Chip module, process cartridge, developing cartridge, and electrophotographic image forming apparatus

Abstract

The application provides a chip module, a developing cartridge, a process cartridge and an electrophotographic image forming apparatus. The chip module comprises a mounting seat, a push block and a chip assembly. The mounting seat has a guide groove. The push block is slidingly mounted in the guide groove. The guide groove penetrates through the mounting seat in the pushing direction of the push block. The chip assembly comprises a substrate and a contact spring group. The substrate is mounted on the mounting seat. The contact spring group is mounted on the substrate and electrically connected with the substrate. In the pushing direction, a part of the contact spring group is located at the downstream end of the guide groove. When the push block is moved in the pushing direction by the pushing force, the push block can push the contact spring group to elastically deform in the direction away from the guide groove, so that the contact spring group is in contact with a stylus group in the electrophotographic image forming apparatus. The electrophotographic image forming apparatus is provided with the process cartridge. The process cartridge comprises the developing cartridge. The developing cartridge is provided with the chip module. The chip module can ensure that the chip assembly is stably electrically connected with the electric stylus in the electrophotographic image forming apparatus and does not hinder the installation of the developing cartridge.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of electrophotographic imaging, in particular to a chip module, a developing cartridge provided with the chip module, a process cartridge provided with the developing cartridge, and an electrophotographic imaging device provided with the process cartridge. BACKGROUND

[0002] An electrophotographic imaging device (such as a laser printer) is an indispensable office equipment in daily work and study, which is a device for forming an image on an image forming medium (such as paper) by using an electrophotographic principle and at least by going through the processes of charging, exposure, development, transfer, fixing, and cleaning. A material device of a printing consumable used on the electrophotographic imaging device is generally referred to as a process cartridge.

[0003] The process cartridge includes a developing cartridge and a drum cartridge, such as Figure 1 As shown in FIG. 1, an existing developing cartridge 9 is provided with a chip 91, wherein the chip 91 is mounted to an end cover 93 of the developing cartridge 9 through a movable support 92. The movable support 92 includes a mounting bracket 921, a connecting bracket 922, and a compression spring (not shown). The chip 91 is fixedly mounted to the mounting bracket 921. The mounting bracket 921 is in sliding connection with the connecting bracket 922. The compression spring is arranged between the mounting bracket 921 and the connecting bracket 922. The compression spring is used to force the mounting bracket 921 to move away from the connecting bracket 922. The connecting bracket 922 is movably mounted to the end cover 93. Due to the sliding connection between the mounting bracket 921 and the connecting bracket 922, the mounting bracket 921 can move relative to the connecting bracket 922 in a direction X1. Due to the movable connection between the connecting bracket 922 and the end cover 93, the movable support 92 can move relative to the end cover 93 in a direction Y1 and a direction Z1. This design can prevent the chip 91 from being in hard contact with parts in the electrophotographic imaging device under the action of the movable support 92 during installation of the developing cartridge 9 into the electrophotographic imaging device, thereby protecting the chip 91 during installation of the developing cartridge 9. After the developing cartridge 9 is installed into the electrophotographic imaging device, the chip 91 can be in stable connection with an electric contact pin in the electrophotographic imaging device under the action of the movable support 92. Even if the electrophotographic imaging device performs a “drum roller separation” operation, i.e., the developing cartridge 9 is moved a small distance in the direction X1 relative to the drum cartridge, the compression spring arranged between the mounting bracket 921 and the connecting bracket 922 can ensure the stability of the electrical connection between the contacts on the chip 91 and the electric contact pin in the electrophotographic imaging device. However, the above design has the following problems:

[0004] In the process of installing the developing cartridge 9 into the electrophotographic image forming apparatus, since the mounting frame 921 and the connecting frame 922 of the movable bracket 92 are both movable in the direction X1, there is a certain probability that the entire movable bracket 92 moves excessively towards the electrical contact pin structure in the electrophotographic image forming apparatus, and thus the edge of the mounting frame 921 abuts against the upper edge of the electrical contact pin structure, resulting in that the developing cartridge 9 cannot be installed in place and / or the contacts of the chip 91 cannot be accurately electrically connected with the electrical contact pins. Especially when there is an error in manufacturing, the movable distance of the movable bracket 92 in the direction X1 is likely to exceed the safe range, and thus the above problems are exacerbated. SUMMARY

[0005] In order to solve the above problems, the first object of the present application is to provide a chip module which can ensure stable electrical connection between the chip assembly and the electrical contact pins in the electrophotographic image forming apparatus and does not hinder the installation of the developing cartridge.

[0006] The second object of the present application is to provide a developing cartridge provided with the above chip module.

[0007] The third object of the present application is to provide a process cartridge provided with the above developing cartridge.

[0008] The fourth object of the present application is to provide an electrophotographic image forming apparatus provided with the above process cartridge.

[0009] In order to achieve the first object of the present application, the present application provides a chip module, which comprises a mounting seat, a pushing block and a chip assembly, the mounting seat has a guide groove, the pushing block is slidingly installed in the guide groove, the guide groove penetrates through the mounting seat in the pushing direction of the pushing block, the chip assembly comprises a substrate and a contact spring group, the substrate is installed on the mounting seat, the contact spring group is installed on the substrate and electrically connected with the substrate, in the pushing direction, a part of the contact spring group is located at the downstream end of the guide groove, when the pushing block is moved in the pushing direction by the pushing force, the pushing block can push the contact spring group to elastically deform in the direction away from the guide groove, so that the contact spring group is in contact with the contact pin group in the electrophotographic image forming apparatus.

[0010] As can be seen from the above, the chip module is fixed on the end cover of the developing box during use, and based on the connection mode and the position and guide structure of the stylus group provided in the electrophotographic image forming apparatus, it can be ensured that the chip module does not interfere with or collide with the stylus group before the developing box is completed to be landed (i.e., before being installed into the electrophotographic image forming apparatus), thereby ensuring that the developing box can be installed in place. In addition, during the landing process of the developing box, the guide structure in the electrophotographic image forming apparatus will push the push block, so that the push block pushes the contact spring group to elastically deform in a direction away from the guide groove to gradually move towards the stylus group, and when the developing box is installed in place, it ensures that the contact spring group and the stylus group are stably and reliably electrically connected, so as to ensure the stability of the communication between the chip assembly and the electrophotographic image forming apparatus. Furthermore, since the chip assembly is electrically connected with the stylus group through the contact spring group, there is no need to worry about the problem of wear and damage of the existing chip contacts.

[0011] One preferred scheme is that the mounting seat further has a receiving cavity, and at least a part of the contact spring group is located in the receiving cavity; along the pushing direction, the first end of the guide groove forms a first opening at the rear end of the mounting seat, the second end of the guide groove is in communication with the first end of the receiving cavity, and the second end of the receiving cavity forms a second opening at the front end of the mounting seat.

[0012] As can be seen from the above, the addition of the receiving cavity for accommodating the contact spring group can reduce the probability of interference and collision between the contact spring group and the parts of the electrophotographic image forming apparatus during installation, thereby protecting the contact spring group.

[0013] A further scheme is that the chip assembly further includes a memory, and the memory is mounted on the substrate and electrically connected with the substrate; along the landing direction of the chip module, the receiving cavity forms a third opening at the top or bottom of the mounting seat, the substrate is mounted at the third opening, and the memory is located in the receiving cavity, or both the substrate and the memory are located in the receiving cavity.

[0014] As can be seen from the above, the above design places the memory of the chip assembly in the receiving cavity for protection, thereby preventing the memory from being damaged due to collision and impact, and improving the protection effect of the chip assembly.

[0015] Another preferred scheme is that the elastic conductive sheet of the contact spring group has a first bending section, the first bending section extends substantially along the pushing direction, and along the landing direction of the chip module, the first bending section is located above the guide groove or at the downstream end of the guide groove; the protruding end of the first bending section has a second bending section, and the second bending section has an included angle with the first bending section, and the included angle is between 70° and 100°.

[0016] As can be seen from the above, the above design is conducive to more stable contact and electrical connection between the contact spring group and the stylus group.

[0017] Another preferred solution is that the chip module further comprises a spring fixing member, all the elastic conductive springs of the contact spring group pass through the spring fixing member; the spring fixing member is located at the downstream end of the guide slot in the pushing direction, and the pushing block is movable to contact the spring fixing member in the pushing direction.

[0018] As can be seen from the above, the spring fixing member is beneficial to the pushing block to synchronously push all the elastic conductive springs of the contact spring group to move towards the stylus group, and to ensure that each elastic conductive spring reliably and stably contacts and electrically connects with the corresponding stylus of the stylus group; at the same time, it is also beneficial to the pushing block to synchronously reset when the contact spring group resets.

[0019] A further solution is that the mounting seat further has a limiting through slot, the limiting through slot is recessed from the outer wall of the mounting seat into the guide slot and communicates with the guide slot, the limiting through slot is parallel to the guide slot, the chip module further comprises a limiting member, the limiting member passes through the limiting through slot and is connected with the pushing block; or the guide slot is T-shaped, the guide slot has a horizontal slot segment and a vertical slot segment, the first width of the horizontal slot segment is greater than the second width of the vertical slot segment, the horizontal slot segment is located at the downstream end of the vertical slot segment in the pushing direction, the pushing block is T-shaped, the pushing block has a horizontal part and a vertical part, the third width of the horizontal part is greater than the fourth width of the vertical part, the horizontal part is located in the horizontal slot segment, the vertical part is located in the vertical slot segment, and a part of the vertical part is movable into the horizontal slot segment.

[0020] As can be seen from the above, the above design can prevent the pushing block from falling off the mounting seat.

[0021] In order to achieve the second object of the present application, the present application provides a developing cartridge comprising a first end cover, wherein the chip module described above is further included, and the mounting seat is arranged on the first end cover.

[0022] As can be seen from the above, the developing cartridge is provided with the chip module described above, so that the chip module does not interfere with and collide with the stylus group before landing (i.e. before being installed into the electrophotographic image forming apparatus), thereby ensuring that it can be installed in place; and in the landing process, the guiding structure in the electrophotographic image forming apparatus will push the pushing block, so that the pushing block elastically deforms the contact spring group away from the guide slot to gradually move towards the stylus group, and when the developing cartridge is installed in place, it ensures that the contact spring group stably and reliably electrically connects with the stylus group, so as to ensure the stability of the communication between the chip assembly and the electrophotographic image forming apparatus; in addition, since the chip assembly is electrically connected with the stylus group through the contact spring group, there is no need to worry about the problem of wear and damage of the existing chip contacts.

[0023] A further solution is that the mounting seat is detachably connected with the first end cover; or the mounting seat is integrally formed on the first end cover.

[0024] From the above, the chip module and the first end cover are connected flexibly, different production requirements can be adapted, different use requirements can be met, the application range of the developing box is expanded, and the practicability of the developing box is improved.

[0025] In order to achieve the third object of the present application, the present application provides a process cartridge comprising a drum cartridge, wherein the process cartridge further comprises the developing box as described above, and the developing box is connected with the drum cartridge.

[0026] From the above, the process cartridge provided with the developing box can ensure that the chip module is not interfered with or collided with the contact pin group before the developing box is installed into the electrophotographic image forming apparatus, thereby ensuring that the chip module can be installed in place. During the installation process, the guiding structure in the electrophotographic image forming apparatus pushes the pushing block, so that the pushing block contacts the contact spring group and is elastically deformed away from the guiding groove to gradually move towards the contact pin group. When the developing box is installed in place, the contact spring group and the contact pin group are stably and reliably electrically connected, so as to ensure the stability of the communication between the chip module and the electrophotographic image forming apparatus. In addition, since the chip module is electrically connected with the contact pin group through the contact spring group, there is no need to worry about the problem of wear and damage of the chip contact.

[0027] In order to achieve the fourth object of the present application, the present application provides an electrophotographic image forming apparatus comprising a body, wherein the body has a process cartridge installation cavity, the process cartridge installation cavity is provided with a contact pin group and a pushing surface, and the process cartridge installation cavity is provided with the process cartridge as described above. The pushing surface pushes the pushing block to move in the pushing direction, so that the pushing block pushes the contact spring group to elastically deform away from the guiding groove and contact the contact pin group.

[0028] From the above, through the design of the electrophotographic image forming apparatus, the developing box can be installed in place, and the chip module and the contact pin group can be stably contacted and electrically connected. BRIEF DESCRIPTION OF DRAWINGS

[0029] Figure 1 is a partial structure diagram of the existing developing box.

[0030] Figure 2 is a structure diagram of the first embodiment of the chip module of the present application from a first perspective.

[0031] Figure 3 is a structure diagram of the first embodiment of the chip module of the present application from a second perspective.

[0032] Figure 4 is a structure diagram of the mounting seat of the first embodiment of the chip module of the present application.

[0033] Figure 5 is a structure diagram of the chip module of the first embodiment of the present application.

[0034] Figure 6is a sectional view of the first embodiment of the chip module of the present application.

[0035] Figure 7 is a sectional view of the first embodiment of the chip module of the present application after the chip module is installed.

[0036] Figure 8 is a sectional view of the second embodiment of the chip module of the present application.

[0037] Figure 9 is a sectional view of the third embodiment of the chip module of the present application.

[0038] Figure 10 is a sectional view of the fourth embodiment of the chip module of the present application.

[0039] Figure 11 is a structural view of the developer cartridge embodiment after omitting some components.

[0040] The present application is further described below in conjunction with the accompanying drawings and embodiments. DETAILED DESCRIPTION

[0041] First embodiment of the chip module

[0042] Referring to Figure 2 and Figure 3 , the chip module 100 comprises a mounting seat 1, a push block 2 and a chip assembly 3; the chip module 100 can be installed on the end cover 102 of the developer cartridge, and is kept fixed relative to the end cover 102 of the developer cartridge and moves synchronously with the developer cartridge.

[0043] In combination Figure 4 , in this embodiment, the mounting seat 1 has a guide groove 11 and a receiving cavity 12; the guide groove 11 penetrates the mounting seat 1 in the pushing direction X2 of the push block 2, and along the pushing direction X2, a first end of the guide groove 11 forms a first opening 111 at the rear end of the mounting seat 1 (i.e. the upstream end side of the mounting seat 1 in the pushing direction X2), and a second end of the guide groove 11 communicates with a first end of the receiving cavity 12, and a second end of the receiving cavity 12 forms a second opening 121 at the front end of the mounting seat 1 (i.e. the downstream end side of the mounting seat 1 in the pushing direction X2). Preferably, along the installation direction Z2 of the chip module 100 (i.e. the direction in which the chip module 100 is installed into the electrophotographic image forming apparatus 101 following the developer cartridge), the receiving cavity 12 forms a third opening 122 at the top or bottom of the mounting seat 1; more preferably, the third opening 122 of the receiving cavity 12 is formed at the bottom of the mounting seat 1 along the installation direction Z2 of the chip module 100, so as to better protect the chip assembly 3 (such as the substrate 31, the memory 33, etc.), and avoid the chip assembly 3 from being bumped.

[0044] The pushing block 2 is slidingly installed in the guide groove 11. In this embodiment, the pushing block 2 is substantially cuboid, and the mounting base 1 further has a limiting through groove 13 recessed from the outer wall of the mounting base 1 into the guide groove 11 until communicating with the guide groove 11, wherein the limiting through groove 13 is parallel to the guide groove 11. Preferably, along the falling direction Z2, the limiting through groove 13 is located at the upper portion of the mounting base 1. In addition, the chip module 100 further comprises a limiting piece 51 penetrating through the limiting through groove 13 and connected with the pushing block 2. Preferably, the limiting piece 51 is a first bolt penetrating through the limiting through groove 13 from the outer wall of the mounting base 1 and threadedly connected with the pushing block 2. Through the above design, the pushing block 2 can be effectively limited to prevent it from falling off the mounting base 1. Of course, as another optional solution, in other embodiments, the limiting piece 51 can also be a pin, and the pin also penetrates through the limiting through groove 13 from the outer wall of the mounting base 1 and is in interference fit with a pin hole provided on the pushing block 2 to fix the pin on the pushing block 2.

[0045] In combination with Figure 5 and Figure 6 , the chip assembly 3 comprises a substrate 31, a contact spring group 32 and a memory 33, and the contact spring group 32 and the memory 33 are both installed on the substrate 31 and electrically connected with the substrate 31. The contact spring group 32 comprises two or more elastic conductive sheets 321, and the number of the elastic conductive sheets 321 can be matched with the number of the contact pins of the contact pin group 1011 in the electrophotographic imaging device 101. In this embodiment, the number of the elastic conductive sheets 321 is four. The substrate 31 is provided with two or more insertion holes 311, and the number of the insertion holes 311 is equal to the number of the elastic conductive sheets 321. The two or more insertion holes 311 correspond to the two or more elastic conductive sheets 321 one by one, so that one elastic conductive sheet 321 can be inserted into one insertion hole 311. In addition, the elastic conductive sheet 321 is welded and fixed with the substrate 31 to realize the electrical connection between the elastic conductive sheet 321 and the substrate 31 and ensure the firmness of the connection between the elastic conductive sheet 321 and the substrate 31.

[0046] The substrate 31 is further provided with a connecting hole 312. When the chip assembly 3 is assembled with the mounting seat 1, the second bolt 52 is screwed with the mounting seat 1 after passing through the connecting hole 312 of the substrate 31, so as to fix the substrate 31 on the mounting seat 1. In this embodiment, the substrate 31 is installed at the third opening 122 of the mounting seat 1, and at least part of the contact spring group 32 is located in the accommodating cavity 12, so that the accommodating cavity 12 can accommodate the contact spring group 32 while reducing the probability of interference and collision between the contact spring group 32 and the parts of the electrophotographic image forming apparatus 101 during installation, thereby protecting the contact spring group 32. At the same time, under the protection of the accommodating cavity 12, the contact spring group 32 in the non-falling state can also be prevented from being excessively exposed outside the mounting seat 1, thereby preventing the contact spring group 32 from being deformed due to extrusion and impact of external objects, and ensuring that the contact spring group 32 can accurately match and dock with the stylus group 1011. It should be noted that, as an optional solution, the contact spring group 32 can be completely located in the accommodating cavity 12, but this may increase the amplitude of the elastic deformation required for the electrical connection between the contact spring group 32 and the stylus group 1011, and / or increase the length of the stylus group 1011 extending to the chip module 100. In addition, the memory 33 is also arranged to be located in the accommodating cavity 12, so that the accommodating cavity 12 protects the memory 33, effectively preventing the memory 33 from being collided and impacted, thereby preventing the memory 33 from being damaged, and improving the protection effect of the chip assembly 3. Further, the mounting seat 1 can be provided with a sunken groove at the third opening 122. The sunken groove is recessed from the outer wall of the mounting seat 1 to the accommodating cavity 12. The sunken groove is used to accommodate the substrate 31, so that the side of the substrate 31 away from the accommodating cavity 12 is flush with the outer wall of the mounting seat 1, or the side of the substrate 31 away from the accommodating cavity 12 is closer to the accommodating cavity 12 relative to the outer wall of the mounting seat 1, thereby better protecting the substrate 31, and also facilitating the reduction of the space occupied by the chip module 100.

[0047] In addition, along the pushing direction X2, part of the contact spring group 32 is located at the downstream end of the guide groove 11 (i.e. part of the contact spring group 32 is located at the downstream end of the guide groove 11 along the pushing direction X2 and on the extension line of the guide groove 11), so as to ensure that when the pushing block 2 moves along the pushing direction X2 under the thrust, the pushing block 2 can reliably push the contact spring group 32 to elastically deform away from the guide groove 11, thereby making the contact spring group 32 contact with the stylus group 1011 in the electrophotographic image forming apparatus 101, and establishing stable electrical connection between the electrophotographic image forming apparatus 101 and the chip assembly 3. The length of the pushing block 2 extending to the first opening 111 is sufficient to push the contact spring group 32 to elastically deform and stably contact with the stylus group 1011 in the electrophotographic image forming apparatus 101.

[0048] Preferably, the elastic conductive sheet 321 of the contact spring group 32 has a first bending section 3211, which extends substantially along the pushing direction X2 and is located above the guide groove 11 or at the downstream port of the guide groove 11 along the landing direction Z2; wherein the first bending section 3211 and the main body of the elastic conductive sheet 321 are preferably arc-shaped transition to reduce stress concentration, and the included angle a between the first bending section 3211 and the main body of the elastic conductive sheet 321 is preferably substantially a right angle. The design of the first bending section 3211 can reduce the moving distance required for the pushing block 2 to push the elastic conductive sheet 321 into contact with the stylus group 1011, thereby facilitating the reduction of the size of the chip module 100; and can also reduce the deformation amount required when the elastic conductive sheet 321 contacts the corresponding stylus of the stylus group 1011, ensuring the reliability of the connection between the elastic conductive sheet 321 and the substrate 31, avoiding damage to the elastic conductive sheet 321 and / or the substrate 31, and prolonging the service life of the chip assembly 3.

[0049] Further, the extending end of the first bending section 3211 has a second bending section 3212, and the first bending section 3211 and the second bending section 3212 are preferably arc-shaped transition to reduce stress concentration. Wherein the second bending section 3212 can be bent to the lower side or the upper side of the first bending section 3211 relative to the first bending section 3211 to adapt to the position setting of the stylus group 1011 in the electrophotographic imaging device 101. The second bending section 3212 can increase the contact area of the elastic conductive sheet 321 and the stylus group 1011, ensure the reliability and stability of the electrical connection between the elastic conductive sheet 321 and the corresponding stylus of the stylus group 1011, and weaken the influence of the vibration generated during the operation of the electrophotographic imaging device 101 on the electrical connection between the elastic conductive sheet 321 and the stylus of the stylus group 1011. In addition, the included angle b between the second bending section 3212 and the first bending section 3211 is preferably between 70° and 100°. By designing the included angle b, it is ensured that the second bending section 3212 and the corresponding stylus of the stylus group 1011 can be tightly abutted together after landing.

[0050] Furthermore, the chip module 100 preferably further comprises a spring fixing member 4, the spring fixing member 4 is provided with two or more through holes 41, the number of the through holes 41 is equal to the number of the elastic conductive sheets 321 of the contact spring group 32, and the two or more through holes 41 correspond to the two or more elastic conductive sheets 321 one by one, so that each elastic conductive sheet 321 passes through the corresponding through hole 41 of the spring fixing member 4. Wherein, along the pushing direction X2, the spring fixing member 4 is located at the downstream port of the guide groove 11, so that the pushing block 2 can move to contact the spring fixing member 4 along the pushing direction X2, and push the contact spring group 32 to move towards the stylus group 1011 through the spring fixing member 4.

[0051] The spring sheet fixing member 4 is beneficial to synchronously push the all elastic conductive sheets 321 of the contact spring sheet set 32 to move towards the stylus set 1011 by the push block 2, and ensures that each elastic conductive sheet 321 reliably and stably contacts and electrically connects with the corresponding stylus of the stylus set 1011; meanwhile, it is also beneficial to better push the push block 2 to synchronously reset by the spring sheet fixing member 4 when the contact spring sheet set 32 resets. In addition, the spring sheet fixing member 4 can also keep a fixed interval between the elastic conductive sheets 321 of the contact spring sheet set 32, preventing the elastic conductive sheets 321 of the contact spring sheet set 32 from short-circuiting due to mutual contact; wherein the spring sheet fixing member 4 is preferably made of insulating material (such as ABS or other non-conductive plastic).

[0052] In combination Figure 7 When the chip module 100 is used, it is fixed on the end cover 102 of the developing cartridge, so that the chip module 100 moves synchronously with the developing cartridge, and based on the connection mode and the position and guiding structure of the stylus set 1011 provided in the electrophotographic image forming apparatus 101, it can be ensured that the chip module 100 does not interfere with or collide with the stylus set 1011 before the developing cartridge is completed (i.e. before it is installed into the electrophotographic image forming apparatus 101), thereby ensuring that the developing cartridge can be installed in place.

[0053] In addition, during the installation of the developing cartridge, the guiding structure in the electrophotographic image forming apparatus 101 pushes the push block 2, so that the push block 2 pushes the contact spring sheet set 32 to elastically deform away from the guiding groove 11 to gradually move towards the stylus set 1011. Since the guiding structure mechanically and hard contacts with the push block 2, it can be ensured that the contact spring sheet set 32 stably and reliably electrically connects with the stylus set 1011 when the developing cartridge is installed in place, so as to ensure the stability of the communication between the chip assembly 3 and the electrophotographic image forming apparatus 101.

[0054] Furthermore, since the chip assembly 3 is electrically connected with the stylus set 1011 through the contact spring sheet set 32, there is no need to worry about the problem of wear and damage of the existing chip contact; and since the contact spring sheet set 32 elastically deforms to contact and establish electrical connection with the stylus set 1011 after the developing cartridge is installed in place, and relies on its own elastic function to reset and push the push block 2 to reset together when the developing cartridge is taken out from the electrophotographic image forming apparatus 101, it can also effectively avoid the contact spring sheet set 32 from interfering with or colliding with the parts of the electrophotographic image forming apparatus 101 during the disassembly and assembly of the developing cartridge, thereby protecting the chip assembly 3.

[0055] In addition, the mounting seat 1 is further formed with a connecting portion 14, which is used for connecting the mounting seat 1 with an end cover 102 of the developing cartridge, and meanwhile forms a certain avoiding space between the chip assembly 3 and the end cover 102, so as to avoid some parts on the end cover 102, and further prevent these parts from blocking the abutment between the chip module 100 and the stylus group 1011 and the guide structure in the electrophotographic image forming apparatus 101; preferably, along the falling direction Z2, the mounting seat 1 is formed with a guide surface 15 below the first opening 111, which can be matched with the guide structure, so as to better guide the chip module 100 to accurately fall, and enable the guide structure to reliably push the push block 2 to move the contact spring group 32 during the falling of the developing cartridge, and further push the contact spring group 32 to move towards the stylus group 1011, so as to ensure that the contact spring group 32 and the stylus group 1011 are stably and reliably electrically connected after the falling of the developing cartridge.

[0056] Chip module second embodiment

[0057] With reference to Figure 8 The difference between the present embodiment and the first embodiment of the chip module is that, in the present embodiment:

[0058] The mounting seat 1 cancels the design of the accommodating cavity 12 and the second opening 121 and the third opening 122 thereof, and also cancels the setting of the spring fixing member 4.

[0059] In addition to the above difference, the other structural design of the chip module 100 in the present embodiment is the same as that in the first embodiment of the chip module.

[0060] Chip module third embodiment

[0061] With reference to Figure 9 The difference between the present embodiment and the first embodiment of the chip module is that, in the present embodiment:

[0062] The mounting seat 1 is formed with the base plate 31 and the memory 33, which are located in the accommodating cavity 12; meanwhile, the mounting seat 1 can cancel the design of the third opening 122 of the accommodating cavity 12. In addition, the contact spring group 32 can also be completely set in the accommodating cavity 12, that is, the chip assembly 3 can be completely set in the accommodating cavity 12, so as to better protect the chip assembly 3.

[0063] In addition to the above difference, the other structural design of the chip module 100 in the present embodiment is the same as that in the first embodiment of the chip module.

[0064] Chip module fourth embodiment

[0065] With reference to Figure 10 The difference between the present embodiment and the first embodiment of the chip module is that, in the present embodiment:

[0066] The limiting member 51 and the limiting through slot 13 on the mounting seat 1 are cancelled; meanwhile, the guide slot 11 is designed in a T shape, i.e. the guide slot 11 has a horizontal slot section 112 and a vertical slot section 113, along the pushing direction X2, the horizontal slot section 112 is located at the downstream end of the vertical slot section 113, wherein the first width W1 of the horizontal slot section 112 is greater than the second width W2 of the vertical slot section 113; correspondingly, the pushing block 2 is designed in a T shape, i.e. the pushing block 2 has a horizontal part 21 and a vertical part 22, along the pushing direction X2, the horizontal part 21 is located at the downstream end of the vertical part 22, and the third width of the horizontal part 21 is greater than the fourth width of the vertical part 22, wherein the horizontal part 21 is located in the horizontal slot section 112, the vertical part 22 is located in the vertical slot section 113, and a part of the vertical part 22 can move into and pass through the horizontal slot section 112.

[0067] Except for the above differences, the other structural designs of the chip module 100 in this embodiment are the same as those in any one of the first to third embodiments of the chip module.

[0068] Developing box embodiment

[0069] With reference to Figure 11 The developing box includes the chip module 100, the first end cover 102, a developing frame (not shown), a developing roller (not shown), etc. Since the developing box is basically the same as the developing box of the prior art except for the chip module 100, no further description is given here. Among them, the chip module 100 is arranged on the first end cover 102, the first end cover 102 is mounted on the first end wall of the developing frame, and the developing roller is rotatably mounted on the developing frame. Among them, the chip module 100 is the chip module 100 described in any one of the first to fourth embodiments of the chip module.

[0070] The developing box is provided with the above-mentioned chip module 100, so that before the landing (i.e. before being installed into the electrophotographic image forming apparatus 101), the chip module 100 will not interfere with or collide with the stylus group 1011 in the electrophotographic image forming apparatus 101, thereby ensuring that it can be installed in place; and during the landing process, the guide structure in the electrophotographic image forming apparatus 101 will push the pushing block 2, so that the pushing block 2 contacts the spring sheet group 32 to elastically deform away from the guide slot 11 to gradually move towards the stylus group 1011, and when the developing box is installed in place, it ensures that the spring sheet group 32 and the stylus group 1011 are stably and reliably electrically connected, so as to ensure the stability of the communication between the chip assembly 3 and the electrophotographic image forming apparatus 101; in addition, since the chip assembly 3 is electrically connected with the stylus group 1011 through the spring sheet group 32, there is no need to worry about the problem of wear and damage of the existing chip contacts.

[0071] In the present embodiment, the mounting seat 1 is detachably connected with the first end cover 102. For example, the connecting portion 14 of the mounting seat 1 is provided with a first connecting hole group 141, and the first end cover 102 is provided with a second connecting hole group 1021 matched with the first connecting hole group 141. When the mounting seat 1 is connected with the first end cover 102, the first connecting hole group 141 and the second connecting hole group 1021 are connected through the bolt group 53.

[0072] Of course, as another alternative, the detachable connection between the mounting seat 1 and the first end cover 102 can also be connected through a buckle structure. For example, the first end cover 102 is provided with a clamping groove on the top, and a buckle is provided on the connecting portion 14. When the mounting seat 1 is connected with the first end cover 102, the buckle is clamped and connected with the clamping groove to fix the mounting seat 1 on the first end cover 102.

[0073] And as a further alternative, the mounting seat 1 can be integrally formed on the end cover 102. It can be seen that the connection of the chip module 100 and the first end cover 102 is flexible, which can adapt to different production requirements, meet different use requirements, expand the application range of the developing box, and improve the practicability of the developing box.

[0074] Developing box embodiment

[0075] The processing box includes a drum box and the developing box described in the above developing box embodiment; wherein the drum box is basically the same as the drum box of the prior art, and thus is not described here. The developing box is connected with the drum box.

[0076] The processing box sets the above developing box, so that the chip module 100 will not interfere with and collide with the stylus group 1011 in the electrophotographic imaging device 101 before the developing box is completed and installed into the electrophotographic imaging device 101, thereby ensuring that it can be installed in place. During the installation process, the guide structure in the electrophotographic imaging device 101 will push the push block 2, so that the push block 2 contacts the spring group 32 and deforms elastically away from the guide groove 11 to gradually move towards the stylus group 1011, and when the developing box is installed in place, it ensures that the spring group 32 and the stylus group 1011 are stably and reliably electrically connected, so as to ensure the stability of the communication between the chip assembly 3 and the electrophotographic imaging device 101. In addition, since the chip assembly 3 is electrically connected with the stylus group 1011 through the spring group 32, there is no need to worry about the problem of wear and damage of the existing chip contact.

[0077] Electrophotographic imaging device embodiment

[0078] The electrophotographic imaging device 101 comprises a machine body having a process cartridge mounting cavity; wherein the process cartridge mounting cavity is provided with a stylus group 1011 and a guide structure, the guide structure has a pushing surface 1012. The process cartridge mounting cavity is mounted with the process cartridge described in the process cartridge embodiments described above. When the process cartridge is mounted to the process cartridge mounting cavity, the pushing surface 1012 forces the pushing block 2 to move along the pushing direction X2, so that the pushing block 2 pushes the contact spring group 32 to elastically deform away from the guide groove 11; when the process cartridge is completed, the pushing surface 1012 makes the pushing block 2 push the contact spring group 32 to elastically deform away from the guide groove 11 and stably contact and electrically connect with the stylus group 1011.

[0079] It can be seen that, through the design of the electrophotographic imaging device 101, the developing cartridge can be installed in place, and the chip assembly 3 and the stylus group 1011 can stably contact and electrically connect.

[0080] Finally, it should be emphasized that the above description is only the preferred embodiment of the present application and is not intended to limit the present application. For those skilled in the art, the present application can have various changes and modifications. Any modification, equivalent replacement, improvement, etc. made within the spirit and principles of the present application shall be included in the protection scope of the present application.

Claims

1. A chip module, characterized by The chip module comprises: a mounting seat having a guide slot; a pushing block slidingly installed in the guide slot, the guide slot extending through the mounting seat in a pushing direction of the pushing block; a chip assembly comprising a substrate and a contact spring set, the substrate being installed on the mounting seat, the contact spring set being installed on the substrate and electrically connected with the substrate, a part of the contact spring set being located at a downstream end of the guide slot in the pushing direction, the pushing block being capable of pushing the contact spring set to elastically deform in a direction away from the guide slot when the pushing block is moved by a pushing force in the pushing direction, so that the contact spring set is in contact with a stylus set in an electrophotographic image forming apparatus provided with a process cartridge.

2. The chip module according to claim 1, wherein: the mounting seat further has a receiving cavity, at least a part of the contact spring set being located in the receiving cavity; a first end of the guide slot forms a first opening at a rear end of the mounting seat in the pushing direction, a second end of the guide slot communicates with a first end of the receiving cavity, and a second end of the receiving cavity forms a second opening at a front end of the mounting seat.

3. The chip module according to claim 2, wherein: the chip assembly further comprises a memory, the memory being installed on the substrate and electrically connected with the substrate; the receiving cavity forms a third opening at a top or bottom of the mounting seat in a landing direction of the chip module, the substrate is installed at the third opening, and the memory is located in the receiving cavity, or both the substrate and the memory are located in the receiving cavity.

4. The chip module according to claim 1, wherein: an elastic conductive sheet of the contact spring set has a first bending section extending in the pushing direction, the first bending section being located above the guide slot in a landing direction of the chip module, or the first bending section being located at a downstream end of the guide slot; an extending end of the first bending section has a second bending section, an included angle between the first bending section and the second bending section being between 70° and 100°.

5. The chip module according to claim 1, wherein: the chip module further comprises a spring fixing member, all elastic conductive sheets of the contact spring set passing through the spring fixing member; the spring fixing member is located at a downstream end of the guide slot in the pushing direction, and the pushing block is capable of moving to contact the spring fixing member in the pushing direction.

6. The chip module according to any one of claims 1 to 5, wherein: the mounting seat further has a limiting through slot, the limiting through slot being recessed from an outer wall of the mounting seat into the guide slot and communicating with the guide slot, and the limiting through slot is parallel to the guide slot, the chip module further comprises a limiting member, the limiting member passing through the limiting through slot and being connected with the pushing block, or the limiting member is located at a downstream end of the guide slot in the pushing direction, and the pushing block is capable of moving to contact the limiting member in the pushing direction. The guide slot is T-shaped, having a horizontal slot section and a vertical slot section, a first width of the horizontal slot section being greater than a second width of the vertical slot section, the horizontal slot section being located downstream of a downstream end of the vertical slot section in the push direction, The push block is T-shaped, having a horizontal portion and a vertical portion, a third width of the horizontal portion being greater than a fourth width of the vertical portion, the horizontal portion being located within the horizontal slot section, the vertical portion being located within the vertical slot section, a portion of the vertical portion being movable into the horizontal slot section.

7. A process cartridge comprising a first end cover, characterized by, Also included is the chip module of any one of claims 1 to 6, the mounting seat being disposed on the first end cover.

8. The developing cartridge of claim 7, wherein: the mounting seat is detachably connected with the first end cover; or the mounting seat is integrally formed on the first end cover.

9. A process cartridge, comprising a drum cartridge, characterized by, Also included is the developing cartridge of claim 7 or 8, the developing cartridge being connected with the drum cartridge.

10. An electrophotographic image forming apparatus comprising a main body having a process cartridge mounting cavity, characterized in that: a stylus set and a push surface are provided in the process cartridge mounting cavity, the process cartridge mounting cavity mounts the process cartridge of claim 9; the push surface forces the push block to move in the push direction, so that the push block pushes the contact spring set to elastically deform away from the guide slot and contact the stylus set.

Images