Imaging device, projection device, vehicle lamp device, display device and vehicle

Abstract

The embodiment of the invention provides an imaging device, a projection device, a vehicle lamp device, a display device and a vehicle, and belongs to the technical field of imaging. The imaging device comprises a thermoelectric refrigerating unit, an imaging device and a shell. A closed cavity is defined by the shell, the thermoelectric refrigerating unit and the imaging device are arranged in the closed cavity, the thermoelectric refrigerating unit is used for adjusting the temperature of the imaging device, and the imaging device generates imaging light emitted to the outside of the shell. According to the imaging device provided by the embodiment of the invention, the thermoelectric refrigerating unit and the imaging device are arranged in the closed cavity, so that the imaging device can be ensured to be used in a severe environment.

Description

Technical Field

[0001] The embodiments of the present application relate to the field of imaging technologies, and in particular, to an imaging device, a projection device, a vehicle headlight device, a display device, and a vehicle. Background Art

[0002] With the development of vehicles and other transportation means, vehicle headlights such as adaptive driving beam (ADB) of vehicles and taillights with projection functions can be implemented by using a display device with pixelated projection functions. The display device can use light-emitting devices such as light emitting diodes (LEDs) or lasers as light sources, and use imaging devices such as liquid crystal on silicon (LCOS) and digital micro-mirror device (DMD) to perform pixelated modulation on light to achieve pixelated illumination, thereby enhancing the interactivity and safety of driving.

[0003] In the related art, a vehicle headlight includes a light source, a reflector, an imaging device, and a lens. Among them, the light beam emitted by the light source is irradiated onto the surface of the imaging device through the reflector. After the imaging device performs pixelated modulation on the light beam, it is reflected to the lens, and the lens projects it onto a target (such as a road surface) to form an image on the target. However, due to the harsh environment inside the vehicle headlight, such as high temperature and high humidity inside the lamp, the imaging device cannot be used.

[0004] Therefore, how to enable the imaging device to be used in a harsh environment (such as the vehicle headlight environment) has become an urgent problem to be solved. Summary of the Invention

[0005] The embodiments of the present application provide an imaging device, a projection device, a vehicle headlight device, a display device, and a vehicle, which can ensure that the imaging device can be used in a harsh environment.

[0006] In a first aspect of the present application, an imaging device is provided. The imaging device is used to generate imaging light that is directed towards a lens. The imaging device includes a thermoelectric cooler, an imaging device, and a housing. The housing encloses a sealed cavity. The thermoelectric cooler and the imaging device are disposed inside the sealed cavity. The thermoelectric cooler is used to adjust the temperature of the imaging device, and the imaging device generates imaging light that is directed towards the outside of the housing.

[0007] By disposing a thermoelectric cooler and an imaging device inside a sealed cavity, the housing can prevent moisture in the harsh environment from entering the inside of the sealed cavity, thereby avoiding environmental problems such as condensation and corrosion of the thermoelectric cooler and the imaging device, improving the environmental reliability of the thermoelectric cooler and the imaging device, and further ensuring the reliability of the thermoelectric cooler and the imaging device when applied in a harsh environment (such as a headlight environment), and ensuring the use of the imaging device in a harsh environment. In addition, by adjusting the temperature of the imaging device through the thermoelectric cooler, the operating temperature of the imaging device can be effectively controlled within its ideal operating temperature range for a long time, thereby improving the optical performance of the imaging device when applied in a harsh environment (such as a headlight environment), and further improving the reliability of the imaging device when applied in a harsh environment (such as a headlight environment).

[0008] In a possible implementation, the sealed cavity is a vacuum cavity, so that the inside of the sealed cavity is in a vacuum, enabling vacuum sealing of the imaging device and the thermoelectric cooler, and improving the reliability of the imaging device when applied in a harsh environment.

[0009] In a possible implementation, at least one inert gas is filled in the sealed cavity. By filling the inert gas in the sealed cavity, airtight sealing of the thermoelectric cooler and the imaging device can be achieved, thereby avoiding contact between the imaging device and oxygen, water vapor, etc. when the imaging device is in an environment with high humidity, and further improving the reliability of the thermoelectric cooler and the imaging device when applied in a harsh environment.

[0010] In a possible implementation, the inert gas is helium, neon, argon, krypton, xenon or radon.

[0011] In a possible implementation, the imaging device is in contact with the thermoelectric cooler, which can reduce the thermal resistance between the imaging device and the thermoelectric cooler, and further improve the heat dissipation effect.

[0012] In a possible implementation, the imaging device further includes a first heat-conducting layer, and the first heat-conducting layer is filled between the thermoelectric cooler and the imaging device.

[0013] The first heat-conducting layer can timely transfer the heat generated by the imaging device to the thermoelectric cooler to ensure that the operating temperature of the imaging device is within the optimal operating temperature range. In addition, by filling the gap between the thermoelectric cooler and the imaging device with the first heat-conducting layer, the thermal resistance between the imaging device and the thermoelectric cooler can be reduced, which helps to further improve the heat dissipation effect.

[0014] In a possible implementation, the imaging device includes an imaging component for generating imaging light, and the imaging component is used to contact the thermoelectric cooler or the first heat-conducting layer.

[0015] By bringing the imaging member into contact with the first heat-conducting layer or the thermoelectric cooler, the thermal resistance between the imaging member and the thermoelectric cooler can be further reduced, and the heat dissipation effect can be further improved.

[0016] In a possible implementation manner, the imaging device includes a substrate and an imaging member. The substrate is disposed between the imaging member and the thermoelectric cooler, and the imaging member is configured to generate imaging light.

[0017] By using the substrate and the imaging member to form the imaging device in cooperation with the thermoelectric cooler, the difficulty of the cooperation between the imaging device and the thermoelectric cooler can be reduced.

[0018] In a possible implementation manner, the imaging device is a liquid crystal on silicon, a digital micromirror device, a liquid crystal display, a microelectromechanical system, or an organic light-emitting diode.

[0019] In a possible implementation manner, along the thickness direction of the thermoelectric cooler, the projection of the thermoelectric cooler covers the imaging device, which can increase the heat exchange area between the thermoelectric cooler and the imaging device, and can further improve the heat dissipation effect.

[0020] In a possible implementation manner, the housing includes a light-transmitting portion. The imaging device is disposed between the light-transmitting portion and the thermoelectric cooler. The light-transmitting portion is configured to transmit the light outside the housing to the inside of the housing and to transmit the imaging light generated by the imaging device to the outside of the housing, which can ensure the use of the imaging device so that the imaging light forms a target image.

[0021] In a possible implementation manner, along the thickness direction of the thermoelectric cooler, the projection of the light-transmitting portion covers the imaging device, which can ensure that the imaging light generated by the imaging device can be transmitted to the outside of the housing.

[0022] In a possible implementation manner, the light-transmitting portion is a glass portion or an optical resin portion, which can transmit the light outside the housing to the inside of the housing and transmit the imaging light to the outside of the housing.

[0023] In a possible implementation manner, the housing further includes a heat-conducting shell portion. The thermoelectric cooler is in contact with the shell portion, which can transfer the heat transferred by the thermoelectric cooler to the outside of the housing to control the operating temperature of the imaging device within an optimal temperature range.

[0024] In a possible implementation manner, the shell portion is a ceramic shell, a metal shell, or a heat-conducting plastic shell.

[0025] The second aspect of the present application provides a projection device, including a lens and an imaging device according to any one of the first aspect. The imaging device is configured to generate imaging light that is incident on the lens.

[0026] The third aspect of the present application provides a vehicle lamp device, including a vehicle lamp housing and the projection device as described in the second aspect, and at least a part of the projection device is disposed inside the vehicle lamp housing.

[0027] In a possible implementation manner, the projection device further includes a heat dissipation device and a second heat conduction layer. At least a part of the heat dissipation device is disposed inside the vehicle lamp housing, the second heat conduction layer is filled between the heat dissipation device and the housing of the imaging device, and the thermoelectric cooler of the imaging device is disposed between the imaging device and the second heat conduction layer.

[0028] In a possible implementation manner, the projection device further includes a light source and a reflection unit. The reflection unit is configured to reflect the light beam emitted by the light source to the imaging device, and the imaging device is configured to generate imaging light according to the light beam emitted by the light source.

[0029] The fourth aspect of the present application provides a display device, including an imaging unit and the projection device as described in the second aspect. The imaging unit is configured to generate a target image according to the imaging light emitted by the projection device.

[0030] The fifth aspect of the present application provides a vehicle, including the vehicle lamp device according to any item of the third aspect or including the display device according to the fourth aspect.

[0031] In a possible implementation manner, the display device is installed in the instrument panel of the vehicle.

[0032] In a possible implementation manner, the vehicle further includes a windshield, the imaging light emitted by the display device is incident on the windshield, and the windshield reflects the imaging light to the human eye. Description of the Drawings

[0033] Figure 1 It is a schematic structural diagram of a vehicle lamp device provided by an embodiment of the present application;

[0034] Figure 2 It is a schematic structural diagram of a usage scenario of the display device provided by an embodiment of the present application;

[0035] Figure 3 It is a schematic structural diagram of a display device installed on a vehicle provided by an embodiment of the present application;

[0036] Figure 4 It is a schematic structural diagram of a first imaging device provided by an embodiment of the present application;

[0037] Figure 5 It is a schematic structural diagram of a second imaging device provided by an embodiment of the present application;

[0038] Figure 6 It is a schematic structural diagram of a third imaging device provided by an embodiment of the present application;

[0039] Figure 7 Schematic structural diagram of the fourth imaging device provided by the embodiment of the present application.

[0040] Explanation of reference numerals:

[0041] 100, imaging device;

[0042] 110, housing; 111, light-transmitting part; 112, shell part; 113, sealed cavity;

[0043] 120, imaging device;

[0044] 121, imaging element; 1211, adhesive layer; 1212, silicon substrate layer; 1213, liquid crystal layer; 1214, glass cover plate layer; 1215, anti-reflection layer;

[0045] 122, substrate; 123, lead; 124, contact pad;

[0046] 130, thermoelectric cooler; 131, first substrate; 132, second substrate; 133, semiconductor particles;

[0047] 140, first heat-conducting layer;

[0048] 200, vehicle lamp device;

[0049] 210, vehicle lamp housing; 211, lamp cover; 212, lamp shell;

[0050] 220, projection device; 221, lens; 222, fuselage; 223, heat dissipation device; 2231, main body part; 2232, fin part; 224, second heat-conducting layer; 225, light source; 226, reflection unit;

[0051] 300, display device; 400, imaging unit. Detailed implementation manners

[0052] In the related art, a vehicle lamp includes a light source, a collimating lens, a reflector, an imaging device, and a lens. Among them, the collimating lens collimates the light beam emitted by the light source, the reflector reflects the collimated light beam through the collimating lens onto the surface of the imaging device, the imaging device is used to perform pixel modulation on the collimated light beam and generate an imaging light beam directed at the lens, and the lens projects the imaging light beam onto a target (such as a road surface) to form an image on the target. However, due to the harsh environment inside the vehicle lamp, such as high temperature and high humidity inside the lamp, the imaging device cannot be used. Therefore, how to enable the imaging device to be used in a harsh environment (such as the vehicle lamp environment) has become an urgent problem to be solved.

[0053] In view of this, embodiments of the present application provide an imaging device 100, a projection device 220, a vehicle headlamp device 200, a display device 300, and a vehicle. By disposing the imaging device 120 and the thermoelectric cooler 130 in a sealed cavity, the environmental reliability of the thermoelectric cooler 130 and the imaging device 120 can be improved, and further the reliability of the thermoelectric cooler 130 and the imaging device 120 when applied in a harsh environment (such as a vehicle headlamp environment) can be improved. In addition, by adjusting the temperature of the imaging device 120 through the thermoelectric cooler 130, the operating temperature of the imaging device 120 can be controlled within the optimal operating temperature range, so that the optical performance of the imaging device 120 can be within a reasonable range, and further the reliability of the imaging device 120 when applied in a harsh environment (such as a vehicle headlamp environment) can be improved. Therefore, it can be ensured that the imaging device 120 is used in a harsh environment to meet the usage requirements.

[0054] The vehicle provided by the embodiments of the present application may include, but is not limited to, an automobile, a truck, a motorcycle, a bus, a ship, an airplane, a helicopter, a lawn mower, a recreational vehicle, a playground vehicle, construction equipment, a tram, a golf cart, a train, or a trolley, etc. Among them, in the embodiments of the present application, taking an automobile as an example of the above vehicle, the vehicle may include a vehicle headlamp device 200, and the vehicle headlamp device 200 may be used for lighting, projection imaging, etc.

[0055] The vehicle headlamp device 200 provided by the embodiments of the present application may include, but is not limited to, an external vehicle headlamp (also called a headlamp), a fog lamp, a tail lamp, an interior cabin lighting or an ambient light, etc. For example, in the embodiments of the present application, taking an external vehicle headlamp as an example of the above vehicle headlamp device 200, the vehicle headlamp device 200 can play a role in projection imaging and display lighting, such as lighting at night.

[0056] Figure 1 It is a schematic structural diagram of a vehicle headlamp device provided by an embodiment of the present application.

[0057] See Figure 1 As shown, the vehicle headlamp device 200 may include a vehicle headlamp housing 210 and a projection device 220. At least part of the projection device 220 is disposed in the vehicle headlamp housing 210. For example Figure 1 As shown, the projection device 220 is disposed inside the vehicle headlamp housing 210. Of course, part of the projection device 220 may also be disposed inside the vehicle headlamp housing 210 and another part may be disposed outside the vehicle headlamp housing 210. The projection device 220 is used for projection imaging and display lighting.

[0058] See Figure 1As shown, the headlight housing 210 includes a lamp cover 211 and a lamp case 212. The lamp cover 211 and the lamp case 212 enclose a cavity that houses at least part of the projection device 220. The lamp cover 211 can transmit light to ensure that the imaging light generated by the projection device 220 passes through.

[0059] See Figure 1 As shown, the projection device 220 includes a lens 221 and an imaging device 100. Among them, the imaging device 100 is used to generate imaging light that shoots towards the lens 221. The lens 221 is close to the lamp cover 211, and the lens 221 is used to project the imaging light outside the headlight housing 210 to form an image or illumination in front of the vehicle.

[0060] See Figure 1 As shown, the projection device 220 may further include a body 222. The lens 221 and the imaging device 100 are respectively installed on the body 222, and the body 222 is connected to the lamp case 212 to realize the fixed connection between the projection device 220 and the lamp case 212.

[0061] See Figure 1 As shown, the imaging device 100 includes an imaging component 120 and a thermoelectric cooler 130. Among them, the imaging component 120 is used to generate imaging light that shoots towards the lens 221. The thermoelectric cooler 130 is used to adjust the temperature of the imaging component 120 so that the operating temperature of the imaging component 120 is within the optimal operating temperature range.

[0062] Among them, the imaging component 120 may include, but is not limited to, liquid crystal on silicon (LCOS), digital micromirror device (DMD), micro electromechanical systems (MEMS), liquid crystal display (LCD), organic light-emitting diode (OLED), or micro-light-emitting diode (micro-LED), etc. For example, in the embodiments of the present application, the liquid crystal on silicon (LCOS) is used as the above-mentioned imaging component 120 for illustration.

[0063] In order to further improve the heat dissipation capacity of the imaging device 100, in some possible implementation manners, see Figure 1 As shown, the projection device 220 may further include a heat dissipation device 223 and a second heat conduction layer 224. Among them, at least part of the heat dissipation device 223 is disposed inside the headlight housing 210. For example Figure 1As shown, the heat dissipation device 223 can be disposed inside the headlight housing 210. Of course, a part of the heat dissipation device 223 can also be disposed inside the headlight housing 210 and another part can be disposed outside the headlight housing 210. The second heat conduction layer 224 is filled between the heat dissipation device 223 and the housing 110 of the imaging device 100.

[0064] By dissipating heat from the imaging device 100 through the heat dissipation device 223, the heat dissipation capacity of the imaging device 100 can be improved to ensure the normal operation of the imaging device 100. In addition, by filling the second heat conduction layer 224 between the housing 110 and the heat dissipation device 223, the thermal resistance between the heat dissipation device 223 and the imaging device 100 and the heat dissipation device 223 can be reduced, and the heat dissipation capacity of the imaging device 100 can be improved.

[0065] The heat dissipation device 223 can dissipate heat from the imaging device 100 through heat dissipation methods such as air cooling and liquid cooling, which are not specifically limited here. In some implementation manners, the heat dissipation device 223 can be a liquid cooling heat dissipation device. The liquid cooling heat dissipation device can include pipelines, liquid cooling plates, etc. The liquid cooling plate is used for heat exchange with the imaging device. In some other implementation manners, the heat dissipation device 223 can also be an air cooling heat dissipation device. The air cooling heat dissipation device can include a radiator and a fan. The radiator is disposed between the imaging device 100 and the fan. In still some other implementation manners, the heat dissipation device 223 can also be a radiator, and the radiator is used to increase the heat exchange area between the imaging device 100 and the air.

[0066] There is no limitation on the specific structure of the heat dissipation device 223 here. Exemplarily, the heat dissipation device 223 can be a finned radiator. Refer to Figure 1 As shown, the finned radiator can include a main body portion 2231 and a plurality of fin portions 2232 disposed on the same side of the main body portion 2231. The second heat conduction layer 224 is filled between the main body portion 2231 and the housing 110 of the imaging device 100. The heat dissipation device 223 can increase the heat exchange area between the imaging device 100 and the air to improve the heat dissipation capacity of the imaging device 100.

[0067] There is no limitation on the specific material of the second heat conduction layer 224 here. Among them, the second heat conduction layer 224 can include but is not limited to heat-conducting silica gel, silver heat-conducting sticker, copper gasket, heat-conducting glue, heat-conducting silicone grease, heat-conducting gel, heat-conducting pad, graphite sheet, heat-conducting insulating film, or heat-conducting ceramic sheet, etc.

[0068] It should be noted that in addition to indirectly contacting the housing 110 of the imaging device 100 through the second heat conduction layer 224, the second heat conduction layer 224 can be removed from the heat dissipation device 223. At this time, the heat dissipation device 223 can be in contact with the housing 110 of the imaging device 100, or the heat dissipation device 223 can also be not in contact with the housing 110 of the imaging device 100.

[0069] In order to reduce the volume of the projection device 220 and ensure the generation of imaging light, in some possible implementation manners, refer to Figure 1 As shown, the projection device 220 may further include a light source 225 and a reflection unit 226. Among them, the reflection unit 226 is used to reflect the light beam emitted by the light source 225 to the imaging device 100, and the imaging device 100 is used to generate imaging light that is directed at the lens 221 according to the light beam emitted by the light source 225.

[0070] Among them, the light source 225 may include, but is not limited to, a light emitting diode (LED) device, a laser diode (LD), etc.

[0071] It should be noted that when the imaging device 120 is a device such as an organic light emitting diode or a micro-light-emitting diode (micro-LED), there is no need to provide the light source 225. At this time, the projection device 220 may also include the reflection unit 226 or remove the reflection unit 226, and the reflection unit 226 may be used to reflect the imaging light emitted by the imaging device 120 to the lens 221.

[0072] Regarding the specific structure of the reflection unit 226, no limitation is imposed here. Exemplarily, continue to refer to Figure 1 As shown, the reflection unit 226 may be a curved mirror, and the light emitted by the light source 225 is reflected to the imaging device 100 through the curved surface of the curved mirror.

[0073] It should be noted that the projection device 220 provided in the embodiments of the present application can be applied not only to the vehicle headlight device 200 for projection imaging and display lighting, but also to display devices 300 such as projectors, head-up displays, augmented reality (AR) glasses, and televisions to play a role in projection imaging. The display device 300 can be installed at positions such as the instrument panel, seat, co-pilot position, or roof of a vehicle.

[0074] The following takes the head-up display as an example of the above display device 300 for illustration.

[0075] Figure 2 It is a schematic structural diagram of the usage scenario of the display device provided in the embodiments of the present application.

[0076] As Figure 2As shown, a head-up display (hereinafter referred to as HUD) can project navigation information, instrument information, etc. within the forward field of view of the driver, avoiding the driver from looking down at this information, thus affecting driving safety. After the image projected by the HUD is reflected by the windshield (wind screen), a virtual image is formed outside the vehicle, and these virtual images can be superimposed on the real environment outside the vehicle, enabling the driver to obtain the visual effect of augmented reality (AR), thereby realizing functions such as AR navigation, adaptive cruise control, lane departure warning, etc. Among them, the types of HUD include but are not limited to windshield (W)-HUD, augmented reality head-up display (AR-HUD), etc.

[0077] Figure 3 It is a schematic structural diagram of a display device provided by an embodiment of the present application installed on a vehicle.

[0078] See Figure 3 As shown, the display device 300 provided by an embodiment of the present application can be installed in the instrument panel of a vehicle to achieve hidden installation. In addition, the imaging light emitted by the display device 300 can be incident on the windshield, and the windshield can reflect the imaging light to the human eye, enabling the human eye to see the virtual image located outside the windshield.

[0079] Continue to see Figure 3 As shown, the vehicle may further include a windshield, and the imaging light emitted by the display device 300 is incident on the windshield, and the windshield reflects the imaging light to the human eye. Specifically, the display device 300 may include a projection device 220 and an imaging unit 400. The imaging unit 400 can reflect the imaging light emitted by the projection device 220 to the windshield, and the windshield reflects the imaging light to the human eye to form a target image.

[0080] Continue to see Figure 3 As shown, the projection device 220 may include an imaging device 100, a lens 221, and a light source 225. The imaging device 100 is used to generate imaging light incident on the lens 221 according to the light beam emitted by the light source 225, and the lens 221 is used to project the imaging light generated by the imaging device 100 onto the imaging unit 400. The imaging unit 400 is used to generate a target image according to the imaging light emitted by the projection device 220.

[0081] Regarding the specific structure of the imaging unit 400, there is no limitation here. Exemplarily, as Figure 3 shown, the imaging unit 400 may include a curved mirror, and the curved mirror is used to reflect the imaging light emitted by the projection device 220 to the windshield, and the windshield can reflect the imaging light to the human eye. In addition, since the concave surface of the curved mirror can reflect the imaging light, the image generated by the projection device 220 can be magnified by the curved mirror, and the user can see the magnified virtual image.

[0082] The implementation of the imaging device 100 provided in the embodiments of the present application will be described below.

[0083] Figure 4 It is a schematic structural diagram of the first imaging device provided in the embodiments of the present application.

[0084] See Figure 4 As shown, the imaging device 100 provided in the embodiments of the present application includes a thermoelectric cooler 130 (TEC), an imaging device 120, and a housing 110. Among them, the housing 110 encloses a sealed cavity 113. The thermoelectric cooler 130 and the imaging device 120 are disposed inside the sealed cavity 113. The thermoelectric cooler 130 is used to adjust the temperature of the imaging device 120, and the imaging device 120 generates imaging light that shoots towards the outside of the housing 110. During the operation of the imaging device 100, the thermoelectric cooler 130 can transfer the heat generated by the imaging device 120 to the housing 110, and the housing 110 can transfer the received heat to the outside of the housing 110 to dissipate heat from the imaging device 120.

[0085] The thermoelectric cooler 130 can be used to lower or raise the temperature of the imaging device 120. Specifically, when the imaging device 100 is in a high-temperature environment, the cold end face of the thermoelectric cooler 130 is close to the imaging device 120, and the hot end face of the thermoelectric cooler 130 is close to the housing 110. The thermoelectric cooler 130 cools the imaging device 120, and can control the temperature of the imaging device 120 within the optimal operating temperature range. When the imaging device 100 is in a low-temperature environment, the hot end face of the thermoelectric cooler 130 is close to the imaging device 120, and the cold end face of the thermoelectric cooler 130 is close to the housing 110. The thermoelectric cooler 130 heats the imaging device 120, which can solve the problem of insufficient performance of the imaging device 120 in a low-temperature environment without the need to additionally set up a heating device.

[0086] Combined with Figure 4 It can be seen that by disposing the thermoelectric cooler 130 and the imaging device 120 inside the sealed cavity 113, the housing 110 can prevent water vapor in the harsh environment from entering the inside of the sealed cavity 113. In other words, the imaging device 120 and the thermoelectric cooler 130 are in a low-humidity environment, thus preventing environmental problems such as condensation and corrosion of the thermoelectric cooler 130 and the imaging device 120, thereby improving the environmental reliability of the thermoelectric cooler 130 and the imaging device 120, and further ensuring the reliability of the thermoelectric cooler 130 and the imaging device 120 when applied in a harsh environment (such as a headlight environment).

[0087] In addition, by adjusting the temperature of the imaging device 120 through the thermoelectric cooler 130, the operating temperature of the imaging device 120 can be effectively controlled within its ideal operating temperature range for a long time, thereby improving the optical performance of the imaging device 120 when applied in a harsh environment (such as a vehicle headlight environment), and further improving the reliability of the imaging device 120 when applied in a harsh environment (such as a vehicle headlight environment). In addition, the temperature control can be adjusted in real time according to the ambient temperature change to keep the imaging device 120 always above the dew point and avoid condensation.

[0088] It should be noted that, as shown in Figure 1 When the imaging device 100 is applied to the projection device 220, the thermoelectric cooler 130 is disposed between the imaging device 120 and the second heat conducting layer 224. In addition, the second heat conducting layer 224 is disposed outside the housing 110, and the second heat conducting layer 224 is filled between the heat dissipation device 223 and the housing 110, and the second heat conducting layer 224 can transfer the heat transferred by the housing 110 to the heat dissipation device 223.

[0089] There is no limitation on the specific structure of the thermoelectric cooler 130 here. For example, a thermoelectric cooler 130 capable of cooling or heating the imaging device 120 in the prior art can be adopted.

[0090] Exemplarily, as shown in Figure 4 the thermoelectric cooler 130 may include a first substrate 131, a second substrate 132 and semiconductor particles 133 which are disposed opposite to each other. Among them, the first substrate 131 and the second substrate 132 are disposed opposite to each other, and the semiconductor particles 133 are disposed between the first substrate 131 and the second substrate 132. The first substrate 131 is disposed between the imaging device 120 and the second substrate 132, and the first substrate 131 can be in contact with the imaging device 120 (such as Figure 6 or Figure 7 shown) or the first heat conducting layer 140 (such as Figure 4 or Figure 5 shown), or the first substrate 131 can also be spaced from the imaging device 120. The second substrate 132 can be in contact with the housing 110 (such as Figure 4 shown), or the second substrate 132 can also be not in contact with the housing 110, or the second substrate 132 can also be in contact with a third heat conducting layer (not shown in the figure), and the third heat conducting layer is disposed between the thermoelectric cooler 130 and the housing 110.

[0091] Among them, the semiconductor particles 133 can be carriers generated by the thermoelectric effect. In addition, both the first substrate 131 and the second substrate 132 can be made of a heat conducting material. For example, each of the first substrate 131 and the second substrate 132 can be a silicon substrate or a ceramic substrate.

[0092] To further improve the sealing performance of the sealed cavity 113, in some possible implementation manners, at least one inert gas may also be filled in the sealed cavity 113. For example, an inert gas (such as Figure 4 the N2 shown in

[0093] is filled in the sealed cavity 113). Of course, multiple inert gases may also be filled in the sealed cavity 113.

[0094] Correspondingly, by filling the inert gas in the sealed cavity 113, the thermoelectric cooler 130 and the imaging device 120 can be hermetically sealed, so that the inside of the sealed cavity 113 will not be at a high humidity level when the imaging device 100 is in an environment with high humidity, and the reliability of the thermoelectric cooler 130 and the imaging device 100 in applications under harsh environments can be further improved.

[0095] In addition to filling the inert gas in the sealed cavity 113 to improve the sealing performance of the sealed cavity 113, in some possible implementation manners, the sealed cavity 113 may also be a vacuum cavity. By performing vacuum treatment on the sealed cavity 113, the inside of the sealed cavity 113 is in a vacuum state, thereby forming a vacuum cavity, and further, the imaging device 120 and the thermoelectric cooler 130 can be vacuum-sealed, and the reliability of the thermoelectric cooler 130 and the imaging device 100 in applications under harsh environments can also be further improved.

[0096] To provide the heat dissipation capacity of the imaging device 120, in some possible implementation manners, as Figure 4 shown, the imaging device 100 may further include a first heat-conducting layer 140, and the first heat-conducting layer 140 is filled between the thermoelectric cooler 130 and the imaging device 120. During the operation of the imaging device 100, the first heat-conducting layer 140 can timely transfer the heat generated by the imaging device 120 to the thermoelectric cooler 130, so that the operating temperature of the imaging device 120 is within the optimal operating temperature range.

[0097] Correspondingly, by filling the gap between the thermoelectric cooler 130 and the imaging device 120 with the first heat-conducting layer 140, the heat transfer of the heat generated by the imaging device 120 to the thermoelectric cooler 130 through air is avoided, the thermal resistance between the imaging device 120 and the thermoelectric cooler 130 can be reduced, and it is helpful to further improve the heat dissipation effect.

[0098] There is no limitation on the specific material of the first heat conduction layer 140. Among them, the first heat conduction layer 140 may include, but is not limited to, heat conduction silicone, silver heat conduction sticker, copper gasket, heat conduction glue, heat conduction silicone grease, heat conduction gel, heat conduction pad, graphite sheet, heat conduction insulation film, heat conduction ceramic sheet or welded metal layer, etc.

[0099] There is no limitation on how to fix the imaging device 120. Exemplarily, the imaging device 120 may be fixedly connected to the thermoelectric cooler 130 through the first heat conduction layer 140. Specifically, the first heat conduction layer 140 may have an adhesive property, and the first heat conduction layer 140 is respectively adhered to the thermoelectric cooler 130 and the imaging device 120. By connecting the imaging device 120 and the thermoelectric cooler 130 through the first heat conduction layer 140, the utilization rate of the first heat conduction layer 140 can be improved and the connection difficulty between the imaging device 120 and the thermoelectric cooler 130 can be reduced. Or in some embodiments, the imaging device 100 may further include a fixing member (not shown in the figure), and the thermoelectric cooler 130 may be fixedly connected to the imaging device 120 through the fixing member. The fixing member may include, but is not limited to, screws, bolts or clamping members, etc.

[0100] See Figure 4 As shown, the imaging device 120 may include a substrate 122 and an imaging member 121. Among them, the substrate 122 is disposed between the imaging member 121 and the thermoelectric cooler 130, and the imaging member 121 is used to generate imaging light. Since the first heat conduction layer 140 is filled between the thermoelectric cooler 130 and the imaging device 120, the first heat conduction layer 140 is filled between the substrate 122 and the thermoelectric cooler 130. In other words, the substrate 122 is indirectly in contact with the thermoelectric cooler 130 through the first heat conduction layer 140.

[0101] Since the imaging device 120 is an LCOS, during the operation of the imaging device 100, the imaging member 121 is used to receive the light beam emitted by the light source 225 and generate the imaging light directed at the lens 221 according to the light beam emitted by the light source 225.

[0102] During the operation of the imaging device 100, the substrate 122 transfers the heat generated by the imaging member 121 to the first heat conduction layer 140, the first heat conduction layer 140 transfers the received heat to the thermoelectric cooler 130, the thermoelectric cooler 130 transfers the received heat to the housing 110, and the housing 110 transfers the received heat to the outside of the housing 110 to dissipate heat from the imaging member 121.

[0103] By using the imaging device 120 composed of the substrate 122 and the imaging element 121 in cooperation with the thermoelectric cooler 130, the existing imaging device 120 in the prior art can be adopted, so that there is no need to redesign the imaging device 120, and thus the cost of the imaging device 120 can be reduced. In addition, the difficulty of connecting the imaging device 120 and the thermoelectric cooler 130 can also be reduced.

[0104] In order to ensure that the heat generated by the imaging element 121 is transferred to the first heat conducting layer 140, the material of the substrate 122 is a heat conducting material, for example, it can be a ceramic substrate.

[0105] There is no limitation on the specific structure of the imaging element 121 here. Among them, it can be determined according to the specific type of the imaging device 120. For example, when the imaging device 120 is an LCOS, combined with Figure 4 it can be known that the imaging element 121 may include a silicon substrate layer 1212, a glass cover layer 1214, an adhesive layer 1211, a liquid crystal layer 1213, and an antireflection layer 1215. The silicon substrate layer 1212 is connected to the substrate 122 through the adhesive layer 1211. The liquid crystal layer 1213 is disposed between the glass cover layer 1214 and the silicon substrate layer 1212. The glass cover layer 1214 is disposed between the antireflection layer 1215 and the liquid crystal layer 1213. The antireflection layer 1215 is used to reduce the intensity of the reflected light and increase the intensity of the transmitted light. The adhesive layer 1211 can be a die bonding glue or a double-sided tape, etc.

[0106] Among them, a circuit board (not shown in the figure) is disposed in the substrate 122. The imaging element 121 is electrically connected to the contact pad 124 on the substrate 122 through the lead 123 and is electrically connected to the circuit board through the contact pad 124. The circuit board transmits an image signal to the imaging element 121 for the imaging element 121 to generate imaging light.

[0107] In order to ensure the generation and emission of the imaging light, in some possible implementation manners, referring to Figure 4 as shown, the housing 110 may further include a light transmissive portion 111. The imaging device 120 is disposed between the light transmissive portion 111 and the thermoelectric cooler 130. The light transmissive portion 111 is used to transmit the light outside the housing 110 to the inside of the housing 110 and is used to transmit the imaging light generated by the imaging device 120 to the outside of the housing 110, which can ensure the use of the imaging device 120 and enable the imaging light to form a target image.

[0108] There is no limitation on the specific material of the light transmissive portion 111 here. Among them, as long as the light can pass through the light transmissive portion 111, for example, as Figure 4As shown, the light-transmitting part 111 can be a glass part, an optical resin part, etc. Of course, the light-transmitting part 111 can also be composed of other light-transmitting materials. However, when the light-transmitting part 111 is a glass part or an optical resin part, the light outside the housing 110 can be transmitted to the inside of the housing 110 and the imaging light can be transmitted to the outside of the housing 110.

[0109] In order to ensure that the heat transferred by the thermoelectric cooler 130 is transferred to the outside of the housing 110, in some possible implementation manners, refer to Figure 4 As shown, the housing 110 can further include a heat-conductive shell part 112. The thermoelectric cooler 130 is in contact with the shell part 112. The shell part 112 can transfer the heat transferred by the thermoelectric cooling part to the outside of the housing 110 to ensure that the working temperature of the imaging device 120 is within the optimal working temperature range.

[0110] In order to further improve the heat dissipation capacity of the imaging device 120, refer to Figure 4 As shown, the shell part 112 can be a cylindrical structure. The light-transmitting part 111 is arranged at the opening of the shell part 112. The light-transmitting part 111 and the shell part 112 enclose a sealed cavity 113. By enclosing the sealed cavity 113 with the heat-conductive shell part 112 and the light-transmitting part 111, not only can the thermoelectric cooler 130 and the imaging device 120 be sealed to improve the reliability of the thermoelectric cooler 130 and the imaging device 120, but also the heat can be transferred between the inside and the outside of the housing 110 to reduce or increase the temperature of the imaging device 120.

[0111] Among them, the shell part 112 can include but is not limited to a ceramic shell, a metal shell, a heat-conductive plastic shell or a heat-conductive shell part made of other new materials with heat-conducting properties. For example, in the example of this application, the ceramic shell is taken as the above shell part 112 for illustration.

[0112] It should be noted that in addition to being in contact with the thermoelectric cooler 130, the shell part 112 can also be arranged at an interval from the thermoelectric cooler 130. In other words, the hot end face or the cold end face of the thermoelectric cooler 130 is not in contact with the shell part 112. Or in some embodiments, the imaging device 100 can further include a third heat-conductive layer (not shown in the figure). The third heat-conductive layer is filled between the shell part 112 and the thermoelectric cooler 130. The third heat-conductive layer transfers the heat transferred by the thermoelectric cooler 130 to the shell part 112.

[0113] There is no limitation on the specific material of the third heat-conductive layer here. Among them, the third heat-conductive layer can include but is not limited to heat-conductive silica gel, silver heat-conductive tape or copper gasket, etc.

[0114] In order to ensure that the imaging device 120 receives the light beam emitted by the light source 225 or emits the imaging light to the outside of the housing 110, in some possible implementations, see Figure 4 As shown, along the thickness direction of the thermoelectric cooler 130 (eg Figure 4 In the Y direction), the projection of the light-transmitting portion 111 can cover the imaging device 120, thereby ensuring that the imaging light generated by the imaging device 120 can be transmitted to the outside of the housing 110, and ensuring that the imaging device 120 receives the light beam emitted by the light source 225.

[0115] Combination Figure 4 It can be seen that along the thickness direction of the thermoelectric cooler 130 (eg Figure 4 In the Y direction), the projected area of ​​the light-transmitting portion 111 is larger than the projected area of ​​the imaging device 120. Of course, the projected area of ​​the light-transmitting portion 111 may also be equal to the projected area of ​​the imaging device 120.

[0116] Since the imaging light is generated by the imaging element 121, in some embodiments, the thickness direction of the thermoelectric cooler 130 (eg Figure 4 In the Y direction), the projection of the light-transmitting portion 111 may also cover the imaging element 121, and may also ensure that the imaging element 121 generates imaging light according to the light beam emitted by the light source 225 or ensure that the imaging light is emitted to the outside of the housing 110.

[0117] In order to improve the heat dissipation capability of the imaging device 120, in some possible implementations, Figure 4 It can be seen that along the thickness direction of the thermoelectric cooler 130 (eg Figure 4 In the Y direction), the projection of the thermoelectric cooler 130 can cover the imaging device 120, which can increase the heat exchange area between the thermoelectric cooler 130 and the imaging device 120, and can further improve the heat dissipation effect.

[0118] Since the imaging device 120 is composed of the substrate 122 and the imaging element 121, and along the thickness direction of the thermoelectric cooler 130 (such as Figure 4 The projection area of ​​the substrate 122 is larger than the projection area of ​​the imaging element 121. Therefore, the thermoelectric cooler 130 is located in the thickness direction of the thermoelectric cooler 130 (eg, Figure 4 The projection in the Y direction (in the middle) should cover the substrate 122 to ensure that the heat transferred by the substrate 122 can be transferred to the thermoelectric cooler 130 through the first heat conducting layer 140.

[0119] Combination Figure 4 It can be seen that along the thickness direction of the thermoelectric cooler 130 (eg Figure 4 In the Y direction), the projected area of ​​the thermoelectric cooler 130 is equal to the projected area of ​​the substrate 122. Of course, the projected area of ​​the thermoelectric cooler 130 may also be larger than the projected area of ​​the substrate 122.

[0120] Figure 5 This is a schematic structural diagram of the second imaging device provided by an embodiment of the present application.

[0121] Figure 5 Different from Figure 4 is that the structure of the imaging device 120 is different. Specifically, as shown in Figure 5 , the substrate 122 of the imaging device 120 is removed, and the imaging element 121 is indirectly in contact with the thermoelectric cooler 130 through the first heat conduction layer 140, which can reduce the thermal resistance between the imaging device 120 and the thermoelectric cooler 130, and helps to further improve the heat dissipation capacity of the imaging device 120.

[0122] Since the substrate 122 is removed, in order to ensure that the imaging element 121 can generate imaging light, the circuit board for transmitting the image signal to the imaging element 121 can be integrated in the thermoelectric cooler 130, or can also be integrated inside the housing part 112, or can also be arranged outside the housing 110. For example, in an embodiment of the present application, the circuit board can be integrated in the thermoelectric cooler 130, and the lead 123 is electrically connected to the circuit board through the contact pad 124 provided on the thermoelectric cooler 130.

[0123] In order to ensure the electrical connection between the imaging element 121 and the circuit board, the first heat conduction layer 140 can have a via for the lead 123 to pass through. Of course, the lead 123 can also be electrically connected to the imaging element 121 and the circuit board in other ways. For example, the inner wall of the housing part 112 can be provided with a lead groove, and a part of the lead 123 is arranged in the lead groove and electrically connected to the circuit board.

[0124] In the above content, a first heat conduction layer 140 is provided between the imaging device 120 and the thermoelectric cooler 130. However, considering that the first heat conduction layer 140 itself also has a thermal resistance, in order to further reduce the thermal resistance of the imaging device 100, the imaging device 120 can also be in contact with the thermoelectric cooler 130, which can further reduce the thermal resistance between the imaging device 120 and the thermoelectric cooler 130 and can further improve the heat dissipation effect. The structure of the imaging device 100 in which the imaging device 120 is in contact with the thermoelectric cooler 130 is described below.

[0125] Combined with Figure 5 it can be seen that since the imaging element 121 has an adhesive layer 1211, the imaging element 121 can be connected to the first heat conduction layer 140 through the adhesive layer 1211, and the imaging element 121 is fixedly connected to the thermoelectric cooler 130 through the first heat conduction layer 140. Of course, the imaging element 121 can also be fixedly connected to the thermoelectric cooler 130 in other ways. In addition, in some examples, the adhesive layer 1211 of the imaging element 121 can also be removed.

[0126] Figure 6 This is a schematic structural diagram of the third imaging device provided by an embodiment of the present application.

[0127] Figure 6 It is different from Figure 4 in that the first heat-conducting layer 140 is removed. Specifically, as shown in Figure 6 , the imaging device 120 includes a substrate 122 and an imaging element 121. The substrate 122 is disposed between the imaging element 121 and the thermoelectric cooler 130. The substrate 122 is in contact with the thermoelectric cooler 130, which can reduce the thermal resistance between the substrate 122 and the thermoelectric cooler 130, and helps to further improve the heat dissipation capacity of the imaging element 121.

[0128] To simplify the structure of the imaging device 100, the substrate 122 can be fixedly connected to the thermoelectric cooler 130. For example, the substrate 122 can be fixedly connected to the thermoelectric cooler 130 by welding. Of course, the substrate 122 can also be fixedly connected to the thermoelectric cooler 130 by other means, such as snap connection or bonding.

[0129] Figure 7 This is a schematic structural diagram of the fourth imaging device provided by an embodiment of the present application.

[0130] Figure 7 It is different from Figure 6 in that the substrate 122 of the imaging device 120 is removed. Specifically, as shown in Figure 7 , the imaging device 120 includes an imaging element 121. The imaging element 121 is used to contact the thermoelectric cooler 130 and generate imaging light. By allowing the imaging element 121 to contact the thermoelectric cooler 130, the thermal resistance between the imaging element 121 and the thermoelectric cooler 130 can be further reduced, which can further improve the heat dissipation effect and the performance and reliability of the imaging device 120.

[0131] Since the substrate 122 is removed, in order to ensure that the imaging element 121 can generate imaging light, the circuit board for transmitting the image signal to the imaging element 121 can be integrated into the thermoelectric cooler 130, or can also be integrated inside the housing part 112, or can also be disposed outside the housing 110. For example, in the embodiment of the present application, the circuit board can be integrated into the thermoelectric cooler 130, and the lead 123 is electrically connected to the circuit board through the contact pad 124 provided on the thermoelectric cooler 130.

[0132] To simplify the structure of the imaging device 100, the imaging element 121 can be fixedly connected to the thermoelectric cooler 130. For example, the imaging element 121 can be fixed on the thermoelectric cooler 130 by welding.

[0133] Combined with Figure 7It can be known that, since the imaging member 121 has an adhesive layer 1211, the imaging member 121 can be fixedly connected to the thermoelectric cooler 130 through the adhesive layer 1211. Of course, the imaging member 121 can also remove the adhesive layer 1211, and at this time, the imaging member 121 can also be fixedly connected to the thermoelectric cooler 130 by other means.

[0134] In the description of the embodiments of the present application, it should be noted that, unless otherwise clearly specified and limited, the terms "installation", "connection", and "connection" should be understood in a broad sense. For example, it can be a fixed connection, or an indirect connection through an intermediate medium, and can be the communication inside two elements or the interaction relationship between two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the embodiments of the present application can be understood according to specific situations.

[0135] The devices or elements referred to in the embodiments of the present application or implied must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the embodiments of the present application. In the description of the embodiments of the present application, the meaning of "a plurality" is two or more, unless otherwise precisely and specifically specified.

[0136] The terms "first", "second", "third", "fourth", etc. (if any) in the specification, claims, and the above drawings of the embodiments of the present application are used to distinguish similar objects, and do not have to be used to describe a specific order or sequence. It should be understood that such data can be interchanged under appropriate circumstances, so that the embodiments of the present application described here can be implemented in an order other than those illustrated or described here. In addition, the terms "comprising" and "having" and any variations thereof are intended to cover non-exclusive inclusion. For example, a process, method, system, product, or device that includes a series of steps or units does not have to be limited to those steps or units clearly listed, but may include other steps or units not clearly listed or inherent to these processes, methods, products, or devices.

[0137] The term "a plurality" in this article refers to two or more. The term "and / or" in this article is only a description of the association relationship of associated objects, indicating that three relationships can exist. For example, A and / or B can represent: A exists alone, A and B exist simultaneously, and B exists alone. In addition, the character " / " in this article generally represents an "or" relationship between the associated objects before and after; in a formula, the character " / " represents a "division" relationship between the associated objects before and after.

[0138] It can be understood that the various numerical numbers involved in the embodiments of the present application are only for the convenience of description and are not used to limit the scope of the embodiments of the present application.

[0139] It should be understood that in the embodiments of the present application, the sequence numbers of the above processes do not indicate the order of execution, and the execution order of each process should be determined by its function and internal logic, and should not constitute any limitation on the implementation process of the embodiments of the present application.

Claims

1. An imaging device, characterized in that, The imaging device is used to generate imaging light directed at the lens. The imaging device includes a thermoelectric cooler, an imaging device, and a housing; The housing encloses a sealed cavity. The thermoelectric cooler and the imaging device are disposed inside the sealed cavity. The thermoelectric cooler is used to adjust the temperature of the imaging device, and the imaging device generates the imaging light directed to the outside of the housing.

2. The imaging device according to claim 1, wherein The sealed cavity is a vacuum cavity or the sealed cavity is filled with at least one inert gas.

3. The imaging device according to claim 2, characterized in that, The inert gas is helium, neon, argon, krypton, xenon, or radon.

4. The imaging device according to any one of claims 1 to 3, characterized in that, The imaging device is in contact with the thermoelectric cooler.

5. The imaging device according to any one of claims 1 to 3, characterized in that, The imaging device further includes a first heat-conducting layer, and the first heat-conducting layer is filled between the thermoelectric cooler and the imaging device.

6. The imaging device according to any one of claims 1 to 5, characterized in that, The imaging device includes an imaging element, and the imaging element is used to generate the imaging light. The imaging element is used to be in contact with the thermoelectric cooler or the first heat-conducting layer.

7. The imaging device according to any one of claims 1 to 5, characterized in that, The imaging device includes a substrate and an imaging element. The substrate is disposed between the imaging element and the thermoelectric cooler, and the imaging element is used to generate the imaging light.

8. The imaging device according to any one of claims 1 to 7, characterized in that, The imaging device is a liquid crystal on silicon, a digital micromirror device, a liquid crystal display, a microelectromechanical system, or an organic light-emitting diode.

9. The imaging device according to any one of claims 1 to 8, characterized in that Along the thickness direction of the thermoelectric cooler, the projection of the thermoelectric cooler covers the imaging device.

10. The imaging device according to any one of claims 1 to 9, characterized in that, The housing includes a light-transmitting portion. The imaging device is disposed between the light-transmitting portion and the thermoelectric cooler. The light-transmitting portion is used to transmit the light outside the housing to the inside of the housing and is used to transmit the imaging light generated by the imaging device to the outside of the housing.

11. The imaging device according to claim 10, wherein Along the thickness direction of the thermoelectric cooler, the projection of the light-transmitting portion covers the imaging device.

12. The imaging device according to claim 10 or 11, characterized in that, The light-transmitting portion is a glass portion or an optical resin portion.

13. The imaging device according to any one of claims 10 to 12, characterized in that, The housing further includes a heat-conducting shell portion, and the thermoelectric cooler is in contact with the shell portion.

14. The imaging device according to claim 13, characterized in that, The shell portion is a ceramic shell, a metal shell, or a heat-conducting plastic shell.

15. A projection device, characterized in that, It includes a lens and the imaging device according to any one of claims 1 to 14. The imaging device is used to generate imaging light directed at the lens.

16. A vehicle lamp device, characterized in that, It includes a headlight housing and the projection device according to claim 15. At least part of the projection device is disposed inside the headlight housing.

17. The headlamp device according to claim 16, characterized in that, The projection device further includes a heat dissipation device and a second heat-conducting layer. At least part of the heat dissipation device is disposed inside the headlight housing. The second heat-conducting layer is filled between the heat dissipation device and the housing of the imaging device. The thermoelectric cooler of the imaging device is disposed between the imaging device of the imaging device and the second heat-conducting layer.

18. The vehicle lamp device according to claim 16 or 17, characterized in that, The projection device further includes a light source and a reflection unit. The reflection unit is used to reflect the light beam emitted by the light source to the imaging device, and the imaging device is used to generate imaging light according to the light beam emitted by the light source.

19. A display device, characterized in that, It includes an imaging unit and the projection device according to claim 15. The imaging unit is used to generate a target image according to the imaging light emitted by the projection device.

20. A means of transportation, characterized in that, It includes the headlight device according to any one of claims 16 to 18 or includes the display device according to claim 19.

21. The vehicle according to claim 20, characterized in that, The display device is installed in the instrument panel of the vehicle.

22. The vehicle according to claim 20 or 21, characterized in that, The vehicle further includes a windshield, and the imaging light emitted by the display device is incident on the windshield, and the windshield reflects the imaging light to the human eye.

Images