Electronic equipment

Abstract

The electronic equipment comprises a first sound production module and a second sound production module which are located in a shell, the first sound production module comprises a first vibrating diaphragm and a shell arranged outside the first vibrating diaphragm in a surrounding mode, and the shell and the first vibrating diaphragm jointly form a sound cavity in a surrounding mode. The second sounding module has a second diaphragm, one side of which is communicated with the outside of the housing and the other side of which is communicated with the inside of the housing. The first sound production module further comprises a phase adjusting part, and the phase adjusting part is used for radiating sound waves in the sound cavity into the shell and adjusting the phase of the sound waves radiated into the shell to be opposite to the phase of the sound waves in the sound cavity, so that the phase of the sound waves radiated into the shell by the sound cavity is opposite to the phase of the sound waves radiated into the shell by the second vibrating diaphragm. In this way, the phases of the two opposite sound waves can be offset in the shell, the intensity of the sound waves in the shell can be effectively weakened, resonance of the shell of the electronic equipment is reduced or avoided, and vibration of the shell of the electronic equipment is effectively reduced or avoided.

Description

Technical Field

[0001] The present application relates to the technical field of loudspeakers, and in particular to an electronic device. Background Art

[0002] As portable devices become smaller and smaller, the space inside electronic devices becomes more and more compact, and the space provided for the arrangement of components inside electronic devices also becomes smaller. Taking the speakers in electronic devices as an example, as electronic devices become smaller, the cavity volume of the speaker module in electronic devices also becomes smaller. However, if the cavity volume of the speaker is too small, it will produce a large elastic restraining force on the diaphragm of the speaker module when it vibrates at low frequencies, resulting in poor low-frequency diving performance and affecting low-frequency performance.

[0003] Electronic devices usually include two speaker modules. In order to expand the low-frequency dive, the rear cavity of the speaker module on the top of the electronic device is usually designed to be open, so that the rear cavity of the speaker module is connected to the cavity of the electronic device shell to increase the volume of the speaker rear cavity. This can reduce the elastic restraint force on the diaphragm of the speaker module when it vibrates at low frequencies, thereby achieving the effect of expanding the low-frequency dive.

[0004] However, the sound waves generated by the speaker module with an open rear cavity will radiate into the cavity of the electronic device, which can easily cause the outer casing of the electronic device to resonate due to the sound waves in the cavity, allowing the user to clearly feel the vibration of the outer casing of the electronic device, affecting the user experience. Summary of the invention

[0005] An embodiment of the present application provides an electronic device to solve the problem in existing electronic devices that sound waves radiated from a speaker module to the inside of a housing can cause the housing to resonate, causing the electronic device to vibrate significantly and reducing the user experience.

[0006] A first aspect of the present application provides an electronic device, comprising a housing and a first sound module and a second sound module located in the housing;

[0007] The first sound module includes a first diaphragm and a shell arranged around the first diaphragm, one side of the first diaphragm is connected to the outside of the shell, and the other side of the first diaphragm is connected to the inside of the shell, and the shell and the first diaphragm are jointly arranged to form a sound cavity;

[0008] The second sound module has a second diaphragm, one side of the second diaphragm is in communication with the outside of the housing, and the other side of the second diaphragm is in communication with the inside of the housing;

[0009] The first sound module further includes a phase adjustment component, and the phase adjustment component is located at an end of the housing opposite to the first diaphragm;

[0010] The phase adjustment member is used to radiate the sound waves in the sound cavity to the interior of the housing, and to adjust the phase of the sound waves radiated to the interior of the housing to be opposite to the phase of the sound waves in the sound cavity.

[0011] The present application sets a phase adjustment component in the first sound module, and adjusts the phase of the sound wave in the sound cavity through the phase adjustment component, so that the phase of the sound wave radiated from the first sound module to the inside of the shell is opposite to the phase of the sound wave radiated from the second sound module to the inside of the shell. The two sound waves with opposite phases can cancel each other out inside the shell, which can effectively weaken the intensity of the sound wave inside the shell, reduce or avoid the shell of the electronic device from resonating due to the sound waves inside, thereby effectively reducing or avoiding the shell of the electronic device from vibrating, and improving the user experience.

[0012] In a possible implementation, the phase adjustment element and the acoustic cavity form a resonator, the resonant frequency of the resonator is Fb, and the phase of the sound wave radiated by the phase adjustment element in the frequency range of 0.4Fb to 1.5Fb is reversed.

[0013] In a possible implementation, the phase adjustment element includes a third diaphragm, an end of the shell opposite to the first diaphragm has an opening, and the third diaphragm is located in the opening and flexibly connected to an inner wall of the opening.

[0014] In a possible implementation, the third diaphragm satisfies the following formula:

[0015]

[0016] Wherein, Mr is the mass of the third diaphragm, and Cb is the equivalent compliance of the air in the acoustic cavity;

[0017] The Cb satisfies the following formula:

[0018]

[0019] Wherein, Vb is the volume of the acoustic cavity, ρ is the air density, C is the air sound speed, and Sr is the vibration area of ​​the third diaphragm.

[0020] In a possible implementation, the mass of the third diaphragm is 0.05 g to 1 g.

[0021] In a possible implementation, the phase adjustment member further includes a folding ring, and the third diaphragm is flexibly connected to the inner wall of the opening via the folding ring.

[0022] In a possible implementation, the phase adjustment element includes a phase-inverting tube, one end of which is connected to the shell and communicated with the sound cavity, and the other end of which is communicated with the interior of the shell.

[0023] In a possible implementation, the inverter tube satisfies the following formula:

[0024]

[0025] Wherein, Mp is the mass of the air in the inverted tube, and Cb is the equivalent compliance of the air in the acoustic cavity;

[0026] The Mp satisfies the following formula:

[0027] Mp=ρ(LSp)

[0028] The Cb satisfies the following formula:

[0029]

[0030] Wherein, ρ is the air density, L is the length of the bass reflex tube, Vb is the volume of the sound cavity, C is the air sound velocity, and Sp is the cross-sectional area of ​​the bass reflex tube.

[0031] In a possible implementation, the length of the inverter is 5 mm to 50 mm.

[0032] In a possible implementation, the cross-sectional area of ​​the inverted tube is 0.3 mm 2 ~3mm 2 .

[0033] In one possible implementation, the volume of the acoustic cavity is 0.2 cm 3 ~2cm 3 .

[0034] In a possible implementation, the housing is provided with two groups of sound outlets, and the first diaphragm is communicated with the outside of the housing through one of the two groups of sound outlets;

[0035] The second diaphragm communicates with the outside of the housing through another sound outlet of the two groups of sound outlets.

[0036] In a possible implementation, the housing of the electronic device includes a back cover, a side wall surrounding the back cover, and a display screen covering the side wall;

[0037] One of the two groups of sound outlets is opened between the display screen and the side wall, the other of the two groups of sound outlets is opened on the side wall, and the two groups of sound outlets are respectively located at two opposite ends of the display screen.

[0038] In a possible implementation, a group of sound outlets is provided on the housing, and the first diaphragm and the second diaphragm are both connected to the outside of the housing through the group of sound outlets.

[0039] In a possible implementation, the housing of the electronic device includes a back cover, a side wall surrounding the back cover, and a display screen covering the side wall;

[0040] The group of sound outlets is opened on the side wall, and the shell further has a front cavity inside, which is communicated with the group of sound outlets, and the first diaphragm and the second diaphragm are communicated with the sound outlets through the front cavity.

[0041] In a possible implementation, the first sound module further includes a first magnetic circuit component, a first vibration component and a first bracket;

[0042] The first bracket is connected to the housing, and the outer edge of the first diaphragm is connected to one end of the first bracket through a first hanging edge;

[0043] The first vibration component includes a first voice coil and a first voice coil frame, one end of the first voice coil frame is connected to the first diaphragm, the first voice coil is arranged on the other end of the first voice coil frame, and at least part of the first voice coil and the first voice coil frame are located in the magnetic field of the first magnetic circuit component.

[0044] In a possible implementation, the first magnetic circuit component includes a first magnetic steel, a first magnetic conductive sheet and a first U iron;

[0045] The first magnetic steel and the first magnetic conductive sheet are stacked on the bottom wall of the first U-iron, and at least part of the first voice coil and the first voice coil frame are located between the first magnetic conductive sheet and the inner side wall of the first U-iron.

[0046] In a possible implementation, the second sound module further includes a second magnetic circuit component, a second vibration component and a second bracket;

[0047] The second bracket is connected to the housing, and the outer edge of the second diaphragm is connected to one end of the second bracket via a second hanging edge;

[0048] The second vibration component includes a second voice coil and a second voice coil frame, one end of the second voice coil frame is connected to the second diaphragm, the second voice coil is sleeved on the other end of the second voice coil frame, and at least part of the second voice coil and the second voice coil frame are located in the magnetic field of the second magnetic circuit component;

[0049] The second bracket and the second magnetic circuit assembly are exposed inside the shell, so that the inside of the shell serves as the back cavity of the second sound module.

[0050] In a possible implementation, the second magnetic circuit component includes a second magnetic steel, a second magnetic conductive sheet, and a second U iron;

[0051] The second magnetic steel and the second magnetic conductive sheet are stacked on the bottom wall of the second U iron, and at least part of the second voice coil and the second voice coil frame are located between the second magnetic conductive sheet and the inner side wall of the second U iron.

[0052] In a possible implementation, the first sound module and the second sound module are arranged opposite to each other, and the front surface of the first diaphragm and the front surface of the second diaphragm are connected to the outside of the housing through the set of sound outlets;

[0053] The front side of the first diaphragm is the side of the first diaphragm facing away from the magnetic circuit component in the first sound module, and the front side of the second diaphragm is the side of the second diaphragm facing away from the magnetic circuit component in the second sound module.

[0054] In a possible implementation, the first sound module and the second sound module are disposed opposite to each other, and the back surface of the first diaphragm and the back surface of the second diaphragm are connected to the outside of the housing through the set of sound outlets;

[0055] The back side of the first diaphragm is the side of the first diaphragm facing the magnetic circuit component in the first sound module, and the back side of the second diaphragm is the side of the second diaphragm facing the magnetic circuit component in the second sound module.

[0056] In a possible implementation, the device further includes a magnetic circuit component, and the first sound module and the second sound module share the magnetic circuit component;

[0057] The first sound module includes a first vibration component and a first bracket, and the second sound module includes a second vibration component and a second bracket, and the first bracket and the second bracket are respectively connected to the housing;

[0058] The outer edge of the first diaphragm is connected to one end of the first bracket via a first hanging edge, and the outer edge of the second diaphragm is connected to one end of the second bracket via a second hanging edge;

[0059] The first vibration component includes a first voice coil and a first voice coil frame, one end of the first voice coil frame is connected to the first diaphragm, the first voice coil is sleeved on the other end of the first voice coil frame, and at least part of the first voice coil and the first voice coil frame are located in the magnetic field of the magnetic circuit component;

[0060] The second vibration component includes a second voice coil and a second voice coil frame, one end of the second voice coil frame is connected to the second diaphragm, the second voice coil is sleeved on the other end of the second voice coil frame, and at least part of the second voice coil and the second voice coil frame are located in the magnetic field of the magnetic circuit component;

[0061] The second vibration component and the first vibration component are respectively located at two opposite ends of the magnetic circuit component.

[0062] A second aspect of the present application provides an electronic device, comprising a housing and a sound module located in the housing, wherein the sound module comprises a first diaphragm and a shell arranged around the first diaphragm, one surface of the first diaphragm communicates with the outside of the housing, the other surface of the first diaphragm communicates with the inside of the shell, and the shell and the first diaphragm are jointly arranged to form a sound cavity;

[0063] The sound module further includes a phase adjustment component, and the phase adjustment component is located at an end of the housing opposite to the first diaphragm;

[0064] The phase adjustment member is used to radiate the sound waves in the sound cavity to the interior of the housing, and to adjust the phase of the sound waves radiated to the interior of the housing to be the same as the phase of the sound waves in the sound cavity.

[0065] The present application sets a phase adjustment component in the sound module, and the phase adjustment component can adjust the phase of the sound wave in the sound cavity, so that the phase of the sound wave radiated from the sound module to the outside of the shell is opposite to the phase of the sound wave radiated to the inside of the shell after adjustment by the phase adjustment component. The two sound waves with opposite phases are isolated from each other by the shell, which can effectively reduce or avoid the cancellation of the two sound waves with opposite phases to produce an acoustic short circuit, thereby effectively improving the sound pressure level of the electronic device.

[0066] In a possible implementation, the phase adjustment element and the acoustic cavity form a resonator, the resonant frequency of the resonator is Fb, and the phases of the sound waves radiated by the phase adjustment element within a frequency range of <0.4Fb are in phase.

[0067] In a possible implementation, the phase adjustment element includes a second diaphragm, an end of the shell opposite to the first diaphragm has an opening, and the second diaphragm is located in the opening and flexibly connected to an inner wall of the opening.

[0068] In a possible implementation, the second diaphragm satisfies the following formula:

[0069]

[0070] Wherein, Mr is the mass of the second diaphragm, and Cb is the equivalent compliance of the air in the acoustic cavity;

[0071] The Cb satisfies the following formula:

[0072]

[0073] Wherein, Vb is the volume of the acoustic cavity, ρ is the air density, C is the air sound velocity, and Sr is the vibration area of ​​the second diaphragm.

[0074] In a possible implementation, the mass of the second diaphragm is 0.05 g to 1 g.

[0075] In a possible implementation, the phase adjustment member further includes a folding ring, and the second diaphragm is flexibly connected to the inner wall of the opening via the folding ring.

[0076] In a possible implementation, the phase adjustment element includes a phase-inverting tube, one end of which is connected to the shell and communicated with the sound cavity, and the other end of which is communicated with the interior of the shell.

[0077] In a possible implementation, the inverter tube satisfies the following formula:

[0078]

[0079] Wherein, Mp is the mass of the air in the inverted tube, and Cb is the equivalent compliance of the air in the acoustic cavity;

[0080] The Mp satisfies the following formula:

[0081] Mp=ρ(LSp)

[0082] The Cb satisfies the following formula:

[0083]

[0084] Wherein, ρ is the air density, L is the length of the bass reflex tube, Vb is the volume of the sound cavity, C is the air sound velocity, and Sp is the cross-sectional area of ​​the bass reflex tube.

[0085] In a possible implementation, the length of the inverter is 5 mm to 50 mm.

[0086] In a possible implementation, the cross-sectional area of ​​the inverted tube is 0.3 mm 2 ~3mm 2 .

[0087] In one possible implementation, the volume of the acoustic cavity is 0.2 cm 3 ~2cm 3 .

[0088] In a possible implementation, a sound outlet is provided on the housing, and the first diaphragm is connected to the outside of the housing through the sound outlet.

[0089] In a possible implementation, the sound module further includes a magnetic circuit component, a vibration component and a bracket;

[0090] The bracket is connected to the housing, and the outer edge of the first diaphragm is connected to one end of the bracket through a first hanging edge;

[0091] The vibration component includes a voice coil and a voice coil frame, one end of the voice coil frame is connected to the first diaphragm, the voice coil is sleeved on the other end of the voice coil frame, and at least part of the voice coil and the voice coil frame are located in the magnetic field of the magnetic circuit component.

[0092] In a possible implementation, the magnetic circuit assembly includes magnetic steel, magnetic conductive sheet and U iron;

[0093] The magnetic steel and the magnetic conductive sheet are stacked on the bottom wall of the U-iron, and the voice coil and the voice coil frame are at least partially located between the magnetic conductive sheet and the inner side wall of the U-iron. BRIEF DESCRIPTION OF THE DRAWINGS

[0094] Figure 1 A schematic diagram of the structure of an electronic device provided in an embodiment of the present application;

[0095] Figure 2 An exploded schematic diagram of an electronic device provided in an embodiment of the present application;

[0096] Figure 3 A schematic diagram of the structure of an electronic device without a display screen provided in an embodiment of the present application;

[0097] Figure 4 A working circuit diagram of a sound module provided in an embodiment of the present application;

[0098] Figure 5 It is a structural schematic diagram of a sound module in an electronic device in the related art;

[0099] Figure 6 A schematic diagram of the structure of the first sound module provided in the embodiment of the present application;

[0100] Figure 7 A phase curve diagram of a phase adjustment element provided in an embodiment of the present application;

[0101] Figure 8 A frequency response curve diagram of a phase adjustment component adopted in an embodiment of the present application;

[0102] Fig. 9 A schematic diagram of the structure of a second sound module provided in an embodiment of the present application;

[0103] Fig.10 for Figure 6 Enlarged view of area A in the middle;

[0104] Fig.11 for Figure 6 Enlarged view of middle area B;

[0105] Fig.12 A schematic diagram of the structure of a third sound module provided in an embodiment of the present application;

[0106] Fig.13 for Fig.12 Enlarged view of middle area C;

[0107] Fig.14 A schematic diagram of the structure of a fourth sound module provided in an embodiment of the present application;

[0108] Fig.15 for Fig.14 Enlarged view of middle area D;

[0109] Fig.16 A schematic diagram of the structure of another electronic device provided in an embodiment of the present application;

[0110] Fig.17 A phase curve diagram of another phase adjustment element provided in an embodiment of the present application;

[0111] Fig.18 for Fig.16 Enlarged view of middle area E;

[0112] Fig.19 A schematic diagram of the structure of another phase adjustment element provided in an embodiment of the present application;

[0113] Fig. 20 for Fig.19 Enlarged view of middle area F;

[0114] Fig.21 A comparison chart of the frequency response curves of the sound module provided in the embodiment of the present application and the sound module with a closed rear cavity in the related art;

[0115] Fig. 22A comparison chart of the frequency response curves of the sound module provided in the embodiment of the present application radiating to the outside of the housing and the sound module of the closed rear cavity in the related art radiating to the outside of the housing.

[0116] Description of reference numerals:

[0117] 100- electronic equipment;

[0118] 110-housing; 111-accommodating cavity; 112-rear cover; 113-side wall; 114-display screen;

[0119] 115, 115a, 115b, 115c-sound outlet; 116a, 116b-sound transmission cavity; 117-front cavity;

[0120] 120-first sound module; 121-first diaphragm; 122-housing; 1221-sound cavity;

[0121] 123-phase adjustment member; 1231-third diaphragm; 1232-folding ring; 1233-inverted phase tube;

[0122] 124-first magnetic circuit component; 1241-first magnetic steel; 1242-first magnetic conductive sheet; 1243-first U iron;

[0123] 125a, 125b-first vibration component; 1251a, 1251b-first voice coil; 1252a, 1252b-first voice coil frame;

[0124] 126a, 126b-first bracket; 127-first hanging edge;

[0125] 130 - second sound module; 131 - second diaphragm; 132 - second magnetic circuit assembly;

[0126] 1321-second magnetic steel; 1322-second magnetic conductive sheet; 1323-second U iron;

[0127] 133a, 133b-second vibration component; 1331a, 1331b-second voice coil; 1332a, 1332b-second voice coil frame;

[0128] 134a, 134b-second bracket; 135-second suspension edge; 136-magnetic circuit assembly;

[0129] 140-battery; 150-circuit board; 160-antenna; 170-camera module; 180-signal processor; 190-power amplifier;

[0130] 200-Electronic equipment;

[0131] 210-housing; 211-accommodation cavity; 212-rear cover; 213-side wall; 214-display screen; 215-sound outlet;

[0132] 220-sound module; 221-first diaphragm; 222-housing; 2221-sound cavity;

[0133] 223-phase adjustment member; 2231-second diaphragm; 2232-folding ring; 2233-inverted phase tube;

[0134] 224-magnetic circuit assembly; 2241-magnetic steel; 2242-magnetic guide sheet; 2243-U iron;

[0135] 225-vibration component; 2251-voice coil; 2252-voice coil frame;

[0136] 226- bracket; 227- first hanging edge. DETAILED DESCRIPTION

[0137] The terms used in the implementation section of this application are only used to explain the specific embodiments of this application and are not intended to limit this application.

[0138] The embodiment of the present application provides an electronic device, which can be a mobile phone, a television, a smart screen, a laptop, a tablet computer, an ultra-mobile personal computer (UMPC), a personal digital assistant (PDA), a handheld computer, a walkie-talkie, a netbook, or any other device with a sound-generating device. In the embodiment of the present application, the electronic device is a mobile phone as an example for description.

[0139] Figure 1 A schematic diagram of the structure of an electronic device provided in an embodiment of the present application, Figure 2 The following is a schematic diagram of an electronic device provided in an embodiment of the present application. Figure 3 A schematic diagram of the structure of an electronic device without a display screen provided in an embodiment of the present application, Figure 4 A working circuit diagram of a sound module provided in an embodiment of the present application.

[0140] See also Figure 1 and Figure 2 As shown, the electronic device 100 may include a housing 110 and a first sound module 120 and a second sound module 130 located in the housing 110. For example, the housing 110 may have a receiving cavity 111, and the first sound module 120 and the second sound module 130 may be disposed in the receiving cavity 111. For example, see Figure 2As shown, the housing 110 may include a back cover 112, a side wall 113 surrounding the back cover 112, and a display screen 114 covering the side wall 113. The back cover 112, the side wall 113, and the display screen 114 may be together surrounding to form a receiving cavity 111. For example, the side wall 113 may be the middle frame of the electronic device 100, and the display screen 114 may be used to display videos, photos, etc. Figure 3 As shown, a battery 140 , a circuit board 150 , an antenna 160 , a camera module 170 , etc. may also be disposed in the housing 110 of the electronic device 100 to realize the complete functions of the electronic device 100 .

[0141] The first sound module 120 and the second sound module 130 may be speaker modules in the electronic device 100, which may convert electrical energy into sound signals so that the electronic device 100 may play sound. For example, during the operation of the electronic device 100, the two sound modules may work at the same time, or only one sound module may work. Figure 4 As shown, the first sound module 120 can be electrically connected to the right channel in the electronic device 100, and the first sound module 120 can receive the right channel signal. The second sound module 130 can be electrically connected to the left channel, and the second sound module 130 can receive the left channel signal. The sound modules (the first sound module 120 and the second sound module 130) and the channel signals can be electrically connected through the signal processor 180 and the power amplifier 190. When the audio signal is input, it can be processed by the signal processor 180 first, and then passed through the power amplifier 190 and then transmitted to the sound module to emit sound through the sound module.

[0142] For example, when the electronic device 100 is playing videos, music, or playing games, two sound modules can work at the same time, and the sound can be radiated to the outside of the housing 110 through the two sound modules at the same time. At this time, it can be understood that the electronic device 100 is playing through external sound. Or, when the electronic device 100 is answering a call or listening to a voice through a handset, only one sound module in the electronic device 100 can work. At this time, it can be understood that the electronic device 100 is playing through bass.

[0143] As electronic devices become smaller, the space inside them becomes more and more compact, which reduces the space for sound modules in the housing of electronic devices, greatly reducing the cavity volume of the sound modules. If the cavity volume of the sound module is too small, it will produce a large elastic restraint force on the diaphragm of the speaker module during low-frequency vibration, resulting in poor low-frequency diving performance and affecting low-frequency performance.

[0144] Figure 5 It is a structural schematic diagram of a sound module in an electronic device in the related art.

[0145] At present, in order to expand the low-frequency dive, in the relevant technology, see Figure 5 As shown, the rear cavity of one of the sound modules in the electronic device 1 is usually designed to be open, and the rear cavity of the other sound module is designed to be closed. For example, the first sound module 20 can be set as a closed rear cavity structure, and the second sound module 30 can be set as an open rear cavity structure, wherein the rear cavity of the second sound module 30 with an open rear cavity is connected to the accommodating cavity 11 of the housing 10 of the electronic device 1, which can increase the rear cavity volume of the sound module. In this way, the elastic restraint force on the diaphragm of the speaker module during low-frequency vibration can be reduced, thereby achieving the effect of expanding the low-frequency dive.

[0146] However, the sound waves generated by the speaker module with an open rear cavity will radiate into the cavity of the electronic device, which can easily cause the outer casing of the electronic device to resonate due to the sound waves in the cavity, allowing the user to clearly feel the vibration of the electronic device casing, affecting the user experience.

[0147] In order to solve the above problems, the researchers thought of improving the sound module of the electronic device. By setting a phase adjustment component in the first sound module and adjusting the phase of the sound wave in the sound cavity through the phase adjustment component, the phase of the sound wave radiated from the first sound module to the inside of the shell can be opposite to the phase of the sound wave radiated from the second sound module to the inside of the shell. The two sound waves with opposite phases can cancel each other out inside the shell, which can effectively weaken the intensity of the sound waves inside the shell, reduce or avoid the resonance of the shell of the electronic device due to the internal sound waves, thereby effectively reducing or avoiding the vibration of the shell of the electronic device and improving the user experience.

[0148] The electronic device provided by the embodiments of the present application will be described in detail below in conjunction with the accompanying drawings.

[0149] Figure 6 A schematic diagram of the structure of the first sound module provided in an embodiment of the present application.

[0150] See also Figure 6 As shown, the first sound module 120 in the electronic device 100 may include a first diaphragm 121 and a shell 122 arranged around the first diaphragm 121, and one side of the first diaphragm 121 may be in communication with the outside of the housing 110. For example, the first diaphragm 121 and the shell 122 may be flexibly connected, and the first diaphragm 121 may reciprocate relative to the shell 122. During the vibration of the first diaphragm 121, the air on both sides of the first diaphragm 121 may be driven to vibrate, thereby generating sound waves on both sides of the first diaphragm 121. Among them, the sound waves generated by the side of the first diaphragm 121 in communication with the outside of the housing 110 may be radiated to the outside of the housing 110 for the convenience of the user to listen.

[0151] The other side of the first diaphragm 121 can communicate with the interior of the housing 122, and the first diaphragm 121 and the housing 122 can together form a sound cavity 1221. When the first diaphragm 121 vibrates, the sound waves generated by the first diaphragm 121 vibrating on the side communicating with the interior of the housing 122 can be radiated into the sound cavity 1221.

[0152] The second sound module 130 may have a second diaphragm 131, one side of the second diaphragm 131 may be in communication with the outside of the housing 110, and the other side of the second diaphragm 131 may be in communication with the inside of the housing 110. The second diaphragm 131 may vibrate back and forth to drive the air on both sides of the second diaphragm 131 to vibrate, thereby generating sound waves on both sides of the second diaphragm 131. The sound waves generated by the side of the second diaphragm 131 in communication with the outside of the housing 110 may be radiated to the outside of the housing 110 for the user to listen. The sound waves generated by the other side of the second diaphragm 131 may be radiated to the inside of the housing 110 to propagate in the accommodating cavity 111 of the housing 110.

[0153] Among them, the first sound module 120 can also include a phase adjustment component 123, and the phase adjustment component 123 can be located at the end of the shell 122 opposite to the first diaphragm 121. The phase adjustment component 123 can be used to radiate the sound waves in the sound cavity 1221 to the interior of the outer shell 110, and can adjust the phase of the sound waves radiated to the interior of the outer shell 110, so that the phase of the sound waves radiated to the interior of the outer shell 110 is opposite to the phase of the sound waves in the sound cavity 1221, so that the phase of the sound waves radiated from the sound cavity 1221 to the interior of the outer shell 110 is opposite to the phase of the sound waves radiated from the second diaphragm 131 to the interior of the outer shell 110.

[0154] During the operation of the sound module (the first sound module 120 and the second sound module 130), the vibration of the diaphragm (the first diaphragm 121 and the second diaphragm 131) can drive the air on both sides of the diaphragm to vibrate, thereby generating sound waves, wherein the sound waves on both sides of the diaphragm have opposite phases. For example, for ease of understanding, see Figure 6 As shown, the phase of the sound waves generated by the side of the first diaphragm 121 communicating with the outside of the housing 110 can be set to a + phase, and conversely, the phase of the sound waves generated by the side of the first diaphragm 121 communicating with the inside of the housing 122 can be set to a - phase, that is, the phase of the sound waves in the acoustic cavity 1221 is a - phase. Correspondingly, the phase of the sound waves generated by the side of the second diaphragm 131 communicating with the housing 110 is also a + phase, and the phase of the sound waves generated by the side of the second diaphragm 131 communicating with the inside of the housing 110 is a - phase.

[0155] The phase adjustment member 123 can radiate the sound waves in the acoustic cavity 1221 to the interior of the housing 110, and can adjust the phase of the sound waves so that the phase of the sound waves radiated to the interior of the housing 110 is opposite to the phase of the sound waves in the acoustic cavity 1221, that is, the phase of the sound waves radiated from the acoustic cavity 1221 to the interior of the housing 110 is changed from -phase to +phase after being adjusted by the phase adjustment member 123. At this time, the sound waves adjusted by the phase adjustment member 123 and radiated to the interior of the housing 110 are opposite in phase to the sound waves radiated to the interior of the housing 110 by the second diaphragm 131, and the two sound waves with opposite phases can cancel each other out inside the housing 110, which can effectively reduce the intensity of the sound waves inside the housing 110, thereby effectively reducing or avoiding vibration of the housing 110.

[0156] It should be noted that the phase adjustment member 123 does not necessarily have to completely reverse the sound waves in the sound cavity 1221. It can just make the phases of the two sound waves in the shell 110 roughly opposite, so that the two sound wave phases can be offset to reduce the sound wave intensity inside the shell 110, thereby weakening the vibration of the shell 110.

[0157] Compared with the sound module in the electronic device in the related art, the embodiment of the present application sets a phase adjustment member 123 in the first sound module 120, and adjusts the phase of the sound wave in the sound cavity 1221 through the phase adjustment member 123, so that the phase of the sound wave radiated from the first sound module 120 to the inside of the housing 110 is opposite to the phase of the sound wave radiated from the second sound module 130 to the inside of the housing 110. The two sound waves with opposite phases can cancel each other out inside the housing 110, which can effectively weaken the intensity of the sound wave inside the housing 110, reduce or avoid the housing 110 of the electronic device 100 from resonating due to the internal sound waves, thereby effectively reducing or avoiding the vibration of the housing 110 of the electronic device 100, and improving the user experience.

[0158] In the embodiment of the present application, the phase adjustment member 123 and the acoustic cavity 1221 can form a resonator, the resonant frequency of the resonator can be Fb, and the phase adjustment member 123 can reverse the phase of the sound wave radiated in the frequency range of 0.4Fb to 1.5Fb, so that the phase of the sound wave in the acoustic cavity 1221 is opposite to the phase of the sound wave radiated to the inside of the housing 110. For example, the value of Fb can be 100Hz to 900Hz. For example, taking Fb as 700Hz as an example, 0.4Fb is equal to 280Hz, and 1.5Fb is equal to 1050Hz, that is, in the frequency range of 280Hz to 1050Hz, the phase of the sound wave radiated by the phase adjustment member 123 can be reversed, so that the phase of the sound wave is reversed by -90° to 90°, so that the phase of the sound wave in the acoustic cavity 1221 is opposite to the phase of the sound wave radiated from the acoustic cavity 1221 to the inside of the housing 110.

[0159] Figure 7 A phase curve diagram of a phase adjustment element provided in an embodiment of the present application, Figure 8 This is a frequency response curve diagram of a phase adjustment component adopted in an embodiment of the present application.

[0160] For example, see Figure 7 As shown, Figure 7 The curve in FIG. 1 represents a curve diagram showing the phase of the sound wave radiated from the phase adjustment member 123 to the inside of the housing 110 as a function of frequency. Figure 7 It can be seen from the figure that when the operating frequency of the first sound module 120 is within the frequency range of 0.4Fb to Fb, that is, when the operating frequency is 280Hz to 700Hz in the figure, at this time, the phase of the sound waves radiated from the phase adjustment component 123 to the inside of the housing 110 is between -90° and -180°. When the operating frequency of the first sound module 120 is within the frequency range of Fb to 1.5Fb, that is, when the operating frequency is 700Hz to 1050Hz in the figure, at this time, the phase of the sound waves radiated from the phase adjustment component 123 to the inside of the housing 110 is between 180° and 90°. That is, within the frequency range of 0.4Fb to 1.5Fb, the phase of the sound waves radiated from the phase adjustment component 123 to the inside of the housing 110 is between -90° and 90°, and the phase is reversed.

[0161] It can be understood that the closer the operating frequency of the first sound module 120 is to the resonant frequency Fb of the resonator, the more obvious the inversion effect of the phase adjustment element 123 on the sound wave phase is. On the contrary, the farther the operating frequency of the first sound module 120 is from the resonant frequency Fb of the resonator, the weaker the inversion effect of the phase adjustment element 123 on the sound wave phase is. Figure 7 It can be seen that when the operating frequency of the first sound module 120 is equal to the resonant frequency Fb of the resonator, the phase adjustment of the sound wave by the phase adjustment component 123 can reach 180°. As the operating frequency moves away from the resonant frequency Fb of the resonator, the adjustment effect of the phase adjustment component 123 on the sound wave phase gradually weakens, for example, gradually reducing from 180° to 160°, 140°, 120°, 100°, etc. Overall, the sound waves in the sound cavity 1221 and the sound waves radiated to the inside of the housing 110 are basically in anti-phase state, and can be offset.

[0162] On the contrary, when the operating frequency is less than 0.4Fb or greater than 1.5Fb, the phase adjustment element 123 has almost no inverting effect on the phase of the sound wave, that is, the phase of the sound wave in the sound cavity 1221 is the same as the phase of the sound wave radiated to the inside of the housing 110.

[0163] In this way, when the operating frequency of the sound modules (the first sound module 120 and the second sound module 130) in the electronic device 100 is within the above-mentioned range of 0.4Fb to 1.5Fb, the phase of the sound waves radiated from the first sound module 120 to the inside of the shell 110 can be opposite to the phase of the sound waves radiated from the second sound module 130 to the inside of the shell 110, so that the two sound waves with opposite phases cancel each other out, which can effectively weaken the intensity of the sound waves inside the shell 110, thereby effectively reducing or avoiding the vibration of the shell 110.

[0164] See also Figure 8 As shown, Figure 8 is a graph showing the sound pressure level of the sound wave radiated from the phase adjustment member 123 to the inside of the housing 110 as a function of frequency. Figure 8 It can be seen that within the frequency range of 700 Hz to 1050 Hz, the sound pressure level of the sound waves radiated from the phase adjustment element 123 to the inside of the housing 110 is relatively high. It can be seen that the closer the operating frequency is to the resonant frequency of the resonator, the higher the sound pressure level of the sound waves generated by the phase adjustment element 123.

[0165] Continue to see Figure 6 As shown, in a possible implementation, the phase adjustment member 123 may include a third diaphragm 1231, and the end of the housing 122 opposite to the first diaphragm 121 may have an opening, the third diaphragm 1231 may be located at the opening, and the third diaphragm 1231 may be flexibly connected to the inner wall of the opening. When the sound waves generated in the sound cavity 1221 during the vibration of the first diaphragm 121 are transmitted to the third diaphragm 1231, the third diaphragm 1231 may be driven to vibrate, and during the vibration of the third diaphragm 1231, the air inside the housing 110 may be driven to vibrate, thereby generating sound waves, and the phase of the sound waves inside the housing 110 is opposite to the phase of the sound waves in the sound cavity 1221.

[0166] For example, when the first diaphragm 121 vibrates, the phase of the sound waves generated outside the housing 110 may be a + phase, while the phase of the sound waves generated by the first diaphragm 121 inside the acoustic cavity 1221 is a - phase, and the phase of the sound waves generated by the third diaphragm 1231 inside the housing 110 is a + phase. Correspondingly, the phase of the sound waves generated by the second diaphragm 131 outside the housing 110 is also a + phase, and the phase of the sound waves generated by the second diaphragm 131 inside the housing 110 is a - phase.

[0167] In this way, the phase of the sound waves radiated to the inside of the shell 110 after adjustment by the third diaphragm 1231 is opposite to the phase of the sound waves generated by the first diaphragm 121 inside the shell 110, so that the phase of the sound waves generated by the first sound module 120 inside the shell 110 is opposite to the sound waves of the second sound module 130 inside the shell 110. The two sound waves with opposite phases can cancel each other out inside the shell 110, thereby effectively reducing the intensity of the sound waves inside the shell 110, and effectively reducing or avoiding the vibration of the shell 110.

[0168] In the embodiment of the present application, the third diaphragm 1231 may satisfy the following formula:

[0169]

[0170] Wherein, Mr is the mass of the third diaphragm 1231, Cb is the equivalent compliance of the air in the acoustic cavity 1221, and Cb can satisfy the following formula:

[0171]

[0172] Wherein, Vb is the volume of the acoustic cavity 1221, ρ is the air density, and the value of ρ can be 1.29 kg / m 3 , C is the air sound speed, the value of C can be 340m / s, and Sr is the vibration area of ​​the third diaphragm 1231.

[0173] It can be concluded from the above formula that: when the phase adjustment component 123 is the third diaphragm 1231, the resonant frequency Fb of the resonator formed by the phase adjustment component 123 and the acoustic cavity 1221 is related to the mass of the third diaphragm 1231, the volume of the acoustic cavity 1221, and the vibration area of ​​the third diaphragm 1231. Therefore, in the specific design process, the resonant frequency Fb of the resonator can be adjusted by adjusting the mass of the third diaphragm 1231, the volume of the acoustic cavity 1221, and the vibration area of ​​the third diaphragm 1231, so that the resonator can meet the resonance requirements of different frequencies, and the phase adjustment component 123 can adjust the phases of sound waves of different frequency bands, so that the sound waves of different frequency bands can cancel each other out in the shell 122, so as to reduce or avoid the vibration of the housing 110.

[0174] For example, in the embodiment of the present application, the mass Mr of the third diaphragm 1231 may range from 0.05g to 1g, for example, the mass Mr of the third diaphragm 1231 may be 0.05g, 0.5g, or 1g. When the volume Vb of the acoustic cavity 1221 and the vibration area Sr of the third diaphragm 1231 in the above formula remain unchanged, by adjusting the mass Mr of the third diaphragm 1231, the operating frequency of the sound module (the first sound module 120 and the second sound module 130) may be within the frequency range of 0.4Fb to 1.5Fb. Within the frequency range of 0.4Fb to 1.5Fb, the phase adjustment element 123 can reverse the phase of the sound waves in the sound cavity 1221, so that the phase of the sound waves radiated to the inside of the shell 110 is opposite to the phase of the sound waves in the sound cavity 1221, thereby making the sound waves generated by the first sound module 120 and the second sound module 130 inside the shell 110 have opposite phases to cancel each other out, thereby effectively weakening the intensity of the sound waves in the shell 110 and reducing or avoiding the vibration of the shell 110 of the electronic device 100.

[0175] It is understandable that, in addition to adjusting the mass Mr of the third diaphragm 1231, the volume of the acoustic cavity 1221 can also be adjusted so that the operating frequency of the sound module is within the frequency range of 0.4Fb to 1.5Fb. For example, the value range of the volume Vb of the acoustic cavity 1221 can be 0.2mm 3 ~2mm 3 For example, the volume Vb of the acoustic cavity 1221 may be 0.2 mm 3 , 0.5mm 3 , 1mm 3 , 2mm 3 Etc. In the case where the mass Mr of the third diaphragm 1231 and the vibration area Sr of the third diaphragm 1231 in the above formula remain unchanged, the resonant frequency of the resonator can also be adjusted by adjusting the volume Vb of the sound cavity 1221, so that the operating frequency of the sound module is within the frequency range of 0.4Fb to 1.5Fb, so that the phase adjustment member 123 can reverse the phase of the sound wave in the sound cavity 1221, so that the sound waves generated by the first sound module 120 and the second sound module 130 inside the housing 110 are opposite in phase, so as to cancel each other, effectively weaken the intensity of the sound waves in the housing 110, and reduce or avoid the vibration of the housing 110 of the electronic device 100.

[0176] Continue to see Figure 6As shown, the phase adjustment member 123 may also include a folded ring 1232, and one end of the third diaphragm 1231 may be flexibly connected to the inner wall of the opening through the folded ring 1232. The folded ring 1232 is also called a suspension edge, which has a certain flexibility. During the vibration of the third diaphragm 1231, the force between the third diaphragm 1231 and the shell 122 may be reduced, and the force between the shell 122 and the third diaphragm 1231 may be reduced or avoided to have an adverse effect on the vibration of the third diaphragm 1231. Moreover, the folded ring 1232 may also isolate the air inside the sound cavity 1221 from the air inside the housing 110 to prevent acoustic short circuit. Furthermore, the folded ring 1232 may also provide certain support for the third diaphragm 1231 to reduce or avoid the shaking of the third diaphragm 1231 during the vibration process, which is beneficial to improve the stability of the vibration of the third diaphragm.

[0177] Fig. 9 A schematic diagram of the structure of the second sound module provided in an embodiment of the present application.

[0178] In another possible implementation, see Fig. 9 As shown, the phase adjustment member 123 may include an inverted phase tube 1233, one end of which may be connected to the housing 122 and communicate with the sound cavity 1221, and the other end of which may be communicated with the interior of the housing 110. When the sound waves generated in the sound cavity 1221 during the vibration of the first diaphragm 121 are transmitted to the inverted phase tube 1233, the sound waves may be reversed in phase in the inverted phase tube 1233 and radiated to the interior of the housing 110 through the inverted phase tube 1233.

[0179] For example, when the first diaphragm 121 vibrates, the phase of the sound waves generated outside the housing 110 may be a + phase, while the phase of the sound waves generated by the first diaphragm 121 inside the acoustic cavity 1221 is a - phase, and the phase of the sound waves in the acoustic cavity 1221 that are radiated to the inside of the housing 110 after being inverted by the inverted tube 1233 is a + phase. Correspondingly, the phase of the sound waves generated by the second diaphragm 131 outside the housing 110 is also a + phase, and the phase of the sound waves generated by the second diaphragm 131 inside the housing 110 is a - phase.

[0180] In this way, the sound waves radiated into the interior of the shell 110 after being inverted by the inverted tube 1233 are opposite in phase to the sound waves generated by the second diaphragm 131 inside the shell 110, so that the phase of the sound waves generated by the first sound module 120 inside the shell 110 is opposite to the sound waves of the second sound module 130 inside the shell 110. The two sound waves with opposite phases can cancel each other out inside the shell 110, thereby effectively reducing the intensity of the sound waves inside the shell 110, and effectively reducing or avoiding the vibration of the shell 110.

[0181] In the embodiment of the present application, the inverter tube 1233 can satisfy the following formula:

[0182]

[0183] Wherein, Mp is the mass of the air in the inverted tube 1233 , and Cb is the equivalent compliance of the air in the acoustic cavity 1221 .

[0184] Mp can satisfy the following formula:

[0185] Mp=ρ(LSp)

[0186] Cb can satisfy the following formula:

[0187]

[0188] Where ρ is the air density, and the value of ρ can be 1.29kg / m 3 , L is the length of the inverted tube 1233, Sp is the cross-sectional area of ​​the inverted tube 1233, Vb is the volume of the sound cavity 1221, and C is the air sound velocity, which can be 340 m / s.

[0189] It can be concluded from the above formula that: when the phase adjustment element 123 is an inverted tube 1233, the resonant frequency Fb of the resonator formed by the phase adjustment element 123 and the acoustic cavity 1221 is related to the length of the inverted tube 1233, the volume of the acoustic cavity 1221, and the cross-sectional area of ​​the inverted tube 1233. Therefore, in the specific design process, the resonant frequency Fb of the resonator can be adjusted by adjusting the length and cross-sectional area of ​​the inverted tube 1233 and the volume of the acoustic cavity 1221, so that the resonator can meet the resonance requirements of different frequencies, and the phase adjustment element 123 can adjust the phases of sound waves of different frequency bands, so that the sound waves of different frequency bands can cancel each other out in the shell 122, so as to reduce or avoid vibration of the housing 110.

[0190] For example, in the embodiment of the present application, the length L of the inverted tube 1233 may range from 5 mm to 50 mm, for example, the length L of the inverted tube 1233 may be 5 mm, 10 mm, 20 mm, or 50 mm. When the volume Vb of the sound cavity 1221 and the cross-sectional area Sp of the inverted tube 1233 in the above formula remain unchanged, by adjusting the length L of the inverted tube 2233, the operating frequency of the sound module can be within the frequency range of 0.4 Fb to 1.5 Fb, and the inverted tube 2233 can reverse the phase of the sound wave in the sound cavity 1221, so that the phases of the sound waves generated by the first sound module 120 and the second sound module 130 inside the housing 110 are opposite, thereby effectively reducing the intensity of the sound waves in the housing 110 and reducing or avoiding the vibration of the housing 110 of the electronic device 100.

[0191] It is understandable that in addition to adjusting the length L of the inverted tube 1233, the cross-sectional area Sp of the inverted tube 1233 can also be adjusted so that the operating frequency of the sound module is within the frequency range of 0.4Fb to 1.5Fb. For example, the cross-sectional area Sp of the inverted tube 1233 can be in the range of 0.3mm 2 ~3mm 2 For example, the cross-sectional area Sp of the inverted tube 1233 may be 0.3 mm 2 , 1mm 2 , 2mm 2 , 3mm 2 In the case where the length L of the inverted tube 1233 and the volume Vb of the sound cavity 1221 in the above formula remain unchanged, the resonant frequency Fb of the resonator formed by the inverted tube 1233 and the sound cavity 1221 can also be adjusted by adjusting the cross-sectional area Sp of the inverted tube 1233, so that the operating frequency of the sound module is within the frequency range of 0.4Fb to 1.5Fb, so that the phase adjustment element 123 can reverse the phase of the sound wave in the sound cavity 1221, so that the phases of the sound waves generated by the first sound module 120 and the second sound module 130 inside the housing 110 are opposite, thereby effectively weakening the intensity of the sound waves in the housing 110, and reducing or avoiding the vibration of the housing 110 of the electronic device 100.

[0192] Alternatively, the volume Vb of the sound cavity 1221 may be adjusted so that the operating frequency of the sound module is within the frequency range of 0.4Fb to 1.5Fb. For example, the volume Vb of the sound cavity 1221 may be within the range of 0.2 cm 3 ~2cm 3 For example, the volume Vb of the acoustic cavity 1221 may be 0.2 cm 3 、0.5cm 3 , 1cm 3 , 2cm 3 By adjusting the volume Vb of the sound cavity 1221, the resonant frequency Fb of the resonator can also be adjusted, so that the operating frequency of the sound module is within the frequency range of 0.4Fb to 1.5Fb, so that the phase adjustment component 123 can reverse the phase of the sound wave in the sound cavity 1221, so that the phases of the sound waves generated by the first sound module 120 and the second sound module 130 inside the shell 110 are opposite, thereby effectively weakening the intensity of the sound waves in the shell 110 and reducing or avoiding the vibration of the shell 110 of the electronic device 100.

[0193] Continue to see Fig. 9 As shown, in one possible implementation, the housing 110 of the electronic device 100 may be provided with two groups of sound outlets 115 (for example, Fig. 9The first diaphragm 121 can be connected to the outside of the housing 110 through one of the two groups of sound outlets 115. The second diaphragm 131 can be connected to the outside of the housing 110 through the other sound outlet 115 of the two groups of sound outlets 115. For example, the two groups of sound outlets 115 can be sound outlet 115a and sound outlet 115b, respectively, wherein the first diaphragm 121 can be connected to the outside of the housing 110 through the sound outlet 115a, and the second diaphragm 131 can be connected to the outside of the housing 110 through the sound outlet 115b.

[0194] For example, taking the electronic device 100 as a mobile phone, one of the sound outlets 115 may be an upper sound outlet 115, which is also called an earpiece and can be used to answer calls, voice, etc. Another sound outlet 115 may be a lower sound outlet 115, which is also called a speaker and can be used to play videos, video calls, play music, play games, etc. For example, the sound outlet 115a may be a lower sound outlet 115, and the sound outlet 115b may be an upper sound outlet 115.

[0195] See also Fig. 9 As shown, the housing 110 of the electronic device 100 may include a back cover 112, a side wall 113 surrounding the back cover 112, and a display screen 114 covering the side wall 113, wherein one of the two groups of sound outlets 115 may be opened between the display screen 114 and the side wall 113, and the other sound outlet 115 may be opened on the side wall 113, and the two groups of sound outlets 115 may be respectively located at opposite ends of the display screen 114. For example, the sound outlet 115a may be opened on the side wall 113 of the electronic device 100, and the sound outlet 115b may be located between the display screen 114 and the side wall 113, and the sound outlet 115a may be located below the display screen 114, and the sound outlet 115b may be located above the display screen 114. The above and below of the display screen 114 refer to the above and below of the display screen 114 when the display screen 114 of the electronic device 100 faces the user.

[0196] Fig.10 for Figure 6 Magnified view of area A in the middle.

[0197] See also Fig.10 As shown, the first sound module 120 may include a first magnetic circuit component 124, a first vibration component 125a and a first bracket 126a, wherein the outer edge of the first diaphragm 121 may be connected to one end of the first bracket 126a via a first suspension edge 127.

[0198] The first vibration component 125a may include a first voice coil 1251a and a first voice coil frame 1252a, one end of the first voice coil frame 1252a may be connected to the first diaphragm 121, and the first voice coil 1251a may be sleeved on the other end of the first voice coil frame 1252a. In addition, at least a portion of the first voice coil 1251a and the first voice coil frame 1252a may be located in the magnetic field of the first magnetic circuit component 124. For example, at least a portion of the first voice coil 1251a and the first voice coil frame 1252a may be located in the magnetic gap of the first magnetic circuit component 124.

[0199] The first bracket 126a can be connected to the housing 110 of the electronic device 100, so that the first sound module 120 can be fixed in the housing 110 through the first bracket 126a.

[0200] The side of the first diaphragm 121 facing away from the first voice coil skeleton 1252a may be a sound-emitting surface, and the sound-emitting surface may communicate with the outside of the housing 110 through the sound outlet 115a. For example, as shown in the figure, a sound transmission cavity 116a may be provided in the housing 110, one end of the sound transmission cavity 116a may be communicated with the sound outlet 115a provided on the housing 110, and the other end of the sound transmission cavity 116a may be connected to the first bracket 126a and communicate with the sound-emitting surface of the first diaphragm 121.

[0201] When an AC audio current signal is input to the first voice coil 1251a, the first voice coil 1251a after being energized can be subjected to a magnetic field force in the magnetic field of the first magnetic circuit assembly 124. Moreover, the magnitude and direction of the magnetic field force will change at any time with the magnitude and direction of the current, so that the first voice coil 1251a and the first voice coil frame 1252a can reciprocate. During the reciprocating motion of the first voice coil 1251a and the first voice coil frame 1252, the first diaphragm 121 can be driven to reciprocate together, so that the first diaphragm 121 can drive the surrounding air to vibrate and emit sound (i.e., sound waves). Among them, the sound generated by the side of the first diaphragm 121 that is connected to the housing 110 can be transmitted to the sound outlet 115a through the sound transmission cavity 116a, and radiated to the outside of the housing 110 through the sound outlet 115a for the user to listen. The sound generated by the side of the first diaphragm 121 facing the first voice coil frame 1252 a can be radiated into the sound cavity 1221 and radiated into the interior of the housing 110 after being adjusted by the phase adjustment member 123 .

[0202] The first magnetic circuit assembly 124 may include a first magnetic steel 1241, a first magnetic conductive sheet 1242 and a first U iron 1243. The first magnetic steel 1241 and the first magnetic conductive sheet 1242 may be stacked on the bottom wall of the first U iron 1243. At least part of the first voice coil 1251a and the first voice coil skeleton 1252a may be located between the first magnetic conductive sheet 1242 and the inner side wall 113 of the first U iron 1243. The first magnetic steel 1241 may be a permanent magnet having a magnetic field. A magnetic gap may be formed between the first magnetic conductive sheet 1242 and the inner side wall 113 of the first U iron 1243, so that the first voice coil 1251a and the first voice coil skeleton 1252a may be subjected to a magnetic field force in the gap, thereby reciprocating under the action of the magnetic field force. The first magnetic conductive sheet 1242 may play a role in magnetic conductivity, so as to enhance the magnetic field strength of the first magnetic circuit assembly 124.

[0203] Fig.11 for Figure 6 Magnified view of area B in the middle.

[0204] See also Fig.11 As shown, the second sound module 130 may include a second magnetic circuit component 132 , a second vibration component 133 a and a second bracket 134 a , wherein the outer edge of the second diaphragm 131 may be connected to one end of the second bracket 134 a via a second suspension edge 135 .

[0205] The second vibration component 133a may include a second voice coil 1331a and a second voice coil frame 1332a, one end of the second voice coil frame 1332a may be connected to the second diaphragm 131, and the second voice coil 1331a may be sleeved on the other end of the second voice coil frame 1332a. In addition, at least a portion of the second voice coil 1331a and the second voice coil frame 1332a may be located in the magnetic field of the second magnetic circuit component 132. For example, at least a portion of the second voice coil 1331a and the second voice coil frame 1332a may be located in the magnetic gap of the second magnetic circuit component 132.

[0206] The second bracket 134a and the second magnetic circuit assembly 132 can be exposed inside the shell 110, so that the inside of the shell 110 serves as the back cavity of the second sound module 130. For example, it can be understood that the second sound module 130 is an open back cavity.

[0207] The second bracket 134a may also be connected to the housing 110 of the electronic device 100 so that the second sound module 130 may be fixed in the housing 110 through the second bracket 134a.

[0208] The side of the second diaphragm 131 facing away from the second voice coil frame 1332a may be a sound outlet surface, and the sound outlet surface may communicate with the outside of the housing 110 through the sound outlet 115b. Fig.11As shown, a sound transmission cavity 116b may be further provided in the housing 110 , one end of the sound transmission cavity 116b may be connected to the sound outlet 115b provided on the housing 110 , and the other end of the sound transmission cavity 116b may be connected to the second bracket 134a and communicate with the sound outlet surface of the second diaphragm 131 .

[0209] When an AC audio current signal is input to the second voice coil 1331a, the second voice coil 1331a after being energized can be subjected to a magnetic field force in the magnetic field of the second magnetic circuit component 132. Moreover, the magnitude and direction of the magnetic field force will change at any time with the magnitude and direction of the current, so that the second voice coil 1331a and the second voice coil frame 1332a can reciprocate. During the reciprocating motion of the second voice coil 1331a and the second voice coil frame 1332a, the second diaphragm 131 can be driven to reciprocate together, so that the second diaphragm 131 can drive the surrounding air to vibrate and emit sound (i.e., sound waves). Among them, the sound generated by the side of the second diaphragm 131 that is connected to the housing 110 can be transmitted to the sound outlet 115b through the sound transmission cavity 116b, and radiated to the outside of the housing 110 through the sound outlet 115b for the user to listen. The sound generated by the side of the second diaphragm 131 facing the second voice coil frame 1332a can be radiated to the inside of the housing 110.

[0210] The second magnetic circuit assembly 132 may include a second magnetic steel 1321, a second magnetic conductive sheet 1322, and a second U-iron 1323. The second magnetic steel 1321 and the second magnetic conductive sheet 1322 may be stacked on the bottom wall of the second U-iron 1323, and at least part of the second voice coil 1331a and the second voice coil skeleton 1332a may be located between the second magnetic conductive sheet 1322 and the inner side wall 113 of the second U-iron 1323. The second magnetic steel 1321 may be a permanent magnet having a magnetic field. A magnetic gap may be formed between the second magnetic conductive sheet 1322 and the inner side wall 113 of the second U-iron 1323, so that the second voice coil 1331a and the second voice coil skeleton 1332a may be subjected to a magnetic field force in the gap, thereby reciprocating under the action of the magnetic field force. The second magnetic conductive sheet 1322 may play a magnetic conductive role to enhance the magnetic field strength of the second magnetic circuit assembly 132.

[0211] Fig.12 A schematic diagram of the structure of a third sound module provided in an embodiment of the present application, Fig.13 for Fig.12 Magnified view of area C in the middle.

[0212] In another possible implementation, see Fig.12 and Fig.13As shown, a group of sound outlets 115 may be provided on the housing 110, and the first diaphragm 121 and the second diaphragm 131 may both communicate with the outside of the housing 110 through the group of sound outlets 115. For example, a sound outlet 115c may be provided on the housing 110, and the first diaphragm 121 and the second diaphragm 131 may both communicate with the sound outlet 115. During the vibration of the first diaphragm 121 and the second diaphragm 131, the sound waves emitted from the side thereof communicating with the housing 110 may be radiated to the outside of the housing 110 through the sound outlet 115c for the user to listen.

[0213] For example, see Fig.13 As shown, the housing 110 of the electronic device 100 may include a rear cover 112, a side wall 113 surrounding the rear cover 112, and a display screen 114 covering the side wall 113, and a sound outlet 115c may be provided on the side wall 113 of the housing 110. A front cavity 117 may also be provided inside the housing 110, and the front cavity 117 may be connected to the sound outlet 115c. The first diaphragm 121 and the second diaphragm 131 may be connected to the sound outlet 115c through the front cavity 117, and thus may be connected to the outside of the housing 110 through the front cavity 117 and the sound outlet 115c. During the vibration process of the first diaphragm 121 and the second diaphragm 131, the sound waves generated by the side thereof facing the front cavity 117 may be transmitted to the sound outlet 115c through the front cavity 117, and radiated to the outside of the housing 110 through the sound outlet 115c, so that the user may listen.

[0214] Continue to see Fig.12 and Fig.13 As shown, the first sound module 120 and the second sound module 130 can be arranged opposite to each other, and the front of the first diaphragm 121 and the front of the second diaphragm 131 can communicate with the outside of the housing 110 through the sound outlet 115c. For example, the front of the first diaphragm 121 and the front of the second diaphragm 131 can communicate with the sound outlet 115c through the front cavity 117 inside the housing 110, and communicate with the outside of the housing 110 through the sound outlet 115c.

[0215] The front side of the first diaphragm 121 refers to the side of the first diaphragm 121 facing away from the magnetic circuit component in the first sound module 120, that is, the front side of the first diaphragm 121 can be understood as the side of the first diaphragm 121 facing away from the first magnetic circuit component 124. On the contrary, the back side of the first diaphragm 121 can be understood as the side of the first diaphragm 121 facing the first magnetic circuit component 124, the back side of the first diaphragm 121 is opposite to the front side of the first diaphragm 121, and the back side of the first diaphragm 121 can be connected to the sound cavity 1221.

[0216] The front side of the second diaphragm 131 refers to the side of the second diaphragm 131 facing away from the magnetic circuit component in the second sound module 130, that is, the front side of the second diaphragm 131 can be understood as the side of the second diaphragm 131 facing away from the second magnetic circuit component 132. On the contrary, the back side of the second diaphragm 131 can be understood as the side of the second diaphragm 131 facing the second magnetic circuit component 132, and the back side of the second diaphragm 131 is opposite to the front side of the second diaphragm 131. That is, in this embodiment, it can be understood that the first sound module 120 and the second sound module 130 are arranged face to face.

[0217] During the vibration of the first diaphragm 121 and the second diaphragm 131, the sound waves generated on their front sides can be transmitted to the front cavity 117, then transmitted to the sound outlet 115c through the front cavity 117, and finally radiated to the outside of the housing 110 through the sound outlet 115c for the user to listen.

[0218] The sound waves generated by the side of the first diaphragm 121 facing the first magnetic circuit component 124 (i.e., the back side of the first diaphragm 121) can be radiated into the acoustic cavity 1221, and the sound waves can be reversed in phase by the phase adjustment member 123 and radiated into the interior of the housing 110. The sound waves generated by the side of the second diaphragm 131 facing the second magnetic circuit component 132 (i.e., the back side of the second diaphragm 131) can be radiated into the interior of the housing 110, and the sound waves radiated into the interior of the housing 110 by the second diaphragm 131 are opposite in phase to the sound waves adjusted by the phase adjustment member 123 and radiated into the interior of the housing 110, so that the two sound waves with opposite phases can cancel each other out.

[0219] Fig.14 A schematic diagram of the structure of the fourth sound module provided in the embodiment of the present application, Fig.15 for Fig.14 Magnified view of area D in the middle.

[0220] Alternatively, see Fig.14 and Fig.15 As shown, the first sound module 120 and the second sound module 130 can also be arranged back to back, and the backs of the first diaphragm 121 and the second diaphragm 131 can communicate with the outside of the housing 110 through the sound outlet 115c. For example, the back of the first diaphragm 121 and the back of the second diaphragm 131 can communicate with the sound outlet 115c through the front cavity 117 inside the housing 110, and communicate with the outside of the housing 110 through the sound outlet 115c. That is, in this embodiment, the first sound module 120 and the second sound module 130 can be understood to be arranged back to back.

[0221] During the vibration of the first diaphragm 121 and the second diaphragm 131, the sound waves generated on their back sides can be transmitted to the front cavity 117, and then transmitted to the sound outlet 115c through the front cavity 117, and finally radiated to the outside of the housing 110 through the sound outlet 115c for the user to listen.

[0222] The sound waves generated by the front side of the first diaphragm 121 can be radiated into the acoustic cavity 1221, and the sound waves can be reversed in phase by the phase adjustment member 123 and radiated into the interior of the housing 110. The sound waves generated by the front side of the second diaphragm 131 can be radiated into the interior of the housing 110, and the sound waves radiated into the interior of the housing 110 by the second diaphragm 131 are opposite in phase to the sound waves adjusted by the phase adjustment member 123 and radiated into the interior of the housing 110, so that the two sound waves with opposite phases can cancel each other out.

[0223] For example, in the embodiments of the present application, see Fig.15 As shown, the electronic device 100 may further include a magnetic circuit component 136, and the first sound module 120 and the second sound module 130 may share the magnetic circuit component 136. For example, the first sound module 120 may include a first vibration component 125b and a first bracket 126b, and the second sound module 130 may include a second vibration component 133b and a second bracket 134b. The outer edge of the first diaphragm 121 may be connected to one end of the first bracket 126b through the first hanging edge 127, and the outer edge of the second diaphragm 131 may be connected to one end of the second bracket 134b through the second hanging edge 135.

[0224] The first vibration component 125 may include a first voice coil 1251b and a first voice coil frame 1252b, wherein one end of the first voice coil frame 1252b may be connected to the first diaphragm 121, and the first voice coil 1251b may be sleeved on the other end of the first voice coil frame 1252b. In addition, at least a portion of the first voice coil 1251b and the first voice coil frame 1252b may be located in the magnetic field of the magnetic circuit component 136. For example, at least a portion of the first voice coil 1251b and the first voice coil frame 1252b may be located in the magnetic gap of the magnetic circuit component 136.

[0225] Accordingly, the second vibration component 133b may include a second voice coil 1331b and a second voice coil frame 1332b, one end of the second voice coil frame 1332b may be connected to the second diaphragm 131, and the second voice coil 1331b may be sleeved on the other end of the second voice coil frame 1332b. Furthermore, at least a portion of the second voice coil 1331b and the second voice coil frame 1332b may be located in the magnetic field of the magnetic circuit component 136. For example, at least a portion of the second voice coil 1331b and the second voice coil frame 1332b may be located in the magnetic gap of the magnetic circuit component 136. Furthermore, the second vibration component 133b and the first vibration component 125b are respectively located at opposite ends of the magnetic circuit component 136.

[0226] Among them, the first bracket 126b and the second bracket 134b can be connected to the shell 110 respectively, so that the first sound module 120 can be fixed inside the shell 110 through the first bracket 126b, and the second sound module 130 can be fixed inside the shell 110 through the second bracket 134b.

[0227] The first vibration component 125b and the second vibration component 133b can share the magnetic circuit component 136. The first vibration component 125b and the second vibration component 133b can be in the magnetic field at both ends of the magnetic circuit component 136. When an AC audio signal is input to the first voice coil 1251b and the second voice coil 1331b, the first voice coil 1251b and the second voice coil 1331b after power-on can be subjected to magnetic field forces in the magnetic field at both ends of the magnetic circuit component 136, and the magnetic field forces can change at any time with the magnitude and direction of the current, so that the first vibration component 125b and the second vibration component 133b can reciprocate. During the reciprocating motion, the first vibration component 125b and the second vibration component 133b can respectively drive the first diaphragm 121 and the second diaphragm 131 to reciprocate together, so that the first diaphragm 121 and the second diaphragm 131 can drive the surrounding air to move together and produce sound.

[0228] During the vibration of the first diaphragm 121 and the second diaphragm 131, the sound waves generated by the side facing the magnetic circuit assembly 136 can be transmitted to the front cavity 117, and then transmitted to the sound outlet 115c through the front cavity 117, and finally radiated to the outside of the housing 110 through the sound outlet 115c for the user to listen.

[0229] The side of the first diaphragm 121 facing away from the magnetic circuit component 136 is in communication with the acoustic cavity 1221, and the sound waves generated by the side of the first diaphragm 121 facing away from the magnetic circuit component 136 can be transmitted to the acoustic cavity 1221, and radiated to the inside of the housing 110 after the phase is adjusted by the phase adjustment member 123. The sound waves generated by the side of the second diaphragm 131 facing away from the magnetic circuit component 136 can be radiated to the inside of the housing 110, and the phase of the sound waves radiated from the second diaphragm 131 to the inside of the housing 110 is opposite to the phase of the sound waves radiated from the phase adjustment member 123 to the inside of the housing 110, so that the two sound waves with opposite phases can cancel each other out, thereby reducing or avoiding the vibration of the housing 110 of the electronic device 100.

[0230] Fig.16 A schematic diagram of the structure of another electronic device provided in an embodiment of the present application.

[0231] The embodiment of the present application also provides an electronic device, which can be a mobile phone, a television, a smart screen, a laptop, a tablet computer, an ultra-mobile personal computer (UMPC), a personal digital assistant (PDA), a handheld computer, a walkie-talkie, a netbook, or any other device with a sound-generating device. In the embodiment of the present application, the electronic device 100 is described as a mobile phone.

[0232] See also Fig.16 As shown, the electronic device 200 may include a housing 210 and a sound module 220 located in the housing 210. For example, the housing 210 may have a receiving cavity 211, and the sound module 220 may be disposed in the receiving cavity 211. For example, the housing 210 of the electronic device 200 may include a back cover 212, a side wall 113 surrounding the back cover 212, and a display screen 214 covered on the side wall 213. For example, the side wall 213 may be a middle frame of the electronic device 200, and the display screen 214 may be used to display videos, photos, etc.

[0233] The sound module 220 may include a first diaphragm 221 and a shell 222 surrounding the first diaphragm 221, one side of the first diaphragm 221 is connected to the outside of the outer shell 210, and the other side of the first diaphragm 221 can be connected to the inside of the shell 222, and the shell 222 and the first diaphragm 221 can be jointly formed to form a sound cavity 2221.

[0234] For example, the first diaphragm 221 and the housing 222 may be flexibly connected, and the first diaphragm 221 may reciprocate relative to the housing 222. During the vibration of the first diaphragm 221, the air on both sides of the first diaphragm 221 may be driven to vibrate, thereby generating sound waves on both sides of the first diaphragm 221. The sound waves generated by the side of the first diaphragm 221 that is in communication with the outside of the housing 210 may be radiated to the outside of the housing 210 for the convenience of the user to listen. The sound waves generated by the side of the first diaphragm 221 that is in communication with the inside of the housing 222 may be radiated into the acoustic cavity 2221.

[0235] The sound module 220 may also include a phase adjustment component 223, which may be located at the end of the shell 222 opposite to the first diaphragm 221. The phase adjustment component 223 may be used to radiate the sound waves in the sound cavity 2221 to the interior of the outer shell 210, and may adjust the phase of the sound waves inside the outer shell 110 so that the phase of the sound waves radiated to the interior of the outer shell 210 is the same as the phase of the sound waves in the sound cavity 2221. It can be understood that the phase adjustment component 223 does not have a reversing effect on the phase of the sound waves in the sound cavity 2221.

[0236] During the operation of the sound module 220, the first diaphragm 221 can drive the air on both sides to vibrate, thereby generating sound waves. Among them, the sound waves on both sides of the first diaphragm 221 have opposite phases. For example, for ease of understanding, the phase of the sound waves generated by the side of the first diaphragm 221 that is connected to the outside of the shell 210 can be set to + phase. On the contrary, the phase of the sound waves generated by the side of the first diaphragm 221 that is connected to the inside of the shell 222 is set to - phase, that is, the phase of the sound waves in the sound cavity 2221 is - phase. Phase adjustment can radiate the sound waves in the sound cavity 2221 to the inside of the shell 210, and can adjust the phase of the sound waves so that the phase of the sound waves in the sound cavity 2221 is the same as the phase of the sound waves radiated to the inside of the shell 210, that is, the phase of the sound waves radiated from the inside of the sound cavity 2221 to the inside of the shell 210 is also - phase. At this time, the phase of the sound wave radiated to the outside of the shell 210 by the first diaphragm 221 is opposite to the phase of the sound wave radiated to the inside of the shell 210 after adjustment by the phase adjustment component 223. The two sound waves with opposite phases are isolated by the shell 210, which can effectively avoid the problem of acoustic short circuit between the sound waves outside the shell 210 and the sound waves inside the shell 210 due to the opposite phases, and can effectively improve the broadcasting performance of the electronic device 200.

[0237] The electronic device 200 provided in the embodiment of the present application, by setting a phase adjustment component 223 in the sound module 220, the phase adjustment component 223 can adjust the phase of the sound wave in the sound cavity 2221, so that the phase of the sound wave radiated from the sound module 220 to the outside of the housing 210 can be opposite to the phase of the sound wave radiated to the inside of the housing 210 after adjustment by the phase adjustment component 223. The two sound waves with opposite phases are isolated from each other by the housing 210, which can effectively reduce or avoid the cancellation of the two sound waves with opposite phases to produce an acoustic short circuit, thereby effectively improving the sound pressure level of the electronic device 200.

[0238] Fig.17 A phase curve diagram of another phase adjustment element provided in an embodiment of the present application.

[0239] In the embodiment of the present application, the phase adjustment member 223 and the acoustic cavity 2221 may form a resonator, the resonant frequency of the resonator may be Fb, and the phase adjustment member 223 may be in phase with the sound waves radiated in the frequency range of <0.4Fb, so that the phase of the sound waves radiated to the inside of the housing 210 is the same as the phase of the sound waves in the acoustic cavity 2221. For example, the value of Fb may be 100 Hz to 900 Hz. For example, taking Fb as 700 Hz as an example, see Fig.17 As shown, 0.4Fb is equal to 280Hz, that is, in the low frequency range of <280Hz, the deflection angle of the phase of the sound wave by the phase adjustment member 223 is 0° to 90°, which can be understood as the phase of the sound wave before adjustment by the phase adjustment member 223 and the phase of the sound wave after adjustment by the phase adjustment member 223 are in phase. In other words, in the frequency range of the operating frequency <0.4Fb, the phase adjustment member 223 will not have a reversing effect on the phase of the sound wave radiated to the inside of the housing 210, and the phase of the sound wave radiated from the sound cavity 2221 to the inside of the housing 210 is the same as the phase of the sound wave in the sound cavity 2221. That is, within the low-frequency range, the phase of the sound wave radiated from the sound module 220 to the outside of the housing 210 is opposite to the phase of the sound wave radiated to the inside of the housing 210 after adjustment by the phase adjustment component 223, and the two sound waves with opposite phases are isolated from each other by the housing 210, which can effectively avoid the problem of acoustic short circuit in the sound module 220 at low frequency, and can effectively reduce or avoid the low-frequency sound pressure level of the electronic device 200 affected by the acoustic short circuit, thereby effectively improving the low-frequency performance of the electronic device 200.

[0240] Fig.18 for Fig.16 Magnified view of area E in the middle.

[0241] In one possible implementation, see Fig.18As shown, the phase adjustment member 223 may include a second diaphragm 2231, and the end of the housing 222 opposite to the first diaphragm 221 may have an opening, and the second diaphragm 2231 may be located at the opening and flexibly connected to the inner wall of the opening. When the working frequency of the sound module is in the low frequency range of <0.4Fb, when the sound waves generated in the sound cavity 2221 during the vibration of the first diaphragm 221 are transmitted to the second diaphragm 2231, the second diaphragm 2231 may be driven to vibrate, and during the vibration of the second diaphragm 2231, the air inside the housing 210 may be driven to vibrate, thereby generating sound waves, and the phase of the sound waves inside the housing 210 is the same as the phase of the sound waves in the sound cavity 2221. At this time, the phase adjustment element 223 will not have a reversing effect on the sound waves in the sound cavity 2221. The phase of the sound waves radiated to the inside of the shell 210 after adjustment by the second diaphragm 2231 is opposite to the phase of the sound waves radiated to the outside of the shell 210 by the first diaphragm 221, and the two sound waves with opposite phases are isolated by the shell 210, which can effectively prevent the two sound waves from canceling each other and causing an acoustic short circuit, thereby effectively improving the low-frequency performance of the electronic device 200.

[0242] In the embodiment of the present application, the second diaphragm 2231 may satisfy the following formula:

[0243]

[0244] Wherein, Mr is the mass of the second diaphragm 2231, Cb is the equivalent compliance of the air in the acoustic cavity 2221, and Cb can satisfy the following formula:

[0245]

[0246] Wherein, Vb is the volume of the acoustic cavity 2221, ρ is the air density, and the value of ρ can be 1.29 kg / m 3 , C is the air sound speed, the value of C can be 340m / s, and Sr is the vibration area of ​​the second diaphragm 2231.

[0247] It can be concluded from the above formula that when the phase adjustment member 223 is the second diaphragm 2231, the resonant frequency Fb of the resonator formed by the phase adjustment member 223 and the acoustic cavity 2221 is related to the mass of the second diaphragm 2231, the volume of the acoustic cavity 2221, and the vibration area of ​​the second diaphragm 2231. Therefore, in the specific design process, the resonant frequency Fb of the resonator can be adjusted by adjusting the mass of the second diaphragm 2231, the volume of the acoustic cavity 2221, and the vibration area of ​​the second diaphragm 2231, so that the resonator can meet the resonance requirements of different frequencies, and the phase adjustment member 223 can adjust the phase of the sound waves of different frequency bands in the same phase, so that the phase of the sound wave generated by the phase adjustment member 223 inside the housing 210 is opposite to the phase of the sound wave outside the housing 210, and the two sound waves with opposite phases can be isolated by the housing 210 to prevent acoustic short circuit, thereby effectively improving the sound pressure level of the sound module 220 in the corresponding low-frequency band.

[0248] For example, in the embodiment of the present application, the mass Mr of the second diaphragm 2231 can range from 0.05g to 1g. For example, the mass Mr of the second diaphragm 2231 can be 0.05g, 5g, or 1g. When the volume Vb of the sound cavity 2221 and the vibration area Sr of the second diaphragm 2231 in the above formula remain unchanged, the operating frequency of the sound module 220 can be made less than 0.4Fb by adjusting the mass Mr of the second diaphragm 2231. In the low-frequency band of less than 0.4Fb, the second diaphragm 2231 can have no inverting effect on the phase of the sound waves in the sound cavity 2221, so that the phase of the sound waves radiated to the inside of the shell 210 remains in phase with the phase of the sound waves in the sound cavity 2221, and the phase of the sound waves generated by the sound module 220 outside the shell 210 is opposite to the phase of the sound waves generated by the phase adjustment component 223 inside the shell 210, and the two sound waves with opposite phases can be isolated by the shell 210, thereby effectively avoiding acoustic short circuits and improving the low-frequency diving performance of the electronic device 200.

[0249] Continue to see Fig.18As shown, the phase adjustment member 223 may also include a folded ring 2232, and one end of the second diaphragm 2231 may be flexibly connected to the inner wall of the opening through the folded ring 2232. The folded ring 2232 has a certain flexibility, and during the vibration of the second diaphragm 2231, the force between the second diaphragm 2231 and the shell 222 may be reduced, and the force between the shell 222 and the second diaphragm 2231 may be reduced or avoided to have an adverse effect on the vibration of the second diaphragm 2231. Moreover, the folded ring 2232 may also isolate the air inside the housing 210 inside the sound cavity 2221 to prevent acoustic short circuit. Moreover, the folded ring 2232 may also provide a certain support for the second diaphragm 2231 to reduce or avoid the shaking of the second diaphragm 2231 during the vibration process, which is conducive to improving the stability of the vibration of the second diaphragm.

[0250] Fig.19 A schematic diagram of the structure of another phase adjustment component provided in an embodiment of the present application.

[0251] In another possible implementation, as shown in the figure, the phase adjustment member 223 may include an inverted tube 2233, one end of which may be connected to the housing 222 and communicated with the sound cavity 2221, and the other end of which may be communicated with the interior of the housing 210. In the low-frequency range where the working frequency of the sound module is less than 0.4Fb, when the sound waves generated in the sound cavity 2221 during the vibration of the first diaphragm 221 are transmitted to the inverted tube 2233, the sound waves may maintain the same phase in the inverted tube 2233 and be radiated to the interior of the housing 210 through the inverted tube 2233, so that the phase of the sound waves radiated from the phase adjustment member 223 to the interior of the housing 210 is the same as the phase of the sound waves in the sound cavity 2221, and the phase of the sound waves radiated from the inverted tube 2233 to the interior of the housing 210 is opposite to the phase of the sound waves radiated from the first diaphragm 221 to the exterior of the housing 210. For example, the air pressure in the sound cavity 2221 can be transmitted to the air inside the housing 210 through the inverted tube 2233, that is, at this time, the elastic constraint force of the air in the sound cavity 2221 on the first diaphragm 221 becomes smaller, so that the front of the first diaphragm 221 can emit a sound wave with a lower frequency response. When the sound module is in the low-frequency working band, the two sound waves with opposite phases can effectively avoid the sound module 220 from being acoustically short-circuited after being isolated by the housing 210, thereby effectively improving the low-frequency performance of the electronic device 200.

[0252] In the embodiment of the present application, the inverter tube 2233 can satisfy the following formula:

[0253]

[0254] Among them, Mp is the mass of the air in the inverted tube 2233, and Cb is the equivalent compliance of the air in the sound cavity 2221.

[0255] Mp can satisfy the following formula:

[0256] Mp=ρ(LSp)

[0257] Cb can satisfy the following formula:

[0258]

[0259] Where ρ is the air density, and the value of ρ can be 1.29kg / m 3 , L is the length of the bass reflex tube 2233, Sp is the cross-sectional area of ​​the bass reflex tube 2233, Vb is the volume of the sound cavity 2221, and C is the air sound velocity, which may be 340 m / s.

[0260] It can be concluded from the above formula that: when the phase adjustment element 223 is an inverted tube 2233, the resonant frequency Fb of the resonator formed by the phase adjustment element 223 and the acoustic cavity 2221 is related to the length of the inverted tube 2233, the volume of the acoustic cavity 2221, and the cross-sectional area of ​​the inverted tube 2233. Therefore, in the specific design process, the resonant frequency Fb of the resonator can be adjusted by adjusting the length and cross-sectional area of ​​the inverted tube 2233 and the volume of the acoustic cavity 2221, so that the resonator can meet the resonance requirements of different frequencies, and the phase adjustment element 223 can adjust the phase of sound waves in different frequency bands, thereby improving the performance of the electronic device 200 in different low-frequency bands.

[0261] For example, in the embodiment of the present application, the length L of the inverted tube 2233 may range from 5 mm to 50 mm, for example, the length L of the inverted tube 2233 may be 5 mm, 10 mm, or 50 mm. In the above formula, when the volume Vb of the sound cavity 2221 and the cross-sectional area Sp of the inverted tube 2233 remain unchanged, the operating frequency of the sound module 220 may be adjusted to be less than 0.4Fb by adjusting the length L of the inverted tube 2233. In the low-frequency band of less than 0.4Fb, the inverted tube 2233 may not have an inverting effect on the phase of the sound waves in the sound cavity 2221, so that the phase of the sound waves radiated to the inside of the housing 210 is kept in phase with the phase of the sound waves in the sound cavity 2221, thereby making the phase of the sound waves of the sound module 220 outside the housing 210 opposite to the phase of the sound waves radiated to the inside of the housing 210 by the phase adjustment member 223. The two sound waves with opposite phases can be isolated by the housing 210 , thereby effectively avoiding acoustic short circuit of the sound module 220 and effectively improving the low-frequency diving performance of the electronic device 200 .

[0262] It is understandable that, in addition to adjusting the length L of the inverted tube 2233, the cross-sectional area Sp of the inverted tube 2233 can also be adjusted to make the operating frequency of the sound module 220 less than 0.4Fb. For example, the cross-sectional area Sp of the inverted tube 2233 can range from 0.3mm2 ~3mm 2 For example, the cross-sectional area Sp of the inverted tube 2233 may be 0.3 mm 2 , 0.1mm 2 , 2mm 2 , 3mm 2 Etc., when the length L of the inverted tube 2233 and the volume Vb of the sound cavity 2221 in the above formula remain unchanged, the operating frequency of the sound module 220 can also be made less than 0.4Fb by adjusting the cross-sectional area Sp of the inverted tube 2233. In the low-frequency band of less than 0.4Fb, the inverted tube 2233 can prevent the phase of the sound wave in the sound cavity 2221 from being reversed, so that the phase of the sound wave radiated to the inside of the housing 210 is kept in phase with the phase of the sound wave in the sound cavity 2221, and the two sound waves with opposite phases can be isolated by the housing 210, thereby effectively avoiding the occurrence of an acoustic short circuit in the sound module 220 and effectively improving the low-frequency diving performance of the electronic device 200.

[0263] Alternatively, the volume Vb of the sound cavity 2221 may be adjusted so that the operating frequency of the sound module 220 is less than 0.4Fb. For example, the volume Vb of the sound cavity 2221 may range from 0.2 cm 3 ~2cm 3 For example, the volume Vb of the acoustic cavity 2221 may be 0.2 cm 3 、0.5cm 3 , 1cm 3 , 2cm 3 Etc. In the above formula, when the length L of the inverted tube 2233 and the cross-sectional area Sp of the inverted tube 2233 remain unchanged, the resonant frequency Fb of the resonator can also be adjusted by adjusting the volume of the sound cavity 2221, so that the working frequency of the sound module 220 is <0.4Fb. In this way, in the low-frequency band of <0.4Fb, the inverted tube 2233 does not reverse the phase of the sound wave in the sound cavity 2221, so that the phase of the sound wave radiated to the inside of the housing 210 is kept in phase with the phase of the sound wave in the sound cavity 2221, and the two sound waves with opposite phases can be isolated by the housing 210, thereby effectively avoiding the occurrence of acoustic short circuit in the sound module 220, so as to improve the low-frequency performance of the electronic device 200.

[0264] The housing 210 may be provided with a sound outlet 215, and the first diaphragm 221 may communicate with the outside of the housing 210 through the sound outlet 215. For example, the sound outlet 215 may be provided on the side wall 213 of the electronic device 200. For example, if the electronic device 200 is a mobile phone, the sound outlet 115 may be the lower sound outlet 115 of the electronic device 200, that is, the speaker of the electronic device 200.

[0265] Fig. 20 for Fig.19 Magnified view of area F in the middle.

[0266] See also Fig. 20 As shown, the sound module 220 may include a magnetic circuit assembly 224, a vibration assembly 225 and a bracket 226, and the outer edge of the first diaphragm 221 may be connected to one end of the bracket 226 through a first suspension 227. The vibration assembly 225 may include a voice coil 2251 and a voice coil frame 2252, one end of the voice coil frame 2252 may be connected to the first diaphragm 221, and the voice coil 2251 may be sleeved on the other end of the voice coil frame 2252. In addition, at least part of the voice coil 2251 and the voice coil frame 2252 may be located in the magnetic field of the magnetic circuit assembly 224. For example, at least part of the voice coil 2251 and the voice coil frame 2252 may be located in the magnetic gap of the magnetic circuit assembly 224. The bracket 226 may be connected to the housing 210 of the electronic device 200, so that the sound module 220 can be fixed in the housing 210 through the bracket 226.

[0267] The side of the first diaphragm 221 facing away from the voice coil frame 2252 can be a sound-emitting surface, and the sound-emitting surface can be connected to the outside of the housing 210 through the sound outlet 215. When an AC audio current signal is input to the voice coil 2251, the voice coil 2251 after being energized can be subjected to a magnetic field force in the magnetic field of the magnetic circuit assembly 224. Moreover, the magnitude and direction of the magnetic field force will change at any time with the magnitude and direction of the current, so that the voice coil 2251 and the voice coil frame 2252 can reciprocate. During the reciprocating motion of the voice coil 2251 and the voice coil frame 2252, the first diaphragm 221 can be driven to reciprocate together, so that the first diaphragm 221 can drive the surrounding air to vibrate and emit sound (i.e., sound waves). Among them, the sound generated by the side of the first diaphragm 221 that is connected to the housing 210 can be radiated to the outside of the housing 210 through the sound outlet 215 for the user to listen. The sound generated by the side of the first diaphragm 221 facing the voice coil frame 2252 can be radiated into the sound cavity 2221 and radiated into the interior of the housing 210 after being adjusted by the phase adjustment member 223 .

[0268] Continue to see Fig. 20As shown, the magnetic circuit assembly 224 may include a magnetic steel 2241, a magnetic conductive sheet 2242 and a U iron 2243, the magnetic steel 2241 and the magnetic conductive sheet 2242 may be stacked on the bottom wall of the U iron 2243, and at least part of the voice coil 2251 and the voice coil skeleton 2252 may be located between the magnetic conductive sheet 2242 and the inner side wall 213 of the U iron 2243. The magnetic steel 2241 may be a permanent magnet having a magnetic field, and a magnetic gap may be formed between the magnetic conductive sheet 2242 and the inner side wall 213 of the U iron 2243, so that the voice coil 2251 may be subjected to a magnetic field force in the gap, thereby reciprocating under the action of the magnetic field force. The magnetic conductive sheet 2242 may play a role in magnetic conductivity, so as to enhance the magnetic field strength of the first magnetic circuit assembly 224.

[0269] In conjunction with the accompanying drawings, the low-frequency performance of the sound module 220 of the electronic device 200 provided in the embodiment of the present application is tested below.

[0270] Fig.21 A comparison chart of frequency response curves of the sound module provided in the embodiment of the present application and the sound module with a closed rear cavity in the related art. Fig. 22 A comparison chart of the frequency response curves of the sound module provided in the embodiment of the present application radiating to the outside of the housing and the sound module of the closed rear cavity in the related art radiating to the outside of the housing.

[0271] See also Fig.21 As shown, in this test, taking the resonant frequency Fb of the resonator as 700 Hz as an example, curve 1 in the figure is the frequency response curve of the sound wave radiated from the sound module 220 in the electronic device 200 provided in the embodiment of the present application to the outside of the housing 210. Curve 2 is the frequency response curve of the sound wave radiated from the phase adjustment member 223 to the inside of the housing 210. Curve 3 is the frequency response curve of the sound wave radiated from the rear cavity closed sound module 220 to the outside of the housing 210 in the related art. Fig. 22 For easy observation, Fig. 22 Only curves 1 and 3 are shown. Fig.21 and Fig. 22 It can be seen that within the frequency range of <280Hz (i.e. <0.4Fb), the ordinate value of curve 3 is greater than the ordinate value of curve 3. It can be seen that the sound pressure level of the sound waves radiated from the sound module 220 provided in the embodiment of the present application to the outside of the housing 210 is higher than the sound pressure level of the sound waves radiated from the rear cavity closed sound module 220 to the outside of the housing 210 in the related technology. Therefore, the sound module 220 of the electronic device 200 provided in the embodiment of the present application has better low-frequency performance.

[0272] In the description of the embodiments of the present application, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, or it can be indirectly connected through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. The directional terms mentioned in the embodiments of the present application, such as "upper", "lower", "left", "right", "inside", "outside", etc., are only referenced to the directions of the accompanying drawings. Therefore, the directional terms used are for better and clearer explanation and understanding of the embodiments of the present application, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the embodiments of the present application. "Multiple" means at least two. For those of ordinary skill in the art, the specific meanings of the above terms in the embodiments of the present application can be understood according to the specific circumstances. The terms "first", "second", "third", "fourth", etc. (if any) are used to distinguish similar objects, and do not have to be used to describe a specific order or sequence.

[0273] In the embodiments of the present application, "and / or" is only a description of the association relationship of the associated objects, indicating that there can be three relationships. For example, A and / or B can represent: A exists alone, A and B exist at the same time, and B exists alone. In addition, the character " / " in this article generally indicates that the associated objects before and after are in an "or" relationship.

[0274] References to "one embodiment" or "some embodiments" etc. described in this specification mean that a particular feature, structure or characteristic described in conjunction with the embodiment is included in one or more embodiments of the present application. Thus, the phrases "in one embodiment", "in some embodiments", "in some other embodiments", "in some other embodiments", etc. that appear at different places in this specification do not necessarily refer to the same embodiment, but mean "one or more but not all embodiments", unless otherwise specifically emphasized in other ways. The terms "including", "comprising", "having" and their variations all mean "including but not limited to", unless otherwise specifically emphasized in other ways.

[0275] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the embodiments of the present application, rather than to limit them. Although the embodiments of the present application have been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or replace some or all of the technical features therein by equivalents. These modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present application.

Claims

1. An electronic device, characterized in that: It comprises a housing and a first sound module and a second sound module located in the housing; The first sound module includes a first diaphragm and a shell arranged around the first diaphragm, one side of the first diaphragm is connected to the outside of the shell, and the other side of the first diaphragm is connected to the inside of the shell, and the shell and the first diaphragm are jointly arranged to form a sound cavity; The second sound module has a second diaphragm, one side of the second diaphragm is in communication with the outside of the housing, and the other side of the second diaphragm is in communication with the inside of the housing; The first sound module further includes a phase adjustment component, and the phase adjustment component is located at an end of the housing opposite to the first diaphragm; The phase adjustment member is used to radiate the sound waves in the sound cavity to the interior of the housing, and to adjust the phase of the sound waves radiated to the interior of the housing to be opposite to the phase of the sound waves in the sound cavity.

2. The electronic device according to claim 1, characterized in that: The phase adjustment element and the acoustic cavity form a resonator, the resonant frequency of the resonator is Fb, and the phase of the sound wave radiated by the phase adjustment element within the frequency range of 0.4Fb to 1.5Fb is reversed.

3. The electronic device according to claim 1 or 2, characterized in that: The phase adjustment member includes a third diaphragm. An end of the housing opposite to the first diaphragm has an opening. The third diaphragm is located in the opening and is flexibly connected to the inner wall of the opening.

4. The electronic device according to claim 3, characterized in that: The third diaphragm satisfies the following formula: Wherein, Mr is the mass of the third diaphragm, and Cb is the equivalent compliance of the air in the acoustic cavity; The Cb satisfies the following formula: Wherein, Vb is the volume of the acoustic cavity, ρ is the air density, C is the air sound speed, and Sr is the vibration area of ​​the third diaphragm.

5. The electronic device according to claim 3 or 4, characterized in that: The mass of the third diaphragm is 0.05 g to 1 g.

6. The electronic device according to any one of claims 3 to 5, characterized in that: The phase adjustment member further includes a folding ring, and the third diaphragm is flexibly connected to the inner wall of the opening via the folding ring.

7. The electronic device according to claim 1 or 2, characterized in that: The phase adjustment member comprises an inverted tube, one end of which is connected to the shell and communicated with the sound cavity, and the other end of which is communicated with the interior of the shell.

8. The electronic device according to claim 7, characterized in that: The inverter tube satisfies the following formula: Wherein, Mp is the mass of the air in the inverted tube, and Cb is the equivalent compliance of the air in the acoustic cavity; The Mp satisfies the following formula: Mp=ρ(LSp) The Cb satisfies the following formula: Wherein, ρ is the air density, L is the length of the bass reflex tube, Vb is the volume of the sound cavity, C is the air sound velocity, and Sp is the cross-sectional area of ​​the bass reflex tube.

9. The electronic device according to claim 7 or 8, characterized in that: The length of the inverted tube is 5 mm to 50 mm.

10. The electronic device according to any one of claims 7 to 9, characterized in that: The cross-sectional area of ​​the inverted tube is 0.3 mm 2 ~3mm 2 .

11. The electronic device according to any one of claims 1 to 10, characterized in that: The volume of the acoustic cavity is 0.2 cm 3 ~2cm 3 .

12. The electronic device according to any one of claims 1 to 11, characterized in that: The housing is provided with two groups of sound outlets, and the first diaphragm is communicated with the outside of the housing through one of the two groups of sound outlets; The second diaphragm communicates with the outside of the housing through another sound outlet of the two groups of sound outlets.

13. The electronic device according to claim 12, characterized in that: The housing of the electronic device comprises a back cover, a side wall surrounding the back cover, and a display screen covering the side wall; One of the two groups of sound outlets is opened between the display screen and the side wall, the other of the two groups of sound outlets is opened on the side wall, and the two groups of sound outlets are respectively located at two opposite ends of the display screen.

14. The electronic device according to any one of claims 1 to 11, characterized in that: The shell is provided with a group of sound outlets, and the first diaphragm and the second diaphragm are both connected to the outside of the shell through the group of sound outlets.

15. The electronic device according to claim 14, characterized in that: The housing of the electronic device comprises a back cover, a side wall surrounding the back cover, and a display screen covering the side wall; The group of sound outlets is opened on the side wall, and the shell further has a front cavity inside, which is communicated with the group of sound outlets, and the first diaphragm and the second diaphragm are communicated with the sound outlets through the front cavity.

16. The electronic device according to any one of claims 12 to 15, characterized in that: The first sound module also includes a first magnetic circuit component, a first vibration component and a first bracket; The first bracket is connected to the housing, and the outer edge of the first diaphragm is connected to one end of the first bracket through a first hanging edge; The first vibration component includes a first voice coil and a first voice coil frame, one end of the first voice coil frame is connected to the first diaphragm, the first voice coil is arranged on the other end of the first voice coil frame, and at least part of the first voice coil and the first voice coil frame are located in the magnetic field of the first magnetic circuit component.

17. The electronic device according to claim 16, characterized in that: The first magnetic circuit component includes a first magnetic steel, a first magnetic conductive sheet and a first U iron; The first magnetic steel and the first magnetic conductive sheet are stacked on the bottom wall of the first U-iron, and at least part of the first voice coil and the first voice coil frame are located between the first magnetic conductive sheet and the inner side wall of the first U-iron.

18. The electronic device according to any one of claims 12 to 17, characterized in that: The second sound module further includes a second magnetic circuit component, a second vibration component and a second bracket; The second bracket is connected to the housing, and the outer edge of the second diaphragm is connected to one end of the second bracket via a second hanging edge; The second vibration component includes a second voice coil and a second voice coil frame, one end of the second voice coil frame is connected to the second diaphragm, the second voice coil is sleeved on the other end of the second voice coil frame, and at least part of the second voice coil and the second voice coil frame are located in the magnetic field of the second magnetic circuit component; The second bracket and the second magnetic circuit assembly are exposed inside the shell, so that the inside of the shell serves as the back cavity of the second sound module.

19. The electronic device according to claim 18, characterized in that: The second magnetic circuit assembly includes a second magnetic steel, a second magnetic conductive sheet and a second U iron; The second magnetic steel and the second magnetic conductive sheet are stacked on the bottom wall of the second U iron, and at least part of the second voice coil and the second voice coil frame are located between the second magnetic conductive sheet and the inner side wall of the second U iron.

20. The electronic device according to claim 14 or 15, characterized in that: The first sound module and the second sound module are arranged opposite to each other, and the front surface of the first diaphragm and the front surface of the second diaphragm are connected to the outside of the housing through the set of sound outlets; The front side of the first diaphragm is the side of the first diaphragm facing away from the magnetic circuit component in the first sound module, and the front side of the second diaphragm is the side of the second diaphragm facing away from the magnetic circuit component in the second sound module.

21. The electronic device according to claim 14 or 15, characterized in that: The first sound module and the second sound module are arranged back to back, and the back of the first diaphragm and the back of the second diaphragm are connected to the outside of the housing through the set of sound outlets; The back side of the first diaphragm is the side of the first diaphragm facing the magnetic circuit component in the first sound module, and the back side of the second diaphragm is the side of the second diaphragm facing the magnetic circuit component in the second sound module.

22. The electronic device according to claim 21, characterized in that: Also includes a magnetic circuit component, the first sound module and the second sound module share the magnetic circuit component; The first sound module includes a first vibration component and a first bracket, and the second sound module includes a second vibration component and a second bracket, and the first bracket and the second bracket are respectively connected to the housing; The outer edge of the first diaphragm is connected to one end of the first bracket via a first hanging edge, and the outer edge of the second diaphragm is connected to one end of the second bracket via a second hanging edge; The first vibration component includes a first voice coil and a first voice coil frame, one end of the first voice coil frame is connected to the first diaphragm, the first voice coil is sleeved on the other end of the first voice coil frame, and at least part of the first voice coil and the first voice coil frame are located in the magnetic field of the magnetic circuit component; The second vibration component includes a second voice coil and a second voice coil frame, one end of the second voice coil frame is connected to the second diaphragm, the second voice coil is sleeved on the other end of the second voice coil frame, and at least part of the second voice coil and the second voice coil frame are located in the magnetic field of the magnetic circuit component; The second vibration component and the first vibration component are respectively located at two opposite ends of the magnetic circuit component.

23. An electronic device, characterized in that: The sound module comprises a housing and a sound module located in the housing, wherein the sound module comprises a first diaphragm and a shell surrounding the first diaphragm, one side of the first diaphragm communicates with the outside of the housing, the other side of the first diaphragm communicates with the inside of the shell, and the shell and the first diaphragm are jointly surrounded to form a sound cavity; The sound module further includes a phase adjustment component, and the phase adjustment component is located at an end of the housing opposite to the first diaphragm; The phase adjustment member is used to radiate the sound waves in the sound cavity to the interior of the housing, and to adjust the phase of the sound waves radiated to the interior of the housing to be the same as the phase of the sound waves in the sound cavity.

24. The electronic device according to claim 23, characterized in that: The phase adjustment element and the acoustic cavity form a resonator, the resonant frequency of the resonator is Fb, and the phases of the sound waves radiated by the phase adjustment element within a frequency range of <0.4Fb are in phase.

25. The electronic device according to claim 23 or 24, characterized in that: The phase adjustment member includes a second diaphragm. An end of the housing opposite to the first diaphragm has an opening. The second diaphragm is located in the opening and flexibly connected to the inner wall of the opening.

26. The electronic device according to claim 25, characterized in that: The second diaphragm satisfies the following formula: Wherein, Mr is the mass of the second diaphragm, and Cb is the equivalent compliance of the air in the acoustic cavity; The Cb satisfies the following formula: Wherein, Vb is the volume of the acoustic cavity, ρ is the air density, C is the air sound velocity, and Sr is the vibration area of ​​the second diaphragm.

27. The electronic device according to claim 25 or 26, characterized in that: The mass of the second diaphragm is 0.05 g to 1 g.

28. The electronic device according to any one of claims 25 to 27, characterized in that: The phase adjustment member further includes a folding ring, and the second diaphragm is flexibly connected to the inner wall of the opening via the folding ring.

29. The electronic device according to claim 23 or 24, characterized in that: The phase adjustment member comprises an inverted tube, one end of which is connected to the shell and communicated with the sound cavity, and the other end of which is communicated with the interior of the shell.

30. The electronic device according to claim 29, characterized in that The inverter tube satisfies the following formula: Wherein, Mp is the mass of the air in the inverted tube, and Cb is the equivalent compliance of the air in the acoustic cavity; The Mp satisfies the following formula: Mp=ρ(LSp) The Cb satisfies the following formula: Wherein, ρ is the air density, L is the length of the bass reflex tube, Vb is the volume of the sound cavity, C is the air sound velocity, and Sp is the cross-sectional area of ​​the bass reflex tube.

31. The electronic device according to claim 29 or 30, characterized in that: The length of the inverted tube is 5 mm to 50 mm.

32. The electronic device according to any one of claims 29 to 31, characterized in that: The cross-sectional area of ​​the inverted tube is 0.3 mm 2 ~3mm 2 .

33. The electronic device according to any one of claims 23 to 32, characterized in that: The volume of the acoustic cavity is 0.2 cm 3 ~2cm 3 .

34. The electronic device according to any one of claims 23 to 33, characterized in that: The shell is provided with a sound outlet, and the first diaphragm is communicated with the outside of the shell through the sound outlet.

35. The electronic device according to any one of claims 23 to 34, characterized in that: The sound module also includes a magnetic circuit component, a vibration component and a bracket; The bracket is connected to the housing, and the outer edge of the first diaphragm is connected to one end of the bracket through a first hanging edge; The vibration component includes a voice coil and a voice coil frame, one end of the voice coil frame is connected to the first diaphragm, the voice coil is arranged on the other end of the voice coil frame, and at least part of the voice coil and the voice coil frame are located in the magnetic field of the magnetic circuit component.

36. The electronic device according to claim 35, characterized in that: The magnetic circuit assembly includes magnetic steel, magnetic conductive sheet and U iron; The magnetic steel and the magnetic conductive sheet are stacked on the bottom wall of the U-iron, and the voice coil and the voice coil frame are at least partially located between the magnetic conductive sheet and the inner side wall of the U-iron.

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