Semiconductor device

Abstract

In a semiconductor device, a cover is reliably embedded in a housing, and the height of the semiconductor device is reduced. This semiconductor device is provided with: a case in which a circuit board on which a semiconductor element is mounted is housed in a board housing region; and a cover that covers the substrate storage area. The cover has a plurality of extension portions and a plurality of deformation holes, and the plurality of extension portions include: a first extension portion extending toward the substrate housing area side (the negative side in the Z direction) and having a protruding portion protruding in a first direction (the positive side in the X direction); and a second extension portion extending toward the substrate housing area side (the negative side in the Z direction) and having a protruding portion protruding in the first direction (the positive side in the X direction). And a second extending portion extending toward the substrate housing area side (the negative side in the Z direction) and having a protruding portion protruding in a second direction (the negative side in the X direction) opposite to the first direction. The housing is provided with a plurality of hooking parts, and the protruding parts of the extending parts are hooked on the hooking parts respectively.

Description

Technical Field

[0001] The present invention relates to a semiconductor device in which a cover is embedded in a housing. Background Art

[0002] Conventionally, semiconductor devices include a circuit board on which semiconductor elements such as IGBTs (Insulated Gate Bipolar Transistors) are mounted, and are used in inverter devices and the like (see, for example, Patent Documents 1 to 10).

[0003] Prior art literature

[0004] Patent Literature

[0005] Patent Document 1: Japanese Utility Model Patent No. 3237816

[0006] Patent Document 2: International Publication No. 2017 / 163638

[0007] Patent Document 3: Japanese Patent Application Publication No. 2023-88146

[0008] Patent Document 4: Japanese Patent Application Publication No. 2022-65692

[0009] Patent Document 5: International Publication No. 2019 / 058454

[0010] Patent Document 6: Japanese Patent Application Publication No. 2021-72329

[0011] Patent Document 7: Japanese Patent Application Publication No. 2021-129451

[0012] Patent Document 8: Japanese Patent Application Publication No. 2018-139278

[0013] Patent Document 9: Japanese Patent Application Publication No. 2021-114511

[0014] Patent Document 10: Japanese Patent Application Publication No. 2014-150204 Summary of the invention

[0015] Problem that the invention aims to solve

[0016] However, when the cover is disposed in the semiconductor device, embedding can be said to be a simple and simplified structure, but from the viewpoint of protecting the circuit substrate, etc., it is required that the cover be reliably embedded in the housing. Therefore, it is considered that the convex portion for embedding is provided on the extension portion extending downward from the cover, but in this case, in order to alleviate the reaction force generated by the deformation when the convex portion is hooked on the housing, the extension portion is extended downward longer, and the height of the semiconductor device becomes higher.

[0017] An object of the present invention is to provide a semiconductor device in which a cover can be reliably fitted into a case and a lower height can be achieved.

[0018] Solutions for solving problems

[0019] In one technical solution, a semiconductor device comprises: a shell that accommodates a circuit substrate with semiconductor elements mounted thereon in a substrate storage area; and a cover that covers the substrate storage area, the cover having a plurality of extension portions and a plurality of deformation holes, the plurality of extension portions comprising: a first extension portion that extends toward the substrate storage area and has a convex portion that protrudes in a first direction; and a second extension portion that extends toward the substrate storage area and has a convex portion that protrudes in a second direction that is opposite to the first direction, the shell having a plurality of hook portions, the convex portions of the extension portions being hooked on the plurality of hook portions respectively.

[0020] Effects of the Invention

[0021] According to the above-described aspect, the cover can be reliably fitted into the housing and a lower height can be achieved. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 It is a top view showing a semiconductor device according to one embodiment.

[0023] Figure 2 It is a perspective view showing a semiconductor device according to one embodiment.

[0024] Figure 3 This is a plan view showing a semiconductor device with a cover removed according to one embodiment.

[0025] Figure 4 This is a perspective view showing a semiconductor device with a cover removed according to one embodiment.

[0026] Figure 5 yes Figure 1 VV cross-sectional view of.

[0027] Figure 6 yes Figure 1 Enlarged view of part VI.

[0028] Figure 7 yes Figure 6 VII-VII sectional view.

[0029] Figure 8 yes Figure 1 An enlarged view of Part VIII.

[0030] Fig. 9 yes Figure 8 IX-IX sectional view.

[0031] Fig.10 is a top view showing the second deformation hole and the like in the first deformation example of one embodiment (same as Figure 1 The enlarged view of part VI Figure 6 correspond).

[0032] Fig.11 is a cross-sectional view showing the fourth deformation hole and the like in the second deformation example of one embodiment (same as Figure 8 IX-IX cross-sectional view Fig. 9 correspond).

[0033] Description of Reference Numerals

[0034] 1. semiconductor device; 10. housing; 11. storage wall; 11a. first hooking portion; 11b. second hooking portion; 11c, 11d, 11e. cover receiving portion; 12. first partition wall; 12a. third hooking portion (middle hooking portion); 13. second partition wall; 13a. fourth hooking portion (middle hooking portion); 14. fixing hole; 15, 16. positioning hole; 20. cover; 21. first extension portion; 21a. convex portion; 22. second extension portion; 22a. convex portion; 23. third extension portion (middle extension portion); 23a. convex portion; 24. fourth extension portion (middle extension portion); 24a. convex portion; 25a. first deformation hole; 25b. second deformation hole; 25b-1. second deformation hole (first deformation example); 25b-2. 1a, 25b-1b, end portion (first variant); 25b-1c, central portion (first variant); 25c, 25d, third deformation hole (middle deformation hole); 25e, 25f, fourth deformation hole (middle deformation hole); 25e-1, 25e-2, recess; 25f-1, fourth deformation hole (second variant); 26a, 26b, recess; 26b-1, recess (first variant); 30, P terminal; 40, N terminal; 50, M terminal; 60, control terminal; 70, circuit substrate; 70a, insulating plate; 70b, heat sink; 70c, circuit board; 71, semiconductor element; 80, metal base; A1, A2, A3, substrate storage area; G, gel; J1, J2, bonding material. DETAILED DESCRIPTION

[0035] Hereinafter, a semiconductor device according to an embodiment of the present invention will be described with reference to the drawings. Note that the present invention is not limited to the embodiment described below, and can be implemented with appropriate modifications within the scope of the gist thereof.

[0036] Figure 1 and Figure 2 1 and 2 are a plan view and a perspective view showing a semiconductor device 1 according to an embodiment.

[0037] Figure 3 and Figure 41 and 2 are a plan view and a perspective view showing the semiconductor device 1 in a state where the cover 20 is removed.

[0038] Figure 5 yes Figure 1 VV cross-sectional view of. Figure 6 yes Figure 1 Enlarged view of part VI. Figure 7 yes Figure 6 VII-VII sectional view. Figure 8 yes Figure 1 An enlarged view of Part VIII. Fig. 9 yes Figure 8 IX-IX sectional view.

[0039] In addition, regarding Figures 1 to 9 and the following Fig.10 and Fig.11 The X direction, Y direction, and Z direction shown in the figure define the vertical direction of the semiconductor device 1 (the thickness direction of the circuit substrate 70) as the Z direction, and in the X direction and the Y direction orthogonal to the Z direction, the length direction of the semiconductor device 1 (cover 20) is defined as the X direction, and the width direction of the semiconductor device 1 (cover 20) is defined as the Y direction. In addition, depending on the situation, the X direction is sometimes referred to as the left-right direction, the Y direction is sometimes referred to as the front-back direction, and the Z direction is sometimes referred to as the up-down direction. These directions are terms used for convenience of explanation, and the corresponding relationship between the XYZ directions may change depending on the installation posture of the semiconductor device 1.

[0040] The semiconductor device 1 of this embodiment is applied to a power conversion device such as a power control unit and is a power semiconductor module constituting an inverter circuit. The semiconductor device 1 can be used for any purpose and is used as an inverter device for a vehicle-mounted or industrial motor, for example.

[0041] like Figure 3 and Figure 5 As shown, the semiconductor device 1 includes a housing 10 that accommodates three circuit substrates 70 (in the substrate accommodation areas A1, A2, and A3) on which semiconductor elements 71 are mounted. Figure 3 In the figure, because it is located inside the gel G, it is shown with hidden lines, i.e., dotted lines); and a cover 20, which covers the substrate storage areas A1, A2, and A3. Figure 5 In FIG. 1 , the housing 10 , the cover 20 , and the gel G are marked with hatching lines indicating cross sections.

[0042] like Figure 3 and Figure 4As shown, the housing 10 is rectangular in plan view, and a cylindrical storage wall 11 protrudes upward from the upper surface. Three substrate storage areas A1 to A3 storing circuit substrates 70 are located inside the storage wall 11. The sizes of these substrate storage areas A1 to A3 in plan view are the same or substantially the same.

[0043] A first hook portion 11a is provided from the right end of the storage wall 11, and protrudes toward the substrate storage area A1 side (negative side in the X direction). In addition, a second hook portion 11b is provided from the left end of the storage wall 11, and protrudes toward the substrate storage area A3 side (positive side in the X direction). The first hook portion 11a and the second hook portion 11b are provided at the upper portion of the inner peripheral surface of the storage wall 11. The first hook portion 11a and the second hook portion 11b are hooked with the substrate to be described later. Figure 1 and Figure 2 The convex parts 21a and 22a of the first extension part 21 and the second extension part 22 of the cover 20 are shown. Figure 3 and Figure 4 In the embodiment, the first hook portion 11 a and the second hook portion 11 b are provided at the center of the storage wall 11 in the width direction of the housing 10 , but the positions in the width direction are not particularly limited.

[0044] like Figure 3 and Figure 4 As shown in FIG. 1 , cover receiving portions 11c and 11d for placing the cover 20 are provided at the right front corner and the left front corner of the storage wall 11. Figure 3 As shown, at the rear portion inside the storage wall 11, a cover receiving portion 11e is provided at the same height as the first partition wall 12 and the second partition wall 13, spanning the right rear corner and the left rear corner.

[0045] The housing 10 has a first partition wall 12 and a second partition wall 13 that partition three substrate storage areas A1 to A3 arranged in the X direction. In addition, a metal base 80 described later is arranged below each of the substrate storage areas A1 to A3, and the housing 10 penetrates each of the substrate storage areas A1 to A3 in the vertical direction to form a hollow space.

[0046] A third hook portion 12a is provided on the upper surface of the first partition wall 12 so as to protrude toward the substrate storage area A1 side (positive side in the X direction). In addition, a fourth hook portion 13a is provided on the upper surface of the second partition wall 13 so as to protrude toward the substrate storage area A3 side (negative side in the X direction). The upper surface of the third hook portion 12a is located above the upper surface of the other portions of the first partition wall 12. In addition, the upper surface of the fourth hook portion 13a is located above the upper surface of the other portions of the second partition wall 13. The convex portions 23a and 24a of the third extension portion 23 and the fourth extension portion 24 of the cover 20 are hooked on these third hook portions 12a and fourth hook portions 13a. The third hook portion 12a and the fourth hook portion 13a are examples of intermediate hook portions. The housing 10 is embedded in the cover 20 by using the above-mentioned snap-fit ​​structure based on the hook parts 11a, 11b, 12a, 13a and the protrusions 21a to 24a. The hook parts 11a, 11b, 12a, 13a are integrated with the housing 10 by injection molding, for example. In addition, the protrusions 21a to 24a and the extensions 21 to 24 themselves can also be called claws. In addition, the hook parts 11a, 11b, 12a, 13a can also be pits (recesses) provided on the wall surface of the housing 10 (storage wall 11, first partition wall 12 or second partition wall 13). In addition, the area below the hook parts 11a, 11b, 12a, 13a can also be regarded as a recess.

[0047] The housing 10 is formed with a plurality of (eg Figure 3 As shown, for example, there are six fixing holes 14. The fixing holes 14 are holes through which bolts for fixing the semiconductor device 1 to an external device such as a cooler (not shown) are passed.

[0048] The housing 10 has a positioning hole 15 provided at a position closer to the positive side in the Y direction than the storage wall 11, and a positioning hole 16 provided at a position closer to the negative side in the Y direction than the storage wall 11. The positions of these positioning holes 15 and 16 in the X direction are different from each other. The positioning hole 15 is circular in a plan view, whereas the positioning hole 16 is a long hole extending obliquely toward the positioning hole 15 in a plan view. Thus, for example, even if the spacing between the positioning pin of the external device inserted into the positioning hole 15 and the positioning pin of the external device inserted into the positioning hole 16 deviates due to tolerance or the like, the two positioning pins can be inserted into the positioning holes 15 and 16.

[0049] In addition, the resin used for the housing 10 may be selected from insulating resins such as polybutylene terephthalate (PBT), polybutyl acrylate (PBA), polyamide (PA), acrylonitrile butadiene styrene (ABS), liquid crystal polymer (LCP), polyether ether ketone (PEEK), polybutylene succinate (PBS), polyurethane, silicone resin, etc., in addition to polyphenylene sulfide (PPS). In addition, the selected resin may be a mixture of two or more resins. The resin may also contain fillers (such as glass fillers) for improving strength or functionality.

[0050] like Figure 4 and Figure 5 As shown, the gel G injected into the substrate storage areas A1 to A3 seals the circuit substrate 70, the semiconductor element 71 mounted on the circuit substrate 70, and the like. The gel G is, for example, a transparent silicone gel. A sealing resin may be used instead of the gel G. The sealing resin is, for example, composed of a thermosetting resin. The sealing resin preferably includes any one of epoxy resin, silicone, polyurethane, polyimide, polyamide, and polyamide-imide. From the viewpoint of insulation, heat resistance, and heat dissipation, the sealing resin is, for example, preferably an epoxy resin mixed with a filler.

[0051] like Figure 1 as well as Figure 6 to Figure 9 As shown in the figure, the cover 20 has a first extension portion 21, a second extension portion 22, a third extension portion 23, and a fourth extension portion 24, each extending to the negative side in the Z direction. These extension portions 21 to 24 are formed integrally with the cover 20 by, for example, injection molding. The first extension portion 21 and the fourth extension portion 24 have convex portions 21a and 24a protruding to the positive side in the X direction, which is an example of the first direction. The second extension portion 22 and the third extension portion 23 have convex portions 22a and 23a protruding to the negative side in the X direction, which is an example of the second direction, which is the direction opposite to the first direction.

[0052] The first extension portion 21 is located at one end (right end) side in the longitudinal direction (X direction) of the cover 20, and the second extension portion 22 is located at the other end (left end) side in the longitudinal direction of the cover 20. That is, the first extension portion 21 and the second extension portion 22 are located at both end sides in the longitudinal direction of the cover 20, and the convex portions 21a and 22a protrude away from each other in the longitudinal direction of the cover 20. In addition, when the cover 20 is square in a plan view, the left-right direction (X direction) and the front-back direction (Y direction) can be referred to as the longitudinal direction of the cover 20.

[0053] like Figure 6 and Figure 7As shown in FIG. 1 , the second extension portion 22 extends from a position adjacent to the recessed portion 26b provided at the end portion (left end) in the longitudinal direction (X direction) of the cover 20 toward the negative side in the Z direction (height, i.e., length L). That is, the second extension portion 22 is provided at a position of the cover 20 that is recessed from the left end in the longitudinal direction (X direction) toward the right (positive side in the X direction).

[0054] The first extension portion 21 is symmetrical with the second extension portion 22. Figure 1 and Figure 2 As shown in FIG. 1 , the first extension portion 21 extends toward the negative side in the Z direction from a position adjacent to the recessed portion 26a provided at the end (right end) in the longitudinal direction (X direction) of the cover 20. That is, the first extension portion 21 is provided at a position recessed toward the left (negative side in the X direction) from the right end in the longitudinal direction (X direction) of the cover 20.

[0055] like Figure 1 and Figure 2 As shown in the figure, the third extension part 23 is located at a position closer to the first extension part 21 side (positive side in the X direction) than the center in the longitudinal direction of the cover 20, so that the protrusion 23a is hooked on the third hooking part 12a of the first partition wall 12. The fourth extension part 24 is located at a position closer to the second extension part 22 side (negative side in the X direction) than the center in the longitudinal direction of the cover 20, so that the protrusion 24a is hooked on the fourth hooking part 13a of the second partition wall 13. The third extension part 23 and the fourth extension part 24 are examples of one or more intermediate extension parts located between the first extension part 21 and the second extension part 22 in the longitudinal direction (X direction) of the cover 20. As the intermediate extension part, only one of the third extension part 23 and the fourth extension part 24 may be provided, or an extension part having a protrusion protruding in a direction different from the protrusions 23a and 24a of the third extension part 23 and the fourth extension part 24 may be provided. In these cases, the intermediate hooking portions, such as the third hooking portion 12a and the fourth hooking portion 13a, and the intermediate deformation holes described below may be provided in a number and in a direction corresponding to the intermediate extending portion.

[0056] like Figure 8 and Fig. 9 As shown, the fourth extension portion 24 extends from between the fourth deformation holes 25e and 25f provided in the cover 20 to the negative side in the Z direction (length (height) L). The third extension portion 23 and the fourth extension portion 24 are symmetrical with each other, and the third extension portion 23 extends from between the third deformation holes 25c and 25d provided in the cover 20 to the negative side in the Z direction.

[0057] like Figure 1 and Figure 2As shown in FIG. 1 , the cover 20 includes a first deformation hole 25a, a second deformation hole 25b, a third deformation hole 25c, 25d, and a fourth deformation hole 25e, 25f as an example of a plurality of deformation holes for relieving (relieving) the reaction force generated by the deformation of the first extension portion 21, the second extension portion 22, the third extension portion 23, and the fourth extension portion 24. The first deformation hole 25a relieves the reaction force generated by the deformation of the first extension portion 21, the second deformation hole 25b relieves the reaction force generated by the deformation of the second extension portion 22, the third deformation holes 25c, 25d relieve the reaction force generated by the deformation of the third extension portion 23, and the fourth deformation holes 25e, 25f relieve the reaction force generated by the deformation of the fourth extension portion 24. Each of the deformation holes 25a to 25f coincides with the center position in the Y direction of the extension portions 21 to 24, which are the objects of relieving the reaction force generated by the deformation. Each of the deformation holes 25a to 25f extends in a straight line in a direction (Y direction) orthogonal to the length direction (X direction) of the cover 20 and the depth direction (Z direction) of the substrate storage areas A1 to A3, and is longer than the extensions 21 to 24 that are the objects of relieving the reaction force generated by the deformation. That is, each of the deformation holes 25a to 25f extends in the Y direction in the front and rear direction longer than the extensions 21 to 24 that are the objects of relieving the reaction force generated by the deformation. However, at least one of the deformation holes 25a to 25f may extend in a direction different from the Y direction or in a curved shape, or may be formed in other shapes such as a circular shape or an elliptical shape. In addition, each of the deformation holes 25a to 25f penetrates the cover 20 in the thickness direction (Z direction). The third deformation holes 25c and 25d are an example of intermediate deformation holes that relieve the reaction force generated by the deformation of the third extension part 23 on both sides of the third extension part 23 (intermediate extension part) in the length direction (X direction) of the cover 20. Similarly, the fourth deformation holes 25e and 25f are an example of intermediate deformation holes for relieving the reaction force generated by the deformation of the fourth extension part 24 on both sides of the fourth extension part 24 (intermediate extension part) in the longitudinal direction (X direction) of the cover 20. Here, it can be said that the deformation holes 25a to 25f can promote the deformation of the extension parts 21 to 24 by narrowing the width of the extension parts 21 to 24 in any direction, or the deformation of the extension parts 21 to 24 can be absorbed by the deformation holes 25a to 25f, thereby relieving (releasing) the reaction force generated by the deformation of the extension parts 21 to 24.

[0058] The first deformation hole 25a and the second deformation hole 25b are provided adjacent to the first extension portion 21 and the second extension portion 22 (see Figure 7 The first deformable hole 25a and the second deformable hole 25b are symmetrical with each other.

[0059] like Figure 8 As shown, the fourth deformation hole 25e, which is located at the positive side of the fourth extension part 24 in the X direction, has a recessed portion 25e-1 that is recessed in the direction opposite to the positive side of the X direction from which the protrusion 24a of the fourth extension part 24 protrudes. The recessed portion 25e-1 is located at a position sandwiching the fourth extension part 24 between the fourth deformation hole 25f when viewed from above, and is therefore located in the same area as the protrusion 24a. In addition, the fourth deformation hole 25e has a recessed portion 25e-2 that is recessed in the positive side of the X direction opposite to the recessed portion 25e-1. These recessed portions 25e-1 and 25e-2 can be said to be provided to avoid interference with the fourth hooking portion 13a of the second partition wall 13. In addition, the recessed portion 25e-1 on one side can also be said to be provided to shorten the width of the fourth extension part 24 in the X direction.

[0060] The third deformation holes 25c and 25d are symmetrical with the fourth deformation holes 25e and 25f. The third deformation hole 25c, which is located at the negative side of the X direction relative to the third extension 23, has a concave portion (left-right symmetrical with the concave portion 25e-1) that is recessed in the opposite direction to the negative side of the X direction from which the convex portion 23a of the third extension 23 protrudes. The concave portion is located at a position where the third extension 23 is sandwiched between the third deformation hole 25d when viewed from above, and is therefore located in the same area as the convex portion 23a. In addition, the third deformation hole 25c has a concave portion (left-right symmetrical with the concave portion 25e-2) that is recessed in the negative side of the X direction opposite to the above-mentioned concave portion. It can be said that these concave portions are provided to avoid interference with the third hooking portion 12a of the first partition wall 12. It can also be said that the recessed portion on one side (left-right symmetrical with the recessed portion 25 e - 1 ) is provided to shorten the width of the third extending portion 23 in the X direction.

[0061] In addition, if Figure 1 and Figure 2 As shown in FIG. 1 , characters such as “U”, “V”, “W”, “P1”, “N1”, “P2”, “N2”, “P3”, “N3”, “K1”, and “E6” are formed on the upper surface of the cover 20 in a rectangular area that is recessed downward so as to protrude upward. The upper surface of each character is consistent with the upper surface of the cover 20 or is located below the upper surface of the cover 20.

[0062] like Figure 1 to Figure 4As shown, the housing 10 is provided with main terminals (P terminal 30, N terminal 40 and M terminal 50) functioning as external connection terminals for connecting to an external conductor and a control terminal 60. One P terminal 30, one N terminal 40 and one M terminal 50 are respectively arranged for each circuit substrate 70. The P terminal 30 may also be referred to as a positive terminal (input terminal) or a first main terminal, the N terminal 40 may also be referred to as a negative terminal (output terminal) or a second main terminal, and the M terminal 50 may also be referred to as an intermediate terminal (output terminal) or a third main terminal.

[0063] The P terminal 30 and the N terminal 40 are located on the negative side in the Y direction relative to the circuit substrate 70. In addition, the M terminal 50 is located on the positive side in the Y direction relative to the circuit substrate 70. The P terminal 30, the N terminal 40, and the M terminal 50 are preferably formed by bending a metal material such as a copper material, a copper alloy material, an aluminum alloy material, or an iron alloy material by press working or the like.

[0064] The P terminal 30, the N terminal 40 and the M terminal 50 are fastened to the external conductor by screws at one end. Figure 5 As shown, for example, it is bent several times, and the other end side is joined to the circuit substrate 70 (for example, the circuit board 70c of the circuit substrate 70 or a copper block (not shown) provided on the circuit board 70c) to be electrically connected.

[0065] The three circuit boards 70 on which the semiconductor elements 71 are mounted respectively correspond to, for example, phases U, V, and W, and form a three-phase inverter circuit as a whole. The three circuit boards 70 on which the semiconductor elements 71 are mounted may also be referred to as power units or semiconductor units.

[0066] The circuit board 70 is composed of, for example, a DCB (Direct Copper Bonding) board, an AMB (Active Metal Brazing) board, or a metal base board. Figure 5 As shown, the circuit board 70 includes, for example, an insulating plate 70a, a heat sink 70b disposed on the lower surface of the insulating plate 70a, and a plurality of circuit boards 70c disposed on the upper surface of the insulating plate 70a. The circuit board 70 can be called a laminated board and is formed in, for example, a rectangular shape in plan view.

[0067] The insulating plate 70a is formed of, for example, a ceramic material such as aluminum oxide (Al2O3), aluminum nitride (AlN), silicon nitride (Si3N4), a composite material of aluminum oxide and zirconium oxide (ZrO2), a resin material such as epoxy resin, or an insulating material such as an epoxy resin material using a ceramic material as a filler. The insulating plate 70a may also be referred to as an insulating layer or an insulating film.

[0068] The heat sink 70b has a predetermined thickness in the Z direction and is formed on the lower surface of the insulating plate 70a. The heat sink 70b is formed of a metal plate with good thermal conductivity such as copper or aluminum. The heat sink 70b is bonded to the upper surface of the metal base 80 using a bonding material J1 such as solder.

[0069] The number of circuit boards 70c formed on the upper surface of the insulating plate 70a can be any number of more than one. The circuit board 70c is a metal layer such as copper foil, and is formed in multiple islands on the insulating plate 70a in a state of electrical insulation. In addition, the circuit board 70c can also be called a circuit layer.

[0070] On the upper surface, or mounting surface, of the circuit substrate 70 (circuit board 70c), a semiconductor element 71 is mounted via a bonding material J2. Figure 3 , two semiconductor elements 71 are shown for each circuit substrate 70, but the number of semiconductor elements 71 is arbitrary. The semiconductor element 71 is formed into a square or rectangular shape in plan view using a semiconductor substrate such as silicon (Si), silicon carbide (SiC), gallium nitride (GaN), or diamond.

[0071] In addition, as the semiconductor element 71, switching elements such as IGBT, power MOSFET (Metal Oxide Semiconductor Field Effect Transistor), and diodes such as FWD (Free Wheeling Diode) are used. The switching element and the diode can be connected in reverse parallel. In addition, as the semiconductor element 71, an RC (Reverse Conducting: Reverse Conducting)-IGBT element, a power MOSFET element, and an RB (Reverse Blocking: Reverse Blocking)-IGBT with sufficient withstand voltage for reverse bias can also be used. In particular, the RC-IGBT element can realize the miniaturization of the internal circuit by bidirectional power supply, thereby realizing the miniaturization of the semiconductor device 1 (circuit substrate 70).

[0072] The semiconductor element 71 is conductively connected to a predetermined circuit board 70c via a metal wiring plate (not shown). The metal wiring plate is made of, for example, a metal raw material such as a copper raw material, a copper alloy raw material, an aluminum alloy raw material, an iron alloy raw material, and is formed by bending using a stamping process or the like. For example, the semiconductor element 71 and the metal wiring plate are joined using a bonding material such as solder. The metal wiring plate may also be referred to as a lead frame. In addition, other connecting members such as a wire may be configured to replace the metal wiring plate. In addition, the semiconductor element 71 is directly or indirectly connected to the control terminal 60 using a connecting member. The control terminal 60 is configured, for example, 10 for each circuit substrate 70 on the storage wall 11 of the housing 10. More specifically, with respect to one circuit substrate 70, 10 control terminals 60 are each configured 5 in the left-right direction (X direction) with the M terminal 50 therebetween.

[0073] In addition, in the above description, an example is given in which three main terminals (P terminal 30, N terminal 40 and M terminal 50) are provided on each of the three circuit substrates 70, but the semiconductor device 1 only needs to have at least one circuit substrate 70, and the number of main terminals and control terminals can be set to any number.

[0074] The metal base 80 is a rectangular plate-shaped member. The metal base 80 functions as a heat conduction member that conducts heat generated by the semiconductor element 71 to a cooler (not shown) located below the metal base 80, and is formed of a metal plate such as a copper plate or an aluminum plate. In addition, the metal base 80 and the cooler are joined via a heat conductive material such as thermal grease or a heat conductive compound.

[0075] Next, fitting of the cover 20 into the housing 10 will be described.

[0076] First, with the semiconductor element 71 mounted on the circuit board 70 and the P terminal 30 , N terminal 40 , M terminal 50 and control terminal 60 electrically connected to the circuit board 70 and the semiconductor element 71 , the gel G is injected into the board housing areas A1 to A3 .

[0077] Then, the cover 20 is horizontally placed in the storage wall 11 so as to cover the substrate storage areas A1 to A3. Figure 3 and Figure 4The upper surfaces of the cover receiving parts 11c, 11d, 11e, the first partition wall 12 and the second partition wall 13 shown are in contact with each other, but each extension part 21 to 24 is elastically deformed during the placement process. Specifically, the first extension part 21 is deformed to the negative side of the X direction when the protrusion 21a is hooked to the first hook part 11a. The second extension part 22 is deformed to the positive side of the X direction when the protrusion 22a is hooked to the second hook part 11b. The third extension part 23 is deformed to the positive side of the X direction when the protrusion 23a is hooked to the third hook part 12a. The fourth extension part 24 is deformed to the negative side of the X direction when the protrusion 24a is hooked to the fourth hook part 13a. Furthermore, if protrusions (not shown) extending upward are provided on the convex portions 21a to 24a and the protrusions are engaged with recesses (not shown) or protrusions (not shown) provided on the bottom surfaces of the hook portions 11a, 11b, 12a, and 13a, the cover 20 can be more reliably fitted into the housing 10.

[0078] As described above, the reaction force generated by the deformation of the extensions 21 to 24 is mitigated by the deformation holes 25a to 25f. In addition, when the bottom surface of the cover 20 is in contact with the upper surfaces of the cover receiving parts 11c, 11d, 11e, the first partition wall 12, and the second partition wall 13, the convex parts 21a to 24a of the extensions 21 to 24 are hooked on the hook parts 11a, 11b, 12a, 13a, and the extensions 21 to 24 are elastically deformed to return to their original shapes.

[0079] Fig.10 is a top view showing the second deformation hole 25b-1 and the like in the first deformation example of the present embodiment (same as Figure 1 The enlarged view of part VI Figure 6 correspond).

[0080] The above Figure 6 The second deformation hole 25b shown is a long hole extending in a straight line along the Y direction. Fig.10 The second deformation hole 25b-1 in the first deformation example shown extends in the Y direction, but the center portion 25b-1c is located farther from the convex portion 22a of the second extension portion 22 in the longitudinal direction (positive side of the X direction) of the cover 20 than the two end portions (end portions 25b-1a, 25b-1b). In addition, in the second deformation hole 25b-1, the center portion 25b-1c extending in the Y direction in a straight line and the two end portions (end portions 25b-1a, 25b-1b) extending in the Y direction in a straight line at the negative side of the X direction relative to the center portion 25b-1c are integrated via a portion extending obliquely. That is, the second deformation hole 25b-1 is formed in a shape along the outer peripheral edge of the cover 20.

[0081] In this way, the central portion 25b-1c is located closer to the positive side of the X direction than the two end portions (end portions 25b-1a, 25b-1b), and the second deformation hole 25b-1 is formed in a shape along the outer peripheral edge of the cover 20, so that the length in the longitudinal direction from the other end (left end) of the cover 20 to the end portion 25b-1a, the length in the longitudinal direction from the recessed portion 26b-1 to the central portion 25b-1c, and the length in the longitudinal direction from the other end (left end) of the cover 20 to the end portion 25b-1b can be made constant. Therefore, the deformation of the second extension portion 22 is promoted, and the reaction force generated by the deformation of the second extension portion 22 can be more easily and reliably alleviated. In addition, in this first deformation example, the recessed portion 26b-1 and Figure 6 The recessed portion 26 b shown is different in that it is not rectangular in plan view, but its width in the Y direction continuously narrows from the opening portion (left end) toward the positive side (right side) in the X direction.

[0082] Here, the first deformation hole 25a can also be formed in a shape that is symmetrical with the second deformation hole 25b-1. In addition, the third deformation hole 25d can also be formed in the same shape as the second deformation hole 25b-1, and the fourth deformation hole 25f can also be formed in a shape that is symmetrical with the second deformation hole 25b-1. In addition, the recess 26a can also be formed in a shape that is symmetrical with the recess 26b-1.

[0083] Fig.11 is a cross-sectional view showing the fourth deformation hole 25f-1 and the like in the second deformation example of the present embodiment (same as Figure 8 IX-IX cross-sectional view Fig. 9 correspond).

[0084] In the above example, each of the deformation holes 25a to 25f penetrates the cover 20 in the thickness direction (Z direction), but may also be Fig.11 As shown in the fourth deformation hole 25f-1, it is a pit provided on the bottom surface of the cover 20 (the surface on the side of the substrate storage areas A1 to A3) along the direction from the bottom surface of the cover 20 to the upper surface (the positive side in the Y direction). In particular, when the thickness of the cover 20 is relatively thick, the depth of the deformation holes such as the fourth deformation hole 25f-1 that does not penetrate the cover 20 is made deeper, so that the reaction force generated by the deformation of the extension parts 21 to 24 can be easily alleviated.

[0085] In the present embodiment described above, the semiconductor device 1 includes: a housing 10 that stores a circuit substrate 70 on which a semiconductor element 71 is mounted in the substrate storage areas A1 to A3; and a cover 20 that covers the substrate storage areas A1 to A3. The cover 20 includes: a plurality of extensions 21 to 24 that extend toward the substrate storage areas A1 to A3 (negative side in the Z direction) and are provided with convex portions 21a to 24a; and a plurality of deformation holes 25a to 25f that, for example, mitigate the reaction force generated by the deformation of the plurality of extensions 21 to 24. The housing 10 includes a plurality of hooks 11a, 11b, 12a, and 13a, and the convex portions 21a to 24a of the extensions 21 to 24 are hooked on the plurality of hooks 11a, 11b, 12a, and 13a, respectively. The plurality of extension portions 21 to 24 include: a first extension portion 21 having a convex portion 21a protruding in a first direction (positive side in the X direction); and a second extension portion 22 having a convex portion 22a protruding in a second direction (negative side in the X direction) which is opposite to the first direction (positive side in the X direction).

[0086] Thus, the convex portions 21a and 22a of the first extension portion 21 and the second extension portion 22 that protrude in opposite directions to each other can be hooked on the first hook portion 11a and the second hook portion 11b of the housing 10. Therefore, the cover 20 can be reliably fitted into the housing 10. Moreover, the plurality of deformation holes 25a to 25f mitigate the reaction force generated by the deformation of the plurality of extension portions 21 to 24, so that the plurality of extension portions 21 to 24 do not need to ensure a length L for mitigating the warping force, and the length L of the extension portions 21 to 24 extending toward the substrate storage areas A1 to A3 side (negative side in the Z direction) can be shortened. Thus, the height of the extension portions 21 to 24 can be reduced, and the height of the semiconductor device 1 can be reduced. Therefore, according to the present embodiment, the cover 20 can be reliably fitted into the housing 10 and the height of the semiconductor device 1 can be reduced. In addition, since the reaction force generated by the deformation of the extension portions 21 to 24 can be mitigated, the extension portions 21 to 24 can be prevented from being broken when the cover 20 is fitted. In addition, compared with a configuration in which an adhesive is used for fixing the housing 10 and the cover 20, cost reduction can be achieved by omitting or reducing the adhesive. In addition, even if the circuit board 70 and the like are sealed with the gel G, the length L (height) of the extensions 21 to 24 can be shortened, so the height of the board storage areas A1 to A3 can be reduced.

[0087] In addition, in this embodiment, the first extension portion 21 and the second extension portion 22 are located at both end sides in the longitudinal direction (X direction) of the cover 20, and the convex portion 21a of the first extension portion 21 and the convex portion 22a of the second extension portion 22 protrude in a manner away from each other in the longitudinal direction of the cover 20.

[0088] Thus, the convex parts 21a and 22a of the first extension part 21 and the second extension part 22 are hooked on the first hook part 11a and the second hook part 11b from the inside of the storage wall 11 (housing 10) (so-called internal hooking). In this way, since the first extension part 21 and the second extension part 22 are located on the inside of the storage wall 11, the size of the semiconductor device 1 in a plan view can be reduced compared with the form in which the convex parts are hooked on the housing 10 from the outside of the storage wall 11 (so-called external hooking). In addition, by adopting the internal hooking, it is possible to more reliably prevent the cover 20 from being hooked off due to warping caused by temperature changes, etc., compared with the external hooking. However, the above-mentioned external hooking structure in which the first extension part 21 and the second extension part 22 are hooked on the housing 10 from the outside of the storage wall 11 can also be adopted. In this case, the convex parts 21a and 22a of the first extension part 21 and the second extension part 22 are provided in a manner protruding in directions close to each other. Alternatively, the plurality of extension portions 21 to 24 may include only the first extension portion 21 and the second extension portion 22 , or the first extension portion 21 and the second extension portion 22 may be provided at positions different from both ends of the cover 20 in the longitudinal direction (X direction).

[0089] In addition, in this embodiment, the multiple extension portions 21 to 24 also include one or more intermediate extension portions (the third extension portion 23 and the fourth extension portion 24), which are located between the first extension portion 21 and the second extension portion 22 on both end sides of the cover 20 in the longitudinal direction (X direction).

[0090] Therefore, the cover 20 can be hooked on the housing 10 not only at both ends in the longitudinal direction of the cover 20 but also at the middle portion. As a result, even if the cover 20 is warped due to temperature changes or the like and vibration is applied to the semiconductor device 1, the cover 20 is unlikely to fall off from the housing 10. Therefore, the cover 20 can be more reliably fitted into the housing 10.

[0091] In addition, in the present embodiment, one or more intermediate extension portions located between the first extension portion 21 and the second extension portion 22 in the longitudinal direction (X direction) of the cover 20 include: a third extension portion 23 having a protrusion 23a protruding in the second direction (negative side of the X direction); and a fourth extension portion 24 having a protrusion 24a protruding in the first direction (positive side of the X direction).

[0092] Thus, the cover 20 can be hooked on the housing 10 in directions away from each other by using the convex portion 21a of the first extension portion 21 protruding in the first direction (X direction positive side) and the convex portion 23a of the third extension portion 23 protruding in the second direction (X direction negative side). Furthermore, the cover 20 can be hooked on the housing 10 in directions away from each other by using the convex portion 22a of the second extension portion 22 protruding in the second direction (X direction negative side) and the convex portion 24a of the fourth extension portion 24 protruding in the first direction (X direction positive side). Therefore, the cover 20 can be more reliably fitted into the housing 10.

[0093] In addition, in the present embodiment, the housing 10 has a plurality of substrate storage areas A1 to A3 and a first partition wall 12 and a second partition wall 13 (an example of one or more partition walls) that partition the plurality of substrate storage areas A1 to A3. The plurality of hooking portions 11a, 11b, 12a, 13a include a third hooking portion 12a and a fourth hooking portion 13a (an example of one or more intermediate hooking portions), the third hooking portion 12a and the fourth hooking portion 13a being provided on the first partition wall 12 and the second partition wall 13, and hooking the convex portions 23a, 24a of the intermediate extension portion (the third extension portion 23 and the fourth extension portion 24).

[0094] Thus, the convex portions 23a and 24a of the third extension portion 23 and the fourth extension portion 24 can be hooked on the housing 10 (the third hooking portion 12a of the first partition wall 12 and the fourth hooking portion 13a of the second partition wall 13) by using a simplified structure using the first partition wall 12 and the second partition wall 13. Therefore, the height of the semiconductor device 1 can be further reduced and the size of the semiconductor device 1 can be further reduced.

[0095] In addition, in the present embodiment, a plurality of deformation holes 25a to 25e are provided on both sides of the third extension portion 23 and the fourth extension portion 24 (an example of an intermediate extension portion) in the length direction (X direction) of the cover 20, for example, including the third deformation holes 25c and 25d and the fourth deformation holes 25e and 25f (an example of an intermediate deformation hole) for alleviating the reaction force generated by the deformation of the third extension portion 23 and the fourth extension portion 24.

[0096] Therefore, by making the width of the third extension part 23 and the fourth extension part 24 in the longitudinal direction (X direction) of the cover 20 narrower between the third deformation holes 25c and 25d and between the fourth deformation holes 25e and 25f, the third extension part 23 and the fourth extension part 24 can be easily bent. As a result, the length L of the third extension part 23 and the fourth extension part 24 in the Z direction can be further shortened, so that the height of the semiconductor device 1 can be further reduced.

[0097] In addition, in the present embodiment, in a direction (Y direction) orthogonal to the length direction (X direction) of the cover 20 and the depth direction (Z direction) of the substrate storage areas A1 to A3, the first deformation hole 25a provided on the first extension portion 21 side extends longer than the first extension portion 21 (for example, in a straight line), and the second deformation hole 25b provided on the second extension portion 22 side extends longer than the second extension portion 22 (for example, in a straight line).

[0098] Thus, at the right end (X-direction positive end) of the cover 20 and the first deformation hole 25a, the width of the first extension portion 21 and its front and rear portions in the longitudinal direction (X direction) of the cover 20 is made narrow, so that the first extension portion 21 can be easily bent. Similarly, at the left end (X-direction negative end) of the cover 20 and the second deformation hole 25b, the width of the second extension portion 22 and its front and rear portions in the longitudinal direction (X direction) of the cover 20 is made narrow, so that the second extension portion 22 can be easily bent. Thus, the length L of the first extension portion 21 and the second extension portion 22 in the Z direction can be further shortened, so that the height of the semiconductor device 1 can be further reduced.

[0099] In addition, in the present embodiment, the first extension portion 21 and the second extension portion 22 located at both end sides in the longitudinal direction (X direction) of the cover 20 are provided at positions (recesses 26a, 26b) that are recessed in the longitudinal direction from both ends in the longitudinal direction (X direction) of the cover 20. Furthermore, in the first modified example of the present embodiment, the second deformation hole 25b-1 that mitigates the reaction force generated by the deformation of the second extension portion 22 (the first deformation hole 25a that mitigates the reaction force generated by the deformation of the first extension portion 21) is formed along the outer peripheral edge of the cover 20. For example, the second deformation hole 25b-1 extends in a direction (Y direction) orthogonal to the length direction (X direction) of the cover 20 and the depth direction (Z direction) of the substrate storage area A1 to A3, and, compared with the two end portions (end portions 25b-1a, 25b-1b), the protrusion 22a of the second extension portion 22 that mitigates the reaction force generated by the deformation from the deformation hole 25b-1 is located in the central portion 25b-1c, away from the length direction (X direction) of the cover 20.

[0100] Therefore, the length in the longitudinal direction from the other end (left end) of the cover 20 to the end 25b-1a, the length in the longitudinal direction from the recessed portion 26b-1 to the central portion 25b-1c, and the length in the longitudinal direction from the other end (left end) of the cover 20 to the end 25b-1b can be made constant, so that the second extension portion 22 can be easily bent. As a result, the length L in the Z direction of the second extension portion 22 (or the first extension portion 21) can be further shortened, so that the height of the semiconductor device 1 can be further reduced.

[0101] In addition, in the present embodiment, the first deformation hole 25 a and the second deformation hole 25 b are provided adjacent to the first extension portion 21 and the second extension portion 22 .

[0102] Therefore, compared with a configuration in which the first deformation hole 25 a and the second deformation hole 25 b are not adjacent to the first extension portion 21 and the second extension portion 22 , the first extension portion 21 and the second extension portion 22 can be easily bent, and the reaction force caused by deformation can be more reliably alleviated.

[0103] In addition, in the present embodiment, the deformation holes 25 a to 25 f penetrate the cover 20 .

[0104] Therefore, the extensions 21 to 24 can be easily bent compared to a configuration using deformation holes that do not penetrate the cover 20. This further shortens the length L of the extensions 21 to 24 in the Z direction, thereby further reducing the height of the semiconductor device 1.

[0105] In the second modification of the present embodiment, the fourth modification hole 25 f - 1 is a recess provided on the surface (bottom surface) of the cover 20 on the substrate housing regions A1 to A3 side.

[0106] Thus, unlike the deformation holes 25 a to 25 f penetrating the cover 20 , dust or the like can be prevented from entering the substrate accommodation areas A1 to A3 from deformation holes that do not penetrate the cover 20 , such as the fourth deformation hole 25 f - 1 .

[0107] Hereinafter, the invention described in the claims at the beginning of the application of this application will be appended.

[0108] <Additional Note 1>

[0109] A semiconductor device, characterized in that

[0110] The semiconductor device comprises:

[0111] a housing that accommodates a circuit substrate on which a semiconductor element is mounted in a substrate accommodation region; and

[0112] a cover covering the substrate receiving area,

[0113] The cover has a plurality of extensions and a plurality of deformation holes, wherein the plurality of extensions include: a first extension extending toward the substrate storage area and having a convex portion protruding toward a first direction; and a second extension extending toward the substrate storage area and having a convex portion protruding toward a second direction opposite to the first direction.

[0114] The housing has a plurality of hooking portions, and the protrusions of the extension portion are hooked on the plurality of hooking portions, respectively.

[0115] <Note 2>

[0116] The semiconductor device according to Supplementary Note 1, characterized in that

[0117] The first extension portion and the second extension portion are located at both end sides of the cover in the length direction.

[0118] The convex portion of the first extending portion and the convex portion of the second extending portion protrude so as to be separated from each other in the longitudinal direction of the cover.

[0119] <Addendum 3>

[0120] The semiconductor device according to Supplementary Note 2 is characterized in that

[0121] The plurality of extension portions further include one or more intermediate extension portions, and the position of the intermediate extension portion in the longitudinal direction of the cover is located between the first extension portion and the second extension portion.

[0122] <Addendum 4>

[0123] The semiconductor device according to Supplementary Note 3 is characterized in that

[0124] The one or more intermediate extension portions include: a third extension portion having the convex portion protruding in the second direction; and a fourth extension portion having the convex portion protruding in the first direction.

[0125] <Addendum 5>

[0126] The semiconductor device according to Supplementary Note 3 is characterized in that

[0127] The housing has a plurality of substrate storage areas and one or more partition walls that partition the plurality of substrate storage areas.

[0128] The plurality of hooking portions include one or more intermediate hooking portions, which are provided on the partition wall and hook the protrusion of the intermediate extension portion.

[0129] <Addendum 6>

[0130] The semiconductor device according to Supplementary Note 3 is characterized in that

[0131] The plurality of deformation holes include a middle deformation hole provided on both sides of the middle extension portion in the length direction of the cover.

[0132] <Addendum 7>

[0133] The semiconductor device according to Supplementary Note 2 is characterized in that

[0134] In a direction orthogonal to the length direction of the cover and the depth direction of the substrate storage area, the deformation hole provided on the first extension part side extends longer than the first extension part, and the deformation hole provided on the second extension part side extends longer than the second extension part.

[0135] <Addendum 8>

[0136] The semiconductor device according to Supplementary Note 2 is characterized in that

[0137] The first extension portion and the second extension portion are provided at positions recessed in the longitudinal direction from the two ends of the cover in the longitudinal direction.

[0138] The deformation hole is formed along the outer peripheral edge of the cover.

[0139] <Addendum 9>

[0140] The semiconductor device according to Supplementary Note 1, characterized in that

[0141] The plurality of deformation holes are provided adjacent to the first extension portion and the second extension portion.

[0142] <Addendum 10>

[0143] The semiconductor device according to Supplementary Note 1, characterized in that

[0144] The deformation hole penetrates the cover.

[0145] <Addendum 11>

[0146] The semiconductor device according to Supplementary Note 1, characterized in that

[0147] The deformation hole is a recess provided on a surface of the cover on the substrate housing region side.

[0148] Industrial Applicability

[0149] As described above, the present invention has an effect of achieving a lower height of a semiconductor device in which a cover is embedded in a housing, and is useful for, for example, a power semiconductor device.

Claims

1. A semiconductor device, characterized in that: The semiconductor device comprises: a housing that accommodates a circuit substrate on which a semiconductor element is mounted in a substrate accommodation region; as well as a cover covering the substrate receiving area, The cover has a plurality of extensions and a plurality of deformation holes, wherein the plurality of extensions include: a first extension extending toward the substrate storage region and having a convex portion protruding toward a first direction; and a second extending portion extending toward the substrate storage region and having a convex portion protruding in a second direction opposite to the first direction, The housing has a plurality of hooking portions, and the protrusions of the extension portion are hooked on the plurality of hooking portions, respectively.

2. The semiconductor device according to claim 1, wherein: The first extension portion and the second extension portion are located at both end sides of the cover in the length direction. The convex portion of the first extending portion and the convex portion of the second extending portion protrude so as to be separated from each other in the longitudinal direction of the cover.

3. The semiconductor device according to claim 2, wherein: The plurality of extension portions further include one or more intermediate extension portions, and the position of the intermediate extension portion in the longitudinal direction of the cover is located between the first extension portion and the second extension portion.

4. The semiconductor device according to claim 3, wherein: The one or more intermediate extension portions include: a third extension portion having the convex portion protruding in the second direction; and a fourth extension portion having the convex portion protruding in the first direction.

5. The semiconductor device according to claim 3, wherein: The housing has a plurality of substrate storage areas and one or more partition walls that partition the plurality of substrate storage areas. The plurality of hooking portions include one or more intermediate hooking portions, which are provided on the partition wall and hook the protrusion of the intermediate extension portion.

6. The semiconductor device according to claim 3, wherein: The plurality of deformation holes include a middle deformation hole provided on both sides of the middle extension portion in the length direction of the cover.

7. The semiconductor device according to claim 2, wherein: In a direction orthogonal to the length direction of the cover and the depth direction of the substrate storage area, the deformation hole provided on the first extension part side extends longer than the first extension part, and the deformation hole provided on the second extension part side extends longer than the second extension part.

8. The semiconductor device according to claim 2, wherein: The first extension portion and the second extension portion are provided at positions recessed in the longitudinal direction from the two ends of the cover in the longitudinal direction. The deformation hole is formed along the outer peripheral edge of the cover.

9. The semiconductor device according to claim 1, wherein: The plurality of deformation holes are provided adjacent to the first extension portion and the second extension portion.

10. The semiconductor device according to claim 1, wherein: The deformation hole penetrates the cover.

11. The semiconductor device according to claim 1, wherein: The deformation hole is a recess provided on a surface of the cover on the substrate housing region side.

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