Focusing device, lens module, optical engine and display device

Abstract

Embodiments of the present application provide a focusing device, a lens module, an optical machine and a display device. The focusing device is used for focusing a lens. The focusing device comprises a semiconductor refrigeration ring, the semiconductor refrigeration ring is provided with an electric connection line, the electric connection line is configured to be electrically connected with an external circuit; a telescopic structural member, the telescopic structural member is arranged along an axial direction of the semiconductor refrigeration ring and located in the semiconductor refrigeration ring, one end of the telescopic structural member is configured to be connected with the lens; in the case that the semiconductor refrigeration ring is in conduction with the external circuit, the telescopic structural member is elongated or shortened along the axial direction of the semiconductor refrigeration ring, so as to adjust the position of the lens to achieve focusing.

Description

Technical Field

[0001] This application relates to the field of focusing technology, and more specifically, to a focusing device, a lens module, an optical engine, and a near-eye display device. Background Technology

[0002] The purpose of focusing is to ensure that the projection or imaging system can produce a clear and accurate image. Taking a DLP projector optical engine as an example, during the operation of a DLP projector optical engine, the LED light source and lens components generate heat, causing the internal temperature of the optical engine to rise. This temperature change causes thermal expansion and contraction of internal components (such as lenses and lens barrels). Due to thermal expansion and contraction, the position and shape of the lenses may change, causing the light to fail to focus accurately on the projection screen, thus producing a blurry projected image, i.e., thermal defocusing.

[0003] Currently, the conventional focusing method for DLP projector optical engines is to adjust the lens position by rotating gears. However, this focusing method has significant drawbacks in practical applications. The gears are prone to jamming during operation, leading to focusing failure and severely impacting the projection display quality and user experience.

[0004] In view of this, a new technical solution is needed to solve the above-mentioned technical problems. Summary of the Invention

[0005] The purpose of this application is to provide a new technology solution for a focusing device, a lens module, an optical engine, and a display device.

[0006] Firstly, embodiments of this application provide a focusing device. The focusing device is used for focusing a lens, and the focusing device includes:

[0007] A semiconductor cooling ring, wherein the semiconductor cooling ring is provided with an electrical connection line configured to be electrically connected to an external circuit;

[0008] A retractable structural component is disposed along the axial direction of the semiconductor cooling ring and located within the semiconductor cooling ring, one end of which is configured to be connected to the lens;

[0009] When the semiconductor cooling ring is connected to the external circuit, the telescopic structure extends or shortens along the axial direction of the semiconductor cooling ring to adjust the lens position and achieve focusing.

[0010] Optionally, the retractable structure includes an element that can adjust the position of the lens based on the principle of thermal expansion and contraction.

[0011] Optionally, the retractable structural member includes a cylinder, a medium located within the cylinder, and a piston rod, wherein the cylinder is located within the semiconductor cooling ring;

[0012] When the semiconductor cooling ring is connected to the external circuit, the semiconductor cooling ring transfers its temperature to the cylinder, and then to the medium;

[0013] The medium acts on the piston rod based on the principle of thermal expansion and contraction, and the lens position is adjusted by the piston rod to achieve focusing.

[0014] Optionally, the medium is liquid within the target temperature range, and the target temperature range is the temperature variation range of the semiconductor cooling ring in the on state.

[0015] Optionally, the target temperature range is -50℃ to 200℃.

[0016] Optionally, the telescopic structural component includes a telescopic rod, the semiconductor cooling ring is in a conductive state, and the range of the length change ΔL of the telescopic rod is 0mm to 0.06mm.

[0017] Optionally, the thermal conductivity of the telescopic rod is in the range of 1W / mK to 2W / mK.

[0018] Optionally, the telescopic rod is made of ethylene containing a thermal conductivity enhancer.

[0019] Optionally, the focusing device further includes a heat dissipation component connected to the semiconductor cooling ring.

[0020] Optionally, the heat dissipation assembly includes a thermal pad and a heat sink, with the thermal pad disposed on at least a portion of the outer periphery of the thermoelectric cooling ring, and the side of the thermal pad facing away from the thermoelectric cooling ring being connected to the heat sink.

[0021] Secondly, embodiments of this application also provide a lens module. The lens module includes a lens and a focusing device as described in the first aspect, wherein a retractable structural component of the focusing device is connected to the lens.

[0022] Optionally, the lens module further includes a support ring connected to the lens, the center of which is located on the optical axis of the lens; the telescopic structural member is connected to the support ring.

[0023] Optionally, the lens module includes a plurality of focusing devices, which are distributed circumferentially along the support ring, and each focusing device is connected to the support ring.

[0024] Thirdly, embodiments of this application also provide an optical engine. The optical engine includes an optical engine housing and a lens module as described in the second aspect, the lens module being disposed within the optical engine housing.

[0025] Optionally, the optical engine further includes a support portion disposed on the optical engine housing, and the end of the focusing device facing away from the lens is disposed on the support portion.

[0026] Fourthly, embodiments of this application also provide a display device. The display device includes a lens module as described in the second aspect, or the display device includes an optical engine as described in the third aspect.

[0027] According to the embodiments of this application, the focusing device utilizes the temperature control characteristics of the semiconductor cooling ring and the characteristic that the stretchable structural component can deform under the temperature control characteristics of the semiconductor cooling ring to adjust the position of the lens, thereby achieving the purpose of lens focusing and ensuring that the projection or imaging display system can output clear and accurate images.

[0028] Other features and advantages of this specification will become clear from the following detailed description of exemplary embodiments with reference to the accompanying drawings. Attached Figure Description

[0029] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments of this specification and, together with their description, serve to explain the principles of this specification.

[0030] Figure 1 The diagram shows the structure of the focusing device provided in the embodiment of this application. Figure 1 .

[0031] Figure 2 The diagram shows the structure of the focusing device provided in the embodiment of this application. Figure 2 .

[0032] Figure 3 The diagram shown is a structural diagram of a semiconductor cooling ring provided in an embodiment of this application.

[0033] Figure 4 The diagram shown is a structural diagram of the optical engine provided in an embodiment of this application.

[0034] Figure 5 The diagram shows a partial structure of the optical engine provided in an embodiment of this application. Figure 1 .

[0035] Figure 6 The diagram shows a partial structure of the optical engine provided in an embodiment of this application. Figure 2 .

[0036] Figure 7 The diagram shows a partial structure of the optical engine provided in an embodiment of this application. Figure 3 .

[0037] Explanation of reference numerals in the attached figures:

[0038] 1. Focusing device; 10. Semiconductor cooling ring; 101. Electrical connection wire; 11. Telescopic structural component; 111. Cylinder; 112. Medium; 113. Piston rod; 114. Telescopic rod; 12. Heat dissipation assembly; 121. Thermal pad; 122. Heat sink;

[0039] 2. Lens module; 20. Lens; 21. Support ring;

[0040] 3. Optical mechanism; 31. Optical mechanism housing; 32. Support component; Detailed Implementation

[0041] Various exemplary embodiments of the present application will now be described in detail with reference to the accompanying drawings. It should be noted that, unless otherwise specifically stated, the relative arrangement, numerical expressions, and values ​​of the components and steps set forth in these embodiments do not limit the scope of the present application.

[0042] The following description of at least one exemplary embodiment is merely illustrative and is in no way intended to limit the scope of this application and its application or use.

[0043] Technologies and equipment known to those skilled in the art may not be discussed in detail, but where appropriate, such technologies and equipment should be considered part of the specification.

[0044] In all the examples shown and discussed herein, any specific values ​​should be interpreted as merely exemplary and not as limitations. Therefore, other examples of exemplary embodiments may have different values.

[0045] It should be noted that similar labels and letters in the following figures indicate similar items; therefore, once an item is defined in one figure, it does not need to be discussed further in subsequent figures.

[0046] This application provides a focusing device 1, which aims to optimize the focusing performance of the lens 20 and improve the image quality of the displayed image. The core components of the focusing device 1 include a semiconductor cooling ring 10 and a retractable structural member 11. By adjusting the intensity and direction of the electrical signal (current or voltage) input to the semiconductor cooling ring 10, its internal temperature state (cooling or heating) changes. This change then causes the retractable structural member 11 to adjust its length along the axial direction of the semiconductor cooling ring 10. Using this principle, the position of the lens 20 can be adjusted, thereby achieving the focusing function of the lens 20.

[0047] Specifically, refer to Figure 1 and Figure 2The focusing device 1 includes a semiconductor cooling ring 10, which is provided with an electrical connection line 101 configured to be electrically connected to an external circuit.

[0048] A retractable structural member 11 is arranged along the axial direction of the semiconductor cooling ring 10 and located within the semiconductor cooling ring 10, and one end of the retractable structural member 11 is configured to be connected to the lens 20.

[0049] When the semiconductor cooling ring 10 is connected to the external circuit, the telescopic structure 11 extends or shortens along the axial direction of the semiconductor cooling ring 10 to adjust the position of the lens 20 and achieve focusing.

[0050] In this embodiment, the focusing device 1 mainly includes two core components: a semiconductor cooling ring 10 and a retractable structural component 11. The semiconductor cooling ring 10 operates based on the combination of N-type and P-type semiconductor materials. When these two types of semiconductor materials are connected as a thermocouple and a direct current is applied to the circuit, energy migration occurs. Specifically, the junction where current flows from the N-type semiconductor element to the P-type semiconductor element absorbs surrounding heat, forming a cold junction; conversely, the junction where current flows from the P-type to the N-type releases heat, becoming a hot junction. The intensity of heat absorption and release at the cold and hot junctions can be controlled by adjusting the current magnitude and the number of N-type and P-type elements in the semiconductor material.

[0051] To significantly enhance the temperature change effect of the thermoelectric cooling ring 10, the thermoelectric cooling ring 10 used in this embodiment integrates hundreds of such thermocouples, forming a highly efficient thermopile structure. Particularly noteworthy is the extremely low thermal inertia exhibited by the thermoelectric cooling ring 10, meaning its cooling and heating responses are extremely rapid. With excellent heat dissipation conditions at the hot end and no load at the cold end, the semiconductor support ring 21 can quickly reach its maximum temperature difference effect in less than one minute after power is applied.

[0052] Based on the above working principle, an electrical connection line 101 is provided on the thermoelectric cooling ring 10. The electrical connection line 101 is used to enable the thermoelectric cooling ring 10 to conduct with an external circuit (providing a voltage signal). By adjusting the magnitude and direction of the voltage, the thermoelectric cooling ring 10 can achieve heating and cooling.

[0053] For example, refer to Figures 1-3The semiconductor cooling ring 10 has a hollow ring structure. Two electrical connection lines 101 are provided at the end of the semiconductor cooling ring 10. One electrical connection line 101 is connected to the N-type semiconductor material of the semiconductor cooling ring 10, and the other electrical connection line 101 is connected to the P-type semiconductor material of the semiconductor cooling ring 10. When the electrical connection line 101 is connected to an external circuit, the semiconductor cooling ring 10 and the external circuit form a series circuit. By adjusting the magnitude and direction of the voltage or current, the semiconductor cooling ring 10 can achieve heating and cooling.

[0054] A retractable structural member 11 is provided inside the semiconductor cooling ring 10. The retractable structural member 11 is arranged along the axial direction of the semiconductor cooling ring 10, and one end of the retractable structural member 11 is connected to the lens 20 to ensure accuracy and stability during the focusing process.

[0055] For example, the retractable structural member 11 can be directly or indirectly connected to the lens barrel of the lens 20. By extending / retracting the retractable structural member 11 along the axial direction of the semiconductor cooling ring 10, the position of all the lenses inside the lens 20 can be adjusted, thereby achieving the purpose of focusing the lens 20. Alternatively, the retractable structural member 11 can be directly or indirectly connected to one or more lenses inside the lens 20. By extending / retracting the retractable structural member 11 along the axial direction of the semiconductor cooling ring 10, the position of one or more lenses inside the lens 20 can be adjusted, thereby achieving the purpose of focusing the lens 20.

[0056] When the thermoelectric cooler 10 is successfully connected to the external circuit, a temperature change occurs inside the thermoelectric cooler 10 due to the action of current / voltage. This temperature change causes the retractable structural member 11 to deform along its axial direction, either elongating or shortening. This deformation directly adjusts the position of the lens 20 connected to the retractable structural member 11, thereby achieving the purpose of focusing the lens 20.

[0057] In this embodiment, the focusing device 1 utilizes the temperature control characteristics of the semiconductor cooling ring 10 and the deformation characteristics of the telescopic structural member 11 under the temperature control of the semiconductor cooling ring 10 to adjust the position of the lens 20, thereby achieving the purpose of focusing the lens 20 and ensuring that the projection or imaging display system can output clear and accurate images. Compared with traditional mechanical (gear) focusing solutions, the focusing device 1 provided in this embodiment exhibits higher flexibility and simplicity, making it more convenient for users to focus the lens 20.

[0058] In one embodiment, the retractable structure 11 includes elements that can adjust the position of the lens 20 based on the principle of thermal expansion and contraction.

[0059] In this embodiment, the retractable structural component 11 employs elements based on the principle of thermal expansion and contraction. These elements can automatically adjust their length according to changes in the temperature of the thermoelectric cooling ring 10, or they can automatically adjust the extension or retraction of their associated components according to changes in the temperature of the thermoelectric cooling ring 10, thereby achieving precise control of the lens 20's position. This design not only utilizes the temperature control characteristics of the thermoelectric cooling ring 10 but also combines the physical principle of thermal expansion and contraction to work together to adjust the position of the lens 20, achieving the purpose of focusing.

[0060] In one specific embodiment, refer to Figure 1 The retractable structural member 11 includes a cylinder 111, a medium 112 located inside the cylinder 111, and a piston rod 113. The cylinder 111 is located inside the semiconductor cooling ring 10.

[0061] When the semiconductor cooling ring 10 is connected to the external circuit, the semiconductor cooling ring 10 transfers its temperature to the cylinder 111, and then to the medium 112;

[0062] The medium 112 acts on the piston rod 113 based on the principle of thermal expansion and contraction, and the position of the lens 20 is adjusted by the piston rod 113 to achieve focusing.

[0063] In this embodiment, the telescopic structural member 11 in the focusing device 1 is a piston mechanism including a medium 112, a cylinder 111, and a piston rod 113. The cylinder 111 is disposed inside the semiconductor cooling ring 10 in order to effectively receive temperature transfer from the semiconductor cooling ring 10.

[0064] When the semiconductor cooling ring 10 is connected to the external circuit, it efficiently transfers the generated temperature (whether cooling or heating) to the cylinder 111, thereby affecting the medium 112 inside the cylinder 111. This medium 112 has the physical property of thermal expansion and contraction, that is, it expands or contracts in volume with changes in temperature.

[0065] Based on this characteristic of medium 112, when medium 112 inside cylinder 111 is affected by temperature changes, it acts on piston rod 113, pushing or pulling piston rod 113 to move along the axial direction of cylinder 111. This movement directly drives the adjustment of the position of lens 20 connected to piston rod 113, thereby realizing the focusing of the projection or imaging system.

[0066] In other words, the medium 112 inside the cylinder 111 needs to have a high coefficient of thermal expansion. This ensures that when the temperature changes due to the semiconductor cooling ring 10, the medium 112 can undergo a significant volume change, thereby effectively driving the piston rod 113 to move and achieving precise adjustment of the position of the lens 20.

[0067] For example, the medium 112 can be a liquid or gas with a high coefficient of thermal expansion.

[0068] For example, the medium 112 can be an oily liquid. For instance, the medium 112 can be silicone oil, mineral oil, or synthetic oil. Preferably, the medium 112 is silicone oil, which has a high coefficient of thermal expansion of approximately 500 ppm K^-1.

[0069] Optionally, to ensure the strength of the telescopic structural component 11 and to meet its thermal conductivity requirements (when the telescopic structural component 11 has good thermal conductivity, the medium 112 inside the cylinder 111 is more prone to thermal expansion and contraction), the cylinder 111 and piston rod 113 can be made of metallic materials. For example, the cylinder 111 and piston rod 113 can be made of aluminum alloy or copper alloy.

[0070] Optionally, to prevent the medium 112 from flowing through the cylinder 111, a black rubber is provided at the end of the piston rod 113 connected to the lens 20 to prevent the medium 112 from flowing out.

[0071] In one specific embodiment, the medium 112 is liquid within a target temperature range, and the target temperature range is the range of temperature variation of the semiconductor cooling ring 10 in the on state.

[0072] In other words, in this embodiment, within the operating temperature range of the thermoelectric cooling ring 10 (the range of temperature changes of the thermoelectric cooling ring 10 itself under pressure), the medium 112 inside the cylinder 111 remains in a liquid or gas state and does not transform into a solid state. Maintaining the medium 112 in a liquid or gas state ensures that it has good fluidity and compressibility, thereby enabling it to respond more sensitively to temperature changes generated by the thermoelectric cooling ring 10. The solid medium 112 cannot respond to temperature changes and generate volume changes as effectively as a liquid or gas, and therefore cannot drive the piston rod 113 to move to achieve focusing.

[0073] It should be noted that the temperature variation range of the semiconductor cooling ring 10 is related to the external voltage intensity and direction, as well as the structure of the semiconductor cooling ring 10 itself.

[0074] In one exemplary embodiment, the target temperature range is -50°C to 200°C. That is, within this temperature range, the medium can extend or retract the piston rod 113 based on the principle of thermal expansion and contraction. For example, the medium 112 is silicone oil (organosilicon compound), which has good fluidity and expansion properties at temperatures between -50°C and 200°C.

[0075] In another specific embodiment, refer to Figure 2The telescopic structural component 11 includes a telescopic rod 114, which also needs to have a high coefficient of thermal expansion. Based on the principle of thermal expansion and contraction, the range of the length change ΔL of the telescopic rod is 0mm to 0.06mm.

[0076] In this embodiment, when the semiconductor cooling ring 10 is connected to the external circuit and a temperature change occurs, this temperature change is transmitted to the telescopic rod 114 via heat conduction. Because the material of the telescopic rod 114 has a high coefficient of thermal expansion, it can quickly respond to this temperature change and produce a corresponding length change. This length change, through mechanical connection or direct action on the lens 20, adjusts the position of the lens 20, thereby achieving focusing.

[0077] The range of the telescopic rod length change ΔL is 0mm to 0.06mm, which meets the lens focusing requirements.

[0078] It should be noted that the length of the telescopic rod 114 changes in response to temperature changes in the semiconductor cooling ring 10, and this change is also related to the original size of the telescopic rod 114. To meet the focusing requirements, the original size of the telescopic rod 114 is 7mm to 15mm.

[0079] In this embodiment, the thermal conductivity of the telescopic rod 114 is in the range of 1 W / mK to 2 W / mK.

[0080] In this embodiment, due to the high thermal conductivity of the telescopic rod 114, when the semiconductor cooling ring 10 is connected to the external circuit and a temperature change occurs, this temperature change can be transmitted to the telescopic rod 114 almost in real time. The telescopic rod 114 then expands or contracts in length according to the temperature change. This change is achieved through mechanical connection or direct action on the lens 20, enabling precise adjustment of the lens 20's position. This rapid response time and precise adjustment capability together ensure the efficiency and accuracy of the focusing process.

[0081] In a specific embodiment, the telescopic rod 114 is made of ethylene material containing a thermal conductivity enhancer.

[0082] In this embodiment, the telescopic rod 114 is made of ethylene, which has a relatively high coefficient of thermal expansion. To further optimize the performance of the telescopic rod 114, a thermal conductivity enhancer is incorporated into the ethylene material. This not only ensures that the telescopic rod 114 maintains its original high coefficient of thermal expansion but also significantly improves its thermal conductivity. Therefore, when the temperature of the semiconductor cooling ring 10 changes, the telescopic rod 114 can respond quickly and sensitively, expanding or contracting its length to achieve the focusing purpose of the lens 20.

[0083] For example, the coefficient of thermal expansion of high-density ethylene material after adding a thermal conductivity enhancer is approximately 150 ppm K^-1. If the length of the telescopic rod 114 made of high-density ethylene material after adding the thermal conductivity enhancer is 10 mm, and the temperature difference of the entire rod during heating or cooling is 35℃, then the change in the length of the telescopic rod is ΔL = rod length * rod expansion coefficient * temperature difference = 10 * 150e-6 * 35 * 10^-6 = 0.0525 mm, which meets the focusing requirements.

[0084] In one specific embodiment, refer to Figure 4 and Figure 6 The focusing device 1 further includes a heat dissipation component 12, which is connected to the semiconductor cooling ring 10.

[0085] In this embodiment, the focusing device 1 further includes a heat dissipation component 12. The design of the heat dissipation component 12 fully considers the operating characteristics and heat release requirements of the thermoelectric cooler 10 to ensure that it can effectively reduce the temperature of the thermoelectric cooler 10, thereby maintaining its operation within a suitable operating temperature range. This not only helps to improve the performance stability of the thermoelectric cooler 10, but also extends its service life.

[0086] Specifically, the energy generated by the thermoelectric cooling ring 10 is transferred to the heat dissipation component 12 to prevent the surface temperature of the thermoelectric cooling ring 10 from concentrating. For example, the heat generated by the thermoelectric cooling ring 10 is transferred to the heat dissipation component 12 to prevent localized overheating of the outer surface of the thermoelectric cooling ring 10.

[0087] In this embodiment, reference is made to Figure 4 , Figure 6 and Figure 7 The heat dissipation assembly 12 includes a thermal pad 121 and a heat sink 122. At least a portion of the outer periphery of the semiconductor cooling ring 10 is provided with the thermal pad 121, and the side of the thermal pad 121 facing away from the semiconductor cooling ring 10 is connected to the heat sink 122.

[0088] Specifically, the side of the thermal pad 121 facing away from the thermoelectric cooling ring 10 is tightly connected to the heat sink 122. The main function of the heat sink 122 is to provide a large heat dissipation area so as to effectively release the heat transferred from the thermal pad 121 to the surrounding environment and avoid the surface temperature concentration of the thermoelectric cooling ring 10. The heat sink 122 is typically designed to include multiple heat dissipation fins or channels to increase the heat dissipation area and improve heat dissipation efficiency.

[0089] This application also provides a lens module 2. (Refer to...) Figure 4 , Figure 5 and Figure 7The lens module 2 includes a lens 20 and a focusing device 1 as described above, wherein the retractable structural member 11 of the focusing device 1 is connected to the lens 20.

[0090] In this application embodiment, a lens module 2 is provided, which includes the focusing device 1 described above. The focusing device 1 utilizes the temperature control characteristics of the semiconductor cooling ring 10 and the ability of the stretchable structural member 11 to deform under the temperature control characteristics of the semiconductor cooling ring 10, thereby realizing the adjustment of the position of the lens 20 and achieving the purpose of focusing the lens 20.

[0091] In one specific embodiment, refer to Figure 4 , Figure 6 and Figure 7 The lens module 2 further includes a support ring 21, which is connected to the lens 20, and the center of the support ring 21 is located on the optical axis of the lens 20; the telescopic structural member 11 is connected to the support ring 21.

[0092] In this embodiment, the lens module 2 further includes a support ring 21, which is sleeved on the lens 20. The center of the support ring 21 is located on the optical axis of the lens 20, that is, the centerline of the support ring 21 is collinear with the optical axis of the lens 20. For example, the support ring 21 is fixedly connected to the lens 20.

[0093] In other words, in this embodiment, the retractable structural member 11 is indirectly connected to the lens 20. Specifically, the retractable structural member 11 is connected to the lens 20 through the support ring 21. For example, the retractable structural member 11 is connected to the center of the support ring 21. The extension or shortening of the retractable structural member 11 adjusts the axial position of the lens 20 to achieve the focusing purpose of the lens 20.

[0094] In another specific embodiment, refer to Figure 4 , Figure 6 and Figure 7 The lens module 2 includes a plurality of focusing devices 1, which are distributed circumferentially along the support ring 21, and each focusing device 1 is connected to the support ring 21.

[0095] In this embodiment, the lens module 2 includes multiple focusing devices 1, such as those mentioned above. Figure 4 , Figure 6 and Figure 7 The lens module 2 includes four focusing devices 1, which can be evenly distributed around the support ring 21. Alternatively, the lens module 2 may also include three focusing devices 1, which can be evenly distributed around the support ring 21.

[0096] It should be noted that the multiple focusing devices 1 may be unevenly distributed around the support ring 21. When focusing the lens 20, the semiconductor cooling rings 10 of the focusing devices 1 at different positions can be connected to voltage signals of different magnitudes or intensities to achieve axial position adjustment of the lens 20 or adjustment of the axial and tilt directions of the lens 20.

[0097] For example, the lens module 2 includes four focusing devices 1:

[0098] When the image recognition system detects that only the axial position of lens 20 needs adjustment, the axial position of lens 20 can be adjusted by controlling the voltage signal and simultaneously adjusting the intensity and direction of the voltage signals at the four positions to be the same.

[0099] When the image recognition system detects that the axial position of the lens 20 needs adjustment and that the lens 20 is tilted, it adjusts the intensity and / or direction of the voltage at the four positions to be not completely consistent, thereby achieving the adjustment of the axial position and tilt direction of the lens 20.

[0100] This application also provides an optical engine 3 in its embodiments. (Refer to...) Figures 4-5 The optical engine 3 includes an optical engine housing 31 and a lens module 2 as described above, wherein the lens module is disposed in the optical engine housing 31.

[0101] This application embodiment also provides an optical engine 3, which can be a DLP optical engine 3. A lens module 2 with a focusing device 1 is mounted on the optical engine housing 31.

[0102] For example, the lens module 2 includes four focusing devices 1:

[0103] When the image recognition system detects that only axial position adjustment is needed between the lens 20 and the optical engine housing 31, it controls the voltage signal and adjusts the strength and direction of the voltage signals at four positions to be the same, thus achieving the axial position adjustment of the lens 20. When it detects that the lens 20 and the optical engine housing 31 need to adjust not only the axial position but also the tilt angle of the lens 20, it adjusts the strength and / or direction of the voltage at the four positions to be not completely consistent, thereby achieving the adjustment of both the axial position and the tilt direction of the lens 20.

[0104] In one specific embodiment, refer to Figure 4 , Figure 5 and Figure 7 The optical engine 3 also includes a support part 32, which is disposed on the optical engine housing 31, and the end of the focusing device 1 facing away from the lens 20 is disposed on the support part 32.

[0105] In this embodiment, the optical engine 3 further includes a support portion 32, which serves to connect the lens module 2 and the optical engine housing 31. For example, the support portion 32 may be a flange.

[0106] One end of the focusing device 1 away from the lens 20 is disposed on the support 32. For example, the side of the telescopic structure away from the lens 20 is disposed on the support 32, and the heat sink 122 of the focusing device 1 can also be disposed on the support 32.

[0107] This application also provides a display device. The display device includes the lens module 2 as described above, or the display device includes the optical engine 3 as described above.

[0108] In this embodiment of the application, a display device is also provided. The display device can be a near-eye display device, such as an AR device or a VR device. Alternatively, the display device can also be a vehicle-mounted head-up display device.

[0109] The above embodiments mainly describe the differences between the various embodiments. As long as the different optimization features between the various embodiments are not contradictory, they can be combined to form a better embodiment. For the sake of brevity, they will not be elaborated here.

[0110] While specific embodiments of this application have been described in detail by way of examples, those skilled in the art should understand that the above examples are for illustrative purposes only and are not intended to limit the scope of this application. Those skilled in the art should understand that modifications can be made to the above embodiments without departing from the scope and spirit of this application. The scope of this application is defined by the appended claims.

Claims

1. A focusing device, characterized in that, For focusing the lens (20), the focusing device includes: A semiconductor cooling ring (10) is provided with an electrical connection line (101), which is configured to be electrically connected to an external circuit. By adjusting the magnitude and direction of the voltage or current, the semiconductor cooling ring (10) can achieve heating and cooling. A retractable structural member (11) is arranged along the axial direction of the semiconductor cooling ring (10) and located within the semiconductor cooling ring (10), and one end of the retractable structural member (11) is configured to be connected to the lens (20). When the semiconductor cooling ring (10) is connected to the external circuit, the telescopic structure (11) extends or shortens along the axial direction of the semiconductor cooling ring (10) to adjust the position of the lens (20) and achieve focusing.

2. The focusing device according to claim 1, characterized in that, The retractable structural component (11) includes an element that can adjust the position of the lens (20) based on the principle of thermal expansion and contraction.

3. The focusing device according to claim 1 or 2, characterized in that, The retractable structural member (11) includes a cylinder (111), a medium (112) located inside the cylinder (111), and a piston rod (113), wherein the cylinder (111) is located inside the semiconductor cooling ring (10); When the semiconductor cooling ring (10) is connected to the external circuit, the semiconductor cooling ring (10) transfers its temperature to the cylinder (111) and then to the medium (112); The medium (112) acts on the piston rod (113) based on the principle of thermal expansion and contraction, and the position of the lens (20) is adjusted by the piston rod (113) to achieve focusing.

4. The focusing device according to claim 3, characterized in that, The medium (112) is liquid within the target temperature range, which is the temperature range of the semiconductor cooling ring (10) in the conducting state.

5. The focusing device according to claim 4, characterized in that, The target temperature range is -50℃ to 200℃.

6. The focusing device according to claim 1 or 2, characterized in that, The telescopic structural component (11) includes a telescopic rod (114), the semiconductor cooling ring (10) is in the conducting state, and the range of the length change ΔL of the telescopic rod (114) is 0mm to 0.06mm.

7. The focusing device according to claim 6, characterized in that, The thermal conductivity of the telescopic rod (114) ranges from 1 W / mK to 2 W / mK.

8. The focusing device according to claim 7, characterized in that, The telescopic rod (114) is made of ethylene containing a thermal conductivity enhancer.

9. The focusing device according to claim 1, characterized in that, The focusing device further includes a heat dissipation component (12), which is connected to the semiconductor cooling ring (10).

10. The focusing device according to claim 9, characterized in that, The heat dissipation assembly (12) includes a thermal pad (121) and a heat sink (122). At least a portion of the outer periphery of the semiconductor cooling ring (10) is provided with the thermal pad (121), and the side of the thermal pad (121) facing away from the semiconductor cooling ring (10) is connected to the heat sink (122).

11. A lens module (2), characterized in that, The lens module (2) includes a lens (20) and a focusing device as described in any one of claims 1-10, wherein the retractable structure (11) of the focusing device is connected to the lens (20).

12. The lens module (2) according to claim 11, characterized in that, The lens module (2) also includes a support ring (21), which is connected to the lens (20), and the center of the support ring (21) is located on the optical axis of the lens (20); the telescopic structural member (11) is connected to the support ring (21).

13. The lens module (2) according to claim 12, characterized in that, The lens module (2) includes a plurality of focusing devices, which are distributed circumferentially along the support ring (21), and each focusing device is connected to the support ring (21).

14. An optical engine, characterized in that, The optical engine (3) includes an optical engine housing (31) and a lens module (2) as described in any one of claims 11-13, wherein the lens module (2) is disposed on the optical engine housing (31).

15. The optical engine according to claim 14, characterized in that, The optical engine (3) also includes a support (32), which is disposed on the optical engine housing (31), and the end of the focusing device (1) facing away from the lens (20) is disposed on the support (32).

16. A display device, characterized in that, The display device includes a lens module (2) as described in any one of claims 11-13, or the display device includes an optical engine (3) as described in claim 14 or 15.

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