Integrated automatic plastic packaging eutectic machine

Abstract

The application relates to an integrated automatic plastic packaging eutectic machine, and relates to the technical field of semiconductor packaging equipment. The eutectic machine comprises a mounting platform, an eutectic table used for heating and bonding a chip and a substrate, the eutectic table being arranged on the mounting platform, a chip feeding device used for conveying the chip towards the eutectic table, the chip feeding device being arranged on the mounting platform, a substrate feeding device used for conveying the substrate towards the eutectic table, the substrate feeding device being arranged on the mounting platform, and a finished product discharging device, the finished product discharging device comprising a suction mechanical hand and a mechanical hand driving mechanism, the mechanical hand driving mechanism being arranged on the mounting platform, the suction mechanical hand being arranged on the mechanical hand driving mechanism, the suction mechanical hand being used for sucking the finished product on the eutectic table, and the mechanical hand driving mechanism being used for driving the suction mechanical hand to move close to or away from the eutectic table. The application can accelerate the packaging speed of the eutectic machine and improve the overall packaging efficiency.

Description

Technical Field

[0001] This application relates to the technical field of semiconductor packaging equipment, and in particular to an integrated automated molding eutectic machine. Background Technology

[0002] Eutectic bonding refers to the phenomenon of eutectic bonding between eutectic solders, a process that creates a highly thermally and electrically conductive bond, typically required for densely packaged circuits in modern chips. Eutectic bonding technology is widely used in the electronic packaging industry, such as bonding chips to substrates, substrates to housings, and housing caps. Compared to common epoxy conductive adhesive bonding, eutectic bonding offers advantages such as high thermal conductivity, low resistance, fast heat transfer, high reliability, and high shear strength after bonding, making it suitable for interconnecting chips to substrates and substrates to housings in high-frequency, high-power devices.

[0003] The eutectic bonding machine is a key piece of equipment in the packaging production line of optoelectronic communication devices. Its working process is as follows: the chip mounting head mechanism picks up the substrate from the material stage and places it on the eutectic bonding machine. The eutectic bonding machine preheats the substrate to the mounting temperature. The chip mounting head mechanism picks up the chip from the corresponding material stage and mounts it to the corresponding mounting position on the substrate. After the chip and substrate are mounted, the eutectic bonding machine heats the substrate to the eutectic temperature and then quickly cools it down to cure it, thus completing the eutectic bonding process.

[0004] Currently, existing eutectic machines mainly include a eutectic stage, a chip loading mechanism, and a substrate loading mechanism. The substrate loading mechanism is used to transport the substrate to the eutectic stage, and the chip loading mechanism is used to transport the chip to the eutectic stage. The eutectic stage is heated, thereby enabling the substrate and the chip to be bonded to obtain the finished product.

[0005] To achieve automated production, existing eutectic bonding machines often use a substrate loading mechanism for both substrate loading and finished product unloading. This means that after the substrate and chip are eutectic bonded, the finished product needs to be transported out via the substrate loading mechanism. Consequently, substrate loading can only occur after the finished product has been placed, which affects the packaging speed of the eutectic bonding machine and reduces the overall packaging efficiency. Summary of the Invention

[0006] This application provides an integrated automated molding eutectic machine, the purpose of which is to accelerate the packaging speed of the eutectic machine and improve the overall packaging efficiency.

[0007] The integrated automated molding eutectic machine provided in this application adopts the following technical solution:

[0008] An integrated automated molding eutectic bonding machine includes a mounting platform; a eutectic stage for heat bonding a chip and a substrate, the eutectic stage being disposed on the mounting platform; a chip loading device for feeding chips toward the eutectic stage, the chip loading device being disposed on the mounting platform; a substrate loading device for feeding substrates toward the eutectic stage, the substrate loading device being disposed on the mounting platform; and a finished product unloading device, the finished product unloading device including a suction robot and a robot drive mechanism, the robot drive mechanism being disposed on the mounting platform, the suction robot being disposed on the robot drive mechanism, the suction robot being used to pick up finished products on the eutectic stage, and the robot drive mechanism being used to drive the suction robot to move closer to or away from the eutectic stage.

[0009] By adopting the above technical solution, a eutectic stage, a chip loading device, and a substrate loading device are set on the mounting platform. Through the cooperation of the eutectic stage, the chip loading device, and the substrate loading device, the substrate and the chip can be transported to the eutectic stage. The eutectic stage is heated, so that the substrate and the chip are thermally bonded, thus obtaining the finished product.

[0010] Based on this, a finished product unloading device is added to the installation platform. The finished product unloading device can pick up the finished products on the eutectic stage by a suction robot, and the robot drive mechanism can drive the suction robot to move closer to or away from the eutectic stage. Through the coordinated setting of the suction robot and the robot drive mechanism, the unloading of finished products can be realized.

[0011] By configuring the substrate loading device, chip loading device, and finished product unloading device, the substrate loading, chip loading, and finished product unloading steps are made independent of each other, allowing each step to be performed independently without interference between them. This accelerates the eutectic bonding process and improves overall packaging efficiency.

[0012] Optionally, the finished product unloading device further includes a material tray and a material tray driving mechanism. The material tray driving mechanism is disposed on the mounting platform, and the material tray is disposed on the material tray driving mechanism. The material tray is spaced apart from the eutectic stage. The material tray driving mechanism is used to drive the material tray to move toward or away from the suction robot, and the robot driving mechanism is used to drive the suction robot to move between the eutectic stage and the material tray.

[0013] By adopting the above technical solution, firstly, the tray can store the prepared finished products. Secondly, through the coordinated arrangement of the tray drive mechanism and the robot drive mechanism, the tray and the suction robot can be driven synchronously, which facilitates the rapid mutual positioning of the tray and the suction robot, thereby accelerating the speed of unloading and loading finished products into the tray.

[0014] Optionally, a heating module is provided on the eutectic platform. The heating module includes a heating stage, which is disposed on the eutectic platform and has several heating rods embedded within it.

[0015] By adopting the above technical solution, the combined arrangement of the heating stage and heating rod enables the heating function of the eutectic stage. Simultaneously, the use of a heating rod improves the accuracy of temperature control on the heating stage.

[0016] Optionally, the heating platform has a heating chamber, and an air extraction device is provided on one side of the heating platform, which is connected to the heating chamber; the heating platform has a vacuum adsorption hole, which is connected to the heating chamber.

[0017] By employing the above technical solution, the coordinated arrangement of the vacuum adsorption holes, heating chamber, and air extraction component on the heating stage enables the air extraction component to extract gas from the heating chamber. Consequently, when the substrate is placed on the heating stage, the vacuum adsorption holes can hold the substrate in place, thus achieving substrate fixation.

[0018] Optionally, a plurality of vacuum adsorption holes are provided, and all of the plurality of vacuum adsorption holes are connected to the air extraction component; the plurality of vacuum adsorption holes are spaced apart, and the inner diameters of the plurality of vacuum adsorption holes are all different.

[0019] By adopting the above technical solution and setting several vacuum adsorption holes of different sizes, the heating stage of this application can adsorb substrates of different sizes, thereby enabling the production of finished products of different sizes.

[0020] Optionally, a first nitrogen gas supply component is also provided on the eutectic stage. A heating pipe for heating nitrogen is provided between the first nitrogen gas supply component and the heating stage. One end of the heating pipe is connected to the first nitrogen gas supply component, and the other end is connected to the heating stage. The heating pipe is also connected to the heating chamber.

[0021] By adopting the above technical solution, the cooperation between the heating gas pipe and the first nitrogen gas supply component can inject heated nitrogen into the heating chamber. On the one hand, it can assist the heating rod in heating the heating platform; on the other hand, the hot nitrogen fills the heating chamber, which can provide uniform heating of the heating platform.

[0022] Optionally, a eutectic groove is formed on the upper side of the eutectic platform, and a transparent plate is provided on the eutectic platform to close the eutectic groove; the heating stage is disposed in the eutectic groove, and the transparent plate has an elongated eutectic hole for accommodating the chip and the substrate.

[0023] By adopting the above technical solution, the heating stage is placed inside the eutectic tank, which reduces the height of the eutectic tank. Covering the eutectic tank with a transparent plate facilitates observation of its interior. The transparent plate has elongated eutectic holes, providing space for the insertion of the substrate and chip.

[0024] Optionally, the transparent plate is spaced apart from the heating stage, and a eutectic chamber is formed between the transparent plate and the heating stage; a second nitrogen gas supply component is provided on one side of the eutectic stage, and a duct is provided between the second nitrogen gas supply component and the eutectic stage, with one end of the duct connected to the second nitrogen gas supply component and the other end connected to the eutectic stage, and the duct connected to the eutectic chamber.

[0025] By adopting the above technical solution, since a eutectic chamber is formed between the transparent plate and the heating stage, and the second nitrogen gas supply component is connected to the eutectic chamber through the air duct, cold nitrogen gas can be introduced into the eutectic chamber, thereby forming a nitrogen atmosphere in the eutectic chamber. This can form an effective atmosphere protection in the heating area of ​​the eutectic stage, avoiding oxidation defects in the finished product during the eutectic process.

[0026] Optionally, an air knife is provided on one side of the eutectic stage, and a plurality of air holes are opened on the side of the air knife facing the eutectic stage. The air holes are positioned facing the transparent plate. The air knife is connected to the second nitrogen gas supply component, and the plurality of air holes are all connected to the second nitrogen gas supply component.

[0027] By adopting the above technical solution, the opening of the air hole on the air knife enables the second nitrogen gas supply component to blow cold nitrogen onto the transparent plate, which can prevent the transparent plate from fogging due to the temperature difference between the inside and outside, and ensure the transparency of the transparent plate.

[0028] Optionally, a eutectic vision element is disposed on the eutectic stage, the eutectic vision element is disposed vertically above the eutectic stage, and the eutectic vision element and the eutectic stage are disposed directly opposite each other in the vertical direction.

[0029] By adopting the above technical solution, the setting of the eutectic vision element enables monitoring of the bonding between the chip and the substrate on the tool table, ensuring that the finished product meets the requirements.

[0030] In summary, this application includes at least one of the following beneficial technical effects:

[0031] 1. This application, through the arrangement of a substrate loading device, a chip loading device, and a finished product unloading device, ensures that the substrate loading, chip loading, and finished product unloading steps are independent of each other, thereby enabling each step to be performed independently without interference between them. This accelerates the packaging speed of the eutectic reactor and improves the overall packaging efficiency.

[0032] 2. By opening a number of vacuum adsorption holes, this application enables the eutectic stage of this application to adsorb substrates of different sizes, thereby adapting to the production of finished products of different sizes and improving the applicability of this application.

[0033] 3. By combining the air duct and the second nitrogen supply component, this application can create a nitrogen atmosphere in the eutectic chamber, which can effectively protect the heating area on the eutectic stage and prevent oxidation defects in the finished product during the eutectic process. Attached Figure Description

[0034] Figure 1 This is a schematic diagram of the overall structure of the eutectic machine in this application.

[0035] Figure 2 This is a schematic diagram of the overall structure of the chip loading device of this application.

[0036] Figure 3 This is a schematic diagram of the overall structure of the eutectic stage in this application.

[0037] Figure 4 This is a cross-sectional structural diagram of the eutectic stage of this application.

[0038] Figure 5 This is an exploded structural diagram of the eutectic stage of this application.

[0039] Figure 6 This is a schematic diagram of the overall structure of the finished product feeding device of this application.

[0040] In the diagram, 1. Mounting platform; 2. Chip loading device; 21. Feeding mechanism; 211. Feeding vision element; 212. Feeding ejector pin element; 213. Wafer mounting frame; 214. Wafer driving component; 22. First transfer mechanism; 221. Nozzle; 222. Swing arm; 223. Swing driving component; 23. Calibration mechanism; 231. Calibration stage; 232. Calibration vision element; 233. Adsorption stage; 234. Rotation driving component; 235. Calibration driving component; 24. Second transfer mechanism; 241. Adsorption robot; 242. First axis driving component; 243. Second axis driving component; 3. Substrate loading device; 4. Eutectic stage; 41. Heating module; 411. Heating table; 412. Heating rod; 413. Heating chamber; 414. Vacuum adsorption hole; 415. Heating gas pipe; 42. Evacuation component; 43. First nitrogen gas supply component; 44. Eutectic tank; 45. Transparent plate; 451. Eutectic elongated hole; 452. Eutectic chamber; 46. Second nitrogen gas supply component; 47. Air duct; 48. Air knife; 481. Air supply pipe; 482. Air hole; 49. Eutectic vision element; 5. Finished product unloading device; 51. Suction robot; 52. Robot drive mechanism; 521. Y-axis drive component; 522. Z-axis drive component; 53. Material tray; 54. Material tray drive mechanism. Detailed Implementation

[0041] The following is in conjunction with the appendix Figure 1 -Appendix Figure 6 This application will be described in further detail below.

[0042] An integrated automated molding eutectic press, as described above. Figure 1 The system includes an installation platform 1, which is horizontally positioned. The installation platform 1 is equipped with a chip loading device 2, a substrate loading device 3, a eutectic stage 4, and a finished product unloading device 5. The chip loading device 2 and the substrate loading device 3 are arranged at intervals along the horizontal direction, and the eutectic stage 4 is located horizontally between the chip loading device 2 and the substrate loading device 3. The finished product unloading device 5 is located on one side of the eutectic stage 4.

[0043] The substrate loading device 3 can provide a substrate to the eutectic stage 4, and the chip loading device 2 can provide a chip to the eutectic stage 4. After both the substrate and the chip are transported to the eutectic stage 4, the eutectic stage 4 is heated. At this time, the substrate and the chip are heated and bonded to obtain the finished product. The finished product unloading device 5 unloads the finished product.

[0044] Reference Figure 1 and Figure 2 In this embodiment, the chip loading device 2 and the substrate loading device 3 have the same structure. This embodiment will be described using the chip loading device 2 as an example.

[0045] Reference Figure 1 and Figure 2 The chip feeding device 2 includes a feeding mechanism 21, which is spaced apart from the eutectic stage 4. A first transfer mechanism 22, a calibration mechanism 23, and a second transfer mechanism 24 are sequentially arranged on the side of the feeding mechanism 21 facing the eutectic stage 4. The first transfer mechanism 22, the calibration mechanism 23, and the second transfer mechanism 24 are located between the feeding mechanism 21 and the eutectic stage 4.

[0046] The feeding mechanism 21 provides chips, and the first transfer mechanism 22 transfers the chips provided by the feeding mechanism 21 to the calibration mechanism 23. The calibration mechanism 23 calibrates the angle and position of the chips. After calibration, the second transfer mechanism 24 transfers the calibrated chips to the eutectic stage 4. Through the cooperation of the feeding mechanism 21, the first transfer mechanism 22, the calibration mechanism 23, and the second transfer mechanism 24, the chip feeding is achieved.

[0047] Reference Figure 1 and Figure 2The feeding mechanism 21 includes a feeding vision element 211, a feeding ejector pin element 212, a wafer mounting frame 213, and a wafer driver 214. The wafer mounting frame 213 is located on the upper side of the mounting platform 1. The feeding vision element 211 is located vertically on the upper side of the wafer mounting frame 213, and the feeding ejector pin element 212 is located vertically below the wafer mounting frame 213. The feeding vision element 211 and the feeding ejector pin element 212 are directly opposite each other in the vertical direction. The wafer driver 214 is mounted on the mounting platform 1 and connected to the wafer mounting frame 213. The wafer driver 214 adopts a two-axis moving platform.

[0048] A wafer comprises a circular crystal ring, a thin film stretched on the crystal ring, and several chips attached to the thin film. A wafer mounting frame 213 mounts the wafer, while the cooperation of the feed vision element 211 and the wafer driver 214 aligns the chips on the wafer with the feed ejector element 212. The feed ejector element 212 then lifts the chips upwards, detaching them from the thin film, thus enabling the chip to be retrieved from the wafer.

[0049] Reference Figure 1 and Figure 2 The first transfer mechanism 22 includes a suction nozzle 221, a swing arm 222, and a swing drive 223. One end of the swing arm 222 is connected to the suction nozzle 221 along its length, and the other end is connected to the swing drive 223. The swing drive 223 is mounted on the mounting platform 1. The swing drive 223 is a motor. The swing drive 223 drives the swing arm 222 to swing back and forth, which allows the swing arm 222 to move back and forth between the feeding mechanism 21 and the calibration mechanism 23. Through the cooperation of the swing arm 222 and the feeding pin element 212, the suction nozzle 221 can pick up the chip lifted by the feeding pin element 212, and then, driven by the swing drive 223, the chip can be transported to the calibration mechanism 23.

[0050] Reference Figure 1 and Figure 2 The calibration mechanism 23 includes a calibration platform 231 and a calibration vision element 232. An adsorption stage 233 is mounted on the upper side of the calibration platform 231, and a rotary drive 234, which is a motor, is also mounted on the calibration platform 231. The drive shaft of the rotary drive 234 is coaxially arranged with the adsorption stage 233. The calibration vision element 232 is vertically positioned on the upper side of the adsorption stage 233, and the calibration vision element 232 is directly opposite the adsorption stage 233.

[0051] Reference Figure 1 and Figure 2 The calibration mechanism 23 also includes a calibration drive 235, which is mounted on the mounting platform 1. The calibration table 231 is mounted on the calibration drive 235, and the calibration drive 235 adopts a two-axis moving platform.

[0052] After the first transfer mechanism 22 transports the chip to the calibration stage 231, the chip is placed on the adsorption stage 233. The adsorption stage 233 fixes the chip by negative pressure adsorption. The position of the chip is detected by the calibration vision element 232, and the adsorption stage 233 is driven to rotate by the rotation drive 234 and moved in the plane by the calibration drive 235. This allows the angle of the chip to be adjusted to the required state.

[0053] Reference Figure 1 and Figure 2 The second transfer mechanism 24 includes an adsorption manipulator 241, a first-axis drive 242, and a second-axis drive 243. The first-axis drive 242 is vertically oriented, the adsorption manipulator 241 is mounted on the first-axis drive 242, and the second-axis drive 243 is horizontally oriented. The first-axis drive 242 and the second-axis drive 243 are connected, and the second-axis drive 243 is mounted on the mounting platform 1. Both the first-axis drive 242 and the second-axis drive 243 are linear modules. With the cooperation of the first-axis drive 242 and the second-axis drive 243, the chip on the adsorption stage 233 can be picked up and transferred to the eutectic stage 4, thus realizing the second transfer of the chip.

[0054] Reference Figure 3 and Figure 4 A eutectic stage 4 has a eutectic tank 44 on its upper side. A heating module 41 is also provided on the eutectic stage 4. The heating module 41 includes a heating platform 411, which is disposed within the eutectic tank 44 and connected to the bottom of the tank. The heating module 41 also includes several heating rods 412, one end of which is embedded within the heating platform 411, and the other end extends outside the eutectic stage 4. By controlling the heating rods 412, the heating effect of the heating platform 411 can be controlled, thereby controlling the temperature of the eutectic stage 4 and providing a suitable temperature for the eutectic.

[0055] Reference Figure 3 and Figure 4 The heating module 41 also includes a heating gas pipe 415. A first nitrogen gas supply component 43 is provided on the outside of the eutectic stage 4. One end of the heating gas pipe 415 is connected to the first nitrogen gas supply component 43, and the other end is connected to the heating stage 411. A heating chamber 413 is formed inside the heating stage 411. One end of the heating rod 412 is inserted into the heating chamber 413, and the heating gas pipe 415 is connected to the heating chamber 413. In this embodiment, several heating wires are provided on the inner sidewall of the heating gas pipe 415. Nitrogen gas can be introduced into the heating gas pipe 415 through the first nitrogen gas supply component 43. After being heated by the heating gas pipe 415, the nitrogen gas is sent into the heating chamber 413, which allows the nitrogen gas to fill the voids in the heating chamber 413 and makes the heating of the eutectic stage 4 more uniform.

[0056] Reference Figure 4 and Figure 5 Several vacuum adsorption holes 414 are provided through the upper side of the heating platform 411, and all of the vacuum adsorption holes 414 are connected to the heating chamber 413.

[0057] Reference Figure 3 and Figure 4 A vacuum extractor 42 is also provided on one side of the eutectic stage 4. The vacuum extractor 42 is connected to the heating stage 411 through a pipe, and the vacuum extractor 42 is also connected to the heating chamber 413 through a corresponding pipe. The vacuum extractor 42 can extract nitrogen gas from the heating chamber 413, which can create a negative pressure at the vacuum adsorption hole 414 on the heating stage 411. Therefore, when the substrate is placed on the heating stage 411, the corresponding vacuum adsorption hole 414 can hold the substrate and fix the substrate.

[0058] Reference Figure 4 and Figure 5 A plurality of vacuum adsorption holes 414 are arranged sequentially at intervals along the horizontal direction, and the inner diameter of the plurality of vacuum adsorption holes 414 decreases or increases sequentially. Due to the different sizes of finished products, the corresponding vacuum adsorption hole 414 can be selected according to the actual finished product to ensure that the vacuum adsorption hole 414 can fix the corresponding finished product.

[0059] Reference Figure 3 and Figure 4 A transparent plate 45 is disposed on the upper side of the eutectic stage 4, enclosing the heating stage 411. The transparent plate 45 and the heating stage 411 are spaced apart, thus forming a eutectic chamber 452 between the transparent plate 45 and the heating stage 411. Eutectic elongated holes 451 are formed on the transparent plate 45, and several vacuum adsorption holes 414 are located within the eutectic elongated holes 451. The presence of the eutectic elongated holes 451 ensures that the chip and substrate can be placed on the heating stage 411, thereby allowing the substrate to be adsorbed by the corresponding vacuum adsorption holes 414.

[0060] Reference Figure 4 and Figure 5 A second nitrogen supply component 46 is provided on one side of the eutectic stage 4. Several air ducts 47 are provided between the second nitrogen supply component 46 and the eutectic stage 4. One end of the air duct 47 is connected to the second nitrogen supply component 46, and the other end is connected to the eutectic stage 4. The air duct 47 is also connected to the eutectic chamber 452. Through the cooperation of the nitrogen supply component and the air ducts 47, cold nitrogen can be injected into the eutectic chamber 452. On the one hand, a nitrogen atmosphere can be formed in the eutectic chamber 452, thereby providing effective atmosphere protection for the heated area on the eutectic stage 4 and avoiding oxidation defects in the finished product during the eutectic process. On the other hand, the injection of cold nitrogen facilitates the rapid cooling of the finished product and the eutectic stage 4.

[0061] Reference Figure 3 and Figure 5 An air knife 48 is provided between the eutectic stage 4 and the second nitrogen gas supply component 46. The air knife 48 has several air holes 482 on the side facing the eutectic stage 4, spaced apart horizontally. Several gas supply pipes 481 are provided between the air knife 48 and the second nitrogen gas supply component 46, each corresponding to one of the air holes 482. One end of each gas supply pipe 481 is connected to the second nitrogen gas supply component 46, and the other end is connected to the air knife 48. Each gas supply pipe 481 is also connected to its corresponding air hole 482. All air holes 482 are positioned axially opposite the transparent plate 45. Through the cooperation of the air knife 48 and the second nitrogen gas supply component 46, cold nitrogen gas can be blown onto the surface of the transparent plate 45, thereby preventing fogging on the transparent plate 45.

[0062] Reference Figure 1 and Figure 3 A eutectic vision element 49 is also provided on the upper side of the eutectic stage 4. The eutectic vision element 49 is located vertically on the upper side of the eutectic stage 4 and is directly facing the eutectic stage 4. Through the setting of the eutectic vision element 49, visual inspection of the finished eutectic product can be performed.

[0063] Reference Figure 1 and Figure 6 The finished product unloading device 5 includes a suction robot 51 and a robot drive mechanism 52. The robot drive mechanism 52 includes a Y-axis drive 521 and a Z-axis drive 522. The driving direction of the Y-axis drive 521 is perpendicular to the spacing direction between the chip loading device 2 and the substrate loading device 3, and the driving direction of the Y-axis drive 521 is set in the horizontal direction. The Y-axis drive 521 is connected to the mounting platform 1. The driving direction of the Z-axis drive 522 is set in the vertical direction, and the Z-axis drive 522 is connected to the Y-axis drive 521. The suction robot 51 is mounted on the Z-axis drive 522. With the cooperation of the Y-axis drive 521 and the Z-axis drive 522, the suction robot 51 can move to the upper side of the eutectic stage 4, thereby suctioning the eutectic finished product and conveying it away.

[0064] Reference Figure 1 and Figure 6 The finished product unloading device 5 also includes a material tray 53 and a material tray drive mechanism 54. The material tray drive mechanism 54 adopts an X-axis drive component, the drive direction of which is set horizontally and perpendicular to the drive direction of the Y-axis drive component 521. The X-axis drive component is located below the Y-axis drive component 521. The material tray 53 is mounted on the X-axis drive component.

[0065] After the suction robot 51 picks up the finished product, the tray drive mechanism 54 drives the tray 53 to move, and the robot drive mechanism 52 drives the suction robot 51 to move. At this time, the tray 53 and the suction robot 51 are positioned to each other, which enables rapid positioning and facilitates the quick loading of the finished product into the tray 53.

[0066] In this embodiment, the X-axis drive, Y-axis drive 521 and Z-axis drive 522 are all linear modules.

[0067] The implementation principle of this application embodiment is as follows: the substrate is fed onto the eutectic stage 4 by the substrate loading device 3, and the chip is fed onto the eutectic stage 4 by the chip loading device 2. During the feeding process of the substrate and the chip, both the chip and the substrate are calibrated by the corresponding calibration mechanism 23. After both the chip and the substrate are fed onto the eutectic stage 4, the eutectic stage 4 is heated to achieve heat bonding between the chip and the substrate, thereby obtaining the finished product. After this, the finished product unloading device 5 removes the finished product from the eutectic stage 4 and places it on the material tray 53. This eutectic machine structure optimizes the connection and cooperation between various processing steps, realizing continuous, stable, and high-precision packaging operations.

[0068] The embodiments described in this specific implementation are preferred embodiments of this application and are not intended to limit the scope of protection of this application. Identical components are represented by the same reference numerals. Therefore, all equivalent changes made to the structure, shape, and principle of this application should be covered within the scope of protection of this application.

Claims

1. An integrated automated molding eutectic press, characterized in that, include: Installation platform (1); A eutectic stage (4) is used for heating and bonding the chip and the substrate. The eutectic stage (4) is disposed on the mounting platform (1). A chip loading device (2) is used for feeding the chip toward the eutectic stage (4). The chip loading device (2) is disposed on the mounting platform (1). A substrate loading device (3) is used for feeding the substrate toward the eutectic stage (4). The substrate loading device (3) is disposed on the mounting platform (1). A finished product unloading device (5) includes a suction robot (51) and a robot drive mechanism (52). The robot drive mechanism (52) is disposed on the mounting platform (1). The suction robot (51) is disposed on the robot drive mechanism (52). The suction robot (51) is used to pick up the finished product on the eutectic stage (4). The robot drive mechanism (52) is used to drive the suction robot (51) to move closer to or away from the eutectic stage (4). A heating module (41) is provided on the eutectic stage (4). The heating module (41) includes a heating platform (411). The heating platform (411) is provided on the eutectic stage (4), and a plurality of heating rods (412) are embedded in the heating platform (411). The heating platform (411) has a heating chamber (413) inside, and an air extraction device (42) is provided on one side of the heating platform (411), which is connected to the heating chamber (413); the heating platform (411) has a vacuum adsorption hole (414), which is connected to the heating chamber (413); The eutectic stage (4) is also provided with a first nitrogen gas supply component (43). A heating pipe (415) for heating nitrogen is provided between the first nitrogen gas supply component (43) and the heating stage (411). One end of the heating pipe (415) is connected to the first nitrogen gas supply component (43), and the other end is connected to the heating stage (411). The heating pipe (415) is also connected to the heating chamber (413).

2. The integrated automated molding eutectic press according to claim 1, characterized in that, The finished product unloading device (5) further includes a tray (53) and a tray driving mechanism (54). The tray driving mechanism (54) is disposed on the mounting platform (1), and the tray (53) is disposed on the tray driving mechanism (54). The tray (53) is spaced apart from the eutectic stage (4). The tray driving mechanism (54) is used to drive the tray (53) to move toward or away from the suction robot (51), and the robot driving mechanism (52) is used to drive the suction robot (51) to move between the eutectic stage (4) and the tray (53).

3. The integrated automated molding eutectic press according to claim 1, characterized in that, The vacuum adsorption holes (414) are provided in a plurality of manner, and each of the plurality of vacuum adsorption holes (414) is connected to the air extraction component (42); the plurality of vacuum adsorption holes (414) are spaced apart, and the inner diameters of the plurality of vacuum adsorption holes (414) are all different.

4. The integrated automated plastic encapsulation eutectic machine according to claim 1, characterized in that, The eutectic stage (4) has a eutectic groove (44) on its upper side, and a transparent plate (45) is provided on the eutectic stage (4), which closes the eutectic groove (44); the heating stage (411) is located in the eutectic groove (44), and the transparent plate (45) has a eutectic elongated hole (451) for accommodating the chip and the substrate.

5. The integrated automated molding eutectic machine according to claim 4, characterized in that, The transparent plate (45) is spaced apart from the heating stage (411), and a eutectic chamber (452) is formed between the transparent plate (45) and the heating stage (411); a second nitrogen gas supply component (46) is provided on one side of the eutectic stage (4), and a duct (47) is provided between the second nitrogen gas supply component (46) and the eutectic stage (4). One end of the duct (47) is connected to the second nitrogen gas supply component (46), and the other end is connected to the eutectic stage (4). The duct (47) is also connected to the eutectic chamber (452).

6. The integrated automated molding eutectic press according to claim 5, characterized in that, A wind knife (48) is provided on one side of the eutectic stage (4). The wind knife (48) has several air holes (482) on the side facing the eutectic stage (4). The air holes (482) are positioned facing the transparent plate (45). The wind knife (48) is connected to the second nitrogen gas supply component (46), and the several air holes (482) are all connected to the second nitrogen gas supply component (46).

7. The integrated automated plastic encapsulation eutectic machine according to claim 1, characterized in that, The eutectic stage (4) is provided with a eutectic vision element (49), which is arranged vertically on the upper side of the eutectic stage (4) and is directly opposite to the eutectic stage (4) in the vertical direction.

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