Adaptive Temperature-Regulating Light and Shadow Lamp and Its Control Method

Abstract

The present invention belongs to the technical field of non-portable lighting devices, and particularly relates to an adaptive temperature regulation type light and shadow lamp and a control method thereof. The adaptive temperature regulation type light and shadow lamp comprises: a bulb base, in which an assembly cavity is formed, an installation cylinder is arranged in the assembly cavity, the installation cylinder divides the assembly cavity into an outer cavity and an inner cavity, a heat dissipation member is arranged on the side wall of the inner cavity, and the top of the installation cylinder is a heat conduction plate; an LED lamp board, arranged on the installation cylinder and located in the outer cavity; a heat conduction member, arranged in the inner cavity; a control module, configured to regulate the upward movement distance of the heat conduction member according to the temperature data obtained by a temperature sensor to stabilize the working temperature of the LED lamp board. The adaptive temperature regulation type light and shadow lamp and the control method thereof are based on the temperature data obtained by the temperature sensor in different scenarios T , and realize preheating or heat dissipation of the LED lamp board by driving the heat conduction member to rise by different distances through a driver.

Description

Technical Field

[0001] The present invention belongs to the technical field of non-portable lighting devices, and specifically relates to lighting devices prepared for fixed installation, and particularly relates to an adaptive temperature-adjustable light and shadow lamp and a control method thereof. Background Art

[0002] A light and shadow lamp is a kind of lamp that can project patterns or create light and shadow effects. It is widely used in fields such as art exhibitions, decorative designs, stage performances, and commercial exhibitions. Such lamps not only provide lighting, but also can create unique visual effects through special light projection methods or in cooperation with designed patterns. Existing light and shadow lamps generally include at least a bulb base and a lampshade, and an LED lamp board is installed in the bulb base.

[0003] If the operating temperature of the LED lamp board is not within the optimal operating temperature range, it will affect the projection effect of the light and shadow lamp; in the related art, generally a fixed heat sink is attached to the back of the LED lamp board to conduct away the heat source when the LED lamp board is working for heat dissipation.

[0004] However, in the above solution, since the heat sink is fixedly arranged, no matter what the operating temperature of the LED lamp board is, the heat sink is dissipating heat; however, in a low-temperature scenario or a scenario at the optimal operating temperature, heat dissipation by the heat sink is not required, and heat dissipation will affect the operation of the LED lamp board.

[0005] Therefore, how to solve the technical problem that the existing use of a fixed heat sink for real-time heat dissipation will affect the LED lamp board and make it more difficult to reach the optimal operating temperature is an urgent problem to be solved by those skilled in the art.

[0006] It should be noted that the above information disclosed in this background art section is only used to understand the background art of the concept of this application. Therefore, the above description is not considered to constitute information on the prior art. Summary of the Invention

[0007] The embodiments of the present disclosure at least provide an adaptive temperature-adjustable light and shadow lamp and a control method thereof.

[0008] In a first aspect, an embodiment of the present disclosure provides an adaptive temperature - regulated light and shadow lamp, which is characterized by comprising: a bulb base, an assembly cavity is formed therein, an installation cylinder is arranged in the assembly cavity, the installation cylinder divides the assembly cavity into an outer cavity and an inner cavity, a heat dissipation member is arranged on the side wall of the inner cavity, and the top of the installation cylinder is a heat conduction plate; an LED lamp board, arranged on the installation cylinder and located in the outer cavity, and the back surface of the LED lamp board is attached to the heat conduction plate; a heat conduction member, arranged in the inner cavity; a temperature sensor, used for acquiring temperature data of the outer cavity at the position of the LED lamp board; a driver, connected to the heat conduction member; a control module, the control module is configured to control the driver to regulate the upward movement distance of the heat conduction member during preheating, so that the heat conduction member disengages from the heat dissipation member and extends into the outer cavity; the control module is further configured to control the driver to regulate the upward movement distance of the heat conduction member during heat dissipation, that is, to adjust the contact area between the heat conduction member and the heat conduction plate; wherein, during heat dissipation, the entire heat conduction surface of the heat dissipation member is attached to the heat conduction member.

[0009] In an optional embodiment, a plurality of avoidance holes are formed in the heat conduction plate; the heat conduction member includes: a bottom plate and a plurality of vertically arranged heat conduction strips, and each heat conduction strip is correspondingly arranged with a corresponding avoidance hole.

[0010] In an optional embodiment, the driver regulates the upward movement distance of the heat conduction member, including:

[0011] ;

[0012] wherein, d is the upward movement distance of the heat conduction member, in centimeters; d 预热 is the upward movement distance of the heat conduction member during preheating, in centimeters; d max is the maximum movement distance of the heat conduction member during heat dissipation, in centimeters; T is the temperature data of the outer cavity at the position of the LED lamp board acquired by the temperature sensor, in degrees Celsius; T low is the lowest set temperature for the LED lamp board to regulate heat dissipation, in degrees Celsius; T high is the highest set temperature for the LED lamp board to regulate heat dissipation, in degrees Celsius.

[0013] In a second aspect, an embodiment of the present disclosure further provides a control method for an adaptive temperature - regulated light and shadow lamp, including: acquiring temperature data of the outer cavity at the position of the LED lamp board through a temperature sensor; controlling the driver to regulate the upward movement distance of the heat conduction member according to the received temperature data through a control module to stabilize the working temperature of the LED lamp board.

[0014] In an alternative embodiment, the method of controlling the upward movement distance of the heat conducting member by the control module according to the received temperature data to stabilize the operating temperature of the LED lamp board includes:

[0015] ;

[0016] wherein, d is the upward movement distance of the heat conducting member, in centimeters; d 预热 is the upward movement distance of the heat conducting member during preheating, in centimeters; d max is the maximum movement distance of the heat conducting member during heat dissipation, in centimeters; T is the temperature data of the outer chamber at the LED lamp board obtained by the temperature sensor, in degrees Celsius; T low is the lowest set temperature for the LED lamp board to control heat dissipation, in degrees Celsius; T high is the highest set temperature for the LED lamp board to control heat dissipation, in degrees Celsius.

[0017] In an alternative embodiment, in the method of controlling the upward movement distance of the heat conducting member by the control module according to the received temperature data to stabilize the operating temperature of the LED lamp board, when the acquired temperature data T<0 the control module is configured to control the driver to drive the heat conducting member upward to d 预热 height; wherein, when the heat conducting member moves upward to d 预热 height to disengage from the heat sink and extend into the outer chamber, transferring the heat of the heat conducting plate into the outer chamber to preheat the LED lamp board.

[0018] In an alternative embodiment, in the method of controlling the upward movement distance of the heat conducting member by the control module according to the received temperature data to stabilize the operating temperature of the LED lamp board, when the acquired temperature data 0 < T < T low the control module is configured to control the driver to drive the heat conducting member to be stationary; wherein, when the heat conducting member is stationary, the upper end of the heat conducting member disengages from the heat conducting plate to stop heat dissipation.

[0019] In an alternative embodiment, in the method of controlling the upward movement distance of the heat conducting member by the control module according to the received temperature data to stabilize the operating temperature of the LED lamp board, when the acquired temperature data T low <T< T highWhen the temperature is detected, the control module is configured to control the driver to drive the heat conducting member to move upward and contact the heat conducting plate for heat dissipation; wherein, the upward movement distance of the heat conducting member is adjusted in real time according to the acquired temperature data, so as to change the contact area between the heat conducting member and the heat conducting plate.

[0020] In an optional embodiment, in the method of controlling the driver by the control module to adjust the upward movement distance of the heat conducting member according to the received temperature data to stabilize the operating temperature of the LED lamp board, when the acquired temperature data T > T high is detected, the control module is configured to control the driver to drive the heat conducting member to move upward to d max a height; wherein, when the heat conducting member moves upward to d max the height and is maintained at d max the height, the heat conducting member dissipates heat at the maximum power.

[0021] The beneficial effect of the present invention is that the self-adaptive temperature regulation type light and shadow lamp and its control method drive the heat conducting member to rise by different distances according to the temperature data acquired by the temperature sensor in different scenarios, so as to realize preheating or heat dissipation of the LED lamp board. T Thereby, preheating or heat dissipation of the LED lamp board is realized.

[0022] Other features and advantages of the present invention will be described in the following description, and some of them will be obvious from the description, or will be understood by implementing the present invention. The objectives and other advantages of the present invention are realized and obtained by the structures specifically pointed out in the description and the drawings.

[0023] To make the above objectives, features and advantages of the present invention more obvious and understandable, specific preferred embodiments are given herein, and in conjunction with the accompanying drawings, the detailed description is as follows. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] In order to more clearly illustrate the specific embodiments of the present invention or the technical solutions in the prior art, the following will briefly introduce the drawings required for the description of the specific embodiments or the prior art. Obviously, the following drawings are some embodiments of the present invention. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.

[0025] Figure 1 A perspective view of a self-adaptive temperature regulation type light and shadow lamp provided by an embodiment of the present disclosure;

[0026] Figure 2 A schematic cross-sectional structure view of a bulb base provided by an embodiment of the present disclosure;

[0027] Figure 3Schematic diagram of a heat conducting component provided by an embodiment of the present disclosure;

[0028] Figure 4 Schematic diagram of an installation cylinder provided by an embodiment of the present disclosure;

[0029] Figure 5 Schematic diagram of the position of the heat conducting component in the first application scenario provided by an embodiment of the present disclosure;

[0030] Figure 6 Schematic diagram of the position of the heat conducting component in the second application scenario provided by an embodiment of the present disclosure;

[0031] Figure 7 Schematic diagram of the position of the heat conducting component in the third application scenario provided by an embodiment of the present disclosure;

[0032] Figure 8 Schematic diagram of the position of the heat conducting component in the fourth application scenario provided by an embodiment of the present disclosure;

[0033] Figure 9 Is the control principle block diagram of the control module.

[0034] In the figure:

[0035] Bulb base 1, assembly cavity 11, outer cavity 111, inner cavity 112, installation cylinder 12, heat conducting plate 121, avoidance hole 122, heat dissipating component 13;

[0036] LED lamp board 2;

[0037] Heat conducting component 3, bottom plate 31, heat conducting strip 32;

[0038] Driver 4. Specific implementation manners

[0039] To make the objectives, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings. Apparently, the described embodiments are some but not all of the embodiments of the present invention. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts shall fall within the protection scope of the present invention.

[0040] It should be noted that like reference numerals and letters denote like items in the following drawings. Therefore, once an item is defined in one drawing, it does not need to be further defined and explained in subsequent drawings. In addition, in the drawings, the thickness of components may be exaggerated or reduced for effective description of the technical content.

[0041] The following will, with reference to the accompanying drawings, elaborate on some embodiments of the present invention. Without conflict, the following embodiments and the features in the embodiments may be combined with each other.

[0042] As Figure 1 , Figure 2 shown, at least one embodiment provides an adaptive temperature-regulated light and shadow lamp, including: a bulb base 1, an LED lamp board 2, a heat conducting member 3, a temperature sensor, a driver 4, and a control module.

[0043] As Figure 2 shown, in some embodiments, an assembly cavity 11 is formed in the bulb base 1, and an installation cylinder 12 is arranged in the assembly cavity 11. The installation cylinder 12 divides the assembly cavity 11 into an outer cavity 111 and an inner cavity 112.

[0044] As Figure 2 shown, in some embodiments, the LED lamp board 2 is arranged on the installation cylinder 12 and located in the outer cavity 111; since the LED lamp board 2 generates heat on the back, the heat dissipated from the back of the LED lamp board 2 will enter the inner cavity 112 during operation.

[0045] In some embodiments, the temperature sensor is arranged in the outer cavity 111 for obtaining the temperature data at the LED lamp board 2 in the outer cavity 111 and sending it.

[0046] As Figure 2 shown, in some embodiments, the heat conducting member 3 is arranged in the inner cavity 112. After receiving the heat dissipated from the LED lamp board 2 through the upper end portion, the heat is transferred away through the lower end portion, thereby achieving the heat dissipation effect on the LED lamp board 2.

[0047] As Figure 2 , Figure 9 shown, in some embodiments, the control module is electrically connected to the driver 4 and the temperature sensor, the driver 4 is connected to the heat conducting member 3, and the control module is configured to control the driver to adjust the upward movement distance of the heat conducting member 3 according to the received temperature data.

[0048] In some embodiments, optionally, the driver 4 includes: a servo motor and a lead screw. The servo motor drives the lead screw to rotate, and a lifting sleeve meshing with the lead screw is arranged on the lead screw. The lead screw drives the lifting sleeve to lift through rotation, thereby realizing the lifting of the heat conducting member 3.

[0049] In this embodiment, the control module will receive the temperature data sent by the temperature sensor, calculate the data required for the upward movement of the heat conducting member 3 according to the temperature data, and then control the driver 4 to drive the heat conducting member 3 to move upward by a corresponding distance, so as to guide the heat to keep the LED lamp board 2 stable within the optimal operating temperature range.

[0050] As Figure 2As shown, in some embodiments, a heat dissipation member 13 is provided on the side wall of the inner cavity 112. The top of the mounting cylinder 12 is a heat conducting plate 121, and the back surface of the LED lamp board 2 is attached to the heat conducting plate 121, thereby absorbing the heat on the back surface of the LED lamp board 2.

[0051] In this embodiment, the heat dissipation member 13 is annular and closely adheres to the side wall of the inner cavity 112 for adhering to the heat conducting member 3 to conduct heat for heat dissipation. During the heat dissipation process, the entire heat conducting surface of the heat dissipation member 13 is attached to the heat conducting member 3, so that during the adjustment process, there is only one variable, that is, the contact area between the heat conducting strip 32 and the heat conducting plate 121.

[0052] As Figure 3 shown, in some embodiments, the heat conducting member 3 includes: a bottom plate 31 and a plurality of vertically arranged heat conducting strips 32; the bottom plate 31 is connected to the driving end of the driver 4, the upper end of the heat conducting strip 32 is used to be attached to the heat conducting plate 121 to receive heat, and the lower end of the heat conducting strip 32 is used to be attached to the heat dissipation member 13 to transfer heat.

[0053] As Figure 4 shown, in some embodiments, a plurality of avoidance holes 122 are formed in the heat conducting plate 121 of the mounting cylinder 12; each heat conducting strip 32 is correspondingly arranged with a corresponding avoidance hole 122.

[0054] In this embodiment, the upper end of the heat conducting strip 32 is used to penetrate into the avoidance hole 122 and receive the heat of the heat conducting plate 121 by adhering to the inner wall of the avoidance hole 122.

[0055] In some embodiments, the driver 4 regulates the upward movement distance of the heat conducting member 3, including:

[0056] ;

[0057] wherein, d is the upward movement distance of the heat conducting member, in centimeters; d 预热 is the upward movement distance of the heat conducting member during preheating, in centimeters; d max is the maximum movement distance of the heat conducting member during heat dissipation, in centimeters; T is the temperature data of the outer cavity at the LED lamp board obtained by the temperature sensor, in degrees Celsius; T low is the lowest set temperature for the LED lamp board to regulate heat dissipation, in degrees Celsius; T high is the highest set temperature for the LED lamp board to regulate heat dissipation, in degrees Celsius.

[0058] In the first application scenario, as Figure 5 shown, the temperature data obtained by the temperature sensorT<0 , that is, the external temperature is very low. At this time, when the light and shadow lamp is started, the temperature rise of the light and shadow lamp will be very slow. If heat dissipation is still carried out on it, it will be even more difficult to reach the optimal working temperature. Therefore, in this embodiment, the control module controls the driver 4 to drive the heat conducting member 3 to move upward to d 预热 the height of, so that the heat conducting member 3 is separated from the heat dissipating member 13 and extends into the outer chamber 111. Then, the heat received by the heat conducting member 3 will no longer be transferred away through the heat dissipating member 13, but instead the heat energy will be transferred in the reverse direction into the outer chamber 111 to preheat the LED lamp board 2 in the outer chamber 111, thereby accelerating the LED lamp board 2 to reach the optimal working temperature.

[0059] In the second application scenario, as Figure 6 shown, the temperature data obtained by the temperature sensor 0 < T < T low , that is, the LED lamp board 2 is in the initial working stage or at the optimal working temperature. At this time, there is no need to dissipate heat from the LED lamp board 2. Therefore, in this embodiment, the control module controls the driver 4 not to drive the heat conducting member 3 to move upward, so that the heat conducting member 3 is separated from the heat conducting plate 121 and does not receive the heat of the heat conducting plate 121.

[0060] In the third application scenario, as Figure 7 shown, the temperature data obtained by the temperature sensor T In T low < T < T high the range of, that is, the working temperature of the LED lamp board 2 has exceeded the optimal working temperature. At this time, it is necessary to dissipate heat from the LED lamp board 2 to bring the temperature down to the range of the optimal working temperature. Therefore, in this embodiment, the control module controls the driver 4 to drive the heat conducting member 3 to move upward, so that the heat conducting member 3 contacts the heat conducting plate 121, thereby receiving the heat of the heat conducting plate 121 and guiding the received heat away through the heat dissipating member 13. Among them, during the upward movement of the heat conducting member 3, the heat dissipating member 13 is always in full contact with the heat conducting member 3, and the contact area does not change. Only the contact area between the heat conducting member 3 and the heat conducting plate 121 is changed, thereby adjusting the heat dissipation efficiency.

[0061] In the fourth application scenario, as Figure 8 shown, when the temperature data obtained by the temperature sensor T > T high , the control module controls the driver 4 to drive the heat conducting member 3 to move upward to d max height. At this time, the heat conducting member 3 fits the entire transmission surface of the heat conducting plate 121, that is, the heat dissipation efficiency is the largest.

[0062] In some embodiments, optionally, d 预热 is 5 centimeters,d max is 3 cm, T low is 30 degrees Celsius, T high is 60 degrees Celsius, and the optimal operating temperature is from 20 degrees Celsius to 30 degrees Celsius.

[0063] When T is -3 degrees Celsius, it meets the first application scenario, and at this time, the heat conducting member 3 moves up 5 cm.

[0064] When T is 10 degrees Celsius, it meets the second application scenario, and at this time, the heat conducting member 3 does not move up.

[0065] When T is 25 degrees Celsius, it meets the second application scenario, and at this time, the heat conducting member 3 does not move up.

[0066] When T is 35 degrees Celsius, it meets the third application scenario, and at this time, the upward movement distance of the heat conducting member 3 d ( T ) = 5 * ((35 - 30) / (60 - 30)) = 0.50 cm.

[0067] When T is 50 degrees Celsius, it meets the third application scenario, and at this time, the upward movement distance of the heat conducting member 3 d ( T ) = 5 * ((50 - 30) / (60 - 30)) = 2.00 cm.

[0068] When T is 70 degrees Celsius, it meets the fourth application scenario, and at this time, the heat conducting member 3 moves up 3 cm.

[0069] At least one embodiment provides a control method for an adaptive temperature - regulated light and shadow lamp, including: obtaining temperature data of the outer chamber 111 at the LED lamp board 2 through a temperature sensor; controlling the driver 4 by a control module according to the received temperature data to regulate the upward movement distance of the heat conducting member 3 to stabilize the operating temperature of the LED lamp board 2.

[0070] For the specific structure and implementation process of the adaptive temperature - regulated light and shadow lamp, refer to the relevant discussions in the above - mentioned embodiments, and details are not repeated here.

[0071] In some embodiments, the method of controlling the driver 4 by a control module according to the received temperature data to regulate the upward movement distance of the heat conducting member 3 to stabilize the operating temperature of the LED lamp board 2 includes:

[0072] ;

[0073] Among them,d is the upward displacement distance of the heat conducting member, in centimeters; d 预热 is the upward displacement distance of the heat conducting member during preheating, in centimeters; d max is the maximum moving distance of the heat conducting member during heat dissipation, in centimeters; T is the temperature data of the outer chamber at the LED lamp board obtained by the temperature sensor, in degrees Celsius; T low is the lowest set temperature for the LED lamp board to regulate heat dissipation, in degrees Celsius; T high is the highest set temperature for the LED lamp board to regulate heat dissipation, in degrees Celsius.

[0074] In some embodiments, in the method of regulating the upward displacement distance of the heat conducting member 3 by the control module according to the received temperature data to stabilize the operating temperature of the LED lamp board 2, when the obtained temperature data T<0 is, the control module is configured to control the driver 4 to drive the heat conducting member 3 upward to d 预热 height; wherein, when the heat conducting member 3 moves upward to d 预热 height to separate from the heat dissipation member 13 and extend into the outer chamber 111, the heat of the heat conducting plate 121 is transferred into the outer chamber 111 to preheat the LED lamp board 2.

[0075] In some embodiments, in the method of controlling the driver 4 by the control module according to the received temperature data to regulate the upward displacement distance of the heat conducting member 3 to stabilize the operating temperature of the LED lamp board 2, when the obtained temperature data 0 < T < T low is, the control module is configured to control the driver 4 to drive the heat conducting member 3 to be stationary; wherein, when the heat conducting member 3 is stationary, the upper end of the heat conducting member 3 is separated from the heat conducting plate 121 to stop heat dissipation.

[0076] In some embodiments, in the method of controlling the driver 4 by the control module according to the received temperature data to regulate the upward displacement distance of the heat conducting member 3 to stabilize the operating temperature of the LED lamp board 2, when the obtained temperature data T low < T < T high is, the control module is configured to control the driver 4 to drive the heat conducting member 3 upward and contact the heat conducting plate 121 to dissipate heat; wherein, the upward displacement distance of the heat conducting member 3 is regulated in real time according to the obtained temperature data to change the contact area between the heat conducting member 3 and the heat conducting plate 121.

[0077] In some embodiments, in the method of controlling the upward movement distance of the heat conducting member 3 by the control module according to the received temperature data to control the driver 4 to stabilize the operating temperature of the LED lamp board 2, when the acquired temperature data T > T high is such that, the control module is configured to control the driver 4 to drive the heat conducting member 3 to move upward to d max a height; wherein, when the heat conducting member 3 moves upward to d max the height and is maintained at d max the height, the heat conducting member 3 dissipates heat at the maximum power.

[0078] In summary, the self-adaptive temperature-regulated light and shadow lamp and its control method obtain temperature data by the temperature sensor in different scenarios T and control the driver 4 by the control module to drive the heat conducting member 3 to have different upward movement distances, thereby realizing preheating or heat dissipation of the LED lamp board 2.

[0079] In this document, when it is mentioned that the first component is located on the second component, this may mean that the first component can be directly formed on the second component, or a third component can be interposed between the first component and the second component.

[0080] In this document, when an element or layer is referred to as "being located on", "engaged to", "connected to", "attached to", or "coupled to" another element or layer, it can be directly located on, engaged, connected, attached, or coupled to another element or layer, or there may be an intermediate element or layer. In contrast, when an element is referred to as "directly on another element or layer", "directly engaged to", "directly connected to", "directly attached to", or "directly coupled to" another element or layer, there may be no intermediate element or layer. Other words used to describe the relationship between elements should be interpreted in a similar manner (e.g., "between" vs. "directly between", "adjacent" vs. "directly adjacent", etc.). As used herein, the term "and / or" includes any and all combinations of one or more of the related listed items.

[0081] In this document, example embodiments of the present disclosure will be described in more detail with reference to the accompanying drawings. As used herein, expressions such as "at least one of..." modify the entire list of elements when following a list of elements. For example, the expression "at least one of a, b, and c" should be understood to include only a, only b, only c, both a and b, both a and c, both b and c, or all of a, b, and c.

[0082] The terms used herein are for the purpose of describing particular exemplary configurations only and are not intended to be limiting. As used herein, the singular articles "a", "an" and "the" may also be intended to include the plural forms, unless the context clearly indicates otherwise. The terms "comprising", "including" and "having" are inclusive and thus specify the presence of stated features, steps, operations, elements and / or components, but do not preclude the presence or addition of one or more other features, steps, operations, elements, components and / or combinations thereof. The method steps, processes and operations described herein should not be construed as necessarily requiring them to be performed in the particular order discussed or illustrated, unless specifically identified as an order of performance. Additional or alternative steps may be employed.

[0083] As used herein, phrases such as "in one embodiment", "according to one embodiment", "in some embodiments", etc. generally refer to the fact that the particular feature, structure or characteristic after such phrase may be included in at least one embodiment of the present disclosure. Thus, a particular feature, structure or characteristic may be included in more than one embodiment of the present disclosure, such that these phrases do not necessarily refer to the same embodiment. As used herein, the terms "example", "exemplary", etc. are used "as an example, instance or illustration. Any embodiment, aspect or design described herein as "example" or "exemplary" is not necessarily to be construed as preferred or superior to other embodiments, aspects or designs. Rather, the use of the terms "example", "exemplary", etc. is intended to present concepts in a concrete manner.

[0084] In the description of the embodiments of the present invention, unless otherwise clearly defined and limited, the terms "mounted", "connected" and "coupled" shall be construed broadly. For example, it may be a fixed connection, a detachable connection or an integral connection; it may be a mechanical connection or an electrical connection; it may be a direct connection or an indirect connection through an intermediate medium, and it may be the communication inside two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention may be understood according to specific circumstances.

[0085] In the description of the present invention, it should be noted that the orientation or positional relationship indicated by the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as a limitation of the present invention. In addition, terms such as "first", "second" and other numerical terms used herein do not imply an order or sequence, unless the context clearly indicates otherwise. Thus, without departing from the teachings of the exemplary embodiments, the first element, component, region, layer or section discussed above may be referred to as the second element, component, region, layer or section.

[0086] Spatially relative terms, such as "inner", "outer", "beneath", "below", "lower", "above", "upper", etc., may be used herein for ease of description to describe the relationship of one element or feature to another element or feature as illustrated in the figures. In addition to the orientation depicted in the figures, spatially relative terms are intended to encompass different orientations of the device in use or operation. For example, if the device in the figures is turned over, an element described as "beneath" or "below" other elements or features will be oriented "above" the other elements or features. Thus, the exemplary term "below" can encompass both an above and a below orientation. The device may be otherwise oriented (rotated 90 degrees or at other orientations), and the spatially relative descriptors used herein are to be interpreted accordingly.

[0087] In the above discussion, unless otherwise stated, when used to describe a numerical value, terms such as "about", "approximately", "substantially", etc. mean a variation of + / −10% of that value.

[0088] Based on the above inspiration from the ideal embodiments of the present invention, through the above description, relevant workers can, without departing from the technical idea of the present invention, make various changes and modifications. The technical scope of the present invention is not limited to the content in the specification, and its technical scope must be determined according to the scope of the claims.

Claims

1. An adaptive temperature-adjustable light and shadow lamp, characterized in that: include: A light bulb base (1) having an assembly cavity (11) formed therein, wherein an installation tube (12) is disposed in the assembly cavity (11), wherein the installation tube (12) divides the assembly cavity (11) into an outer chamber (111) and an inner chamber (112), wherein a heat sink (13) is disposed on a side wall of the inner chamber (112), and the top of the installation tube (12) is a heat conducting plate (121); An LED light board (2) is arranged on the mounting tube (12) and is located in the outer chamber (111), and the back surface of the LED light board (2) is in contact with the heat conducting plate (121); A heat conducting member (3) disposed in the inner chamber (112); A temperature sensor, used to obtain temperature data of the outer chamber (111) at the LED light board (2); A driver (4) connected to the heat conducting member (3); a control module, the control module being configured to control the driver (4) to adjust the upward movement distance of the heat-conducting element (3) during preheating, so that the heat-conducting element (3) is separated from the heat-dissipating element (13) and extends into the outer chamber (111); The control module is further configured to control the driver (4) to adjust the upward movement distance of the heat conducting member (3) during heat dissipation, that is, to adjust the contact area between the heat conducting member (3) and the heat conducting plate (121); Wherein, when dissipating heat, the entire heat-conducting surface of the heat dissipating element (13) is in contact with the heat-conducting element (3); The heat conducting plate (121) is provided with a plurality of avoidance holes (122); The heat conducting member (3) comprises: a bottom plate (31) and a plurality of vertically arranged heat conducting strips (32), each of the heat conducting strips (32) being arranged corresponding to a corresponding avoidance hole (122); The driver (4) regulates the upward movement distance of the heat conducting member (3) including: ； in, d is the upward movement distance of the heat-conducting part, in centimeters; d 预热 is the upward movement distance of the heat-conducting part during preheating, in centimeters; d max The maximum moving distance of the heat conductor during heat dissipation, in centimeters; T The temperature data of the external chamber at the LED light board obtained by the temperature sensor, in degrees Celsius; T low The minimum set temperature for the LED light panel to control heat dissipation, in degrees Celsius; T high The maximum set temperature for regulating heat dissipation of the LED light panel, in degrees Celsius.

2. A control method of the adaptive temperature-adjustable light and shadow lamp as claimed in claim 1, characterized in that: include: Acquiring temperature data of the outer chamber (111) at the LED light board (2) through a temperature sensor; The control module controls the driver (4) according to the received temperature data to adjust the upward movement distance of the heat conducting member (3) so as to stabilize the operating temperature of the LED light board (2).

3. The control method of the adaptive temperature-adjustable light and shadow lamp according to claim 2, characterized in that: In the method for controlling the driver (4) to adjust the upward movement distance of the heat-conducting member (3) by the control module according to the received temperature data to stabilize the working temperature of the LED light board (2), when the acquired temperature data T<0 When the control module is configured to control the driver (4) to drive the heat conducting element (3) to move upward to d 预热 high; The heat conducting member (3) is moved upward to d 预热 The height is such that the heat sink (13) is separated from the heat dissipation element (13) and extends into the outer chamber (111), so as to transfer the heat of the heat conduction plate (121) into the outer chamber (111) to preheat the LED light board (2).

4. The control method of the adaptive temperature-adjustable light and shadow lamp according to claim 2, characterized in that: In the method for controlling the driver (4) to adjust the upward movement distance of the heat-conducting member (3) by the control module according to the received temperature data to stabilize the working temperature of the LED light board (2), when the acquired temperature data 0 <T<T low When the control module is configured to control the driver (4) to drive the heat conducting element (3) to be stationary; When the heat conducting member (3) is stationary, the upper end of the heat conducting member (3) is separated from the heat conducting plate (121) to stop heat dissipation.

5. The control method of the adaptive temperature-adjustable light and shadow lamp according to claim 2, characterized in that: In the method for controlling the driver (4) to adjust the upward movement distance of the heat-conducting member (3) by the control module according to the received temperature data to stabilize the working temperature of the LED light board (2), when the acquired temperature data T low <T<T high When the heat dissipation is reduced, the control module is configured to control the driver (4) to drive the heat conducting member (3) to move upward and contact the heat conducting plate (121) to dissipate heat; The upward movement distance of the heat conducting member (3) is regulated in real time according to the acquired temperature data, so as to change the contact area between the heat conducting member (3) and the heat conducting plate (121).

6. The control method of the adaptive temperature-adjustable light and shadow lamp according to claim 2, characterized in that: In the method for controlling the driver (4) to adjust the upward movement distance of the heat-conducting member (3) by the control module according to the received temperature data to stabilize the working temperature of the LED light board (2), when the acquired temperature data T>T high When the control module is configured to control the driver (4) to drive the heat conducting element (3) to move upward to d max high; Wherein, the heat conducting member (3) is moved to d max Height and maintain d max When the height is high, the heat conducting element (3) dissipates heat at maximum power.

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