Display module

Abstract

The application discloses a display module, comprising a display panel and a circuit board. The display panel comprises an array substrate and a counter substrate arranged oppositely, the array substrate comprises a first glass substrate and a first drive circuit layer arranged on the first glass substrate; the circuit board comprises a second glass substrate and a second drive circuit layer, the second drive circuit layer is arranged on one surface of the second glass substrate; the circuit board is arranged on one surface of the array substrate, and the projection of the second glass substrate on the plane where the first glass substrate is located is located in the first glass substrate, the first drive circuit layer is electrically connected with the second drive circuit layer; the display module has a welding area, in the welding area, the first glass substrate and the second glass substrate are fixedly connected through a laser welding process. Through the above arrangement, the electrical connection between the circuit board and the array substrate can be realized without using a chip on film, the use cost of the chip on film is saved, and the problem that the cost of the liquid crystal display in the prior art is high can be solved.

Description

Technical Field

[0001] This application relates to the field of display technology, and in particular to a display module. Background Technology

[0002] LCD (Liquid Crystal Display) is a widely used display technology. An LCD generally includes a display panel and a circuit board. The display panel includes an array substrate and a color filter substrate arranged opposite each other. The display panel and the circuit board of an LCD are usually electrically connected using COF (Chip On Film).

[0003] Currently, LCD monitors suffer from high costs. Summary of the Invention

[0004] This application mainly provides a display module to solve the problem of high cost of liquid crystal displays in the prior art.

[0005] To solve the above-mentioned technical problems, one technical solution adopted in this application is: to provide a display module, comprising:

[0006] The display panel includes an array substrate and a counter substrate disposed opposite each other; the array substrate includes a first glass substrate and a first driving circuit layer disposed on the first glass substrate.

[0007] The circuit board includes a second glass substrate and a second driving circuit layer, wherein the second driving circuit layer is disposed on a surface of the second glass substrate.

[0008] The circuit board is disposed on one surface of the array substrate, and the projection of the second glass substrate onto the plane of the first glass substrate is located within the first glass substrate.

[0009] The display module has a welding area, in which the first glass substrate and the second glass substrate are fixedly connected by a laser welding process; the first driving circuit layer and the second driving circuit layer are electrically connected.

[0010] In some embodiments, the second glass substrate has opposing first and second surfaces, and a first side surface connecting the first and second surfaces; the second driving circuit layer is disposed on the first surface;

[0011] The second glass substrate is provided with a first through hole, which penetrates the first surface and the second surface; the first through hole is filled with a first conductive paste.

[0012] The second driving circuit layer is electrically connected to the first driving circuit layer through the first conductive paste.

[0013] In some embodiments, the first glass substrate has opposing third and fourth surfaces, the third surface being disposed toward the opposing substrate; the first driving circuit layer is disposed on the third surface;

[0014] In a first direction, the size of the array substrate is larger than the size of the counterpart substrate, and the array substrate includes a bonding region protruding from one side of the counterpart substrate;

[0015] The circuit board is disposed on the third surface and located within the bonding area, and the second surface is disposed facing the third surface.

[0016] In some embodiments, the thickness of the circuit board is the same as the thickness of the opposing substrate; the first side is disposed close to the opposing substrate, and the first through hole is disposed close to the first side.

[0017] The soldering area is located within the bonding area and is disposed along the edge of the bonding area. The soldering area is spaced apart from the first through hole. The first driving circuit layer and the second driving circuit layer are not disposed within the soldering area.

[0018] In some embodiments, the first glass substrate has opposing third and fourth surfaces; the third surface is disposed toward the opposing substrate, and the first driving circuit layer is disposed on the third surface; the circuit board is disposed on the fourth surface, and the second surface is disposed toward the fourth surface;

[0019] The first glass substrate is provided with a second through hole, which penetrates the third surface and the fourth surface, and the second through hole is filled with a second conductive paste;

[0020] The second through hole is aligned with the first through hole, and the first driving circuit layer and the second driving circuit layer are electrically connected sequentially through the second conductive paste and the first conductive paste.

[0021] In some embodiments, the first glass substrate further has a second side surface connecting the third surface and the fourth surface; the first through hole is disposed near the first side surface, and the second through hole is disposed near the second side surface; the first side surface and the second side surface are flush.

[0022] The welding area is disposed along the edge of the second glass substrate and is spaced apart from the first through hole; the second driving circuit layer is not disposed in the welding area.

[0023] In some embodiments, the size of the array substrate is equal to the size of the counterpart substrate.

[0024] In some embodiments, the first glass substrate is provided with a plurality of second through holes, and the second glass substrate is provided with a plurality of first through holes, wherein the plurality of second through holes are provided in a one-to-one correspondence with the plurality of first through holes; and / or,

[0025] The first through hole is prepared using a glass drilling process; and / or, the second through hole is prepared using a glass drilling process.

[0026] In some embodiments, the first glass substrate has opposing third and fourth surfaces, and a second side surface connecting the third and fourth surfaces, the third surface being disposed facing the opposing substrate; the first driving circuit layer is disposed on the third surface and extends to the second side surface;

[0027] The circuit board is disposed on the fourth surface; the second glass substrate has a first surface and a second surface opposite to each other, the second driving circuit layer is disposed on the first surface, and the second surface is disposed facing the fourth surface;

[0028] The display module also includes a flexible circuit board, one end of which is electrically connected to the first driving circuit layer on the second side, and the other end is bent to the side of the circuit board away from the fourth surface and electrically connected to the second driving circuit layer.

[0029] The welding area is disposed along the edge of the second glass substrate and is spaced apart from the flexible circuit board.

[0030] In some embodiments, the second glass substrate is glass residue remaining after cutting a large glass sheet; and / or,

[0031] The display module includes one circuit board, or the display module includes multiple circuit boards spaced apart from each other.

[0032] In some embodiments, when laser welding the first glass substrate and the second glass substrate in the welding area, a laser with an average power of 75W and a long focal length scanning galvanometer with a focal length of 255mm are used; the single pulse energy of the laser is 5-10μJ, and the welding speed is 10-40mm / s; and / or,

[0033] The width of the welding zone is 200-300μm.

[0034] The beneficial effects of this application are as follows: Unlike existing technologies, this application discloses a display module including a display panel and a circuit board. The display panel includes an array substrate and a counter substrate disposed opposite each other. The array substrate includes a first glass substrate and a first driving circuit layer disposed on the first glass substrate. The circuit board includes a second glass substrate and a second driving circuit layer, with the second driving circuit layer disposed on one surface of the second glass substrate. The circuit board is disposed on one surface of the array substrate, and the projection of the second glass substrate onto the plane of the first glass substrate is located within the first glass substrate. The first driving circuit layer and the second driving circuit layer are electrically connected. The display module has a welding area where the first glass substrate and the second glass substrate are fixedly connected by a laser welding process. Through the above arrangement, the circuit board is directly disposed on one surface of the array substrate, and the circuit board is directly fixedly connected to the array substrate using a laser welding process in the welding area. This eliminates the need for a flip-chip film to achieve electrical connection between the circuit board and the array substrate, enabling signal transmission and saving the cost of flip-chip film. This helps solve the problem of high cost in existing liquid crystal displays and also changes the structure of traditional liquid crystal displays. Attached Figure Description

[0035] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort, wherein:

[0036] Figure 1 This is a top view of the display module provided in the first embodiment of this application;

[0037] Figure 2 yes Figure 1 A top view of the display panel of the provided display module;

[0038] Figure 3 yes Figure 1 A schematic diagram of the circuit board structure of the provided display module;

[0039] Figure 4 yes Figure 3 A top view of the provided circuit board.

[0040] Figure 5 yes Figure 1 A schematic diagram of the AA cross-section of the provided display module;

[0041] Figure 6 This is a bottom view of the display module provided in the second embodiment of this application;

[0042] Figure 7 yes Figure 6 A top view diagram of the provided display module structure;

[0043] Figure 8 yes Figure 6 A schematic diagram of the display panel structure of the provided display module from below;

[0044] Figure 9 yes Figure 6 A schematic diagram of the CC cross-section of the provided display module;

[0045] Figure 10 This is a top view of the display module provided in the third embodiment of this application;

[0046] Figure 11 yes Figure 10 A schematic diagram of the display module from below;

[0047] Figure 12 yes Figure 10 A side view of the display panel of the provided display module;

[0048] Figure 13 yes Figure 10 A schematic diagram of the circuit board structure of the provided display module.

[0049] Icon labels:

[0050] Display module 100; display panel 1; array substrate 11; mounting substrate 12; first glass substrate 13; third surface 131; fourth surface 132; second through hole 133; second conductive paste 134; second side surface 135; second contact pad 14; circuit board 2; second glass substrate 21; first surface 211; second surface 212; first side surface 213; first through hole 214; first conductive paste 215; first contact pad 22; flexible circuit board 3; soldering area H; bonding area B. Detailed Implementation

[0051] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of the embodiments. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of this application.

[0052] The terms "first," "second," and "third" used in the embodiments of this application are for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined as "first," "second," or "third" may explicitly or implicitly include at least one of that feature. In the description of this application, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion. For example, a process, method, system, product, or device that includes a series of steps or units is not limited to the listed steps or units, but may optionally include steps or units not listed, or may optionally include other steps or units inherent to these processes, methods, products, or devices.

[0053] In this document, the term "embodiment" means that a particular feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of this application. The appearance of this phrase in various places throughout the specification does not necessarily refer to the same embodiment, nor is it a mutually exclusive, independent, or alternative embodiment. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described herein can be combined with other embodiments.

[0054] See Figures 1 to 5 , Figure 1 This is a top view of the display module provided in the first embodiment of this application. Figure 2 yes Figure 1 A top view of the display panel structure of the provided display module. Figure 3 yes Figure 1 A schematic diagram of the circuit board structure of the provided display module. Figure 4 yes Figure 3 A top view diagram of the provided circuit board structure. Figure 5 yes Figure 1 A schematic diagram of the AA section of the provided display module.

[0055] See Figures 1 to 5 This application provides a display module 100, which includes a display panel 1 and a circuit board 2.

[0056] The display panel 1 includes an array substrate 11 and a counter substrate 12 disposed opposite to each other. A liquid crystal layer (not shown) is disposed between the array substrate 11 and the counter substrate 12. The array substrate 11 and the counter substrate 12 are connected by a sealant (not shown) disposed between the array substrate 11 and the counter substrate 12. Specifically, the array substrate 11 includes a first glass substrate 13 and a first driving circuit layer (not shown) disposed on the first glass substrate 13. The circuit board 2 includes a second glass substrate 21 and a second driving circuit layer (not shown), the second driving circuit layer being disposed on one surface of the second glass substrate 21.

[0057] The circuit board 2 is disposed on one surface of the array substrate 11, and the projection of the second glass substrate 21 of the circuit board 2 onto the plane containing the first glass substrate 13 of the array substrate 11 lies within the first glass substrate 13. For example... Figure 1 As shown, the display module 100 has a welding area H. In the welding area H, the first glass substrate 13 of the array substrate 11 and the second glass substrate 21 of the circuit board 2 are fixedly connected by laser welding process, and the first driving circuit layer and the second driving circuit layer are electrically connected.

[0058] It is understood that in this application, by directly placing the circuit board 2 on one surface of the array substrate 11 and directly using laser welding in the welding area H to fix the circuit board 2 and the array substrate 11 together, the electrical connection between the circuit board 2 and the array substrate 11 can be achieved without using a flip-chip film, thus realizing signal transmission. This saves the cost of using flip-chip film and helps to solve the problem of high cost of liquid crystal displays in the prior art. At the same time, directly using laser welding to connect the circuit board 2 and the array substrate 11 also changes the structure of the traditional liquid crystal display, realizing the diversity of the display module 100 structure. Furthermore, the projection of the second glass substrate 21 of the circuit board 2 onto the plane of the first glass substrate 13 of the array substrate 11 is located within the first glass substrate 13, which also helps to realize a narrow bezel design.

[0059] For details, see Figure 1 , Figure 3 and Figure 4 The second glass substrate 21 of the circuit board 2 has a first surface 211 and a second surface 212 facing each other, and a first side surface 213 connecting the first surface 211 and the second surface 212. The second driving circuit layer is disposed on the first surface 211. In one specific embodiment, the first surface 211 and the second surface 212 are disposed opposite each other along the thickness direction of the display module 100.

[0060] In some implementations, such as Figure 3 , Figure 4 and Figure 5As shown, the second glass substrate 21 is provided with a first through hole 214, which penetrates the first surface 211 and the second surface 212. The first through hole 214 is filled with a first conductive paste 215. The second driving circuit layer of the circuit board 2 is electrically connected to the first driving circuit layer of the array substrate 11 through the first conductive paste 215 in the first through hole 214.

[0061] Specifically, the position of the first through hole 214 is aligned with the signal transmission position of the first driving circuit layer of the array substrate 11. One end of the first conductive paste 215 extends to the first surface 211 and is electrically connected to the second driving circuit layer disposed on the first surface 211. The other end extends to the second surface 212 and is electrically connected to the first driving circuit layer of the array substrate 11 to facilitate signal transmission.

[0062] In some embodiments, the second glass substrate 21 is provided with a plurality of first through holes 214, which are spaced apart from each other. The first through holes 214 are prepared using a glass drilling process, and the first conductive paste 215 is formed by pouring paste into the first through holes 214. In a specific embodiment, such as Figure 5 As shown, the first through hole 214 is a straight through hole, and multiple first through holes 214 are disposed near the first side surface 213 of the second glass substrate 21 and spaced apart from each other. In other embodiments, the first through hole 214 can also be configured as an angled hole, wedge hole, or any other shape, as long as the first through hole 214 penetrates the first surface 211 and the second surface 212, so that the first conductive paste 215 filled in the first through hole 214 can conduct signals between the first driving circuit layer and the second driving circuit layer.

[0063] See Figure 1 and Figure 2 The first glass substrate 13 of the array substrate 11 has a third surface 131 and a fourth surface 132. Specifically, the third surface 131 and the fourth surface 132 are disposed opposite each other along the thickness direction of the display module 100. The third surface 131 is disposed facing the opposing substrate 12. The first driving circuit layer of the array substrate 11 is disposed on the third surface 131.

[0064] In this embodiment, see Figure 1 , Figure 2 and Figure 5 In the first direction, the size of the array substrate 11 is larger than that of the opposing substrate 12. The array substrate 11 includes a bonding region B protruding from one side of the opposing substrate 12. The circuit board 2 is disposed on the third surface 131 and located within the bonding region B. The second surface 212 is disposed facing the third surface 131. That is, the first surface 211 of the second glass substrate 21 of the circuit board 2, on which the second driving circuit layer is disposed, is disposed away from the array substrate 11.

[0065] Specifically, the array substrate 11, the counter substrate 12, and the circuit board 2 are all rectangular. In the circumferential direction of the display module 100, only one side of the array substrate 11 protrudes from the counter substrate 12, while the other three sides are basically aligned with the counter substrate 12, so that the display module 100 has a border on only one side.

[0066] It is understood that in this embodiment, by directly placing the circuit board 2 on the third surface 131 of the first glass substrate 13 of the array substrate 11 and within the bonding area B, after the circuit board 2 and the array substrate 11 are aligned with a reference, the first conductive paste 215 can be aligned and contacted with the signal transmission position of the first driving circuit layer of the array substrate 11. The circuit board 2 is then welded and fixed to the third surface 131 of the array substrate 11 using a laser welding process. This allows for a stable electrical connection between the first driving circuit layer of the array substrate 11 and the second driving circuit layer of the circuit board 2 directly through the first conductive paste 215. This avoids the need to use a flip-chip film to electrically connect the circuit board 2 and the array substrate 11, saving the cost of flip-chip film. Furthermore, the direct laser welding of the circuit board 2 to the third surface 131 of the array substrate 11 and within the bonding area B changes the traditional structure of the liquid crystal display, enabling greater diversity in the structure of the display module 100. At the same time, placing the circuit board 2 within the bonding area B, compared to placing part of the circuit board 2 outside the display panel 1, is more conducive to reducing the bezel size of the display module 100 and achieving a narrow bezel design.

[0067] In some implementations, such as Figure 5 As shown, the first surface 211 of the second glass substrate 21 of the circuit board 2 can also be provided with a first contact pad 22. The second driving circuit layer can be electrically connected to the first contact pad 22. One end of the first conductive paste 215 filled in the first through hole 214 can be directly electrically connected to the first contact pad 22 of the first surface 211, thereby achieving electrical connection with the second driving circuit layer. Similarly, the third surface 131 of the first glass substrate 13 of the array substrate 11 can also be provided with a second contact pad 14. The second contact pad 14 is disposed in the bonding area B. The first driving circuit layer can be electrically connected to the second contact pad 14 on the third surface 131, and then electrically connected to the other end of the first conductive paste 215 filled in the first through hole 214, thereby achieving electrical connection between the first driving circuit layer and the second driving circuit layer.

[0068] In some embodiments, in addition to the second driving circuit layer, the first surface 211 of the second glass substrate 21 of the circuit board 2 may also be bonded with other components. The second surface 212 of the second glass substrate 21 is disposed facing the third surface 131, and the first surface 211 is disposed away from the array substrate 11. This is more conducive to the adhesion of the second surface 212 and the third surface 131, so as to facilitate the laser welding of the second glass substrate 21 and the first glass substrate 13 and the conduction of the first conductive paste 215 and the first driving circuit layer, and can avoid the influence of other components on the laser welding.

[0069] Specifically, in some embodiments, the thickness of the circuit board 2 is the same as the thickness of the counter substrate 12. That is, after the circuit board 2 is soldered to the bonding area B of the first glass substrate 13 of the array substrate 11, the surface of the circuit board 2 away from the array substrate 11 is basically flush with the surface of the counter substrate 12 away from the array substrate 11, which is beneficial to reduce the thickness of the display module 100.

[0070] In some embodiments, the second glass substrate 21 of the circuit board 2 is the glass scrap remaining after cutting a large glass plate. For example, the circuit board 2 is smaller in size than the array substrate 11 or the counter substrate 12. A large glass plate can be cut to form the glass substrate required for the array substrate 11 or the counter substrate 12 of the display panel 1. The scrap remaining after cutting the glass plate for the display panel 1 can be used to prepare the second glass substrate 21 required for the circuit board 2. It is understood that using the glass scrap remaining after cutting the large glass plate to prepare the second glass substrate 21 required for the circuit board 2 can improve glass utilization, reduce residual glass scrap, and further reduce the production cost of the circuit board 2 of the display module 100.

[0071] For details, see Figures 1 to 5 The first side 213 of the second glass substrate 21 of the circuit board 2 is disposed close to the opposing substrate 12, and the first through hole 214 is disposed close to the first side 213, that is, the first through hole 214 on the second glass substrate 21 is disposed close to the opposing substrate 12. The soldering area H is located within the bonding area B and is disposed along the edge of the bonding area B. Specifically, the soldering area H and the first through hole 214 are spaced apart, and the first driving circuit layer and the second driving circuit layer are not disposed in the soldering area H. The second glass substrate 21 and the first glass substrate 13 are soldered in the soldering area H using a laser welding process. At the welding position, the opposing portions of the second glass substrate 21 and the first glass substrate 13 are melted and bonded, thus fixing the second glass substrate 21 and the first glass substrate 13 together. The fact that the first driving circuit layer and the second driving circuit layer are not disposed in the soldering area H avoids the influence of laser welding on the first driving circuit layer and the second driving circuit layer.

[0072] Specifically, such as Figure 1As shown, the soldering area H is only provided along the outer edge of the bonding area B. The soldering area H is roughly U-shaped. No soldering area H is provided at the position corresponding to the first side surface 213 of the second glass substrate 21, that is, no soldering area H is provided at the position adjacent to the first through hole 214. This avoids affecting the first and second driving circuit layers at the position of the first through hole 214 during soldering, preventing the first and second driving circuit layers from achieving a stable electrical connection. In other embodiments, the soldering area H can also be provided at other positions. For example, the soldering area H can be provided only on the side of the bonding area B corresponding to the second glass substrate 21 away from the opposing substrate 12, or the soldering area H can be provided only corresponding to the short side of the bonding area B. The soldering area H can be any shape, such as straight or curved, as long as the first and second driving circuit layers are not provided within the soldering area H, and it can be spaced apart from the first through hole 214.

[0073] In some implementations, the width of the welding area H is in the range of 200-300μm. The welding area H can also be the clearance area for laser welding, ensuring that there are no first driving circuit layers, second driving circuit layers, or other traces or components in the clearance area, so as to avoid the influence of laser welding on traces or components and cause display abnormalities in the display module 100.

[0074] In some embodiments, when laser welding the first glass substrate 13 and the second glass substrate 21 in the welding area H, a laser with an average power of 75W and a long focal length scanning galvanometer with a focal length of 255mm are used. The single pulse energy of the laser is 5-10μJ, and the welding speed is 10-40mm / s. This results in a better welding effect between the first glass substrate 13 and the second glass substrate 21, achieving a more stable connection, and without affecting other components or traces.

[0075] In some embodiments, the display module 100 may include one circuit board 2 or multiple circuit boards 2, depending on the size of the display panel 1. For example, when the size of the display panel 1 is small, the display module 100 may include only one circuit board 2; when the size of the display panel 1 is large, the display module 100 may include multiple circuit boards 2. The second glass substrates 21 of the multiple circuit boards 2 have the same structure. The multiple circuit boards 2 are spaced apart in the bonding area B of the array substrate 11. In the welding area H, the second glass substrates 21 of the multiple circuit boards 2 are welded together with the first glass substrate 13 of the array substrate 11 by laser welding process, so that the first driving circuit layer and the second driving circuit layer are electrically connected, so as to drive and control the display panel 1 to realize the display function.

[0076] See Figures 6 to 9 , Figure 6 This is a bottom view of the display module structure provided in the second embodiment of this application. Figure 7 yes Figure 6 The provided top view diagram of the display module structure. Figure 8 yes Figure 6 A schematic diagram of the display panel structure of the provided display module from below. Figure 9 yes Figure 6 A schematic diagram of the CC cross-section of the provided display module.

[0077] See Figures 6 to 9 The second embodiment of this application also provides another display module 100, which differs from the display module 100 provided in the first embodiment in that, in this embodiment, the circuit board 2 is disposed on the fourth surface 132 of the first glass substrate 13 of the array substrate 11, and the second surface 212 of the second glass substrate 21 of the circuit board 2 faces the fourth surface 132. That is, the second glass substrate 21 of the circuit board 2 is disposed on the surface of the array substrate 11 away from the opposing substrate 12, and the second surface 212 of the second glass substrate 21 without the second driving circuit layer faces the fourth surface 132. Specifically, the second surface 212 and the fourth surface 132 are attached together. In this embodiment, the circuit board 2 is welded to the fourth surface 132 of the first glass substrate 13 of the array substrate 11 using a laser welding process, that is, the circuit board 2 is welded and fixed to the back side of the array substrate 11.

[0078] Furthermore, in this embodiment, see... Figure 8 and Figure 9 The first glass substrate 13 of the array substrate 11 is further provided with a second through hole 133, which penetrates the third surface 131 and the fourth surface 132 of the first glass substrate 13. The second through hole 133 of the array substrate 11 is filled with a second conductive paste 134. The second through hole 133 of the first glass substrate 13 of the array substrate 11 is aligned with the first through hole 214 of the second glass substrate 21 of the circuit board 2. The first driving circuit layer and the second driving circuit layer are electrically connected in sequence through the second conductive paste 134 and the first conductive paste 215.

[0079] Specifically, one end of the second conductive paste 134 extends to the third surface 131 of the first glass substrate 13 and is electrically connected to the first driving circuit layer disposed on the third surface 131. The other end extends to the fourth surface 132 of the first glass substrate 13 and is electrically connected to the first conductive paste 215 filled in the first through hole 214 of the second glass substrate 21. Since the first conductive paste 215 in the first through hole 214 extends to the first surface 211 of the second glass substrate 21 and is electrically connected to the second driving circuit layer disposed on the first surface 211, the first driving circuit layer and the second driving circuit layer can be electrically connected sequentially through the second conductive paste 134 in the second through hole 133 and the first conductive paste 215 in the first through hole 214 to facilitate signal transmission and thus facilitate driving and controlling the display panel 1. In this embodiment, the circuit board 2 and the array substrate 11 do not need to use a flip-chip film to achieve electrical connection, which saves the cost of using flip-chip film and helps to solve the problem of high cost of liquid crystal displays in the prior art. In addition, the circuit board 2 can be soldered and fixed to the back of the array substrate 11, which can also change the structure of the traditional liquid crystal display and realize the diversity design of the display module 100 structure.

[0080] In some embodiments, the first glass substrate 13 is provided with a plurality of second through holes 133, which are spaced apart from each other. The second through holes 133 can be prepared by glass drilling process, and the second conductive paste 134 is formed by pouring paste into the second through holes 133. Specifically, the plurality of second through holes 133 of the first glass substrate 13 are arranged in a one-to-one correspondence with the plurality of first through holes 214 of the second glass substrate 21, so that the second conductive paste 134 in the plurality of second through holes 133 is electrically connected to the first conductive paste 215 in the plurality of first through holes 214 in a one-to-one correspondence.

[0081] In one specific implementation, such as Figure 9 As shown, the second through hole 133 is a straight through hole, and multiple second through holes 133 are spaced apart from each other. In other embodiments, the second through hole 133 can also be set as any shape such as an oblique hole or a wedge hole, as long as the second through hole 133 penetrates the third surface 131 and the fourth surface 132, so that the second conductive paste 134 filled in the second through hole 133 can conduct the second driving circuit layer and the first conductive paste 215, thereby conducting the first driving circuit layer and realizing signal transmission.

[0082] Specifically, the first glass substrate 13 of the array substrate 11 also has a second side surface 135 connecting the third surface 131 and the fourth surface 132. In some embodiments, the first through-hole 214 of the second glass substrate 21 is disposed close to the first side surface 213, and the second through-hole 133 of the first glass substrate 13 is disposed close to the second side surface 135. The first side surface 213 of the second glass substrate 21 and the second side surface 135 of the first glass substrate 13 are flush. That is, the first through-hole 214 and the second through-hole 133 are disposed close to the same side of the display panel 1. In other embodiments, the first through-hole 214 and the second through-hole 133 may not be disposed close to the first side surface 213 and the second side surface 135, but may be disposed at any other location, as long as the first conductive paste 215 in the first through-hole 214 and the second conductive paste 134 in the second through-hole 133 can achieve electrical connection between the first driving circuit layer and the second driving circuit layer to facilitate signal transmission and drive the display panel 1.

[0083] like Figure 6 As shown, in some embodiments, the welding area H is disposed along the edge of the second glass substrate 21 and spaced apart from the first through hole 214, and no second driving circuit layer is disposed within the welding area H. Specifically, as shown... Figure 6 As shown, the welding area H is roughly U-shaped. No welding area H is provided at the position corresponding to the first side surface 213 of the second glass substrate 21, that is, no welding area H is provided near the first through hole 214. This avoids affecting the first driving circuit layer at the position of the first through hole 214 during welding, preventing the first driving circuit layer and the second driving circuit layer from achieving a stable electrical connection. In other embodiments, the welding area H can also be provided at other positions. For example, the welding area H can be provided only for the side surface of the second glass substrate 21 opposite to the first side surface 213, or the welding area H can be provided only for the short side of the second glass substrate 21. The welding area H can be any shape, such as straight or curved, as long as the first and second driving circuit layers are not provided within the welding area H, and it can be spaced apart from the first through hole 214.

[0084] In some implementations, such as Figure 9As shown, the first surface 211 of the second glass substrate 21 of the circuit board 2 can also be provided with a first contact pad 22. The second driving circuit layer can be electrically connected to the first contact pad 22. One end of the first conductive paste 215 filled in the first through hole 214 can be directly electrically connected to the first contact pad 22 of the first surface 211, thereby achieving electrical connection with the second driving circuit layer. Similarly, the third surface 131 of the first glass substrate 13 of the array substrate 11 can also be provided with a second contact pad 14. The first driving circuit layer can be electrically connected to the second contact pad 14 on the third surface 131. One end of the second conductive paste 134 filled in the second through hole 133 can be directly electrically connected to the second contact pad 14 of the third surface 131, thereby achieving electrical connection with the first driving circuit layer. Then, through the electrical connection between the first conductive paste 215 and the second conductive paste 134, the electrical connection between the first driving circuit layer and the second driving circuit layer is achieved.

[0085] In this embodiment, the width of the welding area H is the same as the width of the welding area H of the display module 100 provided in the first embodiment, and can also be set in the range of 200-300μm. The welding area H can be a clearance area for laser welding, ensuring that there are no first driving circuit layers, second driving circuit layers, or other traces or components in the clearance area, so as to avoid the influence of laser welding on traces or components and cause display abnormalities in the display module 100. Similarly, in this embodiment, in some implementations, when laser welding the first glass substrate 13 and the second glass substrate 21 in the welding area H, a laser with an average power of 75W and a long focal length scanning galvanometer with a focal length of 255mm are used. The single pulse energy of the laser is 5-10μJ, and the welding speed is 10-40mm / s, which makes the welding effect between the first glass substrate 13 and the second glass substrate 21 better, achieves a more stable connection, and does not affect other components or circuit layers.

[0086] In some embodiments, the size of the array substrate 11 is equal to the size of the opposing substrate 12. Specifically, both the array substrate 11 and the opposing substrate 12 are rectangular, and the four sides of the array substrate 11 are aligned with the four sides of the opposing substrate 12. It can be understood that in this embodiment, by providing a second through-hole 133 on the first glass substrate 13 of the array substrate 11 and filling the second through-hole 133 with a second conductive paste 134, the circuit board 2 is placed on the fourth surface 132 of the array substrate 11 away from the opposing substrate 12. The first conductive paste 215 in the first through-hole 214 of the second glass substrate 21 is aligned and in contact with the second conductive paste 134 in the second through-hole 133 of the first glass substrate 13. Then, a laser welding process is used to fix and weld the second glass substrate 21 to the fourth surface 132 of the array substrate 11 away from the opposing substrate 12, so that the second driving circuit layer of the circuit board 2 and the second driving circuit layer of the array substrate 11 are electrically connected. The array substrate 11 does not need to have a specific bonding area B. That is, unlike the display module 100 in the first embodiment, in this embodiment, in the first direction, the array substrate 11 does not include the bonding area B protruding from one side of the opposing substrate 12. The size of the array substrate 11 is aligned with the size of the opposing substrate 12, which allows the display module 100 to achieve a borderless design on all four sides. This is beneficial to reduce the size of the display module 100, achieve a true borderless design, and meet more usage needs.

[0087] In other embodiments, the size of the array substrate 11 may not be equal to the size of the counterpart substrate 12. For example, the size of the array substrate 11 may be larger than the size of the counterpart substrate 12. The second glass substrate 21 of the circuit board 2 is still soldered to the fourth surface 132 of the first glass substrate 13, which can be designed as needed.

[0088] In this embodiment, the remaining structure and configuration of the display module 100 are the same as those of the display module 100 provided in the first embodiment, and will not be described again here.

[0089] See Figures 10 to 13 , Figure 10 This is a top view of the display module provided in the third embodiment of this application. Figure 11 yes Figure 10 The provided diagram shows the top-view structure of the display module. Figure 12 yes Figure 10 A side view of the display panel of the provided display module. Figure 13 yes Figure 10 A schematic diagram of the circuit board structure of the provided display module.

[0090] See Figures 10 to 13The third embodiment of this application provides another display module 100, which is different from the display module 100 of the first embodiment and the second embodiment. In this embodiment, the display module 100 further includes a flexible circuit board 3, and the second glass substrate 21 of the circuit board 2 in this embodiment does not have a first through hole 214, and the first glass substrate 13 of the array substrate 11 does not have a second through hole 133.

[0091] Specifically, in this embodiment, the first glass substrate 13 has a third surface 131 and a fourth surface 132 facing each other, and a second side surface 135 connecting the third surface 131 and the fourth surface 132. The third surface 131 is disposed facing the opposing substrate 12, and the first driving circuit layer is disposed on the third surface 131 and extends to the second side surface 135. That is, unlike the display module 100 of the first and second embodiments, in this embodiment, the first driving circuit layer of the first glass substrate 13 is not only disposed on the third surface 131, but also extends to the second side surface 135 of the first glass substrate 13.

[0092] The circuit board 2 is disposed on the fourth surface 132 of the first glass substrate 13, that is, the circuit board 2 is disposed on the surface of the array substrate 11 facing away from the opposing substrate 12. Specifically, the second glass substrate 21 has opposing first surfaces 211 and second surfaces 212 and a first side surface 213 connecting the first surfaces 211 and second surfaces 212. The second driving circuit layer is disposed on the first surface 211, and the second surface 212 faces the fourth surface 132. Specifically, the second surface 212 of the second glass substrate 21 without the second driving circuit layer is bonded to the fourth surface 132 of the first glass substrate 13 facing away from the opposing substrate 12.

[0093] In this embodiment, one end of the flexible circuit board 3 is electrically connected to the first driving circuit layer extending to the second side 135, and the other end is bent to the side of the circuit board 2 opposite to the fourth surface 132, and electrically connected to the second driving circuit layer of the circuit board 2. That is, in this embodiment, the second driving circuit layer of the circuit board 2 and the first driving circuit layer of the array substrate 11 are electrically connected through the flexible circuit board 3, rather than through the first conductive paste 215 in the first through hole 214 or the second conductive paste 134 in the second through hole 133 as in the first and second embodiments.

[0094] It is understood that in this embodiment, the first driving circuit layer of the first glass substrate 13 is directly extended to the second side surface 135 of the first glass substrate 13. It is not necessary to drill holes in the first glass substrate 13 of the array substrate 11 to form the second through-hole 133 and then fill it with slurry to form the second conductive paste 134. Nor is it necessary to drill holes in the second glass substrate 21 of the circuit board 2 to form the first through-hole 214 and then fill it with slurry to form the first conductive paste 215. Furthermore, it is not necessary to align the second through-hole 133 with the first through-hole 214 or align the first through-hole 214 with the signal transmission position of the array substrate 11 to achieve signal transmission. A flexible... The flexible circuit board 3 electrically connects the second driving circuit layer and the first driving circuit layer, which can save the glass drilling and grouting process steps, simplify the process flow, and save production costs. At the same time, it also eliminates the need for the use of flip-chip film, saving the cost of flip-chip film. Furthermore, the circuit board 2 is disposed on the fourth surface 132 of the first glass substrate 13, and the other end of the flexible circuit board 3 is bent to the side of the circuit board 2 away from the fourth surface 132, that is, the circuit board 2 is disposed on the back of the array substrate 11. This can also save the bezel size of the display module 100, which is conducive to realizing a narrow bezel design. It can also change the structure of the traditional liquid crystal display to form a new type of display module 100.

[0095] In some implementations, such as Figure 12 and Figure 13 As shown, the first surface 211 of the second glass substrate 21 of the circuit board 2 can also be provided with a first contact pad 22. The second driving circuit layer can be electrically connected to the first contact pad 22. After one end of the flexible circuit board 3 is bent to the side of the circuit board 2 away from the fourth surface 132, it can be directly electrically connected to the first contact pad 22 of the first surface 211, and thus electrically connected to the second driving circuit layer. Similarly, the second side 135 of the first glass substrate 13 of the array substrate 11 can also be provided with a second contact pad 14. The first driving circuit layer extending to the second side 135 of the first glass substrate 13 can be electrically connected to the second contact pad 14 on the second side 135. One end of the flexible circuit board 3 can be directly electrically connected to the second contact pad 14 on the second side 135, and thus electrically connected to the first driving circuit layer. The first driving circuit layer and the second driving circuit layer are electrically connected through the flexible circuit board 3.

[0096] In some embodiments, the size of the array substrate 11 is equal to the size of the opposing substrate 12, and the first side 213 is flush with the second side 135. The circuit board 2 is disposed on the fourth surface 132 of the first glass substrate 13, which is beneficial for realizing a display module 100 design with no borders on all four sides, meeting more usage requirements. In other embodiments, the size of the array substrate 11 may not be equal to the size of the opposing substrate 12. For example, the size of the array substrate 11 may be larger than the size of the opposing substrate 12, and the circuit board 2 may not be soldered to the fourth surface 132 of the first glass substrate 13.

[0097] In some embodiments, the welding area H is disposed along the edge of the second glass substrate 21 and spaced apart from the flexible circuit board 3. In the welding area H, the second glass substrate 21 of the circuit board 2 is welded and fixed to the fourth surface 132 of the first glass substrate 13 of the array substrate 11 by laser welding process, thereby realizing the fixed connection between the circuit board 2 and the array substrate 11.

[0098] Specifically, the welding area H is roughly U-shaped. No welding area H is provided on the second glass substrate 21 near the first side 213; that is, no welding area H is provided on the second glass substrate 21 near the flexible circuit board 3. This avoids affecting the flexible circuit board 3 and the first driving circuit layer electrically connected to the flexible circuit board 3 during welding, preventing the first driving circuit layer, the flexible circuit board 3, and the second driving circuit layer from achieving a stable electrical connection. In other embodiments, the welding area H can also be provided in other locations. For example, the welding area H can be provided only on the side of the second glass substrate 21 opposite to the first side 213, or it can be provided only on the short side of the second glass substrate 21. The welding area H can be any shape, such as straight or curved, as long as the first and second driving circuit layers are not provided within the welding area H, and it can be spaced apart from the flexible circuit board 3.

[0099] It is understood that the circuit board 2 and the array substrate 11 can be electrically connected through the flexible circuit board 3, thereby driving and controlling the display panel 1 to achieve the display function. The circuit board 2 is soldered and fixed to the fourth surface 132 of the array substrate 11. The position of the circuit board 2 is fixed. During the transportation of the display module 100 or when collisions or shaking occur, the circuit board 2 and the array substrate 11 can be stably connected to the flexible circuit board 3. This ensures that the circuit board 2 and the array substrate 11 can achieve a stable and effective electrical connection. It avoids the problem that when the display module 100 is transported, collided, or shaken, the circuit board 2 is not fixedly connected to the array substrate 11, and the circuit board 2 or the flexible circuit board 3 moves, which would cause poor contact between the flexible circuit board 3 and the second driving circuit layer of the circuit board 2 or the first driving circuit layer of the array substrate 11, resulting in the inability to achieve a stable electrical connection between the second driving circuit layer and the first driving circuit layer. This is beneficial to improving the display effect of the display module 100.

[0100] In some embodiments, the display module 100 may include one circuit board 2 or multiple circuit boards 2; the flexible circuit board 3 may be one or multiple, depending on the size of the display panel 1. For example, when the size of the display panel 1 is small, the display module 100 may include only one circuit board 2 and one or more flexible circuit boards 3; when the size of the display panel 1 is large, the display module 100 may include multiple circuit boards 2 and multiple flexible circuit boards 3, with the multiple circuit boards 2 spaced apart from each other, and the multiple flexible circuit boards 3 also spaced apart from each other. One end of each flexible circuit board 3 is electrically connected to the first driving circuit layer extending to the second side 135, and the other end is bent to the side of the circuit board 2 away from the fourth surface 132 and electrically connected to the second driving circuit layer, thereby realizing the electrical connection between the first driving circuit layer and the second driving circuit layer.

[0101] In this embodiment, the remaining structure and configuration of the display module 100 are the same as those of the display module 100 provided in the first embodiment, and will not be described again here.

[0102] The above description is merely an embodiment of this application and does not limit the patent scope of this application. Any equivalent structural or procedural transformations made using the content of this application's specification and drawings, or direct or indirect applications in other related technical fields, are similarly included within the patent protection scope of this application.

Claims

1. A display module, characterized in that, include: The display panel includes an array substrate and a counter substrate disposed opposite to each other; The array substrate includes a first glass substrate and a first driving circuit layer disposed on the first glass substrate; The circuit board includes a second glass substrate and a second driving circuit layer. The second glass substrate has a first surface and a second surface facing each other. The second driving circuit layer is disposed on the first surface. The second glass substrate is glass residue left after cutting a large glass plate. The circuit board is disposed on one surface of the array substrate, and the projection of the second glass substrate onto the plane of the first glass substrate is located within the first glass substrate; the first surface of the second glass substrate having the second driving circuit layer is disposed away from the first glass substrate; the second surface of the second glass substrate is attached to the surface of the first glass substrate without the first driving circuit layer. The display module has a welding area, in which the first glass substrate and the second glass substrate are fixedly connected by a laser welding process; the first driving circuit layer and the second driving circuit layer are electrically connected; the second driving circuit layer is not disposed in the welding area.

2. The display module according to claim 1, characterized in that, The second glass substrate also has a first side surface connecting the first surface and the second surface; The first glass substrate has a third surface and a fourth surface facing each other; the third surface is disposed toward the opposing substrate, and the first driving circuit layer is disposed on the third surface; the circuit board is disposed on the fourth surface, and the second surface is disposed toward the fourth surface; The second glass substrate is provided with a first through hole, which penetrates the first surface and the second surface; the first through hole is filled with a first conductive paste. The first glass substrate is provided with a second through hole, which penetrates the third surface and the fourth surface, and the second through hole is filled with a second conductive paste; The second through hole is aligned with the first through hole, and the first driving circuit layer and the second driving circuit layer are electrically connected sequentially through the second conductive paste and the first conductive paste.

3. The display module according to claim 2, characterized in that, In a first direction, the size of the array substrate is larger than the size of the counterpart substrate, and the array substrate includes a bonding region protruding from one side of the counterpart substrate; The circuit board is located within the bonding area.

4. The display module according to claim 3, characterized in that, The thickness of the circuit board is the same as the thickness of the substrate. The first through hole is located near the first side surface; The soldering area is located within the bonding area and is disposed along the edge of the bonding area. The soldering area is spaced apart from the first through hole. The first driving circuit layer and the second driving circuit layer are not disposed within the soldering area.

5. The display module according to claim 2, characterized in that, The first glass substrate further has a second side surface connecting the third surface and the fourth surface; the first through hole is disposed near the first side surface, and the second through hole is disposed near the second side surface; the first side surface and the second side surface are flush. The welding area is disposed along the edge of the second glass substrate and is spaced apart from the first through hole.

6. The display module according to claim 5, characterized in that, The size of the array substrate is equal to the size of the counterpart substrate.

7. The display module according to claim 2, characterized in that, The first glass substrate is provided with a plurality of second through holes, and the second glass substrate is provided with a plurality of first through holes, wherein the plurality of second through holes are provided in a one-to-one correspondence with the plurality of first through holes; and / or, The first through hole is prepared using a glass drilling process; and / or, the second through hole is prepared using a glass drilling process.

8. The display module according to claim 1, characterized in that, The first glass substrate has opposing third and fourth surfaces, and a second side surface connecting the third and fourth surfaces, the third surface being disposed toward the opposing substrate; The first driving circuit layer is disposed on the third surface and extends to the second side surface; The circuit board is disposed on the fourth surface; the second surface is disposed facing the fourth surface; The display module also includes a flexible circuit board, one end of which is electrically connected to the first driving circuit layer on the second side, and the other end is bent to the side of the circuit board away from the fourth surface and electrically connected to the second driving circuit layer. The welding area is disposed along the edge of the second glass substrate and is spaced apart from the flexible circuit board.

9. The display module according to any one of claims 1-8, characterized in that, The display module includes one circuit board, or the display module includes multiple circuit boards spaced apart from each other.

10. The display module according to any one of claims 1-8, characterized in that, When laser welding the first glass substrate and the second glass substrate in the welding area, a laser with an average power of 75W and a long focal length scanning galvanometer with a focal length of 255mm are used; the single pulse energy of the laser is 5-10μJ, and the welding speed is 10-40mm / s; and / or, The width of the welding zone is 200-300μm.

Images