Light-emitting substrate and display device

Abstract

The embodiment of the invention provides a light-emitting substrate and a display device, relates to the technical field of display, and is used for improving the yield of connecting leads in the light-emitting substrate. The light-emitting substrate comprises a display area and a peripheral area located on at least one side of the display area. The light-emitting substrate further comprises a substrate, a plurality of connecting leads and auxiliary connecting parts, wherein the connecting leads and the auxiliary connecting parts are located on the substrate. The substrate comprises a first main surface and a second main surface which are opposite in the thickness direction of the substrate, and a side surface located between the first main surface and the second main surface, and the side surface comprises a set side surface corresponding to the peripheral area. The plurality of connecting leads are located on the substrate, and the plurality of connecting leads extend from the first main surface to the second main surface through the set side surface. The plurality of connecting leads are located in the peripheral area. At least one of the plurality of connection leads includes at least one opening. At least part of the auxiliary connecting part is located in the opening, and the auxiliary connecting part is connected with the connecting lead where the opening is located. The display device is used for displaying images.

Description

Technical Field

[0001] The present disclosure relates to the field of display technology, and in particular to a light-emitting substrate and a display device. Background Art

[0002] Light Emitting Diode (LED) chips include Micro Organic Light-Emitting Diode (Micro LED) and Mini Organic Light-Emitting Diode (Mini LED), which can be used to achieve seamless splicing display devices. Mini / Micro LED display devices have the characteristics of high contrast, long life, and low power consumption.

[0003] At present, Mini / Micro LED display devices, from small-size products with high precision to high-end large-screen products, have strong commercial demand and a wide range of application scenarios. Summary of the invention

[0004] An object of the embodiments of the present disclosure is to provide a light-emitting substrate and a display device, which are used to improve the yield rate of connecting leads in the light-emitting substrate.

[0005] To achieve the above objectives, the embodiments of the present disclosure provide the following technical solutions:

[0006] On the one hand, a light-emitting substrate is provided. The light-emitting substrate includes a display area and a peripheral area located on at least one side of the display area; the light-emitting substrate also includes a substrate, and a plurality of connecting leads and auxiliary connecting parts located on the substrate. The substrate includes a first main surface and a second main surface opposite to each other in the thickness direction of the substrate, and a side surface located between the first main surface and the second main surface, and the side surface includes a set side surface corresponding to the peripheral area. A plurality of connecting leads are located on the substrate, and the plurality of connecting leads extend from the first main surface to the second main surface through the set side surface. The plurality of connecting leads are located in the peripheral area. At least one connecting lead among the plurality of connecting leads includes at least one opening. At least part of the auxiliary connecting part is located in the opening, and the auxiliary connecting part connects the connecting lead where the opening is located.

[0007] The above-mentioned light-emitting substrate can be provided with an auxiliary connection part, and at least part of the auxiliary connection part is arranged in the opening, so that the auxiliary connection part can replace the part of the connection lead that has fallen off, so that the connection lead can maintain the circuit conduction normally. Thus, it can be beneficial to improve the yield rate of the connection lead.

[0008] In some embodiments, the auxiliary connection portion is located in the opening, and the auxiliary connection portion abuts against an edge of the connection lead that forms the opening.

[0009] In some embodiments, the auxiliary connection portion includes a main body portion and at least one overlapping portion connected to the main body portion. The main body portion is located in the opening, the overlapping portion is located on a side of the connection lead away from the substrate, and the overlapping portion contacts the side of the connection lead away from the substrate.

[0010] In some embodiments, in a direction from the main body portion to the overlapping portion, a width of the overlapping portion is greater than or equal to 10 μm.

[0011] In some embodiments, the connecting lead includes three line segments connected in sequence, and at least one line segment of the three line segments in the connecting lead includes the at least one opening. The three line segments are respectively a first line segment located on the first main surface, a third line segment located on the set side surface, and a second line segment located on the second main surface. The auxiliary connecting portion is located on the line segment with the opening, and along the extension direction of the line segment with the opening, the length of the auxiliary connecting portion is less than or equal to the length of the line segment with the opening.

[0012] In some embodiments, along the extension direction of the connecting lead having the opening, the length of the auxiliary connecting portion is less than or equal to the length of the connecting lead having the opening.

[0013] In some embodiments, along the width direction of the connecting lead, a ratio of the width of the auxiliary connecting portion located in the opening to the width of the opening is greater than or equal to 50%.

[0014] In some embodiments, the width of the auxiliary connection portion ranges from 50 μm to 100 μm.

[0015] In some embodiments, an orthographic projection of the auxiliary connecting portion on the substrate covers an orthographic projection of the opening on the substrate.

[0016] In some embodiments, an orthographic projection of the auxiliary connecting portion on the substrate covers an orthographic projection of the connecting lead having the opening on the substrate.

[0017] In some embodiments, a plurality of the auxiliary connecting portions are located in the same opening.

[0018] In some embodiments, the light-emitting substrate further comprises a first electrode. The first electrode is located on a side of the first main surface away from the second main surface, the first end of the connecting lead is electrically connected to the first electrode, the first end comprises the opening, and the orthographic projection of the auxiliary connecting portion on the substrate covers the orthographic projection of the first electrode on the substrate.

[0019] In some embodiments, a first distance between a boundary of an orthographic projection of the auxiliary connection portion on the substrate and a boundary of an orthographic projection of the first electrode on the substrate is less than or equal to 5 μm.

[0020] In some embodiments, the square resistance of the auxiliary connection portion is less than or equal to the square resistance of the connection lead.

[0021] In some embodiments, the thickness of the auxiliary connection portion ranges from 5 μm to 20 μm.

[0022] In some embodiments, the material of the auxiliary connection portion includes conductive glue.

[0023] In some embodiments, the connecting leads are metal traces.

[0024] On the other hand, a method for manufacturing a light-emitting substrate is provided. The light-emitting substrate includes a display area and a peripheral area located on at least one side of the display area. The manufacturing method includes: providing a substrate, the substrate including a first main surface and a second main surface opposite to each other in the thickness direction of the substrate, and a side surface located between the first main surface and the second main surface, the side surface including a set side surface corresponding to the peripheral area. A plurality of connecting leads are formed in the peripheral area of ​​the substrate, and the plurality of connecting leads extend from the first main surface through the set side surface to the second main surface. At least one connecting lead among the plurality of connecting leads includes at least one opening. An auxiliary connecting portion is formed on a side of the connecting lead away from the substrate, at least a portion of the auxiliary connecting portion is located in the opening, and the auxiliary connecting portion connects the connecting lead where the opening is located.

[0025] The manufacturing method of the above-mentioned light-emitting substrate has the same structure and beneficial technical effects as the light-emitting substrate provided in some of the above-mentioned embodiments, and will not be repeated here.

[0026] In some embodiments, the forming of a plurality of connecting leads in the peripheral region of the substrate comprises: forming the plurality of connecting leads on the substrate using a sputtering process. The forming of an auxiliary connecting portion on a side of the connecting lead away from the substrate comprises: forming an auxiliary connecting portion on a side of the connecting lead away from the substrate using a three-dimensional printing process, so that at least a portion of the auxiliary connecting portion is located in the opening, and the auxiliary connecting portion is connected to the connecting lead where the opening is located.

[0027] In another aspect, a display device is provided, comprising: a light-emitting substrate as described in any one of the above embodiments.

[0028] The above-mentioned display device has the same structure and beneficial technical effects as the light-emitting substrate provided in some of the above-mentioned embodiments, which will not be described in detail here. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] In order to more clearly illustrate the technical solutions in the present disclosure, the following briefly introduces the drawings required to be used in some embodiments of the present disclosure. Obviously, the drawings described below are only drawings of some embodiments of the present disclosure. For ordinary technicians in this field, other drawings can also be obtained based on these drawings. In addition, the drawings described below can be regarded as schematic diagrams, and are not limitations on the actual size of the product involved in the embodiments of the present disclosure, the actual process of the method, the actual timing of the signal, etc.

[0030] Figure 1 is a structural diagram of a display device according to some embodiments;

[0031] Figure 2 is a structural diagram of a display device according to some other embodiments;

[0032] Figure 3 is a structural diagram of a light emitting surface of a light emitting substrate according to some embodiments;

[0033] Figure 4 is a structural diagram of a backlight surface of a light-emitting substrate according to some embodiments;

[0034] Figure 5 is a cross-sectional view of a light emitting substrate according to some embodiments;

[0035] Figure 6 is a structural diagram of a light-emitting substrate according to some embodiments;

[0036] Figure 7 for Figure 6 A cross-section in the B-B' direction;

[0037] Figure 8 is a structural diagram of a first main surface in a light-emitting substrate according to some embodiments;

[0038] Fig. 9 for Figure 8 A cross-section in the Q-Q' direction;

[0039] Fig.10 A structural diagram of a set side surface in a light emitting substrate according to some embodiments;

[0040] Fig.11 is a cross-sectional view of a light-emitting substrate according to some other embodiments;

[0041] Fig.12 is a structural diagram of a second main surface in a light emitting substrate according to some embodiments;

[0042] Fig.13 for Fig.12 A cross-section along the F-F' direction;

[0043] Fig.14 is a structural diagram of a light-emitting substrate according to some other embodiments;

[0044] Fig.15 is a structural diagram of a light-emitting substrate according to some further embodiments;

[0045] Fig.16 for Fig.15 A cross-section in the T-T' direction;

[0046] Fig.17 is a structural diagram of a light-emitting substrate according to some further embodiments;

[0047] Fig.18 is a structural diagram of a light-emitting substrate according to some further embodiments;

[0048] Fig.19 is a structural diagram of a light-emitting substrate according to some further embodiments;

[0049] Fig. 20 is a cross-sectional view of a light-emitting substrate according to some further embodiments;

[0050] Fig.21 is a cross-sectional view of a light-emitting substrate according to some further embodiments;

[0051] Fig. 22 is a structural diagram of a light-emitting substrate according to some further embodiments;

[0052] Fig.23 is a structural diagram of a light-emitting substrate according to some further embodiments;

[0053] Fig.24 is a structural diagram of a light-emitting substrate according to some further embodiments;

[0054] Fig.25 for Fig.24 A cross-section in the G-G' direction;

[0055] Fig.26 for Fig.24 Another cross-section along the G-G' direction;

[0056] Fig. 27 is a flow chart of a method for manufacturing a light emitting substrate according to some embodiments. DETAILED DESCRIPTION

[0057] The following will be combined with the accompanying drawings to clearly and completely describe the technical solutions in some embodiments of the present disclosure. Obviously, the described embodiments are only part of the embodiments of the present disclosure, rather than all the embodiments. Based on the embodiments provided by the present disclosure, all other embodiments obtained by ordinary technicians in this field belong to the scope of protection of the present disclosure.

[0058] Unless the context requires otherwise, throughout the specification and claims, the term "comprise" and other forms thereof, such as the third person singular form "comprises" and the present participle form "comprising", are to be interpreted as open, inclusive, that is, "including, but not limited to". In the description of the specification, the terms "one embodiment", "some embodiments", "exemplary embodiments", "example", "specific example" or "some examples" and the like are intended to indicate that specific features, structures, materials or characteristics associated with the embodiment or example are included in at least one embodiment or example of the present disclosure. The schematic representation of the above terms does not necessarily refer to the same embodiment or example. In addition, the specific features, structures, materials or characteristics may be included in any one or more embodiments or examples in any appropriate manner.

[0059] In the following, the terms "first" and "second" are used for descriptive purposes only and are not to be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of the embodiments of the present disclosure, unless otherwise specified, "plurality" means two or more.

[0060] When describing some embodiments, the expressions "coupled" and "connected" and their derivatives may be used. The term "connected" should be understood in a broad sense. For example, "connection" can be a fixed connection, a detachable connection, or an integral connection; it can be directly connected or indirectly connected through an intermediate medium. The term "coupled" indicates, for example, that two or more components are in direct physical or electrical contact. The term "coupled" or "communicatively coupled" may also refer to two or more components that are not in direct contact with each other, but still cooperate or interact with each other. The embodiments disclosed herein are not necessarily limited to the contents of this document.

[0061] “At least one of A, B, and C” has the same meaning as “at least one of A, B, or C” and both include the following combinations of A, B, and C: A only, B only, C only, the combination of A and B, the combination of A and C, the combination of B and C, and the combination of A, B, and C.

[0062] “A and / or B” includes the following three combinations: A only, B only, and a combination of A and B.

[0063] As used herein, the term "if" is optionally interpreted to mean "when" or "upon" or "in response to determining" or "in response to detecting," depending on the context. Similarly, the phrases "if it is determined that" or "if [a stated condition or event] is detected" are optionally interpreted to mean "upon determining that" or "in response to determining that" or "upon detecting [a stated condition or event]" or "in response to detecting [a stated condition or event]," depending on the context.

[0064] The use of "adapted to" or "configured to" herein is meant to be open and inclusive language that does not exclude devices adapted or configured to perform additional tasks or steps.

[0065] Additionally, the use of “based on” is meant to be open and inclusive, as a process, step, calculation, or other action “based on” one or more stated conditions or values ​​may, in practice, be based on additional conditions or values ​​beyond those stated.

[0066] As used herein, "about," "substantially," or "approximately" includes the stated value and an average value that is within an acceptable range of variation from the particular value as determined by one of ordinary skill in the art taking into account the measurements in question and the errors associated with the measurement of the particular quantity (i.e., the limitations of the measurement system).

[0067] As used herein, "parallel", "perpendicular", and "equal" include the situations described and situations similar to the situations described, and the range of the similar situations is within the acceptable deviation range, wherein the acceptable deviation range is determined by a person of ordinary skill in the art taking into account the measurement in question and the errors associated with the measurement of a particular quantity (i.e., the limitations of the measurement system). For example, "parallel" includes absolute parallelism and approximate parallelism, wherein the acceptable deviation range of approximate parallelism may be, for example, a deviation within 5°; "perpendicular" includes absolute perpendicularity and approximate perpendicularity, wherein the acceptable deviation range of approximate perpendicularity may also be, for example, a deviation within 5°. "Equal" includes absolute equality and approximate equality, wherein the acceptable deviation range of approximate equality may be, for example, the difference between the two equalities is less than or equal to 5% of either one.

[0068] It will be understood that when a layer or an element is referred to as being on another layer or substrate, it can be directly on the other layer or substrate, or intervening layers may be present between the layer or element and the other layer or substrate.

[0069] Exemplary embodiments are described herein with reference to cross-sectional views and / or plan views that are idealized exemplary drawings. In the drawings, the thickness of the layers and the area of ​​the regions are exaggerated for clarity. Therefore, variations in the shapes relative to the drawings due to, for example, manufacturing techniques and / or tolerances are conceivable. Therefore, the exemplary embodiments should not be interpreted as being limited to the shapes of the regions shown herein, but include shape deviations due to, for example, manufacturing. For example, an etched region shown as a rectangle will typically have curved features. Therefore, the regions shown in the drawings are schematic in nature, and their shapes are not intended to illustrate the actual shapes of the regions of the device, and are not intended to limit the scope of the exemplary embodiments.

[0070] Figure 1 is a structural diagram of a display device according to some embodiments, Figure 2 is a structural diagram of a display device according to some other embodiments.

[0071] Please combine Figure 1 and Figure 2 As shown, some embodiments of the present disclosure provide a display device 200 , which includes a light emitting substrate 100 .

[0072] Exemplarily, the display device 200 may be a liquid crystal display device (LCD), a Mini LED (Mini Light-Emitting Diode, Mini LED for short) display device, and a Micro LED (Micro Light-Emitting Diode, Micro LED for short) display device.

[0073] like Figure 1 As shown, in the case where the display device 200 is a liquid crystal display device, in some embodiments, the display device 200 includes a cover glass, a liquid crystal display panel, and a backlight assembly. The backlight assembly is used to provide a light source for the liquid crystal display panel. Among them, the backlight assembly includes a light-emitting substrate 100, and the light-emitting substrate 100 provides light for the liquid crystal display panel, so that the liquid crystal display panel can display a picture. In some examples, the backlight module in the display device 200 may also include an optical film, which is located on the side of the light-emitting substrate 100 close to the liquid crystal display panel. The optical film may include a reflective sheet, a diffuser, a brightness enhancement film (prism sheet), a diffuser, etc., which can be used to improve the brightness and uniformity of light.

[0074] like Figure 2As shown, when the display device 200 is a Mini LED display device and a Micro LED display device, in some embodiments, the display device 200 includes at least one light-emitting substrate 100, and the light-emitting substrate 100 can realize picture display.

[0075] In some examples, the display device 200 may include a plurality of light emitting substrates 100 , and the plurality of light emitting substrates 100 are spliced ​​together to form the display device 200 . Alternatively, the display device 200 may also include one light emitting substrate 100 .

[0076] In some examples, the display device 200 may further include an anti-reflection film layer and a protective cover plate, wherein the anti-reflection film layer is located between the light-emitting substrate 100 and the protective cover plate. The anti-reflection film layer includes a polarizer, which may be a circular polarizer. Here, the polarizer may reduce external light emission and prevent the light-emitting substrate 100 from reflecting ambient light and thus producing a glare effect.

[0077] Exemplarily, the display device 200 can be any display device that displays images, whether in motion (e.g., video) or fixed (e.g., still images), and whether text or images. More specifically, it is expected that the display device of the embodiments described can be implemented in or associated with a variety of electronic devices, such as (but not limited to) mobile phones, wireless devices, personal data assistants (PDAs), handheld or portable computers, GPS receivers / navigators, cameras, MP4 video players, camcorders, game consoles, watches, clocks, calculators, television monitors, flat panel displays, computer monitors, automotive displays (e.g., odometer displays, etc.), navigators, cockpit controls and / or displays, displays of camera views (e.g., displays of rear-view cameras in vehicles), electronic photographs, electronic billboards or signs, projectors, architectural structures, packaging, and aesthetic structures (e.g., displays of images of a piece of jewelry), etc.

[0078] In some embodiments, the display device 200 also includes a driving circuit board, which is configured to drive an integrated circuit (IC) for driving the light-emitting substrate 100 to display light. The driving circuit board includes, for example, a gate driving circuit, a source driving circuit, a timing controller, and a power supply circuit. The driving circuit board is electrically connected to the light-emitting substrate 100 and is configured to output corresponding signals to control the light-emitting substrate 100 to display light.

[0079] Figure 3 is a structural diagram of a light emitting surface of a light emitting substrate according to some embodiments, Figure 4 is a structural diagram of a backlight surface of a light-emitting substrate according to some embodiments.

[0080] Please combine Figure 3 and Figure 4 As shown, in some embodiments of the present disclosure, a light-emitting substrate 100 is provided, and the light-emitting substrate 100 includes a display area (full name in English: Active Area, referred to as AA area; also referred to as effective display area) AA and a peripheral area SA. The peripheral area SA is located on at least one side of the display area AA (for example, one side; for example, all around, that is, including the upper and lower sides and the left and right sides). The light-emitting substrate 100 also includes a substrate 01 and a plurality of connecting leads L1 located on the substrate 01.

[0081] In some examples, the substrate 01 may be a flexible substrate. Exemplarily, the material of the substrate 01 may be an organic material. For example, the material of the substrate 01 may be any one of polyimide (full name in English: Polyimide, English abbreviation: PI), polycarbonate (full name in English: Polycarbonate, English abbreviation: PC) or polyvinyl chloride (full name in English: Polyvinyl Chloride, English abbreviation: PVC).

[0082] In some other examples, the substrate 01 may be a rigid substrate. For example, the rigid substrate may be a glass substrate or a PMMA (Polymethyl methacrylate) substrate.

[0083] In some examples, the display area AA includes a plurality of light emitting chips 10 , and the plurality of light emitting chips 10 are located on a light emitting surface of the light emitting substrate 100 .

[0084] Exemplarily, the light-emitting chip 10 may be a micro light-emitting diode (Micro Light-Emitting Diode, Micro LED for short) or a mini light-emitting diode (Mini Light-Emitting Diode, Mini LED for short), etc. In this embodiment, the light-emitting chip 10 can emit light, and can be applied to display devices, lighting devices, and the like.

[0085] In the case where the display device 200 is a liquid crystal display device, in some examples, the light-emitting substrate 100 is a backlight source of the display device 200, used to provide a light source for the liquid crystal display device. Each light-emitting chip 10 can be controlled independently; in this way, the display device can achieve local dimming (Local Dimming), achieve a high dynamic range image (High-Dynamic Range, referred to as HDR) effect, and improve the display quality of the display device 200.

[0086] In the case where the display device 200 is a Mini LED display device or a Micro LED display device, in some examples, the light emitting chip 10 (eg, Micro LED, Mini LED, etc.) may emit light to directly display a pattern.

[0087] Exemplarily, the light emitting chip 10 may be a light emitting element capable of emitting light of the same color, such as blue LED, red LED, green LED or yellow LED. Thus, the display device 200 may be a monochrome display device, such as an instrument dial, a signal indicator screen or the like.

[0088] Exemplarily, the light emitting chip 10 may include light emitting elements of multiple different colors, for example, at least two of red LED, green LED, blue LED, yellow LED, etc., and the light emitting units E of different colors may be controlled independently. In this way, the display device 200 may perform color display by mixing light.

[0089] In some examples, the plurality of light emitting chips 10 on the light emitting substrate 100 are arranged in multiple rows and columns. For the convenience of description, the plurality of light emitting chips 10 are described in the present disclosure by arranging them in a matrix form as an example.

[0090] Exemplarily, the plurality of light emitting chips 10 on the light emitting substrate 100 are arranged in an array with equal spacing along the first direction (row direction) X and the second direction (column direction) Y. This arrangement can improve the uniformity of the distribution of the light emitting chips 10 on the light emitting substrate 100 .

[0091] In some examples, the first direction X and the second direction Y may be approximately perpendicular, and the angle between the first direction X and the second direction Y is approximately equal to 90°. For example, the angle between the first direction X and the second direction Y may be 85°, 90°, or 95°.

[0092] A plurality of connecting leads L1 on the light-emitting substrate 100 are located in the peripheral area SA. The light-emitting chip 10 located on the display surface of the light-emitting substrate 100 can be electrically connected to the driving circuit board 210 by using the connecting leads L1. That is, the light-emitting substrate 100 can use the connecting leads L1 to transmit the driving signal provided by the driving circuit board 210 to the light-emitting chip 10 of the light-emitting substrate 100, so as to drive the light-emitting chip 10 to emit light and realize the screen display of the light-emitting substrate 100.

[0093] Exemplarily, the driving circuit board 210 may be electrically connected to the connection lead L1 via a flexible printed circuit (FPC) 220 .

[0094] Figure 5is a cross-sectional view of a light emitting substrate according to some embodiments.

[0095] In some embodiments, please combine Figure 3 to Figure 5 As shown, the substrate 01 in the light emitting substrate 100 includes a first main surface S1 and a second main surface S2 opposite to each other in the thickness direction Z of the substrate 01, and a side surface S3 located between the first main surface S1 and the second main surface S2. The side surface S3 is used to connect the first main surface S1 and the second main surface S2.

[0096] Exemplarily, the substrate 01 includes a plurality of side surfaces S3, and the plurality of side surfaces S3 are used to connect the first main surface S1 and the second main surface S2. For example, the substrate 01 is in the shape of a cuboid, and the shapes of the first main surface S1 and the second main surface S2 of the substrate 01 are, for example, rectangular. In this case, the substrate 01 includes four side surfaces S3.

[0097] The plurality of side surfaces S3 include a set side surface S31 corresponding to the peripheral area SA. It should be noted that the “set side surface S31” refers to the side surface corresponding to the peripheral area SA among the plurality of side surfaces S3 of the substrate 01 .

[0098] In some examples, the driving circuit board 210 may be located on a side of the second main surface S2 away from the first main surface S1, that is, the driving circuit board 210 is located on the backlight surface of the light-emitting substrate 100. Based on this, a plurality of connecting leads L1 may be arranged to extend from the first main surface S1 to the second main surface S2 via the set side surface S31.

[0099] As shown in the above structure, the connecting lead L1 is equivalent to including three line segments located on the first main surface S1, the second main surface S2 and the set side surface S31. The three line segments are respectively located on the first main surface S1. The second line segment L12 is located on the second main surface S2 and the third line segment L13 is located on the set side surface S31. The third line segment L13 is respectively connected to the first line segment L11 and the second line segment L12 to form the connecting lead L1.

[0100] In this way, the driving circuit board can be set on the second main surface S2 of the substrate 01, that is, the binding area of ​​the light-emitting substrate 100 can be set on the second main surface S2 of the substrate 01. The first line segment L11 of the connecting lead L1 is electrically connected to the light-emitting chip 10, and the second line segment L12 is electrically connected to the driving circuit board, so as to realize the electrical connection between the light-emitting chip 10 and the driving circuit board. Based on this, the driving signal provided by the driving circuit board can be transmitted to the light-emitting chip 10 of the light-emitting substrate 100 by using the connecting lead L1, so as to control the light-emitting substrate 100 to display.

[0101] Furthermore, since the driving circuit board is arranged on the second main surface S2 of the substrate 01, when the light-emitting substrate 100 is subjected to the binding process, there is no need to perform a bending binding process at the edge of the light-emitting substrate 100, which is conducive to achieving a narrow frame of the light-emitting substrate 100 and can be widely used in splicing application products.

[0102] In some examples, the thickness direction Z of the substrate 01 is approximately perpendicular to the first direction X. At this time, the angle between the thickness direction Z of the substrate 01 and the first direction X is approximately equal to 90°. For example, the angle between the thickness direction Z of the substrate 01 and the first direction X may be 85°, 90°, or 95°.

[0103] And, the thickness direction Z of the substrate 01 is approximately perpendicular to the second direction Y. At this time, the angle between the thickness direction Z of the substrate 01 and the second direction Y is approximately equal to 90°. For example, the angle between the thickness direction Z of the substrate 01 and the second direction Y can be 85°, 90° or 95°.

[0104] In some examples, the connection lead L1 is a metal wire. Based on this, the metal wire can be used to transmit the driving signal provided by the driving circuit board to the light-emitting substrate 100 to control the light-emitting substrate 100 to display.

[0105] In some examples, the connecting lead L1 may be a laminated metal wire, which can provide the connecting lead with better conductivity and longer service life.

[0106] The stacked metal wiring includes a base layer, a functional layer and a protective layer, and the functional layer is located between the protective layer and the base layer.

[0107] The functional layer in the stacked metal routing can be selected from copper, aluminum, molybdenum, etc. Considering that copper has lower resistance in practical applications, the functional layer can be made of copper.

[0108] The base layer and protection layer in the stacked metal routing can be made of inert metal or other alloy materials, such as titanium, nickel-chromium alloy, etc.

[0109] Exemplarily, the stacked metal wiring may be a Ti / Al / Ti stacked metal wiring, but the embodiments of the present disclosure are not limited thereto.

[0110] In some examples, the thickness of the connecting lead L1 ranges from 0.5 μm to 4 μm.

[0111] When the thickness of the connecting lead L1 is equal to or close to 0.5 μm, the thickness of the connecting lead L1 is relatively thin, which can make the connecting lead L1 fit more closely on the substrate 01, and reduce the risk of the connecting lead L1 being separated from the substrate 01. At the same time, when the thickness of the connecting lead L1 is equal to or close to 0.5 μm, the problem of the connecting lead L1 having a relatively thin thickness causing a relatively large resistance can also be prevented. Furthermore, it can be helpful to reduce the attenuation of the signal transmitted by the resistance of the connecting lead L1, and can be helpful to improve the display quality of the light-emitting substrate 100.

[0112] When the thickness of the connecting lead L1 is equal to or close to 4 μm, the thickness of the connecting lead L1 is relatively thick, and the resistance of the connecting lead L1 can be relatively small. This can help reduce the attenuation of the signal transmitted by the resistance of the connecting lead L1, and can help improve the display quality of the light-emitting substrate 100. At the same time, when the thickness of the connecting lead L1 is equal to or close to 4 μm, it can also prevent the risk of the connecting lead L1 being too thick, which increases the risk of the connecting lead L1 being separated from the substrate 01.

[0113] In some examples, the thickness of the connecting lead L1 ranges from 1 μm to 2 μm.

[0114] When the thickness of the connecting lead L1 is equal to or close to 1 μm, the connecting lead L1 can be made to fit more closely to the substrate 01, thereby reducing the risk of the connecting lead L1 detaching from the substrate 01; it can also prevent the connecting lead L1 from having a large resistance, thereby reducing the attenuation of the signal transmitted by the connecting lead L1 caused by the resistance of the connecting lead L1.

[0115] When the thickness of the connecting lead L1 is equal to or close to 2μm, the resistance of the connecting lead L1 can be smaller, thereby reducing the attenuation of the signal transmitted by the resistance of the connecting lead L1; and the risk of the connecting lead L1 being detached from the substrate 01 due to being too thick can be prevented.

[0116] Exemplarily, the thickness of the connecting lead L1 is about 0.5 μm, 1 μm, 1.5 μm, 2 μm, 2.5 μm, 3 μm, 3.5 μm or 4 μm. However, this is not limited in the embodiments of the present disclosure.

[0117] Taking the thickness of the connection lead L1 as about 1 μm as an example, it can not only improve the problem of the connection lead L1 being separated from the substrate 01, but also improve the attenuation of the signal transmitted by the connection lead L1 caused by the resistance of the connection lead L1.

[0118] It should be noted that due to certain uncontrollable errors (such as manufacturing process errors, equipment accuracy, measurement errors, etc.), when the thickness error of the connecting lead L1 fluctuates within the range of 10%×1μm, it can also be considered that the thickness of the connecting lead L1 satisfies 1μm.

[0119] In addition, in other examples, due to certain uncontrollable errors (such as manufacturing process errors, equipment accuracy, measurement errors, etc.), when the error in the thickness of the connecting lead L1 fluctuates within the range of 5%×1μm, the thickness of the connecting lead L1 can also be considered to be equal to 1μm.

[0120] In some examples, the plurality of connection leads L1 and the plurality of light emitting chips 10 may be coupled one-to-one. In other examples, one connection lead L1 may be coupled to a plurality of light emitting chips 10 , or a plurality of connection leads L1 may be coupled to one light emitting chip 10 .

[0121] In the following, the present disclosure takes the coupling of one connecting lead L1 to a plurality of light-emitting chips 10 as an example to schematically illustrate the structure of the display device 200 .

[0122] Figure 6 is a structural diagram of a light-emitting substrate according to some embodiments, Figure 7 for Figure 6 A cross-sectional view along the B-B' direction. Figure 6 The structure of the first line segment in the connecting lead is shown. The structures of other line segments in the connecting lead are similar to those of the first line segment. The structure of the first line segment can be combined with the introduction, and the structures of other line segments in the connecting lead will also be described in detail below. Figure 6 In order to illustrate the structure of the connecting leads, the substrate underneath is also illustrated simultaneously.

[0123] The inventor has found that Figure 6 and Figure 7 As shown in the figure, after the connection lead L1 on the light-emitting substrate 100 is formed, the disconnection rate of the connection lead L1 is high, which leads to a low yield rate of the connection lead L1. The main reason for the low yield rate of the connection lead L1 is that the existing manufacturing process cannot meet the requirements of the connection lead L1 for environmental cleanliness, which will cause the connection lead L1 to partially fall off to form an opening C. The existence of the opening C affects the yield rate of the connection lead L1.

[0124] For example, the connection lead L1 may fall off in spots, edges, or a large area, and the above-mentioned falling off may cause openings C of different shapes and sizes to appear in the connection lead L1. Regardless of the existence of any type of opening C, the quality of the connection lead L1 is reduced, that is, the yield rate of the connection lead L1 is reduced.

[0125] It should be noted that the opening C on the connecting lead L1 is formed by the natural detachment of part of the connecting lead L1 from the substrate 01, and is not a gap formed by human operation and design. Therefore, the shape of the opening C cannot be guaranteed. The opening C may be a regular shape, such as a circle, a square, a polygon, etc. Alternatively, the opening C may be an irregular shape.

[0126] Figure 8 is a structural diagram of a first main surface in a light emitting substrate according to some embodiments, Fig. 9 for Figure 8 A cross-sectional view along the Q-Q' direction. Figure 8 The structure of the first line segment in a connecting lead is shown. The structures of other line segments in the connecting lead are similar to the first line segment, and the structure of the first line segment can be combined with the introduction, and the structures of other line segments in the connecting lead will also be described in detail below. Figure 8 In order to illustrate the structure of the connecting leads, the substrate underneath is also illustrated simultaneously.

[0127] Based on the above questions, please combine Figure 8 and Fig. 9 As shown, at least one of the multiple connecting leads L1 of the light-emitting substrate 100 provided in the embodiment of the present disclosure includes an opening. The light-emitting substrate 100 also includes an auxiliary connecting portion F1, at least part of the auxiliary connecting portion F1 is disposed in the opening C, and the auxiliary connecting portion F1 is disposed to connect the connecting lead L1 where the opening C is located.

[0128] Based on this, when a connection lead L1 having at least one opening C is found among the multiple connection leads L1 on the light-emitting substrate 100, the auxiliary connection part F1 can be used to repair the opening C formed by the connection lead L1 falling off. That is, the auxiliary connection part F1 can replace the part of the connection lead L1 that has fallen off, so that the connection lead L1 can maintain normal circuit conduction. Therefore, it can be helpful to improve the yield rate of the connection lead L1.

[0129] The above “arranging at least part of the auxiliary connection portion F1 in the opening C” may include the following situations:

[0130] The first method is to place all the auxiliary connection parts F1 in the opening C. In this case, the auxiliary connection parts F1 can be placed in the opening C and fit the connection lead L1 with the opening C, so that the auxiliary connection parts F1 are electrically connected to the connection lead L1.

[0131] The second method is to place part of the auxiliary connection portion F1 in the opening C. In this case, the auxiliary connection portion F1 is placed on a portion of the connection lead L1 having the opening C, so that the auxiliary connection portion F1 is electrically connected to the connection lead L1.

[0132] Regardless of which of the above-mentioned auxiliary connection parts F1 are arranged, the auxiliary connection parts F1 can be used to replace the detached part of the connection lead L1, so that the connection lead L1 can maintain normal circuit conduction, thereby facilitating the improvement of the yield rate of the connection lead L1.

[0133] In summary, the embodiment of the present disclosure provides a light-emitting substrate 100, which can be equipped with an auxiliary connection portion F1, and at least a portion of the auxiliary connection portion F1 is disposed in the opening C, so that the auxiliary connection portion F1 can replace the detached portion of the connection lead L1, so that the connection lead L1 can maintain normal circuit conduction. Therefore, it is beneficial to improve the yield rate of the connection lead L1.

[0134] In some embodiments, the combination Figure 8 and Fig. 9 As shown, a plurality of connecting leads L1 are provided extending from the first main surface S1 through the set side surface S31 to the second main surface S2. That is, the connecting lead L1 includes a first line segment L11 located on the first main surface S1, a third line segment L13 located on the set side surface S31, and a second line segment L12 located on the second main surface S2, which are connected in sequence. Among them, the third line segment L13 is respectively connected to the first line segment L11 and the second line segment L12 to form the connecting lead L1.

[0135] After the connecting lead L1 is formed on the substrate 01, the connecting lead L1 on any surface (the first main surface S1, the set side surface S31, and the second main surface S2) of the substrate 01 may have an opening C. That is, the first line segment L11, the second line segment L12, and the third line segment L13 in the connecting lead L1 may all partially fall off to form at least one opening C.

[0136] That is, the opening C may be located on at least one of the first line segment L11, the second line segment L12 and the third line segment L13. However, the presence of the opening C in any line segment of the connecting lead L1 will affect the yield of the connecting lead L1.

[0137] Based on the above problems, the auxiliary connection part F1 can be set on the line segment with the opening C, so as to use the auxiliary connection part F1 to repair the line segment, thereby ensuring that the connection lead L1 including the line segment maintains normal circuit conduction, so as to improve the yield rate of the connection lead L1. The following will introduce the situation where the opening C is formed in each line segment of the connection lead L1 in conjunction with the relevant drawings.

[0138] In some examples, continue to combine Figure 8 and Fig. 9As shown, the extension direction of the first line segment L11 of the connecting lead L1 located on the first main surface S1 of the substrate 01 can be parallel to the first direction X, one end of the first line segment L11 is electrically connected to the light emitting chip 10, and the other end of the first line segment L11 is electrically connected to the third line segment L13 arranged on the set side surface S31. Among them, the first line segment L11 in at least one connecting lead L1 may include at least one opening C. Among them, "parallel" includes absolute parallelism and approximate parallelism, and the acceptable deviation range of approximate parallelism can be, for example, a deviation within 5°.

[0139] Based on this, the auxiliary connection part F1 can be formed on the first main surface S1, so that the auxiliary connection part F1 is set on the first line segment L11, and at least part of the auxiliary connection part F1 is located in the opening C of the first line segment L11, so that the auxiliary connection part F1 is electrically connected to the first line segment L11 having the opening C. Furthermore, the opening C formed on the first line segment L11 can be repaired by the auxiliary connection part F1, so that the part of the connection lead L1 that has fallen off can be replaced by the auxiliary connection part F1. Thus, the connection lead L1 can maintain normal circuit conduction. Therefore, it can be beneficial to improve the yield rate of the connection lead L1.

[0140] It should be noted that the auxiliary connection part F1 is arranged on the first line segment L11, which can be understood as the auxiliary connection part F1 is arranged at the position of the opening C in the first line segment L11. Exemplarily, after the connection lead L1 is formed, the auxiliary connection part F1 is formed at the position of the opening C. In other words, at least part of the auxiliary connection part F1 is equivalent to being in the opening C, that is, the part of the auxiliary connection part F1 is not formed on the first line segment L11, but is formed on the substrate 01 exposed by the opening C.

[0141] Fig.10 is a structural diagram of a set side surface in a light emitting substrate according to some embodiments, Fig.11 is a cross-sectional view of a light-emitting substrate according to some embodiments. Fig.10 A structural diagram illustrating a plurality of second line segments in the connecting lead, and Fig.11 Can be Fig.10 The cross-sectional view of the light-emitting substrate 100 is shown in FIG. Fig.10 The first connecting lead L1 (third line segment L13) on the left side is taken as an example for illustration.

[0142] In some examples, combine Fig.10 and Fig.11As shown, the extension direction of the third line segment L13 of the connecting lead L1 located on the set side surface S31 of the substrate 01 can be parallel to the thickness direction Z of the substrate 01. The two ends of the third line segment L13 can be electrically connected to the first line segment L11 and the second line segment L12 respectively. The third line segment L13 in at least one connecting lead L1 can include at least one opening C. "Parallel" includes absolute parallelism and approximate parallelism, wherein the acceptable deviation range of approximate parallelism can be, for example, a deviation within 5°.

[0143] Based on this, the auxiliary connection part F1 can be formed on the set side surface S, so that the auxiliary connection part F1 is set on the third line segment L13, and at least part of the auxiliary connection part F1 is located in the opening C of the third line segment L13, so that the auxiliary connection part F1 is electrically connected to the third line segment L13 having the opening C. Furthermore, the opening C formed on the third line segment L13 can be repaired by the auxiliary connection part F1, so that the part of the connection lead L1 that has fallen off can be replaced by the auxiliary connection part F1. Then, the connection lead L1 can maintain normal circuit conduction. Therefore, it can be beneficial to improve the yield rate of the connection lead L1.

[0144] It should be noted that the auxiliary connection part F1 is arranged on the third line segment L13, which can be understood as forming the auxiliary connection part F1 at the position of the opening C after the connection lead L1 is formed. In other words, at least part of the auxiliary connection part F1 is equivalent to being in the opening C, that is, the part of the auxiliary connection part F1 is not formed on the third line segment L13, but is formed on the substrate 01 exposed by the opening C.

[0145] Fig.12 is a structural diagram of the second main surface in the light emitting substrate according to some embodiments, Fig.13 for Fig.12 A cross-sectional view along the F-F' direction.

[0146] In some examples, combine Fig.12 and Fig.13 As shown, the second line segment L12 in the connecting lead L1 has at least one opening C.

[0147] Based on this, the auxiliary connection part F1 can be formed on the second main surface S2, so that the auxiliary connection part F1 is set on the second line segment L12, and at least part of the auxiliary connection part F1 is located in the opening C of the second line segment L12, so that the auxiliary connection part F1 is electrically connected to the second line segment L12 having the opening C. Furthermore, the opening C formed on the second line segment L12 can be repaired by the auxiliary connection part F1, so that the part of the connection lead L1 that has fallen off can be replaced by the auxiliary connection part F1. Thus, the connection lead L1 can maintain normal circuit conduction. Therefore, it can be beneficial to improve the yield rate of the connection lead L1.

[0148] It should be noted that the auxiliary connection part F1 is arranged on the second line segment L12, which can be understood as forming the auxiliary connection part F1 at the position of the opening C after the connection lead L1 is formed. In other words, at least part of the auxiliary connection part F1 is equivalent to being in the opening C, that is, the part of the auxiliary connection part F1 is not formed on the second line segment L12, but is formed on the substrate 01 exposed by the opening C.

[0149] In summary, no matter which line segment of the connecting lead L1 in the light-emitting substrate 100 has a problem of partial line falling off, an auxiliary connecting portion F1 can be formed on the surface corresponding to the line segment, so that at least part of the auxiliary connecting portion F1 is disposed in the opening C of the line segment. That is, the auxiliary connecting portion F1 is used to replace the part of the connecting lead L1 that has fallen off, so that the connecting lead L1 can maintain normal line conduction.

[0150] In some examples, the second line segment L12 of the connecting lead L1 is formed on the second main surface S2, and the display device 200 (return Figure 4 The driving circuit board 210 in the display area AA can also be located on the second main surface S2. Based on this, the second line segment L12 of the connecting lead L1 can be set to be electrically connected to the driving circuit board 210 to receive the signal provided by the driving circuit board 210 and transmit it to the light-emitting chip 10 in the display area AA to realize the light-emitting display of the light-emitting substrate 100.

[0151] Exemplarily, a plurality of second line segments L12 of the connecting leads L1 may be provided, which tend to converge from a side close to the set side S31 (a side away from the driving circuit board) to a side away from the set side S31 (a side close to the driving circuit board), so as to facilitate electrical connection between the second line segments L12 of the connecting leads L1 and the driving circuit board 210.

[0152] The above embodiment describes the case where an opening C is formed in any one line segment of the connecting lead L1 . The following will describe the case where at least two line segments of the connecting lead L1 have at least one opening C formed therein.

[0153] In some examples, any two of the first line segment L11 , the second line segment L12 , and the third line segment L13 in the connection lead L1 may include at least one opening C.

[0154] The above structure can include the following three situations:

[0155] The first type: the first line segment L11 and the second line segment L12 each include at least one opening C.

[0156] The second type: the first line segment L11 and the third line segment L13 each include at least one opening C.

[0157] The third type: the second line segment L12 and the third line segment L13 each include at least one opening C.

[0158] For the first case above:

[0159] Exemplarily, when both the first line segment L11 and the second line segment L12 include at least one opening C, an auxiliary connection portion F1 corresponding to the opening C on the first line segment L11 and an auxiliary connection portion F1 corresponding to the opening C on the second line segment L12 may be provided respectively.

[0160] As in the above structure, two different auxiliary connection parts F1 are used to repair the first line segment L11 and the second line segment L12, so that the size and shape of each auxiliary connection part F1 can be set correspondingly to the size and shape of the opening C in the line segment (the first line segment L11 or the second line segment L12) it repairs. On the one hand, the auxiliary connection part F1 can be used to achieve accurate repair of the line segment (the first line segment L11 or the second line segment L12) in the connecting lead L1. On the other hand, the auxiliary connection part F1 is only set corresponding to the line segment with the opening C (the first line segment L11 or the second line segment L12), which is equivalent to not having to set the auxiliary connection part F1 at the position of the intact third line segment L13 without the opening C, which can be beneficial to saving resources.

[0161] Alternatively, an auxiliary connection portion F1 may be provided, and the auxiliary connection portion F1 may overlap with the opening C on the first line segment L11 and the opening C on the second line segment L12 at the same time, so as to use the auxiliary connection portion F1 to repair the first line segment L11 and the second line segment L12 at the same time. It is understandable that the auxiliary connection portion F1 at this time also crosses the third line segment L13 located between the first line segment L11 and the second line segment L12.

[0162] As in the above structure, the size of the auxiliary connection part F1 in the first line segment L11 and the second line segment L12 repaired simultaneously by using one auxiliary connection part F1 is larger than the size of the auxiliary connection part F1 in the first line segment L11 and the second line segment L12 repaired by using two different auxiliary connection parts F1. Furthermore, when the first line segment L11 and the second line segment L12 are repaired simultaneously by using the same auxiliary connection part F1, since the size of the auxiliary connection part F1 is larger, it is beneficial to increase the overlap area between the auxiliary connection part F1 and the connecting lead L1, thereby facilitating the improvement of the stability of the connection between the auxiliary connection part F1 and the connecting lead L1, thereby further ensuring the yield rate of the connecting lead.

[0163] For the second situation above:

[0164] Exemplarily, when both the first line segment L11 and the third line segment L13 include at least one opening C, an auxiliary connection portion F1 corresponding to the opening C on the first line segment L11 and an auxiliary connection portion F1 corresponding to the opening C on the third line segment L13 may be provided respectively.

[0165] As in the above structure, by using two different auxiliary connection parts F1 to repair the first line segment L11 and the third line segment L13, the size and shape of each auxiliary connection part F1 can be set correspondingly to the size and shape of the opening C in the line segment (the first line segment L11 or the third line segment L13) it repairs. On the one hand, the auxiliary connection part F1 can be used to achieve accurate repair of the line segment (the first line segment L11 or the third line segment L13) in the connecting lead L1. On the other hand, only setting the auxiliary connection part F1 correspondingly to the line segment with the opening C (the first line segment L11 or the third line segment L13) can help save resources.

[0166] Alternatively, since the first line segment L11 and the third line segment L13 are connected, an auxiliary connection portion F1 may also be provided, and the auxiliary connection portion F1 may overlap with the opening C on the first line segment L11 and the opening C on the third line segment L13 at the same time, so as to utilize the auxiliary connection portion F1 to modify the first line segment L11 and the third line segment L13 at the same time.

[0167] As in the above structure, the size of the auxiliary connection part F1 in the first line segment L11 and the third line segment L13 repaired by using one auxiliary connection part F1 is larger than the size of the auxiliary connection part F1 in the first line segment L11 and the third line segment L13 repaired by using two different auxiliary connection parts F1. Furthermore, when the first line segment L11 and the third line segment L13 are repaired by using the same auxiliary connection part F1, since the size of the auxiliary connection part F1 is larger, it is beneficial to increase the overlap area between the auxiliary connection part F1 and the connecting lead L1, thereby facilitating the improvement of the stability of the connection between the auxiliary connection part F1 and the connecting lead L1, thereby further ensuring the yield rate of the connecting lead.

[0168] In addition, the auxiliary connection part F1 is arranged to overlap with the opening C on the first line segment L11 and the opening C on the third line segment L13, which is equivalent to the auxiliary connection part F1 including a portion located on the first main surface S1 and a portion located on the set side surface S31 that are connected. Since the portion located on the first main surface S1 and the portion located on the set side surface S31 are connected, it is helpful to reduce the probability that the end of the auxiliary connection part F1 located on the set side surface S31 close to the first main surface S1 falls off from the substrate 01 (the third line segment L13).

[0169] Regarding the third situation above:

[0170] Exemplarily, when both the second line segment L12 and the third line segment L13 include at least one opening C, an auxiliary connection portion F1 corresponding to the opening C on the second line segment L12 and an auxiliary connection portion F1 corresponding to the opening C on the third line segment L13 may be provided respectively.

[0171] As in the above structure, by using two different auxiliary connection parts F1 to repair the second line segment L12 and the third line segment L13, the size and shape of each auxiliary connection part F1 can be set correspondingly to the size and shape of the opening C in the line segment (the second line segment L12 or the third line segment L13) it repairs. On the one hand, the auxiliary connection part F1 can be used to achieve accurate repair of the line segment (the second line segment L12 or the third line segment L13) in the connecting lead L1. On the other hand, only setting the auxiliary connection part F1 correspondingly to the line segment with the opening C (the second line segment L12 or the third line segment L13) can help save resources.

[0172] Alternatively, since the second line segment L12 and the third line segment L13 are connected, an auxiliary connection portion F1 may also be provided, and the auxiliary connection portion F1 may overlap with the opening C on the second line segment L12 and the opening C on the third line segment L13 at the same time, so as to utilize the auxiliary connection portion F1 to modify the second line segment L12 and the third line segment L13 at the same time.

[0173] As in the above structure, the size of the auxiliary connection part F1 in the second line segment L12 and the third line segment L13 repaired by using one auxiliary connection part F1 is larger than the size of the auxiliary connection part F1 in the second line segment L12 and the third line segment L13 repaired by using two different auxiliary connection parts F1. Furthermore, when the second line segment L12 and the third line segment L13 are repaired by using the same auxiliary connection part F1, since the size of the auxiliary connection part F1 is larger, it is beneficial to increase the overlap area between the auxiliary connection part F1 and the connecting lead L1, thereby facilitating the improvement of the stability of the connection between the auxiliary connection part F1 and the connecting lead L1, thereby further ensuring the yield rate of the connecting lead.

[0174] In addition, the auxiliary connection portion F1 is arranged to overlap with the opening C on the second line segment L12 and the opening C on the third line segment L13, which is equivalent to the auxiliary connection portion F1 including a portion located on the second main surface S2 and a portion located on the set side surface S31 that are connected. Since the portion located on the second main surface S2 and the portion located on the set side surface S31 are connected, it is helpful to reduce the probability that the end of the auxiliary connection portion F1 located on the set side surface S31 close to the first main surface S1 falls off from the substrate 01 (third line segment L13).

[0175] In some other examples, each of the first line segment L11 , the second line segment L12 , and the third line segment L13 in the connecting lead L1 may include at least one opening C.

[0176] At this time, an auxiliary connection part F1 corresponding to the opening C on the first line segment L11, an auxiliary connection part F1 corresponding to the opening C on the second line segment L12, and an auxiliary connection part F1 corresponding to the opening C on the third line segment L13 can be respectively provided.

[0177] As in the above structure, two different auxiliary connection parts F1 are used to repair the first line segment L11, the second line segment L12 and the third line segment L13, so that the size and shape of each auxiliary connection part F1 can be set correspondingly to the size and shape of the opening C in the line segment (the first line segment L11, the second line segment L12 or the third line segment L13) it repairs. On the one hand, the auxiliary connection part F1 can be used to achieve accurate repair of the line segment (the first line segment L11, the second line segment L12 or the third line segment L13) in the connecting lead L1. On the other hand, only setting the auxiliary connection part F1 correspondingly to the line segment with the opening C (the first line segment L11, the second line segment L12 or the third line segment L13) can help save resources.

[0178] Alternatively, an auxiliary connection portion F1 may be provided, which may overlap with the opening C on the first line segment L11, the opening C on the second line segment L12 and the opening C on the third line segment L13 at the same time, so as to utilize the auxiliary connection portion F1 to simultaneously modify the first line segment L11, the second line segment L12 and the third line segment L13.

[0179] As in the above structure, the size of the auxiliary connection part F1 in the first line segment L11, the second line segment L12 and the third line segment L13 repaired by using one auxiliary connection part F1 is larger than the size of the auxiliary connection part F1 in the first line segment L11, the second line segment L12 and the third line segment L13 repaired by using three different auxiliary connection parts F1. Furthermore, when the first line segment L11, the second line segment L12 and the third line segment L13 are repaired by using the same auxiliary connection part F1, since the size of the auxiliary connection part F1 is larger, it is beneficial to increase the overlap area between the auxiliary connection part F1 and the connecting lead L1, thereby facilitating the improvement of the stability of the connection between the auxiliary connection part F1 and the connecting lead L1, thereby further ensuring the yield rate of the connecting lead.

[0180] In addition, the auxiliary connection part F1 is arranged to overlap with the opening C on the second line segment L12 and the opening C on the third line segment L13, which is equivalent to the auxiliary connection part F1 including a portion located on the first main surface S1, a portion located on the set side surface S31, and a portion located on the second main surface S2. Since the portion located on the set side surface S31 can be connected to the portion located on the first main surface S1 and the portion located on the second main surface S2 respectively, it can be helpful to reduce the probability that the end of the auxiliary connection part F1 located on the set side surface S31 close to the first main surface S1 and the end close to the second main surface S2 fall off from the substrate 01 (third line segment L13).

[0181] In addition, when at least one line segment of the connection lead L1 includes a plurality of openings, one auxiliary connection part F1 may be used for repair, or the openings C may be repaired one by one using a plurality of auxiliary connection parts F1.

[0182] The above embodiment mainly introduces the case where at least one line segment in the connecting lead L1 has at least one opening C in combination with the relevant drawings. Hereinafter, the quantitative relationship between the connecting lead L1 and the opening C will be introduced in combination with the relevant drawings.

[0183] In some embodiments, the combination Figure 8 and Fig. 9 As shown, the opening C in the connection lead L1 can correspond to the auxiliary connection part F1 one by one. That is, one opening in the connection lead L is repaired by one auxiliary connection part F1.

[0184] That is, for each opening C in a connection lead L found in the light emitting substrate 100 , an auxiliary connection portion F1 may be correspondingly provided, so that at least a portion of the auxiliary connection portion F1 is provided in the opening C and the auxiliary connection portion F1 is provided to be connected to the connection lead L1 .

[0185] Based on this, the auxiliary connection part F1 is used to fill at least a part of the opening C, so as to use the auxiliary connection part F1 to repair the opening C formed by the connection lead L1 due to the detachment. That is, the auxiliary connection part F1 can replace the detached part of the connection lead L1, so that the connection lead L1 can maintain the circuit conduction normally. Therefore, it can be helpful to improve the yield rate of the connection lead L1.

[0186] In addition, since the opening C in the connecting lead L1 can correspond to the auxiliary connection part F1 one by one, the shape and size of the auxiliary connection part F1 of the regulator can be matched to different openings C, fixed-point repair can be achieved, and it can also help save resources.

[0187] Fig.14 is a structural diagram of a light-emitting substrate according to some other embodiments. Fig.14The structure diagram of the first line segment in the connecting lead is shown. The structures of other line segments in the connecting lead are similar to those of the first line segment and can be combined with the introduction of the first line segment structure. The structures of other line segments in the connecting lead will also be explained in detail below.

[0188] In other embodiments, see Fig.14 As shown, a connection lead L1 includes a plurality of openings C. An auxiliary connection portion F1 may be provided corresponding to the plurality of openings C in a connection lead L1. That is, the auxiliary connection portion F1 may be located in the plurality of openings C in a connection lead L1 at the same time, and the auxiliary connection portion F1 is provided to be connected to the connection lead L1.

[0189] Based on this, one auxiliary connection part F1 is used to fill the multiple openings C formed in the connecting lead L, so that the auxiliary connection part F1 is used to repair the multiple openings C formed by the connecting lead L1 due to the detachment. So that the connecting lead L1 can maintain the circuit conduction normally. Therefore, it can be helpful to improve the yield rate of the connecting lead L1. In addition, multiple openings C in the same connecting lead L1 can be repaired by one auxiliary connection part F1, which can be helpful to reduce the process accuracy of forming the auxiliary connection part F1.

[0190] Fig.15 is a structural diagram of a light-emitting substrate according to some further embodiments, Fig.16 for Fig.15 A cross-sectional view along the T-T' direction. Fig.15 The structure diagram of the first line segment L11 in the connecting lead is shown. The structures of other line segments in the connecting lead are similar to those of the first line segment L11 and can be combined with the introduction of the first line segment structure. The structures of other line segments in the connecting lead will also be explained in detail below.

[0191] In some other embodiments, see Fig.15 As shown, at least two auxiliary connection parts F1 are arranged in the same opening C. Based on this, multiple auxiliary connection parts F1 can be used to repair the same opening C, so that the connection lead L1 can maintain normal circuit conduction. In addition, by using multiple auxiliary connection parts F1 to repair the same opening C, the auxiliary connection parts F1 can occupy a larger proportion of the opening C, so that the auxiliary connection parts F1 can be used to better repair the detached part of the connection lead L1 to fill the opening C. This is conducive to ensuring that the connection lead L1 can maintain normal circuit conduction and improving the yield rate of the connection lead L1.

[0192] Exemplarily, the plurality of auxiliary connection portions F1 are arranged along a direction perpendicular to the extending direction of the connection lead L1 , and the plurality of auxiliary connection portions F1 are all disposed within the opening C.

[0193] It should be noted that when a plurality of auxiliary connection parts F1 are located in the same opening C, the connection relationship between the plurality of auxiliary connection parts F1 in the same opening C is as follows.

[0194] The first type: Fig.15 The two auxiliary connection parts corresponding to the middle and lower connecting leads, and the corresponding Fig.16 The two auxiliary connection parts F1 provided on the left connecting lead L1, that is, the corresponding multiple auxiliary connection parts F1 provided in the same opening C can be arranged at intervals.

[0195] The second type: Fig.15 The two auxiliary connection parts corresponding to the upper middle connection lead and the corresponding Fig.16 The two auxiliary connection parts F1 provided on the middle right connecting lead L1, that is, the corresponding multiple auxiliary connection parts F1 in the same opening C can be electrically connected to each other.

[0196] Regardless of which of the above methods is used, it is sufficient to ensure that each auxiliary connection portion F1 is within the opening C and connected to the connection lead L1 having the opening C, so that the auxiliary connection portion F1 can be used to repair and replace the opening C formed by the connection lead L1 falling off, so as to ensure that the connection lead L1 can maintain normal circuit conduction. The embodiments of the present disclosure are not limited thereto.

[0197] However, the embodiments of the present disclosure are not limited to this. In the following, an auxiliary connection portion F1 is used to repair an opening C as an example.

[0198] The above embodiments describe the positional relationship and quantity relationship between the connecting lead L1 and the auxiliary connecting part F1 in combination with the relevant drawings. The following will describe various parameters of the auxiliary connecting part F1 in combination with the relevant drawings, for example, the square resistance, thickness, length and other parameters of the auxiliary connecting part F1.

[0199] In some embodiments, please continue to combine Figure 8 and Fig. 9 As shown, the square resistance of the auxiliary connection portion F1 is set to be less than or equal to the square resistance of the connection lead L1.

[0200] That is, the auxiliary connection part F1 with a square resistance less than or equal to the connection lead L1 is selected to replace the part of the connection lead L1 that has fallen off. This can prevent the problem that the auxiliary connection part F1 has a large square resistance and causes the auxiliary connection part F1 to generate a large impedance during the operation of the light-emitting substrate 100. Thus, the influence of the auxiliary connection part F1 on the electrical properties of the connection lead L1 can be improved.

[0201] In addition, since the auxiliary connection part F1 needs to contact the connection lead L1 having the opening C, so that the auxiliary connection part F1 is electrically connected to the connection lead L1, the connection lead L1 can maintain circuit conduction normally by utilizing the auxiliary connection part F1.

[0202] Based on this, selecting the auxiliary connection part F1 whose square resistance is less than or equal to the connection lead L1 can also help reduce the contact resistance between the auxiliary connection part F1 and the connection lead L1. Therefore, the contact resistance between the auxiliary connection part F1 and the connection lead L1 can be reduced, and the attenuation of the signal transmitted by the connection lead L1 can be improved, which can help improve the display quality of the light-emitting substrate 100.

[0203] In some embodiments, please continue to combine Figure 8 and Fig. 9 As shown, the material of the auxiliary connection portion F1 includes conductive glue. At least a portion of the conductive glue is disposed in the opening C, and the conductive glue is used to connect the connection lead L1 where the opening C is located.

[0204] On the one hand, the conductive glue is conductive, and can realize the electrical connection between the auxiliary connection part F1 (conductive glue) and the connection lead L1, so that the connection lead L1 can maintain normal circuit conduction. On the other hand, the conductive glue is sticky, and can ensure that the auxiliary connection part F1 (conductive glue) and the connection lead L1 are fixedly connected to prevent the conductive glue from falling off from the connection lead L1, which again leads to the problem of low yield of the connection lead L1.

[0205] In some examples, the material of the conductive adhesive may include conductive silver paste or conductive gold paste. Since conductive silver paste or conductive gold paste has the advantages of low curing temperature, high bonding strength, and stable electrical properties, conductive silver paste or conductive gold paste is disposed in the opening C, and the connecting lead L1 where the opening C is located is connected by conductive adhesive. This can ensure the electrical performance of the connecting lead L1 repaired by the auxiliary connecting part F1 (conductive silver paste or conductive gold paste), and reduce the risk of the auxiliary connecting part F1 (conductive silver paste or conductive gold paste) falling off from the connecting lead L1.

[0206] In some examples, the conductive glue may include an adhesive and a metal ball in the adhesive. This arrangement can ensure the electrical performance of the connecting lead L1 after being repaired by the auxiliary connecting part F1 (conductive glue) and reduce the risk of the auxiliary connecting part F1 (conductive glue) falling off the connecting lead L1.

[0207] For example, the material of the adhesive may be ultraviolet rays (UV) or thermosetting adhesive. However, the embodiments of the present disclosure are not limited thereto.

[0208] Exemplarily, the material of the metal ball may be an inert metal, such as silver and gold, etc. However, the embodiments of the present disclosure are not limited thereto.

[0209] In some embodiments, please continue to combine Figure 8 and Fig. 9As shown, in the thickness direction Z of the substrate 01 , the thickness of the auxiliary connection portion F1 ranges from 5 μm to 20 μm.

[0210] When the thickness of the auxiliary connection part F1 is equal to or close to 5 μm, the thickness of the auxiliary connection part F1 can be made thinner, so that the auxiliary connection part F1 can be more closely attached to the substrate 01 and the connecting lead L1, reducing the risk of the auxiliary connection part F1 being separated from the substrate 01 and the connecting lead L1. At the same time, when the thickness of the auxiliary connection part F1 is equal to or close to 5 μm, the problem of the auxiliary connection part F1 having a large resistance due to the thin thickness of the auxiliary connection part F1 can also be prevented. Furthermore, it can be helpful to reduce the attenuation of the signal transmitted on the connecting lead repaired by the auxiliary connection part F1, which can be helpful to improve the display quality of the light-emitting substrate 100.

[0211] When the thickness of the auxiliary connection part F1 is equal to or close to 20 μm, the thickness of the auxiliary connection part F1 is relatively thick, and the resistance of the auxiliary connection part F1 can be relatively small. This can help reduce the attenuation of the signal transmitted on the connecting lead repaired by the resistance of the auxiliary connection part F1, and can help improve the display quality of the light-emitting substrate 100. At the same time, when the thickness of the auxiliary connection part F1 is equal to or close to 20 μm, it can also prevent the auxiliary connection part F1 from being too thick, which increases the risk of the auxiliary connection part F1 being separated from the substrate 01 and the connecting lead L1.

[0212] In some examples, the thickness of the auxiliary connection portion F1 ranges from 10 μm to 15 μm.

[0213] When the thickness of the auxiliary connection part F1 is equal to or close to 10μm, the auxiliary connection part F1 can be made to fit more closely on the substrate 01 and the connecting lead L1, thereby reducing the risk of the auxiliary connection part F1 detaching from the substrate 01 and the connecting lead L1; it can also prevent the auxiliary connection part F1 from having a large resistance, thereby helping to reduce the attenuation of the signal transmitted on the connecting lead repaired by the auxiliary connection part F1, thereby helping to improve the display quality of the light-emitting substrate 100.

[0214] When the thickness of the auxiliary connection part F1 is equal to or close to 15μm, the resistance of the auxiliary connection part F1 can be smaller, thereby reducing the attenuation of the signal transmitted on the connecting lead repaired by the auxiliary connection part F1; and the auxiliary connection part F1 can be prevented from being too thick, thereby increasing the risk of the auxiliary connection part F1 detaching from the substrate 01 and the connecting lead L1.

[0215] Exemplarily, the thickness of the auxiliary connection portion F1 is about 5 μm, 8 μm, 10 μm, 12 μm, 15 μm, 18 μm or 20 μm. However, this is not limited in the embodiments of the present disclosure.

[0216] It should be noted that the thickness of the auxiliary connection part F1 is about 10 μm. Due to certain uncontrollable errors (such as manufacturing process errors, equipment accuracy, measurement errors, etc.), when the error of the thickness of the auxiliary connection part F1 fluctuates within the range of 10%×10 μm, it can also be considered that the thickness of the auxiliary connection part F1 satisfies and is equal to 10 μm.

[0217] In addition, in other examples, due to certain uncontrollable errors (such as manufacturing process errors, equipment accuracy, measurement errors, etc.), when the error of the thickness of the auxiliary connection part F1 fluctuates within the range of 5%×10μm, it can also be considered that the thickness of the auxiliary connection part F1 satisfies and is equal to 10μm.

[0218] The material and thickness of the auxiliary connection part F1 are introduced above in conjunction with the relevant drawings. The length and width of the auxiliary connection part F1 and how to set the auxiliary connection part F1 so that the auxiliary connection part F1 is connected to the connecting lead L1 will be introduced below in conjunction with the relevant drawings.

[0219] Fig.17 is a structural diagram of a light-emitting substrate according to some other embodiments. Fig.17 The first line segment L11 connected to the lead line L1 on the light emitting substrate 100 is used as an example for illustration.

[0220] First, see Fig.17 As shown, the first arrangement is described above, and all auxiliary connection parts F1 are arranged in the opening C.

[0221] When the connection lead L1 is cut into two parts by the opening C formed by the partial wiring falling off, the connection lead L1 will be formed in the connection lead L1. The first edge 11 and the second edge 12 corresponding to the two parts are formed in the connection lead L1. The first edge 11 and the second edge 12 and the middle area thereof are combined into the opening C.

[0222] Based on this, when all the auxiliary connection parts F1 are arranged in the opening C, one end of the auxiliary connection part F1 can be arranged to abut against the first edge 11, and the other end of the auxiliary connection part F1 can abut against the second edge 12. Thus, the auxiliary connection part F1 abuts against the connecting lead L1 in the opening C, so that the auxiliary connection part F1 can be used to repair the part of the connecting lead L1 that has fallen off, and the auxiliary connection part F1 can be used to keep the connecting lead L1 normally connected.

[0223] In some examples, Fig.17 It is only shown that one end of the auxiliary connection part F1 abuts against a portion of the first edge 11, and the other end of the auxiliary connection part F1 abuts against a portion of the second edge 12. That is, the auxiliary connection part F1 can fill a portion of the opening C. However, the present disclosure is not limited thereto, as long as the auxiliary connection part F1 is used to keep the connection lead L1 normally connected.

[0224] It is understandable that, in other examples, one end of the auxiliary connection part F1 may be arranged to abut against all the first edges 11, and the other end of the auxiliary connection part F1 may abut against all the second edges 12. That is, the auxiliary connection part F1 may completely fill the opening C, so that the auxiliary connection part F1 may completely replace and repair the detached part of the connecting lead L1, so that the connecting lead L1 may maintain normal circuit conduction by using the auxiliary connection part F1, thereby improving the yield rate of the connecting lead L1.

[0225] When the opening C formed by the partial detachment of the connecting lead L1 does not cut the connecting lead L1 into two parts, the detached part will form an edge in the connecting lead L1, which is relatively sunken relative to the original structure of the connecting lead L1 to form the opening C.

[0226] Based on this, the auxiliary connection part F1 can be arranged in the opening C, abutting against the edge part, or abutting against the edge completely, so that the connection lead L1 can maintain normal circuit conduction by utilizing the auxiliary connection part F1.

[0227] Secondly, the second arrangement method described above is used to arrange part of the auxiliary connection portion F1 in the opening C.

[0228] In some embodiments, please return Figure 8 and Fig. 9 As shown, the auxiliary connection part F1 includes a main body F11 and at least one lap part F12 connected to the main body F11. The main body F11 is located in the opening C, and the lap part F12 is located on the side of the connection lead L1 away from the substrate 01, and the lap part F12 contacts the connection lead L1.

[0229] Such a configuration is equivalent to configuring part of the auxiliary connection part F1 (main body part F11) in the opening C, and configuring the other part of the auxiliary connection part F1 (overlap part F12) on the side of the connecting lead L1 away from the substrate 01, and utilizing the auxiliary connection part F1 (overlap part F12) to directly contact the connecting lead L1 to achieve electrical connection between the auxiliary connection part F1 and the connecting lead L1.

[0230] Moreover, the presence of the overlap portion F12 can help increase the contact area between the auxiliary connection portion F1 and the connecting lead L1, thereby improving the stability between the auxiliary connection portion F1 and the connecting lead L1 and preventing the auxiliary connection portion F1 from falling off the connecting lead L1.

[0231] The number of overlapping portions F12 in the auxiliary connection portion F1 can be set accordingly according to the position of the opening C in the connection lead L1, so as to repair the connection lead L1 by using the auxiliary connection portion F1 to ensure the electrical performance of the connection lead L1.

[0232] Fig.18 is a structural diagram of a light-emitting substrate according to some further embodiments, Fig.19 1 is a structural diagram of a light-emitting substrate according to some further embodiments.

[0233] In some examples, combine Fig.18 and Fig.19 As shown, when the opening C is located at the end of the connecting lead L, that is, when the opening C does not cut the connecting lead L1 into multiple line segments. The auxiliary connecting portion F1 can be provided to include a main body portion F11 and a lap portion F12 connected to the main body portion F11. The main body portion F11 is provided in the opening C, and the lap portion F12 is provided on the connecting lead L1, so as to utilize the lap portion F12 to connect with the connecting lead L1 having the opening C, so as to realize the electrical connection between the auxiliary connecting portion F1 and the connecting lead L1.

[0234] Based on this, the auxiliary connection part F1 can be used to repair the opening C formed by the connection lead L1 due to partial wiring detachment, so that the connection lead L1 can maintain normal circuit conduction. This can help improve the yield rate of the connection lead L1 and improve the display quality of the light-emitting substrate 100.

[0235] It should be noted that the "end" of the connecting lead L refers to the edge of the connecting lead L1, and the presence of the opening C at this position does not directly lead to the connection lead L1 being cut into multiple line segments. The "end" can be the edge of the connecting lead L1 along its length direction, or the edge of the connecting lead L1 along its width direction. This is not limited in the embodiments of the present disclosure.

[0236] In other examples, when the opening C is located inside the connecting lead L1, the opening C divides the connecting lead L1 into multiple parts. Figure 8 and Fig. 9 As shown, the example in which the connection lead L1 has an opening C inside is used for description. At this time, the connection lead L1 having the opening C is divided into two parts.

[0237] At this time, the auxiliary connection part F1 may include a main body part F11 and two overlapping parts F12 connected to the main body part F11, wherein the main body part F11 is located between the two overlapping parts F12.

[0238] Based on this, the auxiliary connection part F1 can be connected to a part of the connection lead L1 using one of the overlapped parts F12, and the auxiliary connection part F1 can be connected to another part of the connection lead L1 using another overlapped part F12. Based on this, the auxiliary connection part F1 can be used to repair the connection lead L1 to ensure that the connection lead L1 can maintain normal circuit conduction.

[0239] When the opening C penetrates the connecting lead L1 along the length or width direction of the connecting lead L1, the connecting lead L1 will be cut into multiple line segments. Exemplarily, the connecting lead L1 with one opening C will be cut into two line segments. Exemplarily, the connecting lead L1 with two openings C will be cut into three line segments.

[0240] Based on this, the auxiliary connection part F1 can be connected to one line segment of the connection lead L1 by using one of the overlapping parts F12, and the auxiliary connection part F1 can be connected to another line segment of the connection lead L1 by using another overlapping part F12. Furthermore, the two disconnected line segments can be electrically connected by using the auxiliary connection part F1, so that the two line segments and the auxiliary connection part F1 are combined into the repaired connection lead L1, so as to ensure that the connection lead L1 can maintain normal circuit conduction.

[0241] In some embodiments, please continue to combine Figure 8 and Fig. 9 As shown, in the direction from the main portion F11 to the overlapping portion F12, the width of the overlapping portion F12 is greater than or equal to 10 μm.

[0242] Such a configuration is equivalent to extending the auxiliary connection part F1 inside and outside the opening C onto the connection lead L1 and overlapping the connection lead L1. In addition, the width of the overlapping area between the auxiliary connection part F1 and the connection lead L1 is set to be greater than or equal to 10 μm, which can ensure that the auxiliary connection part F1 is in full contact with the connection lead L1, so as to improve the stability of the fixed connection between the auxiliary connection part F1 and the connection lead L1. This can help prevent the conductive glue from falling off the connection lead L1, which again leads to the problem of low yield of the connection lead L1.

[0243] When the width of the overlapping portion F12 is equal to or close to 10 μm in the direction from the main body F11 to the overlapping portion F12, the width of the overlapping area between the auxiliary connection portion F1 and the connecting lead L1 can be ensured to be wider, thereby ensuring that the auxiliary connection portion F1 is in full contact with the connecting lead L1, thereby improving the stability of the fixed connection between the auxiliary connection portion F1 and the connecting lead L1.

[0244] It should be noted that since the opening C on the connecting lead L1 is formed by part of the connecting lead L1 falling off from the substrate 01, the shape of the opening C cannot be guaranteed, and the opening C can be a regular shape, such as a circle, a square, a polygon, etc. Alternatively, the opening C can be an irregular shape.

[0245] Based on this, the above “width of the overlapping portion F12 ” can be understood as the minimum distance between the orthographic projection of the edge of the overlapping portion F12 away from the main portion F11 on the substrate 01 and the orthographic projection of the boundary of the opening C on the substrate 01 .

[0246] In some examples, along the direction from the main portion F11 to the overlapping portion F12 , the width of the overlapping portion F12 is greater than or equal to 15 μm.

[0247] When the width of the overlapping portion F12 is equal to or close to 15 μm in the direction from the main portion F11 to the overlapping portion F12, the auxiliary connecting portion F1 can be ensured to be in full contact with the connecting lead L1, thereby improving the stability of the fixed connection between the auxiliary connecting portion F1 and the connecting lead L1.

[0248] Illustratively, along the direction from the main portion F11 to the overlapping portion F12 , the width of the overlapping portion F12 is approximately any one of 10 μm, 12 μm, 15 μm, 20 μm, 25 μm or 30 μm.

[0249] It should be noted that the width of the overlapped portion F12 is about 10 μm. Due to certain uncontrollable errors (such as manufacturing process errors, equipment accuracy, measurement errors, etc.), when the error of the width of the overlapped portion F12 fluctuates within the range of 10%×10 μm, it can also be considered that the width of the overlapped portion F12 satisfies and is equal to 10 μm.

[0250] In addition, in other examples, due to certain uncontrollable errors (such as manufacturing process errors, equipment accuracy, measurement errors, etc.), when the error of the width of the overlap portion F12 fluctuates within the range of 5%×10μm, it can also be considered that the width of the overlap portion F12 satisfies the requirement of being equal to 10μm.

[0251] The above-mentioned minimum value of the overlapping area size of the auxiliary connection part F1 and the connection lead L1 is limited in combination with the accompanying drawings. The following will describe in detail the maximum value of the overlapping area size of the auxiliary connection part F1 and the connection lead L1 in combination with the accompanying drawings.

[0252] Fig. 20 is a cross-sectional view of a light-emitting substrate according to some other embodiments.

[0253] In some embodiments, see Fig. 20 As shown, when any of the first line segment L11, the second line segment L12 and the third line segment L13 in the connecting lead L1 has an opening C, the length of the auxiliary connection part F1 can be set to be less than or equal to the length of the line segment with the opening C along the extension direction of the connecting lead L1.

[0254] Based on this, the auxiliary connection part F1 can be used to repair the line segment with the opening C to improve the yield rate of the connecting lead L1. In addition, the length of the auxiliary connection part F1 is set to be less than or equal to the length of the line segment with the opening C, which can ensure the overlap width of the auxiliary connection part F1 and the line segment with the opening C, and can ensure that the auxiliary connection part F1 is in full contact with the line segment with the opening C, so as to improve the stability of the fixed connection between the auxiliary connection part F1 and the connecting lead L1.

[0255] In addition, the length of the auxiliary connection part F1 is set to be less than or equal to the length of the line segment with the opening C along the length direction of the connecting lead L1. This can also prevent the auxiliary connection part F1 from being too long and causing contact with other conductive components in the light-emitting substrate 100 and causing a short circuit, and can also help save resources.

[0256] When the length of the auxiliary connection part F1 is equal to or close to the length of the line segment with the opening C in the direction along the length of the connecting lead L1, the overlap width between the auxiliary connection part F1 and the line segment with the opening C can be made wider, and the auxiliary connection part F1 can be used to fully repair the line segment with the opening C to ensure that the line segment can maintain normal circuit conduction. At the same time, it can also help to improve the stability of the connection between the auxiliary connection part F1 and the connecting lead L1.

[0257] Since the three line segments of the connecting lead L1 are formed on different surfaces of the substrate 01, the extension directions of the three line segments are different. The above-mentioned "extension direction" refers to the extension direction of the line segment with the opening C.

[0258] In some examples, when the opening C is formed in the first line segment L11 of the connecting lead L1 , the length of the auxiliary connection portion F1 along the extending direction of the first line segment L11 is less than or equal to the length of the first line segment L11 having the opening C.

[0259] In some other examples, when the opening C is formed in the second line segment L12 of the connecting lead L1 , the length of the auxiliary connection portion F1 along the extension direction of the second line segment L12 is less than or equal to the length of the second line segment L12 having the opening C.

[0260] In some other examples, when the opening C is formed in the third line segment L13 of the connecting lead L1 , the length of the auxiliary connection portion F1 is less than or equal to the length of the third line segment L13 having the opening C along the extending direction of the third line segment L13 .

[0261] It should be noted that when the opening C in the connecting lead L1 is located at the junction of the first line segment L11 and the third line segment L13:

[0262] The first one is that the opening C can be attributed to the first line segment L11, and the length of the auxiliary connection portion F1 is set to be less than or equal to the length of the first line segment L11, and the auxiliary connection portion F1 can be connected to the first line segment L11 and the third line segment L13 respectively.

[0263] The second method is to attribute the opening C to the third line segment L13, set the length of the auxiliary connection portion F1 to be less than or equal to the length of the third line segment L13, and connect the auxiliary connection portion F1 to the first line segment L11 and the third line segment L13 respectively.

[0264] The third type: the opening C can be divided into two parts, the part of the opening C close to the first line segment L11 belongs to the first line segment L11, and the part of the opening C close to the third line segment L13 belongs to the third line segment L13. In this case, the length of the opening C can be set to be less than or equal to the sum of the lengths of the first line segment L11 and the third line segment L13, and the auxiliary connection portion F1 can be connected to the first line segment L11 and the third line segment L13 respectively.

[0265] In addition, when the opening C in the connecting lead L1 is located at the junction of the second line segment L12 and the third line segment L13, it is similar to the above-mentioned case where the opening C in the connecting lead L1 is located at the junction of the first line segment L11 and the third line segment L13, and is not repeated here.

[0266] In some examples, along the extending direction of the connection lead L1 (the extending direction of the line segment having the opening C), the length of the auxiliary connection portion F1 is equal to the length of the line segment having the opening C.

[0267] Based on this, the boundary of the orthographic projection of the auxiliary connection portion F1 on the substrate 01 along the extension direction of the connection lead L1 roughly coincides with the boundary of the orthographic projection of the line segment with the opening C on the substrate 01 along the extension direction of the connection lead L1.

[0268] Such a configuration is equivalent to arranging that along the extension direction of the connecting lead L1 (the extension direction of the line segment with the opening C), the two ends of the auxiliary connecting part F1 are relatively aligned with the two ends of the line segment. The overlapping width between the auxiliary connecting part F1 and the line segment with the opening C can be made wider, and the auxiliary connecting part F1 can be used to fully repair the line segment with the opening C to ensure that the line segment can maintain normal circuit conduction. At the same time, it can also help to improve the stability of the connection between the auxiliary connecting part F1 and the connecting lead L1.

[0269] It should be noted that "substantially coincident" includes absolute coincidence and approximate coincidence. That is, the floating range of the gap between the orthographic projection boundary of the auxiliary connection part F1 on the substrate 01 and the orthographic projection boundary of the line segment with the opening C on the substrate 01 does not exceed the error threshold, and it can also be considered that the edges of the auxiliary connection part F1 and the line segment are relatively "coincident". Among them, the error threshold can be less than 10% of the length of the line segment with the opening C.

[0270] In addition, when there are multiple openings C in the same line segment, the length of the auxiliary connection part F1 is set to be less than or equal to the length of the line segment with the opening C, so that the length of the auxiliary connection part F1 can be longer, so that the orthographic projection of the auxiliary connection part F1 on the substrate 01 can overlap with the orthographic projections of multiple openings C on the substrate 01 at the same time. Therefore, the auxiliary connection part F1 can be used to repair multiple openings C on the line segment at the same time. Based on this, there is no need to set an auxiliary connection part F1 for each opening C, which can help simplify the process difficulty.

[0271] in, Fig. 20 The following description is made by taking the example that the first line segment L11 in the connecting lead L1 has an opening C. However, the embodiments of the present disclosure are not limited thereto.

[0272] Fig.21 is a cross-sectional view of a light-emitting substrate according to some further embodiments.

[0273] In some embodiments, see Fig.21 As shown, along the extending direction of the connecting lead L1 , the length of the auxiliary connecting portion F1 is less than or equal to the length of the connecting lead L1 having the opening C.

[0274] Based on this, the auxiliary connection part F1 can be used to repair the connection lead L1 with the opening C to improve the yield rate of the connection lead L1. In addition, the structure of the auxiliary connection part F1 is similar to that of the connection lead L1, and the extension direction of the auxiliary connection part F1 is set to be parallel to the extension direction of the connection lead L1. Based on this, the length of the auxiliary connection part F1 is set to be less than or equal to the length of the connection lead L1 with the opening C, which can ensure the overlap size of the auxiliary connection part F1 and the connection lead L1 with the opening C, and can ensure that the auxiliary connection part F1 is in full contact with the connection lead L1 with the opening C, so as to improve the stability of the fixed connection between the auxiliary connection part F1 and the connection lead L1.

[0275] In addition, the length of the auxiliary connection part F1 is less than or equal to the length of the connection lead L1 having the opening C along the extension direction of the connection lead L1. This can also prevent the auxiliary connection part F1 from being too long and causing contact with other conductive components in the light-emitting substrate 100 and causing a short circuit, and can also help save resources.

[0276] When the length of the auxiliary connection part F1 is equal to or close to the length of the connection lead L1 with the opening C in the extending direction of the connection lead L1, the overlap area between the auxiliary connection part F1 and the line segment with the opening C can be made larger, and the auxiliary connection part F1 can be used to fully repair the connection lead L1 with the opening C to ensure that the connection lead L1 can maintain normal circuit conduction. At the same time, it can also help to improve the stability of the connection between the auxiliary connection part F1 and the connection lead L1.

[0277] For some examples, see Fig.21 As shown, along the extending direction of the connecting lead L1 , the length of the auxiliary connecting portion F1 is substantially equal to the length of the connecting lead L1 having the opening C.

[0278] At this time, the structure of the auxiliary connection portion F1 is similar to that of the connection lead L1, and the auxiliary connection portion F1 extends from the first main surface S1 to the second main surface S2. That is, the auxiliary connection portion F1 includes a first auxiliary connection sub-portion corresponding to the first line segment L11, a third auxiliary connection sub-portion corresponding to the third line segment L13, and a second auxiliary connection sub-portion corresponding to the second line segment L12, and the third auxiliary connection sub-portion is respectively connected to the first auxiliary connection sub-portion and the second auxiliary connection sub-portion to form the auxiliary connection portion F1.

[0279] As shown in the above structure, along the extension direction of the connecting lead L1, the length of the auxiliary connecting portion F1 is substantially equal to the length of the line segment with the opening C. It can be understood that along the extension direction of the first line segment L11, the length of the first auxiliary connecting sub-portion is substantially equal to the length of the first line segment L11; along the extension direction of the third line segment L13, the length of the third auxiliary connecting sub-portion is substantially equal to the length of the third line segment L13; and along the extension direction of the second line segment L12, the length of the second auxiliary sub-portion is substantially equal to the length of the second line segment L12. Based on this, in the extension direction of the connecting lead L1, the length of the auxiliary connecting portion F1 is substantially equal to the length of the line segment with the opening C.

[0280] Furthermore, the overlap width between the auxiliary connection part F1 and the connection lead L1 with the opening C can be made wider, and the auxiliary connection part F1 can be used to fully repair the connection lead L1 with the opening C to ensure that the connection lead L1 can maintain normal circuit conduction. At the same time, it can also help to improve the stability of the connection between the auxiliary connection part F1 and the connection lead L1.

[0281] In addition, when there are multiple openings C in the same connection lead L1: for example, when defective channels are formed in different line segments of the same connection lead L1: the length of the auxiliary connection part F1 can be set to be less than or equal to the length of the connection lead L1 with the opening C, so that the length of the auxiliary connection part F1 is longer, so that the positive projection of the auxiliary connection part F1 on the substrate 01 can overlap with the positive projections of multiple openings C on the substrate 01 at the same time. Therefore, the auxiliary connection part F1 can be used to repair multiple openings C on the connection lead L1 at the same time. Based on this, there is no need to set an auxiliary connection part F1 corresponding to each opening C, which can help simplify the process difficulty.

[0282] The above mainly introduces the limitation on the length of the auxiliary connection part F1 , and the following will define the width of the auxiliary connection part F1 with reference to the accompanying drawings.

[0283] In some embodiments, the return Figure 8 and Fig. 9 As shown, along the width direction of the connecting lead L1 , the ratio of the width of the auxiliary connecting portion F1 located in the opening C to the width of the opening C is greater than or equal to 50%.

[0284] When the ratio of the width of the auxiliary connection part F1 located in the opening C to the width of the opening C along the width direction of the connecting lead L1 is equal to or close to 50%, the auxiliary connection part F1 can occupy a larger proportion of the opening C, so that the auxiliary connection part F1 can be used to repair the detached part of the connecting lead L1 to fill the opening C. This is conducive to ensuring that the connecting lead L1 can maintain normal circuit conduction and improving the yield rate of the connecting lead L1.

[0285] In some examples, the direction of the width of the connecting lead L1 is approximately perpendicular to the direction in which the connecting lead L1 extends, and the angle between the direction of the width of the connecting lead L1 and the direction in which the connecting lead L1 extends is approximately equal to 90°. For example, the angle between the direction of the width of the connecting lead L1 and the direction in which the connecting lead L1 extends may be 85°, 90°, or 95°.

[0286] In some examples, along the width direction of the connection lead L1 , a ratio of the width of the auxiliary connection portion F1 located in the opening C to the width of the opening C is greater than or equal to 80%.

[0287] When the ratio of the width of the auxiliary connection part F1 located in the opening C to the width of the opening C along the width direction of the connecting lead L1 is equal to or close to 80%, the auxiliary connection part F1 can occupy a larger proportion of the opening C, so that the auxiliary connection part F1 can be used to better repair the detached part of the connecting lead L1 to fill the opening C. This is conducive to ensuring that the connecting lead L1 can maintain normal circuit conduction and improving the yield rate of the connecting lead L1.

[0288] In some examples, along the width direction of the connection lead L1, the ratio of the width of the auxiliary connection portion F1 in the opening C to the width of the opening C is greater than or equal to 100%. That is, the width of the auxiliary connection portion F1 in the opening C is substantially equal to the width of the opening C.

[0289] With such a configuration, the auxiliary connection portion F1 can be used to fill the opening C, which is beneficial to ensure that the connection lead L1 can maintain normal circuit conduction and improve the yield rate of the connection lead L1.

[0290] For example, along the width direction of the connection lead L1, the ratio of the width of the auxiliary connection portion F1 in the opening C to the width of the opening C is about 50%, 60%, 70%, 80%, 90% or 100%. However, the embodiments of the present disclosure are not limited thereto.

[0291] It should be noted that, in the direction of the width of the connecting lead L1, the ratio of the width of the auxiliary connecting portion F1 in the opening C to the width of the opening C is about 50%. Due to certain uncontrollable errors (such as manufacturing process errors, equipment accuracy, measurement errors, etc.), when the error of the ratio fluctuates within the range of 10%×50%, it can also be considered that the ratio of the width of the auxiliary connecting portion F1 in the opening C to the width of the opening C is about 50%.

[0292] In addition, in other examples, due to certain uncontrollable errors (such as manufacturing process errors, equipment accuracy, measurement errors, etc.), when the ratio error fluctuates within the range of 5%×50%, it can also be considered that the ratio of the width of the auxiliary connection part F1 located in the opening C to the width of the opening C is approximately 50%.

[0293] In some embodiments, in combination Figure 8 and Fig. 9 As shown, along the width direction of the connecting lead L1, the width of the auxiliary connecting portion F1 ranges from 50 μm to 100 μm.

[0294] When the width of the auxiliary connection part F1 along the width direction of the connection lead L1 is equal to or close to 50 μm, the width of the auxiliary connection part F1 can be made wider, so that the auxiliary connection part F1 occupies a larger proportion of the opening C, so as to better repair the detached part of the connection lead L1 by using the auxiliary connection part F1 to fill the opening C. This is conducive to ensuring that the connection lead L1 can maintain normal circuit conduction and improve the yield rate of the connection lead L1. At the same time, it can also help prevent the width of the auxiliary connection part F1 from being too wide, thereby preventing other connection leads L1 adjacent to the connection lead L1 repaired by it from being short-circuited.

[0295] When the width of the auxiliary connection portion F1 along the width direction of the connection lead L1 is equal to or close to 100 μm, the opening C can be better filled to repair the connection lead L1 and improve the yield rate of the connection lead L1. At the same time, the resistance of the auxiliary connection portion F1 can be made smaller, which can improve the loss of the signal transmitted by the repaired connection lead L1 caused by the resistance of the auxiliary connection portion F1.

[0296] In some examples, combined Figure 8 and Fig. 9 As shown, along the width direction of the connecting lead L1, the width of the auxiliary connecting portion F1 ranges from 60 μm to 80 μm.

[0297] When the width of the auxiliary connection part F1 along the width direction of the connecting lead L1 is equal to or close to 60μm, the auxiliary connection part F1 can occupy a larger proportion of the opening C to repair the connecting lead L1 and improve the yield rate of the connecting lead L1; it can also prevent the auxiliary connection part F1 from short-circuiting with other connecting leads L1 adjacent to the connecting lead L1 it repairs.

[0298] When the width of the auxiliary connection part F1 along the width direction of the connecting lead L1 is equal to or close to 90μm, the auxiliary connection part F1 can not only fill the opening C better and improve the yield rate of the connecting lead L1, but also make the resistance of the auxiliary connection part F1 smaller, thereby improving the loss of the signal transmitted by the repaired connecting lead L1 caused by the resistance of the auxiliary connection sub-part F1.

[0299] For example, along the width direction of the connection lead L1 , the width of the auxiliary connection portion F1 is about 50 μm, 60 μm, 70 μm, 80 μm, 90 μm or 100 μm. However, the embodiments of the present disclosure are not limited thereto.

[0300] It should be noted that, in the description, the width of the auxiliary connection portion F1 along the width direction of the connection lead L1 is about 50 μm. Due to certain uncontrollable errors (such as manufacturing process errors, equipment accuracy, measurement errors, etc.), when the error of the width of the auxiliary connection portion F1 fluctuates within the range of 10%×50 μm, it can also be considered that the width of the auxiliary connection portion F1 satisfies 50 μm.

[0301] In addition, in other examples, due to certain uncontrollable errors (such as manufacturing process errors, equipment accuracy, measurement errors, etc.), when the error of the width of the auxiliary connection part F1 fluctuates within the range of 5%×50μm, it can also be considered that the width of the auxiliary connection part F1 satisfies 50μm.

[0302] In some embodiments, in combination Figure 8As shown, the ratio of the overlapping area of ​​the orthographic projection of the auxiliary connection portion F1 on the substrate 01 and the orthographic projection of the opening C on the substrate 01 to the orthographic projection area of ​​the opening C on the substrate 01 is greater than or equal to 50%.

[0303] When the auxiliary connection part F1 is set in the opening C, and the auxiliary connection part F1 is set to connect the connecting lead L1 with the notch C, and the overlapping area of ​​the orthographic projection of the auxiliary connection part F1 on the substrate 01 and the orthographic projection of the opening C on the substrate 01 is set to be equal to or close to 50% of the area of ​​the orthographic projection of the opening C on the substrate 01, the auxiliary connection part F1 can be used to replace more than 50% of the detached part of the connecting lead L1, that is, the connecting lead with the opening C can be better repaired, so that the connecting lead L1 can have better electrical performance, ensuring that the connecting lead L1 can maintain normal circuit conduction, so as to improve the yield rate of the connecting lead L1.

[0304] In some examples, the ratio of the overlapping area of ​​the orthographic projection of the auxiliary connection portion F1 on the substrate 01 and the orthographic projection of the opening C on the substrate 01 to the orthographic projection of the opening C on the substrate 01 is approximately 50%.

[0305] When the auxiliary connection part F1 is set in the opening C, and the auxiliary connection part F1 is set to connect the connecting lead L1 with the notch C, when the overlapping area of ​​the orthographic projection of the auxiliary connection part F1 on the substrate 01 and the orthographic projection of the opening C on the substrate 01 accounts for approximately 50% of the area of ​​the orthographic projection of the opening C on the substrate 01, the auxiliary connection part F1 can be used to connect the connecting lead L1, and the connecting lead with the opening C can be repaired and replaced to ensure that the connecting lead L1 can maintain normal circuit conduction and improve the yield rate of the connecting lead L1.

[0306] In addition, the overlapping area of ​​the orthographic projection of the auxiliary connection portion F1 on the substrate 01 and the orthographic projection of the opening C on the substrate 01 is set to account for about 50% of the area of ​​the orthographic projection of the opening C on the substrate 01, which can also help prevent the auxiliary connection portion F1 from being too large and causing a short circuit with other adjacent connection leads. In addition, resources can be saved.

[0307] It should be noted that, due to certain uncontrollable errors (such as manufacturing process errors, equipment accuracy, measurement errors, etc.), when the error of the proportion of the overlapping area of ​​the orthographic projection of the auxiliary connection part F1 on the substrate 01 and the orthographic projection of the opening C on the substrate 01 to the area of ​​the orthographic projection of the opening C on the substrate 01 fluctuates within the range of 10%×50%, it can also be considered that the overlapping area of ​​the orthographic projection of the auxiliary connection part F1 on the substrate 01 and the orthographic projection of the opening C on the substrate 01, the proportion of the overlapping area of ​​the orthographic projection of the opening C on the substrate 01 to the area of ​​the orthographic projection of the opening C on the substrate 01 satisfies 50%.

[0308] In addition, in other examples, due to certain uncontrollable errors (such as manufacturing process errors, equipment accuracy, measurement errors, etc.), when the error of the proportion of the overlapping area of ​​the orthographic projection of the auxiliary connection part F1 on the substrate 01 and the orthographic projection of the opening C on the substrate 01 to the area of ​​the orthographic projection of the opening C on the substrate 01 fluctuates within the range of 5%×50%, it can also be considered that the overlapping area of ​​the orthographic projection of the auxiliary connection part F1 on the substrate 01 and the orthographic projection of the opening C on the substrate 01, as a proportion of the area of ​​the orthographic projection of the opening C on the substrate 01, satisfies and is equal to 50%.

[0309] In addition, it is understandable that, due to the limitations of equipment and manufacturing processes, the overlapping area of ​​the orthographic projection of an auxiliary connection part F1 on the substrate 01 and the orthographic projection of the opening C on the substrate 01 may not account for 50% of the area of ​​the orthographic projection of the opening C on the substrate 01. In this case, 2, 3 or other multiple auxiliary connection parts F1 may be arranged in the same opening C, so that the sum of the overlapping areas of the orthographic projections of the multiple auxiliary connection parts F1 on the substrate 01 and the orthographic projection of the opening C on the substrate 01 accounts for a proportion of greater than or equal to 50% of the area of ​​the orthographic projection of the opening C on the substrate 01.

[0310] For example, when the overlapping area of ​​the orthographic projection of an auxiliary connection part F1 on the substrate 01 and the orthographic projection of the opening C on the substrate 01 accounts for about 20% of the area of ​​the orthographic projection of the opening C on the substrate 01, three auxiliary connection parts F1 can be arranged in the same opening so that the sum of the overlapping areas of the orthographic projections of the three auxiliary connection parts F1 on the substrate 01 and the orthographic projection of the opening C on the substrate 01 accounts for 60% of the area of ​​the orthographic projection of the opening C on the substrate 01, so as to ensure that the proportion of the area of ​​the orthographic projection of the opening C on the substrate 01 is greater than or equal to 50%. Furthermore, the auxiliary connection part F1 can be used to connect the connecting lead L1, and the connecting lead with the opening C can be repaired and replaced to ensure that the connecting lead L1 can maintain normal circuit conduction and improve the yield rate of the connecting lead L1.

[0311] It should be noted that when multiple auxiliary connection parts F1 are located in the same opening C, the corresponding multiple auxiliary connection parts F1 in the same opening C can be electrically connected to each other. Alternatively, the corresponding multiple auxiliary connection parts F1 in the same opening C can also be arranged at intervals. Regardless of which method is used, as long as each auxiliary connection part F1 is ensured to be in the opening C and connected to the connection lead L1 with the opening C, the auxiliary connection part F1 can be used to repair and replace the part of the opening C formed by the connection lead L1 falling off, so as to ensure that the connection lead L1 can maintain normal circuit conduction.

[0312] In other embodiments, in combination Figure 8As shown, the ratio of the overlapping area of ​​the orthographic projection of the auxiliary connection portion F1 on the substrate 01 and the orthographic projection of the opening C on the substrate 01 to the orthographic projection area of ​​the opening C on the substrate 01 is greater than or equal to 80%.

[0313] When the auxiliary connection part F1 is set in the opening C, and the auxiliary connection part F1 is set to connect the connecting lead L1 with the notch C, and the overlapping area of ​​the orthographic projection of the auxiliary connection part F1 on the substrate 01 and the orthographic projection of the opening C on the substrate 01 is set to be equal to or close to 80% of the area of ​​the orthographic projection of the opening C on the substrate 01, the auxiliary connection part F1 can be used to replace more than 80% of the detached part of the connecting lead L1, that is, the connecting lead with the opening C can be better repaired, so that the connecting lead L1 can have better electrical performance, ensuring that the connecting lead L1 can maintain normal circuit conduction, so as to improve the yield rate of the connecting lead L1.

[0314] In some examples, the ratio of the overlapping area of ​​the orthographic projection of the auxiliary connection portion F1 on the substrate 01 and the orthographic projection of the opening C on the substrate 01 to the orthographic projection of the opening C on the substrate 01 is approximately 80%.

[0315] When the auxiliary connection part F1 is set in the opening C, and the auxiliary connection part F1 is set to connect the connecting lead L1 with the notch C, when the overlapping area of ​​the orthographic projection of the auxiliary connection part F1 on the substrate 01 and the orthographic projection of the opening C on the substrate 01 accounts for approximately 80% of the area of ​​the orthographic projection of the opening C on the substrate 01, the opening C in the connecting lead L1 is basically repaired by using the auxiliary connection part, which can ensure that the connecting lead L1 can maintain normal circuit conduction and improve the yield rate of the connecting lead L1.

[0316] It should be noted that, due to certain uncontrollable errors (such as manufacturing process errors, equipment accuracy, measurement errors, etc.), when the error of the proportion of the overlapping area of ​​the orthographic projection of the auxiliary connection part F1 on the substrate 01 and the orthographic projection of the opening C on the substrate 01 to the area of ​​the orthographic projection of the opening C on the substrate 01 fluctuates within the range of 10%×80%, it can also be considered that the overlapping area of ​​the orthographic projection of the auxiliary connection part F1 on the substrate 01 and the orthographic projection of the opening C on the substrate 01, the proportion of the overlapping area of ​​the orthographic projection of the opening C on the substrate 01 to the area of ​​the orthographic projection of the opening C on the substrate 01 satisfies 80%.

[0317] In addition, in other examples, due to certain uncontrollable errors (such as manufacturing process errors, equipment accuracy, measurement errors, etc.), when the error of the proportion of the overlapping area of ​​the orthographic projection of the auxiliary connection part F1 on the substrate 01 and the orthographic projection of the opening C on the substrate 01 to the area of ​​the orthographic projection of the opening C on the substrate 01 fluctuates within the range of 5%×80%, it can also be considered that the overlapping area of ​​the orthographic projection of the auxiliary connection part F1 on the substrate 01 and the orthographic projection of the opening C on the substrate 01, as a proportion of the area of ​​the orthographic projection of the opening C on the substrate 01, satisfies 80%.

[0318] Fig. 22 1 is a structural diagram of a light-emitting substrate according to some further embodiments.

[0319] In some other embodiments, in combination Fig. 22 As shown, the overlapping area of ​​the orthographic projection of the auxiliary connection portion F1 on the substrate 01 and the orthographic projection of the opening C on the substrate 01 accounts for approximately 100% of the area of ​​the orthographic projection of the opening C on the substrate 01 .

[0320] When the auxiliary connection part F1 is set in the opening C and the auxiliary connection part F1 is set to connect the connecting lead L1 with the notch C, when the ratio of the overlapping area of ​​the orthographic projection of the auxiliary connection part F1 on the substrate 01 and the orthographic projection of the opening C on the substrate 01 to the area of ​​the orthographic projection of the opening C on the substrate 01 is equal to or close to 100%, it is equivalent to the orthographic projection of the auxiliary connection part F1 on the substrate 01 covering the orthographic projection of the opening C on the substrate 01.

[0321] Among them, “the orthographic projection of the auxiliary connection portion F1 on the substrate 01 covers the orthographic projection of the opening C on the substrate 01” includes the following two situations:

[0322] The first type: the orthographic projection of the auxiliary connection portion F1 on the substrate 01 substantially coincides with the orthographic projection of the opening C on the substrate 01 .

[0323] The second type: the orthographic projection of the opening C on the substrate 01 is located within the boundary of the orthographic projection of the auxiliary connection portion F1 on the substrate 01 .

[0324] Regardless of the above situation, the auxiliary connection F1 can be used to completely fill the opening C on the connection lead L1 to complete the connection lead L1. Based on this, it can be helpful to ensure that the connection lead L1 can maintain normal circuit conduction and improve the yield rate of the connection lead L1.

[0325] It should be noted that "substantially coincident" includes absolute coincidence and approximate coincidence. That is, the floating range of the gap between the orthographic projection boundary of the auxiliary connection part F1 on the substrate 01 and the orthographic projection boundary of the opening C on the substrate 01 does not exceed the error threshold, and the auxiliary connection part F1 and the opening C can also be considered to be relatively "coincident". The error threshold can be less than 10% of the length of the line segment with the opening C.

[0326] Fig.23 1 is a structural diagram of a light-emitting substrate according to some further embodiments.

[0327] In some embodiments, see Fig.23 As shown, combined with Fig. 20 The orthographic projection of the auxiliary connecting portion F1 on the substrate 01 covers the orthographic projection of the line segment having the opening C on the substrate 01 .

[0328] The orthographic projection of the auxiliary connection portion F1 on the substrate 01 covers the orthographic projection of the line segment with the opening C on the substrate 01, including the following two cases:

[0329] The first type: the orthographic projection of the auxiliary connection portion F1 on the substrate 01 and the orthographic projection of the line segment having the opening C on the substrate 01 roughly coincide with each other.

[0330] The second type: the orthographic projection of the line segment with the opening C on the substrate 01 is located within the boundary of the orthographic projection of the auxiliary connection portion F1 on the substrate 01 .

[0331] With such a configuration, the overlap area between the auxiliary connection part F1 and the line segment with the opening C can be larger, and the auxiliary connection part F1 can be used to fully repair the line segment with the opening C to ensure that the line segment can maintain normal circuit conduction. At the same time, it can also ensure that the auxiliary connection part F1 is in full contact with the line segment with the opening C, which is conducive to improving the stability of the connection between the auxiliary connection part F1 and the connecting lead L1.

[0332] It should be noted that "substantially coincident" includes absolute coincidence and approximate coincidence. That is, the floating range of the gap between the orthographic projection boundary of the auxiliary connection part F1 on the substrate 01 and the orthographic projection boundary of the opening C on the substrate 01 does not exceed the error threshold, and it can also be considered that the auxiliary connection part F1 and the edge of the line segment are relatively "coincident". Among them, the error threshold can be less than 10% of the length of the line segment with the opening C.

[0333] In some embodiments, continue to refer to Fig.23 And combined Fig.21 As shown, the orthographic projection of the auxiliary connection portion F1 on the substrate 01 covers the orthographic projection of the connection lead L1 having the opening C on the substrate 01 .

[0334] The orthographic projection of the auxiliary connection portion F1 on the substrate 01 covers the orthographic projection of the connection lead L1 having the opening C on the substrate 01, including the following two situations:

[0335] The first type: the orthographic projection of the auxiliary connection portion F1 on the substrate 01 substantially coincides with the orthographic projection of the connection lead L1 having the opening C on the substrate 01 .

[0336] The second type: the orthographic projection of the connection lead L1 having the opening C on the substrate 01 is located within the boundary of the orthographic projection of the auxiliary connection portion F1 on the substrate 01 .

[0337] With such a configuration, the overlap area between the auxiliary connection part F1 and the connection lead L1 with the opening C can be made larger, and the auxiliary connection part F1 can be used to fully repair the connection lead L1 with the opening C to ensure that the connection lead L1 can maintain normal circuit conduction. At the same time, it can also ensure that the auxiliary connection part F1 is in full contact with the connection lead L1 with the opening C, which is conducive to improving the stability of the connection between the auxiliary connection part F1 and the connection lead L1.

[0338] It should be noted that "substantially overlap" includes absolute overlap and approximate overlap. That is, the floating range of the gap between the orthographic projection boundary of the auxiliary connection part F1 on the substrate 01 and the orthographic projection boundary of the connection lead L1 with the opening C on the substrate 01 does not exceed the error threshold, and the auxiliary connection part F1 and the connection lead L1 can also be considered to be relatively "overlapping". The error threshold can be less than 10% of the length of the line segment with the opening C.

[0339] Fig.24 is a structural diagram of a light-emitting substrate according to some further embodiments, Fig.25 for Fig.24 A cross-section diagram along the G-G' direction.

[0340] In some embodiments, please combine Fig.24 and Fig.25 , and return Figure 3 As shown, the light emitting substrate 100 further includes a first electrode 20 , and the first electrode 20 is located on a side of the first main surface S1 away from the second main surface S2 .

[0341] The first electrode 20 can be electrically connected to the light emitting chip 10 and the first end of the connecting lead L1, respectively, so as to realize the electrical connection between the connecting lead L1 and the light emitting chip 10. Subsequently, the connecting lead L1 is electrically connected to the driving circuit board, so that the driving signal provided by the driving circuit board can be transmitted to the light emitting substrate 100 through the connecting lead L1, so as to control the light emitting substrate 100 to display.

[0342] When the first end portion of the connection lead L1 electrically connected to the first electrode 20 includes the opening C, the orthographic projection of the auxiliary connection portion F1 on the substrate 01 may be arranged to at least partially overlap with the orthographic projection of the first electrode 20 on the substrate 01 .

[0343] Based on this, the auxiliary connection part F1 can be used to fill the opening C and connect to the connecting lead L1 to repair the connecting lead L1 to keep the line conductive. At the same time, the area where the auxiliary connection part F1 overlaps and contacts the first electrode 20 can also be used to make an electrical connection to achieve electrical connection between the connecting lead L1 and the first electrode 20. It is ensured that the driving signal provided by the driving circuit board can be transmitted to the light-emitting substrate 100 through the connecting lead L1 to control the light-emitting substrate 100 to display. As a result, it is beneficial to improve the yield rate of the light-emitting substrate 100.

[0344] In some embodiments, the orthographic projection of the auxiliary connection portion F1 on the substrate 01 at least partially overlaps with the orthographic projection of the first electrode 20 on the substrate 01, including the following two situations:

[0345] The first type: the orthographic projection of the auxiliary connection portion F1 on the substrate 01 partially overlaps with the orthographic projection of the first electrode 20 on the substrate 01 .

[0346] When the orthographic projection of the auxiliary connection part F1 on the substrate 01 overlaps with the orthographic projection of the first electrode 20 on the substrate 01, the area where the auxiliary connection part F1 overlaps and contacts the first electrode 20 can be used for electrical connection, so as to realize electrical connection between the connecting lead L1 and the first electrode 20. It is ensured that the driving signal provided by the driving circuit board can be transmitted to the light-emitting substrate 100 through the connecting lead L1, so as to control the light-emitting substrate 100 to display. Therefore, it is beneficial to improve the yield rate of the light-emitting substrate 100.

[0347] The second type: the orthographic projection of the auxiliary connection portion F1 on the substrate 01 covers the orthographic projection of the first electrode on the substrate 01 .

[0348] Such a configuration can make the auxiliary connection part F1 and the first electrode 20 have a larger overlap area, so that the auxiliary connection part F1 can be electrically connected to the first electrode 20 to achieve electrical connection between the connection lead L1 and the first electrode 20. On the other hand, it can be beneficial to improve the stability of the connection between the auxiliary connection part F1 and the first electrode 20, and prevent the auxiliary connection part F1 from falling off from the position of the first electrode 20, resulting in disconnection of the connection lead L1 and the first electrode 20.

[0349] Among them, “the orthographic projection of the auxiliary connection part F1 on the substrate 01 covers the orthographic projection of the first electrode 20 on the substrate 01” may include the following two situations: the orthographic projection of the auxiliary connection part F1 on the substrate 01 roughly overlaps with the orthographic projection of the first electrode on the substrate 01. Alternatively, the orthographic projection of the first electrode on the substrate 01 is located within the boundary of the orthographic projection of the auxiliary connection part F1 on the substrate 01. However, this is not limited in the embodiments of the present disclosure.

[0350] In some embodiments, please combine Fig.21 and Fig. 22 As shown, when the orthographic projection of the auxiliary connection portion F1 on the substrate 01 covers the orthographic projection of the first electrode 20 on the substrate 01, the first spacing between the boundary of the orthographic projection of the auxiliary connection portion F1 on the substrate 01 and the boundary of the orthographic projection of the first electrode 20 on the substrate 01 can be set to be less than or equal to 10μm.

[0351] When a first spacing between a boundary of the orthographic projection of the auxiliary connection portion F1 on the substrate 01 and a boundary of the orthographic projection of the first electrode 20 on the substrate 01 is set to be equal to or close to 10 μm, it is possible to prevent the boundary of the auxiliary connection portion F1 from exceeding the boundary of the first electrode 20 too much, thereby causing a short circuit between other first electrodes 20 adjacent to the first electrode 20 opposite thereto.

[0352] In some examples, a first distance between a boundary of an orthographic projection of the auxiliary connection portion F1 on the substrate 01 and a boundary of an orthographic projection of the first electrode 20 on the substrate 01 is set to be less than or equal to 5 μm.

[0353] When the first spacing between the boundary of the orthographic projection of the auxiliary connection part F1 on the substrate 01 and the boundary of the orthographic projection of the first electrode 20 on the substrate 01 is set to be equal to or close to 5μm, the boundary of the auxiliary connection part F1 can be prevented from exceeding the boundary of the first electrode 20 too much, and space for the auxiliary connection part F1 to overflow its glue can be reserved, thereby preventing the first auxiliary connection part F1 from being too large in size and causing a short circuit between other first electrodes 20 adjacent to the first electrode 20 opposite to it.

[0354] Exemplarily, the first distance between the orthographic projection boundary of the auxiliary connection portion F1 on the substrate 01 and the orthographic projection boundary of the first electrode 20 on the substrate 01 is about 3 μm, 5 μm, 8 μm or 10 μm. However, the embodiments of the present disclosure are not limited thereto.

[0355] Fig.26 for Fig.24 Another cross-sectional view along the G-G' direction.

[0356] In some embodiments, please combine Fig.24 , Fig.26 and return Figure 4 As shown, the light emitting substrate 100 further includes a second electrode 30. The second electrode 30 is located on a side of the second main surface away from the first main surface S1, and the second electrode 30 can be electrically connected to the driving circuit board.

[0357] The first end of the connecting lead L1 is electrically connected to the first electrode 20, and the second end of the connecting lead L1 is electrically connected to the second electrode 30. Thus, the driving signal provided by the driving circuit board can be transmitted to the light-emitting substrate 100 through the connecting lead L1 to control the light-emitting substrate 100 to display.

[0358] When the second end portion of the connection lead L1 electrically connected to the second electrode 30 includes the opening C, the orthographic projection of the auxiliary connection portion F1 on the substrate 01 may be arranged to at least partially overlap with the orthographic projection of the second electrode 30 on the substrate 01 .

[0359] Based on this, the auxiliary connection part F1 can be used to fill the opening C and connect to the connecting lead L1 to repair the connecting lead L1 to keep the line normal. At the same time, the area where the auxiliary connection part F1 overlaps and contacts the second electrode 30 can also be used to make an electrical connection to achieve electrical connection between the connecting lead L1 and the second electrode 30. It is ensured that the driving signal provided by the driving circuit board can be transmitted to the light-emitting substrate 100 through the connecting lead L1 to control the light-emitting substrate 100 to display. As a result, it is beneficial to improve the yield rate of the light-emitting substrate 100.

[0360] In some embodiments, the orthographic projection of the auxiliary connection portion F1 on the substrate 01 at least partially overlaps with the orthographic projection of the second electrode 30 on the substrate 01, including the following two situations:

[0361] The first type: the orthographic projection of the auxiliary connection portion F1 on the substrate 01 partially overlaps with the orthographic projection of the second electrode 30 on the substrate 01 .

[0362] When the orthographic projection of the auxiliary connection part F1 on the substrate 01 overlaps with the orthographic projection of the second electrode 30 on the substrate 01, the overlapping contact area of ​​the auxiliary connection part F1 and the second electrode 30 can be used for electrical connection, so as to realize the electrical connection between the connecting lead L1 and the second electrode 30. It is ensured that the driving signal provided by the driving circuit board can be transmitted to the light-emitting substrate 100 through the connecting lead L1, so as to control the light-emitting substrate 100 to display. Therefore, it is beneficial to improve the yield rate of the light-emitting substrate 100.

[0363] The second type: the orthographic projection of the auxiliary connection portion F1 on the substrate 01 covers the orthographic projection of the first electrode on the substrate 01 .

[0364] Such a configuration can make the auxiliary connection part F1 and the second electrode 30 have a larger overlap area, so that the auxiliary connection part F1 can be electrically connected to the second electrode 30 to achieve electrical connection between the connection lead L1 and the second electrode 30. On the other hand, it can be beneficial to improve the stability of the connection between the auxiliary connection part F1 and the second electrode 30, and prevent the auxiliary connection part F1 from falling off from the position of the second electrode 30, resulting in disconnection of the connection lead L1 and the second electrode 30.

[0365] Among them, “the orthographic projection of the auxiliary connection part F1 on the substrate 01 covers the orthographic projection of the second electrode 30 on the substrate 01” may include the following two situations: the orthographic projection of the auxiliary connection part F1 on the substrate 01 roughly overlaps with the orthographic projection of the first electrode on the substrate 01. Alternatively, the orthographic projection of the first electrode on the substrate 01 is located within the boundary of the orthographic projection of the auxiliary connection part F1 on the substrate 01. However, this is not limited in the embodiments of the present disclosure.

[0366] In some embodiments, the light-emitting substrate 100 may further include a protective layer, which is an insulating material. The protective layer covers the connecting lead L1 and the auxiliary connecting portion F1 corresponding to the connecting lead L1. The protective layer has a certain viscosity, so the protective layer can be used to assist in reinforcing the connecting portion F1 and the connecting lead L1, thereby improving the stability of the connecting lead L1 in the light-emitting substrate 100 and preventing the connecting lead L1 and its auxiliary connecting portion F1 from falling off. The thickness of the protective layer is greater than the sum of the thickness of the connecting lead L1 and the auxiliary connecting portion F1, and the surface of the protective layer is flat at all locations. Based on this, it is beneficial to improve the yield rate of the light-emitting substrate 100.

[0367] In some examples, the material of the protective layer may be at least one of a transparent optical adhesive (OC adhesive) and a fluorinating agent. However, the embodiments of the present disclosure are not limited thereto.

[0368] In addition, the above-mentioned embodiments all take the opening as the connection lead L1 formed due to bumps, scratches or natural falling off, and are not intentionally artificially formed openings. For example, the area where the connection lead L1 is located may have an opening of about 10% or less. Based on this, an auxiliary connection part F1 is added to the light-emitting substrate 100 to repair the fallen connection lead L1. However, the present disclosure is not limited to this. It is understandable that in other embodiments, after the connection lead L1 is formed, it is considered that an opening C is formed in the connection lead L1, and at least part of the auxiliary connection part F1 is arranged in the opening C, and the auxiliary connection part F1 is arranged to be electrically connected to the connection lead L1. Based on this, the auxiliary connection part F1 can be used to replace the structure of the opening area of ​​the connection lead L1. Furthermore, based on the above structure, the auxiliary connection part F1 can be used to adjust other features such as the resistance of the connection lead L1.

[0369] In summary, the formation method of the opening in the connecting lead L1 in the embodiment of the present disclosure may include the above two situations. The first one is non-human operation, and the opening C is formed by the natural falling off of the connecting lead L1. Exemplarily, the opening C is generally irregular in shape. However, the shape of the opening C is not limited to this, and it can also be a regular shape. For example, square, circular, triangular, etc. The second one is human operation, and the opening C is formed in the connecting lead L1 by cutting, etching, etc. Exemplarily, the shape of the opening C is generally regular in shape. For example, square, circular, triangular, etc. However, the shape of the opening C is not limited to this, and it can also be an irregular shape.

[0370] Fig. 27 is a flow chart of a method for manufacturing a light emitting substrate according to some embodiments.

[0371] See also Fig. 27 As shown, some embodiments of the present disclosure provide a method for manufacturing a light-emitting substrate 100, which is used to manufacture the light-emitting substrate 100 described in any of the above embodiments. The light-emitting substrate 100 includes a display area and a peripheral area located on at least one side of the display area. Figure 3 As shown, the light-emitting substrate 100 includes a display area (full name in English: Active Area, referred to as AA area; also referred to as effective display area) AA and a peripheral area SA. The peripheral area SA is located on at least one side of the display area AA (for example, one side; for example, all around, i.e., including the upper and lower sides and the left and right sides).

[0372] The production method includes:

[0373] S01: providing a substrate, the substrate comprising a first main surface and a second main surface opposite to each other in a thickness direction of the substrate, and a side surface between the first main surface and the second main surface, the side surface comprising a set side surface corresponding to a peripheral area.

[0374] S02: forming a plurality of connecting leads in the peripheral region of the substrate, wherein the plurality of connecting leads extend from the first main surface through a set side surface to the second main surface, wherein at least one connecting lead among the plurality of connecting leads comprises at least one opening.

[0375] In step S02, return Figure 5 As shown, after a plurality of connecting leads L1 are formed in the peripheral area SA of the substrate 01, a circuit breaking test is performed on the light emitting substrate 100, and at least some of the plurality of connecting leads L1 in the light emitting substrate 100 are broken.

[0376] The inventors have found that the main reason for the low yield of the connecting lead L1 is that the existing manufacturing process cannot meet the environmental cleanliness requirements of the connecting lead L1, which will cause the connecting lead L1 to partially fall off and form an opening C. The existence of the opening C affects the yield of the connecting lead L1.

[0377] For example, the connection lead L1 may fall off in spots, edges, or a large area, and the above-mentioned falling off may cause openings C of different shapes and sizes to appear in the connection lead L1. Regardless of the existence of any type of opening C, the quality of the connection lead L1 is reduced, that is, the yield rate of the connection lead L1 is reduced.

[0378] Based on the above problems, the manufacturing method of the light-emitting substrate 100 provided in the embodiment of the present disclosure further includes:

[0379] S03: Return Figure 6 and Figure 7 As shown, an auxiliary connection portion is formed on a side of the connection lead away from the substrate, at least a portion of the auxiliary connection portion is located in the opening, and the auxiliary connection portion is connected to the connection lead where the opening is located.

[0380] In step S03, return Figure 8 and Fig. 9 As shown, when an opening C is found to be formed on the connecting lead L1 after the short circuit test, an auxiliary connecting portion F1 can be formed at the position of the opening C to dispose at least part of the auxiliary connecting portion F1 in the opening C, and utilize the auxiliary connecting portion F1 to connect the connecting lead L1 where the opening C is located.

[0381] Based on this, the auxiliary connection part F1 can be used to repair the opening C formed by the connection lead L1 due to the detachment. That is, the auxiliary connection part F1 can replace the detached part of the connection lead L1, so that the connection lead L1 can maintain normal circuit conduction. Therefore, it can be beneficial to improve the yield rate of the connection lead L1.

[0382] In some examples, an auxiliary connection part F1 can be used to repair an opening C. In other examples, a plurality of auxiliary connection parts F1 can be used to repair an opening C. Exemplarily, a plurality of auxiliary connection parts F1 are arranged along the length direction of the opening C so that the plurality of auxiliary connection parts F1 are all disposed within the opening C. In still other examples, a plurality of adjacent openings C can be repaired using an auxiliary connection part F1. Exemplarily, when the connecting lead L1 has a plurality of openings C arranged along a certain direction, an auxiliary connection part F1 extending along the direction can be provided so as to fill the plurality of openings C using the auxiliary connection part F1. However, the embodiments of the present disclosure are not limited to this. In the following, an example of repairing an opening C using an auxiliary connection part F1 is used for description.

[0383] In summary, the embodiment of the present disclosure provides a light-emitting substrate 100, when it is found that the connection lead L1 is formed with an opening C. An auxiliary connection portion F1 can be formed at a position corresponding to the opening C, so that at least part of the auxiliary connection portion F1 is arranged in the opening C, and the auxiliary connection portion F1 is used to connect the connection lead L1 where the opening C is located. Thus, the auxiliary connection portion F1 can be used to replace the part of the connection lead L1 that has fallen off, so that the connection lead L1 can maintain normal circuit conduction. Therefore, it can be beneficial to improve the yield rate of the connection lead L1.

[0384] In some embodiments, please refer to Fig.23 , combined with Figure 5 As shown, in step S02, a plurality of connecting leads are formed in the peripheral area of ​​the substrate, which may include: forming the plurality of connecting leads on the substrate by using a sputtering process (PVD Sputter).

[0385] In some examples, this step may include:

[0386] A protection layer is formed on the substrate 01 , and the protection layer covers the display area AA and exposes the peripheral area SA.

[0387] A metal layer is formed in the peripheral area SA exposed by the protective layer by a sputtering process (PVD Sputter), and the metal line is patterned to form a plurality of connecting leads L1.

[0388] Exemplarily, the metal layer may be laser etched to form a plurality of connecting leads L1.

[0389] In some other examples, this step may include:

[0390] A mask is provided, wherein the mask includes an opening, wherein the opening of the mask corresponds to the shape of a plurality of connecting leads.

[0391] A plurality of connecting leads L1 are formed on the substrate 01 by a sputtering process (PVD Sputter) using a mask.

[0392] Regardless of any of the above-mentioned methods for forming the connection lead L1, they are all formed by a sputtering process (PVD Sputter). The inventors have found through research that the sputtering process (PVD Sputter) has a high requirement for the cleanliness of its working environment in order to ensure the adhesion of the formed metal layer. However, the existing work cannot meet the requirement of the sputtering process (PVD Sputter) for environmental cleanliness, which may cause the connection lead L1 formed by the sputtering process (PVD Sputter) to be easily partially detached, affecting the yield rate of the connection lead L1.

[0393] Based on this, in step S03, forming an auxiliary connection portion on the side of the connecting lead away from the substrate may include: using a three-dimensional printing process to form an auxiliary connection portion on the side of the connecting lead away from the substrate, so that at least part of the auxiliary connection portion F1 is set in the opening C, and using the auxiliary connection portion F1 to connect the connecting lead L1 where the opening C is located.

[0394] Based on this, the auxiliary connection part F1 can be used to repair the opening C formed by the connection lead L1 due to falling off. That is, the auxiliary connection part F1 can replace the part of the connection lead L1 that has fallen off, so that the connection lead L1 can maintain normal circuit conduction. Therefore, it can be helpful to improve the yield rate of the connection lead L1. In addition, by forming the auxiliary connection part F1 using a three-dimensional printing process, the auxiliary connection part F1 can be accurately formed at the position of the opening C of the connection lead L1, thereby improving the accuracy of the positioning of the auxiliary connection part F1.

[0395] However, the embodiments of the present disclosure are not limited thereto, and other processes that can achieve spot repair may also be used.

[0396] The above is only a specific embodiment of the present disclosure, but the protection scope of the present disclosure is not limited thereto. Any changes or substitutions that can be thought of by any person skilled in the art within the technical scope disclosed in the present disclosure should be included in the protection scope of the present disclosure. Therefore, the protection scope of the present disclosure should be based on the protection scope of the claims.

Claims

1. A light-emitting substrate, characterized in that: include: A display area and a peripheral area located on at least one side of the display area; The light-emitting substrate further comprises: A substrate, comprising a first main surface and a second main surface opposite to each other in a thickness direction of the substrate, and a side surface between the first main surface and the second main surface, wherein the side surface comprises a set side surface corresponding to the peripheral area; a plurality of connecting leads, located on the substrate and extending from the first main surface through the set side surface to the second main surface, the plurality of connecting leads being located in the peripheral area; at least one connecting lead of the plurality of connecting leads comprising at least one opening; and, An auxiliary connection portion, at least a portion of which is located in the opening, and the auxiliary connection portion is connected to a connection lead where the opening is located.

2. The light-emitting substrate according to claim 1, characterized in that: The auxiliary connection portion is located in the opening, and the auxiliary connection portion abuts against an edge of the connection lead forming the opening.

3. The light-emitting substrate according to claim 1, characterized in that: The auxiliary connecting portion includes a main body portion and at least one overlapping portion connected to the main body portion; The main body is located in the opening, the overlapping portion is located on a side of the connecting lead away from the substrate, and the overlapping portion contacts the side of the connecting lead away from the substrate.

4. The light-emitting substrate according to claim 3, characterized in that: In a direction from the main body to the overlapping portion, a width of the overlapping portion is greater than or equal to 10 μm.

5. The light-emitting substrate according to claim 1, characterized in that: The connecting lead comprises three line segments connected in sequence, and at least one line segment of the three line segments in the connecting lead comprises the at least one opening; wherein the three line segments are respectively a first line segment located on the first main surface, a third line segment located on the set side surface, and a second line segment located on the second main surface; The auxiliary connection portion is located on the line segment having the opening, and along the extending direction of the line segment having the opening, the length of the auxiliary connection portion is less than or equal to the length of the line segment having the opening.

6. The light-emitting substrate according to claim 1, characterized in that: Along the extending direction of the connecting lead having the opening, the length of the auxiliary connecting portion is less than or equal to the length of the connecting lead having the opening.

7. The light-emitting substrate according to claim 1, characterized in that: In a direction along the width of the connecting lead, a ratio of a width of the auxiliary connecting portion located in the opening to a width of the opening is greater than or equal to 50%.

8. The light emitting substrate according to claim 1, characterized in that: The width of the auxiliary connection portion ranges from 50 μm to 100 μm.

9. The light-emitting substrate according to claim 1, characterized in that: The ratio of the overlapping area of ​​the orthographic projection of the auxiliary connection portion on the substrate and the orthographic projection of the opening on the substrate to the area of ​​the orthographic projection of the opening on the substrate is greater than or equal to 50%.

10. The light emitting substrate according to claim 1, characterized in that: The ratio of the overlapping area of ​​the orthographic projection of the auxiliary connection portion on the substrate and the orthographic projection of the connection lead having the opening on the substrate to the orthographic projection area of ​​the opening on the substrate is greater than or equal to 80%.

11. The light emitting substrate according to claim 1, characterized in that: At least two of the auxiliary connecting parts are located in the same opening.

12. The light emitting substrate according to claim 1, characterized in that: Also includes a first electrode, the first electrode is located on a side of the first main surface away from the second main surface; The first end of the connecting lead is electrically connected to the first electrode, the first end includes the opening, and the orthographic projection of the auxiliary connecting portion on the substrate covers the orthographic projection of the first electrode on the substrate.

13. The light emitting substrate according to claim 12, characterized in that: A first distance between a boundary of an orthographic projection of the auxiliary connection portion on the substrate and a boundary of an orthographic projection of the first electrode on the substrate is less than or equal to 5 μm.

14. The light emitting substrate according to claim 1, characterized in that: The square resistance of the auxiliary connection portion is less than or equal to the square resistance of the connection lead.

15. The light emitting substrate according to claim 1, characterized in that: The thickness of the auxiliary connection portion ranges from 5 μm to 20 μm.

16. The light emitting substrate according to claim 1, characterized in that: The material of the auxiliary connection part includes conductive glue.

17. The light emitting substrate according to claim 1, characterized in that: The material of the connecting lead includes metal.

18. A method for manufacturing a light-emitting substrate, characterized in that: The light-emitting substrate comprises a display area and a peripheral area located on at least one side of the display area, and the manufacturing method comprises: Providing a substrate, the substrate comprising a first main surface and a second main surface opposite to each other in a thickness direction of the substrate, and a side surface located between the first main surface and the second main surface, the side surface comprising a set side surface corresponding to the peripheral area; A plurality of connecting leads are formed in the peripheral region of the substrate, and the plurality of connecting leads extend from the first main surface through the set side surface to the second main surface; wherein at least one connecting lead among the plurality of connecting leads includes at least one opening; An auxiliary connection portion is formed on a side of the connection lead away from the substrate, at least a portion of the auxiliary connection portion is located in the opening, and the auxiliary connection portion is connected to the connection lead where the opening is located.

19. The manufacturing method according to claim 18, characterized in that: The forming of a plurality of connecting leads in the peripheral region of the substrate comprises: forming the plurality of connecting leads on the substrate by a sputtering process; The auxiliary connection portion is formed on a side of the connection lead away from the substrate, comprising: An auxiliary connection portion is formed on a side of the connection lead away from the substrate by using a three-dimensional printing process, so that at least a portion of the auxiliary connection portion is located in the opening, and the auxiliary connection portion is connected to the connection lead where the opening is located.

20. A display device, characterized in that: The light-emitting substrate comprises the light-emitting substrate as claimed in any one of claims 1 to 17.

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