Fixing jig and fixing method used in remodeling process of semiconductor high-purity quartz component

Abstract

The invention belongs to the technical field of remodeling of high-purity quartz components, and discloses a fixing jig and a fixing method used in the remodeling process of semiconductor high-purity quartz components, the fixing jig comprises a coarse positioning area and a fine positioning area, the fine positioning area at least comprises two grooves, a vacuum ring A is formed between a first groove A and a second groove A, and the vacuum ring A is arranged in the coarse positioning area. The vacuum ring A is communicated with the vacuum vent hole A through a vacuum pipeline, a natural suction area is formed after vacuum suction, the natural suction area further comprises an inflation circular ring A, an inflation circular ring B, an inflation circular ring C and an inflation circular ring D, and the inflation circular ring A and the inflation circular ring C are communicated with the pressure gas hole A through the vacuum pipeline. By means of the compressed gas suspension technology, the quality of the remodeling process is stable, the efficiency is improved, meanwhile, operation of workers is easy, the labor intensity is reduced, the consistency of the remodeled quartz glass cover plate is high, and the customer satisfaction degree is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of high-purity quartz component reshaping, in particular to a fixing jig used in the process of reshaping semiconductor silicon wafer high-purity quartz grinding components, and in particular to a fixing jig and a fixing method used in the process of reshaping semiconductor high-purity quartz components. Background Art

[0002] High-purity quartz components are used in mainstream semiconductor factories and are an indispensable component for chip manufacturing. This component is used on semiconductor silicon wafer grinding equipment to carry silicon wafers and drive them to rotate. The purpose is to grind silicon wafers. After the component rotates and heats, it grinds and etches the silicon wafers in a special gas chamber. However, when used for a long time, the gas will corrode the quartz components. After corrosion to a certain extent, the side of the silicon wafer does not have enough contact with the corrosion surface, causing the silicon wafer to fly out, causing huge losses. High-purity quartz components are expensive and the replacement cost is high, so reshaping is the most convenient way to save costs. Most of the existing quartz components do not use fixtures during the reshaping process, and are directly placed on the equipment workbench. This method has poor repeatability for each clamping, which can easily cause product bumps or product breakage.

[0003] The fixed fixtures used in conventional reshaping processes are mostly point-pressing in form. Since high-purity quartz is fragile, there may be a risk of crushing during reshaping. In addition, displacement is likely to occur during reshaping, resulting in huge product scrapping losses. During the removal process, the vacuum formed by the contact between the parts and the fixture makes it very difficult to remove the parts and is prone to damage. Summary of the invention

[0004] In order to make up for the shortcomings of the prior art, the present invention provides a fixing fixture used in the semiconductor high-purity quartz reshaping process, which is positioned by positioning pins, and the repeated installation of parts has high consistency and ensures that the reshaping process will not be displaced; the force point is changed into a circular ring contact by a vacuum ring suction method, and the force area becomes larger, which can avoid the risk of high-purity quartz parts being broken by the traditional point pressing method. After the product contacts the fixture, the vacuum ring is sucked and tightened, and the natural adsorption state between the product surface and the fixture at the vacuum ring position is removed; the reshaping operation is carried out in the adsorption state; when the product is disassembled after the operation is completed, compressed gas is filled into an inflatable ring, and the compressed gas enters the vacuum position so that the product is gently dragged up by the compressed air for easy removal. In the traditional method, the quartz part is pressed on the nylon surface to form a vacuum, and the product can only be lifted forcibly. When lifting, it is easy to cause muscle strain to the operator. If lifting equipment is used, it is easy to cause the product to bump into some metal positions such as the equipment, causing irreversible damage.

[0005] To achieve the above-mentioned purpose, the present invention proposes a fixing jig used in the process of reshaping semiconductor high-purity quartz components, including a coarse positioning area and a fine positioning area. The fine positioning area includes at least two grooves. A vacuum ring A is formed between the first groove A and the second groove A. The vacuum ring A is connected to the vacuum vent A through a vacuum pipeline. After vacuum suction, a natural suction area is formed. The natural suction area also includes an inflatable ring A, an inflatable ring B, an inflatable ring C, and an inflatable ring D. The inflatable rings A and C are connected to the pressure gas hole A through a vacuum pipeline.

[0006] Furthermore, the coarse positioning area and the fine positioning pins are made of resin material, preferably nylon.

[0007] Furthermore, there are at least two precise positioning areas.

[0008] Furthermore, each precision positioning area is composed of at least one precision positioning pin installation.

[0009] Furthermore, the number of natural attraction regions is 2-20.

[0010] Furthermore, the rough positioning area adopts an inverted cone shape design.

[0011] Furthermore, 10-20 positioning spaces are included.

[0012] Fixing method during the reshaping process of semiconductor high-purity quartz components: rinse the surface of the fixture, soak all the natural suction areas, then close the equipment cooling water valve, place the product on the coarse positioning area A and coarse positioning area B, and the area sinks to the fine positioning. At this time, the pressure gas hole A and the pressure gas hole B are closed, open the external link vacuum valve, the vacuum ring A, the vacuum ring B, the vacuum vent A, and the vacuum vent B are in a vacuum state, the product is adsorbed on the fixture, and the product reshaping begins. After the product reshaping is completed, close the vacuum valve, the vacuum ring A, the vacuum ring B, the vacuum vent A, and the vacuum vent B resume ventilation, open the compressed gas valve, open the pressure gas hole A and the pressure gas hole B, the product is gently lifted by the compressed gas, remove the product, and close the compressed gas valve.

[0013] Compared with the prior art, the above technical scheme adopted by the present invention has the following advantages: the rough positioning area designed in the present invention makes disassembly and assembly convenient and avoids damage to the quartz parts; and a circular ring suction method is adopted to avoid the traditional single-point clamping method, avoid product breakage due to excessive clamping force, and use precise positioning pins for precise positioning to avoid displacement and falling off of high-purity quartz parts; multiple natural suction areas are used to avoid losses caused by vacuum failure; and compressed gas suspension technology is used to stabilize the quality of the reshaping process and improve efficiency. At the same time, the operation of the staff is simple, the labor intensity is reduced, and the reshaped quartz glass cover plate has high consistency, which improves customer satisfaction. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 It is the overall correlation diagram of the fixture;

[0015] Figure 2 It is the connection diagram between the fixture gas path and each area;

[0016] Figure 3 This is a cross-sectional view of the fixture;

[0017] Figure 4 It is a partial enlarged view of the cross-sectional view;

[0018] Figure 5 This is the overall picture of the quartz product and fixture after assembly;

[0019] Figure 6 This is a schematic diagram of the back of the product.

[0020] Wherein: 1. Precision positioning pin A, 2. Precision positioning pin B, 3. Vacuum ring A, 4. Vacuum ring B, 5. First groove A, 6. Second groove A, 7. First groove B, 8. Second groove B, 9. Vacuum vent A, 10. Vacuum vent B, 11. Pressure gas hole A, 12. Pressure gas hole B, 13. Inflatable ring A, 14. Inflatable ring B, 15. Inflatable ring C, 16. Inflatable ring D, 17. Positioning space, 18. Coarse positioning area A, 19. Coarse positioning area B, 20. Natural suction area. DETAILED DESCRIPTION

[0021] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0022] This embodiment provides a fixing fixture used in the reshaping process of semiconductor high-purity quartz components, including a vacuum ring suction area, a natural suction area and a pressure gas assisted disassembly area;

[0023] like Figure 1-3As shown, the jig is made of nylon and has 15 positioning spaces 17 for easy installation. At the same time, the precision positioning pin A1 and the precision positioning pin B2 are used for precision positioning, and two sealing strips are used for sealing. Two vacuum gas inlet pipelines are opened on the jig, and the vacuum gas inlet pipelines are connected to the vacuum ring A3 and the vacuum ring B4. The vacuum ring A3 and the vacuum ring B4 have two areas respectively, and each area is provided with a sealing groove of uniform size. There is a gas flow channel between adjacent sealing grooves. Both ends of the gas flow channel are connected to the vacuum generator of the equipment. In this embodiment, the vacuum ring A3 is formed between the first groove A5 and the second groove A7, and the vacuum ring B4 is formed between the first groove B6 and the second groove B8. The natural suction area is naturally formed after the vacuum ring A3 and the vacuum ring B4 are sucked tightly. The pressure gas assists the disassembly and assembly area, and the pressure gas outside the equipment is connected. The pressure gas can be inflated during disassembly.

[0024] Specifically, the rough positioning area adopts an inverted cone shape design. The fine positioning area is composed of two fine positioning pins A1 and a fine positioning pin B2. The position of the fine positioning pin is consistent with the product. The fine positioning pin is made of BOM material, which is a kind of nylon.

[0025] The added quartz component and the fixture naturally attract each other in an area 20, which ensures that the product will not shift or fall off even if the vacuum fails after vacuuming.

[0026] The two vacuum ring suction areas are connected to the vacuum pipeline, and the vacuum pipeline is connected to the equipment vacuum pipeline.

[0027] A groove is dug in the inner ring and the outer ring of the vacuum suction ring respectively, and a sealing ring is installed inside the groove. The area between the two sealing rings forms a pressure holding area.

[0028] There are a total of 4 inflatable rings, which can ensure that the force acting on the adapting parts is consistent under the same pressure, and will open most of the vacuum positions.

[0029] The 15 mounting holes are aligned with the equipment holes, allowing for quick and easy installation and tightening. The actual number can be determined based on the size of the equipment.

[0030] When in use, open the equipment cooling water valve, use the equipment cooling water to rinse the surface of the fixture, and close the equipment cooling water valve after all 12 natural suction areas are soaked. On the coarse positioning area A18 and the coarse positioning area B19, the area sinks to the fine positioning. At this time, the pressure gas hole A11 and the pressure gas hole B12 are closed, open the external link vacuum valve, the vacuum ring A3, the vacuum ring B4, the vacuum vent A9, and the vacuum vent B10 are in a vacuum state. Usually the value of the vacuum control unit is -0.8bar. The product is adsorbed on the fixture and the product reshaping begins. After the product reshaping is completed, close the vacuum valve, the vacuum ring A3, the vacuum ring B4, the vacuum vent A9, and the vacuum vent B10 resume ventilation, open the compressed gas valve, open the pressure gas hole A11 and the pressure gas hole B12, the product is gently lifted by the compressed gas, remove the product, and close the compressed gas valve.

[0031] It should be noted that, in this application, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device.

[0032] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A fixture used in the reshaping process of semiconductor high-purity quartz components, characterized in that: The invention comprises a rough positioning area and a fine positioning area. The fine positioning area comprises at least two grooves. A vacuum ring A (3) is formed between a first groove A (5) and a second groove A (6). The vacuum ring A (3) is connected to a vacuum vent hole A (9) through a vacuum pipeline. After vacuum suction, a natural suction area (20) is formed. The natural suction area (20) further comprises an inflatable ring A (13), an inflatable ring B (14), an inflatable ring C (15), and an inflatable ring D (16). The inflatable ring A (13) and the inflatable ring C (15) are connected to the pressure gas hole A (11) through a vacuum pipeline.

2. The fixing jig used in the semiconductor high-purity quartz component reshaping process according to claim 1, characterized in that: The coarse positioning area and fine positioning pins are made of resin.

3. The fixing jig used in the semiconductor high-purity quartz component reshaping process according to claim 1, characterized in that: There are at least two precise positioning areas.

4. The fixing jig used in the semiconductor high-purity quartz component reshaping process according to claim 1, characterized in that: Each fine positioning area is composed of at least one fine positioning pin installation.

5. The fixing jig used in the semiconductor high-purity quartz component reshaping process according to claim 1, characterized in that: The number of the natural attraction regions (20) is 2-20.

6. The fixing jig used in the semiconductor high-purity quartz component reshaping process according to claim 1, characterized in that: The rough positioning area adopts an inverted cone design.

7. The fixing jig used in the semiconductor high-purity quartz component reshaping process according to claim 1, characterized in that: Also included are 10-20 positioning spaces (17).

8. A method for fixing semiconductor high-purity quartz components during reshaping, characterized in that: Rinse the surface of the fixture clean, soak the natural suction area 20 completely, and then close the equipment cooling water valve. Place the product on the rough positioning area A (18) and the rough positioning area B (19). The area sinks to the fine positioning. At this time, the pressure gas hole A (11) and the pressure gas hole B (12) are closed. Open the external connection vacuum valve. The vacuum ring A (3), the vacuum ring B (4), the vacuum vent A (9), and the vacuum vent B (10) are in a vacuum state. The product is adsorbed on the fixture and the product reshaping begins. After the product reshaping is completed, close the vacuum valve. The vacuum ring A (3), the vacuum ring B (4), the vacuum vent A (9), and the vacuum vent B (10) resume ventilation. Open the compressed gas valve to open the pressure gas hole A (11) and the pressure gas hole B (12). The product is gently lifted by the compressed gas. Remove the product and close the compressed gas valve.

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