Wafer offset detection device and detection method

Abstract

The embodiment of the present application provides a detection device and method for wafer offset, wherein the wafer has a positioning groove; the detection device includes: a substrate for supporting the wafer; a positioning mark located on the substrate; a detection unit for emitting a detection signal to a preset range of the substrate to detect whether the positioning groove and the positioning mark are within the preset range; a collection unit arranged along the path of the detection signal transmitted or reflected by the substrate within the preset range, and configured to obtain image information of the positioning groove and the positioning mark within the preset range when the substrate within the preset range is detected by the detection unit, the image information including: position information of the positioning groove and position information of the positioning mark; a processing unit connected to the collection unit, configured to determine the offset between the initial position of the wafer and the position of the wafer in the image information based on the image information. The above detection device can improve production efficiency.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor manufacturing, and in particular to a wafer offset detection device and a wafer offset detection method. Background Art

[0002] In order to improve the chip's heat dissipation efficiency, reduce the chip packaging volume, reduce the chip's internal stress, and improve electrical performance, the wafer needs to be thinned. The wafer thinning process does not thin the entire wafer surface, but only thins the middle portion of the wafer. The thinned portion forms the wafer body, and the edge portion of the wafer is not thinned. The edge portion of the wafer that is not thinned forms a thinning ring. The thinned wafer is cut once with a dicing blade to remove the thinning ring. The wafer body after the thinning ring is removed is then cut again to form multiple individual chips.

[0003] However, during the wafer cutting process, there is a problem of reduced production efficiency. Therefore, how to provide a technical solution to improve production efficiency has become a technical problem that those skilled in the art urgently need to solve. Summary of the Invention

[0004] The technical problem solved by the present invention is to improve production efficiency by providing a wafer offset detection device and a wafer offset detection method.

[0005] In order to solve the above problems, an embodiment of the present invention provides a wafer offset detection device, wherein the wafer has a positioning groove; the detection device includes: a substrate for carrying the wafer; a positioning mark located on the substrate; a detection unit for emitting a detection signal to a preset range of the substrate to detect whether the positioning groove and the positioning mark are located within the preset range; an acquisition unit is arranged along the path of the detection signal transmitted or reflected by the substrate within the preset range, and is used to obtain image information of the positioning groove and the positioning mark within the preset range when the substrate within the preset range is detected by the detection unit, the image information including: position information of the positioning groove and position information of the positioning mark; a processing unit is connected to the acquisition unit, and is used to determine, based on the image information, the offset between the initial position of the wafer and the position of the wafer in the image information.

[0006] Optionally, the detection unit and the collection unit are located on the same side of the substrate supporting the wafer.

[0007] Optionally, the detection unit and the collection unit are located on opposite sides of the substrate, and the collection unit is located on the side of the substrate carrying the wafer, and the detection unit is located on the side facing away from the substrate carrying the wafer.

[0008] Optionally, the detection device further includes: a fixing ring for fixing the substrate carrying the wafer, the inner diameter of the fixing ring being larger than the diameter of the wafer, so that the positioning mark is arranged on the substrate between the edge of the wafer and the inner wall of the fixing ring.

[0009] Optionally, the detection unit includes an alarm configured to sound an alarm when one or more of the following conditions are met:

[0010] When the detection unit detects that the positioning groove and / or the positioning mark is not within the preset range;

[0011] When the offset is greater than or equal to a preset offset threshold.

[0012] Optionally, the detection unit includes: a transmitter, which transmits a detection signal to a preset range of the substrate, and the angle between the detection signal and the normal of the positioning mark is greater than or equal to 15 degrees.

[0013] Optionally, the shape of the positioning mark includes one or more of a circle, a square, an ellipse, a triangle, a polygon, and an arrow.

[0014] Correspondingly, an embodiment of the present invention also provides a method for detecting wafer offset, the detection device comprising: a substrate, a positioning mark, a detection unit, an acquisition unit, and a processing unit; the wafer has a positioning groove; the detection method comprises: the detection unit transmits a detection signal to a preset range of the substrate to detect whether the positioning groove and the positioning mark are located within the preset range; the acquisition unit obtains image information of the positioning groove and the positioning mark within the preset range when the substrate within the preset range is detected by the detection unit, the image information comprising: position information of the positioning groove and position information of the positioning mark; the processing unit determines the offset between the initial position of the wafer and the position of the wafer in the image information based on the image information.

[0015] Optionally, the detection unit includes: an alarm;

[0016] The step of the detection unit transmitting a detection signal to a preset range of the substrate to detect whether the positioning groove and the positioning mark are located within the preset range includes:

[0017] When the detection unit detects that the positioning groove and / or the positioning mark is not within the preset range, the alarm device sounds an alarm;

[0018] The step of determining, by the processing unit, an offset between an initial position of the wafer and a position of the wafer in the image information based on the image information includes:

[0019] When the offset is greater than or equal to a preset offset threshold, the alarm sounds an alarm.

[0020] Optionally, the detection device further includes: a fixing ring;

[0021] Before the detection unit transmits a detection signal to a preset range of the substrate to detect whether the positioning groove and the positioning mark are located within the preset range, the detection method further includes:

[0022] Formulate a preset offset threshold value between the positioning mark and the positioning groove;

[0023] placing the substrate on the fixing ring;

[0024] Placing the wafer on the substrate exposed in the fixing ring, with a distance between the positioning groove of the wafer and the inner wall of the fixing ring;

[0025] The positioning mark is arranged on the substrate exposed between the wafer positioning groove and the inner wall of the fixing ring according to the preset offset threshold and the distance, and is opposite to the positioning groove of the wafer.

[0026] Compared with the prior art, the technical solution of the embodiment of the present invention has the following advantages:

[0027] The detection device of an embodiment of the present invention includes: a substrate, a positioning mark, a detection unit, an acquisition unit, and a processing unit. The detection unit detects whether the positioning groove and the positioning mark are within the preset range, thereby reducing the probability that the wafer whose positioning groove and the positioning mark are not within the preset range will flow to the wafer cutting process, reducing the probability of poor wafer cutting, and improving production efficiency. The acquisition unit obtains image information of the positioning groove and the positioning mark within the preset range, and the processing unit determines the offset between the initial position of the wafer and the position of the wafer in the image information based on the image information, thereby reducing the probability that the wafer whose position offset on the substrate is greater than or equal to the preset offset threshold will flow to the wafer cutting process, reducing the probability of poor wafer cutting, and also improving production efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are merely embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on the provided drawings without any creative work.

[0029] Figures 1 to 3 1 is a schematic structural diagram of a device for detecting wafer offset according to an embodiment of the present invention;

[0030] Figure 4 It is a flow chart of a detection method corresponding to the wafer offset detection device according to an embodiment of the present invention. DETAILED DESCRIPTION

[0031] The following will be combined with the drawings in the embodiments of this application to clearly and completely describe the technical solutions in the embodiments of this application. Obviously, the embodiments described are only part of the embodiments of this application, not all of the embodiments. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of this application.

[0032] As known from the background technology, there is a problem of reduced production efficiency during the wafer cutting process. The reasons for the reduced production efficiency are analyzed below using a thinned wafer as an example.

[0033] The wafer includes a wafer body and a thinning ring surrounding the wafer body.

[0034] A wafer cutting device comprises a wafer base, a first cutting component, a second cutting component and a cutting blade.

[0035] The first cutting component is used for performing a first cutting, and the second cutting component is used for performing a second cutting.

[0036] The wafer base is used to support the wafer when cutting the wafer, and is also used to align with the cutting equipment to cut the wafer.

[0037] Before wafer cutting, the wafer is placed on the wafer base.

[0038] The wafer base is aligned with the first cutting component, and the thinning ring is cut once to remove the thinning ring.

[0039] The wafer base is aligned with the second cutting component, and the wafer body is cut a second time to cut the wafer body into a plurality of individual chips.

[0040] However, during the transportation process, the wafer base carrying the wafer may be subject to actions such as collision, sliding, falling, and stacking, which may cause the position of the wafer on the wafer base to shift. When the wafer base is aligned with the first cutting component and the second cutting component, the risk of the cutting blade deviating from the cutting path on the wafer is increased, thereby reducing production efficiency.

[0041] Based on the above issues, before performing the first and second cuts on a wafer, manual visual inspection is required to check whether the wafer has shifted relative to the wafer base. This presents the following problems: First, manually visually inspecting the positional offset of each wafer on the wafer base reduces production efficiency. Second, manual visual inspection can result in false positives and missed positives, causing wafers whose positional offset on the wafer base exceeds a preset offset threshold to be sent to the wafer cutting process, resulting in poor cutting, which also reduces production efficiency.

[0042] In order to solve the above technical problems, an embodiment of the present invention provides a device for detecting wafer offset, which can improve production efficiency during the detection process.

[0043] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the following will be combined with the embodiments of the present invention. Figures 1 to 3 , the technical solutions in the embodiments of the present invention are described clearly and completely. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. In the absence of conflict, the following embodiments and features in the embodiments can be combined with each other.

[0044] refer to Figures 1 to 3 , is a structural diagram of a wafer offset detection device according to an embodiment of the present invention. Figure 2 The figure is a top view of the device for detecting wafer offset.

[0045] The wafer offset detection device of this embodiment comprises: a wafer 100 having a positioning groove 102; the detection device comprises: a substrate for carrying the wafer 100; a positioning mark 106 located on the substrate; a detection unit 200 for emitting a detection signal to a preset range of the substrate to detect whether the positioning groove 102 and the positioning mark 106 are located within the preset range; a collection unit 300 is arranged along a path along which the detection signal is transmitted or reflected by the substrate within the preset range, and is configured to obtain image information of the positioning groove 102 and the positioning mark 106 within the preset range when the substrate within the preset range is detected by the detection unit 200, the image information comprising: position information of the positioning groove 102 and position information of the positioning mark 106; a processing unit 400 is connected to the collection unit 300, and is configured to determine, based on the image information, an offset between an initial position of the wafer 100 and a position of the wafer 100 in the image information.

[0046] The preset range is used to represent an area that is pre-determined to have a positioning groove (wafer notch) and a positioning mark.

[0047] As a non-limiting example, the region with the positioning grooves can be determined according to a design layout and a wafer positioning unit (also called a wafer alignment unit) of each tool.

[0048] As a non-limiting example, the positioning mark can be added to the substrate after the wafer is aligned by gluing, welding, vacuum adsorption, etc., and the area with the positioning mark can be determined by the device for adding the positioning mark. In the embodiments of the present invention, the specific implementation method of adding the positioning mark is not limited.

[0049] In a specific embodiment, the image information of the positioning groove 102 may further include an image (such as a picture or video) of the positioning groove 102 , for example, a top view of the positioning groove 102 .

[0050] In a specific embodiment, the image information of the positioning mark 106 may further include an image (such as a picture or video) of the positioning mark 106 , for example, a top view of the positioning mark 106 .

[0051] The detection device of the present invention includes: a substrate, a positioning mark 106, a detection unit 200, a collection unit 300, and a processing unit 400. The detection unit 200 detects whether the positioning groove 102 and the positioning mark 106 are within the preset range, thereby reducing the probability that the wafer 100 whose positioning groove 102 and the positioning mark 106 are not within the preset range will flow to the wafer 100 cutting process, reducing the probability of poor cutting of the wafer 100, and improving production efficiency. The collection unit 300 obtains image information of the positioning groove 102 and the positioning mark 106 within the preset range, and the processing unit 400 determines the offset between the initial position of the wafer 100 and the position of the wafer 100 in the image information based on the image information, thereby reducing the probability that the wafer 100 whose position offset on the substrate is greater than or equal to the preset offset threshold will flow to the wafer 100 cutting process, reducing the probability of poor cutting of the wafer 100, and also improving production efficiency.

[0052] Continue to refer Figure 1 and Figure 2 , the wafer 100 has a positioning groove 102 .

[0053] In this embodiment, the positioning groove 102 has the following functions:

[0054] First, it is used to indicate the crystal orientation of the wafer 100. Different crystal orientations will affect the electrical properties of the semiconductor. The positioning groove 102 can quickly identify the crystal orientation of the wafer 100 during the manufacturing process to ensure correct processing.

[0055] Second, cutting positioning: Before the wafer 100 is cut into individual chips, the positioning groove 102 is used to position the cutting blade.

[0056] Third, quality control: During the appearance inspection of the wafer 100 , the positioning grooves 102 can be used to check whether the wafer 100 is correctly placed, thereby reducing the probability of the wafer 100 being twisted or damaged.

[0057] It should be noted that the above only lists some of the functions of the positioning groove 102 and cannot be used as a limitation to the present invention.

[0058] The shape of the positioning groove 102 includes one or more of: V-shape, U-shape, arc-shape, circle, square, ellipse, triangle, and in this embodiment, the shape of the positioning groove 102 is V-shape.

[0059] Continue to refer Figure 1 and Figure 2 , the detection device includes: a substrate (not shown).

[0060] The substrate is used to support the wafer 100 .

[0061] The types of substrates include: plastic substrates, glass substrates, and metal substrates.

[0062] A base film 104 is provided on the substrate, and the base film 104 is used to fix the wafer 100 on the substrate. During the wafer 100 cutting process, the base film 104 is used to reduce the probability of the wafer 100 moving relative to the substrate, thereby reducing the risk of the cutting knife deviating from the cutting path during the cutting process, improving the cutting yield of the wafer 100, and correspondingly improving production efficiency.

[0063] The material of the base film 104 includes one or more of a polyester film, a UV-curable adhesive film, a heat-curable adhesive film, and a polyimide tape. The material of the base film 104 has UV-curable properties.

[0064] In this embodiment, the substrate is a plastic substrate, and the base film 104 is made of a polyester film. The base film 104 is bonded to the substrate by bonding, and the substrate and the base film 104 have a certain degree of transparency.

[0065] Continue to refer Figure 1 and Figure 2 The detection device includes: a positioning mark 106 and a fixing ring 108.

[0066] The positioning mark 106 is located on the substrate.

[0067] Setting the positioning mark 106 has the following beneficial effects:

[0068] First, the offset of the wafer 100 on the base film 104 is detected.

[0069] The positioning mark 106 cooperates with the positioning groove 102 to detect the offset of the wafer 100 on the base film 104, preventing the wafer 100 from flowing to the cutting process when the offset is greater than or equal to a preset offset threshold, thereby improving production efficiency.

[0070] Second, the manufacturing information of the wafer 100 is identified.

[0071] The positioning mark 106 may be provided with a pattern, such as a QR code and numbers; the QR code is used by a machine to read information of the wafer 100, such as the production date and production batch of the wafer 100; the numbers are used by the naked eye to identify the information of the wafer 100.

[0072] Third, it serves as a reference mark for the cutting and alignment of the wafer 100 .

[0073] The thinned wafer 100 includes: a thinned wafer 100 body and a thinning ring surrounding the thinned wafer 100 body. The positioning groove 102 is located on the thinning ring. After the thinning ring is removed, when the thinned wafer 100 body is cut into multiple single chips, the positioning mark 106 can be used to position the cutting knife to the cutting line position on the wafer 100 body, thereby improving the cutting yield of the wafer 100.

[0074] In this embodiment, the positioning mark 106 is provided independently from the base film 104, and is placed on the base film 104 by, for example, attaching. In other embodiments, the positioning mark 106 can be integrally formed with the base film 104, eliminating the need to attach the positioning mark 106 and improving production efficiency. For example, a region on the base film 104 is selected as the positioning mark 106, and the material properties of the region are different from those of other regions of the base film 104, such as different transparency or reflectivity.

[0075] The fixing ring 108 is used to fix the substrate carrying the wafer 100 . The inner diameter of the fixing ring 108 is larger than the diameter of the wafer 100 so that the positioning mark 106 is set on the substrate between the edge of the wafer 100 and the inner wall of the fixing ring 108 .

[0076] The shape of the positioning mark 106 includes one or more of a circle, a square, an ellipse, a triangle, a polygon, and an arrow. In this embodiment, the shape of the positioning mark 106 is a rectangle.

[0077] The material of the positioning mark 106 includes one or more of resin, paper, and metal sheet. In this embodiment, the material of the positioning mark 106 is paper.

[0078] In this embodiment, the positioning mark 106 is attached to the base film 104 on the substrate manually or by a positioning mark 106 attaching device; the positioning mark 106 is located on the base film 104 on the substrate between the edge of the wafer 100 and the inner wall of the fixing ring 108. At this time, the position of the wafer 100 relative to the positioning mark 106 is the initial position of the wafer 100.

[0079] It should be noted that there may be three states between the positioning mark 106 and the positioning groove 102:

[0080] The first state: the positioning mark 106 is not completely opposite to the positioning groove 102 , for example, the extension line or the reverse extension line of the positioning groove 102 (such as the center line EL mentioned below) does not pass through any point on the positioning mark 106 .

[0081] The second state: the positioning mark 106 is partially opposite to the positioning groove 102 , for example, the extension line or the reverse extension line of the positioning groove 102 (such as the center line EL mentioned below) passes through one or more points on the positioning mark 106 .

[0082] The third state: the positioning mark 106 and the positioning groove 102 are completely opposite to each other, for example, the extension line or the reverse extension line of the positioning groove 102 (such as the center line EL mentioned below) passes through the center of the positioning mark.

[0083] It can be understood that when the positioning mark 106 and the positioning groove 102 are completely opposite to each other, the offset is zero, which is an ideal state.

[0084] In this embodiment, the positioning mark 106 is in the shape of a rectangle ABCD, and the positioning grooves 102 form a triangle EFG.

[0085] In this embodiment, the positioning mark 106 and the positioning groove 102 are completely opposite each other, that is, a distance is set between the positioning mark 106 and the positioning groove 102, and the center line EL of the positioning groove 102 and the center line MN of the positioning mark 106 are on the same straight line, or the offset of the center line EL relative to the center line MN is less than a predetermined offset threshold. In other embodiments, the center line EL of the positioning groove 102 and the center line MN of the positioning mark 106 can be set at a certain angle.

[0086] The orientation of the positioning groove 102 is toward or away from the center of the wafer. In this embodiment, the orientation of the positioning groove 102 is toward the center of the wafer.

[0087] The distance between the positioning mark 106 and the positioning groove 102, that is, the distance between point L on the side EG of the triangle EFG of the positioning groove 102 and point M on the positioning mark 106, can be set according to actual needs. In other embodiments, the distance between the positioning mark 106 and the positioning groove 102 can be selected, for example, from point A to point E. Those skilled in the art can make this selection based on actual needs, and the present invention is not limited thereto.

[0088] The material of the fixing ring 108 includes: metal material (such as stainless steel, aluminum, etc.) or anti-static plastic material (such as polycarbonate, polypropylene, acrylic, etc.); in this embodiment, the material of the fixing ring 108 is metal stainless steel.

[0089] Continue to refer Figure 1 and Figure 2 The detection device includes: a detection unit 200.

[0090] The detection unit 200 is configured to transmit a detection signal to a preset range of the substrate to detect whether the positioning groove 102 and the positioning mark 106 are located within the preset range.

[0091] The predetermined range of the substrate is a range that includes at least the positioning mark 106 and the positioning groove 102. In this embodiment, the predetermined range is shaped as a quadrilateral RPQS, and the positioning mark 106 and the positioning groove 102 are located within the quadrilateral RPQS. In other embodiments, the predetermined range may also be shaped like a triangle, a circle, an ellipse, a polygon, or an irregular shape.

[0092] It should be noted that the preset range is larger than the range enclosed by the positioning mark 106 and the positioning groove 102. The preset range may also include the base film 104. The base film 104, the positioning mark 106 and the positioning groove 102 have different reflectivities or absorption rates of the detection signal emitted by the detection unit 200, which facilitates the detection unit 200 to detect whether the positioning groove 102 and the positioning mark 106 are within the preset range.

[0093] The detection unit 200 is configured to transmit a detection signal to a preset range of the substrate.

[0094] In this embodiment, the detection unit 200 includes a transmitter (not shown), a light scattering detector (not shown), an alarm (not shown), a graphics processor (not shown), and an image comparator (not shown).

[0095] The detection unit 200 transmits a detection signal to a preset range of the substrate through the transmitter.

[0096] The detection signal that can be emitted by the transmitter includes: optical signal, infrared, microwave, X-ray, etc. In this embodiment, the transmitter is provided with a light source, and the detection signal emitted by the transmitter through the light source is an optical signal.

[0097] It should be noted that, in order to facilitate the collection unit 300 in the detection device to collect the signal after the detection signal is reflected by the base film 104, the positioning groove 102, and the positioning mark 106 in the preset range of the substrate, the detection signal emitted by the transmitter to the preset range of the substrate has an angle greater than or equal to 15 degrees with the normal of the positioning mark 106.

[0098] In this embodiment, a light signal is emitted to a preset range of the substrate by a light source, and the light scattering detector detects the scattered light signal after the light signal is scattered by the positioning mark 106, the positioning groove 102, and the base film 104 within the preset range to determine whether the positioning groove 102 and the positioning mark 106 are located within the preset range.

[0099] The alarm is used to sound an alarm when the detection unit 200 detects that the positioning groove 102 and / or the positioning mark 106 are not within the preset range.

[0100] In this embodiment, if the positioning slot 102 is not within the preset range, the alarm will sound an alarm.

[0101] In this embodiment, if the positioning mark 106 is not within the preset range, the alarm will sound an alarm.

[0102] In this embodiment, if the positioning groove 102 and the positioning mark 106 are both outside the preset range, the alarm will sound an alarm.

[0103] The alarm device sounds an alarm, and the positioning grooves 102 and / or the positioning marks 106 that are not within the preset range are screened out to prevent them from flowing into the wafer 100 cutting process, thereby improving the cutting yield and the production efficiency.

[0104] It should be noted that, in this embodiment, the positioning groove 102 is not within the preset range, which means that the entire graphic or part of the graphic of the positioning groove 102 is not within the preset range; the positioning mark 106 is not within the preset range, which means that the entire graphic or part of the graphic of the positioning mark 106 is not within the preset range.

[0105] In this embodiment, the principle of the detection unit 200 detecting whether the positioning groove 102 and the positioning mark 106 are within a preset range is as follows:

[0106] The image comparator stores the image within the preset range to form a stored image, and the stored image at least includes: the positioning groove 102 and the positioning mark 106 .

[0107] The light source emits a light signal to a preset range of the substrate.

[0108] The light scattering detector receives a reflection signal of the light signal after the light signal is reflected by an object within the preset range, and transmits the reflection signal to a graphics processor for processing to form a scattered object image.

[0109] The image comparator compares the scattered object image with the stored image, and the comparison results include the following situations:

[0110] If the scattered object image includes the positioning groove 102 and the positioning mark 106 in the stored image, then the positioning groove 102 and the positioning mark 106 are located within the preset range.

[0111] If the scattered object image only includes: the positioning groove 102, or the positioning mark 106, or a part of the positioning groove 102, or a part of the positioning mark 106, the alarm will sound to prevent the wafer 100 whose positioning groove 102 and / or the positioning mark 106 is not within the preset range from flowing to the cutting process, thereby improving the cutting yield and the production efficiency.

[0112] Continue to refer Figure 1 and Figure 2 The detection device includes: a collection unit 300.

[0113] The acquisition unit 300 is arranged along the path through which the detection signal is transmitted or reflected by the substrate within the preset range, and is used to obtain image information of the positioning groove 102 and the positioning mark 106 within the preset range when the substrate within the preset range is detected by the detection unit 200. The image information includes: position information of the positioning groove 102 and position information of the positioning mark 106.

[0114] In some embodiments, the detection unit 200 and the collection unit 300 are located on the same side of the substrate-carrying wafer 100 , and the collection unit 300 is disposed along a path where the detection signal is reflected by the substrate within the preset range.

[0115] It should be noted that the same side includes: the side of the substrate carrying the wafer 100, or the side facing away from the substrate carrying the wafer 100. The substrate reflection includes: the reflection of the base film 104 on the substrate.

[0116] In other embodiments, the detection unit 200 and the collection unit 300 are located on opposite sides of the substrate, and the collection unit 300 is located on the side of the substrate carrying the wafer 100, the detection unit 200 is located on the side facing away from the substrate carrying the wafer 100, and the collection unit 300 is arranged along the path of the detection signal transmitted through the substrate within the preset range.

[0117] In other embodiments, the detection unit 200 and the collection unit 300 are located on opposite sides of the substrate, and the detection unit 200 is located on the side of the substrate carrying the wafer 100, and the collection unit 300 is located on the side facing away from the substrate carrying the wafer 100. The collection unit 300 is arranged along the path of the detection signal transmitted through the substrate within the preset range.

[0118] In this embodiment, the detection unit 200 and the collection unit 300 are located on the same side of the substrate-supporting wafer 100, which is one side of the substrate-supporting wafer 100. The collection unit 300 is arranged along the path where the detection signal is reflected by the substrate within the preset range.

[0119] The acquisition unit 300 includes a receiver (not shown), a graphic generator (not shown), a display 301, and a position detector (not shown).

[0120] The working principle of the acquisition unit 300 is as follows:

[0121] The receiver receives the detection signal emitted by the transmitter of the detection unit 200 to a preset range of the substrate, and the reflected signal after being reflected by the base film 104, the positioning groove 102, and the positioning mark 106 within the preset range.

[0122] The pattern generator clearly displays a pattern within a preset range on the display 301 based on the reflected signal, wherein the pattern at least includes the base film 104 , the positioning groove 102 , the positioning mark 106 , and the boundary of the preset range.

[0123] refer to Figure 3In order to make the drawings concise and clear, the display 301 only displays the graphics of the positioning mark 106 and the positioning groove 102, and the graphics of the positioning mark 106 and the positioning groove 102 are magnified, but this does not limit the present invention.

[0124] In this embodiment, the position information of the positioning mark 106 is obtained using four points as an example, and the position information of the positioning groove 102 is obtained using three points as an example. Point A1 corresponds to point A, point B1 corresponds to point B, point C1 corresponds to point C, point D1 corresponds to point D, point E1 corresponds to point E, point F1 corresponds to point F, and point G1 corresponds to point G. The positional relationship between rectangle A1B1C1D1 and triangle E1F1G1 reflects the positional relationship between rectangle ABCD and triangle EFG.

[0125] In this embodiment, the position detector uses the coordinates A1 (X1, Y1) of point A1 of the positioning mark 106 on the display 301 as a reference point, and respectively tests the coordinates B1 (X2, Y2) of point B1 of the positioning mark 106, the coordinates C1 (X3, Y3) of point C1, and the coordinates D1 (X4, Y4) of point D1.

[0126] In this embodiment, the position detector uses the coordinates A1 (X1, Y1) of point A1 of the positioning mark 106 on the display 301 as a reference point, and also tests the coordinates E1 (X5, Y5) of point E1, the coordinates F1 (X6, Y6) of point F1, and the coordinates G1 (X7, Y7) of point G1 on the positioning groove 102.

[0127] It should be noted that the number of reference points and coordinate points used to obtain the position information of the positioning mark 106 and the positioning groove 102 can be selected according to actual needs and does not limit the present invention.

[0128] Continue to refer Figure 1 and Figure 2 The detection device includes: a processing unit 400.

[0129] The processing unit 400 is connected to the acquisition unit 300 and is configured to determine, based on the image information, an offset between an initial position of the wafer 100 and a position of the wafer 100 in the image information.

[0130] In this embodiment, the offset between the initial position of the wafer 100 and the position of the wafer 100 in the image information is determined by the deviation between the position of the positioning mark 106 in the image information and the position of the positioning groove 102 in the image information.

[0131] Specifically, the initial position of the wafer 100 is determined using the position information of the positioning mark 106 in the image information. Because the positioning mark 106 is attached to the base film 104 on the substrate, the position of the positioning mark 106 on the base film 104 is not easily changed. The position information of the positioning groove 102 in the image information is used to reflect the position of the wafer 100 in the image information. Because the positioning groove 102 is located on the wafer 100, if the position of the wafer 100 on the base film 104 shifts, the positioning groove 102 will also shift by a corresponding distance along with the wafer 100.

[0132] In this embodiment, the wafer 100 is located on the base film 104 of the substrate. During the processing and / or transportation of the wafer 100 , there is a possibility that the wafer 100 moves on the base film 104 , thereby causing the initial position of the wafer 100 to shift.

[0133] In this embodiment, the processing unit 400 is connected to the collection unit 300 via an optical fiber to achieve rapid data transmission.

[0134] In this embodiment, the processing unit 400 includes a data processor and a memory.

[0135] The data processor is used to process the image information collected by the collection unit 300; the memory is used to store data during the data processing to prevent data loss.

[0136] refer to Figure 3 The acquisition unit 300 transmits the acquired image information, such as the coordinates of points A1, B1, C1, D1, E1, F1, and G1, to the data processor of the processing unit 400. The data processor calculates the midpoint coordinates M1 (X8, Y8) of the A1B1 side and the midpoint coordinates N1 (X9, Y9) of the C1D1 side of the positioning mark 106 according to the coordinates of points A1, B1, C1, and D1, and then calculates the slope K1 of the straight line M1N1.

[0137] The data processor calculates the midpoint coordinates L1 (X10, Y10) of the F1G1 side of the positioning groove 102 according to the coordinates of points E1, F1, and G1, and then calculates the slope K2 of the straight line E1L1.

[0138] The data processor calculates the offset distance of the wafer 100 relative to the positioning mark 106 along the straight line M1N1 according to the midpoint coordinates M1 (X8, Y8) and L1 (X10, Y10).

[0139] The data processor calculates the offset angle of the straight line E1L1 relative to the straight line M1N1 based on the straight line M1N1.

[0140] In this embodiment, the offset between the initial position of the wafer 100 and the position of the wafer 100 in the image information is the offset distance and the offset angle.

[0141] In this embodiment, the alarm is triggered when the offset is greater than or equal to a preset offset threshold, which is a limit where the offset distance and the offset angle meet the process manufacturing standard of the wafer 100 .

[0142] In this embodiment, for the wafer 100 whose offset is greater than or equal to the preset offset threshold, the following two operations are performed:

[0143] The first solution is to rework the wafer 100 with an offset greater than or equal to a preset offset threshold according to the process manufacturing standard and then place it back on the base film 104, thereby improving the cutting efficiency of the wafer 100 and improving production efficiency.

[0144] The second solution is to feed back the offset, i.e., the offset distance and the offset angle, to the cutting equipment. The cutting equipment responds to the detection device of the wafer offset. The cutting equipment automatically adjusts the cutting parameters according to the offset to cut the wafer 100 whose offset is greater than or equal to the preset offset threshold. There is no need to rework the wafer 100, which not only improves the cutting yield but also improves the production efficiency.

[0145] In order to solve the technical problem, accordingly, an embodiment of the present invention further provides a method for detecting wafer offset, which is applied to a device for detecting wafer offset. Figure 4 It is a flow chart of a detection method corresponding to the wafer offset detection device according to an embodiment of the present invention.

[0146] refer to Figure 4 , combined with Figure 1 、 Figure 2 and Figure 3 The detection device includes: a substrate, a positioning mark 106, a detection unit 200, a collection unit 300, a processing unit 400, and a fixing ring 108.

[0147] It should be noted that, before the detection unit 200 transmits a detection signal to a preset range of the substrate to detect whether the positioning groove 102 and the positioning mark 106 are located within the preset range, the detection method further includes: formulating a preset offset threshold value for the offset of the positioning mark 106 from the positioning groove 102; placing the substrate on the fixing ring 108; placing the wafer 100 on the substrate exposed in the fixing ring 108, and a distance is set between the positioning groove 102 of the wafer 100 and the inner wall of the fixing ring 108; the positioning mark 106 is set on the substrate exposed between the positioning groove 102 of the wafer 100 and the inner wall of the fixing ring 108 according to the preset offset threshold value and the distance, and is opposite to the positioning groove 102 of the wafer 100.

[0148] The detection method mainly comprises the following steps:

[0149] Step S11: establishing a preset offset threshold between the positioning mark and the positioning groove.

[0150] Based on process production requirements, a preset offset threshold value for the positioning mark 106 and the positioning groove 102 is established. In this embodiment, the preset offset threshold value for the positioning mark 106 and the positioning groove 102 includes a preset offset distance and a preset offset angle. The preset offset distance and preset offset angle are described in the aforementioned embodiment of the wafer offset detection device and are not further elaborated here.

[0151] In this embodiment, the preset offset distance is ±0.5 mm, and the preset offset angle is ±1 degree.

[0152] Step S12: placing the substrate on the fixing ring.

[0153] The method of placing the substrate on the fixing ring 108 includes: one or more of bolts, vacuum adsorption, and glue bonding. In this embodiment, the substrate is placed on the fixing ring 108 by glue bonding.

[0154] A base film 104 is bonded to the substrate, and the base film 104 is used to bond the wafer 100 .

[0155] The base film 104 for bonding the wafer 100 is exposed in the fixing ring 108 .

[0156] Step S13: placing the wafer on the substrate.

[0157] In this embodiment, the wafer 100 is placed on the substrate exposed in the fixing ring 108 , that is, the wafer 100 is attached to the base film 104 on the substrate exposed in the fixing ring 108 .

[0158] In this embodiment, a wafer attaching device is used to align the center of the wafer 100 with the center of the inner ring of the fixing ring 108, and the wafer 100 is attached to the base film 104 on the substrate exposed within the fixing ring 108. In other embodiments, the wafer 100 is attached to the base film 104 on the substrate exposed within the fixing ring 108 by manual attachment.

[0159] A distance is set between the positioning groove 102 of the wafer 100 and the inner wall of the fixing ring 108 to reserve space for attaching the positioning mark 106 between the positioning groove 102 and the inner wall of the fixing ring 108 .

[0160] In this embodiment, the distance between the edge of the wafer 100 and the inner wall of the fixing ring 108 is equal. In other embodiments, the distance between the edge of the wafer 100 and the inner wall of the fixing ring 108 may be unequal. Those skilled in the art may set the distance between the edge of the wafer 100 and the inner wall of the fixing ring 108 according to actual needs.

[0161] Step S14: setting the positioning mark on the substrate exposed between the wafer positioning groove and the inner wall of the fixing ring.

[0162] The positioning mark 106 is disposed on the substrate exposed between the positioning groove 102 of the wafer 100 and the inner wall of the fixing ring 108 according to the preset offset threshold and the distance, and is opposite to the positioning groove 102 of the wafer 100 .

[0163] In this embodiment, based on the preset offset threshold and the distance, with the positioning groove 102 as a reference, the positioning mark 106 is attached to the base film 104 on the substrate exposed between the positioning groove 102 of the wafer 100 and the inner wall of the fixing ring 108 through the positioning mark 106 attaching device, and the positioning mark 106 and the positioning groove 102 are all arranged opposite to each other.

[0164] In this embodiment, information corresponding to the wafer 100 is printed on the positioning mark 106. For example, a QR code and a number are printed on the positioning mark 106; the QR code is used by a machine to read information about the wafer 100, such as the production date and production batch of the wafer 100; and the number is used by the naked eye to identify the information about the wafer 100.

[0165] In this embodiment, after the positioning mark 106 is attached to the base film 104 on the substrate exposed between the positioning groove 102 of the wafer 100 and the inner wall of the fixing ring 108, the offset between the positioning mark 106 and the positioning groove 102 is detected, for example, with the help of a caliper.

[0166] Step S15: The detection unit transmits a detection signal to a preset range of the substrate to detect whether the positioning groove and the positioning mark are located within the preset range.

[0167] The preset range of the substrate at least includes the range of the positioning mark 106 and the positioning groove 102. In this embodiment, the shape of the preset range is set to be a quadrilateral RPQS, and the positioning mark 106 and the positioning groove 102 are located within the range of the quadrilateral RPQS.

[0168] The detection unit 200 transmits a detection signal to a preset range of the substrate to detect whether the positioning groove 102 and the positioning mark 106 are within the preset range, including: when the detection unit 200 detects that the positioning groove 102 and / or the positioning mark 106 are not within the preset range, the alarm sounds an alarm.

[0169] In this embodiment, the detection unit 200 includes a transmitter, a light scattering detector, an alarm, a graphics processor, and an image comparator. The transmitter includes a light source.

[0170] In this embodiment, the step of the detection unit 200 detecting whether the positioning groove 102 and the positioning mark 106 are located within the preset range mainly includes:

[0171] The image comparator stores the image within the preset range to form a stored image, and the stored image at least includes: the positioning groove 102 and the positioning mark 106 .

[0172] The light source emits a light signal to a preset range of the substrate.

[0173] The light scattering detector receives a reflection signal of the light signal after the light signal is reflected by an object within the preset range, and transmits the reflection signal to a graphics processor for processing to form a scattered object image.

[0174] The image comparator compares the scattered object image with the stored image, and the comparison results include the following situations:

[0175] If the scattered object image includes the positioning groove 102 and the positioning mark 106 in the stored image, the positioning groove 102 and the positioning mark 106 are located within the preset range.

[0176] If the scattered object image only includes: the positioning groove 102, or the positioning mark 106, or a part of the positioning groove 102, or a part of the positioning mark 106, the alarm will sound to prevent the wafer 100 whose position offset on the substrate is greater than or equal to the preset offset threshold from flowing into the cutting process, thereby improving the cutting yield and also improving production efficiency.

[0177] Step S16: When the substrate within the preset range is detected by the detection unit, the acquisition unit obtains image information of the positioning groove and the positioning mark within the preset range, and the image information includes: position information of the positioning groove and position information of the positioning mark.

[0178] The acquisition unit 300 includes a receiver, a graphic generator, a display 301 and a position detector.

[0179] The step of the acquisition unit 300 acquiring the image information of the positioning groove 102 and the positioning mark 106 within the preset range mainly includes:

[0180] The receiver receives the detection signal emitted by the transmitter of the detection unit 200 to a preset range of the substrate, and the reflected signal after being reflected by the base film 104, the positioning groove 102, and the positioning mark 106 within the preset range.

[0181] The pattern generator clearly displays a pattern within a preset range on the display 301 based on the reflected signal, wherein the pattern at least includes the base film 104 , the positioning groove 102 , the positioning mark 106 , and the boundary of the preset range.

[0182] In this embodiment, the position information of the positioning mark 106 is obtained using four points as an example, and the position information of the positioning groove 102 is obtained using three points as an example. Point A1 corresponds to point A, point B1 corresponds to point B, point C1 corresponds to point C, point D1 corresponds to point D, point E1 corresponds to point E, point F1 corresponds to point F, and point G1 corresponds to point G. The positional relationship between rectangle A1B1C1D1 and triangle E1F1G1 reflects the positional relationship between rectangle ABCD and triangle EFG, and also reflects the positional relationship between the initial position of the wafer 100 and the position of the wafer 100 in the image information.

[0183] In this embodiment, the position detector uses the coordinates A1 (X1, Y1) of point A1 of the positioning mark 106 on the display 301 as a reference point, and respectively tests the coordinates B1 (X2, Y2) of point B1 of the positioning mark 106, the coordinates C1 (X3, Y3) of point C1, and the coordinates D1 (X4, Y4) of point D1.

[0184] In this embodiment, the position detector uses the coordinates A1 (X1, Y1) of point A1 of the positioning mark 106 on the display 301 as a reference point, and also tests the coordinates E1 (X5, Y5) of point E1, the coordinates F1 (X6, Y6) of point F1, and the coordinates G1 (X7, Y7) of point G1 on the positioning groove 102.

[0185] It should be noted that the points and the number of points for obtaining the position information of the positioning mark 106 and the positioning groove 102 can be selected according to actual needs and are not intended to limit the present invention.

[0186] Step S17: The processing unit determines, based on the image information, an offset between the initial position of the wafer and the position of the wafer in the image information.

[0187] In this embodiment, the processing unit 400 includes a data processor and a memory.

[0188] The processing unit 400 determines the offset between the initial position of the wafer 100 and the position of the wafer 100 in the image information according to the image information, including: when the offset is greater than or equal to a preset offset threshold, the alarm sounds an alarm.

[0189] refer to Figure 3 The acquisition unit 300 transmits the acquired image information, such as the coordinates of points A1, B1, C1, D1, E1, F1, and G1, to the data processor of the processing unit 400. The data processor calculates the midpoint coordinates M1 (X8, Y8) of the A1B1 side and the midpoint coordinates N1 (X9, Y9) of the C1D1 side of the positioning mark 106 according to the coordinates of points A1, B1, C1, and D1, and then calculates the slope K1 of the straight line M1N1.

[0190] The data processor calculates the midpoint coordinates L1 (X10, Y10) of the F1G1 side of the positioning groove 102 according to the coordinates of points E1, F1, and G1, and then calculates the slope K2 of the straight line E1L1.

[0191] The data processor calculates the offset distance of the wafer 100 relative to the positioning mark 106 along the straight line M1M1 according to the midpoint coordinates M1 (X8, Y8) and L1 (X10, Y10).

[0192] The data processor calculates the offset angle of the straight line E1L1 relative to the straight line M1N1 based on the straight line M1N1.

[0193] In this embodiment, the offset between the initial position of the wafer 100 and the position of the wafer 100 in the image information is the offset distance and the offset angle.

[0194] In this embodiment, the alarm sounds an alarm when the offset is greater than or equal to a preset offset threshold, wherein the preset offset threshold is the offset distance and the offset angle meeting the limit standard of the process of manufacturing the wafer 100 .

[0195] In this embodiment, for the wafer 100 whose offset is greater than or equal to the preset offset threshold, the following two operations are performed:

[0196] The first solution is to rework the wafer 100 whose offset is greater than or equal to the preset offset threshold according to the production standard, and place the wafer 100 back on the base film 104, thereby improving the cutting efficiency of the wafer 100 and improving production efficiency.

[0197] The second solution is to feed back the offset, i.e., the offset distance and the offset angle, to the cutting equipment. The cutting equipment responds to the detection device of the wafer offset. The cutting equipment automatically adjusts the cutting parameters according to the offset to cut the wafer 100 whose offset is greater than or equal to the preset offset threshold. There is no need to rework the wafer 100, which not only improves the cutting yield but also improves the production efficiency.

[0198] In this embodiment, for example, the offset distance of the wafer 100 in the direction away from the positioning mark 106 is 1 mm, and the offset angle of the straight line E1L1 relative to the straight line M1N1 in the counterclockwise direction is 1 degree. The cutting equipment automatically adjusts the offset distance of the cutting knife in the direction away from the positioning mark 106 by 1 mm according to the offset, and adjusts the offset angle in the counterclockwise direction by 1 degree, so that the cutting knife coincides with the cutting path on the wafer 100, so as to cut the wafer 100 whose offset is greater than or equal to the preset offset threshold.

[0199] It should be noted that, in step S14 of other embodiments, after the positioning mark 106 is attached to the base film 104 on the substrate exposed between the positioning groove 102 of the wafer 100 and the inner wall of the fixing ring 108, there is no need to detect the offset between the positioning mark 106 and the positioning groove 102, and steps S15, S16, and S17 are directly executed. In step S17, the offset is directly fed back to the cutting equipment, and the cutting equipment automatically adjusts the cutting parameters according to the offset to cut the wafer 100 whose offset is greater than or equal to the preset offset threshold, without the need to rework the wafer 100, thereby further improving production efficiency.

[0200] It should be pointed out that for other relevant descriptions in the detection method, reference can be made to the corresponding description in the wafer offset detection device in the aforementioned embodiment, which will not be repeated here.

[0201] It should be understood that the term "and / or" as used herein simply describes an association between related objects, indicating that three possible relationships exist. For example, "A and / or B" can represent: A exists alone, A and B exist simultaneously, or B exists alone. Furthermore, the character " / " as used herein indicates that the related objects are in an "or" relationship.

[0202] The term "plurality" used in the embodiments of the present application refers to two or more.

[0203] The first, second, etc. descriptions appearing in the embodiments of this application are only for illustration and distinction of the description objects. There is no order, nor does it indicate any special limitation on the number of devices in the embodiments of this application, and cannot constitute any limitation on the embodiments of this application.

[0204] It should be noted that the serial numbers of the steps in this embodiment do not limit the execution order of the steps.

[0205] Although the present invention has been disclosed above in terms of preferred embodiments, it is not intended to limit the present invention. Any person skilled in the art may make possible changes and modifications to the technical solutions of the present invention by using the methods and technical contents disclosed above without departing from the spirit and scope of the present invention. Therefore, any simple modifications, equivalent changes and modifications made to the above embodiments based on the technical essence of the present invention without departing from the content of the technical solutions of the present invention shall fall within the scope of protection of the technical solutions of the present invention.

Claims

1. A wafer offset detection device, characterized in that: The wafer has a positioning groove; The detection device comprises: a substrate, used for supporting the wafer; A positioning mark is located on the substrate; a detection unit, configured to transmit a detection signal to a preset range of the substrate to detect whether the positioning groove and the positioning mark are located within the preset range; a collection unit, arranged along a path through which the detection signal is transmitted or reflected by the substrate within the preset range, and configured to obtain image information of the positioning groove and the positioning mark within the preset range when the substrate within the preset range is detected by the detection unit, the image information including: position information of the positioning groove and position information of the positioning mark; A processing unit is connected to the acquisition unit and is used to determine, based on the image information, an offset between an initial position of the wafer and a position of the wafer in the image information.

2. The detection device according to claim 1, wherein The detection unit and the collection unit are located on the same side of the substrate supporting the wafer.

3. The detection device according to claim 1, wherein The detection unit and the collection unit are located on opposite sides of the substrate, and the collection unit is located on the side of the substrate carrying the wafer, and the detection unit is located on the side facing away from the substrate carrying the wafer.

4. The detection device according to claim 1, wherein The detection device also includes: a fixing ring for fixing the substrate carrying the wafer, the inner diameter of the fixing ring is larger than the diameter of the wafer, so that the positioning mark is set on the substrate between the edge of the wafer and the inner wall of the fixing ring.

5. The detection device according to claim 1, wherein The detection unit includes an alarm configured to alarm when one or more of the following conditions are met: When the detection unit detects that the positioning groove and / or the positioning mark is not within the preset range; When the offset is greater than or equal to a preset offset threshold.

6. The detection device according to claim 1, wherein The detection unit includes: a transmitter, which transmits a detection signal to a preset range of the substrate, and the angle between the detection signal and the normal of the positioning mark is greater than or equal to 15 degrees.

7. The detection device according to claim 1, wherein: The shape of the positioning mark includes: one or more of a circle, a square, an ellipse, a triangle, a polygon, and an arrow.

8. A wafer shift detection method, applied to a wafer shift detection device, characterized in that: The detection device comprises: Substrate, positioning mark, detection unit, collection unit, processing unit; The wafer has a positioning groove; The detection method comprises: The detection unit transmits a detection signal to a preset range of the substrate to detect whether the positioning groove and the positioning mark are located within the preset range; When the substrate within the preset range is detected by the detection unit, the acquisition unit obtains image information of the positioning groove and the positioning mark within the preset range, wherein the image information includes: position information of the positioning groove and position information of the positioning mark; The processing unit determines, based on the image information, an offset between an initial position of the wafer and a position of the wafer in the image information.

9. The detection method according to claim 8, wherein The detection unit includes: an alarm; The step of the detection unit transmitting a detection signal to a preset range of the substrate to detect whether the positioning groove and the positioning mark are located within the preset range includes: When the detection unit detects that the positioning groove and / or the positioning mark is not within the preset range, the alarm device sounds an alarm; The step of determining, by the processing unit, an offset between an initial position of the wafer and a position of the wafer in the image information based on the image information includes: When the offset is greater than or equal to a preset offset threshold, the alarm sounds an alarm.

10. The detection method according to claim 8, wherein The detection device further includes: a fixing ring; Before the detection unit transmits a detection signal to a preset range of the substrate to detect whether the positioning groove and the positioning mark are located within the preset range, the detection method further includes: Formulate a preset offset threshold value between the positioning mark and the positioning groove; placing the substrate on the fixing ring; Placing the wafer on the substrate exposed in the fixing ring, with a distance between the positioning groove of the wafer and the inner wall of the fixing ring; The positioning mark is arranged on the substrate exposed between the wafer positioning groove and the inner wall of the fixing ring according to the preset offset threshold and the distance, and is opposite to the positioning groove of the wafer.

Images