A multi-channel integrated optoelectronic conversion transceiver device

Abstract

The present application provides a multi-channel integrated optoelectronic conversion transceiver device, which relates to the field of multi-channel multiplexing communication technology and includes: a multi-channel optical transceiver component, a multi-grid integrated base, a multi-core fiber optic cable, a multi-core fiber optic cable pigtail storage compartment, and a multi-core fiber optic cable adapter female head, wherein: each optical transceiver component is provided with a transceiver die, a multiplexer / demultiplexer, and an optical signal coupler, and each optical transceiver component is installed in each grid of the multi-grid integrated base; the received wavelength optical signal and the transmitted wavelength optical signal of the transceiver die in each optical transceiver component are multiplexed / demultiplexed by the multiplexer / demultiplexer and then coupled to one core of the multi-core fiber optic cable through the optical signal coupler to complete the transmission of the received wavelength optical signal and the transmitted wavelength optical signal. Through the above solution, the technical problem that when existing central office equipment accesses more users, it can only meet the demand for high-density interfaces by stacking more equipment, resulting in an increase in the cost of central office equipment, is solved.

Description

Technical Field

[0001] This application belongs to the technical field of multiplex communication, and particularly relates to a multi-channel integrated optoelectronic conversion transceiver device. Background Art

[0002] In the current transmission network, whether it is the backbone network, metropolitan area network or access network, especially the backbone network and metropolitan area network, they have all been fully fiberized, and the access network has also been gradually developing towards full fiberization. These networks are collectively referred to as fiber optic networks. In a fiber optic network, an optoelectronic conversion component needs to be set between the device and the fiber optic medium. Through the optoelectronic conversion component, the electrical signal to be sent is converted into an optical signal, the optical signal to be received is converted into an electrical signal, and after being modulated on a specific optical wavelength, it is transmitted on the fiber optic medium. Currently, the physical shapes of access network optoelectronic conversion transceiver devices can generally be divided into three types: BOSA type, SFF type, and SFP type. The common points of these three types are: 1) Each optical transceiver component is a monomer type, with a large volume and a large space occupied by the device; 2) Each optical transceiver component is connected to the fiber outside the chassis through an SC or LC interface on the chassis panel with an independent optical fiber, resulting in a small number of optical interfaces that can be accommodated in a limited device space or device panel, and unable to meet the current high density of chip interfaces and the need for more high-density optical interfaces.

[0003] However, in a local area network or access network, the central office equipment must meet the high-density interface to achieve the rigid index of reducing the coverage cost. Under the current conditions of monomeric optical modules and optical interfaces, when more users are connected to a central office, only through the stacking of more devices can the demand for high-density interfaces be met, which will inevitably increase the cost of the central office equipment. Summary of the Invention

[0004] The purpose of this application is to provide a multi-channel integrated optoelectronic conversion transceiver device that can meet the demand for high-density interfaces without increasing the cost of the central office equipment.

[0005] A multi-channel integrated optoelectronic conversion transceiver device includes: multi-channel optical transceiver components, a multi-grid integrated base, multi-core optical fibers, a multi-core optical fiber coiling cabin, and a multi-core optical fiber adapter female head, where:

[0006] Each optical transceiver component is provided with a transceiver chip, a multiplexer / demultiplexer, and an optical signal coupler. The transceiver chip, multiplexer / demultiplexer, and optical signal coupler in each optical transceiver component are respectively installed in each grid of the multi-grid integrated base to form a multi-channel integrated optoelectronic conversion transceiver component; the received wavelength optical signal and transmitted wavelength optical signal of the transceiver chip in each optical transceiver component are multiplexed / demultiplexed by the multiplexer / demultiplexer and then coupled into one core of the multi-core optical fiber through the optical signal coupler to complete the transmission of the received wavelength optical signal and transmitted wavelength optical signal;

[0007] The multi-core fiber optic pigtail fiber coiling chamber is connected to the rear end of the multi-grid integrated base. The multi-core fiber optic pigtail is introduced through the multi-core fiber optic pigtail coiling chamber introduction hole. Then, the multi-core fiber optic pigtail introduced into the multi-core fiber optic pigtail coiling chamber is stripped into single-core fiber optic pigtails. After the optical signals are losslessly coiled in the coiling chamber, they are respectively adapted to the optical transceiver components in each grid through optical signal adapters, and the multi-core fiber optic pigtail led out from the coiling chamber and reserved with a preset length is adapted to the multi-core fiber optic pigtail adapter female head.

[0008] In one embodiment, the multi-core fiber optic pigtail adapter female head is inserted into the adapter seat of the multi-core fiber optic pigtail adapter installed on the chassis panel and docked with the connection male head of the multi-core fiber optic pigtail adapter outside the chassis to complete the adaptation to the fiber optic terminal outside the chassis and form a high-density fiber optic interface on the chassis panel.

[0009] In one embodiment, the height and width of the multi-core fiber optic pigtail coiling chamber are determined according to the bending diameter of the fiber optic pigtail for lossless coiling in the coiling chamber to ensure no coiling loss.

[0010] In one embodiment, the bending radius of the single-core fiber optic pigtail in the coiling chamber is greater than or equal to 10 mm.

[0011] In one embodiment, the introduction hole of the multi-core fiber optic pigtail coiling chamber is provided with an outlet bayonet, and the multi-core fiber optic pigtail is snapped into the introduction hole of the multi-core fiber optic pigtail coiling chamber through the outlet bayonet.

[0012] In one embodiment, the wavelengths of the received signal wavelength optical signals of the optical transceiver components in the multi-channel optical transceiver components are equal, the wavelengths of the transmitted signal wavelength optical signals of the optical transceiver components in the multi-channel optical transceiver components are equal, the wavelength of the received signal wavelength optical signal is 1310 nm, and the wavelength of the transmitted signal wavelength optical signal is 1490 nm.

[0013] In one embodiment, the packaging forms include: B-type packaging and S-type packaging. Among them, the B-type packaging follows the mechanical characteristics and electrical performance requirements of the BOSA optical transceiver module, and the S-type packaging follows the mechanical characteristics and electrical performance requirements of the SFP and SFF optical transceiver modules.

[0014] In one embodiment, the number of channels of the multi-channel optical transceiver components includes one of the following: 12 channels, 16 channels, 24 channels, 32 channels, 48 channels, and 64 channels. The rate of the multi-channel optical transceiver components includes: gigabit rate or 10-gigabit rate.

[0015] In one embodiment, the transceiver die includes: a transmitting die and a receiving die in a vertically arranged state; the multiplexer includes: a 0-degree filter holder, a 0-degree wave plate, and a 45-degree wave plate.

[0016] In the above example, a multi-channel integrated optoelectronic conversion transceiver device is provided, including: a multi-channel optical transceiver component, a multi-grid integrated base, a multi-core fiber optic cable, a multi-core fiber optic cable fiber winding compartment, and a multi-core fiber optic cable connecting female head, where: each optical transceiver component is provided with a transceiver chip, a multiplexer / demultiplexer, and an optical signal coupler. The transceiver chip, multiplexer / demultiplexer, and optical signal coupler in each optical transceiver component are respectively installed in each grid of the multi-grid integrated base to form a multi-channel integrated optoelectronic conversion transceiver component; the received wavelength optical signal and the transmitted wavelength optical signal of the transceiver chip in each optical transceiver component are multiplexed / demultiplexed by the multiplexer / demultiplexer and then coupled to one core of the multi-core fiber optic cable through the optical signal coupler to complete the transmission of the received wavelength optical signal and the transmitted wavelength optical signal. Through the above solution, the technical problem that when more users are connected to a central office in the existing technology, the demand for high-density interfaces can only be met by stacking more devices, resulting in an increase in the cost of central office equipment, is solved, and the technical effect of meeting the demand for high-density interfaces without increasing the cost of central office equipment is achieved. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the following will briefly introduce the drawings required for the description of the embodiments or the prior art. Obviously, the drawings in the following description are only some embodiments recorded in the present application. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.

[0018] Figure 1 It is a schematic diagram of a high-density fiber optic interface multi-channel integrated optoelectronic conversion transceiver device provided by the present application;

[0019] Figure 2 It is a schematic diagram of the components in each grid of the B-type multi-channel integrated optoelectronic conversion transceiver device provided by the present application;

[0020] Figure 3 It is a multi-channel grid schematic diagram of the B-type multi-channel integrated optoelectronic conversion transceiver device provided by the present application;

[0021] Figure 4 It is a schematic diagram of a multi-channel integrated module of the B-type packaged multi-channel integrated optoelectronic conversion transceiver device provided by the present application;

[0022] Figure 5 It is a schematic diagram of the B-type multi-channel integrated optoelectronic conversion transceiver device with an additional fiber winding compartment provided by the present application;

[0023] Figure 6 It is a schematic diagram of the adapter and multi-core fiber optic cable of the multi-channel integrated optoelectronic conversion transceiver device provided by the present application;

[0024] Figure 7It is a schematic diagram of the B-type multi-channel integrated optoelectronic conversion transceiver device provided by this application adapting to multi-core optical fibers;

[0025] Figure 8 It is a schematic diagram of the 2*B-type multi-channel integrated optoelectronic conversion transceiver device provided by this application;

[0026] Figure 9 It is a schematic diagram of the S-type packaged multi-channel integrated optoelectronic conversion transceiver device provided by this application;

[0027] Figure 10 It is a schematic diagram of the electrical principle of the optoelectronic conversion module in each grid of the multi-channel integrated module provided by this application;

[0028] Figure 11 It is a schematic diagram of the transceiver die and PCBA in each grid of the S-type package provided by this application;

[0029] Figure 12 It is a schematic diagram of the multi-channel grid of the S-type multi-channel integrated optoelectronic conversion transceiver device provided by this application;

[0030] Figure 13 It is a schematic diagram of the multi-channel module of the S-type multi-channel integrated optoelectronic conversion transceiver device provided by this application;

[0031] Figure 14 It is a schematic diagram of the S-type multi-channel integrated optoelectronic conversion transceiver device with a fiber coiling chamber added provided by this application;

[0032] Figure 15 It is a schematic diagram of the adapter and multi-core optical fiber of the S-type packaged multi-channel integrated optoelectronic conversion transceiver device provided by this application;

[0033] Figure 16 It is a schematic diagram of the installation adapter and multi-core optical fiber of the type packaged multi-channel integrated optoelectronic conversion transceiver device provided by this application;

[0034] Figure 17 It is a schematic diagram of the S-type packaged 2*n-channel multi-channel integrated optoelectronic conversion transceiver device provided by this application. Detailed implementation manners

[0035] In order to enable those skilled in the art to better understand the technical solutions in this application, the following will clearly and completely describe the technical solutions in the embodiments of this application with reference to the accompanying drawings in the embodiments of this application. Obviously, the described embodiments are only a part of the embodiments of this application, rather than all of the embodiments. Based on the embodiments in this application, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of this application.

[0036] In order to overcome the problem that the existing single-piece optical module occupies a large space on the circuit board and the panel and cannot achieve a high-density optical interface for a single device, in this example, a multi-channel integrated optoelectronic conversion transceiver device is provided, including: a multi-channel integrated optoelectronic conversion transceiver component, a multi-core fiber optic cable, and a multi-core fiber optic cable adapter. This device can not only meet all the electrical performance of the existing single-piece optoelectronic conversion transceiver component, but also reduce the overall physical size of the optical transceiver component through the integrated multi-channel component integration process, and combined with the multi-core fiber optic cable adapter, improve the density of the optical interfaces on the device. Compared with the existing single-piece component and the optical interface adapter on the panel, the number of optical interfaces on the device panel with the same area can be increased to more than 10 times, thus effectively solving the problem that the chip interface density is extremely high, but the physical interface density of the device does not match it, so that the optical interfaces of a single device or a split device can reach an optical interface level including but not limited to 48, 64, 96, 128, 192, 256, 384, 512, 768 channels.

[0037] Specifically, in this example, a multi-channel integrated optoelectronic conversion transceiver device is provided, which is applied to the relay device of multi-channel optical fiber signals in the optical fiber network and the access network central office device to realize the optoelectronic conversion, relay, and transmission of multi-channel transmission signals. As Figure 1 shown, the multi-channel integrated optoelectronic conversion transceiver device may include: an integrated multi-channel signal optoelectronic conversion transceiver component 1, a multi-core fiber optic cable 11, a multi-core fiber optic cable adapter 13, and a multi-core fiber optic cable fiber winding cabin upper cover 9.

[0038] Each channel of the multi-channel integrated optoelectronic conversion device has a transceiver die, a multiplexer / demultiplexer (2, 3, 4, and 5), an optical signal coupler, and a fiber optic cable 7. The received signal wavelength optical signal and the transmitted signal wavelength optical signal in each channel are multiplexed / demultiplexed by the multiplexer / demultiplexer and then coupled to one core of the multi-core fiber optic cable 11 through the coupler to complete the transmission of the received and transmitted optical signals in this channel. A multi-core fiber optic cable fiber winding cabin 8 is provided at the rear end of the multi-channel integrated optoelectronic conversion transceiver device. After the multi-core fiber optic cable 11 is introduced into the fiber winding cabin through the inlet of the fiber winding cabin 8, it is separated and orderly wound and then adapted to the coupler of each channel of the optical signal of the multi-channel integrated optoelectronic conversion transceiver device. The other end of the multi-core fiber optic cable is encapsulated into the multi-core fiber optic cable adapter connection female head 12 after leaving a certain length outside the fiber winding cabin 8 to form a multi-channel integrated optoelectronic conversion device. The transceiver rate of the multi-channel integrated optoelectronic conversion transceiver device can support 1GE, 10GE or higher, and the transceiver rate can be a symmetric or asymmetric rate. For example: the received optical signal wavelength is 1310nm wavelength, and the transmitted optical signal wavelength is 1490nm wavelength. However, it should be noted that the wavelength values given in this example are only an exemplary description, and other numerical wavelengths can be selected when implementing.

[0039] In this example, an integrated design is carried out for the multi-channel optical fiber transceiver module, which is organically combined with multi-core optical fibers and multi-core optical fiber adapters to form a high-density optical fiber interface multi-channel integrated optoelectronic conversion transceiver device, thus solving the problem that the existing single-type optical transceiver module occupies a large space in the device while the optical interface density of the device is not high enough. After using the multi-channel integrated optoelectronic conversion transceiver device provided in this example, compared with the existing single optical interface device, the optical interface density on the device panel can be increased by more than 10 times in the chassis panel with the same panel area. On the chassis panel of a single device that can currently accommodate 24 or 48 optical fiber interfaces, it can achieve an order of magnitude of optical interfaces including but not limited to 32, 48, 64, 96, 128, 192, 256, 384, 512, 768, thus solving the problem that the existing chip interface density is high but the physical interface density of the device does not match it.

[0040] That is, in this example, a multi-channel integrated optoelectronic conversion transceiver device is provided. In each grid of the integrated multi-grid base, optoelectronic conversion transceiver die, wavelength division multiplexer / demultiplexer, optical coupler, related transceiver control chips and optical fibers are respectively installed. The optoelectronic conversion transceiver die, wavelength division multiplexer / demultiplexer, optical coupler, related transceiver control chips and adapters in each grid can be divided into two packaging formats: B-type packaging and S-type packaging. The B-type packaging follows the mechanical characteristics and electrical performance requirements of the BOSA (Bidirectional Optical Assembly) optical transceiver module, and the S-type packaging follows the mechanical characteristics and electrical performance standard requirements of the SFP and SFF (Small Form Factor) optical transceiver modules, so as to meet the docking and transmission characteristics of the general BOSA optical transceiver modules, SFP and SFF optical transceiver modules in the market.

[0041] Among them, the optical fibers adapted by each optical signal coupler in the multi-channel integrated optoelectronic conversion transceiver module are orderly coiled in the coiling chamber at the rear end of the integrated base and converge into multi-core optical fibers. The multi-core optical fibers are fixedly led out through the lead-out holes, and after reserving an appropriate length, they are packaged into the connecting female head of the multi-core optical fiber adapter to form a high-density optical fiber interface multi-channel integrated optoelectronic conversion transceiver device. The multi-core optical fibers led out from the coiling chamber of the multi-channel integrated optoelectronic conversion transceiver device, the connecting female head of the multi-core optical fiber adapted to it, the multi-core optical fiber adapter seat on the chassis panel and the connecting male head of the multi-core optical fiber outside the chassis are composed, thus realizing the organic combination of the multi-core optical fiber and the multi-core optical fiber adapter with the multi-channel integrated optoelectronic conversion transceiver device.

[0042] The multi-core fiber optic pigtails are led out from the fiber optic cable storage compartment of the above-mentioned multi-channel integrated optoelectronic conversion transceiver device, rather than the single-core fiber optic pigtails led out from each transceiver component. As a result, there are no messy multi-core single-core fiber optic pigtails wound around on the printed circuit board in the chassis, making it easy to meet the requirement of soldering multiple multi-channel integrated optoelectronic conversion transceiver devices on the printed circuit board. Further, the multi-core fiber optic pigtails led out from the fiber optic cable storage compartment of the multi-channel integrated optoelectronic conversion transceiver device are adapted to the multi-core fiber optic pigtail connection female head, and are docked with the multi-core fiber optic pigtail connection male head outside the chassis through the multi-core fiber optic pigtail adapter on the chassis panel. The multi-core fiber optic pigtail adapter replaces the LC and SC single-core fiber optic pigtail adapter interfaces on the panel of the existing device. Therefore, when N multi-channel integrated optoelectronic conversion transceiver devices can be soldered on the printed circuit board in the chassis, N multi-core fiber optic pigtail adapter seats can be configured on the chassis panel.

[0043] When the number of channels of 1 / N multi-channel integrated optoelectronic conversion transceiver devices is equal to n, the optical interfaces on the chassis panel can be N*n optical interfaces. Among them, the number of channels n of the multi-channel integrated optoelectronic conversion transceiver device can be divided into two series: 12, 24, 48 channels and 16, 32, 64 channels, which can adapt to the docking of different numbers of physical interface chips. In this way, it can be configured on the chassis panel with N*1-core LC and SC interfaces, and can achieve the fiber optic adaptation ability of N*n cores, enabling the optical interfaces of a single device to reach two series of multi-channel optical interfaces such as 48, 96, 192, 384 channels and 64, 128, 256, 512, 768 channels. The transmission rate of the above-mentioned multi-channel integrated optoelectronic conversion transceiver device can include but is not limited to: gigabit rate or ten-gigabit rate, so as to be able to adapt to the high-speed multi-interface chips in the device and provide high-density high-speed optical interfaces for the device. The multi-channel integrated optoelectronic conversion transceiver device can be surface-mounted on the printed circuit board to realize the production process of the pick-and-place machine, thereby reducing the production process cost.

[0044] The above-mentioned multi-channel integrated optoelectronic conversion transceiver device will be described below in conjunction with a specific embodiment. It should be noted that this specific embodiment is only for better explaining the present application and does not constitute an improper limitation to the present application.

[0045] In this example, multiple single-piece optical transceiver component bases are designed into a multi-channel integrated optical transceiver component base grid. The transceiver die, 0-degree filter holder, 0-degree wave plate, receiving die, 45-degree wave plate, transition ring, related transceiver drivers, control chips, and fiber optic adapters of each channel are respectively installed into each grid of the integrated base grid to form a multi-channel integrated optoelectronic conversion transceiver component. A multi-channel pigtail optical signal lossless fiber coiling chamber is provided at the rear end of the multi-grid integrated base. Multi-core pigtails are introduced through the fiber coiling chamber inlet. After the multi-core pigtails introduced into the fiber coiling chamber are stripped into single-core pigtails, they are losslessly coiled in the fiber coiling chamber and then respectively adapted to the fiber optic transceiver components in each grid. At the same time, the other ends of the multi-core pigtails introduced into the fiber coiling chamber are reserved with the required length outside the fiber coiling chamber and adapted to the multi-core pigtail adapter connection female head to form a multi-channel integrated optoelectronic conversion transceiver device. In practical applications, the transceiver pins of the multi-channel integrated optoelectronic conversion transceiver device can be soldered to a printed circuit board. Its multi-core pigtail female head is inserted into the multi-core pigtail adapter adapter socket installed on the chassis panel and docked with the multi-core pigtail adapter connection male head outside the chassis to complete the adaptation to the fiber optic terminal outside the chassis, forming a high-density fiber optic interface on the chassis panel, thus solving the problem of the high-density interface that cannot be achieved by the existing BOSA type, SFF type, or SFP optical module plus LC, SC fiber optic adapter interfaces.

[0046] The above multi-channel integrated optoelectronic conversion transceiver device can adopt a B-type packaging scheme or an S-type packaging scheme. The B-type packaging follows the mechanical and electrical performance requirements of the BOSA optical transceiver module, and the S-type packaging follows the mechanical and electrical performance standard requirements of the SFP and SFF optical transceiver modules, so as to fully meet the docking and transmission characteristics with the general BOSA optical transceiver modules, SFP, and SFF optical transceiver modules on the market. For the multi-channel integrated optoelectronic conversion transceiver device with the B-type packaging and S-type packaging schemes, compared with the number of optical interfaces of the BOSA type, SFF type, or SFP optical module plus LC, SC fiber optic adapter, the number of optical interfaces on the chassis panel of the same area chassis can be increased by more than 10 times. The optical interfaces of a single device can reach 48, 64, 96, 128, 192, 256, 384, 512 to 768 optical interfaces.

[0047] That is, in this example, a multi-channel integrated optoelectronic conversion transceiver device with a high-density fiber optic interface is provided to solve the problem of the low fiber optic interface density of the local area network and access network central office equipment. The multi-channel integrated optoelectronic conversion transceiver device adopts a B-type packaging and an S-type packaging scheme. The B-type packaging follows the mechanical and electrical performance requirements of the BOSA optical transceiver module, and the S-type packaging follows the mechanical and electrical performance standard requirements of the SFP and SFF optical transceiver modules, so as to meet the docking and transmission characteristics with the general BOSA optical transceiver modules, SFP, and SFF optical transceiver modules. Specifically:

[0048] 1) Multi-channel integrated optoelectronic conversion transceiver device of type B:

[0049] As Figure 3 shown, the multi-channel integrated optoelectronic conversion transceiver device of type B may include a plurality of multi-channel integrated grid bases 16 for installing optoelectronic conversion transceiver components as Figure 2 shown, and optoelectronic conversion transceiver die (2, 3, 4, and 5), wavelength division multiplexing / demultiplexing filters (20, 21, 22, 23, and 24) as Figure 2 shown are installed in each grid to form a multi-channel integrated optoelectronic conversion transceiver module 1 as Figure 4 shown. Among them, in Figure 2 , 17 represents the transmitting die mounting hole, 18 represents the receiving die mounting hole, 19 represents the adapter mounting hole, 2 represents the transmitting die, 3 represents the lead-out pin of the transmitting die, 4 represents the receiving die, 5 represents the lead-out pin of the receiving die, 20 represents the 0-degree filter, 21 represents the 0-degree filter mounting base, 22 represents the sealing gasket, 23 represents the 45-degree demultiplexing filter, and 24 represents the transition ring.

[0050] As Figure 5 shown, a multi-channel pigtail fiber coiling chamber 8 may be provided at the rear end of the multi-channel integrated optoelectronic conversion transceiver module 1 as Figure 4 shown. After a multi-core pigtail fiber as Figure 6 shown is introduced into the coiling chamber through the pigtail fiber coiling chamber inlet hole 25, it is separated into single pigtail fibers 7. After the pigtail fibers are fixed in the coiling chamber with a bending radius of not less than 10 mm, the lead-out pigtail fibers 7 of the optical signal adapter 6 after the wavelength division multiplexing / demultiplexing filter in each grid are formed, and the multi-core pigtail fiber 11 led out of the coiling chamber 8 is snapped into the inlet hole 25 through the multi-core pigtail fiber lead-out bayonet 10 to form a multi-channel integrated optoelectronic conversion transceiver device as Figure 7 shown. As Figure 8 shown is a schematic diagram of a 2* type B multi-channel integrated optoelectronic conversion transceiver device, that is, two coiling chambers are connected to a multi-core pigtail fiber adapter connection female head 12.

[0051] As Figure 9 shown, a multi-core pigtail fiber adapter connection female head 12 may be configured at the head end of the multi-core pigtail fiber 11 reserved outside the coiling chamber (inside the cabinet). As Figure 1 shown, a multi-core pigtail fiber adapter mating seat 13 is installed on the chassis panel to facilitate the docking of the multi-core pigtail fiber adapter connection female head 12 inside the chassis and the multi-core pigtail fiber adapter connection male head 14 outside the chassis, and the multi-core pigtail fiber 15 (outside the cabinet) is led out from the multi-core pigtail fiber adapter connection male head 14.

[0052] 2) Multi-channel integrated optoelectronic conversion transceiver device of type S:

[0053] AsFigure 10 As shown, it is the electrical principle block diagram of the optoelectronic conversion module in each grid of the S-type packaged multi-channel integrated module. The optoelectronic conversion module in each grid may include pins: VCCT, TD+, TD-, VEET, monitoring control signal I / O, VCCR, RD+, RD-, VEER, and modules: buffer, LD driver, temperature compensation circuit, optical power automatic control circuit, PD, LD, MCU monitoring control circuit, buffer, limiting amplifier, low-pass filter, preamplifier. A laser shutdown control signal is transmitted between the MCU monitoring control circuit and the optical power automatic control circuit.

[0054] As Figure 11 shown, it is the multi-channel integrated grid base of the S-type packaged optoelectronic conversion transceiver component. As Figure 12 shown, optoelectronic conversion transceiver die (2, 3, 4, and 5), wavelength division multiplexer / demultiplexer (27, 30, 31, and 32), and adapter mounting holes 29 are installed in each grid as Figure 11 shown to form the multi-channel integrated optoelectronic conversion transceiver module 26 as Figure 13 shown.

[0055] As Figure 14 shown, a multi-channel pigtail fiber coiling chamber 8 is provided at the rear end of the multi-channel integrated optoelectronic conversion transceiver module 26. After the multi-core pigtail fiber as Figure 15 shown is introduced into the coiling chamber through the pigtail fiber coiling chamber inlet hole 25, it is separated into single-channel pigtail fibers 7. After the pigtail fibers are fixed with a bending radius of not less than 10 mm in the coiling chamber, the lead-out pigtail fibers 7 of the optical signal adapter 28 after the wavelength division multiplexer / demultiplexer in each grid are formed. The multi-core pigtail fiber 11 led out of the coiling chamber 8 is snapped into the inlet hole 25 through the multi-core pigtail fiber lead-out bayonet 10 to form the multi-channel integrated optoelectronic conversion transceiver device as Figure 16 shown. As Figure 17 shown is the schematic diagram of the S-type packaged 2*n-channel multi-channel integrated optoelectronic conversion transceiver device. As Figure 17 shown, at the head end of the multi-core pigtail fiber 11 reserved outside the coiling chamber, a multi-core pigtail fiber adapter connection female head 12 is configured, and a multi-core pigtail fiber adapter mating seat 13 is installed on the chassis panel to dock with the multi-core pigtail fiber adapter connection female head 12 inside the chassis and the multi-core pigtail fiber adapter connection male head 14 outside the chassis.

[0056] In the above multi-channel integrated optoelectronic conversion transceiver device, the optical transceiver wavelengths of each channel are equal, and may include but are not limited to a 1310 nm light receiving wavelength and a 1490 nm transmitting wavelength.

[0057] In the above example, by using the high-density multi-fiber interface multi-channel optoelectronic conversion transceiver device, the number of optical interfaces on the chassis panel of the same area can be increased by more than 10 times compared with the SC, LC interfaces or pluggable optical modules, effectively solving the problem that the existing chip interface density is high while the physical interface density of the device does not match it. As a result, the number of optical interfaces of a single device can reach the order of 48, 64, 96, 128, 192, 256, 384, 512, 768 optical interfaces, solving the problem that in the local area network or the access network end, when more users are connected to a single end, only the stacking of more devices can be used to meet the demand for high-density interfaces, thus greatly saving the investment cost of the end devices.

[0058] The multi-channel integrated optoelectronic conversion transceiver device provided in this example can be used as the optoelectronic conversion transceiver module in the device, with an optical-to-electric conversion and receiving circuit in the receiving direction and a driving circuit and an electric-to-optical device in the transmitting direction. Through this multi-channel integrated optoelectronic conversion transceiver device, the optical signal with a specified receiving wavelength and carrying data information transmitted by the optical fiber can be converted into an electrical signal through the optical-to-electric conversion function of the device, and after passing through the receiving shaping and amplifying circuit of the electrical signal, it is input to the corresponding receiving circuit of the device; similarly, for the data electrical signal that the device needs to transmit, it is sent to the electro-optical conversion module through the transmitting circuit of this device and converted into an optical signal with a specified transmitting wavelength and sent out. That is, through this multi-channel integrated optoelectronic conversion transceiver device, the single-piece optical module can be integrated into a multi-channel integrated optical module, and an integrated design is carried out using multi-core optical fibers and multi-core optical fiber adapters, solving the problem that the existing single-piece optical transceiver component occupies a large space in the device while the optical interface density of the device is not high enough.

[0059] In the embodiment of the present application, a multi-channel integrated optoelectronic conversion transceiver device is provided, which can meet the demand for high-density interfaces without increasing the cost of the end devices. Specifically, the multi-channel integrated optoelectronic conversion transceiver device may include: multi-channel optical transceiver components, a multi-channel integrated base grid, and multi-core optical fibers, where:

[0060] Each channel of the optical transceiver component is provided with a transceiver die, a multiplexer, and an optical signal coupler. The transceiver die, multiplexer, and optical signal coupler in each channel of the optical transceiver component are respectively installed in each grid of the multi-grid integrated base to form a multi-channel integrated optoelectronic conversion transceiver component; the received wavelength optical signal and the transmitted wavelength optical signal of the transceiver die in each channel of the optical transceiver component, after being multiplexed by the multiplexer, are coupled into one core of the multi-core optical fiber through the optical signal coupler to complete the transmission of the received wavelength optical signal and the transmitted wavelength optical signal.

[0061] In one embodiment, to prevent the pigtails from being messy, the above-mentioned multi-channel integrated optoelectronic conversion transceiver device may further include: a multi-core pigtail fiber optic cable storage compartment. The multi-core pigtail introduced through the multi-core pigtail fiber optic cable storage compartment inlet is stripped into single-core pigtails in the multi-core pigtail fiber optic cable storage compartment. After the optical signals are losslessly wound in the fiber optic cable storage compartment, they are respectively adapted to the optical transceiver components in each grid through optical signal adapters.

[0062] Further, to achieve adaptation and connection to the optical fiber outside the chassis, the above-mentioned multi-channel integrated optoelectronic conversion transceiver device further includes: a connection female head of a multi-core pigtail adapter. The other end of the multi-core pigtail introduced into the multi-core pigtail fiber optic cable storage compartment is reserved with a preset length outside the fiber optic cable storage compartment and then adapted to the connection female head. Among them, the connection female head of the multi-core pigtail adapter is used to be inserted into the adapter socket of the multi-core pigtail adapter installed on the chassis panel and dock with the connection male head of the multi-core pigtail adapter outside the chassis to complete the adaptation to the fiber optic terminal outside the chassis and form a high-density fiber optic interface on the chassis panel.

[0063] When packaging the above-mentioned multi-channel integrated optoelectronic conversion transceiver device, the packaging forms that can be adopted include: B-type packaging and S-type packaging. Among them, the B-type packaging follows the mechanical characteristics and electrical performance requirements of the BOSA optical transceiver module, and the S-type packaging follows the mechanical characteristics and electrical performance requirements of the SFP and SFF optical transceiver modules.

[0064] Each embodiment in this specification is described in a progressive manner. The same or similar parts among the embodiments can be referred to each other, and the key points of each embodiment are the differences from other embodiments. In particular, for the hardware + program type embodiments, since they are basically similar to the method embodiments, the description is relatively simple, and the relevant parts can be referred to the partial description of the method embodiments.

[0065] The above describes specific embodiments of this specification. Other embodiments are within the scope of the appended claims. In some cases, the actions or steps recorded in the claims can be executed in a different order from that in the embodiments and still achieve the desired results. In addition, the processes depicted in the drawings do not necessarily require the specific order or continuous order shown to achieve the desired results. In certain embodiments, multi-tasking and parallel processing are also possible or may be advantageous.

[0066] Although the present application provides method operation steps as described in the embodiments or flowcharts, more or fewer operation steps may be included based on routine or non-creative labor. The step sequences listed in the embodiments are only one way among numerous step execution sequences and do not represent the only execution sequence. When the actual device or client product is executed, it may be executed in the method sequence shown in the embodiments or the drawings or executed in parallel (e.g., in an environment of parallel processors or multi-threaded processing).

[0067] For the convenience of description, when describing the above device, it is divided into various modules according to functions for separate description. Of course, when implementing the embodiments of this specification, the functions of each module can be implemented in the same or multiple software and / or hardware, or the modules implementing the same function can be realized by a combination of multiple sub-modules or sub-units, etc. The device embodiments described above are only illustrative. For example, the division of the units is only a logical function division, and there may be other division methods in actual implementation. For example, multiple units or components can be combined or integrated into another system, or some features can be ignored or not executed. Another point is that the displayed or discussed coupling or direct coupling or communication connection to each other can be through some interfaces, and the indirect coupling or communication connection of the device or unit can be in electrical, mechanical or other forms.

[0068] Those skilled in the art also know that in addition to implementing the controller in the form of pure computer-readable program code, the method steps can be logically programmed to enable the controller to be implemented in the form of logic gates, switches, application-specific integrated circuits, programmable logic controllers, embedded microcontrollers, etc. to achieve the same function. Therefore, such a controller can be regarded as a hardware component, and the devices included therein for implementing various functions can also be regarded as the structures within the hardware component. Or even, the devices for implementing various functions can be regarded as both software modules for implementing the method and the structures within the hardware component.

[0069] This application is described with reference to the flowcharts and / or block diagrams of methods, devices (systems), and computer program products according to the embodiments of this application. It should be understood that each flow and / or block in the flowchart and / or block diagram can be implemented by computer program instructions, as well as the combination of flows and / or blocks in the flowchart and / or block diagram. These computer program instructions can be provided to the processor of a general-purpose computer, a special-purpose computer, an embedded processor, or other programmable data processing devices to generate a machine, so that the instructions executed by the processor of the computer or other programmable data processing devices generate a device for implementing the functions specified in Figure 1 one flow or multiple flows and / or blocks Figure 1 one block or multiple blocks.

[0070] Embodiments of this specification can be described in the general context of computer-executable instructions executed by a computer, such as program modules. Generally, program modules include routines, programs, objects, components, data structures, etc. that perform specific tasks or implement specific abstract data types. Embodiments of this specification can also be practiced in a distributed computing environment where tasks are performed by remote processing devices connected through a communication network. In a distributed computing environment, program modules can be located in local and remote computer storage media including storage devices.

[0071] The embodiments in this specification are all described in a progressive manner. For the same or similar parts among the embodiments, reference can be made to each other. Each embodiment focuses on the differences from other embodiments. In particular, for system embodiments, since they are basically similar to method embodiments, the description is relatively simple, and the relevant parts can refer to the description of the method embodiments. In the description of this specification, the description with reference to terms such as "one embodiment", "some embodiments", "example", "specific example", or "some examples" means that the specific features, structures, materials, or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the embodiments of this specification. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described can be combined in a suitable manner in any one or more embodiments or examples. In addition, without contradiction, those skilled in the art can combine and combine the different embodiments or examples described in this specification and the features of different embodiments or examples.

[0072] The above description is only for the embodiments of this specification and does not limit the embodiments of this specification. For those skilled in the art, various changes and modifications can be made to the embodiments of this specification. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the embodiments of this specification shall be included within the scope of the claims of the embodiments of this specification.

Claims

1. A multi-channel integrated photoelectric conversion transceiver, characterized in that: include: Multi-channel optical transceiver components, multi-grid integrated base, multi-core pigtails, multi-core pigtail trays and multi-core pigtail adapter female heads, including: Each optical transceiver assembly is provided with a transceiver tube core, a combiner / demultiplexer and an optical signal coupler. The transceiver tube core, the combiner / demultiplexer and the optical signal coupler in each optical transceiver assembly are respectively installed in each grid of the multi-grid integrated base to form a multi-channel integrated photoelectric conversion transceiver assembly; the receiving wavelength optical signal and the transmitting wavelength optical signal of the transceiver tube core in each optical transceiver assembly are combined and demultiplexed by the combiner / demultiplexer, and then coupled to one core pigtail of the multi-core pigtail through the optical signal coupler to complete the transmission of the receiving wavelength optical signal and the transmitting wavelength optical signal; A multi-core fiber pigtail cabin is arranged at the rear end of the multi-grid integrated base. The multi-core fiber pigtail introduced through the introduction hole of the multi-core fiber pigtail cabin is stripped into single-core fiber pigtails in the multi-core fiber pigtail cabin and optical signals are losslessly coiled in the cabin. Then, they are adapted to the optical transceiver components in each grid through optical signal adapters respectively, and the multi-core fiber pigtail led out from the cabin and reserved for a preset length is adapted to the multi-core fiber pigtail adapter female head.

2. The multi-channel integrated photoelectric conversion transceiver according to claim 1, characterized in that: The multi-core fiber pigtail adapter female head is inserted into the adapter seat of the multi-core fiber pigtail adapter installed on the chassis panel, and docked with the connecting male head of the multi-core fiber pigtail adapter outside the chassis to complete the adaptation with the optical fiber terminal outside the chassis to form a high-density optical fiber interface on the chassis panel.

3. The multi-channel integrated photoelectric conversion transceiver according to claim 1, characterized in that: The height and width of the multi-core pigtail fiber coiling cabin are determined according to the bending diameter of the pigtail fiber in the coiling cabin without causing any loss of the fiber, so as to ensure that no loss of the fiber coiling is caused.

4. The multi-channel integrated photoelectric conversion transceiver according to claim 3, characterized in that: The bending radius of the single-core pigtail in the fiber coil compartment is greater than or equal to 10 mm.

5. The multi-channel integrated photoelectric conversion transceiver according to claim 1, characterized in that: The introduction hole of the multi-core pigtail fiber winding cabin is provided with a lead-out bayonet, and the multi-core pigtail is inserted into the introduction hole of the multi-core pigtail fiber winding cabin through the lead-out bayonet.

6. The multi-channel integrated photoelectric conversion transceiver according to claim 1, characterized in that: The wavelength of the receiving wavelength optical signal of each optical transceiver component in the multi-channel optical transceiver component is equal, and the wavelength of the transmitting wavelength optical signal of each optical transceiver component in the multi-channel optical transceiver component is equal, the wavelength of the receiving wavelength optical signal is 1310nm, and the wavelength of the transmitting wavelength optical signal is 1490nm.

7. The multi-channel integrated photoelectric conversion transceiver according to claim 1, characterized in that: The packaging forms include: B-type packaging and S-type packaging. Among them, the B-type packaging complies with the mechanical characteristics and electrical performance requirements of the BOSA optical transceiver module, and the S-type packaging complies with the mechanical characteristics and electrical performance requirements of the SFP and SFF optical transceiver modules.

8. The multi-channel integrated photoelectric conversion transceiver according to claim 1, characterized in that: The number of channels of the multi-channel optical transceiver assembly includes one of the following specifications: 12 channels, 16 channels, 24 channels, 32 channels, 48 ​​channels and 64 channels, and the rate of the multi-channel optical transceiver assembly includes: 1 Gigabit rate or 10 Gigabit rate.

9. The multi-channel integrated photoelectric conversion transceiver according to any one of claims 1 to 8, characterized in that: The transceiver tube core comprises: a transmitting tube core and a receiving tube core in a vertical setting state; the combiner / demultiplexer comprises: a 0-degree filter seat, a 0-degree wave plate, and a 45-degree wave plate.

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