A device and method for measuring the thermal conductivity of a material

Abstract

The application provides a kind of material thermal conductivity measuring device, comprising: high temperature experiment box, to accommodate the material to be measured;Heating structure is located in the high temperature experiment box, its output end is used to contact with the material to be measured;Infrared thermal imager is located in the high temperature experiment box, its shooting end is used to be arranged towards the material to be measured, to obtain the temperature distribution on the material to be measured.The application sets up high temperature experiment box to provide constant temperature environment for the material to be measured, to avoid the influence of external environment temperature change on the precision of measuring the thermal conductivity of the material to be measured, is favorable to improve the measurement precision of measuring device, sets up infrared thermal imager, can directly obtain the temperature distribution of the material to be measured, to shorten the thermal conductivity measurement time length, improves the efficiency of measuring the thermal conductivity of measuring device, is favorable to improve the practicality and engineering applicability of measuring device.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of measurement, in particular to a device and method for measuring thermal conductivity of material. BACKGROUND

[0002] Due to the diversity of coating materials, there is no method in the prior art suitable for measuring the thermal conductivity of various coating materials. When applied in engineering sites, the measurement accuracy and efficiency are limited. Therefore, there is an urgent need for a device for measuring thermal conductivity of material to meet the requirements of measurement accuracy and efficiency in engineering applications. SUMMARY

[0003] Therefore, the purpose of the present application is to provide a device and method for measuring thermal conductivity of material.

[0004] To achieve the above purpose, the present application provides a device for measuring thermal conductivity of material, comprising:

[0005] a high-temperature experiment box for accommodating the material to be measured;

[0006] a heating structure located in the high-temperature experiment box, the output end of which is in contact with the material to be measured;

[0007] an infrared thermal imager located in the high-temperature experiment box, the shooting end of which is arranged towards the material to be measured to obtain the temperature distribution on the material to be measured.

[0008] Further, the device further comprises a control system electrically connected with the high-temperature experiment box, the infrared thermal imager and the heating structure.

[0009] Further, the device further comprises a measurement platform located in the high-temperature experiment box for carrying the material to be measured.

[0010] Further, the output end of the heating structure is a heating needle, which is in contact with the center point of the material to be measured, and the infrared thermal imager is located directly above the material to be measured.

[0011] Further, the heating needle and the optical path of the infrared thermal imager are arranged in parallel.

[0012] Based on the same inventive concept, the present application further provides a measuring method applied to the device for measuring thermal conductivity of material as described above, comprising:

[0013] placing the material to be measured in the high-temperature experiment box;

[0014] start the heating structure and increase the output power of the heating structure until the color around the contact point between the material to be measured and the output end of the heating structure changes obviously in the image taken by the infrared thermal imager;

[0015] acquire the image taken by the infrared thermal imager and the output power of the heating structure;

[0016] analyze the image taken by the infrared thermal imager and the output power of the heating structure to obtain the thermal conductivity of the material to be measured.

[0017] Further, after the material to be measured is placed in the high-temperature experiment box, the method further comprises:

[0018] adjust the position of the infrared thermal imager so that the shooting end of the infrared thermal imager is arranged towards the material to be measured;

[0019] adjust the position of the output end of the heating structure so that the output end is in contact with the material to be measured and is arranged in parallel with the optical path of the infrared thermal imager.

[0020] Further, the temperature of the output end of the heating structure is 0.01-10℃ higher than the temperature of the high-temperature experiment box.

[0021] As can be seen from the above, the material thermal conductivity measuring device provided by the application comprises a high-temperature experiment box for accommodating the material to be measured, a heating structure for contacting the material to be measured to provide heat conduction conditions for the material to be measured, and an infrared thermal imager for taking infrared images of the material to be measured, so as to analyze the temperature of each position of the material to be measured under the heat conduction conditions provided by the heating structure and provide a basis for subsequent determination of the thermal conductivity of the material to be measured; the application provides a constant temperature environment for the material to be measured by the high-temperature experiment box, thereby avoiding the influence of external environmental temperature changes on the accuracy of measuring the thermal conductivity of the material to be measured, improving the measurement accuracy of the measuring device, and setting the infrared thermal imager to directly obtain the temperature distribution of the material to be measured, thereby shortening the measurement time of the thermal conductivity and improving the efficiency of the measuring device in measuring the thermal conductivity, which is beneficial to improving the practicality and engineering applicability of the measuring device. BRIEF DESCRIPTION OF DRAWINGS

[0022] In order to more clearly illustrate the technical solutions in the application or related art, the following will briefly introduce the drawings needed to be used in the embodiments or related art descriptions. Obviously, the drawings in the following description are only embodiments of the application, and those skilled in the art can obtain other drawings according to these drawings without creative labor.

[0023] Figure 1 FIG. 1 is a structural schematic diagram of a material thermal conductivity measuring device according to an embodiment of the application;

[0024] Figure 2 The flow structure schematic diagram of the method for measuring the embodiment of the present application is shown in the figure.

[0025] In the figure: 10, high-temperature experiment box; 20, heating structure; 21, heating needle; 30, infrared thermal imager; 40, measurement platform; 50, PC. DETAILED DESCRIPTION

[0026] In order to make the purpose, technical scheme and advantages of the present application more clear and obvious, the present application is further described in detail below in combination with specific embodiments and with reference to the drawings.

[0027] It should be noted that, unless otherwise defined, the technical terms or scientific terms used in the embodiments of the present application should be understood as the usual meanings understood by those skilled in the art to which the present application belongs. The terms "first", "second" and similar terms used in the embodiments of the present application do not represent any order, number or importance, but are only used to distinguish different components. The terms "include" or "contain" and similar terms mean that the elements or objects listed after the terms cover the elements or objects listed before the terms and their equivalents, and do not exclude other elements or objects. The terms "connect" or "connected" and similar terms are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect. The terms "up", "down", "left", "right" and the like are only used to represent relative positional relationships, and when the absolute positions of the described objects change, the relative positional relationships may also change accordingly.

[0028] In the measurement of the thermal conductivity of coating materials, due to the diversity of the structure of coating materials, there is currently no commercial instrument that can replace the laboratory measurement of the thermal conductivity of coating materials, and there is no laboratory measurement method suitable for measuring the thermal conductivity of all coating materials, therefore, various experimental measurement methods are being continuously developed and improved.

[0029] Among them, the thermal conductivity measurement method of coating materials mainly includes two types of steady-state measurement method and non-steady-state measurement method. 1. In the steady-state measurement method, a certain heat flow is applied to the measurement sample by the outside world until the temperature distribution in the measurement sample is a steady-state temperature field that does not change with time, when the measurement sample reaches thermal equilibrium, the thermal conductivity of the measurement sample can be directly determined by using Fourier equation with the help of the heat flow rate per unit area and the temperature gradient of the measurement sample; 2. In the non-steady-state measurement method, the rate of change of the temperature distribution in the measurement sample is measured, which can directly measure the thermal diffusivity of the measurement sample, and then the thermal conductivity can be calculated from the thermal diffusivity, specific heat and density.

[0030] In summary, the steady-state measurement method has simple principle, can directly measure thermal conductivity, and has good accuracy and precision of measurement result, but needs accurate control of heat flow in the measurement process, and the measurement time is long, and the measurement process needs to be carried out under good thermal protection measures; the non-steady-state method shortens the measurement time and reduces the requirements for sample preparation, but also has problems such as complex and precise measurement instrument components, and temperature sensing process is easily affected by environment, which limits its application in engineering field.

[0031] In engineering applications, the thermal conductivity measurement method of coating materials should not only meet the accuracy and precision requirements of thermal conductivity measurement, but also have the characteristics of one-sided non-contact non-destructive measurement, short measurement time, stable and reliable test instrument, and lightness. Therefore, a material thermal conductivity measurement device is urgently needed to meet the application in engineering field.

[0032] The embodiments of the present application will be described in detail below with reference to the accompanying drawings.

[0033] In some embodiments, as shown in Figure 1 A material thermal conductivity measurement device includes:

[0034] A high-temperature experiment box 10 is used to accommodate a material to be measured;

[0035] A heating structure 20 is located in the high-temperature experiment box 10, and an output end of the heating structure 20 is used to contact the material to be measured;

[0036] An infrared thermal imager 30 is located in the high-temperature experiment box 10, and a shooting end of the infrared thermal imager 30 is used to be arranged towards the material to be measured to obtain the temperature distribution on the material to be measured.

[0037] Specifically, the high-temperature experiment box 10 is provided with the infrared thermal imager 30 and the heating structure 20, the material to be measured is located in the high-temperature experiment box 10 and is arranged opposite to the shooting end of the infrared thermal imager 30, so that the infrared thermal imager 30 can shoot the material to be measured, the output end of the heating structure 20 has a temperature, and the output end contacts the material to be measured to transfer the temperature to the material to be measured. The contact point of the material to be measured receives the temperature of the output end and conducts it to the surrounding, so that the periphery of the contact point of the material to be measured appears heat conduction phenomenon, which is conducive to the infrared thermal imager 30 shooting the infrared image of the material to be measured. On this basis, the infrared thermal imager 30 analyzes the temperature distribution on the material to be measured at different times according to the obtained infrared image, and based on this, the thermal conductivity of the material to be measured can be analyzed based on the non-steady-state measurement method.

[0038] The high-temperature experiment box 10 is used to provide a constant temperature measuring environment for the material to be measured, so as to stabilize the measuring environment of the measuring device and avoid the influence of the environment, thereby improving the measuring accuracy of the measuring device. The temperature of the high-temperature experiment box 10 is between 0-200℃.

[0039] The heating structure 20 includes a standard resistor, a graphite electrode, a copper electrode, a sample and an output end connected in sequence.

[0040] The infrared thermal imager 30 includes an infrared detector and an optical imaging objective. The infrared detector and the optical imaging objective receive the infrared radiation energy distribution pattern of the material to be measured and reflect it to the photosensitive element of the infrared detector, so as to obtain an infrared thermal image. Different colors on the infrared thermal image represent different temperatures. Therefore, the temperature distribution of the material to be measured can be obtained through the infrared thermal imager 30.

[0041] The infrared thermal imager 30 is a recording instrument, which can record the temperature distribution of the material to be measured in real time. By analyzing the temperature changes at the same position at different times, the thermal conductivity of the material to be measured can be obtained.

[0042] It should be noted that the analysis of the temperature distribution of the material to be measured obtained by the infrared thermal imager 30 can be manual analysis or analysis by analysis software. Using analysis software can improve the measuring efficiency of the measuring device. Therefore, a PC 50 installed with analysis software is connected to the infrared thermal imager 30 to receive the temperature distribution obtained by the infrared thermal imager 30 and perform analysis. Correspondingly, the heating structure 20 and the high-temperature experiment box 10 are also connected to the PC 50 to obtain the power and temperature of the heating structure 20 and the high-temperature experiment box 10, so that the analysis software can analyze the thermal conductivity of the material to be measured.

[0043] In this embodiment, the high-temperature experiment box 10 is provided to accommodate the material to be measured, the heating structure 20 is provided to contact the material to be measured to provide heat conduction conditions for the material to be measured, and the infrared thermal imager 30 is provided to shoot the infrared image of the material to be measured, so as to analyze the temperature of each position of the material to be measured under the heat conduction conditions provided by the heating structure 20 and provide a basis for subsequent determination of the thermal conductivity of the material to be measured. The high-temperature experiment box 10 provided in the application provides a constant temperature environment for the material to be measured, thereby avoiding the influence of the external temperature change on the accuracy of measuring the thermal conductivity of the material to be measured, improving the measuring accuracy of the measuring device, the infrared thermal imager 30 can directly obtain the temperature distribution of the material to be measured, thereby shortening the measuring time of the thermal conductivity and improving the efficiency of the measuring device in measuring the thermal conductivity, and improving the practicality and engineering applicability of the measuring device.

[0044] In addition, the measuring device has simple structure, is less affected by the environment, is simple and convenient, and can meet the application in an engineering site.

[0045] In some embodiments, the measuring device further comprises a control system electrically connected with the high-temperature experiment box 10, the infrared thermal imager 30 and the heating structure 20.

[0046] Specifically, the control system is used to control the opening and closing and temperature of the high-temperature experiment box 10, the opening and closing and output power of the heating structure 20, and the opening and closing of the infrared thermal imager 30. The control system adjusts the temperature of the output end of the heating structure 20 by adjusting the output power of the heating structure 20.

[0047] It should be noted that the control system can also be connected with a PC 50 installed with analysis software, so that the analysis software can obtain the data of the high-temperature experiment box 10, the heating structure 20 and the infrared thermal imager 30, and the user can also operate the control device, that is, the operation of the PC 50 can control the operation and analysis of the measuring device.

[0048] In the embodiment, the control system controls the high-temperature experiment box 10, the infrared thermal imager 30 and the heating structure 20, so that the measurement environment of the measuring device can be remotely controlled, the measurement environment is not affected during the measurement process, and the measurement precision of the measuring device is improved.

[0049] In some embodiments, the measuring device further comprises a measurement platform 40 located in the high-temperature experiment box 10 and used to carry the material to be measured.

[0050] Specifically, the measurement platform 40 is located at the inner bottom of the high-temperature experiment box 10, the material to be measured is located on the measurement platform 40, and correspondingly, the infrared thermal imager 30 is located at the inner top of the high-temperature experiment box 10, and the shooting end thereof is downwardly arranged.

[0051] In the embodiment, the measurement platform 40 can provide stable support for the material to be measured, and can shorten the distance between the infrared thermal imager 30 and the material to be measured, so that the shooting precision of the infrared thermal imager 30 on the material to be measured is improved, and the measurement precision of the measuring device is improved.

[0052] In some embodiments, the output end of the heating structure 20 is a heating needle 21, the heating needle 21 is used to contact the center point of the material to be measured, and the infrared thermal imager 30 is located directly above the material to be measured.

[0053] Specifically, the output end of the heating structure 20 is a heating needle 21, which can reduce the contact area of the output end with the material to be measured, so as to avoid the situation that the output end has too large an area to block the infrared thermal imager 30 from shooting the temperature change of the material to be measured. The heating needle 21 can make the infrared thermal imager 30 shoot the temperature change of the material to be measured in time, thereby improving the measurement accuracy of the measuring device.

[0054] The heating needle 21 is in contact with the center point of the material to be measured, and the infrared thermal imager 30 is arranged above the material to be measured, so that the infrared thermal imager 30 can shoot the complete temperature diffusion of the material to be measured, facilitating the analysis of the thermal conductivity of the material to be measured, and improving the measurement efficiency and accuracy of the measuring device.

[0055] In some embodiments, the heating needle 21 is arranged in parallel with the optical path of the infrared thermal imager 30.

[0056] Specifically, the arrangement of the heating needle 21 in parallel with the optical path of the infrared thermal imager 30 can maximize the reduction of the blocking of the optical path of the infrared thermal imager 30 by the heating needle 21, thereby increasing the shooting area of the infrared thermal imager 30 on the material to be measured, and improving the measurement accuracy of the measuring device.

[0057] In some embodiments, a measurement method is applied to the material thermal conductivity measuring device as described above, as shown in Figure 2 The method comprises the following steps.

[0058] In step S100, the material to be measured is placed in the high-temperature experiment box 10.

[0059] Specifically, the material to be measured is placed in the high-temperature experiment box 10 and arranged opposite to the shooting end of the infrared thermal imager 30. When the high-temperature experiment box 10 is provided with a measuring platform 40, the material to be measured is placed on the measuring platform 40.

[0060] It should be noted that after this step, the high-temperature experiment box 10 and the infrared thermal imager 30 are started, and the temperature of the high-temperature experiment box 10 is adjusted to a preset value for preheating.

[0061] In step S200, the heating structure 20 is started, and the output power of the heating structure 20 is increased until the color around the contact point between the material to be measured and the output end of the heating structure 20 changes obviously in the image shot by the infrared thermal imager 30.

[0062] Specifically, the output power of the heating structure 20 is adjusted to increase the temperature of the output end of the heating structure 20, so that there is a temperature difference between the environment where the material to be tested is located and the material to be tested, and at the same time, there is a significant temperature difference change on the material to be tested, so that the infrared thermal imager 30 can obtain the infrared image of the material to be tested with different temperatures.

[0063] It should be noted that the output power of the heating structure 20 is not constant, and the output power of the heating structure 20 needs to be adjusted when any of the temperature of the high-temperature experiment box 10 and the material to be tested changes. The specific adjustment is that the infrared image taken by the infrared thermal imager 30 can observe a significant color change.

[0064] Step S300, obtaining the image taken by the infrared thermal imager 30 and the output power of the heating structure 20;

[0065] Specifically, after determining the output power of the heating structure 20, the temperature of the material to be tested is observed by the infrared thermal imager 30 until the temperature of the material to be tested is constant, then the infrared thermal imager 30 is turned off, the image (i.e. the recorded video) taken by the infrared thermal imager 30 is obtained, and the output power of the heating structure 20 is obtained, so as to obtain the thermal conductivity of the material to be tested by subsequent analysis.

[0066] Step S400, analyzing the image taken by the infrared thermal imager 30 and the output power of the heating structure 20 to obtain the thermal conductivity of the material to be tested.

[0067] Specifically, the thermal conductivity analysis software analyzes the image taken by the infrared thermal imager 30 in combination with the output power of the heating structure 20, so as to obtain the thermal conductivity of the material to be tested.

[0068] Analyzing the image taken by the infrared thermal imager 30 can obtain the thermal diffusivity of the material to be tested, the specific heat capacity is determined based on the output power of the heating structure 20, and the density of the material to be tested is a constant value. Based on the thermal diffusivity, the specific heat capacity and the density, the thermal conductivity can be calculated.

[0069] In the embodiment, the process that the measuring device measures the thermal conductivity of the material to be measured is described in detail to clarify the use method of the measuring device. Before measurement, the high-temperature incubator is started to provide a constant temperature environment, which is conducive to improving the stability of the measurement environment. After the material to be measured is placed, the output power of the heating structure 20 is adjusted to determine the output power value of the heating structure 20, so that the output end of the heating structure 20 can transfer heat to the material to be measured while the infrared thermal imager 30 can clearly reflect the heat transfer, which is convenient for subsequent analysis of the image obtained by the infrared thermal imager 30, and is conducive to improving the accuracy of the measurement method.

[0070] In some embodiments, after the material to be measured is placed in the high-temperature experimental box 10 in step S100, the method further comprises:

[0071] Step S500, adjust the position of the infrared thermal imager 30 so that the shooting end of the infrared thermal imager 30 is arranged towards the material to be measured;

[0072] Specifically, according to the placement position of the material to be measured in the high-temperature experimental box 10 (or on the measurement platform 40), the position of the infrared thermal imager 30 is adjusted so that the shooting end of the infrared thermal imager 30 is arranged towards the material to be measured and is opposite to the material to be measured, which can ensure that the material to be measured is symmetrically distributed in the infrared image shot by the infrared thermal imager 30, and is conducive to subsequent analysis of the image shot by the infrared thermal imager 30.

[0073] Step S600, adjust the position of the output end of the heating structure 20 so that the output end is in contact with the material to be measured and is arranged in parallel with the optical path of the infrared thermal imager 30.

[0074] Specifically, after the position of the material to be measured is constant, the position of the output end of the heating structure 20 is adjusted so that the output end is in contact with the material to be measured while being parallel to the optical path of the infrared thermal imager 30, thereby minimizing the shielding of the optical path of the infrared thermal imager 30 by the output end, which is conducive to improving the measurement accuracy of the measuring device.

[0075] In the embodiment, the positions of the heating structure 20 and the infrared thermal imager 30 are adjusted according to the placement position of the material to be measured, which is conducive to improving the accuracy of the measuring device in measuring the thermal conductivity of the material to be measured, thereby improving the practicability of the method.

[0076] In some embodiments, the temperature of the output end of the heating structure 20 is 0.01-10℃ higher than the temperature of the high-temperature experimental box 10.

[0077] Specifically, the temperature difference between the output end of the heating structure 20 and the high-temperature experiment box 10 is not a fixed value. According to the existing experiment, when measuring the thermal conductivity of the coating material, the temperature of the output end of the heating structure 20 is usually 0.01-10℃ higher than the temperature of the high-temperature experiment box 10. The specific value is determined according to the color difference between the material to be measured and the output end of the heating structure 20 that can be clearly observed by the infrared thermal imager 30.

[0078] It can be understood that, before using the technical solutions of various embodiments of the present disclosure, the user will be informed of the type, use range, use scenario, etc. of the personal information involved in a proper manner, and the authorization of the user will be obtained.

[0079] For example, in response to receiving the active request of the user, the user is sent prompt information to explicitly prompt the user that the operation requested to be performed will require obtaining and using the personal information of the user. Thus, the user can voluntarily choose whether to provide the personal information to the software or hardware such as an electronic device, an application program, a server or a storage medium, etc. that performs the operation of the technical solutions of the present disclosure according to the prompt information.

[0080] As an optional but non-limiting implementation manner, in response to accepting the active request of the user, the prompt information can be sent to the user in the form of a pop-up window, and the prompt information can be presented in the form of text in the pop-up window. In addition, the pop-up window can also carry selection controls for the user to select "agree" or "disagree" to provide the personal information to the electronic device.

[0081] It can be understood that the above notification and user authorization process is only illustrative, and does not limit the implementation of the present disclosure, and other ways that meet the relevant laws and regulations can also be applied to the implementation of the present disclosure.

[0082] It should be understood by those skilled in the art that the above discussion of any embodiment is only exemplary and is not intended to suggest that the scope of the present application is limited to these examples; under the idea of the present application, the above embodiments or technical features in different embodiments can also be combined, the steps can be implemented in any order, and there are many other changes of different aspects of the embodiments of the present application as described above. In order to be brief, they are not provided in detail.

[0083] Having described specific details of exemplary embodiments of the application to describe the application, it is obvious to those skilled in the art that the embodiments of the application can be implemented without these specific details or with variations of these specific details. Therefore, these descriptions should be considered as illustrative rather than limiting.

[0084] While the application has been described in connection with specific embodiments thereof, it will be understood that many modifications, substitutions, and variations are possible according to the foregoing description, which can be realized by those ordinarily skilled in the art.

[0085] The embodiments of the application are intended to cover all such alternatives, modifications, and variations as fall within the broad scope of the application as set out in the claims. Accordingly, any one or more features of any element in the foregoing description can be combined with any one or more features of any other element or embodiment, without departing from the scope of the application as set out in the following claims.

Claims

1. A device for measuring thermal conductivity of a material, characterized by, The application relates to a high-temperature experiment box and a method for measuring thermal conductivity of materials. The application relates to a high-temperature experiment box and a method for measuring thermal conductivity of materials. The application relates to a high-temperature experiment box and a method for measuring thermal conductivity of materials. The application relates to a high-temperature experiment box and a method for measuring thermal conductivity of materials. The application relates to a high-temperature experiment box and a method for measuring thermal conductivity of materials.

2. The apparatus for measuring thermal conductivity of a material according to claim 1, wherein, The application relates to a high-temperature experiment box and a method for measuring thermal conductivity of materials.

3. The apparatus for measuring thermal conductivity of a material according to claim 1, wherein, The application relates to a high-temperature experiment box and a method for measuring thermal conductivity of materials.

4. A measurement method applied to the material thermal conductivity measurement device according to any one of claims 1 to 3, characterized by, The application relates to a high-temperature experiment box and a method for measuring thermal conductivity of materials. The application relates to a high-temperature experiment box and a method for measuring thermal conductivity of materials. The application relates to a high-temperature experiment box and a method for measuring thermal conductivity of materials. The application relates to a high-temperature experiment box and a method for measuring thermal conductivity of materials. The application relates to a high-temperature experiment box and a method for measuring thermal conductivity of materials.

5. The measurement method according to claim 4, characterized in that, The application relates to a high-temperature experiment box and a method for measuring thermal conductivity of materials. The application relates to a high-temperature experiment box and a method for measuring thermal conductivity of materials. The application relates to a high-temperature experiment box and a method for measuring thermal conductivity of materials.

6. The measurement method according to claim 5, characterized in that, The application relates to a high-temperature experiment box and a method for measuring thermal conductivity of materials. The application relates to a high-temperature experiment box and a method for measuring thermal conductivity of materials. The application relates to a high-temperature experiment box and a method for measuring thermal conductivity of materials. The application relates to a high-temperature experiment box and a method for measuring thermal conductivity of materials. The application relates to a high-temperature experiment box and a method for measuring thermal conductivity of materials. The application relates to a high-temperature experiment box and a method for measuring thermal conductivity of materials. The application relates to a high-temperature experiment box and a method for measuring thermal conductivity of materials. The application relates to a high-temperature experiment box and a method for measuring thermal conductivity of materials. The application relates to a high-temperature experiment box and a method for measuring thermal conductivity of materials. The application relates to a high-temperature experiment box and a method for measuring thermal conductivity of materials. The application relates to a high-temperature experiment box and a method for measuring thermal conductivity of materials. The application relates to a high-temperature experiment box and a method for measuring thermal conductivity of materials. The application relates to a high-temperature experiment box and a method for measuring thermal conductivity of materials. The application relates to a high-temperature experiment box and a method for measuring thermal conductivity of materials. The application relates to a high-temperature experiment box and a method for measuring thermal conductivity of materials. The application relates to a high-temperature experiment box and a method for measuring thermal conductivity of materials. The application relates to a high-temperature experiment box and a method for measuring thermal conductivity of materials. The application relates to a high-temperature experiment box and a method for measuring thermal conductivity of materials. The application relates to a high-temperature experiment box and a method for measuring thermal conductivity of materials. The application relates to a high-temperature experiment box and a method for measuring thermal conductivity of materials. The application relates to a high-temperature experiment box and a method for measuring thermal conductivity of materials. The application relates to a high-temperature experiment box and a method for measuring thermal conductivity of materials. The application relates to a high-temperature experiment box and a method for measuring thermal conductivity of materials. The application relates to a high-temperature experiment box and a method for measuring thermal conductivity of materials. The application relates to a high-temperature experiment box and a method for measuring thermal conductivity of materials. The application relates to a high-temperature experiment box and a method for measuring thermal conductivity of materials. The application relates to a high-temperature experiment box and a method for measuring thermal conductivity of materials. The application relates to a high-temperature experiment box and a method for measuring thermal conductivity of materials. The application relates to a high-temperature experiment box and a method for measuring thermal conductivity of materials. The application relates to a high-temperature experiment box and a method for measuring thermal conductivity of materials. The application relates to a high-temperature experiment box and a method for measuring thermal conductivity of materials. The application relates to a high-temperature experiment box and a method for

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