High-stability ultra-thin SMD (Surface Mount Device) diode and processing technology thereof

Abstract

The invention discloses a high-stability ultra-thin patch diode and a processing technology thereof.The high-stability ultra-thin patch diode comprises a frame, a heat dissipation assembly is fixedly installed in the frame, a positive plate and a negative plate are fixedly installed at the two ends of one side of the heat dissipation assembly respectively, a positive pin extending to the outside is fixedly installed at the bottom end of the positive plate, and a negative pin extending to the outside is fixedly installed at the bottom end of the negative plate; a positive pole pin extending to the outside is fixedly mounted at the bottom end of the positive pole piece, a negative pole pin extending to the outside is fixedly mounted at the bottom end of the negative pole piece, fastening assemblies are fixedly mounted between the positive pole piece and the positive pole pin and between the negative pole piece and the negative pole pin, each fastening assembly comprises a fastening table and a pressure-resistant shell, and one side of each fastening table is fixedly connected with one side of the corresponding pressure-resistant shell. The fastening table pushes the clamping column on the compression-resistant shell to be clamped into the positive plate or the negative plate, and the compression-resistant shell is made of a stainless steel material, so that the bending and loosening phenomena between the pins and the pole plates are avoided, the phenomenon that the welding between the pole plates and the pins is not firm is avoided, and the normal use of the ultrathin patch diode is ensured.

Description

Technical Field

[0001] The invention relates to the technical field of patch diodes, and in particular to an ultra-thin patch diode with high stability and a processing technology thereof. Background Art

[0002] The chip diode adopts surface mounting technology, with small size and light weight, and is suitable for use in electronic equipment with limited space. The chip diode is suitable for high-speed patch, which can greatly reduce the throwing rate, is suitable for reflow soldering and wave soldering, and is suitable for large-scale production. The chip diode has the characteristics of light weight, small size, low pollution and long life, and is suitable for use in various electronic equipment. The chip diode has unidirectional conductivity, that is, the on-resistance is very small under the action of forward voltage, and the on-resistance is extremely large or infinite under the action of reverse voltage, which is suitable for circuits that require current to be conducted in one direction.

[0003] Comparative document, application number CN202121819532.X, the utility model provides an ultra-thin SMD diode, including an epoxy resin shell, a diode wafer, a cathode conductive foot, and an anode conductive foot; the cathode conductive foot includes a first conductive portion, a first bending portion, and a first welding portion, and a first groove is formed at the upper end of the epoxy resin shell, and the first conductive resin layer and the first insulating protective layer are filled in sequence in the first groove; the anode conductive foot includes a second conductive portion, a second bending portion, and a second welding portion, and a second groove is formed at the lower end of the epoxy resin shell, and the second conductive resin layer and the second insulating protective layer are filled in the second conductive portion and the lower end surface of the diode wafer. The SMD diode of the utility model solves the problem of large thickness of traditional SMD diodes and has excellent heat dissipation performance.

[0004] Comparative document, application number CN201811241277.8, an ultra-thin patch diode. It relates to the photovoltaic field, and in particular to an ultra-thin patch diode. It provides an ultra-thin patch diode with a simple structure, convenient processing, and reliable connection. It includes a frame bottom plate, a frame pin, a plastic package, a chip, and an aluminum strip. The frame bottom plate and the frame pin have the same thickness, and a spacing is provided between the frame bottom plate and the frame pin. One end of the aluminum strip is connected to the frame bottom plate through the chip, and the other end is connected to the frame pin. The plastic package is used to cover the frame bottom plate, the chip, the aluminum strip, and the frame pin. The present invention ensures the welding effect, is not prone to cold soldering, and improves product quality.

[0005] However, the above documents still have the following disadvantages:

[0006] An ultra-thin SMD diode solves the problem of large thickness of traditional SMD diodes, has excellent heat dissipation performance and ensures the welding effect, is not prone to cold soldering, and improves product quality. However, when the ultra-thin SMD diode is used, the welding between the electrode and the pin may be loose, resulting in the ultra-thin SMD diode being unusable. Summary of the invention

[0007] The purpose of the present invention is to provide a highly stable ultra-thin SMD diode and its processing technology, so as to solve the problem that the traditional SMD diode is thick, has excellent heat dissipation performance and ensures the welding effect, is not prone to cold soldering, and improves product quality. However, when the ultra-thin SMD diode is used, the welding between the pole piece and the pin may be loose, resulting in the problem that the ultra-thin SMD diode cannot be used.

[0008] To achieve the above-mentioned purpose, the present invention provides the following technical solutions: a highly stable ultra-thin surface mount diode, comprising a frame, a heat dissipation component is fixedly installed inside the frame, a positive electrode sheet and a negative electrode sheet are fixedly installed at both ends of one side of the heat dissipation component, a positive electrode pin extending to the outside is fixedly installed at the bottom end of the positive electrode sheet, a negative electrode pin extending to the outside is fixedly installed at the bottom end of the negative electrode sheet, a fastening component is fixedly installed between the positive electrode sheet and the positive electrode pin and between the negative electrode sheet and the negative electrode pin, and the two fastening components each include a fastening platform and a pressure-resistant shell, and one side of the fastening platform is fixedly connected to one side of the pressure-resistant shell.

[0009] As a preferred technical solution of the present invention, both ends of the pressure-resistant shell away from the fastening platform are fixedly installed with clamping columns, and the inside of the fastening platform is fixedly installed with a connecting spring, the middle parts of the two fastening platforms are respectively connected to the positive pin and the negative pin, and the top ends of the four clamping columns are respectively engaged and connected with the two sides of the bottom end of the positive electrode sheet and the two sides of the bottom end of the negative electrode sheet, and the ends of the two connecting springs away from the fastening platform are respectively fixedly connected with the side facing the positive electrode sheet and the side facing the negative electrode sheet. The user presses the fastening platform, and the fastening platform pushes the clamping columns on the pressure-resistant shell to clamp into the positive electrode sheet or the negative electrode sheet. The pressure-resistant shell is made of stainless steel to avoid bending and loosening between the pins and the electrode sheets.

[0010] As a preferred technical solution of the present invention, the heat dissipation component includes a heat-conducting shell and an air inlet pipe, a condensing tube is fixedly installed inside the heat-conducting shell, a branch pipe is fixedly installed on one side of the inner wall of the heat-conducting shell, the bottom end of the branch pipe is fixedly connected with a plurality of nozzles, the surface of the heat-conducting shell is fixedly connected with an exhaust pipe, one end of the branch pipe is fixedly connected with one end of the air inlet pipe, one end of the condensing tube is fixedly connected with an injection pipe, and the other end of the condensing tube is fixedly connected with a discharge pipe, the low-temperature gas of the external environment is transported to the branch pipe through the air inlet pipe, the nozzle on the branch pipe sprays the low-temperature gas to contact the condensing tube, heat transfer and cooling are performed on the condensing tube, the low-temperature gas in the condensing tube is in contact with the heat-conducting shell, and the heat-conducting shell is cooled by heat transfer from one side of the positive electrode sheet and the negative electrode sheet, the condensate is injected into the condensing tube through the injection pipe, and the excess condensate is discharged through the discharge pipe.

[0011] As a preferred technical solution of the present invention, two ends of one side of the heat-conducting shell are fixedly connected to the positive electrode sheet and the negative electrode sheet respectively, and the heat dissipation component is installed on one side of the positive electrode sheet and the negative electrode sheet through the heat-conducting shell.

[0012] As a preferred technical solution of the present invention, thermal grease is filled between the frame and the heat dissipation component. The thermal grease transfers the heat on the heat dissipation component to the frame. The frame is in direct contact with the low-temperature gas in the external environment to perform heat transfer, heat dissipation and cooling.

[0013] As a preferred technical solution of the present invention, a power cord extending to the outside is fixedly installed at one end of the frame, and a TVS tube is fixedly installed at the connection between the frame and the power cord. The TVS tube is used on the power cord. The voltage stabilization value is selected according to the withstand voltage of the subsequent circuit, and the power is selected according to the fluctuation of the power supply signal.

[0014] As a preferred technical solution of the present invention, signal leads extending to the outside are fixedly installed on both sides of the frame, and a voltage regulator tube is fixedly installed in the middle of the two signal leads. The voltage regulator tube is used to protect the signal leads. When selecting, pay attention to the power and withstand voltage value. Unless the signal fluctuation amplitude is large, there is no need to pay special attention to the power.

[0015] The present invention provides a processing technology for a high-stability ultra-thin SMD diode, comprising the following steps:

[0016] Step 1: Prepare the heat dissipation component: inject condensate into the condensation pipe through the liquid injection pipe to complete the preparation of the heat dissipation component;

[0017] Step 2: First welding: weld the heat dissipation assembly into the frame;

[0018] Step 3: Second welding: Weld the positive electrode sheet and the negative electrode sheet to the heat dissipation component;

[0019] Step 4: Third welding: weld the positive electrode pin to the positive electrode sheet, and weld the negative electrode pin to the negative electrode sheet;

[0020] Step 5: Fastening and reinforcement: Use fastening components to reinforce the outer side of the connection between the positive pin and the positive electrode sheet and the outer side of the connection between the negative pin and the negative electrode sheet;

[0021] Step 6. Install the signal leads: Weld the signal leads on both sides of the frame;

[0022] Step 7: Install the power cord; weld the power cord on the surface of the frame.

[0023] Compared with the prior art, the beneficial effects of the present invention are: by setting a fastening component, the fastening platform pushes the clamping column on the pressure-resistant shell to clamp into the positive electrode sheet or the negative electrode sheet, and the pressure-resistant shell is made of stainless steel material, thereby avoiding bending and loosening between the pins and the electrode sheets, and avoiding loose welding between the electrode sheets and the pins, thereby ensuring the normal use of the ultra-thin chip diode. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 It is a schematic diagram of the structure of the present invention;

[0025] Figure 2 A perspective view of the present invention;

[0026] Figure 3 is a side view of the fastening assembly of the present invention;

[0027] Figure 4 is a cross-sectional view of the heat dissipation assembly of the present invention;

[0028] Figure 5 It is a flow chart of the present invention.

[0029] In the figure: 1. frame; 2. heat dissipation component; 21. thermal shell; 22. exhaust pipe; 23. drainage pipe; 24. condenser; 25. injection pipe; 26. air inlet pipe; 27. branch pipe; 28. nozzle; 3. signal lead; 4. voltage regulator; 5. TVS tube; 6. power cord; 7. positive electrode; 8. negative electrode; 9. fastening component; 91. fastening platform; 92. pressure-resistant shell; 93. clamping column; 94. connecting spring; 10. negative electrode pin; 11. positive electrode pin; 12. thermal grease. DETAILED DESCRIPTION

[0030] The following will be combined with the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present invention.

[0031] See also Figure 1-5 The present invention provides a high-stability ultra-thin SMD diode, including a frame 1, a heat dissipation component 2 is fixedly installed inside the frame 1, a positive electrode sheet 7 and a negative electrode sheet 8 are fixedly installed at both ends of one side of the heat dissipation component 2, a positive electrode pin 11 extending to the outside is fixedly installed at the bottom end of the positive electrode sheet 7, a negative electrode pin 10 extending to the outside is fixedly installed at the bottom end of the negative electrode sheet 8, a fastening component 9 is fixedly installed between the positive electrode sheet 7 and the positive electrode pin 11 and between the negative electrode sheet 8 and the negative electrode pin 10, and the two fastening components 9 each include a fastening platform 91 and a pressure-resistant shell 92, and one side of the fastening platform 91 is fixedly connected to one side of the pressure-resistant shell 92.

[0032] Both ends of the pressure-resistant shell 92 away from the fastening platform 91 are fixedly installed with clamping columns 93, and the inside of the fastening platform 91 is fixedly installed with connecting springs 94. The middle parts of the two fastening platforms 91 are respectively connected to the positive pin 11 and the negative pin 10, and the top ends of the four clamping columns 93 are respectively engaged with the two sides of the bottom end of the positive electrode sheet 7 and the two sides of the bottom end of the negative electrode sheet 8. The ends of the two connecting springs 94 away from the fastening platform 91 are respectively fixedly connected to the side facing the positive electrode sheet 7 and the side facing the negative electrode sheet 8. The user presses the fastening platform 91, and the fastening platform 91 pushes the clamping columns 93 on the pressure-resistant shell 92 to clamp into the positive electrode sheet 7 or the negative electrode sheet 8. The pressure-resistant shell 92 is made of stainless steel to avoid bending and loosening between the pins and the electrodes.

[0033] The heat dissipation component 2 includes a heat-conducting shell 21 and an air inlet pipe 26. A condenser 24 is fixedly installed inside the heat-conducting shell 21. A branch pipe 27 is fixedly installed on one side of the inner wall of the heat-conducting shell 21. The bottom end of the branch pipe 27 is fixedly connected to a plurality of nozzles 28. The surface of the heat-conducting shell 21 is fixedly connected to an exhaust pipe 22. One end of the branch pipe 27 is fixedly connected to one end of the air inlet pipe 26. One end of the condenser 24 is fixedly connected to an injection pipe 25. The other end of the condenser 24 is fixedly connected to a discharge pipe 23. The low-temperature gas from the external environment is transported to the branch pipe 27 through the air inlet pipe 26. The nozzle 28 on the branch pipe 27 sprays the low-temperature gas to contact the condenser 24, and heat transfer and cooling are performed on the condenser 24. The low-temperature gas in the condenser 24 contacts the heat-conducting shell 21. The heat-conducting shell 21 is cooled by heat transfer from one side of the positive electrode sheet 7 and the negative electrode sheet 8. The condensate is injected into the condenser 24 through the injection pipe 25, and the excess condensate is discharged through the discharge pipe 23.

[0034] Two ends of one side of the heat-conducting shell 21 are fixedly connected to the positive electrode sheet 7 and the negative electrode sheet 8 respectively, and the heat dissipation component 2 is installed on one side of the positive electrode sheet 7 and the negative electrode sheet 8 through the heat-conducting shell 21 .

[0035] Thermal grease 12 is filled between the frame 1 and the heat dissipation component 2. The thermal grease 12 transfers the heat on the heat dissipation component 2 to the frame 1. The frame 1 is in direct contact with the low-temperature gas in the external environment to perform heat transfer, heat dissipation and cooling.

[0036] A power line 6 extending to the outside is fixedly installed at one end of the frame 1, and a TVS tube 5 is fixedly installed at the connection between the frame 1 and the power line 6. The TVS tube 5 is used on the power line 6. The voltage stabilization value is selected according to the withstand voltage of the subsequent circuit, and the power is selected according to the power signal fluctuation.

[0037] Signal leads 3 extending to the outside are fixedly installed on both sides of the frame 1, and voltage regulator tubes 4 are fixedly installed in the middle of the two signal leads 3. The voltage regulator tubes 4 are used to protect the signal leads 3. When selecting, pay attention to the power and withstand voltage value. Unless the signal fluctuation amplitude is large, there is no need to pay special attention to the power.

[0038] The present invention provides a processing technology for a high-stability ultra-thin SMD diode, comprising the following steps:

[0039] Step 1, preparing the heat dissipation component 2: injecting condensate into the condensation pipeline 24 through the injection pipeline 25 to complete the preparation of the heat dissipation component 2;

[0040] Step 2: First welding: welding the heat dissipation component 2 into the frame 1;

[0041] Step 3: Second welding: Weld the positive electrode sheet 7 and the negative electrode sheet 8 to the heat dissipation component 2;

[0042] Step 4: Third welding: welding the positive electrode pin 11 and the positive electrode sheet 7 together, welding the negative electrode pin 10 and the negative electrode sheet 8 together;

[0043] Step 5: Fastening and reinforcement: Use the fastening assembly 9 to reinforce the outer side of the connection between the positive electrode pin 11 and the positive electrode sheet 7 and the outer side of the connection between the negative electrode pin 10 and the negative electrode sheet 8;

[0044] Step 6: Install the signal lead 3: Weld the signal lead 3 on both sides of the frame 1;

[0045] Step 7: Install the power cord 6 ; weld the power cord 6 on the surface of the frame 1 .

[0046] In the present invention, the preparation of the heat dissipation component 2 is completed after the condensate is injected into the condensation pipe 24 through the injection pipe 25, and the low-temperature gas of the external environment is transported to the branch pipe 27 through the air inlet pipe 26. The nozzle 28 on the branch pipe 27 sprays the low-temperature gas to contact the condensation pipe 24, and the condensation pipe 24 is cooled by heat transfer. The low-temperature gas in the condensation pipe 24 is in contact with the heat-conducting shell 21, and the heat-conducting shell 21 is cooled by heat transfer from one side of the positive electrode sheet 7 and the negative electrode sheet 8. The condensate is injected into the condensation pipe 24 through the injection pipe 25, and the excess condensate is discharged through the drain pipe 23; the heat dissipation component 2 is welded in the frame 1; the positive electrode sheet 7 and the negative electrode sheet 8 are welded to the heat dissipation component 2; the positive electrode pin 11 is welded to the positive electrode sheet 7, and the negative electrode pin 10 is welded to the negative electrode sheet 8 together; through the fastening component 9, the outer side of the connection between the positive pin 11 and the positive electrode sheet 7 and the outer side of the connection between the negative pin 10 and the negative electrode sheet 8 are reinforced respectively, the user presses the fastening platform 91, and the fastening platform 91 pushes the clamping column 93 on the pressure-resistant shell 92 to clamp into the positive electrode sheet 7 or the negative electrode sheet 8. The pressure-resistant shell 92 is made of stainless steel to avoid bending and loosening between the pin and the electrode sheet; the signal lead 3 is welded on both sides of the frame 1; the voltage regulator tube 4 is used to protect the signal lead 3. When selecting, pay attention to the power and withstand voltage value. Unless the signal fluctuation amplitude is large, there is no need to pay special attention to the power. The power line 6 is welded on the surface of the frame 1, and the TVS tube 5 is used on the power line 6. The voltage regulator value is selected according to the withstand voltage of the subsequent circuit, and the power is selected according to the power signal fluctuation.

[0047] Although the present invention has been described in detail with reference to the aforementioned embodiments, it is still possible for those skilled in the art to modify the technical solutions described in the aforementioned embodiments, or to make equivalent substitutions for some of the technical features therein. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A highly stable ultra-thin chip diode, comprising a frame (1), characterized in that: A heat dissipation component (2) is fixedly installed inside the frame (1); a positive electrode sheet (7) and a negative electrode sheet (8) are fixedly installed at both ends of one side of the heat dissipation component (2); a positive electrode pin (11) extending to the outside is fixedly installed at the bottom end of the positive electrode sheet (7); a negative electrode pin (10) extending to the outside is fixedly installed at the bottom end of the negative electrode sheet (8); a fastening component (9) is installed between the positive electrode sheet (7) and the positive electrode pin (11) and between the negative electrode sheet (8) and the negative electrode pin (10); the two fastening components (9) each include a fastening platform (91) and a pressure-resistant shell (92); one side of the fastening platform (91) is fixedly connected to one side of the pressure-resistant shell (92).

2. The high-stability ultra-thin SMD diode according to claim 1, characterized in that: Both ends of the pressure-resistant shell (92) away from the fastening platform (91) are fixedly mounted with clamping columns (93); a connecting spring (94) is fixedly mounted inside the fastening platform (91); the middle parts of the two fastening platforms (91) are respectively connected to the positive electrode pin (11) and the negative electrode pin (10); the top ends of the four clamping columns (93) are respectively engaged with the two sides of the bottom end of the positive electrode sheet (7) and the two sides of the bottom end of the negative electrode sheet (8); and the ends of the two connecting springs (94) away from the fastening platform (91) are respectively fixedly connected to the side directly opposite to the positive electrode sheet (7) and the side directly opposite to the negative electrode sheet (8).

3. The ultra-thin SMD diode with high stability according to claim 1, characterized in that: The heat dissipation component (2) comprises a heat-conducting shell (21) and an air inlet pipe (26); a condensing pipe (24) is fixedly installed inside the heat-conducting shell (21); a branch pipe (27) is fixedly installed on one side of the inner wall of the heat-conducting shell (21); the bottom end of the branch pipe (27) is fixedly connected to a plurality of nozzles (28); the surface of the heat-conducting shell (21) is fixedly connected to an exhaust pipe (22); one end of the branch pipe (27) is fixedly connected to one end of the air inlet pipe (26); one end of the condensing pipe (24) is fixedly connected to a liquid injection pipe (25); and the other end of the condensing pipe (24) is fixedly connected to a liquid discharge pipe (23).

4. The ultra-thin SMD diode with high stability according to claim 3, characterized in that: Two ends of one side of the heat-conducting shell (21) are respectively fixedly connected to the positive electrode sheet (7) and the negative electrode sheet (8).

5. The ultra-thin SMD diode with high stability according to claim 1, characterized in that: Thermal conductive silicone grease (12) is filled between the frame (1) and the heat dissipation component (2).

6. The high-stability ultra-thin SMD diode according to claim 1, characterized in that: A power line (6) extending to the outside is fixedly mounted on one end of the frame (1), and a TVS tube (5) is fixedly mounted at the connection between the frame (1) and the power line (6).

7. The ultra-thin SMD diode with high stability according to claim 1, characterized in that: Signal leads (3) extending to the outside are fixedly mounted on both sides of the frame (1), and voltage regulator tubes (4) are fixedly mounted in the middle of the two signal leads (3).

8. A process for processing a highly stable ultra-thin SMD diode according to any one of claims 1 to 7, characterized in that: The following steps are involved: Step 1, preparing the heat dissipation component (2): injecting condensate into the condensation pipeline (24) through the liquid injection pipeline (25) to complete the preparation of the heat dissipation component (2); Step 2: First welding: welding the heat dissipation component (2) into the frame (1); Step 3: Second welding: welding the positive electrode sheet (7) and the negative electrode sheet (8) to the heat dissipation component (2); Step 4: Third welding: welding the positive electrode pin (11) and the positive electrode sheet (7) together, and welding the negative electrode pin (10) and the negative electrode sheet (8) together; Step 5: buckle and reinforce: Use the fastening assembly (9) to reinforce the outer side of the connection between the positive electrode pin (11) and the positive electrode sheet (7) and the outer side of the connection between the negative electrode pin (10) and the negative electrode sheet (8); Step 6: Install the signal lead (3): weld the signal lead (3) on both sides of the frame (1); Step 7: Install the power line (6); weld the power line (6) on the surface of the frame (1).

Images