Polymer processing apparatus and process for implementing the same

Abstract

A polymer processing apparatus includes: an extruder unit configured to receive, melt, and mix an adhesive; and a dispensing valve unit configured to dispense the adhesive onto the substrate. Additionally, the dispensing valve unit may include a positive displacement valve that provides discrete dispensing of the adhesive.

Description

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This application claims the benefit of U.S. Provisional Application No. 63 / 392,564, filed on July 27, 2022, which is incorporated herein by reference in its entirety for all purposes as if fully set forth herein. Technical Field

[0003] The present disclosure relates to a polymer processing apparatus. Additionally, the present disclosure relates to a process for implementing a polymer processing apparatus. Background Art

[0004] Adhesives can be applied to various surfaces using dispensing devices. These dispensing devices can dispense adhesives, such as filamentary adhesives, onto various surfaces, such as the surface of a substrate. Fig.18 A typical dispensing device 1 for dispensing an adhesive is shown. The typical dispensing device 1 may use a barrel 2, which may include one or more heating elements. In addition, the typical dispensing device 1 may include a rotatable screw 3 received in the barrel 2. In addition, the typical dispensing device 1 may include an outlet 4 at the distal end of the barrel 2 for dispensing the adhesive in a molten form from the typical dispensing device 1. In addition, the typical dispensing device 1 may control the flow of the adhesive. In particular, the typical dispensing device 1 controls the operation of the rotatable screw 3 to control the flow of the adhesive dispensed from the outlet 4 of the typical dispensing device 1. Therefore, the typical dispensing device 1 controls the flow of the adhesive dispensed from the outlet 4 based on the pressure of the adhesive provided by the rotatable screw 3.

[0005] In addition, the typical dispensing device 1 may include a check valve 5. The check valve 5 is usually implemented with a closing member to prevent flow. The closing member is spring-loaded to help keep the check valve 5 closed. In addition, the typical dispensing device 1 can control the flow of adhesive. In particular, the typical dispensing device 1 controls the operation of the rotatable screw 3 together with the check valve 5 to control the flow of adhesive dispensed from the outlet 4 of the typical dispensing device 1. Therefore, the typical dispensing device 1 controls the flow of adhesive dispensed from the outlet 4 based on the pressure of the adhesive provided by the rotatable screw 3 in combination with the check valve 5.

[0006] However, controlling the flow of adhesive of a typical dispensing device 1 by operating the rotatable screw 3 with and / or without the check valve 5 results in undesirable application of adhesive. Fig.19, adhesive 7 has been applied to substrate 8 by a typical dispensing device 1 through the operation of a rotatable screw 3 together with a check valve 5. This application of adhesive 7 results in poor cut-off 9 due to the "stretchability" of the material; this application of adhesive 7 is poor even in the molten state; this application of adhesive 7 has less precise metering, as shown by the end 11 including the starting end and the ending end and the thick portion 12; and thus this application of adhesive 7 achieves less precise dispensing. In this regard, the typical dispensing device 1 mainly operates based on pressure, for example using a check valve 5 and / or a rotatable screw 3.

[0007] Therefore, what is needed is a dispensing device and / or a dispensing device process having better cutoff, more accurate metering, and more precise dispensing. Summary of the invention

[0008] In one general aspect, a polymer processing device may include: an extruder unit configured to receive, melt and mix an adhesive; and a dispensing valve unit configured to dispense the adhesive onto a substrate, and wherein the dispensing valve unit may include a positive displacement valve / positive displacement valve that provides discrete dispensing of the adhesive.

[0009] In one general aspect, a polymer processing device may include: an extruder unit configured to receive, melt and mix an adhesive; and a dispensing valve unit configured to dispense the adhesive onto a substrate, and wherein the dispensing valve unit is configured to be implemented as a pneumatic valve, an electrically operated valve, an electromagnetically operated valve and / or a hydraulically operated valve.

[0010] In one general aspect, a process may include: implementing an extruder unit configured to receive, melt and mix an adhesive; implementing a dispensing valve unit configured to dispense the adhesive onto a substrate, and wherein the dispensing valve unit is configured to be implemented as a pneumatic valve, an electrically operated valve, a solenoid operated valve and / or a hydraulically operated valve.

[0011] Various other features, details, and advantages of the present invention will become more readily apparent to those of ordinary skill in the art upon reading the following detailed description of illustrative embodiments in conjunction with the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] Figure 1 A perspective view of a polymer processing apparatus according to aspects of the present disclosure is shown.

[0013] Figure 2 Shown according to Figure 1 Front view of a polymer processing apparatus.

[0014] Figure 3 Shown according to Figure 1 Side view of a polymer processing apparatus.

[0015] Figure 4 Shown according to Figure 1 Top view of a polymer processing apparatus.

[0016] Figure 5 Shown according to Figure 1 Another side view of the polymer processing device.

[0017] Figure 6 Shown according to Figure 1 Rear view of a polymer processing unit.

[0018] Figure 7 Shown according to Figure 1 Bottom view of a polymer processing device.

[0019] Figure 8 Shown according to Figure 1 A cross-sectional view of an exemplary embodiment of a polymer processing apparatus.

[0020] Fig. 9 Shown according to Figure 8 A partial cross-sectional view of a polymer processing device.

[0021] Fig.10 Shown according to Figure 8 A partial cross-sectional view of a polymer processing device.

[0022] Fig.11 Shown according to Figure 8 A partial cross-sectional view of a polymer processing device.

[0023] Fig.12 Shown according to Fig.11 A partial cross-sectional view of a polymer processing device.

[0024] Fig.13 Shown according to Fig.12 A partial cross-sectional view of the dispensing valve unit 200.

[0025] Fig.14 Shown according to Figure 1 Side view of a polymer processing apparatus.

[0026] Fig.15 Shown according to Figure 1 Side view of a polymer processing apparatus.

[0027] Fig.16 An exemplary process for implementing a polymer processing apparatus according to aspects of the present disclosure is shown.

[0028] Fig.17The application of an adhesive to a substrate using the polymer processing apparatus of the present disclosure is shown.

[0029] Fig.18 A typical dispensing device for dispensing adhesive is shown.

[0030] Fig.19 The adhesive is shown having been applied to a substrate using a typical dispensing apparatus. DETAILED DESCRIPTION

[0031] Figure 1 A perspective view of a polymer processing apparatus according to aspects of the present disclosure is shown.

[0032] Figure 2 Shown according to Figure 1 Front view of a polymer processing apparatus.

[0033] Figure 3 Shown according to Figure 1 Side view of a polymer processing apparatus.

[0034] Figure 4 Shown according to Figure 1 Top view of a polymer processing apparatus.

[0035] Figure 5 Shown according to Figure 1 Another side view of the polymer processing device.

[0036] Figure 6 Shown according to Figure 1 Rear view of a polymer processing unit.

[0037] Figure 7 Shown according to Figure 1 Bottom view of a polymer processing device.

[0038] In particular, Figure 1 A polymer processing device 100 is shown. The polymer processing device 100 includes a dispensing valve unit 200 and an extruder unit 300. The polymer processing device 100 is configured to operate in conjunction with the dispensing valve unit 200 and the extruder unit 300 to implement a configuration for receiving, melting, mixing, and dispensing an adhesive (such as a filament adhesive) onto a substrate. In particular, the polymer processing device 100 is configured to operate in conjunction with the dispensing valve unit 200 to carefully and accurately control the dispensing of the adhesive received from the extruder unit 300.

[0039] In this regard, the dispensing valve unit 200 may be implemented to operate as a positive displacement valve / positive displacement valve that provides discrete dispensing of adhesive from the polymer processing device 100. More specifically, the polymer processing device 100 may be configured to operate the dispensing valve unit 200 to control the flow of adhesive for dispensing the adhesive from the polymer processing device 100. In this regard, the polymer processing device 100 may implement the dispensing valve unit 200 to open and allow the flow of adhesive generated by the extruder unit 300 to flow through the dispensing valve unit 200 for dispensing on a substrate; and the polymer processing device 100 may implement the dispensing valve unit 200 to close and stop the flow of adhesive generated by the extruder unit 300 through the dispensing valve unit 200 for cutting off the dispensing of the adhesive on the substrate.

[0040] Therefore, reference Fig.17 , the polymer processing device 100 is configured to operate in conjunction with the dispensing valve unit 200 to apply the adhesive 500 to the substrate 502 at the end of the dispensing routine, wherein the start 506 of the adhesive 500 is more controlled and / or more accurate. In addition, the polymer processing device 100 is configured to operate in conjunction with the dispensing valve unit 200 to provide a more controlled and / or more accurate cutoff 504 of the application of the adhesive 500 at the beginning of the dispensing routine. In addition, the dispensing valve unit 200 is configured to: even in the molten state, the "stretchability" of the material is addressed by the positive displacement operation of the dispensing valve unit 200.

[0041] In addition, refer to Fig.17 , the dispensing valve unit 200 is configured to provide a more precise metering of the adhesive 500 from the extruder unit 300 of the polymer processing device 100, as shown by the more uniform width of the adhesive 500. In this regard, the polymer processing device 100 can implement the dispensing valve unit 200 to provide a more precise flow of the adhesive from the extruder unit 300. Therefore, the dispensing valve unit 200 can be configured to provide precise metering of the adhesive from the extruder unit 300 through the controlled operation of the dispensing valve unit 200.

[0042] In several aspects, the dispensing valve unit 200 of the polymer processing device 100 can be implemented as a pneumatic valve, an electrically operated valve, a solenoid operated valve, a hydraulically operated valve, and / or the like. It will be understood that the dispensing valve unit 200 and the polymer processing device 100 can be integrated together or coupled in any desired manner.

[0043] In several aspects, the polymer processing device 100 and / or the extruder unit 300 can include a polymer inlet 106. In several aspects, the polymer inlet 106 can be supported by the block 102. The polymer inlet 106 can be configured to receive an adhesive, such as a filament adhesive, and direct the adhesive into the extruder unit 300.

[0044] In several aspects, the polymer processing device 100 may include an air supply valve 108, which may be configured to supply pressurized air to the dispensing valve unit 200 for operating the dispensing valve unit 200 as described herein. In particular, the polymer processing device 100 may include a conduit 104 to deliver pressurized air from the air supply valve 108 to the dispensing valve unit 200. The polymer processing device 100 may further include: various connectors between the conduit 104 and the air supply valve 108; and various connectors between the air supply valve 108 and the dispensing valve unit 200. In addition, the air supply valve 108 may include at least one connector 116 for connecting to a pressurized air source. Therefore, the air supply valve 108 may be configured to control the delivery of pressurized air from the pressurized air source to the dispensing valve unit 200. The air supply valve 108 may be implemented as a valve, a regulator, a solenoid valve, and / or the like for controlling the delivery of pressurized air from the pressurized air source to the dispensing valve unit 200. The various connectors associated with the air supply valve 108 may be threaded connectors, push-on connectors, and / or the like.

[0045] In several aspects, the dispensing valve unit 200 can be attached to and moved by a moving mechanism (not shown), such as a robot, an xy positioner, and / or the like. In particular, the dispensing valve unit 200 can be moved on the surface of the substrate in a pattern by the moving mechanism.

[0046] Figure 8 Shown according to Figure 1 A cross-sectional view of an exemplary embodiment of a polymer processing apparatus.

[0047] Fig. 9 Shown according to Figure 8 A partial cross-sectional view of a polymer processing device.

[0048] like Figure 8 and Fig. 9 As shown in , the extruder unit 300 may include an extruder barrel 302 and an extruder screw 304. In several aspects, the extruder barrel 302 may be configured as a barrel used in a single screw extruder embodiment of the extruder unit 300. In addition, the extruder screw 304 may have a configuration as an extruder screw used in a single screw extruder. However, the extruder unit 300 may be implemented by any number of extruder barrels 302, by any number of extruder screws 304, by any type of extruder technology, and / or the like.

[0049] In some aspects, the extruder screw 304 may include an axis having a diameter that increases gradually along its length. In some aspects, the axis extending around the extruder screw 304 may be a spiral thread for conveying molten material in a forward direction toward the dispensing valve unit 200 as the extruder screw 304 rotates in the extruder barrel 302. In addition, in some aspects, a notch may be provided in the spiral thread of the extruder screw 304 to provide a clamping lug. These clamping lugs of the extruder screw 304 may provide additional edges that help capture and actively pull the continuous filament adhesive through the inlet and into the extruder barrel 302.

[0050] refer to Fig. 9 , the extruder barrel 302 can have an inner surface 306 that is cylindrical and engages the extruder screw 304 in a surrounding relationship. The inner surface 306 terminates in an outlet 308 at the distal end of the extruder barrel 302. The outlet 308 can be generally circular, but can have any other suitable shape. The outlet 308 of the extruder unit 300 outputs the adhesive to the dispensing valve unit 200 and / or the intermediate component of the polymer processing device 100.

[0051] The extruder barrel 302 and / or the extruder unit 300 can include one or more heating elements 318 for heating the inner surface 306 and melting the adhesive during the dispensing operation. In several aspects, the one or more heating elements 318 can be embedded in the wall of the extruder barrel 302, the one or more heating elements 318 can be attached to the wall of the extruder barrel 302, and / or the one or more heating elements 318 can be in thermal communication with the wall and / or the inner surface 306 of the extruder barrel 302 in other ways. In several aspects, the inner surface 306 of the extruder barrel 302 can be grooved or otherwise textured to increase friction between the extruder barrel 302 and the extruded adhesive.

[0052] The polymer processing device 100 and / or the extruder unit 300 may include an inlet for receiving an adhesive. The inlet may be configured to receive the adhesive and direct the adhesive into the extruder unit 300, the extruder screw 304 and / or the extruder barrel 302 to be mixed and melted by the extruder unit 300 for subsequent delivery to the dispensing valve unit 200.

[0053] like Figure 8 As shown in FIG. 1 , the extruder unit 300 may include a device for winding an extruder screw 304 around a Figure 8The drive mechanism 310 is rotated about an axis parallel to the y-axis shown in FIG. The rotation of the extruder screw 304 relative to the extruder barrel 302 mixes, melts and / or moves the adhesive within the extruder unit 300. In particular, the extruder screw 304 moves the adhesive through the extruder unit 300 toward the outlet 308 and the dispensing valve unit 200.

[0054] Fig.10 Shown according to Figure 8 A partial cross-sectional view of a polymer processing device.

[0055] refer to Fig.10 , the drive mechanism 310 may include a gearbox 314 and a motor 312. The motor 312 may be implemented by any motor technology. The motor 312 may include a motor output 320 (such as an output shaft having a rotating connection portion), which transmits the rotational torque generated by the motor 312 to the gearbox 314. The gearbox 314 may be configured to receive the rotational torque generated by the motor 312 and output the rotational torque to a gearbox output 322 (such as an output shaft having a rotating connection portion). The gearbox output 322 may be rotationally engaged and / or connected to the extruder screw 304. Therefore, the operation of the motor 312 rotates the motor output 320, which in turn rotates the gearbox output 322, and the gearbox output 322 in turn rotates the extruder screw 304.

[0056] Fig.11 Shown according to Figure 8 A partial cross-sectional view of a polymer processing device.

[0057] In particular, Fig.11 Further exemplary details of one aspect of the dispensing valve unit 200 are shown. In this regard, the dispensing valve unit 200 of the polymer processing device 100 may be implemented as a pneumatic valve, an electrically operated valve, a solenoid operated valve, a hydraulically operated valve, and / or the like.

[0058] The dispensing valve unit 200 and / or the extruder unit 300 may include a manifold 324. The manifold 324 may direct the adhesive exiting the outlet 308 from the extruder unit 300 to the dispensing valve unit 200. In this regard, the manifold 324 may include one or more conduits 326 that may direct the adhesive from the outlet 308 of the extruder unit 300 to the dispensing valve unit 200.

[0059] Additionally, the manifold 324 can include one or more heating elements 348. Implementing the one or more heating elements 348 within the manifold 324 can heat the adhesive flowing through the manifold 324. In several aspects, the one or more heating elements 348 can be embedded in the wall of the manifold 324, the one or more heating elements 348 can be attached to the wall of the one or more conduits 326, and / or the one or more heating elements 348 can be in thermal communication with the wall of the one or more conduits 326 in other ways.

[0060] In this regard, the dispensing valve unit 200 can be implemented to operate as a positive displacement valve that provides discrete dispensing of adhesive from the extruder unit 300 and / or the manifold 324. More specifically, the polymer processing device 100 can be configured to operate the dispensing valve unit 200 to control the flow of adhesive for dispensing the adhesive from the extruder unit 300 and / or the manifold 324. In this regard, the polymer processing device 100 can implement the dispensing valve unit 200 to open and allow the flow of adhesive generated by the extruder unit 300 to flow through the manifold 324 and then flow through the dispensing valve unit 200 for dispensing on the substrate; and the polymer processing device 100 can implement the dispensing valve unit 200 to close and stop the flow of adhesive generated by the extruder unit 300 and provided by the manifold 324 through the dispensing valve unit 200 for cutting off the dispensing of the adhesive on the substrate.

[0061] Fig.12 Shown according to Fig.11 A partial cross-sectional view of a polymer processing device.

[0062] Fig.13 Shown according to Fig.12 A partial cross-sectional view of the dispensing valve unit 200.

[0063] In particular, Fig.12 and Fig.13 Further exemplary details of one aspect of the dispensing valve unit 200 implemented as a pneumatic valve connected to the manifold 324 are shown. Fig.13 , the dispensing valve unit 200 may include: a module body 40; a valve stem 42 mounted for movement within the module body 40; and a supply chamber 44 that may be disposed in the module body 40. A valve seat 48 may be disposed between an inlet 49 and a discharge passage 50. A valve element 54, which may be spherical, is positioned on the valve stem 42 for engaging the valve seat 48 when the dispensing valve unit 200 is in a closed condition. The valve element 54 is spaced apart from the valve seat 48 when the dispensing valve unit 200 is in an open condition. In the open condition, adhesive can flow from the inlet 49 through the supply chamber 44 and the annular gap between the valve element 54 and the valve seat 48 into the discharge passage 50 for dispensing onto a substrate.

[0064] Continue to refer Fig.13 , the valve stem 42 is moved to provide the open and closed conditions by selectively applying air pressure to the piston assembly 62. The coil spring 64 applies a force to the valve stem 42, which urges the valve element 54 into contact with the valve seat 48. The module body 40 may include an air inlet 68, which provides pressurized air sufficient to supply the open condition to the piston assembly 62. The air inlet 68 can be in fluid communication with the air supply valve 108 through the conduit 104. When the dispensing valve unit 200 is in the open condition, a dispensing path from the extruder unit 300 and / or the outlet 308 to the one or more conduits 326, the inlet 49, the supply chamber 44, and the discharge passage 50 can be defined.

[0065] Fig.14 Shown according to Figure 1 Side view of a polymer processing apparatus.

[0066] refer to Fig.14 , the polymer processing device 100 can include electrical connections. In particular, the polymer processing device 100 can include electrical connections to individual components to provide power, data, control, sensor information, and / or the like. In one aspect, the polymer processing device 100 can include electrical connections 110, 112, and 114. However, the polymer processing device 100 can include any number of electrical connections.

[0067] In several aspects, the electrical connector 110 can be connected to a separate component to provide power, data, control, sensor information, and / or the like to and / or from the polymer processing device 100 and / or the extruder unit 300. In several aspects, the electrical connector 110 can include an electrical connector, which can be implemented as a screw-on connector, a push-on connector, and / or the like. In several aspects, the electrical connector 110 can include wiring, an insulator, and / or the like extending from the electrical connector to the polymer processing device 100 and / or the extruder unit 300.

[0068] In several aspects, the electrical connector 112 can be connected to a separate component to provide power, data, control, sensor information, and / or the like to and / or from the polymer processing device 100 and / or the dispensing valve unit 200. In several aspects, the electrical connector 112 can include an electrical connector, which can be implemented as a screw-on connector, a push-on connector, and / or the like. In several aspects, the electrical connector 112 can include wiring, an insulator, and / or the like extending from the electrical connector to the polymer processing device 100 and / or the dispensing valve unit 200.

[0069] In several aspects, the electrical connector 114 can be connected to a separate component to provide power, data, control, sensor information, and / or the like to and / or from the polymer processing device 100, the extruder unit 300, and / or the drive mechanism 310. In several aspects, the electrical connector 114 can include an electrical connector, which can be implemented as a screw-on connector, a push-on connector, and / or the like. In several aspects, the electrical connector 114 can include wiring, an insulator, and / or the like extending from the electrical connector to the polymer processing device 100, the extruder unit 300, and / or the drive mechanism 310.

[0070] Fig.15 Shown according to Figure 1 Side view of a polymer processing apparatus.

[0071] In several aspects further described herein, the polymer processing device 100 can include a controller 180. The controller 180 can be implemented by one or more of a computer, a computer system, a controller, and / or the like. The controller 180 can include a plurality of computers, computer systems, controllers, and / or the like. In addition, the controller can include a random access memory, a read-only memory, an analog to digital device, a digital to analog device, a drive circuit, a filtering component, and / or the like.

[0072] The controller 180 may be connected to the electrical connector 110, the electrical connector 112, and / or the electrical connector 114. In several aspects, the controller 180 may be connected via the electrical connector 114 and may be configured to provide data, control, sensor information, and / or the like to and / or from the polymer processing device 100, the extruder unit 300, and / or the drive mechanism 310. In several aspects, the controller 180 may be connected via the electrical connector 114 and may be configured to control the speed and / or torque of the drive mechanism 310, the motor 312, and / or the extruder screw 304.

[0073] In several aspects, the controller 180 can be connected via the electrical connections 110 and can be configured to provide data, control, sensor information, and / or the like to and / or from the polymer processing device 100, the extruder unit 300, and / or the like. In several aspects, the controller 180 can be connected via the electrical connections 110 and can be configured to control the one or more heating elements 318.

[0074] In several aspects, the controller 180 can be connected via the electrical connector 112 and can be configured to provide data, control, sensor information, and / or the like to and / or from the polymer processing device 100, the dispensing valve unit 200, and / or the like. In several aspects, the controller 180 can be connected via the electrical connector 112 and can be configured to control the dispensing valve unit 200, the air supply valve 108, and / or the like. In several aspects, the controller 180 can be connected via the electrical connector 112 and can be configured to control the dispensing valve unit 200 to open and / or close.

[0075] In some aspects, the polymer processing device 100 may include one or more sensors. The one or more sensors may include a pressure sensor, a position sensor, a rotation sensor, a movement sensor, a temperature sensor, a power sensor, a voltage sensor, a current sensor, and / or the like. In some aspects, the pressure sensor may measure the pressure of the adhesive in the extruder unit 300, the dispensing valve unit 200, and / or the like. In some aspects, the position sensor may measure the position of the dispensing valve unit 200 and / or the like. The rotation sensor may sense the rotation of the components of the extruder unit 300 and / or the like. In some aspects, the temperature sensor may measure the temperature of the adhesive, the components of the extruder unit 300, the components of the dispensing valve unit 200, and / or the like.

[0076] In several aspects, the controller 180 can be configured to operate components of the polymer processing device 100, components of the extruder unit 300, components of the dispensing valve unit 200, and / or the like. In particular, the controller 180 can provide drive signals to one or more components of the polymer processing device 100, one or more components of the dispensing valve unit 200, one or more components of the extruder unit 300, and / or the like for operating these components. In several aspects, the controller 180 can be configured to operate components of the polymer processing device 100, components of the extruder unit 300, components of the dispensing valve unit 200, and / or the like in response to sensor outputs from components of the polymer processing device 100, components of the extruder unit 300, components of the dispensing valve unit 200, and / or the like.

[0077] In several aspects, the controller 180 can be configured to operate the extruder unit 300 to start operation of the drive mechanism 310, and in particular, to operate the motor 312 to start rotation of the extruder screw 304, prior to operation of the dispensing valve unit 200. Thereafter, the rotation of the extruder screw 304 can begin to increase the pressure of the adhesive within the extruder unit 300. In this regard, starting operation 604 of the extruder unit prepares the polymer processing device 100 for application of adhesive via the dispensing valve unit 200.

[0078] In this regard, the controller 180 may implement a delay period that allows the extruder unit 300 to prepare the adhesive for use by the dispensing valve unit 200. In the case where no time delay is implemented, reference is made to Fig.19 , the adhesive initially applied by the polymer processing device 100 may have poor quality. The time delay may be a set amount of time, may be a dynamically adjustable amount of time in response to a sensor of the polymer processing device 100, may be based on a sensor output of the polymer processing device 100, and / or the like. In several aspects, the controller 180 may implement a settable delay time period that allows the extruder unit 300 to prepare the adhesive for use by the dispensing valve unit 200. For example, in a specific embodiment of the extruder unit 300 and the dispensing valve unit 200, the delay time period may be 0ms to 2000ms, 10ms to 50ms, 50ms to 100ms, 100ms to 200ms, 200ms to 500ms, 500ms to 1000ms, or 1000ms to 2000ms. As another example, in a specific embodiment of the extruder unit 300 and the dispensing valve unit 200, the delay time period may be less than 50ms, 100ms, 200ms, 500ms, 500ms, or 2000ms. As another example, in certain embodiments of the extruder unit 300 and the dispensing valve unit 200, the delay period may be greater than 0 ms, 50 ms, 100 ms, 200 ms, 500 ms, 500 ms, or 1000 ms.

[0079] Fig.16 An exemplary process for implementing a polymer processing apparatus according to aspects of the present disclosure is shown.

[0080] In particular, Fig.16 An exemplary process 600 for implementing a polymer processing apparatus is shown. In this regard, the process 600 for implementing a polymer processing apparatus can be a process for implementing a polymer processing apparatus 100 of the present disclosure.

[0081] In particular, it should be noted that the process 600 for implementing a polymer processing device is merely exemplary and can be modified in accordance with the various aspects disclosed herein. It should be noted that the process 600 for implementing a polymer processing device can be performed in a different order in accordance with the above aspects. In addition, the process 600 for implementing a polymer processing device can be modified to have more or fewer process steps in accordance with the various aspects disclosed herein. In addition, the process 600 for implementing a polymer processing device can be implemented by a computer, a computer system, a controller, a controller 180, and / or the like.

[0082] The process 600 for implementing a polymer processing device of the present disclosure may include determining whether the polymer processing device has received a signal to dispense adhesive 602. In this regard, determining whether the polymer processing device has received a signal to dispense adhesive 602 may include determining whether the polymer processing device 100 has received a signal to dispense adhesive. In this regard, determining whether the polymer processing device has received a signal to dispense adhesive 602 may include any one or more materials, structures, arrangements, processes, and / or the like as described herein.

[0083] The process 600 for implementing a polymer processing apparatus of the present disclosure may include starting an extruder unit operation 604. In this regard, starting the extruder unit operation 604 may include starting the extruder unit 300 of the present disclosure. In this regard, starting the extruder unit operation 604 may include any one or more materials, structures, arrangements, processes, and / or the like as described herein.

[0084] In several aspects, starting the operation 604 of the extruder unit can include the controller 180 operating the extruder unit 300 to start the operation of the drive mechanism 310, and in particular, operating the motor 312 to start the rotation of the extruder screw 304. Thereafter, the rotation of the extruder screw 304 can begin to increase the pressure of the adhesive within the extruder unit 300. In this regard, starting the operation 604 of the extruder unit prepares the polymer processing device 100 for applying the adhesive via the dispensing valve unit 200.

[0085] The disclosed process 600 for implementing a polymer processing apparatus may include implementing a delay period 606. In this regard, implementing the delay period 606 may include implementing the delay period with the controller 180. In this regard, implementing the delay period 606 may include any one or more materials, structures, arrangements, processes, and / or the like as described herein.

[0086] In this regard, implementing the delay time period 606 allows the extruder unit 300 to prepare the adhesive for use by the dispensing valve unit 200. In the case where no time delay is implemented, reference Fig.19 , the adhesive initially applied by the polymer processing apparatus 100 may be of poor quality.

[0087] The process 600 for implementing a polymer processing device of the present disclosure may include implementing an operation 608 of a dispensing valve unit. In this regard, implementing the operation 608 of the dispensing valve unit may include implementing the operation of the dispensing valve unit 200. In this regard, implementing the operation 608 of the dispensing valve unit may include any one or more materials, structures, arrangements, processes, and / or the like as described herein. In this regard, after the time delay, the polymer processing device 100 may be ready for applying an adhesive, and thereafter the dispensing valve unit 200 may be operated to apply the adhesive to the substrate as described herein.

[0088] The process 600 for implementing a polymer processing device of the present disclosure may include dispensing a material 610 from the polymer processing device through control of a dispensing valve unit. In this regard, dispensing a material 610 from the polymer processing device through control of a dispensing valve unit may include dispensing a material from the polymer processing device 100 through control of a dispensing valve unit 200. In this regard, dispensing a material 610 from the polymer processing device through control of a dispensing valve unit may include any one or more materials, structures, arrangements, processes, and / or the like as described herein. In this regard, the dispensing valve unit 200 applies an adhesive to a substrate as described herein.

[0089] The process 600 for implementing the polymer processing device of the present disclosure can include receiving a signal 612 to stop dispensing adhesive. In this regard, receiving the signal 612 to stop dispensing adhesive can include receiving a signal from the controller 180 to stop dispensing adhesive. In this regard, receiving the signal 612 to stop dispensing adhesive can include any one or more materials, structures, arrangements, processes and / or the like as described herein. In this regard, the controller 180 can send a signal to the dispensing valve unit 200 to stop applying adhesive to the substrate as described herein.

[0090] The process 600 for implementing a polymer processing device of the present disclosure may include stopping the operation 614 of the dispensing valve unit. In this regard, stopping the operation 614 of the dispensing valve unit may include stopping the operation of the dispensing valve unit 200. In this regard, stopping the operation 614 of the dispensing valve unit may include any one or more materials, structures, arrangements, processes, and / or the like as described herein. In this regard, the dispensing valve unit 200 may receive a signal from the controller 180 and stop applying the adhesive to the substrate as described herein.

[0091] Fig.17 The application of an adhesive to a substrate using the polymer processing apparatus of the present disclosure is shown.

[0092] In particular, the exemplary embodiment of the polymer processing apparatus 100 is used in conjunction with the dispensing valve unit 200 to apply the adhesive 500 to the substrate 502. Fig.17As shown in , when the polymer processing device 100 is operated in conjunction with the dispensing valve unit 200, the polymer processing device 100 applies the adhesive 500 to the substrate 502 at the end of the dispensing routine, wherein the start 506 of the adhesive 500 is more controlled and / or more accurate. In addition, the polymer processing device 100 operated in conjunction with the dispensing valve unit 200 provides a more controlled and / or more accurate start 506 of the application of the adhesive 500 at the beginning of the dispensing routine. In addition, the dispensing valve unit 200 addresses the "stretchability" of the material (even in the molten state) through the positive displacement operation of the dispensing valve unit 200.

[0093] In addition, refer to Fig.17 , the dispensing valve unit 200 provides for more accurate metering of the adhesive 500 from the extruder unit 300 of the polymer processing apparatus 100 , as indicated by a more uniform width of the adhesive 500 .

[0094] In aspects of the present disclosure, the adhesive utilized by the polymer processing device 100 can be a pressure sensitive adhesive. Pressure sensitive adhesives are materials that adhere to a substrate when pressure is applied. They do not require solvents, water, or heat to provide adhesive bonding. State of the art pressure sensitive adhesives are capable of achieving very high bonding performance and can replace traditional mechanical fasteners in many industrial applications. These bonding solutions are also economical and easy to use.

[0095] Conventional pressure sensitive adhesives are thin and flat and are usually dispensed in sheets or rolls. However, in certain applications, it may be advantageous to form the pressure sensitive adhesive in situ. In automotive bonding applications, for example, the bonding surfaces of the components may be non-planar to provide increased mechanical retention. Some components may have ribbed bonding surfaces that require significant penetration of the pressure sensitive adhesive into the ribbed structure to obtain sufficient bonding strength.

[0096] In addition, the most commonly used plastic is thermoplastic olefin ("TPO", sometimes referred to as "PP / EPDM"), which is a low surface energy plastic similar to polypropylene. Common pressure sensitive adhesives do not achieve a high degree of "wetting" on these and similar plastics, resulting in a reduction in the surface area between the adhesive and the substrate. Primers and other surface treatments can be used to improve "wetting", but these increase the complexity and cost of bonding. For these reasons, bonding to non-planar low surface energy substrates remains a challenging technical problem.

[0097] In certain aspects, the polymer processing apparatus 100, the dispensing valve unit 200, and / or the extruder unit 300 can be implemented as described below, can be implemented in a system as described below, can further include additional components and features as described below, and / or the like.

[0098] Thus, the present disclosure has described embodiments of a polymer processing apparatus that is configured to operate in conjunction with a dispensing valve unit to apply an adhesive to a substrate at the end of a dispensing routine, wherein the cutoff of the adhesive is more controlled and / or more accurate. In addition, the present disclosure has described embodiments of a polymer processing apparatus that is configured to operate in conjunction with a dispensing valve unit to provide a more controlled and / or more accurate start of the application of the adhesive at the beginning of a dispensing routine. In addition, the present disclosure has described embodiments of a dispensing valve unit that is configured to account for the "stretchability" of the material, even in a molten state, through positive displacement operation of the dispensing valve unit.

[0099] It will be understood that although the terms first, second, etc. can be used to describe various elements in this article, these elements should not be limited by these terms. These terms are only used to distinguish one element from another element. For example, without departing from the scope of the present disclosure, the first element can be named as the second element, and similarly, the second element can be named as the first element. As used herein, the term "and / or" includes any and all combinations of one or more associated listed items. Relative terms such as "below" or "above" or "up" or "down" or "horizontal" or "vertical" can be used to describe the relationship between an element, layer or region and another element, layer or region as shown in the figure in this article. It will be understood that, in addition to the orientation depicted in the accompanying drawings, these terms and those discussed above are intended to cover different orientations of the device.

[0100] The terms used herein are used only for the purpose of describing particular aspects and are not intended to limit the present disclosure. As used herein, the singular forms "a", "an", and "the" are also intended to include the plural forms, unless the context clearly indicates otherwise. It will be further understood that the terms "comprise", "comprising", "include", and / or "including" when used herein specify the presence of the features, integers, steps, operations, elements, and / or parts, but do not exclude the presence or addition of one or more other features, integers, steps, operations, elements, parts, and / or groups thereof.

[0101] Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by those of ordinary skill in the art to which the present disclosure belongs. It will be further understood that the terms used herein should be interpreted as having a meaning consistent with their meaning in the context of this specification and the related art, and will not be interpreted in an idealized or overly formal sense (unless explicitly defined as such herein). Further in accordance with various aspects of the present disclosure, the methods described herein are intended to operate with dedicated hardware implementations (including but not limited to PCs, PDAs, semiconductors, application specific integrated circuits (ASICs), programmable logic arrays, cloud computing devices, and other hardware devices configured to implement the methods described herein).

[0102] It should also be noted that the software implementations of the present disclosure as described herein may optionally be stored on a tangible storage medium, such as: a magnetic medium, such as a disk or tape; a magneto-optical or optical medium, such as a disk; or a solid-state medium, such as a memory card or other package containing one or more read-only (non-volatile) memories, random access memories, or other rewritable (volatile) memories. A digital file attachment to an e-mail or other self-contained information archive or set of archives is considered a distribution medium equivalent to a tangible storage medium. Therefore, the present disclosure is considered to include a tangible storage medium or distribution medium as listed herein, and includes equivalents and successor media recognized in the art, in which the software implementations of the present disclosure are stored.

[0103] In addition, various aspects of the present disclosure may be implemented in non-general purpose computer implementations. In addition, as will be apparent from the disclosure herein, various aspects of the disclosure set forth herein improve the functionality of the system. In addition, various aspects of the present disclosure relate to computer hardware that is specifically programmed to solve the complex problems solved by the present disclosure. Therefore, various aspects of the present disclosure generally improve the functionality of the system in its specific implementations to perform the processes set forth by the present disclosure and as defined by the claims.

[0104] Several aspects of the present disclosure may be implemented in any type of computing device with wired / wireless communication capabilities via a communication channel, such as, for example, desktop computers, personal computers, laptop / mobile computers, personal data assistants (PDAs), mobile phones, tablet computers, cloud computing devices, and the like.

[0105] Although the present invention has been illustrated by the description of various preferred embodiments, and although these embodiments have been described in some detail, it is not the intention of the applicant to restrict or in any way limit the scope of the appended claims to such details. Additional advantages and modifications will readily occur to those skilled in the art. Depending on the needs and preferences of the user, the various features discussed herein may be used alone or in any combination. This has described the illustrative aspects and embodiments of the present invention and the preferred methods of practicing the present invention as currently known. However, the invention itself shall be limited only by the appended claims.

Claims

1. A polymer processing device comprising: an extruder unit configured to receive, melt and mix the adhesive; as well as a dispensing valve unit configured to dispense adhesive onto a substrate, Wherein the dispensing valve unit comprises a positive displacement valve, the positive displacement valve providing discrete dispensing of the adhesive.

2. The polymer processing device according to claim 1, wherein: The distribution valve unit is configured to be implemented as a pneumatic valve, an electrically operated valve, an electromagnetically operated valve and / or a hydraulically operated valve.

3. The polymer processing device according to claim 1, wherein: The dispensing valve unit is configured to control a flow of adhesive for dispensing the adhesive produced by the extruder unit.

4. The polymer processing device according to claim 1, wherein: The dispensing valve unit is configured to close and stop the flow of adhesive produced by the extruder unit.

5. The polymer processing device according to claim 1, wherein: The extruder unit includes an extruder barrel and an extruder screw.

6. The polymer processing apparatus of claim 5, further comprising a manifold comprising one or more conduits configured to direct adhesive from an outlet of the extruder unit to the dispensing valve unit.

7. The polymer processing device according to claim 5, wherein: The extruder unit comprises an outlet at a distal end of the extruder barrel.

8. The polymer processing device according to claim 5, wherein: The extruder unit includes one or more heating elements configured to melt the adhesive during a dispensing operation.

9. The polymer processing device according to claim 5, in, The extruder unit includes an inlet configured to receive an adhesive; and Therein, the extruder screw and / or the extruder barrel are configured to mix and melt an adhesive and provide the adhesive to the dispensing valve unit.

10. The polymer processing device according to claim 9, wherein: The extruder unit includes a drive mechanism for rotating the extruder screw to move adhesive through the extruder unit to the dispensing valve unit.

11. The polymer processing device according to claim 10, wherein: The driving mechanism includes a gear box and a motor.

12. The polymer processing device according to claim 6, wherein: The manifold includes one or more heating elements.

13. The polymer processing device according to claim 1, wherein: The distribution valve unit is embodied as a pneumatic valve.

14. The polymer processing device according to claim 1, wherein: The dispensing valve unit includes: a module body; a valve stem mounted for movement within the module body; and a supply chamber disposable in the module body.

15. The polymer processing device according to claim 14, in, The dispensing valve unit includes a valve seat and a valve element; and Wherein, the valve stem is moved to provide an open condition and a closed condition by selectively applying air pressure to a piston assembly.

16. The polymer processing device of claim 13, further comprising an air supply valve configurable to supply pressurized air to the dispensing valve unit.

17. The polymer processing device of claim 1, further comprising an electrical connector configured to transmit power, data, control and / or sensor information to or from one or more components of the dispensing valve unit and / or one or more components of the extruder unit.

18. The polymer processing device of claim 10, further comprising a controller configured to provide a drive signal to one or more components of the dispensing valve unit and / or one or more components of the extruder unit.

19. The polymer processing device according to claim 18, wherein: The controller is configured to operate the extruder unit to start the operation of the drive mechanism prior to the operation of the dispensing valve unit.

20. The polymer processing apparatus of claim 18, wherein: The controller is configured to operate the extruder unit to start the operation of the drive mechanism and to start the operation of the dispensing valve unit after a time delay.

21. A polymer processing device comprising: an extruder unit configured to receive, melt and mix the adhesive; as well as a dispensing valve unit configured to dispense adhesive onto a substrate, The distribution valve unit is configured to be implemented as a pneumatic valve, an electrically operated valve, an electromagnetically operated valve and / or a hydraulically operated valve.

22. The polymer processing apparatus according to claim 21, wherein: The dispensing valve unit is configured to control a flow of adhesive for dispensing the adhesive produced by the extruder unit.

23. The polymer processing apparatus of claim 21, wherein: The dispensing valve unit is configured to close and stop the flow of adhesive produced by the extruder unit.

24. The polymer processing apparatus of claim 21, wherein: The extruder unit includes an extruder barrel and an extruder screw.

25. The polymer processing apparatus of claim 24, further comprising a manifold comprising one or more conduits configured to direct adhesive from an outlet of the extruder unit to the dispensing valve unit.

26. The polymer processing apparatus of claim 24, wherein: The extruder unit comprises an outlet at a distal end of the extruder barrel.

27. The polymer processing apparatus of claim 24, wherein: The extruder unit includes one or more heating elements configured to melt the adhesive during a dispensing operation.

28. The polymer processing device according to claim 24, in, The extruder unit includes an inlet configured to receive an adhesive; and Therein, the extruder screw and / or the extruder barrel are configured to mix and melt an adhesive and provide the adhesive to the dispensing valve unit.

29. The polymer processing apparatus of claim 28, wherein: The extruder unit includes a drive mechanism for rotating the extruder screw to move adhesive through the extruder unit to the dispensing valve unit.

30. The polymer processing apparatus of claim 29, wherein: The driving mechanism includes a gear box and a motor.

31. The polymer processing apparatus of claim 25, wherein: The manifold includes one or more heating elements.

32. The polymer processing apparatus of claim 21, wherein: The distribution valve unit is embodied as the pneumatic valve.

33. The polymer processing apparatus of claim 21, wherein: The dispensing valve unit includes: a module body; a valve stem mounted for movement within the module body; and a supply chamber disposable in the module body.

34. The polymer processing device according to claim 33, in, The dispensing valve unit includes a valve seat and a valve element; and Wherein, the valve stem is moved to provide an open condition and a closed condition by selectively applying air pressure to a piston assembly.

35. The polymer processing device of claim 32, further comprising an air supply valve configurable to supply pressurized air to the dispensing valve unit.

36. The polymer processing device of claim 21, further comprising an electrical connector configured to transmit power, data, control and / or sensor information to or from one or more components of the dispensing valve unit and / or one or more components of the extruder unit.

37. The polymer processing device of claim 29, further comprising a controller configured to provide drive signals to one or more components of the dispensing valve unit and / or one or more components of the extruder unit.

38. A polymer processing apparatus according to claim 37, wherein: The controller is configured to operate the extruder unit to start the operation of the drive mechanism prior to the operation of the dispensing valve unit.

39. The polymer processing apparatus of claim 37, wherein: The controller is configured to operate the extruder unit to start the operation of the drive mechanism and to start the operation of the dispensing valve unit after a time delay.

40. A process for implementing a polymer processing device comprising: implementing an extruder unit configured to receive, melt and mix the adhesive; as well as implementing a dispensing valve unit configured to dispense adhesive onto a substrate, The distribution valve unit is configured to be implemented as a pneumatic valve, an electrically operated valve, an electromagnetically operated valve and / or a hydraulically operated valve.

41. The process of implementing a polymer processing device according to claim 40, wherein: The dispensing valve unit is configured to control a flow of adhesive for dispensing the adhesive produced by the extruder unit.

42. The process of implementing a polymer processing device according to claim 40, wherein: The dispensing valve unit is configured to close and stop the flow of adhesive produced by the extruder unit.

43. The process of implementing a polymer processing device according to claim 40, wherein: The extruder unit includes an extruder barrel and an extruder screw.

44. The process of implementing a polymer processing device of claim 43, further comprising a manifold comprising one or more conduits configured to direct adhesive from an outlet of the extruder unit to the dispensing valve unit.

45. The process of implementing a polymer processing device according to claim 43, wherein: The extruder unit comprises an outlet at a distal end of the extruder barrel.

46. ​​The process of implementing a polymer processing device according to claim 43, wherein: The extruder unit includes one or more heating elements configured to melt the adhesive during a dispensing operation.

47. The process of implementing a polymer processing device according to claim 43, in, The extruder unit includes an inlet configured to receive an adhesive; and Therein, the extruder screw and / or the extruder barrel are configured to mix and melt an adhesive and provide the adhesive to the dispensing valve unit.

48. The process of implementing a polymer processing device according to claim 47, wherein: The extruder unit includes a drive mechanism for rotating the extruder screw to move adhesive through the extruder unit to the dispensing valve unit.

49. The process of implementing a polymer processing device according to claim 48, wherein: The driving mechanism includes a gear box and a motor.

50. The process of implementing a polymer processing device according to claim 44, wherein: The manifold includes one or more heating elements.

51. The process of implementing a polymer processing device according to claim 40, wherein: The distribution valve unit is embodied as the pneumatic valve.

52. The process of implementing a polymer processing device according to claim 40, wherein: The dispensing valve unit includes: a module body; a valve stem mounted for movement within the module body; and a supply chamber disposable in the module body.

53. The process of implementing a polymer processing device according to claim 52, in, The dispensing valve unit includes a valve seat and a valve element; and Wherein, the valve stem is moved to provide an open condition and a closed condition by selectively applying air pressure to a piston assembly.

54. The process of implementing a polymer processing device of claim 51, further comprising an air supply valve configurable to supply pressurized air to the dispensing valve unit.

55. The process of implementing a polymer processing device according to claim 40 further includes an electrical connector configured to transmit power, data, control and / or sensor information to or from one or more components of the dispensing valve unit and / or one or more components of the extruder unit.

56. The process of implementing a polymer processing device of claim 48, further comprising a controller configured to provide drive signals to one or more components of the dispensing valve unit and / or one or more components of the extruder unit.

57. The process of implementing a polymer processing device according to claim 56, wherein: The controller is configured to operate the extruder unit to start the operation of the drive mechanism prior to the operation of the dispensing valve unit.

58. The process of implementing a polymer processing device according to claim 56, wherein: The controller is configured to operate the extruder unit to start the operation of the drive mechanism and to start the operation of the dispensing valve unit after a time delay.

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