A two-phase cooling system for servers and its control method

Abstract

This invention discloses a two-phase cooling system for servers and its control method, comprising: a cooling module for providing refrigerant to the server to maintain its normal operating temperature, the cooling module including a refrigerant pump cooling mode and a compressor cooling mode; and a heat dissipation module for heat exchange of the refrigerant, transferring the heat absorbed by the refrigerant to the atmosphere, the heat dissipation module including an air-cooled heat dissipation mode and a hybrid heat dissipation mode; the cooling module and the heat dissipation module are connected by pipelines. The phase change liquid cooling plate disclosed in this invention can replenish the liquid refrigerant more promptly, avoiding dry burning, and has stronger heat exchange performance and temperature uniformity performance.

Description

Technical Field

[0001] This invention relates to the field of data center heat dissipation technology, and in particular to a two-phase cooling system for servers and its control method. Background Technology

[0002] With the rapid development of science and technology, the number and scale of global data centers are increasing year by year. Data center servers are operating at increasingly faster speeds to meet the demands of fields such as autonomous driving, high-performance computing, and artificial intelligence. This high heat flux density has become one of the main factors limiting the development of electronic components. Traditional air cooling can no longer meet the ever-increasing heat dissipation needs. Emerging data center liquid cooling technologies mainly include immersion liquid cooling and cold plate liquid cooling. While immersion liquid cooling has strong heat dissipation performance, it requires strict working fluid requirements and has high installation and maintenance costs, making it difficult to popularize in the short term. Cold plate liquid cooling is currently the most mature and widely used liquid cooling technology. Currently, commonly used cold plate liquid cooling uses a single-phase liquid circulation cooling method. However, as the heat flux density of server chips continues to rise, single-phase liquid cooling can no longer meet the chip's heat dissipation needs, requiring more efficient phase change cold plate liquid cooling. However, current phase change cold plate liquid cooling suffers from problems such as uneven working fluid distribution, dry burning, and localized hot spots.

[0003] Based on the above problems, this invention discloses a dual-phase cooling system for servers and its control method. Compared with conventional liquid cooling plates, the phase change liquid cooling plate disclosed in this invention can replenish liquid working fluid more promptly, avoid dry burning, and has stronger heat exchange performance and temperature uniformity performance. Summary of the Invention

[0004] In order to overcome the above-mentioned shortcomings and deficiencies of the prior art, the purpose of this invention is to provide a dual-phase cooling system for servers and its control method.

[0005] The objective of this invention is achieved through the following technical solution:

[0006] A dual-phase cooling system for servers, comprising:

[0007] A cooling module is used to provide refrigerant to the server to maintain the server's normal operating temperature. The cooling module includes a refrigerant pump cooling mode and a compressor cooling mode.

[0008] A heat dissipation module is used for heat exchange of the refrigerant, transferring the heat absorbed by the refrigerant to the atmosphere. The heat dissipation module includes air-cooled heat dissipation mode and hybrid heat dissipation mode.

[0009] The cooling module and the heat dissipation module are connected by pipes.

[0010] Furthermore, the refrigeration module includes a liquid storage tank 101, a first valve 1021, a refrigerant pump 103, a second valve 1022, a third valve 1023, a gas separator 104, a compressor 105, an oil separator 106, a fourth valve 1024, a first temperature sensor 107, a first pressure sensor 108, a first heat exchanger 109, a second temperature sensor 110, a second pressure sensor 111, an electronic expansion valve 112, a fifth valve 1025, a liquid supply pipe 113, a third pressure sensor 114, a third temperature sensor 115, a sixth valve 1026, multiple server liquid cooling modules 3, a fourth temperature sensor 116, a fourth pressure sensor 117, and a return pipe 118;

[0011] The liquid storage tank 101 is connected to two branches. The first branch includes a first valve 1021, a refrigerant pump 103, and a second valve 1022 connected in sequence. The second branch includes a third valve 1023, a gas separator 104, a compressor 105, an oil separator 106, and a fourth valve 1024. Both branches are connected to a first temperature sensor 107. The first temperature sensor 107, a first pressure sensor 108, a first heat exchanger 109, a second temperature sensor 110, and a second pressure sensor 111 are connected in sequence. The second pressure sensor 111 is connected to an electronic expansion valve 112 and a fifth valve 1025 connected in parallel.

[0012] Then it is connected to the liquid supply pipe 113, which is connected to multiple server liquid cooling modules. The third pressure sensor 114, the third temperature sensor 115 and the sixth valve 1026 are connected in sequence and are set between the liquid supply pipe and the server liquid cooling module. The multiple server liquid cooling modules are connected to the return pipe 118, and a fourth pressure sensor 117 and a fourth temperature sensor 116 are set between the return pipe 118 and the server liquid cooling module.

[0013] Furthermore, the fluorine pump refrigeration mode includes a liquid storage tank 101, a first valve 1021, a fluorine pump 103, a second valve 1022, a first temperature sensor 107, a first pressure sensor 108, a first heat exchanger 109, a second temperature sensor 110, a second pressure sensor 111, a fifth valve 1025, a liquid supply pipe 113, a third pressure sensor 114, a third temperature sensor 115, a sixth valve 1026, a server liquid cooling module 3, a fourth temperature sensor 116, a fourth pressure sensor 117, and a return pipe 118;

[0014] The compressor cooling mode includes a liquid storage tank 101, a third valve 1023, a gas separator 104, a compressor 105, an oil separator 106, a fourth valve 1024, a first temperature sensor 107, a first pressure sensor 108, a first heat exchanger 109, a second temperature sensor 110, a second pressure sensor 111, an electronic expansion valve 112, a liquid supply pipe 113, a third pressure sensor 114, a third temperature sensor 115, a sixth valve 1026, a server liquid cooling module 3, a fourth temperature sensor 116, a fourth pressure sensor 117, and a return pipe 118.

[0015] Furthermore, the heat dissipation module includes a second heat exchanger 201, a third temperature sensor 202, a seventh valve 2031, a first water pump 204, an eighth valve 2032, a fourth temperature sensor 205, a fan 206, an air inlet 207, a water tank 208, a ninth valve 2033, a second water pump 209, a jet nozzle 210, and a third heat exchanger 211;

[0016] The second heat exchanger 201, the third temperature sensor 202, the seventh valve 2031, the first water pump 204, the eighth valve 2032, the first heat exchanger 109, and the fourth temperature sensor 205 are connected in sequence; the second heat exchanger 201, the fan 206, the air inlet 207, the water tank 208, the ninth valve 2033, the second water pump 209, the jet nozzle 210, and the third heat exchanger 211 are integrated in a single chassis.

[0017] Furthermore, the air-cooled heat dissipation mode includes a second heat sink 201, a fan 206, and an air inlet 207;

[0018] The hybrid heat dissipation mode includes a second radiator 201, a fan 206, an air inlet 207, a water tank 208, a ninth valve 2033, a second water pump 209, a jet nozzle 210, and a third heat exchanger 211.

[0019] Furthermore, the server liquid cooling module includes a server fan 301, a radiator 302, a fifth temperature sensor 303, a phase change liquid cooling plate 304, a memory liquid cooling module 305, a sixth temperature sensor 306, heat dissipation fins 307, and a liquid distribution module 308.

[0020] The server fan 301 is mounted on the side of the radiator 302 and connected; the phase change liquid cooling plate 304 is in close contact with the internal chip of the server; the sixth temperature sensor 306 is set on the phase change liquid cooling plate; the memory liquid cooling module 305 is attached to the server memory; the heat dissipation fins 307 are installed between the memory liquid cooling modules 305; and the fifth temperature sensor is used to detect the temperature inside the server liquid cooling module.

[0021] Furthermore, the phase change liquid cooling plate includes, from top to bottom, a liquid cooling plate cover plate 3041, a liquid cavity 3042, a jet plate 3043, and a liquid cooling plate bottom plate 3044; the liquid cavity 3042 includes a working fluid inlet 30421, a working fluid outlet 30422, a liquid distribution cavity 30423, and a reflux cavity 30424; the jet plate 3043 includes a jet hole 30431 and a reflux port 30432; and the liquid cooling plate bottom plate 3044 is provided with a liquid cooling channel 30441.

[0022] Furthermore, the cooling medium of the phase change liquid cooling plate 304 enters the liquid distribution chamber 30423 from the working medium inlet 30421. The working medium is divided in the liquid distribution chamber 30423 and jetted onto the liquid cooling plate bottom plate 3044 through different jet holes 30431 and spreads to the entire liquid cooling plate bottom plate 3044. The working medium flows in an S-shape along the liquid cooling channel 30441 on the liquid cooling plate bottom plate 3044. At the same time, the working medium is continuously jetted downward through the jet holes 30431, forming turbulence with the working medium flowing on the liquid cooling plate bottom plate 3044. This continuously replenishes the working medium to the liquid cooling plate bottom plate 3044 and enhances the convective heat transfer performance of the phase change liquid cooling plate 304. After absorbing heat through heat exchange on the liquid cooling plate bottom plate 3044, the working medium flows back to the return chamber 30424 from the return port 30432 and finally flows out from the working medium outlet 30422.

[0023] Furthermore, the cooling module 1 and the heat dissipation module 2 are connected by a pipeline; the pipeline includes a second heat exchanger 201, a third temperature sensor 202, a seventh valve 2031, a first water pump 204, an eighth valve 2032, a first heat exchanger 109, and a fourth temperature sensor 205.

[0024] A control method based on the aforementioned two-phase cooling system for servers.

[0025] The system switches between refrigerant pump cooling mode and compressor cooling mode based on temperature feedback from the server liquid cooling module. It calculates the subcooling degree of the cooling module 1 based on data from the second temperature sensor 110 and the second pressure sensor 111, and switches between air cooling mode and hybrid cooling mode based on the subcooling degree.

[0026] Compared with the prior art, the present invention has the following advantages and beneficial effects:

[0027] This invention provides a new solution for data center heat dissipation systems by attaching a phase change liquid cooling plate to the main heat-generating chips inside the server. The heat exchange efficiency is improved by the phase change of the cooling medium inside the phase change liquid cooling plate. At the same time, this invention adopts a hybrid cooling method that combines air cooling and phase change cooling to dissipate heat from the server, integrating air cooling and phase change cooling into one, thus improving the integration of the heat dissipation system.

[0028] Compared to conventional liquid cooling plates, the phase change liquid cooling plate disclosed in this invention adopts a liquid cooling plate structure that combines jet impact and microchannel liquid cooling, which has a stronger turbulence effect and can replenish liquid working fluid more promptly, avoiding dry burning, and has stronger heat exchange performance and temperature uniformity performance. Attached Figure Description

[0029] Figure 1 This is a diagram of a two-phase cooling system for servers provided by the present invention;

[0030] Figure 2 This is a schematic diagram of the server liquid cooling module provided by the present invention;

[0031] Figure 3 This is a schematic diagram of the phase change liquid cooling plate provided by the present invention;

[0032] Figure 4 This is a flowchart illustrating the control method of a two-phase cooling system for servers according to the present invention. Detailed Implementation

[0033] The present invention will be further described in detail below with reference to the embodiments, but the implementation of the present invention is not limited thereto.

[0034] Example

[0035] like Figure 1 As shown, a dual-phase cooling system for servers includes a cooling module 1 and a heat dissipation module 2.

[0036] The refrigeration module 1 is used to provide refrigerant to the server to maintain the server's normal operating temperature. It includes a liquid storage tank 101, a first valve 1021, a refrigerant pump 103, a second valve 1022, a third valve 1023, a gas separator 104, a compressor 105, an oil separator 106, a fourth valve 1024, a first temperature sensor 107, a first pressure sensor 108, a first heat exchanger 109, a second temperature sensor 110, a second pressure sensor 111, an electronic expansion valve 112, a fifth valve 1025, a liquid supply pipe 113, a third pressure sensor 114, a third temperature sensor 115, a sixth valve 1026, a server liquid cooling module 3, a fourth temperature sensor 116, a fourth pressure sensor 117, and a return pipe 118.

[0037] Its specific connection method is as follows:

[0038] The storage tank 101 is connected to two branches. The first branch includes a first valve 1021, a refrigerant pump 103, and a second valve 1022 connected in sequence. The second branch includes a third valve 1023, a gas separator 104, a compressor 105, an oil separator 106, and a fourth valve 1024. Both branches are connected to a first temperature sensor 107. The first temperature sensor 107, the first pressure sensor 108, the first heat exchanger 109, the second temperature sensor 110, and the second pressure sensor 111 are connected in sequence. The second pressure sensor 111 is connected to the parallel electronic expansion valve 112 and the fifth valve 1025, and then to the liquid supply pipe 113. The liquid supply pipe 113 is connected to multiple server liquid cooling modules. The third pressure sensor, the third temperature sensor and the sixth valve are connected in sequence and are located between the liquid supply pipe and the server liquid cooling modules. The multiple server liquid cooling modules are connected to the return pipe 118. A fourth pressure sensor 117 and a fourth temperature sensor 116 are located between the return pipe 118 and the server liquid cooling modules to complete the connection of the cooling modules.

[0039] The fluorine pump cooling mode includes a liquid storage tank 101, a first valve 1021, a fluorine pump 103, a second valve 1022, a first temperature sensor 107, a first pressure sensor 108, a first heat exchanger 109, a second temperature sensor 110, a second pressure sensor 111, a fifth valve 1025, a liquid supply pipe 113, a third pressure sensor 114, a third temperature sensor 115, a sixth valve 1026, a server liquid cooling module 3, a fourth temperature sensor 116, a fourth pressure sensor 117, and a return pipe 118.

[0040] The compressor cooling mode includes a liquid storage tank 101, a third valve 1023, a gas separator 104, a compressor 105, an oil separator 106, a fourth valve 1024, a first temperature sensor 107, a first pressure sensor 108, a first heat exchanger 109, a second temperature sensor 110, a second pressure sensor 111, an electronic expansion valve 112, a liquid supply pipe 113, a third pressure sensor 114, a third temperature sensor 115, a sixth valve 1026, a server liquid cooling module 3, a fourth temperature sensor 116, a fourth pressure sensor 117, and a return pipe 118.

[0041] The heat dissipation module 2 is used for heat exchange of the working fluid, transferring the heat absorbed by the working fluid to the atmosphere. It includes a second heat exchanger 201, a seventh temperature sensor 202, a seventh valve 2031, a first water pump 204, an eighth valve 2032, an eighth temperature sensor 205, a fan 206, an air inlet 207, a water tank 208, a ninth valve 2033, a second water pump 209, a jet nozzle 210, and a third heat exchanger 211.

[0042] The second heat exchanger 201, the third temperature sensor 202, the seventh valve 2031, the first water pump 204, the eighth valve 2032, the first heat exchanger 109, and the fourth temperature sensor 205 are connected in sequence; the second heat exchanger 201, the fan 206, the air inlet 207, the water tank 208, the ninth valve 2033, the second water pump 209, the jet nozzle 210, and the third heat exchanger 211 are integrated in a single chassis.

[0043] The heat dissipation module 2 includes air-cooled heat dissipation mode and hybrid heat dissipation mode;

[0044] The air-cooled heat dissipation mode includes a second heat sink 201, a fan 206, and an air inlet 207;

[0045] The hybrid heat dissipation mode includes a second radiator 201, a fan 206, an air inlet 207, a water tank 208, a ninth valve 2033, a second water pump 209, a jet nozzle 210, and a third heat exchanger 211.

[0046] The second heat exchanger 201, the third temperature sensor 202, the seventh valve 2031, the first water pump 204, the eighth valve 2032, the first heat exchanger 109, and the fourth temperature sensor 205 are connected in sequence; the second heat exchanger 201, the fan 206, the air inlet 207, the water tank 208, the ninth valve 2033, the second water pump 209, the jet nozzle 210, and the third heat exchanger 211 are integrated in a single chassis.

[0047] The refrigeration module 1 and the heat dissipation module 2 are connected by a pipeline; the pipeline includes a second heat exchanger 201, a seventh temperature sensor 202, a seventh valve 2031, a first water pump 204, an eighth valve 2032, a first heat exchanger 109, and an eighth temperature sensor 205.

[0048] The dual-phase cooling system for servers switches between refrigerant pump cooling mode and compressor cooling mode based on temperature feedback from the server liquid cooling module 3. It calculates the subcooling degree of the cooling module 1 based on data from the second temperature sensor 110 and the second pressure sensor 111, and switches between air cooling mode and hybrid cooling mode based on the subcooling degree.

[0049] Figure 2 This is a schematic diagram of the structure of a server liquid cooling module, which includes a server fan 301, a radiator 302, a fifth temperature sensor 303, a phase change liquid cooling plate 304, a memory liquid cooling module 305, a sixth temperature sensor 306, heat dissipation fins 307, and a liquid distribution module 308.

[0050] The server fan 301 is mounted on the side of the radiator 302 and connected to it with bolts; the phase change liquid cooling plate 304 is in close contact with the internal chip of the server, and thermal grease is applied between the phase change liquid cooling plate 304 and the chip to reduce thermal resistance; the memory liquid cooling module 305 is attached to the server memory; the heat dissipation fins 307 are installed between the memory liquid cooling modules 305.

[0051] The phase change liquid cooling plate 304 and the memory liquid cooling module 305 respectively cool the high-power chips and memory inside the server; the server fan 301, together with the radiator 302 and heat dissipation fins 307, performs secondary cooling on the air inside the server, reducing the temperature of the air inside the server and maintaining the uniformity of the air temperature.

[0052] Figure 3 This is a schematic diagram of the phase change liquid cooling plate. The phase change liquid cooling plate 304 includes a liquid cooling plate cover plate 3041, a liquid cavity 3042, a jet plate 3043, and a liquid cooling plate base plate 3044. The liquid cavity 3042 includes a working fluid inlet 30421, a working fluid outlet 30422, a liquid distribution cavity 30423, and a reflux cavity 30424. The jet plate 3043 includes a jet hole 30431 and a reflux port 30432. The liquid cooling plate base plate 3044 is provided with a liquid cooling channel 30441. The shape and size of the liquid cooling channel 30441 can be set according to requirements, and can be a serpentine flow channel, a parallel flow channel, a bifurcated flow channel, or various composite flow channels.

[0053] The cooling medium of the phase change liquid cooling plate 304 enters the liquid distribution chamber 30423 from the working medium inlet 30421. The working medium is divided in the liquid distribution chamber 30423 and jetted through different jet holes 30431 onto the liquid cooling plate bottom plate 3044 and spreads to the entire liquid cooling plate bottom plate 3044. The working medium flows in an S-shape along the liquid cooling channel 30441 on the liquid cooling plate bottom plate 3044. At the same time, the working medium is continuously jetted downward through the jet holes 30431, forming turbulence with the working medium flowing on the liquid cooling plate bottom plate 3044. This continuously replenishes the working medium to the liquid cooling plate bottom plate 3044 and enhances the convective heat transfer performance of the phase change liquid cooling plate 304. After absorbing heat through heat exchange on the liquid cooling plate bottom plate 3044, the working medium flows back to the return chamber 30424 from the return port 30432 and finally flows out from the working medium outlet 30422.

[0054] To further explain, the shape of the jet orifice 30431 can be selected according to requirements, including but not limited to cylindrical, conical, spiral, etc.; the shape of the liquid cooling channel 30441 can be selected according to requirements, including but not limited to serpentine flow channel, annular flow channel, fractal flow channel, etc.

[0055] Figure 4 This invention relates to a control method for a two-phase cooling system for servers, comprising:

[0056] S1 controls the dual-phase cooling system to circulate via the control motherboard;

[0057] S2 defines T b T6 represents the maximum allowable temperature for server electronic components, and T6 is the temperature data collected by the sixth temperature sensor 306. <T b When T6 > T, turn on the refrigerant pump cooling mode. b When needed, turn on the compressor cooling mode;

[0058] S3 defines T c The maximum allowable superheat of the system; T3 and T4 are the temperature data collected by the third temperature sensor 115 and the fourth temperature sensor 116, respectively; P3 and P4 are the pressure data collected by the third pressure sensor 114 and the fourth pressure sensor 117, respectively; the saturation temperature under pressure P4 is defined as T. def1 The superheat is defined as T0 = T4 - T def1 When T0 > 0℃, control the frequency of fluorine pump 103 to H1; when T0 > T c At that time, control the heat dissipation module 2 to switch to hybrid heat dissipation mode;

[0059] S4 defines Tthr as the critical value of system superheat, and Tc as the maximum allowable superheat of the system; T3 and T4 are the temperature data collected by the third temperature sensor 115 and the fourth temperature sensor 116, respectively; P3 and P4 are the pressure data collected by the third pressure sensor 114 and the fourth pressure sensor 117, respectively; the saturation temperature at pressure P4 is defined as T. def1 The superheat is defined as T0 = T4 - T def1 When T0>0℃, control the compressor 105 frequency to H2; when T0>Tthr, control the electronic expansion valve 108 to open to F1; when T0>Tc, control the heat dissipation module 2 to switch to hybrid heat dissipation mode.

[0060] S5 defines ΔT as the maximum allowable inlet and outlet water temperature difference of the system, and T7 and T8 are the temperature data collected by the seventh temperature sensor 202 and the eighth temperature sensor 205, respectively. e =T4T3 is the temperature difference between the inlet and outlet water of the system, when T e When the flow rate of the first water pump 204 is greater than ΔT, the flow rate of the first water pump 204 is controlled to F1.

[0061] S6 defines Td as the minimum allowable subcooling of the system, T1 and T2 are the temperature data collected by the first temperature sensor 107 and the second temperature sensor 110, respectively, and P1 and P2 are the pressure data collected by the first pressure sensor 108 and the second pressure sensor 111, respectively. The saturation temperature at pressure P2 is defined as T. def2 Define supercooling T t =T2-Tdef2 When T t <T d When T... t >T d When the time comes, control the heat dissipation module 2 to switch to air cooling mode;

[0062] S7 defines Tf as the highest permissible temperature of the air inside the server, and T5 as the temperature data collected by the fifth temperature sensor 303. When T5 > Tf, the frequency of the server fan 302 is increased to H3, and the heat dissipation module 2 is controlled to switch to air cooling mode.

[0063] The phase change liquid cooling plate is bonded to the main heat-generating chip in the server. The heat exchange efficiency is improved by the phase change of the cooling working fluid inside the phase change liquid cooling plate. Compared with conventional liquid cooling plates, the phase change liquid cooling plate adopts a structure that combines jet impact and microchannel liquid cooling, which has a stronger turbulence effect and can replenish the liquid working fluid more timely, avoiding dry burning. It has stronger heat exchange performance and temperature uniformity performance.

[0064] The above embodiments are preferred embodiments of the present invention, but the embodiments of the present invention are not limited to the embodiments described above. Any changes, modifications, substitutions, combinations, or simplifications made without departing from the spirit and principle of the present invention shall be considered equivalent substitutions and shall be included within the protection scope of the present invention.

Claims

1. A two-phase cooling system for servers, characterized in that, include: A refrigeration module (1) is used to provide refrigerant to the server to maintain the normal operating temperature of the server. The refrigeration module includes a refrigerant pump refrigeration mode and a compressor refrigeration mode. The heat dissipation module (2) is used for heat exchange of the refrigerant and transfers the heat absorbed by the refrigerant to the atmosphere. The heat dissipation module includes air-cooled heat dissipation mode and hybrid heat dissipation mode. The cooling module and the heat dissipation module are connected by pipes; The refrigeration module includes a liquid storage tank (101), a first valve (1021), a refrigerant pump (103), a second valve (1022), a third valve (1023), a gas separator (104), a compressor (105), an oil separator (106), a fourth valve (1024), a first temperature sensor (107), a first pressure sensor (108), a first heat exchanger (109), a second temperature sensor (110), a second pressure sensor (111), an electronic expansion valve (112), a fifth valve (1025), a liquid supply pipe (113), a third pressure sensor (114), a third temperature sensor (115), a sixth valve (1026), multiple server liquid cooling modules (3), a fourth temperature sensor (116), a fourth pressure sensor (117), and a return pipe (118). The liquid storage tank (101) is connected to two branches. The first branch includes a first valve (1021), a fluorine pump (103), and a second valve (1022) connected in sequence. The second branch includes a third valve (1023), a gas separator (104), a compressor (105), an oil separator (106), and a fourth valve (1024). Both branches are connected to a first temperature sensor (107). The first temperature sensor (107), the first pressure sensor (108), the first heat exchanger (109), the second temperature sensor (110), and the second pressure sensor (111) are connected in sequence. The second pressure sensor (111) is connected to an electronic expansion valve (112) and a fifth valve (1025) connected in parallel. Then it is connected to the liquid supply pipe (113), which is connected to multiple server liquid cooling modules respectively. The third pressure sensor (114), the third temperature sensor (115) and the sixth valve (1026) are connected in sequence and set between the liquid supply pipe and the server liquid cooling module. The multiple server liquid cooling modules are connected to the return pipe (118). The fourth pressure sensor (117) and the fourth temperature sensor (116) are set between the return pipe (118) and the server liquid cooling module. The fluorine pump cooling mode includes a liquid storage tank (101), a first valve (1021), a fluorine pump (103), a second valve (1022), a first temperature sensor (107), a first pressure sensor (108), a first heat exchanger (109), a second temperature sensor (110), a second pressure sensor (111), a fifth valve (1025), a liquid supply pipe (113), a third pressure sensor (114), a third temperature sensor (115), a sixth valve (1026), a server liquid cooling module (3), a fourth temperature sensor (116), a fourth pressure sensor (117), and a return pipe (118); The compressor refrigeration mode includes a liquid storage tank (101), a third valve (1023), a gas separator (104), a compressor (105), an oil separator (106), a fourth valve (1024), a first temperature sensor (107), a first pressure sensor (108), a first heat exchanger (109), a second temperature sensor (110), a second pressure sensor (111), an electronic expansion valve (112), a liquid supply pipe (113), a third pressure sensor (114), a third temperature sensor (115), a sixth valve (1026), a server liquid cooling module (3), a fourth temperature sensor (116), a fourth pressure sensor (117), and a return pipe (118); The server liquid cooling module includes a server fan (301), a radiator (302), a fifth temperature sensor (303), a phase change liquid cooling plate (304), a memory liquid cooling module (305), a sixth temperature sensor (306), heat dissipation fins (307), and a liquid distribution module (308). The server fan (301) is mounted on the side of the radiator (302) and connected; the phase change liquid cooling plate (304) is in close contact with the internal chip of the server; the sixth temperature sensor (306) is set on the phase change liquid cooling plate; the memory liquid cooling module (305) is attached to the server memory; the heat dissipation fins (307) are installed between the memory liquid cooling modules (305); and the fifth temperature sensor is used to detect the temperature inside the server liquid cooling module. The phase change liquid cooling plate, from top to bottom, includes a liquid cooling plate cover plate (3041), a liquid chamber (3042), a jet plate (3043), and a liquid cooling plate bottom plate (3044); the liquid chamber (3042) includes a working fluid inlet (30421), a working fluid outlet (30422), a liquid distribution chamber (30423), and a reflux chamber (30424); the jet plate (3043) includes a jet hole (30431) and a reflux port (30432); the liquid cooling plate bottom plate (3044) is provided with a liquid cooling channel (30441); The heat dissipation module includes a second heat exchanger (201), a seventh temperature sensor (202), a seventh valve (2031), a first water pump (204), an eighth valve (2032), an eighth temperature sensor (205), a fan (206), an air inlet (207), a water tank (208), a ninth valve (2033), a second water pump (209), a jet nozzle (210), and a third heat exchanger (211); The fluorine pump cooling mode and compressor cooling mode are switched according to the temperature feedback of the server liquid cooling module. The subcooling degree of the cooling module (1) is calculated according to the data fed back by the second temperature sensor (110) and the second pressure sensor (111). The air cooling mode and hybrid cooling mode are switched according to the subcooling degree. The control process of the server's dual-phase cooling system includes: S1 controls the dual-phase cooling system to circulate via the control motherboard; S2 defines Tb as the maximum allowable temperature of the server's electronic components, and T6 as the temperature data collected by the sixth temperature sensor. When T6 < Tb, the refrigerant pump cooling mode is activated; when T6 > Tb, the compressor cooling mode is activated. S3 defines Tc as the maximum allowable superheat of the system; T3 and T4 are the temperature data collected by the third and fourth temperature sensors, respectively; P3 and P4 are the pressure data collected by the third and fourth pressure sensors, respectively; the saturation temperature under pressure P4 is defined as Tdef1, and the superheat T0 is defined as T4 - Tdef1; when T0 > 0℃, the refrigerant pump frequency is controlled to H1; when T0 > Tc, the heat dissipation module is controlled to switch to hybrid heat dissipation mode. S4 defines Tthr as the critical value of system superheat and Tc as the maximum allowable superheat of the system; T3 and T4 are the temperature data collected by the third and fourth temperature sensors, respectively; P3 and P4 are the pressure data collected by the third and fourth pressure sensors, respectively; the saturation temperature under pressure P4 is defined as Tdef1, and the superheat T0 is defined as T4 - Tdef1; when T0 > 0℃, the compressor frequency is controlled to H2; when T0 > Tthr, the opening degree of the electronic expansion valve is controlled to F1; when T0 > Tc, the heat dissipation module is controlled to switch to hybrid heat dissipation mode. S5 defines ΔT as the maximum allowable temperature difference between the inlet and outlet water of the system. T7 and T8 are the temperature data collected by the seventh and eighth temperature sensors, respectively. Te = T8 - T7 is defined as the temperature difference between the inlet and outlet water of the system. When Te > ΔT, the flow rate of the first water pump is controlled to M1. S6 defines Td as the minimum subcooling degree allowed by the system, T1 and T2 are the temperature data collected by the first temperature sensor and the second temperature sensor respectively, P1 and P2 are the pressure data collected by the first pressure sensor and the second pressure sensor respectively. Define the saturation temperature at pressure P2 as Tdef2, and define the subcooling degree Tt = T2 - Tdef2; when Tt < Td, control the heat dissipation module to switch to the hybrid heat dissipation mode, and when Tt > Td, control the heat dissipation module to switch to the air-cooled heat dissipation mode; S7 defines Tf as the maximum temperature allowed for the air inside the server, T5 is the temperature data collected by the fifth temperature sensor. When T5 > Tf, increase the frequency of the server fan to H3 and control the heat dissipation module to switch to the air-cooled heat dissipation mode.

2. The two-phase refrigeration system for a server according to claim 1, wherein The second heat exchanger (201), the seventh temperature sensor (202), the seventh valve (2031), the first water pump (204), the eighth valve (2032), the first heat exchanger (109) and the eighth temperature sensor (205) are connected in sequence; The second heat exchanger (201), the fan (206), the air inlet (207), the water tank (208), the ninth valve (2033), the second water pump (209), the jet nozzle (210) and the third heat exchanger (211) are integrated in one chassis.

3. The dual-phase cooling system for servers according to claim 2, characterized in that, The air-cooled heat dissipation mode includes the second heat exchanger (201), the fan (206) and the air inlet (207); The hybrid heat dissipation mode includes the second heat exchanger (201), the fan (206), the air inlet (207), the water tank (208), the ninth valve (2033), the second water pump (209), the jet nozzle (210) and the third heat exchanger (211).

4. The dual-phase cooling system for servers according to claim 1, characterized in that, The cooling working medium of the phase change liquid cooling plate (304) enters the liquid distribution cavity (30423) from the working medium inlet (30421). The working medium is split in the liquid distribution cavity (30423) and jets onto the bottom plate (3044) of the liquid cooling plate through different jet holes (30431) and spreads to the entire bottom plate (3044) of the liquid cooling plate. The working medium flows in an S shape along the liquid cooling channel (30441) on the bottom plate (3044) of the liquid cooling plate. At the same time, the working medium continuously jets downward through the jet holes (30431), forming a turbulent flow with the working medium flowing on the bottom plate (3044) of the liquid cooling plate, continuously replenishing the working medium for the bottom plate (3044) of the liquid cooling plate and enhancing the heat transfer performance of the convection heat transfer of the phase change liquid cooling plate (304). After the working medium absorbs heat through heat exchange on the bottom plate (3044) of the liquid cooling plate, it flows back to the return cavity (30424) from the return port (30432), and finally flows out from the working medium outlet (30422).

5. The dual-phase cooling system for servers according to claim 1, characterized in that, The refrigeration module (1) and the heat dissipation module (2) are connected by pipelines; the pipelines include the second heat exchanger (201), the seventh temperature sensor (202), the seventh valve (2031), the first water pump (204), the eighth valve (2032), the first heat exchanger (109), the eighth temperature sensor (205).

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