Atomization base material assembly and laser heating device thereof

Abstract

The invention discloses an atomization base material assembly and a laser heating device thereof, the atomization base material assembly is used for the laser heating device, the laser heating device comprises an insertion cavity and a laser generator located at the bottom of the insertion cavity, the atomization base material assembly comprises an atomization base material section and a heated body, the atomization base material section is inserted into the insertion cavity, and the heated body is located at the bottom of the insertion cavity. The heated body is arranged in the atomization base material section and extends to the two ends of the atomization base material section, the laser generator generates the laser beams to heat the heated body in the atomization base material section, non-contact heating is adopted, and cleaning can be avoided; the structure is simple, the manufacturability is high, and the cost is controllable; the laser generator generates laser beams for heating, heating is fast, a heated body is located on the whole length section of the atomization base material section, heat conduction is fast, and heating is even. The atomization speed is high, aerosol is full, and the user experience is improved.

Description

Technical Field

[0001] The invention relates to the technical field of atomizers, and in particular to an atomized substrate component and a laser heating device thereof. Background Art

[0002] Currently, the atomizing substrate assembly used in the heat-not-burn device only has an atomizing substrate; it is usually necessary to insert the atomizing substrate assembly into a heating needle or a heating plate in the insertion cavity of the electronic atomizing device for heating, which results in uneven heating, slow atomization speed, and the heating needle or heating plate needs to be cleaned and is easily damaged, resulting in a poor user experience. Summary of the invention

[0003] The purpose of the present invention is to provide an atomized substrate assembly and a laser heating device thereof, aiming to solve the technical problems in the related art that the electronic atomization device has uneven heating, the heating needle or heating plate needs to be cleaned, and is easily damaged.

[0004] In order to solve the above problems, according to one aspect of the present application, an embodiment of the present invention provides an atomizing substrate assembly for a laser heating device, wherein the laser heating device includes an insertion cavity and a laser generator located at the bottom of the insertion cavity, and the atomizing substrate assembly includes an atomizing substrate segment and a heat receiving body, wherein the atomizing substrate segment is inserted into the insertion cavity, and the heat receiving body is arranged in the atomizing substrate segment and extends to both ends of the atomizing substrate segment.

[0005] In some embodiments, the heated body includes a tubular member and a heated plate disposed in the tubular member, and the heated plate is disposed opposite to the laser generator.

[0006] In some embodiments, the heat receiving body includes a tubular member and a heat receiving plate integrally formed in the tubular member, and the heat receiving plate is arranged opposite to the laser generator.

[0007] In some embodiments, the thickness of the heat receiving plate is not less than the wall thickness of the tubular member.

[0008] In some embodiments, the distance between the end of the tubular member away from the laser generator and the heated plate is not greater than the distance between the end of the tubular member facing the laser generator and the heated plate.

[0009] In some embodiments, the axis of the tubular member is coaxial with the axis of the atomizing substrate segment; and / or the axis of the tubular member is coaxial with the axis of the heat receiving plate.

[0010] In some embodiments, the atomizing substrate assembly further includes a filter, which is disposed at an end of the atomizing substrate segment away from the laser generator.

[0011] In some embodiments, the atomizing substrate assembly further includes a cooling section, wherein the cooling section is disposed between the atomizing substrate section and the filter.

[0012] In some embodiments, the atomizing substrate assembly further comprises an annular net bag, which is disposed at one end of the atomizing substrate segment facing the laser generator, and the inner diameter of the annular net bag is smaller than the outer diameter of the tubular member and not smaller than the inner diameter of the tubular member.

[0013] According to another aspect of the present application, an embodiment of the present invention also provides a laser heating device, which includes an insertion cavity, a laser generator located at the bottom of the insertion cavity, and the atomized substrate assembly as described above, wherein the atomized substrate assembly is inserted into the insertion cavity, and the heated body faces the laser generator.

[0014] Compared with the prior art, the atomized substrate assembly of the present invention has at least the following beneficial effects:

[0015] The embodiment of the present invention discloses an atomizing substrate assembly, which is used for a laser heating device. The laser heating device includes an insertion cavity and a laser generator located at the bottom of the insertion cavity. The atomizing substrate assembly includes an atomizing substrate section and a heat receiving body. The atomizing substrate section is inserted in the insertion cavity. The present invention arranges the heat receiving body in the atomizing substrate section and extends to both ends of the atomizing substrate section, and generates a laser beam by a laser generator to heat the heat receiving body in the atomizing substrate section. Non-contact heating is adopted, and cleaning is unnecessary. The structure is simple, the manufacturability is high, and the cost is controllable. The laser generator is adopted to heat the heat receiving body in the atomizing substrate section, and then the atomizing substrate section is heated quickly. The heat receiving body is arranged in the atomizing substrate section and extends to both ends of the atomizing substrate section. The heat receiving body is located in the entire length section of the atomizing substrate section, and the heat conduction is rapid and the heating is uniform. The atomization speed is fast, the aerosol is full, and the user experience is improved.

[0016] The above description is only an overview of the technical solution of the present invention. In order to more clearly understand the technical means of the present invention and implement it according to the contents of the specification, the following is a detailed description of the preferred embodiments of the present invention in conjunction with the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are some embodiments of the present invention. For ordinary technicians in this field, other accompanying drawings can be obtained based on these accompanying drawings without paying any creative work.

[0018] Figure 1 A cross-sectional view of a laser heating device provided by an embodiment of the present invention;

[0019] Figure 2 A cross-sectional view of an atomized substrate assembly provided by an embodiment of the present invention;

[0020] Figure 3 A cross-sectional view of a heated body of an atomized substrate assembly provided in an embodiment of the present invention;

[0021] Figure 4 A cross-sectional view of another heat receiving body of the atomizing substrate assembly provided in an embodiment of the present invention.

[0022] Description of reference numerals:

[0023] 1. Atomizing substrate assembly; 11. Atomizing substrate section; 12. Heat receiving body; 121. Tubular member; 122. Heat receiving sheet; 13. Filter tip; 14. Cooling section; 15. Ring-shaped net bag;

[0024] 2. Laser heating device; 21. Insertion cavity; 22. Laser generator; 23. Laser beam. DETAILED DESCRIPTION

[0025] In order to further explain the technical means and effects adopted by the present invention to achieve the predetermined invention purpose, the specific implementation methods, structures, features and effects of the present invention application are described in detail below in conjunction with the accompanying drawings and preferred embodiments. In the following description, different "one embodiment" or "embodiment" does not necessarily refer to the same embodiment. In addition, specific features, structures, or characteristics in one or more embodiments may be combined in any suitable form.

[0026] In the description of the present invention, it should be clarified that the terms "first", "second", etc. in the specification and claims of the present invention and the above-mentioned drawings are used to distinguish similar objects, but are not necessarily used to describe a specific order or sequence; the terms "vertical", "lateral", "longitudinal", "front", "rear", "left", "right", "up", "down", "horizontal", etc. indicating directions or positional relationships are based on the directions or positional relationships shown in the drawings, and are only for the convenience of describing the present invention, and do not mean that the referred device or element must have a specific direction or position, and therefore cannot be understood as a limitation on the present invention.

[0027] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0028] Example 1

[0029] like Figure 1-4 As shown, an embodiment of the present invention provides an atomizing substrate assembly 1 for a laser heating device 2, wherein the laser heating device 2 includes an insertion cavity 21 and a laser generator 22 located at the bottom of the insertion cavity 21, and the atomizing substrate assembly 1 includes an atomizing substrate segment 11 and a heat receiving body 12, wherein the atomizing substrate segment 11 is inserted into the insertion cavity 21, and the heat receiving body 12 is arranged in the atomizing substrate segment 11 and extends to both ends of the atomizing substrate segment 11.

[0030] In the present embodiment, the atomizing substrate assembly 1 is used for the laser heating device 2, which includes an insertion cavity 21 and a laser generator 22 located at the bottom of the insertion cavity 21. The atomizing substrate assembly 1 includes an atomizing substrate segment 11 and a heat receiving body 12. The atomizing substrate segment 11 is inserted into the insertion cavity 21. In the present embodiment, the heat receiving body 12 is arranged in the atomizing substrate segment 11 and extends to both ends of the atomizing substrate segment 11. The laser generator 22 generates a laser beam 23 to heat the heat receiving body 12 in the atomizing substrate segment 11. Non-contact heating is adopted, which can be cleaned. Moreover, the laser generator 22 is adopted to heat the heat receiving body 12 in the atomizing substrate segment 11, and then the atomizing substrate segment 11 is heated quickly. The heat receiving body 12 is arranged in the atomizing substrate segment 11 and extends to both ends of the atomizing substrate segment 11. The heat receiving body 12 is located in the entire length section of the atomizing substrate segment 11, and the heat conduction is rapid and the heating is uniform. The atomization speed is fast, the aerosol is full, and the user experience is improved.

[0031] The heat receiving body 12 is made of a material with good thermal conductivity.

[0032] In some embodiments, the heated body 12 includes a tubular member 121 and a heated plate 122 disposed in the tubular member 121 , and the heated plate 122 is disposed opposite to the laser generator 22 .

[0033] The heat receiving body 12 of the present embodiment includes a tubular member 121 and a heat receiving plate 122 arranged in the tubular member 121. The tubular member 121 can be manufactured separately from the heat receiving plate 122. The heat receiving plate 122 is arranged opposite to the laser generator 22. The heat receiving plate 122 is heated by the laser beam 23 generated by the laser generator 22. The heat of the heat receiving plate 122 is transferred to the atomizing substrate segment 11 through the tubular member 121. This structure heats evenly to avoid the center of the atomizing substrate segment 11 from being burnt or scorched. In addition, the heat receiving body 12 has a simple structure, high manufacturability, and controllable cost.

[0034] In some embodiments, the heat receiving body 12 includes a tubular member 121 and a heat receiving plate 122 integrally formed in the tubular member 121 , and the heat receiving plate 122 is disposed opposite to the laser generator 22 .

[0035] The heat receiving body 12 of the present embodiment includes a tubular member 121 and a heat receiving plate 122 integrally formed in the tubular member 121. The heat receiving plate 122 is arranged opposite to the laser generator 22. The heat receiving plate 122 is heated by the laser beam 23 generated by the laser generator 22. The heat of the heat receiving plate 122 is transferred to the atomizing substrate segment 11 through the tubular member 121. This structure heats evenly to avoid the center of the atomizing substrate segment 11 from being burnt or scorched. In addition, the heat receiving body 12 has a simple structure, high manufacturability, and controllable cost.

[0036] In some embodiments, the thickness a of the heat receiving plate 122 is not less than the wall thickness b of the tubular member 121, so that the heat receiving plate 122 can accumulate more heat. In this way, the heat accumulated on the heat receiving plate 122 can be quickly transferred to the tubular member 121 to ensure rapid heating of the atomizing substrate segment 11.

[0037] In some embodiments, the distance H1 between the end of the tubular member 121 away from the laser generator 22 and the heat receiving plate 122 is not greater than the distance H2 between the end of the tubular member 121 facing the laser generator 22 and the heat receiving plate 122. This structure can ensure uniform heating of the atomized substrate segment 11 in the length direction.

[0038] In some embodiments, the axis of the tubular member 121 is coaxial with the axis of the atomized substrate segment 11 . This structure can ensure uniform heating of the atomized substrate segment 11 in the radial direction.

[0039] In some embodiments, the axis of the tubular member 121 is coaxial with the axis of the heat receiving plate 122 . This structure can ensure uniform heating of the atomized substrate segment 11 in the radial direction.

[0040] In some embodiments, the atomizing substrate assembly 1 further includes a filter 13 , and the filter 13 is disposed at one end of the atomizing substrate segment 11 away from the laser generator 22 .

[0041] In some embodiments, the atomizing substrate assembly 1 further includes a cooling section 14 , and the cooling section 14 is disposed between the atomizing substrate section 11 and the filter 13 .

[0042] In some embodiments, the atomizing substrate assembly 1 also includes an annular net bag 15, which is arranged at one end of the atomizing substrate segment 11 facing the laser generator 22. The inner diameter of the annular net bag 15 is smaller than the outer diameter of the tubular member 121 and not smaller than the inner diameter of the tubular member 121, thereby preventing the substrate of the atomizing substrate segment 11 from falling.

[0043] The atomizing substrate assembly 1 of the present invention can be directly heated by laser without being inserted into the heating element of the electronic atomizer, and is easy to operate. The laser heating device 2 heats and atomizes quickly, heats evenly, is not easy to burn, has a mellow taste, and greatly improves the taste.

[0044] Example 2

[0045] An embodiment of the present invention provides a laser heating device 2, which includes an insertion cavity 21, a laser generator 22 located at the bottom of the insertion cavity 21, and the atomized substrate assembly 1 as described above, wherein the atomized substrate assembly 1 is inserted into the insertion cavity 21, and the heat receiving body 12 faces the laser generator 22.

[0046] In summary, it is easy for those skilled in the art to understand that, under the premise of no conflict, the above-mentioned advantageous technical features can be freely combined and superimposed.

[0047] The above is only a specific embodiment of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can easily think of various equivalent modifications or replacements within the technical scope disclosed by the present invention, and these modifications or replacements should be included in the protection scope of the present invention. Therefore, the protection scope of the present invention shall be based on the protection scope of the claims.

Claims

1. An atomized substrate assembly for a laser heating device, the laser heating device comprising an insertion cavity and a laser generator located at the bottom of the insertion cavity, characterized in that: The atomizing substrate assembly comprises an atomizing substrate segment and a heat receiving body. The atomizing substrate segment is inserted into the insertion cavity, and the heat receiving body is arranged in the atomizing substrate segment and extends to both ends of the atomizing substrate segment.

2. The atomized substrate assembly according to claim 1, characterized in that: The heat receiving body comprises a tubular member and a heat receiving plate arranged in the tubular member, and the heat receiving plate is arranged opposite to the laser generator.

3. The atomized substrate assembly according to claim 1, characterized in that: The heat receiving body comprises a tubular member and a heat receiving plate integrally formed in the tubular member, and the heat receiving plate is arranged opposite to the laser generator.

4. The atomized substrate assembly according to claim 2 or 3, characterized in that: The thickness of the heat receiving plate is not less than the wall thickness of the tubular member.

5. The atomized substrate assembly according to claim 2 or 3, characterized in that: The distance between the end of the tubular member away from the laser generator and the heat receiving plate is not greater than the distance between the end of the tubular member facing the laser generator and the heat receiving plate.

6. The atomized substrate assembly according to claim 2 or 3, characterized in that: The axis of the tubular member is coaxial with the axis of the atomizing substrate segment; and / or, the axis of the tubular member is coaxial with the axis of the heat receiving plate.

7. The atomized substrate assembly according to claim 1, characterized in that: The atomizing substrate assembly further includes a filter, which is arranged at one end of the atomizing substrate segment away from the laser generator.

8. The atomized substrate assembly according to claim 7, characterized in that: The atomizing substrate assembly further includes a cooling section, which is disposed between the atomizing substrate section and the filter.

9. The atomized substrate assembly according to claim 2 or 3, characterized in that: The atomizing substrate assembly also includes an annular net bag, which is arranged at one end of the atomizing substrate segment facing the laser generator, and the inner diameter of the annular net bag is smaller than the outer diameter of the tubular member and not smaller than the inner diameter of the tubular member.

10. A laser heating device, characterized in that: The laser heating device comprises an insertion cavity, a laser generator located at the bottom of the insertion cavity, and the atomizing substrate assembly according to any one of claims 1 to 9, wherein the atomizing substrate assembly is inserted into the insertion cavity, and the heated body faces the laser generator.

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