Device and method for removing internal cavity of semiconductor chip plastic package body

By improving the transportation, storage, wake-up temperature and injection molding conditions of plastic sealing materials during the semiconductor chip plastic sealing process, the problem of hollow inside the plastic sealing body is solved, and the quality and production efficiency of plastic sealing are improved.

CN119526677APending Publication Date: 2025-02-28华羿微电子股份有限公司
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Patent Information

Application Number
CN202411820659.1
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2024-12-11
Publication Date
2025-02-28

AI Technical Summary

Technical Problem

During the plastic sealing process of semiconductor chips, epoxy resin easily forms hollows inside the plastic sealing body during injection molding, affecting the processing process, production efficiency and product quality of the product.

Method used

By improving the conditions of plastic sealing materials during transportation, storage, wake-up temperature and injection molding, including using storage frames to control the moisture of plastic sealing materials, the wake-up temperature rack accelerates the wake-up temperature process, and adjusting the injection pressure of the injection head through multi-stage injection molding methods to ensure the optimal flow of plastic sealing materials.

Benefits of technology

It effectively removes the hollows inside the plastic seal body, improves the quality of the plastic seal, extends the service life of the product, and improves production efficiency.

✦ Generated by Eureka AI based on patent content.

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    Figure CN119526677A_ABST
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Abstract

The invention discloses a device and a method for removing an internal cavity of a semiconductor chip plastic package body. The removing device comprises a storage mechanism, a temperature awakening mechanism and an injection molding mechanism. The removing device adopts the storage frame to eliminate the problem that the plastic package material is affected with damp due to the fact that the plastic package material is easily affected by the external environment for a long time in the transportation and storage process. And in the material waking process, the plastic package material is accelerated to be waked, so that the plastic package material is prevented from being damped again within a relatively long material waking time (the self-waking time of the plastic package material at present is about 24 hours) on the basis of shortening the material waking time. And in the final injection molding process, the injection pressure of the injection head on the molding compound is adjusted, so that the problem that internal cavities are generated and increased due to the fact that the molding compound is easy to form a layered structure in the step-by-step injection molding process is solved, the problem of cavities in a semiconductor chip plastic package body is solved on the whole, and the plastic package quality is improved.
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