A gate line drying apparatus

Abstract

This invention discloses a grid drying device, including a drying chamber with an inlet and an outlet, a built-in drying channel and a heating device; a transfer assembly; a support assembly including a support unit, the support unit including a support member, the support member including a support roller and a fan blade, and air holes opened on the bottom wall of the unit; a reflux assembly and a filter assembly, the reflux assembly including a guide shell and a reflux pump. This grid drying device uses the reflux pump to drive airflow, allowing hot air to preheat and delay the cooling of silicon wafers in the corresponding unit channels of the inlet and outlet. The heating device uniformly heats the silicon wafers in the remaining unit channels, ensuring uniform heating and slowing down the rate of temperature change of the silicon wafers to avoid thermal stress damage. Furthermore, the airflow drives the fan blades on the support member to rotate, causing the support roller to rotate and move the silicon wafers horizontally. Combined with the transfer assembly to transfer the silicon wafers, this allows the silicon wafers to continuously pass through the drying channel, thereby improving drying efficiency.

Description

Technical Field

[0001] This invention relates to the field of grid wire processing technology, and in particular to a grid wire drying apparatus. Background Technology

[0002] Drying the grid lines is an important step after grid line printing. After the paste is printed, the cells need to be dried to remove solvents and volatile components from the paste, so that the grid lines can adhere more firmly to the silicon wafer.

[0003] In the prior art, such as Chinese invention patent application with publication number CN118463553A, a multi-chamber heterojunction battery sintering furnace device is disclosed. When the device is in use, the drying chamber is evacuated by a vacuum component during drying and sintering to form a vacuum inside, and inert gases such as nitrogen are introduced to effectively isolate oxygen, improve the conversion efficiency of the battery cells, and improve production quality. This effectively solves the problem that impurities generated by the reaction of organic matter in the metal slurry with oxygen in the air affect the contact performance of the metal grid lines during the traditional drying and sintering process.

[0004] During the drying process, although the aforementioned device can hold multiple solar cells using a basket, the infrared radiation from the infrared heating lamps cannot evenly illuminate the side of the solar cells with printed grid lines. This means that the amount of infrared radiation received by each solar cell cannot be guaranteed to be uniform. Parts not exposed to infrared radiation rely solely on heat transfer and the ambient temperature for drying, leading to uneven heating and affecting the drying quality. Furthermore, while infrared lamps offer fast heating and high efficiency, they also cause the silicon wafers to heat up too quickly, resulting in thermal stress damage and affecting their electrical properties, thus reducing drying quality. In addition, the device requires frequent movement of the lifting plate via the lifting assembly. After the basket and silicon wafers enter the frame cavity, the lifting plate descends, and the conveying device stops operating. After the grid lines on the silicon wafers in the frame cavity are dried, the conveying device restarts, removing the silicon wafers and baskets from the frame cavity while simultaneously transporting other silicon wafers to be dried into the frame cavity. This necessitates frequent interruptions in the silicon wafer transport by the conveying device in coordination with the lifting assembly, further impacting drying efficiency.

[0005] Therefore, it is necessary to improve the existing grid drying device. Summary of the Invention

[0006] The purpose of this invention is to overcome the defects in the prior art and provide a grid drying device that ensures uniform heating, avoids thermal stress damage to silicon wafers, and improves drying efficiency.

[0007] To achieve the above-mentioned technical effects, the technical solution of the present invention is: a grid wire drying device, comprising:

[0008] A drying oven is provided with a feed inlet and a discharge outlet on its side wall. The drying oven has a built-in drying channel and a heating device. The drying channel includes multiple unit channels, each of which is long and horizontally arranged side by side. The unit channels are connected in sequence. The two unit channels at the ends are connected to the feed inlet and the discharge outlet, respectively. The heating device is positioned downwards directly above the remaining unit channels. The drying oven is also provided with an air inlet.

[0009] A transfer assembly is disposed at the connection of adjacent unit channels and is used to transfer the silicon wafer at the output end of one unit channel to the input end of another unit channel;

[0010] A support assembly is provided, which corresponds one-to-one with the unit channel. The support assembly includes support units spaced apart along the length of the unit channel. Each support unit includes a support member, which includes a support roller and a fan blade. The axis of the support roller extends parallel to the width of the unit channel. The fan blades are arranged in a circular array on one side of the support roller with the axis of the support roller as the center line, and the fan blades are located inside the curved surface where the outer circumferential edge of the support roller is located. The bottom wall of the unit channel is provided with a vent hole for the support member to rotate. The top of the support roller is higher than the vent hole. In the support members of the support assemblies corresponding to adjacent unit channels, the fan blades are arranged in opposite directions, and the rotation directions of the support members are opposite.

[0011] The recirculation assembly includes a flow guide shell and a recirculation pump. The flow guide shell covers the bottom of the air vent and forms a flow guide cavity with the drying chamber. The flow guide cavity is connected to the input end of the recirculation pump to drive the fan blades to rotate around the axis of the support roller. The output end of the recirculation pump is connected to the air inlet through the filter assembly.

[0012] Preferably, in order to facilitate the rotation of the support rollers by airflow and realize the movement of silicon wafers within the unit channel, the drying oven includes a base plate, the top surface of which forms the bottom wall of the unit channel, the air vents are disposed on the base plate, and the bottom of the fan blades' movement path is located below the base plate.

[0013] Preferably, in order to further promote the rotation of the support rollers and drive the movement of the silicon wafers through the flow of air, the air guide shell corresponds one-to-one with the air holes. The air guide shell is provided with an air guide hole that communicates with the input end of the return pump. The plane where the opening of the air guide hole is located is parallel to the axis of the support roller and is directly opposite to the blade surface of the fan that has rotated to the bottom.

[0014] Preferably, in order to ensure the transmission force between the support roller and the silicon wafer, the support roller is provided with an elastic buffer sleeve.

[0015] Preferably, to facilitate the assembly of the base plate and the support, the base plate includes an upper clamping plate and a lower clamping plate. The upper clamping plate and the lower clamping plate have opposing upper clamping grooves and lower clamping grooves on their opposite surfaces. The upper clamping grooves and the lower clamping grooves enclose and form an assembly hole. The support roller is coaxially fixedly connected to a rotating shaft, and the outer circumferential edge of the rotating shaft is sealed to the inner circumferential wall of the assembly hole.

[0016] Preferably, in order to ensure that the rotational speed of each support component in the same support assembly is consistent during the transmission of the silicon wafer through the support assembly, and to reduce the relative friction between the bottom surface of the silicon wafer and the support component, a synchronization assembly is also included. The synchronization assembly includes two synchronization units, and two adjacent support assemblies are respectively connected to the two synchronization units in a one-to-one transmission connection to ensure that the rotational speed of each support component in the same support assembly is consistent.

[0017] Preferably, in order to achieve synchronous rotation of the support components at the same speed, the synchronization component includes synchronous shafts distributed along the length of the unit channel and corresponding one-to-one with the support units. Among two adjacent synchronous shafts, one is radially fixedly connected to the corresponding rotating shaft, and the other is radially rotatably connected to the corresponding rotating shaft. The synchronization unit includes a synchronous wheel, and the rotating shaft that is radially fixedly connected to the rotating shaft is fixedly connected to the synchronous wheel along the same axis. Adjacent synchronous wheels are hinged together by a connecting rod.

[0018] Preferably, for ease of assembly, the rotating shaft is a hollow shaft through which the corresponding synchronous shaft passes. The synchronous shaft includes a round shaft and a key located on the outer circumferential edge of the round shaft and extending axially along the round shaft. In each support assembly, among the rotating shafts of two adjacent support units, the inner circumferential wall of one rotating shaft is sealed and fitted to the outer circumferential edge of the synchronous shaft, while the inner circumferential wall of the other rotating shaft has a gap with the outer circumferential edge of the synchronous shaft.

[0019] Preferably, in order to ensure the smooth movement of the silicon wafer within the unit channel, avoid displacement, and reduce wear on the sidewalls of the silicon wafer, ball bearings that rotate around their own centers and protrude from the sidewall surfaces are provided on the opposite sidewalls of the unit channel. The centers of the ball bearings are located above the horizontal plane where the top of the support is located and the distance between the ball bearings and the horizontal plane is less than the thickness of the silicon wafer.

[0020] Preferably, in order to realize the transfer of silicon wafers between two adjacent unit channels, the transfer assembly includes transfer units distributed along the unit channels. Each transfer unit includes a transfer strip, the length direction of which is projected on the horizontal plane is parallel to the width direction of the unit channel. Two telescopic units are arranged below the transfer strip. The telescopic ends of the two telescopic units move in the vertical direction. The telescopic end of one telescopic unit is rotatably connected to the transfer strip and the rotation axis is parallel to the length direction of the unit channel. The telescopic end of the other telescopic unit abuts against the transfer strip.

[0021] In summary, compared with the prior art, the grid drying device of the present invention uses a reflux pump to drive airflow, enabling hot air to preheat and delay the cooling of silicon wafers in the corresponding unit channels of the inlet and outlet. The heating device uniformly heats the silicon wafers in the remaining unit channels, ensuring uniform heating and slowing down the rate of temperature change of the silicon wafers to avoid thermal stress damage. In addition, the airflow drives the fan blades on the support to rotate, causing the support rollers to rotate and move the silicon wafers horizontally. With the help of the transfer component, the silicon wafers are transferred continuously through the drying channel, thereby improving the drying efficiency. Attached Figure Description

[0022] Figure 1 This is a schematic diagram of the structure of the present invention;

[0023] Figure 2 This is a structural schematic diagram from another perspective of the present invention;

[0024] Figure 3 yes Figure 2 An explosion diagram;

[0025] Figure 4 yes Figure 2 A schematic diagram of the cross-sectional structure;

[0026] Figure 5 yes Figure 4 Enlarged view of part A;

[0027] Figure 6 This is a schematic diagram of the structure of the filter component of the present invention;

[0028] Figure 7 yes Figure 6 An explosion diagram;

[0029] Figure 8 This is a partial structural schematic diagram of the present invention;

[0030] Figure 9 yes Figure 8 An explosion diagram;

[0031] Figure 10 yes Figure 9 Enlarged view of part B;

[0032] Figure 11 yes Figure 8 Partial structural diagram;

[0033] Figure 12 yes Figure 11 Top view;

[0034] Figure 13 yes Figure 11 An explosion diagram;

[0035] Figure 14 This is a schematic diagram of the structure of the base plate of the present invention;

[0036] Figure 15 yes Figure 14 An explosion diagram;

[0037] Figure 16 yes Figure 14 An illustration of the explosion from another perspective;

[0038] Figure 17 yes Figure 14 A schematic diagram of the cross-sectional structure;

[0039] Figure 18 yes Figure 17 Enlarged view of part C;

[0040] Figure 19 This is a structural schematic diagram of two adjacent support components;

[0041] Figure 20 This is a schematic diagram of the structure of the transfer component of the present invention;

[0042] In the diagram: 1. Drying oven; 11. Base plate; 111. Upper clamping plate; 1111. Upper clamping groove; 1112. Upper air vent; 1113. Receiving through hole; 112. Lower clamping plate; 1121. Lower clamping groove; 1122. Lower air vent; 1123. Through hole; 1124. Support leg; 113. Air vent; 12. Top plate; 121. Air inlet; 13. Side plate; 14. Partition plate; 15. Feed inlet; 16. Discharge outlet; 17. Heating device; 18. Ball bearing; 19. Distance sensor; 2. Transfer assembly; 21. Transfer strip; 22. Telescopic unit; 23. Transfer roller; 3. Support component; 31. Support roller; 32. Fan blade; 33. Buffer sleeve; 3 4. Rotating shaft; 4. Reflux assembly; 41. Guide shell; 42. Reflux pump; 43. Suction pipe; 5. Filter assembly; 51. Filter shell; 511. Filter barrel; 5111. Inner convex ring; 512. Barrel cover; 513. Screw; 514. Screw tube; 52. Filter frame; 53. Heating shell; 54. Electric heating grid; 55. Handle; 56. Top cover; 57. Reflux inlet pipe; 58. Reflux outlet pipe; 6. Synchronization assembly; 61. Synchronization shaft; 611. Round shaft; 612. Convex key; 62. Synchronization unit; 621. Synchronization wheel; 622. Connecting rod; 63. Positioning plate; 7. Material guiding assembly; 71. Material guiding plate; 72. Material guiding roller; 8. Silicon wafer; 9. Base. Detailed Implementation

[0043] The specific embodiments of the present invention will be further described below with reference to the accompanying drawings and examples. The following examples are only used to more clearly illustrate the technical solutions of the present invention and should not be construed as limiting the scope of protection of the present invention.

[0044] like Figures 1-20 As shown, the grid wire drying apparatus of the present invention includes:

[0045] The drying chamber 1 has an inlet 15 and an outlet 16 on its side wall. The drying chamber 1 has a built-in drying channel and a heating device 17. The drying channel includes multiple unit channels, which are all long strips and arranged side by side in the horizontal direction. The unit channels are connected in sequence. The two unit channels at the end are connected to the inlet 15 and the outlet 16 respectively. The heating device 17 is arranged downwards directly above the remaining unit channels. The drying chamber 1 is also provided with an air inlet 121.

[0046] Transfer component 2 is disposed at the connection of adjacent unit channels and is used to transfer the silicon wafer 8 at the output end of one unit channel to the input end of another unit channel;

[0047] The support assembly corresponds one-to-one with the unit channel. The support assembly includes support units spaced apart along the length of the unit channel. Each support unit includes a support member 3. The support member 3 includes a support roller 31 and a fan blade 32. The axis of the support roller 31 extends parallel to the width of the unit channel. The fan blade 32 is arranged in a ring array on one side of the support roller 31 with the axis of the support roller 31 as the center line. The fan blade 32 is located inside the curved surface of the outer circumferential edge of the support roller 31. The bottom wall of the unit channel is provided with a wind hole 113 for the support member 3 to rotate. The top of the support roller 31 is higher than the wind hole 113. In the support members 3 of the support assemblies corresponding to adjacent unit channels, the fan blade 32 is set in opposite directions, and the rotation direction of the support member 3 is opposite.

[0048] The return flow assembly 4 and the filter assembly 5 are included. The return flow assembly 4 includes a guide shell 41 and a return flow pump 42. The guide shell 41 covers the bottom of the air hole 113 and forms a guide flow cavity with the drying box 1. The guide flow cavity is connected to the input end of the return flow pump 42 to drive the fan blade 32 to rotate around the axis of the supporting roller 31. The output end of the return flow pump 42 is connected to the air inlet 121 through the filter assembly 5.

[0049] When the device is in use, the heating device 17 and the reflux pump 42 operate continuously. The heating device 17 heats the unit channels except for the first and last ends. The reflux pump 42 draws air from the guide cavity, filters it through the filter assembly 5, and then delivers it to the drying chamber 1 through the air inlet 121. The air in the drying chamber 1 is then input into the guide cavity through the air hole 113, and then passed into the filter assembly 5 through the reflux pump 42. In this way, the air is circulated. At the same time, the air flows and acts on the fan blades 32 of the support member 3, causing the fan blades 32 to rotate around the axis of the support roller 31, thereby driving the support roller 31 to rotate. In two adjacent support assemblies, the rotation directions of the support rollers 31 are opposite.

[0050] A single silicon wafer 8 is conveyed into the drying channel through the feed port 15. It first enters the unit channel connected to the feed port 15. The hot air flowing in the unit channel comes into contact with the silicon wafer 8 to preheat it. At the same time, negative pressure is generated at the air hole 113 in the unit channel to increase the pressure between the silicon wafer 8 and the support roller 31. The rotation of the support roller 31 drives the silicon wafer 8 to move along the length of the unit channel.

[0051] After the silicon wafer 8 moves to the output end of the aforementioned unit channel, the transfer component 2 transfers the silicon wafer 8 to the input end of another unit channel adjacent to the aforementioned unit channel. Meanwhile, the support roller 31 in this unit channel rotates in the opposite direction, causing the silicon wafer 8 to move in the opposite direction from the original direction. As it passes through this unit channel, the top surface of the silicon wafer 8 is heated by the heating device 17 within its heating range, causing the grid lines on the silicon wafer 8 to dry. Since preheating has been performed before heating, the silicon wafer 8 has a certain temperature, thereby slowing down the heating rate of the silicon wafer 8.

[0052] After the silicon wafer 8 moves to the output end of the unit channel, the transfer component 2 transfers the silicon wafer 8 to other unit channels. With the help of the rotating support roller 31, it moves in the opposite direction to the previous movement. During the movement, it passes through the heating range of the heating device 17 to heat the top surface of the silicon wafer 8 so that the grid lines on the silicon wafer 8 can be dried.

[0053] Following the above method, the silicon wafer 8 is transferred by the end transfer component 2 to the input end of the unit channel corresponding to the discharge port 16. Since the unit channel is outside the heating range of the heating device 17, the silicon wafer 8 only comes into contact with the hot air flowing in the drying oven 1 when it passes through the unit channel. By coming into contact with the hot air flowing, the cooling rate of the silicon wafer 8 can be slowed down, and finally the silicon wafer 8 is discharged from the discharge port 16.

[0054] Therefore, when the silicon wafer 8 passes through the drying channel, the flowing hot air enables preheating before heating and delayed cooling after heating. This reduces the heating rate of the silicon wafer 8 throughout the drying process, alleviates temperature gradient changes, avoids thermal stress damage caused by rapid temperature changes, and reduces the risk of cracking and deformation. In addition, when the silicon wafer 8 passes through the unit channel in the middle position, its top surface is directly heated by the heating device 17, and the air flow ensures uniform heating, avoiding the decline in drying quality caused by uneven heating. Furthermore, the airflow driven by the return pump 42 rotates the support roller 31, which, together with the transfer component 2, transfers the silicon wafer 8, allowing it to pass through each unit channel in an orderly manner. This ensures continuous heating of the silicon wafer 8, maintains drying efficiency, and avoids the decline in drying efficiency caused by transmission interruptions.

[0055] The specific structure of the drying oven 1 in this invention Figure 3 , Figure 4 , Figure 8 , Figure 9 , Figures 11-13As shown, the drying oven 1 includes a horizontal base plate 11. Several vertically arranged side plates 13 are fixed above the outer periphery of the base plate 11. Three vertical partitions 14 are also fixed above the base plate 11. The length direction of the partitions 14 is consistent with the length direction of the base plate 11. The three partitions 14 are staggered and fixedly connected to the side plates 13 at the ends. A top plate 12 is fixed to the top of the side plates 13 and the partitions 14. The air inlet 121 is located at the edge of the top plate 12 and is distributed at intervals along the circumference of the top plate 12 to ensure uniform air intake. The feed inlet 15 and the discharge outlet 16 are located on the same side of the drying oven 1 and are adjacent to the top of the base plate 11. This facilitates the feeding of the silicon wafers 8 to be dried through the feed inlet 15 and the receiving of the dried silicon wafers 8 from the discharge outlet 16 on the same side of the drying oven 1.

[0056] In this embodiment, three partitions 14 are provided, which, together with the bottom plate 11, side plate 13 and top plate 12, enclose and form four unit channels that are arranged side by side along the width direction of the drying box 1 and extend along the length direction of the drying box 1. The four unit channels are connected end to end to form a serpentine drying channel. Correspondingly, three transfer components 2 are provided, which are respectively set at the connection between two adjacent unit channels. Compared with the straight strip design in the prior art, the drying channel of the present invention is a serpentine shape with multiple bends, which reduces the length of the device while ensuring the same length. In addition, two of the four unit channels are directly opposite the feed inlet 15 and the discharge outlet 16, respectively, and the remaining two are separated from the feed inlet 15 and the discharge outlet 16.

[0057] The heating device 17 is an infrared lamp, which is positioned downwards and fixed between two adjacent partitions 14. This ensures that the heating device 17 is located in the middle and separated from the feed inlet 15 and the discharge outlet 16 by two unit channels. The infrared lamp used in the heating device 17 has the characteristics of rapid and uniform heating. Before entering the two unit channels, the silicon wafer 8 first enters the unit channel connected to the feed inlet 15 for preheating to avoid excessively rapid temperature rise. After passing through the two unit channels, the silicon wafer 8 enters the unit channel connected to the discharge outlet 16. The flowing hot air slows down the cooling rate of the silicon wafer 8, thus greatly reducing thermal stress damage to the silicon wafer 8, thereby avoiding deformation and damage to the silicon wafer 8, and ensuring the drying quality of the grid lines on the silicon wafer 8.

[0058] During the drying process of silicon wafer 8, the slurry is heated and the solvent and some volatile substances evaporate, resulting in the hot air drawn by the return pump 42 containing the aforementioned harmful substances. In order to prevent harmful substances from flowing back into the drying chamber 1 and affecting the drying effect, and to prevent harmful substances from being discharged into the outside world through the inlet 15 and outlet 16 and polluting the surrounding air, a filter assembly 5 is provided at the output end of the return pump 42. The filter assembly 5 can filter the solvent and volatile substances in the air.

[0059] Specifically, such as Figures 4-7 As shown, the filter assembly 5 is fixed above the top plate 12. The filter assembly 5 includes a filter shell 51. The two sides of the filter shell 51 are fixedly connected to a return inlet pipe 57. There are two return pumps 42, which are connected to the two return inlet pipes 57 one by one. The filter shell 51 has a built-in filter frame 52 for placing filter material. The bottom of the filter shell 51 is fixedly connected to a heating shell 53. The heating shell 53 is fixed above the top plate 12 and has a built-in electric heating mesh 54. The four sides of the heating shell 53 are fixedly connected to a return outlet pipe 58. The return outlet pipe 58 is fixedly connected to a frame-shaped top cover 56. The top cover 56 covers the air inlet 121 and its bottom surface is fixedly connected to the top surface of the top plate 12.

[0060] After the reflux pump 42 draws in air, it is delivered to the filter housing 51 through the reflux inlet pipe 57. The air is filtered by the filter material placed on the filter frame 52, so that the clean air is output from the filter housing 51 and enters the heating housing 53. The electric heating grid 54 in the heating housing 53 heats the air and then outputs it through the reflux outlet pipe 58 into the top cover 56. Finally, it is evenly delivered downward into the drying oven 1 through the circumferentially distributed air inlets 121.

[0061] It should be noted that the filter material placed on the filter rack 52 can be one type or multiple types, such as silicon carbide porous ceramic particles, high-temperature synthetic fiber particles, activated carbon filter screen or filter layer, etc.

[0062] To facilitate the replacement of filter media, the filter holder 52 is detachably installed inside the filter housing 51.

[0063] Specifically, the filter housing 51 includes a filter barrel 511 with an open top and fixedly connected to the top of the heating housing 53. The filter barrel 511 has an open top and an outward flange on its outer circumferential edge. A screw 513 extending in the vertical direction is integrally connected to the outward flange. The top of the filter barrel 511 is covered with a barrel cover 512, which is fitted over the screw 513. The screw 513 is threadedly connected to a threaded tube 514, which is used to lock the barrel cover 512 onto the filter barrel 511. This facilitates the detachable connection between the barrel cover 512 and the filter barrel 511, so as to open or close the filter barrel 511.

[0064] An inner convex ring 5111 is coaxially arranged on the inner wall of the filter barrel 511. The inner convex ring 5111 is located below the end of the return inlet pipe 57 away from the return pump 42. The filter frame 52 is a cylindrical structure with an open top. The filter frame 52 includes a positioning ring and a filter bag fixed below the positioning ring. The inner diameter and outer diameter of the positioning ring are respectively the inner diameter of the inner convex ring 5111 and the inner diameter of the filter barrel 511, so that the positioning ring can be placed in the filter barrel 511 and supported by the inner convex ring 5111. The filter bag is used to hold the filter material. The positioning ring is fixedly connected to a handle 55, which can be used to move the positioning ring. After the barrel cover 512 is locked above the filter barrel 511 by the threaded screw 513 and the screw tube 514, the handle 55 abuts against the bottom of the barrel cover 512. In this way, the axial and radial positioning of the positioning ring is achieved to fix the position of the filter frame 52 and prevent the position of the filter frame 52 from changing in the filter shell 51.

[0065] A further improvement is that both the inlet 15 and the outlet 16 are equipped with guiding components 7. The guiding component 7 connected to the inlet 15 facilitates the introduction of silicon wafers 8 into the drying chamber 1 through the inlet 15, and the guiding component 7 connected to the outlet 16 facilitates the discharge of silicon wafers 8 through the outlet 16. Specifically, the guiding component 7 includes two guiding plates 71 arranged side by side along the width direction of the drying chamber 1. Both guiding plates 71 are elongated and inclined, and are fixedly connected to the side plate 13. The guiding roller 72 is along the length of the guiding plate 71. The guide rollers 71 are evenly spaced between two guide plates 71 and rotate around their own axis. In the guide assembly 7 corresponding to the feed port 15, the end of the guide plate 71 adjacent to the drying box 1 is lower than the other end, which facilitates the silicon wafer 8 to move downward along the inclined guide rollers 72 and enter the drying box 1 from the feed port 15. In the guide assembly 7 corresponding to the discharge port 16, the end of the guide plate 71 adjacent to the drying box 1 is higher than the other end, which facilitates the silicon wafer 8 to move downward along the inclined guide rollers 72 after being discharged from the discharge port 16.

[0066] A further improvement is that the drying chamber 1 includes a bottom plate 11, the top surface of which forms the bottom wall of the unit channel, and air holes 113 are provided on the bottom plate 11. The bottom of the movement path of the fan blade 32 is located below the bottom plate 11. The guide shell 41 corresponds one-to-one with the air holes 113. The guide shell 41 is provided with a guide hole that communicates with the input end of the return pump 42. The plane where the orifice of the guide hole is located is parallel to the axis of the support roller 31 and faces the blade surface of the fan blade 32 that rotates to the bottom.

[0067] With the above structure, when the reflux pump 42 is started, air flow is generated. Above the bottom plate 11 inside the drying oven 1, the air flows downward from above, passes through the air hole 113, and flows towards the input end of the reflux pump 42. During the flow, it acts on the fan blade 32, pushing the fan blade 32 to rotate, which is conducive to the rotation of the support roller 31. By using the top of the support roller 31 to contact the bottom surface of the silicon wafer 8, the silicon wafer 8 can move along the length direction of the unit channel. In this invention, the guide hole on the guide shell 41 is directly opposite the blade of the fan blade 32 rotated to the bottom position. This helps to ensure that when the air flows towards the input end of the return pump 42, its flow path passes through the fan blade 32, which can drive the fan blade 32 to rotate. In order to facilitate the connection between the guide cavity and the return pump 42, an air extraction pipe 43 is fixed below the guide shell 41. The air extraction pipe 43 is a U-shaped pipe. The upper part of the air extraction pipe 43 is fixedly connected to the guide shell 41 directly below the two unit channels. The middle part of the air extraction pipe 43 is connected to the return pump 42. The return pump 42 is fixed on the side plate 13.

[0068] A further improvement is that the support roller 31 is covered with an elastic cushioning sleeve 33.

[0069] Specifically, such as Figure 19 As shown, the support member 3 includes two support rollers 31 arranged side by side along the width direction of the unit channel. Each of the two support rollers 31 is covered with an elastic buffer sleeve 33. There are matching protrusions and depressions between the circumferential outer edge of the support rollers 31 and the circumferential inner wall of the buffer sleeve 33.

[0070] The above structure ensures the synchronous rotation of the buffer sleeve 33 and the support roller 31. During use, the air in the drying chamber 1 is discharged at the air hole 113, forming a negative pressure. This causes the silicon wafer 8 located above the support 3 to be attracted by the negative pressure, increasing the contact pressure with the support 3 and ensuring the transmission pressure. In addition, the buffer sleeve 33 can increase the contact area with the bottom surface of the silicon wafer 8 through its own elastic deformation, ensuring stable transmission and avoiding wear caused by rigid contact between the silicon wafer 8 and the support roller 31.

[0071] A further improvement is that the base plate 11 includes an upper clamping plate 111 and a lower clamping plate 112. The upper clamping plate 111 and the lower clamping plate 112 are provided with opposing upper clamping grooves 1111 and lower clamping grooves 1121. The upper clamping grooves 1111 and the lower clamping grooves 1121 enclose and form an assembly hole. The support roller 31 is fixedly connected to a rotating shaft 34 along the coaxial centerline. The outer circumferential edge of the rotating shaft 34 is sealed to the inner circumferential wall of the assembly hole.

[0072] Specifically, such as Figures 15-17As shown, the base plate 11 is formed by an upper clamping plate 111 and a lower clamping plate 112 that are fixedly connected to each other. The upper clamping plate 111 is located directly above the lower clamping plate 112. The bottom surface of the upper clamping plate 111 is provided with upper clamping grooves 1111 arranged side by side along the length direction of the drying box 1 and equally spaced along the width direction of the drying box 1. The upper clamping plate 111 is also provided with upper air vents 1112 arranged in a rectangular array and in the form of through holes. The upper clamping grooves 1111 pass through the upper air vents 1112. Correspondingly, the top surface of the lower clamping plate 112 is provided with lower clamping grooves 1121 arranged side by side along the length direction of the drying box 1 and equally spaced along the width direction of the drying box 1. The lower clamping plate 112 is also provided with a rectangular array of through-hole-shaped lower air vents 1122. The lower clamping grooves 1121 pass through the lower air vents 1122. The upper clamping grooves 1111 correspond one-to-one with the lower clamping grooves 1121. The air vents 113 are formed by connecting the upper air vents 1112 and the lower air vents 1122.

[0073] With the above structure, during assembly, the support 3 is placed in the lower air vent 1122 of the lower clamping plate 112, so that both ends of the rotating shaft 34 are sealed and fitted with the lower clamping groove 1121. Then, the upper clamping plate 111 is placed on the lower clamping plate 112 and the upper clamping plate 111 is fixedly connected to the lower clamping plate 112. The fixed connection method is not limited, including welding, gluing, etc., so that the upper air vent 1112 and the lower air vent 1122 are connected to form an air hole 113. The top and bottom of the support roller 31 are located above and below the air hole 113, respectively. The upper clamping groove 1111 and the lower clamping groove 1121 are combined to form an assembly hole that is sealed and connected to the outer edge of the rotating shaft 34. In this way, the support 3 can rotate around the axis of the assembly hole.

[0074] A further improvement is that it also includes a synchronization component 6, which includes two synchronization units 62. Two adjacent support components are respectively connected to the two synchronization units 62 in a one-to-one transmission connection to ensure that the rotational speed of each support member 3 in the same support component is consistent.

[0075] Two synchronization units 62 of the synchronization component 6 are respectively arranged on both sides of the drying chamber 1. One synchronization unit 62 is driven to the support member 3 in the corresponding unit channel of the feed inlet 15 and the support member 3 in the unit channel with the same transmission direction as the corresponding unit channel, so as to ensure that the support members 3 in the two unit channels rotate at the same speed. The other synchronization unit 62 is driven to the support members 3 in the remaining two unit channels, so that the support members 3 in the remaining two unit channels rotate at the same speed and the rotation direction is opposite to the rotation direction of the support members 3 in the first two unit channels. This achieves that the silicon wafer 8 moves in opposite directions in the four unit channels and avoids wear between the support member 3 and the bottom surface of the silicon wafer 8 caused by inconsistent rotation speed of the support member 3 in the same unit channel.

[0076] A further improvement is that the synchronization component 6 includes synchronization shafts 61 distributed along the length of the unit channel and corresponding one-to-one with the support units. Among two adjacent synchronization shafts 61, one is radially fixedly connected to the corresponding rotation shaft 34, and the other is radially rotatably connected to the corresponding rotation shaft 34. The synchronization unit 62 includes a synchronization wheel 621. The rotating shaft that is radially fixedly connected to the rotation shaft 34 is coaxially fixedly connected to the synchronization wheel 621. Adjacent synchronization wheels 621 are hinged together by a connecting rod 622. The rotation shaft 34 is a hollow shaft through which the corresponding synchronization shaft 61 passes. The synchronization shaft 61 includes a round shaft 611 and a protruding key 612 disposed on the circumferential outer edge of the round shaft 611 and extending axially along the round shaft 611. Among the rotation shafts 34 of two adjacent support units in each support component, the circumferential inner wall of one rotation shaft 34 is sealed and fitted with the circumferential outer edge of the synchronization shaft 61, and there is a gap between the circumferential inner wall of the other rotation shaft 34 and the circumferential outer edge of the synchronization shaft 61.

[0077] Specifically, such as Figure 9 , Figure 10 , Figure 15 , Figure 16 and Figure 19 As shown, the synchronization assembly 6 consists of synchronization shafts 61 spaced apart along the length of the drying chamber 1 and synchronization units 62 disposed at both ends of the synchronization shafts 61. The upper clamping groove 1111 of the upper clamping plate 111 and the lower clamping groove 1121 of the lower clamping plate 112 are both through grooves, and their number is equal to the number of synchronization shafts 61 and corresponds one-to-one. There is a gap between the synchronization shafts 61 and the circumferential inner wall of the assembly hole.

[0078] All rotating shafts 34 of the support member 3 are hollow shafts. In the same support assembly, along the length of the unit channel, on two adjacent rotating shafts 34, the inner circumferential wall of one rotating shaft 34 is sealed and fitted with the outer circumferential edge of the synchronous shaft 61, so that the rotation of the synchronous shaft 61 can drive the rotating shaft 34 and the corresponding support roller 31 to rotate. The inner circumferential wall of the other rotating shaft 34 is spaced from the outer circumferential edge of the synchronous shaft 61, so that the rotation of the synchronous shaft 61 will not affect the rotating shaft 34. The distance between the centerlines of two adjacent synchronous shafts 61 is less than half the length of the silicon wafer 8. Thus, when the silicon wafer 8 is transported and moved by the rotating support member 3, at least two support members 3 are always in contact with the bottom surface of the silicon wafer 8, thereby ensuring that at least one support member 3 can be affected by the rotation of the synchronous shaft 61 and rotate, thereby driving the silicon wafer 8 to move.

[0079] The synchronization unit 62 includes synchronization wheels 621 distributed at intervals along the drying chamber 1. The distribution interval of the synchronization wheels 621 is twice the distribution interval of the synchronization shafts 61. A positioning piece 63 is provided between two adjacent synchronization wheels 621. The synchronization wheels 621 and the adjacent positioning pieces 63 are fixedly connected to the coaxial center lines of the two adjacent synchronization shafts 61, respectively. Both the synchronization wheels 621 and the positioning pieces 63 are in contact with the two sides of the base plate 11 to prevent the synchronization shafts 61 from moving axially.

[0080] Adjacent synchronous pulleys 621 are hinged together by connecting rods 622, thereby ensuring that the synchronous pulleys 621 in the synchronous unit 62 rotate at the same speed. The synchronous shaft 61 acts on the rotating shaft 34, so that the rotation speed of each support member 3 in the support assembly corresponding to the same unit channel is the same.

[0081] A further improvement is that ball bearings 18 are provided on the opposite side walls of the unit channel, which rotate around their own center and protrude from the surface of the side wall; the center of the ball bearing 18 is located above the horizontal plane where the top of the support member 3 is located and the distance between the ball bearing 18 and the horizontal plane is less than the thickness of the silicon wafer 8.

[0082] Specifically, the bottom of the partition 14 and the side plates 13 distributed on both sides along the width direction of the drying oven 1 are provided with balls 18. The balls 18 rotate around their own center and protrude from the surface of the partition 14 and the side plates 13. Since the distance between the center of the balls 18 and the plane where the top of the support 3 is located is less than the thickness of the silicon wafer 8, when the silicon wafer 8 is transferred by rotating the support 3, the side wall of the silicon wafer 8 can contact the surface of the balls 18. The balls 18 guide the silicon wafer 8 to translate along the length direction of the unit channel, and the rotation of the balls 18 around their own center reduces the friction between them and the side wall of the silicon wafer 8.

[0083] A further improvement is that the transfer assembly 2 includes transfer units distributed along the unit channel. Each transfer unit includes a transfer bar 21. The projection length of the transfer bar 21 on the horizontal plane is parallel to the width direction of the unit channel. Two telescopic units 22 are arranged below the transfer bar 21. The telescopic ends of the two telescopic units 22 move in the vertical direction. The telescopic end of one telescopic unit 22 is rotatably connected to the transfer bar 21 and the center line of the rotation axis 34 is parallel to the length direction of the unit channel. The telescopic end of the other telescopic unit 22 abuts against the transfer bar 21.

[0084] Specifically, such as Figures 14-18 and Figure 20As shown, the transfer assembly 2 includes two transfer units distributed along the unit channel. The spacing between the two transfer units is greater than half the length of the silicon wafer 8 but less than the length of the silicon wafer 8. Specifically, the transfer unit includes a transfer bar 21, multiple transfer rollers 23 disposed above the transfer bar 21, and two telescopic units 22 disposed below the transfer bar 21. Both telescopic units 22 are telescopic cylinders. A horizontal base 9 is fixed below the drying chamber 1. The bottom of the lower clamping plate 112 is fixed above the base 9 by a support leg 1124. The cylinders of the telescopic cylinders are all fixed vertically upward above the base 9. The transfer rollers 23 are evenly distributed along the length direction of the transfer bar 21 and their rotation axis is parallel to the length direction of the drying chamber 1.

[0085] Correspondingly, the upper clamping plate 111 is provided with a receiving through hole 1113 extending along the width direction of the drying box 1, which is used to receive the transfer strip 21 and the transfer roller 23; the lower clamping plate 112 is provided with a through hole 1123 located directly below the receiving through hole 1113 and for the piston rod of the telescopic cylinder to pass through in a sealed manner; of the two telescopic cylinders, the top of the piston rod of one of them is rotatably connected to the bottom of the transfer strip 21, and this telescopic cylinder is located below the input end of the unit channel; the top of the piston rod of the other is abutted against the bottom of the transfer strip 21, and this telescopic cylinder is located below the output end of the unit channel.

[0086] With the above structure, in the initial state, the two telescopic cylinders in the transfer unit control the piston rods to descend, causing the transfer bar 21 and transfer roller 23 to descend into the receiving through hole 1113. When a silicon wafer 8 is transferred to the output end of one of the unit channels, the silicon wafer 8 is located below the transfer bar 21 and transfer roller 23 in one of the transfer components 2. At this time, the two telescopic cylinders move synchronously, lifting the silicon wafer 8 horizontally, so that the silicon wafer 8 is separated from the support member 3. The telescopic cylinder corresponding to the output end of the unit channel continues to push the piston rod upward, while the other telescopic cylinder stops operating, causing the transfer bar 21 to tilt downward. The lower end is located above the stopped telescopic cylinder. Following the inclined transfer bar 21, it slides down through the transfer roller 23. After contacting the partition plate 14 or the side plate 13, the piston rods of the two telescopic cylinders descend, causing the transfer bar 21 and the transfer roller 23 to enter the receiving through hole 1113 and be separated from the bottom surface of the silicon wafer 8. The silicon wafer 8 moves downward under the influence of gravity. With the help of the airflow generated by the return pump 42 at the air hole 113, the silicon wafer 8 contacts the ball 18 and finally falls on the support member 3. Then, through the rotating support roller 31, the silicon wafer 8 moves in another unit channel.

[0087] To facilitate the detection of whether there is a silicon wafer 8 at the output end of the unit channel connected to the discharge port 16, a distance sensor 19 is provided at the bottom of the side plate 13, facing the output end of the unit channel inside the drying chamber 1. The plane of the distance sensor 19 coincides with the plane of the top of the support member 3. In this way, it is convenient to detect the distance between the silicon wafer 8 and the output end of the unit channel. When the silicon wafer 8 moves to the output end of the unit channel as the support member 3 rotates, it can be transferred to the input end of another unit channel by the transfer component 2.

[0088] The above description is only a preferred embodiment of the present invention. It should be noted that for those skilled in the art, several improvements and modifications can be made without departing from the technical principles of the present invention, and these improvements and modifications should also be considered within the scope of protection of the present invention.

Claims

1. A gate line baking apparatus, characterized by, include: A drying box (1) is provided with a feed inlet (15) and a discharge outlet (16) on its side wall. The drying box (1) has a built-in drying channel and a heating device (17). The drying channel includes multiple unit channels that are all long strips and arranged side by side in the horizontal direction. The unit channels are connected in sequence. The two unit channels at the ends are connected to the feed inlet (15) and the discharge outlet (16) respectively. The heating device (17) is arranged downwards directly above the other unit channels. The drying box (1) is also provided with an air inlet (121). Transfer component (2), the transfer component (2) is disposed at the connection of adjacent unit channels, and is used to transfer the silicon wafer at the output end of one unit channel to the input end of another unit channel; The support assembly corresponds one-to-one with the unit channel. The support assembly includes support units spaced apart along the length direction of the unit channel. Each support unit includes a support member (3). The support member (3) includes a support roller (31) and a fan blade (32). The axis of the support roller (31) extends parallel to the width direction of the unit channel. The fan blade (32) is arranged in a ring array on one side of the support roller (31) with the axis of the support roller (31) as the center line. The fan blade (32) is located inside the curved surface where the outer circumferential edge of the support roller (31) is located. The bottom wall of the unit channel is provided with a wind hole (113) for the support member (3) to rotate. The top of the support roller (31) is higher than the wind hole (113). In the support members (3) of the support assemblies corresponding to adjacent unit channels, the fan blades (32) are arranged in opposite directions, and the rotation directions of the support members (3) are opposite. The return assembly (4) and the filter assembly (5) include a flow guide shell (41) and a return pump (42). The flow guide shell (41) covers the bottom of the air hole (113) and forms a flow guide cavity with the drying box (1). The flow guide cavity is connected to the input end of the return pump (42) to drive the fan blade (32) to rotate around the axis of the support roller (31). The output end of the return pump (42) is connected to the air inlet (121) through the filter assembly (5).

2. The grid wire drying device according to claim 1, characterized in that: The drying box (1) includes a bottom plate (11), the top surface of which forms the bottom wall of the unit channel, the air hole (113) is provided on the bottom plate (11), and the bottom of the movement path of the fan blade (32) is located below the bottom plate (11).

3. The grid drying device according to claim 1, characterized in that: The guide shell (41) corresponds one-to-one with the air hole (113). The guide shell (41) is provided with a guide hole that communicates with the input end of the return pump (42). The plane where the guide hole is located is parallel to the axis of the support roller (31) and faces the blade surface of the fan blade (32) that has rotated to the bottom.

4. The grid drying device according to claim 1, characterized in that: The support roller (31) is covered with an elastic buffer sleeve (33).

5. The grid wire drying device according to claim 2, characterized in that: The base plate (11) includes an upper clamping plate (111) and a lower clamping plate (112). The upper clamping plate (111) and the lower clamping plate (112) are provided with opposing upper clamping grooves (1111) and lower clamping grooves (1121). The upper clamping grooves (1111) and the lower clamping grooves (1121) enclose to form an assembly hole. The support roller (31) is fixedly connected to a rotating shaft (34) along the coaxial center line. The outer circumferential edge of the rotating shaft (34) is sealed to the inner circumferential wall of the assembly hole.

6. The grid wire drying apparatus according to claim 5, characterized in that: It also includes a synchronization component (6), which includes two synchronization units (62). Two adjacent support components are respectively connected to the two synchronization units (62) in a one-to-one transmission connection to ensure that the rotational speed of each support member (3) in the same support component is consistent.

7. The grid wire drying apparatus according to claim 6, characterized in that: The synchronization component (6) includes synchronization shafts (61) distributed along the length of the unit channel and corresponding one-to-one with the support unit. Among two adjacent synchronization shafts (61), one is radially fixedly connected to the corresponding rotating shaft (34), and the other is radially rotatably connected to the corresponding rotating shaft (34). The synchronization unit (62) includes a synchronization wheel (621). The rotating shaft that is radially fixedly connected to the rotating shaft (34) is fixedly connected to the synchronous wheel (621) along the same axis. Adjacent synchronization wheels (621) are hinged together by a connecting rod (622).

8. The grid wire drying apparatus according to claim 7, characterized in that: The rotating shaft (34) is a hollow shaft through which the corresponding synchronous shaft (61) passes. The synchronous shaft (61) includes a round shaft (611) and a convex key (612) disposed on the circumferential outer edge of the round shaft (611) and extending axially along the round shaft (611). In each support assembly, among the rotating shafts (34) of two adjacent support units, the circumferential inner wall of one rotating shaft (34) is sealed and fitted with the circumferential outer edge of the synchronous shaft (61), and the circumferential inner wall of the other rotating shaft (34) has a gap with the circumferential outer edge of the synchronous shaft (61).

9. The grid drying apparatus according to any one of claims 1-8, characterized in that: On the opposite side walls of the unit channel, there are balls (18) that rotate around their own center and protrude from the side wall surface. The center of the balls (18) is located above the horizontal plane where the top of the support (3) is located and the distance between the ball and the horizontal plane is less than the thickness of the silicon wafer (8).

10. The grid drying apparatus according to any one of claims 1-8, characterized in that: The transfer assembly (2) includes transfer units distributed along the unit channel. Each transfer unit includes a transfer strip (21). The projection length of the transfer strip (21) on the horizontal plane is parallel to the width direction of the unit channel. Two telescopic units (22) are arranged below the transfer strip (21). The telescopic ends of the two telescopic units (22) move in the vertical direction. The telescopic end of one telescopic unit (22) is rotatably connected to the transfer strip (21) and the center line of the rotation axis (34) is parallel to the length direction of the unit channel. The telescopic end of the other telescopic unit (22) abuts against the transfer strip (21).

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