Current sensor, electronic apparatus, and detection device

Abstract

The invention discloses a current sensor, electronic equipment and a detection device, and relates to the technical field of sensors, the current sensor comprises a current lead, a sensing assembly and a signal processing module, and the current lead comprises a detection section; the sensing assembly comprises a first sensing module and a second sensing module, the first sensing module, the second sensing module and a current lead are arranged in the first direction, and the first sensing module and the second sensing module are both used for detecting a magnetic field generated by electrification of the detection section and outputting a first detection value and a second detection value respectively; the first sensing module and the second sensing module are both in communication connection with the signal processing module, and the signal processing module is used for obtaining the current of the detection section according to the difference value of the first detection value and the second detection value. According to the invention, the current of the current lead is obtained through the difference between the first detection value and the second detection value, so that the influence of an external magnetic field is reduced, and the signal quality and the working stability are effectively improved.

Description

Technical Field

[0001] The present invention relates to the technical field of sensors, and in particular to a current sensor, an electronic device and a detection device. Background Art

[0002] The current sensor is used to measure the current in the current lead. The measurement principle is that when the current passes through the current lead frame, a magnetic field proportional to the current is formed. The magnetic sensing module senses the magnetic field and produces changes in parameters such as potential / resistance. The parameter changes are processed by the signal processing module and output a voltage or current signal to characterize the current. Existing current sensors are often interfered by the external environment during the measurement process, resulting in poor signal quality and working stability of the current sensor. Summary of the invention

[0003] The main purpose of the present invention is to provide a current sensor, an electronic device and a detection device, aiming to improve the signal quality and working stability of the current sensor.

[0004] To achieve the above object, the current sensor proposed by the present invention comprises:

[0005] a current lead, the current lead comprising a detection section;

[0006] A sensing component, the sensing component includes a first sensing module and a second sensing module, wherein the first sensing module, the second sensing module and the current lead are arranged in a first direction, and the first sensing module and the second sensing module are both used to detect the magnetic field generated by the power supply of the detection section and output a first detection value and a second detection value respectively;

[0007] A signal processing module, wherein the first sensing module and the second sensing module are both communicatively connected to the signal processing module, and the signal processing module is used to obtain the current magnitude of the detection section according to the difference between the first detection value and the second detection value.

[0008] In one embodiment, the signal processing module comprises a first side and a second side arranged opposite to each other along the first direction, and the current lead is arranged on the second side.

[0009] In one embodiment, the first sensing module is disposed on the first side, and the second sensing module is disposed on a side of the first sensing module away from the signal processing module;

[0010] Alternatively, the first sensing module is disposed on a side of the current lead away from the signal processing module, and the second sensing module is disposed on a side of the first sensing module away from the current lead.

[0011] In one embodiment, the first sensing module is disposed on the first side, and the second sensing module is disposed on a side of the current lead away from the signal processing module;

[0012] Alternatively, the second sensing module is disposed on the first side, and the first sensing module is disposed on a side of the current lead away from the signal processing module.

[0013] In one embodiment, the first sensing module is integrated into the signal processing module;

[0014] The second sensing module is disposed on the first side;

[0015] Alternatively, the second sensing module is disposed on a side of the current lead away from the signal processing module.

[0016] In one embodiment, the first sensing module and the second sensing module are respectively arranged at two positions with different magnetic field strengths and / or directions, so that the first detection value is not equal to the second detection value; and the distance from the first sensing module to the detection section is not equal to the distance from the second sensing module to the detection section.

[0017] In one embodiment, the current sensor further comprises a housing, wherein the housing is formed with a housing cavity for housing the detection section, the sensor assembly and the signal processing module.

[0018] In one embodiment, the current sensor further comprises a signal lead, wherein the signal lead is electrically connected to the signal processing module, and the current of the signal lead can flow through the signal processing module and the sensing component.

[0019] In one embodiment, the current direction of the signal lead and the current direction of the detection section are perpendicular to each other.

[0020] In one embodiment, the first sensing module and the second sensing module have the same performance parameters.

[0021] The present invention further provides an electronic device, which includes the above-mentioned current sensor.

[0022] The present invention also provides a detection device, which includes the above-mentioned current sensor.

[0023] In the technical solution of the present invention, there is a difference in the magnetic field strength and / or direction at the positions where the first sensing module and the second sensing module are located, and the difference will cause a difference between the first detection value of the first sensing module and the second detection value of the second sensing module, and the distance from the first sensing module to the detection section is not equal to the distance from the second sensing module to the detection section, so that the difference is proportional to the current magnitude, and therefore the current magnitude in the current lead can be obtained through the difference. When an external magnetic field intervenes, since the first sensing module and the second sensing module are far away from the magnetic field center of the external magnetic field, the distance is far greater than the difference between the distance from the first sensing module to the current lead and the distance from the second sensing module to the current lead, the first sensing module and the second sensing module can be approximately regarded as being at a position where the magnetic field strength is equal in the external magnetic field, that is, the external magnetic field has basically the same effect on the detection values ​​of the first sensing module and the second sensing module. This solution reduces the influence of the external magnetic field by the difference between the first detection value and the second detection value, thereby effectively improving the signal quality and working stability. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on the structures shown in these drawings without paying creative work.

[0025] Figure 1 A schematic cross-sectional view of an embodiment of a first sensing module and a second sensing module provided by the present invention being stacked on a signal processing module;

[0026] Figure 2 A schematic cross-sectional view of an embodiment of the present invention in which the first sensing module and the second sensing module are stacked on the current lead;

[0027] Figure 3 A schematic cross-sectional view of an embodiment in which the first sensing module and the second sensing module provided by the present invention are respectively arranged on the signal processing module and the current lead;

[0028] Figure 4 A schematic cross-sectional view of an embodiment in which the second sensing module and the first sensing module provided by the present invention are respectively arranged on the signal processing module and the current lead;

[0029] Figure 5 A cross-sectional structural diagram of an embodiment of the present invention in which the first sensing module is integrated into the signal processing module;

[0030] Figure 6This is a cross-sectional structural schematic diagram of another embodiment of the first sensing module provided by the present invention being integrated into a signal processing module.

[0031] Description of Figure Numbers:

[0032] 100. Current sensor; 1. Current lead; 11. Detection section; 2. Sensing component; 21. First sensing module; 22. Second sensing module; 3. Signal processing module; 31. First side; 32. Second side; 4. Shell; 41. Accommodating cavity; 5. Signal lead.

[0033] The realization of the purpose, functional features and advantages of the present invention will be further explained in conjunction with embodiments and with reference to the accompanying drawings. DETAILED DESCRIPTION

[0034] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0035] It should be noted that if the embodiments of the present invention involve directional indications (such as up, down, left, right, front, back, etc.), the directional indications are only used to explain the relative position relationship, movement status, etc. between the components in a certain specific posture. If the specific posture changes, the directional indication will also change accordingly.

[0036] In addition, if there are descriptions involving "first", "second", etc. in the embodiments of the present invention, the descriptions of "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of technical features indicated. Therefore, the features limited to "first" and "second" may explicitly or implicitly include at least one of the features. In addition, if "and / or" or "and / or" appears in the full text, its meaning includes three parallel solutions. Taking "A and / or B" as an example, it includes solution A, solution B, or solutions that satisfy both A and B. In addition, the technical solutions between the various embodiments can be combined with each other, but it must be based on the ability of ordinary technicians in this field to implement. When the combination of technical solutions is contradictory or cannot be implemented, it should be deemed that such combination of technical solutions does not exist and is not within the scope of protection required by the present invention.

[0037] The current sensor is used to measure the current in the current lead. The measurement principle is that when the current passes through the current lead frame, a magnetic field proportional to the current is formed. The magnetic sensing module senses the magnetic field and produces changes in parameters such as potential / resistance. The parameter changes are processed by the signal processing module and output a voltage or current signal to characterize the current. Existing current sensors are often interfered by the external environment during the measurement process, resulting in poor signal quality and working stability of the current sensor.

[0038] The applicant has found that existing current sensors are affected by external magnetic fields. When there are other external magnetic fields, the magnetic sensing module will also capture the external magnetic field, thereby affecting the final current / voltage signal, forming noise interference, and affecting the signal quality and working stability of the device.

[0039] In view of this, the present invention proposes a current sensor, an electronic device and a detection device, aiming to improve the signal quality and working stability of the current sensor.

[0040] See also Figures 1 to 6 In one embodiment of the present invention, the current sensor 100 includes a current lead 1, a sensing component 2 and a signal processing module 3. The current lead 1 includes a detection segment 11; the sensing component 2 includes a first sensing module 21 and a second sensing module 22. In a first direction, the first sensing module 21, the second sensing module 22 and the current lead 1 are arranged. The first sensing module 21 and the second sensing module 22 are both used to detect the magnetic field generated by the detection segment 11 when it is energized and output a first detection value and a second detection value respectively. The first sensing module 21 and the second sensing module 22 are respectively arranged at two positions with different magnetic field strengths and / or directions. The distance from the first sensing module 21 to the detection segment 11 is not equal to the distance from the second sensing module 22 to the detection segment 11, and the first detection value is not equal to the second detection value; the first sensing module 21 and the second sensing module 22 are both communicatively connected to the signal processing module 3, and the signal processing module 3 is used to obtain the current size of the detection segment 11 according to the difference between the first detection value and the second detection value.

[0041] Among them, there is a difference in the magnetic field strength at the positions where the first sensing module 21 and the second sensing module 22 are located, or the magnetic field strength at the positions where the first sensing module 21 and the second sensing module 22 are located is the same but the magnetic field direction is different, for example, the magnetic field direction is opposite or vertical, etc.; or, there is a difference in both the magnetic field strength and direction at the positions where the first sensing module 21 and the second sensing module 22 are located; since the first detection value of the first sensing module 21 can represent the magnitude and direction of the magnetic field strength at the position where the first sensing module 21 is located, and the second detection value of the second sensing module 22 can represent the magnitude and direction of the magnetic field strength at the position where the second sensing module 22 is located, the difference in magnetic field strength and / or direction at the positions where the first sensing module 21 and the second sensing module 22 are located will cause a difference between the first detection value of the first sensing module 21 and the second detection value of the second sensing module 22. According to the formula: B=μI / 2πr, where B is Magnetic field intensity, μ is the vacuum magnetic permeability constant, I is the current of the current lead 1, r is the distance from the current lead 1, the difference in magnetic field magnitude between the first sensing module 21 and the second sensing module 22 is ΔB=uI / [2π(r2-r1)], wherein r2-r1 is the difference between the distance from the second sensing module 22 to the current lead 1 and the distance from the first sensing module 21 to the current lead 1. Since the distance from the first sensing module 21 to the detection segment 11 is not equal to the distance from the second sensing module 22 to the detection segment 11, r2-r1≠0. The difference between the first detection value and the second detection value is proportional to ΔB, and ΔB is proportional to I / (r2-r1). It can be seen that the difference between the first detection value and the second detection value is related to the magnitude of the current I. Therefore, the difference between the first detection value and the second detection value can be used to characterize the magnitude of the current in the current lead 1, that is, the magnitude of the current in the current lead 1 can be obtained through the difference. It should be noted that the signal processing module 3 may be an ASIC chip, and the current lead 1 may be a pin of the chip. It should also be noted that both the first sensing module 21 and the second sensing module 22 can detect the magnitude and direction of the magnetic field, the numerical values ​​of the first detection value and the second detection value can represent the magnitude of the intensity of the magnetic field, and the positive and negative values ​​of the first detection value and the second detection value can represent whether the directions of the magnetic field are the same.

[0042] It should be noted that the first sensing module 21, the second sensing module 22 and the current lead 1 are arranged along the first direction, so that the size of the current sensor 100 along the second direction can be reduced. The first direction is perpendicular to the second direction, so that the current sensor 100 can meet the assembly requirements of a smaller installation space size in the second direction, thereby improving the application scope of the current sensor 100.

[0043] When an external magnetic field intervenes, since the first sensing module 21 and the second sensing module 22 are far away from the magnetic field center of the external magnetic field, the distance is much greater than the difference between the distance from the first sensing module 21 to the current lead 1 and the distance from the second sensing module 22 to the current lead 1. Therefore, the first sensing module 21 and the second sensing module 22 can be approximately regarded as being at positions where the magnetic field strength is equal in the external magnetic field, that is, the influence of the external magnetic field on the detection values ​​of the first sensing module 21 and the second sensing module 22 is basically the same. Assuming that when there is no external magnetic field, the first detection value of the first sensing module 21 is B1, and the second detection value of the second sensing module 22 is B2. When there is an external magnetic field, the first detection value of the first sensing module 21 is B1+B 11 The second detection value of the second sensing module 22 is B2+B 22 , where B 11 B is the amount of change in the output value of the first induction module 21 caused by the addition of the external magnetic field, 22 B is the amount of change in the output value of the second sensing module 22 caused by the addition of the external magnetic field. Since the external magnetic field has basically the same effect on the detection values ​​of the first sensing module 21 and the second sensing module 22, 11 ≈B 22 , that is, B 11 -B 22 ≈0; It can be seen that when there is an external magnetic field, the difference between the first detection value and the second detection value = B1-B2+B 11 -B 22 ≈B1-B2, this solution reduces the influence of the external magnetic field through the difference between the first detection value and the second detection value, thereby effectively improving the signal quality and working stability.

[0044] In one embodiment, the first sensing module 21 and the second sensing module 22 are respectively arranged at two positions with different magnetic field strengths and / or directions, so that the first detection value is not equal to the second detection value; the distance from the first sensing module 21 to the detection section 11 is not equal to the distance from the second sensing module 22 to the detection section 11. In this embodiment, the first sensing module 21 and the second sensing module 22 are respectively arranged at two positions with different magnetic field strengths and / or directions, so as to ensure that the first detection value is not equal to the second detection value, and the distance from the first sensing module 21 to the detection section 11 is not equal to the distance from the second sensing module 22 to the detection section 11, so as to ensure that r2-r1≠0, and further ensure that the magnitude of the current in the current lead 1 can be obtained through the difference between the first detection value and the second detection value.

[0045] In one embodiment, the signal processing module 3 includes a first side 31 and a second side 32 arranged opposite to each other along a first direction, and the current lead 1 is arranged on the second side 32. The current lead 1 can be welded to the second side 32 or bonded to the second side 32, and can be bonded with conductive glue or non-conductive glue, which is not limited here. It should be noted that the first direction is Figure 1 Up and down directions shown.

[0046] See also Figure 1 In one embodiment, the first sensing module 21 is arranged on the first side 31, and the second sensing module 22 is arranged on the side of the first sensing module 21 away from the signal processing module 3; in this embodiment, by stacking the first sensing module 21 and the second sensing module 22 on the first side 31, there is a height difference between the first sensing module 21 and the second sensing module 22, so that the magnetic field strengths of the first sensing module 21 and the second sensing module 22 are different; if the second sensing module 22 is bonded to the side of the first sensing module 21 away from the signal processing module 3 by adhesive, then r2-r1=thickness of the second sensing module 22+thickness of the adhesive between the first sensing module 21 and the second sensing module 22. It should be noted that if the second sensing module 22 is in contact with the side of the first sensing module 21 away from the signal processing module 3, that is, the adhesive is located on the periphery of the second sensing module 22, then r2-r1=thickness of the second sensing module 22. It should also be noted that the first sensing module 21 and the second sensing module 22 are sensing modules of the same specification.

[0047] See also Figure 2 In one embodiment, the first sensing module 21 is arranged on the side of the current lead 1 away from the signal processing module 3, and the second sensing module 22 is arranged on the side of the first sensing module 21 away from the current lead 1. In this embodiment, by stacking the first sensing module 21 and the second sensing module 22 on the side of the current lead 1 away from the signal processing module 3, there is a height difference between the first sensing module 21 and the second sensing module 22, so that the magnetic field strengths of the first sensing module 21 and the second sensing module 22 are different; if the second sensing module 22 is bonded to the side of the first sensing module 21 away from the current lead 1 by adhesive, then ΔD=r2-r1=thickness of the second sensing module 22+thickness of the adhesive between the first sensing module 21 and the second sensing module 22.

[0048] See also Figure 3In one embodiment, the first sensing module 21 is arranged on the first side 31, and the second sensing module 22 is arranged on the side of the current lead 1 away from the signal processing module 3; in this embodiment, since the signal processing module 3 is between the first sensing module 21 and the current lead 1, and the second sensing module 22 is directly arranged on the side of the current lead 1 away from the signal processing module 3, there is a difference in the distance between the first sensing module 21 and the second sensing module 22 and the current lead 1, which ensures that the magnetic field strengths of the first sensing module 21 and the second sensing module 22 are different; if the first sensing module 21 is bonded to the first side 31, the second sensing module 22 is bonded to the current lead 1, and the current lead 1 is bonded to the second side 32, if the thickness of the adhesive between the first sensing module 21 and the signal processing module 3 is equal to the thickness of the adhesive between the second sensing module 22 and the current lead 1, then ΔD=r2-r1=thickness of the signal processing module 3+thickness of the adhesive between the current lead 1 and the signal processing module 3.

[0049] See also Figure 4 In one embodiment, the second sensing module 22 is arranged on the first side 31, and the first sensing module 21 is arranged on the side of the current lead 1 away from the signal processing module 3. In this embodiment, since the signal processing module 3 is between the second sensing module 22 and the current lead 1, and the first sensing module 21 is directly arranged on the side of the current lead 1 away from the signal processing module 3, there is a difference in the distance between the first sensing module 21 and the second sensing module 22 and the current lead 1, which ensures that the magnetic field strengths of the first sensing module 21 and the second sensing module 22 are different; if the first sensing module 21 is bonded to the current lead 1, the second sensing module 22 is bonded to the first side 31, and the current lead 1 is bonded to the second side 32, if the thickness of the adhesive between the first sensing module 21 and the current lead 1 is equal to the thickness of the adhesive between the second sensing module 22 and the signal processing module 3, then ΔD=r2-r1=thickness of the signal processing module 3+thickness of the adhesive between the current lead 1 and the signal processing module 3.

[0050] See also Figure 5 In one embodiment, the first sensing module 21 is integrated with the signal processing module 3; the second sensing module 22 is arranged on the first side 31; by integrating the first sensing module 21 with the signal processing module 3, the installation step of the first sensing module 21 is omitted, and the second sensing module 22 is arranged on the first side 31, so that there is a difference in the distance from the first sensing module 21 and the second sensing module 22 to the current lead 1, ensuring that the magnetic field strengths of the first sensing module 21 and the second sensing module 22 are different; if the second sensing module 22 is bonded to the signal processing module 3, then ΔD=r2-r1=the thickness of the second sensing module 22+the thickness of the adhesive between the second sensing module 22 and the signal processing module 3.

[0051] See also Figure 6 In one embodiment, the first sensing module 21 is integrated into the signal processing module 3; the second sensing module 22 is arranged on the side of the current lead 1 away from the signal processing module 3. By integrating the first sensing module 21 into the signal processing module 3, the installation step of the first sensing module 21 is omitted, and the second sensing module 22 is arranged on the side of the current lead 1 away from the signal processing module 3, so that there is a difference in the distance between the first sensing module 21 and the second sensing module 22 to the current lead 1, ensuring that the magnetic field strengths of the first sensing module 21 and the second sensing module 22 are different. If the thickness of the adhesive between the current lead 1 and the signal processing module 3 is equal to the thickness of the adhesive between the second sensing module 22 and the current lead 1, then ΔD=r2-r1=the difference between the thickness of the second sensing module 22 and the thickness of the signal processing module 3.

[0052] In one embodiment, the current sensor 100 further includes a housing 4, which is formed with a housing cavity 41 for housing the detection section 11, the sensor assembly 2, and the signal processing module 3. The housing 4 can provide effective protection for the detection section 11, the sensor assembly 2, and the signal processing module 3 located inside the housing 4.

[0053] In one embodiment, the current sensor 100 further includes a signal lead 5, the signal lead 5 is electrically connected to the signal processing module 3, and the current of the signal lead 5 can flow through the signal processing module 3 and the sensor component 2. The signal lead 5 is provided to ensure power supply to the sensor component 2 and the signal processing module 3. It should be noted that the current of the signal lead 5 is much smaller than the current of the current lead 1, so the magnetic field generated by the signal lead 5 will basically not generate electromagnetic interference with the magnetic field generated by the current lead 1.

[0054] In one embodiment, the current direction of the signal lead 5 is perpendicular to the current direction of the detection section 11. This setting can further reduce the influence of the magnetic field generated by the signal lead 5 on the magnetic field generated by the current lead 1. It should be noted that the detection section 11 extends along the second direction, and the first direction is perpendicular to the second direction.

[0055] In one embodiment, the performance parameters of the first sensing module 21 and the second sensing module 22 are the same. This setting unifies the measurement references of the first measurement value and the second measurement value, so that the first measurement value and the second measurement value are substantially the same when the first sensing module 21 and the second sensing module 22 are at positions with the same magnetic field strength, avoiding the situation where the first detection value and the second detection value of the first sensing module 21 and the second sensing module 22 are the same at two positions with different magnetic field strengths, so that when the first sensing module 21 and the second sensing module 22 are at places with different magnetic field strengths, there will be a difference between the first measurement value and the second measurement value, eliminating the step of correcting the calculated difference due to the different performance parameters of the first sensing module 21 and the second sensing module 22.

[0056] The present invention also proposes an electronic device, which includes the above-mentioned current sensor 100. Since the electronic device adopts all the technical solutions of all the above-mentioned embodiments, it at least has all the beneficial effects brought by the technical solutions of the above-mentioned embodiments, which will not be described one by one here. Among them, the electronic device can be an electric and electric heating device, and the current sensor 100 detects and controls the current size of the electric and electric heating device, thereby detecting and controlling the output power of the electric and electric heating device, and adjusting the speed and heat generation of the device by controlling the output power of the electric and electric heating device. It should be noted that the electronic device can also be an overcurrent protection device such as a circuit breaker or a relay; the electronic device can also be a measuring device such as an oscilloscope and a multimeter.

[0057] The present invention also proposes a detection device, which includes the above-mentioned current sensor 100. Since the detection device adopts all the technical solutions of all the above-mentioned embodiments, it at least has all the beneficial effects brought by the technical solutions of the above-mentioned embodiments, which will not be repeated here. Among them, the detection device can be a battery management device, and the current sensor 100 is used to detect and adjust the charging and discharging current of the battery, which helps to extend the battery life. It should be noted that the detection device can also be a power system and power grid monitoring device.

[0058] The above are only exemplary embodiments of the present invention, and are not intended to limit the patent scope of the present invention. All equivalent structural changes made using the contents of the present invention's specification and drawings, or directly / indirectly applied in other related technical fields, are included in the patent protection scope of the present invention.

Claims

1. A current sensor, characterized in that: include: a current lead, the current lead comprising a detection section; A sensing component, the sensing component includes a first sensing module and a second sensing module, wherein the first sensing module, the second sensing module and the current lead are arranged in a first direction, and the first sensing module and the second sensing module are both used to detect the magnetic field generated by the power supply of the detection section and output a first detection value and a second detection value respectively; A signal processing module, wherein the first sensing module and the second sensing module are both communicatively connected to the signal processing module, and the signal processing module is used to obtain the current magnitude of the detection section according to the difference between the first detection value and the second detection value.

2. The current sensor according to claim 1, characterized in that The signal processing module includes a first side and a second side that are oppositely arranged along the first direction, and the current lead is arranged on the second side.

3. The current sensor according to claim 2, characterized in that: The first sensing module is disposed on the first side, and the second sensing module is disposed on a side of the first sensing module away from the signal processing module; Alternatively, the first sensing module is disposed on a side of the current lead away from the signal processing module, and the second sensing module is disposed on a side of the first sensing module away from the current lead.

4. The current sensor according to claim 2, characterized in that: The first sensing module is arranged on the first side, and the second sensing module is arranged on a side of the current lead away from the signal processing module; Alternatively, the second sensing module is disposed on the first side, and the first sensing module is disposed on a side of the current lead away from the signal processing module.

5. The current sensor according to claim 2, characterized in that: The first sensing module is integrated into the signal processing module; The second sensing module is disposed on the first side; Alternatively, the second sensing module is disposed on a side of the current lead away from the signal processing module.

6. The current sensor according to any one of claims 1 to 5, characterized in that: The first sensing module and the second sensing module are respectively arranged at two positions with different magnetic field strengths and / or directions, so that the first detection value is not equal to the second detection value; and the distance from the first sensing module to the detection section is not equal to the distance from the second sensing module to the detection section.

7. The current sensor according to any one of claims 1 to 5, characterized in that: The current sensor further comprises a housing, wherein the housing is formed with a housing cavity for housing the detection section, the sensor assembly and the signal processing module.

8. The current sensor according to any one of claims 1 to 5, characterized in that: The current sensor further comprises a signal lead, wherein the signal lead is electrically connected to the signal processing module, and the current of the signal lead can flow through the signal processing module and the sensing component.

9. The current sensor according to claim 8, characterized in that The current direction of the signal lead and the current direction of the detection section are perpendicular to each other.

10. The current sensor according to any one of claims 1 to 5, characterized in that: The first sensing module and the second sensing module have the same performance parameters.

11. An electronic device, characterized in that: The electronic device comprises the current sensor according to any one of claims 1 to 10.

12. A detection device, characterized in that: The detection device comprises the current sensor according to any one of claims 1 to 10.

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