Semiconductor humidification device and battery pack including the same

Abstract

The invention relates to a semiconductor humidifying device, which comprises a semiconductor chip, a condensation piece, a heat dissipation piece, a condensed water collection device and a controller. The semiconductor humidifying device is configured to be capable of adjusting the temperature of a device shell when the humidity of the external environment where the device shell is located is higher than a first humidity threshold value and / or the difference value between the actual temperature and the dew point temperature is lower than a first temperature difference threshold value; the current is controlled to flow through the semiconductor sheet along the first direction, so that the semiconductor humidity adjusting device enters a dehumidification mode in which water vapor in ambient air is condensed and collected in the condensed water collecting device; when the humidity of the external environment where the device shell is located is lower than a second humidity threshold value and / or the difference value between the actual temperature and the dew point temperature is higher than a second temperature difference threshold value, the current is controlled to flow through the semiconductor chip in the second direction; condensate water is heated and gasified, is discharged out of the device shell through the air vent, and then is discharged out of the external environment. The invention also relates to a battery pack comprising the semiconductor humidifying device.

Description

Technical Field

[0001] The present invention relates to the technical field of humidity control devices, and more specifically, to a semiconductor humidity control device for controlling humidity in a battery pack and a battery pack including the semiconductor humidity control device, wherein the battery pack is particularly a battery pack for a pure electric vehicle. Background Art

[0002] Condensation in battery packs, especially those of pure electric vehicles (BEVs), is a common problem faced by all original equipment manufacturers (OEMs). In low-latitude areas like Guangzhou, the ambient relative humidity cloud cover reaches 90% or more in the summer. The humid air will exchange with the air in the battery pack through the vents and eventually fill the battery pack with the same humid air. When the weather is hot, in order to keep the battery in good working condition, the cooling system inside the battery pack will start working, especially in the case of fast charging. In order to ensure the power of fast charging, the water cooling system will often run at high power. These measures create safe conditions for the battery, but there is also a risk of condensation if the surface temperature on the battery or cooling plate cools to the dew point under high ambient humidity.

[0003] Once moisture in the air condenses into water on the copper rod or any electrical and electronic equipment, it will affect the creepage distance, causing safety issues or interfering with the normal operation of the battery. To avoid condensation, the general solution is to cut or reduce the cooling power so that the temperature of the battery does not fall below the dew point. However, this strategy also limits the charging power, so drivers need to spend more time charging their cars. Another solution is to place a humidity control sheet inside the battery pack. The humidity control sheet is made of natural plant fibers and polymer materials and is designed to balance humidity, so the humidity control sheet can absorb moisture from the air in a high humidity environment and desorb when the ambient humidity is lower than its designed balance value. These humidity control sheets are widely used by battery suppliers such as CATL, but it is also challenged because it has a short life of only 5-6 years. Summary of the invention

[0004] The purpose of the present invention is to solve some or all of the above-mentioned defects and / or other defects existing in the prior art. In particular, the present invention provides a semiconductor humidity control device and a battery pack including the semiconductor humidity control device. The semiconductor humidity control device is particularly suitable for dehumidification in a battery pack and has a long service life.

[0005] To this end, according to one aspect of the present invention, there is provided a semiconductor humidity control device, comprising:

[0006] a device housing having a vent and a heat dissipation opening;

[0007] a semiconductor chip disposed in the device housing, the semiconductor chip having a first side and a second side opposite to the first side, wherein the semiconductor chip is configured such that when current flows through the semiconductor chip in a first direction, the first side forms a cold end and the second side forms a hot end, and when current flows through the semiconductor chip in a second direction opposite to the first direction, the first side forms a hot end and the second side forms a cold end;

[0008] a condensation member disposed within the device housing and thermally attachable to the first side of the semiconductor die so that water vapor in ambient air can condense on the condensation member when the first side acts as a cold end;

[0009] a heat sink at least partially disposed within the device housing and capable of being thermally attached to the second side of the semiconductor die, wherein the heat sink is capable of releasing heat to the outside of the device housing via the heat dissipation opening;

[0010] a condensate collecting device disposed in the device housing, which is in communication with the condensation member so as to receive condensate from the condensation member, wherein the condensate collecting device and the condensation member are positioned so that the condensation member can transfer heat with the condensate collected in the condensate collecting device so as to vaporize the condensate; and

[0011] A controller configured to: when the humidity in the external environment where the device shell is located is higher than a first humidity threshold and / or the difference between the actual temperature and the dew point temperature is lower than a first temperature difference threshold, control the current to flow through the semiconductor chip along the first direction so that the semiconductor humidity control device enters a dehumidification mode in which water vapor in the ambient air condenses and is collected in the condensed water collection device; and when the humidity in the external environment where the device shell is located is lower than a second humidity threshold and / or the difference between the actual temperature and the dew point temperature is higher than a second temperature difference threshold, control the current to flow through the semiconductor chip along the second direction so that the semiconductor humidity control device enters a dehumidification mode in which the condensed water is heated and vaporized and discharged out of the device shell through the vent and then discharged out of the external environment through the breathable structure of the external environment.

[0012] Preferably, the condensed water collecting device comprises a collecting container and a regenerable hygroscopic material located in the collecting container, wherein the hygroscopic material is selected to absorb the condensed water in the dehumidification mode and release the condensed water in the form of water vapor in the dehumidification mode.

[0013] Preferably, the semiconductor sheet, the heat sink, the condensation sheet and the condensation water collecting device are all arranged vertically, and the condensation water collecting device is connected to the condensation sheet near the lower end of the condensation sheet, wherein the condensation sheet comprises: a U-shaped plate, which comprises an intermediate plate and two end plates at the lateral ends of the intermediate plate, the two end plates extending in a direction away from the semiconductor sheet, the intermediate plate having a first side surface attached to a first side of the semiconductor sheet and a second side surface opposite to the first side surface; and a guide portion arranged on the second side surface of the intermediate plate, the guide portion being configured to guide the condensation water on the condensation sheet toward the lower end and thus toward the condensation water collecting device.

[0014] Preferably, the guide portion includes a plurality of ridges extending from the second side of the middle plate in a direction away from the first side, and the plurality of ridges extend vertically between the lower end and the upper end in parallel with the two end plates and are laterally spaced apart from each other, so that the plurality of ridges together with the two end plates form a fin-like structure.

[0015] Preferably, the collecting container comprises a rectangular bottom, a U-shaped side wall extending vertically upward from three adjacent sides of the rectangular bottom, and a plurality of rectangular strips extending from the middle wall of the U-shaped side wall toward the opposite side thereof parallel to the rectangular bottom near the top end, the plurality of rectangular strips are distributed along the length of the middle wall defined by the two end walls of the U-shaped side wall, and are spaced apart from each other, thereby forming a top of the collecting container in the form of a grid-like structure, wherein the condensation piece and the condensation water collecting device are arranged to be embedded in each other, wherein the condensation piece is placed as a whole on the condensation water collecting device The U-shaped plate is disposed on a rectangular bottom, and each end plate of the U-shaped plate overlaps with a corresponding end wall of the U-shaped side wall, so that the U-shaped plate and the U-shaped side wall jointly define a cylindrical side wall with a roughly rectangular cross-section, wherein the multiple rectangular bars of the grid-like structure and the multiple ridges of the fin-like structure are alternately arranged so that each of the rectangular bars is inserted between two corresponding adjacent ridges, wherein there is a gap between each rectangular bar and each adjacent ridge, and the gap allows condensed water and water vapor to pass through it to enter and exit the interior of the collection container, but prevents the hygroscopic material in the collection container from passing through it.

[0016] Preferably, the semiconductor humidity control device also includes at least one of the following: a fan located inside the device housing between the vent and the condensation element; a temperature sensor attached to the first side of the condensation element for detecting the temperature of the surface of the condensation element; and a temperature and humidity sensor arranged outside the device housing.

[0017] Preferably, the controller is also configured to calculate the dew point temperature in the external environment based on the measured values ​​of temperature and humidity in the external environment received from the temperature and humidity sensor, and calculate the difference between the dew point temperature and the actual temperature in real time.

[0018] Preferably, the controller includes a main control module and a power control module communicatively connected to the main control module, wherein the controller is also configured to enable the main control module to establish a temperature and humidity correlation model based on the measured values ​​of temperature and humidity in the external environment received from the temperature and humidity sensor and the measured value of the temperature of the surface of the condensation piece received from the temperature sensor, and to enable the power control module to control the power of the semiconductor chip and thus the temperature of the surface of the condensation piece in a closed loop based on the temperature and humidity correlation model.

[0019] Preferably, the controller is further configured to enable the power control module to control the power of the motor of the fan in an open loop based on the temperature and humidity correlation model.

[0020] Preferably, the first humidity threshold is 70%, more preferably 50%.

[0021] Preferably, the first temperature difference threshold is 5°C.

[0022] Preferably, the second humidity threshold is 35%.

[0023] Preferably, the second temperature difference threshold is 15°C.

[0024] According to another aspect of the present invention, a battery pack is provided, comprising: a battery pack shell, the battery pack shell having a breathable valve on at least a portion thereof that allows gas but prevents liquids and solids from passing through the breathable valve into and out of the battery pack shell; a battery management system located in the battery pack shell; a battery module; and the above-mentioned semiconductor humidity control device located in the battery pack shell.

[0025] The semiconductor humidity control device of the present invention and the battery pack including the semiconductor humidity control device can achieve the following technical effects:

[0026] When the humidity in the external environment where the shell is located, such as a battery pack, is higher than a first humidity threshold and / or the difference between the actual temperature and the dew point temperature is lower than a first temperature difference threshold, current is caused to flow through the semiconductor chip along the first direction to put the semiconductor humidity control device into a dehumidification mode, and when the humidity in the external environment where the shell is located is lower than a second humidity threshold and / or the difference between the actual temperature and the dew point temperature is higher than a second temperature difference threshold, current is caused to flow through the semiconductor chip along the opposite second direction to put the semiconductor humidity control device into a dehumidification mode, thereby discharging the condensed water stored in the condensed water collection device out of the device shell through the vent of the device shell in the form of water vapor and then discharging it out of the battery pack through, for example, a breathable valve on the battery pack shell, thereby achieving a dehumidification effect on the external environment where the semiconductor humidity control device is located, such as inside the battery pack.

[0027] In addition, since the condensed water collected by the condensed water collection device has been discharged in the form of water vapor in the dehumidification mode, the condensed water collection device can be regenerated repeatedly and continue to collect condensed water in the next dehumidification mode, which greatly extends the service life of the semiconductor humidity control device.

[0028] In addition, the present invention makes full use of the air valve of the battery pack shell itself, such as a semi-permeable membrane, to discharge condensed water in the form of water vapor outside the battery pack in the dehumidification mode, which makes full use of the air permeability of the battery pack shell itself to complete the dehumidification process. Therefore, the semiconductor humidity control device of the present invention is particularly suitable for continuous dehumidification of battery packs, especially battery packs of pure electric vehicles. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] Objects, advantages and features according to the present invention will become more apparent in the following detailed description of embodiments of the present invention given by way of non-limiting example with reference to the accompanying drawings, in which:

[0030] Figure 1 A schematic diagram of a battery pack according to an exemplary embodiment of the present invention is shown.

[0031] Figure 2a A schematic diagram of a semiconductor humidity control device according to an exemplary embodiment of the present invention is shown;

[0032] Figure 2b Shows Figure 2a A left side external view of the semiconductor humidity control device shown;

[0033] Figure 3 Shows Figure 2a A schematic diagram of a semiconductor chip in a semiconductor humidity control device shown;

[0034] Figure 4 Shows Figure 2a A schematic diagram of a condensing element in a semiconductor humidity control device shown;

[0035] Figure 5 Shows Figure 2a A schematic diagram of a condensed water collection device in a semiconductor humidity control device shown;

[0036] Figure 6 A perspective view showing the assembled condensation element and condensate collection device;

[0037] Figures 7a to 7c The front view, left view and top view of the assembled condensation element and condensation water collecting device are respectively shown;

[0038] Figure 8 Shows Figure 2a A top view of an embodiment of a heat sink in a semiconductor humidity control device;

[0039] Fig. 9 A flow chart showing how a controller of a semiconductor humidity control device according to an exemplary embodiment of the present invention switches between a dehumidification mode and a dehumidification mode is shown;

[0040] Fig.10 A flow chart showing how the controller of the semiconductor humidity control device according to an exemplary embodiment of the present invention controls the power of the semiconductor chip in a closed loop and controls the power of the fan motor in an open loop; and

[0041] Fig.11 A control flow chart showing a battery pack including a semiconductor humidity control device according to an exemplary embodiment of the present invention is shown. DETAILED DESCRIPTION

[0042] A semiconductor humidity control device according to an embodiment of the present invention and a battery pack including the semiconductor humidity control device are described below with reference to the accompanying drawings. In the following description, many specific details are set forth so that those skilled in the art can have a more comprehensive understanding of the present invention. However, it is obvious to those skilled in the art that the present invention may be implemented without some of these specific details. In addition, it should be understood that the present invention is not limited to the specific embodiments described. On the contrary, the present invention may be implemented with any combination of the following features and elements, regardless of whether they relate to different embodiments. Therefore, unless explicitly stated in the claims, the following features, embodiments and advantages are for illustrative purposes only and should not be regarded as elements or limitations of the claims.

[0043] Figure 1A battery pack 2000 according to an embodiment of the present invention is shown, which includes a battery pack housing 2100, a battery management system (BMS) 2200 located in the battery pack housing 2100, a power module / battery module 2300, a communication module, and a semiconductor humidity control device 1000 located in the battery pack housing 2100. The battery pack housing 2100 has at least one breathable valve 2110 on at least a portion thereof, for example, on one side wall thereof, which allows gas to pass through but prevents liquid and solid from entering and exiting the battery pack housing 2100. The breathable valve 2110 is, for example, in the form of a semipermeable membrane. Preferably, the semipermeable membrane may be made of expanded polytetrafluoroethylene (e-PTFE).

[0044] Despite Figure 1 In the embodiment shown, the vent valve 2110 is disposed at one of the battery pack housings 2100 (at Figure 1 However, it should be understood that the air valve 2110 may be disposed at any suitable position on the battery pack housing 2100, and the number thereof may vary, as long as they can achieve gas communication between the interior of the battery pack and the external environment.

[0045] Preferably, if Figure 1 As shown, the semiconductor humidity control device 1000 is arranged inside the battery pack housing 2100 near one of the air permeable valves 2110, and preferably, the position of the semiconductor humidity control device 1000 inside the battery pack housing 2100 is determined so that the semiconductor humidity control device 1000 can be in direct contact with the battery pack housing 2100. More preferably, the semiconductor humidity control device 1000 can be thermally bonded to the inner wall of the battery pack housing 2100 by means of a thermally conductive adhesive 2400 to improve the thermal conductivity between the semiconductor humidity control device 1000 and the battery pack housing 2100, thereby facilitating the release of heat.

[0046] It should be understood that, depending on the design and arrangement of different types of battery packs, the position of the semiconductor humidity control device 1000 in the battery pack shell 2100, for example, the distance between it and any other components in the battery pack 2000 such as a breathable valve, may vary, as long as the size of the battery pack meets the installation space of the semiconductor humidity control device 1000.

[0047] In addition, despite Figure 1 As shown in the figure, the semiconductor humidity control device 1000 is bonded to the inner wall of the battery pack housing 2100 by means of a thermally conductive adhesive 2400, but it should be understood that any suitable connection mechanism can be used to connect the semiconductor humidity control device 1000 to the battery pack housing 2100. Other suitable connection mechanisms include, but are not limited to, screw connection mechanisms, hook and loop connection mechanisms, rivet connection mechanisms, and the like.

[0048] like Figure 2a and2b As shown, preferably, in this embodiment, the semiconductor humidity control device 1000 includes a device housing 1100, and the device housing 1100 has a vent 1110 and a heat dissipation opening 1120. The vent 1110 is, for example, in the form of an air intake grille, a hole on a porous plate, a single opening, etc. Preferably, the device housing 1100 may be, for example, in the shape of a substantially rectangular parallelepiped, and preferably has rounded corners. Preferably, the vent 1110 and the heat dissipation opening 1120 may be respectively arranged on two opposite sides of the device housing 1100. However, it should be understood that the shape of the device housing 1100 is not limited to a substantially rectangular parallelepiped shape, and it may also be any other suitable shape, for example, it may be in the shape of a cube, an oval, a sphere, etc.

[0049] In this embodiment, the semiconductor humidity control device 1000 may further include the following parts:

[0050] - a semiconductor chip 1200 disposed in the device housing 1100, having a first side and a second side opposite to the first side, wherein the semiconductor chip 1200 is configured such that when current flows through it in a first direction, the first side thereof forms a cold end and the second side thereof forms a hot end, and when current flows through it in a second direction opposite to the first direction, the first side thereof forms a hot end and the second side thereof forms a cold end;

[0051] - a condensation member 1300 disposed in the device housing 1100, which can be thermally attached to the first side of the semiconductor chip 1200, so that water vapor in the ambient air can condense on the condensation member 1300 when the first side acts as a cold end. The condensation member 1300 can be bonded to the semiconductor chip 1200 by a thermally conductive adhesive 1920, for example;

[0052] - a heat sink 1400 at least partially disposed in the device housing 1100, which can be thermally attached to the second side of the semiconductor chip 1200, wherein the heat sink 1400 can release heat to the outside of the device housing 1100 via the heat dissipation opening 1120, preferably, the heat sink 1400 can be inserted into the heat dissipation opening 1120 in a matching manner with the heat dissipation opening 1120, and a portion of the heat sink 1400 can extend out of the heat dissipation opening 1120 and thus the device housing 1100 ( Figure 2a and 2b ), preferably, the heat sink 1400 can be bonded to the semiconductor chip 1200 by a thermally conductive adhesive 1920;

[0053] - a condensate collecting device 1500 disposed in the device housing 1100, which is in communication with the condensation member 1300 so as to receive condensate from the condensation member 1300, and the positions of the condensate collecting device 1500 and the condensation member 1300 are determined so that the condensation member 1300 can transfer heat with the condensate collected in the condensate collecting device 1500 to vaporize the condensate; and

[0054] - A controller 1600 configured to:

[0055] When the humidity in the external environment (in this case, the internal environment of the battery pack) of the device housing 1100 is higher than the first humidity threshold and / or the difference between the actual temperature and the dew point temperature is lower than the first temperature difference threshold, the current is controlled to flow through the semiconductor chip 1200 in the first direction so that the semiconductor humidity control device 1000 enters a dehumidification mode in which water vapor in the ambient air is condensed and collected in the condensed water collection device 1500; and

[0056] When the humidity in the external environment where the device housing 1100 is located is lower than the second humidity threshold and / or the difference between the actual temperature and the dew point temperature is higher than the second temperature difference threshold, the control current flows through the semiconductor chip 1200 along the second direction, so that the semiconductor humidity control device 1000 enters a dehumidification mode in which condensed water is heated and vaporized and discharged out of the device housing 1100 through the vent 1110 and then discharged out of the external environment.

[0057] As an example, preferably, the first humidity threshold may be in the range of about 75% to about 48%, preferably about 70%, and more preferably about 50%. The second humidity threshold is preferably in the range of about 30% to about 38%, and more preferably about 35%. Generally speaking, safe humidity control below 50% can ensure that no condensation occurs at the temperature of most battery operating conditions. In addition, controlling the second humidity threshold at about 35% can ensure that the humidity in the battery pack after dehumidification will not exceed 50% due to excessive fluctuations.

[0058] In addition, the first temperature difference threshold is preferably in the range of about 4°C to about 6°C, more preferably about 5°C. The second temperature difference threshold is preferably in the range of about 8°C to about 15°C, more preferably about 15°C or about 10°C.

[0059] This embodiment determines that there is a risk of condensation in the battery pack when the humidity in the battery pack where the device housing 1100 is located is higher than a first humidity threshold, such as 70% or 50% and / or the difference between the actual temperature and the dew point temperature is lower than a first temperature difference threshold, such as 5°C. At this time, the current is controlled to flow through the semiconductor chip 1200 in a first direction to make the semiconductor humidity control device 1000 enter a dehumidification mode in which water vapor in the ambient air condenses and is collected in the condensed water collection device 1500, so as to reduce the humidity in the battery pack and increase the temperature in the battery pack. When the humidity in the battery pack is lower than the second humidity threshold, such as 35%, and / or the difference between the actual temperature and the dew point temperature is higher than the second temperature difference threshold, such as 15°C, it is determined that the humidity in the battery pack after dehumidification will not exceed the first humidity threshold due to excessive fluctuations. At this time, the control current flows through the semiconductor chip 1200 in the second direction, so that the semiconductor humidity control device 1000 enters a dehumidification mode in which the condensed water is heated and vaporized and discharged from the device housing 1100 through the vent 1110 and then discharged from the battery pack. The second humidity threshold and / or the second temperature difference threshold ensure that even if the condensed water in the condensed water collection device is discharged in the form of steam in the dehumidification mode, the humidity in the battery pack will not be as high as the first humidity threshold and / or the temperature difference will be less than the first temperature difference threshold. In this way, the condensed water in the condensed water collection device can be discharged in the form of water vapor, or even emptied, so that it can continue to collect condensed water in the next dehumidification mode in an even empty state without causing the condensed water to overflow.

[0060] Preferably, if Figure 2a As shown, the semiconductor humidity control device 1000 may also include a fan 1700 located in the device housing 1100 between the vent and the condensation member 1300, and the fan 1700 may include a motor 1710 and at least two blades 1720 distributed around the motor 1710. The fan 1700 may be arranged opposite to the vent 1110 and the condensation member 1300 on the device housing 1100 to achieve forced convection of gas between the interior of the device housing 1100 and the internal environment of the battery pack in which it is located. Of course, the position of the fan 1700 may be changed as long as it can achieve convection of gas between the interior of the device housing 1100 and the internal environment of the battery pack in which it is located.

[0061] Preferably, if Figure 2aAs shown, the semiconductor humidity control device 1000 may also include a temperature sensor 1910 attached to the first side of the condensation element 1300, for detecting the temperature of the surface of the condensation element 1300, or the cold end temperature. The temperature sensor 1910 is, for example, in the form of an NTC temperature probe, which can be attached to the surface of the first side of the condensation element 1300, and is preferably arranged on the first side of the condensation element 1300 at the upper end to reduce the obstruction to the flow of condensed water. The temperature sensor 1910 can transmit the temperature of the surface of the condensation element 1300 to the controller 1600 in real time, so that the controller 1600 can adjust the temperature of the condensation surface according to the received real-time temperature, for example, by adjusting the power of the semiconductor chip 1200 in real time.

[0062] Preferably, if Figure 2a As shown, the semiconductor humidity control device 1000 may also include a temperature and humidity sensor 1800 disposed outside the device housing 1100, for detecting the temperature and humidity in the external environment (in this case, the internal environment of the battery pack) in which the semiconductor humidity control device 1000 is located. The temperature and humidity sensor 1800 may be attached to the outer surface of the device housing 1100 or may be at least partially embedded in the thickness of the device housing 1100. Of course, the temperature and humidity sensor 1800 may not be disposed on the device housing 1100, but may be disposed at any other suitable position in the battery pack, as long as it can detect the temperature and humidity in the battery pack and transmit the detected temperature and humidity to the controller 1600 of the semiconductor humidity control device 1000, which all fall within the protection scope of the present invention.

[0063] like Figure 3 As shown, in a specific embodiment, preferably, the semiconductor sheet 1200 is formed by stacking a plurality of N-type and P-type semiconductor particles, and the N-type semiconductor particles and the P-type semiconductor particles are interconnected by a general conductor 1210 (usually copper, aluminum or other metal conductors) to form a complete circuit, and finally sandwiched between a first ceramic sheet 1220 and a second ceramic sheet 1230 like a sandwich, wherein the two ceramic sheets are insulated and have good thermal conductivity.

[0064] During operation, when the current flows in the first direction ( Figure 3 When the current flows through the circuit in a second direction (clockwise in the figure), the first ceramic sheet 1220 forms a cold end and the second ceramic sheet 1230 forms a hot end (i.e., Peltier effect), and when the current flows in a second direction (clockwise in the figure) opposite to the first direction, Figure 3 When the heat (counterclockwise in the figure) flows through the circuit, the first ceramic sheet 1220 forms a hot end and the second ceramic sheet 1230 forms a cold end. In this case, the condensation member 1300 is attached to the first ceramic sheet 1220 and the heat dissipation member 1400 is attached to the second ceramic sheet 1230.

[0065] like Figure 1 The semiconductor chip 1200, heat sink 1400, condensation element 1300 and condensation water collecting device 1500 shown in the figure can all be arranged vertically, and the condensation water collecting device 1500 can be connected to the condensation element 1300 near the lower end of the condensation element 1300, so that the condensation water can flow from the condensation element 1300 to the condensation water collecting device 1500 under the action of its own gravity.

[0066] Preferably, if Figure 4 As shown, the condensation member 1300 includes a U-shaped plate and a guide portion. Preferably, the U-shaped plate may include an intermediate plate 1310 and two end plates 1320 at both ends of the intermediate plate 1310 in the transverse direction, the two end plates 1320 extending in a direction away from the semiconductor chip 1200, and the intermediate plate 1310 having a first side surface attached to the first side of the semiconductor chip 1200 and a second side surface opposite to the first side surface. The two end plates 1320 may be formed integrally with the intermediate plate 1310 or may be formed separately from the intermediate plate 1310 and then connected to the intermediate plate 1310 by a suitable connection method such as screw connection, adhesive connection, etc., as long as they can form a final U-shaped plate. In addition, the guide portion is provided on the second side surface of the intermediate plate 1310, and is preferably configured to guide the condensed water on the condensation member 1300 toward the lower end and thus toward the condensed water collection device 1500, thereby increasing the rate at which the condensed water flows into the condensed water collection device 1500.

[0067] In a specific example, preferably, Figure 4 As shown, the guide portion may include a plurality of ridges 1330 extending from the second side of the middle plate 1310 in a direction away from the first side, the plurality of ridges 1330 extending vertically between the lower end and the upper end parallel to the two end plates 1320 and spaced apart from each other laterally, so that the plurality of ridges 1330 together with the two end plates 1320 form a fin-like structure, so that a guide groove for guiding condensed water to flow into the condensed water collection device 1500 can be formed between each end plate 1320 and its adjacent ridge 1330 and between two adjacent ridges 1330. Obviously, the guide portion can not only play a role in guiding flow, but also play a role in increasing the condensation area when the air contacts, thereby further improving the condensation efficiency and achieving a better dehumidification effect.

[0068] It is contemplated that the plurality of ridges 1330 may be as Figure 4 As shown, it extends along the entire height of the middle plate 1310, but it may also extend along only a portion of the height of the middle plate 1310 (not shown), as long as the flow guiding effect can be achieved.

[0069] In addition, despite the Figure 4The guide portion is shown in the form of a plurality of ridges 1330, but it should be understood that the guide portion may also be in any other suitable form besides the ridges 1330 or the fin-like structure, and it should also be understood that the plurality of ridges 1330 may also be inclined relative to the vertical plane, that is, they may not be parallel to the two end plates 1320, as long as they can achieve the guide function.

[0070] Preferably, if Figure 5 As shown, the condensate collection device 1500 may include a collection container and a regenerable hygroscopic material 1550 located in the collection container, wherein the hygroscopic material 1550 is selected to absorb the condensate in the dehumidification mode and release the condensate in the form of water vapor in the dehumidification mode. The hygroscopic material 1550 may be, for example, one or more of a reversible desiccant, bentonite, silica aerogel, carbon molecular sieve, carbon aerogel adsorbent, and a water-absorbent resin. The hygroscopic material 1550 may be in a granular or other structure.

[0071] In this way, when in dehumidification mode, the liquid cores of condensed water on the condensation element increase and merge, and under the action of gravity, they gradually increase in size and exceed the static friction between them and the condensation surface. Under the action of gravity, water droplets will flow down along the surface of the condensation element and be collected by the condensation water collection device below and absorbed by the hygroscopic material in the collection container, making the hygroscopic material moist. At the same time, the condensed water will not exist freely in the collection container, which prevents the condensed water from flowing out of the collection container unintentionally.

[0072] When in the dehumidification mode, the condensing element becomes a hot end and heats the hygroscopic material around it, so that the moisture absorbed by the hygroscopic material evaporates back into the air, making the hygroscopic material dry and regenerated again for repeated use.

[0073] In one example, if Figure 5 As shown, the collecting container may include a rectangular bottom 1510, a U-shaped side wall extending vertically upward from three adjacent sides of the rectangular bottom 1510, and a plurality of rectangular bars 1540 extending from the middle wall 1520 of the U-shaped side wall toward its opposite side in parallel with the rectangular bottom 1510 near the top, wherein the plurality of rectangular bars 1540 are distributed along the length of the middle wall 1520 defined by the two end walls 1530 of the U-shaped side wall and are spaced apart from each other, thereby forming a top of the collecting container in the form of a grid-like structure. Preferably, the two rectangular bars 1540 at the two ends may also be spaced apart from the corresponding end wall 1530, and the spacing between two adjacent rectangular bars 1540 and between the rectangular bars 1540 and the end wall 1530 is preferably equal.

[0074] It should be understood that the collection container may also be in any other suitable shape and structure, as long as it can be installed in conjunction with the condensation member 1300 and can receive and collect the condensed water therein and can allow gas such as water vapor to leave therefrom. For example, the condensed water collection device 1500 may also be composed of controllable mechanical components such as valves and water tanks. In the dehumidification mode, the one-way valve can be opened inwardly to allow the condensed water to flow into the water tank for storage, and in the dehumidification mode, the one-way valve can be opened outwardly to release the water vapor.

[0075] In one example, when assembled together, the condensation member 1300 and the condensation water collection device 1500 are arranged to be embedded in each other, wherein the condensation member 1300 is placed as a whole on the rectangular bottom 1510 of the condensation water collection device 1500, and each end plate 1320 of the U-shaped plate overlaps with a corresponding one end wall 1530 of the U-shaped side wall, so that the U-shaped plate and the U-shaped side wall together define a cylindrical side wall with a substantially rectangular cross-section, wherein the plurality of rectangular bars 1540 of the grid-like structure and the plurality of ridges 1330 of the fin-like structure are alternately arranged so that each rectangular bar 1540 is inserted between corresponding adjacent two ridges 1330, wherein there is a slight gap ( Figure 7c ), this gap allows condensed water and water vapor to enter and exit the collection container through it, but prevents the hygroscopic material 1550 in the collection container from passing through it, thereby allowing condensed water droplets and water vapor to enter or leave the collection container through the gap, and preventing the hygroscopic material 1550 from leaving the gap, thereby keeping the hygroscopic material 1550 and the condensed water absorbed by it inside the collection container.

[0076] For example, in an alternative embodiment, the condensate collecting device 1500 may further include a container wall arranged opposite to the middle wall 1520, so that it can surround a cylindrical side wall with a rectangular cross-section. In this case, when assembled together, the condensate member 1300 is placed on the rectangular bottom 1510 of the condensate collecting device 1500 as a whole and the middle plate 1310 is located inside the collecting container as a whole, and similarly, each end plate 1320 of the U-shaped plate overlaps with a corresponding end wall 1530 of the U-shaped side wall.

[0077] like Figure 8 As shown, the heat sink 1400 may, for example, include a plate-like body 1410 attached to the second side of the semiconductor chip 1200, and may preferably also include fins 1420 on a side of the plate-like body 1410 facing away from the semiconductor chip 1200. These fins 1420 may, for example, at least partially extend from the heat dissipation opening to the outside of the device housing 1100 to accelerate the heat dissipation speed.

[0078] Preferably, if Fig. 9As shown, the controller 1600 is also configured to calculate the dew point temperature in the external environment (in this case, the internal environment of the battery pack) based on the measured values ​​of temperature and humidity in the external environment received from the temperature and humidity sensor 1800, and calculate the difference between the dew point temperature and the actual temperature in real time.

[0079] As an example, the controller 1600 may calculate the dew point temperature based on the following formula:

[0080] T 露点 =(237.7*D) / (17.27-D) Formula 1

[0081] D=17.27*T / (237.7+RH)+ln(RH / 100) Formula 2

[0082] Where RH is the humidity measurement value, T is the temperature measurement value, and T 露点 is the dew point temperature.

[0083] In addition, the inventor surprisingly found that the dehumidification efficiency of the semiconductor humidity control device 1000 is strongly correlated with the cold end temperature. Figures 10 to 11 As shown, the controller 1600 may include a main control module and a power control module communicatively connected to the main control module, wherein the controller 1600 is also configured to enable the main control module to establish a temperature and humidity correlation model based on the measured values ​​of temperature and humidity in the external environment received from the temperature and humidity sensor 1800 and the measured value of the temperature of the surface of the condensation element 1300 received from the temperature sensor 1910, and to enable the power control module to control the power of the semiconductor chip 1200 and thus the temperature / cold end temperature of the surface of the condensation element 1300 in a closed loop based on the temperature and humidity correlation model.

[0084] In addition, the inventors surprisingly found that the dehumidification efficiency of the semiconductor humidity control device 1000 is also strongly correlated with the wind speed. Figures 10 to 11 As shown, the controller 1600 is further configured to enable the power control module to open-loop control the power / input current voltage / speed of the motor 1710 of the fan 1700 based on the temperature and humidity correlation model.

[0085] As an example, the main control module may establish a temperature and humidity association model according to the following formula based on the measured values ​​of the temperature and humidity inside the battery pack received from the temperature and humidity sensor 1800 and the measured value of the temperature on the surface of the condensation member 1300 received from the temperature sensor 1910:

[0086]

[0087]

[0088] Where J is the condensation rate, ΔT is the minimum subcooling required for condensation, and T s The temperature of the battery pack received by the main control module.

[0089] The minimum subcooling degree ΔT required for condensation can be calculated using formula 4, and the temperature of the condensation surface can be controlled according to the calculated ΔT value: T 冷凝件 =T s -ΔT. Fig.10 and 11 As shown, by controlling the temperature of the condensing element 1300, it can be operated in certain working modes, such as when the humidity has reached the set humidity but the user wants it to be turned on all the time to ensure that the humidity does not rise, then it can maintain the minimum temperature required for condensation at the lowest power.

[0090] Formula 2 can calculate the condensation rate J, which can be coupled with the evaporation formula discussed further below to give the estimated time to reach the set humidity or adjust the power, etc.

[0091] In addition, as an example, the main control module can use the following formula to adjust the power of the fan 1700 motor 1710:

[0092] g h = Θ A (x s - x) Formula 5

[0093] in,

[0094] g h = Evaporation per hour (kg / h)

[0095] Θ=(a+bv)=wind speed influence constant (kg / m 2 h)

[0096] v = wind speed (m / s)

[0097] A = liquid surface area (m 2 )

[0098] x s = Saturated absolute humidity (kg / kg) (kg of water per kg of dry air)

[0099] x = current absolute humidity (kg / kg) (kilograms of water per kilogram of dry air)

[0100] The two constants a and b required by Θ need to be determined through experiments, and then the relationship between wind speed and evaporation when the dehumidifier is in use can be established. In this way, by comparing the evaporation rate and condensation rate J, the optimal dehumidification efficiency can be achieved by adjusting the fan speed 1700 and the semiconductor power.

[0101] In a specific example, if Fig. 9As shown, the main control module receives the temperature and humidity in the battery pack from the temperature and humidity sensor 1800, and calculates the dew point temperature T based on the above formulas 1 and 2. 露点 , calculate the difference between the dew point temperature and the actual temperature, and compare the difference with the first temperature difference threshold value, such as 5°C and the second temperature difference threshold value, such as 15°C, and / or compare the measured humidity with the first humidity threshold value and the second humidity threshold value. When the actual temperature difference is less than the first temperature difference threshold value, such as 5°C, and / or when the measured humidity RH is greater than the first humidity threshold value, such as 70% or 50%, the main control module controls the semiconductor humidity control device 1000 to enter the dehumidification mode. When the temperature difference is greater than the second temperature difference threshold value, such as 15°C, and / or when the measured humidity RH is less than the second humidity threshold value, such as 35%, the main control module controls the semiconductor humidity control device 1000 to enter the dehumidification mode.

[0102] As a preferred embodiment, Fig.10 and 11 As shown, the power of the semiconductor chip 1200 and the power of the motor 1710 of the fan 1700 are adjusted in the following manner:

[0103] -The battery pack temperature and humidity sensor 1800 collects the ambient temperature and humidity inside the battery pack and transmits them to the main control module for processing and generating control signals for the power control module.

[0104] -The main control module calculates the power required by the semiconductor chip 1200 and the fan 1700 based on the known temperature and humidity signals.

[0105] The power control module receives commands from the main control module and adjusts the power / input voltage and current of the semiconductor chip 1200 and the motor 1710 of the fan 1700 .

[0106] -The semiconductor wafer 1200 creates a cold end, causing water vapor in the air to condense.

[0107] -The temperature sensor 1910 of the condensation element 1300 collects the cold end temperature of the condensation element 1300, that is, the semiconductor chip 1200, and transmits it to the main control module for processing and calculation of the optimal power of the semiconductor chip 1200 or the motor of the fan 1700.

[0108] -The battery management system is connected to the main control module through the power module / battery module and the communication module, where the power module performs voltage boost / voltage reduction and the communication module performs the corresponding analog-to-digital conversion.

[0109] In summary, the semiconductor humidity control device 1000 of the present invention and the battery pack including the semiconductor humidity control device 1000 can achieve the following technical effects:

[0110] When the humidity in the external environment where the shell is located, such as a battery pack, is higher than a first humidity threshold and / or the difference between the actual temperature and the dew point temperature is lower than a first temperature difference threshold, current is caused to flow through the semiconductor chip 1200 along the first direction to enable the semiconductor humidity control device 1000 to enter a dehumidification mode, and when the humidity in the external environment where the shell is located is lower than a second humidity threshold and / or the difference between the actual temperature and the dew point temperature is higher than a second temperature difference threshold, current is caused to flow through the semiconductor chip 1200 along the opposite second direction to enable the semiconductor humidity control device 1000 to enter a dehumidification mode, thereby discharging the condensed water stored in the condensed water collection device 1500 in the form of water vapor through the vent 1110 of the device shell 1100 to the outside of the device shell 1100 and then through, for example, a breathable valve on the battery pack shell to the outside of the battery pack, thereby achieving a dehumidification effect on the external environment where the semiconductor humidity control device 1000 is located, such as inside a battery pack.

[0111] In addition, since the condensed water collected by the condensed water collection device 1500 has been discharged in the form of water vapor in the dehumidification mode, the condensed water collection device 1500 can be repeatedly regenerated and continue to collect condensed water in the next dehumidification mode. Therefore, the semiconductor humidity control device 1000 of the present invention is particularly suitable for continuous dehumidification of battery packs of pure electric vehicles.

[0112] Although the above embodiments are all described with respect to a battery pack, it should be understood that the semiconductor humidity control device 1000 of the present invention can be used in other external environments to dehumidify the external environment in which it is located.

[0113] Furthermore, in this document, the term "comprising" does not exclude other elements or steps. A single unit or step may fulfill the functions of several features recited in the claims. The mere fact that certain measures are recited in mutually different dependent claims does not indicate that a combination of these measures cannot be used to advantage. The terms "about", "approximately" etc. in conjunction with an attribute or a value in particular also explicitly define the attribute or explicitly define the value, respectively. The term "about" in the context of a given value or range refers, for example, to a value or range within 20%, within 10%, within 5% or within 2% of the given value or range.

[0114] The embodiments described herein are for illustrative purposes only and are not intended to limit the scope of the claims. It should be understood that various modifications or changes obvious to those skilled in the art are within the spirit and scope of the present application and the scope of the appended claims.

[0115] It will be clear that various modifications and / or improvements and / or combinations obvious to a person skilled in the art may be made to the various embodiments of the invention described above without departing from the scope of the invention as defined by the appended claims.

Claims

1. A semiconductor humidity control device (1000), comprising: A device housing (1100) having a vent (1110) and a heat dissipation opening (1120); A semiconductor chip (1200) disposed in the device housing (1100), having a first side and a second side opposite to the first side, wherein the semiconductor chip (1200) is configured such that when current flows through it in a first direction, the first side forms a cold end and the second side forms a hot end, and when current flows through it in a second direction opposite to the first direction, the first side forms a hot end and the second side forms a cold end; A condensation member (1300) disposed within the device housing (1100) and capable of being thermally attached to a first side of the semiconductor chip (1200) so that water vapor in ambient air can condense on the condensation member (1300) when the first side acts as a cold end; a heat sink (1400) at least partially disposed within the device housing (1100) and capable of being thermally attached to the second side of the semiconductor chip (1200), wherein the heat sink (1400) can release heat to the outside of the device housing (1100) via the heat dissipation opening (1120); A condensed water collecting device (1500) is disposed in the device housing (1100), and is in communication with the condensation element (1300) so as to receive condensed water from the condensation element (1300). The positions of the condensed water collecting device (1500) and the condensation element (1300) are determined so that the condensation element (1300) can transfer heat with the condensed water collected in the condensed water collecting device (1500) so as to vaporize the condensed water. and A controller (1600) configured to: When the humidity in the external environment where the device housing (1100) is located is higher than a first humidity threshold and / or the difference between the actual temperature and the dew point temperature is lower than a first temperature difference threshold, the current is controlled to flow through the semiconductor chip (1200) along the first direction, so that the semiconductor humidity control device (1000) enters a dehumidification mode in which water vapor in the ambient air condenses and is collected in the condensed water collection device (1500); and When the humidity in the external environment where the device housing (1100) is located is lower than a second humidity threshold and / or the difference between the actual temperature and the dew point temperature is higher than a second temperature difference threshold, the control current flows through the semiconductor chip (1200) along the second direction, so that the semiconductor humidity control device (1000) enters a dehumidification mode in which the condensed water is heated and vaporized and discharged out of the device housing (1100) through the vent (1110) and then discharged out of the external environment through the breathable structure of the external environment.

2. The semiconductor humidity control device (1000) according to claim 1, wherein: The condensate collection device (1500) includes a collection container and a renewable hygroscopic material (1550) located in the collection container, wherein the hygroscopic material (1550) is selected to absorb the condensate in the dehumidification mode and release the condensate in the form of water vapor in the dehumidification mode.

3. The semiconductor humidity control device (1000) according to claim 2, wherein: The semiconductor chip (1200), the heat sink (1400), the condensation element (1300) and the condensation water collecting device (1500) are all arranged vertically, and the condensation water collecting device (1500) is connected to the condensation element (1300) near the lower end of the condensation element (1300), wherein the condensation element (1300) comprises: A U-shaped plate, comprising a middle plate (1310) and two end plates (1320) at both lateral ends of the middle plate (1310), wherein the two end plates (1320) extend in a direction away from the semiconductor chip (1200), and the middle plate (1310) has a first side surface attached to a first side of the semiconductor chip (1200) and a second side surface opposite to the first side surface; and A guide portion is provided on the second side surface of the intermediate plate (1310), and the guide portion is configured to guide the condensed water on the condensation member (1300) toward the lower end and thus toward the condensed water collecting device (1500).

4. The semiconductor humidity control device (1000) according to claim 3, wherein: The guide portion includes a plurality of ridges (1330) extending from the second side of the middle plate (1310) in a direction away from the first side, and the plurality of ridges (1330) extend vertically between the lower end and the upper end in parallel with the two end plates (1320) and are laterally spaced apart from each other, so that the plurality of ridges (1330) together with the two end plates (1320) form a fin-like structure.

5. The semiconductor humidity control device (1000) according to claim 4, wherein: The collecting container comprises a rectangular bottom (1510), a U-shaped side wall extending vertically upward from three adjacent sides of the rectangular bottom (1510), and a plurality of rectangular bars (1540) extending from a middle wall (1520) of the U-shaped side wall toward its opposite side parallel to the rectangular bottom (1510) near the top end, wherein the plurality of rectangular bars (1540) are distributed along the length of the middle wall (1520) defined by two end walls (1530) of the U-shaped side wall and are spaced apart from each other, thereby forming a top of the collecting container in the form of a grid-like structure. The condensation element (1300) and the condensation water collecting device (1500) are arranged to be embedded in each other, wherein the condensation element (1300) is placed as a whole on the rectangular bottom (1510) of the condensation water collecting device (1500), and each end plate (1320) of the U-shaped plate overlaps with a corresponding end wall (1530) of the U-shaped side wall, so that the U-shaped plate and the U-shaped side wall jointly define a cylindrical side wall with a roughly rectangular cross-section, wherein the multiple rectangular bars (1540) of the grid-like structure and the multiple ridges (1330) of the fin-like structure are arranged alternately so that each of the rectangular bars (1540) is inserted between corresponding two adjacent ridges (1330), wherein there is a gap between each rectangular bar (1540) and each adjacent ridge (1330), and the gap allows condensation water and water vapor to pass through it in and out of the interior of the collection container, but prevents the hygroscopic material (1550) in the collection container from passing through it.

6. The semiconductor humidity control device (1000) according to any one of claims 1 to 5, further comprising: a fan (1700) located within the device housing (1100) between the vent and the condensing member (1300); A temperature sensor (1910) attached to a first side of the condensation member (1300) for detecting a temperature of a surface of the condensation member (1300); and A temperature and humidity sensor (1800) is arranged outside the device housing (1100).

7. The semiconductor humidity control device (1000) according to claim 6, wherein: The controller (1600) is also configured to calculate the dew point temperature in the external environment based on the measured values ​​of temperature and humidity in the external environment received from the temperature and humidity sensor (1800), and calculate the difference between the dew point temperature and the actual temperature in real time.

8. The semiconductor humidity control device (1000) according to claim 6, wherein: The controller (1600) includes a main control module and a power control module communicatively connected to the main control module, wherein the controller (1600) is further configured to enable the main control module to establish a temperature and humidity correlation model based on the measured values ​​of temperature and humidity in the external environment received from the temperature and humidity sensor (1800) and the measured value of the temperature of the surface of the condensation piece (1300) received from the temperature sensor (1910), and to enable the power control module to control the power of the semiconductor chip (1200) and thus the temperature of the surface of the condensation piece (1300) in a closed loop based on the temperature and humidity correlation model.

9. The semiconductor humidity control device (1000) according to claim 8, wherein: The controller (1600) is also configured to enable the power control module to open-loop control the power of the motor (1710) of the fan (1700) based on the temperature and humidity correlation model.

10. The semiconductor humidity control device (1000) according to claim 1, wherein: The first humidity threshold is 50%; The first temperature difference threshold is 5°C; The second humidity threshold is 35%; and / or The second temperature difference threshold is 15°C.

11. A battery pack (2000), comprising: A battery pack housing (2100) having a vent valve (2110) on at least a portion thereof that allows gas but prevents liquids and solids from passing through the vent valve into and out of the battery pack housing; A battery management system (2200) located in the battery pack housing; Battery module (2300); and A semiconductor humidity control device (1000) according to any one of claims 1 to 10, located in the battery pack housing (2100).

Images