Method and system for evaluating bearing characteristic of power transmission line fitting in extreme environment

Abstract

The invention relates to a bearing characteristic evaluation method and system for a power transmission line fitting in an extreme environment. The method comprises the steps of collecting a real fitting three-dimensional model of a real fitting image in an environment where the power transmission line fitting is located; comparing the real hardware fitting three-dimensional model with the reference hardware fitting three-dimensional model to obtain a defect position on the real hardware fitting three-dimensional model; counting and classifying defect positions; creating a generation environment parameter of the standard defect position; the generated environment parameters are superposed on the simulated hardware fitting three-dimensional model, and a deformed hardware fitting three-dimensional model is obtained; and comparing the three-dimensional model of the simulated hardware fitting with the three-dimensional model of the deformed hardware fitting, and determining the bearing capacity on the three-dimensional model of the simulated hardware fitting. According to the method and the system for evaluating the bearing characteristic of the power transmission line fitting in the extreme environment, the bearing characteristic of the power transmission line fitting in a complex environment can be evaluated in a mode of combining simulation with comparison.

Description

Technical Field

[0001] The present application relates to the technical field, and in particular to a method and system for evaluating the load-bearing characteristics of power transmission line fittings in extreme environments. Background Art

[0002] As an important component connecting transmission lines and towers, transmission line fittings play a vital role in the safe and stable operation of overhead transmission lines. The failure of any fitting will cause the transmission line to fall, which will affect the entire power grid system. With the further intensification of the El Nino and La Nina phenomena, the service environment of transmission line fittings has deteriorated, and the requirements for fittings have also been further increased.

[0003] Therefore, it is urgent to propose an effective method to evaluate the load-bearing characteristics of hardware in complex environments. When transmission line hardware is impacted, it will show strong geometric nonlinearity and material nonlinearity. Conventional solutions are difficult to effectively simulate the movement process of hardware. Finite element simulation methods can handle nonlinear problems in complex situations very well and can efficiently calculate the impact of complex loads and working conditions on hardware in real environments; however, simple finite element simulation has high computational costs, complex modeling, and limited ability to handle nonlinear problems, and has certain limitations. Summary of the invention

[0004] The present application provides a method and system for evaluating the load-bearing characteristics of transmission line fittings in extreme environments, which can evaluate the load-bearing characteristics of transmission line fittings in complex environments by combining simulation and comparison.

[0005] The above-mentioned purpose of the present application is achieved through the following technical solutions: In a first aspect, the present application provides a method for evaluating the load-bearing characteristics of transmission line fittings in extreme environments, comprising: Collect real hardware 3D models of real hardware images in the environment where the power transmission line hardware is located, and the number of real hardware 3D models is the same as the number of target hardware and corresponds one to one; Compare the real hardware 3D model with the reference hardware 3D model and obtain the defect position on the real hardware 3D model; Count and classify the defect positions to obtain standard defect positions and random defect positions; Create standard defect location generation environment parameters; The generated environmental parameters are superimposed on the simulated hardware three-dimensional model to obtain the deformed hardware three-dimensional model; The simulated hardware 3D model and the deformed hardware 3D model are compared to determine the load-bearing capacity on the simulated hardware 3D model, which includes the deformation position and deformation amount.

[0006] In a possible implementation manner of the first aspect, creating generation environment parameters for a standard defect position includes: Determine the stress points on the three-dimensional model of the simulated hardware and the potential stress direction at each stress point; Simulate based on the stress points and the potential stress direction at each stress point to obtain the reference defect position, and apply force in the potential stress direction during the simulation; Compare the reference defect position and the standard defect position and determine the simulation direction until the difference between the reference defect position and the standard defect position is within the allowable range; The force points and the actual force direction and force value at each force point are used as generation environment parameters.

[0007] In a possible implementation manner of the first aspect, simulating based on the force points and the potential force direction at each force point includes: Randomly select a force point and a potential force direction belonging to the force point on the three-dimensional model of the hardware; Assigning a force value to the potential force direction and determining a deformation amount attributable to the force value; Calculate the correlation between the deformation variable and the standard defect position; A sub-generation environment parameter is determined according to the association relationship, and a sub-generation environment parameter includes a force point, a potential force direction and a force value.

[0008] In a possible implementation manner of the first aspect, when the deformation amount is associated with the standard defect position, the method further includes: Determine the influence of potential force direction change or force value change on the correlation between deformation variable and standard defect position; Draw an influence change curve belonging to the influence degree and determine the change speed of the influence change curve; When the change speed of the influence change curve is less than or equal to the set change speed, the change of the potential force direction or force value is stopped.

[0009] In a possible implementation manner of the first aspect, comparing the reference defect position and the standard defect position and determining the simulation direction includes: Transfer the reference defect position and the standard defect position into the same coordinate system; Create analysis surfaces based on reference defect locations; Calculate the changing trend of reference defect position and standard defect position on the analysis surface; When the changing trends of the reference defect position on the analysis surface and the standard defect position on the analysis surface are the largest, the analysis surface is taken as the surface where the force direction is located.

[0010] In a possible implementation of the first aspect, when the analysis plane is created for the first time based on the reference defect position, adjacent analysis planes are arranged in parallel; When multiple analysis surfaces can be used as simulation directions, it also includes: Randomly rotate the analysis surface so that the variation trend of the reference defect position belonging to the rotated analysis surface is maximized; Select the analysis surface with the largest change trend among multiple analysis surfaces as the simulation direction; When the analysis plane is rotated, a plurality of analysis planes are provided with reference lines or reference areas.

[0011] In a second aspect, the present application provides a device for evaluating the load-bearing characteristics of transmission line fittings in extreme environments, comprising: The first three-dimensional model creation unit is used to collect real hardware three-dimensional models of real hardware images in the environment where the power transmission line hardware is located, and the number of real hardware three-dimensional models is the same as the number of object hardware and corresponds one to one; The first processing unit is used to compare the real hardware three-dimensional model with the reference hardware three-dimensional model and obtain the defect position on the real hardware three-dimensional model; A statistics and classification unit is used to count and classify defect positions to obtain standard defect positions and random defect positions; An environmental parameter generation unit, used to create environmental parameters for standard defect locations; The second processing unit is used to superimpose the generated environmental parameters on the simulated hardware three-dimensional model to obtain the deformed hardware three-dimensional model; The third processing unit is used to compare the simulated hardware three-dimensional model with the deformed hardware three-dimensional model to determine the load-bearing capacity of the simulated hardware three-dimensional model, where the load-bearing capacity includes the deformation position and the deformation amount.

[0012] In a third aspect, the present application provides a system for evaluating the load-bearing characteristics of transmission line fittings in extreme environments, the system comprising: one or more memories for storing instructions; and One or more processors, used to call and run the instructions from the memory to execute the method as described in the first aspect and any possible implementation of the first aspect.

[0013] In a fourth aspect, the present application provides a computer-readable storage medium, the computer-readable storage medium comprising: Program, when the program is executed by a processor, the method described in the first aspect and any possible implementation of the first aspect is executed.

[0014] In a fifth aspect, the present application provides a computer program product, comprising program instructions. When the program instructions are executed by a computing device, the method described in the first aspect and any possible implementation of the first aspect is executed.

[0015] In a sixth aspect, the present application provides a chip system, which includes a processor for implementing the functions involved in the above aspects, for example, generating, receiving, sending, or processing the data and / or information involved in the above methods.

[0016] The chip system may be composed of chips, or may include chips and other discrete devices.

[0017] In a possible design, the chip system also includes a memory, which is used to store necessary program instructions and data. The processor and the memory can be decoupled and respectively set on different devices, connected by wired or wireless means, or the processor and the memory can also be coupled on the same device. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 This is a schematic diagram of the steps of a load-bearing characteristic evaluation method provided in this application.

[0019] Figure 2 This is a schematic diagram of a finite element analysis of an electrical fitting provided in this application.

[0020] Figure 3 This is another schematic diagram of finite element analysis of electrical fittings provided by the present application.

[0021] Figure 4 This is a schematic diagram of the principle of obtaining a reference defect position provided by the present application.

[0022] Figure 5 This is a schematic diagram of an influence degree change curve obtained based on numerical adjustment provided by the present application.

[0023] Figure 6 This is a schematic diagram of an influence degree change curve obtained based on direction adjustment provided by the present application. DETAILED DESCRIPTION

[0024] The technical solution in this application is further described in detail below in conjunction with the accompanying drawings.

[0025] This application discloses a method for evaluating the load-bearing characteristics of power transmission line fittings in extreme environments. Figure 1 In some examples, the method for evaluating the load-bearing characteristics of power transmission line fittings in extreme environments disclosed in this application includes the following: S101, collecting real hardware three-dimensional models of real hardware images in the environment where the power transmission line hardware is located, the number of real hardware three-dimensional models is the same as the number of target hardware and corresponds one to one; S102, comparing the real hardware 3D model with the reference hardware 3D model and obtaining the defect position on the real hardware 3D model; S103, counting and classifying the defect positions to obtain standard defect positions and random defect positions; S104, creating generation environment parameters of standard defect positions; S105, superimposing the generated environmental parameters onto the simulated hardware three-dimensional model to obtain a deformed hardware three-dimensional model; S106, comparing the simulated hardware three-dimensional model and the deformed hardware three-dimensional model, and determining the load-bearing capacity of the simulated hardware three-dimensional model, where the load-bearing capacity includes the deformation position and the deformation amount.

[0026] In general, in step S101, it is necessary to first collect the real hardware three-dimensional model of the real hardware image of the transmission line hardware in the environment where the transmission line hardware is located. The transmission line hardware here refers to the transmission line hardware used in the real environment, and its shape has changed, which is the so-called deformation.

[0027] Next, in step S102, the real fitting 3D model is compared with the reference fitting 3D model to obtain the defect positions on the real fitting 3D model. The reference fitting 3D model refers to a 3D model established using unused transmission line fittings.

[0028] exist Figure 2 and Figure 3 The defect location is indicated in the figure. There are two types of defect location: color and shape. Figure 2 and Figure 3 The defect location is not obvious, so text is used for assistance. However, the defect location here is only for representation and is not used as the actual defect location.

[0029] By comparing, the defect position on the real hardware 3D model can be determined. In the present application, the defect position refers to the part on the real hardware 3D model that cannot overlap with the reference hardware 3D model.

[0030] In addition, the three-dimensional model of the real hardware is generally created by three-dimensional scanning, and the three-dimensional model of the reference hardware can be created by three-dimensional scanning, or the three-dimensional drawings of the transmission line hardware during the design process can be called as the reference hardware three-dimensional model.

[0031] In step S103, the defect positions are counted and classified. The purpose of the statistics and classification is to obtain standard defect positions and random defect positions. There are two ways to evaluate the standard defect positions and random defect positions. The first is to determine whether the ratio of the number of occurrences to the number of real hardware three-dimensional models is greater than a set ratio value, and the second is to determine whether the number of occurrences is greater than a set quantity value.

[0032] The purpose of obtaining the standard defect position and the random defect position is to determine whether the defect will definitely or with a high probability occur. This is because the problem to be solved in this application is the load-bearing characteristics of transmission line fittings under extreme environments. When analyzing the load-bearing characteristics, it is necessary to first determine the standard defect position and then conduct targeted analysis on the standard defect position.

[0033] In step S104 and step S105, generation environment parameters belonging to the standard defect position are created, and then the generation environment parameters are superimposed on the simulated hardware three-dimensional model to obtain the deformed hardware three-dimensional model. Finally, in step S106, the simulated hardware three-dimensional model and the deformed hardware three-dimensional model are compared to determine the load-bearing capacity of the simulated hardware three-dimensional model, which includes the deformation position and the deformation amount.

[0034] The simulated hardware 3D model here refers to the newly designed electrical hardware that has not yet been put into use. Compared with the electrical hardware corresponding to the real hardware 3D model mentioned in the previous article, the electrical hardware that has not been put into use has changed in local structure and internal characteristics. However, without investigation in the real environment, it is impossible to determine the actual performance of the changes in local structure and internal characteristics in the real environment.

[0035] In the process of superimposing the generated environmental parameters onto the three-dimensional model of the simulated hardware, the generated environmental parameters can also be grouped according to time, such as three-year group, five-year group, etc. The generated environmental parameters can also be artificially amplified to simulate the load-bearing characteristics under extreme environments.

[0036] In some examples, the specific method of creating the generation environment parameters of the standard defect location is as follows: S201, determining the stress points on the simulated hardware three-dimensional model and the potential stress direction at each stress point; S202, performing simulation based on the force points and the potential force direction at each force point to obtain a reference defect position, and applying force in the potential force direction during the simulation; S203, comparing the reference defect position and the standard defect position and determining the simulation direction until the phase difference between the reference defect position and the standard defect position is within an allowable range; S204, using the force points and the actual force direction and force value at each force point as generation environment parameters.

[0037] See also Figure 4 In step S201 to step S204, the simulated hardware three-dimensional model ( Figure 3 The stress points on the standard defect position (indicated by a straight line) and the potential stress direction at each stress point are generally considered to be Figure 4 The middle position or middle position area of ​​the defect (represented by a solid line curve) is then determined, and the potential force direction at the force point is generally in the opposite direction of the defect.

[0038] Then, simulation is performed based on the stress points and the potential stress direction at each stress point to obtain the reference defect position ( Figure 4 Indicated by a dotted curve in the figure), force is applied in the potential force direction during the simulation. Of course, the reference defect position and the standard defect position cannot be completely consistent at this time. This is because the force points are simplified in this application, and in actual usage scenarios, there are multiple force points.

[0039] Therefore, it is necessary to compare the reference defect position and the standard defect position and determine the simulation direction until the difference between the reference defect position and the standard defect position is within the allowable range. Here, a certain tolerance is given to the actual force direction of the force point and each force point.

[0040] In some possible implementations, it is also possible to use a processing method of dividing the partial surface corresponding to the reference defect position, that is, dividing the partial surface corresponding to the reference defect position into multiple independent surfaces, and then performing separate calculations on the force point, actual force direction and force value for each surface. At this time, the generated environment parameters obtained include multiple groups of force points, actual force directions and force values.

[0041] The specific process of simulation based on the force points and the potential force direction at each force point is as follows: Randomly select a force point and a potential force direction belonging to the force point on the three-dimensional model of the hardware; Assigning a force value to the potential force direction and determining a deformation amount attributable to the force value; Calculate the correlation between the deformation variable and the standard defect position; A sub-generation environment parameter is determined according to the association relationship, and a sub-generation environment parameter includes a force point, a potential force direction and a force value.

[0042] The correlation here refers to the degree of fit between the deformation variable and the standard defect position. Generally, a numerical value is set, such as 0.8-0.9. The deformation variable will cause the local deformation of the simulated hardware three-dimensional model. The similarity between the surface corresponding to the deformation and the standard defect position is the correlation relationship.

[0043] When the deformation variable is associated with the standard defect position, the following method is used for processing: Determine the influence of potential force direction change or force value change on the correlation between deformation variable and standard defect position; Draw an influence change curve belonging to the influence degree and determine the change speed of the influence change curve; When the change speed of the influence change curve is less than or equal to the set change speed, the change of the potential force direction or force value is stopped.

[0044] The purpose of this part is to examine the changing relationship between the deformation variable and the standard defect position during the simulation process. The cutoff time can be determined by the changing speed of the influence change curve attributed to the influence degree, thereby avoiding falling into an endless calculation process.

[0045] It should be understood that the change speed of the influence change curve generally undergoes a change process from fast to slow. Figure 5 and Figure 6 When the change speed of (as shown in the figure) is slow, the calculation can be terminated by setting a cutoff condition, thereby stopping the processing process.

[0046] At the same time, the above process also involves the direction adjustment and value adjustment of the force point. At this time, by examining the changing speed of the influence degree change curve, the direction adjustment and value adjustment of the force point can also be examined. For example, when examining the direction of a certain force point, the force direction of the force point can be preliminarily determined by adjusting the direction only, and then the value of the force point processing can be determined by adjusting the value.

[0047] In some examples, the reference defect position and the standard defect position are compared and the simulation direction is determined as follows: S301, transferring the reference defect position and the standard defect position into the same coordinate system; S302, creating an analysis surface based on a reference defect position; S303, calculating the variation trend of the reference defect position and the standard defect position on the analysis surface; S304, when the changing trends of the reference defect position on the analysis surface and the standard defect position on the analysis surface are the largest, the analysis surface is used as the surface where the force direction is located.

[0048] In step S301 to step S304, the reference defect position and the standard defect position are transferred to the same coordinate system for processing. The specific processing process is to first create an analysis surface based on the reference defect position, and the analysis surface is applicable to both the reference defect position and the standard defect position.

[0049] Then, the changing trends of the reference defect position and the standard defect position on the analysis surface are calculated respectively. When the changing trends of the reference defect position and the standard defect position on the analysis surface are the largest, the analysis surface is taken as the surface where the force direction is located.

[0050] The changing trend here refers to the speed at which the projection of the reference defect position on the analysis surface approaches the projection of the standard defect position on the analysis surface. There are multiple analysis surfaces, so the speed at which the projection of the reference defect position on the analysis surface approaches the projection of the standard defect position on the analysis surface can be calculated on each analysis surface.

[0051] For the approach speed, there are two indicators. The first indicator is the maximum distance between the projection of the reference defect position on the analysis surface and the projection of the standard defect position on the analysis surface. The second indicator is the enclosed area of ​​the projection of the reference defect position on the analysis surface and the projection of the standard defect position on the analysis surface.

[0052] The approach speed refers to the change speed of the maximum distance mentioned above or the change speed of the enclosed area.

[0053] When creating analysis surfaces, it is required that adjacent analysis surfaces be set in parallel when the analysis surface is created for the first time based on the reference defect position.

[0054] When multiple analysis surfaces can be used as simulation directions, use the following method to handle them: Randomly rotate the analysis surface so that the variation trend of the reference defect position belonging to the rotated analysis surface is maximized; Select the analysis surface with the largest change trend among multiple analysis surfaces as the simulation direction; When the analysis plane is rotated, a plurality of analysis planes are provided with reference lines or reference areas.

[0055] In the above content, an analysis surface is retained by rotating to obtain the maximum change trend. At this time, if two or more analysis surfaces need to be retained, then these two or more analysis surfaces need to be retained.

[0056] When the direction of creating the analysis surface changes, a certain number of analysis surfaces can be obtained. At this time, these analysis surfaces are converted into line segments for representation. One end of the line segment is located in the overlapping area between the analysis surface and the standard defect position. For the overlapping area here, if the maximum distance processing method described in the previous article is used, one end of the line segment is located at the maximum distance. If the enclosed area processing method is used, one end of the line segment is located at the lowest point of the enclosed area.

[0057] These line segments can be enclosed into an area, in which case the midpoint of the area can be used as the force point.

[0058] The present application also provides a device for evaluating the load-bearing characteristics of transmission line fittings in extreme environments, comprising: The first three-dimensional model creation unit is used to collect real hardware three-dimensional models of real hardware images in the environment where the power transmission line hardware is located, and the number of real hardware three-dimensional models is the same as the number of object hardware and corresponds one to one; The first processing unit is used to compare the real hardware three-dimensional model with the reference hardware three-dimensional model and obtain the defect position on the real hardware three-dimensional model; A statistics and classification unit is used to count and classify defect positions to obtain standard defect positions and random defect positions; An environmental parameter generation unit, used to create environmental parameters for standard defect locations; The second processing unit is used to superimpose the generated environmental parameters on the simulated hardware three-dimensional model to obtain the deformed hardware three-dimensional model; The third processing unit is used to compare the simulated hardware three-dimensional model with the deformed hardware three-dimensional model to determine the load-bearing capacity of the simulated hardware three-dimensional model, where the load-bearing capacity includes the deformation position and the deformation amount.

[0059] Furthermore, the generation environment parameters for creating the standard defect location include: Determine the stress points on the three-dimensional model of the simulated hardware and the potential stress direction at each stress point; Simulate based on the stress points and the potential stress direction at each stress point to obtain the reference defect position, and apply force in the potential stress direction during the simulation; Compare the reference defect position and the standard defect position and determine the simulation direction until the difference between the reference defect position and the standard defect position is within the allowable range; The force points and the actual force direction and force value at each force point are used as generation environment parameters.

[0060] Furthermore, simulation based on the force points and the potential force direction at each force point includes: Randomly select a force point and a potential force direction belonging to the force point on the three-dimensional model of the hardware; Assigning a force value to the potential force direction and determining a deformation amount attributable to the force value; Calculate the correlation between the deformation variable and the standard defect position; A sub-generation environment parameter is determined according to the association relationship, and a sub-generation environment parameter includes a force point, a potential force direction and a force value.

[0061] Furthermore, when the deformation amount is associated with the standard defect position, it also includes: Determine the influence of potential force direction change or force value change on the correlation between deformation variable and standard defect position; Draw an influence change curve belonging to the influence degree and determine the change speed of the influence change curve; When the change speed of the influence change curve is less than or equal to the set change speed, the change of the potential force direction or force value is stopped.

[0062] Further, comparing the reference defect position with the standard defect position and determining the simulation direction includes: Transfer the reference defect position and the standard defect position into the same coordinate system; Create analysis surfaces based on reference defect locations; Calculate the changing trend of reference defect position and standard defect position on the analysis surface; When the changing trends of the reference defect position on the analysis surface and the standard defect position on the analysis surface are the largest, the analysis surface is taken as the surface where the force direction is located.

[0063] Further, when the analysis plane is created for the first time based on the reference defect position, adjacent analysis planes are set in parallel; When multiple analysis surfaces can be used as simulation directions, it also includes: Randomly rotate the analysis surface so that the variation trend of the reference defect position belonging to the rotated analysis surface is maximized; Select the analysis surface with the largest change trend among multiple analysis surfaces as the simulation direction; When the analysis plane is rotated, a plurality of analysis planes are provided with reference lines or reference areas.

[0064] In one example, the unit in any of the above devices can be one or more integrated circuits configured to implement the above methods, such as: one or more application specific integrated circuits (ASICs), or, one or more digital signal processors (DSPs), or, one or more field programmable gate arrays (FPGAs), or a combination of at least two of these integrated circuit forms.

[0065] For another example, when the units in the device can be implemented in the form of a processing element scheduling program, the processing element can be a general-purpose processor, such as a central processing unit (CPU) or other processor that can call a program. For another example, these units can be integrated together and implemented in the form of a system-on-a-chip (SOC).

[0066] Various objects such as various messages / information / equipment / network elements / systems / devices / actions / operations / processes / concepts that may appear in this application are named. It can be understood that these specific names do not constitute a limitation on the relevant objects. The names assigned may change with factors such as scenarios, contexts or usage habits. The understanding of the technical meaning of the technical terms in this application should be mainly determined from the functions and technical effects embodied / executed in the technical scheme.

[0067] Those skilled in the art can clearly understand that, for the convenience and brevity of description, the specific working processes of the systems, devices and units described above can refer to the corresponding processes in the aforementioned method embodiments and will not be repeated here.

[0068] In the several embodiments provided in the present application, it should be understood that the disclosed systems, devices and methods can be implemented in other ways. For example, the device embodiments described above are only schematic. For example, the division of the units is only a logical function division. There may be other division methods in actual implementation, such as multiple units or components can be combined or integrated into another system, or some features can be ignored or not executed. Another point is that the mutual coupling or direct coupling or communication connection shown or discussed can be through some interfaces, indirect coupling or communication connection of devices or units, which can be electrical, mechanical or other forms.

[0069] The units described as separate components may or may not be physically separated, and the components shown as units may or may not be physical units, that is, they may be located in one place or distributed on multiple network units. Some or all of the units may be selected according to actual needs to achieve the purpose of the solution of this embodiment.

[0070] Those of ordinary skill in the art will appreciate that the units and algorithm steps of each example described in conjunction with the embodiments disclosed herein can be implemented in electronic hardware, or a combination of computer software and electronic hardware. Whether these functions are performed in hardware or software depends on the specific application and design constraints of the technical solution. Professional and technical personnel can use different methods to implement the described functions for each specific application, but such implementation should not be considered to be beyond the scope of this application.

[0071] It should also be understood that in various embodiments of the present application, the first, second, etc. are only used to indicate that multiple objects are different. For example, the first time window and the second time window are only used to indicate different time windows. They should not have any impact on the time window itself, and the first, second, etc. mentioned above should not impose any limitations on the embodiments of the present application.

[0072] It should also be understood that in the various embodiments of the present application, unless otherwise specified or there is a logical conflict, the terms and / or descriptions between different embodiments are consistent and can be referenced to each other, and the technical features in different embodiments can be combined to form new embodiments according to their internal logical relationships.

[0073] If the functions are implemented in the form of software functional units and sold or used as independent products, they can be stored in a computer-readable storage medium. Based on this understanding, the technical solution of the present application can be essentially or partly embodied in the form of a software product that contributes to the prior art. The computer software product is stored in a computer-readable storage medium, including several instructions for a computer device (which can be a personal computer, a server, or a network device, etc.) to perform all or part of the steps of the methods described in each embodiment of the present application. The aforementioned computer-readable storage medium includes: various media that can store program codes, such as a USB flash drive, a mobile hard disk, a read-only memory (ROM), a random access memory (RAM), a magnetic disk or an optical disk.

[0074] The present application also provides a system for evaluating the load-bearing characteristics of transmission line fittings in extreme environments, the system comprising: one or more memories for storing instructions; and One or more processors are used to call and run the instructions from the memory to execute the method as described above.

[0075] The present application also provides a computer program product, which includes instructions. When the instructions are executed, the terminal device and the network device perform operations of the terminal device and the network device corresponding to the above method.

[0076] The present application also provides a chip system, which includes a processor for implementing the functions involved in the above content, such as generating, receiving, sending, or processing the data and / or information involved in the above method.

[0077] The chip system may be composed of chips, or may include chips and other discrete devices.

[0078] The processor mentioned in any of the above places can be a CPU, a microprocessor, an ASIC, or one or more integrated circuits for executing programs for controlling the above-mentioned feedback information transmission method.

[0079] In a possible design, the chip system also includes a memory, which is used to store necessary program instructions and data. The processor and the memory can be decoupled and respectively set on different devices, connected by wire or wireless means to support the chip system to implement various functions in the above embodiments. Alternatively, the processor and the memory can also be coupled on the same device.

[0080] Optionally, the computer instructions are stored in a memory.

[0081] Optionally, the memory is a storage unit within the chip, such as a register, a cache, etc. The memory can also be a storage unit within the terminal located outside the chip, such as a ROM or other types of static storage devices that can store static information and instructions, RAM, etc.

[0082] It can be understood that the memory in the present application can be a volatile memory or a non-volatile memory, or can include both volatile and non-volatile memories.

[0083] The non-volatile memory may be a ROM, a programmable ROM (PROM), an erasable PROM (EPROM), an electrically erasable PROM (EEPROM), or a flash memory.

[0084] The volatile memory may be a RAM, which is used as an external cache. There are many different types of RAM, such as static RAM (SRAM), dynamic RAM (DRAM), synchronous DRAM (SDRAM), double data rate SDRAM (DDR SDRAM), enhanced SDRAM (ESDRAM), synchronous link DRAM (SLDRAM), and direct memory bus RAM.

[0085] The embodiments of this specific implementation method are all preferred embodiments of the present application, and are not intended to limit the protection scope of the present application. Therefore, all equivalent changes made based on the structure, shape, and principle of the present application should be included in the protection scope of the present application.

Claims

1. A method for evaluating the load-bearing characteristics of transmission line hardware in extreme environments, characterized in that: include: Collect real hardware 3D models of real hardware images in the environment where the power transmission line hardware is located, and the number of real hardware 3D models is the same as the number of target hardware and corresponds one to one; Compare the real hardware 3D model with the reference hardware 3D model and obtain the defect position on the real hardware 3D model; Count and classify the defect positions to obtain standard defect positions and random defect positions; Create standard defect location generation environment parameters; The generated environmental parameters are superimposed on the simulated hardware three-dimensional model to obtain the deformed hardware three-dimensional model; The simulated hardware 3D model and the deformed hardware 3D model are compared to determine the load-bearing capacity on the simulated hardware 3D model, which includes the deformation position and deformation amount.

2. The method for evaluating the load-bearing characteristics of power transmission line fittings in extreme environments according to claim 1 is characterized in that: The generation environment parameters for creating standard defect locations include: Determine the stress points on the three-dimensional model of the simulated hardware and the potential stress direction at each stress point; Simulate based on the stress points and the potential stress direction at each stress point to obtain the reference defect position, and apply force in the potential stress direction during the simulation; Compare the reference defect position and the standard defect position and determine the simulation direction until the difference between the reference defect position and the standard defect position is within the allowable range; The force points and the actual force direction and force value at each force point are used as generation environment parameters.

3. The method for evaluating the load-bearing characteristics of power transmission line fittings in extreme environments according to claim 2 is characterized in that: The simulation based on the force points and the potential force direction at each force point includes: Randomly select a force point and a potential force direction belonging to the force point on the three-dimensional model of the hardware; Assigning a force value to the potential force direction and determining a deformation amount attributable to the force value; Calculate the correlation between the deformation variable and the standard defect position; A sub-generation environment parameter is determined according to the association relationship, and a sub-generation environment parameter includes a force point, a potential force direction and a force value.

4. The method for evaluating the load-bearing characteristics of power transmission line fittings in extreme environments according to claim 3 is characterized in that: When the deformation amount is associated with the standard defect position, it also includes: Determine the influence of potential force direction change or force value change on the correlation between deformation variable and standard defect position; Draw an influence change curve belonging to the influence degree and determine the change speed of the influence change curve; When the change speed of the influence change curve is less than or equal to the set change speed, the change of the potential force direction or force value is stopped.

5. The method for evaluating the load-bearing characteristics of power transmission line fittings in extreme environments according to claim 2, characterized in that: Comparing the reference defect position with the standard defect position and determining the simulation direction includes: Transfer the reference defect position and the standard defect position into the same coordinate system; Create analysis surfaces based on reference defect locations; Calculate the changing trend of reference defect position and standard defect position on the analysis surface; When the changing trends of the reference defect position on the analysis surface and the standard defect position on the analysis surface are the largest, the analysis surface is taken as the surface where the force direction is located.

6. The method for evaluating the load-bearing characteristics of power transmission line fittings in extreme environments according to claim 5 is characterized in that: When the analysis surfaces are first created based on the reference defect location, adjacent analysis surfaces are set in parallel; When multiple analysis surfaces can be used as simulation directions, it also includes: Randomly rotate the analysis surface so that the variation trend of the reference defect position belonging to the rotated analysis surface is maximized; Select the analysis surface with the largest change trend among multiple analysis surfaces as the simulation direction; When the analysis plane is rotated, a plurality of analysis planes are provided with reference lines or reference areas.

7. A device for evaluating the load-bearing characteristics of power transmission line fittings in extreme environments, characterized in that: include: The first three-dimensional model creation unit is used to collect real hardware three-dimensional models of real hardware images in the environment where the power transmission line hardware is located, and the number of real hardware three-dimensional models is the same as the number of target hardware and corresponds one to one; The first processing unit is used to compare the real hardware three-dimensional model with the reference hardware three-dimensional model and obtain the defect position on the real hardware three-dimensional model; A statistics and classification unit is used to count and classify defect positions to obtain standard defect positions and random defect positions; An environmental parameter generation unit, used to create environmental parameters for standard defect locations; The second processing unit is used to superimpose the generated environmental parameters on the simulated hardware three-dimensional model to obtain a deformed hardware three-dimensional model; The third processing unit is used to compare the simulated hardware three-dimensional model with the deformed hardware three-dimensional model to determine the load-bearing capacity of the simulated hardware three-dimensional model, where the load-bearing capacity includes the deformation position and the deformation amount.

8. A system for evaluating the load-bearing characteristics of power transmission line fittings in extreme environments, characterized in that: The system comprises: one or more memories for storing instructions; and One or more processors, configured to call and execute the instructions from the memory to perform the method according to any one of claims 1 to 6.

9. A computer-readable storage medium, characterized in that: The computer readable storage medium comprises: The program, when the program is executed by a processor, the method according to any one of claims 1 to 6 is executed.

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