Display panel, preparation method thereof and display device

Abstract

The invention provides a display panel and a preparation method thereof and a display device, and relates to the technical field of display, the display panel comprises a substrate, a pixel definition layer, an isolation structure and a protection layer, the pixel definition layer is located at one side of the substrate along the thickness direction, the isolation structure is located at one side of the pixel definition layer away from the substrate, and a plurality of isolation openings are defined, the protection layer is arranged in the at least one isolation opening, is located on the side, away from the substrate, of the pixel definition layer, and is adjacent to the pixel definition layer. According to the display panel provided by the invention, the use performance of the display device can be improved.

Description

Technical Field

[0001] The present application belongs to the field of display technology, and more specifically, relates to a display panel and a preparation method thereof, and a display device. Background Art

[0002] Currently, flat panel display devices have the advantages of high image quality, power saving, compact size and wide application range, and are used in various consumer electronic products such as mobile phones, televisions, laptops, desktop computers, etc.

[0003] However, the performance and process performance of current display products need to be improved. Summary of the invention

[0004] The purpose of the embodiments of the present application is to provide a display panel and a method for manufacturing the same, and a display device, so as to improve the performance / process performance of the display device.

[0005] To achieve the above purpose, the technical solution adopted in this application is:

[0006] In a first aspect, a display panel is provided, comprising: a substrate, a pixel definition layer, an isolation structure and a protective layer, wherein the pixel definition layer is located on one side of the substrate along the thickness direction, the isolation structure is located on the side of the pixel definition layer away from the substrate and defines a plurality of isolation openings, and the protective layer is arranged in at least one isolation opening, the protective layer is located on the side of the pixel definition layer away from the substrate and is adjacent to the pixel definition layer.

[0007] Through the above technical solution, the display panel provided by the present application can use a protective layer to protect the pixel definition layer to avoid damage to the pixel definition layer, and can avoid affecting the electrode on the side of the pixel definition layer facing the substrate, thereby improving reliability and avoiding affecting the luminous effect to a certain extent.

[0008] Therefore, the display panel provided by the present application can improve the performance of the display device.

[0009] In some embodiments, the pixel definition layer defines a plurality of pixel openings, the pixel openings are located in corresponding isolation openings, and in the same isolation opening, an orthographic projection of the protection layer on the substrate is spaced apart from an orthographic projection of the pixel opening on the substrate.

[0010] In some embodiments, the plurality of isolation openings include a first isolation opening, a second isolation opening, and a third isolation opening, and the protection layer is disposed inside at least one of the second isolation opening and the third isolation opening.

[0011] In some embodiments, the protection layer includes a first protection layer and a second protection layer, the first protection layer is disposed in the second isolation opening, and the second protection layer is disposed in the third isolation opening.

[0012] In some embodiments, the thickness of the first protective layer is less than or equal to the thickness of the second protective layer; and / or, the material of the first protective layer is different from the material of the second protective layer.

[0013] In some embodiments, the pixel definition layer defines a first pixel opening, a second pixel opening, and a third pixel opening, the first pixel opening is located in the first isolation opening, the second pixel opening is located in the second isolation opening, the third pixel opening is located in the third isolation opening, the first protective layer is arranged at an interval between the orthographic projection of the substrate and the orthographic projection of the second pixel opening on the substrate, and / or the second protective layer is arranged at an interval between the orthographic projection of the substrate and the orthographic projection of the third pixel opening on the substrate.

[0014] In some embodiments, the material of the protection layer is different from the material of the pixel definition layer.

[0015] Optionally, the material of the protection layer includes an inorganic material, and the material of the pixel definition layer includes an inorganic material.

[0016] Optionally, the etching selectivity of the inorganic material of the protection layer is greater than or equal to the etching selectivity of the inorganic material of the pixel definition layer.

[0017] Optionally, the inorganic material of the protection layer includes one of silicon oxide and silicon oxynitride, and the inorganic material of the pixel definition layer includes silicon nitride.

[0018] In some embodiments, the display panel provided in the present application also includes a light-emitting unit, which includes a first electrode, a light-emitting layer, and a second electrode stacked in sequence along a direction away from the substrate, the first electrode is arranged at intervals on one side of the substrate, the pixel definition layer is arranged on the side of the first electrode away from the substrate, the pixel definition layer defines a plurality of pixel openings, the pixel openings are located in corresponding isolation openings, the pixel openings expose a portion of the first electrode, the orthographic projection of the light-emitting layer on the substrate is located in the orthographic projection of the second electrode on the substrate, and the protective layer is located on the side of the second electrode facing the substrate and is adjacent to the second electrode.

[0019] Optionally, an orthographic projection of the protective layer on the substrate does not overlap with an orthographic projection of the light-emitting layer on the substrate.

[0020] Optionally, the light emitting layer covers a portion of the protection layer close to the pixel opening.

[0021] In some embodiments, the display panel provided in the present application further includes a first packaging layer and a plurality of light-emitting units, wherein at least part of the light-emitting unit is located within the orthographic projection of the corresponding isolation opening on the substrate, and the first packaging layer is located on the side of the light-emitting unit facing away from the substrate.

[0022] Optionally, the material of the protection layer is different from the material of the first encapsulation layer.

[0023] Optionally, the material of the protection layer includes an inorganic material, and the material of the first encapsulation layer includes an inorganic material.

[0024] Optionally, the inorganic material of the protective layer includes one of silicon nitride, silicon oxide and silicon oxynitride, and the inorganic material of the first encapsulation layer includes another of silicon nitride, silicon oxide and silicon oxynitride.

[0025] Optionally, the inorganic material of the protective layer includes one of silicon oxide and silicon oxynitride, and the inorganic material of the first encapsulation layer includes silicon nitride.

[0026] Optionally, the material of the protection layer is the same as that of the first encapsulation layer.

[0027] In some embodiments, the isolation structure includes a base portion, a support portion, and an eave portion stacked in sequence in a direction away from the substrate, and the protective layer is connected to the base portion on one side close to the isolation structure.

[0028] Optionally, an orthographic projection of the protective layer on the substrate does not overlap with an orthographic projection of the base portion on the substrate.

[0029] Optionally, an orthographic projection of the protective layer on the substrate is located within an orthographic projection of the eaves portion on the substrate.

[0030] In some embodiments, the isolation structure includes a base portion, a support portion, and an eaves portion stacked in sequence in a direction away from the substrate, and the base portion covers a portion of the protective layer close to the isolation structure.

[0031] Optionally, an orthographic projection of the support portion on the substrate is located within an orthographic projection of the base portion on the substrate.

[0032] Optionally, an orthographic projection of the base portion on the substrate is located within an orthographic projection of the eave portion on the substrate.

[0033] In some embodiments, the thickness of the protective layer is less than or equal to the thickness of the base portion.

[0034] In some embodiments, the protective layer has a thickness less than or equal to 200 angstroms.

[0035] In some embodiments, the protection layer is in contact with the isolation structure near a side of the isolation structure.

[0036] Optionally, the isolation structure includes a base portion, a support portion and an eave portion which are stacked in sequence in a direction away from the substrate, and the protective layer is in contact with the base portion at a side surface close to the isolation structure.

[0037] In a second aspect, the present application provides a method for preparing a display panel, the method comprising:

[0038] providing a substrate;

[0039] Preparing a pixel definition layer and a protective layer on one side of the substrate along the thickness direction;

[0040] An isolation structure is prepared on a side of the pixel definition layer facing away from the substrate, and a plurality of isolation openings are formed by patterning;

[0041] The protection layer is disposed in at least one isolation opening, and is adjacent to the pixel definition layer.

[0042] In some embodiments, a pixel definition layer and a protective layer are prepared on one side of a substrate along a thickness direction, comprising:

[0043] Preparing a pixel definition layer on one side of the substrate along the thickness direction;

[0044] A protective layer is formed on the side of the pixel definition layer facing away from the substrate.

[0045] In some embodiments, a pixel definition layer and a protective layer are prepared on one side of a substrate along a thickness direction, comprising:

[0046] Preparing a pixel definition layer and a protective layer on one side of the substrate along the thickness direction;

[0047] Portions of the protective layer in the first area and the second area are removed, and the isolation structure includes a base portion, a support portion and an eaves portion which are stacked in sequence along a direction away from the substrate, an orthographic projection of the first area on the substrate overlaps with at least a portion of an orthographic projection of the base portion on the substrate, the first area surrounds the second area, and the first area and the second area are spaced apart.

[0048] In some embodiments, after preparing the isolation structure on the side of the pixel definition layer facing away from the substrate, the preparation method further includes:

[0049] The pixel definition layer is patterned to form a plurality of pixel openings.

[0050] In some embodiments, after preparing the isolation structure on the side of the pixel definition layer facing away from the substrate, the preparation method further includes:

[0051] Prepare a light-emitting unit and a first encapsulation layer on a side of the substrate facing the isolation structure;

[0052] Prepare a second encapsulation layer on a side of the first encapsulation layer facing away from the substrate;

[0053] A third encapsulation layer is formed on the side of the second encapsulation layer facing away from the substrate.

[0054] In some embodiments, the plurality of isolation openings include a first isolation opening, a second isolation opening, and a third isolation opening, the pixel definition layer defines a first pixel opening, a second pixel opening, and a third pixel opening, the first pixel opening is located in the first isolation opening, the second pixel opening is located in the second isolation opening, and the third pixel opening is located in the third isolation opening, the light-emitting unit includes a first light-emitting unit, a second light-emitting unit, and a third light-emitting unit, and the first encapsulation layer includes a first encapsulation portion, a second encapsulation portion, and a third encapsulation portion; the light-emitting unit and the first encapsulation layer are prepared on a side of the substrate facing the isolation structure, including:

[0055] preparing a first light emitting unit in the first pixel opening;

[0056] Prepare a first encapsulation portion on a side of the first light-emitting unit facing away from the substrate;

[0057] preparing a second light emitting unit in the second pixel opening;

[0058] Prepare a second encapsulation portion on a side of the second light-emitting unit facing away from the substrate;

[0059] preparing a third light emitting unit in the third pixel opening;

[0060] A third encapsulation portion is prepared on a side of the third light emitting unit facing away from the substrate.

[0061] In a third aspect, the present application provides a display device, comprising the display panel of the above embodiment. BRIEF DESCRIPTION OF THE DRAWINGS

[0062] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative labor.

[0063] Figure 1 A schematic diagram of the structure of the display panel during the preparation process provided in the embodiment of the present application Figure 1 ;

[0064] Figure 2 A schematic diagram of the structure of the display panel during the preparation process provided in the embodiment of the present application Figure 2 ;

[0065] Figure 3 A schematic diagram of the structure of the display panel during the preparation process provided in the embodiment of the present application Figure 3 ;

[0066] Figure 4 for Figure 3 A partial enlargement of the middle A Figure 1 ;

[0067] Figure 5 for Figure 3 A partial enlargement of the middle A Figure 2 ;

[0068] Figure 6 for Figure 3 A partial enlargement of the middle A Figure 3 ;

[0069] Figure 7 Schematic diagram of the structure of the display panel provided in the embodiment of the present application Figure 1 ;

[0070] Figure 8 for Figure 7 A partial enlargement of point B in the middle Figure 1 ;

[0071] Fig. 9 for Figure 7 A partial enlargement of point B in the middle Figure 2 ;

[0072] Fig.10 for Figure 7 A partial enlargement of point B in the middle Figure 3 ;

[0073] Fig.11 Schematic diagram of the structure of the display panel provided in the embodiment of the present application Figure 2 ;

[0074] Fig.12 Schematic diagram of the preparation method provided in the embodiment of the present application Figure 1 ;

[0075] Fig.13 Schematic diagram of the preparation method provided in the embodiment of the present application Figure 2 ;

[0076] Fig.14 Schematic diagram of the preparation method provided in the embodiment of the present application Figure 3 ;

[0077] Fig.15 Schematic diagram of the preparation method provided in the embodiment of the present application Figure 4 .

[0078] Among them, the reference numerals in the figure are:

[0079] 01-photoresist; 10-substrate; 20-first electrode; 30-pixel definition layer; 31-first notch; 32-second notch; 33-protective layer; 331-first protective layer; 332-second protective layer; 40-isolation structure; 41-first isolation opening; 42-second isolation opening; 43-third isolation opening; 50-light-emitting layer; 51-first light-emitting layer; 52-second light-emitting layer; 53-third light-emitting layer; 60-second electrode; 70-first encapsulation layer; 71-first encapsulation part; 72-second encapsulation part; 73-third encapsulation part; 80-second encapsulation layer; 90-third encapsulation layer. DETAILED DESCRIPTION

[0080] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present application more clearly understood, the present application is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application.

[0081] It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it can be directly on the other element or indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or indirectly connected to the other element.

[0082] It should be understood that the terms "length", "width", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0083] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of this application, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0084] An embodiment of the present application provides a display panel, which may be an organic light-emitting diode (OLED) display panel, a micro light-emitting diode (Micro LED / μLED) display panel, or a liquid crystal display (LCD) display panel.

[0085] The embodiment of the present application is described by taking the display panel being an OLED display panel as an example.

[0086] The display panel provided in the embodiment of the present application includes a substrate 10. The substrate 10 may include a driving device layer. The specific structures of the substrate 10 and the driving device layer are not described in detail herein.

[0087] The display panel provided in the embodiment of the present application further includes a pixel definition layer 30 (Pixel Define Layer, PDL), and the pixel definition layer 30 is located on one side of the substrate 10 along the thickness direction. Exemplarily, the material of the pixel definition layer 30 may include an inorganic material. Of course, in some application scenarios, the material of the pixel definition layer 30 may include an organic material. Exemplarily, the inorganic material of the pixel definition layer 30 may include one of silicon nitride (SiN), silicon oxide (SiO) and silicon oxynitride (SiON). Exemplarily, the inorganic material of the pixel definition layer 30 may include silicon nitride.

[0088] The display panel provided in the embodiment of the present application further includes an isolation structure 40, which is located on the side of the pixel definition layer 30 away from the substrate 10 and defines a plurality of isolation openings, and the protection layer 33 is disposed in at least one isolation opening. It is understood that the isolation openings can be formed by patterning.

[0089] Exemplarily, the plurality of isolation openings may include a first isolation opening 41, a second isolation opening 42, and a third isolation opening 43. For example, the plurality of isolation openings are divided into three parts, the isolation openings of the first part are the first isolation openings 41, the isolation openings of the second part are the second isolation openings 42, and the isolation openings of the third part are the third isolation openings 43.

[0090] Exemplarily, the isolation structure 40 may include a base portion, a support portion, and an eave portion that are sequentially stacked in a direction away from the substrate 10 .

[0091] The composition, preparation, etc. of the isolation structure 40 are described in patents CN118251982A, 202410864269.8, PCT / CN2024 / 098407, PCT / CN2024 / 102783, PCT / CN2024 / 098217, PCT / CN2024 / 099419, PCT / CN2024 / 099072, CN 117979755A, CN117998900A, CN117062489A, CN117580403A, CN116583155A, CN116669477A, ​​CN117396039A, CN116669480A, CN116600606A, and CN117500332A for reference.

[0092] The display panel provided in the embodiment of the present application further includes a light emitting unit. The light emitting unit and the isolation structure 40 are located on the same side of the substrate 10 , and the orthographic projection of the light emitting unit on the substrate 10 is located within the orthographic projection of the isolation opening on the substrate 10 .

[0093] There may also be multiple light-emitting units, which may include a first light-emitting unit, a second light-emitting unit and a third light-emitting unit. The first light-emitting unit is arranged corresponding to the first isolation opening 41, the orthographic projection of the first light-emitting unit on the substrate 10 is located within the orthographic projection of the first isolation opening 41 on the substrate 10, the orthographic projection of the second light-emitting unit on the substrate 10 is located within the orthographic projection of the second isolation opening 42 on the substrate 10, and the orthographic projection of the third light-emitting unit on the substrate 10 is located within the orthographic projection of the third isolation opening 43 on the substrate 10.

[0094] It is understood that the first light emitting unit, the second light emitting unit and the third light emitting unit can emit light of different colors. The first light emitting unit can emit green light, the second light emitting unit can emit blue light, and the third light emitting unit can emit red light. Alternatively, the first light emitting unit can emit red light, the second light emitting unit can emit green light, and the third light emitting unit can emit blue light. Alternatively, the first light emitting unit can emit blue light, the second light emitting unit can emit red light, and the third light emitting unit can emit green light.

[0095] It is understood that the driving device layer can be electrically connected to the light-emitting unit to provide a signal to the light-emitting unit. The light-emitting unit includes a first electrode 20, a light-emitting layer 50, and a second electrode 60 arranged in sequence in a direction away from the substrate 10. The first electrode 20 can be an anode, and the second electrode 60 can be a cathode. The light-emitting layer 50 of the first light-emitting unit can be a first light-emitting layer 51, the light-emitting layer 50 of the second light-emitting unit can be a second light-emitting layer 52, and the light-emitting layer 50 of the third light-emitting unit can be a third light-emitting layer 53.

[0096] The first electrode 20 is disposed at intervals on one side of the substrate 10, the pixel definition layer 30 is disposed on the side of the first electrode 20 away from the substrate 10, the pixel definition layer 30 defines a plurality of pixel openings, the pixel openings are located in the corresponding isolation openings, and the pixel openings expose a portion of the first electrode 20.

[0097] Please also read Figure 1 , Figure 2 and Figure 3 In some implementations, when preparing the display panel provided in the embodiment of the present application, the first light-emitting unit, the second light-emitting unit and the third light-emitting unit are prepared in sequence. For example, when preparing the first light-emitting unit, a pixel opening is first prepared to expose the first electrode 20, and then the first light-emitting layer 51 and the second electrode 60 are vapor-deposited on the entire surface, and then the first light-emitting layer 51 and the second electrode 60 are covered with a photoresist 01 in a patterned manner and only the first light-emitting layer 51 and the second electrode 60 are retained in the first isolation opening 41. That is, the orthographic projection of the first light-emitting layer 51 and the second electrode 60 in the first isolation opening 41 is located within the orthographic projection of the photoresist 01 on the substrate 10, and the first light-emitting layer 51 and the second electrode 60 in the second isolation opening 42 and the third isolation opening 43 are etched away.

[0098] Similarly, when preparing the second light-emitting unit, a pixel opening is first prepared to expose the first electrode 20, and then the second light-emitting layer 52 and the second electrode 60 are vapor-deposited on the entire surface, and then patterning is performed to retain only the second light-emitting layer 52 and the second electrode 60 in the second isolation opening 42. The second light-emitting layer 52 and the second electrode 60 in the first isolation opening 41 and the third isolation opening 43 are etched away.

[0099] The inventors found that when preparing the first light-emitting unit, the portion of the pixel definition layer 30 in the second isolation opening 42 and the third isolation opening 43 is easily damaged, especially the portion of the pixel definition layer 30 in the second isolation opening 42 close to the isolation structure 40 is easily damaged to produce the first notch 31, and the portion of the pixel definition layer 30 in the third isolation opening 43 close to the isolation structure 40 is easily damaged to produce the second notch 32. In addition, the portion of the pixel definition layer 30 in the third isolation opening 43 is more likely to form the second notch 32 after two rounds of patterning.

[0100] Of course, in some embodiments, when preparing the display panel, the first light emitting unit, the third light emitting unit and the second light emitting unit are prepared in sequence. In this way, the portion of the pixel definition layer 30 in the second isolation opening 42 undergoes two rounds of patterning, making it easier to form the first gap 31 .

[0101] Please also read Figure 4 , Figure 5 and Figure 6In some cases, both the first notch 31 and the second notch 32 expose the first electrode 20. In some cases, the second notch 32 exposes the first electrode 20, and the first notch 31 does not expose the first electrode 20. In some cases, the first notch 31 exposes the first electrode 20, and the second notch 32 does not expose the first electrode 20.

[0102] As a result, when the second light-emitting unit and / or the third light-emitting unit are subsequently prepared, the first electrode 20 may be damaged.

[0103] Please also read Figure 7 , Figure 8 , Fig. 9 and Fig.10 In order to solve the above technical problems, the display panel provided in the embodiment of the present application also includes a protective layer 33, which is located on the side of the pixel definition layer 30 away from the substrate 10 and is adjacent to the pixel definition layer 30, so that there is no gap between the protective layer 33 and the isolation structure 40.

[0104] In this way, the display panel provided by the present application can utilize the protective layer 33 to protect the pixel definition layer 30, avoid damage to the pixel definition layer 30, and avoid affecting the electrode (first electrode 20) on the side of the pixel definition layer 30 facing the substrate 10, thereby improving reliability and avoiding affecting the luminous effect to a certain extent.

[0105] Therefore, the display panel provided by the present application can improve the performance of the display device.

[0106] In some embodiments, the pixel definition layer 30 defines a plurality of pixel openings, and the pixel openings are located in corresponding isolation openings. In the same isolation opening, the orthographic projection of the protection layer 33 on the substrate 10 is spaced from the orthographic projection of the pixel opening on the substrate 10. In this way, the protection layer 33 will not completely cover the portion of the pixel definition layer 30 in the corresponding isolation opening, which is conducive to reducing the thickness of the film layer.

[0107] In some embodiments, the material of the protective layer 33 is different from that of the pixel definition layer 30. Due to the etching selectivity, when etching the light-emitting layer 50 and the second electrode 60 of the light-emitting unit, even if the protective layer 33 is greatly damaged, it is not easy to damage the pixel definition layer 30. This arrangement can improve the protective effect of the protective layer 33 on the pixel definition layer 30.

[0108] Optionally, the material of the protection layer 33 includes an inorganic material, and the material of the pixel definition layer 30 includes an inorganic material.

[0109] Optionally, the etching selectivity of the inorganic material of the protection layer 33 is greater than or equal to the etching selectivity of the inorganic material of the pixel definition layer 30 .

[0110] Optionally, the inorganic material of the protection layer 33 includes one of silicon oxide and silicon oxynitride, and the inorganic material of the pixel definition layer 30 includes silicon nitride.

[0111] In some embodiments, the protection layer 33 is disposed inside at least one of the second isolation opening 42 and the third isolation opening 43. Figure 8 For example, the protective layer 33 may be disposed in the second isolation opening 42 and the third isolation opening 43 , that is, the protective layer 33 is disposed in the portion of the pixel definition layer 30 in the second isolation opening 42 and the third isolation opening 43 . Fig. 9 , illustratively, the protection layer 33 may be disposed only in the third isolation opening 43, that is, the protection layer 33 is disposed in the portion of the pixel definition layer 30 in the second isolation opening 42. Fig.10 Exemplarily, the protection layer 33 may be disposed only in the second isolation opening 42 , that is, the protection layer 33 is disposed in the portion of the pixel definition layer 30 in the second isolation opening 42 .

[0112] In some embodiments, the protective layer 33 includes a first protective layer 331, which can be disposed in the second isolation opening 42, that is, the protective layer 33 disposed in the second isolation opening 42 is the first protective layer 331. The protective layer 33 also includes a second protective layer 332, which is disposed in the third isolation opening 43, that is, the protective layer 33 disposed in the third isolation opening 43 is the second protective layer 332.

[0113] It can be understood that the pixel definition layer 30 defines a first pixel opening, a second pixel opening, and a third pixel opening, that is, the plurality of pixel openings may include a first pixel opening, a second pixel opening, and a third pixel opening, and the plurality of pixel openings include three parts, the pixel openings of the first part are the first pixel openings, the pixel openings of the second part are the second pixel openings, and the pixel openings of the third part are the second pixel openings. The first pixel opening is located in the first isolation opening 41, the second pixel opening is located in the second isolation opening 42, and the third pixel opening is located in the third isolation opening 43.

[0114] Optionally, the orthographic projection of the first protection layer 331 on the substrate 10 is spaced from the orthographic projection of the second pixel opening on the substrate 10. In this way, the first protection layer 331 will not completely cover the portion of the pixel definition layer 30 in the second isolation opening 42, which is beneficial to reducing the film thickness.

[0115] Optionally, the orthographic projection of the second protection layer 332 on the substrate 10 is spaced from the orthographic projection of the third pixel opening on the substrate 10. In this way, the second protection layer 332 will not completely cover the portion of the pixel definition layer 30 in the third isolation opening 43, which is beneficial to reduce the film thickness.

[0116] In some embodiments, the thickness of the first protective layer 331 is less than or equal to the thickness of the second protective layer 332. It is understood that when the second light-emitting unit is prepared before the third light-emitting unit, the first protective layer 331 undergoes one round of etching, and the second protective layer 332 undergoes two rounds of etching, and the second protective layer 332 is more susceptible to damage. Therefore, the thickness of the first protective layer 331 can be less than or equal to the thickness of the second protective layer 332, and the protective effect of the second protective layer 332 can be guaranteed.

[0117] In some embodiments, the material of the first protective layer 331 is different from the material of the second protective layer 332. Also due to the etching selectivity, when the light-emitting layer 50 and the second electrode 60 of the light-emitting unit are etched, the first protective layer 331 and the second protective layer 332 will not be damaged at the same time, which is beneficial to improve the reliability of the protective layer 33.

[0118] In some embodiments, the orthographic projection of the light emitting layer 50 on the substrate 10 is located within the orthographic projection of the second electrode 60 on the substrate 10, the protective layer 33 is located on the side of the second electrode 60 facing the substrate 10, and the protective layer 33 is adjacent to the second electrode 60. The protective layer 33 may be on the side of the second electrode 60 facing the pixel definition layer 30, and the protective layer 33 may protect the pixel definition layer 30.

[0119] Exemplarily, the orthographic projection of the protective layer 33 on the substrate 10 does not overlap with the orthographic projection of the light emitting layer 50 on the substrate 10. In this way, the light emitting layer 50 will not overlap the side of the protective layer 33 away from the substrate 10, and the protective layer 33 can block the light emitting layer 50 and the isolation structure 40 to a certain extent.

[0120] For example, the light emitting layer 50 may also cover the portion of the protective layer 33 close to the pixel opening. There may be a height difference between the light emitting layer 50 and the pixel definition layer 30, which may prevent the light emitting layer 50 from climbing to the isolation structure 40 to a certain extent.

[0121] See also Fig.11 In some embodiments, the display panel provided by the present application further includes a first encapsulation layer 70, which is located on the side of the light-emitting unit facing away from the substrate 10. The first encapsulation layer 70 is also located on the side of the light-emitting unit facing away from the substrate 10, and the first encapsulation layer 70 can encapsulate the light-emitting unit. The protective layer 33 is located on the side of the first encapsulation layer 70 facing the substrate 10.

[0122] For example, the first encapsulation layer 70 may be prepared by chemical vapor deposition (CVD) technology.

[0123] The material of the protective layer 33 is different from that of the first encapsulation layer 70. Also due to the etching selectivity, when the first encapsulation layer 70, the light emitting layer 50 and the second electrode 60 are etched, the protective layer 33 is not easily damaged.

[0124] Optionally, the material of the protection layer 33 includes an inorganic material, and the material of the first encapsulation layer 70 includes an inorganic material.

[0125] Optionally, the inorganic material of the protection layer 33 includes one of silicon nitride, silicon oxide and silicon oxynitride, and the inorganic material of the first encapsulation layer 70 includes another of silicon nitride, silicon oxide and silicon oxynitride.

[0126] Optionally, the inorganic material of the protection layer 33 includes one of silicon oxide and silicon oxynitride, and the inorganic material of the first encapsulation layer 70 includes silicon nitride.

[0127] In another example, the material of the protective layer 33 may be the same as that of the first encapsulation layer 70. Although the material of the protective layer 33 is the same as that of the first encapsulation layer 70, the protective layer 33 may cover part of the pixel definition layer 30, and the protective layer 33 may still protect the pixel definition layer 30.

[0128] In some embodiments, the isolation structure 40 includes a base portion, a support portion, and an eaves portion stacked in sequence in a direction away from the substrate 10, and the side of the protective layer 33 close to the isolation structure 40 is connected to the base portion. In this way, there is no gap between the protective layer 33 and the base portion, thereby preventing the etching gas or etching liquid from passing through the gap between the protective layer 33 and the base portion to damage the pixel definition layer 30.

[0129] Optionally, the orthographic projection of the protective layer 33 on the substrate 10 does not overlap with the orthographic projection of the base on the substrate 10. In this way, the protective layer 33 will not overlap the side of the base away from the substrate 10, avoiding the second electrode 60 protruding in the direction away from the substrate 10.

[0130] Optionally, the orthographic projection of the protection layer 33 on the substrate 10 is located within the orthographic projection of the eaves portion on the substrate 10 .

[0131] Exemplarily, the thickness of the protection layer 33 is less than or equal to the thickness of the base portion.

[0132] For example, the thickness of the protective layer 33 is less than or equal to 200 angstroms (A). For example, the thickness of the protective layer 33 can be 25 angstroms, 50 angstroms, 75 angstroms, 100 angstroms, 125 angstroms, 150 angstroms, 175 angstroms, 200 angstroms, etc.

[0133] In other embodiments, the base portion may cover a portion of the protection layer 33 close to the isolation structure 40 , which can prevent the etching gas or etching solution from passing through the gap between the protection layer 33 and the isolation structure 40 to cause damage to the pixel definition layer 30 to a certain extent.

[0134] Exemplarily, the orthographic projection of the support portion on the substrate 10 is located within the orthographic projection of the base portion on the substrate 10 .

[0135] Exemplarily, the orthographic projection of the base portion on the substrate 10 is located within the orthographic projection of the eave portion on the substrate 10 .

[0136] In some embodiments, the side of the protective layer 33 close to the isolation structure 40 is in contact with the isolation structure 40, so that there is no gap between the side of the protective layer 33 close to the isolation structure 40 and the isolation structure 40. In this way, the display panel provided by the embodiment of the present application can use the protective layer 33 to protect the pixel definition layer 30, so as to prevent the etching gas or etching liquid from passing through the gap between the protective layer 33 and the isolation structure 40 to damage the pixel definition layer 30, and avoid affecting the first electrode 20, thereby improving reliability and avoiding affecting the light-emitting effect to a certain extent.

[0137] Optionally, the side of the protective layer 33 close to the isolation structure 40 is in contact with the base. In this way, there is no gap between the side of the protective layer 33 close to the isolation structure 40 and the base, so that the etching gas or etching liquid is prevented from passing through the gap between the side of the protective layer 33 close to the isolation structure 40 and the base to damage the pixel definition layer 30.

[0138] Please continue reading Fig.11 In some embodiments, the display panel of the embodiment of the present application further includes a second encapsulation layer 80, which is located on the side of the first encapsulation layer 70 away from the substrate 10, and the second encapsulation layer 80 can encapsulate the first encapsulation layer 70 and the isolation structure 40. Exemplarily, the material of the second encapsulation layer 80 may include an organic material. Exemplarily, the second encapsulation layer 80 may be prepared by inkjet printing (IJP) technology.

[0139] Optionally, the display panel of the embodiment of the present application further includes a third encapsulation layer 90, which is located on the side of the second encapsulation layer 80 away from the substrate 10, and the third encapsulation layer 90 can encapsulate the second encapsulation layer 80. Exemplarily, the material of the third encapsulation layer 90 includes an inorganic material. Exemplarily, the third encapsulation layer 90 can be prepared by chemical vapor deposition (CVD) technology.

[0140] See also Fig.12The present application also provides a method for preparing a display panel, the method comprising the following steps:

[0141] S1, providing a substrate 10;

[0142] S2, preparing a pixel definition layer 30 and a protective layer 33 on one side of the substrate 10 along the thickness direction;

[0143] S3 , preparing an isolation structure 40 on the side of the pixel definition layer 30 facing away from the substrate 10 , and patterning to form a plurality of isolation openings; wherein the protection layer 33 is disposed in at least one isolation opening, and the protection layer 33 is adjacent to the pixel definition layer 30 .

[0144] In this way, the display panel provided in the embodiment of the present application can use the protective layer 33 to protect the pixel definition layer 30, thereby preventing the etching gas or etching liquid from passing through the gap between the protective layer 33 and the isolation structure 40 to cause damage to the pixel definition layer 30, and avoiding affecting the first electrode 20, thereby improving reliability and avoiding affecting the luminous effect to a certain extent.

[0145] In some embodiments, the preparation method provided in the embodiments of the present application further comprises:

[0146] S4, patterning the pixel definition layer 30 to form a plurality of pixel openings.

[0147] In this way, the preparation method provided in the embodiment of the present application can process the light-emitting unit in a subsequent process, so that the light-emitting layer 50 of the light-emitting unit can pass through the pixel opening and be connected to the first electrode 20.

[0148] In some embodiments, the preparation method provided in the embodiments of the present application further comprises:

[0149] S5, preparing a light-emitting unit and a first encapsulation layer 70 on a side of the substrate 10 facing the isolation structure 40;

[0150] S6, preparing a second encapsulation layer 80 on a side of the first encapsulation layer 70 facing away from the substrate 10;

[0151] S7, preparing a third encapsulation layer 90 on the side of the second encapsulation layer 80 facing away from the substrate 10.

[0152] In this way, the preparation method provided in the embodiment of the present application can prepare a light-emitting unit and a first encapsulation layer 70 that encapsulates the light-emitting unit, and can also prepare a second encapsulation layer 80 and a third encapsulation layer 90 that encapsulate the first encapsulation layer 70 and the isolation structure 40.

[0153] See also Fig.13 In some embodiments, in step S2, a pixel definition layer 30 and a protective layer 33 are prepared on one side of the substrate 10 along the thickness direction, including:

[0154] S21, preparing a pixel definition layer 30 on one side of the substrate 10 along the thickness direction;

[0155] S22 , preparing a protective layer 33 on the side of the pixel definition layer 30 facing away from the substrate 10 .

[0156] In this way, the preparation method provided in the embodiment of the present application can first prepare the pixel definition layer 30 and then prepare the protection layer 33.

[0157] See also Fig.14 Alternatively, in some other embodiments, the pixel definition layer 30 and the protective layer 33 may be prepared at the same time. That is, in step S2, the pixel definition layer 30 and the protective layer 33 are prepared on one side of the substrate 10 along the thickness direction, including:

[0158] S21', preparing a pixel definition layer 30 and a protective layer 33 on one side of the substrate 10 along the thickness direction;

[0159] S22`, remove the protective layer 33 in the first area and the second area, the isolation structure 40 includes a base part, a support part and an eaves part which are stacked in sequence along a direction away from the substrate 10, the orthographic projection of the first area on the substrate 10 overlaps with at least part of the orthographic projection of the base part on the substrate, the first area surrounds the second area, and the first area and the second area are spaced apart.

[0160] Exemplarily, the orthographic projection of the first region on the substrate 10 may completely overlap with the orthographic projection of the base portion on the substrate, so that the protective layer 33 may be attached to or connected to the base portion. Exemplarily, the orthographic projection of the first region on the substrate 10 may be completely within the orthographic projection of the base portion on the substrate, so that the base portion may cover the portion of the protective layer 33 close to the isolation structure 40.

[0161] See also Fig.15 In some embodiments, the plurality of isolation openings include a first isolation opening 41, a second isolation opening 42, and a third isolation opening 43, the pixel definition layer 30 defines a first pixel opening, a second pixel opening, and a third pixel opening, the first pixel opening is located in the first isolation opening 41, the second pixel opening is located in the second isolation opening 42, the third pixel opening is located in the third isolation opening 43, the light-emitting unit includes a first light-emitting unit, a second light-emitting unit, and a third light-emitting unit, and the first encapsulation layer 70 includes a first encapsulation portion 71, a second encapsulation portion 72, and a third encapsulation portion 73.

[0162] In step S5, a light emitting unit and a first encapsulation layer 70 are prepared on a side of the substrate 10 facing the isolation structure 40, including:

[0163] S51, preparing a first light-emitting unit in the first pixel opening, covering the first light-emitting unit with a photoresist 01 during the preparation process, and removing other parts except the first light-emitting unit;

[0164] S52, preparing a first encapsulation portion 71 on a side of the first light-emitting unit facing away from the substrate 10, and during the preparation process, covering the first encapsulation portion 71 with a photoresist 01, and removing other parts of the first encapsulation layer 70;

[0165] S53, preparing a second light-emitting unit in the second pixel opening, covering the second light-emitting unit with photoresist 01 during the preparation process, and removing other parts except the second light-emitting unit;

[0166] S54, preparing a second encapsulation portion 72 on a side of the second light-emitting unit away from the substrate 10, and during the preparation process, covering the second encapsulation portion 72 with a photoresist 01, and removing other parts of the first encapsulation layer 70;

[0167] S55, preparing a third light emitting unit in the third pixel opening, covering the third light emitting unit with photoresist 01 during the preparation process, and removing other parts except the third light emitting unit;

[0168] S56, preparing a third encapsulation portion 73 on a side of the third light-emitting unit facing away from the substrate 10, and during the preparation process, the third encapsulation portion 73 is covered with a photoresist 01, and other parts of the first encapsulation layer 70 are removed.

[0169] In this way, the preparation method provided in the embodiment of the present application can rely on the isolation structure 40 to sequentially prepare the first light-emitting unit, the second light-emitting unit and the third light-emitting unit, and can also sequentially prepare the first packaging part 71 that encapsulates the first light-emitting unit, the second packaging part 72 that encapsulates the second light-emitting unit, and the third packaging part 73 that encapsulates the third light-emitting unit.

[0170] The embodiment of the present application also provides a display device, which includes the display panel of the above embodiment. The display device provided by the present application has the same or similar technical effects as the display panel of the above embodiment, which will not be described in detail here.

[0171] Optionally, the display device can be a mobile phone, a television, a tablet computer, a laptop computer, a desktop computer, a vehicle-mounted display terminal, a wearable device, an advertising display device, etc.

[0172] The above description is only a preferred embodiment of the present application and is not intended to limit the present application. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present application should be included in the protection scope of the present application.

Claims

1. A display panel, characterized in that: include: substrate; A pixel definition layer, located on one side of the substrate along the thickness direction; An isolation structure, the isolation structure is located on a side of the pixel definition layer away from the substrate and defines a plurality of isolation openings; The protection layer is disposed in at least one isolation opening, and the protection layer is located on a side of the pixel definition layer away from the substrate and is adjacent to the pixel definition layer.

2. The display panel according to claim 1, wherein: The pixel definition layer defines a plurality of pixel openings, and the pixel openings are located in corresponding isolation openings. In the same isolation opening, the protection layer is arranged at an interval between the orthographic projection of the substrate and the orthographic projection of the pixel opening on the substrate.

3. The display panel according to claim 1, wherein: The plurality of isolation openings include a first isolation opening, a second isolation opening, and a third isolation opening, and the protection layer is disposed inside at least one of the second isolation opening and the third isolation opening.

4. The display panel according to claim 3, wherein: The protective layer includes a first protective layer and a second protective layer. The first protective layer is disposed in the second isolation opening, and the second protective layer is disposed in the third isolation opening.

5. The display panel according to claim 4, wherein: The thickness of the first protective layer is less than or equal to the thickness of the second protective layer; and / or, the material of the first protective layer is different from the material of the second protective layer.

6. The display panel according to claim 4, wherein: The pixel definition layer defines a first pixel opening, a second pixel opening and a third pixel opening, the first pixel opening is located in the first isolation opening, the second pixel opening is located in the second isolation opening, the third pixel opening is located in the third isolation opening, the first protective layer is arranged at an interval between the orthographic projection of the substrate and the orthographic projection of the second pixel opening on the substrate, and / or the second protective layer is arranged at an interval between the orthographic projection of the substrate and the orthographic projection of the third pixel opening on the substrate.

7. The display panel according to claim 1, wherein: The material of the protective layer is different from the material of the pixel definition layer; Preferably, the material of the protective layer includes an inorganic material, and the material of the pixel definition layer includes an inorganic material; Preferably, the etching selectivity of the inorganic material of the protective layer is greater than or equal to the etching selectivity of the inorganic material of the pixel definition layer; Preferably, the inorganic material of the protective layer includes one of silicon oxide and silicon oxynitride, and the inorganic material of the pixel definition layer includes silicon nitride.

8. The display panel according to claim 1, wherein: The display panel further includes a light-emitting unit, the light-emitting unit includes a first electrode, a light-emitting layer, and a second electrode which are sequentially stacked in a direction away from the substrate, the first electrode is arranged at intervals on one side of the substrate, the pixel definition layer is arranged on a side of the first electrode away from the substrate, the pixel definition layer defines a plurality of pixel openings, the pixel openings are located in the corresponding isolation openings, the pixel openings expose a portion of the first electrode, the orthographic projection of the light-emitting layer on the substrate is located in the orthographic projection of the second electrode on the substrate, and the protective layer is located on a side of the second electrode facing the substrate and is adjacent to the second electrode; Preferably, the orthographic projection of the protective layer on the substrate does not overlap with the orthographic projection of the light-emitting layer on the substrate; Preferably, the light emitting layer covers a portion of the protective layer close to the pixel opening.

9. The display panel according to claim 1, wherein: The display panel further comprises a plurality of first encapsulation layers and a plurality of light-emitting units, wherein at least a portion of the orthographic projection of the light-emitting unit on the substrate is located within the orthographic projection of the corresponding isolation opening on the substrate, and the first encapsulation layer is located on a side of the light-emitting unit away from the substrate; Preferably, the material of the protective layer is different from that of the first encapsulation layer; Preferably, the material of the protective layer includes an inorganic material, and the material of the first encapsulation layer includes an inorganic material; Preferably, the inorganic material of the protective layer includes one of silicon nitride, silicon oxide and silicon oxynitride, and the inorganic material of the first encapsulation layer includes another of silicon nitride, silicon oxide and silicon oxynitride; Preferably, the inorganic material of the protective layer includes one of silicon oxide and silicon oxynitride, and the inorganic material of the first encapsulation layer includes silicon nitride; Preferably, a material of the protection layer is different from a material of the first encapsulation layer.

10. The display panel according to claim 1, wherein: The isolation structure comprises a base portion, a support portion and an eaves portion which are stacked in sequence in a direction away from the substrate, and the side of the protective layer close to the isolation structure is connected to the base portion; Preferably, the orthographic projection of the protective layer on the substrate does not overlap with the orthographic projection of the base portion on the substrate; Preferably, the orthographic projection of the protective layer on the substrate is located within the orthographic projection of the eaves portion on the substrate.

11. The display panel according to claim 1, wherein: The isolation structure comprises a base portion, a support portion and an eaves portion which are sequentially stacked in a direction away from the substrate, wherein the base portion covers a portion of the protective layer close to the isolation structure; Preferably, the orthographic projection of the support portion on the substrate is located within the orthographic projection of the base portion on the substrate; Preferably, the orthographic projection of the base portion on the substrate is located within the orthographic projection of the eave portion on the substrate.

12. The display panel according to claim 10 or 11, characterized in that: The thickness of the protective layer is less than or equal to the thickness of the base portion.

13. The display panel according to claim 1, wherein: The thickness of the protective layer is less than or equal to 200 angstroms.

14. The display panel according to claim 1, wherein: The side of the protective layer close to the isolation structure is in contact with the isolation structure; Preferably, the isolation structure comprises a base portion, a support portion and an eaves portion which are stacked in sequence in a direction away from the substrate, and the protective layer is in contact with the base portion near a side of the isolation structure.

15. A method for preparing a display panel, characterized in that: include: providing a substrate; Preparing a pixel definition layer and a protective layer on one side of the substrate along the thickness direction; Preparing an isolation structure on a side of the pixel definition layer facing away from the substrate, and patterning to form a plurality of isolation openings; The protection layer is disposed in at least one isolation opening, and the protection layer is adjacent to the pixel definition layer.

16. The preparation method according to claim 15, characterized in that: The method of preparing a pixel definition layer and a protective layer on one side of the substrate along the thickness direction comprises: Preparing a pixel definition layer on one side of the substrate along the thickness direction; Preparing a protective layer on a side of the pixel definition layer facing away from the substrate; Alternatively, the step of preparing a pixel definition layer and a protective layer on one side of the substrate along the thickness direction comprises: Preparing a pixel definition layer and a protective layer on one side of the substrate along the thickness direction; Portions of the protective layer in the first area and the second area are removed, and the isolation structure includes a base portion, a support portion and an eaves portion which are stacked in sequence along a direction away from the substrate, the orthographic projection of the first area on the substrate overlaps with at least part of the orthographic projection of the base portion on the substrate, and the first area surrounds the second area and is spaced apart from the second area.

17. The preparation method according to claim 15, characterized in that: After preparing an isolation structure on a side of the pixel definition layer facing away from the substrate, the preparation method further comprises: The pixel definition layer is patterned to form a plurality of pixel openings.

18. The preparation method according to claim 15, characterized in that: After preparing an isolation structure on a side of the pixel definition layer facing away from the substrate, the preparation method further comprises: Prepare a light-emitting unit and a first encapsulation layer on a side of the substrate facing the isolation structure; preparing a second encapsulation layer on a side of the first encapsulation layer facing away from the substrate; A third encapsulation layer is formed on a side of the second encapsulation layer facing away from the substrate.

19. The preparation method according to claim 18, characterized in that: The plurality of isolation openings include a first isolation opening, a second isolation opening, and a third isolation opening, the pixel definition layer defines a first pixel opening, a second pixel opening, and a third pixel opening, the first pixel opening is located in the first isolation opening, the second pixel opening is located in the second isolation opening, the third pixel opening is located in the third isolation opening, the light emitting unit includes a first light emitting unit, a second light emitting unit, and a third light emitting unit, and the first encapsulation layer includes a first encapsulation portion, a second encapsulation portion, and a third encapsulation portion; The step of preparing a light-emitting unit and a first encapsulation layer on a side of the substrate facing the isolation structure comprises: preparing a first light emitting unit in the first pixel opening; Preparing a first encapsulation portion on a side of the first light-emitting unit facing away from the substrate; preparing a second light emitting unit in the second pixel opening; Prepare a second encapsulation portion on a side of the second light-emitting unit facing away from the substrate; preparing a third light emitting unit in the third pixel opening; A third encapsulation portion is prepared on a side of the third light emitting unit facing away from the substrate.

20. A display device, characterized in that: A display panel comprising any one of claims 1 to 14.

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