Key assembly and electronic equipment

Abstract

The invention discloses a key assembly and electronic equipment. The key assembly comprises a carrier which is provided with an accommodating groove; the key comprises a key cap and a connecting piece, at least one part of the key cap is located in the containing groove, the connecting piece is located on the side, facing the groove bottom of the containing groove, of the key cap, the connecting piece is connected with the middle of the key cap and the carrier, and a first working area and a second working area are defined by the key cap, the connecting piece and the groove wall of the containing groove; at least one sensing group is arranged in the first working area, at least one sensing group is arranged in the second working area, each sensing group comprises a sensing structure, and the sensing structures are connected with the keycaps; and the supporting piece is supported between the sensing structure and the groove bottom of the accommodating groove or supported between the keycap and the groove bottom of the accommodating groove.

Description

Technical Field

[0001] The present application belongs to the technical field of electronic devices, and specifically relates to a key assembly and an electronic device. Background Art

[0002] In the related art, an electronic device includes a pressure-sensitive button, and the pressure-sensitive button includes two sensor groups and two metal frames. The two metal frames are arranged at intervals, and the two metal frames are located between the two sensor groups. The sensor group has a brittle fracture characteristic, the supporting strength of the portion of the sensor group located between the two metal frames is low, and the connection between the sensor group and the metal frame is a stress concentration area. When the pressure-sensitive button is triggered, an external force directly acts on the sensor group. As the electronic device is used for a longer time, the portion of the sensor group located between the two metal frames is prone to cracks, which will cause the pressure-sensitive button to fail, thus greatly reducing the service life of the pressure-sensitive button and reducing the performance of the electronic device. Summary of the invention

[0003] The present application aims to provide a key assembly and an electronic device, which solves one of the problems in the related art that pressure-sensitive keys are prone to failure and have a short service life.

[0004] In order to solve the above technical problems, this application is implemented as follows:

[0005] In the first aspect, an embodiment of the present application proposes a key assembly, comprising: a carrier, the carrier is provided with a receiving groove; a key, the key comprising a keycap and a connecting member, at least a portion of the keycap is located in the receiving groove, the connecting member is located on the side of the keycap facing the bottom of the receiving groove, and the connecting member connects the middle part of the keycap and the carrier, the keycap, the connecting member and the groove wall of the receiving groove enclose a first working area and a second working area; multiple sensor groups, at least one sensor group is provided in the first working area, and at least one sensor group is provided in the second working area, the sensor group comprising: a sensor structure, the sensor structure is connected to the keycap; a supporting member, the supporting member is supported between the sensor structure and the bottom of the receiving groove, or between the keycap and the bottom of the receiving groove.

[0006] In a second aspect, an embodiment of the present application provides an electronic device, including: a key assembly as in the first aspect.

[0007] In an embodiment of the present application, the key assembly includes a carrier, a key, and a plurality of sensor groups. Any of the plurality of sensor groups includes a sensor structure and a support member.

[0008] The key comprises a key cap and a connecting piece, at least a part of the key cap is located in the receiving groove, the connecting piece is located on the side of the key cap facing the groove bottom of the receiving groove, the connecting piece is connected to the middle part of the key cap, and the connecting piece is also connected to the carrier. The part of the carrier located on the peripheral side of the connecting piece is suspended.

[0009] The support member is supported between the sensing structure and the bottom of the receiving groove, or the support member is supported between the key cap and the bottom of the receiving groove. It can be understood that the connecting member cooperates with the support member to play a role in supporting the key cap together, and the connecting member cooperates with the support member to jointly define the matching size of the key cap and the carrier.

[0010] It is understandable that when the support member is supported between the sensing structure and the bottom of the accommodating groove, external force acts on the key assembly, and the portion of the key cap that is arranged opposite to the support member will be deformed.

[0011] It is understandable that when the support member is supported between the keycap and the bottom of the accommodating groove, and the support member is close to the connecting member, an external force acts on the key assembly, and the portion of the keycap located outside the support member will be deformed.

[0012] It is understandable that when the support member is supported between the keycap and the bottom of the accommodating groove, and the support member is located at the peripheral wall of the keycap, external force acts on the key assembly, and the portion of the keycap located between the support member and the connecting member will be deformed.

[0013] When external force acts on the key assembly, the sensor group is triggered. Specifically, the external force acts on the key, the key cap deforms and drives the sensor structure to deform (e.g., twist), and the detection data of the sensor structure is correlated with the pressure received, so as to determine the pressing force received by the key, and use this as the data basis for triggering the corresponding preset function.

[0014] By reasonably setting the matching structure of the carrier, button, sensor group and support, when external force acts on the button, the keycap and the sensor structure are more likely to deform, and the keycap and the sensor structure can undergo a larger deformation. This is beneficial to increasing the signal amount of the sensor group, and is beneficial to improving the sensitivity and accuracy of the sensor group in detecting pressure, so that the corresponding preset function of the electronic device can be accurately and quickly triggered, which is beneficial to improving the product's performance and market competitiveness.

[0015] In addition, the keycap, the connector and the wall of the receiving groove enclose a first working area and a second working area, and at least one sensor group is provided in the first working area, and at least one sensor group is provided in the second working area. That is, the sensor structure is located on the side of the keycap facing the bottom of the receiving groove. In other words, the keycap has the function of protecting the sensor structure. The sensor structure will not be suspended, and external force will not directly act on the sensor structure. In this way, the support strength of the sensor structure can be improved, and the sensor structure is not easy to be damaged or failed, which is conducive to extending the service life of the key assembly and improving the safety and reliability of the use of electronic equipment.

[0016] In addition, at least one sensor group is provided in the first working area, and at least one sensor group is provided in the second working area, that is, at least one sensor group is provided in each working area. In this way, no matter from which position the key assembly is touched, the key cap and the sensor structure can be effectively deformed, and the key assembly can be effectively triggered, which is conducive to improving the sensitivity and accuracy of the key assembly.

[0017] Additional aspects and advantages of the present application will be given in part in the description below, and in part will become apparent from the description below, or will be learned through the practice of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] The above and / or additional aspects and advantages of the present application will become apparent and easily understood from the description of the embodiments in conjunction with the following drawings, in which:

[0019] Figure 1 is a partial structural schematic diagram of the key assembly of the first embodiment of the present application in the first state;

[0020] Figure 2 is a partial structural schematic diagram of the key assembly of the first embodiment of the present application in the second state;

[0021] Figure 3 is a partial structural schematic diagram of the key assembly of the first embodiment of the present application in the third state;

[0022] Figure 4 is a partial structural schematic diagram of the key assembly of the first embodiment of the present application in the fourth state;

[0023] Figure 5 is a schematic structural diagram of a sensing structure of an embodiment of the present application;

[0024] Figure 6 is a partial structural schematic diagram of a key assembly of a second embodiment of the present application in a first state;

[0025] Figure 7 is a partial structural schematic diagram of a key assembly of a second embodiment of the present application in a second state;

[0026] Figure 8 is a partial structural schematic diagram of a key assembly of a third embodiment of the present application in a first state;

[0027] Fig. 9 is a partial structural schematic diagram of a key assembly of a third embodiment of the present application in a second state;

[0028] Fig.10 is a partial structural schematic diagram of a key assembly of the fourth embodiment of the present application;

[0029] Fig.11 is a partial structural schematic diagram of a key assembly according to a fifth embodiment of the present application;

[0030] Fig.12 is a partial structural schematic diagram of a key assembly of a sixth embodiment of the present application in a first state;

[0031] Fig.13 is a partial structural schematic diagram of a key assembly of a sixth embodiment of the present application in a second state;

[0032] Fig.14 is a partial structural schematic diagram of a key assembly of a seventh embodiment of the present application in a first state;

[0033] Fig.15 is a partial structural schematic diagram of the key assembly of the seventh embodiment of the present application in the second state;

[0034] Fig.16 is a partial structural schematic diagram of a key assembly according to an eighth embodiment of the present application;

[0035] Fig.17 is a structural schematic diagram of the first part of a key cap and a sensor structure of an embodiment of the present application;

[0036] Fig.18 is a structural schematic diagram of the second part of the key cap and the sensor structure of an embodiment of the present application;

[0037] Fig.19 is a structural schematic diagram of the third part of the key cap and the sensor structure of one embodiment of the present application;

[0038] Fig. 20 is a schematic structural diagram of an electronic device according to a first embodiment of the present application;

[0039] Fig.21 is a schematic structural diagram of an electronic device according to a second embodiment of the present application;

[0040] Fig. 22 is a partial structural schematic diagram of a sensing structure of an embodiment of the present application;

[0041] Fig.23 It is a schematic structural diagram of a sensing structure of an embodiment of the present application under a stress state.

[0042] Reference numerals:

[0043] Figures 1 to 23 The corresponding relationship between the reference numerals and component names in the figure is:

[0044] 10 key assembly, 100 carrier, 110 receiving groove, 112 groove bottom of receiving groove, 114 notch of receiving groove, 116 second installation cavity, 200 key, 210 keycap, 212 middle part of keycap, 214 outer peripheral wall of keycap, 220 connecting piece, 222 connecting section, 224 limiting section, 310 first working area, 320 second working area, 330 first installation cavity, 400 sensing group, 410 sensing structure, 412 conductive piece, 4122 pad, 4124 conductive part, 414 pressure sensing part, 416 insulating protective layer, 420 supporting piece, 430 first flexible circuit board, 440 elastic frame, 450 switch, 460 gold finger, 470 wire, 482 first resistor, 484 second resistor, 490 conductive piece, 500 second flexible circuit board, 60 electronic device, 600 frame, 700 power button, 800 volume button. DETAILED DESCRIPTION

[0045] The embodiments of the present application will be described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present application, and should not be construed as limitations on the present application. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in the field without making creative work are within the scope of protection of the present application.

[0046] The term "first" or "second" in the specification and claims of this application may include one or more of the features explicitly or implicitly. In the description of this application, unless otherwise specified, "plurality" means two or more. In addition, "and / or" in the specification and claims means at least one of the connected objects, and the character " / " generally means that the objects connected before and after are in an "or" relationship.

[0047] In the description of the present application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0048] In the description of this application, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0049] The following is combined with Figures 1 to 23 The key assembly 10 and the electronic device 60 provided in the embodiment of the present application are described.

[0050] like Figure 1 , Figure 2 , Figure 3 , Figure 4 , Figure 6 , Figure 7 , Figure 8 , Fig. 9 , Fig.10 , Fig.11 , Fig.12 , Fig.13 , Fig.14 , Fig.15 and Fig.16 As shown, according to some embodiments of the present application, the key assembly 10 includes: a carrier 100, the carrier 100 is provided with a receiving groove 110; a key 200, the key 200 includes a key cap 210 and a connecting member 220, at least a portion of the key cap 210 is located in the receiving groove 110, the connecting member 220 is located on a side of the key cap 210 facing the groove bottom 112 of the receiving groove, and the connecting member 220 connects the middle part 212 of the key cap and the carrier 100, and the key cap 210, the connecting member 220 and the groove wall of the receiving groove 110 are connected. A first working area 310 and a second working area 320 are enclosed; a plurality of sensor groups 400, at least one sensor group 400 is provided in the first working area 310, and at least one sensor group 400 is provided in the second working area 320, and the sensor group 400 includes: a sensor structure 410, the sensor structure 410 is connected to the keycap 210; a support member 420, the support member 420 is supported between the sensor structure 410 and the bottom 112 of the receiving groove, or supported between the keycap 210 and the bottom 112 of the receiving groove.

[0051] In the embodiment of the present application, the key assembly 10 includes a carrier 100 , a key 200 , and a plurality of sensor groups 400 . Any sensor group 400 among the plurality of sensor groups 400 includes a sensor structure 410 and a support member 420 .

[0052] The key 200 includes a key cap 210 and a connecting member 220. At least a portion of the key cap 210 is located in the receiving groove 110. The connecting member 220 is located on the side of the key cap 210 facing the groove bottom 112 of the receiving groove. The connecting member 220 is connected to the middle portion 212 of the key cap. The connecting member 220 is also connected to the carrier 100. The portion of the carrier 100 located around the connecting member 220 is suspended.

[0053] The support member 420 is supported between the sensing structure 410 and the groove bottom 112 of the receiving groove, or the support member 420 is supported between the keycap 210 and the groove bottom 112 of the receiving groove. It can be understood that the connecting member 220 cooperates with the support member 420 to play a role in supporting the keycap 210 together, and the connecting member 220 cooperates with the support member 420 to jointly define the matching size of the keycap 210 and the carrier 100.

[0054] It is understandable that when the support member 420 is supported between the sensing structure 410 and the groove bottom 112 of the accommodating groove, an external force acts on the key assembly 10, and the portion of the key cap 210 disposed opposite to the support member 420 will be deformed.

[0055] It is understandable that when the support member 420 is supported between the keycap 210 and the bottom 112 of the accommodating groove, and the support member 420 is close to the connecting member 220, external force acts on the key assembly 10, and the portion of the keycap 210 located outside the support member 420 will be deformed.

[0056] It is understandable that when the support member 420 is supported between the keycap 210 and the bottom 112 of the accommodating groove, and the support member 420 is located at the outer peripheral wall 214 of the keycap, external force acts on the key assembly 10, and the portion of the keycap 210 located between the support member 420 and the connecting member 220 will deform.

[0057] When an external force acts on the key assembly 10, the sensor group 400 is triggered. Specifically, the external force acts on the key 200, the key cap 210 is deformed and drives the sensor structure 410 to deform (e.g., twist), and the detection data of the sensor structure 410 is correlated with the pressure received, so as to determine the pressing force received by the key 200, and use this as the data basis for triggering the corresponding preset function.

[0058] By reasonably setting the matching structure of the carrier 100, the button 200, the sensor group 400 and the support 420, when an external force acts on the button 200, the keycap 210 and the sensor structure 410 are more likely to deform, and the keycap 210 and the sensor structure 410 can undergo a larger deformation, which is beneficial to increasing the signal amount of the sensor group 400, and is beneficial to improving the sensitivity and accuracy of the sensor group 400 in detecting pressure, so that the corresponding preset function of the electronic device 60 can be accurately and quickly triggered, which is beneficial to improving the product's performance and market competitiveness.

[0059] In addition, the keycap 210, the connector 220 and the groove wall of the receiving groove 110 enclose a first working area 310 and a second working area 320, and at least one sensor group 400 is provided in the first working area 310, and at least one sensor group 400 is provided in the second working area 320. That is, the sensor structure 410 is located on the side of the keycap 210 facing the groove bottom 112 of the receiving groove. In other words, the keycap 210 has the function of protecting the sensor structure 410. The sensor structure 410 will not be suspended, and the external force will not directly act on the sensor structure 410. In this way, the support strength of the sensor structure 410 can be improved, and the sensor structure 410 is not easy to be damaged or failed, which is conducive to extending the service life of the key assembly 10 and improving the safety and reliability of the use of the electronic device 60.

[0060] In addition, at least one sensor group 400 is provided in the first working area 310, and at least one sensor group 400 is provided in the second working area 320, that is, at least one sensor group 400 is provided in each working area. In this way, no matter from which position the key assembly 10 is touched, the key cap 210 and the sensor structure 410 can be effectively deformed, and the key assembly 10 can be effectively triggered, which is conducive to improving the sensitivity and accuracy of the key assembly 10.

[0061] in, Figure 2 , Figure 3 , Figure 7 , Fig. 9 , Fig.13 and Fig.15 It is a schematic diagram of a single-sided pressing key assembly 10, and the arrow indicates the direction of the external force. Figure 4 It is a schematic diagram of the sliding button assembly 10, and the arrow indicates the direction of the external force.

[0062] In some embodiments, Figure 1 , Figure 2 , Figure 3 , Figure 4 , Figure 6 , Figure 7 , Figure 8 and Fig. 9 As shown, the sensor group 400 further includes an elastic frame 440 , and the sensor structure 410 is connected to the key cap 210 via the elastic frame 440 .

[0063] In this embodiment, the sensing group 400 further includes an elastic frame 440 .

[0064] The sensing structure 410 is connected to the key cap 210 via an elastic frame 440. The elastic frame 440 serves as a mounting carrier 100 of the sensing structure 410 and has the function of mounting and fixing the sensing structure 410.

[0065] In addition, the elastic frame 440 is elastic, and the elastic frame 440 can be deformed under the action of external force, and the elastic frame 440 can also restore the deformation when the external force is removed. Specifically, when an external force acts on the key assembly 10, the sensor group 400 is triggered. Specifically, the external force acts on the key 200, the keycap 210 deforms and drives the elastic frame 440 to deform (e.g., twist), and the deformation of the elastic frame 440 drives the sensor structure 410 to deform (e.g., twist), and the detection data of the sensor structure 410 is correlated with the pressure received, so as to determine the pressing force received by the key 200, and use this as the data basis for triggering the corresponding preset function.

[0066] In some embodiments, Figure 1 , Figure 2 , Figure 3 and Figure 4 As shown, when the support member 420 is used to support the sensing structure 410 , the elastic frame 440 is connected to the side of the keycap 210 facing the bottom 112 of the accommodating groove, and the elastic frame 440 and the keycap 210 enclose a first installation cavity 330 , and the sensing structure 410 is located in the first installation cavity 330 .

[0067] In this embodiment, the matching structure of the elastic frame 440 , the key cap 210 and the sensing structure 410 is further defined.

[0068] The elastic frame 440 is connected to the side of the keycap 210 facing the groove bottom 112 of the receiving groove, that is, a part of the carrier 100 is recessed, and the elastic frame 440 is connected to the opening of the recess. The elastic frame 440 and the keycap 210 enclose the first installation cavity 330. The first installation cavity 330 has the function of installing and fixing the sensor structure 410. The matching size of the keycap 210, the sensor structure 410 and the elastic frame 440 can be reduced in the direction from the keycap 210 to the elastic frame 440.

[0069] This arrangement can reduce the overall dimensions of the key assembly 10 along the direction from the key cap 210 to the elastic frame 440 , which is beneficial to reducing the internal space occupancy rate of the electronic device 60 and facilitating the layout of other components of the electronic device 60 .

[0070] In addition, the first installation cavity 330 can also block water vapor and dirt in the environment, preventing water vapor, dirt, etc. from entering the sensor structure 410, and providing structural support to ensure the performance and service life of the sensor structure 410.

[0071] In addition, this arrangement can increase the deformation of the key cap 210 and the sensor structure 410 when the key assembly 10 is subjected to force, which is beneficial to improving the trigger sensitivity of the key assembly 10.

[0072] In some embodiments, Figure 6 , Figure 7 , Figure 8 and Fig. 9 As shown, when the support member 420 is used to support the keycap 210 , the elastic frame 440 is connected between the sensing structure 410 and the keycap 210 .

[0073] In this embodiment, the matching structure of the elastic frame 440 , the key cap 210 and the sensing structure 410 is further defined.

[0074] The elastic frame 440 is connected between the sensing structure 410 and the keycap 210. That is, along the direction from the keycap 210 to the connecting member 220, the elastic frame 440 is located between the sensing structure 410 and the keycap 210. When an external force acts on the key 200, the keycap 210 deforms and drives the elastic frame 440 to deform (e.g., twist), and the deformation of the elastic frame 440 drives the sensing structure 410 to deform (e.g., twist).

[0075] In some embodiments, Figure 8 , Fig. 9 , Fig.11 , Fig.14 and Fig.15 As shown, when the support member 420 is used to support the key cap 210 , the support member 420 is located between the sensing structure 410 and the connecting member 220 .

[0076] In this embodiment, the positional relationship among the support member 420 , the sensing structure 410 and the connecting member 220 is further defined.

[0077] The support member 420 is located between the sensor structure 410 and the connecting member 220. The connecting member 220 and the support member 420 cooperate with each other to increase the effective supporting area of ​​the key cap 210 and ensure the effective matching size of the key cap 210 and the carrier 100.

[0078] It is understandable that, along the direction from the connecting member 220 to the supporting member 420, the portion of the keycap 210 located outside the supporting member 420 is suspended, and the suspended portion of the keycap 210 is relatively large. When an external force acts on the suspended portion of the keycap 210, the keycap 210 is prone to tilt, that is, the tilting angle of the keycap 210 is relatively large, and the sensing structure 410 will also tilt accordingly, which is conducive to increasing the signal amount of the sensing group 400, and is conducive to improving the sensitivity and accuracy of the sensing group 400 in detecting pressure, so that the corresponding preset function of the electronic device 60 can be accurately and quickly triggered, which is conducive to improving the product's performance and market competitiveness.

[0079] In some embodiments, the support member 420 is closer to the connector 220 than the sensing structure 410 .

[0080] In this embodiment, the positional relationship among the support member 420 , the sensing structure 410 and the connecting member 220 is further defined.

[0081] The support member 420 is closer to the connector 220 than the sensing structure 410. That is, along the direction from the support member 420 to the connector 220, the distance between the end surfaces of the support member 420 and the connector 220 facing each other is smaller than the distance between the end surfaces of the support member 420 and the sensing structure 410 facing each other.

[0082] This arrangement not only ensures the supporting area of ​​the keycap 210 by the connecting member 220 and the supporting member 420 , but also further increases the volume of the suspended portion of the keycap 210 , making it easier for the keycap 210 to tilt up, which is beneficial to improving the sensitivity and accuracy of the pressure detection by the sensor group 400 .

[0083] In some embodiments, Figure 6 , Figure 7 , Fig.10 , Fig.12 , Fig.13 and Fig.16 As shown, when the supporting member 420 is used to support the key cap 210 , the sensing structure 410 is located between the connecting member 220 and the supporting member 420 .

[0084] In this embodiment, the positional relationship among the support member 420 , the sensing structure 410 and the connecting member 220 is further defined.

[0085] The sensing structure 410 is located between the connecting member 220 and the supporting member 420. The connecting member 220 and the supporting member 420 cooperate with each other to increase the effective supporting area of ​​the key cap 210 and ensure the effective matching size of the key cap 210 and the carrier 100.

[0086] It is understandable that the sensing structure 410 is located between the connecting member 220 and the supporting member 420, so the portion of the keycap 210 located between the connecting member 220 and the supporting member 420 is suspended, and the portion of the keycap 210 suspended is relatively large. When an external force acts on the suspended portion of the keycap 210, the keycap 210 is easily deformed, that is, the deformation amount of the keycap 210 is relatively large, and the sensing structure 410 will also deform accordingly, which is conducive to increasing the signal amount of the sensing group 400, and is conducive to improving the sensitivity and accuracy of the sensing group 400 in detecting pressure, so that the corresponding preset function of the electronic device 60 can be accurately and quickly triggered, which is conducive to improving the product's performance and market competitiveness.

[0087] In some embodiments, Figure 6 , Figure 7 , Fig.10 , Fig.12 , Fig.13 and Fig.16 As shown, the support member 420 abuts against the peripheral wall 214 of the keycap.

[0088] In this embodiment, the positional relationship between the support member 420 and the key cap 210 is further defined.

[0089] The support member 420 abuts against the outer peripheral wall 214 of the key cap.

[0090] This arrangement not only ensures the supporting area of ​​the keycap 210 by the connecting member 220 and the supporting member 420 , but also further increases the volume of the suspended portion of the keycap 210 , making the keycap 210 more easily deformable, which is beneficial to improving the sensitivity and accuracy of the pressure detection by the sensor group 400 .

[0091] In some embodiments, Figure 5 As shown, the sensing structure 410 includes: a plurality of conductive members 412, the plurality of conductive members 412 are arranged at intervals, each conductive member 412 includes a pad 4122 and a conductive portion 4124, the conductive portion 4124 is stacked on one side of the pad 4122; at least one pressure sensing portion 414, a pressure sensing portion 414 is connected between two adjacent conductive members 412; and an insulating protective layer 416, the insulating protective layer 416 covers the plurality of conductive members 412 and at least one pressure sensing portion 414.

[0092] In this embodiment, the composition of the sensing structure 410 is further defined.

[0093] The sensing structure 410 includes a plurality of conductive elements 412 , at least one pressure sensing portion 414 , and an insulating protection layer 416 .

[0094] A plurality of conductive members 412 are arranged at intervals. Each conductive member 412 includes a pad 4122 and a conductive portion 4124 . The conductive portion 4124 is stacked on one side of the pad 4122 . The pad 4122 is electrically connected to the conductive portion 4124 .

[0095] A pressure sensing portion 414 is connected between two adjacent conductive members 412 . The insulating protection layer 416 covers the plurality of conductive members 412 and at least one pressure sensing portion 414 .

[0096] The insulating protection layer 416 has the function of protecting the multiple conductive parts 412 and at least one pressure sensing part 414 , and also has the function of insulation, and can meet the safety requirements for the use of the key assembly 10 .

[0097] Optionally, the conductive portion 4124 includes a conductive paste.

[0098] In some embodiments, Figure 1 , Figure 2 , Figure 3 , Figure 4 , Figure 5 , Figure 6 , Figure 7 , Figure 8 and Fig. 9As shown, the sensing structure 410 further includes a first flexible circuit board 430 , a plurality of conductive members 412 , at least one pressure sensing portion 414 and an insulating protection layer 416 are connected to the same side of the first flexible circuit board 430 , and the first flexible circuit board 430 is connected to the key cap 210 .

[0099] In this embodiment, the sensing structure 410 further includes a first flexible circuit board 430 . A plurality of conductive elements 412 , at least one pressure sensing portion 414 and an insulating protection layer 416 are connected to the same side of the first flexible circuit board 430 , and the first flexible circuit board 430 is connected to the key cap 210 .

[0100] When the sensing group 400 includes an elastic frame, the first flexible circuit board 430 is connected to the keycap 210 through the elastic frame 440. That is, any one of the plurality of conductive members 412, the pressure sensing portion 414 and the insulating protection layer 416 is located on a side of the first flexible circuit board 430 away from the elastic frame 440, and the elastic frame 440 is connected to the keycap 210.

[0101] The elastic frame 440 serves as an installation carrier 100 for the first flexible circuit board 430, multiple conductive members 412, at least one pressure sensing portion 414 and the insulating protective layer 416, and has the function of installing and fixing the first flexible circuit board 430, multiple conductive members 412, at least one pressure sensing portion 414 and the insulating protective layer 416.

[0102] In some embodiments, Fig.10 and Fig.11 As shown, the pad 4122 is connected to the key cap 210 .

[0103] In this embodiment, the matching structure between the sensing structure 410 and the key cap 210 is further defined.

[0104] The sensing structure 410 includes a plurality of conductive members 412, at least one pressure sensing portion 414, and an insulating protective layer 416. Each conductive member 412 includes a pad 4122 and a conductive portion 4124, and the pad 4122 of the conductive member 412 is connected to the key cap 210. This arrangement can reduce the external dimensions of the key assembly 10 along the direction from the key cap 210 to the connecting member 220, which is conducive to saving the installation space of the key assembly 10.

[0105] In some embodiments, Fig.16 As shown, the sensor group 400 further includes a switch 450 , which is disposed on a side of the support member 420 facing the key cap 210 .

[0106] In this embodiment, the structure of the sensor group 400 is further defined. The sensor group 400 also includes a switch 450, which is disposed on the side of the support member 420 facing the key cap 210. That is, the support member 420 serves as a mounting carrier 100 of the switch 450, and has the function of mounting and fixing the switch 450. This configuration enables the key assembly 10 to have a local vibration feedback function, enriches the use functions of the key assembly 10, and can improve the use performance of the key assembly 10.

[0107] Optionally, the switch 450 includes any one of the following or a combination thereof: piezoelectric ceramics, a linear motor, an electromagnetic motor, and a spring.

[0108] In some embodiments, the carrier 100 is further provided with a second installation cavity 116, and the second installation cavity 116 is arranged at intervals on one side of the accommodating groove 110 along the direction from the groove opening 114 to the groove bottom of the accommodating groove; the connecting member 220 includes a connecting section 222 and a limiting section 224, and the limiting section 224 is located in the second installation cavity 116, one end of the connecting section 222 is connected to the keycap 210, and the other end of the connecting section 222 extends into the second installation cavity 116 and is connected to the limiting section 224.

[0109] In this embodiment, the matching structure of the carrier 100 and the button 200 is further defined.

[0110] The carrier 100 is further provided with a second installation cavity 116 , and along the direction from the notch 114 of the receiving groove to the groove bottom, the second installation cavity 116 is arranged at one side of the receiving groove 110 at intervals.

[0111] The connecting member 220 includes a connecting section 222 and a limiting section 224. The limiting section 224 is located in the second installation cavity 116, one end of the connecting section 222 is connected to the keycap 210, and the other end of the connecting section 222 extends into the second installation cavity 116 and is connected to the limiting section 224. That is, a part of the connecting member 220 is located in the receiving groove 110, and the other part of the connecting member 220 extends into the second installation cavity 116.

[0112] The cavity wall of the second installation cavity 116 has the function of limiting the limiting section 224, which is combined with the structure of the accommodating groove 110, the supporting member 420 and the connecting section 222 to ensure the matching size of the keycap 210 and the groove bottom 112 of the accommodating groove along the direction from the keycap 210 to the connecting member 220.

[0113] like Fig. 20 and Fig.21 As shown, an electronic device 60 according to some other embodiments of the present application includes: a key assembly 10 as in any of the above embodiments.

[0114] The electronic device 60 provided in the present application includes the key assembly 10 of any of the above embodiments, and therefore has all the beneficial effects of the above key assembly 10, which will not be described one by one here.

[0115] Optionally, the electronic device 60 can be a mobile terminal such as a mobile phone, a wearable device, a tablet computer, a laptop computer, a mobile computer, an augmented reality device (also known as an AR device), a virtual reality device (also known as a VR device), a handheld game console, etc.

[0116] In some embodiments, Fig. 20 and Fig.21 As shown, the electronic device 60 further includes: a frame 600 , a part of which is configured as a carrier 100 .

[0117] In this embodiment, the structure of the electronic device 60 is further limited, and the electronic device 60 further includes a frame 600 .

[0118] A portion of the frame 600 is configured as a carrier 100 , that is, a portion of the frame 600 forms the carrier 100 . The frame 600 is provided with a receiving groove 110 . The frame 600 also has the function of installing the button 200 and the plurality of sensor groups 400 .

[0119] Optionally, the present application arranges the sensing structure 410 of the sensing group 400 on the key 200, and applies external force on the key 200 to press or slide the key 200, thereby causing the pressure-sensitive part 414 of the sensing structure 410 to deform, resulting in a change in resistance, which is converted into an electrical signal, thereby realizing the corresponding function.

[0120] The present application can increase the signal quantity of the key component 10 while increasing the structural strength of the key component 10 by reasonably setting the structure of the key component 10, and can give the key component 10 the functions of single-click, double-click and side sliding detection through software debugging. For example, single-click to focus. For example, double-click to wake up or take a photo. For example, sliding zoom. For example, pressing hard to take a photo, etc., which are not listed here one by one. This setting enables multiple functions of the electronic device 60 to be realized by triggering the key component 10.

[0121] like Fig. 22 and Fig.23 As shown, when an external force F acts on the key assembly 10, the pressure sensing portion 414 on the first flexible circuit board 430 of the key assembly 10 is deformed. The first flexible circuit board 430 will be stretched or compressed during the bending process, and the resistance R of the pressure sensing portion 414 changes to R'. Due to the Poisson's ratio of the pressure sensing portion 414, the resistance values ​​of R1 (i.e., the first resistor 482) and R2 (i.e., the second resistor 484) change inconsistently. In view of the linear relationship between the deformation and resistance of the pressure sensing portion 414, the pressure difference between the two ends is detected according to the Wheatstone bridge principle to determine whether the pressure sensing portion 414 is deformed by force, and it is converted into an electrical signal to achieve the corresponding function.

[0122] like Figure 1 As shown, the first flexible circuit board 430 of the sensing structure 410 is attached to the elastic frame 440. Optionally, the elastic frame 440 includes a metal frame, a plastic frame, etc., which are not listed here. Then the elastic frame 440 is bonded to the key 200. The connection method between the elastic frame 440 and the key 200 includes but is not limited to bonding, and can also be riveting, screw fastening connection and welding. The part where the keycap 210 and the sensing structure 410 are arranged relative to each other is dug out with a groove, and the elastic frame 440 and the keycap 210 enclose a first installation cavity 330. The sensing structure 410 is located in the first installation cavity 330. This setting can increase the deformation amount of the keycap 210 when the key assembly 10 is subjected to force. The first resistor 482 of the sensing structure 410 is arranged relative to the support member 420. Optionally, the support member 420 and the carrier 100 are two relatively independent structures. Optionally, the support member 420 and the carrier 100 are formed integrally. The key 200 is connected to the mainboard of the electronic device 60 via the BTB (Board to Board, connector) or the gold surface on the first flexible circuit board 430. The key 200 is bent downward by the pressure F pressed downward by the finger, and the key 200 cooperates with the support member 420 to deform the elastic frame 440. The deformation of the elastic frame 440 drives the sensor structure 410 to deform. After the sensor structure 410 is deformed, the change in resistance is converted into an electrical signal to realize the function detection of the key assembly 10.

[0123] Optionally, the peripheral wall 214 of the keycap and the carrier 100 can be fixed by using soft glue or soft double-sided tape, which can prevent the keycap 210 from deforming while being waterproof.

[0124] like Figure 4 As shown, there are two sensor groups 400, and the two sensor groups 400 are respectively recorded as the first sensor group and the second sensor group. The first working area 310 is provided with a first sensor group, and the second working area 320 is provided with a second sensor group. When the pressure F pressed by the finger slides from the first sensor group to the second sensor group when the keycap 210 slides from the first sensor group to the second sensor group, the force on the first sensor group gradually decreases from large (that is, the signal amount changes from strong to weak). At this time, the force on the first sensor group is greater than the force on the second sensor group (that is, the signal amount of the first sensor group is greater than the signal amount of the second sensor group). When the force point slides to the center point of the first sensor group and the second sensor group, the force on the first sensor group is equal to that on the second sensor group (that is, the signal amount of the first sensor group is equal to the signal amount of the second sensor group). When the finger slides past the center point and approaches the second sensor group, the force on the second sensor group is greater than the force on the first sensor group (that is, the signal amount of the second sensor group is greater than the signal amount of the first sensor group).

[0125] The position detection logic is as follows: input the signal CH1 of the first sensor group, the signal CH2 of the second sensor group and the length L of the sliding area; output F (force value) and L1 (force position). Among them, L1 = L × (CH1 / (CH1+CH2)), F = (CH1+CH2) × K, K is the calibration coefficient.

[0126] The size of the signal (CH1+CH2) is almost unaffected by the position of the force F. When the same force is applied to any position of the key 200, the difference of the signal (CH1+CH2) is small, and the sensitivity consistency is good. This logic is used to detect the displacement of the user's hand and realize the sliding function of the electronic device 60.

[0127] Optionally, the shapes of the parts of the keycap 210 located on both sides of the connecting member 220 are the same, and the parts of the keycap 210 located on both sides of the connecting member 220 have the same matching structure as the sensor group 400. This ensures that under the same pressure, the deformation amounts of the parts of the keycap 210 located on both sides of the connecting member 220 and the sensor structure 410 are equal.

[0128] When the button assembly 10 generates a trigger signal, the corresponding deformation amount is less than or equal to 1 mm.

[0129] Optionally, the elastic frame 440 includes a steel sheet, and the thickness of the steel sheet is less than or equal to 2 mm.

[0130] Optionally, multiple conductive members 412 , at least one pressure sensing portion 414 and an insulating protective layer 416 are connected to the same side of the first flexible circuit board 430 , and the overall thickness of the multiple conductive members 412 , at least one pressure sensing portion 414 and the insulating protective layer 416 is less than or equal to 1 mm.

[0131] like Figure 6 and Figure 7As shown, the first flexible circuit board 430 of the sensing structure 410 is attached to the elastic frame 440. Optionally, the elastic frame 440 includes a metal frame, a plastic frame, etc., which are not listed here one by one. The elastic frame 440 is then bonded to the key 200. The connection method between the elastic frame 440 and the key 200 includes but is not limited to bonding, and can also be riveting, screw fastening connection and welding. The support member 420 is supported at the peripheral wall 214 of the keycap. Optionally, the support member 420 and the carrier 100 are two relatively independent structures. Optionally, the support member 420 and the carrier 100 are formed integrally. The key 200 is connected to the mainboard of the electronic device 60 through the BTB (Board to Board, connector) or gold surface on the first flexible circuit board 430. The pressure F pressed downward by the finger drives the button 200 to bend downward, and the button 200 cooperates with the support member 420 to cause the elastic frame 440 to deform. The deformation of the elastic frame 440 drives the sensor structure 410 to deform. After the sensor structure 410 is deformed, the change in resistance is converted into an electrical signal to realize the function detection of the button assembly 10.

[0132] like Figure 8 and Fig. 9 As shown, the support member 420 is located in the middle position, the support member 420 is supported between the key cap 210 and the groove bottom 112 of the accommodating groove, and the support member 420 is arranged close to the connecting member 220 .

[0133] like Fig.10 and Fig.11 As shown, the elastic frame 440 may also be eliminated, and the first flexible circuit board 430 of the sensor structure 410 may be directly attached to the button 200, thereby further saving side space and increasing the stacking space of the entire device.

[0134] like Figures 12 to 16As shown, the first flexible circuit board 430 is eliminated, and the sensing structure 410 is integrated into the key 200, such as making a plastic pressure-sensitive key. The wire 470, the pad 4122 and the gold finger 460 are made on the inner side of the key cap 210 by using the LDS (Laser Direct Structuring) technology, and at least one pressure-sensitive part and the insulating protective layer 416 are printed on the pad 4122. The gold finger 460 is interconnected with the second flexible circuit board 500 by welding, bonding or spring connection, and the second flexible circuit board 500 is connected to the main board of the electronic device 60 through a BTB (Board to Board, connector) or a gold surface. The support member 420 is located at the peripheral wall 214 of the key cap, or the support member 420 is located in the middle position of the key cap 210 (such as, adjacent to the position of the connecting member 220). Optionally, the support member 420 and the carrier 100 are two relatively independent structures. Optionally, the support member 420 and the carrier 100 are formed integrally. The pressure F applied by the finger causes the button 200 to bend downward, and the button 200 cooperates with the support member 420 to deform the button 200 and drive the sensing structure 410 to deform. After the sensing structure 410 is deformed, the change in resistance is converted into an electrical signal to realize function detection of the button assembly 10.

[0135] Optionally, the conductive member 490 connects the gold finger and the second flexible circuit board 500 .

[0136] The principle of LDS is to give ordinary plastic components and circuit boards the functions of electrical interconnection, supporting components, and supporting and protecting plastic shells, as well as shielding, antenna and other functions generated by the combination of mechanical entities and conductive patterns.

[0137] like Fig.17 , Fig.18 and Fig.19 As shown, LDS technology is used to directly make pads 4122, wires 470 and gold fingers 460 on the inner side of the plastic button. The pressure sensing part 414 is printed on the pad 4122 to form pressure sensing resistors R1 and R2, and then covered with insulating ink (i.e., insulating protective layer 416) to achieve the pressure sensing function. The gold fingers 460 are interconnected with the second flexible circuit board 500 by welding, bonding or spring sheet.

[0138] The key assembly 10 of the present application can effectively reduce the failure rate of the key assembly 10 during production, transportation and assembly while ensuring the signal quantity, and the cost of the key assembly 10 is lower. The key assembly 10 has the dual functions of pressure detection and sliding detection. The sliding detection function can realize the functions of sliding to increase or decrease volume, sliding to take pictures, sliding to switch photos, short videos, music switching, etc. through debugging software, and the application scenarios are diversified to improve the user experience.

[0139] For example, if Fig. 20 As shown, the key assembly 10 is placed at the position of the volume key in the related art and replaces the function of the volume key. At the same time, the key assembly 10 can also realize the sliding function. Different switching functions are realized in different scenarios through software debugging. For example, you can slide to take pictures or continuous shots in the photo interface. For example, you can slide to increase or decrease the volume in the lock screen interface. At the same time, the key assembly 10 is set on the right side of the electronic device 60, which is convenient for users to hold and slide, and improve the user experience.

[0140] For example, if Fig.21 As shown, the key assembly 10 is arranged separately on the right side of the electronic device 60, and the key assembly 10 does not replace the volume key 800 and the power key 700 of the electronic device 60. Through software debugging, the key assembly 10 has multiple scenes and multiple functions such as single-click pressing, double-click pressing and sliding. For example, in the photo application, single-click focusing, double-clicking to wake up, double-clicking to take pictures, sliding zoom, pressing hard to take pictures, etc. For example, in software applications such as short videos or music, sliding switching, double-clicking to like, etc. For example, in the album application, sliding switching, etc.

[0141] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "illustrative embodiments", "examples", "specific examples", or "some examples" means that the specific features, structures, materials, or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present application. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described may be combined in any one or more embodiments or examples in a suitable manner.

[0142] Although the embodiments of the present application have been shown and described, those skilled in the art will appreciate that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present application, and that the scope of the present application is defined by the claims and their equivalents.

Claims

1. A button assembly, characterized in that: include: A carrier, wherein the carrier is provided with a receiving groove; A key, the key comprising a keycap and a connecting member, at least a portion of the keycap is located in the receiving groove, the connecting member is located on a side of the keycap facing the groove bottom of the receiving groove, and the connecting member connects the middle portion of the keycap and the carrier, and the keycap, the connecting member and the groove wall of the receiving groove enclose a first working area and a second working area; A plurality of sensor groups, at least one of the sensor groups is disposed in the first working area, at least one of the sensor groups is disposed in the second working area, and the sensor groups include: A sensing structure connected to the key cap; A support member is supported between the sensing structure and the bottom of the receiving groove, or between the key cap and the bottom of the receiving groove.

2. The key assembly according to claim 1, characterized in that: The sensor group further includes an elastic frame, and the sensor structure is connected to the key cap via the elastic frame.

3. The key assembly according to claim 2, characterized in that: When the support member is used to support the sensing structure, the elastic frame is connected to a side of the keycap facing the bottom of the accommodating groove, and the elastic frame and the keycap enclose a first installation cavity, and the sensing structure is located in the first installation cavity.

4. The key assembly according to claim 2, characterized in that: When the supporting member is used to support the key cap, the elastic frame is connected between the sensing structure and the key cap.

5. The key assembly according to claim 1, characterized in that: When the supporting member is used to support the key cap, the supporting member is located between the sensing structure and the connecting member.

6. The key assembly according to claim 5, characterized in that: The supporting member is closer to the connecting member than the sensing structure.

7. The key assembly according to claim 1, characterized in that: When the supporting member is used to support the key cap, the sensing structure is located between the connecting member and the supporting member.

8. The key assembly according to claim 7, characterized in that: The supporting member abuts against the outer peripheral wall of the key cap.

9. The key assembly according to any one of claims 1 to 8, characterized in that: The sensing structure comprises: A plurality of conductive members, the plurality of conductive members are arranged at intervals, each of the conductive members comprises a pad and a conductive portion, and the conductive portion is stacked on one side of the pad; At least one pressure-sensing portion, one of the pressure-sensing portions being connected between two adjacent conductive members; An insulating protective layer covers the plurality of the conductive members and at least one of the pressure sensing parts.

10. The key assembly according to claim 9, characterized in that: The sensing structure further includes a first flexible circuit board, the plurality of conductive members, at least one of the pressure sensing parts and the insulating protection layer are connected to the same side of the first flexible circuit board, and the first flexible circuit board is connected to the key cap.

11. The key assembly according to claim 9, characterized in that: The pad is connected to the key cap.

12. The key assembly according to any one of claims 1 to 8, characterized in that: The sensor group also includes: A switch is arranged on a side of the support member facing the key cap.

13. The key assembly according to any one of claims 1 to 8, characterized in that: The carrier is further provided with a second installation cavity, and along the direction from the notch of the receiving groove to the groove bottom, the second installation cavity is arranged at one side of the receiving groove at intervals; The connecting member includes a connecting section and a limiting section, wherein the limiting section is located in the second mounting cavity, one end of the connecting section is connected to the key cap, and the other end of the connecting section extends into the second mounting cavity and is connected to the limiting section.

14. An electronic device, characterized in that: include: Frame; and According to any one of claims 1 to 13, a portion of the frame is configured as the carrier.

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