An intracranial probe with built-in miniature pressure and temperature sensors and its packaging process.

Abstract

This invention relates to the field of intracranial probe technology, and discloses an intracranial probe with built-in miniature pressure and temperature sensors and its packaging process. The probe includes a metal sleeve, a hemispherical head, a plastic sleeve, a carrier plate, a pressure sensor chip, sealing tape, a vent tube, and a temperature sensor chip. One end of the metal sleeve is fixedly connected to the hemispherical head, and the other end is fixedly connected to the plastic sleeve. The carrier plate has a notch, a first through groove, and a second through groove sequentially arranged along the X direction. The notch communicates with the first through groove. The end of the carrier plate near the second through groove has symmetrically arranged protrusions along the Y direction. This invention provides an intracranial probe with built-in miniature pressure and temperature sensors and its packaging process, solving the problems of inaccurate stress measurement data caused by the displacement of the pressure sensor chip placement position due to the influence of the wires and the springback of the wires in existing intracranial probes.

Description

Technical Field

[0001] This invention relates to the field of intracranial probe technology, specifically to an intracranial probe with built-in miniature pressure and temperature sensors and its packaging process. Background Technology

[0002] Intracranial pressure (ICP) refers to the pressure exerted by the contents of the cranial cavity on the walls of the cranial cavity. In adults, it is typically maintained between 5 and 15 mmHg. Abnormally elevated ICP is a common and significant factor in neurosurgical practice that can lead to rapid deterioration of a patient's condition. For patients with severe traumatic brain injury, monitoring ICP is of paramount clinical importance. Increased intracranial pressure endangers brain function and can potentially cause death, and is usually caused by a variety of conditions, including traumatic brain injury, cerebral hemorrhage, brain tumors, and cerebral edema. Therefore, accurate monitoring of ICP is crucial for the diagnosis and treatment of critically ill neurological patients.

[0003] Intracranial pressure (ICP) monitoring involves placing a catheter or a miniature pressure sensor chip probe inside the patient's cranial cavity. The other end of the probe is connected to an intracranial pressure monitor, which converts dynamic pressure changes into electrical signals and displays them as numerical values, pressure waveform curves, and alarms. Based on the intracranial pressure values ​​and waveforms displayed on the monitor, doctors can accurately analyze changes in the patient's intracranial pressure, which is of significant reference value for assessing the patient's intracranial condition, guiding subsequent treatment, and evaluating prognosis.

[0004] Intracranial temperature (ICT) is also an important auxiliary indicator for monitoring intracranial conditions. When a patient's intracranial condition worsens or postoperative infection occurs, the resulting increase in intracranial temperature will be accompanied by an increase in intracranial pressure. Therefore, it is necessary to monitor intracranial temperature and intracranial pressure simultaneously in order to more completely monitor the real-time changes in intracranial conditions.

[0005] Piezoresistive pressure sensor chips, which utilize the Wheatstone bridge principle, have resistance that changes with pressure. Based on their structure, pressure sensor chips are categorized into absolute pressure, gauge pressure, and differential pressure types. The atmospheric gauge pressure type is a special classification of the differential pressure type, where the back cavity of the pressure sensing surface is connected to the external atmospheric pressure, using this external atmospheric pressure as a reference pressure to measure the pressure applied to the front of the pressure sensing surface. Based on the number of bridge arms, pressure sensor chips are further divided into half-bridge (two resistors that change with pressure) and full-bridge (four resistors that change with pressure). Currently, the pressure sensor chip most commonly used clinically for intracranial pressure monitoring is the Wheatstone half-bridge sensor.

[0006] According to the search, the Chinese patent publication number CN 112107306 A describes the structure of the intracranial pressure probe. The chip is connected at both ends with hard glue and suspended in the cavity. The wires need to be bent with a tiny jig. The chip needs to be placed precisely in the metal tube window, which presents difficulties in dispensing and soldering.

[0007] The Chinese patent publication number is CN220588255U. This patent requires the assembly of the first and second shells. The double-shell assembly method has the problem of loose adhesion. The adhesive used for bonding is easy to overflow outside the tube wall, resulting in unclean tube wall or rough appearance. The airtightness may not be guaranteed, and there is a risk of falling off.

[0008] The Chinese patent publication number is CN221129864U. This patent involves fabricating a cylindrical skeleton as a whole and then attaching the chip in the groove of the skeleton. This method has the problems of complicated operation, high cost and low yield. Summary of the Invention

[0009] The purpose of this invention is to provide an intracranial probe with built-in miniature pressure and temperature sensors and a packaging process to solve at least one of the aforementioned problems in the prior art.

[0010] To achieve the above objectives, the present invention adopts the following technical solution:

[0011] An intracranial probe with built-in miniature pressure and temperature sensors includes a metal sleeve, a hemispherical head, a plastic sleeve, a carrier plate, a pressure sensor chip, sealing tape, a venting tube, and a temperature sensor chip. One end of the metal sleeve is fixedly connected to the hemispherical head, and the other end of the metal sleeve is fixedly connected to the plastic sleeve.

[0012] The carrier plate is provided with a notch, a first through groove and a second through groove in sequence along the X direction. The notch is connected to the first through groove. The carrier plate is provided with protrusions symmetrically along the Y direction at one end near the second through groove.

[0013] The pressure sensor chip is sealed and fixed at the upper end of the first through groove by sealing soft glue, and the sealing tape is pasted at the lower end of the first through groove so that the first through groove forms a sealed transition cavity. The vent tube is located in the notch, one end of the vent tube extends into the sealed transition cavity, and the other end of the vent tube extends into the plastic sleeve. The temperature sensor chip is embedded in the second through groove.

[0014] The metal sleeve has symmetrical mating grooves at its ends. The metal sleeve is fitted over the carrier plate. The protrusion is embedded and mated with the corresponding mating groove of the metal sleeve and kept fixed. The metal sleeve has a sensing surface window. The sensing surface of the pressure sensor chip corresponds to the position of the sensing surface window. The pressure sensor chip and the sensing surface window are sealed and fixed by sealing hard glue. The metal sleeve and the carrier plate, as well as the metal sleeve and the plastic sleeve, are fixed by filling with hard glue.

[0015] In this technical solution, the carrier plate has a plate-like structure with a notch, a first through groove, and a second through groove formed on it. The structure is simple and easy to form. The first through groove on the carrier plate not only serves to position the pressure sensor chip to improve its accuracy, but also works with sealing tape to seal the upper and lower ends of the first through groove through the pressure sensor chip and sealing tape respectively, forming a sealed transition cavity. Combined with a venting tube, this allows the pressure sensor chip to communicate with the atmosphere, thereby reducing the influence of atmospheric pressure on the pressure sensor's sensing surface during intracranial pressure measurement and achieving more accurate pressure detection. The notch on the carrier plate has a fixed... The placement of the vent tube ensures stable connection between the sealed transition cavity and the outside. The second slot on the carrier plate is used to mount the temperature sensor chip, improving the accuracy of its mounting position. Furthermore, the metal sleeve and carrier plate have simple molding structures, and are fixed by the insertion and mating of protrusions into the corresponding grooves of the metal sleeve. This initial fixation of the metal sleeve and carrier plate is achieved, followed by filling with hard glue to secure the connection. This improves the accuracy of the metal sleeve and carrier plate mounting positions, thereby enhancing the accuracy of the correspondence between the sensing surface and the sensing window of the pressure sensor chip, ultimately improving monitoring accuracy.

[0016] In summary, this technical solution requires only the processing of a carrier plate and a metal sleeve, which are simple to process and have low processing costs. During assembly, the pressure sensor chip, temperature sensor chip, sealing tape, and vent pipe can be installed on the carrier plate as a whole, ensuring the accuracy of the component installation positions on the carrier plate. Then, the metal sleeve is matched and installed with the carrier plate, ensuring the accuracy of the installation positions of the carrier plate and the metal sleeve. This makes the overall assembly operation more convenient, reduces assembly costs, and improves the accuracy of the installation positions of each component, thereby improving the accuracy of monitoring.

[0017] Furthermore, since the thickness of the carrier plate is uniform throughout, including the notch and the first through groove area, in order for the vent pipe to extend into the sealed transition cavity without exceeding the sealed transition cavity, the outer diameter of the vent pipe is less than or equal to the thickness of the carrier plate.

[0018] Furthermore, to improve the installation stability of the vent pipe and the carrier plate, the gap between the vent pipe and the notch is filled with soft rubber.

[0019] Furthermore, to facilitate the lead-out of the wires, the wires of the pressure sensor chip and the temperature sensor chip are led out sequentially through a metal sleeve and a plastic sleeve.

[0020] Furthermore, in order to provide a wire lead-out structure, the wires of the temperature sensor chip are located above the carrier plate, and the wires of the pressure sensor chip and the temperature sensor chip bypass the carrier plate and enter the plastic sleeve from below the carrier plate and are led out.

[0021] Furthermore, to provide another wire lead-out structure, the wires of the temperature sensor chip are located below the carrier plate, and the wires of the pressure sensor chip, after bypassing the carrier plate, enter the plastic sleeve together with the wires of the temperature sensor chip from below the carrier plate and are led out.

[0022] Furthermore, the carrier plate is made of thin metal plate, FPC plate, FR4 plate, ceramic plate, aluminum substrate or BT plate;

[0023] The metal sleeve is made of stainless steel, nickel-titanium alloy, pure titanium, titanium-based metal, or cobalt-based metal;

[0024] Specifically, the metal sheath is made of a relatively non-magnetic and biocompatible material. The relatively non-magnetic material does not contain magnetic metals such as iron. These materials can be titanium-based metals, cobalt-based metals, etc. These materials can come into direct contact with the human body and will not cause patients to have allergies, cancer, or teratogenic effects. They can also be well integrated with bone tissue, epithelium, and connective tissue.

[0025] The plastic sleeve is made of nylon, Teflon or PU tubing;

[0026] The hemispherical head is made of epoxy or UV adhesive, which meets medical biocompatibility requirements and is non-toxic and harmless to the human body.

[0027] Furthermore, in order to provide a method for forming a hemispherical head, the hemispherical head is integrally formed at the distal end of the metal sleeve after being filled with hard glue and hardened.

[0028] Furthermore, to provide another method of forming a hemispherical head, a prefabricated hemispherical head is fixedly bonded to the distal end of a metal sleeve.

[0029] This invention also provides a packaging process for an intracranial probe with built-in miniature pressure and temperature sensors, comprising the following steps:

[0030] Several wires are soldered onto the pads of the pressure sensor chip and the temperature sensor chip using laser welding or ultrasonic welding.

[0031] The pressure sensor chip is fixed to the upper end of the first through slot with sealing soft glue, and the temperature sensor chip is embedded in the second through slot.

[0032] Clamp the vent tube at the notch and insert one end of the vent tube into the first groove. Fill the gap between the vent tube and the notch with soft glue. After attaching sealing tape to the lower end of the first groove, a sealed transition cavity is formed between the pressure sensor chip and the sealing tape.

[0033] The metal sleeve is placed over the carrier plate, and the two protrusions on the carrier plate are inserted and fixed into the corresponding mating grooves of the metal sleeve. The pressure sensor chip and the sensing surface window are sealed and fixed with sealing hard glue.

[0034] Insert one end of the plastic sleeve into the metal sleeve, pass the wire through the plastic sleeve, and then place the vent tube inside the plastic sleeve as well.

[0035] Apply adhesive or fill adhesive at the connection between the metal sleeve and the plastic sleeve until the metal sleeve and the carrier plate, as well as the metal sleeve and the plastic sleeve, are fixed by filling with hard adhesive. At the same time, the adhesive at the far end of the metal sleeve hardens and is formed into a hemispherical head, or a pre-made hemispherical head is bonded by filling with hard adhesive until the entire metal sleeve is completely sealed.

[0036] The beneficial effects of this invention are as follows: In this technical solution, the carrier plate has a plate-like structure with a notch, a first through groove, and a second through groove formed on it. The structure is simple and easy to form. The first through groove on the carrier plate not only serves to position the pressure sensor chip to improve the accuracy of its installation, but also works with the sealing tape to seal the upper and lower ends of the first through groove through the pressure sensor chip and the sealing tape respectively, thus forming a sealed transition cavity. Combined with the venting tube, this allows the pressure sensor chip to communicate with the atmosphere, thereby reducing the influence of atmospheric pressure on the sensing surface of the pressure sensor during intracranial pressure measurement and achieving more accurate pressure detection. The notch serves to position the vent tube, ensuring a stable connection between the sealed transition chamber and the outside. The second slot on the carrier plate is used to mount the temperature sensor chip, improving the accuracy of its mounting position. Furthermore, the metal sleeve and carrier plate have simple molding structures, and are fixed by the insertion and mating of the protrusions into the corresponding grooves of the metal sleeve. This initial fixation of the metal sleeve and carrier plate is achieved before filling with hard glue to secure them together. This improves the accuracy of the metal sleeve and carrier plate mounting positions, thereby enhancing the accuracy of the correspondence between the sensing surface and the sensing window of the pressure sensor chip, ultimately improving monitoring accuracy.

[0037] In summary, this technical solution requires only the processing of a carrier plate and a metal sleeve, which are simple to process and have low processing costs. During assembly, the pressure sensor chip, temperature sensor chip, sealing tape, and vent pipe can be installed on the carrier plate as a whole, ensuring the accuracy of the component installation positions on the carrier plate. Then, the metal sleeve is matched and installed with the carrier plate, ensuring the accuracy of the installation positions of the carrier plate and the metal sleeve. This makes the overall assembly operation more convenient, reduces assembly costs, and improves the accuracy of the installation positions of each component, thereby improving the accuracy of monitoring. Attached Figure Description

[0038] Figure 1This is a schematic diagram of the planar structure of the carrier plate in this invention;

[0039] Figure 2 This is a three-dimensional structural diagram of the carrier plate in this invention;

[0040] Figure 3 This is a schematic diagram of the structure of the metal sleeve in this invention;

[0041] Figure 4 This is a schematic diagram of the internal structure of the metal sleeve in this invention;

[0042] Figure 5 This is a schematic diagram of the structure of the present invention.

[0043] In the diagram: 1. Metal sleeve; 2. Hemispherical head; 3. Plastic sleeve; 4. Carrier plate; 5. Pressure sensor chip; 6. Sealing tape; 7. Vent pipe; 8. Temperature sensor chip; 9. Notch; 10. First through groove; 11. Second through groove; 12. Protrusion; 13. Sealing soft rubber; 14. Sealing transition cavity; 15. Filling hard rubber; 16. Sensing surface window; 17. Docking groove; 18. Sealing hard rubber; 19. Wire. Detailed Implementation

[0044] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the present invention will be briefly introduced below in conjunction with the accompanying drawings and descriptions of the embodiments or the prior art. Obviously, the following description of the structure of the accompanying drawings is only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort. It should be noted that the description of these embodiments is for the purpose of helping to understand the present invention, but does not constitute a limitation of the present invention.

[0045] Example 1:

[0046] like Figures 1-5 As shown, this embodiment provides an intracranial probe with built-in miniature pressure and temperature sensors, including a metal sleeve 1, a hemispherical head 2, a plastic sleeve 3, a carrier plate 4, a pressure sensor chip 5, a sealing tape 6, a vent tube 7, and a temperature sensor chip 8. One end of the metal sleeve 1 is fixedly connected to the hemispherical head 2, and the other end of the metal sleeve 1 is fixedly connected to the plastic sleeve 3.

[0047] like Figure 1 , Figure 2 As shown, the carrier plate 4 is provided with a notch 9, a first through groove 10 and a second through groove 11 in sequence along the X direction. The notch 9 is connected to the first through groove 10. The carrier plate 4 is provided with a protrusion 12 symmetrically along the Y direction at one end near the second through groove 11.

[0048] like Figure 4 , Figure 5As shown, the pressure sensor chip 5 is sealed and fixed at the upper end of the first through groove 10 by sealing soft glue 13. Specifically, the sealing soft glue 13 can be die-bonding soft glue, which serves to stick and fix the chip. The sealing tape 6 is pasted at the lower end of the first through groove 10 so that the first through groove 10 forms a sealed transition cavity 14. The vent pipe 7 is located in the notch 9. One end of the vent pipe 7 extends into the sealed transition cavity 14, and the other end of the vent pipe 7 extends into the plastic sleeve 3. The temperature sensor chip 8 is embedded in the second through groove 11 and fixed to the carrier plate 4 by filling with hard glue 15.

[0049] The metal sleeve 1 has symmetrically provided docking grooves 17 at its end. The metal sleeve 1 is sleeved on the carrier plate 4. The protrusion 12 is embedded and docked with the corresponding docking groove 17 of the metal sleeve 1 and kept fixed. The metal sleeve 1 has a sensing surface window 16. The sensing surface of the pressure sensor chip 5 corresponds to the position of the sensing surface window 16. The pressure sensor chip 5 and the sensing surface window 16 are sealed and fixed by sealing hard glue 18. The metal sleeve 1 and the carrier plate 4 and the metal sleeve 1 and the plastic sleeve 3 are fixed by filling hard glue 15.

[0050] In this technical solution, the carrier plate 4 has a plate-like structure, with a notch 9, a first through groove 10, and a second through groove 11 cut into it. The structure is simple and easy to form. The first through groove 10 on the carrier plate 4 not only positions the pressure sensor chip 5 to improve its accuracy, but also works with the sealing tape 6 to seal the upper and lower ends of the first through groove 10 through the pressure sensor chip 5 and the sealing tape 6 respectively, forming a sealed transition cavity 14. Combined with the ventilation tube 7, this allows the pressure sensor chip 5 to communicate with the atmosphere, thereby reducing the influence of atmospheric pressure on the pressure sensor's sensing surface during intracranial pressure measurement and achieving more accurate pressure detection. The notch 9 on the carrier plate 4 positions the ventilation tube 7, allowing the ventilation tube 7 to... The system stably achieves communication between the sealed transition cavity 14 and the outside. The second through groove 11 on the carrier plate 4 is used to install the temperature sensor chip 8 (NTC or temperature-sensitive diode) to improve the accuracy of the installation position of the temperature sensor chip 8. In addition, the metal sleeve 1 and the carrier plate 4 have simple molding structures. The mating groove 17 and the sensing surface window 16 on the metal sleeve 1 are also cut and formed. The carrier plate 4 is embedded and fixed with the corresponding mating groove 17 of the metal sleeve 1 through the protrusion 12, which can achieve the initial fixation of the metal sleeve 1 and the carrier plate 4. Then, the hard glue 15 is filled to achieve the fixed connection between the two, thereby improving the accuracy of the installation position of the metal sleeve 1 and the carrier plate 4, and thus improving the accuracy of the correspondence between the sensing surface and the sensing surface window 16 of the pressure sensor chip 5, so as to improve the accuracy of monitoring.

[0051] In summary, this technical solution requires only the carrier plate 4 and the metal sleeve 1 to be processed, and the processing is simple and cost-effective. During assembly, the pressure sensor chip 5, temperature sensor chip 8, sealing tape 6, and vent tube 7 can be installed on the carrier plate 4 as a whole, ensuring the accuracy of the component installation positions on the carrier plate 4. Then, the metal sleeve 1 is matched and installed with the carrier plate 4, ensuring the accuracy of the installation positions of the carrier plate 4 and the metal sleeve 1. This makes the overall assembly operation more convenient, reduces assembly costs, and improves the accuracy of the installation positions of each component, thereby improving the accuracy of monitoring. This technical solution solves the problems of inaccurate measurement data caused by the displacement of the pressure sensor chip placement position due to the influence of the wires connected to the pressure sensor chip, and the stress caused by the springback of the wires connected to the pressure sensor chip, which leads to large fluctuations, time drift, and temperature drift in the sensor measurement data. In this probe, the pressure sensor chip 5 is easily mounted on the carrier plate 4, and the temperature sensor chip 8 is even easier to embed into the carrier plate 4, making assembly more convenient.

[0052] Example 2:

[0053] This embodiment is an optimization based on the above embodiment one.

[0054] Since the thickness of the carrier plate 4 is uniform throughout, including the notch 9 and the first through groove 10 area, in order for the vent pipe 7 to be able to extend into the sealed transition cavity 14 without exceeding the sealed transition cavity 14, the outer diameter of the vent pipe 7 is less than or equal to the thickness of the carrier plate 4.

[0055] Example 3:

[0056] This embodiment is an optimization based on the above embodiment one.

[0057] To improve the installation stability of the vent pipe 7 and the carrier plate 4, the gap between the vent pipe 7 and the notch 9 is filled with soft rubber.

[0058] Example 4:

[0059] This embodiment is an optimization based on the above embodiment one.

[0060] To facilitate the lead-out of the wire 19, the wire 19 of the pressure sensor chip 5 and the wire 19 of the temperature sensor chip 8 are led out after passing through the metal sleeve 1 and the plastic sleeve 3 in sequence.

[0061] Example 5:

[0062] This embodiment is an optimization based on the above embodiment one.

[0063] In order to provide a lead wire 19 lead-out structure, the lead wire 19 of the temperature sensor chip 8 is located above the carrier plate 4, and the lead wires 19 of the pressure sensor chip 5 and the temperature sensor chip 8 pass around the carrier plate 4 and enter the plastic sleeve 3 from below the carrier plate 4 and are led out.

[0064] Example 6:

[0065] This embodiment is an optimization based on the above embodiment one.

[0066] To provide an alternative lead wire 19 structure, the lead wire 19 of the temperature sensor chip 8 is located below the carrier plate 4, and the lead wire 19 of the pressure sensor chip 5 passes around the carrier plate 4 and enters the plastic sleeve 3 together with the lead wire 19 of the temperature sensor chip 8 from below the carrier plate 4 and is then led out.

[0067] Example 7:

[0068] This embodiment is an optimization based on the above embodiment one.

[0069] The carrier board 4 is made of thin metal plate, FPC board, FR4 board, ceramic board, aluminum substrate or BT board;

[0070] The metal sleeve 1 is made of stainless steel, nickel-titanium alloy, pure titanium, titanium-based metal, or cobalt-based metal;

[0071] Specifically, the metal sleeve 1 is made of a relatively non-magnetic and biocompatible material. The relatively non-magnetic material does not contain magnetic metals such as iron. These materials can be titanium-based metals, cobalt-based metals, etc. These materials can come into direct contact with the human body and will not cause patients to have allergies, cancer, or teratogenic effects. They can be well integrated with bone tissue, epithelium, and connective tissue.

[0072] The plastic sleeve 3 is made of nylon tubing, Teflon tubing, or PU tubing;

[0073] The hemispherical head 2 is made of hard plastic, which can be epoxy or UV adhesive, and meets medical biocompatibility requirements, and is non-toxic and harmless to the human body.

[0074] Example 8:

[0075] This embodiment is an optimization based on the above embodiment one.

[0076] In order to provide a method for forming a hemispherical head 2, the hemispherical head 2 is integrally formed at the distal end of the metal sleeve 1 after being filled with hard glue 15 and hardened.

[0077] Example 9:

[0078] This embodiment is an optimization based on the above embodiment one.

[0079] To provide an alternative method for forming the hemispherical head 2, the prefabricated hemispherical head 2 is fixedly bonded to the distal end of the metal sleeve 1.

[0080] Example 10:

[0081] This invention also provides a packaging process for an intracranial probe with built-in miniature pressure and temperature sensors, comprising the following steps:

[0082] Several wires 19 are soldered onto the pads of the pressure sensor chip 5 and the temperature sensor chip 8 by laser welding or ultrasonic welding. Specifically, the pressure sensor chip 5 is soldered with three wires 19 and the temperature sensor chip 8 is soldered with two wires 19. The sensor signals are connected to the host computer by leading out the wires 19.

[0083] The pressure sensor chip 5 is fixed to the upper end of the first through slot 10 with sealing soft glue 13, and the temperature sensor chip 8 is embedded in the second through slot 11. The wire 19 of the temperature sensor chip 8 can be above the carrier plate 4 or below the carrier plate 4.

[0084] The vent tube 7 is clamped at the notch 9, and one end of the vent tube 7 extends into the first through groove 10. The gap between the vent tube 7 and the notch 9 is filled with soft glue. After the sealing tape 6 is pasted on the lower end of the first through groove 10, a sealed transition cavity 14 is formed between the pressure sensor chip 5 and the sealing tape 6. After sealing, the back cavity of the pressure sensor chip 5 is connected to the external atmospheric pressure through the vent tube 7.

[0085] The metal sleeve 1 is fitted over the carrier plate 4. The two protrusions 12 on the carrier plate 4 are inserted and fixed into the corresponding mating grooves 17 of the metal sleeve 1, so that the metal sleeve 1 and the carrier plate 4 form a tight combination. This causes the sensing surface of the pressure sensor chip 5 to align with the sensing surface window 16, ensuring that the position of the pressure sensor chip 5 does not shift and the force is more even. The pressure sensor chip 5 and the sensing surface window 16 are sealed and fixed by the sealing hard glue 18.

[0086] Insert one end of the plastic sleeve 3 into the metal sleeve 1, pass the wire 19 through the plastic sleeve 3, and place the vent tube 7 inside the plastic sleeve 3. Specifically, pass the wire 19 around the carrier plate 4 to the bottom of the carrier plate 4. The bent wire 19 and the vent tube 7 are parallel to facilitate passing through the plastic sleeve 3. The wire 19 achieves insulation through the plastic sleeve 3 and is led to the interface circuit connected to the host.

[0087] Apply adhesive or fill adhesive at the connection between the metal sleeve 1 and the plastic sleeve 3 until the metal sleeve 1 and the carrier plate 4, as well as the metal sleeve 1 and the plastic sleeve 3, are fixed by filling with hard glue 15. At the same time, after the hard glue is filled and hardened, the distal end of the metal sleeve 1 is formed into a hemispherical head 2, or a pre-made hemispherical head 2 is bonded by filling with hard glue 15 until the entire metal sleeve 1 is completely sealed, so that the entire part of the probe implanted in the skull is insulated and sealed. The filling hard glue 15 can be UV glue, epoxy glue, or silicone. The glue outside the metal sleeve 1 forms a smooth surface without burrs.

[0088] Specifically, the hemispherical head 2 can be formed by hardening with glue or by bonding a hemispherical head end.

[0089] It should be noted that when clinicians use intracranial pressure sensors for intracranial pressure monitoring, a small hole of about 3 mm is usually drilled in the skull to place the sensor. Therefore, the intracranial probe with built-in miniature pressure and temperature sensors of this invention has an outer diameter of less than 1.3 mm and a length of less than 4 mm. Preferably, the carrier plate 4 has a width of 0.7-1.5 mm, a length of 1.5-3 mm, and a thickness of 0.08-0.25 mm. The ventilation tube 7 has a diameter of 0.08-0.25 mm, extends beyond the end of the carrier plate 4, and enters the plastic sleeve 3, ensuring that the ventilation tube 7 is not blocked. The material of the ventilation tube 7 is not limited.

[0090] If necessary, the intracranial probe with built-in miniature pressure and temperature sensors and the wires to be implanted can be inserted into the external ventricular drainage tube. When the external ventricular drainage tube with built-in miniature pressure and temperature sensors is implanted into the patient's ventricle, it is possible to drain cerebrospinal fluid while monitoring intracranial pressure. At the same time, draining cerebrospinal fluid can also reduce intracranial pressure.

[0091] Finally, it should be noted that the above are merely preferred embodiments of the present invention and are not intended to limit the scope of protection of the present invention. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the scope of protection of the present invention.

Claims

1. An intracranial probe with built-in miniature pressure and temperature sensors, characterized in that: It includes a metal sleeve, a hemispherical head, a plastic sleeve, a carrier plate, a pressure sensor chip, sealing tape, a vent tube, and a temperature sensor chip. One end of the metal sleeve is fixedly connected to the hemispherical head, and the other end of the metal sleeve is fixedly connected to the plastic sleeve. The carrier plate is provided with a notch, a first through groove and a second through groove in sequence along the X direction. The notch is connected to the first through groove. The carrier plate is provided with protrusions symmetrically along the Y direction at one end near the second through groove. The pressure sensor chip is sealed and fixed at the upper end of the first through groove by sealing soft glue, and the sealing tape is pasted at the lower end of the first through groove so that the first through groove forms a sealed transition cavity. The vent tube is located in the notch, one end of the vent tube extends into the sealed transition cavity, and the other end of the vent tube extends into the plastic sleeve. The temperature sensor chip is embedded in the second through groove. The metal sleeve has symmetrical mating grooves at its ends. The metal sleeve is fitted over the carrier plate. The protrusion is embedded and mated with the corresponding mating groove of the metal sleeve and kept fixed. The metal sleeve has a sensing surface window. The sensing surface of the pressure sensor chip corresponds to the position of the sensing surface window. The pressure sensor chip and the sensing surface window are sealed and fixed by sealing hard glue. The metal sleeve and the carrier plate, as well as the metal sleeve and the plastic sleeve, are fixed by filling with hard glue.

2. The intracranial probe with built-in miniature pressure and temperature sensors according to claim 1, characterized in that: The outer diameter of the vent pipe is less than or equal to the thickness of the carrier plate.

3. The intracranial probe with built-in miniature pressure and temperature sensors according to claim 1, characterized in that: The gap between the vent tube and the notch is filled with soft rubber.

4. The intracranial probe with built-in miniature pressure and temperature sensors according to claim 1, characterized in that: The wires of the pressure sensor chip and the temperature sensor chip are led out after passing through a metal sleeve and a plastic sleeve in sequence.

5. An intracranial probe with built-in miniature pressure and temperature sensors according to claim 1, characterized in that: The wires of the temperature sensor chip are located above the carrier plate, and the wires of the pressure sensor chip and the temperature sensor chip pass around the carrier plate and enter the plastic sleeve from below the carrier plate and then come out.

6. An intracranial probe with built-in miniature pressure and temperature sensors according to claim 1, characterized in that: The wires of the temperature sensor chip are located below the carrier plate. The wires of the pressure sensor chip bypass the carrier plate and, together with the wires of the temperature sensor chip, enter the plastic sleeve from below the carrier plate and are led out.

7. An intracranial probe with built-in miniature pressure and temperature sensors according to claim 1, characterized in that: The carrier plate is made of thin metal plate, FPC plate, FR4 plate, ceramic plate, aluminum substrate or BT plate; the metal sleeve is made of stainless steel, nickel titanium alloy, pure titanium, titanium-based metal or cobalt-based metal; the plastic sleeve is made of nylon tube, Teflon tube or PU tube; the hemispherical head is made of epoxy glue or UV glue.

8. An intracranial probe with built-in miniature pressure and temperature sensors according to claim 1, characterized in that: The hemispherical head is integrally formed at the distal end of the metal sleeve after being filled with hard glue and hardened.

9. An intracranial probe with built-in miniature pressure and temperature sensors according to claim 1, characterized in that: The prefabricated hemispherical head is fixedly bonded to the distal end of the metal sleeve.

10. A packaging process for an intracranial probe with built-in miniature pressure and temperature sensors, characterized in that, Includes the following steps: Solder wires onto the pads of the pressure sensor chip and the temperature sensor chip; The pressure sensor chip is fixed to the upper end of the first through slot with sealing soft glue, and the temperature sensor chip is embedded in the second through slot. Clamp the vent tube at the notch and insert one end of the vent tube into the first groove. Fill the gap between the vent tube and the notch with glue. After attaching sealing tape to the lower end of the first groove, a sealed transition cavity is formed between the pressure sensor chip and the sealing tape. The metal sleeve is placed over the carrier plate, and the two protrusions on the carrier plate are inserted and fixed into the corresponding mating grooves of the metal sleeve. The pressure sensor chip and the sensing surface window are sealed and fixed with sealing hard glue. Insert one end of the plastic sleeve into the metal sleeve, and place the wire and vent tube inside the plastic sleeve; Apply adhesive or fill adhesive at the connection between the metal sleeve and the plastic sleeve until the metal sleeve and the carrier plate, as well as the metal sleeve and the plastic sleeve, are fixed by filling with hard adhesive. At the same time, the adhesive at the far end of the metal sleeve hardens and is formed into a hemispherical head, or a pre-made hemispherical head is bonded by filling with hard adhesive until the entire metal sleeve is completely sealed.

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