A drilling processing technology for flexible circuit board production

Abstract

The application discloses a kind of drilling processing technology for flexible circuit board production, it is related to flexible circuit board processing technical field, including doing well to the preparation before flexible circuit board drilling, set the parameter of laser drilling machine, flexible circuit board is drilled, the automatic recycling of carrier, to the inspection of flexible circuit board workpiece and to the cleaning of laser drilling machine;The application can convey flexible circuit board to specified position, and the speed of conveying flexible circuit board is relatively stable, can guarantee that the flexible circuit board of each material board can fall into material board surface, is favorable to improve the machining precision of flexible circuit board, can push out the flexible circuit board on material board upper surface, can automatically push out flexible circuit board from material board surface, can utilize two poking pieces to push flexible circuit board, so that flexible circuit board moves from middle plate position to below blanking box, can automatically push out flexible circuit board from blanking box bottom end.

Description

Technical Field

[0001] This invention relates to the field of flexible circuit board processing technology, specifically a drilling process for flexible circuit board production. Background Technology

[0002] Flexible circuit boards are widely used in the electronics industry due to their thinness, flexibility, and bendability, especially in electronic devices that require high density, lightweight, and three-dimensional assembly. Drilling is one of the important steps in the manufacturing of flexible circuit boards. By rotating the flexible circuit board or the connecting rigid board on its edge, the drilling process can achieve electrical connections between different layers or different lines.

[0003] In the existing technology, the drilling process for flexible circuit board production has certain drawbacks. Because flexible circuit boards are thin and light, it is inconvenient to repeatedly place them directly under the laser head each time. Since manual placement under the laser head cannot be accurate, it affects the precision of the laser head. The process of manually placing the flexible circuit board requires repeatedly putting the flexible circuit board under the laser head and taking it out from under the laser head, which is also quite troublesome. It is not possible to automatically put the flexible circuit board under the laser head or automatically remove it from under the laser head. Summary of the Invention

[0004] The purpose of this invention is to provide a drilling process for the production of flexible circuit boards, so as to solve the problems mentioned in the background art.

[0005] The objective of this invention can be achieved through the following technical solutions:

[0006] A drilling process for manufacturing flexible circuit boards includes the following steps:

[0007] Step 1: Prepare for drilling the flexible circuit board by stacking the flexible circuit board on the feeding structure of the laser drilling machine chassis. The circuit board is transported and positioned by the feeding structure. Adjust the power of the laser head according to the drilling size of the flexible circuit board and ensure that the hole diameter at the laser head processing point is smaller than the reserved hole diameter of the carrier.

[0008] Step 2: Set the parameters of the laser drilling machine. Adjust the drilling parameters according to the material, thickness, and hole diameter of the flexible circuit board.

[0009] Step three: drilling the flexible circuit board, after all the preparations are completed, start the laser drilling machine to start drilling operation, through the lifting seat to lift to make the laser head rise and fall along the vertical direction, determine the distance between the laser head and the flexible circuit board to drill the flexible circuit board or the edge of the connected hard plate, and the drilled flexible circuit board is pushed by the blanking structure, the drilled flexible circuit board falls into the discharge chute along the blanking structure and the blanking chute, and the flexible circuit board falling from the feeding structure continues to move forward along the feeding structure, so that the processed flexible circuit board falls into the discharge chute;

[0010] Step four: automatic recycling of the carrier, the carrier is transported along the feeding structure to one end of the feeding structure and then reversely moved, until the carrier is transported along the feeding structure to the other end of the feeding structure and then reversely moved again, so that the carrier realizes automatic repeated recycling;

[0011] Step five: checking the flexible circuit board and cleaning the laser drilling machine, after drilling is completed, the drilling area of the laser drilling machine box needs to be cleaned, and the drilling quality of the flexible circuit board is checked, including the size of the hole diameter, the accuracy of the hole position and the integrity of the hole wall;

[0012] The feeding structure in steps one to five is transversely arranged in the middle of the upper end of the laser drilling machine box, one end of the feeding structure is located directly below the laser head, the discharge chute is arranged below the same end of the feeding structure, and the feeding structure and the blanking structure are arranged at the two end portions of the feeding structure respectively, the feeding structure comprises a driving motor, the driving motor is arranged on one side of the laser drilling machine box, the end portion of the driving motor is provided with gear one and gear two which are engaged with each other, and the inside of the laser drilling machine box is transversely provided with rotating shaft one and rotating shaft two which are parallel to each other, rotating shaft one and gear one rotate synchronously, rotating shaft two and gear two rotate synchronously, the cylindrical surfaces of rotating shaft one and rotating shaft two are both provided with helical groove one and helical groove two which are opposite in helical direction, the number of helical lines of helical groove one and helical groove two is both two, the end portions of helical groove one and helical groove two are provided with guide grooves which are connected smoothly, the inside of the laser drilling machine box and the side walls of rotating shaft one and rotating shaft two are both provided with one guide strip two and two guide strips one, and the guide strip two is located between the two guide strips one, the four corners of the carrier in steps one to five are inside the two helical grooves one and the two helical grooves two, and the four corners of the carrier are in sliding connection with the guide strip two.

[0013] As a preferred technical solution of the application, the bottom end of the driving motor and the side wall of the laser drilling machine box are welded with a mounting seat, the two end portions of rotating shaft one and rotating shaft two are both provided with fixing frames, and the two fixing frames are respectively mounted on the surface of the mounting seat and the blanking groove, and rotating shaft one and rotating shaft two are rotatably connected with the fixing frames.

[0014] As a preferred technical scheme of the present application, when the material plate is located between the second guide strip and the first guide strip below, the two corners on one side of the material plate are movably connected with the two spiral grooves one of the rotating shaft one respectively, the two corners on the other side of the material plate are movably connected with the two spiral grooves two of the rotating shaft two respectively, and the material plate moves towards the material feeding structure.

[0015] As a preferred technical scheme of the present application, when the material plate is located between the second guide strip and the first guide strip below, the two corners on one side of the material plate are movably connected with the two spiral grooves one of the rotating shaft one respectively, the two corners on the other side of the material plate are movably connected with the two spiral grooves two of the rotating shaft two respectively, and the material plate moves towards the material feeding structure.

[0016] As a preferred technical scheme of the present application, the material feeding structure is arranged on the end face of the material falling groove, the material feeding structure comprises a connecting plate welded on the material falling groove, the end of the connecting plate is located below the ends of the rotating shaft one and the rotating shaft two, the middle of the material plate is provided with a middle groove, a fixing plate is welded on the surface of the connecting plate and below the middle groove, the edge of the fixing plate is provided with a rotating plate, the rotating plate is rotatably connected with the fixing plate through a connecting pin, the cylindrical surface of the connecting pin is provided with a torsion spring, the two ends of the torsion spring are in contact with the fixing plate and the rotating plate respectively, and the position of the rotating plate is aligned with the position of the middle groove.

[0017] As a preferred technical scheme of the present application, the rotating plate is in contact with the flexible circuit board on the surface of the material plate, the width of the rotating plate is less than the width of the middle groove, and the flexible circuit board slides along the connecting plate and the material falling groove.

[0018] As a preferred technical scheme of the present application, the material feeding structure comprises a first poking piece and a second poking piece, the first poking piece is welded on the end face of the gear one, the second poking piece is welded on the end face of the gear two, the rotating directions of the first poking piece and the second poking piece are opposite, a material falling box is arranged on the side wall of the laser drilling machine box and above the rotating shaft one and the rotating shaft two, the two side bottom ends of the material falling box are provided with reserved grooves, the bottom end of the material falling box is provided with a middle plate, the spiral surfaces of the first poking piece and the second poking piece are in contact with the two side reserved grooves of the middle plate respectively.

[0019] As a preferred technical scheme of the present application, the end position of the first poking piece, the end position of the second poking piece and the edge position of the middle plate are aligned, the thickness of the middle plate is greater than the thickness of the flexible circuit board, the thicknesses of the first poking piece and the second poking piece are adapted to the thickness of the flexible circuit board, and the bottom end of the material falling box is a through groove.

[0020] As a preferred technical scheme of the present application, the laser head laser and flexible circuit board spacing in step three is affected by the laser power of the laser drilling machine, and the limit depth of the laser drilling machine laser penetration is located at the material guide strip two, and the carrier moves above and below the material guide strip two in step four.

[0021] Compared with the prior art, the present application has the following advantages:

[0022] The feeding structure is provided, the four corners of the material plate slide along the spiral groove one and the spiral groove two, so that the flexible circuit board on the surface of the material plate is moved directly below the laser head, the flexible circuit board can be conveyed to the specified position, and the conveying speed of the flexible circuit board is stable;

[0023] Through the automatic circulation process of the carrier, the material plate can move above and below the material guide strip two, the material plate is circulated along the spiral groove, and the linear distance between the material plates is the same, so that the flexible circuit board of each material plate can fall on the surface of the material plate, which is beneficial to improve the processing precision of the flexible circuit board;

[0024] The material falling structure is provided, when the material plate reaches the end of the spiral groove, the rotating plate rotates around the connecting pin, so that the flexible circuit board on the upper surface of the material plate can be pushed out, and the flexible circuit board can be automatically pushed out from the surface of the material plate;

[0025] The feeding structure is provided, when the material plate moves below the material falling box, the two push pieces can push the flexible circuit board, so that the flexible circuit board moves from the middle plate position to below the material falling box, and the flexible circuit board can be automatically pushed out from the bottom end of the material falling box. BRIEF DESCRIPTION OF DRAWINGS

[0026] In order to facilitate the understanding of those skilled in the art, the present application will be further described below with reference to the drawings.

[0027] Figure 1 is the main structure diagram of the present application;

[0028] Figure 2 is the schematic diagram of the laser head and the material falling groove of the present application;

[0029] Figure 3 is the schematic diagram of the feeding structure of the present application;

[0030] Figure 4 is the schematic diagram of the spiral groove one and the spiral groove two of the present application;

[0031] Figure 5 is the schematic diagram of the material falling structure of the present application;

[0032] Figure 6The schematic diagram of the fixed plate and the rotating plate of the present application;

[0033] Figure 7 The schematic diagram of the feeding structure of the present application;

[0034] Figure 8 The schematic diagram of the intermediate plate and the two toggle pieces of the present application.

[0035] In the figure: 1, laser drilling machine box; 2, laser head; 3, elevator seat; 4, feeding groove; 5, feeding structure; 6, blanking structure; 7, feeding structure; 8, blanking groove; 51, driving motor; 52, gear one; 53, gear two; 54, rotating shaft one; 55, rotating shaft two; 56, guide groove; 57, spiral groove one; 58, spiral groove two; 59, material plate; 510, guide bar one; 511, guide bar two; 61, connecting plate; 62, intermediate groove; 63, fixed plate; 64, rotating plate; 65, connecting pin; 66, torsion spring; 71, toggle piece one; 72, toggle piece two; 73, blanking box; 74, reserved groove; 75, intermediate plate. DETAILED DESCRIPTION

[0036] The technical solutions of the present application will be described clearly and completely below in combination with embodiments. Obviously, the described embodiments are only some of the embodiments of the present application, but not all the embodiments. Based on the embodiments in the present application, all the other embodiments obtained by those skilled in the art without creative labor fall within the protection scope of the present application.

[0037] Embodiment one:

[0038] Please refer to Figures 1-3 The drilling processing technology for flexible circuit board production is characterized by comprising the following steps:

[0039] Step one: make preparations for drilling the flexible circuit board in advance, stack the flexible circuit boards on the feeding structure 7 of the laser drilling machine box 1, position the circuit boards while conveying them through the feeding structure 5, place the flexible circuit boards inside the feeding structure 7, ensure that the flexible circuit boards are neatly stacked inside the blanking box 73 of the feeding structure 7, and move each flexible circuit board through the feeding structure 7 and drop it onto the surface of the material plate 59, adjust the power of the laser head 2 according to the size of the hole to be drilled in the flexible circuit board, and ensure that the hole diameter processed by the laser head 2 is smaller than the reserved hole diameter of the carrier, so as to avoid damage to the carrier caused by the laser emitted by the laser head 2;

[0040] Step two: set the parameters of the laser drilling machine, adjust the drilling parameters according to the material, thickness and hole diameter of the flexible circuit board, so that the laser of the laser head 2 can drill holes in the flexible circuit board or the connected hard plate at the edge thereof;

[0041] Step three: drilling the flexible circuit board, after all the preparations are completed, start the laser drilling machine to begin drilling operation, through the lifting seat 3 to lift so that the laser head 2 rises and falls along the vertical direction, the distance between the laser head 2 and the flexible circuit board is affected by the laser power of the laser drilling machine, and the limit depth of the laser drilling machine laser penetration is located at the guide strip two 511, the distance between the laser head 2 and the flexible circuit board is determined to drill the flexible circuit board or the edge of the connected hard plate, so that the flexible circuit board can be processed at a specific position, and the drilled flexible circuit board is pushed by the material falling structure 6, the drilled flexible circuit board falls along the material falling structure 6 and the material falling groove 8 into the material falling groove 4, and the flexible circuit board falling from the material feeding structure 7 continues to move forward along the material feeding structure 5, the carrier moves along the upper and lower sides of the guide strip two 511 in turn, so that the processed flexible circuit board falls into the material falling groove 4, and the flexible circuit board can be dropped from the material plate 59 of the material feeding structure 5;

[0042] Step four: automatic recycling of the carrier, after the carrier is transported along the material feeding structure 5 to one end of the material feeding structure 5, it moves reversely, and after the carrier is transported along the material feeding structure 5 to the other end of the material feeding structure 5, it moves reversely again, the four corners of the material plate 59 are limited by the shape of the spiral groove of the two rotating shafts, so that the material plate 59 moves along the guide strip one 510 and the guide strip two 511, so that the carrier realizes automatic repeated recycling;

[0043] Step five: checking the flexible circuit board and cleaning the laser drilling machine, after drilling, the drilling area of the laser drilling machine box 1 needs to be cleaned, and the drilling quality of the flexible circuit board is checked, including the size of the hole diameter, the accuracy of the hole position and the integrity of the hole wall;

[0044] The feeding structure 5 in steps one to five is transversely arranged in the middle of the upper end of the laser drilling machine box 1, and one end of the feeding structure 5 is located directly below the laser head 2, the feeding groove 4 is arranged below the same end of the feeding structure 5, the feeding structure 5 includes a driving motor 51, the driving motor 51 is arranged on one side of the laser drilling machine box 1, the end of the driving motor 51 is provided with gear one 52 and gear two 53 which are engaged with each other, and the inside of the laser drilling machine box 1 is transversely provided with rotating shaft one 54 and rotating shaft two 55 which are parallel to each other, the rotating shaft one 54 and the gear one 52 rotate synchronously, the rotating shaft two 55 and the gear two 53 rotate synchronously, starting the driving motor 51 to rotate makes the gear one 52 and the gear two 53 rotate at the same time, and the rotating directions of the gear one 52 and the gear two 53 are opposite, so as to drive the rotating shaft one 54 and the rotating shaft two 55 to rotate in opposite directions, the cylindrical surfaces of the rotating shaft one 54 and the rotating shaft two 55 are both provided with helical groove one 57 and helical groove two 58, the helical directions of the helical groove one 57 and the helical groove two 58 are opposite, and the number of helical lines of the helical groove one 57 and the helical groove two 58 is two, because the cylindrical surfaces of the two rotating shafts are both provided with two left-handed helical lines and two right-handed helical lines, so as to restrict the material plate 59 by the helical lines, the ends of the helical groove one 57 and the helical groove two 58 are provided with a smooth connecting material guide groove 56, the material guide groove 56 can move the corners of the material plate 59 along a helical line of one direction to a helical line of another direction, so as to change the moving direction of the material plate 59, the inside of the laser drilling machine box 1 and the side walls of the rotating shaft one 54 and the rotating shaft two 55 are both provided with one material guide strip two 511 and two material guide strips one 510, and the material guide strip two 511 is located between the two material guide strips one 510, the carriers of steps one to five are the material plate 59, the four corners of the material plate 59 are located in the inside of the two helical groove one 57 and the two helical groove two 58, the four corners of the material plate 59 are in sliding connection with the material guide strip two 511, the material plate 59 is above the material guide strip two 511 when moving from the feeding structure 7 to the discharging structure 6, and the material plate 59 is below the material guide strip two 511 when moving from the discharging structure 6 to the feeding structure 7, the material guide strip two 511 is located between the two material plates 59, so that the material guide strip two 511 and the material guide strip one 510 can restrict the four corners of the material plate 59.

[0045] Please refer to Figures 3-5As shown, the bottom end of the driving motor 51 and the side wall of the laser drilling machine box 1 are welded with a mounting seat, the driving motor 51 is installed on the side wall of the laser drilling machine box 1, the two ends of the rotating shaft one 54 and the rotating shaft two 55 are provided with fixing frames, and the two fixing frames are respectively installed on the surface of the mounting seat and the blanking groove 8, and the rotating shaft one 54 and the rotating shaft two 55 are rotatably connected with the fixing frames, so that the rotating shaft one 54 and the rotating shaft two 55 can normally rotate.

[0046] As shown in Figure 5 As shown, when the material plate 59 is located between the guide strip two 511 and the guide strip one 510 above, the two corners on one side of the material plate 59 are movably connected with the two spiral grooves two 58 of the rotating shaft one 54, and the two corners on the other side of the material plate 59 are movably connected with the two spiral grooves one 57 of the rotating shaft two 55, and the material plate 59 moves to the blanking structure 6, since the rotating directions of the two rotating shafts are opposite, and the spiral directions of the two rotating shafts are opposite, at this time, it is similar to a double-spiral conveyor, so that the flexible circuit board on the material plate 59 can be conveyed to the position directly below the laser head 2, and the laser head 2 can drill holes on the flexible circuit board or the connected hard board of the flexible circuit board after the driving motor 51 stops rotating, and the corners of the material plate 59 are limited by the guide strip and the spiral groove, so that the uniform and uniform movement between the material plates 59 can be ensured.

[0047] As shown in Figure 5 As shown, when the material plate 59 above the guide strip two 511 moves to the end of the spiral groove and enters the guide groove 56, it can enter the spiral groove below the guide strip two 511, when the material plate 59 is located between the guide strip two 511 and the guide strip one 510 below, the two corners on one side of the material plate 59 are movably connected with the two spiral grooves one 57 of the rotating shaft one 54, and the two corners on the other side of the material plate 59 are movably connected with the two spiral grooves two 58 of the rotating shaft two 55, the corners of the material plate 59 above the guide strip two 511 are located at a spiral line, the corners of the material plate 59 entering below the guide strip two 511 change to another spiral line, the material plate 59 moves to the feeding structure 7, and the driving motor 51 needs to be started intermittently during the movement to ensure that the laser head 2 can drill holes on the flexible circuit board.

[0048] It needs to be explained that the flexible circuit board is placed on the material plate 59, and the four corners of the material plate 59 are located at the two spiral grooves of the two rotating shafts respectively, wherein the directions of the two spiral grooves on one side of the material plate 59 are opposite to the directions of the two spiral grooves on the other side of the material plate 59, so that the material plate 59 can be moved, and the four corners of the material plate 59 move along the guide strip two 511 and the guide strip one 510 until the material plate 59 is moved below the laser head 2, so that the flexible circuit board directly below the laser head 2 is punched, so that the flexible circuit board or the flexible circuit board connected to the hard board can be processed and moved to the end of the rotating shaft. The four corners of the material plate 59 enter the guide groove 56, so that the material plate 59 located above the guide strip two 511 is moved below the guide strip two 511, until the material plate 59 is moved from the material falling structure 6 to the material adding structure 7.

[0049] Please refer to Figure 2 and Figure 5 As shown in the drawings, the material falling structure 6 is arranged at the end face of the material falling groove 8, and the material falling structure 6 includes a connecting plate 61 welded at the material falling groove 8, the end of the connecting plate 61 is located below the end of the rotating shaft one 54 and the rotating shaft two 55, and the material plate 59 on the rotating shaft one 54 and the rotating shaft two 55 is moved to the connecting plate 61 to discharge the material plate 59. Specifically, the middle of the material plate 59 is provided with a middle groove 62, and a fixed plate 63 is welded on the surface of the connecting plate 61 and below the middle groove 62, the edge of the fixed plate 63 is provided with a rotating plate 64, the rotating plate 64 is rotatably connected with the fixed plate 63 through a connecting pin 65, and the cylindrical surface of the connecting pin 65 is provided with a torsion spring 66, the two ends of the torsion spring 66 are respectively in contact with the fixed plate 63 and the rotating plate 64, the position of the rotating plate 64 is aligned with the position of the middle groove 62, and when the material plate 59 is located at the end of the guide strip one 510, the material plate 59 presses the rotating plate 64. When the rotating plate 64 is aligned with the middle groove 62, the rotating plate 64 is rotated around the connecting pin 65 under the action of the torsion spring 66, so that the rotating plate 64 passes through the middle groove 62 to discharge the flexible circuit board.

[0050] Please refer to Figure 5 and Figure 6 As shown in the drawings, the rotating plate 64 is in contact with the flexible circuit board on the surface of the material plate 59, the width of the rotating plate 64 is less than the width of the middle groove 62, and the flexible circuit board slides along the connecting plate 61 and the material falling groove 8, so that the rotating plate 64 can penetrate the inside of the middle groove 62. The flexible circuit board falls from the material plate 59 and slides from the connecting plate 61 to the material falling groove 8, and then the processed flexible circuit board falls to the material falling groove 4.

[0051] It should be noted that after the flexible circuit board above the material plate 59 is processed, the material plate 59 continues to move along the guide strip two 511, the material plate 59 presses the rotating plate 64, and the rotating plate 64 is aligned with the middle groove 62 of the material plate 59. At this time, the rotating plate 64 rotates under the action of the torsion spring 66, can discharge the flexible circuit board from the material plate 59, and fall into the connecting plate 61 and the material falling groove 8 until the flexible circuit board falls into the material falling groove 4.

[0052] Please refer to Figure 2 and Figure 7 As shown in the drawings, the feeding structure 7 includes a first toggle piece 71 and a second toggle piece 72, the first toggle piece 71 is welded to the end face of the gear one 52, the second toggle piece 72 is welded to the end face of the gear two 53, the rotating directions of the first toggle piece 71 and the second toggle piece 72 are opposite, the gears one 52 and two 53 rotate to drive the first toggle piece 71 and the second toggle piece 72 to rotate, the first toggle piece 71 and the second toggle piece 72 are symmetrically arranged, the sidewall of the laser drilling machine box 1 and above the rotating shaft one 54 and the rotating shaft two 55 are provided with a material falling box 73, the flexible circuit board is put into the top end of the material falling box 73 and stacked in the inside of the material falling box 73, because the thickness of the flexible circuit board is relatively thin, the thickness of the two toggle pieces is adapted to the thickness of the flexible circuit board, the two sides of the bottom end of the material falling box 73 are provided with a reserved groove 74, the first toggle piece 71 and the second toggle piece 72 are inserted into the reserved groove 74 on both sides of the material falling box 73 when rotating, the bottom end of the material falling box 73 is provided with an intermediate plate 75, the helical surface of the first toggle piece 71 and the helical surface of the second toggle piece 72 are respectively in contact with the two reserved grooves 74 on both sides of the intermediate plate 75, the rotating toggle piece can push the flexible circuit board above the intermediate plate 75, so as to push the flexible circuit board along the intermediate plate 75 to the other side of the intermediate plate 75, so as to discharge the flexible circuit board from below the material falling box 73, at this time, the material plate 59 is just below the material falling box 73, so that the flexible circuit board falls to the material plate 59.

[0053] Please refer to Figure 7 and Figure 8 As shown in the drawings, the end position of the first toggle piece 71, the end position of the second toggle piece 72 and the edge position of the intermediate plate 75 are aligned, the flexible circuit board above the intermediate plate 75 is pushed by the end of the first toggle piece 71 and the second toggle piece 72, the thickness of the intermediate plate 75 is greater than the thickness of the flexible circuit board, the thickness of the first toggle piece 71 and the second toggle piece 72 is adapted to the thickness of the flexible circuit board, so as to push the flexible circuit board along the intermediate plate 75, the bottom end of the material falling box 73 is a through groove, so that the flexible circuit board falls from the material falling box 73.

[0054] It should be noted that the material plate 59 moving from below the guide strip two 511 will move to the feeding structure 7, the material plate 59 is located directly below the falling box 73, at the same time, the gear one 52 and the gear two 53 rotate, the driving piece one 71 and the driving piece two 72 also rotate, and the driving piece one 71 and the driving piece two 72 rotate in opposite directions, so that the helical surface of the driving piece one 71 and the driving piece two 72 enters the reserved groove 74, the helical surface of the driving piece one 71 and the driving piece two 72 can push the flexible circuit board on the upper surface of the middle plate 75, so as to push the stacked flexible circuit board, so that the lowermost flexible circuit board is moved to the bottom end of the falling box 73, so that the flexible circuit board is discharged from the bottom end of the falling box 73, and falls on the surface of the material plate 59, because the surface of the material plate 59 is provided with a shape matched with the flexible circuit board, so that the laser head 2 punches the flexible circuit board.

[0055] The preferred embodiments of the application disclosed above are only used to help explain the application. The preferred embodiments do not describe all the details and limit the application to the specific embodiments. Obviously, according to the content of the specification, many modifications and changes can be made. The specification selects and specifically describes these embodiments in order to better explain the principles and practical applications of the application, so that those skilled in the art can well understand and utilize the application. The application is limited by the claims and their entire scope and equivalents.

Claims

1. A drilling process for flexible circuit board production, characterized by, Comprising the following steps: Step one: make good preparation before drilling flexible circuit board, stack flexible circuit board on the feeding structure (7) of the laser drilling machine case (1), position the circuit board while conveying it through the feeding structure (5), adjust the power of the laser head (2) according to the size of the flexible circuit board drilling, and ensure that the aperture of the laser head (2) processing is smaller than the reserved aperture of the carrier; Step two: set the parameters of the laser drilling machine, adjust the drilling parameters according to the material, thickness and aperture of the flexible circuit board; Step three: drill the flexible circuit board, after all the preparations are completed, start the laser drilling machine to begin drilling operation, lift the laser head (2) along the vertical direction through the lifting seat (3), determine the distance between the laser head (2) and the flexible circuit board, and drill the hard board connected to the edge of the flexible circuit board, and the drilled flexible circuit board is pushed by the discharging structure (6), the drilled flexible circuit board falls into the discharge tank (4) along the discharging structure (6) and the discharge slot (8), and the flexible circuit board falling from the feeding structure (7) continues to move forward along the feeding structure (5), so that the processed flexible circuit board automatically falls into the discharge tank (4); Step four: automatic recycling of the carrier, after conveying the carrier along the feeding structure (5) to one end of the feeding structure (5), move it in the opposite direction, and then move it in the opposite direction again after conveying it to the other end of the feeding structure (5), so that the carrier realizes automatic repeated recycling; Step five: check the flexible circuit board and clean the laser drilling machine, after drilling, clean the drilling area of the laser drilling machine case (1), check the drilling quality of the flexible circuit board, including the size of the aperture, the accuracy of the hole position and the integrity of the hole wall. The feeding structure (5) is transversely arranged at the upper end of the laser drilling machine box (1), and one end of the feeding structure (5) is located directly below the laser head (2); the discharging groove (4) is arranged below the same end of the feeding structure (5); the cylindrical surfaces of the rotating shaft one (54) and the rotating shaft two (55) are each provided with a helical groove one (57) and a helical groove two (58); the helical directions of the helical groove one (57) and the helical groove two (58) are opposite; the helical groove one (57) and the helical groove two (58) each have two helical lines; the end portions of the helical groove one (57) and the helical groove two (58) are provided with a smooth connecting material guide groove (56); the laser drilling machine box (1) is internally provided with one material guide strip two (511) and two material guide strips one (510) on the side walls of the rotating shaft one (54) and the rotating shaft two (55); the material guide strip two (511) is located between the two material guide strips one (510); the carrier of the steps one to five is a material plate (59); the four corners of the material plate (59) are located inside the two helical groove one (57) and the two helical groove two (58); and the four corners of the material plate (59) are in sliding connection with the material guide strip two (511).

2. The drilling process for manufacturing a flexible circuit board according to claim 1, wherein The feeding structure (5) is transversely arranged at the upper end of the laser drilling machine box (1), and one end of the feeding structure (5) is located directly below the laser head (2); the discharging groove (4) is arranged below the same end of the feeding structure (5); the cylindrical surfaces of the rotating shaft one (54) and the rotating shaft two (55) are each provided with a helical groove one (57) and a helical groove two (58); the helical directions of the helical groove one (57) and the helical groove two (58) are opposite; the helical groove one (57) and the helical groove two (58) each have two helical lines; the end portions of the helical groove one (57) and the helical groove two (58) are provided with a smooth connecting material guide groove (56); the laser drilling machine box (1) is internally provided with one material guide strip two (511) and two material guide strips one (510) on the side walls of the rotating shaft one (54) and the rotating shaft two (55); the material guide strip two (511) is located between the two material guide strips one (510); the carrier of the steps one to five is a material plate (59); the four corners of the material plate (59) are located inside the two helical groove one (57) and the two helical groove two (58); and the four corners of the material plate (59) are in sliding connection with the material guide strip two (511).

3. The drilling process for manufacturing a flexible circuit board according to claim 2, wherein The bottom end of the driving motor (51) and the side wall of the laser drilling machine box (1) are welded with a mounting seat, the two ends of the rotating shaft one (54) and the rotating shaft two (55) are provided with fixing frames, and the two fixing frames are respectively installed on the surface of the mounting seat and the blanking groove (8), and the rotating shaft one (54) and the rotating shaft two (55) are rotatably connected with the fixing frames.

4. The drilling process for manufacturing a flexible circuit board according to claim 3, wherein When the material plate (59) is located between the guide strip two (511) and the guide strip one (510) above, the two corners on one side of the material plate (59) are movably connected with the two spiral grooves two (58) of the rotating shaft one (54), and the two corners on the other side of the material plate (59) are movably connected with the two spiral grooves one (57) of the rotating shaft two (55), and the material plate (59) moves to the blanking structure (6).

5. The drilling process for manufacturing a flexible circuit board according to claim 3, wherein When the material plate (59) is located between the guide strip two (511) and the guide strip one (510) below, the two corners on one side of the material plate (59) are movably connected with the two spiral grooves one (57) of the rotating shaft one (54), and the two corners on the other side of the material plate (59) are movably connected with the two spiral grooves two (58) of the rotating shaft two (55), and the material plate (59) moves to the blanking structure (6).

6. The drilling process for manufacturing a flexible circuit board according to claim 1, wherein The blanking structure (6) is arranged on the end surface of the blanking groove (8), and the blanking structure (6) comprises a connecting plate (61) welded on the blanking groove (8), the end of the connecting plate (61) is located below the ends of the rotating shaft one (54) and the rotating shaft two (55), the middle of the material plate (59) is provided with a middle groove (62), the surface of the connecting plate (61) and below the middle groove (62) are welded with a fixed plate (63), the edge of the fixed plate (63) is provided with a rotating plate (64), the rotating plate (64) is rotatably connected with the fixed plate (63) through a connecting pin (65), the cylindrical surface of the connecting pin (65) is provided with a torsion spring (66), the two ends of the torsion spring (66) are respectively in contact with the fixed plate (63) and the rotating plate (64), and the position of the rotating plate (64) is aligned with the position of the middle groove (62).

7. The drilling process for manufacturing a flexible circuit board according to claim 6, wherein The rotating plate (64) is in contact with the flexible circuit board on the surface of the material plate (59), the width of the rotating plate (64) is less than the width of the middle groove (62), and the flexible circuit board slides along the connecting plate (61) and the blanking groove (8).

8. The drilling process for manufacturing a flexible circuit board according to any one of claims 1 to 7, wherein The distance between the laser of the laser head (2) and the flexible circuit board in step three is affected by the laser power of the laser drilling machine, and the limit depth of the laser drilling machine laser penetration is located at the guide strip two (511), and the carrier moves above and below the guide strip two (511) in step four.

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