Metal hot pressing process, device and storage medium

Abstract

The present application relates to a kind of metal hot pressing process, equipment and storage medium, process includes the following steps: S1, metal material is preheated;S2, at preset temperature, higher compression rate is reached by pre-compression to metal material;S3, using the mold with specific microstructure pattern is carried out multi-stage hot pressing under high temperature condition, each stage is accurately controlled pressure and temperature, and the required chip structure is gradually formed;S4, chip structure is formed and cooling demolding operation is carried out.The present application is accurately controlled to temperature, pressure and time in metal hot pressing process by self-adapting temperature control system and precision pressure regulating system, reduces temperature and pressure instability, possibly lead to crack of metal layer, poor contact, even lead to chip damage, improve the performance and reliability of chip.

Description

Technical Field

[0001] This invention relates to the field of chip manufacturing technology, and in particular to a metal hot pressing process, equipment, and storage medium. Background Technology

[0002] With the rapid development of information technology, the demand for integrated circuits (ICs) and chips in electronic devices is constantly increasing. Especially in the field of semiconductor manufacturing, chip size is continuously shrinking and performance is continuously improving, leading to increasingly stringent requirements for materials and processes. To meet the requirements of modern chips for high performance, high reliability, and ultra-miniaturization, metal interconnect technology in the chip manufacturing process, especially the hot metal bonding process, is playing an increasingly important role.

[0003] Metal hot pressing is a process that utilizes high temperature and high pressure to achieve miniaturized structures through the plastic deformation of metal materials. It is widely used in chip packaging, interconnection, and the manufacturing of other microelectronic products. In chip packaging, metal materials are typically used to connect the chip to the external circuit board, ensuring good conductivity and mechanical strength. However, precise control of temperature, pressure, and time in metal hot pressing remains a critical factor affecting product quality. Unstable temperature and pressure can lead to cracks in the metal layers, poor contact, or even chip damage, thus affecting chip performance and reliability.

[0004] Traditional metal hot pressing processes rely heavily on manual operation or a single automated control system. This often results in difficulties in precisely controlling temperature and pressure during the hot pressing process, especially in high-precision chip manufacturing. To address these issues, the industry needs a more intelligent and precisely controlled metal hot pressing technology to ensure the quality of metal connections, thereby improving chip production yield and stability.

[0005] Currently, some advanced hot pressing technologies employ temperature and pressure feedback regulation mechanisms, but they still face problems such as control instability under high-temperature environments, high complexity, and insufficient response speed of the control system. Furthermore, the wide variety of metal materials and the differences in thermal expansion coefficients, thermal conductivity, and other properties among different metal materials during hot pressing also require hot pressing processes to possess greater adaptability and flexibility.

[0006] Therefore, there is an urgent need for an innovative metal hot pressing process that can precisely regulate temperature and pressure through an intelligent control system, overcome the limitations of traditional technologies, and ensure that the hot pressing process can be carried out efficiently, stably, and accurately under different metal materials and complex process conditions, thereby improving the quality and efficiency of chip production. Summary of the Invention

[0007] The main objective of this invention is to provide a metal hot pressing process, equipment, and storage medium, which aims to monitor and control the temperature and pressure of metal materials during the metal hot pressing process in order to improve the quality of hot-pressed metal.

[0008] To achieve the above objectives, the present invention provides a metal hot pressing process, comprising the following steps:

[0009] S1. Preheating of the metal material;

[0010] S2. A higher compression ratio is achieved by pre-compressing the metal material at a preset temperature;

[0011] The preset temperature is dynamically adjusted by an adaptive temperature control system, including an advanced adaptive temperature control system. The system automatically adjusts the temperature based on real-time data from the process and the response characteristics of the metal powder at high temperatures, and makes precise adjustments to the temperature. The temperature adjustment range is from 450°C to 750°C.

[0012] S3. Under high temperature conditions, a mold with a specific microstructure pattern is used for multi-stage hot pressing. The pressure and temperature are precisely controlled at each stage to gradually form the required chip structure.

[0013] S4. After the chip structure is formed, a cooling and demolding operation is performed. During the cooling and demolding process, the type of metal material is selected in the adaptive temperature control system. The demolding temperature is dynamically adjusted according to the selected type of metal material through the adaptive temperature control system to control the demolding time.

[0014] Furthermore, the advanced adaptive temperature control system adjusts the system by equipping it with a high-sensitivity temperature sensor. Multiple temperature sensors are installed at different locations near the workpiece, and the area covered by each temperature sensor is divided. The advanced adaptive temperature control system is also equipped with a monitoring screen, which has a screen segmentation unit. The screen segmentation unit divides the above-mentioned area into multiple imaging zones. The data displayed in each imaging zone corresponds to the temperature data of the area covered by one temperature sensor.

[0015] Furthermore, the pressure and duration of the hot pressing stage are optimized according to the physical properties of the metal powder and the expected microstructure characteristics. The pressure adjustment range is from 150 to 600 MPa. Precise pressure adjustment is achieved through a high-precision pressure regulation system that can automatically adjust the pressure according to the compression stage and the type of metal powder used.

[0016] Furthermore, the pressure regulation system includes a high-precision pressure sensor, which is set within the area defined by each temperature sensor. The pressure regulation system operates in conjunction with the temperature control system, adjusting the pressure and temperature in real time based on feedback from the high-precision pressure sensor and the high-sensitivity temperature sensor.

[0017] Furthermore, the mold with a specific microstructure pattern includes a self-adjusting dynamic mode under high pressure, which allows the mold to finely adjust its shape and size according to a preset pattern under pressure. This self-adjusting capability is achieved by adding specific shape memory alloys and programmable microparticles to the mold material.

[0018] Furthermore, the response characteristics of metal powder at high temperatures, specifically the physical and chemical behavior of metal powder under specific temperature conditions, including thermal stability, reaction rate, and thermal conductivity, are detected and controlled by the adaptive temperature control system using corresponding sensors and in conjunction with the following formula:

[0019]

[0020] Where α is the coefficient of thermal expansion, L0 is the initial length, dL is the change in length, and dT is the change in temperature;

[0021]

[0022] Where r is the reaction rate, κ is the rate constant, and E a It is the activation energy, R is the gas constant, and T is the absolute temperature;

[0023] λ=λ0·(1+β·(T+T0))

[0024] Where λ is the thermal conductivity of the material, λ0 is the thermal conductivity at the reference temperature, β is the temperature-dependent adjustment coefficient, T is the current temperature of the material, and T0 is the reference temperature.

[0025] Furthermore, the preheating of the metal is achieved by generating eddy currents inside the metal through a high-frequency electromagnetic field, which generates heat. The temperature of the metal preheating is adjusted by an adaptive temperature control system, which can preset the metal material, preheating temperature, and duration in advance.

[0026] The present invention also provides a metal hot pressing device, comprising:

[0027] Heating unit: Heating metal materials, the heating temperature, frequency and duration are all adjustable, and it can also generate eddy currents inside the metal through a high-frequency electromagnetic field to preheat the metal;

[0028] Temperature control unit: The temperature control unit is equipped with an adaptive temperature control system and is electrically connected to the heating unit. The temperature control unit obtains the basic information and physical properties of the preset metal material, calculates the response characteristics of the metal powder at high temperature, and monitors the temperature of the material during the preheating and heating stages of the metal through a temperature sensor, and controls the heating temperature of the heating unit.

[0029] Hot pressing unit: The hot pressing unit is used to perform hot pressing on metal materials. It includes a pressure regulation system, which is linked with the temperature control unit to control the pressure during the hot pressing stage based on the temperature inside the metal material, and monitors the pressure through a pressure sensor.

[0030] Mold with a specific microstructure pattern: The mold is capable of self-adjusting dynamic mode under high pressure. The dynamic mode allows the mold to finely adjust its shape and size according to a preset pattern under pressure. This self-adjusting capability is achieved by adding specific shape memory alloys and programmable microparticles to the mold material.

[0031] The present invention also provides a computer device, including a memory and a processor, wherein the memory stores a computer program, and the processor executes the computer program to implement the steps of the above-described metal hot pressing process.

[0032] The present invention also provides a computer-readable storage medium having a computer program stored thereon, wherein the computer program, when executed by a processor, implements the steps of the above-described metal hot pressing process.

[0033] The metal hot pressing device and storage medium provided by this invention have the following beneficial effects:

[0034] (1) This invention uses an adaptive temperature control system and a precision pressure regulation system to precisely control the temperature, pressure and time in the metal hot pressing process, thereby reducing temperature and pressure instability that may lead to cracks in the metal layer, poor contact or even chip damage, and improving the performance and reliability of the chip.

[0035] (2) By preheating the metal, eddy currents are generated inside the metal through a high-frequency electromagnetic field, generating heat; the temperature of the metal preheating is adjusted by an adaptive temperature control system. The adaptive temperature control system can preset the metal material and the preheating temperature and time in advance, thereby improving the plasticity of the metal material, reducing the hardening of the material, and ensuring better formability and forming quality.

[0036] (3) By pre-compressing the metal material to achieve a higher compression ratio, its density and mechanical properties can be significantly enhanced, material uniformity and defects can be improved, while improving formability and machinability, reducing material usage and cost, and enhancing environmental sustainability.

[0037] (4) Hot pressing is achieved by using a mold with a specific microstructure pattern that can self-adjust dynamically under high pressure. This self-adjustment capability is achieved by incorporating specific shape memory alloys and programmable microparticles into the mold material. Using a self-adjusting mold with shape memory alloys and programmable microparticles for hot pressing significantly improves the precision and efficiency of the manufacturing process. Under pressure and heat, this mold can automatically adjust its shape and size according to a preset pattern, ensuring accurate product dimensions, reducing material waste, and adapting to complex and ever-changing design requirements. Furthermore, the self-adjustment function helps optimize the distribution of heat and force, improving production consistency and process repeatability, thereby meeting the stringent requirements of modern industry for high-performance materials and precision components.

[0038] (5) During the cooling and demolding stage, the adaptive temperature control system can select the type of metal material and dynamically adjust the demolding temperature according to the selected metal material, controlling the demolding time. Appropriate cooling can optimize the crystal structure of the metal, reduce internal stress and cracks caused by rapid temperature changes, and ensure tight contact and excellent electrical performance between the metal layer and the substrate. A reasonable cooling process can also effectively prevent deformation caused by uneven thermal expansion, improve the mechanical strength and thermal stability of the chip package, and reduce the risk of material failure. Furthermore, precise control of cooling time and temperature can improve the consistency of the production process, reduce defect rates, optimize yield, thereby improving production efficiency and reducing costs. This precise cooling control not only adapts to various metal materials, meeting the stringent quality and reliability requirements of high-end chips, but also significantly improves the long-term performance and reliability of the final product. Attached Figure Description

[0039] Figure 1 This is a schematic flowchart of a metal hot pressing process in one embodiment of the present invention;

[0040] Figure 2 This is a structural block diagram of a metal hot pressing device according to an embodiment of the present invention;

[0041] Figure 3 This is a schematic block diagram of the structure of a computer device according to an embodiment of the present invention.

[0042] The realization of the objective, functional features and advantages of the present invention will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0043] To make the objectives, technical solutions, and advantages of this invention clearer, the invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the invention.

[0044] Reference Figure 1The diagram below illustrates a metal hot pressing process proposed in this invention, comprising the following steps:

[0045] S1. Preheating of the metal material;

[0046] S2. A higher compression ratio is achieved by pre-compressing the metal material at a preset temperature;

[0047] The preset temperature is dynamically adjusted by an adaptive temperature control system, including an advanced adaptive temperature control system. The system automatically adjusts the temperature based on real-time data from the process and the response characteristics of the metal powder at high temperatures, and makes precise adjustments to the temperature. The temperature adjustment range is from 450°C to 750°C.

[0048] Maintaining the temperature between 450℃ and 750℃ offers the following advantages:

[0049] Promoting Metal Bonding: Within this temperature range, metal bonding agents (such as low-melting-point metals or alloys like tin and silver) will melt, forming a uniform liquid layer that helps create strong metal bonds between the two chip surfaces. This temperature is above the melting point of these metals, but sufficient to ensure effective bonding without damaging the chip's underlying structure.

[0050] To avoid thermal stress and deformation: Keeping the maximum temperature within this range below 750°C can prevent the chip from developing thermal stress or deformation due to excessive heat. Excessive temperature can damage the delicate circuitry on the chip, affecting performance.

[0051] Improved production efficiency and quality control: This temperature range can accelerate the melting and solidification process of metal bonding agents, while ensuring that the chip maintains good physical and chemical stability during heating and cooling, which is crucial for precise control of the production process.

[0052] S3. Under high temperature conditions, a mold with a specific microstructure pattern is used for multi-stage hot pressing. The pressure and temperature are precisely controlled at each stage to gradually form the required chip structure.

[0053] S4. After the chip structure is formed, a cooling and demolding operation is performed. During the cooling and demolding process, the type of metal material is selected in the adaptive temperature control system. The demolding temperature is dynamically adjusted according to the selected type of metal material through the adaptive temperature control system to control the demolding time.

[0054] The advanced adaptive temperature control system adjusts the system by equipping it with multiple high-sensitivity temperature sensors, which are installed at different locations near the workpiece, and each temperature sensor is responsible for a specific area. The advanced adaptive temperature control system is also equipped with a monitoring screen, which has a screen segmentation unit. The screen segmentation unit divides the above-mentioned areas into multiple imaging zones, and the data displayed in each imaging zone corresponds to the temperature data of the area responsible for a temperature sensor.

[0055] In the specific implementation process, multiple temperature sensors are set at different locations near the workpiece. The monitoring screen is set outside the hot pressing equipment. The monitoring screen can also preset the advanced adaptive temperature control system, such as the specific material of the metal and the heating time. The adaptive temperature control system can connect to the Internet. When the specific material of the metal is preset, it searches the Internet for the physical properties of the material and calculates the specific heating temperature and time for the metal material. At the same time, during the hot pressing stage, the data displayed in each imaging area corresponds to the temperature data of the area responsible for a temperature sensor. This can be presented through a time-temperature table. If the temperature exceeds or falls below the expected value, the system can also alarm and record the data.

[0056] The pressure and duration of the hot pressing stage are optimized based on the physical properties of the metal powder and the expected microstructure characteristics. The pressure adjustment range is from 150 to 600 MPa. Precise pressure adjustment is achieved through a high-precision pressure regulation system that can automatically adjust the pressure according to the compression stage and the type of metal powder used.

[0057] The reason for the pressure adjustment range of 150 to 600 MPa is as follows:

[0058] Ensuring good metal layer contact and bonding: During the hot pressing process, appropriate pressure can ensure close contact between chips and their metal layers, avoiding the formation of air bubbles and other defects, which is crucial for the unimpeded transmission of electrical signals.

[0059] Controlling metal flow and distribution: This pressure range allows for control of the flow of molten metal, ensuring its uniform distribution on the contact surface and forming a homogeneous metal bonding layer. This is crucial for improving the mechanical strength and electrical conductivity of the joint surface.

[0060] To meet the needs of different chip sizes and materials: Chips of different sizes and materials may require different pressures to achieve optimal bonding results. A pressure range of 150 to 600 MPa is sufficient to cover the production needs of a variety of chip types, while avoiding chip damage caused by excessive pressure.

[0061] In summary, these temperature and pressure settings are designed to optimize the metal hot pressing process in chip manufacturing and meet the stringent connection quality requirements of high-precision electronic products.

[0062] The pressure regulation system includes high-precision pressure sensors, which are positioned within the areas defined by each temperature sensor. The pressure regulation system operates in conjunction with the temperature control system, adjusting pressure and temperature in real time based on feedback from the high-precision pressure sensors and the high-sensitivity temperature sensors. In implementation, piezoelectric pressure sensors can be used. Piezoelectric pressure sensors utilize the property of materials generating electrical charges when subjected to force to measure pressure, and are commonly used for measuring dynamic pressure changes. The measurement data is transmitted to the corresponding imaging area. The data displayed in each imaging area corresponds to the pressure data of the area covered by a high-precision pressure sensor, specifically presented through a time-pressure gauge. If the pressure exceeds or falls below expectations, the system can also trigger an alarm and record the data.

[0063] In S3, a mold with a specific microstructure pattern includes a self-adjusting dynamic mode under high pressure. The dynamic mode allows the mold to finely adjust its shape and size according to a preset pattern under pressure. This self-adjusting capability is achieved by adding specific shape memory alloys and programming microparticles to the mold material. Multi-stage hot pressing is performed using a mold with a specific microstructure pattern, with each stage precisely controlling the pressure and temperature to gradually form the desired chip structure.

[0064] Using self-adjusting molds for hot pressing, especially those incorporating shape memory alloys and programmable microparticles, offers the following advantages:

[0065] Precise control of product size and shape: This type of mold can automatically fine-tune its shape and size according to a preset pattern under pressure, thus providing higher precision in finished products. This is especially important for high-precision manufacturing industries that require strict dimensional control, such as aerospace and precision engineering.

[0066] Improved production efficiency and consistency: Self-adjusting molds reduce the need for manual mold adjustments and subsequent corrections, thereby accelerating the production process and improving product consistency.

[0067] Reduce material waste: Self-adjusting molds can precisely control the flow and distribution of materials, reducing over-compression and material loss, thereby reducing costs and improving material utilization efficiency.

[0068] Adapting to complex and ever-changing design needs: This technology allows for flexible mold adjustments during the production process, enabling a single mold to be used to produce a variety of different products, enhancing the flexibility of the production line and its ability to adapt to different market demands.

[0069] Enhanced process repeatability: Because the mold can self-adjust to adapt to the preset microstructure pattern, it can ensure that the same high quality standard is achieved every time production, thus improving the repeatability and reliability of the entire manufacturing process.

[0070] Optimized heat and force distribution: The application of shape memory alloys and programmable microparticles enables the mold to distribute pressure and heat more evenly throughout the hot pressing process, which helps to improve the overall performance and quality of the product.

[0071] Regarding the response characteristics of metal powders at high temperatures mentioned in S2, specifically the physical and chemical behavior of metal powders under specific temperature conditions, these characteristics include:

[0072] Thermal stability: describes the ability of a metal powder to maintain its structure and properties in high-temperature environments. Materials with poor thermal stability may experience structural deformation or performance degradation.

[0073] Phase transition: Metal powders may undergo a phase transition when they reach a certain temperature, such as changing from a solid to a liquid state, or undergoing a change in crystal structure.

[0074] Oxidizing properties: At high temperatures, some metal powders may react with oxygen in the air to form oxides. This oxidation process can affect the mechanical properties and chemical stability of the material.

[0075] Sintering behavior: Sintering is a common process in powder metallurgy, involving heating metal powder at high temperatures to promote diffusion and bonding between particles. Sintering behavior is affected by the particle size, shape, temperature, and holding time of the powder.

[0076] Thermal conductivity and thermal expansion: The thermal conductivity and coefficient of thermal expansion of metal powders at high temperatures are also important physical properties, affecting the stability and integrity of the material during heat treatment. Adaptive temperature control systems use corresponding sensors and the following formula to detect and control the response characteristics of some metal powders at high temperatures:

[0077] 1. Coefficient of thermal expansion

[0078]

[0079] Where α is the coefficient of thermal expansion, L0 is the initial length, dL is the change in length, and dT is the change in temperature;

[0080] 2. Oxidation rate

[0081]

[0082] Where r is the reaction rate, κ is the rate constant, and E a It is the activation energy, R is the gas constant, and T is the absolute temperature;

[0083] 3. Sintering model

[0084]

[0085] Where ΔL is the shrinkage rate, L0 is the initial length, and L... t t is the length after sintering, K is the sintering time, and n is an experimentally determined constant. This formula is used to predict dimensional changes during the sintering process.

[0086] 4. Relationship between thermal conductivity and temperature

[0087] λ=λ0·(1+β·(T+T0))

[0088] Where λ is the thermal conductivity of the material, λ0 is the thermal conductivity at the reference temperature, β is the temperature-dependent adjustment coefficient, T is the current temperature of the material, and T0 is the reference temperature.

[0089] These formulas provide the basis for quantifying and predicting the properties of metal powders at high temperatures, enabling the system to design more precise heat treatment and sintering processes.

[0090] Regarding the preheating of the metal mentioned in S1, heat is generated by inducing eddy currents within the metal using a high-frequency electromagnetic field. Specifically, when an alternating electromagnetic field passes through a conductive material (metal), closed current loops are induced within the material; these are called eddy currents. The generation of eddy currents is related to Faraday's law of electromagnetic induction, which states that changes in the electromagnetic field generate an electromotive force in a conductor, causing current to flow. The presence of eddy currents leads to the conversion of electrical energy within the metal into heat energy. This is due to the resistive properties of the metal; when current flows through the metal, it encounters resistance, thus generating heat. An adaptive temperature control system adjusts the current used for preheating the metal, thereby adjusting the preheating temperature. Before implementation, the adaptive temperature control system can also pre-set the metal material, preheating temperature, and duration.

[0091] Reference Figure 2 This invention also provides a metal hot pressing device, comprising:

[0092] Heating unit: Heating metal materials, the heating temperature, frequency and duration are all adjustable, and it can also generate eddy currents inside the metal through a high-frequency electromagnetic field to preheat the metal;

[0093] Temperature control unit: The temperature control unit is equipped with an adaptive temperature control system and is electrically connected to the heating unit. The temperature control unit obtains the basic information and physical properties of the preset metal material, calculates the response characteristics of the metal powder at high temperature, and monitors the temperature of the material during the preheating and heating stages of the metal through a temperature sensor, and controls the heating temperature of the heating unit.

[0094] Hot pressing unit: The hot pressing unit is used to perform hot pressing on metal materials. It includes a pressure regulation system, which is linked with the temperature control unit to control the pressure during the hot pressing stage based on the temperature inside the metal material, and monitors the pressure through a pressure sensor.

[0095] A mold with a specific microstructure pattern: The mold is capable of self-adjusting dynamic mode under high pressure. The dynamic mode allows the mold to finely adjust its shape and size according to a preset pattern under pressure. This self-adjusting capability is achieved by adding specific shape memory alloys and programmable microparticles to the mold material.

[0096] Reference Figure 3 This invention also provides a computer device, which can be a server, and its internal structure can be as follows: Figure 3 As shown, the computer device includes a processor, memory, display screen, input device, network interface, and database connected via a system bus. The processor provides computing and control capabilities. The memory includes a non-volatile storage medium and internal memory. The non-volatile storage medium stores the operating system, computer programs, and database. The internal memory provides an environment for the operation of the operating system and computer programs in the non-volatile storage medium. The database stores the data corresponding to this embodiment. The network interface is used to communicate with external terminals via a network connection. When the computer program is executed by the processor, it implements the above-described method.

[0097] Those skilled in the art will understand that Figure 3 The structures shown are merely block diagrams of some structures related to the present invention and do not constitute a limitation on the computer devices on which the present invention is applied.

[0098] An embodiment of the present invention also provides a computer-readable storage medium having a computer program stored thereon, which, when executed by a processor, implements the above-described method. It is understood that the computer-readable storage medium in this embodiment can be a volatile readable storage medium or a non-volatile readable storage medium.

[0099] In summary,

[0100] Those skilled in the art will understand that all or part of the processes in the methods of the above embodiments can be implemented by a computer program instructing related hardware. The computer program can be stored in a non-volatile computer-readable storage medium. When executed, the computer program can include the processes of the embodiments of the above methods. Any references to memory, storage, databases, or other media used in the present invention and embodiments can include non-volatile and / or volatile memory. Non-volatile memory can include read-only memory (ROM), programmable ROM (PROM), electrically programmable ROM (EPROM), electrically erasable programmable ROM (EEPROM), or flash memory. Volatile memory can include random access memory (RAM) or external cache memory. By way of illustration and not limitation, RAM is available in various forms, such as static RAM (SRAM), dynamic RAM (DRAM), synchronous DRAM (SDRAM), dual-rate SDRAM (SSRSDRAM), enhanced SDRAM (ESDRAM), synchronous link DRAM (SLDRAM), Rambus direct RAM (RDRAM), direct memory bus dynamic RAM (DRDRAM), and memory bus dynamic RAM, etc.

[0101] It should be noted that, in this document, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, apparatus, article, or method that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, apparatus, article, or method. Unless otherwise specified, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, apparatus, article, or method that includes that element.

[0102] The above description is only a preferred embodiment of the present invention and does not limit the patent scope of the present invention. Any equivalent structural or procedural transformations made based on the content of the present invention specification and drawings, or direct or indirect applications in other related technical fields, are similarly included within the patent protection scope of the present invention.

Claims

1. A metal hot pressing process, characterized in that, The process includes: S1. Preheating of the metal material; S2. A higher compression ratio is achieved by pre-compressing the metal material at a preset temperature; The preset temperature is dynamically adjusted by an adaptive temperature control system. The system automatically adjusts the temperature based on real-time data during the process and the response characteristics of the metal powder at high temperatures, and makes precise adjustments to the temperature. The temperature adjustment range is from 450°C to 750°C. The response characteristics of the metal powder at high temperatures specifically refer to the physical and chemical behavior of the metal powder under specific temperature conditions, including thermal stability, reaction rate, and thermal conductivity. The adaptive temperature control system detects and controls the response characteristics of the metal powder at high temperatures using corresponding sensors and in conjunction with the following formula: Where α is the coefficient of thermal expansion. It is the initial length. It is a change in length. It's a change in temperature; in It is the reaction rate. It is the rate constant. It is the activation energy, R is the gas constant, and T is the absolute temperature; in It refers to the thermal conductivity of the material. It is the thermal conductivity at the reference temperature. It is a temperature-related adjustment coefficient, where T is the current temperature of the material. It is the reference temperature; S3. Under high temperature conditions, a mold with a specific microstructure pattern is used for multi-stage hot pressing. The pressure and temperature are precisely controlled at each stage to gradually form the required chip structure. S4. After the chip structure is formed, a cooling and demolding operation is performed. During the cooling and demolding process, the type of metal material is selected in the adaptive temperature control system. The demolding temperature is dynamically adjusted according to the selected type of metal material through the adaptive temperature control system to control the demolding time.

2. The metal hot pressing process according to claim 1, characterized in that, The adaptive temperature control system includes multiple temperature sensors, which are installed at different locations near the workpiece, and each temperature sensor is responsible for a specific area. The adaptive temperature control system is also equipped with a monitoring screen, which has a screen segmentation unit. The screen segmentation unit divides the above-mentioned areas into multiple imaging areas, and the data displayed in each imaging area corresponds to the temperature data of the area responsible for a temperature sensor.

3. The metal hot pressing process according to claim 2, characterized in that, The pressure and duration of the hot pressing stage are optimized according to the physical properties of the metal powder and the expected microstructure characteristics. The pressure adjustment range is from 150 to 600 MPa. The pressure is precisely regulated by a high-precision pressure regulation system that can automatically adjust the pressure according to the pre-compression stage and the type of metal powder used.

4. The metal hot pressing process according to claim 3, characterized in that, The pressure regulation system includes a high-precision pressure sensor, which is set in the area defined by each temperature sensor. The pressure regulation system operates in conjunction with an adaptive temperature control system, adjusting the pressure and temperature in real time based on feedback from the high-precision pressure sensor and the high-sensitivity temperature sensor.

5. The metal hot pressing process according to claim 1, characterized in that, Preheating of metallic materials involves generating eddy currents within the material using a high-frequency electromagnetic field, which in turn generates heat. An adaptive temperature control system is used to adjust the preheating temperature of the metallic materials, allowing for pre-setting of the material, preheating temperature, and duration.

6. A computer device comprising a memory and a processor, wherein the memory stores a computer program, characterized in that, When the processor executes the computer program, it implements the steps of the metal hot pressing process according to any one of claims 1 to 5.

7. A computer-readable storage medium having a computer program stored thereon, characterized in that, When the computer program is executed by the processor, it implements the steps of the metal hot pressing process as described in any one of claims 1 to 5.

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