Test probe rod used for quantum voltage standard and capable of rapidly disassembling and assembling samples
By designing a test probe for quickly disassembling and assembly of samples for quantum voltage standards, the problem of rapid disassembling and assembly and replacement of quantum voltage chips is solved, and efficient quantum voltage value transfer and sample temperature stability are achieved.
Patent Information
- Application Number
- CN202411941485.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-26
- Publication Date
- 2025-03-25
AI Technical Summary
It is difficult for the prior art to realize the rapid disassembly and assembly and replacement of quantum voltage chips, especially while maintaining the low temperature environment of the refrigerator, the traditional methods have risks of manual operation and heat leakage problems.
A test probe rod for quickly disassembly and assembled samples of quantum voltage standards is designed, including a measurement adapter box, sample cavity, connecting rod, second fixing device and transmission assembly, through which the compact structure and quick plug-in and pull-out function of the probe rod are realized.
The rapid disassembly and assembly and replacement of quantum voltage chips is achieved, efficiency is improved, and the sample temperature is maintained through thermal insulation design, avoiding the freezing flux and heat leakage problems caused by manual operation.
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Figure CN119689040A_ABST
Abstract
Description
Technical Field
[0001] The invention belongs to the field of low-temperature measurement, and in particular relates to a test probe rod for a quantum voltage standard and capable of quickly disassembling and assembling a sample. Background Art
[0002] With the continuous development and improvement of quantum voltage reference applications in the field of metrology, the demand and importance of system mobility have become increasingly prominent, especially for practical voltage calibration in industrial sectors, military calibration laboratories, and large scientific facilities. The cooling part of traditional quantum voltage reference systems usually directly uses a cryogenic thermostat filled with refrigerant (such as a Dewar filled with liquid helium) or a cryogenic refrigerator (such as a pulse tube refrigerator).
[0003] When a dewar filled with liquid helium is used, the cooling of the chip usually requires manual insertion of the probe rod containing the chip into the liquid helium dewar little by little. This process usually requires slow and uniform operation to prevent frost on the sample rod from affecting further cooling of the sample stage. The manual cooling process may introduce additional frozen magnetic flux into the quantum voltage chip, affecting device performance. In addition, improperly designed measurement probes may also cause heat leakage problems, which will have an adverse effect on the stability of the sample temperature.
[0004] When a pulse tube refrigerator is used, the sample stage with the chip is usually placed on the cold head of the refrigerator. The refrigerator needs to be disassembled and reassembled every time the sample is changed. The process is relatively cumbersome and it is difficult to achieve rapid disassembly and replacement of the quantum voltage chip. Summary of the invention
[0005] The present specification provides a test probe for a quantum voltage standard that can quickly disassemble and install a sample, so as to solve the problem that it is difficult to quickly disassemble and replace a quantum voltage chip in the prior art.
[0006] A test probe for a quantum voltage standard capable of quickly disassembling and assembling a sample of the present invention comprises:
[0007] The measurement adapter box is provided with at least one SMA interface and / or a multi-core jack;
[0008] A sample chamber, wherein a sample testing table is arranged inside;
[0009] A connecting rod, one end of which is fixedly connected to the measurement adapter box, and the other end of which is fixedly connected to the sample chamber;
[0010] A second fixing device is provided in plurality, wherein the plurality of second fixing devices are fixedly provided outside the connecting rod and distributed along the axis direction of the connecting rod;
[0011] A transmission component, one end of which is connected to the measurement adapter box, and the other end of which is connected to the sample test bench.
[0012] According to some embodiments of the present application, a test probe rod for a quantum voltage standard with a quickly detachable sample is provided, wherein the second fixing device is in the form of an annular partition structure, the inner ring of the second fixing device is fixedly connected to the connecting rod, and the second fixing device is provided with a gap capable of fixing the transmission component.
[0013] According to some embodiments of the present application, a test probe rod for a quantum voltage standard with a quickly detachable sample is provided, wherein the sample cavity is cylindrical, and the outer ring of the second fixing device is consistent with the circular outer size of the sample cavity.
[0014] According to some embodiments of the present application, a test probe rod for a quantum voltage standard that can quickly disassemble and assemble a sample is provided, wherein the transmission components are transmission lines and waveguides, and ports for the transmission lines and waveguides are provided on the sample test bench.
[0015] According to some embodiments of the present application, a test probe rod for a quantum voltage standard that can quickly disassemble and assemble a sample is provided. The test probe rod also includes a first fixing device, and the first fixing device is arranged outside the connecting rod.
[0016] According to some embodiments of the present application, a test probe rod for a quantum voltage standard with a quickly detachable sample also includes a vacuum dewar, one end of the test probe rod having a sample cavity extends into the vacuum dewar, and the first fixing device is arranged at the connection between the test probe rod and the vacuum dewar.
[0017] According to some embodiments of the present application, a test probe rod for a quantum voltage standard that can quickly disassemble and assemble samples also includes a primary cold shield and a secondary cold shield, and the primary cold shield and the secondary cold shield are sequentially arranged in the vacuum dewar.
[0018] According to some embodiments of the present application, a test probe rod for a quantum voltage standard with a rapidly detachable sample also includes a refrigeration device and a flexible thermally conductive bridge. The refrigeration device extends into the vacuum dewar and is connected to the sample chamber via the flexible thermally conductive bridge.
[0019] At least one of the above technical solutions adopted in the embodiments of this specification can achieve the following beneficial effects:
[0020] (1) The present invention has a compact structure, and the quantum chip can be easily replaced and plugged in. There is no need to open the cold screen to replace the sample, and the low temperature environment of the refrigerator can be maintained as much as possible. The quantum voltage chip can be quickly disassembled and replaced, thereby improving efficiency.
[0021] (2) Due to the limited service life of superconducting quantum chips, the present invention improves the efficiency of quantum voltage value transmission by plugging and unplugging the test probe to exchange samples. BRIEF DESCRIPTION OF THE DRAWINGS
[0022] The drawings described herein are used to provide a further understanding of the present application and constitute a part of the present application. The illustrative embodiments of the present application and their descriptions are used to explain the present application and do not constitute an improper limitation on the present application. In the drawings:
[0023] Figure 1 This is a schematic diagram of the structure of some embodiments of the present application;
[0024] Figure 2 Schematic diagram of the overall low-temperature thermostat structure of the measuring probe integrated pulse tube refrigerator provided in some embodiments of the present application.
[0025] Explanation of the accompanying drawings: 1. SMA interface; 2. Multi-core jack; 3. Measurement adapter box; 4. Connecting rod; 5. First fixing device; 6. Second fixing device; 7. Transmission component; 8. Sample chamber; 9. Sample test bench; 10. Refrigeration device; 11. Vacuum Dewar; 12. Primary cold shield; 13. Secondary cold shield; 14. Flexible thermal bridge. DETAILED DESCRIPTION
[0026] In order to make the purpose, technical solution and advantages of the present application clearer, the technical solution of the present application will be clearly and completely described below in combination with the specific embodiments of the present application and the corresponding drawings. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present application.
[0027] The technical solutions provided by various embodiments of the present application are described in detail below in conjunction with the accompanying drawings.
[0028] like Figure 1-2 As shown, the present invention provides a test probe for a quantum voltage standard with a sample that can be quickly disassembled and assembled, comprising a measurement adapter box 3, a sample chamber 8, a connecting rod 4, a second fixing device 6 and a transmission component 7:
[0029] The measurement adapter box 3 is provided with at least one SMA interface 1 and / or a multi-core jack 2, a sample test bench 9 is provided inside the sample cavity 8, one end of the connecting rod 4 is fixedly connected to the measurement adapter box 3, and the other end is fixedly connected to the sample cavity 8, a plurality of second fixing devices 6 are provided, and the plurality of second fixing devices 6 are fixedly arranged on the outside of the connecting rod 4 and distributed along the axial direction of the connecting rod 4, one end of the transmission component 7 is connected to the measurement adapter box 3, and the other end of the transmission component 7 is connected to the sample test bench 9.
[0030] In specific implementation, the full name of SMA is SubMiniature versionA. There are two forms of SMA interfaces. The standard SMA is "external thread + hole" at one end and "internal thread + needle" at the other end; the reverse polarity RP-SMA is "external thread + needle" at one end and "internal thread + hole" at the other end. The SMA interface 1 and the multi-core jack 2 on the measurement adapter box 3 are each provided with at least one. In some embodiments, the SMA interface 1 and the multi-core jack 2 can be provided with multiple ones. The connecting rod 4 plays a role of connection and support. The measurement adapter box 3 is connected to the sample cavity 8 by providing the connecting rod 4. In addition, one or more second fixing devices 6 are provided on the connecting rod 4. When multiple second fixing devices 6 are provided, a better heat insulation effect can be achieved. The sample test bench 9 is located inside the sample cavity 8. The corresponding transmission lines and waveguide ports are led out from the sample test bench 9 and are led out through the upper end of the sample cavity 8.
[0031] In some embodiments, the second fixing device 6 is an annular partition structure, the inner ring of the second fixing device 6 is fixedly connected to the connecting rod 4, and a gap capable of fixing the transmission component 7 is provided on the second fixing device 6.
[0032] In a specific implementation, the second fixing device 6 is a partition structure having a circular ring shape, the inner ring of which is connected to the connecting rod 4 to form a hollow fixing structure for realizing the connection between the transmission component 7 and the chip.
[0033] In some embodiments, the sample chamber 8 is cylindrical, and the outer ring of the second fixing device 6 is consistent with the circular outer size of the sample chamber 8 .
[0034] In specific implementation, during the operation of the quantum voltage standard, one end of the low-temperature test probe is connected to room temperature and the other end is connected to a sample stage with liquid helium temperature, with a temperature difference of about 300K at both ends. Therefore, in order to maintain the temperature stability of the sample stage surface and prevent the heat of room temperature from leaking into the test probe to affect the cooling of the sample, the thermal insulation effect of the test probe is crucial. The thermal insulation effect of the test probe is related to the special design of the sample cavity 8 and the second fixture and the number of partitions thereof. The outer ring of the partition has the same circular size as the outer circular size of the cylindrical sample cavity 8. The partition can be made of a material with high specific heat, thereby playing the role of a heat sink and forming a certain temperature gradient near the room temperature end in the sample probe cavity. Preferably, in this embodiment, the number of partitions of the second fixture 6 is 3.
[0035] In some embodiments, the transmission component 7 is a transmission line and a waveguide, and ports of the transmission line and the waveguide are provided on the sample test platform 9 .
[0036] During specific implementation, corresponding transmission lines and waveguide ports are led out from the sample test bench 9 , and the transmission lines and waveguides in the transmission component 7 are led out through the upper end of the sample cavity 8 .
[0037] In some embodiments, a first fixing device 5 is further included, and the first fixing device is arranged outside the connecting rod 4 .
[0038] In a specific implementation, the first fixing device 5 includes a device for determining the position of the test probe rod, and the first fixing device 5 includes a sealing ring and a flange, which are used for vacuum sealing the sample test probe rod.
[0039] In some embodiments, a vacuum dewar 11 is further included, one end of the test probe provided with the sample cavity 8 extends into the vacuum dewar 11 , and the first fixing device 5 is provided at the connection between the test probe and the vacuum dewar 11 .
[0040] When implementing it, Figure 2 As shown, the test probe rod can be inserted into the vacuum dewar 11 , and the first fixing device 5 is located outside the vacuum dewar 11 , and the test probe rod is fixed by the first fixing device 5 .
[0041] In some embodiments, a primary cold shield 12 and a secondary cold shield 13 are also included, and the primary cold shield 12 and the secondary cold shield 13 are sequentially arranged in the vacuum dewar 11 step by step.
[0042] In a specific implementation, when three second fixing devices 6 are provided, as Figure 2 As shown, the three second fixing devices 6 are respectively located at different positions in the vacuum dewar 11 .
[0043] In some embodiments, a refrigeration device 10 and a flexible heat-conducting bridge 14 are also included. The refrigeration device 10 extends into the vacuum dewar 11 and is connected to the sample chamber 8 through the flexible heat-conducting bridge 14 .
[0044] In the description of the present invention, the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer" and the like indicating directions or positional relationships are based on the directions or positional relationships shown in the drawings, which are only for the convenience of description, and do not indicate or imply that the device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first", "second", and "third" are used for descriptive purposes only, and cannot be understood as indicating or implying relative importance.
[0045] In addition, it should be noted that in the description of the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For those skilled in the art, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.
[0046] The term "comprise" or any other similar term is intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus / device that includes a list of elements includes not only those elements but also other elements not expressly listed, or also includes elements inherent to such process, method, article, or apparatus / device.
[0047] The above is only an embodiment of the present application and is not intended to limit the present application. For those skilled in the art, the present application may have various changes and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application should be included in the scope of the claims of the present application.
Claims
1. A test probe for a quantum voltage standard with a sample that can be quickly disassembled and assembled, characterized in that: include: A measurement adapter box (3) is provided with at least one SMA interface (1) and / or a multi-core jack (2); A sample chamber (8) having a sample testing table (9) disposed therein; A connecting rod (4), one end of which is fixedly connected to the measurement adapter box (3), and the other end of which is fixedly connected to the sample chamber (8); A plurality of second fixing devices (6), wherein the plurality of second fixing devices (6) are fixedly arranged outside the connecting rod (4) and distributed along the axial direction of the connecting rod (4); A transmission component (7), one end of the transmission component (7) is connected to the measurement adapter box (3), and the other end of the transmission component (7) is connected to the sample test table (9) in the sample chamber (8).
2. A test probe for a quantum voltage standard with a sample that can be quickly disassembled and assembled according to claim 1, characterized in that: The second fixing device (6) is in the form of an annular partition structure, the inner ring of the second fixing device (6) is fixedly connected to the connecting rod (4), and the second fixing device (6) is provided with a gap capable of fixing the transmission component (7).
3. A test probe for a quantum voltage standard with a sample that can be quickly disassembled and assembled according to claim 2, characterized in that: The sample chamber (8) is in the form of a cylinder, and the outer ring of the second fixing device (6) is consistent with the circular outer size of the sample chamber (8).
4. A test probe for a quantum voltage standard with a sample that can be quickly disassembled and assembled according to claim 3, characterized in that: The transmission component (7) is a transmission line and a waveguide, and the sample test bench (9) is provided with ports of the transmission line and the waveguide.
5. A test probe for a quantum voltage standard with a sample that can be quickly disassembled and assembled according to any one of claims 1 to 4, characterized in that: The test probe further comprises a first fixing device (5), which is arranged outside the connecting rod (4).
6. A test probe for a quantum voltage standard with a sample that can be quickly disassembled and assembled according to claim 5, characterized in that: It also comprises a vacuum dewar (11), one end of the test probe rod provided with a sample cavity (8) extends into the vacuum dewar (11), and the first fixing device (5) is arranged at the connection between the test probe rod and the vacuum dewar (11).
7. A test probe for a quantum voltage standard with a sample that can be quickly disassembled and assembled according to claim 6, characterized in that: It also comprises a primary cold screen (12) and a secondary cold screen (13), wherein the primary cold screen (12) and the secondary cold screen (13) are sequentially arranged in the vacuum dewar (11) step by step.
8. A test probe for a quantum voltage standard capable of rapid sample assembly and disassembly according to claim 7, characterized in that: It also includes a refrigeration device (10) and a flexible heat-conducting bridge (14). The refrigeration device (10) extends into the vacuum dewar (11) and is connected to the sample chamber (8) via the flexible heat-conducting bridge (14).