Circuit board assembly and electronic device

Abstract

The application discloses a circuit board assembly and electronic equipment, and belongs to the field of circuit boards. The circuit board assembly comprises a circuit board body, an electronic element is arranged on the circuit board body; a shielding cover is arranged on the circuit board body, and the electronic element is contained in the shielding cover; the shielding cover is provided with an opening, and the outer surface of the shielding cover is provided with a connecting groove, and a connecting piece is arranged in the connecting groove; and a shielding piece is arranged on the outer surface of the shielding cover and is fixedly connected with the connecting piece, and the shielding piece covers the opening.

Description

Technical Field

[0001] This application belongs to the field of circuit boards, specifically relating to a circuit board assembly and electronic device. Background Technology

[0002] With the development of technology, electronic devices have become essential tools in people's daily lives, enabling them to take pictures, watch videos, and communicate remotely. Typically, electronic devices contain circuit board assemblies with electronic components mounted on them. These components are usually covered by shielding to prevent them from interfering with the antenna and other parts of the electronic device. However, over time, these shielding components can fail, causing the electronic components to affect the antenna and thus the communication capabilities of the electronic device. Summary of the Invention

[0003] The purpose of this application is to provide a circuit board assembly and an electronic device that at least solves the problem that shielding components are prone to failure, causing electronic components to affect the antenna of the electronic device and thus affecting the communication of the electronic device.

[0004] In a first aspect, embodiments of this application provide a circuit board assembly, the circuit board assembly comprising:

[0005] A circuit board body, on which electronic components are disposed;

[0006] A shielding cover is disposed on the circuit board body, and the electronic components are housed in the shielding cover. The shielding cover has an opening, and the outer surface of the shielding cover has a connecting groove, in which a connector is disposed.

[0007] A shielding component is disposed on the outer surface of the shielding cover and is fixedly connected to the connector, the shielding component covering the opening.

[0008] In a second aspect, embodiments of this application provide an electronic device, characterized in that the electronic device includes a housing and the circuit board assembly described in the first aspect above;

[0009] The circuit board assembly is disposed within the housing.

[0010] In this embodiment, since electronic components are disposed on the circuit board body, and a shielding cover is disposed on the circuit board body and the electronic components are housed within the shielding cover, the shielding cover can shield the electronic components. Because the shielding cover has openings, and the shielding component covers the openings, the combination of the shielding component and the shielding cover ensures that the electronic components are well shielded, preventing the electronic components from affecting the antenna of the electronic device. Because the outer surface of the shielding cover has a connecting groove, and a connector is disposed in the connecting groove, and the shielding component is disposed on the outer surface of the shielding cover and fixedly connected to the connector, the shielding component and the shielding cover can be fixedly connected by the connector, preventing the shielding component and the shielding cover from separating over time, or the shielding component from reducing its coverage of the openings, thus preventing the electronic components from affecting the antenna of the electronic device. That is, in this embodiment of the application, by setting a connecting groove on the outer surface of the shielding cover and setting a connector in the connecting groove, the shielding component and the connector can be fixedly connected, and the opening on the shielding cover is covered. This ensures that the shielding component is fixedly connected to the shielding cover through the connector, and avoids the shielding component and the shielding cover from separating over time, which would affect the shielding of the opening on the shielding cover and thus cause the electronic components to affect the antenna of the electronic device. Attached Figure Description

[0011] Figure 1 This represents an isometric view of a circuit board assembly provided in an embodiment of this application;

[0012] Figure 2 This is a schematic diagram illustrating a shielding component provided in an embodiment of this application, wherein conductive adhesive is disposed on the shielding component and the shielding cover is separated.

[0013] Figure 3 This is a schematic diagram illustrating a shielding component provided in an embodiment of this application, wherein conductive adhesive is disposed on the shielding component and the shielding cover is connected.

[0014] Figure 4 This is a schematic diagram illustrating a shielding component provided in an embodiment of this application, wherein a fixing component is provided on the shielding component, and the shielding component is separated from the shielding cover;

[0015] Figure 5 This is a schematic diagram illustrating a shielding component provided in an embodiment of this application, wherein a fixing component is provided on the shielding component and the shielding component is connected to the shielding cover;

[0016] Figure 6 This is a schematic diagram illustrating a shielding component provided in an embodiment of this application, which has a folded edge and is separate from the shielding cover;

[0017] Figure 7 This is a schematic diagram showing a shielding component provided in an embodiment of this application, which has a folded edge and is connected to a shielding cover.

[0018] Figure label:

[0019] 10: Circuit board body; 101: Electronic component; 20: Shielding cover; 21: Top wall; 22: Side wall; 201: Opening; 202: Connecting groove; 30: Shielding component; 31: Shielding body; 32: Folded edge; 301: Conductive adhesive; 302: Clearance groove; 40: Connector; 50: Fixing component; 51: Substrate; 52: Adhesive layer. Detailed Implementation

[0020] The terms "first" and "second" in the specification and claims of this application may explicitly or implicitly include one or more of the features. In the description of this application, unless otherwise stated, "multiple" means two or more. Furthermore, "and / or" in the specification and claims indicates at least one of the connected objects, and the character " / " generally indicates that the preceding and following objects are in an "or" relationship.

[0021] In the description of this application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicating the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0022] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection between two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0023] like Figures 1 to 7 As shown, an embodiment of this application provides a circuit board assembly including: a circuit board body 10, on which electronic components 101 are disposed; a shielding cover 20, which is disposed on the circuit board body 10 and the electronic components 101 are accommodated in the shielding cover 20, the shielding cover 20 has an opening 201, and the outer surface of the shielding cover 20 has a connecting groove 202, in which a connector 40 is disposed; and a shielding member 30, which is disposed on the outer surface of the shielding cover 20 and fixedly connected to the connector 40, the shielding member 30 covering the opening 201.

[0024] In this embodiment, since the circuit board body 10 is provided with electronic components 101, and the shielding cover 20 is provided on the circuit board body 10, and the electronic components 101 are accommodated in the shielding cover 20, the shielding cover 20 can shield the electronic components 101. Since the shielding cover 20 is provided with an opening 201, and the shielding member 30 covers the opening 201, the combination of the shielding member 30 and the shielding cover 20 can ensure that the electronic components 101 can be well shielded, avoiding the electronic components 101 from affecting the antenna of the electronic device. Since the outer surface of the shielding cover 20 is provided with a connecting groove 202, and a connector 40 is provided in the connecting groove 202, and the shielding member 30 is provided on the outer surface of the shielding cover 20 and fixedly connected to the connector 40, the shielding member 30 and the shielding cover 20 can be fixedly connected by the connector 40, avoiding the problem that the shielding member 30 and the shielding cover 20 will separate over time, or that the shielding member 30's coverage of the opening 201 will decrease, causing the electronic components 101 to affect the antenna of the electronic device. That is, in this embodiment of the application, by setting a connecting groove 202 on the outer surface of the shielding cover 20 and setting a connector 40 in the connecting groove 202, the shielding component 30 can be fixedly connected to the connector 40 and cover the opening 201 on the shielding cover 20. This ensures that the shielding component 30 is fixedly connected to the shielding cover 20 through the connector 40, and avoids the shielding component 30 and the shielding cover 20 from separating over time, which would affect the shielding of the opening 201 on the shielding cover 20 and thus cause the electronic component 101 to affect the antenna of the electronic device.

[0025] In related technologies, circuit board assemblies typically include a circuit board body 10, on which electronic components 101 and a shielding cover 20 are mounted. The shielding cover 20 is fixedly connected to the circuit board body 10 and covers the electronic components 101. An opening 201 is provided on the shielding cover. Shielding material is bonded to the surface of the shielding cover 20 using conductive adhesive 301, and the shielding material covers the opening 201. Thus, the shielding material and the shielding cover 20 form a Faraday cage, achieving electromagnetic shielding and preventing the electronic components 101 from affecting the antenna of the electronic device. However, during the operation of the electronic device, the frequency of the electronic components 101 may be high, causing the temperature of the electronic components 101 to rise. Alternatively, when the electronic device is in a high-temperature and high-humidity environment, or an environment subject to thermal shock, the conductive adhesive 301 may age, expand, or contract due to temperature changes, causing the shielding material to warp and the adhesive surface of the conductive adhesive 301 to misalign. This can lead to electromagnetic leakage, interference with the antenna of the electronic device, and affect the communication of the electronic device.

[0026] In this embodiment, by providing a connecting groove 202 on the outer surface of the shielding cover 20 and a connector 40 in the connecting groove 202, when the shielding member 30 is placed on the outer surface of the shielding cover 20, the shielding member 30 and the connector 40 can be fixedly connected. Thus, the connector 40 can fix the shielding member 30 and the shielding cover 20, and the shielding member 30 covers the opening 201 on the shielding cover 20. This allows the shielding member 30 and the shielding cover 20 to effectively shield the electronic component 101 electromagnetically, preventing the shielding member 30 and the shielding cover 20 from easily separating and causing electromagnetic leakage, which could lead to the electronic component 101 interfering with the antenna of the electronic device.

[0027] It should be noted that, in this embodiment, electronic component 101 can be a system-on-chip (SOC), and of course, electronic component 101 can also be dynamic random access memory. The specific type of electronic component 101 is not limited in this embodiment.

[0028] In addition, in this embodiment of the application, the shielding cover 20 can be fixedly connected to the circuit board body 10, for example, by soldering the shielding cover 20 to the circuit board body 10.

[0029] In addition, in this embodiment of the application, the electronic component 101 can be soldered to the circuit board body 10, that is, the electronic component 101 can be soldered to the pads on the circuit board body 10, so that the electronic component 101 is fixed on the circuit board body 10.

[0030] In addition, in this embodiment, the connector 40 can be low-temperature solder paste, conductive silver paste, etc. Of course, the connector 40 can also be other devices with connection functions, such as screws. The specific type of connector 40 is not limited in this embodiment.

[0031] When the connector 40 is a low-temperature solder paste, the low-temperature solder paste can be pre-set in the connector groove 202. After the shield 30 is placed on the outer surface of the shield cover 20, the low-temperature solder paste can be melted through a reflow process. The melted low-temperature solder paste will fill the connector groove 202 and come into contact with the shield 30. After the low-temperature solder paste solidifies, it can fix the shield 30 and the shield cover 20 together, thus avoiding the problem that the shield 30 and the shield cover 20 may easily separate, which could cause the electronic component 101 to affect the antenna of the electronic device.

[0032] When the connector 40 is conductive silver paste, conductive silver paste can be pre-set in the connector groove 202. After the shield 30 is placed on the outer surface of the shield cover 20, the conductive silver paste not only fills the connector, but also contacts the conductive component with the shield 30, which allows the conductive silver paste to solidify. The conductive silver paste can then fix the shield 30 and the shield cover 20 together, avoiding the problem that the shield 30 and the shield cover 20 may easily separate, which could cause the electronic component 101 to affect the antenna of the electronic device.

[0033] In addition, in some embodiments, the surface of the shielding member 30 facing the shielding cover 20 may be provided with conductive adhesive 301, and the shielding member 30 and the shielding cover 20 are bonded together by the conductive adhesive 301.

[0034] Since conductive adhesive 301 can be provided on the surface of the shielding component 30 facing the shielding cover 20, after the shielding component 30 is placed on the shielding cover 20, the shielding component 30 can first be bonded to the shielding cover 20 by the conductive adhesive 301, thereby initially positioning the shielding component 30 and preventing the shielding component 30 from easily shaking relative to the shielding cover 20, which would make it difficult for the subsequent connector 40 to fix the shielding component 30 to the shielding cover 20. That is, by providing conductive adhesive 301, when it is necessary to fix the shielding component 30 to the shielding cover 20, the conductive adhesive 301 can be used to initially position the shielding component 30, which facilitates the connector 40 to fix the shielding component 30 to the shielding cover 20, thereby ensuring that the shielding component 30 and the shielding cover 20 are not easily separated, and avoiding the problem of the electronic component 101 affecting the antenna of the electronic device.

[0035] It should be noted that the shielding element 30 can be conductive copper foil. Of course, the shielding element 30 can also be made of other metal materials, such as silver foil. The specific material of the shielding element 30 is not limited in this embodiment.

[0036] Furthermore, in this embodiment, to avoid the circuit board assembly occupying a large space in the electronic device, the thickness of the conductive adhesive 301 can be set. This prevents the conductive adhesive 301 from being too thick, which would increase the size of the circuit board assembly and consequently reduce the space utilization rate within the electronic device. The thickness of the conductive adhesive 301 can be set according to actual needs; for example, the thickness of the conductive adhesive 301 can be 0.5 mm, or even 0.3 mm. This embodiment does not limit the specific thickness of the conductive adhesive 301, as long as it can bond the shielding member 30 and the shielding cover 20.

[0037] In addition, in some embodiments, a clearance groove 302 may be provided on the conductive adhesive 301, the clearance groove 302 being opposite to the connecting groove 202, and the connector 40 extending into the clearance groove 302 and connecting to the shield 30.

[0038] Because the conductive adhesive 301 has a clearance groove 302, and the clearance groove 302 is positioned opposite to the connecting groove 202, the connector 40 can extend into the clearance groove 302, allowing the connector 40 to directly contact the shielding component 30, thus making the connection between the shielding component 30 and the shielding cover 20 more secure. In other words, by providing the clearance groove 302 on the conductive adhesive 301, a secure connection between the shielding component 30 and the shielding cover 20 can be ensured, preventing the shielding component 30 from easily separating from the shielding cover 20, which could cause the electronic component 101 to affect the antenna of the electronic device.

[0039] For example, when the connector 40 is low-temperature solder paste, after the low-temperature solder paste is placed in the connector groove 202, once the shield 30 is placed on the outer surface of the shield cover 20, the clearance groove 302 can be positioned opposite the connector groove 202. Therefore, during the reflow of the circuit board assembly, the low-temperature solder paste melts and fills the connector groove 202, and the molten low-temperature solder paste also enters the clearance groove 302. Thus, the molten low-temperature solder paste can directly contact the shield 30. After the low-temperature solder paste solidifies, it can firmly connect the shield 30 to the shield cover 20. If the conductive adhesive 301 does not have a clearance groove 302, the low-temperature solder paste will contact the conductive adhesive 301, affecting the firmness of the solidified low-temperature solder paste in connecting the shield 30 to the shield cover 20.

[0040] It should be noted that the shape of the clearance groove 302 can be the same as the shape of the connecting groove 202. For example, if the connecting groove 202 is square, then the clearance groove 302 is square. Or, for another example, if the connecting groove 202 is circular, then the clearance groove 302 is circular.

[0041] In some embodiments, the melting point of connector 40 is lower than that of conductive adhesive 301. Connector 40 may be a low-temperature solder paste or conductive silver paste.

[0042] When the melting point of connector 40 is lower than that of conductive adhesive 301, once connector 40 is placed in connector groove 202 and shielding member 30 is placed on the outer surface of shielding cover 20, connector 40 will melt during reflow of the circuit board assembly, but conductive adhesive 301 will not melt. This prevents conductive adhesive 301 from melting and mixing with the melted connector 40, which would affect the firmness of the connection between connector 40 and shielding cover 20 and shielding member 30 after connector 40 solidifies. In other words, by setting the melting point of connector 40 to be lower than that of conductive adhesive 301, a more secure connection between shielding member 30 and shielding cover 20 via connector 40 can be ensured, thus preventing easy separation of shielding member 30 and shielding cover 20, which could cause electronic component 101 to affect the antenna of electronic equipment.

[0043] When the connector 40 is a low-temperature solder paste, the melting point of the low-temperature solder paste is lower than the melting point of the conductive adhesive 301.

[0044] In addition, in some embodiments, a fixing component 50 may be provided on the surface of the shielding member 30 facing away from the shielding cover 20. The fixing component 50 covers at least a portion of the surface of the shielding member 30 facing away from the shielding cover 20 and is connected to the shielding cover 20.

[0045] Since the surface of the shielding member 30 facing away from the shielding cover 20 can be provided with a fixing component 50, and the fixing component 50 covers at least a portion of the surface of the shielding member 30 facing away from the shielding cover 20, after the shielding member 30 is placed on the surface of the shielding cover 20, it can be connected to the shielding cover 20 by the part of the fixing component 50 extending outside the shielding member 30. Thus, the part of the fixing component 50 can initially position the shielding member 30, avoiding the problem that the shielding member 30 is easy to shake relative to the shielding cover 20, which would be detrimental to the subsequent fixed connection of the connecting member 40 to the shielding cover 20.

[0046] It should be noted that the fixing component 50 can cover the entire surface of the shielding member 30 facing away from the shielding cover 20, and the area of ​​the fixing component 50 is larger than the area of ​​the shielding member 30. Therefore, when it is necessary to connect the shielding member 30 to the shielding cover 20, the fixing component 50 extending beyond the shielding member 30 can be used to initially position and fix the shielding member 30. This facilitates the subsequent fixing of the shielding member 30 to the shielding cover 20 by the connecting component 40, thus preventing the shielding member 30 from easily separating from the shielding cover 20 and causing the electronic component 101 to affect the antenna of the electronic device. Of course, the fixing component 50 can cover only a portion of the surface of the shielding member 30 facing away from the shielding cover 20, but a portion of the fixing component 50 extends beyond the shielding member 30. The initial positioning of the shielding member 30 can be achieved using the fixing component 50 extending beyond the shielding member 30.

[0047] It should be noted that the portion of the fixing component 50 extending beyond the shielding component 30 is bendable, thereby allowing this portion of the fixing component 50 to be connected to the shielding cover 20.

[0048] In some embodiments, the fixing component 50 may include a substrate 51 and an adhesive layer 52, wherein the substrate 51 and the adhesive layer 52 are stacked, and the area of ​​the adhesive layer 52 is larger than the area of ​​the shield 30, the area of ​​the substrate 51 is larger than the area of ​​the shield 30, and the area of ​​the substrate 51 is equal to the area of ​​the adhesive layer 52. Part of the adhesive layer 52 is bonded to the shield 30, and the other part of the adhesive layer 52 is bonded to the shield cover 20.

[0049] Since the substrate 51 and the adhesive layer 52 are stacked, and the area of ​​the adhesive layer 52 is larger than the area of ​​the shielding member 30, and the area of ​​the substrate 51 is larger than the area of ​​the shielding member 30, and the area of ​​the substrate 51 is equal to the area of ​​the adhesive layer 52, after the shielding member 30 is placed on the outer surface of the shielding cover 20, the adhesive layer 52 extending beyond the shielding member 30 can be bonded to the shielding cover 20, and the adhesive layer 52 bonds the shielding member 30 to the substrate 51. Thus, the substrate 51 extending beyond the shielding member 30 is connected to the shielding cover 20 through the adhesive layer 52, which is equivalent to fixing this part of the substrate 51 to the shielding cover 20, initially positioning the shielding member 30, that is, initially fixing the shielding member 30, and preventing the shielding member 30 from easily shaking relative to the shielding cover 20, which would be detrimental to the subsequent fixed connection of the shielding member 30 to the shielding cover 20 by the connector 40. By setting a substrate 51 and an adhesive layer 52, with the substrate 51 and adhesive layer 52 stacked together, and the area of ​​adhesive layer 52 being larger than the area of ​​shielding member 30, the area of ​​substrate 51 being larger than the area of ​​shielding member 30, and the area of ​​substrate 51 being equal to the area of ​​adhesive layer 52, when it is necessary to connect shielding member 30 and shielding cover 20, the substrate 51 and shielding cover 20 can be bonded by adhesive layer 52 extending beyond shielding member 30, thereby initially positioning and fixing shielding member 30, which facilitates subsequent connection of shielding member 30 and shielding cover 20 to be fixedly connected by connector 40. This avoids the problem of shielding member 30 and shielding cover 20 easily separating, which could cause electronic component 101 to affect the antenna of electronic device.

[0050] For example, when the connector 40 is a low-temperature solder paste, after the low-temperature solder paste is placed in the connector groove 202, when the shield 30 is placed on the outer surface of the shield cover 20, the adhesive layer 52 extending beyond the shield 30 can be bonded to the shield cover 20, thereby bonding the substrate 51 extending beyond the shield 30 to the shield cover 20. The substrate 51 can then initially fix the shield 30, so that when the circuit board assembly is reflowed, the shield 30 is less likely to shake relative to the shield cover 20, which facilitates the contact between the low-temperature solder paste after melting and the shield 30, and then firmly connects the shield 30 and the shield cover 20 after the low-temperature solder paste solidifies.

[0051] It should be noted that the substrate 51 can be a PET substrate. Of course, the substrate 51 can also be made of other materials, such as a PP substrate. The specific material of the substrate 51 is not limited in this embodiment.

[0052] In some embodiments, the melting point of connector 40 is lower than that of adhesive layer 52, and the melting point of connector 40 is lower than that of substrate 51. Connector 40 may be low-temperature solder paste or conductive silver paste.

[0053] When the melting point of connector 40 is lower than that of adhesive layer 52 and substrate 51, once connector 40 is placed in connector groove 202 and shielding member 30 is placed on the outer surface of shielding cover 20, connector 40 will melt during reflow of the circuit board assembly, but adhesive layer 52 and substrate 51 will not melt. This avoids the adhesive layer 52 and substrate 51 melting, which would cause adhesive layer 52 to mix with the melted connector 40, affecting the firmness of the connection between the connector 40 and shielding cover 20 and shielding member 30 after the connector 40 solidifies. In other words, by setting the melting point of connector 40 to be lower than that of adhesive layer 52 and substrate 51, it can be ensured that shielding member 30 and shielding cover 20 are firmly connected by connector 40, thereby avoiding the problem of shielding member 30 and shielding cover 20 easily separating, which could cause electronic component 101 to affect the antenna of electronic device.

[0054] When the connector 40 is a low-temperature solder paste, the melting point of the low-temperature solder paste is lower than the melting point of the adhesive layer 52, and the melting point of the low-temperature solder paste is lower than the melting point of the substrate 51.

[0055] In some embodiments, the shielding member 30 may include an interconnected shielding body 31 and a folded edge 32, with the folded edge 32 surrounding the shielding body 31. The shielding cover 20 includes an interconnected top wall 21 and a side wall 22, with the side wall 22 surrounding the top wall 21 and connected to the circuit board body. The top wall 21, the side wall 22, and the circuit board body enclose a shielding space, in which the electronic component 101 is located. The shielding body 31 is positioned opposite to the top wall 21, and the shielding body 31 contacts the top wall 21, while the folded edge 32 contacts the side wall 22. At least one of the top wall 21 and the side wall 22 is provided with a connecting groove 202, and the top wall 21 is provided with an opening 201.

[0056] Since the shielding body 31 and the top wall 21 are positioned opposite each other and the shielding body 31 is in contact with the top wall 21, and the folded edge 32 is in contact with the side wall 22, and at least one of the top wall 21 and the side wall 22 is provided with a connecting groove 202, once it is necessary to connect the shielding component 30 and the shielding cover 20, the connecting component 40 in the connecting groove 202 can fix the top wall 21 and the shielding body 31, and / or the connecting component 40 in the connecting groove 202 can fix the side wall 22 and the folded edge 32, ensuring that the shielding component 30 and the shielding cover 20 are firmly connected.

[0057] It should be noted that the connecting groove 202 can be provided only on the top wall 21. In this case, the shielding body 31 and the top wall 21 are fixedly connected through the connector 40 in the connecting groove 202 on the top wall 21. Alternatively, the connecting groove 202 can be provided only on the side wall 22. In this case, the folded edge 32 and the side wall 22 are fixedly connected through the connector 40 in the connecting groove 202 on the side wall 22. Of course, the connecting groove 202 can also be provided on both the top wall 21 and the side wall 22. In this case, the shielding body and the top wall 21 are fixedly connected through the connector 40 in the connecting groove 202 on the top wall 21, and the folded edge 32 and the side wall 22 are fixedly connected through the connector 40 in the connecting groove 202 on the side wall 22, making the connection between the shielding component 30 and the shielding cover 20 more secure.

[0058] In some embodiments, the connecting groove 202 is arranged around the opening 201. With this arrangement, after the shielding member 30 is placed on the shielding cover 20, once the connector 40 in the connecting groove 202 connects the shielding cover 20 and the shielding member 30, the arrangement of the connecting groove 202 around the opening 201 can ensure that the shielding member 30 and the shielding cover 20 are firmly connected in the circumferential direction of the opening 201, and the shielding member 30 can effectively shield the opening 201. It is equivalent to the shielding member 30 being able to completely shield the opening 201 in the circumferential direction, avoiding the problem of electromagnetic leakage in the circumferential direction of the opening 201.

[0059] It should be noted that the shape of the opening 201 can be set according to actual needs. For example, the shape of the opening 201 can be circular, square, or pentagonal. The specific shape of the opening 201 is not limited in this embodiment.

[0060] In addition, in this embodiment, the shielding component 30 and the shielding cover 20 can be welded, that is, the shielding component 30 and the shielding cover 20 are connected by a welding process.

[0061] In this embodiment, since the circuit board body 10 is provided with electronic components 101, and the shielding cover 20 is provided on the circuit board body 10, and the electronic components 101 are accommodated in the shielding cover 20, the shielding cover 20 can shield the electronic components 101. Since the shielding cover 20 is provided with an opening 201, and the shielding member 30 covers the opening 201, the combination of the shielding member 30 and the shielding cover 20 can ensure that the electronic components 101 can be well shielded, avoiding the electronic components 101 from affecting the antenna of the electronic device. Since the outer surface of the shielding cover 20 is provided with a connecting groove 202, and a connector 40 is provided in the connecting groove 202, and the shielding member 30 is provided on the outer surface of the shielding cover 20 and fixedly connected to the connector 40, the shielding member 30 and the shielding cover 20 can be fixedly connected by the connector 40, avoiding the problem that the shielding member 30 and the shielding cover 20 will separate over time, or that the shielding member 30's coverage of the opening 201 will decrease, causing the electronic components 101 to affect the antenna of the electronic device. That is, in this embodiment of the application, by setting a connecting groove 202 on the outer surface of the shielding cover 20 and setting a connector 40 in the connecting groove 202, the shielding component 30 can be fixedly connected to the connector 40 and cover the opening 201 on the shielding cover 20. This ensures that the shielding component 30 is fixedly connected to the shielding cover 20 through the connector 40, and avoids the shielding component 30 and the shielding cover 20 from separating over time, which would affect the shielding of the opening 201 on the shielding cover 20 and thus cause the electronic component 101 to affect the antenna of the electronic device.

[0062] This application provides an electronic device, which includes a housing and a circuit board assembly as described in any of the above embodiments; the circuit board assembly is disposed in the housing.

[0063] In this embodiment, since the circuit board body 10 is provided with electronic components 101, and the shielding cover 20 is provided on the circuit board body 10, and the electronic components 101 are accommodated in the shielding cover 20, the shielding cover 20 can shield the electronic components 101. Since the shielding cover 20 is provided with an opening 201, and the shielding member 30 covers the opening 201, the combination of the shielding member 30 and the shielding cover 20 can ensure that the electronic components 101 can be well shielded, avoiding the electronic components 101 from affecting the antenna of the electronic device. Since the outer surface of the shielding cover 20 is provided with a connecting groove 202, and a connector 40 is provided in the connecting groove 202, and the shielding member 30 is provided on the outer surface of the shielding cover 20 and fixedly connected to the connector 40, the shielding member 30 and the shielding cover 20 can be fixedly connected by the connector 40, avoiding the problem that the shielding member 30 and the shielding cover 20 will separate over time, or that the shielding member 30's coverage of the opening 201 will decrease, causing the electronic components 101 to affect the antenna of the electronic device. That is, in this embodiment of the application, by setting a connecting groove 202 on the outer surface of the shielding cover 20 and setting a connector 40 in the connecting groove 202, the shielding component 30 can be fixedly connected to the connector 40 and cover the opening 201 on the shielding cover 20. This ensures that the shielding component 30 is fixedly connected to the shielding cover 20 through the connector 40, and avoids the shielding component 30 and the shielding cover 20 from separating over time, which would affect the blocking of the opening 201 on the shielding cover 20 and thus cause the electronic component 101 to affect the antenna of the electronic device. This effectively improves the communication performance of the electronic device.

[0064] In addition, in this embodiment, the electronic device may further include a heat-conducting component, which abuts against the shielding component 30 and is connected to the heat sink in the electronic device. This allows heat generated by the electronic component 101 to be transferred to the shielding component 30, then to the heat-conducting component, and finally to the heat sink, preventing overheating of the electronic component 101 during operation and thus avoiding performance degradation. The heat-conducting component can be thermally conductive adhesive, or other components with thermal conductivity, such as a metal component. The specific type of heat-conducting component is not limited in this embodiment.

[0065] It should be noted that, in the embodiments of this application, electronic devices include, but are not limited to, controllers, smart devices, and terminal products. Smart devices include, for example, smartphones, smart TVs, smart speakers, smart robots, VR devices, AR devices, XR devices, etc., while terminal products include personal computers, tablets, etc. When the smart device is a smartphone, the smartphone can be foldable; however, it can also be a non-foldable phone, which is not limited in this embodiment.

[0066] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of this application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0067] Although embodiments of this application have been shown and described, those skilled in the art will understand that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of this application, the scope of which is defined by the claims and their equivalents.

Claims

1. A circuit board assembly, characterized in that, The circuit board assembly includes: A circuit board body, on which electronic components are disposed; A shielding cover is disposed on the circuit board body, the electronic components are housed in the shielding cover, the shielding cover has an opening, and the outer surface of the shielding cover has a connecting groove, in which a connector is disposed; A shielding component is disposed on the outer surface of a shielding cover and fixedly connected to a connector, the shielding component covering the opening; conductive adhesive is disposed on the surface of the shielding component facing the shielding cover; a clearance groove is disposed on the conductive adhesive, the clearance groove being opposite to the connecting groove, the connector extending into the clearance groove and connecting to the shielding component; the shielding component includes interconnected shielding bodies and folded edges, the folded edges surrounding the shielding bodies; the shielding cover includes interconnected top walls and side walls, the side walls surrounding the top wall and connected to the circuit board body, the top wall, the side walls, and the circuit board body enclosing a shielding space, the electronic component being located in the shielding space; the shielding body is opposite to the top wall and contacts the top wall, the folded edges contact the side walls, at least one of the top wall and the side walls is provided with the connecting groove, and the top wall is provided with the opening; The melting point of the connector is lower than that of the conductive adhesive; the shielding component and the shielding cover are fixedly connected by the connector.

2. The circuit board assembly according to claim 1, characterized in that, The shielding component and the shielding cover are bonded together with the conductive adhesive.

3. The circuit board assembly according to any one of claims 1-2, characterized in that, The connecting groove is arranged around the opening.

4. An electronic device, characterized in that, The electronic device includes a housing and a circuit board assembly as described in any one of claims 1-2; The circuit board assembly is disposed within the housing.

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