Display module and display device

Abstract

The invention discloses a display module and a display device.The display module comprises a display area and a non-display area located on one side of the display area and further comprises a display panel, a driving chip and a backlight module, and the driving chip is arranged on the side, facing the display side, of the display panel and located in the non-display area; the driving chip defines a first area in the direction perpendicular to the display panel; the backlight module comprises a light-emitting assembly and a light guide plate, the light-emitting assembly comprises a circuit board and a light-emitting element arranged on the circuit board, the light-emitting element is located on the side, facing the non-display area, of the light guide plate, and the circuit board defines a second area in the direction perpendicular to the display panel; a first thermal induction part is formed on the portion, located in the first area, of the display panel, a second thermal induction part is formed on the portion, located on the side, away from the light-emitting element, of the circuit board and located in the second area, of the display module, and at least part of the first thermal induction part is located outside the second thermal induction part. The heat dissipation capability of the display module provided by the invention is improved.

Description

Technical Field

[0001] The present application belongs to the technical field of display equipment, and in particular, relates to a display module and a display device. Background Art

[0002] The liquid crystal display module includes an IC for driving the deflection of the liquid crystal in the display panel and a backlight module for providing backlight. The IC and the light-emitting components in the backlight module are the two major heat sources in the liquid crystal display panel. The light-emitting components in the edge-entry backlight module are located close to the IC, resulting in concentrated heat sources and great difficulty in heat dissipation. Summary of the invention

[0003] The purpose of this application is to at least solve the problem that the rigidity of the display module cannot be adjusted. This purpose is achieved through the following technical solutions:

[0004] The first aspect of the present application provides a display module, comprising a display area and a non-display area located on one side of the display area, the display module comprising:

[0005] Display panel;

[0006] A driving chip is disposed on a side of the display panel facing the display side and located in the non-display area, and the driving chip defines a first area in a direction perpendicular to the display panel;

[0007] a backlight module, arranged on a side of the display panel away from the display side, the backlight module comprising a light-emitting assembly and a light guide plate, the light-emitting assembly comprising a circuit board and a light-emitting element arranged on the circuit board, the light-emitting element being located on a side of the light guide plate facing the non-display area, and the circuit board defining a second area in a direction perpendicular to the display panel;

[0008] Among them, the portion of the display panel located in the first area forms a first heat sensing portion, and the portion of the display module located on the side of the circuit board away from the light-emitting element and located in the second area forms a second heat sensing portion, and at least part of the first heat sensing portion is located outside the second heat sensing portion.

[0009] In the display module provided by the present application, the driver chip defines a first area in a direction perpendicular to the display panel (i.e., the thickness direction of the display panel, which is also the arrangement direction of the display panel and the backlight module), and the portion of the display panel located in the first area A forms a first heat sensing portion, and the portion of the display panel covered by the orthographic projection of the driver chip on the display panel is the first heat sensing portion, and the first heat sensing portion is located in the display panel and on the side of the driver chip away from the display side. The circuit board defines a second area in a direction perpendicular to the display panel, and the portion of the display module located on the side of the circuit board away from the light-emitting element and located in the second area forms a second heat sensing portion, and the second area is an area of ​​the display module that is arranged opposite to the circuit board in a direction perpendicular to the display panel, and the second heat sensing portion is a portion of the display module that is located in the second area and on the side of the circuit board away from the light-emitting element. At least part of the first heat sensing portion is located outside the second heat sensing portion, including: the first heat sensing portion and the second heat sensing portion are away from each other in a direction perpendicular to the display panel, and / or the first heat sensing portion and the second heat sensing portion are away from each other in a direction parallel to the display panel. In the display panel provided in the present application, by disposing at least part of the first heat sensing part outside the second heat sensing part, the dispersed setting of the heating area in the display module is realized, thereby avoiding the problem of concentrated heating area in the display module, improving the problem of excessively high local temperature in the display module, and thus improving the heat dissipation capacity of the display module. Moreover, the implementation difficulty and cost of disposing at least part of the first heat sensing part outside the second heat sensing part are relatively low.

[0010] In some embodiments of the present application, the backlight module also includes a back plate, which is located on a side of the display panel away from the display side, and the back plate includes a heat dissipation cavity, and the first heat sensing part and / or the second heat sensing part releases heat through the heat dissipation cavity.

[0011] In some embodiments of the present application, the light-emitting element is located on a side of the circuit board facing the display panel, the heat dissipation cavity is located at a position where the back plate and the light-emitting component are opposite to each other in a direction perpendicular to the display panel, the heat dissipation cavity includes a heat dissipation hole that passes through the back plate in a direction perpendicular to the display panel, the circuit board is located in the heat dissipation hole, a preset gap is set between an edge of the circuit board and an edge of the heat dissipation hole, and the circuit board is connected to the back plate.

[0012] In some embodiments of the present application, the display module further includes a heat-conducting layer, which is located on a side of the back plate facing away from the display panel, and the heat-conducting layer is adhesively connected to both the back plate surface and the circuit board surface.

[0013] In some embodiments of the present application, the display module also includes a glue frame located in the non-display area, the light-emitting element is located between the glue frame and the light guide plate, the glue frame includes a first overlapping portion overlapping with the circuit board in a direction perpendicular to the display panel, the light guide plate includes a second overlapping portion overlapping with the circuit board in a direction perpendicular to the display panel, and the circuit board is adhered to the first overlapping portion through a first glue layer, and is adhered to the second overlapping portion through a second glue layer.

[0014] In some embodiments of the present application, the display module further includes a reflective layer, and the reflective layer is filled between the light emitting element, the first overlapping portion, the second overlapping portion and the display panel.

[0015] In some embodiments of the present application, the light-emitting component is located in the non-display area, and the orthographic projection of the driving chip on the display panel is located within the orthographic projection of the circuit board on the display panel.

[0016] In some embodiments of the present application, at least part of the light emitting elements are located between the first region and the display area, and the heat dissipation cavity is located at a position where the back plate and the driving chip are opposite to each other along a direction perpendicular to the display panel.

[0017] In some embodiments of the present application, the backlight module also includes a rubber frame, and the back panel also includes a main body and a first supporting portion, the main body is located on the side of the light guide plate away from the display panel, the first supporting portion extends in the non-display area along the edge of the main body toward the display panel, the heat dissipation cavity is located on the side of the first supporting portion away from the main body, the rubber frame includes a first part and a second part that are interconnected, the first part is in contact connection with the first supporting portion and the main body, and the second part is located between the first supporting portion and the display panel and extends toward the side away from the display area.

[0018] In some embodiments of the present application, a side surface of the second portion facing away from the display panel is flush with an end surface of the first supporting portion close to the display panel.

[0019] In some embodiments of the present application, the rubber frame further includes a reinforcing rib, wherein the reinforcing rib is located in the heat dissipation cavity, one end of the reinforcing rib is connected to the second part, and the other end is connected to a side of the first support portion close to the heat dissipation cavity.

[0020] In some embodiments of the present application, the backlight module further includes a rubber frame, the back plate further includes a main body, a first supporting portion and a second supporting portion, the first supporting portion extends in the non-display area along the edge of the main body toward the direction close to the display panel, the second supporting portion extends from an end of the first supporting portion close to the display panel toward a direction away from the display area, and the heat dissipation cavity is located on a side of the first supporting portion away from the main body and a side of the second supporting portion away from the display panel;

[0021] The rubber frame is located at a side of the first supporting portion close to the light guide plate, and is contact-connected with a surface of the first supporting portion and a surface of the main body portion.

[0022] In some embodiments of the present application, the back plate further includes a plurality of heat dissipation fins disposed at intervals, wherein the heat dissipation fins are located in the heat dissipation cavity and connected to a surface of a side of the second support portion facing away from the display panel.

[0023] In some embodiments of the present application, the display module also includes a buffer layer and an adhesive layer located in the non-display area, the buffer layer contacts the side of the display panel away from the display side, the adhesive layer is bonded and fixed to the side surface of the display panel away from the display side and the side surface of the buffer layer away from the display side, the material of the buffer layer includes silicone, and the thermal conductivity of the silicone is in the range of 5W / (m·K)-8W / (m·K).

[0024] The second aspect of the present application further provides a display device, comprising any display module provided in the first aspect of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Various other advantages and benefits will become apparent to those of ordinary skill in the art by reading the detailed description of the preferred embodiments below. The accompanying drawings are only for the purpose of illustrating the preferred embodiments and are not to be considered as limiting the present application. Also, the same reference numerals are used throughout the accompanying drawings to represent the same components. In the accompanying drawings:

[0026] Figure 1a It is an axonometric diagram of a display module in the prior art;

[0027] Figure 1b yes Figure 1a The main view of

[0028] Figure 1c yes Figure 1a Rear view of

[0029] Figure 1d yes Figure 1b A cross-sectional view along the Y-Y' line;

[0030] Figure 2a is a structural schematic diagram of a first display module provided in an embodiment of the present application;

[0031] Figure 2b This is a front view of the first display module provided in the embodiment of the present application;

[0032] Figure 2c It is a rear view of the first display module provided in the embodiment of the present application;

[0033] Figure 2d yes Figure 2b Sectional view along the middle line M-M';

[0034] Figure 2e It is a schematic diagram of the first display module provided in the embodiment of the present application when the lamp glue is maintained under pressure;

[0035] Figure 3a is a structural schematic diagram of a second display module provided in an embodiment of the present application;

[0036] Figure 3b This is a front view of a second display module provided in an embodiment of the present application;

[0037] Figure 3c is a rear view of the second display module provided in the embodiment of the present application;

[0038] Figure 3d yes Figure 3b A cross-sectional view taken along the N-N' line;

[0039] Figure 3e is a partial structural diagram of a third display module provided in an embodiment of the present application;

[0040] Figure 4a is a schematic structural diagram of a third display module provided in an embodiment of the present application;

[0041] Figure 4b This is a front view of a third display module provided in an embodiment of the present application;

[0042] Figure 4c is a rear view of a third display module provided in an embodiment of the present application;

[0043] Figure 4d yes Figure 4b Sectional view along P-P';

[0044] Figure 5 is a partial structural cross-sectional view of a fourth display module provided in an embodiment of the present application;

[0045] Figure 6 It is a partial structural cross-sectional view of the fifth display module provided in an embodiment of the present application.

[0046] The reference numerals are as follows:

[0047] 1. Display module; AA, display area; NA, non-display area; 10, second heat sensing part; 11, display panel; 110, first heat sensing part; 12, driver chip; A1, first area; 13, backlight module; 131, light emitting component; 1311, circuit board; 1312, light emitting element; 132, light guide plate; 1321, second overlapping part; 133, optical film material; A2, second area; 14, back plate; 140, heat dissipation cavity; 141, main body; 142. First support portion; 143. Second support portion; 144. Heat sink fin; L. Preset gap; 15. Heat conductive layer; 16. Glue frame; 161. First overlapping portion; 163. First portion; 164. Second portion; 165. Reinforcing ribs; 17. First glue layer; 18. Second glue layer; 19. Reflective layer; 20. Buffer layer; 21. Adhesive layer; 22. Heat conductive sheet; 23. Flexible circuit board; 31. First pressure head; 32. Second pressure head; 2. Display device. DETAILED DESCRIPTION

[0048] The exemplary embodiments of the present disclosure will be described in more detail below with reference to the accompanying drawings. Although the exemplary embodiments of the present disclosure are shown in the accompanying drawings, it should be understood that the present disclosure can be implemented in various forms and should not be limited by the embodiments described herein. On the contrary, these embodiments are provided in order to enable a more thorough understanding of the present disclosure and to fully convey the scope of the present disclosure to those skilled in the art.

[0049] It should be understood that the terms used herein are only for the purpose of describing specific example embodiments and are not intended to be limiting. Unless the context clearly indicates otherwise, the singular forms "one", "an" and "said" as used herein may also be meant to include plural forms. The terms "include", "comprise", "contain", and "have" are inclusive, and therefore specify the existence of stated features, steps, operations, elements and / or parts, but do not exclude the existence or addition of one or more other features, steps, operations, elements, parts, and / or combinations thereof. The method steps, processes, and operations described herein are not interpreted as necessarily requiring them to be performed in the specific order described or illustrated, unless the execution order is clearly indicated. It should also be understood that additional or alternative steps may be used.

[0050] Although the terms first, second, third, etc. can be used in the text to describe multiple elements, components, regions, layers and / or sections, these elements, components, regions, layers and / or sections should not be limited by these terms. These terms can only be used to distinguish an element, component, region, layer or section from another region, layer or section. Unless the context clearly indicates, terms such as "first", "second" and other numerical terms do not imply order or sequence when used in the text. Therefore, the first element, component, region, layer or section discussed below can be referred to as the second element, component, region, layer or section without departing from the teaching of the example embodiments.

[0051] For ease of description, spatial relative terms may be used herein to describe the relationship of one element or feature relative to another element or feature as shown in the figure, such as "inside", "outside", "inner side", "outer side", "below", "below", "above", "above", etc. Such spatial relative terms are intended to include different orientations of the device in use or operation in addition to the orientation depicted in the figure. For example, if the device in the figure is turned over, then the elements described as "below other elements or features" or "below other elements or features" will subsequently be oriented as "above other elements or features" or "above other elements or features". Therefore, the example term "below..." can include both upper and lower orientations. The device can be oriented otherwise (rotated 90 degrees or in other directions) and the spatial relative descriptors used in the text are interpreted accordingly.

[0052] Research has found that the reason why the display module has difficulty in heat dissipation is: Figure 1a to Figure 1d As shown, the internal structure of the display module 1' is compact, and the positions of the two major heat sources, the light-emitting components (including the light-emitting element 1312' and the circuit board 1311') and the driver chip 12' in the display module 1' are close, resulting in concentrated heat sources. It is difficult to effectively cool the display module 1' through traditional passive heat dissipation methods, making it difficult to improve the heat dissipation problem of the display module in the prior art. The present application provides a display module and a display device, which can improve the heat dissipation performance of the display module.

[0053] like Figure 2a to Figure 2dAs shown, according to the embodiment of the present application, a display module 1 is proposed, the display module 1 includes a display area AA and a non-display area NA located on one side of the display area AA, the display module 1 includes a display panel 11, a driver chip 12 and a backlight module 13, the driver chip 12 is arranged on the side of the display panel 11 facing the display side and located in the non-display area NA, and the driver chip 12 defines a first area A1 in a direction perpendicular to the display panel 11. The backlight module 13 is arranged on the side of the display panel 11 away from the display side, the backlight module 13 includes a light-emitting component 131 and a light guide plate 132, the light-emitting component 131 includes a circuit board 1311 and a light-emitting element 1312 arranged on the circuit board 1311, the light-emitting element 1312 is located on the side of the light guide plate 132 facing the non-display area NA, and the circuit board 1311 defines a second area A2 in a direction perpendicular to the display panel 11. Among them, the portion of the display panel 11 located in the first area A1 forms a first thermal sensing portion 110, and the portion of the display module 1 located on the side of the circuit board 1311 away from the light-emitting element 1312 and located in the second area A2 forms a second thermal sensing portion 10, and at least part of the first thermal sensing portion 110 is located outside the second thermal sensing portion 10.

[0054] The display module 1 provided in the present application includes a display area AA and a non-display area NA located on one side of the display area AA, the display area AA is used to realize the display function, and the non-display area NA is arranged around at least part of the circumference of the display area AA. The display module 1 includes a display panel 11, a driver chip 12 connected to the display panel 11, and a backlight module 13 for providing backlight for the display panel 11. The driver chip 12 is located in the non-display area NA and is located on the side of the display panel 11 facing the display side. The driver chip 12 is electrically connected to the edge of the display panel 11 and is used to drive the display panel 11 for display. The backlight module 13 is used to provide backlight for the display panel 11 to realize the display function, and the backlight module 13 is located on the side of the display panel 11 away from the display side. The backlight module 13 includes a light-emitting component 131 and a light guide plate 132, and the light-emitting component 131 includes a light-emitting element 1312 and a circuit board 1311 stacked in a direction perpendicular to the display panel 11. The backlight module 13 is an edge-entry backlight module 13, that is, the light-emitting element 1312 is located on the side of the light guide plate 132 facing the non-display area NA, and the light emitted by the light-emitting element 1312 enters the light guide plate 132 from the side of the light guide plate 132 close to the light-emitting element 1312, and is guided by the light guide plate 132, thereby providing a surface light source for the display panel 11.

[0055] In the display module 1 provided in the present application, the driver chip 12 defines a first area A1 in a direction perpendicular to the display panel 11 (i.e., the thickness direction of the display panel 11, which is also the arrangement direction of the display panel 11 and the backlight module 13). The portion of the display panel 11 located in the first area A1 forms a first heat sensing portion 110. The portion of the display panel 11 covered by the orthographic projection of the driver chip 12 on the display panel 11 is the first heat sensing portion 110. The first heat sensing portion 110 is located in the display panel 11 and on the side of the driver chip 12 away from the display side. The circuit board 1311 defines a second area A2 in a direction perpendicular to the display panel 11. A portion of the display module 1 located on a side of the circuit board 1311 away from the light-emitting element 1312 and located in the second area A2 forms a second heat-sensing portion 10. The second area A2 is a region of the display module 1 that is arranged opposite to the circuit board 1311 in a direction perpendicular to the display panel 11. The second heat-sensing portion 10 is a portion of the display module 1 that is located in the second area A2 and on a side of the circuit board 1311 away from the light-emitting element 1312. At least a portion of the first heat-sensing portion 110 is located outside the second heat-sensing portion 10, including: the first heat-sensing portion 110 and the second heat-sensing portion 10 are away from each other in a direction perpendicular to the display panel 11, and / or the first heat-sensing portion 110 and the second heat-sensing portion 10 are away from each other in a direction parallel to the display panel 11. In the display panel 11 provided in the present application, by disposing at least part of the first heat sensing portion 110 outside the second heat sensing portion 10, a dispersed arrangement of the heating area in the display module 1 is achieved, thereby avoiding the problem of concentrated heating areas in the display module 1, improving the problem of excessively high local temperatures in the display module 1, and thus improving the heat dissipation capacity of the display module 1. Moreover, the implementation difficulty and cost of disposing at least part of the first heat sensing portion 110 outside the second heat sensing portion 10 are relatively low.

[0056] In the above implementation, the display side refers to the side of the display module 1 used for display, that is, the side where the user is located when the user views the picture displayed by the display module 1 .

[0057] In a feasible implementation, the display panel 11 includes an array substrate and a liquid crystal layer located on the side of the array substrate facing the display side, wherein the side of the liquid crystal layer facing away from the array substrate is the display side.

[0058] Specifically, the display panel 11 includes an array substrate and a color filter substrate (not shown in the figure) arranged relatively to each other. The array substrate is close to the backlight module 13 relative to the color filter substrate. The array substrate includes a protruding portion protruding relative to the color filter substrate, the protruding portion is located in the non-display area NA, and the driving chip 12 is arranged on the surface of the protruding portion.

[0059] In a feasible embodiment, the display module 1 further includes a filter, a polarizer, a cover plate, etc. located on the side of the liquid crystal layer facing the display, and the filter, polarizer, and cover plate are stacked in sequence in a direction away from the liquid crystal layer. Specifically, the display module 1 further includes a flexible circuit board 23 connected to the portion of the display panel 11 located in the non-display area NA, the first end of the flexible circuit board 23 is connected to the side of the display panel 11 facing the display side, and the first end of the flexible circuit board 23 is connected to the side of the display panel 11 located at the edge of the driver chip 12 close to the display panel 11. The second end of the flexible circuit board 23 passes through the edge of the display panel 11 and is bent to the side of the display panel 11 and the backlight module 13 away from the display side.

[0060] Specifically, the display module 1 also includes a heat conductive sheet 22, which is connected to the side of the driving chip 12 facing the display side and the side of the flexible circuit board 23 connected to the display panel 11 facing the display side, and the heat conductive sheet 22 and the flexible circuit board 23 are synchronously bent in a direction away from the display side.

[0061] Specifically, the material of the heat conductive sheet 22 may include graphite.

[0062] In a feasible implementation, the backlight module 13 further includes a back plate 14 , which is located on the side of the display panel 11 away from the display side. The back plate 14 includes a heat dissipation cavity 140 , and the first heat sensing part 110 and / or the second heat sensing part 10 releases heat through the heat dissipation cavity 140 .

[0063] In the above embodiment, the backlight module 13 further includes a back plate 14 , and the back plate 14 is used to achieve internal support of the display module 1 .

[0064] In the above embodiment, the backlight module 13 further includes a back plate 14, and a heat dissipation cavity 140 is formed on the back plate 14. The heat dissipation cavity 140 is provided on the back plate 14 to improve the heat dissipation speed of the first heat sensing portion 110 and / or the second heat sensing portion 10, thereby improving the heat dissipation performance of the display module 1. In a feasible embodiment, as Figure 2d As shown, the light-emitting element 1312 is located on the side of the circuit board 1311 facing the display panel 11, the heat dissipation cavity 140 is located at a position where the back plate 14 and the light-emitting component 131 are opposite to each other in a direction perpendicular to the display panel 11, the heat dissipation cavity 140 includes a heat dissipation hole that penetrates the back plate 14 in a direction perpendicular to the display panel 11, the circuit board 1311 is located in the heat dissipation hole, a preset gap L is set between the edge of the circuit board 1311 and the edge of the heat dissipation hole, and the circuit board 1311 is connected to the back plate 14.

[0065] In the above embodiment, the circuit board 1311 is connected to the back plate 14, and the light-emitting element 1312 is connected to the side of the circuit board 1311 facing the display panel 11. On the one hand, the light-emitting component 131 can be fixed by the back plate 14. On the other hand, by arranging the circuit board 1311 in the light-emitting component 131 on the side of the light-emitting element 1312 away from the display panel 11, the first thermal sensing portion 110 and the second thermal sensing portion 10 can be moved away from each other in a direction perpendicular to the display panel 11.

[0066] At this time, the first heat sensing portion 110 is located in the display panel 11, and is located in the area where the display panel 11 and the driving chip 12 are opposite in a direction perpendicular to the display panel 11, that is, it is located in the area covered by the projection path when the driving chip 12 is projected in the direction perpendicular to the display panel 11. The second heat sensing portion 10 is located in the display module 1, and is located in the area covered by the projection path when the display module 1 is projected to the side away from the display panel 11 through the circuit board 1311. Since the second heat sensing portion 10 does not include the part in the display panel 11 at this time, the first heat sensing portion 110 is located outside the second heat sensing portion 10, that is, there is no overlap between the two, thereby reducing the interference between the two during the heat dissipation process and improving the problem of concentrated heat dissipation positions in the display module 1.

[0067] In the above embodiment, the circuit board 1311 is connected to the back plate 14 , so that the heat of the circuit board 1311 is transferred to the back plate 14 for heat dissipation, which can effectively improve the heat dissipation efficiency of the circuit board 1311 .

[0068] In the above embodiment, a heat dissipation cavity 140 is provided at a position where the back plate 14 and the light emitting assembly 131 are opposite to each other in a direction perpendicular to the display panel 11, so that the heat dissipation of the second heat sensing portion 10 can be further performed. Specifically, the heat dissipation cavity 140 includes a heat dissipation hole penetrating the back plate 14 in a direction perpendicular to the display panel 11, and the circuit board 1311 is located in the heat dissipation hole, so that the heat dissipation of the circuit board 1311 can be further performed.

[0069] In the above embodiment, disposing the circuit board 1311 in the heat dissipation hole of the back plate 14 can effectively utilize the internal space of the display module 1 and avoid the increase in thickness of the display module 1 caused by placing the circuit board 1311 on the side of the light emitting element 1312 away from the display panel 11.

[0070] A preset gap L is set between the edge of the circuit board 1311 and the edge of the heat dissipation hole. On the one hand, it can avoid process fluctuations that affect the assembly yield of the circuit board 1311 and the back plate 14; on the other hand, it can improve the heat exchange efficiency between the circuit board 1311 and the air, thereby further improving the heat dissipation performance.

[0071] In a possible implementation, Figure 2d As shown, the display module 1 further includes a heat-conducting layer 15 , which is located on the side of the back plate 14 away from the display panel 11 , and the heat-conducting layer 15 is bonded to the surface of the back plate 14 and the surface of the circuit board 1311 .

[0072] In the above embodiment, the display module 1 further includes a heat-conducting layer 15, which is used to realize the connection between the circuit board 1311 and the back plate 14, and the heat-conducting layer 15 is used to transfer the heat of the circuit board 1311 to the back plate 14. Specifically, the heat-conducting layer 15 is located on the side of the circuit board 1311 and the back plate 14 away from the display panel 11, and the heat-conducting layer 15 is respectively bonded and fixed to the circuit board 1311 and the back plate 14, so that the heat of the circuit board 1311 can be better transferred to the back plate 14.

[0073] Specifically, the material of the heat conducting layer 15 may include graphite.

[0074] In the above embodiment, the orthographic projection of the circuit board 1311 on the thermal conductive layer 15 is located inside the thermal conductive layer 15 . On the one hand, the contact area between the circuit board 1311 and the thermal conductive layer 15 can be increased, thereby further improving the heat dissipation effect of the circuit board 1311 . On the other hand, the supporting effect of the thermal conductive layer 15 on the circuit board 1311 can be improved.

[0075] In the above embodiment, in order to ensure the supporting strength of the back plate 14 after the heat dissipation holes are opened, and to reduce the step difference between the side surface of the back plate 14 facing away from the display panel 11 and the side surface of the circuit board 1311 facing away from the display panel 11, the material of the back plate 14 can be selected to be a material with higher strength, such as stainless steel. The thickness of the stainless steel back plate 14 can be 0.1 mm.

[0076] By using a back plate 14 made of a stronger material, the thickness of the back plate can be reduced, thereby reducing the step difference between the side surface of the back plate 14 away from the display panel and the side surface of the circuit board away from the display panel, thereby improving the bonding yield of the circuit board, the back plate and the thermal conductive layer 15.

[0077] In a possible implementation, Figure 2d As shown, a preset gap L is provided between the edge of the circuit board 1311 and the edge of the heat dissipation hole, and the size range of the preset gap L is 0.2 mm to 1 mm.

[0078] In the above embodiment, the size range of the preset gap L is set to 0.2mm~1mm, which can reduce the impact of process fluctuations on the assembly yield of the circuit board 1311 and the heat dissipation holes on the one hand; on the other hand, it can avoid setting the area of ​​the heat dissipation holes to be too large to affect the support and heat dissipation area of ​​the back plate 14.

[0079] In a feasible implementation manner, the bonding width between the heat conducting layer 15 and the surface of the back plate 14 is greater than or equal to 0.5 mm.

[0080] In the above embodiment, the thermal conductive layer 15 is bonded and fixed to the surface of the back plate 14 on the side facing away from the display panel 11 by the adhesive layer 21, and the dimension of the positive projection of the adhesive layer 21 on the back plate 14 along the arrangement direction of the circuit board 1311 and the back plate 14 is greater than or equal to 0.5 mm, thereby ensuring the bonding strength between the thermal conductive layer 15 and the back plate 14.

[0081] In a possible implementation, Figure 2d As shown, the display module 1 also includes a glue frame 16 located in the non-display area NA, the light-emitting element 1312 is located between the glue frame 16 and the light guide plate 132, the glue frame 16 includes a first overlapping portion 161 overlapping with the circuit board 1311 in a direction perpendicular to the display panel 11, the light guide plate 132 includes a second overlapping portion 1321 overlapping with the circuit board 1311 in a direction perpendicular to the display panel 11, and the circuit board 1311 is adhered to the first overlapping portion 161 through a first glue layer 17, and is adhered to the second overlapping portion 1321 through a second glue layer 18.

[0082] In the above embodiment, the display module 1 further includes a plastic frame 16, which is located in the non-display area NA and is used to package the display module 1 to ensure the yield of the display module 1. Specifically, the plastic frame 16 may be an annular structure arranged circumferentially around the display area AA.

[0083] In the above embodiment, the plastic frame 16 is located on the side of the light emitting element 1312 away from the light guide plate 132 , which can prevent the backlight module 13 from being corroded by water and oxygen, thereby improving the yield of the backlight module 13 .

[0084] In the above embodiment, the side surface of the circuit board 1311 facing away from the display panel 11 is connected to the back plate 14 through the heat conductive layer 15, and the side surface of the circuit board 1311 facing the display panel 11 is connected to the plastic frame 16 and the light guide plate 132 respectively, thereby improving the stability of the structure inside the display module 1.

[0085] Specifically, the glue frame 16 includes a first overlapping portion 161 overlapping with the circuit board 1311 in a direction perpendicular to the display panel 11, and the light guide plate 132 includes a second overlapping portion 1321 overlapping with the circuit board 1311 in a direction perpendicular to the display panel 11. The circuit board 1311 is adhered to the first overlapping portion 161 through a first glue layer 17, and is adhered to the second overlapping portion 1321 through a second glue layer 18, wherein the projection of the first glue layer 17 on the display panel 11 is located within the projection of the glue frame 16 on the display panel 11, and the projection of the second glue layer 18 on the display panel 11 is located within the projection of the light guide plate 132 on the display panel 11, so that the first glue layer 17 does not protrude from the edge of the glue frame 16, and the second glue layer 18 does not protrude from the edge of the light guide plate 132, so that the first glue layer 17 and the second glue layer 18 can be prevented from being mistakenly bonded to other components, that is, the assembly yield is improved.

[0086] In a possible implementation, Figure 2d As shown, the display module 1 further includes a reflective layer 19 , which is filled between the light emitting element 1312 , the first overlapping portion 161 , the second overlapping portion 1321 and the display panel 11 .

[0087] In the above embodiment, the display module 1 further includes a reflective layer 19 , and the reflective layer 19 is used to reflect the light of the light emitting element 1312 .

[0088] Specifically, a receiving cavity for receiving the light emitting element 1312 is formed between the light guide plate 132 and the rubber frame 16, and the light emitting element 1312 is disposed in the receiving cavity. The light emitted by the light emitting element 1312 enters the light guide plate 132 from the side of the receiving cavity. In order to improve the light output brightness of the light emitting component 131, a reflective layer 19 can be provided on the side of the light emitting element 1312 away from the circuit board 1311, and the light emitted by the light emitting element 1312 toward the reflective layer 19 is reflected into the receiving cavity and then enters the light guide plate 132, thereby improving the brightness of the light emitting component 131.

[0089] Specifically, the reflective layer 19 may be made of a reflective material with a reflectivity greater than or equal to 90%.

[0090] Specifically, the reflective material may include polyethylene terephthalate (PET) material.

[0091] Specifically, the reflective layer 19 can be made of a hard substrate and filled between the light emitting element 1312, the first overlapping portion 161, the second overlapping portion 1321 and the display panel 11, so that the light glue pressure holding operation can be performed when the backlight module 13 is assembled to ensure the light glue activation rate.

[0092] Specifically, the surface of the first overlapping portion 161 facing away from the circuit board 1311 may be flush with the surface of the second overlapping portion 1321 facing away from the circuit board 1311. The surface of the reflective layer 19 facing away from the display side is in direct contact with the first overlapping portion 161 and the second overlapping portion 1321, and the surface of the reflective layer 19 facing the display side is in direct contact with the upper film layer, so that the reflective layer 19 fills the portion between the first overlapping portion 161, the second overlapping portion 1321 and the display panel 11.

[0093] like Figure 2e As shown, the specific process of the lamp glue pressure holding operation is: the first pressing head 31 is in contact with the surface of the side of the reflective layer 19, the glue frame 16 and the light guide plate 132 facing the display panel 11, and the second pressing head 32 is in contact with the surface of the side of the circuit board 1311 and the back plate away from the display panel. The first pressing head 31 and the second pressing head 32 are pressed against each other to achieve the extrusion of the first glue layer 17 and the second glue layer 18. The pressing process of the first pressing head 31 and the second pressing head 32 lasts for a period of time, that is, the pressure is held. The purpose of the pressure holding is to make the glue in the first glue layer 17 and the second glue layer 18 evenly distributed and fully cured, so as to improve the fixing effect of the circuit board 1311 and prevent the circuit board 1311 from falling off or generating bubbles to affect the product quality.

[0094] Specifically, in order to provide uniform pressure to the first glue layer 17 and the second glue layer 18 on the side facing the display panel 11, it is necessary to keep the first pressing head 31 in contact with the reflective layer 19 and provide support for the first pressing head 31 through the reflective layer 19. Therefore, the reflective layer 19 needs to use a hard substrate and fill the space between the glue frame 16 and the light guide layer on the side facing the display panel 11.

[0095] In a feasible embodiment, the backlight module 13 also includes a reflective sheet 24, the light guide plate 132 is located between the display panel 11 and the back plate 14, the reflective sheet 24 is located between the light guide plate 132 and the back plate 14, and the light guide plate 132 includes a first portion 163 located in the display area AA in the orthographic projection of the display panel 11, and the first portion 163 is located within the orthographic projection of the reflective sheet 24 on the display panel 11.

[0096] In the above embodiment, the backlight module 13 further includes a reflective sheet 24 located on a side of the light guide plate 132 away from the display panel 11 for reflecting light to enhance the light guiding effect of the light guide plate 132 and the backlight brightness of the backlight module 13 .

[0097] Specifically, the reflective sheet 24 is at least partially located in the display area AA, and the orthographic projection of the portion of the light guide plate 132 located in the display area AA on the display panel 11 is located within the orthographic projection of the reflective sheet 24 on the display panel 11, so that the light in the portion of the light guide plate 132 located in the display area AA can be fully reflected by the reflective sheet 24 to enhance the backlight effect.

[0098] In a possible implementation, Figure 2d As shown, the light emitting component 131 is located in the non-display area NA, and the orthographic projection of the driving chip 12 on the display panel 11 is located within the orthographic projection of the circuit board 1311 on the display panel 11. At this time, only the second heat sensing part 10 releases heat through the heat dissipation cavity.

[0099] Specifically, when the circuit board 1311 in the light emitting assembly 131 is located on the side of the light emitting element 1312 away from the display panel 11 , the orthographic projection of the light emitting element 1312 on the display panel 11 is located within the orthographic projection of the driving chip 12 on the display panel 11 .

[0100] In the above embodiment, on the one hand, the width of the non-display area NA can be reduced, thereby increasing the area ratio of the display area AA to the non-display area NA to improve the display effect; on the other hand, the first thermal sensing portion 110 and the second thermal sensing portion 10 are moved away from each other in a direction perpendicular to the display panel 11, thereby improving the problem of concentrated heat areas in the display module 1 and improving the heat dissipation capacity of the display module 1.

[0101] Specifically, the first heat sensing portion 110 is located in the display panel 11, including a structure in which the display panel 11 is located in the first area A1, and specifically may include a structure in the array substrate located in the non-display area, such as a portion in the substrate and a portion in the conductive layer on the substrate. Figure 2d As shown, the second thermal sensing unit 10 includes a structure within the display module, specifically including a thermal conductive sheet 22 , a flexible circuit board 23 and a thermal conductive layer 15 located in the second area A2 and stacked from a side away from the display panel 11 to a side close to the display panel 11 .

[0102] In the above implementation mode, as shown in Table 1 and Figure 2d As shown, Figure 2d In Example 1, the temperature of the light-emitting element 1312 can be reduced by 9.7% on average. Since the lower the operating temperature of the light-emitting element 1312, the higher the luminous efficiency, this embodiment can effectively improve the luminous efficiency of the light-emitting element 1312. The temperature of the driver chip 12 can be reduced by 5.5% on average; the lower temperature of the driver chip 12 can improve the performance of the driver chip 12 and increase the life of the driver chip 12. The temperature difference between the center of the driver chip 12 and the center of the display panel 11 is 6.1°C, which is lower than 8.7°C in the prior art, that is, the thermal resistance of the heat conduction path between the driver chip 12 and the display panel 11 is reduced to a certain extent, thereby greatly improving the heat dissipation capacity of the display module 1.

[0103]

[0104]

[0105] Table 1: Comparison of test point temperatures between comparative example and embodiment 1

[0106] In a possible implementation, Figure 3a to Figure 3d As shown, at least part of the light emitting element 1312 is located between the first area A1 and the display area AA, and the heat dissipation cavity 140 is located at a position where the back plate 14 and the driving chip 12 are opposite to each other along a direction perpendicular to the display panel 11 .

[0107] When the display module 1 has a low requirement for a narrow frame, that is, when the frame can be wider, the heat dissipation capacity of the display module 1 can be improved by moving the first heat sensing portion 110 and the second heat sensing portion 10 away from each other in a direction parallel to the display panel 11. Specifically, the second heat sensing portion 10 is located on a side of the first heat sensing portion 110 close to the display area AA.

[0108] In the above embodiment, at least part of the light emitting element 1312 is located between the first area A1 and the display area AA, that is, the orthographic projection of the light emitting element 1312 on the display panel 11 may not overlap or partially overlap with the orthographic projection of the driving chip 12 on the display panel 11 .

[0109] In the above embodiment, the light emitting assembly 131 can adopt the design in the above embodiment, that is, the light emitting element 1312 is located on the side of the circuit board 1311 facing the display panel 11. In this case, the first heat sensing portion 110 and the second heat sensing portion 10 can be moved away from each other in a direction parallel to the display panel 11, and the first heat sensing portion 110 and the second heat sensing portion 10 can be moved away from each other in a direction perpendicular to the display panel 11, so as to further improve the heat dissipation effect.

[0110] Alternatively, in the light emitting assembly 131, the light emitting element 1312 may be located on a side of the circuit board 1311 away from the display panel 11. In this case, the first heat sensing portion 110 and the second heat sensing portion 10 may be moved away from each other in a direction parallel to the display panel 11.

[0111] In the above embodiment, the heat dissipation cavity 140 is located at a position where the back plate 14 and the driving chip 12 are opposite to each other in a direction perpendicular to the display panel 11, so that the heat of the first heat sensing part 110 can be released through the heat dissipation cavity 140. In a feasible embodiment, as Figure 3d and Figure 3eAs shown, the backlight module 13 also includes a rubber frame 16, and the back plate 14 also includes a main body 141 and a first supporting portion 142. The main body 141 is located on the side of the light guide plate 132 away from the display panel 11, and the first supporting portion 142 extends along the edge of the main body 141 in the non-display area NA toward the display panel 11. The heat dissipation cavity 140 is located on the side of the first supporting portion 142 away from the main body 141. The rubber frame 16 includes a first part 163 and a second part 164 that are interconnected. The first part 163 is in contact connection with the first supporting portion 142 and the main body 141, and the second part 164 is located between the first supporting portion 142 and the display panel 11 and extends toward the side away from the display area AA.

[0112] In the above embodiment, when at least part of the light emitting element 1312 is located between the first area A1 and the display area AA, the light emitting assembly 131 moves toward the display area AA, so the space in the non-display area NA becomes larger. At this time, the back plate 14 and the plastic frame 16 can be further designed to enhance the support effect of the upper components and the heat dissipation effect.

[0113] Specifically, the back plate 14 includes a heat dissipation cavity 140, a main body 141 and a first support portion 142. The main body 141 is located on the side of the light guide plate 132 away from the display panel 11, and is used to support components such as the light guide plate 132, the reflector 24, and the heat conductive layer 15. The first support portion 142 extends along the edge of the main body 141 in the non-display area NA in a direction close to the display panel 11, and the first support portion 142 is inclined relative to the main body 141. The first support portion 142 is used to support the rubber frame 16 and the part of the display panel 11 located in the non-display area NA, the driving chip 12, etc. The edge of the side of the part of the back plate 14 located in the non-display area NA away from the display area AA is retracted toward the side close to the display area AA to form a heat dissipation cavity 140. The heat dissipation cavity 140 can dissipate heat from the first heat sensing portion 110 from the side of the first heat sensing portion 110 away from the display side, so as to further improve the heat dissipation effect of the display module 1.

[0114] In the above embodiment, the plastic frame 16 includes a first portion 163 and a second portion 164 connected to each other. The first portion 163 is in contact connection with the first support portion 142 and the main body portion 141. The first portion 163 has a large contact area with the back plate 14 and a high connection strength. The second portion 164 is located between the first support portion 142 and the display panel 11 and extends toward a side away from the display area AA. The second portion 164 is used to provide buffering and sealing for the structure located in the second portion 164 away from the first support portion 142, and cooperates with the back plate 14 to provide support for the display panel 11. Specifically, the first support portion 142 and the main body portion 141 can be arranged vertically.

[0115] In the above embodiment, the second portion 164 extends toward the side away from the display area AA and protrudes out of the first support portion 142, so that the side of the second portion 164 away from the display panel 11 and the side of the first support portion 142 away from the display area AA form a heat dissipation cavity 140, which can further improve the heat dissipation effect.

[0116] In a possible implementation, Figure 3d As shown, the display module 1 further includes a buffer layer 20 and an adhesive layer 21 located in the non-display area NA. The buffer layer 20 and the adhesive layer 21 are sequentially disposed between the display panel 11 and the second portion 164 .

[0117] In the above embodiment, a buffer layer 20 and an adhesive layer 21 are provided between the non-display area NA and the second portion 164 on the surface of the display panel 11 facing away from the display side, and the buffer layer 20 and the second portion 164 are bonded and fixed by the adhesive layer 21. The buffer layer 20 is used to provide a buffer for the display panel 11 to protect the display panel 11.

[0118] Specifically, the material of the buffer layer 20 includes foam or silica gel.

[0119] In a possible implementation, Figure 3e As shown, a side surface of the second portion 164 facing away from the display panel 11 is flush with an end surface of the first support portion 142 close to the display panel 11 .

[0120] In the above embodiment, the side surface of the second portion 164 facing away from the display panel 11 does not protrude toward the side facing away from the display panel 11 from the end surface of the first support portion 142 close to the display panel 11, that is, the second portion 164 is thinner, so that the heat dissipation cavity 140 formed between the side surface of the second portion 164 facing away from the display panel 11 and the side surface of the first support portion 142 away from the display area AA is larger, so as to further enhance the convection heat exchange capacity under the first thermal sensing portion 110, thereby enhancing the heat dissipation effect of the first thermal sensing portion 110.

[0121] In a possible implementation, Figure 3e As shown, the plastic frame 16 further includes a reinforcing rib 165 , which is located in the heat dissipation cavity 140 , one end of the reinforcing rib 165 is connected to the second portion 164 , and the other end is connected to a side of the first support portion 142 close to the heat dissipation cavity 140 .

[0122] In the above embodiment, the rubber frame 16 also includes a reinforcing rib 165, which can, on the one hand, enhance the supporting strength of the membrane structure located on the side of the second portion 164 away from the back plate 14, thereby reducing the deformation of the display module 1; on the other hand, one end of the reinforcing rib 165 is connected to the second portion 164, and the other end is connected to the side of the first support portion 142 close to the heat dissipation cavity 140; a triangular space is formed between the reinforcing rib 165 and the second portion 164 and the first support portion 142, thereby enhancing the supporting effect of the second portion 164 and enhancing the supporting effect of the second portion 164 on the membrane structure located on the side of the second portion 164 facing the display panel 11.

[0123] In a feasible implementation manner, there are multiple reinforcing ribs 165 , and the multiple reinforcing ribs 165 are arranged at intervals along the extending direction of the boundary between the display area AA and the non-display area NA.

[0124] In the above embodiment, the plurality of reinforcing ribs 165 are arranged at intervals, which can improve the reinforcing effect on one hand, and on the other hand, heat dissipation gaps can be formed between adjacent reinforcing ribs 165 to improve the heat dissipation effect on the first thermal sensing portion 110 .

[0125] Specifically, the plurality of reinforcing ribs 165 may be disposed at equal intervals along the extension direction of the boundary between the display area AA and the non-display area NA to enhance the uniformity of the supporting effect.

[0126] Specifically, the total effective support width of the multiple reinforcing ribs 165 in the display module 1 is W1, and the dimension in the extension direction of the boundary between the display area AA and the non-display area NA is W2, 0.25*W2≤W1≤0.50*W2; wherein, the effective support width of the reinforcing rib 165 is: the dimension of the reinforcing rib 165 along the extension direction of the boundary between the display area AA and the non-display area NA.

[0127] Specifically, the effective supporting thickness of the reinforcing rib 165 is greater than or equal to 0.2 mm to ensure supporting strength.

[0128] Specifically, the rubber frame 16 and the reinforcing ribs 165 may be an integrated structure, and the rubber-iron integrated structural member may be manufactured by an integrated injection molding method to form the rubber frame 16 and the reinforcing ribs 165 having an integrated structure.

[0129] Specifically, the first heat sensing portion 110 is located in the display panel 11, including a structure in which the display panel 11 is located in the first area A1, and specifically may include a structure in the array substrate located in the non-display area, such as a portion in the substrate and a portion in the conductive layer on the substrate. Figure 3dAs shown, the second heat sensing portion 10 includes a structure in the display module 1, specifically including a bonding layer 21, a buffer layer 20, an array substrate, a color film substrate, a polarizer, and a cover plate, which are located in the second area A2 and are stacked from a side close to the back plate 14 to a side away from the back plate 14. The second heat sensing portion 10 may also include a touch layer (not shown in the figure).

[0130] In the above implementation mode, as shown in Table 2 and Figure 3d As shown, Figure 3d In Example 2, when the back plate 14 includes a body portion 141 and a first support portion 142, the rubber frame 16 includes a first portion 163 and a second portion 164 connected to each other, and the light-emitting element 1312 in the light-emitting assembly 131 is located on the side of the circuit board 1311 facing the display panel 11, the temperature of the light-emitting element 1312 can be reduced by 12.2% on average. Since the lower the operating temperature of the light-emitting element 1312, the higher the luminous efficiency, this embodiment can effectively improve the luminous efficiency of the light-emitting element 1312. The temperature of the driver chip 12 can be reduced by 0.8% on average; the lower the temperature of the driver chip 12 can improve the performance of the driver chip 12 and the life of the driver chip 12. The temperature difference between the center of the driver chip 12 and the center of the display panel 11 is 2.6°C, which is lower than 8.7°C in the prior art, that is, the thermal resistance of the heat conduction path between the driver chip 12 and the display panel 11 is reduced to a certain extent, thereby greatly improving the heat dissipation capacity of the display module 1.

[0131]

[0132] Table 2: Comparison of test point temperatures between the comparative example and Example 2

[0133] In another possible implementation, if Figures 4a to 4d As shown, the backlight module 13 further includes a plastic frame 16, and the back plate 14 further includes a body portion 141, a first support portion 142 and a second support portion 143. The first support portion 142 extends in the non-display area NA along the edge of the body portion 141 toward the direction close to the display panel 11, and the second support portion 143 extends from an end of the first support portion 142 close to the display panel 11 toward a direction away from the display area AA. The heat dissipation cavity 140 is located on a side of the first support portion 142 away from the body portion 141 and on a side of the second support portion 143 away from the display panel 11.

[0134] The plastic frame 16 is located at a side of the first support portion 142 close to the light guide plate 132 , and is in contact connection with a surface of the first support portion 142 and a surface of the main body 141 .

[0135] In the above embodiment, the back plate 14 adopts another structure, specifically including a heat dissipation cavity 140, a body portion 141, a first support portion 142 and a second support portion 143. The first support portion 142 extends in the non-display area NA along the edge of the body portion 141 toward the display panel 11, and the first support portion 142 is arranged obliquely relative to the body portion 141. The first support portion 142 is used to support the rubber frame 16 and the portion of the display panel 11 located in the non-display area NA, the driving chip 12, etc. The heat dissipation cavity 140 is located on a side of the first support portion 142 away from the body portion 141 and on a side of the second support portion 143 away from the display panel 11.

[0136] The second support portion 143 extends from an end of the first support portion 142 close to the display panel 11 in a direction away from the display area AA, and the second support portion 143 is used to provide support for the structure located on the second support portion 143 away from the first support portion 142. A heat dissipation cavity 140 is formed between a side of the second support portion 143 away from the display panel and a side of the first support portion 142 away from the display area AA, and the heat dissipation cavity 140 can dissipate heat from the first heat sensing portion 110 from a side of the first heat sensing portion 110 away from the display side, so as to further improve the heat dissipation effect of the display module 1.

[0137] Specifically, the first support portion 142 and the main body 141 can be vertically arranged, and the second support portion 143 and the first support portion 142 can be vertically arranged, that is, the second support portion 143 and the main body 141 are arranged parallel, and the first support portion 142 is vertically arranged between the second support portion 143 and the main body 141.

[0138] In the above embodiment, the rubber frame 16 is located on the side of the first support portion 142 close to the light guide plate 132, and is contact-connected with the surface of the first support portion 142 and the surface of the main body portion 141, and the side surface of the rubber frame 16 close to the display panel 11 and the side surface of the second support portion 143 close to the display panel 11 can be flush with each other to achieve a good sealing effect.

[0139] In the above embodiment, since the first supporting portion 142 is arranged between the second supporting portion 143 and the main body portion 141, the side surface of the second supporting portion 143 facing away from the display panel 11 is arranged flush with the side surface of the first supporting portion 142 facing the display panel 11, so that a heat dissipation cavity 140 is formed between the side surface of the second supporting portion 143 facing away from the display panel 11 and the side surface of the first supporting portion 142 facing away from the display area AA, thereby improving the convection heat exchange capacity below the first thermal sensing portion 110 to further improve the heat dissipation effect.

[0140] In a possible implementation, Figure 4dAs shown, the back plate 14 further includes a plurality of heat dissipation fins 144 disposed at intervals. The heat dissipation fins 144 are located in the heat dissipation cavity 140 and connected to a surface of a side of the second support portion 143 away from the display panel 11 .

[0141] In the above embodiment, by disposing a plurality of heat dissipation fins 144 on the side of the second support portion 143 away from the display panel 11 , the heat exchange capacity between the first thermal sensing portion 110 and the outside can be further improved, thereby further improving the heat dissipation effect.

[0142] In the above embodiment, the heat dissipation fins 144 and the back plate 14 may be an integrated structure, and an integrated plastic-iron structural member may be manufactured by an integrated injection molding method to form the heat dissipation fins 144 and the back plate 14 having an integrated structure.

[0143] Specifically, the material of the heat dissipation fin 144 can be plastic with high thermal conductivity, so as to reduce the overall weight of the display module 1. Specifically, the heat dissipation performance of the heat dissipation fin 144 can be improved by reducing the ratio of the thickness to the height of the heat dissipation fin 144. Specifically, the thickness of the heat dissipation fin 144 is the maximum distance between one end close to the second support portion 143 and one end away from the second support portion 143. The thickness of the heat dissipation fin 144 is greater than or equal to 0.2 mm, and the minimum thickness is 0.2 mm, so as to reduce the thickness of the heat dissipation fin 144 within the range allowed by the process.

[0144] In a possible implementation, Figure 4d As shown, the circuit board 1311 is located between the light guide plate 132 and the display panel 11, the light emitting element 1312 is located on the side of the circuit board 1311 away from the display panel 11, and the portion of the circuit board 1311 opposite to the light guide plate 132 is bonded to the light guide plate 132;

[0145] The backlight module 13 further includes a reflective sheet 24 located between the light guide plate 132 and the back plate 14 . The light emitting element 1312 is located between the light guide plate 132 and the plastic frame 16 . The orthographic projection of the light emitting element 1312 on the reflective sheet 24 is located inside the reflective sheet 24 .

[0146] In the above embodiment, when at least part of the light emitting element 1312 is located between the first area A1 and the display area AA, in the light emitting assembly 131, the light emitting element 1312 may be located on the side of the circuit board 1311 facing the display panel 11, or Figure 5 and Figure 6 As shown, in the light emitting assembly 131 , the light emitting element 1312 may be located on a side of the circuit board 1311 away from the display panel 11 .

[0147] When the light-emitting element 1312 is located on the side of the circuit board 1311 facing away from the display panel 11, the circuit board 1311 is located between the light guide plate 132 and the display panel 11, the portion of the circuit board 1311 opposite to the light guide plate 132 is bonded to the light guide plate 132, and the area of ​​the circuit board 1311 opposite to the plastic frame 16 is bonded to the plastic frame 16, thereby fixing the light-emitting component 131.

[0148] Specifically, the backlight module 13 also includes a reflective sheet 24 located between the light guide plate 132 and the back plate 14. When the light-emitting element 1312 is located on the side of the circuit board 1311 away from the display panel 11, a receiving cavity for accommodating the light-emitting element 1312 is formed between the light guide plate 132 and the rubber frame 16. The light-emitting element 1312 is located in the receiving cavity, that is, the light-emitting element 1312 is located between the light guide plate 132 and the rubber frame 16 along a direction parallel to the display panel 11. The light emitted by the light-emitting element 1312 enters the light guide plate 132 from the side through the accommodating cavity. In order to improve the light output brightness of the light-emitting component 131, the reflective sheet 24 can be extended to the side of the light-emitting element 1312 away from the circuit board 1311, that is, the positive projection of the light-emitting element 1312 on the reflective sheet 24 is located inside the reflective sheet 24, so that the light emitted by the light-emitting element 1312 toward the reflective sheet 24 can be reflected into the accommodating cavity through the reflective sheet 24, and then enters the light guide plate 132, thereby improving the brightness of the light-emitting component 131.

[0149] Specifically, the first heat sensing portion 110 is located in the display panel 11, including a structure in which the display panel 11 is located in the first area A1, and specifically may include a structure in the array substrate located in the non-display area, such as a portion in the substrate and a portion in the conductive layer on the substrate. Figure 4d As shown, the second heat sensing portion 10 includes a structure in the display module 1, specifically including a bonding layer 21, a buffer layer 20, an array substrate, a color film substrate, a polarizer, and a cover plate, which are located in the second area A2 and are stacked from a side close to the back plate 14 to a side away from the back plate 14. The second heat sensing portion 10 may also include a touch layer (not shown in the figure).

[0150] In the above implementation mode, as shown in Table 3 and Figure 4d As shown, Figure 4dIn Example 3, when the back plate 14 includes a main body 141, a first support portion 142, and a second support portion 143, and the light-emitting element 1312 in the light-emitting assembly 131 is located on the side of the circuit board 1311 away from the display panel 11, the temperature of the light-emitting element 1312 can be reduced by 12.5% ​​on average. Since the lower the operating temperature of the light-emitting element 1312, the higher the luminous efficiency, this embodiment can effectively improve the luminous efficiency of the light-emitting element 1312. The temperature of the driver chip 12 can be reduced by 0.8% on average; the lower temperature of the driver chip 12 can improve the performance of the driver chip 12 and the life of the driver chip 12. The temperature difference between the center of the driver chip 12 and the center of the display panel 11 is 3.1°C, which is lower than 8.7°C in the prior art, that is, the thermal resistance of the heat conduction path between the driver chip 12 and the display panel 11 is reduced to a certain extent, thereby greatly improving the heat dissipation capacity of the display module 1.

[0151] In the present application, the temperature of the display panel 11 is reduced by at most 2.8° C. compared with the prior art, and a good heat dissipation effect can be achieved.

[0152]

[0153] Table 3: Comparison of test point temperatures between the comparative example and Example 3

[0154] In this application, when using Figure 5 and Figure 6 In the structure shown, that is, the first heat sensing portion 110 and the second heat sensing portion 10 are away from each other in a direction perpendicular to the display panel 11, and at the same time, when the first heat sensing portion 110 and the second heat sensing portion 10 are away from each other in a direction parallel to the display panel 11, a better heat dissipation effect can be achieved.

[0155] like Figure 5 and Figure 6 As shown, the first heat sensing unit 110 is located in the display panel 11, including the structure of the display panel 11 located in the first area A1, and specifically may include the structure located in the non-display area in the array substrate, such as the part in the substrate and the part in the conductive layer on the substrate. The second heat sensing unit 10 includes the structure in the display module 1, specifically including the heat conductive sheet 22, the flexible circuit board 23 and the heat conductive layer 15, which are located in the second area A2 and are stacked from the side away from the display panel 11 to the side close to the display panel 11.

[0156] In a possible implementation, Figure 4dAs shown, the display module 1 also includes a buffer layer 20 and an adhesive layer 21 located in the non-display area NA. The buffer layer 20 contacts the side of the display panel 11 away from the display side. The adhesive layer 21 is bonded and fixed to the surface of the side of the display panel 11 away from the display side and the surface of the side of the buffer layer 20 away from the display side. The material of the buffer layer 20 includes silicone, and the thermal conductivity of silicone is in the range of 5W / (m·K)-8W / (m·K).

[0157] In the above embodiment, the buffer layer 20 is used to provide buffering for the display panel 11 to protect the display panel 11 .

[0158] A groove structure is disposed on a surface of the display panel 11 that is away from the display side. The groove structure is located in the non-display area NA, and the buffer layer 20 is located in the groove structure.

[0159] The area where the adhesive layer 21 is opposite to the groove structure along a direction perpendicular to the display panel 11 is bonded and fixed to the surface of the buffer layer 20 facing away from the display panel 11, the area where the adhesive layer 21 exceeds the groove structure is bonded and fixed to the surface of the display panel 11 facing away from the display side, and the surface of the adhesive layer 21 facing away from the display panel 11 is bonded and fixed to the second support portion 143.

[0160] Specifically, the material of the buffer layer 20 includes silica gel, and the thermal conductivity of silica gel ranges from 5 W / (m·K) to 8 W / (m·K).

[0161] The buffer layer 20 made of the silica gel material can reduce thermal resistance, which helps to increase the heat conduction speed of the first thermal sensing portion 110 away from the driving chip 12 .

[0162] In a possible implementation, Figure 4d , Figure 5 and Figure 6 As shown, the backlight module 13 further includes an optical film material 133 located on a side of the light guide plate 132 facing the display panel 11 .

[0163] The present application also provides a display device 2, comprising any one of the display modules 1 provided in the above embodiments.

[0164] The display device 2 improves the structure of the light emitting component 131, the plastic frame 16 and the back plate 14, and optimizes the material selection of the buffer layer 20 to improve the heat dissipation capacity of the display module 1. The above improvements are relatively easy to implement, have a low risk of causing adverse effects on the display module 1, and do not require additional costs. The heat dissipation performance of the display device 2 is effectively improved, which can improve the comprehensive performance and service life of the display device 2.

[0165] The display device 2 may be a mobile terminal such as a mobile phone or a laptop computer, or a fixed terminal such as a television or a computer monitor, or may be a wearable device such as a watch, etc., and the present application does not make any special limitation thereto.

[0166] The above are only preferred specific implementations of the present application, but the protection scope of the present application is not limited thereto. Any changes or substitutions that can be easily thought of by a person skilled in the art within the technical scope disclosed in the present application should be included in the protection scope of the present application. Therefore, the protection scope of the present application shall be based on the protection scope of the claims.

Claims

1. A display module, characterized in that: The display module comprises a display area and a non-display area located on one side of the display area. The display module comprises: Display panel; A driving chip is disposed on a side of the display panel facing the display side and located in the non-display area, and the driving chip defines a first area in a direction perpendicular to the display panel; A backlight module is arranged on a side of the display panel away from the display side, the backlight module includes a light-emitting component and a light guide plate, the light-emitting component includes a circuit board and a light-emitting element arranged on the circuit board, the light-emitting element is located on a side of the light guide plate facing the non-display area, and the circuit board defines a second area in a direction perpendicular to the display panel; wherein a portion of the display panel located within the first area forms a first heat sensing portion, a portion of the display module located on a side of the circuit board away from the light-emitting element and within the second area forms a second heat sensing portion, and at least a portion of the first heat sensing portion is located outside the second heat sensing portion.

2. The display module according to claim 1, characterized in that: The backlight module further includes a back plate, which is located on a side of the display panel away from the display side. The back plate includes a heat dissipation cavity, and the first heat sensing portion and / or the second heat sensing portion releases heat through the heat dissipation cavity.

3. The display module according to claim 2, characterized in that: The light-emitting element is located on a side of the circuit board facing the display panel, the heat dissipation cavity is located at a position where the back plate and the light-emitting component are opposite to each other in a direction perpendicular to the display panel, the heat dissipation cavity includes a heat dissipation hole that penetrates the back plate in a direction perpendicular to the display panel, the circuit board is located in the heat dissipation hole, a preset gap is set between an edge of the circuit board and an edge of the heat dissipation hole, and the circuit board is connected to the back plate.

4. The display module according to claim 3, characterized in that: The display module further includes a heat-conducting layer, which is located on a side of the back plate away from the display panel, and the heat-conducting layer is adhesively connected to the surface of the back plate and the surface of the circuit board.

5. The display module according to claim 2, characterized in that: The display module also includes a glue frame located in the non-display area, the light-emitting element is located between the glue frame and the light guide plate, the glue frame includes a first overlapping portion overlapping with the circuit board in a direction perpendicular to the display panel, the light guide plate includes a second overlapping portion overlapping with the circuit board in a direction perpendicular to the display panel, and the circuit board is adhered to the first overlapping portion through a first glue layer, and is adhered to the second overlapping portion through a second glue layer.

6. The display module according to claim 5, characterized in that: The display module further includes a reflective layer, and the reflective layer is filled between the light emitting element, the first overlapping portion, the second overlapping portion and the display panel.

7. The display module according to any one of claims 1 to 6, characterized in that: The light emitting component is located in the non-display area, and the orthographic projection of the driving chip on the display panel is located within the orthographic projection of the circuit board on the display panel.

8. The display module according to claim 2, characterized in that: At least part of the light emitting elements is located between the first region and the display area, and the heat dissipation cavity is located at a position where the back plate and the driving chip are opposite to each other along a direction perpendicular to the display panel.

9. The display module according to claim 8, characterized in that: The backlight module also includes a rubber frame, and the back panel also includes a main body and a first supporting portion, the main body is located on the side of the light guide plate away from the display panel, the first supporting portion extends in the non-display area along the edge of the main body toward the display panel, the heat dissipation cavity is located on the side of the first supporting portion away from the main body, the rubber frame includes a first part and a second part that are interconnected, the first part is contact-connected with the first supporting portion and the main body, and the second part is located between the first supporting portion and the display panel and extends toward the side away from the display area.

10. The display module according to claim 9, characterized in that: A side surface of the second portion facing away from the display panel is flush with an end surface of the first supporting portion close to the display panel.

11. The display module according to claim 10, characterized in that: The rubber frame further includes a reinforcing rib, which is located in the heat dissipation cavity. One end of the reinforcing rib is connected to the second part, and the other end is connected to a side of the first supporting part close to the heat dissipation cavity.

12. The display module according to claim 8, characterized in that: The backlight module further includes a rubber frame, and the back plate further includes a main body, a first supporting part and a second supporting part, wherein the first supporting part extends in the non-display area along the edge of the main body toward the direction close to the display panel, and the second supporting part extends from an end of the first supporting part close to the display panel toward a direction away from the display area, and the heat dissipation cavity is located at a side of the first supporting part away from the main body and a side of the second supporting part away from the display panel; The rubber frame is located at a side of the first supporting portion close to the light guide plate, and is contact-connected with a surface of the first supporting portion and a surface of the main body portion.

13. The display module according to claim 12, characterized in that: The back plate further includes a plurality of heat dissipation fins arranged at intervals, wherein the heat dissipation fins are located in the heat dissipation cavity and connected to a surface of a side of the second support portion away from the display panel.

14. The display module according to claim 1, characterized in that: The display module also includes a buffer layer and an adhesive layer located in the non-display area, the buffer layer contacts the side of the display panel away from the display side, the adhesive layer is bonded and fixed to the side surface of the display panel away from the display side and the side surface of the buffer layer away from the display side, the material of the buffer layer includes silicone, and the thermal conductivity of the silicone is in the range of 5W / (m·K)-8W / (m·K).

15. A display device, characterized in that: Comprising a display module as described in any one of claims 1-14.

Images