Probe type contact aging tray assembly

Abstract

A probe type contact aging tray assembly provided by the present invention comprises a laminate, a bottom plate, aging tray clamps, a lossless tripping probe assembly and a formation circuit board, the plurality of aging tray clamps are arranged on the laminate, the bottom plate is arranged at the bottom of one side of the laminate, the bottom plate is electrically connected with the formation circuit board through the lossless tripping probe assembly, and the lossless tripping probe assembly is electrically connected with the formation circuit board. Compared with the prior art, the device has the advantages that the device is simple in structure, convenient to use, ingenious in design, rapid in positioning, small in occupied space and low in cost, formation circuit boards of different specifications can be clamped, a female end pin header interface in the middle of the lossless tripping adjusting seat and a male end pin header interface in the middle of the bottom plate can be rapidly buckled with each other, and contact electrification is achieved.

Description

Technical Field

[0001] The invention relates to the technical field of fixtures, in particular to a probe type contact aging tray assembly. Background Art

[0002] The aging board (forming circuit board) of the existing mini battery in the forming equipment is set on a layer board. When the battery is clamped on the aging board, when pressure is applied to the battery during the forming process, the aging board is easily damaged. Therefore, the battery can only be formed under normal temperature and normal environment. Formation under normal temperature and normal use will cause the battery to take a long time to form, and the thickness and hardness after formation will be inconsistent, and the battery capacity will be different, resulting in poor battery quality.

[0003] Chinese patent CN206364129U discloses a soft pack battery formation fixture, characterized in that it includes a layer plate and a tray arranged on the layer plate; an insulating layer is arranged on the upper end of the tray; a formation circuit board is arranged between the layer plate and the tray, and a gold finger socket is arranged on one side of the formation circuit board; an aging clip is arranged on the tray, and the number of the aging clips is several, and the aging clip is electrically connected to the formation circuit board; a heating device is arranged inside the layer plate, which solves the problem of the soft pack battery formation fixture. The battery can be placed on the tray and clamped with the aging clip. Since the formed circuit board is arranged between the tray and the layer plate, the formed circuit board can be protected; therefore, the soft pack battery formation fixture can be arranged on a formation device with an extrusion function, so that the battery pressure formation can be satisfied. A heating device is arranged inside the layer plate, and the heating device generates heat after being energized to heat the battery, so that the battery is formed at a reasonable pressure and temperature, thereby ensuring the high consistency of the battery, improving the hardness of the battery, and ensuring the consistency of the battery capacity.

[0004] With the development of society and the progress of science and technology, the application of electronic equipment is becoming more and more extensive, involving all areas of daily life, bringing great convenience to people's lives. During the operation of electronic equipment, the internal circuit board is easily affected by the external environment and burned and damaged. The existing circuit board adopts a modular design, and the device on the local module is usually damaged or burned. The maintenance is relatively simple, and only the damaged device needs to be repaired. When repairing the damaged circuit board, the circuit board needs to be clamped and fixed, which is convenient for the staff to perform the repair operation. In the existing circuit board repair, the staff usually places the circuit board on the workbench for operation, which is easy to cause wear and tear on the circuit board, and it is easy to shake, which is not convenient for the staff to perform the repair. However, when the electronic products are used in production, they are usually tested. The common method is to use the circuit board for testing. When testing, the test circuit board needs to be clamped first, and then the circuit is installed. The clamping plate used is specially designed for a type of product. If there are test circuit boards of different specifications during the test, clamping mechanisms of different specifications will be selected, which brings inconvenience to people when using. Summary of the invention

[0005] The purpose of the present invention is to solve the above-mentioned technical problems and to provide a novel probe-type contact aging tray assembly, which can clamp formed circuit boards of different specifications, and quickly engage the female pin header interface in the middle of the lossless release adjustment seat with the male pin header interface in the middle of the base plate, and make contact and energize.

[0006] The present invention is achieved through the following technical solutions: A probe-type contact aging tray assembly comprises a layer plate, a bottom plate, an aging tray fixture, a lossless release probe assembly, and a formed circuit board. The layer plate is provided with a plurality of aging tray fixtures, a bottom plate is provided at the bottom of one side of the layer plate, the bottom plate is electrically connected to the formed circuit board through a lossless release probe assembly, a male end pin interface in the middle of the bottom plate, the lossless release probe assembly comprises a lossless release bottom plate, a lossless release lower plate, a lossless release pressure plate, a lossless release upper plate, and a lossless release adjustment device. A lossless release bottom plate is provided with a lossless release lower plate, a lossless release upper plate is provided above the lossless release lower plate, and a lossless release lower plate is provided between the lossless release lower plate and the lossless release upper plate. A release pressure plate, a formation circuit board mounting position is provided on the lossless release lower plate, one end of the formation circuit board is embedded in the formation circuit board mounting position on the lossless release lower plate, a lossless release adjustment mounting groove is provided in the middle of the lossless release upper plate, the lossless release adjustment device is installed in the lossless release adjustment mounting groove in the middle of the lossless release upper plate, the lossless release adjustment device applies pressure downward, the lossless release adjustment device drives the lossless release upper plate, the lossless release upper plate applies pressure downward on the lossless release pressure plate, the lossless release pressure plate seamlessly butts one end of the formation circuit board into the formation circuit board mounting position on the lossless release lower plate, and is fixed on the lossless release lower plate.

[0007] As a further step, the lossless release adjustment device includes a lossless release manual adjustment elbow clamp, a lossless release adjustment seat, a lossless release adjustment screw, a lossless release adjustment spring, and a lossless release female end pin interface. The lossless release manual adjustment elbow clamp is installed on the lossless release upper plate, a lossless release manual adjustment elbow clamp is provided with a lossless adjustment seat installation groove on one side, and a limit block is provided on the inner side wall of the lossless release seat installation groove. The lossless release adjustment seat is embedded in the lossless adjustment seat installation groove at the front end of the lossless release manual adjustment elbow clamp and is fixed to the lossless release manual adjustment elbow clamp by the limit block. A female end pin header interface mounting position is provided in the middle of the seat, and the lossless release female end pin header interface is embedded in the female end pin header interface mounting position in the middle of the lossless release adjustment seat, screw through holes are provided on both sides of the lossless release adjustment seat, and a lossless release adjustment spring is sleeved on the lossless release adjustment screw, and the lossless release adjustment screw passes through the screw through hole on the lossless release adjustment seat to lock the lossless release adjustment seat on the lossless release upper plate, and a round hole is provided at the front end of the lossless release manual adjustment toggle clamp, and the lossless release female end pin header interface in the middle of the lossless release adjustment seat and the male end pin header interface in the middle of the bottom plate are buckled with each other, and the contact is energized.

[0008] Furthermore, a hook is provided on the upper plate of the lossless release, and the hook passes through the round hole at the front end of the manual adjustment elbow clamp of the lossless release to seamlessly butt-joint the edge of the formed circuit board on the upper plate of the lossless release.

[0009] As a further feature, the lossless release manually adjustable toggle clamp is in a Z-shape.

[0010] As a further feature, the lossless release adjustment seat is U-shaped.

[0011] As a further feature, a wiring socket is provided at one end of the formation circuit board.

[0012] The beneficial effects of the present invention are: (1) It has a simple structure, is easy to use, has an ingenious design, can be quickly positioned, occupies a small space, and has a low cost. It can clamp circuit boards of different specifications, and quickly engage the female pin header interface in the middle of the non-destructive release adjustment seat with the male pin header interface in the middle of the circuit board, and the contact is energized; (2) The non-destructive trip probe assembly is also provided with a trip adjustment device. The test formation circuit board is inserted into the formation circuit board mounting position on the trip lower plate, and then the trip adjustment device is tightened to clamp the formation circuit board tightly between the trip lower plate and the trip upper plate, thereby effectively preventing the formation circuit board from slipping between the trip lower plate and the trip upper plate. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 This is a schematic diagram of the structure of the probe-type contact aging tray assembly of the present invention; Figure 2 This is a schematic diagram of the structure of the probe type contact aging tray assembly of the present invention viewed from above Figure 3 It is a schematic diagram of the structure of the non-destructive release probe assembly of the present invention; Figure 4 It is a schematic diagram of the explosion structure of the non-destructive release probe assembly of the present invention; Figure 5 It is a schematic diagram of the structure of the trip assembly of the present invention; Figure 6 This is a schematic diagram of the explosion structure of the release assembly of the present invention; : 1. Layer; 2. Bottom plate; 21. Male end pin header interface; 3. Aging tray fixture; 4. Non-destructive release probe assembly; 41. Non-destructive release bottom plate; 42. Non-destructive release lower plate; 420. Forming circuit board mounting position; 43. Non-destructive release pressure plate; 44. Non-destructive release upper plate; 440. Hook; 441. Release adjustment mounting groove; 45. Non-destructive release adjustment device; 450. Non-destructive release manual adjustment elbow clamp; 4501. Adjustment seat mounting groove; 4502. Limit block; 4503. Round hole; 451. Non-destructive release adjustment seat; 452. Non-destructive release adjustment screw; 453. Non-destructive release adjustment spring; 454. Non-destructive release female end pin header interface; 5. Forming circuit board; 51. Wiring socket. DETAILED DESCRIPTION

[0014] The present invention will be further described below in conjunction with the accompanying drawings and specific embodiments: Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by technicians in the technical field of this application; the terms used in the specification of the application herein are only for the purpose of describing specific embodiments and are not intended to limit this application; the terms "including" and "having" and any variations thereof in the specification and claims of this application and the above-mentioned drawings are intended to cover non-exclusive inclusions. The terms "first", "second", etc. in the specification and claims of this application or the above-mentioned drawings are used to distinguish different objects, not to describe a specific order.

[0015] Reference to "embodiments" herein means that a particular feature, structure, or characteristic described in conjunction with the embodiments may be included in at least one embodiment of the present application. The appearance of the phrase in various locations in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment that is mutually exclusive with other embodiments. It is explicitly and implicitly understood by those skilled in the art that the embodiments described herein may be combined with other embodiments.

[0016] Refer to Figure 1-Figure 6 As shown, a probe-type contact aging tray assembly comprises a layer plate 1, a bottom plate 2, an aging tray fixture 3, a lossless release probe assembly 4, and a formed circuit board 5. The layer plate 1 is provided with a plurality of aging tray fixtures 3, a bottom plate 2 is provided at the bottom of one side of the layer plate 1, the bottom plate 2 is electrically connected to the formed circuit board 5 through the lossless release probe assembly 4, a male end pin interface 21 in the middle of the bottom plate 2, the lossless release probe assembly 4 comprises a lossless release bottom plate 41, a lossless release lower plate 42, a lossless release pressure plate 43, a lossless release upper plate 44, and a lossless release adjustment device 45. A lossless release bottom plate 41 is provided with a lossless release lower plate 42, a lossless release upper plate 44 is provided above the lossless release lower plate 42, and a lossless release is provided between the lossless release lower plate 42 and the lossless release upper plate 44. The buckling plate 44, the lossless release lower plate 42 is provided with a formation circuit board mounting position 420, one end of the formation circuit board 5 is embedded in the formation circuit board mounting position 420 on the lossless release lower plate 42, and the middle part of the lossless release upper plate 44 is provided with a lossless release adjustment mounting groove 441, the lossless release adjustment device 45 is installed in the lossless release adjustment mounting groove 441 in the middle part of the lossless release upper plate 44, the lossless release adjustment device 45 applies downward pressure, the lossless release adjustment device 45 drives the lossless release upper plate 44, the lossless release upper plate 44 applies downward pressure on the lossless release pressure plate 43, and the lossless release pressure plate 43 seamlessly buckles one end of the formation circuit board 5 in the formation circuit board mounting position 420 on the lossless release lower plate 42, and is fixed on the lossless release lower plate 42.

[0017] Preferably, the lossless release adjustment device 45 includes a lossless release manual adjustment elbow clamp 450, a lossless release adjustment seat 451, a lossless release adjustment screw 452, a lossless release adjustment spring 453, and a lossless release female end pin interface 454. The lossless release manual adjustment elbow clamp 450 is installed on the lossless release upper plate 44, and a lossless release seat mounting groove 4501 is provided on one side of the lossless release manual adjustment elbow clamp 450. A limit block 4502 is provided on the inner side wall of the lossless release seat mounting groove 4501. The lossless release adjustment seat 451 is embedded in the lossless release seat mounting groove 4501 at the front end of the lossless release manual adjustment elbow clamp 450, and is fixed to the lossless release manual adjustment elbow clamp 450 by the limit block 4502. A female end pin header interface mounting position is provided in the middle of the release adjustment seat 451, and the lossless release female end pin header interface 454 is embedded in the female end pin header interface mounting position in the middle of the lossless release adjustment seat 451. Screw through holes are provided on both sides of the lossless release adjustment seat 451. A lossless release adjustment spring 453 is sleeved on the lossless release adjustment screw 452. The lossless release adjustment screw 452 passes through the screw through hole on the lossless release adjustment seat 451 to lock the lossless release adjustment seat 451 on the lossless release upper plate 44. A round hole 4503 is provided at the front end of the lossless release manual adjustment toggle clamp 450. The lossless release female end pin header interface 454 in the middle of the lossless release adjustment seat 451 and the male end pin header interface 21 in the middle of the bottom plate 2 are mutually buckled, and the contact is energized.

[0018] Preferably, a hook 440 is further provided on the lossless release upper plate 44 , and the hook 440 passes through a round hole 4503 at the front end of the lossless release manual adjustment toggle clamp 450 to seamlessly butt-join the edge of the formed circuit board 5 onto the lossless release upper plate 44 .

[0019] Preferably, the non-destructive release manually adjustable toggle clamp 450 is Z-shaped.

[0020] Preferably, the lossless release adjustment seat 451 is U-shaped.

[0021] Preferably, a wiring socket 51 is provided at one end of the formation circuit board 5 .

[0022] To sum up, a probe-type contact aging tray assembly can clamp formed circuit boards of different specifications, and quickly engage the female pin header interface in the middle of the lossless release adjustment seat with the male pin header interface in the middle of the formed circuit board, and contact and energize; the lossless release probe assembly is also provided with a release adjustment device, and the test formed circuit board is inserted into the formed circuit board mounting position on the release lower plate, and then the release adjustment device is tightened to clamp the formed circuit board tightly between the release lower plate and the release upper plate, thereby effectively preventing the formed circuit board from slipping between the release lower plate and the release upper plate.

[0023] According to the disclosure and teaching of the above description, those skilled in the art to which the present invention belongs may also make appropriate changes and modifications to the above embodiments. Therefore, the present invention is not limited to the specific embodiments disclosed and described above, and some modifications and changes to the present invention should also fall within the scope of protection of the claims of the present invention. In addition, although some specific terms are used in this specification, these terms are only for the convenience of description and do not constitute any limitation to the present invention.

Claims

1. A probe type contact aging tray assembly, characterized in that: It includes a layer plate, a bottom plate, an aging tray fixture, a lossless release probe assembly, and a formed circuit board. The layer plate is provided with a plurality of aging tray fixtures. A bottom plate is provided at the bottom of one side of the layer plate. The bottom plate is electrically connected to the formed circuit board through a lossless release probe assembly. The male end pin interface in the middle of the bottom plate, the lossless release probe assembly includes a lossless release bottom plate, a lossless release lower plate, a lossless release pressure plate, a lossless release upper plate, and a lossless release adjustment device. A lossless release bottom plate is provided with a lossless release lower plate, a lossless release upper plate is provided above the lossless release lower plate, a release pressure plate is provided between the lossless release lower plate and the lossless release upper plate, and the A formation circuit board mounting position is provided on the lossless tripping lower plate, one end of the formation circuit board is embedded in the formation circuit board mounting position on the lossless tripping lower plate, a lossless tripping adjustment mounting groove is provided in the middle of the lossless tripping upper plate, the lossless tripping adjustment device is installed in the lossless tripping adjustment mounting groove in the middle of the lossless tripping upper plate, the lossless tripping adjustment device applies pressure downward, the lossless tripping adjustment device drives the lossless tripping upper plate, the lossless tripping upper plate applies pressure downward on the lossless tripping pressure plate, the lossless tripping pressure plate seamlessly butts one end of the formation circuit board into the formation circuit board mounting position on the lossless tripping lower plate, and is fixed on the lossless tripping lower plate.

2. The probe type contact aging tray assembly according to claim 1, characterized in that: The lossless release adjustment device comprises a lossless release manual adjustment elbow clamp, a lossless release adjustment seat, a lossless release adjustment screw, a lossless release adjustment spring, and a lossless release female end pin interface. The lossless release manual adjustment elbow clamp is mounted on the lossless release upper plate. A lossless release seat mounting groove is provided on one side of the lossless release manual adjustment elbow clamp. A limit block is provided on the inner side wall of the lossless release seat mounting groove. The lossless release adjustment seat is embedded in the lossless release seat mounting groove at the front end of the lossless release manual adjustment elbow clamp and is fixed to the lossless release manual adjustment elbow clamp by the limit block. The lossless release adjustment seat is provided in the middle. The female end pin header interface installation position, the lossless release female end pin header interface is embedded in the female end pin header interface installation position in the middle of the lossless release adjustment seat, screw through holes are provided on both sides of the lossless release adjustment seat, a lossless release adjustment spring is sleeved on the lossless release adjustment screw, the lossless release adjustment screw passes through the screw through hole on the lossless release adjustment seat, and the lossless release adjustment seat is locked on the lossless release upper plate, a round hole is provided at the front end of the lossless release manual adjustment toggle clamp, the lossless release female end pin header interface in the middle of the lossless release adjustment seat and the male end pin header interface in the middle of the bottom plate are buckled with each other, and the contact is energized.

3. The probe type contact aging tray assembly according to claim 1, characterized in that: The non-destructive release upper plate is also provided with a hook, which passes through the round hole at the front end of the non-destructive release manual adjustment toggle clamp to seamlessly butt-joint the edge of the formed circuit board on the non-destructive release upper plate.

4. The probe type contact aging tray assembly according to claim 2, characterized in that: The non-destructive release manually adjustable toggle clamp is in a Z-shape.

5. The probe type contact aging tray assembly according to claim 2, characterized in that: The lossless release adjustment seat is U-shaped.

6. The probe type contact aging tray assembly according to claim 1, characterized in that: One end of the formation circuit board is provided with a wiring socket.

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