Chip active row feed network of dual-polarization meteorological radar

Abstract

The invention discloses a chip active row feed network of a dual-polarization weather radar, which comprises two sections of active comprehensive mother boards, the two sections of active comprehensive mother boards are connected through a crimping board, and the active row feed network has signal processing and signal transmission functions at the same time; a multifunctional chip, a multi-path differential transceiver chip, a direct current conversion module chip, a radio frequency dual-polarization transceiving interface, a monitoring interface, a wave control interface and a secondary power supply interface are respectively assembled on the front surface of each section of active comprehensive mother board, and an active channel interface is respectively assembled on the back surface of each section of active comprehensive mother board; the chips and the interfaces assembled on the two active integrated mother boards are symmetrical about the crimping board. According to the chip active row feed network of the dual-polarization meteorological radar, the use of a large number of functional module interconnection connectors and interconnection cable assemblies is reduced through interconnection between multiple layers of printed board signal layers and crimping interconnection of the crimping plates, and the interconnection cost is reduced.

Description

Technical Field

[0001] The invention belongs to the field of antenna and microwave technology, and in particular relates to a chip-based active line feed network of a dual-polarization weather radar. Background Art

[0002] Conventional weather radars emit electromagnetic waves in the horizontal direction, so the characteristics of precipitation particles detected by radar are more related to the characteristics of precipitation particles in the horizontal direction. However, in many cases, there are certain differences between the characteristics of precipitation particles in the horizontal direction and in the vertical direction. In order to detect the structure of precipitation particles more accurately, another polarization channel is added on the basis of conventional weather radars, which can be used to simultaneously detect the characteristics of precipitation particles in two directions. In this way, compared with conventional weather radars, dual-polarization meteorological radars can obtain more variables about the characteristics of precipitation particles.

[0003] The main implementation methods of the dual-polarization line feed network of the dual-polarization meteorological radar include slot waveguide, air plate line, power division module cascade, etc. Various line feed networks have their own characteristics, but they also have their own shortcomings. For example, the slot waveguide traveling wave array network leads to scanning blind spots due to waveguide dispersion; the slot waveguide standing wave array network is large in size, heavy in weight, and difficult to achieve ultra-low sidelobes; the network loss of air plate line, power division module cascade, etc. is large and the debugging work is complicated, which is not conducive to large-scale production. Summary of the invention

[0004] In order to solve the above problems, the present invention proposes a chip-based active line feed network for a dual-polarization meteorological radar, comprising two sections of active integrated motherboards, the two sections of active integrated motherboards being connected by a press-fit plate, and the active line feed network having both signal processing and signal transmission functions;

[0005] The front of each active integrated motherboard is equipped with a multifunctional chip, a multi-channel differential transceiver chip, a DC conversion module chip, a RF dual-polarization transceiver interface, a monitoring interface, a wave control interface, and a secondary power supply interface, and the back of each active integrated motherboard is equipped with an active channel interface; the chips and interfaces installed on the two active integrated motherboards are symmetrical about the crimping plate; the layout is partitioned, that is, different functional circuits are distributed in different local areas; the active channel interface is interconnected with the array antenna unit to realize the feeding of the dual-polarization antenna unit.

[0006] Specifically, the back of each section of the active integrated motherboard is also equipped with a resistor welding groove; the isolation resistor and the absorption resistor required by the radio frequency circuit are welded in the resistor welding groove, and after welding, the metal sheet is assembled on the surface.

[0007] Specifically, the RF dual-polarization transceiver interface includes a first RF dual-polarization transceiver interface, a second RF dual-polarization transceiver interface, a third RF dual-polarization transceiver interface, and a fourth RF dual-polarization transceiver interface, which correspond to two rows of dual-polarization transceiver networks respectively; the monitoring interface includes a first internal monitoring interface, a second internal monitoring interface, a third internal monitoring interface, and a fourth internal monitoring interface, which respectively monitor the amplitude and phase characteristics of the two rows of dual-polarization transceiver networks; the active channel interface feeds two adjacent rows of dual-polarization antenna units on the radar array respectively; the wave control interface includes a first wave control interface and a second wave control interface, which respectively realize the control of the multi-function chip and the multi-channel differential transceiver chip on the two sections of the first active integrated motherboard and the second active integrated motherboard; the secondary power supply interface includes a first secondary power supply interface and a second secondary power supply interface; respectively realize the bus level transmission of the DC conversion module chip on the two sections of the first active integrated motherboard and the second active integrated motherboard; after the pressing plate is pressed with the first active integrated motherboard and the second active integrated motherboard, the RF signal is interconnected in the inner layer.

[0008] Specifically, the active integrated motherboard and the press-fit plate are installed on a heat dissipation frame, and the heat dissipation frame is provided with heat dissipation bosses. The positions and shapes of the chips and interfaces on the active integrated motherboard are adapted to the recesses between the heat dissipation bosses, and heat conduction and heat dissipation are achieved by bonding the active integrated motherboard and the heat dissipation frame.

[0009] Specifically, the multifunctional chip combines phase shifting, attenuation, amplifier, switch, wave control, and receiving power modulation functions, and adopts quad flat leadless packaging technology;

[0010] The multi-channel differential transceiver chip realizes the control of differential signal conversion to single-ended signal, and the control chip T / R component in the multi-function chip realizes beam control;

[0011] The DC conversion module chip realizes +28V input, +3.3V and -5V voltage source output, and provides power to each module on the two active integrated motherboards. It adopts plastic package spherical array package, built-in input filter and noise cancellation circuit to realize low noise coupling.

[0012] Specifically, the active integrated motherboard uses the integrated backplane as a carrier, and the integrated backplane completes the transmission of RF transceiver signals, RF internal monitoring signals, antenna transceiver signals, wave control signals, and secondary power supply signals; in the three-dimensional structure, from top to bottom, there are low-frequency signal layers and RF signal layers;

[0013] The low-frequency signal layer realizes the formation and distribution of the secondary power supply signal and wave control signal of the active integrated motherboard. The low-frequency signal layer transmits low-frequency signals with a frequency not exceeding 1MHz.

[0014] The RF signal layer is used for RF signal transmission of the active integrated motherboard, including the transceiver network, internal monitoring network, and RF winding. The routing of the RF signal layer is in the form of stripline, and 1mm or 2mm stripline is selected to achieve it.

[0015] Specifically, the RF functions of the active integrated motherboard include: RF dual-polarization transceiver function and internal monitoring function; the RF dual-polarization transceiver function and the internal monitoring function are realized through two layers of strip lines, using the form of Wilkinson power divider cascaded and fed; a coupler with narrow-edge coupling design is used to realize the internal monitoring function; the isolation resistor and absorption resistor required for the RF circuit are welded in the form of printed circuit board cavity.

[0016] Specifically, the press-fit board is a double-layer printed board, one side of which has the same pattern as the radio frequency circuit layer pattern on the active integrated motherboard, and the other side is fully covered with copper.

[0017] Specifically, an "H"-shaped heat dissipation area is provided on the printed circuit board, and heat dissipation is achieved by contacting the heat-generating device and the printed circuit board through the heat dissipation skeleton.

[0018] Specifically, the press-fit plate and the active integrated motherboard are installed and fixed on the heat dissipation frame by screws.

[0019] Compared with the prior art, the present invention has the following advantages:

[0020] 1. Light weight: The chip-based active line feed network of the dual-polarization weather radar of the present invention is composed of a highly integrated active integrated motherboard and a press-fit board, so the weight is greatly reduced compared with the waveguide system or the power divider cascade system;

[0021] 2. Low cost: The chip-based active line feed network of the dual-polarization weather radar of the present invention adopts multi-layer board pressing technology and press-bonded board interconnection design, and realizes signal interconnection and transmission by vertical transition and printed line pressing, which greatly reduces interconnection equipment and reduces interconnection cost;

[0022] 3. Facilitates mass production: The chip-based active line feed network of the dual-polarization weather radar of the present invention can efficiently complete network assembly and testing using an automated assembly and testing system, greatly reducing manual work and improving overall production efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 FIG. 4 is a composition diagram of a chip-based active line feed network according to an embodiment of the present invention.

[0024] Figure 2 This is a diagram of a signal flow chart of an active integrated motherboard according to an embodiment of the present invention.

[0025] Figure 3 This is a view of the radio frequency signal layer of the active integrated motherboard according to an embodiment of the present invention.

[0026] Figure 4 It is a schematic diagram of the front layout of the active integrated motherboard according to an embodiment of the present invention.

[0027] Figure 5 It is a schematic diagram of the back layout of the active integrated motherboard according to an embodiment of the present invention.

[0028] Figure 6 Schematic diagram of a crimping plate according to an embodiment of the present invention.

[0029] Figure 7 The present invention is a schematic diagram of the interconnection between the active integrated motherboard and the press-fit board.

[0030] The markings in the figure are:

[0031] The first active integrated motherboard A1-1, the second active integrated motherboard A1-2, the pressing plate A2, the Wilkinson power divider D1, the heat dissipation skeleton G1, the integrated backplane M1, the multi-function chip M2, the multi-channel differential transceiver chip M3, the DC conversion module chip M4, the first RF dual-polarization transceiver interface P1-1, the second RF dual-polarization transceiver interface P2-1, the third RF dual-polarization transceiver interface P1-2, the fourth RF dual-polarization transceiver interface P2-2, the first internal monitoring interface P3-1, the second internal monitoring interface P4-1, the third internal monitoring interface P3-2, the fourth internal monitoring interface P4-2, the first to the second The thirty-second active channel interface H1-1~H32-1, the thirty-third to sixty-fourth active channel interfaces H1-2~H32-2, the sixty-fifth to ninety-sixth active channel interfaces V1-1~V32-1, the ninety-seventh to the twenty-eighth active channel interfaces V1-2~V32-2, the first wave control interface P5-1, the second wave control interface P5-2, the first secondary power supply interface P6-1, the second secondary power supply interface P6-2, "H"-shaped heat dissipation area Q1, the resistor welding groove Q2, the low-frequency signal layer S1, the radio frequency signal layer S2, the radio frequency transceiver signal X1, the radio frequency internal monitoring signal X2, the antenna transceiver signal X3. DETAILED DESCRIPTION

[0032] In order to facilitate understanding of the present application, the present application will be described more fully below with reference to the relevant drawings. Embodiments of the present application are provided in the drawings. However, the present application can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the present application more thorough and comprehensive.

[0033] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art to which this application belongs. The terms used herein in the specification of this application are only for the purpose of describing specific embodiments and are not intended to limit this application.

[0034] It can be understood that the terms "first", "second", etc. used in the present application can be used in this article to describe various elements, but these elements are not limited by these terms. These terms are only used to distinguish the first element from another element.

[0035] Spatially relative terms such as "under," "beneath," "below," "under," "above," "above," and the like may be used herein to describe the relationship of an element or feature shown in the figures to other elements or features. It should be understood that, in addition to the orientations shown in the figures, spatially relative terms also include different orientations of the device in use and operation. For example, if the device in the accompanying drawings is flipped, an element or feature described as "under other elements" or "under it" or "under it" will be oriented as being "above" the other elements or features. Thus, the exemplary terms "under" and "under" may include both upper and lower orientations. In addition, the device may also include additional orientations (e.g., rotated 90 degrees or other orientations), and the spatial descriptors used herein are interpreted accordingly.

[0036] It should be noted that when an element is considered to be "connected" to another element, it can be directly connected to the other element, or connected to the other element through an intermediate element. In addition, the "connection" in the following embodiments should be understood as "electrical connection", "communication connection", etc. if there is transmission of electrical signals or data between the connected objects.

[0037] When used herein, the singular forms "a", "an", and "said / the" may also include plural forms, unless the context clearly indicates otherwise. It should also be understood that the terms "include / comprise" or "have" and the like specify the presence of stated features, wholes, steps, operations, components, parts, or combinations thereof, but do not exclude the possibility of the presence or addition of one or more other features, wholes, steps, operations, components, parts, or combinations thereof. At the same time, the term "and / or" used in this specification includes any and all combinations of the relevant listed items.

[0038] In order to make the purpose, technical solution and advantages of the present application clearer, the present application is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application.

[0039] refer to Figure 1 The chip-based active line feed network composition diagram of a dual-polarization meteorological radar according to an embodiment of the present invention is composed of a first active integrated motherboard A1-1, a second active integrated motherboard A1-2, and a press-fit board A2, and has both signal processing and signal transmission functions.

[0040] The first active integrated motherboard A1-1 and the second active integrated motherboard A1-2 use multi-layer board lamination technology and vertical transition technology between signal layers to realize the processing and transmission of power signals, beam control signals, RF dual-polarization transceiver signals, and internal monitoring signals. In actual design, different layers of printed circuit boards are selected for lamination according to different functional requirements. The stacking design is low-frequency signal layer S1 and RF signal layer S2, such as Figure 2 shown.

[0041] like Figure 2As shown, the first active integrated motherboard A1-1 and the second active integrated motherboard A1-2 are both carried by the integrated backplane M1, and are equipped with multi-function chips M2, multi-channel differential transceiver chips M3, DC conversion module chips M4 and other devices on the surface, and the external interfaces include the first RF dual-polarization transceiver interface P1-1, the second RF dual-polarization transceiver interface P2-1, the third RF dual-polarization transceiver interface P1-2, the fourth RF dual-polarization transceiver interface P2-2, the first internal monitoring interface P3-1, and the second internal monitoring interface P4-2. -1, the third internal monitoring interface P3-2, the fourth internal monitoring interface P4-2, the first to the thirty-second active channel interfaces H1-1~H32-1, the thirty-third to the sixty-fourth active channel interfaces H1-2~H32-2, the sixty-fifth to the ninety-sixth active channel interfaces V1-1~V32-1, the ninety-seventh to the twenty-eighth active channel interfaces V1-2~V32-2, the first wave control interface P5-1, the second wave control interface P5-2, the first secondary power supply interface P6-1, and the second secondary power supply interface P6-2. The first RF dual-polarization transceiver interface P1-1, the second RF dual-polarization transceiver interface P2-1, the third RF dual-polarization transceiver interface P1-2, and the fourth RF dual-polarization transceiver interface P2-2 correspond to two rows of dual-polarization transceiver networks respectively, the first internal monitoring interface P3-1, the second internal monitoring interface P4-1, the third internal monitoring interface P3-2, and the fourth internal monitoring interface P4-2 monitor the amplitude and phase characteristics of the two rows of dual-polarization transceiver networks respectively, and the 128 active channel interfaces (the first to the thirty-second active channel interfaces H1-1 to H32-1, the thirty-third to the sixty-fourth active channel interfaces H1-2 to H32-2, the sixty-fifth to the ninety-sixth active channel interfaces V1-1 to V32-1, the ninety-seventh to the twenty-eighth active channel interfaces V1-2 to V32-2) are respectively given to the thunder The two adjacent rows of dual-polarized antenna units on the array surface are fed, the first wave control interface P5-1 and the second wave control interface P5-2 respectively realize the control of the multi-function chip M2 and the multi-channel differential transceiver chip M3 on the two sections of the first active integrated motherboard A1-1 and the second active integrated motherboard A1-2, the first secondary power interface P6-1 and the second secondary power interface P6-2 respectively realize the bus level transmission of the DC conversion module chip M4 on the two sections of the first active integrated motherboard A1-1 and the second active integrated motherboard A1-2, and the press plate A2 is used to realize the interconnection of multiple sections of the first active integrated motherboard A1-1 and the second active integrated motherboard A1-2 to form the active channel scale required for active row feeding, which is beneficial to engineering implementation on the one hand, and can greatly reduce the use of interconnect connectors and cable assemblies on the other hand. After the press plate A2 is pressed together with the first active integrated motherboard A1-1 and the second active integrated motherboard A1-2, the RF signal is interconnected in the inner layer.

[0042] The first active integrated motherboard A1-1 and the second active integrated motherboard A1-2 and the press-fit plate A2 are mounted on the heat dissipation frame G1, and heat conduction and heat dissipation are achieved by bonding the first active integrated motherboard A1-1 and the second active integrated motherboard A1-2 to the heat dissipation frame. The heat dissipation frame G1 is designed with corresponding heat dissipation bosses according to the positions of the heat-generating devices on the first active integrated motherboard A1-1 and the second active integrated motherboard A1-2: the multi-function chip M2, the multi-channel differential transceiver chip M3, and the DC conversion module chip M4, so that the heat-generating devices and the printed circuit board are effectively cooled, thereby ensuring the normal operation of the chip-based active line feed network.

[0043] refer to Figure 2 The signal flow chart of the first active integrated motherboard A1-1 and the second active integrated motherboard A1-2 of the embodiment of the present invention, in terms of electrical performance, the multifunctional chip M2 has the functions of phase shifting, attenuation, amplifier, switch, wave control, receiving power modulation, etc. The chip size is 9mm*9mm*1mm. Under this size, the square flat leadless package QFN technology is adopted to improve the reliability of chip welding. The multi-channel differential transceiver chip M3 realizes the control of differential signal conversion to single-ended signal, and the control chip T / R component in the multifunctional chip M2 realizes beam control. The DC conversion module chip M4 realizes +28V input, +3.3V and -5V voltage source output, and provides power to each module on the two active integrated motherboards. The chip size is 15mm*15mm*4.92mm, and the plastic package ball array package PBGA is adopted. The built-in input filter and noise cancellation circuit realize low-noise coupling, which effectively reduces electromagnetic interference. The integrated backplane M1 of the present invention completes the transmission of the RF transceiver signal X1, the RF internal monitoring signal X2, the antenna transceiver signal X3, the wave control signal S1, and the secondary power supply signal S2. In the three-dimensional structure, from top to bottom, there are the low-frequency signal layer S1 and the RF signal layer S2. The low-frequency signal layer S1 mainly realizes the formation and distribution of the secondary power supply signal and the wave control signal of the active integrated motherboard. The low-frequency signal layer transmits low-frequency signals with a frequency not exceeding 1MHz. The active integrated motherboard of the present invention uses FR4 printed circuit boards in this layer. The RF signal layer S2 is used for the RF signal transmission of the active integrated motherboard. According to the functional requirements of the active integrated motherboard, it generally includes a transceiver network, an internal monitoring network, RF winding, etc. In actual design, the number of RF layers can be appropriately increased or decreased according to the needs. The RF layer routing is in the form of strip lines. Considering the processing accuracy of the printed line, a 1mm or 2mm strip line is generally selected for implementation.

[0044] refer to Figure 3This is a view of the RF signal layer of the first active integrated motherboard A1-1 and the second active integrated motherboard A1-2 of the embodiment of the present invention. The RF functions of the active integrated motherboard of the present invention include: RF dual-polarization transceiver function and internal monitoring function. According to the actual design situation, two layers of strip lines are designed to realize the above RF functions, and the RF dual-polarization transceiver function is realized in the form of cascaded and parallel feeding of Wilkinson power divider D1; the coupler is designed using narrow-edge coupling to realize the internal monitoring function. The isolation resistor and absorption resistor required for the RF circuit are in the form of printed circuit board cavity welding, which has high stability and low cost.

[0045] refer to Figure 4 The front layout diagram of the first active integrated motherboard A1-1 and the second active integrated motherboard A1-2 of the embodiment of the present invention. The front includes a multifunctional chip M2, a multi-channel differential transceiver chip M3, a DC conversion module chip M4, a first RF dual-polarization transceiver interface P1-1, a second RF dual-polarization transceiver interface P2-1, a third RF dual-polarization transceiver interface P1-2, a fourth RF dual-polarization transceiver interface P2-2, a first internal monitoring interface P3-1, a second internal monitoring interface P4-1, a third internal monitoring interface P3-2, a fourth internal monitoring interface P4-2, a first wave control interface P5-1, a second wave control interface P5-2, a first secondary power supply interface P6-1, and a second secondary power supply interface P6-2. The layout is partitioned, that is, different functional circuits are distributed in different local areas, and mutual interference is reduced through regional isolation to improve electromagnetic compatibility. The printed circuit board is designed with an "H"-shaped heat dissipation area Q1, which contacts the heat-generating device and the printed circuit board through the heat dissipation skeleton G1 to achieve heat dissipation.

[0046] refer to Figure 5 The back side layout diagram of the first active integrated motherboard A1-1 and the second active integrated motherboard A1-2 of the embodiment of the present invention. The back side includes the first to the third second active channel interfaces H1-1 to H32-1, the thirty-third to the sixty-fourth active channel interfaces H1-2 to H32-2, the sixty-fifth to the ninety-sixth active channel interfaces V1-1 to V32-1, the ninety-seventh to the twenty-eighth active channel interfaces V1-2 to V32-2, the resistor welding slot Q2 and some resistor and capacitor components; wherein every four active channel interfaces are grouped. The active channel interface is interconnected with the array antenna unit to realize the feeding of the dual-polarized antenna unit; the isolation resistor and the absorption resistor required for the radio frequency circuit are welded in the resistor welding slot Q2, and after welding, the metal sheet is assembled on the surface to improve the isolation.

[0047] refer to Figure 6 The schematic diagram of the compression board A2 of the embodiment of the present invention is as follows. The compression board A2 is a double-layer printed board, one side of which has the same pattern as the RF circuit layer pattern of the first active integrated motherboard A1-1 and the second active integrated motherboard A1-2, and the other side is fully covered with copper.

[0048] refer to Figure 7The schematic diagram of the interconnection between the first active integrated motherboard A1-1 and the second active integrated motherboard A1-2 and the press-fit plate A2 of the embodiment of the present invention. After the press-fit plate A2 is press-fitted with the first active integrated motherboard A1-1 and the second active integrated motherboard A1-2, the RF dual-polarized transceiver circuits of the active integrated motherboard A1-1 and A1-2 are interconnected. The press-fit plate A2 and the active integrated motherboard are fixed to the heat dissipation frame G1 by screws.

[0049] The chip-based active line feed network of a dual-polarization meteorological radar of the present invention is mainly used to meet the dual-polarization beamforming requirements of the X-band dual-polarization meteorological radar. It adopts multi-layer board pressing technology and realizes telecommunication characteristics such as good polarization consistency, excellent sidelobe indicators, and low feed loss through an active integrated motherboard and a press-connected interconnection design architecture. It also has structural characteristics such as small size, light weight, and high machinability.

[0050] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. A chip-based active line feed network for a dual-polarization weather radar, characterized in that: It comprises two sections of active integrated motherboards, which are connected via a crimping plate (A2), and the active line feed network has both signal processing and signal transmission functions; The front of each active integrated motherboard is equipped with a multi-function chip, a multi-channel differential transceiver chip, a DC conversion module chip, a RF dual-polarization transceiver interface, a monitoring interface, a wave control interface, and a secondary power supply interface, and the back of each active integrated motherboard is equipped with an active channel interface; the chips and interfaces installed on the two active integrated motherboards are symmetrical about the crimping plate (A2); the layout is partitioned, that is, different functional circuits are distributed in different local areas; the active channel interface is interconnected with the array antenna unit to realize the feeding of the dual-polarization antenna unit.

2. The chip-based active line feed network of the dual-polarization weather radar according to claim 1, characterized in that: The back of each section of the active integrated motherboard is also equipped with a resistor welding groove (Q2); the isolation resistor and absorption resistor required for the radio frequency circuit are welded in the resistor welding groove (Q2), and after welding, a metal sheet is assembled on the surface.

3. The chip-based active line feed network of the dual-polarization weather radar according to claim 1, characterized in that: The RF dual-polarization transceiver interface includes a first RF dual-polarization transceiver interface (P1-1), a second RF dual-polarization transceiver interface (P2-1), a third RF dual-polarization transceiver interface (P1-2), and a fourth RF dual-polarization transceiver interface (P2-2), which correspond to two rows of dual-polarization transceiver networks respectively; the monitoring interface includes a first internal monitoring interface (P3-1), a second internal monitoring interface (P4-1), a third internal monitoring interface (P3-2), and a fourth internal monitoring interface (P4-2), which monitor the amplitude and phase characteristics of the two rows of dual-polarization transceiver networks respectively; the active channel interface feeds two adjacent rows of dual-polarization antenna units on the radar array respectively; the wave control interface includes a first wave control interface (P5-1), The second wave control interface (P5-2) realizes the control of the multi-function chip (M2) and the multi-channel differential transceiver chip (M3) on the two sections of the first active integrated motherboard (A1-1) and the second active integrated motherboard (A1-2); the secondary power supply interface includes the first secondary power supply interface (P6-1) and the second secondary power supply interface (P6-2); respectively realizes the bus level transmission of the DC conversion module chip (M4) on the two sections of the first active integrated motherboard (A1-1) and the second active integrated motherboard (A1-2); the pressing plate (A2) is pressed with the first active integrated motherboard (A1-1) and the second active integrated motherboard (A1-2) to realize the interconnection of radio frequency signals in the inner layer.

4. The chip-based active line feed network of the dual-polarization weather radar according to claim 1, characterized in that: The active integrated motherboard and the press-fit plate (A2) are mounted on a heat dissipation frame (G1), and the heat dissipation frame (G1) is provided with heat dissipation bosses. The positions and shapes of the chips and interfaces on the active integrated motherboard are adapted to the recesses between the heat dissipation bosses, and heat conduction and heat dissipation are achieved by bonding the active integrated motherboard and the heat dissipation frame.

5. The chip-based active line feed network of the dual-polarization weather radar according to claim 1, characterized in that: The multifunctional chip combines phase shifting, attenuation, amplifier, switch, wave control, and receiving power modulation functions, and adopts square flat leadless packaging technology; The multi-channel differential transceiver chip realizes the control of differential signals to single-ended signals, and the control chip T / R components in the multi-function chip realize beam control; The DC conversion module chip realizes +28V input, +3.3V and -5V voltage source output, and provides power to each module on the two active integrated motherboards. It adopts plastic package spherical array package, built-in input filter and noise cancellation circuit to realize low noise coupling.

6. The chip-based active line feed network of the dual-polarization weather radar according to claim 1, characterized in that: The active integrated motherboard is carried by the integrated backplane (M1), which transmits RF transceiver signals (X1), RF internal monitoring signals (X2), antenna transceiver signals (X3), wave control signals (S1), and secondary power supply signals (S2). In the three-dimensional structure, from top to bottom, there are low-frequency signal layers (S1) and RF signal layers (S2). The low-frequency signal layer (S1) realizes the formation and distribution of the secondary power supply signal and wave control signal of the active integrated motherboard. The low-frequency signal layer transmits low-frequency signals with a frequency not exceeding 1MHz. The RF signal layer (S2) is used for RF signal transmission of the active integrated motherboard, including the transceiver network, internal monitoring network, and RF winding. The routing of the RF signal layer is in the form of stripline, and 1mm or 2mm stripline is selected for implementation.

7. The chip-based active line feed network of the dual-polarization weather radar according to claim 1, characterized in that: The RF functions of the active integrated motherboard include: RF dual-polarization transceiver function and internal monitoring function; the RF dual-polarization transceiver function and internal monitoring function are realized through two layers of strip lines and the Wilkinson power divider (D1) is cascaded and fed in parallel to realize the RF dual-polarization transceiver function; a coupler with narrow-edge coupling design is used to realize the internal monitoring function; the isolation resistor and absorption resistor required for the RF circuit are welded in the form of printed circuit board cavity.

8. The chip-based active line feed network of the dual-polarization weather radar according to claim 1, characterized in that: The press-fit board (A2) is a double-layer printed board, one side of which has the same pattern as the RF circuit layer pattern on the active integrated motherboard, and the other side is fully covered with copper.

9. The chip-based active line feed network of the dual-polarization weather radar according to claim 4 or 8, characterized in that: An "H"-shaped heat dissipation area (Q1) is provided on the printed circuit board, which is in contact with the heat-generating device and the printed circuit board through a heat dissipation skeleton (G1) to achieve heat dissipation.

10. The chip-based active line feed network of the dual-polarization weather radar according to claim 4, characterized in that: (A2) The press-fit plate and the active integrated motherboard are installed and fixed on the heat dissipation frame (G1) by screws.

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