Flexible glass cover plate and preparation method thereof, flexible screen assembly and electronic device

Abstract

This application relates to the field of electronic device technology, and particularly to a flexible glass cover plate and its manufacturing method, a flexible screen assembly, and an electronic device. The flexible glass cover plate includes a first main body portion, a bending portion, and a second main body portion, connected by the bending portion. The bending portion includes a first transition portion, a recessed portion, and a second transition portion. One side of the first transition portion is connected to the first main body portion, and the other side is connected to the recessed portion. One side of the second transition portion is connected to the recessed portion, and the other side is connected to the second main body portion. Furthermore, the thickness of the first transition portion increases or gradually increases as it approaches the first main body portion, and the thickness of the second transition portion also increases or gradually increases as it approaches the second main body portion. This application avoids the problem of noticeably sharp edges on the product's appearance.

Description

Technical Field

[0001] This application relates to the field of electronic equipment technology, and in particular to a flexible glass cover plate and its preparation method, a flexible screen assembly, and an electronic device. Background Technology

[0002] With the development of display technology, the performance requirements for screens are gradually increasing. Flexible screen components, characterized by their bendability and foldability, offer convenience for portability and use. The flexible glass cover is a crucial component of flexible screen components; therefore, higher requirements are placed on the bendability of the flexible glass cover.

[0003] Flexible glass covers can be designed with bends to meet flexibility requirements. However, the surface of finished flexible glass covers with bends is prone to showing some obvious ridges. In actual production, the observed ridges are defined as an appearance defect – sharp edges. The presence of obvious sharp edges is a factor that affects the exquisite appearance of the product. Summary of the Invention

[0004] Based on this, this application provides a flexible glass cover plate and its preparation method, a flexible screen assembly, and an electronic device to solve the problem of sharp edges on the flexible glass cover plate and avoid affecting the appearance of the product.

[0005] The first aspect of this application provides a flexible glass cover, the technical solution of which is as follows:

[0006] A flexible glass cover includes: a first main body portion, a bending portion, and a second main body portion, wherein the first main body portion and the second main body portion are connected through the bending portion;

[0007] The bending portion includes a first transition portion, a recessed portion, and a second transition portion. One side of the first transition portion is connected to the first main body portion, and the other side is connected to the recessed portion. One side of the second transition portion is connected to the recessed portion, and the other side is connected to the second main body portion.

[0008] Furthermore, the thickness of the first transition portion increases or gradually increases as it approaches the first main body portion, and the thickness of the second transition portion increases or gradually increases as it approaches the second main body portion.

[0009] The second aspect of this application provides a method for preparing a flexible glass cover, the technical solution of which is as follows:

[0010] A method for preparing a flexible glass cover includes the following steps:

[0011] A glass substrate is provided, the glass substrate having a first main body region, a bending region and a second main body region, the first main body region and the second main body region being connected through the bending region, the bending region including a first transition region, a concave platform region and a second transition region, one side of the first transition region being connected to the first main body region and the other side being connected to the concave platform region, one side of the second transition region being connected to the concave platform region and the other side being connected to the second main body region;

[0012] A first main coating, a first transition coating, a second transition coating, and a second main coating are formed on the first main region, the first transition region, the second transition region, and the second main region of the glass substrate, respectively. The first transition coating is connected to the first main coating, and its thickness increases or gradually increases as it approaches the first main coating. The second transition coating is connected to the second main coating, and its thickness increases or gradually increases as it approaches the second main coating.

[0013] An etching process with equal etching depth is performed on each side of the coating on the glass substrate.

[0014] The third aspect of this application provides a method for preparing a flexible glass cover, the technical solution of which is as follows:

[0015] A method for preparing a flexible glass cover includes the following steps:

[0016] A glass substrate is provided, the glass substrate having a first main body region, a bending region and a second main body region, the first main body region and the second main body region being connected through the bending region;

[0017] The glass substrate is patterned multiple times to form a bent portion including a first transition portion, a recessed portion, and a second transition portion in the bending area. One side of the first transition portion is connected to the first main body region, and the other side is connected to the recessed portion. The thickness of the first transition portion gradually increases as it approaches the first main body region. Similarly, one side of the second transition portion is connected to the recessed portion, and the other side is connected to the second main body region. The thickness of the second transition portion gradually increases as it approaches the second main body region.

[0018] Each graphical processing step independently includes one or more of the following steps:

[0019] Photoresist is coated onto the glass substrate to form a photoresist layer;

[0020] Expose the photoresist layer;

[0021] The photoresist layer after exposure is developed.

[0022] The glass substrate after development is etched.

[0023] A fourth aspect of this application provides a flexible screen assembly, which includes a flexible display screen and the flexible glass cover plate described above or the flexible glass cover plate prepared by the above preparation method, wherein the flexible glass cover plate is disposed on the display surface of the flexible display screen.

[0024] The fifth aspect of this application provides an electronic device, which includes the above-described flexible screen assembly, housing, and circuit board;

[0025] The housing and the flexible screen assembly form an accommodating space;

[0026] The circuit board is disposed within the receiving space.

[0027] This application has the following beneficial effects:

[0028] In this application, a first transition portion with a gradually changing or gradient thickness is provided between the recessed portion and the first main body portion, and a second transition portion with a gradually changing or gradient thickness is provided between the recessed portion and the second main body portion. This gradually reduces the discontinuity between the first / second main body portion and the recessed portion, thus avoiding the problem of obvious sharp edges on the product appearance. Furthermore, compared to directly connecting the first and second transition portions, the recessed portion in this application helps to increase the width of the bending area. The increased width of the bending area can improve the light and shadow problems caused by the discontinuity on both sides of the recessed portion. Attached Figure Description

[0029] To more clearly illustrate the technical solutions in the embodiments of this application and to more completely understand this application and its beneficial effects, the drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0030] Figure 1 A schematic diagram of the structure of a flexible glass cover plate according to one embodiment;

[0031] Figure 2 for Figure 1 Schematic diagram of the structure at section A-A';

[0032] Figure 3 A structural schematic diagram of a cross-section of a flexible glass cover plate according to another embodiment;

[0033] Figure 4 A flowchart illustrating the fabrication process of a flexible glass cover plate according to one embodiment;

[0034] Figure 5 A schematic diagram of the structure of a glass substrate according to one embodiment;

[0035] Figure 6This is a schematic diagram of the structure of a coated glass substrate according to one embodiment;

[0036] Figure 7 This is a schematic diagram of the structure of a coated glass substrate according to another embodiment;

[0037] Figure 8 A schematic diagram illustrating the process of preparing a flexible glass cover plate for Example 1;

[0038] Figure 9 A flowchart illustrating the fabrication process of a flexible glass cover plate according to another embodiment;

[0039] Figure 10 This is a schematic diagram of the process for preparing a flexible glass cover plate for Example 2. Detailed Implementation

[0040] The present application will be further described in detail below with reference to specific embodiments. The present application can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided to provide a more thorough and complete understanding of the disclosure of this application.

[0041] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application.

[0042] the term

[0043] Unless otherwise stated or in case of conflict, the terms or phrases used in this application shall have the following meanings:

[0044] In this application, "multiple" means at least two, such as two, three, etc., unless otherwise expressly and specifically defined. In this application, "several" means at least one, such as one, two, etc., unless otherwise expressly and specifically defined.

[0045] In this application, the terms "optionally," "optionally," and "optional" refer to options that are optional, meaning they can be selected from either "with" or "without." If multiple "optional" options appear in a technical solution, unless otherwise specified and there are no contradictions or mutual constraints, each "optional" option is independent.

[0046] In this application, the terms "first aspect," "second aspect," "third aspect," and "fourth aspect," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance or quantity, nor should they be construed as implicitly indicating the importance or quantity of the indicated technical features. Moreover, "first," "second," "third," and "fourth," etc., serve only a non-exhaustive enumeration purpose and should be understood not to constitute a closed limitation on quantity.

[0047] In this application, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0048] In this application, when an element is referred to as "fixed to" or "set on" another element, it can be directly on the other element or there may be an intervening element. When an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intervening element. It should also be understood that, in interpreting the connection or positional relationship of elements, although not explicitly described, connection and positional relationships are interpreted to include a range of error, which should be within the acceptable deviation range of a specific value as determined by a person skilled in the art.

[0049] In this application, the electronic device may be, but is not limited to, various personal computers, laptops, smartphones, tablets, IoT devices, and portable wearable devices. IoT devices may include smart speakers, smart TVs, smart air conditioners, smart in-vehicle devices, etc. Portable wearable devices may include smartwatches, smart bracelets, head-mounted devices, etc.

[0050] To improve the flexibility of flexible glass covers, the industry typically creates grooves in the bending area to form the bending section. For example, grooves can be formed using CNC machining. However, CNC-machined flexible glass covers have a high surface roughness, making them prone to micro-cracks and affecting product strength. To avoid these problems, a protective film can be applied to the non-bending area, and the bending area can be etched to form grooves. However, this method of applying a protective film and etching results in sharp edges, affecting the product's appearance.

[0051] To address the issue of sharp edges on the product's exterior, this application provides a flexible glass cover in its first aspect. In one embodiment, please refer to... Figure 1The flexible glass cover 1 includes a first main body 11, a bending part 12, and a second main body 13. The first main body 11 and the second main body 13 are connected by the bending part 12.

[0052] Figure 1 The structure of section A-A' is as follows Figure 2 As shown, the bending portion 12 includes a first transition portion 121, a recessed portion 122, and a second transition portion 123. One side of the first transition portion 121 is connected to the first main body portion 11, and the other side is connected to the recessed portion 122. One side of the second transition portion 123 is connected to the recessed portion 122, and the other side is connected to the second main body portion 13.

[0053] The thickness of the first transition section 121 increases as it approaches the first main body section 11.

[0054] The thickness of the second transition section 123 increases as it approaches the second main body section 13.

[0055] In this embodiment, a first transition portion 121 with a gradually varying thickness is provided between the recessed portion 122 and the first main body portion 11, and a second transition portion 123 with a gradually varying thickness is provided between the recessed portion 122 and the second main body portion 13. This gradually reduces the discontinuity between the first main body portion 11 / second main body portion 13 and the recessed portion 122, thus avoiding the problem of obvious sharp edges on the product appearance. Furthermore, compared to directly connecting the first transition portion 121 and the second transition portion 123, the recessed portion 122 in this embodiment helps to increase the width of the bending area. This increased width of the bending area can improve the light and shadow problems caused by the discontinuity on both sides of the recessed portion 122.

[0056] In this embodiment, the thickness change of the first transition portion 121 is greater the closer it is to the first main body portion 11; the thickness change of the second transition portion 123 is greater the closer it is to the second main body portion 13.

[0057] In another embodiment, the thickness of the first transition portion increases gradually towards the first main body portion, and the thickness of the second transition portion increases gradually towards the second main body portion. See also... Figure 3The flexible glass cover 2 includes a first main body 21, a bending portion 22, and a second main body 23. The first main body 21 and the second main body 23 are connected by the bending portion 22. The bending portion 22 includes a first transition portion 221, a recessed portion 222, and a second transition portion 223. One side of the first transition portion 221 is connected to the first main body 21, and the other side is connected to the recessed portion 222. One side of the second transition portion 223 is connected to the recessed portion 222, and the other side is connected to the second main body 23. The thickness of the first transition portion 221 gradually increases as it approaches the first main body 21. The thickness of the second transition portion 223 gradually increases as it approaches the second main body 23. By providing a first transition portion 221 with a thickness gradient between the recessed portion 222 and the first main body portion 21, and a second transition portion 223 with a thickness gradient between the recessed portion 222 and the second main body portion 23, the discontinuity between the first main body portion 21 / second main body portion 23 and the recessed portion 222 can be gradually reduced, thus avoiding the problem of obvious sharp edges in the product appearance.

[0058] Please continue reading Figure 2 In this embodiment, the thickness of the recessed portion 122 remains unchanged. Optionally, the thickness of the recessed portion 122 is 30μm to 50μm. For example, the thickness of the recessed portion 122 is any value within the range of any two numerical endpoints, including 30μm, 40μm, and 50μm.

[0059] In this embodiment, the thickness of the first main body portion 11 remains unchanged. Optionally, the thickness of the first main body portion 11 is 70μm to 220μm. For example, the thickness of the first main body portion 11 is any value within the range of any two numerical endpoints, including 70μm, 100μm, 150μm, 200μm, and 220μm.

[0060] In this embodiment, the thickness of the second main body portion 13 remains unchanged. Optionally, the thickness of the second main body portion 13 is 70μm to 220μm. For example, the thickness of the second main body portion 13 is any value within the range of any two numerical endpoints, including 70μm, 100μm, 150μm, 200μm, and 220μm.

[0061] Optionally, the distance h1 between the side of the first transition portion 121 that connects to the first main body portion 11 and the side that connects to the recessed portion 122 (i.e., the width of the first transition portion 121) is 10mm to 20mm. For example, h1 is any value in any two numerical endpoint value ranges including 10μm, 15μm and 20μm.

[0062] Optionally, the distance h2 between the side of the recessed portion 122 that connects to the first transition portion 121 and the side that connects to the second transition portion 123 (i.e., the width of the recessed portion 122) is 15mm to 25mm. For example, h2 is any value in any two numerical endpoint value ranges including 15μm, 20μm, and 25μm.

[0063] Optionally, the distance h3 between the side of the second transition portion 123 that connects to the recessed portion 122 and the side that connects to the second main body portion 13 (i.e., the width h3 of the second transition portion 123) is 10mm to 20mm. For example, h3 is any value in any two numerical endpoint value ranges including 10μm, 15μm and 20μm.

[0064] The second aspect of this application provides a method for preparing a flexible glass cover. In one embodiment, please refer to... Figure 4 The preparation method of the flexible glass cover includes the following steps:

[0065] S11, Provide a glass substrate.

[0066] See Figure 5 The glass substrate 3 has a first main body region 31, a bending region 32, and a second main body region 33. The first main body region 31 and the second main body region 33 are connected through the bending region 32. The bending region 32 includes a first transition region 321, a concave platform region 322, and a second transition region 323. One side of the first transition region 321 is connected to the first main body region 31, and the other side is connected to the concave platform region 322. One side of the second transition region 323 is connected to the concave platform region 322, and the other side is connected to the second main body region 33.

[0067] Optionally, the thickness of the glass substrate 3 is 70 μm to 220 μm. For example, the thickness of the glass substrate 3 is any value in any two numerical endpoint ranges, including the two numerical endpoint values, of 70 μm, 100 μm, 150 μm, 200 μm, and 220 μm.

[0068] In this embodiment, the glass substrate is a planar substrate, that is, the glass substrates of the first main body region 31, the bending region 32 and the second main body region 33 have the same thickness.

[0069] Understandably, the glass substrate can be cleaned. For example, the glass substrate can be cleaned with a weak alkaline cleaning agent, and after cleaning, it can be soaked in plasma water at 50°C to 60°C for 20 to 30 minutes, and then dried quickly.

[0070] Optionally, the main material of the glass substrate is high-aluminosilicate glass.

[0071] S12, A coating is formed on the glass substrate 3.

[0072] In this embodiment, see Figure 6 A first main coating 41 is formed on the first main body region 31 of the glass substrate 3, a first transition coating 421 is formed on the first transition region 321 of the glass substrate 3, a second transition coating 423 is formed on the second transition region 323 of the glass substrate 3, and a second main coating 43 is formed on the second main body region 33 of the glass substrate 3.

[0073] The first transition coating 421 is connected to the first main coating 41, and its thickness increases as it approaches the first main coating 41.

[0074] The second transition coating 423 is connected to the second main coating 43, and its thickness increases as it approaches the second main coating 43.

[0075] In other embodiments, the thickness of the first transition coating may also increase with increasing gradient as it approaches the first main coating. The thickness of the second transition coating may also increase with increasing gradient as it approaches the second main coating.

[0076] In this embodiment, the thickness of the first main coating 41 remains unchanged.

[0077] In this embodiment, the thickness of the second main coating 43 remains unchanged.

[0078] In another embodiment, the step of forming a recessed coating on the recessed area of ​​the glass substrate is further included. See also Figure 7 A first main coating 51 is formed on the first main body region 31 of the glass substrate 3, a first transition coating 521 is formed on the first transition region 321 of the glass substrate 3, a recess coating 522 is formed on the recessed region 322 of the glass substrate 3, a second transition coating 523 is formed on the second transition region 323 of the glass substrate 3, and a second main coating 53 is formed on the second main body region 33 of the glass substrate 3.

[0079] The first transition coating 521 is connected to the first main coating 51, and its thickness increases as it approaches the first main coating 51.

[0080] The second transition coating 523 is connected to the second main coating 53, and its thickness increases as it approaches the second main coating 53.

[0081] One side of the recessed coating 522 is connected to the first transition coating 521, and the other side is connected to the second transition coating 523.

[0082] In other embodiments, the thickness of the first transition coating may also increase with increasing gradient as it approaches the first main coating. The thickness of the second transition coating may also increase with increasing gradient as it approaches the second main coating.

[0083] In this embodiment, the thickness of the first main coating 51 remains unchanged.

[0084] In this embodiment, the thickness of the second main coating 53 remains unchanged.

[0085] In this embodiment, the thickness of the recessed coating 522 remains unchanged.

[0086] Optionally, the distance h4 between the side of the first transition coating 521 that connects to the first main coating 51 and the side that connects to the recessed coating 522 (i.e., the width of the first transition coating 521) is 10 mm to 20 mm. For example, h4 is any value in any two numerical endpoint ranges including 10 μm, 15 μm, and 20 μm.

[0087] Optionally, the distance h5 between the side of the recessed coating 522 that connects to the first transition coating 521 and the side that connects to the second transition coating 523 (i.e., the width h5 of the recessed coating 522) is 15mm to 25mm. For example, h5 is any value in any two numerical endpoint ranges including 15μm, 20μm, and 25μm.

[0088] Optionally, the distance h6 between the side of the second transition coating 523 that connects to the recessed coating 522 and the side that connects to the second main coating 53 (i.e., the width h6 of the second transition coating 523) is 10 mm to 20 mm. For example, h6 is any value in any two numerical endpoint ranges including 10 μm, 15 μm, and 20 μm.

[0089] Optionally, a first transition coating may be formed on the first transition region of the glass substrate by method one or method two.

[0090] Method 1: Forming a first transition coating on the first transition region of a glass substrate, including the following steps:

[0091] A first positive photoresist is coated on the first transition region and dried to form a first transition photoresist layer;

[0092] The first transition photoresist layer is exposed, and the exposure energy is controlled so that the exposure thickness of the first transition photoresist layer becomes smaller or the gradient becomes smaller as it approaches the first host region.

[0093] The first transition photoresist layer after exposure is developed.

[0094] In this method, the exposed portions of positive photoresist dissolve in the developer and are removed during the development process, while the exposed portions of negative photoresist remain insoluble in the developer. Using positive photoresist, the exposure process results in a gradual or gradient change in the thickness of the photoresist layer removed during development, thus forming a first transitional photoresist layer with a gradually varying or gradient thickness.

[0095] Understandably, the first transition photoresist layer left after the development process serves as the first transition coating.

[0096] Method 2: Forming a first transition coating on the first transition region of the glass substrate, including the following steps:

[0097] A first curing material is coated on the first transition zone, and the coating thickness of the first curing material increases or gradually increases as it approaches the first main body region.

[0098] The first curing material is cured.

[0099] Optionally, the coating method for the first curing material can be spraying, and the coating thickness of the first curing material can be controlled by controlling the movement speed of the spraying equipment. Generally, the slower the movement speed of the spraying equipment, the greater the coating thickness.

[0100] Understandably, the first curing material, after curing, serves as the first transition coating.

[0101] Optionally, the first curing material includes one or more of thermosetting curing materials and photocuring curing materials, wherein the photocuring material includes positive photoresist or negative photoresist.

[0102] When the first curing material is a positive photoresist, drying forms a first transition photoresist layer. This layer can be masked to prevent exposure and removal during development. In this case, the dried first transition photoresist layer serves as the first transition coating. Alternatively, masking and development can be omitted, and the exposed first transition photoresist layer directly serves as the first transition coating. When the first curing material is a negative photoresist, drying forms a first transition photoresist layer, which can be exposed to remain in the development process. In this case, the first transition photoresist layer remaining after development serves as the first transition coating. Alternatively, development can be omitted, and the exposed first transition photoresist layer directly serves as the first transition coating.

[0103] When the first curing material is a photocurable material other than positive photoresist and negative photoresist, it can be photocured to form a first transition coating.

[0104] When the first curing material is a thermosetting curing material, it can be thermosetting to form a first transition coating.

[0105] Optionally, the solid content of the first curing material is 25wt% to 95wt%.

[0106] Understandably, the first transition coating formed in the above manner can be etched away by subsequent etching processes.

[0107] Optionally, a second transition coating may be formed on the second transition region of the glass substrate by method one or method two.

[0108] Method 1: Forming a second transition coating on the second transition region of a glass substrate, including the following steps:

[0109] A second positive photoresist is coated onto the second transition region and dried to form a second transition photoresist layer;

[0110] The second transition photoresist layer is exposed, and the exposure energy is controlled so that the exposure thickness of the second transition photoresist layer becomes smaller or the gradient becomes smaller as it approaches the second host region.

[0111] The second transition photoresist layer after exposure is developed.

[0112] The second positive photoresist may be the same as or different from the first positive photoresist. The second transition photoresist layer left after development serves as the second transition coating.

[0113] Method 2: Forming a second transition coating on the second transition region of the glass substrate, including the following steps:

[0114] A second curing material is coated on the second transition zone, and the coating thickness of the second curing material increases or gradually increases as it approaches the second main body zone.

[0115] Curing the second curing material.

[0116] Optionally, the coating method for the second curing material can be spraying, and the coating thickness of the second curing material can be controlled by controlling the movement speed of the spraying equipment.

[0117] Understandably, the second curing material, after curing, serves as a second transition coating.

[0118] Optionally, the second curing material includes one or more of thermosetting curing materials and photocuring curing materials, wherein the photocuring curing material includes positive photoresist or negative photoresist.

[0119] When the second curing material is a positive photoresist, drying forms a second transition photoresist layer. This layer can be masked to prevent exposure and removal during development. In this case, the dried second transition photoresist layer serves as the second transition coating. Alternatively, masking and development can be omitted, and the exposed second transition photoresist layer directly serves as the second transition coating. When the second curing material is a negative photoresist, drying forms a second transition photoresist layer. This layer can be exposed to ensure it remains during development. In this case, the second transition photoresist layer remaining after development serves as the second transition coating. Alternatively, development can be omitted, and the exposed second transition photoresist layer directly serves as the second transition coating.

[0120] When the second curing material is a photocurable material other than positive or negative photoresist, it can be photocured to form a second transition coating.

[0121] When the first curing material is a thermosetting curing material, it can be thermoset to form a second transition coating.

[0122] Optionally, the solid content of the second curing material is 25wt% to 95wt%.

[0123] Understandably, the second transition coating formed in the above manner can be etched away by subsequent etching processes.

[0124] Optionally, forming a first main coating on a first main region of a glass substrate includes the following steps:

[0125] A third curing material is applied to the first main body area;

[0126] Curing the third curing material.

[0127] Optionally, the coating method for the third curing material can be spraying, and the coating thickness of the third curing material can be controlled by controlling the movement speed of the spraying equipment.

[0128] Optionally, the third curing material includes one or more of thermosetting curing materials and photocuring curing materials, wherein the photocuring material includes positive photoresist or negative photoresist.

[0129] When the third curing material is a positive photoresist, drying forms the first host photoresist layer. This layer can be masked to prevent exposure and removal during development. In this case, the dried first host photoresist layer serves as the first host coating. Alternatively, masking and development can be omitted, and the exposed first host photoresist layer directly serves as the first host coating. When the third curing material is a negative photoresist, drying forms the first host photoresist layer, which can be exposed to remain in the development process. In this case, the first host photoresist layer remaining after development serves as the first host coating. Alternatively, development can be omitted, and the exposed first host photoresist layer directly serves as the first host coating.

[0130] When the third curing material is a photocurable material other than positive or negative photoresist, it can be photocured to form the first main coating.

[0131] When the third curing material is a thermosetting curing material, it can be thermoset to form the first main coating.

[0132] Optionally, the solid content of the third curing material is 25wt% to 95wt%.

[0133] Understandably, the first main coating formed in the above manner can be etched away by subsequent etching processes.

[0134] Optionally, forming a second body coating on a second body region of a glass substrate includes the following steps:

[0135] A fourth curing material is applied to the second main body area;

[0136] Curing the fourth curing material.

[0137] Optionally, the coating method for the fourth curing material can be spraying, and the coating thickness of the fourth curing material can be controlled by controlling the movement speed of the spraying equipment.

[0138] Optionally, the fourth curing material includes one or more of thermosetting curing materials and photocuring curing materials, wherein the photocuring material includes positive photoresist or negative photoresist.

[0139] When the fourth curing material is a positive photoresist, drying forms a second host photoresist layer. This layer can be masked to prevent exposure and removal during development. In this case, the dried second host photoresist layer serves as the second host coating. Alternatively, masking and development can be omitted, and the exposed second host photoresist layer directly serves as the second host coating. When the fourth curing material is a negative photoresist, drying forms a second host photoresist layer, which can be exposed to remain in the development process. In this case, the second host photoresist layer remaining after development serves as the second host coating. Alternatively, development can be omitted, and the exposed second host photoresist layer directly serves as the second host coating.

[0140] When the fourth curing material is a photocurable material other than positive or negative photoresist, it can be photocured to form a second main coating.

[0141] When the fourth curing material is a thermosetting curing material, it can be thermoset to form the second main coating.

[0142] Optionally, the solid content of the fourth curing material is 25wt% to 95wt%.

[0143] Understandably, the second main coating formed in the above manner can be etched away by subsequent etching processes.

[0144] Optionally, a recessed coating can be formed on the recessed area of ​​the glass substrate by method one or method two.

[0145] Method 1: Forming a recessed coating on the recessed area of ​​a glass substrate, including the following steps:

[0146] A third positive photoresist is coated on the recessed area and dried to form a recessed photoresist layer;

[0147] Expose the photoresist layer on the concave stage;

[0148] The exposed recessed photoresist layer is then developed.

[0149] The third positive photoresist may be the same as or different from the first positive photoresist, and may be the same as or different from the second positive photoresist. The recessed photoresist layer left after development is used as the recessed coating layer.

[0150] Method 2: Forming a recessed coating on the recessed area of ​​a glass substrate, including the following steps:

[0151] Apply the fifth curing material to the concave area;

[0152] The fifth curing material is cured.

[0153] Alternatively, the coating method for the fifth curing material can be spraying, and the coating thickness of the fifth curing material can be controlled by controlling the movement speed of the spraying equipment.

[0154] Understandably, the fifth curing material, after curing, serves as a recessed coating.

[0155] Optionally, the fifth curing material includes one or more of thermosetting curing materials and photocuring curing materials, wherein the photocuring material includes positive photoresist or negative photoresist.

[0156] When the fifth curing material is a positive photoresist, drying forms a recessed photoresist layer. This layer can be masked to prevent exposure and removal during development. In this case, the dried recessed photoresist layer serves as the recessed coating layer. Alternatively, masking and development can be omitted, and the exposed recessed photoresist layer directly serves as the recessed coating layer. When the second curing material is a negative photoresist, drying forms a recessed photoresist layer. This layer can be exposed to allow it to remain during development. In this case, the recessed photoresist layer remaining after development serves as the recessed coating layer. Alternatively, development can be omitted, and the exposed recessed photoresist layer directly serves as the recessed coating layer.

[0157] When the fifth curing material is a photocurable material other than positive or negative photoresist, it can be photocured to form a recessed coating.

[0158] When the fifth curing material is a thermosetting curing material, it can be thermosetting to form a recessed coating.

[0159] Optionally, the solid content of the fifth curing material is 25wt% to 95wt%.

[0160] Understandably, the concave coatings formed in the above manner can all be etched away by subsequent etching processes.

[0161] Optionally, the first curing material, the second curing material, the third curing material, the fourth curing material, and the fifth curing material may be the same, or they may all be different, or some may be the same and some may be different.

[0162] Optionally, the first curing material, the second curing material, the third curing material, the fourth curing material and the fifth curing material can be applied at once or in batches.

[0163] S13. Perform an etching process with equal etching depth on each side of the coating on the glass substrate.

[0164] In this embodiment, equal etching depth means that the etching depth is the same on each side of the coating on the glass substrate, that is, the thickness removed by etching is the same.

[0165] Optionally, the etching depth is greater than the minimum thickness of the first transition coating and the second transition coating.

[0166] Alternatively, the etching depth may be no greater than the maximum thickness of the first and second body coatings.

[0167] Optionally, an etching process with equal etching depth is performed on each side of the coating on the glass substrate, including the following steps:

[0168] Make each coating side of the glass substrate come into contact with the etching solution.

[0169] Optionally, the etching solution is an acidic etching solution.

[0170] Understandably, if coating residue remains after etching, the preparation method of this embodiment also includes a step of removing the residual coating.

[0171] Understandably, the preparation method of this embodiment includes the steps of cleaning and drying the etched product.

[0172] Example 1 of this application provides a method for preparing a flexible glass cover, wherein the first curing material, the second curing material, the third curing material, the fourth curing material, and the fifth curing material are the same, all being positive photoresist. Please refer to [link to relevant documentation]. Figure 8 The steps are as follows:

[0173] Positive photoresist is applied to the first main area, first transition area, recessed area, second transition area and second main area of ​​glass substrate 3 in one step, and then dried to form a first main photoresist layer, a first transition photoresist layer, a recessed photoresist layer, a second transition photoresist layer and a second main photoresist layer, with each photoresist layer having the same thickness and being continuous.

[0174] Using a mask to mask the first and second main photoresist layers, one side of each photoresist layer on the glass substrate 3 is exposed. The exposure energy is controlled so that the exposure thickness meets the following conditions: the exposure thickness of the recessed photoresist layer is equal to the thickness of the recessed photoresist layer; the closer to the first main region, the smaller the exposure thickness of the first transition photoresist layer; and the closer to the second main region, the smaller the exposure thickness of the second transition photoresist layer.

[0175] The exposed glass substrate is developed to obtain a first main coating, a first transition coating, a second transition coating, and a second main coating. The width of the first transition coating and the second transition coating is 15 mm, and the distance between the first transition coating and the second transition coating is 20 mm.

[0176] An acidic etching solution is used to perform etching treatment with equal etching depth on each side of the coating of the glass substrate. In this example, the etching depth is the thickness of the first main coating and the second main coating to obtain a flexible glass cover plate 1. On the flexible glass cover plate 1, the width of the first transition portion and the second transition portion are both 15 mm, and the width of the recessed portion is 20 mm.

[0177] A third aspect of this application provides a method for preparing a flexible glass cover. In one embodiment, please refer to [link to embodiment]. Figure 9 The preparation method of the flexible glass cover includes the following steps:

[0178] S21, Provide a glass substrate.

[0179] The glass substrate has a first main area, a bending area, and a second main area, and the first main area and the second main area are connected through the bending area.

[0180] Optionally, the thickness of the glass substrate is 70 μm to 220 μm. For example, the thickness of the glass substrate is any value in any two numerical endpoint ranges, including the two numerical endpoint values, of 70 μm, 100 μm, 150 μm, 200 μm, and 220 μm.

[0181] S22. Perform multiple patterning processes on the glass substrate.

[0182] Through multiple graphical processing steps, a bending region including a first transition portion, a concave platform portion, and a second transition portion is formed in the bending area. The first transition portion is connected to the first main body region on one side and to the concave platform portion on the other side. The thickness of the first transition portion increases as it approaches the first main body region. The second transition portion is connected to the concave platform portion on one side and to the second main body region on the other side. The thickness of the second transition portion increases as it approaches the second main body region.

[0183] In this embodiment, each graphical processing step independently includes one or more of the following steps:

[0184] Photoresist is coated onto the glass substrate to form a photoresist layer;

[0185] Expose the photoresist layer;

[0186] The photoresist layer after exposure is developed.

[0187] The glass substrate after development is etched.

[0188] Understandably, photoresist can be applied during the first patterning process to form a photoresist layer, and then exposed during subsequent patterning processes. Alternatively, the photoresist layer can be removed during the first patterning process, and then reapplied during subsequent patterning processes to form a new photoresist layer.

[0189] Optionally, the photoresist can be a positive photoresist or a negative photoresist. The usage methods of positive and negative photoresists are as described above and will not be repeated here.

[0190] After the photoresist layer undergoes development, the glass substrate to be etched is exposed, and the exposed glass substrate is then etched. Optionally, the etching solution used in the etching process is an acidic etching solution. Through multiple patterning processes, gradient etching of the glass substrate in the bending area is achieved.

[0191] Example 2 of this application provides a method for preparing a flexible glass cover plate. Please refer to [link / reference]. Figure 10 The steps are as follows:

[0192] Positive photoresist is applied to the first main area, first transition area, recessed area, second transition area and second main area of ​​glass substrate 3 in one step, and then dried to form a first main photoresist layer, a first transition photoresist layer, a recessed photoresist layer, a second transition photoresist layer and a second main photoresist layer, with each photoresist layer having the same thickness and being continuous.

[0193] A photomask is used to mask the first main photoresist layer, the first transition photoresist layer, the second transition photoresist layer, and the second main photoresist layer, exposing one side of each photoresist layer on the glass substrate 3. After exposure, each photoresist layer is developed to expose the glass substrate in the recessed area.

[0194] The exposed recessed area of ​​the glass was etched using an acidic etching solution to obtain a recessed portion with a width of 20 mm, thus completing the first patterning process.

[0195] The exposed area of ​​the photomask is expanded to expose a portion of the first transition photoresist layer and the second transition photoresist layer. After exposure, development and etching, the second patterning process is completed.

[0196] The exposed area of ​​the photomask is further expanded until the remaining first transition photoresist layer and second transition photoresist layer are exposed. After exposure, development and etching, the third patterning process is completed to obtain the flexible glass cover plate 2. On the flexible glass cover plate 2, the thickness gradient of the first transition part and the second transition part changes, and the total width is 15mm.

[0197] This application also provides comparative example 3, which provides a method for preparing a flexible glass cover, the steps of which are as follows:

[0198] A glass substrate is provided, the glass substrate including a first main body region, a bending region and a second main body region, the first main body region and the second main body region being connected through the bending region.

[0199] An acid-resistant protective film is applied to the first and second main areas of the glass substrate, exposing the glass substrate in the bending area.

[0200] An acidic etching solution is used to etch the exposed glass substrate to form a recessed section with a width of 20 mm, resulting in a flexible glass cover.

[0201] Comparing the flexible glass covers of Examples 1, 2, and 3, the sharp edge of Example 3 is clearly visible, while the sharp edges of Examples 1 and 2 are not obvious. It is evident that, compared to applying a protective film to the non-bending area and etching the bending area to form a recess, the method of this application, by forming a first transition portion and a second transition portion, can solve the problem of obvious sharp edges on the product's appearance.

[0202] The flexible glass cover preparation methods of the second and third aspects of this application can produce flexible glass cover products with no obvious sharp edges, and at the same time, can improve the light and shadow problems caused by the discontinuity on both sides of the concave platform.

[0203] The fourth aspect of this application provides a flexible screen assembly. In one embodiment, the flexible screen assembly includes a flexible display screen and the flexible glass cover plate described above or the flexible glass cover plate prepared by the above-described preparation method, wherein the flexible glass cover plate is disposed on the display surface of the flexible display screen.

[0204] The flexible screen assembly of this embodiment has all the advantages of the flexible glass cover described above, which will not be repeated here.

[0205] The fifth aspect of this application provides an electronic device, in one embodiment of which the electronic device includes the flexible screen assembly, housing, and circuit board described above;

[0206] The housing and flexible screen assembly enclose the receiving space;

[0207] The circuit board is housed within the receiving space.

[0208] The electronic device of this embodiment has all the advantages of the flexible screen assembly described above, which will not be repeated here.

[0209] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0210] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the invention patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.

Claims

1. A method for preparing a flexible glass cover, characterized in that, Includes the following steps: A glass substrate is provided, the glass substrate having a first main body region, a bending region and a second main body region, the first main body region and the second main body region being connected through the bending region, the bending region including a first transition region, a concave platform region and a second transition region, one side of the first transition region being connected to the first main body region and the other side being connected to the concave platform region, one side of the second transition region being connected to the concave platform region and the other side being connected to the second main body region; A first main coating, a first transition coating, a second transition coating, and a second main coating are formed on the first main area, the first transition area, the second transition area, and the second main area of ​​the glass substrate, respectively. The first transition coating is connected to the first main coating, and its thickness increases or gradually increases as it approaches the first main coating. The second transition coating is connected to the second main coating, and its thickness increases or gradually increases as it approaches the second main coating. No coating is formed on the recessed area. An etching process with equal etching depth is performed on each side of the coating of the glass substrate to obtain a flexible glass cover plate. The flexible glass cover plate includes: a first main body, a bending part, and a second main body, wherein the first main body and the second main body are connected through the bending part. The bending portion includes a first transition portion, a recessed portion, and a second transition portion. One side of the first transition portion is connected to the first main body portion, and the other side is connected to the recessed portion. One side of the second transition portion is connected to the recessed portion, and the other side is connected to the second main body portion. Furthermore, the thickness of the first transition portion increases or gradually increases as it approaches the first main body portion, and the thickness of the second transition portion increases or gradually increases as it approaches the second main body portion. And it meets the following conditions: (1) The distance between the side of the first transition portion that connects to the first main body portion and the side that connects to the recessed portion is 15mm~20mm; (2) The distance between the side of the concave platform that connects to the first transition portion and the side that connects to the second transition portion is 20mm~25mm, and the thickness of the concave platform remains unchanged; (3) The distance between the side of the second transition portion that connects to the recessed portion and the side that connects to the second main body portion is 15mm~20mm.

2. The method for preparing the flexible glass cover plate according to claim 1, characterized in that, The etching depth is greater than the minimum thickness of the first transition coating and the second transition coating.

3. The method for preparing the flexible glass cover plate according to claim 2, characterized in that, The etching process, which involves performing an etching depth equal to the depth on each side of the coating on the glass substrate, includes the following steps: The glass substrate is brought into contact with the etching solution on one side of each coating.

4. The method for preparing the flexible glass cover plate according to claim 3, characterized in that, The etching solution is an acidic etching solution.

5. The method for preparing the flexible glass cover plate according to claim 1, characterized in that, One or more of the following conditions must be met: (1) The thickness of the first main coating remains unchanged; (2) The thickness of the second main coating remains unchanged; (3) The thickness of the first main body remains unchanged; (4) The thickness of the first main body is 70μm~220μm; (5) The thickness of the second main body remains unchanged; (6) The thickness of the second main body is 70μm~220μm; (7) The thickness of the concave part is 30μm~50μm.

6. The method for preparing the flexible glass cover plate according to claim 1, characterized in that, The process of forming a first transition coating on the first transition region of the glass substrate includes the following steps: A first positive photoresist is coated on the first transition region to form a first transition photoresist layer; the first transition photoresist layer is exposed, and the exposure energy is controlled so that the exposure thickness of the first transition photoresist layer decreases or the gradient decreases as it approaches the first main body region; the first transition photoresist layer after exposure is developed; or A first curing material is coated on the first transition region, and the coating thickness of the first curing material increases or the gradient increases as it approaches the first main body region; the first curing material is then cured.

7. The method for preparing the flexible glass cover plate according to claim 6, characterized in that, The process of forming a second transition coating on the second transition region of the glass substrate includes the following steps: A second positive photoresist is coated on the second transition region to form a second transition photoresist layer; the second transition photoresist layer is exposed, and the exposure energy is controlled so that the exposure thickness of the second transition photoresist layer decreases or the gradient decreases as it approaches the second main region; the exposed second transition photoresist layer is then developed; or A second curing material is coated on the second transition zone, and the coating thickness of the second curing material increases or the gradient increases as it approaches the second main body zone; the second curing material is then cured.

8. The method for preparing the flexible glass cover plate according to claim 7, characterized in that, One or more of the following conditions must be met: (1) The formation of a first main coating on a first main area of ​​the glass substrate includes the following steps: coating a third curing material on the first main area; curing the third curing material; (2) The formation of the second main coating on the second main area of ​​the glass substrate includes the following steps: coating the second main area with a fourth curing material; curing the fourth curing material.

9. The method for preparing the flexible glass cover according to claim 8, characterized in that, The first curing material, the second curing material, the third curing material, and the fourth curing material satisfy one or more of the following conditions: (1) The first curing material, the second curing material, the third curing material and the fourth curing material each independently include one or more of thermosetting curing materials and photosetting curing materials, wherein the photosetting curing material includes positive photoresist or negative photoresist; (2) The solid content of the first curing material, the second curing material, the third curing material and the fourth curing material is independently 25wt%~95wt%.

10. The method for preparing a flexible glass cover according to any one of claims 1 to 9, characterized in that, The thickness of the glass substrate is 70μm~220μm.

11. A flexible glass cover, characterized in that, Prepared by the preparation method according to any one of claims 1 to 10.

12. A flexible screen assembly, characterized in that, The device includes a flexible display screen and a flexible glass cover plate as described in claim 11 or a flexible glass cover plate prepared by the preparation method described in any one of claims 1 to 10, wherein the flexible glass cover plate is disposed on the display surface of the flexible display screen.

13. An electronic device, characterized in that, Includes the flexible screen assembly, housing, and circuit board as described in claim 12; The housing and the flexible screen assembly form an accommodating space; The circuit board is disposed within the receiving space.

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