Polishing device and polishing method for optical quartz wafer production

Abstract

The invention relates to the field of quartz wafer grinding and polishing equipment, and discloses a grinding device and method for optical quartz wafer production. The grinding device comprises a base, a support is fixedly installed on the base, an upper grinding disc is installed on the support in a sliding mode, the upper grinding disc is driven by a first driving source to ascend and descend, and an inner gear ring is rotatably installed in the base; the part, higher than the wandering star wheel, of the optical quartz wafer is pushed through the sliding block, so that the optical quartz wafer abuts against the inner wall of the fixing hole, and at the moment, the friction force between the sliding block and the optical quartz wafer and the friction force between the optical quartz wafer and the inner wall of the fixing hole can enable the rotating drum to drive the optical quartz wafer and the wandering star wheel to ascend and descend synchronously; in this way, the parts, higher than the wandering star wheel, of the fixing holes are ingeniously utilized, simultaneous discharging of the wandering star wheel and the optical quartz wafers is achieved, batch discharging of the optical quartz wafers is achieved, the time for taking the optical quartz wafers is shortened, meanwhile, manual feeding between the lower grinding disc and the upper grinding disc is not needed, and the feeding safety is improved.

Description

Technical Field

[0001] The invention relates to the field of quartz wafer grinding and polishing equipment, and in particular to a grinding device and a grinding method for producing optical quartz wafers. Background Art

[0002] Optical quartz wafer is a transparent glass made of natural quartz mineral. It has high dielectric and leakage resistance and is widely used in the manufacture of electronic and optical components. Its production process includes multiple steps such as raw material preparation, melt molding, cutting, grinding and polishing. The importance of the polishing step lies in that it directly determines the surface quality of the lens.

[0003] In the existing optical quartz wafer grinding process, in order to improve the efficiency and effect of grinding, a double-sided grinder is generally used for operation. The basic process of this process includes installing the planetary wheel on the lower grinding disc, and then accurately placing the optical quartz wafer to be polished in the fixed hole of the planetary wheel. According to the specific process requirements, the operator will set the appropriate grinding speed, pressure and grinding time and other key parameters. Once all the settings are completed, the double-sided grinder will start. At this time, the upper grinding disc and the lower grinding disc will rotate in opposite directions, and the planetary wheel will simultaneously revolve and rotate to form a planetary motion. During the entire grinding process, the grinding fluid will be continuously injected to ensure the smooth progress of the grinding.

[0004] However, there is no interference fit between the optical quartz wafer and the fixing hole of the planetary wheel, but a certain gap. In addition, for the sake of grinding effect, when the workpiece is placed in the fixing hole, it will be slightly higher than the planetary wheel. As a result, when taking out the polished optical quartz wafer, it is usually necessary to take out the planetary wheel from the lower grinding disk first. At this time, the workpiece will fall on the lower grinding disk, and then the optical quartz wafer is taken out of the lower grinding disk, which requires the operator to manually remove them one by one. In addition, the thin nature of the optical quartz wafer results in a small contact area between the operator's fingers and the edge of the optical quartz wafer, which makes the manual material removal process very inconvenient. Based on this, the present invention purposely provides a grinding device and a grinding method for optical quartz wafer production that can facilitate the removal of polished optical quartz wafers and has high material removal efficiency. Summary of the invention

[0005] The purpose of the present invention is to provide a polishing device and a polishing method for optical quartz wafer production in view of the shortcomings of the prior art, so as to solve the technical problems in the prior art.

[0006] The purpose of the present invention can be achieved through the following technical solutions:

[0007] A polishing device for producing optical quartz wafers, comprising:

[0008] A base, on which a bracket is fixedly installed, an upper grinding disc is slidably installed on the bracket, and the upper grinding disc is driven to rise and fall by a first driving source. An inner gear ring is rotatably installed in the base, and the inner gear ring is driven to rotate by a first output source, and a lower grinding disc is sleeved on its outer circumferential surface, and the two are fixedly connected. The outer circumferential surface of the lower grinding disc is sleeved on an outer gear ring, and the two are rotatably connected, and the outer gear ring is fixedly connected to the base;

[0009] A grinding liquid injection assembly is disposed on the upper grinding disc and is used to inject the grinding liquid between the upper grinding disc and the lower grinding disc;

[0010] A planetary wheel, wherein a plurality of planetary wheels are placed on the lower grinding disc, the planetary wheel meshes with the outer gear ring, and the planetary wheel meshes with the inner gear ring, and the planetary wheel is provided with three circumferentially arranged fixing holes, and an optical quartz wafer is placed in each fixing hole;

[0011] The cam is provided with a first end which is fixedly provided with a first disk, and the first disk is fixedly connected with the first disk, and a slider is slidably installed in each slider. The slider is driven by a driving assembly arranged on the rotating drum and moves along the radial direction of the first disk. The distance between the axis of the rotating rod and the axis of the rotating drum plus the distance between the axis of the planetary wheel and the axis of the lower grinding disk is equal to the distance between the axis of the rotating rod and the axis of the lower grinding disk. When the axis of the rotating drum and the axis of the planetary wheel coincide, the second driving source drives the cross plate to descend, so that the first disk is located between the three optical quartz wafers. At this time, the driving assembly drives the three sliders to expand outward, and the sliders push the optical quartz wafer to abut against the inner wall of the fixing hole.

[0012] As a further solution of the present invention: a center hole is provided on the planetary wheel, the axis of the center hole coincides with the axis of the planetary wheel, a plug rod is fixedly installed on the bottom of the rotating drum, the radius of the plug rod is smaller than the radius of the center hole, and three circumferentially arranged grooves are provided on the outer circular surface of the plug rod, and an eccentric wheel is rotatably installed in each groove, and the eccentric wheel is driven to rotate by a synchronous component arranged in the plug rod. When the axis of the rotating drum and the axis of the planetary wheel coincide, the cross plate descends to insert the plug rod into the center hole, and at this time the synchronous component drives the eccentric wheel to rotate so that the eccentric wheel abuts against the inner wall of the center hole.

[0013] As a further solution of the present invention: a feeding platform and a loading platform are provided on the base, when the rotating drum drives the planetary wheel to move to the feeding platform, the driving component drives the three sliders to retract, and the optical quartz wafer falls from the fixed hole to the feeding platform, and then the rotating drum drives the planetary wheel to move to the loading platform, at which time the planetary wheel is loaded and the three sliders are driven to expand outward by the driving component.

[0014] As a further solution of the present invention: the number of the transverse plates is two, and the two transverse plates are symmetrically arranged on the rotating rod.

[0015] As a further solution of the present invention: the driving assembly includes a straight groove, a second disc, an inclined groove and a round rod, each slide groove is provided with a straight groove, the second disc is sleeved on the rotating drum, and the two are rotatably connected, the second disc is driven to rotate by a third output source, three inclined grooves are circumferentially arranged on the second disc, and each inclined groove corresponds to a straight groove, the inclined grooves are arranged obliquely, and there is an angle between the inclined grooves and the straight grooves, and a round rod is fixedly installed on each slider, the round rod is slidably installed in the straight groove, and it is slidably connected to the inclined groove.

[0016] As a further solution of the present invention: the synchronization component includes a driven gear, a driving gear and a transmission rod, and a driven gear is coaxially fixedly installed on the rotating shaft of each eccentric wheel. The driving gear is rotatably installed in the insertion rod, and the transmission rod is rotatably installed in the rotating drum. It is coaxially fixedly connected with the driving gear and is driven to rotate by a fourth output source. The three driven gears are all meshed with the driving gear.

[0017] As a further solution of the present invention: one end of the sliding block abutting against the optical quartz wafer is sleeved with a rubber elastic sleeve, and each of the eccentric wheels is sleeved with a rubber elastic sleeve.

[0018] A method for polishing an optical quartz wafer for production, the method being applied to the above-mentioned polishing device for producing an optical quartz wafer, the method comprising the following steps:

[0019] Step S1: First, multiple planetary wheels are placed in the lower grinding disc in sequence, and the planetary wheels are ensured to be meshed with the outer gear ring and the inner gear ring, and then an optical quartz wafer is placed in the fixing hole of each planetary wheel;

[0020] Step S2: driving the upper grinding disc to descend by the first driving source, then starting the upper grinding disc and driving the inner gear ring to rotate by the first output source, at this time, each planetary wheel performs planetary motion between the lower grinding disc and the upper grinding disc, and the upper grinding disc and the lower grinding disc grind the upper and lower surfaces of the optical quartz wafer at the same time, and the grinding liquid injection assembly delivers the grinding liquid between the upper grinding disc and the lower grinding disc;

[0021] Step S3: After the first driving source drives the upper grinding disc to rise, the second output source drives the rotating rod to rotate and the first output source drives the inner gear ring to rotate, so that the axis of the rotating drum coincides with the axis of the planetary wheel;

[0022] Step S4: the second driving source drives the horizontal plate to descend, so that the first disk is located between the three optical quartz wafers. At this time, the driving assembly drives the three sliders to expand outward, and the sliders push the optical quartz wafers to abut against the inner wall of the fixing hole;

[0023] Step S5: The second driving source drives the horizontal plate to rise. At this time, the friction between the slider and the optical quartz wafer, and the friction between the optical quartz wafer and the fixing hole, will cause the rotating drum to rise and drive the planetary wheel and the optical quartz wafer to rise synchronously, thereby completing the unloading.

[0024] Step S6: Repeat steps S3 to S5 to complete all the material cutting work.

[0025] Beneficial effects of the present invention:

[0026] 1. In the present invention, when the optical quartz wafer is polished, the inner gear ring is rotated while the rotating rod is rotated, so that the axis of the rotating drum and the axis of the planetary wheel coincide with each other, and then the horizontal plate drives the rotating drum and the first disc to descend, so that the first disc is located between the three optical quartz wafers, and then the three sliders expand outward, and the sliders push the optical quartz wafer higher than the planetary wheel, so that the optical quartz wafer abuts against the inner wall of the fixing hole. At this time, the friction between the slider and the optical quartz wafer and the friction between the optical quartz wafer and the inner wall of the fixing hole can make the rotating drum drive the optical quartz wafer and the planetary wheel to rise and fall synchronously, so as to cleverly utilize the part of the fixing hole higher than the planetary wheel, not only to realize the simultaneous unloading of the planetary wheel and the optical quartz wafer, but also to realize the batch unloading of the optical quartz wafer, which greatly reduces the time for taking the optical quartz wafer, and at the same time, the optical quartz wafer and the planetary wheel can be directly loaded by the rotating drum, without the need to manually place the optical quartz wafers one by one in the fixing hole between the lower grinding disc and the upper grinding disc, thereby improving the safety of loading;

[0027] 2. In the present invention, the insertion rod is inserted into the center hole, and then the eccentric wheel is driven to rotate by the synchronization component, and the three eccentric wheels will abut against the inner wall of the center hole. At this time, the friction between the three eccentric wheels and the inner wall of the center hole can strengthen the connection between the insertion rod and the planetary wheel, and the automatic positioning effect can be achieved in the process of the eccentric wheels abutting against the inner wall of the center hole. The abutment of the three eccentric wheels against the inner wall of the center hole means that the axis of the insertion rod will coincide with the axis of the center hole, which means that as long as the insertion rod can be inserted into the center hole, the axis of the drum and the axis of the planetary wheel can coincide;

[0028] 3. In the present invention, by setting up two horizontal plates, it is possible to place a planetary wheel carrying an optical quartz wafer on the lower grinding disc while placing the optical quartz wafer into the fixing hole on another planetary wheel. Such synchronous work can carry out continuous unloading and loading, thereby shortening the interval between two grinding operations. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] The present invention will be further described below in conjunction with the accompanying drawings.

[0030] Figure 1It is a schematic diagram of the overall structure of the present invention;

[0031] Figure 2 It is a schematic structural diagram of the lowering of the upper grinding disc in the present invention;

[0032] Figure 3 It is a structural schematic diagram of the rotary drum in the present invention;

[0033] Figure 4 The present invention Figure 3 Schematic diagram of structural decomposition;

[0034] Figure 5 It is a structural schematic diagram of a cross-section of the rotary drum in the present invention;

[0035] Figure 6 It is a schematic diagram of the structure of the slider abutting against the optical quartz wafer in the present invention;

[0036] Figure 7 It is a schematic diagram of the structure in which the eccentric wheel abuts against the inner wall of the center hole in the present invention;

[0037] Figure 8 It is a structural schematic diagram of the present invention in which the midstream star wheel is located on the unloading platform;

[0038] Fig. 9 It is a structural schematic diagram of the present invention in which the upstream star wheel is located on the loading platform.

[0039] In the figure: 1, base; 101, bracket; 2, outer gear ring; 3, lower grinding disc; 4, inner gear ring; 5, upper grinding disc; 6, planetary wheel; 7, fixing hole; 8, center hole; 9, optical quartz wafer; 10, rotating rod; 11, cross plate; 12, rotating drum; 13, plug rod; 14, groove; 15, eccentric wheel; 16, driven gear; 17, driving gear; 18, transmission rod; 19, first disc; 20, slide groove; 21, slider; 22, straight groove; 23, second disc; 24, inclined groove; 25, round rod; 26, unloading platform; 27, loading platform; 28, grinding liquid injection assembly. DETAILED DESCRIPTION

[0040] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0041] See also Figure 1-Figure 9 As shown, the present invention is a polishing device for producing optical quartz wafers, comprising:

[0042] A base 1, on which a bracket 101 is fixedly installed, an upper grinding disc 5 is slidably installed on the bracket 101, and the upper grinding disc 5 is driven to rise and fall by a first driving source, an inner gear ring 4 is rotatably installed in the base 1, and the inner gear ring 4 is driven to rotate by a first output source, and a lower grinding disc 3 is sleeved on its outer circumferential surface, and the two are fixedly connected, and an outer gear ring 2 is sleeved on the outer circumferential surface of the lower grinding disc 3, and the two are rotatably connected, and the outer gear ring 2 is fixedly connected to the base 1;

[0043] A grinding liquid injection assembly 28, which is disposed on the upper grinding disc 5 and is used to inject the grinding liquid between the upper grinding disc 5 and the lower grinding disc 3;

[0044] A planetary wheel 6, wherein a plurality of planetary wheels 6 are placed on the lower grinding disc 3, wherein the planetary wheel 6 is meshed with the outer gear ring 2 and the inner gear ring 4, and wherein three circumferentially arranged fixing holes 7 are provided on the planetary wheel 6, wherein an optical quartz wafer 9 is placed in each fixing hole 7;

[0045] The rotating rod 10 is rotatably mounted on the base 1 and driven to rotate by the second output source. A horizontal plate 11 is slidably mounted on the rotating rod 10. The horizontal plate 11 is driven to rise and fall by the second driving source. A rotating drum 12 is rotatably mounted on one end of the rotating rod 10. A first disc 19 is sleeved on the rotating drum 12. The first disc 19 is fixedly connected to the rotating drum 12. Three circumferentially arranged slide grooves 20 are opened on the first disc 19. A slider 21 is slidably mounted in each slide groove 20. The slider 21 is arranged on the rotating drum 12. The driving component drives and moves along the radial direction of the first disc 19, the distance between the axis of the rotating rod 10 and the axis of the rotating drum 12 plus the distance between the axis of the planetary wheel 6 and the axis of the lower grinding disk 3 is equal to the distance between the axis of the rotating rod 10 and the axis of the lower grinding disk 3. When the axis of the rotating drum 12 coincides with the axis of the planetary wheel 6, the second driving source drives the cross plate 11 to descend, so that the first disc 19 is located between the three optical quartz chips 9. At this time, the driving component drives the three sliders 21 to expand outward, and the sliders 21 push the optical quartz chip 9 to abut against the inner wall of the fixing hole 7.

[0046] In one case of the present embodiment, the upper grinding disc 5 includes an upper grinding disc, a driving device, a sensor and a control system, etc. The first output source and the second output source can both be selected from servo motors, servo motors and other components, and other mechanisms capable of realizing rotational motion can also be selected. The first driving source and the second driving source can both be selected from electric cylinders, electric telescopic rods and other components, and other mechanisms capable of realizing lifting and lowering motion can also be selected. This embodiment does not make specific limitations here.

[0047] The working principle of the present invention is as follows: first, multiple planetary wheels 6 are placed in the lower grinding disc 3 in sequence, and it is ensured that the planetary wheels 6 are meshed with the outer gear ring 2 and the planetary wheels 6 are meshed with the inner gear ring 4, then an optical quartz wafer 9 is placed in the fixing hole 7 on each planetary wheel 6, the upper grinding disc 5 is driven down by the first driving source, then the upper grinding disc 5 is started and the inner gear ring 4 is driven to rotate by the first output source, at this time, each planetary wheel 6 performs planetary motion between the lower grinding disc 3 and the upper grinding disc 5, the upper grinding disc 5 and the lower grinding disc 3 grind the upper and lower surfaces of the optical quartz wafer 9 at the same time, and the grinding liquid injection assembly 28 transports the grinding liquid between the upper grinding disc 5 and the lower grinding disc 3, after the grinding is completed, the first driving source drives the upper grinding disc 5 to rise, the second output source drives the rotating rod 10 to rotate and the first output source drives the inner gear ring 4 to rotate, so that the axis of the rotating drum 12 coincides with the axis of the planetary wheel 6, then the second driving source drives the cross plate 11 to descend, so that the first disc 19 is located between the three optical quartz wafers 9. At this time, the driving component drives the three sliders 21 to expand outward. The slider 21 pushes the part of the optical quartz wafer 9 that is higher than the planetary wheel 6, so that the optical quartz wafer 9 abuts against the inner wall of the fixing hole 7. At this time, the friction between the slider 21 and the optical quartz wafer 9 and the friction between the optical quartz wafer 9 and the inner wall of the fixing hole 7 can enable the rotating drum 12 to drive the optical quartz wafer 9 and the planetary wheel 6 to rise and fall synchronously. In this way, the part of the fixing hole 7 that is higher than the planetary wheel 6 is cleverly utilized, which not only realizes the simultaneous unloading of the planetary wheel 6 and the optical quartz wafer 9, but also realizes the batch unloading of the optical quartz wafer 9, which greatly reduces the time for taking the optical quartz wafer 9. At the same time, the optical quartz wafer 9 and the planetary wheel 6 can be directly loaded by the rotating drum 12, without the need to manually place the optical quartz wafer 9 one by one in the fixing hole 7 between the lower grinding disc 3 and the upper grinding disc 5, thereby improving the safety of loading.

[0048] like Figure 1-Figure 7 As shown, as a preferred embodiment of the present invention, a center hole 8 is provided on the planetary wheel 6, and the axis of the center hole 8 coincides with the axis of the planetary wheel 6. A plug rod 13 is fixedly installed on the bottom of the rotating drum 12. The radius of the plug rod 13 is smaller than the radius of the center hole 8. The outer circular surface of the plug rod 13 is provided with three circumferentially arranged grooves 14, and an eccentric wheel 15 is rotatably installed in each groove 14. The eccentric wheel 15 is driven to rotate by a synchronous component arranged in the plug rod 13. When the axis of the rotating drum 12 coincides with the axis of the planetary wheel 6, the cross plate 11 descends to insert the plug rod 13 into the center hole 8. At this time, the synchronous component drives the eccentric wheel 15 to rotate so that the eccentric wheel 15 abuts against the inner wall of the center hole 8.

[0049] In actual application of this embodiment, the rod 13 is inserted into the center hole 8, and then the eccentric wheel 15 is driven to rotate through the synchronization component. The three eccentric wheels 15 will abut against the inner wall of the center hole 8. At this time, the friction between the three eccentric wheels 15 and the inner wall of the center hole 8 can strengthen the connection between the rod 13 and the planetary wheel 6, and the eccentric wheel 15 can also achieve automatic positioning in the process of abutting against the inner wall of the center hole 8. The abutment of the three eccentric wheels 15 against the inner wall of the center hole 8 means that the axis of the rod 13 will coincide with the axis of the center hole 8, which means that as long as the rod 13 can be inserted into the center hole 8, the axis of the rotating drum 12 can coincide with the axis of the planetary wheel 6.

[0050] like Figure 1-Figure 9 As shown, as a preferred embodiment of the present invention, a feeding platform 26 and a loading platform 27 are provided on the base 1. When the rotating drum 12 drives the planetary wheel 6 to move to the feeding platform 26, the driving component drives the three sliders 21 to retract. At this time, the optical quartz wafer 9 falls from the fixing hole 7 to the feeding platform 26. Then the rotating drum 12 drives the planetary wheel 6 to move to the loading platform 27. At this time, the planetary wheel 6 is loaded and the three sliders 21 are driven to expand outward by the driving component.

[0051] In practical application, if Figure 8 As shown in the example, when one rotating drum 12 drives the planetary wheel 6 to move onto the unloading platform 26, the driving assembly drives the three sliders 21 to retract, and the optical quartz wafer 9 falls from the fixing hole 7 onto the unloading platform 26, thereby directly completing the unloading of all the optical quartz wafers 9 on the planetary wheel 6. Then, when the rotating rod 10 continues to rotate, one rotating drum 12 moves onto the loading platform 27, and the other rotating drum 12 moves onto the lower grinding disc 3, as shown in FIG. Fig. 9 Taking the example shown, at this time, the horizontal plate 11 on the loading platform 27 can be controlled to descend, so that the planetary wheel 6 can abut against the loading platform 27, and then the optical quartz wafer 9 to be polished can be loaded into the fixing hole 7, and then the driving component drives the three sliders 21 to expand outward, so that the planetary wheel 6 with the optical quartz wafer 9 to be polished can be rotated from the loading platform 27 to the lower grinding disc 3 through the rotation of the rotating rod 10, thereby dividing the unloading platform 26 and the loading platform 27. On the one hand, the unloading and loading areas can be separated, and automatic unloading is faster. On the other hand, the loading platform 27 is far away from the grinding area, avoiding manual loading operations directly between the lower grinding disc 3 and the upper grinding disc 5, thereby improving safety.

[0052] like Figure 1-Figure 9 As shown, as a preferred embodiment of the present invention, the number of the transverse plates 11 is two, and the two transverse plates 11 are symmetrically arranged on the rotating rod 10.

[0053] In actual application of this embodiment, when one rotating drum 12 takes material from the planetary wheel 6 on the lower grinding disc 3, the other rotating drum 12 is located on the loading platform 27 and can load the other planetary wheel 6. Then, the two planetary wheels 6 can be exchanged by rotating the rotating rod 10, thereby realizing synchronous loading and unloading.

[0054] like Figure 1-Figure 4 As shown, as a preferred embodiment of the present invention, the driving assembly includes a straight groove 22, a second disc 23, an inclined groove 24 and a round rod 25, each slide groove 20 is provided with a straight groove 22, the second disc 23 is sleeved on the rotating drum 12, and the two are rotatably connected, the second disc 23 is driven to rotate by a third output source, three inclined grooves 24 are circumferentially arranged on the second disc 23, and each inclined groove 24 corresponds to a straight groove 22, the inclined grooves 24 are arranged obliquely, and there is an angle between the inclined grooves 24 and the straight grooves 22, and each slider 21 is fixedly installed with a round rod 25, the round rod 25 is slidably installed in the straight groove 22, and it is slidably connected to the inclined groove 24.

[0055] In one case of this embodiment, the third output source may be a servo motor, a motor-driven gear set or other components, or other mechanisms capable of achieving rotational motion, which is not specifically limited in this embodiment.

[0056] In actual application of this embodiment, the second disc 23 is driven to rotate by the third output source, which will drive the inclined groove 24 to change its position, so that the round rod 25 slides in the inclined groove 24, and the straight groove 22 guides the sliding direction of the straight groove 22, and determines that the round rod 25 will drive the slider 21 to move along the radial direction of the first disc 19, so that the three sliders 21 can be expanded and retracted.

[0057] like Figure 1-Figure 5 As shown, as a preferred embodiment of the present invention, the synchronization assembly includes a driven gear 16, a driving gear 17 and a transmission rod 18. A driven gear 16 is coaxially fixedly installed on the rotating shaft of each eccentric wheel 15. The driving gear 17 is rotatably installed in the insertion rod 13. The transmission rod 18 is rotatably installed in the rotating drum 12. It is coaxially fixedly connected with the driving gear 17 and is driven to rotate by the fourth output source. The three driven gears 16 are all meshed with the driving gear 17.

[0058] In one case of this embodiment, the fourth output source may be a servo motor, a servo motor or other components, or other mechanisms capable of achieving rotational motion, which is not specifically limited in this embodiment.

[0059] When this embodiment is actually used, the fourth output source drives the transmission rod 18 to rotate, thereby driving the driving gear 17 to rotate, and the driving gear 17 is meshed with the driven gear 16, so the driving gear 17 will drive the three driven gears 16 to rotate synchronously, and then the driven gear 16 drives the three eccentric wheels 15 to rotate synchronously. When the eccentric wheel 15 rotates to abut against the inner wall of the center hole 8, when the insertion rod 13 is inserted into the center hole 8, if the axis of the insertion rod 13 and the center hole 8 are offset, by synchronously controlling the rotation of the three eccentric wheels 15, the planetary wheel 6 can be moved a smaller distance to achieve the purpose of coinciding the axis of the insertion rod 13 and the center hole 8, thereby avoiding the problem that the planetary wheel 6 moves too much, causing excessive friction between the optical quartz wafer 9 and the lower grinding disc 3, and causing scratches on the optical quartz wafer 9.

[0060] like Figure 1-Figure 9 As shown, as a preferred embodiment of the present invention, a rubber elastic sleeve is sleeved on one end of the slider 21 that abuts against the optical quartz wafer 9, and a rubber elastic sleeve is sleeved on each of the eccentric wheels 15.

[0061] In actual application of this embodiment, the rubber has good elasticity and a high friction coefficient. The softness of the rubber enables it to better fill the gap and increase the actual contact area. Even if the pressure is the same, the increase in the effective friction area will increase the overall friction force, thereby increasing the friction between the slider 21 and the optical quartz wafer 9 and the friction between the eccentric wheel 15 and the center hole 8, thereby improving the reliability of the optical quartz wafer 9 and the planetary wheel 6 being driven to move by the rotating drum 12 through the friction force.

[0062] See also Figure 1-Figure 9 As shown, the present invention is a polishing method for producing optical quartz wafers, the method is applied to a polishing device for producing optical quartz wafers as described in the above embodiment, and the method comprises the following steps:

[0063] Step S1: First, multiple planetary wheels 6 are placed in the lower grinding disc 3 in sequence, and the planetary wheels 6 are ensured to be meshed with the outer gear ring 2 and the planetary wheels 6 are meshed with the inner gear ring 4, and then an optical quartz wafer 9 is placed in the fixing hole 7 on each planetary wheel 6;

[0064] Step S2: driving the upper grinding disc 5 to descend by the first driving source, then starting the upper grinding disc 5 and driving the inner gear ring 4 to rotate by the first output source, at which time each planetary wheel 6 performs planetary motion between the lower grinding disc 3 and the upper grinding disc 5, and the upper grinding disc 5 and the lower grinding disc 3 grind the upper and lower surfaces of the optical quartz wafer 9 at the same time, and at the same time, the grinding liquid injection assembly 28 delivers the grinding liquid between the upper grinding disc 5 and the lower grinding disc 3;

[0065] Step S3: After the first driving source drives the upper grinding disc 5 to rise, the second output source drives the rotating rod 10 to rotate and the first output source drives the inner gear ring 4 to rotate, so that the axis of the rotating drum 12 coincides with the axis of the planetary wheel 6;

[0066] Step S4: the second driving source drives the horizontal plate 11 to descend, so that the first disk 19 is located between the three optical quartz wafers 9. At this time, the driving assembly drives the three sliders 21 to expand outward, and the sliders 21 push the optical quartz wafers 9 to abut against the inner wall of the fixing hole 7;

[0067] Step S5: The second driving source drives the horizontal plate 11 to rise. At this time, the friction between the slider 21 and the optical quartz wafer 9, and the friction between the optical quartz wafer 9 and the fixing hole 7, will cause the rotating drum 12 to rise and drive the planetary wheel 6 and the optical quartz wafer 9 to rise synchronously, thereby completing the unloading;

[0068] Step S6: Repeat steps S3 to S5 to complete all the material cutting work.

[0069] The above is a detailed description of an embodiment of the present invention, but the content is only a preferred embodiment of the present invention and cannot be considered to limit the scope of implementation of the present invention. All equivalent changes and improvements made within the scope of the present invention should still fall within the scope of the patent coverage of the present invention.

Claims

1. A polishing device for producing optical quartz wafers, characterized in that: include: A base (1) is fixedly mounted with a bracket (101), an upper grinding disc (5) is slidably mounted on the bracket (101), the upper grinding disc (5) is driven by a first driving source to be raised and lowered, an inner gear ring (4) is rotatably mounted in the base (1), the inner gear ring (4) is driven by a first output source to rotate, and a lower grinding disc (3) is sleeved on its outer circumferential surface, and the two are fixedly connected, an outer gear ring (2) is sleeved on the outer circumferential surface of the lower grinding disc (3), and the two are rotatably connected, and the outer gear ring (2) is fixedly connected to the base (1); A grinding liquid injection assembly (28), which is arranged on the upper grinding disc (5) and is used to inject the grinding liquid between the upper grinding disc (5) and the lower grinding disc (3); A planetary wheel (6), wherein a plurality of planetary wheels (6) are placed on the lower grinding disc (3), wherein the planetary wheel (6) is meshed with the outer gear ring (2) and the inner gear ring (4), and wherein three circumferentially arranged fixing holes (7) are provided on the planetary wheel (6), and an optical quartz wafer (9) is placed in each fixing hole (7); A rotating rod (10) is rotatably mounted on a base (1) and driven to rotate by a second output source. A transverse plate (11) is slidably mounted on the rotating rod (10). The transverse plate (11) is driven to rise and fall by a second driving source. A rotating drum (12) is rotatably mounted on one end of the rotating rod. A first disc (19) is sleeved on the rotating drum (12). The first disc (19) is fixedly connected to the rotating drum (12). Three circumferentially arranged sliding grooves (20) are provided on the first disc (19). A sliding block (21) is slidably mounted in each sliding groove (20). The sliding block (21) is arranged on the rotating drum (12). The driving assembly drives and moves along the radial direction of the first disc (19), and the distance between the axis of the rotating rod (10) and the axis of the rotating drum (12) plus the distance between the axis of the planetary wheel (6) and the axis of the lower grinding disc (3) is equal to the distance between the axis of the rotating rod (10) and the axis of the lower grinding disc (3). When the axis of the rotating drum (12) and the axis of the planetary wheel (6) coincide, the second driving source drives the cross plate (11) to descend, so that the first disc (19) is located between the three optical quartz wafers (9). At this time, the driving assembly drives the three sliders (21) to expand outward, and the sliders (21) push the optical quartz wafer (9) to abut against the inner wall of the fixing hole (7).

2. The polishing device for producing optical quartz wafers according to claim 1, characterized in that: The planetary wheel (6) is provided with a center hole (8), the axis of the center hole (8) coincides with the axis of the planetary wheel (6), a plug rod (13) is fixedly installed at the bottom of the rotating drum (12), the radius of the plug rod (13) is smaller than the radius of the center hole (8), the outer circumferential surface of the plug rod (13) is provided with three circumferentially arranged grooves (14), each groove (14) is rotatably installed with an eccentric wheel (15), the eccentric wheel (15) is driven to rotate by a synchronous component arranged in the plug rod (13), when the axis of the rotating drum (12) coincides with the axis of the planetary wheel (6), the cross plate (11) descends to allow the plug rod (13) to be inserted into the center hole (8), at which time the synchronous component drives the eccentric wheel (15) to rotate so that the eccentric wheel (15) abuts against the inner wall of the center hole (8).

3. The polishing device for producing optical quartz wafers according to claim 2, characterized in that: The base (1) is provided with a material unloading platform (26) and a material loading platform (27). When the rotating drum (12) drives the planetary wheel (6) to move onto the material unloading platform (26), the driving component drives the three sliders (21) to retract. At this time, the optical quartz wafer (9) falls from the fixing hole (7) onto the material unloading platform (26). Subsequently, the rotating drum (12) drives the planetary wheel (6) to move onto the material loading platform (27). At this time, the planetary wheel (6) is loaded and the three sliders (21) are driven outward by the driving component.

4. The polishing device for producing optical quartz wafers according to claim 3, characterized in that: The number of the transverse plates (11) is two, and the two transverse plates (11) are symmetrically arranged on the rotating rod (10).

5. The polishing device for producing optical quartz wafers according to claim 1, characterized in that: The driving assembly comprises a straight groove (22), a second disc (23), an inclined groove (24) and a round rod (25); each slide groove (20) is provided with a straight groove (22); the second disc (23) is sleeved on the rotating drum (12), and the two are rotatably connected; the second disc (23) is driven to rotate by a third output source; three inclined grooves (24) are circumferentially arranged on the second disc (23), and each inclined groove (24) corresponds to a straight groove (22); the inclined grooves (24) are arranged obliquely, and an angle exists between the inclined grooves (24) and the straight grooves (22); each slider (21) is fixedly provided with a round rod (25); the round rod (25) is slidably installed in the straight groove (22), and is slidably connected to the inclined groove (24).

6. The polishing device for producing optical quartz wafers according to claim 2, characterized in that: The synchronization assembly comprises a driven gear (16), a driving gear (17) and a transmission rod (18); a driven gear (16) is coaxially fixedly mounted on the rotating shaft of each eccentric wheel (15); the driving gear (17) is rotatably mounted in the insertion rod (13); the transmission rod (18) is rotatably mounted in the rotating drum (12); it is coaxially fixedly connected with the driving gear (17), and is driven to rotate by a fourth output source; the three driven gears (16) are all meshed with the driving gear (17).

7. The polishing device for producing optical quartz wafers according to claim 2, characterized in that: One end of the slider (21) that abuts against the optical quartz wafer (9) is sleeved with a rubber elastic sleeve, and each of the eccentric wheels (15) is sleeved with a rubber elastic sleeve.

8. A polishing method for producing optical quartz wafers, characterized in that: The method is applied to a polishing device for producing optical quartz wafers as described in any one of claims 1 to 7, and the method comprises the following steps: Step S1: First, multiple planetary wheels (6) are placed in the lower grinding disc (3) in sequence, and the planetary wheels (6) are ensured to be meshed with the outer gear ring (2) and the planetary wheels (6) are meshed with the inner gear ring (4), and then an optical quartz wafer (9) is placed in the fixing hole (7) on each planetary wheel (6); Step S2: the upper grinding disc (5) is driven to descend by the first driving source, and then the upper grinding disc (5) is started and the inner gear ring (4) is driven to rotate by the first output source. At this time, each planetary wheel (6) performs planetary motion between the lower grinding disc (3) and the upper grinding disc (5). The upper grinding disc (5) and the lower grinding disc (3) grind the upper and lower surfaces of the optical quartz wafer (9) at the same time. At the same time, the grinding liquid injection assembly (28) transports the grinding liquid between the upper grinding disc (5) and the lower grinding disc (3); Step S3: After the first driving source drives the upper grinding disc (5) to rise, the second output source drives the rotating rod (10) to rotate and the first output source drives the inner gear ring (4) to rotate, so that the axis of the rotating drum (12) coincides with the axis of the planetary wheel (6); Step S4: the second driving source drives the horizontal plate (11) to descend, so that the first disk (19) is located between the three optical quartz wafers (9). At this time, the driving component drives the three sliders (21) to expand outward, and the sliders (21) push the optical quartz wafer (9) to abut against the inner wall of the fixing hole (7); Step S5: The second driving source drives the horizontal plate (11) to rise. At this time, the friction between the slider (21) and the optical quartz wafer (9), and the friction between the optical quartz wafer (9) and the fixing hole (7) will cause the rotating drum (12) to rise and drive the planetary wheel (6) and the optical quartz wafer (9) to rise synchronously, thereby completing the unloading. Step S6: Repeat steps S3 to S5 to complete all the material cutting work.

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