A polishing method, a polishing apparatus, a device, and a medium

Abstract

The present disclosure provides a polishing method, a polishing device, a polishing apparatus and a polishing medium. The polishing method comprises: obtaining a polished wafer sample based on a preset polishing parameter, wherein the preset polishing parameter comprises a previous polishing parameter and / or a pre-stored first polishing parameter, and the polishing parameter comprises at least one of a polishing removal amount and a polishing liquid temperature; detecting a surface reflectivity of the wafer sample based on the previous polishing parameter; if the surface reflectivity is less than a first threshold value, adjusting at least one of the polishing removal amount and the polishing liquid temperature to obtain a next polishing parameter; detecting a surface reflectivity of the wafer sample based on the next polishing parameter; and repeating the above steps until the surface reflectivity of the wafer sample based on an Nth polishing parameter is greater than or equal to a second threshold value, and the Nth polishing parameter is determined as a target polishing parameter. The polishing method, the polishing device, the polishing apparatus and the polishing medium can improve the cloud mark defect.

Images