A method for manufacturing a rigid-flexible combined board in which a flexible board is perpendicular to a board surface

Abstract

The application discloses a kind of rigid-flexible combination plate manufacturing method of flexible plate perpendicular to plate surface, the partial area of flexible plate is attached cover film, remaining partial area is bonded with rigid plate, and rigid-flexible bearing plate is formed, then window core plate, window cover plate, window release layer are sequentially manufactured, the above-mentioned plate layer is sequentially stacked with release layer and single-sided copper-clad plate and is pressed together, the cover film area of flexible plate sequentially passes through core plate window pattern, release window pattern and cover plate window pattern, and then whole plate is formed to form rigid-flexible combination plate;By designing flexible plate from the plane direction of the surface of rigid plate, a structure perpendicular to the surface of the plate is formed, the effective use of space is realized, the overall volume of the circuit board is compressed, the design flexibility is enhanced, more design possibilities are provided for circuit designs that need to be bent or folded, and the entire processing process is effectively coordinated before and after, high-precision processing is realized.

Description

Technical Field

[0001] This invention relates to the field of rigid-flex plate manufacturing, and more particularly to a method for manufacturing a rigid-flex plate with the flexible plate perpendicular to the plate surface. Background Technology

[0002] Rigid-flex circuit boards are favored by many electronic modules due to their flexible assembly characteristics and reliability. With the rapid development of fields such as low-altitude aircraft and intelligent connected vehicles, the demand for rigid-flex circuit boards is increasing, which also brings new challenges to the design and processing technology of new rigid-flex circuit boards.

[0003] Currently, rigid-flex boards are generally designed with the flexible board and the rigid board on the same horizontal plane, with the flexible board extending from the side of the rigid board. Furthermore, the manufacturing method usually adopts a multi-layer circuit board structure by laminating layers, and then "opening the cover" to remove the corresponding rigid board layer covering the surface of the flexible board in the flexible area, exposing the flexible board and forming a rigid-flex board.

[0004] In some electronic modules that require installation space and complex functions, flexible boards extend from the plane of a rigid board, forming a flexible board structure where the flexible board "stands" on the horizontal surface of the rigid board and is perpendicular to the board surface. In application, the flexible board can be plugged into or welded to other electronic components, while the rigid board plays the role of supporting electronic components and fixing them in place.

[0005] Currently, no method for manufacturing this type of rigid-flex plate has been found. Therefore, a method for manufacturing a rigid-flex plate with the flexible plate perpendicular to the plate surface is needed. Summary of the Invention

[0006] This invention proposes a method for manufacturing a rigid-flexible composite plate with a flexible plate perpendicular to the plate surface. The manufacturing method includes the following steps:

[0007] S10: Take the first single-sided copper-clad board, and make the circuit pattern, solder mask layer and core board window pattern to form a windowed core board; the solder mask layer is smaller on one side than the insulating dielectric layer of the windowed core board;

[0008] S20: Take a prepreg and create a windowed pattern for the prepreg, which corresponds to the windowed pattern of the core board to form a windowed cover plate; then take a release layer and create a release windowed pattern to form a windowed release layer, which corresponds to the windowed pattern of the core board; the size of the windowed release layer is smaller on one side than that of the windowed cover plate;

[0009] S30: Take a flexible plate and a rigid plate, bond a portion of the flat area of ​​the flexible plate to the rigid plate medium layer of the rigid plate to form a bonding area, and attach a covering film to both sides of the remaining flat area to form a bending area, thus forming a rigid-flexible load-bearing plate as a whole.

[0010] S40: Take the release layer and the second single-sided copper-clad laminate, and stack the rigid-flex bearing board, the windowed core board, the windowed release layer, the windowed cover board, the release layer and the second single-sided copper-clad laminate in sequence to form a stacked structure, and then press them together to form a press board; the bending area in the stacked structure passes through the windowed pattern of the core board, the release windowed pattern and the windowed pattern of the cover board in sequence, and the edge of the cover film in the bending area is within the height range of the windowed core board;

[0011] S50: The press plate is formed by removing the window release layer, the window cover plate, the release layer and the second single-sided copper-clad plate to form a rigid-flexible bonded plate perpendicular to the plate surface of the flexible plate.

[0012] Optionally, the windowed cladding plate is formed by taking a single-sided copper-clad board, and sequentially fabricating the copper layer pattern and the window pattern of the cladding plate to form the windowed cladding plate; the window pattern of the cladding plate corresponds to the window pattern of the core board.

[0013] Optionally, the adhesive content of the medium layer of the prepreg or the windowed cover plate formed from the single-sided copper clad laminate is 60% to 68%.

[0014] Furthermore, the release layer is smaller on one side than the second single-sided copper-clad laminate.

[0015] Furthermore, one side of the release window pattern is less than or equal to the core board window pattern.

[0016] Furthermore, the stencil window pattern is larger on one side than the release stencil window pattern.

[0017] Furthermore, forming the press plate includes fixing the stacked structure with rivets and then pressing it together to form the press plate.

[0018] Furthermore, the pressing process employs a slow heating method with a heating rate of 1.8℃ / min to 2.2℃ / min, a maximum temperature of 160℃ to 180℃, a pressing time at the maximum temperature of 20min to 40min, and a slow cooling method with a cooling rate of 3.8℃ / min to 4.5℃ / min.

[0019] Furthermore, the molding process includes performing controlled-depth milling on the pressed plate from the core plate window pattern to the edge of the pressed plate, wherein the controlled-depth milling depth is from the surface of the pressed plate to the window release layer.

[0020] Furthermore, forming a rigid-flexible bonded plate perpendicular to the surface of the flexible plate also includes applying adhesive at the bonding position between the flexible plate and the rigid plate.

[0021] The flexible board provided by this invention is a rigid-flex board with a flexible board perpendicular to the board surface. The flexible board extends from the plane of the rigid board, forming a structure perpendicular to the board surface. On the one hand, it achieves effective use of space and compresses the overall volume of the circuit board, making it particularly suitable for miniaturized and high-density integrated electronic devices. On the other hand, it enhances design flexibility, providing more design possibilities for circuit designs that require bending or folding. The overall processing adopts a multi-layer auxiliary core board processing and removal method. First, the outer layer of the rigid board is changed to an inner core board to prevent the problem of difficulty in processing the outer layer circuit pattern and solder mask of the rigid board due to the flexible board extending from the board surface. Then, the window relationship between each core board layer is formed to provide a channel for the flexible board to extend from the plane of the rigid board. Each core board layer is made sequentially. During the subsequent lamination and layout, the stacked structure of auxiliary layers such as release layer and cover layer is designed to cooperate in forming. The auxiliary layers are removed during the forming process to expose the surface circuit pattern and solder mask layer. The entire processing process forms an effective cooperation between the front and back ends to achieve high-precision processing. Attached Figure Description

[0022] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort.

[0023] Figure 1 This is a schematic diagram of the process flow of an embodiment of the present invention;

[0024] Figure 2 This is a plan view of the windowed core board according to an embodiment of the present invention;

[0025] Figure 3 for Figure 2 Schematic diagram of AA section;

[0026] Figure 4 This is a schematic diagram of the cross-sectional structure of the windowed cover plate according to an embodiment of the present invention;

[0027] Figure 5 This is a schematic diagram of the cross-sectional structure of the rigid-flexible bearing plate according to an embodiment of the present invention;

[0028] Figure 6 This is a schematic cross-sectional view of the stacked structure according to an embodiment of the present invention;

[0029] Figure 7 for Figure 6 Schematic diagram of BB planar structure;

[0030] Figure 8 This is a schematic diagram of the cross-sectional structure of the pressing plate according to an embodiment of the present invention;

[0031] Figure 9 This is a schematic diagram of the cross-sectional structure of the rigid-flexible plate according to an embodiment of the present invention;

[0032] Figure 10 for Figure 9 Create a schematic diagram of the cross-sectional structure with glue.

[0033] Explanation of icon numbers:

[0034]

[0035] The realization of the objective, functional features and advantages of the present invention will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0036] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present invention.

[0037] It should be noted that all directional indications (such as up, down, left, right, front, back, inside, outside, etc.) in the embodiments of the present invention are only used to explain the relative positional relationship and movement of each component in a certain specific posture (as shown in the figure). If the specific posture changes, the directional indication will also change accordingly.

[0038] Furthermore, in this invention, descriptions involving "first," "second," etc., are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this invention, "a plurality of" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0039] Furthermore, the technical solutions of the various embodiments of the present invention can be combined with each other, but only if they are feasible for those skilled in the art. If the combination of technical solutions is contradictory or cannot be implemented, it should be considered that such combination of technical solutions does not exist and is not within the scope of protection claimed by the present invention.

[0040] Please see Figure 1 , Figure 1 This is a schematic diagram of the process flow according to an embodiment of the present invention.

[0041] The manufacturing process of this invention includes using Figure 1 The implementation of each step in the process will be described below. Figure 1 The process of each step will be explained step by step.

[0042] Please see Figure 2 and Figure 3 , Figure 2 This is a plan view of the windowed core board according to an embodiment of the present invention; Figure 3 for Figure 2 A schematic diagram of the AA section.

[0043] Step S10:

[0044] Take the first single-sided copper-clad board and fabricate the circuit pattern 1010, solder mask layer 1020 and core board window pattern 1030 to form the windowed core board 10.

[0045] Since the flexible plate of the rigid-flex board extends from the plane of the rigid plate, if the traditional manufacturing method is used to fabricate the surface circuit pattern and solder mask after lamination, a series of problems will occur due to the influence of the flexible plate, such as poor adhesion of the dry film, poor exposure, etching solvent seepage, and difficulty in screen printing. Therefore, the surface circuit pattern and solder mask need to be fabricated in advance when making the core board before lamination. That is, the surface circuit pattern and solder mask of the rigid-flex board are designed as the core board layer of the lamination board in this embodiment, and then processed in subsequent processes.

[0046] Therefore, the circuit pattern 1010 must be made first, and a solder mask layer 1020 must be made to protect the circuit pattern 1030. It is worth noting that the solder mask layer 1020 is designed to be relatively thick, ranging from 30μm to 45μm, to prevent the circuit pattern 1010 from being crushed due to excessive pressure during the lamination process, which could lead to short circuits and other problems on the circuit board during application.

[0047] By creating the core board window pattern 1030, the bending area of ​​the flexible board in the subsequent processing can be made to allow passage, providing a processing basis for the subsequent process to form a structure perpendicular to the board surface of the flexible board. Furthermore, the solder resist layer 1020 is smaller on one side than the insulating dielectric layer 1040 of the windowed core board 10, that is, the solder resist layer 1020 does not exceed the edge of the board, so that the pressing board 80 in the subsequent process forms a good fusion at the edge of the board.

[0048] Please see Figure 4 , Figure 4 This is a schematic diagram of the cross-sectional structure of the windowed cover plate according to an embodiment of the present invention.

[0049] Step S20:

[0050] Take a prepreg and make a window pattern for the prepreg. The window pattern of the prepreg corresponds to the window pattern 1030 of the core board to form a windowed cover plate 20.

[0051] In this embodiment, optionally, the windowed cover plate 20 is fabricated by taking a single-sided copper-clad laminate and sequentially fabricating the cover plate copper layer pattern 2010 and the cover plate window pattern 2020 to form the windowed cover plate 20. The bending area 4011a of the flexible board 4010 with the cover film 4011 attached does not need to be covered, so that the cover plate copper layer pattern 2010 formed by the single-sided copper-clad laminate can provide some support for the bending area, which is beneficial to the rigid-flex board 90 having good support during application. On the other hand, it can ensure that one side of the high-flow-rate prepreg is constrained, preventing excessive glue flow and forming a glue flow buffering cover effect on only one side. Furthermore, the cover plate window pattern 2010 corresponds to the core board window pattern 1030 and has the same function as the windowed core board 10, which will not be described again.

[0052] During the lamination process, since the windowed core board 10 produced in the previous process has already formed the circuit pattern 1010, the corresponding overlay layer needs to use a material with a greater overlay effect to form a lamination buffer effect on the circuit pattern 1010, avoiding problems such as bending or deformation of the circuit pattern 1010. Therefore, in this embodiment, the adhesive content of the prepreg of the windowed overlay board 20 or the overlay medium layer of the windowed overlay board 20 made of single-sided copper clad laminate is 60% to 68%, which can be understood as a high-flow adhesive prepreg. This adhesive content can better fill and penetrate into the gaps between the boards during the lamination process, which helps to eliminate air bubbles and voids, enhance the bonding strength between the boards, and help improve the stability and durability of the entire rigid-flex board 90. Furthermore, the adhesive content in the range of 60% to 68% has good heat resistance and can maintain good physical and chemical stability in high-temperature environments, which helps to enhance the durability and reliability of the rigid-flex board 90 in high-temperature environments.

[0053] Please refer to the following first. Figure 6 , Figure 6 This is a schematic cross-sectional view of the stacked structure according to an embodiment of the present invention.

[0054] Next, the release layer is removed, and a release window pattern 3010 is made to form a windowed release layer 30, which provides separability for the removal of excess board layers in subsequent processes. The release layer is made of materials such as PI, PTFE, TPX, ETFE, and silicone sheets. The release layer is relatively thin, ranging from 5μm to 20μm. Furthermore, the release window pattern 3010 corresponds to the core board window pattern 1030 and has the same function as the windowed core board 10, which will not be described in detail here.

[0055] Furthermore, the size of the window release layer 30 is smaller on one side than that of the window cover plate 20. That is, the window release layer 30 will not completely cover the edge of the window cover plate 20, so that the pressing plate 80 in the subsequent process forms a good fusion at the edge of the plate, which is conducive to forming a stable pressing plate 80 structure.

[0056] In this embodiment, the release window pattern 3010 has one side less than or equal to the core board window pattern 1030. This is beneficial for effectively isolating the flowing adhesive between the window core board 10 and the window cover plate 20 during the pressing process. This prevents the adhesive from the insulating dielectric layer of the window core board 10 and the cover plate dielectric layer 2030 of the window cover plate 20 from flowing into the core board window pattern 1030 and forming an adhesive. This would affect the removal of excess board layers of the release layer 50 and above in subsequent processes, and may even lead to the scrapping of the board.

[0057] In this embodiment, the 2020 of the cover plate is larger on one side than the release 3010, which effectively reduces the risk of semi-cured sheet flowing into the core plate 1030 during the pressing process, thereby preventing the adhesive from flowing into the core plate 1030, which would make it difficult to release in subsequent processes and difficult to peel off the 20 of the cover plate.

[0058] Please see Figure 5 , Figure 5 This is a schematic diagram of the cross-sectional structure of the rigid-flexible bearing plate according to an embodiment of the present invention.

[0059] Step S30:

[0060] Take a flexible plate 4010 and a rigid plate 4020, and bond a portion of the flat area of ​​the flexible plate 4010 to the rigid plate medium layer 4021 of the rigid plate 4020 to form a bonding area 4021a. The remaining portion of the flat area is covered with a cover film 4011 on both sides to form a bending area 4011a, and the whole is formed into a rigid-flexible bearing plate 40. Since a portion of the flexible plate 4010 needs to extend from the window pattern of each layer during the pressing and layout, the portion of the flexible plate 4010 that does not need to extend is bonded to the rigid plate 4020 to fix the flexible plate 4010 on the rigid plate 4020, providing a base for core plate processing during subsequent stacking and pressing.

[0061] Covering films 4011 are attached to both sides of the bending area 4011a of the flexible board 4010. On the one hand, the covering film 4011 serves to isolate and protect the flexible board 4010 from oxidation or corrosion when exposed to air. On the other hand, the covering film 4011 (commonly made of polyimide) has good bending resistance and can provide sufficient toughness and support when the flexible board 4010 is bent, preventing the circuit pattern of the flexible board 4010 from being damaged during the bending process.

[0062] It is worth noting that the covering film 4011 in the bending area 4011a is relatively recessed relative to the edge of the plate, which is beneficial for the subsequent pressing plate 80 to form a good fusion at the edge of the plate, thus forming a stable pressing plate 80 structure.

[0063] Please refer to it again. Figure 6 And see Figure 7 and Figure 8 , Figure 7 for Figure 6 A schematic diagram of the BB planar structure. Figure 8 This is a schematic diagram of the cross-sectional structure of the pressing plate according to an embodiment of the present invention.

[0064] Step S40:

[0065] Take the release layer 50 and the second single-sided copper clad laminate 60, and stack the rigid-flex bearing board 40, the windowed core board 10, the windowed release layer 30, the windowed clad laminate 20, the release layer 50 and the second single-sided copper clad laminate 60 in sequence to form a stacked structure 70, and then press them together to form a laminated board 80, and then make the surface circuit pattern.

[0066] The bending area 4011a in the stacked structure 70 passes through the core board window pattern 1030, the release window pattern 3010 and the cover board window pattern 2020 in sequence, and the edge of the covering film 4011 in the bending area 4011a is within the height range of the windowed core board 10.

[0067] In this embodiment, the release layer 50 is smaller on one side than the second single-sided copper clad laminate 60, that is, the area located between the forming line 7020 and the edge of the board, so that the laminating plate 80 in the subsequent process forms a good fusion at the edge of the board, which is conducive to forming a stable laminating structure.

[0068] In this embodiment, forming the press plate 80 includes fixing the stacked structure 70 with rivets 7010 and then pressing it together to form the press plate 80. On the one hand, pre-fixing with rivets 7010 before pressing ensures that each layer of material maintains good alignment and flatness during the pressing process, especially ensuring that the part of the flexible plate 4010 extending out of the window area is effectively fixed, preventing problems such as wrinkles and dents on the surface of the flexible plate 4010 due to unevenness or insecure fixing during pressing; and reducing defects such as displacement and air bubbles during the pressing process, avoiding problems such as poor pressing due to material displacement, effectively improving the yield of the press plate 80. On the other hand, the pre-fixed stacked structure 70 is more likely to achieve uniform pressure distribution during the pressing process, thereby improving the overall structural stability of the press plate 80 and the quality of pressing.

[0069] In this embodiment, the stacked structure 70 is formed by multilayer composite material. Therefore, in order to improve the stability and reliability of the pressed plate 80, a temperature control method of slow heating and slow cooling is adopted for pressing. That is, the pressing adopts a slow heating rate of 1.8℃ / min to 2.2℃ / min and a slow cooling rate of 3.8℃ / min to 4.5℃ / min. On the one hand, slow heating can gradually soften the material, making it easier to flow and bond during the pressing process, thereby improving the bonding strength of the material and facilitating the formation of a slower layer covering and buffering effect. On the other hand, slow heating and slow cooling can effectively reduce the thermal stress inside the material and avoid material cracking or deformation caused by rapid heating and cooling.

[0070] Furthermore, the maximum pressing temperature is 160℃ to 180℃, and the maximum pressing time is 20min to 40min. On the one hand, the higher temperature (160℃ to 180℃) ensures that the material is fully softened and cured, so that the material layers form a tighter bond, improving the overall mechanical strength and durability. On the other hand, the longer maximum pressing time (20min to 40min) can ensure a uniform temperature distribution during the pressing process. A uniform temperature distribution helps the material layers fuse better, reduces the generation of bubbles and voids, and improves the flatness and density of the pressed plate 80.

[0071] Please see Figure 9 , Figure 9 This is a schematic diagram of the cross-sectional structure of a rigid-flexible bonded plate perpendicular to the surface of a flexible plate according to an embodiment of the present invention.

[0072] Step S50:

[0073] The press plate 80 is formed, and the windowed release layer 30, the windowed cover plate 20, the release layer 50, and the second single-sided copper clad plate 60 are removed to form a flexible rigid-flex plate 90 with the flexible plate perpendicular to the plate surface.

[0074] In this embodiment, the molding process includes controlling the depth of milling of the press plate 80 from the core board window pattern 1030 to the edge of the press plate 80. The depth of the controlled milling is from the surface of the press plate 80 to the window release layer 30. The controlled milling can ensure that the milling only reaches the window release layer 30, effectively avoiding milling damage to the window core board 10, which would expose the circuit pattern 1010 and cause short circuits and other problems in subsequent applications, thereby improving the yield of the circuit board.

[0075] Please see Figure 10 , Figure 10 for Figure 9 Create a schematic diagram of the cross-sectional structure with glue.

[0076] In this embodiment, the rigid-flexible bonded plate 90 forming the flexible plate perpendicular to the plate surface further includes applying adhesive 9010 at the bonding position between the flexible plate 4010 and the rigid plate 4020; applying adhesive 9010 can significantly enhance the bonding strength between the two, ensure that the rigid-flexible bonded plate 90 remains stable during application, extend the service life of the product, and improve the sealing of the bonding position between the flexible plate and the rigid plate.

[0077] The above description is merely a preferred embodiment of the present invention and does not limit the patent scope of the present invention. Any equivalent structural transformations made using the contents of the present invention's specification and drawings under the inventive concept of the present invention, or direct / indirect applications in other related technical fields, are included within the patent protection scope of the present invention.

Claims

1. A method for manufacturing a rigid-flexible composite plate with a flexible plate perpendicular to the plate surface, characterized in that, The manufacturing method includes the following steps: S10: Take the first single-sided copper-clad board, make the circuit pattern, solder mask layer and core board window pattern to form a windowed core board; The solder resist layer is smaller on one side than the insulating dielectric layer of the windowed core board; S20: Take a prepreg, make a window pattern of the prepreg to form a window pattern of the cover plate, the window pattern of the cover plate corresponds to the window pattern of the core board to form a windowed cover plate; or, The windowed cladding is formed by taking a single-sided copper-clad board, and sequentially fabricating the copper layer pattern and the window pattern of the cladding to form the windowed cladding; the window pattern of the cladding corresponds to the window pattern of the core board; Next, remove the release layer and create a release window pattern to form a windowed release layer, wherein the release window pattern corresponds to the core board window pattern; The size of the window release layer is smaller on one side than that of the window cover plate; S30: Take a flexible plate and a rigid plate, bond a portion of the flat area of ​​the flexible plate to the rigid plate medium layer of the rigid plate to form a bonding area, and attach a covering film to both sides of the remaining flat area to form a bending area, thus forming a rigid-flexible load-bearing plate as a whole. S40: Take the release layer and the second single-sided copper-clad laminate, and stack the rigid-flex bearing plate, the windowed core plate, the windowed release layer, the windowed laminate, the release layer and the second single-sided copper-clad laminate in sequence to form a stacked structure, and then press them together to form a press plate; The bending area in the stacked structure passes sequentially through the core board window pattern, the release window pattern, and the cover board window pattern, and the edge of the covering film in the bending area is within the height range of the windowed core board; S50: The press plate is formed by removing the window release layer, the window cover plate, the release layer and the second single-sided copper-clad plate to form a rigid-flexible bonded plate perpendicular to the plate surface of the flexible plate.

2. The method for manufacturing a flexible plate with a rigid-flexible joint perpendicular to the plate surface as described in claim 1, characterized in that, The adhesive content of the medium layer of the prepreg or the windowed cover plate formed from the single-sided copper clad laminate is 60% to 68%.

3. The method for manufacturing a flexible plate with a rigid-flexible joint perpendicular to the plate surface as described in claim 1, characterized in that, The release layer is smaller on one side than the second single-sided copper-clad laminate.

4. The method for manufacturing a flexible plate with a rigid-flexible joint perpendicular to the plate surface as described in claim 1, characterized in that, The single side of the release window pattern is less than or equal to the core board window pattern.

5. A method for manufacturing a flexible plate with a rigid-flexible joint perpendicular to the plate surface as described in claim 1 or 4, characterized in that, The window pattern of the cover plate is larger on one side than the release window pattern.

6. The method for manufacturing a flexible plate with a rigid-flexible joint perpendicular to the plate surface as described in claim 1, characterized in that, Forming the press plate includes fixing the stacked structure with rivets and then pressing them together to form the press plate.

7. The method for manufacturing a flexible plate with a rigid-flexible joint perpendicular to the plate surface as described in claim 1, characterized in that, The pressing process employs a slow heating method with a heating rate of 1.8℃ / min to 2.2℃ / min, a maximum temperature of 160℃ to 180℃, a pressing time of 20min to 40min at the maximum temperature, and a slow cooling method with a cooling rate of 3.8℃ / min to 4.5℃ / min.

8. The method for manufacturing a flexible plate with a rigid-flexible joint perpendicular to the plate surface as described in claim 1, characterized in that, The molding process includes controlling the depth of milling the pressed plate from the core plate window pattern to the edge of the pressed plate, wherein the depth of the controlled milling is from the surface of the pressed plate to the window release layer.

9. The method for manufacturing a flexible plate with a rigid-flexible joint perpendicular to the plate surface as described in claim 1, characterized in that, The rigid-flexible bonded plate that forms the flexible plate perpendicular to the plate surface also includes applying adhesive at the bonding position between the flexible plate and the rigid plate.

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