A control method and system for glass laser marking

Abstract

The application provides a control method and system for glass laser marking, and relates to the field of intelligent control or regulation system in industrial processing.The method comprises the following steps: obtaining three-dimensional height data of each processing point on the working surface of a processing table to form a three-dimensional height data set; generating a laser head height compensation data set of each processing position of the processing table based on the three-dimensional height distribution data of the overall processing table; obtaining information of a glass to be marked and geometric data of a region to be marked on the glass to be marked; obtaining height compensation data of the region to be marked according to the information of the glass to be marked and the geometric data of the region to be marked to generate a region-to-be-marked path plan; the scheme takes the three-dimensional height data collection of the processing table as the core, obtains the region-to-be-marked path plan for controlling the operation of the marking machine based on the data, adjusts the region-to-be-marked path through the height compensation data set, generates a final region path scheme, and dynamically adjusts the movement of the laser head by using intelligent control technology.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of intelligent control or regulation system in industrial processing, in particular to a control method and system for glass laser marking. BACKGROUND

[0002] Glass laser marking technology has been widely used in consumer electronics, architectural glass, optical instruments and other fields due to its non-contact, high precision and high efficiency. However, there are many factors that affect the quality of glass laser marking, among which the flatness of the working surface of the processing table has a key influence on the marking quality. If the working surface of the processing table is inclined or uneven, it will directly cause the laser focal point position to deviate, and then affect the marking depth, line clarity and the consistency of the overall effect.

[0003] In the prior art, in order to ensure the quality of glass laser marking, strict leveling operation is often required for the working surface of the processing table. The purpose of leveling is to keep the glass surface consistent with the horizontal plane of the processing table, so as to keep the laser focal point distance constant and ensure uniform marking effect.

[0004] However, the leveling of the processing table usually needs to be completed manually by professional operators with the help of instruments. This process is time-consuming and labor-intensive, and has high requirements for operation accuracy. Any slight error may affect the final marking effect.

[0005] Moreover, due to mechanical wear, temperature change, stress release and other reasons, the flatness of the processing table will inevitably decrease during long-term use. Even after leveling operation, the processing table may still have new flatness deviation during operation, which will lead to instability of the marking quality. Therefore, in order to maintain high marking quality, enterprises need to frequently detect and level the processing table, which not only increases the downtime of the equipment, but also significantly increases the production cost and labor intensity, resulting in low production efficiency and poor quality consistency. SUMMARY

[0006] The present application constructs a dynamic height compensation mechanism based on the three-dimensional height data acquisition of the processing table, and obtains the marking area path planning for controlling the operation of the marking machine based on this data. The height compensation data set is used to adjust the marking area path, generate the final area path scheme, and dynamically adjust the movement of the laser head by using intelligent control technology, so that the distance between the laser head and the glass surface can be adjusted in real time, the height deviation of the processing table surface can be accurately compensated, and the laser focal point can always be in the ideal position. Combined with path planning optimization and quality feedback monitoring, the precision and consistency of complex pattern and large area marking can be greatly improved, the leveling frequency of the processing table can be reduced, the maintenance cost can be reduced, the production efficiency and product quality can be significantly improved, and the industrial production demand can be met. The specific content is as follows.

[0007] A control method for laser marking on glass, the method comprising:

[0008] Acquire the three-dimensional height data of each machining point on the worktable surface to form a three-dimensional height dataset;

[0009] Based on the three-dimensional height distribution data of the overall machining table, a laser head height compensation dataset for each machining position on the machining table is generated.

[0010] Obtain information about the glass to be marked and the geometric data of the area to be marked on the glass, including its geometric shape, size and position data;

[0011] Based on the information of the glass to be marked and the geometric data of the marking area, the height compensation data of the marking area is obtained, and the marking area path planning is generated.

[0012] Furthermore, the method also includes:

[0013] Execute the marking task according to the marked area path plan;

[0014] Adjust the XY axis movement and Z axis height of the laser head based on the path planning data of the marking area.

[0015] Furthermore, the method also includes: obtaining marking quality data, and monitoring changes in marking quality based on the marking quality data;

[0016] If the marking quality is lower than the preset value, re-acquire the three-dimensional height data of each processing point on the working surface of the processing table and generate a new laser head height compensation dataset for each processing position on the processing table.

[0017] Furthermore, the method for obtaining the three-dimensional height data of each machining point on the working surface of the machining table is as follows:

[0018] Place the glass sheet onto the processing table;

[0019] Obtain the three-dimensional height data of the processing stage at each point on the glass sheet;

[0020] The height difference of thickness data in various glass sheets is obtained, the three-dimensional height data is compensated, and the three-dimensional height data of the processing stage at each point on the glass sheets of different thicknesses is obtained.

[0021] In the process of implementing the embodiments of this application, the inventors discovered that by obtaining the height difference of thickness data in various glass sheets, the three-dimensional height data is compensated to obtain the three-dimensional height data of the processing stage at each point on the glass sheets of different thicknesses. Although the printing path generated based on this can be used, the consistency of quality is still poor. Although the printing effect is still within the acceptable range, the quality still fluctuates.

[0022] As a preferred option, in order to solve the above problems, the inventors have further improved and optimized the method for obtaining the three-dimensional height data of each processing point on the working surface of the processing table, and the specific method is as follows:

[0023] Glass sheets of different thicknesses are placed on the processing table;

[0024] Obtain the three-dimensional height data of the processing stage at various points on glass sheets of different thicknesses.

[0025] Furthermore, the method for obtaining the three-dimensional height data is as follows;

[0026] Obtain the processable range of the glass on the processing table;

[0027] Define a two-dimensional grid based on the machinable range;

[0028] The vertical height data of all grid points in the two-dimensional grid is obtained by measuring probes;

[0029] Record the vertical height data of all measuring points, combined with the corresponding position information of the measuring points, into three-dimensional coordinate values;

[0030] The thickness information of the glass is obtained and measured. Based on the distribution of the measurement points, the recorded data is organized and recorded to generate a three-dimensional height dataset of the working surface of the processing table corresponding to the thickness of the glass.

[0031] Furthermore, the method for generating the laser head height compensation dataset at each processing position of the processing table is as follows:

[0032] Using the 3D height dataset of the machining table, a 3D height distribution model of the machining table working surface corresponding to different thicknesses is generated through data processing.

[0033] Let x be the vertical distance between the laser head and the glass surface;

[0034] Based on the data in the three-dimensional height distribution model, the vertical distance x between the laser head and the glass surface is compared to calculate the compensation value between the processing head and the glass surface.

[0035] The calculated compensation values ​​for each grid point are compiled to generate a 3D height compensation dataset for the machining table.

[0036] Secondly, this application also discloses a control system for laser marking on glass, the system comprising:

[0037] 3D Height Data Acquisition Module: Used to collect 3D height data of each processing point on the working surface of the machining table, form a 3D height dataset, and generate a laser head height compensation dataset for each processing position on the machining table based on the 3D height distribution data of the entire machining table;

[0038] Processing requirement acquisition module: used to acquire information about the glass to be marked and the geometric data of the area to be marked on the glass;

[0039] Processing scheme generation module: used to obtain the height compensation data of the marking area based on the information of the glass to be marked and the geometric data of the marking area, and generate the marking area path plan;

[0040] Laser marking execution module: Executes the marking task according to the marking area path planning, and adjusts the XY axis movement and Z axis height of the laser head according to the marking area path planning data;

[0041] Monitoring and feedback module: used to obtain marking quality data and monitor changes in marking quality based on the marking quality data;

[0042] If the marking quality is lower than the preset value, re-acquire the three-dimensional height data of each processing point on the working surface of the processing table and generate a new laser head height compensation dataset for each processing position on the processing table.

[0043] In the process of implementing the embodiments of this application, the inventors discovered that the existing laser marking equipment is highly dependent on the flatness of the processing table. Once the processing table deviates slightly, it is difficult to accurately adjust the focal position of the laser head, resulting in problems such as uneven marking depth and blurred patterns.

[0044] Furthermore, in the existing technology, the laser marking process lacks real-time height compensation capability, which cannot effectively cope with the slight unevenness of the processing table surface, resulting in marking failure or poor effect in local areas. For complex geometric patterns or large-area marking tasks, the existing technology lacks effective coordination in path planning and height adjustment, which can easily lead to a decline in the marking quality of details.

[0045] Furthermore, the frequent leveling and maintenance operations in existing technologies not only reduce production efficiency but also increase production costs. The limitations of existing technologies are particularly evident in industrial scenarios requiring large-scale production.

[0046] In actual operation, this system employs intelligent control technology to dynamically adjust the movement of the laser head in real time, achieving precise control of the laser head's XYZ axes and ensuring that the laser focus remains at the optimal processing distance. Furthermore, the system effectively reduces unnecessary laser head movement through path optimization technology, improving processing efficiency and accuracy. Combined with height compensation and path planning, the system can adapt to uneven processing table surfaces, automatically adjusting the laser head height to ensure uniformity and consistency in marking quality. This solution integrates path planning, height compensation, and real-time feedback adjustment functions, significantly improving marking accuracy and efficiency, reducing reliance on manual adjustments, and providing an innovative solution for the intelligent upgrading of manufacturing systems.

[0047] To address the aforementioned technical problems, one or more technical solutions provided in this application have at least the following technical effects or advantages:

[0048] This application establishes a three-dimensional height data model of high-density grid points in the glass surface processing area through a contact measurement method, thereby achieving a comprehensive reflection of the unevenness of the glass surface.

[0049] This application combines height compensation data with path planning, enabling the laser head to dynamically adjust the Z-axis height in real time during the printing process, ensuring a constant distance between the processing head and the glass surface, thereby improving marking quality.

[0050] This application can combine height distribution data of the glass surface to generate optimized path planning for complex geometric patterns, ensuring an effective combination of path planning and height compensation.

[0051] In cases where the flatness of the processing table is insufficient, this application abandons the traditional method of leveling the processing table. Instead, through accurate calculation and dynamic adjustment of height compensation data, it not only ensures the stability of marking quality but also effectively extends the service life of the processing table.

[0052] This application combines automated high-compensation with path planning to enable laser marking to exhibit higher efficiency and stability in large-scale industrial production, reducing downtime losses caused by equipment adjustments or substandard quality.

[0053] The above description is only an overview of the technical solution of this application. In order to better understand the technical means of this application and to implement it in accordance with the contents of the specification, and to make the above and other objects, features and advantages of this application more obvious and understandable, the following are specific embodiments of this application. Attached Figure Description

[0054] Figure 1 This is a schematic flowchart of a control method for laser marking on glass, provided as an embodiment of this application.

[0055] Figure 2 This is a schematic diagram of a control system for laser marking on glass, provided as an embodiment of this application.

[0056] Figure labeling: 3D height data acquisition module 10, processing requirement acquisition module 20, processing plan generation module 30, laser marking execution module 40, monitoring and feedback module 50. Detailed Implementation

[0057] This application provides a control method for laser marking on glass. Precise three-dimensional height data acquisition and real-time adjustment enable dynamic control of the distance between the laser head and the glass surface, eliminating the influence of unevenness on the processing table surface. By combining height data with the geometry of the marking pattern, a globally optimal path planning is generated, ensuring the accuracy and consistency of complex patterns. Even with insufficient flatness of the processing table, height compensation technology guarantees marking quality, reducing reliance on processing table leveling and extending equipment lifespan. This method not only features high automation, simple operation, and convenient maintenance, adapting to the needs of large-scale industrial production, but also lowers the technical threshold for operators.

[0058] The solution centers on the acquisition of three-dimensional height data of the processing table, accurately obtaining the three-dimensional height distribution data of the processing table surface and the glass surface through non-contact measurement technology. Based on this data, the system generates a preliminary path plan for controlling the operation of the marking machine, and dynamically adjusts the path by combining the height compensation dataset, thereby generating a final area path plan that meets the actual processing requirements.

[0059] After introducing the basic principles of this application, various non-limiting embodiments of this application will be described in detail below with reference to the accompanying drawings. It should be understood that the specific embodiments described herein are merely illustrative of this application and are not intended to limit this application.

[0060] Example 1: As Figure 1 As shown, a control method for laser marking on glass includes:

[0061] S100 acquires the three-dimensional height data of each machining point on the working surface of the machining table, forming a three-dimensional height dataset.

[0062] The method for obtaining the three-dimensional height data of each machining point on the working surface of the machining table is as follows:

[0063] The preparations are as follows:

[0064] Confirm that the processing table is fixed in place and ensure that its surface is clean and free of foreign objects to avoid measurement interference.

[0065] Install contact measuring devices, such as mechanical height measuring probes (e.g., digital dial gauges or displacement sensors), and calibrate the probe's zero-point height.

[0066] Set the resolution and measurement spacing of the measuring equipment (i.e., the horizontal distance between every two measuring points on the surface of the processing table) to ensure that the data density meets the accuracy requirements.

[0067] Place a glass sheet of a certain thickness onto the processing table;

[0068] Obtain the processable range of the glass on the processing table;

[0069] Define a two-dimensional grid based on the machinable range and determine the boundary of the measurement area to ensure that the grid covers the entire working surface of the machining table. The grid spacing can be set according to the machining accuracy and surface characteristics, and is usually a uniform rectangular or square distribution.

[0070] Move the measuring probe to the first grid point on the machining table and bring the probe into contact with the table surface;

[0071] After the probe contacts the platform, it will automatically record the vertical height data (Z value) of that point based on the contact position.

[0072] Its control system can control the measuring device to move point by point along the grid through a precision motion platform (such as an XYZ servo platform). When it reaches a grid point, the probe touches and records the height of the point, and the measurement is completed in a set order.

[0073] Record the height data of all measuring points as three-dimensional coordinate values ​​(X, Y, Z), where:

[0074] X and Y represent the horizontal positions of the grid points where the probe is located;

[0075] Z represents the measured height of that point.

[0076] Based on the distribution of measurement points, the vertical height data of all measurement points are combined with the location information of the corresponding measurement points and recorded as three-dimensional coordinate values. The recorded data are then organized into a grid-like matrix or table.

[0077] Obtain the thickness information of the glass and, based on the distribution of the measurement points, organize and record the recorded data to generate a three-dimensional height dataset of the processing table working surface corresponding to the glass thickness.

[0078] By repeatedly testing glass of different thicknesses, the three-dimensional height data of the processing table at various points on the glass sheet of different thicknesses are obtained, and a three-dimensional height dataset of the processing table working surface corresponding to the thickness is generated.

[0079] Based on the three-dimensional height distribution data of the overall machining table, S200 generates a laser head height compensation dataset for each machining position on the machining table.

[0080] Specifically, the method for generating the laser head height compensation dataset for each processing position on the processing table is as follows:

[0081] By obtaining the three-dimensional height dataset of the processing table corresponding to glass of different thicknesses, a three-dimensional height distribution model of the working surface of the processing table corresponding to different thicknesses is generated through data processing.

[0082] Let x be the vertical distance between the laser head and the glass surface;

[0083] Based on the data in the three-dimensional height distribution model, the vertical distance x between the laser head and the glass surface is compared to calculate the compensation value between the processing head and the glass surface.

[0084] The calculated compensation values ​​for each grid point are compiled to generate a 3D height compensation dataset for the machining table.

[0085] S300 acquires information about the glass to be marked and the geometric data of the area to be marked on the glass, including its geometric shape, size and position data.

[0086] Specifically:

[0087] It can import the geometric information of the marking area from the design system, including the pattern shape, size and its expected position on the glass, as well as the thickness information of the glass to be marked;

[0088] Typical geometric information may include the outlines of rectangles, circles, text, or complex patterns.

[0089] Calibrate by referring to the positioning marks on the processing table or the alignment points on the glass to ensure that the marking area is correctly aligned with the actual position on the glass;

[0090] After calibration, record the specific location data of the marking area on the glass (such as the coordinates of the upper left corner and the area range).

[0091] Analyze the geometry of the marked area, such as lines, surfaces, or filled areas;

[0092] Determine the position and order of shape feature points (such as vertices and boundary lines).

[0093] Obtain dimensional information such as the length, width, or radius of the marking area;

[0094] For complex patterns, each part needs to be dimensioned separately, and its relative position recorded.

[0095] Determine the exact location of the marking area on the glass, including its position relative to the glass edge (such as the offset from the lower left corner).

[0096] If multiple areas need to be marked, the position and shape of each marking area must be recorded separately.

[0097] The collected geometric data of the marking area is compared with the design drawings, and the distance between the marking area and the glass boundary is checked to ensure that its shape, size and position are consistent with expectations, so as to ensure that the marking area does not exceed the effective range of the glass or contact the boundary of the processing table, and to avoid errors during processing.

[0098] If there is a deviation, the glass position needs to be adjusted or the marking area needs to be reset;

[0099] The glass information (dimensions, thickness) and the geometric data of the marking area are integrated into a standardized data format to generate a file containing the following:

[0100] The overall dimensions and thickness of the glass;

[0101] The shape and size of the marking area;

[0102] The coordinates of the marking area on the glass.

[0103] Save the file to the specified path and pass it to the next module (S400).

[0104] S400 obtains the height compensation data of the marking area based on the information of the glass to be marked and the geometric data of the marking area, and generates the marking area path plan.

[0105] Specifically, it first obtains the overall size and thickness information of the glass to be marked; the geometry, size and position of the area to be marked; the three-dimensional height data of the glass surface (combined with the height-compensated data), and imports the marking design file (such as vector graphics, CAD drawings) to extract the geometric information of the lines, outlines or filled areas of the pattern;

[0106] Based on the design pattern, the complex pattern is decomposed into basic path units (such as straight lines, arcs, curves, etc.), and the starting and ending positions of each unit are determined.

[0107] If the design pattern has a layered structure (such as different areas requiring different laser intensities or depths), it needs to be processed into layers, and the priority and processing order of each layer should be marked.

[0108] Determine the processing sequence of the marking path, prioritize paths with high continuity, and handle cases of path intersections or overlaps to ensure that processing is not repeated or omitted, and reduce unnecessary movement of the laser head.

[0109] Obtain the coordinate information of each processing point in the area to be marked, call the 3D height dataset of the processing table generated by the 3D height data acquisition module, and associate each processing point on the path of the marking area with the corresponding height compensation value;

[0110] Based on the height deviation value of each processing point on the path, a height compensation value for the laser head in the Z-axis direction is generated to ensure that the distance between the laser head and the glass surface remains constant.

[0111] The height compensation data is merged with the XY axis path data to generate a final path plan that includes the XY plane path and Z-axis height adjustment. This path completely describes the dynamic motion trajectory of the laser head in three-dimensional space.

[0112] This involves introducing height compensation data into the path planning to dynamically adjust the Z-axis height of the path and smooth out any sharp turns or high curvature points in the path. This ensures the stability of the laser head's trajectory and processing efficiency, and ensures that the laser focal length is consistent at each point, avoiding uneven marking results caused by height differences.

[0113] Generate a path model, integrating the geometric information of the marked area, the decomposed path units, and the height compensation data into a three-dimensional machining path;

[0114] Convert the generated path data into a standard format that the laser marking machine can recognize (such as G-code or other device-specific codes).

[0115] Save the path file to the specified path and output it along with the processing parameter file;

[0116] The path planning file is transmitted to the laser marking machine control system to ensure that the path data is consistent with the equipment configuration.

[0117] The S500 executes the marking task according to the marking area path planning, that is, it adjusts the XY axis movement and Z axis height of the laser head according to the marking area path planning data.

[0118] Specifically, turn on the laser marking machine and its control system, check the hardware status of the equipment, and ensure that the laser head, XY axis movement module and Z axis height adjustment module are working properly.

[0119] Calibrate the initial distance between the laser head and the processing table to ensure that the laser head is at the reference height (usually the reference point of the processing table).

[0120] Import the path planning file and processing parameter file output by S400 into the control system of the laser marking machine;

[0121] Place the glass to be marked on the processing table, ensuring that the position of the glass is aligned with the position data in the path planning;

[0122] Use positioning devices (such as positioning pins, clamps, or vacuum adsorption) to secure the glass and prevent it from moving during processing;

[0123] Move the laser head to the starting point of the marking area;

[0124] Adjust the XY position of the laser head according to the path planning data to ensure that the area to be marked is completely matched with the planned path;

[0125] Load laser power, scanning speed, and focal length compensation parameters according to the path planning file;

[0126] The system's automatic focusing function is invoked to adjust the Z-axis height of the laser head based on the height compensation data of the marking area, so that the laser focus is always kept on the glass surface;

[0127] The marking program is activated, and the control system executes the movement of the laser head and the marking operation in the sequence planned by the path.

[0128] Control the movement of the XY axes to ensure that the laser head moves precisely along the planned path, while dynamically adjusting the height compensation of the Z axis;

[0129] During the marking process, the Z-axis height of the laser head is adjusted in real time according to the height compensation data in the path planning to ensure that the laser focus is always at the same relative distance to the glass surface.

[0130] Based on the processing parameters in the path planning, the moving speed and laser power of the laser head are dynamically adjusted at different positions on the path to ensure that the marking quality in curved areas and sharp turns is consistent with that in straight areas.

[0131] After completing the marking of the last path unit, the control system automatically moves the laser head back to the initial position;

[0132] Stop laser output, shut down the processing program, and check the marking effect on the glass surface, including line clarity, depth uniformity, and pattern integrity. If a decrease in marking effect is detected, pause subsequent marking tasks and issue a warning signal.

[0133] The S600 obtains marking quality data and monitors changes in marking quality based on the marking quality data.

[0134] If the marking quality is lower than the preset value, re-acquire the three-dimensional height data of each processing point on the working surface of the processing table and generate a new laser head height compensation dataset for each processing position on the processing table.

[0135] Specifically;

[0136] It can activate the marking monitoring module and calibrate the monitoring equipment to accurately capture the surface features of the laser head processing area, ensuring that the camera or other quality monitoring sensors work properly;

[0137] During the marking process, images or laser reflection intensity data of the marking area are collected in real time;

[0138] Image data is used to check the clarity, integrity, and depth uniformity of the lines in the marked area;

[0139] The laser reflection intensity is monitored to assess whether the laser focus is correctly focused on the glass surface;

[0140] Image processing algorithms are used to analyze the collected data to identify the edge sharpness, contrast of light and dark, and integrity of the shape of the lines.

[0141] If an anomaly is detected (such as broken lines, blurriness, or uneven depth), the system will record the location of the anomaly and the specific problem type.

[0142] Based on the requirements of the glass marking task, the detection thresholds for marking quality can be preset, including:

[0143] Sharpness threshold: Whether the edges of lines are sharp;

[0144] Depth threshold: Whether the marking depth is within the target range;

[0145] Shape threshold: Whether the marking pattern is consistent with the plan.

[0146] The real-time detected marking quality data is compared with a preset threshold.

[0147] If all indicators are within the threshold range, the marking quality is considered acceptable.

[0148] If any indicator is below the threshold, the system determines that the marking quality is abnormal, and then re-acquires the three-dimensional height data of each processing point on the working surface of the processing table and generates a new laser head height compensation dataset for each processing position on the processing table.

[0149] The first aspect of this application discloses a control system for laser marking on glass, the system comprising:

[0150] A control system for laser marking on glass, the system comprising:

[0151] 3D height data acquisition module 10: used to acquire 3D height data of each processing point on the working surface of the machining table, form a 3D height dataset, and generate a laser head height compensation dataset for each processing position on the machining table based on the overall 3D height distribution data of the machining table;

[0152] Glass sheet positioning unit: used to place the glass sheet on the processing table and ensure its stability;

[0153] It obtains information on the position, size, and thickness of the original glass sheet and uses this data to determine the specific location of the marking area, providing a basis for subsequent path planning and height adjustment.

[0154] Three-dimensional height data acquisition unit: used to acquire the vertical height data of each machining point on the working surface of the machining table by using contact measurement method or other suitable measurement technology.

[0155] It scans the surface of the machining table with a probe to generate the three-dimensional coordinates of each grid point, and uses these three-dimensional coordinate data to form a three-dimensional height dataset of the entire machining table.

[0156] Height compensation data generation unit: It is used to obtain the three-dimensional height distribution data of different thicknesses of the overall plus workbench and generate a laser head height compensation data set for each processing position on the processing table;

[0157] It obtains the actual thickness value of the glass to be processed (for example, 5 mm), and based on this, classifies and organizes the obtained three-dimensional coordinate data to generate a three-dimensional height distribution model of the glass surface relative to the processing table;

[0158] Assume that the surface of the processing table is completely flat under ideal conditions, the glass is in close contact with the processing table, and the processing distance between the laser head and the glass surface should be the set value x.

[0159] Analyze the actual measurement data and calculate the deviation value between the actual height value y and the set height x of each grid point:

[0160] When y > x, calculate the compensation value as y - x, and this compensation value represents the height that the processing head needs to adjust downward;

[0161] When y < x, calculate the compensation value as x - y, and this compensation value represents the height that the processing head needs to adjust upward.

[0162] Organize the compensation values of all grid points into a height compensation data file, recording the specific compensation values of each processing point and the corresponding grid point coordinates.

[0163] The height compensation data file will be used to guide the dynamic adjustment of the Z-axis direction of the laser head during the processing path planning and execution stages.

[0164] Processing requirement acquisition module 20: It is used to obtain the information of the glass to be marked and the geometric data of the area to be marked on the glass to be marked. The processing requirement acquisition module includes:

[0165] Glass information collection unit: It is used to obtain the basic information of the glass to be marked (such as thickness, specifications), and generate the basic information of the glass, which can be obtained through the glass parameter database or manually input by the user;

[0166] Marking area definition unit: It is used to define the specific position and shape of the area to be marked. It determines the geometric shape of the marking area (such as lines, characters, patterns, etc.) by obtaining the geometric graph and size parameters of the marking area designed by the user, and extracts the size of the marking area and its specific position on the glass;

[0167] Output the information of the glass to be marked and the geometric data of the marking area to the processing plan generation module.

[0168] Processing scheme generation module 30: used to obtain the height compensation data of the marking area based on the information of the glass to be marked and the geometric data of the marking area, and generate the marking area path plan. The processing scheme generation module includes:

[0169] Path planning unit: Used to generate basic path planning based on the location and shape of the marking area; and to optimize the basic path to reduce unnecessary movement, generating the XY axis motion path of the laser head as preliminary path planning data;

[0170] Height Compensation Adjustment Unit: Used to generate a laser head Z-axis height adjustment scheme. It obtains the compensated height data of the processing table and path planning data, and determines the laser head height compensation value for each processing point in the path planning by combining the preliminary path planning data. Based on this, it generates the final path planning, which includes the complete processing path of the marking area (including XY path and Z height adjustment), and is used to guide the execution of laser marking tasks.

[0171] Laser marking execution module 40: used to execute marking tasks according to the marking area path planning, and adjust the XY axis movement and Z axis height of the laser head according to the marking area path planning data; the laser marking execution module includes:

[0172] Path execution unit: Used to control the XY and Z-axis movement of the laser head according to the path plan, that is, to control the movement of the laser head in the XY plane along the complete processing path of the marking area, and to simultaneously adjust the Z-axis height while controlling the movement of the laser head in the XY plane, so as to ensure that the laser focus is constant and accurate to the specified position.

[0173] Laser control unit: Used to control the power and on / off status of laser marking according to the path planning of the marking area, so that it can accurately control the laser switch according to the path planning and adjust the laser power and marking speed according to the material.

[0174] Monitoring and feedback module 50: Used to obtain marking quality data and monitor changes in marking quality based on the marking quality data;

[0175] If the marking quality is lower than the preset value, re-acquire the three-dimensional height data of each processing point on the working surface of the processing table and generate a new laser head height compensation dataset for each processing position on the processing table.

[0176] The monitoring and feedback module includes:

[0177] Real-time monitoring unit: Used to acquire image or reflection intensity data in real time based on the image acquisition device or sensor installed on the equipment, and analyze the marking quality, detect sharpness, depth and shape integrity, so as to obtain real-time quality monitoring data, so that the quality data in the marking process can be monitored through real-time quality monitoring data;

[0178] Anomaly Feedback Unit: Used to provide adjustment suggestions or automatically trigger correction processes for marking anomalies, and its method is as follows:

[0179] Obtain real-time quality monitoring data and compare it with preset quality thresholds;

[0180] If an anomaly is detected, the abnormal area will be marked and a correction process will be automatically triggered.

[0181] Through the foregoing detailed description of a control method and system for laser marking on glass, those skilled in the art can clearly understand the control system for laser marking on glass in this embodiment. Since it corresponds to the method disclosed in the embodiment, the description is relatively simple, and relevant parts can be referred to in the method section.

[0182] Through the above description of the disclosed embodiments, it is believed that those skilled in the art will be able to implement or use this application. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of this application. Therefore, this application is not to be limited to the embodiments shown herein, but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A control method for laser marking on glass, characterized in that, The method includes: Acquire the three-dimensional height data of each machining point on the worktable surface to form a three-dimensional height dataset; Based on the three-dimensional height distribution data of the overall machining table, a laser head height compensation dataset for each machining position on the machining table is generated. The method for generating the three-dimensional height dataset is as follows: Place the glass sheet onto the processing table; Obtain the processable range of the glass on the processing table; Define a two-dimensional grid based on the machinable range and determine the boundaries of the measurement area to ensure that the grid covers the entire working surface of the machining table; Move the measuring probe to the first grid point on the machining table and bring the probe into contact with the table surface; After the probe contacts the platform, it will automatically record the vertical height data of that point based on the contact position; The control system controls the measuring device to move along the grid points one by one through a precision motion platform. When it reaches a grid point, the probe touches and records the height of the point, and the measurement is completed in a set sequence. Based on the distribution of measurement points, the vertical height data of all measurement points are combined with the position information of the corresponding measurement points and recorded as three-dimensional coordinate values. Obtain the thickness information of the glass to be measured, and based on the distribution of the measurement points, organize and record the recorded data to generate a three-dimensional height dataset of the working surface of the processing table corresponding to the glass thickness. The method for generating the laser head height compensation dataset for each processing position on the processing table is as follows: By obtaining the three-dimensional height dataset of the processing table corresponding to glass of different thicknesses, a three-dimensional height distribution model of the working surface of the processing table corresponding to different thicknesses is generated through data processing. Let x be the vertical distance between the laser head and the glass surface; Based on the data in the three-dimensional height distribution model, the vertical distance x between the laser head and the glass surface is compared to calculate the compensation value between the processing head and the glass surface. Compile the compensation values ​​of each grid point obtained from the calculation to generate a three-dimensional height compensation dataset for the processing table; Obtain information about the glass to be marked and the geometric data of the area to be marked on the glass; Based on the information of the glass to be marked and the geometric data of the area to be marked on the glass, obtain the height compensation data of the marking area and generate the marking area path plan. Execute the marking task according to the marked area path plan; Adjust the XY axis movement and Z axis height of the laser head based on the path planning data of the marking area.

2. The control method for laser marking on glass according to claim 1, characterized in that, The method further includes: obtaining marking quality data and monitoring changes in marking quality based on the marking quality data; If the marking quality is lower than the preset value, re-acquire the three-dimensional height data of each processing point on the working surface of the processing table and generate a new laser head height compensation dataset for each processing position on the processing table.

3. The control method for laser marking on glass according to claim 1, characterized in that, The method for obtaining the three-dimensional height data of each machining point on the working surface of the machining table includes: Place the glass sheet onto the processing table; Obtain the three-dimensional height data of the processing stage at various points on the glass sheet; The height differences in thickness data of various glass sheets are obtained, and the three-dimensional height data is compensated to obtain the three-dimensional height data of the processing stage at each point on glass sheets of different thicknesses.

4. The control method for laser marking on glass according to claim 1, characterized in that, The method for obtaining the three-dimensional height data of each machining point on the working surface of the machining table includes: Glass sheets of different thicknesses are placed on the processing table; Obtain the three-dimensional height data of the processing stage at various points on glass sheets of different thicknesses.

5. A control system for laser marking on glass, characterized in that, The system is used to implement the control method for glass laser marking according to any one of claims 1-4, the system comprising: 3D Height Data Acquisition Module: Used to collect 3D height data of each processing point on the working surface of the processing table, form a 3D height dataset, and generate a laser head height compensation dataset for each processing position on the processing table based on the overall 3D height distribution data of the processing table. Processing requirement acquisition module: used to acquire information about the glass to be marked and the geometric data of the area to be marked on the glass; Processing scheme generation module: used to obtain the height compensation data of the marking area based on the information of the glass to be marked and the geometric data of the marking area, and generate the marking area path plan; Laser marking execution module: Executes the marking task according to the marking area path planning, and adjusts the XY axis movement and Z axis height of the laser head according to the marking area path planning data; Monitoring and feedback module: used to obtain marking quality data and monitor changes in marking quality based on the marking quality data; If the marking quality is lower than the preset value, re-acquire the three-dimensional height data of each processing point on the working surface of the processing table and generate a new laser head height compensation dataset for each processing position on the processing table.

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