Substrate processing system and method for operating substrate processing chamber using virtual machine architecture

Abstract

Substrate processing systems and methods include functions of substrate processing chambers that are virtually controlled by processing module software of individual substrate processing chambers running on a remote platform computer (e.g., positioned with a device front-end module or a load lock module). The platform computer includes a memory that stores processing module software for each associated substrate processing chamber and transmits signals for operating those substrate processing chambers based on data generated by the respective processing module software for that substrate processing chamber. The platform computers also receive data (e.g., sensor data) transmitted from the substrate processing chambers, which can be used by their respective processing module software to generate further operating signals for controlling the respective substrate processing chambers. Avoiding using and / or including a separate computer in and in connection with each separate substrate processing chamber can simplify maintenance and repair, reduce costs, reduce downtime, and improve efficiency.

Description

Technical Field

[0001] The present disclosure generally relates to substrate processing systems and methods in which the functions of a substrate processing chamber are virtually controlled by software operating on a remote platform computer. In this way, a separate personal computer ("PC") for operating the substrate processing chamber can be eliminated. Background Art

[0002] During the manufacture of semiconductor devices, such as integrated circuits and electronic devices, material layers are typically deposited onto a substrate. Material layer deposition is typically accomplished by supporting the substrate within a substrate processing chamber apparatus, heating the substrate to a desired deposition temperature, and flowing one or more material layer precursors through the chamber apparatus and across the substrate. As the precursors flow through the substrate, the material layer is gradually formed onto the substrate surface, typically based on the temperature of the substrate and the environmental conditions within the chamber apparatus.

[0003] Conventional substrate processing systems 10 generally include Figure 1A 1. Such a substrate processing system 10 includes a substrate handling chamber 12 that is operably connected to two to four substrate processing chambers 14A-14D via gate valves 16. Each substrate processing chamber 14A-14D is equipped to receive a substrate on a substrate support 18 that holds the substrate during processing (e.g., during deposition of a material layer as described above).

[0004] The substrate handling chamber 12 includes a robot 20 for moving substrates into and out of the various substrate processing chambers 14A-14D through gate valves 16. In use, the gate valves 16 are opened, and the end effector 20A of the robot 20 extends through the open gate valves 16 to insert a substrate into or remove a substrate from the interior chamber of the substrate processing chamber 14A-14D (e.g., place a substrate on or remove a substrate from the substrate support 18). Once the robot 20 is retracted from the substrate processing chamber 14A-14D, the gate valves 16 are closed, thereby sealing the substrate processing chamber 14A-14D relative to the substrate handling chamber 12. Other desired actions may then be performed in the substrate processing chambers 14A-14D and / or the substrate handling chamber 12.

[0005] Figure 1AThe substrate processing system 10 is further shown to include a load lock module 22. The load lock module 22 is connected to the substrate handling chamber 12 through a gate valve 24. The load lock module 22 includes one or more substrate holding components 22A for holding substrates on the way into the substrate handling chamber 12 for further processing and on the way out of the substrate handling chamber 12 (after processing is completed). The end effector 20A of the robot 20 moves through the gate valve 24 (when open) to move substrates from the load lock module 22 into the substrate handling chamber 12 (for layer deposition and other processing in the substrate processing chambers 14A-14D), and from the substrate handling chamber 12 to the load lock module 22 (after processing is completed). The load lock module 22 and the gate valve 24 keep the substrate isolated from the environment of the substrate handling chamber 12 until the conditions (e.g., temperature, pressure, atmospheric content, etc.) within the substrate handling chamber 12 and the load lock module 22 are ready for the substrate to be transferred.

[0006] The load lock module 22 is also coupled to the equipment front end module 26 via one or more additional gate valves 28. The equipment front end module 26 includes a robot 30. The end effector 30A of the robot 30 moves through the gate valve 28 (when open) to move substrates from the equipment front end module 26 into the load lock module 22 (for layer deposition and other processing), and from the load lock module 22 into the equipment front end module 26 (after processing is completed). The robot 30 of the equipment front end module 26 also picks up new substrates for processing from one of the load ports 32A-32D, and returns processed substrates to one of the load ports 32A-32D, for example, to be transferred to another location for further processing.

[0007] A substrate processing system 10 of the type described above is equipped with a plurality of computers. In a conventional arrangement, as Figures 1A-1C As shown, the platform computer 40 communicates with a separate dedicated computer 42A-42D provided in each substrate processing chamber 14A-14D. The separate dedicated computers 42A-42D operate their corresponding substrate processing chambers 14A-14D (each substrate processing chamber 14A-14D provides a separate and dedicated computer 42A-42D, respectively). These separate dedicated computers 42A-42D provided in each separate substrate processing chamber 14A-14D can constitute a complete PC, each with its own operating system, memory, etc. The platform computer 40 can be connected to the input / output ports 44A-44D of the computers 42A-42D provided for each substrate processing chamber 14A-14D via Ethernet cables 46A-46D. As shown in FIG. Figures 1A-1CAs shown, data from the platform computer 40 is transmitted to various computers 42A-42D provided for the substrate processing chambers 14A-14D. These computers 42A-42D are configured using software 48A-48D stored in their local memory to: (a) process input data from the platform computer 40, (b) process input data from devices associated with the substrate processing chambers 14A-14D (e.g., pressure sensors 50, temperature sensors 52, one or more motors 54, one or more heating elements 56, etc.), (c) generate and transmit data signals to operate devices associated with the substrate processing chambers 14A-14D (e.g., pressure sensors 50, temperature sensors 52, motors 54, heating elements 56, etc.), and (d) generate data and transmit it back to the platform computer 40. The platform computer 40 receives input data from the substrate processing chambers 14A-14D (and other sources) and uses the data to synchronize and control the operation of the entire substrate processing system 10.

[0008] Conventional semiconductor production systems and methods of this type are generally acceptable for their intended purposes, but there is room for improvement. For example, this distributed computing architecture (having separate and dedicated computers 42A-42D in each substrate processing chamber 14A-14D) significantly increases the cost and complexity of the substrate processing system 10. As some more specific examples, each computer 42A-42D of the corresponding substrate processing chamber 14A-14D requires its own operating system, its own virus scanning software, and its own application software to cooperate with the platform computer 40. These features significantly increase the cost and maintenance requirements of the substrate processing system 10. For example, software updates and maintenance increase the costs associated with the purchase / license price of the updated software (for each computer 42A-42D); the labor costs involved in performing updates and / or maintenance (for each computer 42A-42D); and production "downtime" (if the substrate processing chamber 14A-14D must be shut down for computer updates / maintenance). Production downtime can add significant time delays and monetary costs, particularly if the substrate processing modules 14A-14D must be shut down and / or cooled for refresh and maintenance processes, and then recalibrated, requalified, and / or heated before resuming production.

[0009] The computers 42A-42D of the substrate processing chambers 14A-14D also occupy space within and / or around the substrate processing chambers 14A-14D and require additional supplies (e.g., power requirements, cooling fans, user interface equipment, etc.) These features further complicate the packaging of the substrate processing system 10 and its components and further increase costs.

[0010] Improvements that reduce software costs, reduce process downtime, and / or increase efficiency would be welcome advancements in the art. Summary of the invention

[0011] Various aspects of the present technology relate to substrate processing systems and methods in which the functions of a substrate processing chamber are virtually controlled by processing module software for individual substrate processing chambers operating on a remote platform computer. These aspects of the present technology can avoid the use and / or inclusion of a separate personal computer in and associated with each substrate processing chamber, thereby simplifying maintenance and repair, reducing costs, reducing downtime, and improving efficiency.

[0012] According to at least some examples of the present technology, a substrate processing system includes one or more of the following: (a) a first substrate handling chamber, which includes a first robot; (b) a first substrate processing chamber, which is connected to the first substrate handling chamber via a first gate valve, wherein a portion of the first robot is configured to extend through the first gate valve and enter the first substrate processing chamber to move a substrate into and out of the first substrate processing chamber; (c) a second substrate processing chamber, which is connected to the first substrate handling chamber via a second gate valve, wherein a portion of the first robot is configured to extend through the second gate valve and enter the second substrate processing chamber to move a substrate into and out of the second substrate processing chamber; and (d) a platform computer, which is remote from the first substrate processing chamber and the second substrate processing chamber and communicates electronically therewith. The platform computer: (a) includes a memory storing first processing module software for operating the first substrate processing chamber and second processing module software for operating the second substrate processing chamber, (b) signals for operating the first substrate processing chamber based on data transmission generated by the first processing module software, and (c) signals for operating the second substrate processing chamber based on data transmission generated by the second processing module software.

[0013] In addition to one or more of the features described above, or as an alternative, a substrate processing system according to some examples of the present technology may also include a third substrate processing chamber, which is connected to the first substrate handling chamber via a third gate valve, wherein a portion of the first robot arm is configured to extend through the third gate valve and enter the third substrate processing chamber to move the substrate into and out of the third substrate processing chamber, wherein the platform computer is remote from the third substrate processing chamber and communicates electronically with it, wherein the memory of the platform computer also stores third processing module software for operating the third substrate processing chamber, and wherein the platform computer is also used to operate signals for the third substrate processing chamber based on data transmissions generated by the third processing module software.

[0014] In addition to one or more of the features described above, or as an alternative, a substrate processing system according to some examples of the present technology may also include a fourth substrate processing chamber, which is connected to the first substrate handling chamber via a fourth gate valve, wherein a portion of the first robot arm is configured to extend through the fourth gate valve and enter the fourth substrate processing chamber to move the substrate into and out of the fourth substrate processing chamber, wherein the platform computer is remote from the fourth substrate processing chamber and communicates electronically with it, wherein the memory of the platform computer also stores fourth processing module software for operating the fourth substrate processing chamber, and wherein the platform computer is also used to operate signals for the fourth substrate processing chamber based on data transmissions generated by the fourth processing module software.

[0015] In addition to one or more of the features described above, or as an alternative, some examples of substrate processing systems according to the present technology may also include: (A) a second substrate handling chamber, which includes a second robot arm; and (B) a fifth substrate processing chamber, which is connected to the second substrate handling chamber via a fifth gate valve, wherein a portion of the second robot arm is configured to extend through the fifth gate valve and enter the fifth substrate processing chamber to move the substrate into and out of the fifth substrate processing chamber, wherein the platform computer is remote from the fifth substrate processing chamber and communicates electronically with it, wherein the memory of the platform computer also stores fifth processing module software for operating the fifth substrate processing chamber, and wherein the platform computer also uses signals for operating the fifth substrate processing chamber based on data transmissions generated by the fifth processing module software.

[0016] In addition to one or more of the features described above, or as an alternative, a substrate processing system according to some examples of the present technology may also include a sixth substrate processing chamber, which is connected to the second substrate handling chamber via a sixth gate valve, wherein a portion of the second robot arm is configured to extend through the sixth gate valve and enter the sixth substrate processing chamber to move the substrate into and out of the sixth substrate processing chamber, wherein the platform computer is remote from the sixth substrate processing chamber and communicates electronically with it, wherein the memory of the platform computer also stores a sixth processing module software for operating the sixth substrate processing chamber, and wherein the platform computer is also used to operate the sixth substrate processing chamber based on data transmissions generated by the sixth processing module software. Signal.

[0017] In addition to or instead of one or more of the features described above, a substrate processing system according to some examples of the present technology may also include a load lock module connecting the first substrate handling chamber and the second substrate handling chamber, wherein the load lock module is configured to hold a substrate moving between the first substrate handling chamber and the second substrate handling chamber.

[0018] In addition to one or more of the features described above, or as an alternative, some examples of substrate processing systems according to the present technology may also include: (A) a second substrate handling chamber, which includes a second robot arm; and (B) a third substrate processing chamber, which is connected to the second substrate handling chamber via a third gate valve, wherein a portion of the second robot arm is configured to extend through the third gate valve and enter the third substrate processing chamber to move the substrate into and out of the third substrate processing chamber, wherein the platform computer is remote from the third substrate processing chamber and communicates electronically with it, wherein the memory of the platform computer also stores third processing module software for operating the third substrate processing chamber, and wherein the platform computer also uses signals for operating the third substrate processing chamber based on data transmissions generated by the third processing module software.

[0019] In addition to or instead of one or more of the features described above, a substrate processing system according to some examples of the present technology may also include a load lock module connecting the first substrate handling chamber and the second substrate handling chamber, wherein the load lock module is configured to hold a substrate moving between the first substrate handling chamber and the second substrate handling chamber.

[0020] A substrate processing system according to at least some examples of the present technology includes one or more of the following: (a) a first substrate handling chamber, which includes a first robot; (b) a first substrate processing chamber, which is connected to the first substrate handling chamber via a first gate valve, wherein a portion of the first robot is configured to extend through the first gate valve and enter the first substrate processing chamber to move a substrate into and out of the first substrate processing chamber; (c) a second substrate processing chamber, which is connected to the first substrate handling chamber via a second gate valve, wherein a portion of the first robot is configured to extend through the second gate valve and enter the second substrate processing chamber to move a substrate into and out of the second substrate processing chamber; (d) a front-end module, which is configured to receive an unprocessed substrate for processing and to hold a processed substrate before removal from the substrate processing system; (e) a first load lock module, which connects the front-end module and the first substrate handling chamber, wherein the first load lock module is configured to hold a substrate moving between the front-end module and the first substrate handling chamber; and (f) a platform computer, which is provided with the front-end module or the first load lock module, and the platform computer is remote from the first substrate processing chamber and the second substrate processing chamber and communicates electronically therewith. A platform computer: (a) includes a memory storing first processing module software for operating a first substrate processing chamber and second processing module software for operating a second substrate processing chamber, (b) signals for operating the first substrate processing chamber based on data transmission generated by the first processing module software, and (c) signals for operating the second substrate processing chamber based on data transmission generated by the second processing module software.

[0021] In addition to one or more of the features described above, or as an alternative, substrate processing systems according to some examples of the present technology may also include: (A) a second substrate handling chamber, which includes a second robot arm; (B) a second load lock module, which connects the first substrate handling chamber and the second substrate handling chamber, wherein the second load lock module is configured to hold a substrate moving between the first substrate handling chamber and the second substrate handling chamber; and (C) a third substrate processing chamber, which is connected to the second substrate handling chamber via a third gate valve, wherein a portion of the second robot arm is configured to extend through the third gate valve and enter the third substrate processing chamber to move the substrate into and out of the third substrate processing chamber, wherein the platform computer is remote from the third substrate processing chamber and communicates electronically with it, wherein the memory of the platform computer also stores third processing module software for operating the third substrate processing chamber, and wherein the platform computer is also used to operate the third substrate processing chamber based on data transmissions generated by the third processing module software. Signals for the processing chamber.

[0022] In addition to or instead of one or more of the features described above, substrate processing systems according to some examples of the present technology may also include: (A) a second substrate handling chamber comprising a second robot; (B) a second load lock module connecting the first substrate handling chamber and the second substrate handling chamber, wherein the second load lock module is configured to hold a substrate moving between the first substrate handling chamber and the second substrate handling chamber; and (C) a plurality of additional substrate processing chambers connected to the second substrate handling chamber, wherein a portion of the second robot is configured to extend into the plurality of additional substrate processing chambers to move substrates into and out of the plurality of additional substrate processing chambers, wherein a platform computer is remote from the plurality of additional substrate processing chambers and in electronic communication therewith, wherein a memory of the platform computer also stores processing module software for operating each of the plurality of additional substrate processing chambers, and wherein the platform computer also uses signals for operating the plurality of additional substrate processing chambers based on data transmissions generated by the processing module software for the plurality of additional substrate processing chambers.

[0023] In addition to or instead of one or more of the features described above, substrate processing systems according to some examples of the present technology may also include: (A) a second substrate handling chamber, which includes a second robot; (B) a second load lock module, which connects the first substrate handling chamber and the second substrate handling chamber, wherein the second load lock module is configured to hold a substrate moving between the first substrate handling chamber and the second substrate handling chamber; and (C) a plurality of additional substrate processing chambers, which are connected to the second substrate handling chamber, wherein a portion of the second robot is configured to extend into the plurality of additional substrate processing chambers to move substrates into and out of the plurality of additional substrate processing chambers, wherein the platform computer is remote from the plurality of additional substrate processing chambers and in electronic communication with them, wherein the memory of the platform computer also stores separate processing module software for operating each of the plurality of additional substrate processing chambers, and wherein the platform computer also uses signals for operating the plurality of additional substrate processing chambers based on data transmissions generated by the processing module software for the corresponding plurality of additional substrate processing chambers.

[0024] In addition to one or more of the above features, or as an alternative, a substrate processing system according to some examples of the present technology may also include a plurality of additional substrate processing chambers connected to the first substrate handling chamber, wherein a portion of the first robot is configured to extend into the plurality of additional substrate processing chambers to move substrates into and out of the plurality of additional substrate processing chambers, wherein a platform computer is remote from the plurality of additional substrate processing chambers and electronically communicates with them, wherein the memory of the platform computer also stores processing module software for operating each of the plurality of additional substrate processing chambers, and wherein the platform computer also transmits signals for operating the plurality of additional substrate processing chambers based on data transmissions generated by the processing module software for the corresponding plurality of additional substrate processing chambers.

[0025] According to some examples of the present technology, methods for operating a substrate processing system may include one or more of the following: (a) operating a first substrate processing chamber using first operating instructions generated by first processing module software stored in a memory on a platform computer, the platform computer being remote from the first substrate processing chamber and in electronic communication with it; (b) operating a second substrate processing chamber using second operating instructions generated by second processing module software stored in a memory on the platform computer, the platform computer being remote from the second substrate processing chamber and in electronic communication with it; (c) creating first replacement processing module software; (d) storing the first replacement processing module software in the memory of the platform computer; (e) replacing the first processing module software with the first replacement processing module software; and (f) operating the first substrate processing chamber using operating instructions generated by the first replacement processing module software stored in the memory on the platform computer.

[0026] In addition to one or more of the features described above, or as an alternative, methods according to some examples of the present technology may also include one or more of the following: (A) creating a second replacement processing module software; (B) storing the second replacement processing module software in a memory of the platform computer; (C) replacing the second processing module software with the second replacement processing module software; and (D) operating a second substrate processing chamber using operating instructions generated by the second replacement processing module software stored in a memory on the platform computer.

[0027] In addition to one or more of the features described above, or as an alternative, some example methods according to the present technology may also include one or more of the following: (A) creating a second replacement processing module software; (B) storing the second replacement processing module software in the memory of the platform computer; (C) replacing the first replacement processing module software with the second replacement processing module software; and (D) operating the first substrate processing chamber using operating instructions generated by the second replacement processing module software stored in the memory of the platform computer.

[0028] In addition to or instead of one or more of the features described above, in at least some examples of the present technology, the step of replacing the first processing module software with the first replacement processing module software occurs while the first substrate processing chamber is processing one or more substrates and without interrupting the processing of the one or more substrates.

[0029] In addition to or in lieu of one or more of the features described above, in at least some examples of the present technology, replacing the first process module software with the first replacement process module software occurs without shutting down operation of the first substrate processing chamber.

[0030] In addition to or as an alternative to one or more of the features described above, in at least some examples of the present technology, the first replacement processing module software includes a software upgrade from the first processing module software.

[0031] In addition to or in lieu of one or more of the features described above, methods according to some examples of the present technology may further include one or more of the following: (A) operating one or more additional substrate processing chambers using additional operating instructions generated by one or more additional processing module software components stored in memory on a platform computer, the platform computer being remote from and in electronic communication with the one or more additional substrate processing chambers; (B) creating an additional replacement processing module software component; (C) storing the additional replacement processing module software component in memory on the platform computer; (D) replacing one of the additional processing module software components with the additional replacement processing module software component; and (E) operating a particular additional substrate processing chamber associated with the additional processing module software component replaced by the additional replacement processing module software component using operating instructions generated by the additional replacement processing module software component stored in memory on the platform computer. One or more of these steps may occur without interrupting substrate processing and / or without shutting down operation of any substrate processing chambers.

[0032] The present invention is provided to introduce some concepts related to the present technology in a simplified form. These concepts will be further described in detail in the detailed description below. The present invention is not intended to identify the key features or essential features of the claimed subject matter, nor is it intended to be used to limit the scope of the claimed subject matter. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] These and other features, aspects and advantages of the invention disclosed herein are described below with reference to the accompanying drawings of certain embodiments, which are intended to illustrate and not to limit the invention.

[0034] Figures 1A to 1C Various views of a conventional cluster-type substrate processing system are shown having a separate dedicated computer for each substrate processing chamber;

[0035] FIG. 2A to FIG. 2C Various views of a cluster substrate processing system and method according to aspects of the present technique are shown, including virtual control of a substrate processing chamber from a platform computer;

[0036] Figure 3A and Figure 3B Features for replacing software components for operating a substrate processing chamber at a platform computer level in a substrate processing system and method according to aspects of the present technique are shown;

[0037] Figure 4 Generally illustrates the equipment and connections of a platform computer to a plurality of substrate processing chambers in a substrate processing system and method according to aspects of the present technique; and

[0038] Figure 5A schematic top view of a cluster-type substrate processing system and method according to additional aspects of the present technique is provided.

[0039] It should be understood that the elements in the drawings are shown for simplicity and clarity and are not necessarily drawn to scale and / or all details. For example, the relative sizes of some elements in the drawings may be exaggerated relative to other elements to help improve the understanding of the illustrated embodiments of the present disclosure. DETAILED DESCRIPTION

[0040] Reference will now be made to the drawings, wherein like reference numerals represent similar structural features or aspects of the subject disclosure.

[0041] As mentioned above, during the fabrication of semiconductor devices, such as integrated circuits and electronic devices, layers of material are typically deposited onto a substrate. Figure 2A A top view of a "cluster-type" substrate processing system 100 according to some examples of the present technology is schematically shown. The example substrate processing system 100 includes a substrate handling chamber 102, which is operably connected to one to four substrate processing chambers 104A-104D through gate valves 106. Each substrate processing chamber 104A-104D includes one or more substrate supports and is equipped to receive a substrate on a substrate support 108 and hold the substrate during processing (e.g., during deposition of a material layer as described above, during an etching process, etc.). Figure 2A Each substrate processing chamber 104A-104D is shown to include four substrate supports 108, onto which substrates may be placed during processing. More or fewer substrate supports 108 may be provided in each substrate processing chamber 104A-104D (e.g., the substrate processing chambers 104A-104D may be dual chamber modules (DCMs) or quad chamber modules (QCMs)). Substrate processing chambers 104A-104D according to some examples of the present technology may include an additional four substrate supports 108 located Figure 2A 1. The four substrate supports 108 are shown vertically below the top view of the substrate processing chambers 104A-104D. Each substrate processing chamber 104A-104D may have the same structure, or one or more substrate processing chambers 104A-104D may have a different structure than the other substrate processing chambers 104A-104D.

[0042] The substrate handling chamber 102 includes a robot 110 for moving substrates into and out of various substrate processing chambers 104A-104D through gate valves 106. In use, the gate valves 106 are opened, and the end effector 110A of the robot 110 extends through the open gate valves 106 to insert or remove a substrate from an interior chamber of the substrate processing chamber 104A-104D (e.g., placing a substrate on or removing a substrate from a substrate support 108 within the substrate processing chamber 104A-104D). Once the robot 110 is retracted from the substrate processing chamber 104A-104D, the gate valves 106 are closed, thereby sealing and isolating the substrate processing chamber 104A-104D from the substrate handling chamber 102. Other desired actions (e.g., material layer deposition, etching, etc.) may then be performed in the substrate processing chambers 104A-104D and / or the substrate handling chamber 102.

[0043] Figure 2A The example substrate processing system 100 is further shown to include a load lock module 112. The load lock module 112 is connected to the substrate handling chamber 102 through one or more gate valves 116. The load lock module 112 includes a substrate holding member 114 (e.g., a "positioning plate") for holding the substrate on its way into the substrate handling chamber 102 for further processing and on its way out of the substrate handling chamber 102 (after processing is completed). The end effector 110A of the robot 110 moves through the gate valve 116 (when open) to move the substrate from the load lock module 112 into the substrate handling chamber 102 (for layer deposition, etching and / or other processing), and from the substrate handling chamber 102 into the load lock module 112 (after processing is completed). The load lock module 112 and the gate valves 116 keep the substrate isolated from the environment of the substrate handling chamber 102 until the conditions (e.g., temperature, pressure, atmosphere content, etc.) within the substrate handling chamber 102 are ready for the insertion of the substrate, for example, while waiting for all gate valves 106 to close.

[0044] The load lock module 112 is further coupled to the equipment front end module 120 through one or more additional gate valves 118. The equipment front end module 120 includes a robot 122. The end effector 122A of the robot 122 moves through the gate valve 118 (when open) to move substrates from the equipment front end module 120 into the load lock module 112 (for layer deposition, etching, and / or other processing), and from the load lock module 112 into the equipment front end module 120 (after processing is completed). The robot 122 of the equipment front end module 120 also picks up a new substrate for processing from one of the load ports 124A-124D, and returns a processed substrate to one of the load ports 124A-124D, such as to be transported to another location for further processing or other actions.

[0045] Figures 2A-2CFeatures of the platform computer 200 according to some examples of the present technology are further illustrated. Figure 2A The platform computer 200 and its connection to the input / output ports 202A-202D respectively disposed on the substrate processing chambers 104A-104D are generally shown, and Figure 2B and 2C Additional details about these connections and architectures are shown. Figure 2A As shown, platform computer 200 is remote from substrate processing chambers 104A-104D, but is in electronic communication therewith via communication connections (e.g., cables 204A-204D, respectively). Figure 2A A platform computer 200 is shown housing the tool front end module 120, but it may be provided as part of one of the other components (e.g., with the substrate processing chamber 102, load lock module 112, etc.), and / or it may be provided as a separate stand-alone component or at a separate workstation.

[0046] The substrate processing system 100 and method according to aspects of the present technology eliminate those separate, individual dedicated computers 42A-42D and place (store) the process module software 220A-220D in the memory 222 provided in (or accessible by) the platform computer 200, rather than providing an individual dedicated computer 42A-42D for each substrate processing chamber 14A-14D, as described above in conjunction with Figures 1A-1C In addition, it is possible to eliminate Figures 1A-1C Instead of separate, individual dedicated computers 42A-42D, one or more (relatively simple and inexpensive) multi-port input / output devices 206A-206D associated with and located at each substrate processing chamber 104A-104D are supported, such as Figure 2B and 2C As shown. Platform computer 200 may include one or more microprocessors 224, one or more input / output ports 226 I / O (e.g., for wired and / or wireless communications), and / or other computer hardware and / or software components, and / or it may constitute a conventional computer of a type known and used in the art (and commercially available). In some examples of the present technology, platform computer 200 will include server-class hardware for operating commercial systems.

[0047] Thus, the substrate processing chambers 104A-104D in the substrate processing system 100 and method according to aspects of the present technique will not include a personal computer that stores and / or operates the process module software for controlling the operation of the substrate processing chambers 104A-104D. Instead, according to aspects of the present technique, the process module software 220A-220D for each substrate processing chamber 104A-104D will be provided in the platform computer 200. In addition, the platform computer 200 (remote from the substrate processing chambers 104A-104D, such as at the equipment front end module 120 or the load lock module 112) will process input data (e.g., from sensors and equipment in the substrate processing chambers 104A-104D and from other sources) and generate outputs (using the process module software 220A-220D) that are used to control the equipment in and associated with the substrate processing chambers 104A-104D. In this manner, the platform computer 200 and the process module software 220A-220D running thereon will virtually (and / or remotely) control the operation of the substrate processing chambers 104A-104D.

[0048] exist Figures 2A-2C In the illustrated example system and method, cables 204A-204D (e.g., Ethernet cables) or other suitable wired or wireless connections connect the platform computer 200 to input / output ports 202A-202D disposed at the substrate processing chambers 104A-104D, respectively. The input / output ports 202A-202D may be connected to input / output ports and / or may constitute input / output ports of corresponding multi-port input / output devices 206A-206D provided for each substrate processing chamber 104A-104D, respectively. The multi-port input / output devices 206A-206D may include an Ethernet switch (e.g., an 8-port Ethernet switch) or other devices capable of routing data and / or electronic signals between one component and another, such as between the platform computer 200 and one or more components disposed within individual substrate processing chambers 104A-104D (described below).

[0049] The multi-port input / output device 206A-206D of the illustrated example is also connected to: one or more pressure sensors 210 (e.g., for measuring the pressure in the interior chamber of the corresponding substrate processing chamber 104A-104D), one or more temperature sensors 212 (e.g., for measuring the temperature in the interior chamber of the corresponding substrate processing chamber 104A-104D), one or more motors 214 (e.g., for opening or closing the gate valve 106, for activating the vacuum pump, for operating the gas supply pump or gas source), and one or more heating elements 216 (e.g., for changing the temperature in the interior chamber of the corresponding substrate processing chamber 104A-104D). The multi-port input / output device 206A-206D can be connected to additional and / or other devices related to the corresponding substrate processing chamber 104A-104D.

[0050] use Figure 2C , the processing module software 220A-220D may be configured to receive data from and / or be associated with, send data to and / or operate on the corresponding substrate processing chambers 104A-104D and / or components associated with the corresponding substrate processing chambers 104A-104D. As some more specific examples, using Figure 2CThe connections and configurations shown: (a) the platform computer 200 (and the processing module software 220A-220D contained thereon) can send signals (e.g., data) via one of the cables 204A-204D, one of the input / output ports 202A-202D, and one of the multi-port input / output devices 206A-206D to control and / or operate any one or more of the pressure sensors 210, temperature sensors 212, motors 214, and / or heating elements 216 associated with the substrate processing chambers 104A-104D; and / or ( b) Any one or more of the pressure sensor 210, temperature sensor 212, motor 214, and / or heating element 216 associated with a single substrate processing chamber 104A-104D may send (transmit) signals (e.g., data) to the platform computer 200 via the multi-port input / output device 206A-206D, one of the input / output ports 202A-202D, and one of the cables 204A-204D (e.g., used by the processing module software 220A-220D associated with the substrate processing chamber 104A-104D that transmitted the signal). The signals (e.g., data) received by the platform computer 200 may be used by the corresponding processing module software 220A-220D to further control the equipment and equipment operations in the corresponding substrate processing chamber 104A-104D. Thus, in this illustrated example: (a) the processing module software 220A in the platform computer 200 is used to control the operation of the substrate processing chamber 104A; (b) the processing module software 220B in the platform computer 200 is used to control the operation of the substrate processing chamber 104B; (c) the processing module software 220C in the platform computer 200 is used to control the operation of the substrate processing chamber 104C; and (d) the processing module software 220D in the platform computer 200 is used to control the operation of the substrate processing chamber 104D.

[0051] By eliminating Figures 1A-1C separate, dedicated computers 42A-42D that support Figures 2A-2C A remote and virtual architecture of the type shown can achieve various advantages. For example, the cost of separate computers, software licenses, and support equipment within the substrate processing chambers 104A-104D can be reduced or eliminated. Figures 1A-1C The separate, individual dedicated computers 42A-42D also eliminate the need to maintain operating systems, anti-virus software and / or applications resident on those computers 42A-42D. In addition, providing the processing module software 220A-220D for the individual substrate processing chambers 104A-104D on the platform computer 200 preserves the advantages of eliminating Figures 1A-1C All necessary functionality provided by the computers 42A-42D in the platform computer 200 may be provided on reliable server-class hardware.

[0052] As Figures 2A-2C Among other potential advantages of the present technology of the type shown in , the ability to interact with processing module software 220A-220D at the platform computer 200 location can limit (or eliminate) delays that may occur due to platform bus bandwidth limitations, such as when a user needs to access or transfer relatively large log files (such as precursor valve open / close cycles during deposition using atomic layer deposition ("ALD") techniques), thereby improving the reliability of the substrate processing system 100.

[0053] Figure 3A and 3B Some example method features and aspects of the present technology are shown. Figure 3A and 3B Use with Figures 2A-2C Where the same figure numbers are used, the same or similar parts are referenced, and many repeated descriptions may be omitted.

[0054] Figure 3A The connection and operation of a substrate processing system (e.g., substrate processing system 100) according to some examples of the present technology are shown in a first time period. At this time: (a) the operating instructions generated (at least in part) by the processing module software 220A in the platform computer 200 are used to control the operation of the substrate processing chamber 104A; (b) the operating instructions generated (at least in part) by the processing module software 220B in the platform computer 200 are used to control the operation of the substrate processing chamber 104B; (c) the operating instructions generated (at least in part) by the processing module software 220C in the platform computer 200 are used to control the operation of the substrate processing chamber 104C; and (d) the operating instructions generated (at least in part) by the processing module software 220D in the platform computer 200 are used to control the operation of the substrate processing chamber 104D.

[0055] Eventually, it may be necessary to change at least a portion of the process module software 220A-220D for one of the substrate processing chambers 104A-104D. This may occur, for example, by applying an update to the process module software 220A-220D, performing a virus scan on the process module software 220A-220D, removing virus threats from the process module software 220A-220D, etc. Figure 3A As shown in the example of , a first "replacement" processing module software 300 can be created. The replacement processing module software 300 can be created directly on the platform computer 200, and / or can be introduced into the platform computer 200 (e.g., via an input / output port, such as from a downloaded file; from a USB drive, disk or other removable storage device, etc.). Figure 3AThe replacement processing module software 300 of the specific example is intended to replace all or only a portion of the code of the existing processing module software 220B (eg, to provide an "update" to one or more portions of the software code of the processing module software 220B).

[0056] Once created, the replacement processing module software 300 may be stored in the memory 222 of the platform computer 200. Such storage may occur simultaneously with replacing, deleting and / or overwriting at least some (optionally all) of the previous processing module software 220B in the memory 222 with the replacement processing module software 300. Figure 3B As shown: (a) the replacement process module software 300 located in the memory 222 of the platform computer 200 and / or (b) at least some portion (optionally all) of the previous process module software 220B may be moved to a "deleted items" area or cache 302 of the memory 222 (or simply completely deleted, overwritten and / or partially overwritten). Once the replacement process module software 300 is in place, the corresponding substrate processing chamber (in this particular example, the substrate processing chamber 104B) will be controlled and operated using (at least in part) the operating instructions generated by the replacement process module software 300 stored in the memory 222 of the platform computer 200.

[0057] For example, updates and / or replacements of the types of processing module software 220A-220D described above may occur multiple times (e.g., as often as desired) on the processing module software 220A-220D stored on the platform computer 200. For example, after the replacement processing module software 300 is stored and in active use on the platform computer 200, one or more additional “replacement” actions may occur on the replacement processing module software 300. Additionally or alternatively, one or more additional “replacement” actions may occur for the processing module software 220A, 220C, and / or 220D stored and in active use on the platform computer 200.

[0058] Advantageously, in at least some examples of the present technology, the above combined Figure 3A and 3B A replacement step of the type described may take place in the associated substrate processing chamber (in conjunction with Figure 3A and 3BThe example substrate processing chamber 104B in the depicted embodiment is processing one or more substrates without interrupting substrate processing anywhere in the substrate processing system 100 and / or without shutting down operation of the associated substrate processing chamber 104B. Avoiding the need to interrupt substrate processing anywhere in the substrate processing system 100 and / or avoiding the need to shut down operation of the associated substrate processing chamber 104B can have significant advantages because of the significant downtime and costs that may be involved in cooling down the substrate processing chamber 104B, making necessary replacements, reheating the substrate processing chamber, recalibrating and / or requalifying operation of the substrate processing chamber 104B, etc.

[0059] As some more specific examples of this technique, the replace action may be scheduled by the platform computer 200 to occur during a time period when the associated substrate processing chamber 104B is engaged in an activity that is expected to take more time than a software replacement / update (e.g., an atmosphere purge activity, a temperature ramp-up activity, a temperature ramp-down activity, etc.). Additionally or alternatively, the replace action may be scheduled by the platform computer 200 to occur during a time period when the associated substrate processing chamber 104B is between operational steps (e.g., waiting for one or more new substrates to be inserted into the substrate processing chamber 104, waiting for a substrate to be removed, when the substrate processing chamber 104B is inactive for any reason, etc.). Still additionally or alternatively, the "replace" action performed by the platform computer 200 may initiate a process to replace one active processing module software component (e.g., 220B) with another (e.g., 300) substantially on the fly. For example, the replacement action may include: (a) transferring any relevant data from the processing module software 220B to initialize the replacement processing module software 300 in the background (if necessary) when the processing module software 220B actively controls the substrate processing chamber 104B, and (b) after the replacement processing module software 300 is fully initialized, changing the processing calls, procedure calls, function calls, method calls, program calls, subroutine calls, routine calls, subroutine calls, etc. made by the platform computer 200 to call the replacement processing module software 300 instead of the previous processing module software 220B.

[0060] The above examples relate to a substrate processing system 100 that includes one substrate handling chamber 102 with up to four "cluster-type" substrate processing chambers 104A-104D. Other arrangements are possible. Figure 4 A diagram of a general purpose platform computer 200 and substrate processing system architecture according to some examples of the present technology is provided, wherein a single remote platform computer 200 includes processing module software for "N" substrate handling chambers (e.g., 104A to 104N), where N can be any desired number (e.g., from 1 to 12). Figure 4As shown, the connection and operation of an example substrate processing system according to the present technology may include: (A) using operating instructions generated (at least in part) by the processing module software 220A in the platform computer 200 to control the operation of the substrate processing chamber 104A (see data transmission arrow A), until (b) using operating instructions generated (at least in part) by the processing module software 220N in the platform computer 200 to control the operation of the substrate processing chamber 104N (see data transmission arrow N), each individual substrate processing chamber of the entire substrate processing system is operated by its own processing module software (e.g., 220A to 220N) provided by the platform computer 200. The processing module software 220A,...,220N may also, for example, receive data from its corresponding substrate processing chamber using the same data transmission system and connection. The individual substrate processing chambers 104A to 104N may include more detailed structures and / or features and / or the above in combination. Figures 2A-3B Operate in the manner described.

[0061] Figure 5 Schematically illustrates a top view of another example substrate processing system 400 (another “cluster” type semiconductor processing system) according to some examples of the present technology, such as Figure 4 , where "N" can be at least 6 or even as high as 8. The substrate processing system 400 can be of the type described in U.S. Provisional Patent Application No. 63 / 524,272, filed on June 30, 2023, entitled "Extended Substrate Processing Systems and Methods with Additional Processing Chamber Connectability." U.S. Provisional Patent Application No. 63 / 524,272 is incorporated herein by reference in its entirety. When Figure 5 Use in Figure 2A-4 When the same reference numeral is used in any one of the drawings, the same or similar parts are referenced, and many overlapping descriptions may be omitted.

[0062] Figure 5The illustrated substrate processing system 400 includes: (a) a first substrate handling chamber 402 (the "inside" substrate handling chamber) including a first robot 404 having an end effector 404A; (b) a first load lock module 410 (the "inside" load lock module) connected to one edge or face of the first substrate handling chamber 402; (c) a second load lock module 420 (the "outside" load lock module) connected to the opposite edge or face of the first substrate handling chamber 402; and (d) a second substrate handling chamber 430 (the "outside" substrate handling chamber) including a second robot 432 having an end effector 432A. The second load lock module 420 extends between and connects the first substrate handling chamber 402 and the second substrate handling chamber 430. The first load lock module 410 of this example is also connected to an equipment front end module 440, which includes a third robot 442 having an end effector 442A. The equipment front end module 440 may include or be connected to a nitrogen source for providing a nitrogen atmosphere within the equipment front end module 440. The equipment front end module 440 receives new substrates for processing into the substrate processing system 400 and discharges processed substrates from the substrate processing system 400 via one or more load ports 450A-450D (using a robot 442 to move substrates between the load ports 450A-450D and the first load lock module 410). Figure 5 Four load ports 450A-450D are shown in the example of FIG. 4 , but more or fewer load ports may be provided in other examples of the present technology.

[0063] Each of the first substrate handling chamber 402 and the second substrate handling chamber 430 is connected to (or can be connected to) a plurality of substrate processing chambers 460A-460F (two substrate processing chambers 460A and 460B are connected to the substrate handling chamber 402, and four substrate processing chambers 460C-460F are connected to the substrate handling chamber 430). The substrate is transferred to the substrate processing chambers 460A-460F, where one or more layers of material are deposited on the substrate surface and / or other desired substrate processing is performed. Figure 5 Each substrate processing chamber 460A-460F is shown to include four substrate supports 462, on which substrates can be placed during processing. More or fewer substrate supports 462 may be provided in each substrate processing chamber 460A-460F (e.g., the substrate processing chambers 460A-460F may be dual chamber modules (DCM) or quad chamber modules (QCM)). The substrate processing chambers 460A-460F according to some examples of the present technology may include an additional four substrate supports 462, which are located Figure 54. The four substrate supports 462 are shown in the top view of FIG. Each substrate processing chamber 460A-460F may have the same structure, or one or more substrate processing chambers 460A-460F may have a different structure than other substrate processing chambers 460A-460F that exist.

[0064] Each of the first substrate handling chamber 402 and the second substrate handling chamber 430 is connected to its corresponding substrate processing chamber 460A-460F through one or more gate valves 470. Although two gate valves 470 are shown to connect the substrate handling chambers 402, 430 to each of their corresponding substrate processing chambers 460A-460F, in other examples of the present technology, each substrate processing chamber 460A-460F may be provided with more or fewer gate valves 470. According to some examples of the present technology, the substrate processing chambers 460A-460F may be connected to their corresponding substrate handling chambers 402, 430 through two more gate valves 470, for example, located Figure 5 460F). When closed, the gate valves 470 sealably separate the substrate handling chambers 402, 430 from their corresponding substrate processing chambers 460A-460F (so that independent atmosphere conditions can be maintained in each chamber). When opened, the gate valves 470 provide openings (e.g., substrate transfer slots) through which the end effectors 404A, 432A of the robot arms 404, 432 can extend to move substrates into and out of the substrate processing chambers 460A-460F. The openings through the gate valves 470 are aligned with the substrate transfer slots provided in the substrate processing chambers 460A-460F and the substrate handling chambers 402, 430 so that the substrates can be moved between the substrate processing chambers 460A-460F and the substrate handling chambers 402, 430 through the gate valves 470. Each gate valve 470 can have the same structure, or one or more gate valves 470 can have a different structure than the other gate valves 470.

[0065] One face of the first load lock module 410 is provided with one or more gate valves 480A ( Figure 5 Two are shown in the figure) are connected to the equipment front end module 440, and the opposite side of the first load lock module 410 is connected through one or more gate valves 480B ( Figure 5 The first load lock module 410 also includes one or more substrate supports 412 (two are shown in FIG. 1 ). Figure 5The gate valves 480A, 480B are used to hold substrates while they are waiting to be moved into the equipment front end module 440 or the first substrate handling chamber 402. When closed, the gate valves 480A, 480B sealably separate the load lock module 410 from the equipment front end module 440 and the substrate handling chamber 402 (so that independent atmosphere conditions can be maintained in each chamber). When opened, the gate valve 480A provides an opening (e.g., a substrate transfer slot) through which the end effector 442A of the robot 442 can extend to move substrates into and out of the equipment front end module 440. The opening through the gate valve 480A is aligned with the substrate transfer slot provided in the equipment front end module 440 and the first load lock module 410 so that the substrate can be moved between the equipment front end module 440 and the first load lock module 410 through the gate valve 480A. When open, the gate valve 480B provides an opening (e.g., a substrate transfer slot) through which the end effector 404A of the robot 404 can extend to move substrates into and out of the substrate handling chamber 402. The opening through the gate valve 480B is aligned with the substrate transfer slot provided in the substrate handling chamber 402 and the first load lock module 410 to enable the substrate to be moved between the substrate handling chamber 402 and the first load lock module 410 through the gate valve 480B. Each gate valve 480A, 480B can have the same structure, or one or more gate valves 480A, 480B can have a different structure than the other gate valves 470, 480A, 480B.

[0066] exist Figure 5 In the substrate processing system 400, one side of the second load lock module 420 is connected by one or more gate valves 490A ( Figure 5 Two are shown in FIG. 4 ) are connected to the first substrate handling chamber 402, and the opposite side of the second load lock module 420 is connected to the first substrate handling chamber 402 through one or more gate valves 490B ( Figure 5 The second load lock module 420 also includes one or more substrate supports 422 (two are shown in FIG. 1 ). Figure 5The gate valves 490A, 490B are used to hold substrates while they are waiting to be moved between the two substrate handling chambers 402, 430. When closed, the gate valves 490A, 490B sealably separate the second load lock module 420 from the two substrate handling chambers 402, 430 (so that independent atmosphere conditions can be maintained in each chamber). When open, the gate valve 490A provides an opening (e.g., a substrate transfer slot) through which the end effector 404A of the robot 404 can extend to move substrates into and out of the first substrate handling chamber 402. The opening through the gate valve 490A is aligned with the substrate transfer slot provided in the first substrate handling chamber 402 and the second load lock module 420 so that the substrate can be moved between the substrate handling chamber 402 and the second load lock module 420 through the gate valve 490A. When opened, the gate valve 490B provides an opening (e.g., a substrate transfer slot) through which the end effector 432A of the robot 432 can extend to move a substrate into and out of the second substrate handling chamber 430. The opening through the gate valve 490B is aligned with a substrate transfer slot provided in the second substrate handling chamber 430 and the second load lock module 420 so that the substrate can be moved between the second substrate handling chamber 430 and the second load lock module 420 through the gate valve 490B. Each of the gate valves 490A, 490B can have the same structure, or one or more of the gate valves 490A, 490B can have a different structure than the other gate valves 490A, 490B. The gate valves 490A and / or 490B can also have the same or different structure than the gate valves 470, 480A, and / or 480B.

[0067] The first load lock module 410 can have the same structure as the second load lock module 420, and / or the first and second load lock modules 410, 420 can be interchangeable (e.g., such that the load lock modules 410, 420 can switch positions and / or have a modular structure). In other examples, the first load lock module 410 and the second load lock module 420 can have different structures and / or be non-interchangeable (e.g., such that the load lock modules 410, 420 cannot switch positions in the substrate processing system 400). Either or both of the load lock modules 410, 420 can be a multi-station cooling type and / or a path-through type.

[0068] like Figure 5 As shown by the dashed lines in FIG. 4 , the two smaller faces of the first substrate handling chamber 402 may be equipped with at least one substrate transfer slot 252. When present, the substrate transfer slot 252 may be sealed (e.g., by a removable sealing plate) at Figure 5In the illustrated type of substrate processing system 400 arrangement, there are no substrate processing chambers 460 attached to those faces. The substrate transfer slots 252 in these faces may also be smaller than the corresponding slots in other faces of the first substrate handling chamber 402 and / or the second substrate handling chamber 430 (although in all examples of the present technology, the transfer slots 252 need not be smaller). Therefore, if desired, these smaller faces can be connected to substrate processing chambers (optionally, smaller substrate processing chambers) through additional gate valves.

[0069] Figure 5 The example substrate processing system 400 is also shown to include a platform computer 200, such as the one described above in conjunction with Figure 2A-4 The type described includes process module software 220A-220F for each substrate processing chamber 460A-460F. Figure 5 The platform computer 200 is generally shown and its connection to the input / output ports 202A-202F disposed on the substrate processing chambers 460A-460F, respectively. Figure 5 As shown, platform computer 200 is remote from substrate processing chambers 460A-460F but is in electronic communication therewith via communication connections (e.g., cables 204A-204F, respectively, such as Ethernet cables). Figure 5 The platform computer 200 is shown housing an equipment front end module 440, but it may be provided as part of one of the other components (e.g., with one of the substrate processing chambers 402, 430, one of the load lock modules 410, 420, etc.), and / or it may be provided as a separate stand-alone component or at a separate workstation.

[0070] exist Figure 5 In the illustrated example system and method, cables 204A-204F (e.g., Ethernet cables) or other suitable wired or wireless connections connect the platform computer 200 to input / output ports 202A-202F provided at the substrate processing chambers 460A-460F, respectively. The input / output ports 202A-202F can be connected to input / output ports and / or can constitute input / output ports of corresponding multi-port input / output devices provided for each substrate processing chamber 460A-460F, respectively. The multi-port input / output devices included in the substrate processing chambers 460A-460F can be combined with the above Figure 2A-4 The multi-port input / output devices 206A-206D described herein may be constructed and / or function in any manner. As some more specific examples, Figure 5The multi-port input / output devices 206A-206F included in the substrate processing chambers 460A-460F may include an Ethernet switch (e.g., an 8-port Ethernet switch) or other devices capable of routing data and / or electronic signals between one component and another, such as between the platform computer 200 and one or more components disposed within the individual substrate processing chambers 460A-460F. Figure 5 The configuration and architecture of the substrate processing system 400 eliminates the need for separate dedicated computers in the substrate processing chambers 460A-460F (and thus can provide the above reference Figures 2A-3B some or all of the advantages described).

[0071] In other examples of the present technology, when one or two additional substrate processing chambers are provided at the substrate transfer slot 252 of the substrate handling chamber 402, additional processing module software (e.g., similar to 220A) can be provided in the platform computer 200 for operating those additional substrate processing chambers. More specifically, in such a system, Figure 4 The "N" in may be equal to 7 or 8. When present, the additional substrate processing chamber at the substrate transfer slot 252 may have the same connections and structures as the other substrate processing chambers 104A-104D, 460A-460F described above (e.g., input / output ports similar to port 202A, multi-port input / output devices similar to 206A, cables or other connections similar to 204A, etc.).

[0072] Although the present disclosure has been provided in the context of certain embodiments and examples, it will be understood by those skilled in the art that the present disclosure extends to other alternative embodiments and / or uses of embodiments beyond the specifically described embodiments and obvious modifications and equivalents thereof. In addition, although various variations of the embodiments of the present disclosure have been shown and described in detail, other modifications within the scope of the present disclosure will be apparent to those skilled in the art based on the present disclosure. It is also contemplated that various combinations or sub-combinations of the specific features and aspects of the embodiments may be made and still fall within the scope of the present disclosure. It should be understood that the various features and aspects of the disclosed embodiments may be combined or replaced with one another to form different modes of embodiments of the present disclosure. Therefore, the scope of the present disclosure should not be limited by the specific embodiments described above.

[0073] The headings provided herein, if any, are for convenience only and do not necessarily affect the scope or meaning of the apparatus and methods disclosed herein.

Claims

1. A substrate processing system, comprising: A first substrate handling chamber including a first robot arm; a first substrate processing chamber coupled to the first substrate handling chamber via a first gate valve, wherein a portion of the first robot arm is configured to extend through the first gate valve and enter the first substrate processing chamber to move a substrate into and out of the first substrate processing chamber; a second substrate processing chamber coupled to the first substrate handling chamber via a second gate valve, wherein a portion of the first robot arm is configured to extend through the second gate valve and enter the second substrate processing chamber to move a substrate into and out of the second substrate processing chamber; as well as A platform computer is remote from a first substrate processing chamber and a second substrate processing chamber and is in electronic communication therewith, the platform computer: (a) including a memory storing first processing module software for operating the first substrate processing chamber and second processing module software for operating the second substrate processing chamber, (b) signals for operating the first substrate processing chamber based on data transmissions generated by the first processing module software, and (c) signals for operating the second substrate processing chamber based on data transmissions generated by the second processing module software.

2. The substrate processing system according to claim 1, further comprising: A third substrate processing chamber is connected to the first substrate handling chamber via a third gate valve, wherein the portion of the first robot arm is configured to extend through the third gate valve and enter the third substrate processing chamber to move the substrate into and out of the third substrate processing chamber, wherein the platform computer is remote from the third substrate processing chamber and electronically communicates with it, wherein the memory of the platform computer also stores third processing module software for operating the third substrate processing chamber, and wherein the platform computer is also used to operate signals for the third substrate processing chamber based on data transmission generated by the third processing module software.

3. The substrate processing system according to claim 2, further comprising: A fourth substrate processing chamber connected to the first substrate handling chamber via a fourth gate valve, wherein the portion of the first robot arm is configured to extend through the fourth gate valve and enter the fourth substrate processing chamber to move substrates into and out of the fourth substrate processing chamber, wherein the platform computer is remote from the fourth substrate processing chamber and in electronic communication with the fourth substrate processing chamber, wherein the memory of the platform computer also stores fourth processing module software for operating the fourth substrate processing chamber, and wherein the platform computer also transmits signals for operating the fourth substrate processing chamber based on data transmission generated by the fourth processing module software.

4. The substrate processing system according to claim 3, further comprising: a second substrate handling chamber, comprising a second robotic arm; as well as A fifth substrate processing chamber is connected to the second substrate handling chamber via a fifth gate valve, wherein a portion of the second robot arm is configured to extend through the fifth gate valve and enter the fifth substrate processing chamber to move the substrate into and out of the fifth substrate processing chamber, wherein the platform computer is remote from the fifth substrate processing chamber and electronically communicates with it, wherein the memory of the platform computer also stores fifth processing module software for operating the fifth substrate processing chamber, and wherein the platform computer also transmits signals for operating the fifth substrate processing chamber based on data transmission generated by the fifth processing module software.

5. The substrate processing system according to claim 4, further comprising: A sixth substrate processing chamber connected to the second substrate handling chamber via a sixth gate valve, wherein the portion of the second robot arm is configured to extend through the sixth gate valve and enter the sixth substrate processing chamber to move substrates into and out of the sixth substrate processing chamber, wherein the platform computer is remote from the sixth substrate processing chamber and in electronic communication with the sixth substrate processing chamber, wherein the memory of the platform computer also stores a sixth processing module software for operating the sixth substrate processing chamber, and wherein the platform computer also transmits signals for operating the sixth substrate processing chamber based on data transmission generated by the sixth processing module software.

6. The substrate processing system according to claim 4, further comprising: A load lock module connects the first substrate handling chamber and the second substrate handling chamber, wherein the load lock module is configured to hold a substrate moving between the first substrate handling chamber and the second substrate handling chamber.

7. The substrate processing system according to claim 1, further comprising: a second substrate handling chamber, comprising a second robotic arm; as well as A third substrate processing chamber is connected to the second substrate handling chamber via a third gate valve, wherein a portion of the second robot arm is configured to extend through the third gate valve and enter the third substrate processing chamber to move the substrate into and out of the third substrate processing chamber, wherein the platform computer is remote from the third substrate processing chamber and electronically communicates with it, wherein the memory of the platform computer also stores third processing module software for operating the third substrate processing chamber, and wherein the platform computer is also used to operate signals for the third substrate processing chamber based on data transmission generated by the third processing module software.

8. The substrate processing system according to claim 7, further comprising: A load lock module connects the first substrate handling chamber and the second substrate handling chamber, wherein the load lock module is configured to hold a substrate moving between the first substrate handling chamber and the second substrate handling chamber.

9. A substrate processing system comprising: A first substrate handling chamber including a first robot arm; a first substrate processing chamber coupled to the first substrate handling chamber via a first gate valve, wherein a portion of the first robot arm is configured to extend through the first gate valve and enter the first substrate processing chamber to move a substrate into and out of the first substrate processing chamber; a second substrate processing chamber coupled to the first substrate handling chamber via a second gate valve, wherein a portion of the first robot arm is configured to extend through the second gate valve and enter the second substrate processing chamber to move a substrate into and out of the second substrate processing chamber; a front end module configured to receive an unprocessed substrate for processing and to hold a processed substrate prior to removal from the substrate processing system; a first load lock module connecting the front end module and the first substrate handling chamber, wherein the first load lock module is configured to hold a substrate moving between the front end module and the first substrate handling chamber; and A platform computer is provided with a front-end module or a first load lock module, the platform computer is remote from a first substrate processing chamber and a second substrate processing chamber and is in electronic communication therewith, the platform computer: (a) includes a memory storing a first processing module software for operating the first substrate processing chamber and a second processing module software for operating the second substrate processing chamber, (b) signals for operating the first substrate processing chamber based on data transmission generated by the first processing module software, and (c) signals for operating the second substrate processing chamber based on data transmission generated by the second processing module software.

10. The substrate processing system according to claim 9, further comprising: a second substrate handling chamber, comprising a second robotic arm; a second load lock module connecting the first substrate handling chamber and the second substrate handling chamber, wherein the second load lock module is configured to hold a substrate moving between the first substrate handling chamber and the second substrate handling chamber; as well as A third substrate processing chamber is connected to the second substrate handling chamber via a third gate valve, wherein a portion of the second robot arm is configured to extend through the third gate valve and enter the third substrate processing chamber to move the substrate into and out of the third substrate processing chamber, wherein the platform computer is remote from the third substrate processing chamber and electronically communicates with it, wherein the memory of the platform computer also stores third processing module software for operating the third substrate processing chamber, and wherein the platform computer is also used to operate signals for the third substrate processing chamber based on data transmission generated by the third processing module software.

11. The substrate processing system according to claim 9, further comprising: a second substrate handling chamber, comprising a second robotic arm; a second load lock module connecting the first substrate handling chamber and the second substrate handling chamber, wherein the second load lock module is configured to hold a substrate moving between the first substrate handling chamber and the second substrate handling chamber; as well as A plurality of additional substrate processing chambers are coupled to the second substrate handling chamber, wherein a portion of the second robot arm is configured to extend into the plurality of additional substrate processing chambers to move substrates into and out of the plurality of additional substrate processing chambers, wherein the platform computer is remote from and in electronic communication with the plurality of additional substrate processing chambers, wherein the memory of the platform computer also stores processing module software for operating each of the plurality of additional substrate processing chambers, and wherein the platform computer also transmits signals for operating the plurality of additional substrate processing chambers based on data transmissions generated by the processing module software for the plurality of additional substrate processing chambers.

12. The substrate processing system according to claim 9, further comprising: a second substrate handling chamber, comprising a second robotic arm; a second load lock module connecting the first substrate handling chamber and the second substrate handling chamber, wherein the second load lock module is configured to hold a substrate moving between the first substrate handling chamber and the second substrate handling chamber; as well as A plurality of additional substrate processing chambers are coupled to the second substrate handling chamber, wherein a portion of the second robot arm is configured to extend into the plurality of additional substrate processing chambers to move substrates into and out of the plurality of additional substrate processing chambers, wherein the platform computer is remote from and in electronic communication with the plurality of additional substrate processing chambers, wherein the memory of the platform computer also stores separate process module software for operating each of the plurality of additional substrate processing chambers, and wherein the platform computer also transmits signals for operating the plurality of additional substrate processing chambers based on data transmissions generated by the process module software for the corresponding plurality of additional substrate processing chambers.

13. The substrate processing system according to claim 9, further comprising: A plurality of additional substrate processing chambers are coupled to the first substrate handling chamber, wherein the portion of the first robot is configured to extend into the plurality of additional substrate processing chambers to move substrates into and out of the plurality of additional substrate processing chambers, wherein the platform computer is remote from and in electronic communication with the plurality of additional substrate processing chambers, wherein the memory of the platform computer also stores processing module software for operating each of the plurality of additional substrate processing chambers, and wherein the platform computer also transmits signals for operating the plurality of additional substrate processing chambers based on data transmissions generated by the processing module software for the corresponding plurality of additional substrate processing chambers.

14. A method of operating a substrate processing system, the method comprising: operating a first substrate processing chamber using first operating instructions generated by first process module software stored in memory on a platform computer remote from and in electronic communication with the first substrate processing chamber; operating a second substrate processing chamber using second operating instructions generated by second process module software stored in memory on a platform computer remote from and in electronic communication with the second substrate processing chamber; creating a first replacement processing module software; storing the first replacement processing module software in a memory of the platform computer; replacing the first processing module software with the first replacement processing module software; as well as The first substrate processing chamber is operated using operating instructions generated by first replacement process module software stored in memory on the platform computer.

15. The method according to claim 14, further comprising: creating a second replacement processing module software; storing second replacement processing module software in a memory of the platform computer; replacing the second processing module software with a second replacement processing module software; as well as The second substrate processing chamber is operated using operating instructions generated by second replacement process module software stored in memory on the platform computer.

16. The method according to claim 14, further comprising: creating a second replacement processing module software; storing second replacement processing module software in a memory of the platform computer; replacing the first replacement processing module software with a second replacement processing module software; as well as The first substrate processing chamber is operated using operating instructions generated by second replacement process module software stored in the memory of the platform computer.

17. The method according to claim 14, wherein: The step of replacing the first process module software with the first replacement process module software occurs while the first substrate processing chamber is processing one or more substrates and without interrupting the processing of the one or more substrates.

18. The method according to claim 14, wherein: The step of replacing the first process module software with the first replacement process module software occurs without shutting down operation of the first substrate processing chamber.

19. The method according to claim 14, wherein: The first replacement processing module software comprises a software upgrade from the first processing module software.

20. The method of claim 14, further comprising: operating one or more additional substrate processing chambers using additional operating instructions generated by one or more additional processing module software components stored in memory on the platform computer, the platform computer being remote from and in electronic communication with the one or more additional substrate processing chambers; creating an additional replacement processing module software component; storing the additional replacement processing module software component in a memory of the platform computer; replacing one of the additional processing module software components with the additional replacement processing module software component; and The operating instructions generated by the additional replacement process module software component stored in memory on the platform computer are used to operate the particular additional substrate processing chamber associated with the additional process module software component replaced by the additional replacement process module software component.

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