Camera module and electronic device
By incorporating a movable shielding mechanism into the camera module, the problem of image sensor damage in laser environments is solved, resulting in higher imaging quality and a better user experience.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- VIVO MOBILE COMM CO LTD
- Filing Date
- 2024-11-13
- Publication Date
- 2026-06-23
AI Technical Summary
Camera modules are easily damaged in laser environments, affecting image quality and reducing user experience.
A movable shielding mechanism is set in the camera module to block part of the photosensitive area in a laser environment, reducing laser irradiation. The movement of the shielding mechanism drives airflow for heat dissipation, preventing damage to the photosensitive chip.
It effectively reduces the surface temperature of the image sensor, avoids damage, improves image quality, and enhances the user experience.
Smart Images
Figure CN119520955B_ABST
Abstract
Description
Technical Field
[0001] This application belongs to the field of communication technology, specifically relating to a camera module and an electronic device. Background Technology
[0002] As users increasingly demand the best user experience, electronic devices such as smartphones and tablets are becoming more feature-rich, and their usage frequency is also rising. For example, camera modules in electronic devices, as a function that enables shooting, are being used more and more frequently in various shooting scenarios.
[0003] However, in some laser-based shooting scenarios, such as official light shows during major holidays or light shows at celebrity concerts, the high power density of lasers can damage the image sensor chip within the camera module during shooting. This can affect the image quality of the camera module and reduce the user's experience with the electronic device. Summary of the Invention
[0004] This application aims to provide a camera module and an electronic device to solve the problem that the photosensitive chip in existing camera modules is easily damaged by lasers.
[0005] To solve the above-mentioned technical problems, this application is implemented as follows:
[0006] In a first aspect, this application discloses a camera module, the camera module comprising:
[0007] A support, wherein a receiving cavity is provided within the support;
[0008] A photosensitive chip, the photosensitive chip being located within the receiving cavity, the photosensitive chip having a photosensitive area;
[0009] A lens, which is connected to the bracket and at least partially communicates with the receiving cavity, is used to focus external light onto the photosensitive area;
[0010] And a blocking mechanism, which is movably connected within the receiving cavity, wherein when the camera module is in a laser environment, the blocking mechanism blocks at least a portion of the photosensitive area, and when the camera module is in a non-laser environment, the blocking mechanism releases the blocking of the photosensitive area.
[0011] Secondly, this application also discloses an electronic device, which includes: the camera module described in any of the preceding claims.
[0012] In this embodiment, the camera module can have a movable shielding mechanism within the housing cavity of the bracket. When the camera module is in a laser environment, the shielding mechanism can block at least part of the photosensitive area to reduce the amount of light projected onto the photosensitive area by external laser light, thereby lowering the surface temperature of the photosensitive area and preventing damage to the photosensitive chip to a certain extent. When the camera module is in a non-laser environment, the shielding mechanism can move within the housing cavity to release the shielding of the photosensitive area, allowing the photosensitive chip to be in a better imaging state. Moreover, the movement of the shielding mechanism within the housing cavity can drive airflow for heat dissipation, further reducing the surface temperature of the photosensitive chip and preventing damage to the photosensitive chip caused by laser irradiation. This improves the image quality of the camera module and correspondingly enhances the user experience of electronic devices using the camera module.
[0013] Additional aspects and advantages of the invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description
[0014] The above and / or additional aspects and advantages of the present invention will become apparent and readily understood from the description of the embodiments taken in conjunction with the following drawings, in which:
[0015] Figure 1 This is a schematic diagram of the initial state of the blocking mechanism of a camera module according to an embodiment of this application;
[0016] Figure 2 yes Figure 1 The diagram shows the structure of the camera module in an obstructed state.
[0017] Figure 3 This is a schematic diagram of the exposure process of the photosensitive pixels on the photosensitive chip described in the embodiments of this application;
[0018] Figure 4 This is an exposure timing diagram of the photosensitive pixels on the photosensitive chip described in the embodiments of this application.
[0019] Reference numerals: 10 - bracket, 100 - receiving cavity, 11 - photosensitive chip, 110 - photosensitive area, 111 - photosensitive pixel, 12 - lens, 13 - blocking mechanism, 131 - moving part, 132 - coil, 133 - magnetic part, 134 - blocking plate, 14 - light-transmitting sheet, 15 - circuit board, 16 - wire, 17 - laser detection mechanism, 18 - controller. Detailed Implementation
[0020] Embodiments of the present invention will now be described in detail. Examples of these embodiments are illustrated in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and should not be construed as limiting the present invention. All other embodiments obtained by those skilled in the art based on the embodiments in this application without inventive effort are within the scope of protection of this application.
[0021] The terms "first" and "second" in the specification and claims of this application may explicitly or implicitly include one or more of the features. In the description of this invention, unless otherwise stated, "a plurality of" means two or more. Furthermore, in the specification and claims, "and / or" indicates at least one of the connected objects, and the character " / " generally indicates that the preceding and following objects are in an "or" relationship.
[0022] In the description of this invention, it should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this invention and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention.
[0023] In the description of this invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.
[0024] Reference Figure 1 This diagram illustrates the structure of a camera module's blocking mechanism in its initial state, as described in an embodiment of this application. (Refer to...) Figure 2 , showed Figure 1 The diagram shows the structure of the camera module in an obstructed state.
[0025] like Figure 1 and Figure 2As shown, the camera module may specifically include: a bracket 10, with a receiving cavity 100 disposed within the bracket 10; a photosensitive chip 11, located within the receiving cavity 100, having a photosensitive area 110; a lens 12, connected to the bracket 10 and at least partially communicating with the receiving cavity 100, the lens 12 being used to focus external light onto the photosensitive area 110; and a blocking mechanism 13, movably connected within the receiving cavity 100. Figure 2 As shown, when the camera module is in a laser environment, the blocking mechanism 13 blocks at least part of the photosensitive area 110, such as... Figure 1 As shown, when the camera module is in a non-laser environment, the blocking mechanism 13 can remove the blocking of the photosensitive area 110.
[0026] In this embodiment, the camera module can have a movable shielding mechanism 13 installed within the receiving cavity 100 of the bracket 10. When the camera module is in a laser environment, the shielding mechanism 13 can shield at least part of the photosensitive area 110 to reduce the amount of light projected onto the photosensitive area 110 by external laser light, thereby lowering the surface temperature of the photosensitive area 110 and preventing damage to the photosensitive chip 11 to a certain extent. When the camera module is in a non-laser environment, the shielding mechanism 13 can move within the receiving cavity 100 to release the shielding of the photosensitive area 110, allowing the photosensitive chip 11 to be in a better imaging state. Moreover, the movement of the shielding mechanism 13 within the receiving cavity 100 can drive airflow for heat dissipation, further reducing the surface temperature of the photosensitive chip 11 and preventing damage to the photosensitive chip 11 caused by laser irradiation. This improves the shooting quality of the camera module and correspondingly enhances the user experience of electronic devices using the camera module.
[0027] In specific applications, the bracket 10 can serve as a support for the camera module, supporting the various functional components within it. The bracket 10 may contain a receiving cavity 100, which can accommodate components such as the photosensitive chip 11, a filter (not shown), and a light-transmitting sheet 14. The lens 12 is connected to the bracket 10. When external light enters the lens 12, it converges the light, focusing it onto the photosensitive area 110 of the photosensitive chip 11. The photosensitive area 110 of the photosensitive chip 11 may contain multiple photosensitive pixels 111, which can sense light and be exposed to form an image. In practical applications, when the camera module is in a laser environment, such as under laser pointer illumination or laser illumination in a light show, the lens 12 can focus the external laser light onto the photosensitive area 110. The laser focus point on the photosensitive area 110 is prone to generating sustained high temperatures (greater than 300°C). When the temperature at the laser focal point on the photosensitive area 110 exceeds the damage threshold of the photosensitive chip 11, burns will occur on the surface of the photosensitive chip 11, resulting in laser damage to the photosensitive chip 11 and affecting its imaging effect. For example, dot-shaped, cross-shaped, or vertical line-shaped damage may occur during the shooting process.
[0028] like Figure 1 and Figure 2 As shown, the camera module may further include a circuit board 15, which can be disposed at the bottom of the bracket 10 and form a receiving cavity 100 with the bracket 10. A photosensitive chip 11 can be disposed on the circuit board 15. Figure 1 and Figure 2 As shown, circuit board 15 can be electrically connected to circuit board 15 via wire 16.
[0029] like Figure 3 As shown, the photosensitive area 110 is provided with a plurality of photosensitive pixels 111, and the photosensitive pixels 111 may include an exposed state and an unexposed state; wherein, when the camera module is in the laser environment, the blocking mechanism 13 blocks at least part of the photosensitive pixels 111 that are in the unexposed state.
[0030] In specific applications, the exposure mode of the photosensitive pixel 111 can include two types: progressive exposure and global exposure. Progressive exposure is a common mode for existing photosensitive pixels 111. This application embodiment only describes the exposure mode of the photosensitive pixel 111 as progressive exposure. The method of global exposure for the photosensitive pixel 111 can be referred to in the same way.
[0031] like Figure 3As shown, 111-pixel progressive exposure means that exposure starts from the first row, and the second row begins exposure only after one row cycle is completed, and so on, until the nth row begins exposure after n-1 rows. Data is read out after the first row exposure is completed, as shown below. Figure 4 As shown, reading out one row of photosensitive pixels 111 requires one row cycle time T0 (including the row exposure time T1 and the row blanking time T2). After the first row of photosensitive pixels 111 is completely read out, the second row begins to be read out, and so on. When the (n-1)th row of photosensitive pixels 111 is read out, the nth row begins to be read out, until the entire image is completely read out. The exposure time for each row in the sequential exposure is expected to be in the microsecond range, but since the total number of photosensitive pixel rows is generally more than 1000, the estimated time for completing one exposure of the entire photosensitive pixel array is in the millisecond range.
[0032] In the embodiments of this application, such as Figure 3 As shown, exposure begins with the first row of photosensitive pixels 111. After the third row of photosensitive pixels 111 has been exposed, exposure can begin with the fourth row of photosensitive pixels 111. At this point, the fourth row of photosensitive pixels 111 is in the exposed state, while the photosensitive pixels 111 outside the fourth row are in the unexposed state. Figure 3 As shown, when the camera module is in a laser environment, the blocking mechanism 13 can only block the photosensitive pixels 111 outside the fourth row, so as to avoid the blocking mechanism 13 blocking the fourth row of pixels in the exposure state and affecting the imaging of the fourth row of photosensitive pixels 111.
[0033] In practical applications, when the photosensitive pixel 111 is in the exposed state, it can convert light signals into electrical signals, and then into an image. When the photosensitive pixel 111 is in the unexposed state, light signals illuminating the photosensitive chip 11 will not be converted into electrical signals, and therefore no image will be formed. When the photosensitive pixel 111 is in the exposed state, it cannot be obstructed because imaging is required. When the photosensitive pixel 111 is in the unexposed state, since it does not need to form an image, even if it is obstructed, it will not affect the imaging of the photosensitive chip 11. Therefore, while not affecting the imaging of the photosensitive chip 11, the temperature of the photosensitive area 110 can be reduced, preventing laser damage to the photosensitive chip 11.
[0034] In some optional embodiments of this application, the camera module may further include: a laser detection mechanism 17, which is connected to the bracket 10. The laser detection mechanism 17 can be used to detect laser intensity. When the laser intensity is greater than a first threshold, the environment in which the camera module is located is a laser environment. When the laser intensity is less than or equal to the first threshold, the environment in which the camera module is located is a non-laser environment.
[0035] In specific applications, the first threshold can be determined based on the laser damage failure mechanism and the characteristics of the laser. When the laser intensity in the environment is less than or equal to the first threshold, it can be assumed that there is no laser in the environment, or although laser is present, it does not affect the normal use of the camera module, nor does it damage the photosensitive chip 11 of the camera module. Therefore, it is not necessary to activate the blocking mechanism 13 to block the photosensitive area 110. When the laser intensity in the environment is greater than the first threshold, it can be assumed that the laser in the environment may affect the normal use of the camera module, or may damage the photosensitive chip 11 in the camera module. Therefore, it is necessary to activate the blocking mechanism 13 to block at least a portion of the photosensitive area 110 to prevent the photosensitive area 110 from developing an area with excessively high temperature, which could damage the photosensitive chip 11 and affect the imaging quality of the camera module.
[0036] For example, the laser detection mechanism 17 can be made of a composite material of photonic crystal and liquid crystal monomer. The potential difference across the laser detection mechanism 17 increases with the increase of light intensity, thus enabling real-time detection of laser intensity. Compared to ordinary light, the main characteristic of laser is its high power density. Therefore, a power density threshold can be set. When the power density of ambient light exceeds the power density threshold, it can be assumed that laser is present in the ambient light, and the laser intensity is greater than the first threshold, meaning that the camera module is in the laser environment. At this time, the laser detection mechanism 17 can send an electrical signal to the blocking mechanism 13 to control the blocking mechanism 13 to block at least a portion of the photosensitive area 110.
[0037] Optionally, the laser detection mechanism 17 is at least partially exposed outside the bracket 10 and positioned close to the lens 12 to enable it to detect the laser intensity in the environment. In specific applications, only the detection end of the laser detection mechanism 17 may be exposed outside the bracket 10, thus exposing the detection end to the environment described by the camera module. Alternatively, the entire laser detection mechanism 17 may be exposed outside the bracket 10, thus exposing the entire laser detection mechanism 17 to the environment described by the camera module. This application does not specifically limit the method of exposing the laser detection mechanism 17.
[0038] It should be noted that in practical applications, the laser detection mechanism 17 can also be set in other positions in the camera module according to actual needs, such as near the photosensitive chip 11, or on the side of the bracket 10. This application embodiment does not limit the specific position of the laser detection mechanism 17.
[0039] In some optional embodiments of this application, the camera module may further include a controller 18, which is electrically connected to the laser detection mechanism 17 and the blocking mechanism 13 respectively. The controller 18 can be used to control the blocking mechanism 13 to block at least part of the photosensitive area 110 when the laser detection mechanism 17 detects that the camera module is in the laser environment, and to control the blocking mechanism 13 to release the blocking of the photosensitive area 110 when the laser detection mechanism 17 detects that the camera module is in the non-laser environment.
[0040] like Figure 1 and Figure 2 As shown, the controller 18 can be mounted on the circuit board 15 and electrically connected to the laser detection mechanism 17 and the blocking mechanism 13, respectively. When the laser detection mechanism 17 detects that the laser intensity in the ambient light is greater than the first threshold, it can send an electrical signal to the controller 18. Based on the electrical signal, the controller 18 can control the blocking mechanism 13 to block at least a portion of the photosensitive area 110, thereby reducing the amount of light projected onto the photosensitive area 110 by external laser light and preventing the photosensitive area 110 from overheating. When the laser detection mechanism 17 detects that the laser intensity in the ambient light is less than or equal to the first threshold, it can send another electrical signal to the controller 18. Based on the electrical signal, the controller 18 can control the blocking mechanism 13 to release the blocking of the photosensitive area 110, allowing the photosensitive area 110 to receive sufficient light and improving the imaging quality of the photosensitive area 110.
[0041] like Figure 1 and Figure 2 As shown, the camera module may further include a circuit board 15, which is connected to the bracket 10 and forms a receiving cavity 100 with the bracket 10. The photosensitive chip 11 is connected to the circuit board 15. The blocking mechanism 13 may specifically include a movable component 131, a coil 132, a magnetic component 133, and a blocking plate 134. The movable component 131 is movably connected to the circuit board 15, the blocking plate 134 is connected to the movable component 131, one of the coil 132 and the magnetic component 133 is connected to the blocking plate 134, and the other of the coil 132 and the magnetic component 133 is connected to the blocking plate 134. The coil 132 is connected to the circuit board 15, and the magnetic component 133 is disposed opposite to the coil 132. When the camera module is in a laser environment, the coil 132 or the magnetic component 133 drives the shielding plate 134 to block at least part of the photosensitive area 110 based on the electromagnetic induction between the coil 132 and the magnetic component 133. When the camera module is in a non-laser environment, the coil 132 or the magnetic component 133 drives the shielding plate 134 to release the blocking of the photosensitive area 110 based on the electromagnetic induction between the coil 132 and the magnetic component 133.
[0042] That is, the movable component 131 can move relative to the photosensitive chip 11. Thus, the baffle 134 connected to the movable component 131 can move relative to the photosensitive chip 11 under the drive of the coil 132 or the magnetic component 133, thereby achieving the function of either blocking or releasing the blocking of the photosensitive area 110. In practical applications, during the movement of the baffle 134, the airflow within the receiving cavity 100 can also be disturbed, increasing the airflow speed within the receiving cavity 100, thereby reducing the surface temperature of the photosensitive chip 11 and preventing laser damage to the photosensitive area 110. In practical applications, the coil 132 can be electrically connected to the controller 18. The controller 18 can be used to control the direction and magnitude of the current in the coil 132 to change the interaction force between the coil 132 and the magnetic component 133, thereby adjusting the movement range of the baffle 134 to achieve the purpose of adjusting the baffle 134's blocking of the photosensitive area 110.
[0043] The following provides a Figure 1 and Figure 2 Example of the working process of the camera module shown:
[0044] First, if the laser detection mechanism 17 detects that the environment in which the camera module is located is a non-laser environment, the blocking mechanism 13 can... Figure 1 The initial state shown is that the shielding plate 134 does not obstruct the light-sensitive area 110. At this time, the camera module can be used normally.
[0045] Next, when the camera module switches to a laser environment, the laser detection mechanism 17 can detect that the laser intensity in the environment is greater than the first threshold, meaning the environment described by the camera module is a laser environment. At this time, the laser detection mechanism 17 can send a control signal to the controller 18, which can control the direction and magnitude of the current in the coil 132 to generate an electromagnetic induction effect between the coil 132 and the magnetic component 133. The magnetic force exerted by the magnetic component 133 on the coil 132 can push the coil 132 to move the shielding plate 134 to a designated position to block a portion of the photosensitive area 110.
[0046] As the exposure of the photosensitive chip 11 changes line by line and the gap between the exposure time TI and the line blanking time T2 of the photosensitive chip 11 changes, the blocking mechanism 13 can change its position accordingly, thereby reducing the surface temperature of the photosensitive chip 11 and ultimately preventing damage to the photosensitive chip 11 in the camera module. Since the blocked photosensitive pixels 111 are in an unexposed state and do not require exposure, they do not affect the normal shooting of the camera module.
[0047] Next, when the camera module moves from a laser environment to a non-laser environment, if the laser detection mechanism 17 detects that the light power density is below a set threshold for an extended period, the environment described by the camera module can be considered a laser environment. At this time, the laser detection mechanism 17 will again send an electrical signal to the controller 18, which will then energize the coil 132. Furthermore, by adjusting the direction and magnitude of the current in the coil 132, the shielding plate 134 can be driven back under the action of the Ampere force. Figure 1 The camera module is still functioning normally at the initial position shown.
[0048] In practical applications, when the masking mechanism 13 uses a combination of coil 132 and magnetic component 133 to drive the movement of the masking plate 134, with existing technology, the masking plate 134 can stably change its position within 10ms (where 10ms is the exposure time from the first row of photosensitive pixels 111 to the last row of photosensitive pixels 111).
[0049] For example, assuming the photosensitive area 110 of the photosensitive chip 11 has 4000 rows of photosensitive pixels 111, the exposure time of each row of photosensitive pixels 111 is 1µm, the corresponding average movement speed is 0.4µm / µs, and the control precision can be less than the exposure time of 2 rows of photosensitive pixels 111 (approximately 2µm). The actual control precision requirement can be confirmed based on the actual design, and it is expected that a precision of 10µm (approximately the exposure time of 10 rows of photosensitive pixels 111) is fully acceptable. That is, by using the coil 132 and the magnetic component 133 to drive the baffle 134 to switch positions, the requirement of stable position change within a specified time can be achieved.
[0050] It should be noted that the accompanying drawings of this application only show the case where the coil 132 is connected to the shield 134 and the magnetic component 133 is connected to the circuit board 15. In practical applications, the coil 132 can also be connected to the circuit board 15 and the magnetic component 133 can be connected to the shield 134. The specific positions of the coil 132 and the magnetic component 133 are not limited in this application embodiment.
[0051] Optionally, the movable component 131 may include an elastic component, one end of which is connected to the circuit board 15 and the other end to the baffle plate 134. Through the elastic deformation of the elastic component, the baffle plate 134 can be moved... Figure 1 The initial state and Figure 2 Switch between the shown occlusion states.
[0052] For example, the elastic element may include, but is not limited to, any one of a sheet spring or a spring. The specific type of the elastic element is not limited in this embodiment. Because the elastic element has a simple structure and stable performance, when the movable element 131 is the elastic element, the blocking mechanism 13 can correspondingly have the advantages of simple structure and stable performance.
[0053] Alternatively, the movable component 131 may also include a ball bearing connected between the circuit board 15 and the baffle plate 134. The ball bearing's rolling motion on the circuit board 15 can drive the baffle plate 134 to move... Figure 1 The initial state and Figure 2 The blocking state is switched as shown. Since the ball has the advantage of smooth movement, when the moving part 131 is the ball, the blocking mechanism 13 can also have the advantage of smooth movement.
[0054] It should be noted that, Figure 1 and Figure 2 The example only shows the case where the moving part 131 is an elastic element. If the moving part 131 is a ball or other component, please refer to the example.
[0055] In another optional embodiment of this application, the shielding plate 134 may be tilted relative to the circuit board 15. Thus, during the process of the shielding plate 134 moving relative to the photosensitive chip 11 to shield or release the photosensitive area 110, the disturbance effect of the shielding plate 134 on the airflow within the receiving cavity 100 can be increased, thereby increasing the airflow velocity within the receiving cavity 100 and further reducing the surface temperature of the photosensitive chip 11, thus preventing overheating of the photosensitive area 110 and subsequent laser damage.
[0056] It should be noted that the tilt angle of the shielding plate 134 relative to the circuit board 15 can be 5 degrees, 8 degrees, or 15 degrees, etc., and this application embodiment does not limit the tilt angle of the shielding plate 134 relative to the circuit board 15. Moreover, in some embodiments, the shielding plate 134 can also be arranged parallel to the circuit board 15, and this application embodiment does not limit this.
[0057] In some alternative embodiments of this application, the blocking mechanism 13 may further include a piezoelectric mechanism or a shape memory metal mechanism. Specifically, both the piezoelectric mechanism and the shape memory metal mechanism can change shape when energized, so that the blocking mechanism 13 switches between a state of blocking the photosensitive area 110 and a state of releasing the blocking of the photosensitive area 110, so as to avoid laser damage to the photosensitive area 110.
[0058] It should be noted that, in specific applications, those skilled in the art can configure the shielding mechanism 13 as one or more of the following mechanisms: electromagnetic + elastic element mechanism, electromagnetic + ball mechanism, piezoelectric mechanism or shape memory metal mechanism, depending on actual needs. This application embodiment does not limit this.
[0059] In summary, the camera module described in the embodiments of this application may include at least the following advantages:
[0060] In this embodiment, the camera module can have a movable shielding mechanism within the housing cavity of the bracket. When the camera module is in a laser environment, the shielding mechanism can block at least part of the photosensitive area to reduce the amount of light projected onto the photosensitive area by external laser light, thereby lowering the surface temperature of the photosensitive area and preventing damage to the photosensitive chip to a certain extent. When the camera module is in a non-laser environment, the shielding mechanism can move within the housing cavity to release the shielding of the photosensitive area, allowing the photosensitive chip to be in a better imaging state. Moreover, the movement of the shielding mechanism within the housing cavity can drive airflow for heat dissipation, further reducing the surface temperature of the photosensitive chip and preventing damage to the photosensitive chip caused by laser irradiation. This improves the image quality of the camera module and correspondingly enhances the user experience of electronic devices using the camera module.
[0061] This application provides an electronic device, which may include, but is not limited to, at least one of mobile phones, tablet computers, and wearable devices. This application does not limit the specific type of the electronic device.
[0062] It should be noted that in this embodiment, the camera module in the electronic device has the same structure as the camera module in the above embodiments, and its beneficial effects are similar, so it is not limited here.
[0063] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.
[0064] Although embodiments of the invention have been shown and described, those skilled in the art will understand that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the claims and their equivalents.
Claims
1. A camera module, characterized in that, The camera module includes: A support (10) is provided with a receiving cavity (100) inside the support (10); Photosensitive chip (11), the photosensitive chip (11) is located in the receiving cavity (100), the photosensitive chip (11) has a photosensitive area (110). Lens (12), the lens (12) is connected to the bracket (10) and at least partially communicates with the receiving cavity (100), the lens (12) is used to focus external light onto the photosensitive area (110); And a blocking mechanism (13) is movably connected within the receiving cavity (100). When the camera module is in a laser environment, the blocking mechanism (13) blocks at least part of the photosensitive area (110). When the camera module is in a non-laser environment, the blocking mechanism (13) releases the blocking of the photosensitive area (110). The photosensitive area (110) is provided with a plurality of photosensitive pixels (111), the photosensitive pixels (111) including an exposed state and an unexposed state; wherein, when the camera module is in the laser environment, the blocking mechanism (13) blocks at least part of the photosensitive pixels (111) in the unexposed state.
2. The camera module according to claim 1, characterized in that, The camera module further includes a laser detection mechanism (17), which is connected to the bracket (10). The laser detection mechanism (17) is used to detect the laser intensity. When the laser intensity is greater than a first threshold, the environment in which the camera module is located is a laser environment. When the laser intensity is less than or equal to the first threshold, the environment in which the camera module is located is a non-laser environment.
3. The camera module according to claim 2, characterized in that, The laser detection device is at least partially exposed on the bracket (10) and is positioned close to the lens (12).
4. The camera module according to claim 2, characterized in that, The camera module also includes a controller (18), which is electrically connected to the laser detection mechanism (17) and the blocking mechanism (13) respectively. The controller (18) is used to control the blocking mechanism (13) to block at least part of the photosensitive area (110) when the laser detection mechanism (17) detects that the camera module is in the laser environment, and to control the blocking mechanism (13) to release the blocking of the photosensitive area (110) when the laser detection mechanism (17) detects that the camera module is in the non-laser environment.
5. The camera module according to claim 1, characterized in that, The camera module also includes a circuit board (15), which is connected to the bracket (10) and forms the receiving cavity (100) together with the bracket (10), and the photosensitive chip (11) is connected to the circuit board (15). The shielding mechanism (13) includes a movable part (131), a coil (132), a magnetic part (133), and a shielding plate (134). The movable part (131) is movably connected to the circuit board (15), and the shielding plate (134) is connected to the movable part (131). One of the coil (132) and the magnetic part (133) is connected to the shielding plate (134), and the other of the coil (132) and the magnetic part (133) is connected to the circuit board (15). The coil (132) and the magnetic part (133) are arranged opposite to each other. When the camera module is in a laser environment, based on the electromagnetic induction between the coil (132) and the magnetic component (133), the coil (132) or the magnetic component (133) drives the shielding plate (134) to shield at least part of the photosensitive area (110). When the camera module is in a non-laser environment, based on the electromagnetic induction between the coil (132) and the magnetic component (133), the coil (132) or the magnetic component (133) drives the shielding plate (134) to release the shielding of the photosensitive area (110).
6. The camera module according to claim 5, characterized in that, The movable component (131) includes an elastic component, one end of which is connected to the circuit board (15) and the other end of which is connected to the shield (134). Alternatively, the movable element (131) may include a ball bearing connected between the circuit board (15) and the shield (134).
7. The camera module according to claim 5, characterized in that, The shield (134) is tilted relative to the circuit board (15).
8. The camera module according to claim 1, characterized in that, The shielding mechanism (13) includes a piezoelectric mechanism or a shape memory metal mechanism.
9. An electronic device, characterized in that, The electronic device includes: the camera module according to any one of claims 1 to 8.