they are inserted into the first gap A and the second gap, or to a position where they are separated from the first gap A and the second gap. It should be understood that in other embodiments not shown in the present disclosure, the specific structure of the separation component 100 is not limited thereto.

[0056] Furthermore, in some embodiments, Figure 3 and Figure 4 As shown, the moving assembly 200 includes a rotating mechanism 210, and the rotating mechanism 210 includes a rotating shaft 211, and the axial direction of the rotating shaft 211 extends along the first direction X, wherein the connecting rod 101 is connected to the rotating shaft 211, and the plurality of comb tooth structures 102 are rotatable around the rotating shaft 211 so that the plurality of first comb tooth portions 1022 are engaged in or disengaged from the first gap A, and the plurality of second comb tooth portions 1023 are engaged in or disengaged from the second gap.

[0057] By adopting the above solution, the connecting rod 101 is driven to rotate by the rotating shaft 211 to achieve the insertion or disengagement of the comb structure 102 into or from the first gap A and the second gap. The structure is simple, easy to implement and simple to operate.

[0058] In addition, in some exemplary embodiments, the moving assembly 200 may also include a lifting mechanism 220, and the rotating mechanism 210 and one of the connecting rods 101 are connected to the lifting mechanism 220, and the lifting mechanism 220 is configured to be able to drive the connecting rod 101 to move along a second direction Y toward or away from the silicon rod to be cut 20, wherein the second direction Y is a direction from the silicon rod to be cut 20 to the cutting line 30.

[0059] In the above scheme, after the cutting line 30 breaks, the silicon rod 20 to be cut will first be lifted away from the cutting line 30 in a direction away from the cutting line 30, and then move towards the cutting line 30 after the cutting line 30 is repaired, until the cutting line 30 reaches the processing position before the cutting line 30 breaks. Therefore, the separation component 100 can be lifted and lowered by the lifting mechanism 220 along the direction from the silicon rod 20 to be cut to the cutting line 30 (i.e., the second direction Y) to adapt to the position change of the silicon rod 20 to be cut.

[0060] Furthermore, the separation assembly 100 can be raised and lowered along the second direction Y by the lifting mechanism 220 . In addition, when no wire breakage occurs, during a normal cutting process, the separation assembly 100 can be kept away from the silicon rod 20 to be cut to avoid interference between the two.

[0061] As an exemplary embodiment, Figure 3 and Figure 4 As shown, the lifting mechanism 220 includes a guide rail 221 and a slider 222, the slider 222 is slidably matched with the guide rail 221, and the rotating mechanism 210 and the connecting rod 101 are mounted on the slider 222. Exemplarily, the guide rail 221 can be any suitable component such as a lead screw, a telescopic rod, etc. However, it is understandable that the specific structure of the lifting mechanism 220 is not limited thereto.

[0062] In addition, as an exemplary embodiment, Figure 3 As shown, the separation assembly 100 includes two groups of separation units 100A, and the two groups of separation units 100A are located on opposite sides of the silicon rod 20 to be cut in a third direction Z, and the third direction Z is perpendicular to the first direction X and parallel to the silicon wafer 21, wherein a comb tooth groove 1024 is formed between the first comb tooth portion 1022 and the second comb tooth portion 1023, and the openings of the comb tooth groove 1024 in the two groups of separation units 100A are arranged facing each other.

[0063] In the above solution, the two groups of separation units 100A can be respectively inserted into the first gaps A between adjacent silicon wafers 21 from both radial sides of the silicon rod 20 to be cut, so as to ensure that the first gaps A between the silicon wafers 21 are uniform and the silicon wafers 21 are flat.

[0064] In addition, as an exemplary embodiment, in each group of the separation units 100A, the distance between two adjacent comb-tooth structures 102 along the extending direction of the connecting rod 101 is 1.035-1.060 mm. The appropriate distance can be selected according to the thickness of the processed silicon wafer 21.

[0065] In some exemplary embodiments, in each group of the separation units 100A, the spacing between two adjacent comb-tooth structures 102 along the extending direction of the connecting rod 101 may be fixed. For example, the wire spool 11a in the wire cutting unit 11 of the wire cutting device has a wire groove for winding the cutting wire 30, and the spacing between two adjacent comb-tooth structures 102 can be set according to the spacing of the wire grooves on the wire spool 11a.

[0066] In other embodiments, in each group of the separation units 100A, the spacing between two adjacent comb-tooth structures 102 along the extending direction of the connecting rod 101 may be adjustable. For example, the comb-tooth structure 102 may be slidably connected to the connecting rod 101, so that the spacing between two adjacent comb-tooth structures 102 along the extending direction of the connecting rod 101 is adjustable.

[0067] In addition, as an exemplary embodiment, the material of the comb tooth structure 102 can be selected from PVC (polyvinyl chloride), PU (polyurethane), PTFE (polytetrafluoroethylene) and carbon materials (such as carbon fiber) and the like.

[0068] In addition, an embodiment of the present disclosure provides a wire cutting device, including a wire break post-processing device provided in an embodiment of the present disclosure. In addition to the above-mentioned wire break post-processing device, the other essential components of the wire cutting device (such as a wire cutting unit, etc.) should be understood by those of ordinary skill in the art, and will not be elaborated here, nor should they be used as limitations on the present disclosure. Since the principle of solving the problem by the wire cutting device is similar to the principle of solving the problem by the above-mentioned wire break post-processing device, the embodiment of the wire cutting device provided in an embodiment of the present disclosure can refer to the embodiment of the above-mentioned wire break post-processing device provided in an embodiment of the present disclosure, and will not be elaborated here.

[0069] In addition, an embodiment of the present disclosure provides a wire cutting method, which is applied to the wire cutting device provided in an embodiment of the present disclosure. The wire cutting method includes the following steps:

[0070] Step S01, after the cutting line 30 is broken during the wire cutting process, the silicon rod is moved away from the cutting line 30 so that the silicon rod is separated from the cutting line 30;

[0071] Step S02, moving the separation component 100 by the moving component 200, so that the first separation components 110 are inserted into the first gaps A between the adjacent silicon wafers 21 that have been cut in the silicon rod 20 to be cut, so as to separate the adjacent silicon wafers 21;

[0072] Step S03, moving the silicon rod toward the direction close to the repaired cutting line 30, so that the plurality of the second separation components 120 are inserted into the second gaps between the repaired adjacent cutting lines 30, isolating the adjacent cutting lines 30, until the repaired cutting line 30 enters the second gaps between the adjacent silicon wafers 21;

[0073] Step S04: Move the separation component 100 by the moving component 200 so that the first separation component 110 is separated from the first gap A, and the second separation component 120 is separated from the second gap.

[0074] Since the principle of solving the problem by the wire cutting device is similar to the principle of solving the problem by the above-mentioned post-broken wire processing device, the embodiment of the wire cutting device provided in the embodiment of the present disclosure can refer to the embodiment of the above-mentioned post-broken wire processing device provided in the embodiment of the present disclosure, and will not be repeated here.

[0075] There are a few points to note:

[0076] (1) The drawings of the embodiments of the present disclosure only relate to the structures related to the embodiments of the present disclosure, and other structures may refer to the general design.

[0077] (2) For the sake of clarity, in the drawings used to describe the embodiments of the present disclosure, the thickness of layers or regions is exaggerated or reduced, that is, these drawings are not drawn according to the actual scale. It is understood that when an element such as a layer, film, region or substrate is referred to as being "on" or "under" another element, the element may be "directly" "on" or "under" the other element or there may be intermediate elements.

[0078] (3) In the absence of conflict, the embodiments of the present disclosure and the features therein may be combined with each other to obtain new embodiments.

[0079] The above are only specific implementations of the present disclosure, but the protection scope of the present disclosure is not limited thereto, and the protection scope of the present disclosure shall be based on the protection scope of the claims.

Claims

1. A wire-break post-processing device, applied to a wire-cutting device capable of cutting silicon rods; characterized in that: The post-breakage processing device comprises: A separation assembly, comprising a plurality of first separation components and a plurality of second separation components, wherein the plurality of first separation components are sequentially spaced apart along a first direction, and the plurality of first separation components are configured to be inserted into first gaps between adjacent silicon wafers that have been cut in a silicon rod to be cut, so as to separate the adjacent silicon wafers; a plurality of second separation components are sequentially spaced apart along the first direction, and the plurality of second separation components are configured to be inserted into second gaps between adjacent cutting lines that have been repaired, so as to separate the adjacent cutting lines; wherein the first direction is the axial direction of the silicon rod to be cut; and A moving component is connected to the separation component, and the moving component can drive the first separation component to be inserted into or separated from the first gap, and drive the second separation component to be inserted into or separated from the second gap.

2. The post-processing device for wire breakage according to claim 1, characterized in that: The separation assembly includes at least one group of separation units, each group of separation units includes a connecting rod extending axially along the first direction, and a plurality of comb tooth structures arranged in sequence along the axial direction of the connecting rod, each of the comb tooth structures includes a comb body portion, a first comb tooth portion and a second comb tooth portion, the comb body portion extends perpendicular to the axial direction of the connecting rod, the first comb tooth portion and the second comb tooth portion are connected to the comb body portion and are arranged at intervals; wherein, the first comb tooth portions in a plurality of the comb tooth structures cooperate together to form a plurality of the first separation components, and the second comb tooth portions in a plurality of the comb tooth structures cooperate together to form a plurality of the second separation components.

3. The post-breakage processing device according to claim 2, characterized in that: The moving assembly includes a rotating mechanism, which includes a rotating shaft, and the axial direction of the rotating shaft extends along the first direction, wherein the connecting rod is connected to the rotating shaft, and the plurality of comb tooth structures can rotate around the rotating shaft so that the plurality of first comb tooth portions can be inserted into or disengaged from the first gap, and the plurality of second comb tooth portions can be inserted into or disengaged from the second gap.

4. The post-processing device for wire breakage according to claim 3, characterized in that: The moving assembly also includes a lifting mechanism, to which the rotating mechanism and one of the connecting rods are connected, and the lifting mechanism is configured to drive the connecting rod to move along a second direction toward or away from the silicon rod to be cut, wherein the second direction is a direction from the silicon rod to be cut to the cutting line.

5. The post-processing device for wire breakage according to claim 4, characterized in that: The lifting mechanism comprises a guide rail and a slider, the slider is slidably matched with the guide rail, and the rotating mechanism and the connecting rod are installed on the slider.

6. The post-processing device for wire breakage according to claim 2, characterized in that: The separation assembly includes two groups of separation units, which are located on opposite sides of the silicon rod to be cut in a third direction, and the third direction is perpendicular to the first direction and parallel to the silicon wafer, wherein a comb tooth groove is formed between the first comb tooth portion and the second comb tooth portion, and the openings of the comb tooth grooves in the two groups of separation units are arranged facing each other.

7. The post-processing device for wire breakage according to claim 2, characterized in that: In each group of the separation units, the spacing between two adjacent comb-tooth structures along the extending direction of the connecting rod is 1.035-1.060 mm.

8. The post-processing device for wire breakage according to claim 2, characterized in that: In each group of the separation units, the distance between two adjacent comb-tooth structures along the extending direction of the connecting rod is adjustable.

9. A wire cutting device, characterized in that: The invention comprises a post-breakage processing device as claimed in any one of claims 1 to 8.

10. A wire cutting method, characterized in that: Applied to the wire cutting device according to claim 9, the wire cutting method comprises the following steps: After the cutting line breaks during the wire cutting process, the silicon rod is moved away from the cutting line so that the silicon rod is separated from the cutting line; The separation component is moved by the moving component, so that the first separation components are inserted into the first gaps between adjacent silicon wafers that have been cut in the silicon rod to be cut, so as to separate the adjacent silicon wafers; Move the silicon rod toward the direction close to the repaired cutting line, so that the plurality of the second separation components are inserted into the second gaps between the repaired adjacent cutting lines, and separate the adjacent cutting lines, until the repaired cutting line enters the second gaps between the adjacent silicon wafers; The separation component is moved by the moving component so that the first separation component is separated from the first gap and the second separation component is separated from the second gap.

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