Chip bonding apparatus with stable clamping function

Chip bonding equipment with stable clamping function automates the cutting and splicing of bonding wires, solving the bonding wire alignment problem, improving material feeding uniformity and bonding efficiency, and ensuring the quality of chip bonding.

CN119601475BActive Publication Date: 2026-07-03容泰半导体(江苏)有限公司
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
容泰半导体(江苏)有限公司
Filing Date
2024-10-09
Publication Date
2026-07-03

AI Technical Summary

Technical Problem

When replacing bonding wires in existing bonding equipment, the bonding wires may fail to align or overlap initially, causing material to accumulate in the bonding area, affecting the uniformity of material supply, and wasting time and effort.

Method used

A chip bonding device with a stable clamping function is used to automatically complete the cutting and splicing of bonding wires by adding spare bonding wires. The chip is stably clamped by a slider and a sliding table, and the bonding wires are fixed after use to avoid overlapping and accumulation, thus realizing automated replacement.

Benefits of technology

It shortens downtime, improves material feeding uniformity and bonding efficiency, reduces manual calibration and repetitive processing steps, and ensures the quality and efficiency of chip bonding.

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Abstract

This invention relates to the field of bonding equipment technology, and more particularly to a chip bonding device with a stable clamping function. It includes a work cabinet containing a bonding gun. A support plate is fixedly connected to the work cabinet, and the support plate is rotatably connected to a mirror-distributed rotating component. A wire feeding component is detachably mounted on the rotating component, and bonding wire is wound around the wire feeding component. The support plate is equipped with a mirror-distributed coil turn measurement module, and a first sliding component is located on the lower side of the support plate. The first sliding component is fixedly connected to a delivery component for conveying the bonding wire on the mirror-distributed wire feeding component. This invention employs a "spare bonding wire addition" method, automatically trimming and splicing the bonding wire after use, reducing downtime and eliminating the need for repeated wire calibration. Furthermore, during the "automatic bonding wire replacement process," the "spare bonding wire" can be easily replenished manually.
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