Intra-arm chassis and hinge

Abstract

An arm of a head-mountable display may include an arm tip, an arm hinge, and a housing. The housing may include a first surface and a second surface opposite the first surface, the housing defining the arm tip and an interior volume spanning between the arm tip and the arm hinge. The head-mountable display may also include a frame positioned inside the interior volume, the frame including a chassis and a hinge connection. In some cases, the head-mountable display also includes a printed circuit board (PCB), the printed circuit board (PCB) being mounted to the chassis.

Description

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This patent application claims priority to U.S. Provisional Patent Application No. 63 / 366,402, filed on June 14, 2022, and entitled “ARM INNERCHASSIS AND HINGE,” the entire disclosure of which is hereby incorporated by reference. Technical Field

[0003] The described embodiments generally relate to eyeglass arms. More specifically, embodiments of the invention relate to one or more arm designs for electronic eyeglasses. Background Art

[0004] In eyewear electronics (e.g., head-mounted electronics), software and computer hardware continue to advance at a rapid pace. Eyewear electronics are also designed to have a reduced form factor to provide better aesthetics and comply with social norms. As eyewear electronics are designed to have a smaller form factor, various challenges arise with different assembly methods and protection of internal components. Therefore, there is a need for improvements in assembly, particularly for assembling fixed arms with seamless housings. Additionally, there is a need to protect internal components from unexpected load application. Summary of the invention

[0005] One aspect of the present disclosure relates to an arm of a head-mounted display, the arm comprising an arm tip, an arm hinge, and a housing. The housing may include a first surface and a second surface opposite the first surface, the housing defining the arm tip and an internal volume spanning between the arm tip and the arm hinge. The head-mounted display may also include a frame positioned within the internal volume, the frame comprising a chassis and a hinge connector. In some examples, the head-mounted display also includes a printed circuit board (PCB) mounted to the chassis.

[0006] In some examples, the housing comprises a seamless housing that defines an assembly access proximate the arm hinge. In some examples, the frame is insertable into the internal volume through the assembly access. In certain examples, the frame is at least partially deformable. In one or more examples, the frame further comprises a first material and a second material that is different from the first material. In some specific implementations, the first material is a plastic material and the second material is a metal material. In some examples, the frame comprises a plastic material. In other examples, the frame comprises a metal material.

[0007] Another aspect of the present disclosure relates to a head-mountable device. In some embodiments, a head-mountable device includes a display and an arm connected to the display. In some examples, the arm includes an arm housing, which includes a monolithic housing. In a specific example, the arm also includes a frame, which is connected to the arm housing at a joint and cantilevered from the joint within the arm housing.

[0008] In some examples, the frame of the head-mountable device further includes a metal portion and a plastic portion. In a specific example, the metal portion includes a titanium material. In some examples, the plastic portion includes a carbon fiber-filled nylon material.

[0009] In some examples, the joint attaches the metal portion to the arm housing. In certain examples, the frame includes a nano-geometric joint feature between the metal portion and the plastic portion.

[0010] In one or more embodiments, the head-mounted device further includes an arm hinge that connects the arm to the display. Additionally, the head-mounted device may further include a rigid hinge connector defined by the frame and connected to the arm hinge, the rigid hinge connector defining a cable channel passing through the rigid hinge connector. Furthermore, in some examples, the arm of the head-mounted device may include: at least one of a speaker or a microphone, the speaker or the microphone being attached to the frame; a printed circuit board (PCB), the printed circuit board (PCB) being mounted to the frame; and a battery, the battery being mounted to the frame.

[0011] Another aspect of the present disclosure relates to an arm subassembly of an augmented reality (AR) glasses arm. The arm subassembly may include a chassis, a printed circuit board (PCB), and a cable harness. In some examples, the chassis defines an opening in a central area of ​​the chassis. In a specific example, the chassis includes a deformable portion, a rigid portion, and a hinge connector that defines a cable channel between a first orifice and a second orifice of the hinge connector. In one or more examples, the PCB is disposed in the opening. Additionally, in one or more examples, the cable harness extends from the PCB and passes through the first orifice and the second orifice.

[0012] In some examples, the arm subassembly further comprises an interposer plate (or plate) connecting the deformable portion and the rigid portion across the opening. In addition, the arm subassembly may comprise a battery attached to the interposer plate.

[0013] In some examples, the rigid portion includes a machined inlet that is backfilled with material sintered to the rigid portion. In a particular example, the chassis includes a curved edge that covers an edge of the PCB.

[0014] In some examples, the deformable portion of the arm subassembly includes a first reference portion. The rigid portion may include a second reference portion. In addition, in one or more examples, the first reference portion is adjacent to the second reference portion. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] The present disclosure will be readily understood through the following detailed description in conjunction with the accompanying drawings, in which like reference numerals represent like structural elements, and in which:

[0016] Figure 1 Illustrated is a top view of an example of a head-mountable display worn on a user's head.

[0017] Figure 2 A schematic diagram of an example frame for assembly into an enclosure is illustrated.

[0018] Figure 3 A cross-sectional top view of an example arm of a head mountable display is illustrated.

[0019] Figure 4 A cross-sectional top view of an example arm of a head mountable display is illustrated.

[0020] Figure 5 A cross-sectional top view of an example arm of a head mountable display is illustrated.

[0021] Figure 6 A cross-sectional top view of an example arm of a head mountable display is illustrated.

[0022] FIG. 7A to FIG. 7B Illustrated are top and bottom perspective views of an example frame for an arm subassembly for a head mountable display.

[0023] Figure 8 A partially exploded view of an example arm subassembly is illustrated.

[0024] Fig. 9 A cross-sectional top view of an example arm of a head mountable display is illustrated.

[0025] FIG. 10A to FIG. 10B Illustrated are top and bottom perspective views of an example interposer board implemented with an example framework.

[0026] Fig.11 A partial exploded view of an example flexible electrical harness implemented using an example frame and an example interposer board is illustrated. DETAILED DESCRIPTION

[0027] The following description will provide detailed reference to the representative embodiments illustrated in the accompanying drawings. The following description is not intended to limit the embodiments to one preferred embodiment. The following description is intended to cover alternatives, modifications and equivalents that may be included within the spirit and scope of the described embodiments defined by the appended claims.

[0028] The following disclosure relates to a head-mountable display. Examples of head-mountable displays may include virtual reality or augmented reality devices that include optical components. In the case of augmented reality devices, optical glasses may be worn on a user's head such that the optical lenses and / or optical displays are positioned in front of the user's eyes. In another example, a virtual reality device may be worn on a user's head such that a display screen is positioned in front of the user's eyes.

[0029] In a specific example, a head-mounted display includes: a display for presenting visualization; an arm housing (or shell) connected to the display; and an arm subassembly inserted into the interior of the arm housing. The arm housing can interface with the user to secure the display in place (e.g., in front of the user's eyes). In one example, the arm housing extends from the arm tip to the arm hinge. The arm tip can be positioned behind the user's ear. The arm hinge can be connected to a hinge for rotatably connecting the arm housing to the display.

[0030] The arm subassembly may include a variety of different components for operating the head-mounted display. Example components of the arm subassembly include a microphone, a speaker, a battery, a printed circuit board (PCB), a system on a chip, etc. Other example components of the arm subassembly include a chassis and a hinge connection.

[0031] Conventional arrangements of these or other components of the arm subassembly are incompatible with certain housings. For example, for non-dual shell housings, assembling the arm components inside the arm housing may be particularly challenging (or impossible). In practice, conventional component arrangements typically include assembly of the components in an open dual shell configuration in which the upper (or lower) half of the housing is opened or removed to allow access to the components. Once conventional assembly is complete, the upper (or lower) half of the housing is closed over the opposing half.

[0032] In contrast, the disclosed device may embody a monolithic housing (e.g., a seamless housing). Such a monolithic housing may include a single component access at a localized area of ​​the arm (e.g., near a hinge). The arm subassembly (preassembled as a modular unit) may be pushed or inserted through the component access to enter the internal volume of the arm. A monolithic housing assembled in this manner may provide various advantages, including a more socially acceptable (or smooth) arm profile and the elimination of seams that may cause user discomfort. In addition, the internal components may be designed to be protected from external loading from the assembly process and ordinary consumer use.

[0033] A variety of different component configurations and designs within the scope of the present disclosure can be implemented to achieve the foregoing. For example, in some examples, the arm of the disclosed device includes a frame. The frame may include an arm chassis. In certain embodiments, the arm chassis includes multiple materials. For example, the arm chassis includes a rigid portion (e.g., a metal portion) and a deformable portion (e.g., a plastic portion). Using multiple materials, the arm chassis can provide cross-functionality as will be discussed below. Additionally or alternatively, the arm chassis includes a single material (e.g., all metal or all plastic).

[0034] In some examples, in addition to increasing component protection and improving weight reduction, the deformable portion of the arm chassis also provides increased flexibility to the frame. For illustration, the deformable portion of the arm chassis can be flexed or bent during assembly (e.g., to fit through the component entrance). Similarly, the deformable portion of the arm chassis can be flexed or bent during assembly to adjustably conform to the curvature of the housing as it is pushed into place by the arm. In addition, the components mounted to the deformable portion of the arm chassis can be protected from external loading. For example, the deformable portion of the arm chassis can be separated from the housing so that stress and strain are not transferred from the housing to the mounted components. The deformable portion can also be made of a lightweight, strong material, which is beneficial for improving weight reduction and strength-to-weight ratio.

[0035] In some examples, the rigid portion of the arm chassis provides mechanical, load-bearing strength. For example, the rigid portion of the arm chassis is joined to the arm housing at a joint. The arm chassis can then be cantilevered from the joint within the housing. The rigid portion of the arm chassis is strong enough to carry the load of other portions of the arm chassis, including the deformable portion and the mounted components.

[0036] In some examples, the frame includes a hinge connector. In one or more examples, the hinge connector is defined by a rigid portion of the arm chassis. In a specific example, the hinge connector defines a cable channel. Via the cable channel, the cable bundle can be efficiently routed through the arm of the head-mounted display. Such efficient cable routing can help provide a smooth arm profile. Additionally, the rigidity of the hinge connector can protect the cable bundle during the hinge cycle (e.g., opening and closing of the arm).

[0037] In some examples, the frame includes an open, hollow design. For example, the frame includes an opening in a central region of the frame. The open, hollow design of the frame can be beneficial to increase space utilization and improve load shedding. Additionally or alternatively, the open, hollow design of the frame can be beneficial to improve weight reduction and material consumption.

[0038] A variety of different components can be mounted to the frame (e.g., as part of an arm subassembly). For example, components that are sensitive to stress and strain can be mounted to the frame. As specific examples of components, a PCB, a battery, a speaker, or a microphone can be mounted to the frame. As another example, an interposer board can be mounted to the frame. In some examples, the interposer board can optimize the space for the battery within the arm subassembly.

[0039] The following will refer to Figures 1 to 11 to discuss these examples and other examples. However, those skilled in the art will readily appreciate that the detailed description of these figures given herein is for illustrative purposes only and should not be construed as limiting. In addition, as used herein, a system, method, article, component, feature, or sub-feature comprising at least one of a first option, a second option, or a third option should be understood to refer to a system, method, article, component, feature, or sub-feature that may include one option of each listed option (e.g., only one first option, only one second option, only one third option), multiple options of a single listed option (e.g., two or more first options), two options at the same time (e.g., one first option and one second option), or a combination thereof (e.g., two first options and one second option).

[0040] Figure 1 A top view of an example of a head-mountable display 100 worn on a user's head 101 is illustrated. The head-mountable display 100 may include a display 102 (e.g., one or more optical lenses or display screens in front of the user's eyes). The display 102 may include a display for presenting an augmented reality visualization, a virtual reality visualization, or other suitable visualization.

[0041] The head-mountable display 100 may include one or more arms 104, 106. The arms 104, 106 are connected to the display 102 and extend distally toward the back of the head 101. The arms 104, 106 are configured to fix the display 102 in a certain position relative to the head 101 (e.g., so that the display 102 remains in front of the user's eyes). For example, the fixed arms 104, 106 extend above the user's ears 103. In some examples, the arms 104, 106 are placed on the user's ears 103 to fix the head-mountable display 100 via friction between the arms 104, 106 and the head 101. Additionally or alternatively, the arms 104, 106 may rest against the head 101. For example, the arms 104, 106 may apply opposing pressure to the sides of the head 101 to fix the head-mountable display 100 to the head 101.

[0042] The terms “proximal” and “distal” may be used to refer to the positioning of various components of the devices described herein relative to the display 102 of the head mountable display 100. The orientation of the “proximal” and “distal” directions relative to the devices described herein is in the Figure 1 Shown in.

[0043] Figure 1 Any of the features, components, and / or parts shown (including arrangements and configurations thereof) may be included alone or in any combination in any other examples of devices, features, components, and parts shown in other figures described herein. Similarly, any of the features, components, and / or parts shown or described with reference to other figures (including arrangements and configurations thereof) may be included alone or in any combination in any other examples of devices, features, components, and parts shown in other figures described herein. Figure 1 Examples of devices, features, components and parts are shown below. Figure 2 Further details of frames that may be used in the arms 104, 106 of the head mountable display 100 are provided.

[0044] Figure 2 A schematic diagram of an example frame 200 for assembly into a housing 206 is illustrated. The frame 200 and housing 206 may be described above with respect to Figure 1 The invention is implemented in one or more of the arms 104, 106 in question.

[0045] As used herein, the term "frame" refers to a structural member or body inside the arm of a head-mountable display. For example, the frame 200 can mount or support other components. In some examples, the frame 200 can also provide a specific framework of elements (e.g., components, surfaces, cutouts, etc.) that is arranged as a platform suitable for accommodating, positioning, fixing, guiding, protecting, covering, spacing, insulating, or thermally coupling certain components. In specific examples, the frame 200 includes an assembly skeleton, chassis, or base for assembling components into a predetermined configuration (e.g., a modular unit or an arm subassembly).

[0046] Additionally, as used herein, the term "housing" or "shell" refers to the main body of the arm of the head-mounted display. In some examples, the housing 206 defines the outer shell or surface contour of the arm. As will be discussed below, in some examples, the housing 206 is a unitary housing or a seamless housing.

[0047] In certain examples, the frame 200 (as part of the arm subassembly) can be inserted into the housing 206. For example, the frame 200 can be inserted into the housing 206 by being positioned at a localized area of ​​the arm (e.g., near the Figure 1 The assembly access 208 of the housing 206 (shown as a hinge at the proximal end of the arms 104, 106) is inserted into the interior of the housing 206. The assembly access 208 can be sized and shaped to accommodate the frame 200 (and other mounted components not shown). In some implementations, at least a portion of the frame 200 is deformable for insertion into the unibody interior of the housing 206 (in which case the frame 200 is constructed similar to a ship in a bottle).

[0048] The ship-in-a-bottle method is different from conventional assembly methods for implementing a double-shell housing in that the double-shell housing facilitates assembly with the upper half (or lower half) of the housing opened. In addition, the ship-in-a-bottle method is superior to conventional double-shell assembly methods because a single-piece housing can provide a relatively small form factor.

[0049] like Figure 2 As shown, the frame 200 includes an arm chassis 202. The arm chassis 202 can mount a PCB, a battery, a speaker, or a microphone. As will be described more below with respect to subsequent figures, the arm chassis 202 can mount these or other components in a manner that protects the components from external loading.

[0050] Further, in some examples, frame 200 can include a mechanism for movement. For example, frame 200 includes hinge connection 204. Hinge connection 204 can connect an arm to a display of a head-mountable display. Via hinge connection 204, the arm of the head-mountable display can rotate relative to the display (e.g., between an open configuration and a closed configuration).

[0051] Figure 2 Any of the features, components, and / or parts shown (including arrangements and configurations thereof) may be included alone or in any combination in any other examples of devices, features, components, and parts shown in other figures described herein. Similarly, any of the features, components, and / or parts shown or described with reference to other figures (including arrangements and configurations thereof) may be included alone or in any combination in any other examples of devices, features, components, and parts shown in other figures described herein. Figure 2 Examples of devices, features, components and parts are shown below. Figure 3Further details are provided on how the exemplary frame 200 may be incorporated into a head mountable display.

[0052] Figure 3 A cross-sectional top view of an example arm 300 for a head-mounted display is illustrated. The arm 300 may be similar to the one described above with respect to Figure 1 The arms 104, 106 discussed are identical or similar.

[0053] As shown, arm 300 includes the Figure 2 The housing 206 discussed. In practice, the housing 206 defines an outer shell or surface profile of the arm 300. In a particular example, the housing 206 includes a first surface 306 and a second surface 308. The first surface 306 and the second surface 308 extend at least partially between the arm tip 310 and the arm hinge 312, thereby defining an interior volume 302 inside the arm 300. In some cases, the first surface 306 and the second surface 308 span the entire distance between the arm tip 310 and the arm hinge 312.

[0054] As used herein, the term "arm tip" or "tip of the arm" refers to an end region of the arm 300, as defined by the housing 206. The arm tip 310 can be positioned behind the user's ear 103. Additionally or alternatively, the arm tip 310 can be pressed against the user's head 101 for securing a head-mountable display. The arm tip 310 is positioned opposite to another end region of the arm 300 that is adjacent or connected to the arm hinge 312.

[0055] Additionally, as used herein, the term "arm hinge" refers to the connection between the arm 300 and the display 102 (in Figure 1 Further details about the arm hinge 312 will be discussed below.

[0056] In some examples, the housing 206 comprises a unitary housing. For example, the first surface 306 and the second surface 308 form a complete whole or combination. To illustrate one example, the first surface 306 and the second surface 308 are combined, paired, or joined together so that the housing 206 forms a single shell. As another example, the first surface 306 and the second surface 308 refer to discrete portions, sides, or regions of the otherwise non-discrete entire body of the arm 300. It should be understood that forming the housing 206 can be achieved in countless different ways (e.g., casting, injection molding, three-dimensional printing, machining, etc.).

[0057] In addition, the housing 206 may include a variety of different materials. In some examples, the housing 206 includes a metal material. For example, the housing 206 may include one or more base metals, such as titanium, stainless steel, tungsten, cobalt, aluminum, copper, lead, nickel, tin, zinc, gold, silver, etc. Additionally or alternatively, in some examples, the housing 206 may include materials other than metals. For example, the housing 206 may include a polymer material, a carbon fiber material, a glass material, etc. Combinations of the foregoing materials are also contemplated herein. For example, in addition to one or more coatings, the housing 206 may be composed of one or more base materials.

[0058] exist Figure 3 As further shown in the figure, the housing 206 defines an assembly inlet 208 for entering the interior volume 302 within the arm 300. The assembly inlet 208 can be positioned in numerous different positions along the arm 300. For example, as illustrated, the assembly inlet 208 can be positioned near the arm hinge 312. As an alternative example, the assembly inlet 208 can be positioned at the arm tip 310. In yet another example, the assembly inlet 208 can be positioned between the arm tip 310 and the arm hinge 312. In some examples, the size and shape of the assembly inlet 208 can be set to allow the arm subassembly 304 to be inserted into the interior volume 302.

[0059] As used herein, the term "arm subassembly" refers to components within the arm 300. In certain examples, the arm subassembly 304 includes components that are assembled together as a unit for insertion into the housing 206. In some examples, the arm subassembly 304 includes a frame 314 and a printed circuit board (PCB) 320 (and, for example, Figures 4 to 5 ), each of which will be discussed in turn.

[0060] like Figure 3 As shown, the frame 314 includes a deformable portion 316. As used herein, the term "deformable" refers to a type or portion of a frame material that can bend, flex, move, or modify its shape or form in response to a given force. Thus, in some examples, the deformable portion 316 can be plastically deformed using permanent or semi-permanent deformation in response to a force (e.g., an insertion force used to insert the frame 314 into the internal volume 302). Additionally or alternatively, the deformable portion 316 can be elastically deformed so that the deformable portion 316 can rebound to its original shape or form after being deformed in response to the force. In one or more examples, the deformable portion 316 can mount certain components (e.g., PCB 320).

[0061] The deformable portion 316 may include a variety of different materials. For example, the deformable portion 316 may include a polymer material, a composite material, a carbon fiber material, a metal material, a rubber material, a silicone material, etc. Combinations of the foregoing materials are also contemplated herein. For example, the deformable portion 316 may include carbon fiber filled nylon (e.g., Kalix 1330, Nylon 12CF). As another example, the deformable portion 316 may include acrylonitrile butadiene styrene. In yet another example, the deformable portion 316 may include polycarbonate.

[0062] exist Figure 3 As further shown in , the frame 314 includes a rigid portion 318. As used herein, the term "rigid" refers to a type or portion of a frame material that is sufficiently hardened to support a load (e.g., the cantilever weight of the frame 314 and mounted components). In addition, the term "rigid" refers to a type or portion of a frame material that is sufficiently hardened to cycle multiple times (e.g., at least hundreds or thousands of times) in a hinge joint. Therefore, in some examples, the rigid portion 318 includes a material with a hardness rating of at least 3 (based on the Mohs relative hardness scale). In certain examples, the rigid portion 318 may include a material with a Mohs hardness rating of between 4 and 10. In a specific example, the rigid portion may include a material with a Mohs hardness rating of between 5.5 and 9.

[0063] In some examples, the rigid portion 318 may include one or more base metals, such as titanium, stainless steel, tungsten, cobalt, aluminum, copper, lead, nickel, tin, zinc, gold, silver, etc. Additionally or alternatively, in some examples, the rigid portion 318 may include materials other than metals. For example, the rigid portion 318 may include a polymer material, a carbon fiber material, a diamond material, a graphite material, a silicon carbide material, etc. Combinations of the foregoing materials are also contemplated herein. For example, the rigid portion 318 may include an alpha-beta titanium alloy (Ti-6AL-4v).

[0064] It should be understood that the deformable portion 316 and the rigid portion 318 of the frame 314 may include an arm chassis (e.g., as described above with respect to Figure 2 The arm chassis 202 discussed herein. That is, the arm chassis may include a portion of the deformable portion 316 and a portion of the rigid portion 318. The term "chassis" refers to one or more components connected to the arm hinge 312. In certain examples, the chassis is configured to carry loads from one or more components mounted thereto. In some examples, the chassis transfers or distributes the load to the arm hinge 312.

[0065] It should be appreciated that a multi-material chassis may provide various advantages. For example, a flexible chassis portion (e.g., deformable portion 316) may be manipulated or deformed as needed to facilitate assembly into interior volume 302 via component access 208. Additionally, the flexible chassis portion may provide independent support for mounted components (e.g., PCB 320) without transferring external loads applied to housing 206.

[0066] In contrast, a rigid chassis portion (e.g., rigid portion 318) can be attached to housing 206 via joint 322 to cantilever frame 314 from joint 322 within housing 206. In this manner, rigid portion 318 can decouple deformable portion 316 (and corresponding components) from external loads applied to housing 206. Furthermore, the rigid chassis portion can efficiently and reliably transfer loads from frame 314 to arm hinge 312 via hinge connection 204.

[0067] In alternative examples, the deformable portion 316 and the rigid portion 318 are not composed of different materials. Instead, the deformable portion 316 and the rigid portion 318 form a single, uniform material (or combination of materials). For example, in some examples, an all-plastic material or an all-metal material can achieve the same or similar functionality just described.

[0068] As mentioned, arm subassembly 304 may include PCB 320. The term "PCB" or "printed circuit board" refers to a logical assembly that includes electronic components. PCB 320 may include electrical connections and circuitry for mounting various components, including a system on a chip or an integrated circuit. PCB 320 may also transfer power from a power source (e.g., a battery, not in a power source). Figure 3 320 is a main logic board. PCB 320 can be a rigid board (e.g., composed of glass epoxy). In some examples, PCB 320 is a multi-layer PCB (e.g., a laminated sandwich structure of conductive layers and insulating layers). In some examples, PCB 320 can be flexible (e.g., having a flexible circuit system made of polyimide). In some examples, PCB 320 includes reinforcements added via lamination or pressure-sensitive adhesives.

[0069] The PCB 320 can be mounted to the deformable portion 316 in one or more different ways. In some examples, the PCB 320 is mechanically attached to the deformable portion 316 (e.g., via one or more fasteners). In other examples, the PCB 320 is bonded or adhered to the deformable portion 316 (e.g., using a pressure sensitive adhesive). Additionally or alternatively, the PCB 320 is potted in place (e.g., adjacent or abutting the deformable portion 316) by an epoxy molding compound.

[0070] Figure 3 Any of the features, components, and / or parts shown (including arrangements and configurations thereof) may be included alone or in any combination in any other examples of devices, features, components, and parts shown in other figures described herein. Similarly, any of the features, components, and / or parts shown or described with reference to other figures (including arrangements and configurations thereof) may be included alone or in any combination in any other examples of devices, features, components, and parts shown in other figures described herein. Figure 3 Examples of devices, features, components and parts are shown below. Figure 4 Further details and examples of arm configurations are provided.

[0071] Figure 4 A cross-sectional top view of an example arm 400 for a head-mounted display is illustrated. The arm 400 may be similar to the one described above with respect to Figure 1 The arms 104, 106 discussed are identical or similar.

[0072] As shown in the figure, arm 400 includes Figure 3 The first surface 306 and the second surface 308 discussed above define the housing 206. In addition, the arm 400 includes an arm subassembly 402, which includes the arm subassembly 402 also described above. Figure 3 The arm subassembly 402 also includes a frame 314 cantilevered from the housing 206 via a joint 322, as described above with respect to Figure 3 In addition, although not in Figure 4 4, but the arm 400 spans between the arm tip and the arm hinge, as described above in a similar manner with respect to Figure 3 The arm tip 310 and the arm hinge 312 are described.

[0073] However, with Figure 3 Differently, arm subassembly 402 may include one or more optional components, such as battery 404 or element 406. In some examples, arm subassembly 402 includes both. Each will be discussed in turn.

[0074] The battery 404 may include a rechargeable battery. For example, the battery 404 may include a nickel-cadmium battery, a nickel-metal hydride battery, a lithium-ion battery, a lithium-ion polymer battery, a lead-acid battery, or a rechargeable alkaline battery. Additionally or alternatively, the battery 404 may include a storage battery or a secondary battery.

[0075] Element 406 may include one or more components or design configurations. In some examples, element 406 may include an air gap, a heat sink, a vapor chamber, or an insulating material. Additionally or alternatively, element 406 may include a battery, a speaker, a microphone, etc. In a specific example, element 406 may include a combination of the aforementioned elements, such as a speaker-microphone combination.

[0076] The battery 404 and the element 406 can be mounted to the frame 314 in one or more different ways. In some examples, the components are mechanically fastened to the frame 314 (e.g., the deformable portion 316). In other examples, the components are bonded or adhered to the frame 314 (e.g., using a pressure sensitive adhesive). Other suitable methods of attaching the components together are within the scope of the present disclosure.

[0077] It should be understood that at least one of the battery 404 or the component 406 is mounted to a component other than the frame 314. For example, in some examples, at least one of the battery 404 or the component 406 is mounted to the PCB 320. In addition, in some examples, at least one of the battery 404 or the component 406 is mounted to a component (not shown) of the arm subassembly 402 (e.g., as described below with respect to Figures 9 to 11 The interposer board described herein).

[0078] Figure 4 Any of the features, components, and / or parts shown (including arrangements and configurations thereof) may be included alone or in any combination in any other examples of devices, features, components, and parts shown in other figures described herein. Similarly, any of the features, components, and / or parts shown or described with reference to other figures (including arrangements and configurations thereof) may be included alone or in any combination in any other examples of devices, features, components, and parts shown in other figures described herein. Figure 4 Examples of devices, features, components and parts are shown below. Figure 5 Additional details are provided regarding example arm configurations.

[0079] Figure 5 A cross-sectional top view of an example arm 500 for a head-mounted display is illustrated. The arm 500 may be similar to the one described above with respect to Figure 1 The arms 104, 106 discussed are identical or similar.

[0080] Arm 500 is similar to that described above with respect to Figure 4 The arm 400 discussed. Specifically, the arm 500 may include an arm subassembly 502 that includes the frame 314, PCB 320, and battery 404 discussed above.

[0081] However, if Figure 5 As shown, the arm subassembly 502 also includes a component 504 mounted to at least one of the PCB 320 or the frame 314 (e.g., the deformable portion 316). In some examples, the component 504 is mounted to both the PCB 320 and the deformable portion 316. The component 504 can include a variety of different components. Example components include a heat source (or system on chip), an integrated circuit, or other suitable electronic component (e.g., a resistor, a capacitor, an inductor, a potentiometer, a transformer, a diode, a transistor, etc.).

[0082] Additionally in Figure 5 , button 506 may be disposed on or through first surface 306 of housing 206. Button 506 may also be attached to or interfaced with frame 314 (or associated components, such as PCB 320). In some examples, button 506 is a power button for powering on the head-mounted display. In other examples, button 506 includes a visualization control button for starting, pausing, stopping, changing, or otherwise interacting with a visualization presented via the head-mounted display.

[0083] The arm subassembly 502 also includes a speaker-microphone 508. The speaker-microphone 508 may include one or more components for receiving, processing, transmitting, amplifying, or otherwise participating in audio processing. The speaker-microphone 508 may be mounted to the frame 314 (e.g., the deformable portion 316) via mechanical fasteners, bonding, pressure-sensitive adhesive, or other suitable methods.

[0084] exist Figure 5 As further shown in FIG. 5 , the hinge connector 204 defines a cable channel 510. The cable channel 510 can include a hollowed-out portion or slot through the hinge connector 204. In one or more examples, the cable channel 510 can be sized and shaped to accommodate a cable bundle (not shown). More specifically, the cable channel 510 can be oriented to guide the cable bundle through the hinge connector 204 so that the cable bundle can extend between the PCB 320 and components in the ear handle area 512 of the head-mounted display.

[0085] Figure 5 Any of the features, components, and / or parts shown (including arrangements and configurations thereof) may be included alone or in any combination in any other examples of devices, features, components, and parts shown in other figures described herein. Similarly, any of the features, components, and / or parts shown or described with reference to other figures (including arrangements and configurations thereof) may be included alone or in any combination in any other examples of devices, features, components, and parts shown in other figures described herein. Figure 5 Examples of devices, features, components and parts are shown below. Figure 6 Further details of example arm configurations are provided.

[0086] Figure 6 A cross-sectional top view of an example arm 600 for a head-mounted display is illustrated. The arm 600 may be similar to the one described above with respect to Figure 1 to Figure 2 The arms 104, 106 discussed are identical or similar.

[0087] The arm 600 includes a specific arrangement of components within the scope of the present disclosure for implementing the framework as an inner arm chassis and hinge mechanism. As shown, the arm 600 includes a metal chassis portion 602 and a plastic chassis portion 604. The metal chassis portion 602 is attached to the inner portion of the first surface 306 of the housing 206 at a joint 606.

[0088] The arm 600 also includes a hinge connection 608 extending from the metal chassis portion 602. The hinge connection 608 and the hinge assembly 610 work together to provide a rotatable hinge joint for the arm 600 so that the arm 600 can be rotated relative to the display 102 between an open position and a closed position (in Figure 1 to Figure 2 Arranged within the hinge connection 608 is a cable bundle 612 which is guided through a cable channel 613 defined by an inner wall of the hinge connection 608 .

[0089] A machining access 605 is defined between the metal chassis portion 602 and the plastic chassis portion 604. Through the machining access 605, the cable channel (for the cable bundle 612) in the hinge connector 608 can be machined, deburred, cleaned, polished, surface treated, coated, etc. The machining access 605 can then be backfilled. For example, the machining access 605 can be backfilled with a patch co-sintered to the metal chassis portion 602. Thus, the machining access 605 can be backfilled with the same or similar material as the metal chassis portion 602. Alternatively, the machining access 605 can be backfilled with the same or similar material as the plastic chassis portion 604.

[0090] It should be understood that the plastic chassis portion 604, the metal chassis portion 602, and the hinge connection 608 as just discussed may constitute the frame 314 discussed above with respect to the aforementioned figures. In fact, the plastic chassis portion 604 may correspond to the deformable portion 316, the metal chassis portion 602 may correspond to the rigid portion 318, and the hinge connection 608 may correspond to the hinge connection 204.

[0091] In addition, the arm 600 may include a battery 614. The battery 614 may be positioned between the PCB 320 and the second surface 308. In addition to a power connection between the battery 614 and the PCB 320, an air gap may surround the battery 614. In addition, the arm 600 may include any number of audio components, including a speaker 616. The speaker 616 may be positioned near the arm tip 310 of the arm 600 so as to be conveniently placed near the user's ear during use.

[0092] Figure 6Any of the features, components, and / or parts shown (including their arrangements and configurations) may be included alone or in any combination in any other examples of devices, features, components, and parts shown in other figures described herein. Similarly, any of the features, components, and / or parts shown or described with reference to other figures (including their arrangements and configurations) may be included alone or in any combination in any other examples of devices, features, components, and parts shown in other figures described herein. Figure 6 Examples of devices, features, components and parts are shown below. Fig. 7A and Figure 7B Further details of an example framework 314 are provided.

[0093] Fig. 7A and Figure 7B 1 and 2 illustrate a top perspective view and a bottom perspective view of an example frame 700 for an arm subassembly of a head-mountable display, respectively. Specifically, Fig. 7A and Figure 7B A frame 700 is shown that includes a rigid portion 702, a deformable portion 704, and a hinge connection 708. The rigid portion 702, the deformable portion 704, and the hinge connection 708 may correspond to the deformable portion 316, the rigid portion 318, and the hinge connection 204 discussed above, respectively. Additionally or alternatively, the rigid portion 702, the deformable portion 704, and the hinge connection 708 may correspond to the metal chassis portion 602, the plastic chassis portion 604, and the hinge connection 608, respectively, also discussed above.

[0094] In addition to these components, the rigid portion 702, the deformable portion 704, and the hinge connection 708 may also define certain features. For example, the hinge connection 708 defines a cable channel between the first aperture 710 and the second aperture 712. Through the cable channel, a cable bundle (not shown) can be efficiently directed to extend through the first aperture 710, through the cable channel, and through the second aperture 712. As previously mentioned, such cabling can help provide a reduced form factor for a sleek arm profile.

[0095] It should be understood that the first orifice 710, the second orifice 712 and the connecting cable channel can be processed in various ways. In some examples, the first orifice 710, the second orifice 712 and the connecting cable channel are processed through a processing entrance. For example, the first orifice 710, the second orifice 712 and the connecting cable channel can be machined, deburred, cleaned, polished, surface treated, coated, etc. through the processing entrance.

[0096] The backfilled portion 718 may correspond to the machining entry just described. In practice, after machining is performed via the machining entry, the backfilled portion 718 may be formed. In some examples, the backfilled portion 718 includes a patch of material sintered to the rigid portion 702 or the hinge connection 708. Thus, the backfilled portion 718 may be backfilled with the same or similar material (e.g., titanium alloy) as the rigid portion 702 and the hinge connection 708. Alternatively, the backfilled portion 718 is backfilled with the same or similar material as the deformable portion 704.

[0097] In one or more examples, the deformable portion 704 primarily defines the size and shape of the frame 700. In a particular example, the deformable portion 704 includes a flat C-shaped bend. In some examples, the curvature of the deformable portion 704 matches the curvature and shape of at least a portion of the arm housing (not shown). Additionally or alternatively, the shape and curvature of the deformable portion 704 corresponds to a component edge for at least partially protecting or covering. For example, the curved edge 714 of the deformable portion 704 can cover a component edge, such as a PCB edge of a PCB disposed within the opening 706.

[0098] Additionally, the deformable portion 704 defines an opening 706 within a central region of the frame 700. The opening 706 may be sized and shaped to allow for increased space utilization for components mounted to the frame 700. The opening 706 may also allow for thermal coupling between components mounted to the frame 700 and an arm housing (not shown).

[0099] In one or more examples, the rigid portion 702 and the deformable portion 704 are connected via one or more engagement features 716. In some examples, the engagement features 716 may include interlocking elements that interlock the rigid portion 702 and the deformable portion 704. In some implementations, the engagement features 716 include nano-geometric engagement features (e.g., dovetail elements, snap fits, press fits, tongue-and-groove elements, etc., sized to the nanometer scale). Additionally or alternatively, the engagement features 716 include co-bonded portions, sintered portions, adhesive portions, etc., that transition between and connect the rigid portions 702 and 704.

[0100] exist Fig. 7A and Figure 7B As further shown in FIG. 1 , the deformable portion 704 includes one or more reference portions 720, and the rigid portion 702 includes one or more reference portions 722. The reference portions 720, 722 include respective faces or surfaces of the deformable portion 704 and the rigid portion 702 corresponding to the mechanical stop. In a specific example, the reference portions 720, 722 include abutting faces. For example, the reference portion 720 of the deformable portion 704 abuts the reference portion 722 of the rigid portion 702.

[0101] It should be understood that forming the frame 700 can be accomplished in numerous different ways (e.g., casting, injection molding, 3D printing, machining, etc.). Furthermore, in some examples, the frame 700 can be formed using separate processes for individual components. For example, in one method of manufacturing, the deformable portion 704 and the hinge connector 708 can be metal injection molded. As another example, the rigid portion 702 can be 3D printed or molded using polymer injection molding.

[0102] It should also be understood that the manufacturing process for forming the frame 700 may take into account subsequent manufacturing processes. For example, the deformable portion 704 and the hinge connection 708 may be metal injection molded at slightly larger sizes to account for material shrinkage as the metal cools. Additionally or alternatively, the components may be formed slightly larger to achieve tight, precise machining tolerances (as may be desired, particularly for nano-geometry engagement features).

[0103] Fig. 7A and Figure 7B Any of the features, components, and / or parts shown (including their arrangements and configurations) may be included alone or in any combination in any other examples of devices, features, components, and parts shown in other figures described herein. Similarly, any of the features, components, and / or parts shown or described with reference to other figures (including their arrangements and configurations) may be included alone or in any combination in any other examples of devices, features, components, and parts shown in other figures described herein. Fig. 7A and Figure 7B Examples of devices, features, components and parts are shown below. Figure 8 An assembly of an exemplary frame with additional components is provided.

[0104] Figure 8 A partially exploded view of an example arm subassembly 800 is illustrated. Figure 8 As shown, arm subassembly 800 includes frame 801. Frame 801 is similar to frame 700 discussed above, but is not identical thereto. In fact, frame 700 and frame 801 are different because frame 700 corresponds to the right arm (e.g., Figure 1 arm 106) and frame 801 corresponds to the left arm (e.g., Figure 1 However, the features between frames 700, 801 are similar such that subsequent discussion of various features of frame 801 refers to features of frame 700.

[0105] Specifically, the arm subassembly 800 may include a PCB 320 mounted to the frame 801 via a pressure sensitive adhesive strip 802. Additionally or alternatively, other forms of bonding, fastening or attachment may be implemented. When doing so, the PCB 320 is disposed within the opening 706 so that the edge of the PCB 320 is at least partially covered by the curved edge 714 of the deformable portion 704.

[0106] exist Figure 8 As further shown in FIG. 7 , the arm subassembly 800 can be connected to the arm hinge 804 that engages the hinge connector 708. Specifically, the hinge connector 708 includes a cable channel to guide the cable bundle 612. The cable bundle 612 includes one or more wires extending from the opening 706 (e.g., to connect with the PCB 320). Additionally, the cable bundle 612 can extend through the hinge connector 708 (e.g., through the first and second apertures discussed above). The cable bundle 612 can further leave the hinge connector 708 and the arm hinge 804 to fan out and form additional connectors. It should be understood that such efficient cable routing can help provide a smooth arm profile for a head-mounted display.

[0107] Figure 8 Any of the features, components, and / or parts shown (including their arrangements and configurations) may be included alone or in any combination in any other examples of devices, features, components, and parts shown in other figures described herein. Similarly, any of the features, components, and / or parts shown or described with reference to other figures (including their arrangements and configurations) may be included alone or in any combination in any other examples of devices, features, components, and parts shown or described in other figures. Figure 8 Examples of devices, features, components and parts are shown below. Fig. 9 Further examples are provided that illustrate incorporating an arm subassembly into a head-mountable display.

[0108] Fig. 9 A cross-sectional top view of an example arm 900 for a head-mounted display is illustrated. The arm 900 may be similar to the one described above with respect to Figure 1 The arms 104, 106 discussed are identical or similar.

[0109] As shown, arm 900 includes the same elements as arm 400 , but with one additional element. Specifically, arm 900 includes an arm subassembly 902 that includes an interposer plate 904 .

[0110] In one or more examples, the interposer plate 904 is mounted to the frame 314. For example, the interposer plate 904 is mounted to both the deformable portion 316 and the rigid portion 318 of the frame 314. In some examples, the interposer plate 904 includes reinforcements to provide the frame 314 with increased rigidity and strength.

[0111] Additionally or alternatively, in some examples, the inserter plate 904 may be mounted to certain components for providing component-specific support or providing improved component spacing. For example, the battery 404 may be mounted to the inserter plate 904. In some examples, the inserter plate 904 positions the battery 404 in a specific position within the arm 900, which takes into account tolerance errors (e.g., tolerance stacking). As another example, the inserter plate 904 positions the battery 404 at a specific interval or gap from the second surface 308, which takes into account battery expansion during the charging cycle. For illustration, the inserter plate 904 provides an air gap between the battery 404 and the second surface 308, which is about 2% to about 40% of the nominal thickness of the battery. In other examples, the air gap is about 5% to about 20% of the nominal thickness of the battery. In a specific example, the air gap is about 10% of the nominal thickness of the battery.

[0112] It should be understood that the interposer plate 904 can include a variety of different materials. In some examples, the interposer plate 904 includes the same or similar material as the deformable portion 316. In other examples, the interposer plate 904 includes the same or similar material as the rigid portion 318. In some specific implementations, the interposer plate 904 includes a 316 stainless steel material. Other example materials for the interposer plate 904 include environmentally friendly recyclable materials, thermal insulation materials, etc.

[0113] Fig. 9 Any of the features, components, and / or parts shown (including their arrangements and configurations) may be included alone or in any combination in any other examples of devices, features, components, and parts shown in other figures described herein. Similarly, any of the features, components, and / or parts shown or described with reference to other figures (including their arrangements and configurations) may be included alone or in any combination in any other examples of devices, features, components, and parts shown or described in other figures. Fig. 9 Examples of devices, features, components and parts are shown below. Fig. 10A and Fig. 10B Further examples are provided of how an interposer plate may be coupled to a frame.

[0114] FIG. 10A to FIG. 10B The top and bottom perspective views of an example interposer board implemented using an example framework are illustrated. Specifically, FIG. 10A to FIG. 10BAn interposer plate 904 is depicted mounted to the frame 700, both of which have been discussed above. For example, the interposer plate 904 joins opposite ends of the frame 700 together. For example, the interposer plate 904 is mounted to the deformable portion 704 at one end of the frame 700 and to the rigid portion 702 at the other end of the frame 700. The sizes and shapes of various surfaces of the frame 700 can be set to mount the interposer plate 904. For example, the frame 700 includes a flat interface surface to engage and mount the interposer plate 904.

[0115] In a particular example, the interposer plate 904 is mounted to the frame 700 via a glue joint 1002 (positioned between the interposer plate 904 and the frame 700). The glue joint 1002 may include various types of structural glue, such as 6011LV glue. In alternative examples, the interposer plate 904 and the frame 700 may be joined together using fasteners or other attachment methods.

[0116] In at least some examples, the alignment holes 1004 defined by the interposer plate 904 can help ensure that the interposer plate 904 is accurately positioned relative to the frame 700. For example, the alignment holes 1004 can correspond to alignment dowels of the frame 700. In some examples, the alignment dowels (shown in FIG. 7 ) of the frame 700 are press-fitted into the alignment holes 1004 in a mating manner.

[0117] like FIG. 10A to FIG. 10B As further shown, the interposer plate 904 defines an opening 1006 between opposing surfaces of the interposer plate 904. In some examples, the opening 1006 is sized and shaped to at least partially expose a surface of a component mounted to the interposer plate 904. In other examples, the opening 1006 reduces material consumption and reduces arm weight.

[0118] The interposer plate 904 includes a mounting surface 1008. The mounting surface 1008 may include a coating, an adhesive, or other layers for accommodating components (e.g., batteries) for mounting. In some examples, the mounting surface 1008 may include a pressure-sensitive adhesive (e.g., Nitto 5610, Tesa 4982, etc.). The amount (e.g., surface area, thickness) of the mounting surface 1008 may depend on various factors. In some examples, the surface area of ​​the mounting surface 1008 is a function of the strength of the attachment and the retention force over a period of time. Additionally, in some examples, the thickness of the mounting surface 1008 is a function of mechanical damping, space constraints, etc. As an example, the thickness of the mounting surface 1008 includes a thickness of about 0.1 mm to about 1 mm. As another example, the thickness of the mounting surface 1008 includes a thickness of about 0.2 mm to about 6 mm. In some specific implementations, the thickness of the mounting surface 1008 includes a thickness of about 0.4 mm.

[0119] Likewise, the thickness of the inserter plate 904 may include numerous different thicknesses. The thickness of the inserter plate 904 may add desired strength or rigidity to the frame 700. Additionally or alternatively, the thickness of the inserter plate 904 may spatially determine the positioning of the installed components (e.g., batteries) relative to other components or surfaces. Some example thicknesses of the inserter plate 904 include a thickness of approximately 0.01 mm to approximately 0.8 mm. In some examples, the thickness of the inserter plate 904 includes a thickness of approximately 0.02 mm to approximately 0.3 mm. In a particular example, the thickness of the inserter plate 904 includes a thickness of approximately 0.25 mm.

[0120] It should be understood that one or more surfaces of the interposer plate 904 may be coated or lined with certain materials to impart desired properties. In some examples, the interposer plate 904 may include a coating to impart hardness, resist chemical exposure, or reduce electrical interference. Examples of coatings include phenol formaldehyde resins, bio-based resins (e.g., lignin, tannic acid, cardanol, hydroxymethyl furfural, and glyoxal), epoxy molding compounds, and the like.

[0121] Fig. 10A and Fig. 10B Any of the features, components, and / or parts shown (including their arrangements and configurations) may be included alone or in any combination in any other examples of devices, features, components, and parts shown in other figures described herein. Similarly, any of the features, components, and / or parts shown or described with reference to other figures (including their arrangements and configurations) may be included alone or in any combination in any other examples of devices, features, components, and parts shown in other figures described herein. Fig. 10A and Fig. 10B Examples of devices, features, components and parts are shown below. Fig.11 Additional example construction configurations of the frame and its associated components are provided.

[0122] Fig.11 A partial exploded view of an example flexible electrical harness 1100 implemented using the frame 700 and interposer plate 904 discussed above is illustrated. With respect to the interposer plate 904, a mountable end 1114 of the interposer plate 904 is configured to engage a receiving surface 1112 of a frame portion, namely the rigid portion 702. Additionally, a mountable end 1116 of the interposer plate 904 is configured to engage a receiving surface 1118 of another frame portion, namely the deformable portion 704. As discussed above, seam glue may attach the mounted portions.

[0123] exist Fig.11As further shown in FIG. 1 , the flexible electrical harness 1100 is configured to be mounted to the frame 700. Specifically, the electrical tab 1102 can engage the receiving surface 1110 of the rigid portion 702 via the pressure sensitive adhesive strip 1104. In some examples, the receiving surface 1110 is opposite the receiving surface 1112. Other portions of the flexible electrical harness 1100 can be mounted to the frame 700 or the interposer board 904 (although not required).

[0124] The electrical tab 1102 may include one or more electrical components, such as an integrated circuit, a resistor, a capacitor, an inductor, a potentiometer, a transformer, a diode, a transistor, etc. In addition, the electrical tab 1102 may be communicatively coupled to other components connected to the flexible electrical harness 1100 (e.g., provide power to it, send electrical signals to it, etc.). For example, the electrical tab 1102 may communicate with or provide power to components connected to the flexible electrical harness 1100 at the connection areas 1108 along the flexible circuit body 1106. Alternatively, one or more of the connection areas 1108 along the flexible circuit body 1106 may correspond to a mounting surface that is not necessarily communicatively coupled to the electrical tab 1102.

[0125] It should be appreciated that implementing a flexible printed circuit board such as the flexible electrical harness 1100 may be advantageous for certain purposes. For example, implementing the flexible electrical harness 1100 using the frame 700 and the interposer board 904 may help provide a reduced form factor for an arm of a head-mountable display.

[0126] Fig.11 Any of the features, components, and / or parts shown (including their arrangements and configurations) may be included alone or in any combination in any other examples of devices, features, components, and parts shown in other figures described herein. Similarly, any of the features, components, and / or parts shown or described with reference to other figures (including their arrangements and configurations) may be included alone or in any combination in any other examples of devices, features, components, and parts shown in other figures described herein. Fig.11 Examples of devices, features, components, and parts are shown.

[0127] Where applicable, data that can be obtained from various sources (such as personal information) can be used to improve the delivery of invitation content or any other content that may be of interest to users. In some cases, the use of such personal information can be used to improve the user's experience. However, to the extent personal information is used, this information should be collected and implemented in accordance with a sound privacy policy and / or privacy practice. Additionally, in some examples, users can selectively block the use or access of personal information data.

[0128] The specific details provided herein are not necessary to practice the examples described. Therefore, the descriptions of the specific examples described herein are provided for purposes of illustration and description and are not exhaustive and are not intended to limit the examples to those disclosed herein.

Claims

1. An arm for a head-mounted display, the arm comprising: a housing including a first surface and a second surface opposite the first surface, the housing defining a tip of the arm and an interior volume; a frame positioned within the interior volume, the frame comprising a chassis and a hinge connection; as well as A printed circuit board (PCB) is mounted to the chassis.

2. The arm of the head-mountable display according to claim 1, wherein: The housing comprises a seamless housing; and The housing defines a component access port opposite the tip of the arm.

3. The head mountable display arm of claim 2, wherein the frame is insertable into the interior volume through the component access port.

4. The arm of the head-mountable display according to claim 2, wherein the frame is deformable.

5. The arm of the head-mountable display according to claim 1, wherein the frame further comprises: First material; and A second material, the second material being different from the first material.

6. The arm of the head-mountable display according to claim 5, wherein: The first material is a plastic material; and The second material is a metal material.

7. The head mountable display arm of claim 1, wherein the frame comprises a plastic material.

8. The arm of the head mountable display according to claim 1, wherein the frame comprises a metal material.

9. A head-mountable device, the head-mountable device comprising: monitor; and an arm connected to the display, the arm comprising: an arm housing, the arm housing comprising a unitary housing; A frame is connected to the arm housing at a joint and cantilevered from the joint within the arm housing.

10. The head mountable device according to claim 9, wherein the frame further comprises: Metal parts; and Plastic part.

11. The head mountable device according to claim 10, wherein: The metal portion comprises titanium; and The plastic portion includes carbon fiber filled nylon.

12. The head mountable device of claim 10, wherein the joint attaches the metal portion to the arm housing.

13. The head mountable device of claim 10, wherein the frame comprises nano-geometry joint features at the joint.

14. The head mountable device according to claim 9, further comprising: an arm hinge connecting the arm to the display; as well as A rigid hinge connection is defined by the frame and connected to the arm hinge, the rigid hinge connection defining a cable channel.

15. The head mountable device of claim 9, wherein the arm further comprises: at least one of a speaker or a microphone, the speaker or the microphone attached to the frame; a printed circuit board (PCB), the PCB being mounted to the frame; as well as A battery is mounted to the frame.

16. An arm subassembly of an augmented reality (AR) glasses arm, the arm subassembly comprising: A chassis defining an opening in a central region of the chassis, the chassis comprising: A deformable portion; Rigid parts; and a hinge integral with the rigid portion, the hinge defining a cable channel; a printed circuit board (PCB), the PCB disposed within the opening; and A cable harness extends from the PCB and passes through the cable channel.

17. The arm subassembly according to claim 16, further comprising: a plate connecting the deformable portion and the rigid portion across the opening; as well as A battery is attached to the board.

18. The arm subassembly of claim 16, wherein the rigid portion includes a backfilled machined inlet.

19. The arm subassembly of claim 16, wherein the chassis includes a curved edge that covers an edge of the PCB.

20. The arm subassembly of claim 16, wherein: The deformable portion includes a first reference portion; The rigid portion includes a second reference portion; and The first reference portion is adjacent to the second reference portion.

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