Manufacturing method of display panel, display panel and display device

Abstract

The invention relates to a manufacturing method of a display panel, the display panel and a display device. The manufacturing method of the display panel comprises the following steps: providing a circuit substrate bonded with a plurality of light-emitting chips; a lens assembly is provided, the lens assembly comprises a substrate and a plurality of independent lenses arranged on the substrate, concave surfaces are formed on the sides, away from the substrate, of the lenses, and quantum dot materials are arranged on the concave surfaces; lenses on the lens assembly are aligned and bonded towards the light-emitting chips on the circuit substrate, one lens corresponds to one light-emitting chip, and at least two kinds of lenses with different colors made of quantum dot materials are bonded on the circuit substrate; in some implementation processes, the corresponding lenses can be arranged on the light-emitting chips of the circuit substrate in batches, the quantum dot materials are arranged on the light-emitting chips along with the lenses, and the production efficiency is high.

Description

Technical Field

[0001] The present application relates to the field of light emitting technology, and in particular to a method for manufacturing a display panel, a display panel and a display device. Background Art

[0002] Micro LED (Micro Light Emitting Diode) products are composed of micron-scale semiconductor light-emitting unit arrays. They are a comprehensive technology that integrates new display technology and LED (Light Emitting Diode) technology. They have the advantages of self-luminescence, high efficiency, low power consumption, high integration, high stability, and all-weather operation. They are considered to be one of the most promising next-generation new display and light-emitting devices. However, as the size of light-emitting chips such as MicroLED chips (hereinafter referred to as micro light-emitting chips) in display products becomes smaller and smaller, and the number of light-emitting chips is also increasing, the production efficiency of display products is not high enough.

[0003] Therefore, how to improve the production efficiency of display products has become an urgent problem to be solved. Summary of the invention

[0004] In view of the deficiencies of the above-mentioned related technologies, the purpose of the present application is to provide a method for manufacturing a display panel, a display panel and a display device, aiming to solve the problem that the manufacturing efficiency of display products is not high enough as the number of light-emitting chips in the display products increases.

[0005] A display panel, comprising:

[0006] Providing a circuit substrate with multiple light-emitting chips bonded thereto;

[0007] A lens assembly is provided, wherein the lens assembly includes a substrate and a plurality of independent lenses disposed on the substrate, wherein a concave surface is formed on a side of the lens away from the substrate, and a quantum dot material is disposed on the concave surface;

[0008] The lens on the lens assembly is aligned and bonded toward the light-emitting chip on the circuit substrate, one lens corresponds to one light-emitting chip, and at least two lenses with different colors of quantum dot materials are bonded to the circuit substrate.

[0009] In the above-mentioned display panel manufacturing method, a lens assembly is used to set the lens. In some implementation processes, corresponding lenses can be set on the light-emitting chip of the circuit substrate in batches, and the production efficiency is high; and quantum dot material is set on the concave surface of the lens, which can realize the display of multiple colors. The quantum dot material is set on the light-emitting chip together with the lens, avoiding step-by-step production on the circuit substrate and improving assembly efficiency.

[0010] Optionally, the step of providing a lens assembly comprises:

[0011] depositing gallium nitride material on the substrate;

[0012] Etching the gallium nitride material by using a gradient transparent photomask to form a plurality of concave surfaces on a side of the gallium nitride material away from the substrate;

[0013] Disposing a quantum dot material at the concave surface of the gallium nitride material;

[0014] The gallium nitride material between adjacent concave surfaces is etched to form a plurality of independent lenses.

[0015] Gallium nitride material has a high refractive index and a low absorption rate. It can be used to form a lens to improve the light extraction efficiency. It is a semiconductor material with good optical uniformity. Its high temperature resistance further ensures that good optical performance is maintained during operation. In addition, in the production process of micro-light-emitting chip products, the deposition and photolithography processes of gallium nitride materials are relatively mature, and the additional cost required for the production of lens components using gallium nitride materials is not high. In addition, by processing through photolithography to form a lens, a higher processing precision can be obtained, and the size of the lens can be made smaller. In some implementation processes, a lens suitable for the scale of a micro-light-emitting chip can be produced; and the consistency of each lens formed is good, and high-quality lenses can be formed in large quantities and transferred efficiently, thereby improving production efficiency and product quality.

[0016] Optionally, the step of providing a quantum dot material on the concave surface of the gallium nitride material comprises:

[0017] forming a porous structure at the inner concave surface of the gallium nitride material;

[0018] A quantum dot material is injected into the porous structure.

[0019] The reliability of the quantum dot material can be improved by forming a porous structure on the gallium nitride material to arrange the quantum dot material.

[0020] Optionally, the step of providing a lens assembly comprises:

[0021] Providing a first lens assembly having a first quantum dot material on each lens, a second lens assembly having a second quantum dot material on each lens, and a third lens assembly having no quantum dot material on each lens, wherein the first quantum dot material and the second quantum dot material have different colors;

[0022] The step of aligning and bonding the lens on the lens assembly toward the light-emitting chip on the circuit substrate comprises:

[0023] Transferring the lens on the first lens assembly to a position corresponding to the first light-emitting chip;

[0024] Moving the lens on the second lens assembly to a position corresponding to the second light-emitting chip;

[0025] The lens on the third lens assembly is transferred to a position corresponding to the third light-emitting chip.

[0026] When manufacturing each lens component, only one quantum dot material needs to be set, which reduces the difficulty and complexity of manufacturing the lens component, and the quality of the quantum dot material on the formed lens is better.

[0027] Optionally, the step of providing a lens assembly comprises: providing the lens assembly comprising at least three lenses, wherein the first and second quantum dot materials are respectively disposed on the inner concave surfaces of the first lens and the second lens, and the quantum dot material is not disposed on the inner concave surface of the third lens;

[0028] The step of aligning and bonding the lenses on the lens assembly toward the light-emitting chip on the circuit substrate includes: directing the lens assembly toward the light-emitting chip, and bonding each of the lenses in the lens assembly to the circuit substrate simultaneously.

[0029] Various required lenses are manufactured on a single lens assembly and arranged on a circuit substrate at one time, thereby reducing the difficulty and complexity of transferring the lenses to the circuit substrate.

[0030] Based on the same inventive concept, the present application also provides a display panel, including:

[0031] Circuit board;

[0032] A plurality of light-emitting chips bonded to the circuit substrate;

[0033] A plurality of independent lenses arranged corresponding to the light-emitting chip;

[0034] The display panel is manufactured by the above-mentioned method for manufacturing a display panel.

[0035] The display panel has high manufacturing efficiency, and the provided lens can improve the light extraction efficiency of the light emitting chip and enable the display panel to display multiple colors.

[0036] Based on the same inventive concept, the present application also provides a display device, comprising: a frame and the above-mentioned display panel, wherein the display panel is arranged on the frame.

[0037] The above-mentioned display device uses the above-mentioned display panel, and in some implementation processes, the production efficiency is higher, the light extraction efficiency is high, and multiple colors can be displayed. BRIEF DESCRIPTION OF THE DRAWINGS

[0038] Figure 1 A schematic diagram of a process for manufacturing a display panel provided in an embodiment of the present application;

[0039] Figure 2 A schematic diagram of the structure of a lens assembly provided in an embodiment of the present application;

[0040] Figure 3 A schematic diagram of a process for manufacturing a lens assembly provided in an embodiment of the present application;

[0041] Figure 4 Another schematic diagram of the structure of the lens assembly provided in the embodiment of the present application;

[0042] Figure 5 A schematic diagram of a process for setting quantum dot materials provided in an embodiment of the present application;

[0043] Figure 6 A schematic diagram of the process of setting quantum dot materials provided in an embodiment of the present application;

[0044] Figure 7 Another schematic diagram of a process for manufacturing a lens assembly provided in an embodiment of the present application;

[0045] Figure 8 A schematic diagram of a process for manufacturing a lens assembly provided in an embodiment of the present application;

[0046] Fig. 9 Another schematic diagram of a process for setting quantum dot materials provided in an embodiment of the present application;

[0047] Fig.10 A schematic diagram of another process for setting quantum dot materials provided in an embodiment of the present application;

[0048] Fig.11 A schematic diagram of a manufacturing process of an exemplary display panel provided in an embodiment of the present application;

[0049] Fig.12 A schematic diagram of another exemplary display panel manufacturing process provided in an embodiment of the present application;

[0050] Description of reference numerals:

[0051] 1-substrate; 2-lens; 21-gallium nitride material; 3-quantum dot material; 31-first quantum dot material; 32-second quantum dot material; 33-porous structure; 4-circuit substrate; 41-metal wiring pattern; 42-receiving adhesive material; 51-blue light-emitting chip; 6-photoresist. DETAILED DESCRIPTION

[0052] In order to facilitate the understanding of the present application, the present application will be described more fully below with reference to the relevant drawings. The preferred embodiments of the present application are given in the drawings. However, the present application can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the present application more thoroughly and comprehensively understood.

[0053] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art to which this application belongs. The terms used herein in the specification of this application are only for the purpose of describing specific embodiments and are not intended to limit this application.

[0054] The number of light-emitting chips in display products of related technologies is increasing, and the manufacturing efficiency of display products is not high enough.

[0055] Based on this, the present application hopes to provide a solution that can solve the above-mentioned technical problems, the details of which will be described in the subsequent embodiments.

[0056] This embodiment provides a method for manufacturing a display panel. Figure 1 As shown, the steps of the method include but are not limited to:

[0057] S101, providing a circuit substrate bonded with a plurality of light-emitting chips;

[0058] The circuit substrate 4 includes but is not limited to a PCB circuit board, or other materials such as a glass substrate. A light-emitting chip is provided on the circuit substrate 4, and the light-emitting chip can be arranged in an array on the circuit substrate 4. The light-emitting chip can be a micro light-emitting chip. Of course, in practical applications, the light-emitting chip can also be a mini light-emitting chip or other light-emitting chip.

[0059] The light-emitting chips arranged on the circuit substrate 4 can be of the same color or different colors. For example, the light-emitting chips can all be blue light-emitting chips 51. The blue light-emitting chips 51 emit blue light. Through the conversion of the quantum dot material 3, colors including but not limited to red light, green light, etc. can be achieved.

[0060] S102, providing a lens assembly;

[0061] See also Figure 2 As shown, the lens assembly of this embodiment includes a substrate 1 and a plurality of lenses 2 arranged on the substrate 1. The lenses 2 on the substrate 1 are independent of each other, that is, these lenses 2 can be transferred and used individually. The lenses 2 in the lens assembly of this embodiment may not be integrated into one so as to facilitate transfer as needed.

[0062] It is understandable that the size of the lens 2 on the lens assembly corresponds to the light emitting chip. For example, as an example, for a micro light emitting chip, the size of the lens 2 may be no greater than 100um, and may be less than or equal to 50um, or between 50-100um, such as 60um, 70um, etc., which can match the size of the micro light emitting chip.

[0063] A concave surface may be formed on the lens 2, and the concave surface may be an arc surface or other shapes. For example, in some embodiments, it may match the shape of the light-emitting chip. In this embodiment, the lens 2 forms a concave surface, which allows the lens 2 to cooperate with the circuit substrate 4 to form a housing space. In actual use, the housing space can be used to accommodate the light-emitting chip, so that the light-emitting chip is covered by the lens 2. This allows the lens 2 to be manufactured independently of the light-emitting chip and then set on the light-emitting chip after the manufacturing is completed. In some implementation processes, the lens 2 can be set on the same plane as the light-emitting chip to reduce the overall thickness of the display panel. For some lenses 2, a quantum dot material 3 is provided at the concave surface thereof. It can be understood that the quantum dot material 3 can be provided on the concave surface as an independent color conversion layer, or it can be combined with the lens 2 as a whole, for example, embedded in the concave surface.

[0064] S103, aligning and bonding the lens on the lens assembly toward the light-emitting chip on the circuit substrate;

[0065] In this embodiment, one lens 2 corresponds to one light-emitting chip, and at least two lenses 2 of different colors of quantum dot materials 3 are bonded to the circuit substrate 4. That is, the lens 2 and the light-emitting chip are in a one-to-one correspondence, but it should be noted that the lenses 2 provided on the light-emitting chip in this embodiment are not all the same, and include at least two lenses 2, and these two lenses 2 are provided with quantum dot materials 3 of different colors. It should be understood that the quantum dot material 3 is used to convert the light of the light-emitting chip into other colors. The color of the quantum dot material 3 referred to in this application refers to the color after the quantum dot material 3 converts the light, and does not limit the color of the material itself. In addition, in some implementation processes, a lens 2 that does not include the quantum dot material 3 is also provided on the circuit substrate 4, which allows the light-emitting chip there to emit light in its original color. As an example, the display panel of this embodiment can be configured for full-color display, for example, using a blue light-emitting chip 51, and providing a lens 2 formed with red quantum dots and green quantum dots, and setting a corresponding lens 2 on the blue light-emitting chip 51 to produce red and green light. Some blue light-emitting chips 51 are not provided with corresponding lenses 2 or lenses 2 without quantum dot materials 3 are provided, thereby forming a full-color display of the three primary colors.

[0066] In addition, the lens 2 disposed on the circuit substrate 4 may be from the same lens assembly, for example, different lenses 2 are disposed in the same lens assembly, and the different lenses 2 are respectively provided with quantum dot materials 3 of different colors or are not provided with quantum dot materials 3. More than one lens assembly may also be provided, and different lenses 2 are obtained from different lens assemblies.

[0067] The bonding of the lens 2 and the circuit substrate 4 can be achieved by methods including but not limited to bonding. In order to better bond the lens 2, a receiving adhesive material 42 can be provided on the circuit substrate 4. The receiving adhesive material 42 can be a viscous adhesive material or other viscous material for receiving and fixing the lens 2. In addition, the use of the receiving adhesive material 42 for connection can also ensure the stability of the lens 2 in some implementation processes and provide the accuracy of its setting. In some examples, for example, when the material of the lens 2 is an adhesive material, the lens 2 itself may also be viscous, and then no additional receiving adhesive material 42 may be provided, and the fixation on the circuit substrate 4 is achieved by the viscosity of the lens 2 itself.

[0068] It should be noted that in step S103, the lens assembly can be in contact with the circuit substrate 4, and in some implementation processes, it can be placed above the circuit substrate 4 without contact. When the lens 2 is separated from the lens assembly, the lens 2 can fall onto the circuit substrate 4 to bond with the circuit substrate 4. It should be understood that the lens 2 in the lens assembly is aligned with the light-emitting chip, that is, the lens 2 to be transferred is directly opposite to the light-emitting chip. In practical applications, the lenses 2 transferred at a single time can be all of the lens assembly, or a part of them can be selectively transferred. For example, the arrangement density of the lenses 2 on the lens assembly can be higher than the density of the light-emitting chip, or more than one type of lens 2 needs to be arranged on a single circuit substrate 4. In this case, when transferring, only part of the lenses 2 in the lens assembly needs to be transferred.

[0069] In the display panel manufacturing method of the present embodiment, a lens assembly is used to set the lens 2. In some implementation processes, corresponding lenses 2 can be set on the light-emitting chip of the circuit substrate 4 in batches, and the production efficiency is high. A quantum dot material 3 is set on the concave surface of the lens 2, which can realize the display of multiple colors. The quantum dot material 3 is set on the light-emitting chip together with the lens 2, avoiding step-by-step manufacturing on the circuit substrate 4, thereby improving assembly efficiency.

[0070] In some embodiments, the substrate 1 of the lens assembly can be made of transparent material. The transparent substrate 1 does not affect the light emission of the light emitting chip. The lens assembly can be set on the circuit substrate 4 as a whole without peeling off its substrate 1, making the manufacturing process simpler. In some embodiments, the lens 2 on the lens assembly can be separated from the substrate 1 under predetermined conditions, and the substrate 1 can be separated from the lens 2, leaving only the lens 2 on the circuit substrate 4. The predetermined conditions for separating the lens 2 from the substrate 1 can be heating, light, etc. As an example, a photolytic glue material can be provided between the lens 2 and the substrate 1. When the photolytic glue material is irradiated by the corresponding light, its viscosity is weakened or released, and the lens 2 is thus separated from the substrate 1. In addition, in some examples, the material of the lens 2 itself can also be decomposed under conditions such as light, and separation from the substrate 1 can also be achieved; for example, the gallium nitride material 21 can be decomposed under the irradiation of a laser. If a laser is used to irradiate the interface between the gallium nitride material 21 and the substrate 1, the lens 2 can be separated from the substrate 1. In some implementations, the lens 2 can be selectively separated from the substrate 1 by illumination, so that the lens 2 in the lens assembly can be selectively transferred to the circuit substrate 4, which can adapt to products of different specifications and has high compatibility. In practical applications, the light used for illumination can be laser or ordinary light of a predetermined wavelength, etc., which can be determined according to the material of the photolytic glue or the lens 2 itself. It is understandable that in the implementation of separating the lens 2 by illumination, the substrate 1 of the lens assembly can be made of a light-transmitting material to increase the success rate of separating the lens 2 from the substrate 1.

[0071] The material of the lens 2 includes but is not limited to lens 2 glue and other materials such as gallium nitride that can be made into the lens 2. One material can be used or a mixture of multiple materials can be used. In practical applications, in addition to the main material of the lens 2, other optical materials can also be provided, such as quantum dot material 3 or optical diffusion material, which can be mixed into the glue material and other materials.

[0072] In some embodiments, the material of the lens 2 may be a plastic material, such as Figure 3 As shown, the steps of providing a lens assembly include:

[0073] S201, providing a lens adhesive layer on the substrate;

[0074] The adhesive material used to make the lens 2 can be disposed on the substrate 1 by coating or the like. The adhesive layer disposed on the substrate 1 is referred to as a lens adhesive layer in this embodiment.

[0075] S202, manufacturing the lens adhesive layer into a plurality of independent lenses;

[0076] Among them, each lens 2 forms a concave surface on the side away from the substrate 1. There are many ways to make the lens adhesive layer into the lens 2. In practical applications, as long as the adhesive materials on the substrate 1 can be formed into the shape of the lens 2, it can be used. Exemplarily, the lens adhesive layer can be molded by a mold to form the lens adhesive layer into multiple lenses 2; the lens adhesive layer can also be etched by etching means such as photolithography to etch the lens adhesive layer into a desired shape to form multiple lenses 2.

[0077] S203, disposing a quantum dot material on the inner concave surface of the lens;

[0078] like Figure 4 As shown, for the lenses 2 in the same lens assembly, all the lenses 2 can be provided with the same quantum dot material 3; Figure 2 As shown, different colors of quantum dot materials 3 can also be set for lenses 2 at different positions. The lenses 2 with quantum dot materials 3 at the concave surface can be all lenses 2 in the lens assembly, or can be part of them, that is, in the same lens assembly, some lenses 2 can be provided with quantum dot materials 3, and the other part can not be provided with quantum dot materials 3.

[0079] See also Figure 5 As shown, the step of providing the quantum dot material 3 on the inner concave surface of the lens 2 specifically includes:

[0080] S2031, disposing a first quantum dot material on the inner concave surface of each lens;

[0081] like Figure 6 As shown in (a), the first quantum dot material 31 is disposed on the concave surface of all lenses 2. As an example, in a full-color display product, the light-emitting chip may be a blue light-emitting chip 51, and the first quantum dot material 31 may be a red quantum dot material or a green quantum dot material.

[0082] S2032, removing the first quantum dot material on part of the lens;

[0083] like Figure 6 As shown in (b), the first quantum dot material 31 on a portion of the lens 2 can be selectively removed by methods including but not limited to etching, and the first quantum dot material 31 on a portion of the lens 2 is not removed.

[0084] S2033, disposing a second quantum dot material on the inner concave surface of each lens;

[0085] In this embodiment, the first quantum dot material 31 and the second quantum dot material 32 refer to two quantum dot materials 3 of different colors, that is, the second quantum dot material 32 is a quantum dot material 3 of a different color from the first quantum dot material 31. As an example, in a full-color display product, the light-emitting chip may be a blue light-emitting chip 51, the first quantum dot material 31 may be a green quantum dot material, and the second quantum dot material 32 may be a red quantum dot material. The second quantum dot material 32 may be arranged in the same manner as the first quantum dot material 31, and the second quantum dot material 32 is arranged at the concave surface of each lens 2 in the lens assembly. At this time, the first quantum dot material 31 and the second quantum dot material 32 stacked in sequence exist on a part of the lenses 2 at the same time.

[0086] S2034, removing the second quantum dot material on part of the lens, wherein at least the second quantum dot material on the lens provided with the first quantum dot material is removed;

[0087] like Figure 6 As shown in (c), only the second quantum dot material 32 on some lenses 2 is retained. The second quantum dot material 32 stacked on the first quantum dot material 31 is removed so that the first quantum dot material 31 can function. As an example, in each of the three adjacent lenses 2, the first quantum dot material 31 is provided on the concave surface of one lens 2, the second quantum dot material 32 is provided on the concave surface of one lens 2, and the quantum dot material 3 is not provided on the concave surface of one lens 2; in some full-color display products, a single lens assembly with a variety of different lenses 2 can be fully utilized to achieve full-color display in conjunction with a monochrome light-emitting chip.

[0088] In some embodiments, the lens 2 may be made of gallium nitride material 21. Gallium nitride material 21 has a high refractive index and a low absorptivity. When used to form the lens 2, it can have a good effect of improving light extraction efficiency. It is a semiconductor material with good optical uniformity. Its high temperature resistance further ensures that good optical performance is maintained during operation. In addition, in the production process of micro-light-emitting chip products, the deposition and photolithography processes of gallium nitride material 21 are relatively mature, and the additional cost required when the lens assembly is made of gallium nitride material 21 is not high. Figure 7 As shown, the steps of providing a lens assembly include:

[0089] S301, depositing gallium nitride material on a substrate;

[0090] like Figure 8 As shown in (a), a layer of gallium nitride material 21 is deposited on the substrate 1 to form a gallium nitride layer. The substrate 1 can be a substrate 1 such as a sapphire substrate 1 that is convenient for depositing the gallium nitride material 21.

[0091] S302, etching the gallium nitride material through a gradient transparent photomask to form a plurality of concave surfaces on a side of the gallium nitride material away from the substrate;

[0092] like Figure 8 As shown in (b), at this time, the gallium nitride material 21 is still a whole, and array-arranged pits are formed thereon, that is, an inner concave surface. The photoresist 6 can be selected from photoresists 6 containing more silicon, such as BCB (benzocyclobutene) glue.

[0093] S303, disposing a quantum dot material on the concave surface of the gallium nitride material;

[0094] like Figure 8 As shown in (c), the quantum dot material 3 can be set after the concave surface is formed. Of course, the quantum dot material 3 is also set in the area between the concave surfaces.

[0095] S304, etching the gallium nitride material between adjacent concave surfaces to form a plurality of independent lenses;

[0096] like Figure 8 As shown in (d), the gallium nitride material 21 between the concave surfaces is etched to the bottom, so that the concave surfaces are separated to form independent lenses 2. The photoresist 6 in this step can be selected to have a lower silicon content for better etching. Of course, in some embodiments, the step of setting the quantum dot material 3 can also be performed after this step, that is, in the absence of conflict, the execution order of step S303 can be after S304.

[0097] In this example, the gallium nitride material 21 is processed through a photolithography process to form a lens 2, which can achieve higher processing precision, and the size of the lens 2 can be made smaller. In some implementation processes, a lens 2 suitable for the scale of a micro-light-emitting chip can be produced; and the consistency of each lens 2 formed is good, and high-quality lenses 2 can be formed in large quantities and transferred efficiently, thereby improving production efficiency and product quality.

[0098] The photolithography in this embodiment is divided into two stages, respectively forming a concave surface on the gallium nitride material 21 and dividing each concave surface into independent lenses 2. In addition, using photoresists 6 with different silicon contents in different stages can enable more precise molding and ensure the accuracy of the lenses 2.

[0099] See also Fig. 9 In some embodiments, the step of providing the quantum dot material 3 on the concave surface of the gallium nitride material 21 includes:

[0100] S3011, forming a porous structure at the inner concave surface of the gallium nitride material;

[0101] The porous structure 33 can be formed by corrosion or the like. Fig.10 As shown in (a), the side of the gallium nitride material 21 away from the transparent substrate 1 is corroded to form a porous structure 33. The etching method includes but is not limited to electrochemical etching or other etching methods that can realize the porous structure 33.

[0102] S3012, injecting quantum dot material into the porous structure;

[0103] The quantum dot material 3 can be injected by natural leveling methods such as coating and inkjet printing, or by immersing the lens assembly formed with the porous structure 33 in a quantum dot solution. Fig.10 As shown in (b), in these embodiments, the quantum dot material 3 is not simply arranged on the surface of the lens 2, but micropores can be formed within a certain thickness range on one side of the inner concave surface of the lens 2, and the part of the formed micropores into which the quantum dot material 3 is injected forms a color conversion layer. By forming a porous structure 33 on the gallium nitride material 21 to arrange the quantum dot material 3, the reliability of the quantum dot material 3 can be improved, and the arranged quantum dot material 3 can be arranged together with the lens 2, and the process is simple and efficient.

[0104] In some embodiments, the quantum dot material 3 may be disposed on the inner concave surface of the lens 2 of the gallium nitride material 21 in other ways, such as a similar way to the aforementioned S2031 to S2034.

[0105] As exemplified above, the lens assembly of this embodiment includes, in some implementations, a variety of different lenses 2, such as the aforementioned Figure 2 Example; In some embodiments, the structure of the lens 2 in the same lens assembly is consistent, such as the aforementioned Figure 4 For example, for different lens assemblies, the process of aligning and bonding the lens 2 thereon toward the light-emitting chip on the circuit substrate 4 may be different.

[0106] For a lens assembly that only forms the same type of lenses 2 , at least two different lens assemblies need to be provided, and the lenses 2 therein are respectively bonded to corresponding positions on the circuit substrate 4 .

[0107] In some embodiments, the step of providing a lens assembly includes providing a first lens assembly in which each lens 2 is provided with a first quantum dot material 31, a second lens assembly in which each lens 2 is provided with a second quantum dot material 32, and a third lens assembly in which each lens 2 is not provided with a quantum dot material 3, and the colors of the first quantum dot material 31 and the second quantum dot material 32 are different.

[0108] Accordingly, the step of aligning and bonding the lens 2 on the lens assembly toward the light-emitting chip on the circuit substrate 4 includes:

[0109] Move the lens 2 on the first lens assembly to a position corresponding to the first light-emitting chip;

[0110] Move the lens 2 on the second lens assembly to a position corresponding to the second light-emitting chip;

[0111] The lens 2 on the third lens assembly is transferred to a position corresponding to the third light-emitting chip.

[0112] It should be noted that the description of the first light-emitting chip, the second light-emitting chip, and the third light-emitting chip here is only used to distinguish the light-emitting chips that need to be provided with different lenses 2 respectively, and does not represent other restrictions. For example, the first light-emitting chip, the second light-emitting chip, and the third light-emitting chip can all be light-emitting chips of the same type or different colors, and various parameters can be the same or different. In these embodiments, three different lens assemblies are provided. Through multiple transfers, three lenses 2 can be bonded to the circuit substrate 4 correspondingly, and two of the lenses 2 are provided with quantum dot materials 3, so that the circuit substrate 4 can achieve multiple colors of light emission, thereby achieving multiple colors of display. When each lens assembly is manufactured, only one quantum dot material 3 needs to be provided, which reduces the difficulty and complexity of manufacturing the lens assembly, and the quality of the quantum dot material 3 on the formed lens 2 is better.

[0113] For a lens assembly that simultaneously forms a plurality of lenses 2, the layout of these lenses 2 on the lens assembly can be arranged one-to-one with the light-emitting chip. The entire lens assembly can be aligned and bonded to the circuit substrate 4 in a manner that the lens 2 faces the light-emitting chip. A single lens assembly is fully utilized in one production, and the setting of the lens 2 is completed at one time, and the setting efficiency of the lens 2 is high.

[0114] In some embodiments, the step of providing a lens assembly includes: providing a lens assembly including at least three lenses 2, wherein the first lens 2 and the second lens 2 are provided with a first quantum dot material 31 and a second quantum dot material 32 respectively at the inner concave surface, and the inner concave surface of the third lens 2 is not provided with a quantum dot material 3. In such embodiments, the step of aligning and bonding the lens 2 on the lens assembly toward the light-emitting chip on the circuit substrate 4 includes: aligning the lens assembly toward the light-emitting chip, and bonding each lens 2 in the lens assembly to the circuit substrate 4 at the same time. The various lenses 2 required are manufactured on a single lens assembly and set on the circuit substrate 4 at one time, which reduces the difficulty and complexity of transferring the lens 2 to the circuit substrate 4.

[0115] For better understanding, the present embodiment describes the manufacturing process of the display panel with reference to specific examples.

[0116] See also Fig.11In an example provided in this embodiment, the process of manufacturing the display panel includes:

[0117] See also Fig.11 (a), a circuit substrate 4 is provided, and a metal wiring pattern 41 is formed on the circuit substrate 4. The metal wiring pattern 41 can be formed by evaporation, photolithography and other processes, and the present application does not limit this. In this example, a glass substrate can be used as the circuit substrate 4, which can improve the flatness and has an advantage in cost over the substrate 1.

[0118] See also Fig.11 (b), a blue light emitting chip 51 is set on the circuit substrate 4.

[0119] See also Fig.11 (c) A receiving adhesive material 42 is provided, and the receiving adhesive material 42 can cover the blue light-emitting chip 51, or be flush with the surface of the blue light-emitting chip 51 on the side away from the circuit substrate 4. The receiving adhesive material 42 is used to receive and fix the lens 2. A thicker receiving adhesive material 42 can also provide better fixing ability.

[0120] See also Fig.11 (d), providing a lens assembly, wherein the lenses 2 on the lens assembly are circulated in groups of three, namely, a lens 2 without a quantum dot material 3, a lens 2 with a first quantum dot material 31, and a lens 2 with a second quantum dot material 32, wherein the first quantum dot material 31 and the second quantum dot material 32 can be quantum dot material 3 and arranged on the concave surface of the lens 2. The first quantum dot material 31 and the second quantum dot material 32 can be green quantum dot material and red quantum dot material, respectively, to convert blue light into green light and red light, respectively. The lens assembly can be directly placed on the circuit substrate 4 and fixed with the receiving adhesive 42 on the circuit substrate 4. In this example, both sides of the lens 2 are adhered by the receiving adhesive 42, and the fixing force is higher; the lens 2 and the circuit substrate 4 form a accommodating space to accommodate the light-emitting chip, and the concave surface of the lens 2 faces the light-emitting chip and serves as the light-entering surface of the light-emitting chip. The arrangement of the upper lens array of the lens assembly in this example corresponds to the arrangement of the light-emitting chip, and each lens 2 can be transferred to the circuit substrate 4 at one time. The circuit substrate 4 can simultaneously form blue, green and red light-emitting units, and three adjacent light-emitting units can form a pixel.

[0121] See also Fig.11 (e), the substrate 1 is peeled off, and each lens 2 is left on the circuit substrate 4. At this time, the light-emitting module obtained has a higher light extraction efficiency due to the provision of the lens 2, and the provision of the lens 2 and the quantum dot material 3 can be completed by a single transfer, achieving full-color display, and high production efficiency. In some examples, the substrate 1 is made of a transparent material, and the substrate 1 may not be peeled off.

[0122] In this example, the lens 2 is formed on the substrate 1, and the side close to the substrate 1 (that is, the side disposed on the circuit substrate 4 away from the circuit substrate 4) is in a flat shape. A layer of photoresist 6 can be disposed on the side of the lens 2 away from the circuit substrate 4, and the photoresist 6 between the lenses 2 can be separated by exposure. Fig.11 (e), the photoresist 6 can be hard-baked to shrink it into a curved surface, such as a hemispherical shape.

[0123] See also Fig.11 (f), the aforementioned structure can be dry-etched (the selection ratio can be set between 0.9-1.1, such as 0.9, 0.95, 1, 1.05, etc.), and the arc surface shape of the photoresist 6 is copied to the lens 2, so that the surface of the lens 2 away from the circuit substrate 4 is formed into an arc. It can be understood that in other examples, the surface shape of the lens 2 may not be adjusted, or the lens 2 may be formed into other shapes. By setting the surface shape of the lens 2, the light type of the emitted light can be adjusted in some implementation processes.

[0124] See also Fig.12 In another example provided by this embodiment, the process of manufacturing the display panel includes:

[0125] A circuit substrate 4 is provided, and a metal wiring pattern 41 is formed on the circuit substrate 4. The metal wiring pattern 41 can be formed by processes such as evaporation and photolithography, and the present application does not limit this. In this example, a glass substrate can be used as the circuit substrate 4, which can improve the flatness and has an advantage in the cost of the substrate 1. A blue light-emitting chip 51 is set on the circuit substrate 4.

[0126] See also Fig.12 (a), a first lens assembly is provided, wherein the lenses 2 on the lens assembly are not provided with quantum dot materials 3, and in this example, the first lens assembly uses gallium nitride material 21. The first lens assembly can be placed above the circuit substrate 4 but not in contact with the circuit substrate 4, and of course, each lens 2 in the first lens assembly is still aligned with the light-emitting chip.

[0127] See also Fig.12 (b) , part of the lens 2 on the first lens assembly is transferred to the circuit substrate 4. For example, by selective irradiation of the target light, the corresponding lens 2 can be separated from the first lens assembly and dropped onto the circuit substrate 4. In this example, one lens 2 is transferred every two blue light-emitting chips 51.

[0128] See also Fig.12(c) provides a second lens assembly, wherein the lens 2 on the lens assembly is made of gallium nitride material 21, and a porous structure 33 is formed on the inner concave surface of the gallium nitride material 21, wherein the first quantum dot material 31 is filled, and all lenses 2 on the lens assembly are provided with the first quantum dot material 31. In this example, the first quantum dot material 31 can be a green quantum dot material. The second lens assembly can be placed above the circuit substrate 4 but not in contact with the circuit substrate 4. Of course, each lens 2 in the second lens assembly is still aligned with the light-emitting chip.

[0129] See also Fig.12 (d) , part of the lens 2 on the second lens assembly is transferred to the circuit substrate 4. Exemplarily, by selective irradiation of the target light, the corresponding lens 2 can be separated from the second lens assembly and dropped onto the circuit substrate 4. In this example, a lens 2 provided with the second quantum dot material 32 is transferred every two blue light-emitting chips 51.

[0130] Similarly, a third lens assembly is provided, wherein the lens 2 on the lens assembly is made of gallium nitride material 21, and a porous structure 33 is formed on the inner concave surface of the gallium nitride material 21, wherein the second quantum dot material 32 is filled, and all lenses 2 on the lens assembly are filled with the second quantum dot material 32, and the second quantum dot material 32 can be a red quantum dot material. The third lens assembly can be placed above the circuit substrate 4 but not in contact with the circuit substrate 4. Of course, each lens 2 in the third lens assembly is still aligned with the light-emitting chip. See Fig.12 (e), part of the lens 2 on the third lens assembly is transferred to the circuit substrate 4. Exemplarily, by selective irradiation of the target light, the corresponding lens 2 can be separated from the third lens assembly and dropped onto the circuit substrate 4. In this example, a lens 2 provided with a second quantum dot material 32 is transferred for every two blue light-emitting chips 51. At this time, the positions of all blue light-emitting chips 51 on the circuit substrate 4 are transferred with corresponding lenses 2, and every three adjacent blue light-emitting chips 51 and their lenses 2 can provide a full-color display. In each lens assembly in this example, the lenses 2 formed thereon are all the same, and each lens assembly is more efficient and convenient in production. By selectively transferring one by one, a full-color product with different lenses 2 on the circuit substrate 4 can still be produced. It can be understood that the lenses 2 that have not been transferred on each lens assembly can continue to be used in subsequent production processes.

[0131] The size of the micro-light-emitting chip is extremely small, and it needs to be set on the circuit substrate 4 by means of mass transfer. The light-emitting module manufacturing method of this embodiment can use the aforementioned lens assembly to set the lens 2 on the micro-light-emitting chip by means of mass transfer. The process and precision can match the scale of the micro-light-emitting chip, so that the lens 2 is accurately set above the micro-light-emitting chip, thereby improving the light output efficiency of the micro-light-emitting chip.

[0132] This embodiment also provides a display panel, which includes a circuit substrate 4, a plurality of light-emitting chips bonded to the circuit substrate 4, and a plurality of independent lenses 2 arranged corresponding to the light-emitting chips. In addition, the display panel of this embodiment is manufactured by the aforementioned display panel manufacturing method. The display panel of this embodiment has high manufacturing efficiency, and the arranged lenses 2 can improve the light extraction efficiency of the light-emitting chip and enable the display panel to display multiple colors. The display panel can include, but is not limited to, a computer display screen, a TV display screen, a mobile phone display screen, etc.

[0133] This embodiment also provides a display device, including a frame and the above-mentioned display panel, wherein the display panel is disposed on the frame. The display device of this embodiment uses the above-mentioned display panel, and in some implementations, the production efficiency is higher and multiple colors can be displayed. The display device can include but is not limited to electronic devices such as computers, televisions, and mobile phones.

[0134] It should be understood that the application of the present application is not limited to the above examples. For ordinary technicians in this field, improvements or changes can be made based on the above description. All these improvements and changes should fall within the scope of protection of the claims attached to this application.

Claims

1. A method for manufacturing a display panel, characterized in that: The method comprises: Providing a circuit substrate with multiple light-emitting chips bonded thereto; A lens assembly is provided, wherein the lens assembly includes a substrate and a plurality of independent lenses disposed on the substrate, wherein a concave surface is formed on a side of the lens away from the substrate, and a quantum dot material is disposed on the concave surface; The lens on the lens assembly is aligned and bonded toward the light-emitting chip on the circuit substrate, one lens corresponds to one light-emitting chip, and at least two lenses with different colors of quantum dot materials are bonded to the circuit substrate.

2. The method for manufacturing a display panel according to claim 1, wherein: The step of providing a lens assembly comprises: Disposing a lens adhesive layer on the substrate; The lens adhesive layer is manufactured into a plurality of independent lenses, and a side of each lens away from the substrate forms an inner concave surface; A quantum dot material is disposed at the inner concave surface of the lens.

3. The method for manufacturing a display panel according to claim 2, wherein: The step of providing a quantum dot material at the inner concave surface of the lens comprises: Disposing a first quantum dot material at the inner concave surface of each of the lenses; removing a portion of the first quantum dot material on the lens; Disposing a second quantum dot material on the inner concave surface of each of the lenses, wherein the first quantum dot material and the second quantum dot material have different colors; The second quantum dot material on a portion of the lens is removed, wherein at least the second quantum dot material on the lens provided with the first quantum dot material is removed.

4. The method for manufacturing a display panel according to claim 1, wherein: The step of providing a lens assembly comprises: depositing gallium nitride material on the substrate; Etching the gallium nitride material by using a gradient transparent photomask to form a plurality of concave surfaces on a side of the gallium nitride material away from the substrate; Disposing a quantum dot material at the concave surface of the gallium nitride material; The gallium nitride material between adjacent concave surfaces is etched to form a plurality of independent lenses.

5. The method for manufacturing a display panel according to claim 4, wherein: The step of providing a quantum dot material on the concave surface of the gallium nitride material comprises: forming a porous structure at the inner concave surface of the gallium nitride material; A quantum dot material is injected into the porous structure.

6. The method for manufacturing a display panel according to claim 1, wherein: The step of providing a lens assembly comprises: Providing a first lens assembly having a first quantum dot material on each lens, a second lens assembly having a second quantum dot material on each lens, and a third lens assembly having no quantum dot material on each lens, wherein the first quantum dot material and the second quantum dot material have different colors; The step of aligning and bonding the lens on the lens assembly toward the light-emitting chip on the circuit substrate comprises: Transferring the lens on the first lens assembly to a position corresponding to the first light-emitting chip; Moving the lens on the second lens assembly to a position corresponding to the second light-emitting chip; The lens on the third lens assembly is transferred to a position corresponding to the third light-emitting chip.

7. The method for manufacturing a display panel according to claim 1, wherein: The step of providing a lens assembly comprises: providing the lens assembly comprising at least three lenses, wherein the first and second lenses are provided with a first quantum dot material and a second quantum dot material at the inner concave surfaces thereof, respectively, and the inner concave surface of the third lens is not provided with a quantum dot material; The step of aligning and bonding the lenses on the lens assembly toward the light-emitting chip on the circuit substrate includes: directing the lens assembly toward the light-emitting chip, and bonding each of the lenses in the lens assembly to the circuit substrate simultaneously.

8. The method for manufacturing a display panel according to any one of claims 1 to 7, characterized in that: Before aligning and bonding the lens on the lens assembly toward the light-emitting chip on the circuit substrate, the step further includes: A receiving adhesive material is arranged on the circuit substrate, and the receiving adhesive material is used for receiving and fixing the lens.

9. A display panel, characterized in that: include: Circuit board; A plurality of light-emitting chips bonded to the circuit substrate; A plurality of independent lenses arranged corresponding to the light-emitting chip; The display panel is manufactured by the method for manufacturing a display panel according to any one of claims 1 to 8.

10. A display device, characterized in that: The invention comprises a frame body and the display panel according to claim 9, wherein the display panel is arranged on the frame body.

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