Method for producing electronic module for hearing device and corresponding electronic module

Abstract

The invention discloses a manufacturing method of an electronic module for a hearing device and the corresponding electronic module, and the method comprises the steps: providing an electronic component for the electronic module, and the electronic component comprises at least one functional component; sealing the masking element to the at least one functional element by placing a connecting material between the masking element and the surface of the electronic element, the sealed masking element forming a cavity centered above the at least one functional element; positioning the electronic component having the sealed masking element in the embedding mold using the masking element such that only the masking element is in contact with the interior of the embedding mold; encapsulating the electronic component in an embedding material by introducing the embedding material into the embedding mold; removing the embedding mold after the embedding material is cured; and removing the masking element from the packaged electronic element to enable access to the at least one functional element.

Description

[0001] This application is a divisional application of Chinese patent application 202011522488.6, filed on December 21, 2020, with the invention name “Electronic module for hearing devices”. Technical Field

[0002] The present invention relates to an electronic module for a hearing device. More specifically, the present invention relates to an electronic module for a hearing aid. The present invention relates to a method for manufacturing an electronic module for a hearing device, especially for a hearing aid. Furthermore, the present invention relates to a hearing aid comprising the electronic module. Background Art

[0003] In the field of hearing devices, in particular hearing aids, one of the problems is to protect the hearing device, in particular its electronic parts, from dust and moisture, while making the device resistant to electrostatic discharge (ESD). Furthermore, when providing a structure for the hearing device, one problem is the size and weight of the hearing device. This means that the structure of the device providing protection from dust and moisture and ESD protection should not lead to an increase in the size and / or weight of the hearing device. Thus, in the field of hearing devices, there is a need to improve the properties of the hearing device without increasing the size and / or weight.

[0004] At the current state of the art, covering the surface of an electronic component with a protective and / or insulating material is known as a method of providing protection for the electronic component. However, in known solutions, only parts of the surface are covered with insulating material, thus providing only partial protection for the electronic component. This is because the electronic component has some functional parts, such as microphone ports or contact pads, which need to be freely accessible for the intended purpose. Therefore, at the current state of the art, it is necessary to leave the electronic component only partially uncovered by the insulating material, while leaving the remaining surface of the electronic component covered with the protective material.

[0005] Therefore, there is a need to provide a solution that solves at least some of the above mentioned problems. Summary of the invention

[0006] According to one aspect of the present invention, an electronic module for a hearing device is provided. The electronic module may include at least one electronic component for a hearing device and an embedding material covering the electronic component. The electronic component may include at least one restricted area, which is free of embedding material. The restricted area may be at least partially surrounded by an area, which is covered by a connecting material. The connecting material covering the area may have a molded portion formed by molding and a freely formed edge facing the restricted area.

[0007] The embedding material forms a kind of capsule for the electronic component, with a restricted area not covered by the embedding material. Thus, the embedding material encapsulates the electronic component. The embedding material provides protection for the hearing device from the external environment while enabling access to the intended parts of the electronic component. This is particularly important in the field of hearing aids. Since the embedding material covers the electronic component, there is no need to provide a separate element to protect the electronic component from dust and moisture. Since the electronic module comprises a restricted area without embedding material, access is enabled to certain parts of the electronic component, which can be used in a planned manner, while all the remaining surfaces are covered by the embedding material. Since the embedding material covers the surface of the electronic module except for the restricted area, the surface of the electronic component covered by the embedding material is protected from moisture and dust, such as battery poles. In addition, the electronic module according to the present invention improves the electrostatic discharge (ESD) performance of the device in which the module is to be used. This means that the design of the hearing device may be simplified since fewer other devices for ESD protection are required. In the case where the electronic module comprises more than one component, the embedding material connects these components relative to each other. The embedding material can not only connect the components of the electronic module, but also fix these components relative to each other. The embedding of electronic components can be carried out, for example, by encapsulation, molding, transfer molding, injection molding, secondary molding, perfusion or any other known method that enables the object to be covered with an embedding material, and the embedding material is in contact with the component, preferably the electronic component, to be cured or solidified. The embedding material is a solidifying material. The solidifying material can be, for example, epoxy resin, silicone, polyurethane, thermosetting material or thermoplastic material. The embedding material preferably has at least one of the following characteristics: low viscosity, low shrinkage, suitable for embedding, UV curing, heat curing, contact with skin, heat conduction, dielectric, transparent, translucent, opaque, electrically insulating, conductive, soft, rigid, low thermal expansion before solidification.

[0008] Preferably, the embedding material encapsulates the electronic component. This means that, except for at least one restricted area, the entire surface of the electronic component is covered with the embedding material.

[0009] The electronic module may include a connecting material which is a sealing material.

[0010] Using a sealing material enables the masking element to be connected to the electronic component using a sealing material having the desired bonding and sealing properties.

[0011] The electronic module may comprise the connecting material as an embedding material.

[0012] When the embedding material is used as the connecting material, the structure of the electronic module is simplified.

[0013] The embedding material may form an outer surface of the electronic module, and the region forms at least a part of a bottom of a recess in the outer surface of the encapsulated electronic module.

[0014] The embedding material may form an outer surface of the electronic module.

[0015] The recess may serve as a mounting for a part of a hearing device.

[0016] The electronic module may include the region disposed on a protruding portion of the electronic module.

[0017] The electronic module may comprise at least two electronic components, and the embedding material may connect these components with respect to each other.

[0018] The embedding material covers the electronic components and connects these components relative to each other. The embedding material can fix these components relative to each other. When these components are connected by means of the embedding material, the embedding material performs the function of a mounting piece, for example the function of a rack. Thus, the need to provide a rack is eliminated. Furthermore, embedding is particularly advantageous for heavy parts of the hearing device, because these heavy parts are exposed to damage when the hearing device is dropped, for example. Since the embedding material covers the entire surface of the electronic components, these components are connected more stably, so that a layer of embedding material performs the function of a protective piece. Due to the embedding so that the electronic components are trapped in the embedding material and the embedding material fills the gaps between the components, there is no need for an underlying filler for the IC or other electronic parts on the PCB.

[0019] The electronics module may comprise a PCB folded into a three-dimensional shape such that the PCB fits into the hearing aid.

[0020] The electronic module may comprise elements which may be arranged relative to each other in any desired manner.When the electronic module is folded to fit the three-dimensional shape of the hearing aid, the arrangement of the elements of the hearing aid is adapted to the shape of the hearing device.

[0021] According to another aspect, a hearing aid is provided comprising a packaged electronic module according to the invention.

[0022] Since the electronic components are embedded in the embedding material, the electronic components are protected from dust and moisture. Thus, no additional protection needs to be provided in the hearing device. Furthermore, no rack needs to be provided. Since no rack and components for protecting the electronic components from dust and moisture are required, the hearing device is lighter.

[0023] According to another aspect, a method for manufacturing an electronic module for a hearing device is provided. The method comprises: providing at least one electronic component for the electronic module. The method may comprise connecting a masking element to the electronic component. A cavity may be provided between the masking element and the electronic component. The method may comprise embedding the electronic component in an embedding material.

[0024] Since the masking element is connected to the electronic component, a surface of the electronic component is prevented from being covered with the embedding material. The cavity between the masking element and the electronic component provides a capillary stop for the connecting material, thereby preventing the connecting material from entering the restricted area and preventing the embedding material from entering the restricted area. The embedding of the electronic component can be performed, for example, by encapsulation, molding, transfer molding, injection molding, secondary molding, perfusion or any other known method that enables covering an object with an embedding and / or curable and / or solidifying material, which is in contact with the electronic component and / or is cured or solidified on or around the electronic component.

[0025] The masking element may comprise a cavity.

[0026] When the masking element comprises a cavity, the masking element can be used with many types of surfaces of the electronic component. The masking element can be used repeatedly. Furthermore, when the masking element is provided with a cavity, for each specific application, the masking element can be freely selected, which matches the shape and type of the electronic component and / or the properties of the embedding material and / or the characteristics of the electronic module we want to obtain.

[0027] The electronic component may include a cavity.

[0028] When the cavity is provided in the electronic component, the masking element used in the method can be flat, thereby improving the pressing of the masking element against the electronic component. In addition, when the masking element will remain in the encapsulated electronic module after curing, the top surface of the masking element can be in the same plane as the outer surface of the encapsulated electronic component formed by the encapsulation material.

[0029] The connection can be made using a connecting material or a connecting piece.

[0030] The connecting substance or the connecting element enables the masking element to be fixed to the electronic component in the desired position, ie above the restricted area. Both the connecting substance and the connecting element enable the embedding material to not enter the restricted area.

[0031] The connection can be made using a sealing material as the connection material.

[0032] The connection is performed using a potting material as a connection material.

[0033] The embedded electronic module may include at least two electronic components, and the embedding material fixes these components relative to each other.

[0034] The method may include removing the masking element from the encapsulated electronic module.

[0035] The restricted area may include a protruding portion, and the method includes sealing the masking element to the protruding portion.

[0036] The restricted area may comprise functional elements, such as microphone inlet and / or connector and / or switch and / or PCB and / or LED and / or light guide and / or speaker outlet and / or (optical) sensor and / or skin electrode and / or opening or serial number label.

[0037] The method may include providing a spring element for reducing a gap between the masking element and the electronic component.

[0038] According to another aspect of the present invention, a method for manufacturing an object embedded in a solidifying material and an apparatus for performing the method are provided.

[0039] In the field of methods for covering objects with liquid materials and subsequent curing, there is a need to provide methods that enable the elimination of air from a mold cavity, thereby maximizing the filling of the mold cavity with solidified material and minimizing the presence and size of bubbles in the material. This is particularly important in applications where the object to be covered has a complex shape. In this case, there is a risk that bubbles are trapped somewhere inside the object, for example in a cavity or in an unevenness on the surface of the object. This problem is particularly important for objects covered with relatively thin layers of material. In this case, it is important to avoid and / or reduce the problem of bubbles in the embedding material, because in the case of thin layers, bubbles can lead to interruptions in the embedding material. This is particularly important for electronic devices, especially devices that include electronic components and are designed to be used in environments where dust and moisture are present. In the field of hearing devices, one of the problems is to protect the electronic parts of the hearing device from dust and moisture, while making the device resistant to electrostatic discharge (ESD). In addition, when providing the structure of a hearing device, especially a hearing aid, a problem is the size and weight of the hearing device. This means that the structure of the device that provides protection from dust and moisture and ESD protection should not lead to an increase in the size and / or weight of the hearing device. Thus, in the field of hearing devices there is a need to improve the properties of hearing devices without increasing size and / or weight.

[0040] In the state of the art, it is known to cover the surface of an object with a solidifying material. However, in the state of the art, it is desirable to provide a method for embedding an object such that the amount of air in the embedding material is minimized. Therefore, it is desirable to provide a solution that solves at least some of the above mentioned problems.

[0041] According to one aspect of the present invention, a method for manufacturing an object embedded in a solidifying material is provided. The method includes providing an object for embedding in a mold cavity. The mold cavity may have a closed cavity. The method may include initially filling the mold cavity and at least one reservoir with solidifying material. The method may include supplementally filling the mold cavity with solidifying material from at least one reservoir. The method may include solidifying the solidifying material embedding the object.

[0042] The method according to the invention enables the mold cavity and the solidified material storage tank to be filled with solidified material at the same time. Solidified material should be understood as a material in contact with an object. Solidification can be carried out by reaction and / or phase change, so solidification can be, for example, curing, phase change, vulcanization or cross-linking, etc. The initial filling is the first stage of the method, which ends when the solidified material arrangement is introduced into the mold cavity and the storage tank from a distribution system for the solidified material, for example from a nozzle.

[0043] Thus, in the present method, solidified material is supplied to the mold cavity and the storage tank in one operation. During the initial filling period, the solidified material fills the mold cavity and at least one storage tank. Once the initial filling is completed, new solidified material may not be supplied by the distribution system. At this moment, the mold cavity includes solidified material and bubbles. The bubbles can be released, for example, by vibration, and / or minimized in size by changing the pressure or changing the temperature or a combination of the aforementioned means. As a result of the release and / or contraction of the bubbles, void spaces / gaps are generated in the mold cavity. The void spaces / gaps are filled with solidified material from the storage tank during the supplementary filling period.

[0044] Since during the initial filling, the solidified material is collected in at least one reservoir, the material can be supplied to the mold cavity from the at least one reservoir. The reservoir can provide a passage for the solidified material to the mold cavity. The method according to the invention allows the filling of the mold cavity to continue after the supply of solidified material from the distribution system has ended.

[0045] Therefore, during the supplementary filling, no filling device such as a nozzle is required. This enables time saving, since the solidified material for the supplementary filling is collected in the reservoir and is ready for use when the nozzle supplying the material is moved to the next mold cavity. The method according to the invention may be a potting method, an encapsulation method, an injection molding method, a secondary molding method, or any other known method enabling an object to be embedded in a solidifying material, which solidifies in contact with the object.

[0046] The method according to the invention enables controlling the geometry of an object having all faces, for example all six faces, bottom, left, right, front, back and top, embedded in solidified material, which is advantageous compared to known prior art solutions.

[0047] The solidifying material for supplementary filling can be supplied to at least one storage tank via the initial filling device.

[0048] When the solidifying material is supplied to the storage tank by the initial filling device, it can be used as a source of solidifying material in the present method.

[0049] The reservoir may be of any shape, such as a thick pipe, a runner, with accumulated solidified material.

[0050] During supplemental filling, solidified material may be introduced into the mold cavity at the point where solidified material was introduced during initial filling.

[0051] Such a design will simplify the mold cavity and leave fewer processing marks on the final product (if the supplemental filling is performed at two different points from the initial filling, two door marks will be left on the final product instead of one).

[0052] Supplemental filling may include introducing solidified material into the mold cavity at least at a point in the mold cavity at which the solidified material completely fills the mold cavity when reached during initial filling.

[0053] The technical effect of introducing material at the poles is that the poles in the mold are usually the most difficult places to fill, which is caused by entrapped air or lack of material flowing into this area (material dead ends). Therefore, it is a good idea to set the material introduction points there because this ensures that these poles are filled.

[0054] In the method, at least one viewing port is provided at or beside the pinnacle, wherein the pinnacle is the point in the mold cavity to which solidified material during initial filling completely fills the mold cavity.

[0055] The sight hole allows a direct view of the inside of the mold cavity. In addition, the sight hole is also a ventilation hole. The sight hole can also be used as a sump.

[0056] The supplemental fill may be performed at a higher pressure than the initial fill pressure.

[0057] When the supplementary filling is carried out at a pressure higher than the initial filling pressure, for example, the initial filling is carried out under vacuum and the supplementary filling is carried out at atmospheric pressure or, for example, at a pressure higher than 5 bar or 10 bar, once the pressure is increased to atmospheric pressure, the bubbles trapped in the mold cavity during the initial filling are minimized. This is advantageous because bubbles are minimized, otherwise the presence and size of bubbles will negatively affect the properties of the embedded object. Therefore, reducing the bubble size improves the performance. The pressure used to carry out the initial filling or supplementary filling or solidification can be obtained by changing the pressure in the mold cavity or by placing the mold cavity in a pressure chamber.

[0058] The supplementary filling pressure can be as high as possible above the initial filling pressure.

[0059] Reducing the bubble size may favorably affect the visual surface of the embedded object, which is suitable for products in which the embedded object is not covered with a shell.

[0060] Reducing the size of the bubbles can affect reliability. Specifically, moisture can penetrate the bubbles, causing corrosion and reducing the structural strength of the solidified material. Reducing the size of the bubbles will reduce the risk of corrosion.

[0061] Additionally, bubbles may also divert light into or out of a packaged object, such as light from a packaged LED, or light to an optical sensor such as a camera, color sensor, light intensity sensor, or the like.

[0062] Solidification may be carried out at a pressure higher than the initial filling pressure.

[0063] The initial filling can be performed in a vacuum.

[0064] When the first step, the initial filling, is carried out in a vacuum, the greatest possible size difference between the gas bubbles when entrained and when solidified can be achieved.

[0065] The initial filling and / or the supplementary filling may be performed by gravity.

[0066] When filling is performed by gravity, the energy required to carry out the method is minimized.

[0067] When the mould cavity is filled by gravity, this reduces the complexity of the filling apparatus because after the initial filling, the supply of solidified material can continue without the use of a pump, so that each mould does not require a sophisticated pump for simultaneous filling and supplemental filling.

[0068] Provides sufficient gravity to achieve low fill pressures and fill speeds suitable for embedding delicate electronic circuits such as hearing aid components.

[0069] The object may include at least one electronic component of a hearing aid.

[0070] According to one aspect of the present invention, there is provided an apparatus for manufacturing an object embedded in a solidifying material. The apparatus comprises a mould cavity. The apparatus may comprise an initial filling device for initially filling the mould cavity and at least one reservoir for solidifying material. The at least one reservoir may be connected to the mould cavity so that the mould cavity may be replenished with solidifying material.

[0071] The device according to the invention enables to fill the mould cavity from a reservoir. The device enables to save time, because the solidifying material is supplied to the device at once, i.e. to the initial filling device and to the reservoir. Thus, after the material has been supplied to the device, the filling device, such as a nozzle, can be moved to the next mould cavity.

[0072] Apparatus for producing an object embedded in a solidifying material may comprise at least one reservoir connected to the mould cavity at at least one point of the mould cavity. The at least one point is the point at which the solidifying material completely fills the mould cavity when reached during initial filling.

[0073] The apparatus for manufacturing an object embedded in solidifying material may comprise openings for viewing and / or for venting the mould cavity at or beside the poles, at least one pole being the point in the mould cavity at which the solidifying material completely fills the mould cavity when reached during initial filling.

[0074] The opening in the top of the mold cavity for ventilation can also be used as a sump so that no excessive trace amounts are left on the final product.

[0075] The apparatus may comprise openings at or beside the poles for viewing and / or for venting the mould cavity, at least one pole being a point in the mould cavity at which solidifying material, when reached during initial filling, completely fills the mould cavity.

[0076] The apparatus for manufacturing an object embedded in solidifying material may comprise openings for viewing and / or for venting the mould cavity at or beside the poles, at least one pole being a point in the mould cavity at which solidifying material reaches during initial filling, closing the mould cavity.

[0077] The reservoir may be arranged along the channel for introducing the solidification material for the initial filling.

[0078] The apparatus includes at least one reservoir arranged so that solidified material fills the mold cavity by gravity.

[0079] According to some embodiments of this aspect, there is provided:

[0080] A method of manufacturing an object embedded in a solidifying material comprises:

[0081] - providing an object for embedding in a mold cavity;

[0082] -The mold cavity is a closed cavity;

[0083] - initially filling the mould cavity and at least one reservoir with solidifying material;

[0084] - refilling the mould cavity with solidified material from at least one reservoir;

[0085] - Solidification of the solidifying material of the embedded object.

[0086] A method for producing an object embedded in a solidifying material, wherein solidifying material for supplementary filling is supplied to at least one reservoir by means of an initial filling device.

[0087] Method for manufacturing an object embedded in solidifying material, wherein, during supplementary filling, solidifying material is introduced into the mould cavity at the points where solidifying material was introduced during initial filling.

[0088] A method for manufacturing an object embedded in a solidifying material, wherein supplementary filling comprises introducing solidifying material into a mold cavity at least at one point of the mold cavity, the at least one point being a point in the mold cavity at which the solidifying material completely fills the mold cavity when reached during initial filling.

[0089] A method of manufacturing an object embedded in a solidifying material, wherein at least one viewing port is provided at or beside a pinnacle, wherein the pinnacle is the point in the mould cavity to which the solidifying material completely fills the mould cavity when reached during initial filling.

[0090] Method for producing an object embedded in a solidifying material, wherein the supplementary filling is carried out at a higher pressure than the initial filling pressure.

[0091] A method of manufacturing an object embedded in a solidifying material, wherein solidification is carried out at a pressure higher than the initial filling pressure.

[0092] A method for producing an object embedded in a solidifying material, wherein the initial filling is carried out under vacuum.

[0093] Method for producing an object embedded in a solidifying material, wherein the initial filling and / or the supplementary filling is carried out by gravity.

[0094] A method for producing an object embedded in a solidifying material, wherein the object comprises at least one electronic component of a hearing aid.

[0095] Apparatus for producing an object embedded in a solidifying material includes:

[0096] - Mould cavity;

[0097] - an initial filling device for initially filling the mould cavity and at least one reservoir for solidified material;

[0098] At least one reservoir is connected to the mould cavity so that the mould cavity can be replenished with solidifying material.

[0099] Apparatus for making an object embedded in solidifying material, wherein at least one reservoir is connected to the mould cavity at at least one point of the mould cavity, the at least one point being the point at which the solidifying material completely fills the mould cavity when reached during initial filling.

[0100] The apparatus for manufacturing an object embedded in solidifying material comprises openings for viewing and / or for ventilating the mould cavity at or beside the poles, at least one pole being the point in the mould cavity at which the solidifying material completely fills the mould cavity when reached during initial filling.

[0101] Apparatus for producing an object embedded in a solidifying material, wherein a reservoir is arranged along a channel for introducing the solidifying material for initial filling.

[0102] Apparatus for producing an object embedded in a solidifying material, wherein at least one reservoir is arranged so that the solidifying material fills the mould cavity by gravity. BRIEF DESCRIPTION OF THE DRAWINGS

[0103] Various aspects of the present invention will be best understood from the detailed description below in conjunction with the accompanying drawings. For clarity, the drawings are schematic and simplified, and only the details necessary for understanding the present invention are given, while other details are omitted. Throughout the specification, the same reference numerals are used for the same or corresponding parts. The various features of each aspect may be combined with any or all features of the other aspects. These and other aspects, features and / or technical effects will be apparent from and illustrated in conjunction with the following figures, in which:

[0104] Figure 1 An electronic module is shown;

[0105] Figure 2 An electronic module is shown;

[0106] Figure 3 A top view of a restricted area of ​​an electronics module is shown;

[0107] Figure 4 An electronic module having a masking element is shown;

[0108] Figure 5 An electronic module having a masking element is shown;

[0109] Figure 6a-6f The step of masking with a masking element having a cavity is shown;

[0110] Figures 7a-7f The step of masking with a masking element disposed in the mold is shown;

[0111] Figures 8a-8f The masking step of the restricted area including the protruding portion is shown;

[0112] Fig. 9 The device for embedding and the object to be embedded according to the present invention are shown;

[0113] Fig.10 The device for embedding and the object to be embedded according to the present invention are shown;

[0114] Fig.11 The invention shows a device for embedding and an object to be embedded. DETAILED DESCRIPTION

[0115] The detailed description proposed below in conjunction with the accompanying drawings serves as a description of a variety of different configurations. The detailed description includes specific details for providing a thorough understanding of a number of different concepts. However, it is apparent to those skilled in the art that these concepts can be implemented without these specific details. Several aspects of the apparatus and method are described by a number of different blocks, functional units, modules, components, circuits, steps, processes, algorithms, etc. (collectively referred to as "elements"). Depending on the specific application, design limitations or other reasons, these elements can be implemented using electronic hardware, computer programs or any combination thereof.

[0116] Electronic hardware may include microelectromechanical systems (MEMS), (e.g., application specific) integrated circuits, microprocessors, microcontrollers, digital signal processors (DSPs), field programmable gate arrays (FPGAs), programmable logic devices (PLDs), gating logic, discrete hardware circuits, printed circuit boards (PCBs) (e.g., flexible PCBs), and other appropriate hardware configured to perform the various functions described in this specification, such as sensors, e.g., sensors for sensing and / or recording physical characteristics of the environment, device, user, etc. Computer programs should be broadly construed as instructions, instruction sets, codes, code segments, program codes, programs, subroutines, software modules, applications, software applications, software packages, routines, subroutines, objects, executables, execution threads, programs, functions, etc., whether referred to as software, firmware, middleware, microcode, hardware description language, or otherwise.

[0117] A hearing device (or hearing instrument, hearing aid) may be or may include a hearing aid adapted to improve or enhance the hearing ability of a user by receiving an acoustic signal from the user's environment, generating a corresponding audio signal, possibly modifying the audio signal, and providing the possibly modified audio signal as an audible signal to at least one ear of the user. "Improving or enhancing the hearing ability of a user" may include compensating for a specific hearing loss of an individual user. "Hearing device" may also refer to a device such as a hearable device, an earphone or a headset adapted to electronically receive an audio signal, possibly modify the audio signal, and provide the possibly modified audio signal as an audible signal to at least one ear of a user. The audible signal may be provided in the form of an acoustic signal radiated into the outer ear of the user, an acoustic signal transmitted to the inner ear of the user as a mechanical vibration through the bone structure of the user's head and / or through parts of the middle ear, and an electrical signal transmitted directly or indirectly to the cochlear nerve and / or auditory cortex of the user.

[0118] The hearing device is adapted to be worn in any known manner. This may include: i) arranging the unit of the hearing device behind the ear (with a tube directing airborne acoustic signals into the ear canal or with a receiver / speaker arranged close to or in the ear canal and connected to the unit behind the ear by a wire (or wirelessly), such as a behind-the-ear hearing aid; and / or ii) arranging the hearing device in whole or in part in the pinna and / or ear canal of the user, such as an in-the-ear hearing aid or an in-the-canal / deep-in-the-canal hearing aid; or iii) arranging the unit of the hearing device to be connected to a fixing device implanted in the skull, such as a bone-anchored hearing aid or a cochlear implant; or iv) arranging the unit of the hearing device as a whole or in part implanted unit, such as a bone-anchored hearing aid or a cochlear implant. The hearing device may be implemented in a single unit (housing) or in a plurality of units connected to each other.

[0119] A "hearing system" refers to a system comprising one or two hearing devices. A "binaural hearing system" refers to a system comprising two hearing devices, wherein the hearing devices are adapted to provide audible signals to both ears of a user in a coordinated manner. A hearing system or binaural hearing system may further comprise one or more auxiliary devices in communication with at least one hearing device, the auxiliary device affecting the operation of the hearing device and / or benefiting from the function of the hearing device. A wired or wireless communication link is established between at least one hearing device and the auxiliary device so that information (such as control and status signals, possibly audio signals) can be exchanged therebetween. The auxiliary device may comprise at least one of the following: a remote control, a remote microphone, an audio gateway device, a wireless communication device such as a mobile phone (such as a smart phone) or a tablet or another device such as comprising a graphical interface, a broadcast system, a car audio system, a music player or a combination thereof. The audio gateway device is adapted to receive a plurality of audio signals such as from an entertainment device such as a TV or a music player, from a telephone device such as a mobile phone, or from a computer such as a PC. The auxiliary device may also be adapted to (e.g. enable a user to) select and / or combine appropriate signals from the received audio signals (or signal combinations) for transmission to at least one hearing device. The remote controller is adapted to control the functions and operation of at least one hearing device. The functions of the remote controller may be implemented in a smartphone or other (eg portable) electronic device, which may run an application (APP) for controlling the functions of at least one hearing device.

[0120] Generally, a hearing device comprises i) an input unit such as a microphone for receiving acoustic signals from the user's surroundings and providing a corresponding input audio signal; and / or ii) a receiving unit for electronically receiving the input audio signal. The hearing device also comprises a signal processing unit for processing the input audio signal and an output unit for providing an audible signal to the user based on the processed audio signal.

[0121] The input unit may include multiple input microphones, for example, for providing direction-dependent audio signal processing. The aforementioned directional microphone system is suitable for (relatively) enhancing a target sound source among multiple sound sources in the user's environment, and / or attenuating other sound sources (such as noise). On the one hand, the directional system is suitable for detecting (such as adaptively detecting) from which direction a specific part of the microphone signal originates. This can be achieved using conventionally known methods. The signal processing unit may include an amplifier suitable for applying a frequency-dependent gain to the input audio signal. The signal processing unit may also be suitable for providing other suitable functions such as compression, noise reduction, etc. The output unit may include an output transducer such as a speaker / receiver for providing an air-transmitted acoustic signal to the skull percutaneously or transcutaneously, or a vibrator for providing a structure-transmitted or liquid-transmitted acoustic signal. In some hearing devices, the output unit may include one or more output electrodes for providing an electrical signal, for example in a cochlear implant.

[0122] Figure 1 An electronic module 1 for a hearing aid according to the invention is shown. The electronic module comprises an electronic component 25 . Figure 1 The electronic module shown in is suitable for behind-the-ear hearing aids. Figure 1 The electronic module shown in comprises the following electronic components: microphone, speaker, battery, connector, thus in this example of the invention the electronic module comprises the basic elements of an exemplary hearing aid. The battery may be a rechargeable battery or a rechargeable battery.

[0123] Figure 1 The electronic module 1 shown in FIG. 1 comprises two restricted areas 5. The restricted areas 5 are the parts of the surface of the electronic component 25 that are not covered by the embedding material. The restricted areas 5 are free of embedding material. This enables access to the electronic component 25. Each restricted area 5 is surrounded by an area 16 made of connecting material, which can also be Figure 3 . The region 16 has a molded portion 29 and an edge 27. The edge 27 is the side of the region 16 facing the restricted region 5. The molded portion 29 is formed by molding. The edge 27 is freely formed by the embedding material. The remaining surface of the module 1, not including the restricted region 5, is covered with the embedding material 3. Therefore, only the part of the surface of the electronic component that needs to be approached is not covered with the embedding material 3.

[0124] The electronic module 1 according to the present invention has a layer of embedding material 3, which covers the electronic components 25 except for the restricted area 5. The embedding material 3 is preferably a solidifying material, such as epoxy resin, silicone, polyurethane, thermosetting material or thermoplastic material. The embedding material preferably has at least one of the following properties: suitable for secondary molding, UV curable, heat curable, suitable for contact with the user's skin, thermally conductive, low dielectric, transparent, translucent. The embedding material can be a liquid.

[0125] The embedding material 3 forms the outer surface 20 of the electronic module 1. In addition, the embedding material fills the gaps, spaces or cavities between and / or in the electronic components 25. This is for example when the shape or surface of the electronic components 25 is complex or just uneven. Thus, the embedding material forms the outer shape of the electronic module 1. The embedding material 3 connects the electronic components 25 to each other. Since the electronic components 25 are trapped in the embedding material 3, the mutual arrangement of the electronic components 25 relative to each other is established. According to the characteristics of the embedding material 3, due to the characteristics of the embedding material 3 and the characteristics and arrangement of the electronic components 25, the electronic components 25 may move relative to each other to a certain extent. Since the electronic components 25 are fixed by the embedding material 3, the electronic components 25 are installed in place, and there is no need to provide a rack in the device where the electronic module 1 is planned to be used. The components can be fixedly installed by the embedding material. In addition, the embedding material 3 provides protection for the electronic components 25 from mechanical damage. Mechanical damage is particularly harmful for so-called "heavy parts" such as pickup coils and / or NFMI coils. Since the embedding material 3 performs the function of a frame, there is no need to use a frame in the hearing device. This means that the embedding material 3 provides structural integrity to the hearing device. When excluding a frame, a reduction in weight and / or size of the hearing device is achieved.

[0126] An example of electronic component 25 is Figure 2 . The electronic component 25 may be, for example, a microphone. The electronic component may be any other component suitable for a hearing device, in particular a hearing aid, such as a speaker, a PCB, a pickup coil, a near-link coil, a connector or a battery. The electronic module 1 may include any combination of the electronic components mentioned above. In addition, the electronic component may also include at least one non-electronic component.

[0127] The electronic module 1 is shaped so that a suitable part of a hearing device can be mounted to the electronic module 1. Since the restricted area 5 has a limited surface, which is adjusted to the surface of the part to be mounted to the restricted area 5, the restricted area 5 is connected to the intended part of the hearing device, thereby providing tightness of the hearing device. Since the embedding material 3 covers the at least one electronic component but does not cover the restricted area 5, the embedding material 3 protects the at least one electronic component from moisture and dust. In addition, the at least one electronic component has improved ESD performance when covered with the embedding material 3.

[0128] The electronic module 1 includes a microphone and a speaker. Figure 1 and Figure 4 The electronic components of the electronic module 1 shown in the figure include a PCB folded into a three-dimensional shape. The PCB is a flexible PCB or a rigid PCB. The PCB is shaped so that its shape fits the hearing aid.

[0129] Restricted Area 5 Figure 3Detailed description is shown in FIG. The restricted area 5 preferably includes a functional element 23 of the electronic component 25. The functional element 23 may be, for example, a microphone inlet and / or a connector and / or a switch and / or a PCB and / or an LED and / or a light guide. The restricted area 5 is large enough to allow access to the functional part 23 so as to use the functional element 23 for the intended purpose. In addition, the restricted area 5 may be used for other purposes, such as for mounting a housing or any other element. Figure 3 The functional part 23 shown in the figure is, for example, a microphone port or a contact pad. The restricted area 5 is surrounded by the area / zone 16. The area 16 is covered by the connecting material. The area 16 has a molded part 29 and an edge 27. The molded part 29 is formed by molding. The area 16 has an edge 27. The edge 27 faces the restricted area 5. The edge 27 is freely formed by the connecting material. The term "freely formed" used means that the edge 27 is formed without contact with a molding surface acting on the edge 27. This means that the edge 27 is formed by the surface tension, viscosity and density of the embedding material. Therefore, the shape of the edge 27 is usually smooth and / or curved, depending on the characteristics of the embedding material 3. The edge 27 is Figure 5 The electronic module 1 is shown in detail in a cross-sectional view.

[0130] The electronic module 1 according to the invention is manufactured by the method according to the invention. The method for manufacturing the electronic module 1 for a hearing device comprises providing at least one electronic component 25 for a hearing device. To prevent a portion of the surface of the electronic component 25 (referred to as the restricted area 5) from being covered by the embedding material 3, a masking element 8 is connected to the electronic component 25, such as Figure 4 as shown in .

[0131] To obtain an electronic module with a restricted area 5, a masking element 8 is connected to the electronic component 25 so that the masking element 8 covers a part of the surface of the electronic component 25. The masked surface comprises the component which needs to be free of the embedding material 3. The masked surface comprises, for example, a microphone port, a contact pad or any other component. The masking element 8 is connected to the electronic component 25 to prevent the embedding material 3 from covering at least a part of the masked surface, called the restricted area 5. The connection is made with a connecting material, for example with a sealing material, with an embedding material or both. During the connecting step, the connecting material fills the gap between the masking element 8 and the masked surface, such as Figure 6a-6f Thus, the connecting material forms a barrier which prevents the embedding material 3 from covering the restricted area 5 .

[0132] The masking element 8 is shaped such that the masking element 8 provides a capillary stop for the connecting material. To provide the capillary stop, a cavity is provided between the masking element 8 and the electronic component 25. Figure 5In the example shown in detail, the cavity 17 is provided in the masking element 8. When the masking step is performed, the masking element 8 is connected to the electronic component 25 so that the cavity 17 faces the electronic component 25. The cavity 17 can be provided in the electronic component 25, for example by providing a recess in the electronic component 25. In this case, the masking element can be flat. The connection of the masking element 8 can be carried out together with the embedding or before the embedding. If the connection is carried out before the embedding, once the masking element 8 is connected to the electronic component 25, the embedding with the embedding material makes the entire surface of the electronic component 25 that is not covered by at least one masking element 8 covered with the embedding material 3. The embedding is preferably carried out in a mold. The embedding is carried out so that the masking element 8 can be removed after the embedding. This means that the masking element 8 is preferably not covered with the embedding material 3 at least in part or can be covered but the masking element 8 can be removed. The masking element 8 can preferably be removed by breaking the masking element 8. The removal of the masking element 8 can also be carried out by cutting the masking element 8 or dissolving.

[0133] The masking element 8 can be part of the electronic module. The masking element can be left as part of the electronic module. The opening in the masking element can be formed after embedding is complete, thus enabling access to the restricted area 5 arranged below the masking element 8.

[0134] The steps of the method for manufacturing an electronic module according to the present invention are as follows: Figure 6a-6f . In this example, the electronic module comprises an opening 30 in a PCB 31. The opening 30 is a functional element 23 that should not be covered by the embedding material 3. The portion of the surface of the electronic component 25 that includes the functional element 23 constitutes the restricted area 5. The opening 30 is, for example, a MEMS microphone inlet. Once the functional element 23 is determined, a masking element 8 is placed above the functional element 23. The masking element 8 comprises a cavity 17. The masking element 8 is placed on the surface of the electronic component 25 so that the cavity 17 faces the functional element 23. The masking element is connected to the surface of the electronic component 25. Preferably, the cavity 17 is substantially centrally arranged and opposite to the functional unit 23. In the example shown, the restricted area has no protruding parts.

[0135] The structure of the masking element 8 will now be combined with Figure 5 The masking element 8 is shown in detail. The masking element 8 has a connection side 32. The connection side 32 is connected to the masking area of ​​the electronic component 25. The connection side 32 is shaped so that the connection side 32 provides a capillary stop for the connection material. The masking element 8 also includes a top surface 33. The top surface 33 is substantially arranged opposite the cavity 17. When the embedding step is performed, the top surface 33 of the masking element 8 is preferably at least partially free of the embedding material 3, so that the masking element 8 can be removed after the embedding is performed. After the masking element 8 is removed, a layer of connection material remaining on the surface of the electronic component 25 produces the area 16.

[0136] The connection steps are Figure 6c . During the connecting step, the connecting side 32 is connected / attached to the electronic component 25. The connecting material seals the masking element 8 and the electronic component 25, thereby preferably providing a tight connection between the masking element 8 and the electronic component 25. The connecting material is placed between the masking element 8 and the surface of the electronic component 25. The connecting material can be applied after the masking element 8 is placed on the electronic component 25. The connecting material can be placed on the electronic component 25. The connecting material can be placed on the masking element 8. In the example shown, the connecting material can be placed on the connecting side 32.

[0137] Once the masking element 8 is sealed with the electronic component 25, as Figure 6c As shown in FIG. 1 , the electronic component 25 having the masking element 8 is placed in the embedding mold 34. The masking element 8 can be used to position the electronic component 25 in the mold 34. For example, when the electronic component 25 having the masking element 8 is placed in the mold 34, only the masking element 8 is in contact with the mold 34. Figure 6d-6f In the example shown, the mold 34 comprises a recess. The recess receives a portion of the masking element 8. Preferably, the recess receives at least the top 33 of the masking element 8, ie the end portion of the masking element 8.

[0138] When the electronic component 25 with the masking element 8 is placed in the mold cavity, the embedding material 3 is introduced into the mold 34 so as to cover the electronic component 25. After that, the mold cavity is filled with the embedding material 3, and further, the embedding material 3 is cured. After solidifying, for example, curing, the embedding material 3 with the electronic component 25, the electronic module according to the present invention is obtained. Once the embedding material 3 is cured, the electronic module 1 can be taken out of the mold cavity.

[0139] The mould cavity has a shape adapted to the planned electronic module 1. The shape of the inner space of the mould 34, where the electronic components 25 are placed, forms the outer surface of the electronic module 1.

[0140] After curing, the masking element 8 is removed, thereby enabling access to the functional element 23 not covered by the embedding material 3. A portion of the masked surface arranged below the connection side 32 of the masking element 8 is shaped, thereby forming a molded portion 29 of the area 16 covered by the connection material. The inner edge of the area 16 forms the edge 27. The edge 27 is formed by the connection material which is not molded but freely formed.

[0141] Examples of the present invention are Figures 7a-7f . In this example, the masking element 8 is part of the mold 34. The masking element 8 protrudes from the wall of the mold 34. The masking element 8 has a connection side 32 and a cavity 17. The masking element 8 is part of the mold 34 or a separate part inserted and mounted in the mold. As described above, the connection side 32 is connected to the masked surface. In addition, the method may include using a spring element 36, such as Figure 7c-7f. The spring element 36 is placed opposite to the masking element 8 in the mold. The spring element 36 presses the electronic component 25 against the masking element 8, thereby reducing the distance between the electronic component 25 and the masking element 8. The spring element 36 can be a piece of foam, a piece of elastomer, a beam spring, a coil spring, or a combination of the above-mentioned elements. In addition, the wall of the mold cavity opposite to the masking element 8 can have spring properties, thereby providing the function of the spring element 36. The masking element 8 can be left in the electronic module 1 or removed after the embedding material 3 is solidified. The spring element 36 can be used again when the next electronic component is molded. The spring element 36 can also be used when the masking element 8 is not a part of the mold 34.

[0142] Examples of the present invention are Figures 8a-8f In this example, the functional element 23 has a protruding portion. Figure 8b In the embodiment, the masking element 8 is connected to the protruding portion, such as Figure 8b As shown in Figures 8a-8f In the embodiment of the present invention, the protruding part is a connector. The shielding element 8 is placed so that its connection surface 32 abuts the protruding part. The shielding element is sealed with the protruding part. The shielding element 8 forms a cover around the protruding part. The shielding element 8 is connected to the protruding part by a connecting material. In addition, a spring element may be provided to reduce the gap between the shielding element 8 and the protruding part of the electronic component 25.

[0143] When the masking element 8 is connected to the protruding portion, an area 16 may be formed on the protruding portion, such as Figure 8f . The region 16 is a layer of connecting material remaining on the surface of the electronic component 25 after the masking element 8 is removed. The region 16 can be covered by a layer of connecting material that is thinner than the layer of embedding material 3 covering the remaining surface of the electronic component 25. The region 16 has an edge 27 facing the restricted region 5. In this example, the restricted region 5 includes a protruding portion.

[0144] Fig. 9 An object 100 to be embedded is shown, in this example an electronic module comprising electronic components for a hearing aid. Fig. 9 The electronic module shown in is suitable for a behind-the-ear hearing aid. However, the object may be an electronic component of any type of hearing aid, such as an in-the-ear hearing aid. Fig. 9 The electronic module shown in the figure comprises a microphone, a speaker, a battery, a connector. Thus, in this example of the invention, the object 100 to be embedded comprises the electronic components of a hearing aid. Furthermore, the object to be embedded may comprise at least one electronic and / or non-electronic component. Thus, it is possible to encapsulate the entire electronic circuit of a hearing aid using the method according to the invention.

[0145] The embedding material is a solidifying material. The solidifying material may be, for example, epoxy resin, silicone, polyurethane, thermosetting material or thermoplastic material. The embedding material preferably has at least one of the following properties: low viscosity before solidification, low shrinkage, suitable for embedding, UV curing, heat curing, skin contact, thermal conductivity, dielectric, transparent, translucent, opaque, electrical insulation, electrical conductivity, soft, rigid, low thermal expansion.

[0146] Fig. 9 An object 100 to be embedded is shown placed in a mold cavity 200. The object 100 is placed in the mold cavity 200, and the mold cavity is closed to provide a closed cavity of the mold cavity 200. When the cavity of the mold cavity 200 is closed, a material for embedding is introduced into the cavity of the mold cavity 200 and the reservoirs A and B, thereby initially filling the mold cavity 200 and the reservoirs A and B with solidified material. The initial filling of the mold cavity 200 is preferably performed until the moment when the mold cavity 200 is filled with the solidified material. The inlet 600 of the solidified material to the mold cavity 200 is preferably arranged so that the solidified material forces out bubbles present in the mold cavity 200 during the filling of the mold cavity 200. Fig. 9 In the embodiment of the present invention, the inlet 600 for the solidifying material is located at the lowest possible point in the object 100. This allows the gravity / buoyancy of the entrained gas bubbles to assist in forcing the air out through the top of the mold cavity.

[0147] During the initial filling of the mold cavity 200, the tanks A and B are filled substantially simultaneously, which means that a portion of the amount of solidified material is collected in the tanks A and B. The solidified material collected in the tanks A and B is used to supplement the mold cavity 200 after the initial filling is completed. The initial filling is performed using an initial filling device, for example, including a nozzle for providing the solidified material. Preferably, after the initial filling is completed, the initial filling device is moved to the next mold cavity. However, even if the mold cavity is completely filled with solidified material, the initial filling device can be moved to the next mold cavity. The solidified material includes bubbles, which means that the solidified material introduced into the mold cavity is a mixture of material and bubbles. After the initial filling is completed, the bubbles present in the mold cavity 200 are released or reduced in volume, so that free space / gap is generated in the mold cavity 200. The bubbles can be released by vibration, changing temperature, changing pressure or any combination of the factors mentioned above. The solidified material for supplementary filling is provided, and the free space appearing in the mold cavity 200 will be filled without using the initial filling device. Fig. 9 The reservoirs A, B shown in FIG. 1 are connected to the mold cavity 200 and ensure the availability of additional solidified material to fill the space / void.

[0148] This enables saving time in using the initial filling device, while at the same time allowing the mold cavity 200 to be filled with solidifying material as the free space / gap is being created. After the supplementary filling is completed, the solidifying material is cured.

[0149] The free space in the mold cavity 200 may be created by releasing the bubbles. The free space may be created by a reduction in the volume of the bubbles. The reduction in the volume of the bubbles may be the result of a pressure difference between the initial filling and the supplementary filling and / or between the initial filling and the curing stage. For example, the initial filling may be performed under vacuum, such as in a vacuum chamber. After the initial filling is completed, the vacuum may be released. When the vacuum is released, the size of the bubbles decreases due to the increase in pressure within the bubbles from vacuum to atmospheric pressure.

[0150] exist Fig. 9 In the embodiment of the present invention, a tank A is arranged along a channel 500 for supplying initial filling material to the mould cavity 200. In this case, the tank A is a tank placed along the channel 500. However, the tank can be a smooth widening of the channel 500. A second tank B can be arranged, for example, substantially opposite to an entrance 600 of the channel 500 to the mould cavity 200. Preferably, the second tank B is arranged at the pole of the mould cavity. The pole is the point in the mould cavity at which the solidified material reaches the point at which the mould cavity 200 is filled with solidified material. Near the pole, adjacent to the pole or in the pole, an observation hole and / or a ventilation point can be provided.

[0151] At least one reservoir A, B, C may be arranged so that the solidifying material enters the mould cavity by gravity. However, the solidifying material may be introduced under pressure.

[0152] When the mold cavity 500 is more complex, such as Fig.11 As shown in FIG. 3 , the device according to the invention may comprise more than one pole 300 as defined above. Fig.11 The device according to the invention shown in FIG. 1 has two tanks connected to the poles, namely tank B and tank C.

[0153] The apparatus according to the invention may comprise a reservoir for more than one mould cavity 200. Fig.10 In the embodiment, a reservoir A is arranged along a channel 500 for supplying solidifying material to two mould cavities 200, 200'. In each mould cavity 200, 200', an object 100, 100' is arranged respectively.

[0154] The invention also relates to a method without supplementary filling. In this case, a single filling of the mould cavity 200 with solidifying material is carried out. The filling is carried out under vacuum, for example in a vacuum chamber, with an absolute pressure of, for example, between 0.1 mBar and 1 Bar, and with solidifying material, for example, via gravity or at a pressure below 50 bar. The vacuum minimizes the chances of trapped bubbles in the mould cavity during the filling process. When the vacuum is released, the bubble size will shrink. Curing can be carried out at a pressure higher than atmospheric pressure to squeeze the trapped bubbles to a higher degree and thus make the bubbles smaller.

Claims

1. A method for manufacturing an electronic module for a hearing device, the method comprising: Providing an electronic component for an electronic module, the electronic component comprising at least one functional element; The masking element is sealed to the at least one functional element by placing a connecting material between the masking element and the surface of the electronic element, and the sealed masking element forms a cavity centered above the at least one functional element; positioning the electronic component with the sealed masking element in the embedding mold using the masking element so that only the masking element contacts the interior of the embedding mold; encapsulating the electronic component in the embedding material by introducing the embedding material into the embedding mold; Removing the investment mold after the investment material has solidified; and The masking element is removed from the packaged electronic component to enable access to at least one functional element.

2. The manufacturing method according to claim 1, wherein: The shape of the masking element includes said cavity.

3. The manufacturing method according to claim 1, wherein: The electronic component includes the cavity.

4. The manufacturing method according to claim 1, wherein: The connecting material is a sealing material.

5. The manufacturing method according to claim 1, wherein: The connection material is the same as the packaging material.

6. The manufacturing method according to claim 1, wherein: The electronic component includes a protruding portion that forms a restricted area around the functional element, and sealing the masking element to at least one functional element includes sealing the masking element to a surface of the protruding portion.

7. The manufacturing method according to claim 1, wherein: Removing the masking element forms a restricted area around the functional element.

8. The manufacturing method according to claim 7, wherein: The restricted zone is at least partially surrounded by a region covered by the connecting material, which covers a region with a molded portion formed by the masking element and a freely formed edge facing the restricted zone.

9. The manufacturing method according to claim 8, wherein: The freely formed edge facing the restricted area has a curve formed by the surface tension, viscosity, and / or density of the joining material.

10. An electronic module for a hearing device, comprising: An electronic component for a hearing device, the electronic component comprising at least one functional element; and an embedding material encapsulating the electronic component except for a restricted area around the at least one functional element; The restricted area is at least partially surrounded by a region formed by removing the masking element, the region being covered by a connecting material used to seal the masking element to the electronic component before packaging.

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