Self-heat-dissipation structure of handheld terminal

Abstract

The invention discloses a handheld terminal self-heat-dissipation structure, and relates to the technical field of electric equipment shell parts. An infrared probe and a loudspeaker are installed on the front face of a main shell, the temperature of a fire scene can be monitored through infrared scanning collection, and when the temperature of an area in front of a firefighter reaches an early warning threshold value, the firefighter can be warned out. The circuit board is arranged in the heat insulation cabin box, an alarm is sent to firefighters through the loudspeaker, the firefighters are reminded to avoid a high-temperature dangerous area in time, the safety of the firefighters in the fire scene rescue process is improved, and the circuit board is sealed in a relatively independent space through the heat insulation cabin box. By means of conduction of a first C-shaped copper pipe, a second C-shaped copper pipe and low-boiling-point liquid filled in the heat insulation cabin box and active refrigeration and cooling of a semiconductor refrigeration piece, the temperature in the heat insulation cabin box can be prevented from being too high in an active refrigeration mode, and the purpose of cooling and heat dissipation in the heat insulation cabin box is achieved; and the operation stability of the device in an extremely high-temperature fire scene can be improved.

Description

Technical Field

[0001] The invention relates to the technical field of electrical equipment housing components, and in particular to a handheld terminal self-heating structure. Background Art

[0002] In modern firefighting and rescue operations, a handheld terminal is an electronic device used by firefighters for communication, data collection and transmission, and location positioning at the fire scene. The stability of its performance is directly related to the efficiency and safety of fire rescue operations.

[0003] Normally, a fire scene is an extremely harsh high-temperature environment. When a fire occurs, the heat generated by the burning of the combustibles will cause the surrounding air temperature to rise sharply. The excessively high ambient temperature causes the handheld terminal to face severe heat dissipation problems. Traditional handheld terminals mainly rely on air flow to achieve heat dissipation. However, affected by the high temperature environment at the fire scene, this conventional heat dissipation method cannot meet the operating requirements of handheld terminals used for firefighting and disaster relief. Continuous high temperature invades the interior of the handheld terminal. High temperature and heat radiation will have a serious impact on the operating stability of internal electronic components, affecting the safety and stability of the handheld terminal in the fire scene. In severe cases, it will even cause great interference to the rescue operation.

[0004] Therefore, a handheld terminal self-heating structure is proposed to solve some problems existing in the above-mentioned prior art. Summary of the invention

[0005] The purpose of the present invention is to solve the shortcomings of the prior art that the internal heat dissipation structure of a handheld terminal for fire rescue has poor operating efficiency, which causes the internal electronic components of the handheld terminal to easily become high temperature, affecting the stability and safety of the handheld terminal during fire rescue, and to propose a handheld terminal self-heating structure.

[0006] In order to solve the problems existing in the prior art, the present invention adopts the following technical solutions: A handheld terminal self-heating structure comprises a main shell, a back cover is fixedly installed on the back of the main shell, and an elastic hook is installed on the back of the back cover, an infrared probe is fixedly installed at the upper position of the front of the main shell, a speaker is installed in the main shell, a vertically arranged antenna is installed on the top of the main shell, a heat-insulating cabin box is fixed in the main shell, and a circuit board connected to the infrared probe, the speaker and the antenna is installed in the heat-insulating cabin box, a wireless transmission module, a positioning module and a charging and discharging module are integrated in the circuit board, a battery connected to the charging and discharging module is installed in the heat-insulating cabin box, a charging port connected to the charging and discharging module is installed on the main shell, a plurality of uniformly distributed first C-shaped copper tubes are fixedly installed in the heat-insulating cabin box, a second C-shaped copper tube connected to the plurality of first C-shaped copper tubes corresponding to each other is installed on the back of the heat-insulating cabin box, the first C-shaped copper tube and the second C-shaped copper tube are filled with low-boiling-point liquid, a semiconductor refrigeration plate is installed in the main shell, and the heat-absorbing surface of the semiconductor refrigeration plate is in contact with the second C-shaped copper tube, and the heat-dissipating surface of the semiconductor refrigeration plate is away from the heat-insulating cabin box toward the outside of the main shell.

[0007] Preferably, the main housing, the back cover, and the exterior of the antenna are all made of engineering plastics.

[0008] Preferably, a graphene layer and an aluminum foil layer are sequentially attached to the inner end walls of the main housing and the rear cover.

[0009] Preferably, a bracket arranged on the back side of the heat-insulating cabin box is fixedly installed in the main shell, and a plug-in plate is slidably inserted in the bracket, one end of the plug-in plate is exposed on the outside of the main shell, the semiconductor cooling plate is fixedly embedded in the plug-in plate, a plug connected to the circuit board is fixed in the bracket, a socket adapted to the plug is arranged on the plug-in plate, and the socket is connected to the semiconductor cooling plate.

[0010] Preferably, the two ends of the second C-shaped copper tube are slidably inserted into the two ends of the corresponding first C-shaped copper tube, and a copper plate is commonly connected between the multiple second C-shaped copper tubes corresponding to the same semiconductor refrigeration plate. A spring sheet for elastically supporting the copper plate is fixedly installed on the back of the insulation box. The copper plate fits tightly with the heat-absorbing surface of the semiconductor refrigeration plate with the elastic support of the spring sheet.

[0011] Preferably, a copper box tightly fitting the heat dissipation surface of the semiconductor refrigeration plate is fixedly installed in the back cover, and the copper box is filled with water. A threaded cover connected to the inside of the copper box is screwed on the back of the back cover.

[0012] Preferably, a plurality of volutes are fixedly mounted on the front inner end wall of the heat-insulating cabin box, and a fan wheel is rotatably mounted inside the volute.

[0013] Preferably, the air inlet of the volute faces the first C-shaped copper tube, and the air outlet of the volute faces the inner side end wall of the heat-insulating cabin box.

[0014] Preferably, the thickness of the volute is set to 5 mm, and a driving mechanism for driving the impeller to rotate is installed on the heat-insulating cabin box.

[0015] Preferably, a partition is fixedly installed in the middle position of the insulation cabin box, and the interior of the insulation cabin box is divided into two independent spaces that are not connected to each other by the partition, each independent space is installed with a volute, each independent space corresponds to a semiconductor refrigeration plate, and there is a temperature difference between the two independent spaces. The driving mechanism includes a heat pipe fixedly installed in the two independent spaces, and a first slider is slidably installed in the heat pipe, and the heat pipe is filled with a low-boiling point liquid located on one side of the first slider. A slide groove corresponding to the heat pipe is opened on the outer end wall of the insulation cabin box, and a second slider is slidably installed in the slide groove, and magnetically attractive magnets are installed in the first slider and the second slider, and a rack rod parallel to the slide groove is fixed on the second slider, and the rotation of the fan wheel extends to the outside of the insulation cabin box, and a transmission belt is connected between the rotating shafts of two adjacent fan wheels, and a gear meshing with the rack rod is fixedly installed on the rotating shaft of one of the fan wheels.

[0016] Compared with the prior art, the present invention has the following beneficial effects: 1. In the present invention, by integrating the positioning module into the circuit board, the command center outside the fire scene can monitor the position of the firefighters in a timely and accurate manner. At the same time, the infrared probe and the speaker are installed on the front of the main shell. Through infrared scanning and collection, the temperature of the fire scene can be monitored. When the temperature in the area in front of the firefighter reaches the warning threshold, an alarm reminder will be issued to the firefighter through the speaker to remind the firefighter to avoid the high-temperature dangerous area in time, which is conducive to improving the safety of firefighters during fire rescue. In addition, the circuit board is enclosed in a relatively independent space by the heat-insulating cabin box. With the help of the conduction of the first C-shaped copper tube, the second C-shaped copper tube and the low-boiling point liquid filled inside, and the active cooling and cooling of the semiconductor refrigeration sheet, the temperature inside the heat-insulating cabin box can be prevented from being too high by active cooling, so as to achieve the purpose of cooling and dissipating the heat inside the heat-insulating cabin box, which is conducive to improving the stability of the device in extremely high-temperature fire scenes; 2. In the present invention, by sliding the plug-in board into the bracket and embedding the semiconductor refrigeration sheet into the plug-in board, the semiconductor refrigeration sheet can be flexibly and conveniently replaced when damaged, which is conducive to ensuring that the device can actively cool and dissipate heat continuously and stably. At the same time, by sliding the two ends of the second C-shaped copper tube into the two ends of the corresponding first C-shaped copper tube and cooperating with the elastic support of the spring sheet, the copper plate fixedly connected to the second C-shaped copper tube can be adaptively and tightly fitted with the heat absorption surface of the semiconductor refrigeration sheet, which is conducive to ensuring the effect and stability of the cooling and cooling effect of the heat absorption surface of the semiconductor refrigeration sheet on the second C-shaped copper tube; 3. In the present invention, by installing an ultra-thin volute and a fan wheel in the heat-insulating cabin box, the rotation of the fan wheel in the volute can drive the air flow inside the heat-insulating cabin box, so that the cooling and heat dissipation inside the heat-insulating cabin box is more uniform. At the same time, the interior of the heat-insulating cabin box is divided into two independent spaces that are not connected to each other by a partition, and a temperature difference is formed, which drives the driving mechanism to provide power for the rotation of the fan wheel, so that the device does not need to use a motor when providing rotational drive for the fan wheel, which can effectively reduce the space occupied by the volute and the fan wheel in the heat-insulating cabin box, and can avoid the unnecessary heat generated by the motor when running to affect the heat dissipation inside the heat-insulating cabin box, which is conducive to further ensuring the stability of the heat dissipation operation inside the device. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] The drawings described herein are used to provide a further understanding of the present invention and constitute a part of this application. The exemplary embodiments of the present invention and their descriptions are used to explain the present invention and do not constitute an improper limitation of the present invention. In the drawings: Figure 1 This is a split diagram of the present invention from the front perspective; Figure 2 This is a disassembled diagram of the internal structure of the main housing of the present invention from the front perspective; Figure 3 This is a split diagram of the present invention from the back viewing angle; Figure 4 This is a disassembled diagram of the internal structure of the main housing of the present invention from the back view; Figure 5 A perspective view of the present invention; Figure 6 It is a front view of the present invention; Figure 7 For the present invention Figure 6 Sectional view at AA in the middle; Figure 8 For the present invention Figure 6 Sectional view at the middle BB; Fig. 9 For the present invention Figure 6 Sectional view at CC; Fig.10 It is a disassembled diagram of the volute and the impeller of the present invention.

[0018] Serial number in the picture: 1. Main housing; 101. Back cover; 102. Elastic hook; 103. Infrared probe; 104. Speaker; 105. Antenna; 2. Insulated cabin box; 201. Circuit board; 202. First C-shaped copper tube; 203. Second C-shaped copper tube; 204. Copper plate; 205. Reed; 206. Semiconductor cooling sheet; 207. Partition plate; 3. Bracket; 301. Plug board; 302. Plug; 303. Socket; 4. volute; 401. fan wheel; 5. heat pipe; 501. first slider; 502. slideway; 503. second slider; 504. rack rod; 505. transmission belt; 506. gear; 6. Copper box; 601, threaded cover. DETAILED DESCRIPTION

[0019] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments.

[0020] Embodiment: This embodiment provides a handheld terminal self-heating structure, see Figure 1 - Fig.10 Specifically, it includes a main shell 1, a back cover 101 is fixedly installed on the back of the main shell 1, and an elastic hook 102 is installed on the back of the back cover 101, an infrared probe 103 is fixedly installed on the upper front of the main shell 1, a speaker 104 is installed in the main shell 1, and a vertically arranged antenna 105 is installed on the top of the main shell 1, a heat insulation cabin 2 is fixed in the main shell 1, and a circuit board 201 connected with the infrared probe 103, the speaker 104 and the antenna 105 is installed in the heat insulation cabin 2, a wireless transmission module, a positioning module and a charging and discharging module are integrated in the circuit board 201, and a charging and discharging module is installed in the heat insulation cabin 2. A battery connected to the discharge module, a charging port connected to the charge and discharge module is installed on the main shell 1, a plurality of evenly distributed first C-shaped copper tubes 202 are fixedly installed in the insulation box 2, and a second C-shaped copper tube 203 which is connected to the plurality of first C-shaped copper tubes 202 in a one-to-one correspondence is installed on the back of the insulation box 2, the first C-shaped copper tube 202 and the second C-shaped copper tube 203 are filled with a low-boiling point liquid, a semiconductor refrigeration plate 206 is installed in the main shell 1, and the heat absorption surface of the semiconductor refrigeration plate 206 is in contact with the second C-shaped copper tube 203, and the heat dissipation surface of the semiconductor refrigeration plate 206 is away from the insulation box 2 toward the outside of the main shell 1.

[0021] When the device is in use, it is suitable for fire rescue scenes. In daily use, the battery installed in the insulation cabin 2 can be charged through the charging port installed on the main shell 1, and the battery can provide power support for the device. During the fire rescue process, the device can be mounted on the chest and shoulder of the firefighter through the elastic hook 102. The positioning module integrated in the circuit board 201 can locate the position of the device in the fire scene in real time, and exchange data with the external server through the wireless transmission module and the antenna 105, so that the command center can understand the position of the firefighter in time. The infrared probe 103 can detect the fire situation at the fire scene, monitor the temperature of the fire scene through infrared scanning, and transmit the relevant data to the circuit board 201 for processing. When the infrared probe 103 collects that the temperature in the area in front of the firefighter at the fire scene reaches the warning threshold, it will send an alarm reminder to the firefighter through the speaker 104, reminding the firefighter to avoid the high temperature danger area, which is beneficial to improve the safety of the firefighter during fire rescue.

[0022] In the specific implementation process, Figure 1 and Figure 3 As shown, the main shell 1, the back cover 101, and the exterior of the antenna 105 are all made of engineering plastics, and a graphene layer and an aluminum foil layer are attached to the inner end walls of the main shell 1 and the back cover 101 in sequence. When the device is in use, the main shell 1, the back cover 101 and the exterior of the antenna 105 are made of anti-fall and high-temperature resistant engineering plastics, which can effectively improve the overall protection performance of the device, so that the device can be used normally in a high-temperature environment of a fire scene. The graphene layer and the aluminum foil layer attached to the inside of the main shell 1 and the back cover 101 can effectively absorb, reflect and shield the heat radiation in the fire scene, prevent excessive heat radiation in the fire scene from diffusing into the inside of the insulation cabin 2, and help to ensure the stability of the circuit board 201 inside the insulation cabin 2 during operation.

[0023] When the device is in use, its interior presents a relatively independent space, and the high temperature environment in the fire scene is not easy to affect the normal operation of the internal parts of the device. In order to prevent the circuit board 201 inside the heat insulation box 2 from being affected by the high temperature environment at the fire scene, the interior of the heat insulation box 2 is kept in a relatively stable low temperature environment by actively cooling, thereby ensuring the stability of the operation of the circuit board 201 inside the heat insulation box 2. During the operation, the semiconductor refrigeration sheet 206 installed inside the main shell 1 is powered on and started. Based on the Peltier effect, when current passes through the thermocouple, one of the nodes emits heat, while the other node absorbs heat, making the semiconductor One side of the refrigeration plate 206 forms a heat absorption surface, and the other side of the semiconductor refrigeration plate 206 forms a heat dissipation surface. Since the heat absorption surface of the semiconductor refrigeration plate 206 is in contact with the second C-shaped copper tube 203, with the help of the first C-shaped copper tube 202, the second C-shaped copper tube 203 and the flow conduction of the low-boiling point liquid therein, the inside of the thermal insulation chamber 2 is actively cooled, so that the inside of the thermal insulation chamber 2 is in a low-temperature environment, thereby ensuring the stability of the low-temperature operation of the circuit board 201 when the device is used in a high-temperature fire scene. The low-boiling point liquid filled in the first C-shaped copper tube 202 and the second C-shaped copper tube 203 can be water, alcohol or ethylene glycol.

[0024] By enclosing the circuit board 201 in a sealed and heat-insulated independent space through the insulating cabin box 2, the interference of the high temperature environment of the external fire scene on the operating environment of the circuit board 201 inside the insulating cabin box 2 can be reduced. At the same time, by providing a semiconductor refrigeration sheet 206 for cooling, combined with the flow conduction of the first C-shaped copper tube 202, the second C-shaped copper tube 203 and the internal low-boiling point liquid, the internal temperature of the insulating cabin box 2 can be prevented from being too high through active cooling, thereby achieving the purpose of cooling and dissipating the heat inside the insulating cabin box 2, which is beneficial to improving the stability of the device in operation in extremely high-temperature fire scenes.

[0025] In the specific implementation process, Figure 1 - Figure 4As shown, a bracket 3 arranged on the back of the heat-insulating chamber box 2 is fixedly installed in the main shell 1, and a plug board 301 is slidably inserted in the bracket 3, one end of the plug board 301 is exposed outside the main shell 1, and the semiconductor cooling sheet 206 is fixedly embedded in the plug board 301. A plug 302 connected to the circuit board 201 is fixed in the bracket 3, and a socket 303 adapted to the plug 302 is arranged on the plug board 301, and the socket 303 is connected to the semiconductor cooling sheet 206. When the device is used, the plug board 301 is slidably inserted into the bracket 3 from the outside of the main shell 1, and the semiconductor cooling sheet 206 is embedded in the plug board 301. The power supply connection of the semiconductor cooling sheet 206 during use is connected through The semiconductor refrigeration chip 206 in the device is replaceable by plugging into the plug 302 and the socket 303. Due to the high temperature environment of fire rescue, the semiconductor refrigeration chip 206 usually operates in a relatively extreme high-temperature environment during use. It is overloaded in a harsh environment and is easily damaged. Therefore, the actual condition of the semiconductor refrigeration chip 206 needs to be checked after each fire rescue. If the semiconductor refrigeration chip 206 is damaged or has a poor effect, the semiconductor refrigeration chip 206 can be replaced. The plug-in connection method can effectively improve the convenience of replacing the semiconductor refrigeration chip 206 of the device.

[0026] In the specific implementation process, Figure 2 , Figure 4 and Figure 7 - Fig. 9 As shown, the two ends of the second C-shaped copper tube 203 are slidably inserted into the two ends of the corresponding first C-shaped copper tube 202, and a plurality of second C-shaped copper tubes 203 corresponding to the same semiconductor cooling plate 206 are commonly connected with a copper plate 204. A reed 205 for elastically supporting the copper plate 204 is fixedly installed on the back of the heat-insulating chamber 2. The copper plate 204 is tightly fitted with the heat-absorbing surface of the semiconductor cooling plate 206 by means of the elastic support of the reed 205. When the device is used, the two ends of the second C-shaped copper tube 203 are slidably inserted into the two ends of the corresponding first C-shaped copper tube 202, which enables the second C-shaped copper tube 203 to be relatively The tube 202 is slidably adjusted, and multiple second C-shaped copper tubes 203 corresponding to the same semiconductor refrigeration plate 206 are fixedly connected through the copper plate 204, which can effectively increase the heat conduction area between the numerous second C-shaped copper tubes 203 and the semiconductor refrigeration plate 206, and with the help of the elastic support of the reed 205, the copper plate 204 can adaptively fit tightly with the heat absorption surface of the semiconductor refrigeration plate 206, and always ensure the tight and stable fit between the heat absorption surface of the semiconductor refrigeration plate 206 and the copper plate 204, which is beneficial to improve the effect and stability of the cooling and cooling effect of the heat absorption surface of the semiconductor refrigeration plate 206 on the second C-shaped copper tube 203.

[0027] In the specific implementation process, Figure 1 , Figure 3 and Figure 7 As shown, a copper box 6 which fits tightly with the heat dissipation surface of the semiconductor refrigeration chip 206 is fixedly installed in the back cover 101, and the copper box 6 is filled with water. A threaded cover 601 which is connected to the inside of the copper box 6 is screwed on the back of the back cover 101. When the device is in use, with the help of the fit between the copper box 6 and the heat dissipation surface of the semiconductor refrigeration chip 206, after the semiconductor refrigeration chip 206 is powered on and started, the heat generated inside the semiconductor refrigeration chip 206 will be absorbed by the water filled in the copper box 6 through conduction of the copper box 6. With the help of the large specific heat capacity of water, the heat generated by the heat dissipation surface of the semiconductor refrigeration chip 206 can be temporarily stored in the water in the copper box 6, which is beneficial to ensure the stability of the semiconductor refrigeration chip 206 in the high temperature environment at the fire scene. The threaded cover 601 can be opened by rotation, so that the water in the copper box 6 can be replenished and replaced conveniently.

[0028] In the specific implementation process, Figure 4 , Figure 7 and Fig.10 As shown, a plurality of volutes 4 are fixedly mounted on the front inner end wall of the heat-insulating cabin 2, and a fan wheel 401 is rotatably mounted in the volute 4, the air inlet of the volute 4 faces the first C-shaped copper tube 202, and the air outlet of the volute 4 faces the inner side end wall of the heat-insulating cabin 2. When the device is in use, the fan wheel 401 installed in the volute 4 will continuously rotate to form a continuously flowing airflow in the heat-insulating cabin 2. Since the air inlet of the volute 4 faces the first C-shaped copper tube 202, and the air outlet of the volute 4 faces other positions inside the heat-insulating cabin 2, during the flow of the airflow, the low-temperature environment formed by the refrigeration and cooling of the semiconductor refrigeration plate 206 on the first C-shaped copper tube 202 will be engulfed, forming a low-temperature airflow flowing in other directions inside the heat-insulating cabin 2, so that the cooling and heat dissipation inside the heat-insulating cabin 2 is more uniform, which is conducive to ensuring the operational stability of the self-heating and cooling inside the device.

[0029] In the specific implementation process, Figure 2 , Figure 3 and Figure 7As shown, the thickness of the volute 4 is set to 5mm, a driving mechanism for driving the impeller 401 to rotate is installed on the heat-insulating cabin box 2, a partition 207 is fixedly installed at the middle position of the heat-insulating cabin box 2, and the interior of the heat-insulating cabin box 2 is divided into two independent spaces that are not connected to each other by the partition 207, each independent space is equipped with a volute 4, each independent space corresponds to a semiconductor refrigeration plate 206, and there is a temperature difference between the two independent spaces, and the driving mechanism includes a heat pipe 5 fixedly installed in the two independent spaces, and a first slider 501 is slidably installed in the heat pipe 5, and the heat pipe 5 is filled with a liquid located at the first slider. The heat pipe 5 is provided with a low-boiling-point liquid on one side of the block 501, a slide groove 502 corresponding to the heat pipe 5 is provided on the outer end wall of the heat insulation box 2, and a second slider 503 is slidably installed in the slide groove 502, and magnets that attract each other are installed in the first slider 501 and the second slider 503, and a rack rod 504 parallel to the slide groove 502 is fixed on the second slider 503, and the rotation of the impeller 401 passes through the outside of the heat insulation box 2, and a transmission belt 505 is connected between the rotating shafts of two adjacent impellers 401, and a gear 506 meshing with the rack rod 504 is fixedly installed on the rotating shaft of one of the impellers 401.

[0030] When the device is used, the interior of the heat-insulating chamber 2 is divided into two independent spaces that are not connected to each other by the partition 207. Each independent space corresponds to a different semiconductor refrigeration sheet 206. By controlling the semiconductor refrigeration sheet 206, the temperature of the two different independent spaces in the heat-insulating chamber 2 can be controlled separately. The cooling coefficients of the heat dissipation surfaces of the two semiconductor refrigeration sheets 206 are different, which causes a temperature difference in the two independent spaces. Due to the temperature difference, the low-boiling-point liquid in the heat pipe 5 inserted in the two independent spaces undergoes gas-liquid conversion, absorbs heat and vaporizes in the independent space with a high temperature, and releases heat in the independent space with a low temperature. The heat liquefaction is circulated, thereby driving the first slider 501 to move continuously in the heat pipe 5. The low-boiling point liquid in the heat pipe 5 can be water, alcohol or ethylene glycol. With the help of the magnetic attraction of the magnets in the first slider 501 and the second slider 503, during the reciprocating movement of the first slider 501, the second slider 503 can be driven to reciprocate synchronously in the slide groove 502, thereby driving the rack rod 504 fixedly connected to the second slider 503 to reciprocate, and then with the help of the meshing of the rack rod 504 and the gear 506, and the transmission connection of the transmission belt 505, power is provided for the rotation of the impeller 401 in the volute 4.

[0031] During the operation of the device, by setting the volute 4 to a thickness of 5 mm and not using a motor to provide power for the rotation of the impeller 401, the space occupied by the volute 4 and the impeller 401 in the heat-insulating chamber 2 can be effectively reduced, which is conducive to making the device more integrated. At the same time, by not using a motor to drive the impeller 401 to rotate, unnecessary heat generated when the motor is running can be avoided, which is conducive to further ensuring the stability of the internal heat dissipation operation of the device.

[0032] Specifically, the working principle and operation method of the present invention are as follows: When firefighters are fighting fires and rescuing people at a fire scene, they can mount the device on their chest and shoulders through the elastic hook 102. Through the positioning module integrated in the circuit board 201, the position of the firefighters wearing the device in the fire scene can be located in real time, making it convenient to arrange fire rescue according to the real-time position. The infrared probe 103 installed on the front of the main shell 1 can collect infrared temperature of the fire scene in front and transmit the relevant data to the circuit board 201 for analysis. When the temperature on the front path exceeds the safety threshold, the loudspeaker 104 is used to alarm the firefighters, making it convenient for the firefighters to avoid the dangerous area in time. When the device is running, the semiconductor cooling plate 206 is inserted into the bracket 3 through the plug board 301 for installation. With the elastic support of the reed 205, the copper plate 204 is tightly attached to the heat absorption surface of the semiconductor cooling plate 206, and the heat dissipation surface of the semiconductor cooling plate 206 is tightly attached to the copper box 6. After the semiconductor cooling plate 206 is powered on and started, the heat absorption surface is cooled and refrigerated. Through the first C-shaped copper tube 202 and the second C-shaped The heat conduction between the copper tube 203 and the internal low-boiling-point liquid transfers the low temperature to the heat-insulating chamber 2, and the heat generated by the heat dissipation surface is absorbed by the water stored in the copper box 6. Since the heat-insulating chamber 2 is divided into two independent spaces that are not connected to each other by the partition 207, the temperatures in the two independent spaces are different by controlling the different temperatures of the heat-absorbing surfaces of the two semiconductor refrigeration plates 206, and there is a temperature difference, so that the low-boiling-point liquid in the heat pipe 5 is continuously converted into gas and liquid, driving the first slider 501 to circulate in the heat pipe 5, and by means of the magnetic attraction of the magnets in the first slider 501 and the second slider 503, the second slider 503 drives the rack rod 504 to move synchronously back and forth along the slide groove 502, and by means of the meshing of the rack rod 504 and the gear 506, and the transmission connection of the transmission belt 505, the impeller 401 is driven to rotate in the volute 4, forming a continuously flowing airflow in the two independent spaces, and by means of the flow of the airflow, the cooling and cooling are evenly distributed in the heat-insulating chamber 2, ensuring the uniformity of heat dissipation and cooling.

[0033] The above are only preferred specific implementation modes of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can make equivalent replacements or changes according to the technical solutions and inventive concepts of the present invention within the technical scope disclosed by the present invention, which should be covered by the protection scope of the present invention.

Claims

1. A handheld terminal self-heating structure, comprising a main housing (1), characterized in that: A back cover (101) is fixedly mounted on the back of the main shell (1), and an elastic hook (102) is mounted on the back of the back cover (101); an infrared probe (103) is fixedly mounted on the upper front of the main shell (1); a speaker (104) is mounted in the main shell (1); a vertically arranged antenna (105) is mounted on the top of the main shell (1); a heat-insulating cabin (2) is fixed in the main shell (1), and a circuit board (201) connected to the infrared probe (103), the speaker (104) and the antenna (105) is mounted in the heat-insulating cabin (2); a wireless transmission module, a positioning module and a charging and discharging module are integrated in the circuit board (201); and a charging and discharging module is mounted in the heat-insulating cabin (2). A storage battery connected to an electric module, wherein a charging port connected to the charging and discharging module is installed on the main shell (1), a plurality of evenly distributed first C-shaped copper tubes (202) are fixedly installed in the heat-insulating chamber (2), a second C-shaped copper tube (203) connected to the plurality of first C-shaped copper tubes (202) in a one-to-one correspondence is installed on the back of the heat-insulating chamber (2), the first C-shaped copper tube (202) and the second C-shaped copper tube (203) are filled with a low-boiling-point liquid, a semiconductor cooling sheet (206) is installed in the main shell (1), and the heat absorption surface of the semiconductor cooling sheet (206) is in contact with the second C-shaped copper tube (203), and the heat dissipation surface of the semiconductor cooling sheet (206) is away from the heat-insulating chamber (2) and faces the outside of the main shell (1).

2. A handheld terminal self-heating structure according to claim 1, characterized in that: The main housing (1), the back cover (101), and the exterior of the antenna (105) are all made of engineering plastics.

3. A handheld terminal self-heating structure according to claim 1, characterized in that: A graphene layer and an aluminum foil layer are sequentially attached to the inner end walls of the main housing (1) and the rear cover (101).

4. The handheld terminal self-heating structure according to claim 1, characterized in that: A bracket (3) arranged on the back side of the heat-insulating chamber box (2) is fixedly installed in the main shell (1), and a plug board (301) is slidably inserted in the bracket (3), one end of the plug board (301) is exposed outside the main shell (1), the semiconductor cooling sheet (206) is fixedly embedded in the plug board (301), a plug (302) connected to the circuit board (201) is fixed in the bracket (3), a socket (303) adapted to the plug (302) is arranged on the plug board (301), and the socket (303) is connected to the semiconductor cooling sheet (206).

5. A handheld terminal self-heating structure according to claim 4, characterized in that: The two ends of the second C-shaped copper tube (203) are slidably inserted into the two ends of the corresponding first C-shaped copper tube (202); a copper plate (204) is commonly connected between a plurality of second C-shaped copper tubes (203) corresponding to the same semiconductor cooling plate (206); a spring sheet (205) for elastically supporting the copper plate (204) is fixedly mounted on the back of the heat-insulating chamber box (2); the copper plate (204) is tightly fitted to the heat-absorbing surface of the semiconductor cooling plate (206) by means of the elastic support of the spring sheet (205).

6. A handheld terminal self-heating structure according to claim 5, characterized in that: A copper box (6) that is tightly fitted to the heat dissipation surface of the semiconductor refrigeration plate (206) is fixedly installed in the rear cover (101), and the copper box (6) is filled with water. A threaded cover (601) that is in communication with the inside of the copper box (6) is screwed onto the back of the rear cover (101).

7. The handheld terminal self-heating structure according to claim 1, characterized in that: A plurality of volutes (4) are fixedly mounted on the front inner end wall of the heat-insulating cabin box (2), and a fan wheel (401) is rotatably mounted inside the volute (4).

8. A handheld terminal self-heating structure according to claim 7, characterized in that: The air inlet of the volute (4) faces the first C-shaped copper tube (202), and the air outlet of the volute (4) faces the inner side end wall of the heat-insulating cabin box (2).

9. The handheld terminal self-heating structure according to claim 7, characterized in that: The thickness of the volute (4) is set to 5 mm, and a driving mechanism for driving the impeller (401) to rotate is installed on the heat-insulating cabin box (2).

10. A handheld terminal self-heating structure according to claim 9, characterized in that: A partition (207) is fixedly installed in the middle position of the heat-insulating cabin (2), and the interior of the heat-insulating cabin (2) is divided into two independent spaces that are not connected to each other by the partition (207). A volute (4) is installed in each of the independent spaces. Each of the independent spaces corresponds to a semiconductor refrigeration plate (206). There is a temperature difference between the two independent spaces. The driving mechanism comprises a heat pipe (5) fixedly installed in the two independent spaces, and a first slider (501) is slidably installed in the heat pipe (5). The heat pipe (5) is filled with a low-boiling-point liquid located on one side of the first slider (501). The outer end wall of the heat-insulating cabin (2) A slide groove (502) corresponding to the heat pipe (5) is provided on the upper portion, and a second slider (503) is slidably mounted in the slide groove (502); magnets that attract each other are mounted in the first slider (501) and the second slider (503); a rack rod (504) arranged parallel to the slide groove (502) is fixed on the second slider (503); the rotation of the impeller (401) extends to the outside of the heat-insulating chamber (2); a transmission belt (505) is connected between the rotating shafts of two adjacent impellers (401); and a gear (506) meshing with the rack rod (504) is fixedly mounted on the rotating shaft of one of the impellers (401).

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