Exposure equipment and exposure method

Abstract

The invention relates to the technical field of semiconductors, and provides exposure equipment and an exposure method, the exposure equipment is used for transferring a mask pattern to a photosensitive substrate in an exposure mode, and the exposure equipment comprises a mask shaping device which can be overlapped with a mask to form a pressure adjusting space; the operation mechanism is used for overlapping the mask shaping device with the mask; a mask stage for holding the mask assembly; a pressure controller for controlling the pressure in the pressure adjustment space to shape the mask; the granularity detection part is used for detecting particles on the surface of the mask and / or the mask shaping device; and the transmission part is used for transmitting the masks or the mask combination to the granularity detection part, and / or transmitting the mask combination to the mask table. According to the exposure equipment, masks which do not accord with the cleanliness can be eliminated from the source, and the phenomenon of pollution caused by the mask shaping device or pollution caused by the masks in the conveying process after detection or pollution caused by the masks in the stacking process can be eliminated.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor technology, and in particular to an exposure device and an exposure method. Background Art

[0002] The mask size in some lithography machines is relatively large. When a large mask is adsorbed on the mask stage, the mask will inevitably be affected by its own weight, resulting in vertical deformation. Since the deformation of the mask's own weight far exceeds the focal depth, it will greatly affect the focal depth range of the projection objective, making it difficult to ensure the imaging quality.

[0003] Therefore, it is necessary to compensate for the vertical deformation of the mask, for example, by applying an external force opposite to the gravity of the mask to balance the deformation caused by gravity. In the prior art, it is usually necessary to set a shaping device for the mask, and the shaping device is superimposed on the mask to shape the mask. Since the exposure machine has very high requirements for the cleanliness of the mask, it is necessary to perform particle size detection on the surface of the mask to ensure that the cleanliness of the shaping plate can be monitored to ensure that it meets the production requirements.

[0004] In existing exposure equipment, only the particle size of the mask is usually detected. If a shaping device is added, on the one hand, the cleanliness of the shaping device itself will affect the light transmittance of the mask. On the other hand, during the superposition process of the shaping device and the mask, the cleanliness of the mask and the shaping device may be reduced.

[0005] Therefore, there is an urgent need for an exposure device and an exposure method to ensure that the cleanliness of the shaping device and the mask after superposition meets the requirements. Summary of the invention

[0006] The invention provides an exposure device and an exposure method. In the exposure device, the particle size of the mask and the mask combination after the mask shaping device and the mask are superimposed can be detected, which is beneficial to ensure that the overall cleanliness of the mask shaping device and the mask after superimposition meets the requirements.

[0007] The present invention provides an exposure device for transferring a mask pattern onto a photosensitive substrate by exposure, the exposure device comprising:

[0008] A mask shaping device, which can be overlapped with the mask to form a pressure regulating space;

[0009] An operating mechanism, which is used to overlap the mask shaping device with the mask to form a mask combination;

[0010] A mask stage, which is used to hold the mask assembly;

[0011] A pressure controller for controlling the pressure in the pressure regulating space to shape the mask;

[0012] A particle size detection unit, which is used to detect particles on the surface of the mask and / or the mask shaping device;

[0013] The transporting section is used to transport the mask or the mask combination to the particle size detection section and / or to transport the mask combination to the mask stage.

[0014] Optionally, a cache table is also included, and the cache table is used to place the mask or mask combination.

[0015] Optionally, it further comprises a signal sending unit, wherein the signal sending unit is used to send a mask replacement signal to the transmission unit when the mask needs to be replaced, and the transmission unit transports the mask assembly to the mask stage when receiving the mask replacement signal.

[0016] Optionally, the transmission unit is used for:

[0017] Transmitting the mask or the mask shaping device or the mask combination to the particle size detection section;

[0018] and / or, transferring the mask or mask shaping device or mask combination from the particle size detection section to the cache station;

[0019] And / or, transferring the mask combination from the buffer stage to the mask stage.

[0020] Optionally, the transmission unit is used for:

[0021] Before receiving the mask change signal:

[0022] Transmitting the mask or the mask shaping device or the mask combination to the particle size detection section;

[0023] The mask or mask shaping device or mask combination that has completed the particle size detection is transmitted from the particle size detection unit to the buffer station;

[0024] After receiving the mask change signal:

[0025] The mask combination is transferred from the buffer stage to the mask stage.

[0026] Optionally, the mask shaping device comprises a shaping frame and a cover;

[0027] The middle part of the shaping frame is a hollow structure that penetrates through two sides of the shaping frame along a first direction;

[0028] The cover seals and covers one side of the shaping frame along the first direction, and the other side of the shaping frame along the first direction is used to be sealed and connected with the mask to form a closed pressure adjustment space in the shaping frame;

[0029] The shaping frame has a first channel, and the first channel is connected to the pressure regulating space.

[0030] Optionally, the shaping frame has a second channel, and the second channel is connected to a side of the shaping frame that contacts the mask.

[0031] The present invention also provides an exposure method, comprising the following steps:

[0032] S1: transferring the mask to the particle size detection table for particle size detection;

[0033] S2: transporting the mask to a buffer station;

[0034] S3: The mask shaping device is transferred to the buffering station, and the operating device overlaps the mask shaping device with the mask to form a mask combination;

[0035] S4: transmitting the mask assembly to the particle size detection table for particle size detection;

[0036] S5: transporting the mask assembly to a mask stage;

[0037] S6: causing the mask shaping device to adsorb onto the mask to form a pressure regulating space between the two, and adjusting the air pressure in the pressure regulating space to shape the mask;

[0038] S7: The mask stage holds the mask assembly, and the exposure device transfers the pattern on the mask to the photosensitive substrate.

[0039] Optionally, step S2-1 is further included between step S2 and step S3;

[0040] Step S2-1: transporting the mask shaping device to the particle size detection table for particle size detection.

[0041] Optionally, step S5-1 is further included between step S5 and step S6;

[0042] S5-1: confirming the position deviation of the mask assembly relative to the reference plate of the mask stage, and adjusting the posture of the mask assembly to compensate for the position deviation.

[0043] Optionally, step S4-1 is further included between step S4 and step S5;

[0044] S4-1: The mask assembly is transferred to a buffer station, and the old mask assembly to be replaced on the mask station is transferred to a particle size detection station for temporary storage.

[0045] Optionally, the step S4-1 further includes a step S4-2;

[0046] S4-2: Separate the mask shaping device from the mask in the old mask assembly, and transport the separated mask shaping device and the mask to designated locations respectively.

[0047] Optionally, in step S4-2, the mask shaping device in the old mask assembly is transported to a cache station, and then the mask shaping device is transported from the cache station to the first designated position.

[0048] Optionally, in step S4-2, the masks in the old mask assembly are transported from the particle size detection station to the second designated position.

[0049] In such a configuration, in the above-mentioned exposure equipment and exposure method, a buffer station is provided for temporary storage of the mask or mask shaping device or mask combination. The buffer station is used as a transfer point to facilitate the orderly execution of the conveying process. In addition, the exposure equipment and the transmission method can not only perform particle size detection on the mask during the transmission process, but also perform particle size detection on the mask combination formed after the mask and the mask shaping device are superimposed. On the one hand, the particle size detection of the mask before superposition helps to ensure the cleanliness requirements of the mask, and then excludes the masks that do not meet the cleanliness requirements from participating in the subsequent superposition process, and can exclude masks that do not meet the cleanliness requirements from the source, which helps to reduce the probability of rework due to the cleanliness not meeting the requirements and improve the efficiency of mask transmission. On the other hand, after superposition, the particle size detection of the mask combination is performed to ensure that the superimposed mask combination meets the cleanliness requirements, which helps to eliminate the phenomenon that the cleanliness of the mask combination does not meet the requirements due to the contamination of the mask shaping device itself or the contamination of the mask during the transportation process after detection or the contamination during the superposition process, and helps to ensure the cleanliness of the mask combination.

[0050] In the present invention, by combining the particle size detection of the mask with the particle size detection of the mask combination after superposition, it helps to increase the probability of the mask combination meeting the cleanliness requirements and effectively reduce the probability of not meeting the cleanliness requirements. This is because through the particle size detection of the mask, masks that do not meet the cleanliness requirements are most likely eliminated from the source to participate in the subsequent superposition process. BRIEF DESCRIPTION OF THE DRAWINGS

[0051] Figure 1 is a schematic diagram of an existing mask deformation structure;

[0052] Figure 2 A schematic diagram of a shaping structure of a mask shaping device according to an embodiment of the present invention;

[0053] Figure 3 It is a structural schematic diagram of a mask shaping device according to an embodiment of the present invention;

[0054] Figure 4 A partial structural schematic diagram of a mask shaping device according to an embodiment of the present invention;

[0055] Figure 5 A schematic diagram of a mask transfer process according to an embodiment of the present invention;

[0056] Figure 6 A schematic block diagram of a mask transmission process according to an embodiment of the present invention;

[0057] Figure 7 FIG. 4 is a schematic diagram of a mask transfer process according to an embodiment of the present invention.

[0058] The reference numerals are as follows:

[0059] 100-mask; 110-mask shaping device; 120-plate library; 130-plate pick-up and placement hand; 140-plate box unlocking mechanism; 150-granularity detection platform; 160-cache table; 170-plate exchange hand; 180-mask table; 181-illumination device; 182-projection objective lens; 190-workpiece table;

[0060] 10-shaping frame; 11-waist-shaped groove;

[0061] 20-covering piece;

[0062] 30-pressure regulating space;

[0063] 40-sealing gasket;

[0064] 50-Plastic version of the gas block;

[0065] 60-Plastic version of the lug;

[0066] 70- plastic plate limit block;

[0067] 80- plastic plate sensor baffle;

[0068] a-First direction.

[0069] As used in the invention, the singular forms "one", "a", and "the" include plural objects, the term "or" is usually used to include the meaning of "and / or", the term "several" is usually used to include the meaning of "at least one", and the term "at least two" is usually used to include the meaning of "two or more". In addition, the terms "first", "second", and "third" are used only for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as "first", "second", and "third" can explicitly or implicitly include one or at least two of the features. In addition, as used in the invention, "installed", "connected", "connected", and one element "set" to another element should be understood in a broad sense, usually only indicating that there is a connection, coupling, matching or transmission relationship between the two elements, and the connection, coupling, matching or transmission between the two elements can be direct or indirect through an intermediate element, and cannot be understood as indicating or implying the spatial position relationship between the two elements, that is, one element can be in any orientation such as inside, outside, above, below or on one side of another element, unless the content clearly indicates otherwise. For those skilled in the art, the specific meanings of the above terms in the invention can be understood according to specific circumstances. In addition, directional terms such as above, below, up, down, upward, downward, left, right, etc. are used with respect to the exemplary embodiments as they are shown in the figures, with the upward or upper direction toward the top of the corresponding figure, and the downward or lower direction toward the bottom of the corresponding figure.

[0070] Please refer to Figure 1 As shown, the large-sized mask 100 will inevitably be affected by its own weight, resulting in deformation in its vertical direction. Since the deformation of the mask 100 due to its own weight far exceeds the focal depth, it will greatly affect the focal depth range of the projection lens, making it difficult to ensure the imaging quality, so it is necessary to compensate for the sinking of the mask due to its own weight.

[0071] On this basis, in this embodiment, a mask shaping device 110 is provided, such as Figure 2 As shown, after the mask shaping device 110 is superimposed on the mask 100, a force can be applied to the mask 100 to overcome its own weight, thereby compensating for the deformation caused by its own weight.

[0072] Please refer to Figure 3 As shown, the mask shaping device 110 includes a shaping frame 10 and a cover 20;

[0073] The middle part of the shaping frame 10 is a hollow structure that penetrates through both sides of the shaping frame 10 along the first direction a. In this embodiment, the mask shaping device 110 shapes the mask 100 of a rectangular structure, so the shaping frame 10 is a square frame structure as a whole, and the corresponding cover 20 is also adaptively set to a rectangular plate structure. The cover 20 is made of a transparent material to allow light to pass through, and the corresponding first direction a is the vertical direction of the cover 20.

[0074] The shaping frame 10 is preferably made of a material with high strength and elasticity coefficient, such as polycarbonate, which is a colorless and transparent material with high strength to meet the strength requirements of the shaping frame 10 as the frame of the mask shaping device. At the same time, its elasticity coefficient is high and it is not easy to scratch the mask 100. In addition, the shaping frame 10 is made of transparent material, which will also reduce the influence of the frame on light transmittance.

[0075] In other alternative embodiments, the shape of the shaping frame 10 can be adaptively adjusted based on the shape of the mask 100 being shaped, and similarly, the cover 20 can be adaptively adjusted based on the shape of the shaping frame 10 .

[0076] The cover 20 is sealed and covers one side of the shaping frame 10 along the first direction a. The cover 20 may be a glass plate and may be sealed and connected to the shaping frame 10 by bonding, mechanical fastening, etc. The other side of the shaping frame 10 along the first direction a is used to be sealed and connected to the mask 100 and form a closed pressure adjustment space 30 in the shaping frame 10.

[0077] In this embodiment, after the mask shaping device 110 is superimposed on the mask 100, that is, after the shaping frame 10 is superimposed on the mask 100, a sealed connection relationship is formed. The shaping frame 10 and the mask 100 are in a detachable connection relationship. In this embodiment, a sealing gasket 40 is added to ensure the sealing performance of the two. The shape adaptation of the sealing gasket 40 and the shaping frame 10 are both square frame structures. The sealing gasket 40 is arranged on one side of the shaping frame 10, so that the shaping frame 10 is sealed and connected to the mask 100 through the sealing gasket 40 to form a closed pressure regulating space 30. In this way, the mask shaping device 110 is easy to be sealed and connected or separated from the mask 100. For example, when the mask shaping device 110 is superimposed on the mask 100, the two form a sealed connection relationship through the sealing gasket 40, forming a closed pressure regulating space 30. When separation is required, the mask shaping device 110 is lifted, and the mask shaping device 110 and the mask 100 are naturally separated.

[0078] In actual application, the shaping frame 10 is vertically penetrated, that is, the first direction a corresponds to the vertical direction, the lower surface of the shaping frame 10 is connected to the upper surface of the mask 100, and the upper surface of the shaping frame 10 is connected to the lower surface of the cover 20, so the pressure regulating space 30 is located above the mask 100. At this time, the air pressure in the pressure regulating space 30 can be reduced to provide a vertical upward force for the mask 100 to balance the deformation caused by the self-weight of the mask 100, thereby achieving the purpose of shaping the mask 100.

[0079] Of course, in another alternative embodiment, the lower surface of the shaping frame 10 can be connected to the upper surface of the cover 20, and the upper surface of the shaping frame 10 can be connected to the lower surface of the mask 100. In this case, the pressure regulating space 30 is located below the mask 100. At this time, the air pressure in the pressure regulating space 30 can be increased to provide a vertical upward force for the mask 100.

[0080] Please continue to refer to Figure 3 As shown, the shaping frame 10 has a first channel, which is connected to the pressure regulating space 30. The first channel is used to be connected to an external pressure controller. The pressure controller can be a vacuum pump, which is used to evacuate the pressure regulating space 30. By reducing the air pressure in the pressure regulating space 30, the purpose of shaping the mask 100 can be achieved. The air pressure in the pressure regulating space 30 can be adaptively adjusted based on the actual deformation of the mask 100, so that the shaping amount of the mask 100 and its deformation amount are offset.

[0081] Please continue to refer to Figure 3 As shown, the shaping frame 10 has a second channel which is not shown in the figure, and the second channel is connected to a side of the shaping frame 10 which contacts the mask 100 .

[0082] A shaping plate air distribution block 50 is arranged on the side of the shaping frame 10, and an air duct is arranged inside the shaping plate air distribution block 50. The air duct is divided into two paths, and the two air ducts are respectively connected to the first channel and the second channel, wherein the first channel and the second channel are connected to the shaping plate adsorption joint 90 through the shaping plate air distribution block 50, and the shaping plate adsorption joint is connected to the pressure controller device.

[0083] like Figure 4 As shown, a waist-shaped groove 11 is provided on one side where the shaping frame 10 is connected to the mask 100, and the second channel is connected to the waist-shaped groove 11. After the shaping frame 10 and the mask 100 are attached to each other, the mask 100 covers the waist-shaped groove 11, and the external pressure controller evacuates the waist-shaped groove 11 through the second channel, so that the shaping frame 10 and the mask 100 are firmly adsorbed without relative movement, and it is beneficial to ensure the relative sealing between the shaping frame 10 and the mask 100, which helps to form a closed pressure adjustment space 30.

[0084] Please continue to refer to Figure 3 As shown, a shaping plate ear 60 is also provided on the side of the shaping frame 10. The shaping plate ear 60 serves as an interface when the transmission robot transfers the mask shaping device 110. The shaping plate ear 60 can be set to a block structure, a ring structure, etc., which can be adjusted based on the adaptability of the transmission robot.

[0085] A shaping plate limit block 70 is also provided on the side of the shaping frame 10. The inner side below the shaping plate limit block 70 is a wedge-shaped surface. When the mask shaping device 110 and the mask 100 are superimposed, a plurality of shaping plate limit blocks 70 can be provided, for example, one is provided on each side of the shaping frame 10. The wedge-shaped surface helps to guide the initial alignment of the shaping frame 10 and the mask 100. When the mask shaping device 110 and the mask 100 are superimposed, under normal circumstances, there is a certain gap between the wedge-shaped surface and the side of the mask 100.

[0086] A shaping plate sensor baffle 80 is also provided on the side of the shaping frame 10. A plurality of shaping plate sensor baffles 80 may be provided, for example, one shaping plate sensor baffle 80 is provided on at least two sides of the shaping frame 10. When the shaping frame 10 and the mask 100 are superimposed on the buffer table, the position sensor on the buffer table detects the position of the shaping plate sensor baffle 80 before superposition, and after ensuring that the shaping plate is in an accurate position, the shaping plate and the mask are superimposed to ensure the accuracy of superposition.

[0087] The structural forms of the shaping plate air dividing block 50, shaping plate lifting lug 60, shaping plate limiting block 70 and shaping plate sensor baffle 80 are not particularly limited in this embodiment, and their structures can be adaptively adjusted based on actual use requirements. In addition, based on actual needs, the shaping plate lifting lug 60, shaping plate limiting block 70 and shaping plate sensor baffle 80 can be set in an adjustable number, for example, arranged circumferentially around the shaping frame 10.

[0088] The mask shaping device 110, the mask 100 and the cover 20 are all arranged on one side of the shaping frame 10 along the first direction a. The remaining structures, such as the shaping plate air distribution block 50, the shaping plate lifting ear 60, the shaping plate limit block 70 and the shaping plate sensor baffle 80, are all arranged on the side of the shaping frame 10 perpendicular to the first direction a and not higher than the upper surface of the cover 20. The lower surface of the mask 100 and the upper surface of the cover 20 are made flat and their edges are free of obstruction and interference, so that the particle size detection device can perform particle size detection on the mask 100 and the cover 20 without interference, reduce the interference of other components during the particle size detection process, and help improve the detection accuracy.

[0089] For mask transmission, this embodiment also provides an exposure device for transferring the mask pattern to the photosensitive substrate by exposure. Figure 5 As shown, the exposure equipment includes a mask shaping device 110, a plate library 120, a plate picking and placing hand 130, a plate box unlocking mechanism 140, a particle size detection platform 150, a cache table 160, a plate exchange hand 170, a mask table 180, a workpiece table 190, a pressure controller and a signal sending unit.

[0090] The mask shaping device 110 can be overlapped with the mask 100 to form a pressure regulating space. The structure of the mask shaping device 110 is described in detail in the above content and will not be repeated here.

[0091] The exchange plate hand 170 is used as the operating mechanism, which is used to overlap the mask shaping device with the mask to form a mask combination;

[0092] A mask stage 180, which is used to hold the mask assembly;

[0093] A pressure controller, which is used to control the pressure in the pressure regulating space to shape the mask. The pressure controller is, for example, a suction pump, the air inlet of the suction pump is connected to the regulating space, and the pressure in the pressure regulating space is controlled by suction;

[0094] The particle size detection platform 150 serves as a particle size detection unit, which is at least used to detect particles on the surface of the mask and / or the mask assembly;

[0095] The plate pick-and-place hand 130, the plate exchange hand 170 and the detection plate fork of the particle size detection platform 150 together serve as a transmission part for transmitting the mask or mask combination to the particle size detection part, and / or transmitting the mask combination to the mask stage. The specific conveying method of the transmission part is determined based on the actual exposure process.

[0096] The following describes the functions of each unit in the exposure equipment and the workflow of each unit;

[0097] The plate library 120 is used to store the plate box loaded with the mask 100 or the mask shaping device 110.

[0098] The plate picker 130 is used to place the plate box loaded with the mask 100 or the mask shaping device 110 to a specified position in the plate library 120, or to take the plate box loaded with the mask 100 or the mask shaping device 200 out of the plate library 120 and transport it to the plate box unlocking mechanism 140.

[0099] The plate box unlocking mechanism 140 is used to open the plate box, and the plate exchanger 170 is used to take out the mask 100 or the mask shaping device 110 in the plate box, or the plate exchanger 170 is used to transfer the mask 100 or the mask shaping device 110 to other positions.

[0100] The particle size detection platform 150 is used to detect the particle size of the mask 100 or the mask shaping device 110 or the superposition of the two, that is, to detect whether the light transmission performance thereof meets the requirements.

[0101] The cache table 160 serves as a temporary storage position, and the workpiece table 190 is used to place workpieces, such as silicon wafers. The mask table 180 is equipped with an illumination device 181 to generate light. The illumination light emitted from the illumination device 181 is evenly transmitted through the mask combination, and the pattern on the mask 100 is imaged on the photosensitive substrate via the projection objective lens 182, thereby transferring the pattern on the mask to the photosensitive substrate, which is convenient for being a silicon wafer.

[0102] The plate library 120 is adjacent to the plate picking and placing hand 130, the plate box unlocking mechanism 140 is adjacent to the plate library 120, the particle size detection platform 150 is adjacent to the plate box unlocking mechanism 140, the cache table 160 is adjacent to the particle size detection platform 150, the plate exchange hand 170 is located above the cache table 160, the mask table 180 is adjacent to the cache table 160, and the workpiece table 190 is located below the mask table 180.

[0103] The plate library 120, the plate pick-and-place hand 130, the plate box unlocking mechanism 140, the particle size detection platform 150, the buffer table 160, the plate exchange hand 170, the mask table 180 and the workpiece table 190 all adopt existing structures and are not described in detail here.

[0104] The signal sending unit is used to send a mask replacement signal to the transmission unit when the mask needs to be replaced, and the transmission unit transmits the mask assembly to the mask stage when receiving the mask replacement signal, and the mask assembly is specifically transmitted to the mask stage by the exchange plate hand 170. The signal sending unit can be, for example, a central processing unit (CPU), or other general-purpose processors, digital signal processors (DSP), application-specific integrated circuits (ASIC), off-the-shelf programmable gate arrays (FPGAs) or other programmable logic devices, discrete gates or transistor logic devices, discrete hardware components, etc.

[0105] Wherein, the transmission unit is used for:

[0106] Before receiving the mask replacement signal, the mask 100 or the mask shaping device 110 or the mask combination is transmitted to the particle size detection platform 150 for particle size detection; specifically, the mask 100 can be taken out by the plate exchanger 170 and handed over to the particle size detection platform 150 for particle size detection of the mask 100; the mask combination can be placed on the particle size detection platform 150 by the plate exchanger 170 for particle size detection of the mask combination; the plate exchanger 170 can take out the plate box where the mask shaping device 110 is placed from the plate library, and place it on the particle size detection platform 150 for particle size detection of the mask shaping device 110;

[0107] And / or, the mask 100 or the mask shaping device 110 or the mask combination that has completed the particle size detection is transferred from the particle size detection section to the cache table 160; specifically, the detection plate fork of the particle size detection platform 150 drives the mask 100 or the mask shaping device 110 or the mask combination to move within the travel range of the exchange plate hand 170, and the exchange plate hand 170 lifts the mask 100 or the mask shaping device 110 or the mask combination and hands it over to the cache table 160.

[0108] And / or, after receiving the mask replacement signal, the mask assembly is transferred from the buffer stage 160 to the mask stage 180. Specifically, the mask assembly can be placed on the mask stage 180 by the exchange plate hand 170.

[0109] The components that need to be transmitted by the transmission unit and the transmission process can be adaptively adjusted based on the actual exposure process.

[0110] The above-mentioned exposure equipment is provided with a buffer station 160 for temporarily storing the mask 100 or the mask shaping device 110 or the mask combination. The buffer station 160 is used as a transfer point to facilitate the orderly execution of the conveying process. In addition, the exposure equipment can perform a particle size test on the mask 100 during the transmission process, and can also perform a particle size test on the mask combination formed by superimposing the mask 100 and the mask shaping device 110. On the one hand, the particle size detection of the mask 100 before stacking helps to ensure the cleanliness requirements of the mask 100, and thus exclude the mask 100 that does not meet the cleanliness requirements from participating in the subsequent stacking process. The mask 100 that does not meet the cleanliness requirements can be excluded from the source, which helps to reduce rework due to unsatisfactory cleanliness requirements and improve the mask transmission efficiency. On the other hand, the particle size detection of the mask combination after stacking is performed to ensure that the mask combination after stacking meets the cleanliness requirements, which helps to exclude the phenomenon that the cleanliness of the mask combination does not meet the requirements due to contamination of the mask shaping device 110 itself or contamination of the mask 100 during transportation after detection or contamination during the stacking process, and helps to ensure the cleanliness of the mask combination.

[0111] On this basis, the present invention also provides an exposure method, comprising the following steps:

[0112] S1: The mask 100 is transferred to the particle size detection platform 150 for particle size detection; specifically, the plate box is first loaded into the plate library 120, and the plate picker 130 transports the plate box with the mask placed on it to the plate box unlocking mechanism 140, and the box cover is opened at the plate box unlocking mechanism 140, and the mask 100 is taken out by the plate exchanger 170 and handed over to the particle size detection platform 150 for particle size detection of the mask 100; after the plate exchanger 170 takes out the mask from the plate box, the plate box unlocking mechanism 140 puts the box cover back on the base of the plate box, and then the plate picker 130 puts the empty plate box back to the plate library.

[0113] S2: The mask 100 is transported to the buffer table; after the particle size detection is completed, the detection plate fork of the particle size detection platform 150 drives the mask 100 to move into the travel range of the plate exchange hand 170, and the plate exchange hand 170 lifts the mask 100 and hands it over to the buffer table 160, and performs mechanical alignment on the buffer table 160.

[0114] S3: transporting the mask shaping device 110 to the buffer stage 160 and overlapping it with the mask 100 on the buffer stage 160 to form a mask assembly;

[0115] Specifically, the plate picker 130 transports the plate box containing the mask shaping device 110 to the plate box unlocking mechanism 140 and transports it to the handover position. Since the plate box containing the mask shaping device 110 generally does not have a box cover, it is not necessary to open the box cover through the plate box unlocking mechanism 140. When the plate box containing the mask shaping device 110 has a box cover, the plate picker 130 needs to transport the corresponding plate box to the plate box unlocking mechanism 140 to open the box cover. Then, the plate exchanger 170 takes out the mask shaping device 110 in the plate box and hands it over to the buffer table, and the mask shaping device 110 is overlapped with the mask 100 that has completed mechanical pre-alignment.

[0116] S4: transferring the mask assembly to the particle size detection platform for particle size detection; specifically, the mask assembly may be placed on the particle size detection platform 150 through the exchange plate hand 170 to perform particle size detection of the mask assembly;

[0117] S5: The mask assembly is transported to the mask stage 180 , and after the particle size detection is completed, the mask assembly is placed on the mask stage 180 through the exchange plate hand 170 .

[0118] S6: The mask shaping device is adsorbed onto the mask to form a closed pressure regulating space between the two, and the air pressure in the pressure regulating space is adjusted to shape the mask. Specifically, the mask table adsorption vacuum mechanism is docked with the interface of the shaping plate air distributor block 50, and vacuum is drawn through the second channel on the shaping plate air distributor block 50, so that the shaping frame 10 and the mask 100 are adsorbed to form a closed pressure regulating space 30. Then, vacuum is drawn through the first channel on the shaping plate air distributor block 50 to reduce the air pressure in the pressure regulating space 30, thereby completing the shaping of the mask 100. At this time, the plate exchanger 170 moves to the cache table 160, and the plate picker 130 puts the plate box base of the mask shaping device 110 back into the plate library 120.

[0119] S7: The mask stage holds the mask assembly, and the exposure device transfers the pattern on the mask to the photosensitive substrate. The illumination light emitted from the illumination device 181 evenly passes through the mask assembly, and the pattern on the mask 100 is imaged on the photosensitive substrate via the projection objective lens 182, thereby transferring the pattern on the mask to the photosensitive substrate.

[0120] In the above exposure method, a buffer station is provided for temporarily storing the mask 100 or the mask shaping device 110 or the mask combination. The buffer station is used as a transfer point to facilitate the orderly execution of the transmission process. In addition, the transmission method not only performs a particle size detection on the mask 100 during the transmission process, but also performs a particle size detection on the mask combination formed by superimposing the mask 100 and the mask shaping device 110. On the one hand, the particle size detection of the mask 100 before stacking helps to ensure the cleanliness requirements of the mask 100, and thus exclude the mask 100 that does not meet the cleanliness requirements from participating in the subsequent stacking process. The mask 100 that does not meet the cleanliness requirements can be excluded from the source, which helps to reduce rework due to unsatisfactory cleanliness requirements and improve the mask transmission efficiency. On the other hand, the particle size detection of the mask combination after stacking is performed to ensure that the mask combination after stacking meets the cleanliness requirements, which helps to exclude the phenomenon that the cleanliness of the mask combination does not meet the requirements due to contamination of the mask shaping device 110 itself or contamination of the mask 100 during transportation after detection or contamination during the stacking process, and helps to ensure the cleanliness of the mask combination.

[0121] In this embodiment, by combining the particle size detection of mask 100 with the particle size detection of the mask combination after stacking, it helps to increase the probability of the mask combination meeting the cleanliness requirements and effectively reduce the probability of not meeting the cleanliness requirements. This is because through the particle size detection of mask 100, masks 100 that do not meet the cleanliness requirements are most likely eliminated from the source to participate in the subsequent stacking process.

[0122] After the mask assembly is transported to the mask stage 180, the position accuracy of the mask assembly directly affects the optical performance, so in this embodiment, step S5-1 is further included between step S5 and step S6;

[0123] S5-1: Confirm the position deviation of the mask assembly relative to the reference plate of the mask stage, and adjust the position of the mask assembly to compensate for the position deviation. Specifically, the optical pre-alignment system measures the position deviation of the mask assembly relative to the reference plate in the three directions of X, Y and RZ, wherein the X direction and the Y direction are two horizontal directions perpendicular to each other, and the Z direction is the vertical direction; after determining the deviation, the exchange plate hand 170 lifts the superimposed mask assembly as a whole, and the exchange plate hand 170 and the mask stage 180 cooperate to compensate for the deviations in the three directions. In this embodiment, the exchange plate hand 170 only has the ability to move in the X direction, so the exchange plate hand 170 compensates for the deviation in the X direction, and the movement of the mask stage 180 itself compensates for the deviations in the Y direction and the RZ direction. After the compensation is completed, the exchange plate hand 170 transfers the mask assembly as a whole to the mask stage 180, and the optical pre-alignment system re-detects the deviation of the mask assembly as a whole. If it still does not meet the standard, the above actions are repeated until the deviation is less than the specified threshold.

[0124] Furthermore, step S2-1 is further included between step S2 and step S3;

[0125] Step S2-1: transport the mask shaping device 110 to the particle size detection table for particle size detection.

[0126] Specifically, the plate box containing the mask shaping device 110 is taken out from the plate library by the plate exchange hand 170, and is placed on the particle size detection platform 150 for particle size detection of the mask shaping device 110; after the particle size detection is completed, the detection plate fork of the particle size detection platform 150 drives the mask shaping device 110 to move within the travel range of the plate exchange hand 170, and the plate exchange hand lifts the mask shaping device 110 and overlaps it with the mask 100.

[0127] This step is used to perform particle size detection on the mask shaping device 110 before stacking, which further ensures the cleanliness of the mask combination after stacking and further reduces the probability that the cleanliness does not meet the requirements. The particle size detection can effectively control the probability that the cleanliness does not meet the requirements by detecting the particle size of the mask 100 before stacking and the particle size of the mask combination after stacking. Therefore, the particle size detection of the mask shaping device 110 before stacking is an optional step, which is selectively added or deleted based on the requirements for the cleanliness of the mask combination during actual use.

[0128] The mask transmission process not only involves the transportation of the newly loaded mask 100 and the mask shaping device 110 as well as the mask combination after the two are superimposed, but also involves the transportation of the old mask combination to be replaced on the mask table 180. At this time, a reasonable transportation process needs to be set up to ensure the orderly and efficient transportation of each component.

[0129] Therefore, please refer to Figure 6 and Figure 7 As shown, further, step S4-1 is also included between steps S4 and S5, and step S4-2 is added after step S4-1; it should be emphasized here that step S4-2 is located after step S4-1, and it is not necessarily located immediately between step S4 and step S5. It can also be located after step S5, as long as it is located after step S4-1.

[0130] S4-1: The mask combination is transferred to the buffer station 160, and the old mask combination to be replaced on the mask station 180 is transferred to the particle size detection station 150 for temporary storage. At this time, the old mask combination to be replaced is removed, so that the position of the mask station 180 is vacated for performing step S5 to place a new mask combination on the mask station 180. After this step is completed, the old mask combination to be replaced is taken out, which requires the mask and the mask shaping device in the old mask combination to be separated, so step S4-2 is added, and step S4-2 can be performed immediately after S4-1, or it can be performed after step S5 is performed.

[0131] S4-2: Separate the mask shaping device from the mask in the old mask assembly, and transport the separated mask shaping device and the mask to the designated positions respectively. During the separation process, it is necessary to ventilate inward through the first channel and the second channel to restore the air pressure, and lift the mask shaping device through the plate exchange hand 170 so that the mask shaping device and the mask are naturally separated, and then transport the mask shaping device to the buffer table, and transport the mask shaping device to the first designated position through the plate exchange hand 170 and the plate pick-and-place hand 130. The first position can be a plate box for placing the mask shaping device, and then the plate box is put back into the plate library by the plate pick-and-place hand 130. At this time, the mask in the old mask assembly is located on the particle size detection table 150, and the mask can be transported to the second designated position by the detection plate fork of the particle size detection table 150 and the plate pick-and-place hand 130. The second designated position can be a plate box for placing the mask, and then the plate box is put back into the plate library by the plate pick-and-place hand 130.

[0132] In summary, the exposure method includes the following steps: S1: transferring the mask to a particle size detection table for particle size detection; S2: transferring the mask to a buffer table; S3: transferring the mask shaping device to the buffer table and superimposing it with the mask on the buffer table to form a mask combination; S4: transferring the mask combination to the particle size detection table for particle size detection; S5: transferring the mask combination to the mask table.

[0133] In this configuration, the above exposure method sets a buffer station for temporarily storing the mask 100 or the mask shaping device 110 or the mask combination, and the buffer station is used as a transfer point to facilitate the orderly execution of the transmission process. In addition, during the transmission process, the transmission method not only performs a particle size detection on the mask 100, but also performs a particle size detection on the mask combination formed by superimposing the mask 100 and the mask shaping device 110. On the one hand, the particle size detection of the mask 100 before stacking helps to ensure the cleanliness requirements of the mask 100, and thus exclude the mask 100 that does not meet the cleanliness requirements from participating in the subsequent stacking process. The mask 100 that does not meet the cleanliness requirements can be excluded from the source, which helps to reduce rework due to unsatisfactory cleanliness requirements and improve the mask transmission efficiency. On the other hand, the particle size detection of the mask combination after stacking is performed to ensure that the mask combination after stacking meets the cleanliness requirements, which helps to exclude the phenomenon that the cleanliness of the mask combination does not meet the requirements due to contamination of the mask shaping device 110 itself or contamination of the mask 100 during transportation after detection or contamination during the stacking process, and helps to ensure the cleanliness of the mask combination.

[0134] By combining the particle size detection of mask 100 with the particle size detection of the mask combination after stacking, it helps to increase the probability of the mask combination meeting the cleanliness requirements and effectively reduce the probability of not meeting the cleanliness requirements. This is because through the particle size detection of mask 100, masks 100 that do not meet the cleanliness requirements are most likely eliminated from the source for participating in the subsequent stacking process.

[0135] Through the above-mentioned conveying method, the old mask assembly and the new mask assembly can be conveyed in an orderly manner, which is conducive to the efficient replacement of the mask assembly.

[0136] The various embodiments in this specification are described in a progressive manner, and each embodiment focuses on the differences from other embodiments. The same or similar parts between the various embodiments can be referenced to each other.

[0137] The above description is only a description of the preferred embodiments of the invention, and is not intended to limit the scope of the invention. Any changes or modifications made by a person of ordinary skill in the art based on the above disclosure shall fall within the scope of protection of the claims.

Claims

1. An exposure device for transferring a mask pattern onto a photosensitive substrate by exposure, characterized in that: include: A mask shaping device, which can be overlapped with the mask to form a pressure regulating space; An operating mechanism, which is used to overlap the mask shaping device with the mask to form a mask combination; A mask stage, which is used to hold the mask assembly; a pressure controller for controlling the pressure in the pressure regulating space to shape the mask; A particle size detection unit, which is used to detect particles on the surface of the mask and / or mask assembly; The transporting section is used to transport the mask or the mask combination to the particle size detection section and / or to transport the mask combination to the mask stage.

2. The exposure device according to claim 1, characterized in that Also included is a cache table, which is used to place a mask or a mask combination.

3. The exposure device according to claim 2, characterized in that It also includes a signal sending unit, which is used to send a mask replacement signal to the transmission unit when the mask needs to be replaced, and the transmission unit transports the mask assembly to the mask stage when receiving the mask replacement signal.

4. The exposure device according to claim 2, characterized in that The transmission unit is used for: Transmitting the mask or the mask shaping device or the mask combination to the particle size detection section for particle size detection; and / or, transferring the mask or mask shaping device or mask combination from the particle size detection section to the cache station; And / or, transferring the mask combination from the buffer stage to the mask stage.

5. The exposure device according to claim 3, characterized in that The transmission unit is used for: Before receiving the mask change signal: Transmitting the mask or the mask shaping device or the mask combination to the particle size detection section; The mask or mask shaping device or mask combination that has completed the particle size detection is transmitted from the particle size detection unit to the buffer station; After receiving the mask change signal: The mask combination is transferred from the buffer stage to the mask stage.

6. The exposure device according to claim 1, characterized in that The mask shaping device comprises a shaping frame and a covering member; The middle part of the shaping frame is a hollow structure that penetrates through two sides of the shaping frame along a first direction; The cover seals and covers one side of the shaping frame along the first direction, and the other side of the shaping frame along the first direction is used to be sealed and connected with the mask to form a closed pressure adjustment space in the shaping frame; The shaping frame has a first channel, and the first channel is connected to the pressure regulating space.

7. The mask shaping device according to claim 6, characterized in that: The shaping frame has a second channel, and the second channel is connected to a side of the shaping frame that contacts the mask.

8. An exposure method, characterized in that: The following steps are involved: S1: transferring the mask to the particle size detection table for particle size detection; S2: transporting the mask to a buffer station; S3: transporting the mask shaping device to the buffering station, and the operating device superimposing the mask shaping device and the mask to form a mask combination; S4: transporting the mask assembly to the particle size detection table for particle size detection; S5: transporting the mask assembly to a mask stage; S6: causing the mask shaping device to adsorb onto the mask to form a pressure regulating space between the two, and adjusting the air pressure in the pressure regulating space to shape the mask; S7: The mask stage holds the mask assembly, and the exposure device transfers the pattern on the mask to the photosensitive substrate.

9. The exposure method according to claim 8, characterized in that: Step S2-1 is also included between step S2 and step S3; Step S2-1: transporting the mask shaping device to the particle size detection table for particle size detection.

10. The exposure method according to claim 8, characterized in that: The step S5-1 is also included between the step S5 and the step S6; S5-1: confirming the position deviation of the mask assembly relative to the reference plate of the mask stage, and adjusting the posture of the mask assembly to compensate for the position deviation.

11. The exposure method according to claim 8, characterized in that: The step S4-1 is also included between the step S4 and the step S5; S4-1: The mask assembly is transferred to a buffer station, and the old mask assembly to be replaced on the mask station is transferred to a particle size detection station for temporary storage.

12. The exposure method according to claim 11, characterized in that: The step S4-1 also includes a step S4-2; S4-2: Separate the mask shaping device from the mask in the old mask assembly, and transport the separated mask shaping device and the mask to designated locations respectively.

13. The exposure method according to claim 12, characterized in that: In the step S4-2, the mask shaping device in the old mask assembly is transported to the buffer station, and then the mask shaping device is transported from the buffer station to the first designated position.

14. The exposure method according to claim 13, characterized in that: In the step S4-2, the masks in the old mask set are transported from the particle size detection station to the second designated position.

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