Application of Beryllium Oxide in Slurry Development

Abstract

The present invention belongs to the field of slurry technology and relates to the application of beryllium oxide in slurry development. The present invention provides the application of beryllium oxide in slurry development, the slurry includes glass powder and a carrier, wherein the preparation method of the carrier is: beryllium oxide and an additive are mixed according to a mass ratio of 1:1.5-2, placed in a mixer and blended for 2-6h to obtain; the additive is composed of polyamide, isooctyl alcohol, polydimethylsiloxane and terpineol. The interaction and synergistic effect between these components of the present invention enable the slurry to maintain stable performance under extreme conditions, and can also resist the erosion of corrosive substances, thereby improving the stability and reliability of electronic devices.

Description

Technical Field

[0001] The invention belongs to the technical field of slurry and relates to the application of beryllium oxide in slurry development. Background Art

[0002] In the field of electronic device manufacturing, the performance of pastes has a crucial impact on the quality and stability of electronic devices. Pastes are commonly used to fill, encapsulate, and connect various components in electronic devices. Their stability directly determines the reliability and service life of electronic devices. Traditional pastes have problems such as insufficient stability in certain application scenarios, limiting the improvement of electronic device performance.

[0003] In the prior art, glass powder, as one of the main components of the slurry, is usually composed of a variety of inorganic oxides. These components are obtained through specific ratios and melting processes to obtain glass powder, but different components and preparation processes have a significant impact on the performance of the slurry. At the same time, the carrier, as another important component in the slurry, its type and preparation method are also directly related to the stability of the slurry. Traditional carrier materials such as alumina and silica, although they can meet the basic requirements of the slurry to a certain extent, their performance will be limited under certain specific conditions (such as high-pressure environments). In the preparation process of the carrier material, the selection and ratio of different additives will also have a significant impact on the performance of the carrier material. If the additives are improperly selected or the ratio is unreasonable, it will not only reduce the performance of the carrier material, but also have a negative impact on the overall performance of the slurry.

[0004] Therefore, it is necessary to improve the formulation and preparation process of the slurry to improve its stability. Summary of the Invention

[0005] To address the challenges of existing technologies, the present invention proposes a slurry preparation method using beryllium oxide as a key component. Beryllium oxide, a high-performance inorganic material, possesses excellent physical and chemical properties, such as a high melting point, high hardness, good electrical insulation, and chemical stability. Introducing beryllium oxide as a carrier material into the slurry, combined with specific additives, can enhance the slurry's stability.

[0006] To achieve the above object, the technical solution of the present invention is as follows:

[0007] In a first aspect, the present invention provides an application of beryllium oxide in the development of a slurry, wherein the slurry comprises glass powder and a carrier, wherein:

[0008] The preparation method of the carrier is as follows: beryllium oxide and an additive are mixed in a mass ratio of 1:1.5-2, and the mixture is placed in a mixer and blended for 2-6 hours;

[0009] The additive consists of polyamide, isooctyl alcohol, polydimethylsiloxane and terpineol;

[0010] The glass powder consists of SiO2, H3BO3, Al2O3, ZnO and SrO.

[0011] Preferably, the slurry comprises 46-52 parts of glass powder and 35-41 parts of vehicle in parts by mass.

[0012] Preferably, the additive consists of 0.3-0.5 parts of polyamide, 0.1-0.2 parts of isooctyl alcohol, 0.05-0.1 parts of polydimethylsiloxane and 0.03-0.08 parts of terpineol in parts by mass.

[0013] More preferably, the glass powder consists of 32-36 parts of SiO2, 22-30 parts of H3BO3, 8-10 parts of Al2O3, 1-3 parts of ZnO and 0.5-3 parts of SrO in parts by mass.

[0014] Preferably, the method for preparing the slurry comprises the following steps:

[0015] 1) Preparation of glass powder

[0016] S11. After the glass powder components are evenly mixed, melted at a temperature of 1000-1100 ℃ for 1-2h, quenched in water, and cooled to solidify;

[0017] S12. The solidified mixture is sequentially crushed, ball-milled, sieved and dried to obtain a glass powder having a particle size of less than 5 μm;

[0018] 2) Preparation of the carrier: beryllium oxide and the additive are mixed in a mass ratio of 1:1.5-2, placed in a mixer and blended for 2-6 hours;

[0019] 3) Preparation of slurry: Ultrasonic dispersion of glass powder and carrier at a temperature of 50-60°C to obtain slurry.

[0020] In a second aspect, a slurry with good dispersibility is provided, wherein the slurry comprises glass powder and a carrier, wherein:

[0021] The glass powder consists of SiO2, H3BO3, Al2O3, ZnO and SrO;

[0022] The preparation method of the carrier is as follows: beryllium oxide and an additive are mixed in a mass ratio of 1:1.5-2, and the mixture is placed in a mixer and blended for 2-6 hours;

[0023] The additive consists of polyamide, isooctyl alcohol, polydimethylsiloxane and terpineol.

[0024] In a third aspect, a slurry with good stability is provided, wherein the slurry comprises glass powder and a carrier, wherein:

[0025] The glass powder consists of SiO2, H3BO3, Al2O3, ZnO and SrO;

[0026] The preparation method of the carrier is as follows: beryllium oxide and an additive are mixed in a mass ratio of 1:1.5-2, and the mixture is placed in a mixer and blended for 2-6 hours;

[0027] The additive consists of polyamide, isooctyl alcohol, polydimethylsiloxane and terpineol.

[0028] Preferably, the glass powder consists of 32-36 parts of SiO2, 22-30 parts of H3BO3, 8-10 parts of Al2O3, 1-3 parts of ZnO and 0.5-3 parts of SrO in parts by mass.

[0029] Preferably, the additive consists of 0.3-0.5 parts of polyamide, 0.1-0.2 parts of isooctyl alcohol, 0.05-0.1 parts of polydimethylsiloxane and 0.03-0.08 parts of terpineol in parts by mass.

[0030] In a fourth aspect, the present invention provides a method for improving the stability of electronic devices using the slurry of the present invention.

[0031] In a fifth aspect, the present invention provides an application of the slurry described in the present invention in improving the high voltage resistance of electronic devices.

[0032] In a sixth aspect, the present invention provides a method for improving the corrosion resistance of electronic devices using the slurry of the present invention.

[0033] In a seventh aspect, the present invention provides an application of the slurry described in the present invention in improving the thermal stability of electronic devices.

[0034] In the present invention, glass powder, beryllium oxide and additives each play a very important role in improving the stability and corrosion resistance of the slurry. The interaction and synergistic effect between these components enable the slurry to maintain stable performance under extreme conditions such as high temperature and high pressure, and can also resist the erosion of corrosive substances, thereby improving the stability and reliability of electronic devices.

[0035] Regarding stability: On the one hand, the glass powder particles can fill the voids in the slurry, increasing its density and thus improving its compressive strength. On the other hand, beryllium oxide's high melting point enables it to maintain structural stability under extremely high temperatures, making it resistant to melting or deformation. Its high hardness also helps the slurry resist deformation under high pressure. Furthermore, the additives composed of polyamide, isooctyl alcohol, polydimethylsiloxane, and terpineol form a good interfacial bond with beryllium oxide, thereby improving the stability of the slurry.

[0036] Regarding corrosion resistance: On the one hand, beryllium oxide is resistant to a variety of chemically corrosive media, a property that allows the slurry to maintain stable performance when exposed to corrosive substances. On the other hand, the additives composed of polyamide, isooctyl alcohol, polydimethylsiloxane, and terpineol form a hydrophobic protective film on the slurry surface, isolating the corrosive media from contact with the interior of the slurry and reducing the erosion of the corrosive media.

[0037] Compared with the prior art, the present invention has the following beneficial effects:

[0038] The slurry of the present invention comprises a specific glass powder and a specific carrier combination, as well as an optimized preparation process; the carrier of the present invention is composed of beryllium oxide and a specific additive; this combination and preparation method of the present invention enable the slurry to have excellent stability, thereby improving the reliability and service life of electronic devices.

[0039] By optimizing the glass powder ratio and melting process, the present invention produces glass powder with a small and uniform particle size distribution. Furthermore, by selecting appropriate additives and ratios, and optimizing the carrier preparation process, the carrier performance is improved. These measures work together to ensure uniform dispersion of the slurry during the preparation process, improving the slurry's stability. Furthermore, the introduction of beryllium oxide further enhances the slurry's stability.

[0040] Specifically, beryllium oxide's high melting point and chemical stability enable the slurry to maintain stable performance under extreme conditions such as high temperature and high pressure. Furthermore, the introduction of additives can enhance the slurry's corrosion resistance, further improving the stability of electronic devices.

[0041] In summary, the present invention, by introducing beryllium oxide as a key component, combined with a specific glass powder and carrier combination and an optimized preparation process, addresses the existing slurry problems of insufficient stability and poor high-voltage resistance, providing a high-performance slurry preparation solution for electronic device manufacturing. This is primarily due to the combination of the glass powder and carrier, as well as the synergistic effect between the beryllium oxide in the carrier and the additives. DETAILED DESCRIPTION

[0042] The present invention will be described in detail below in conjunction with specific embodiments and examples, and the advantages and various effects of the present invention will be more clearly presented. It should be understood by those skilled in the art that these specific embodiments and examples are for illustrating the present invention, rather than limiting the present invention.

[0043] The following examples illustrate the technical solutions of the present invention, but the present invention is not limited to the following examples. The experimental methods and detection methods described in each example are conventional methods unless otherwise specified; the reagents and materials are commercially available unless otherwise specified.

[0044] Example 1

[0045] This embodiment provides a slurry, which comprises 46 parts of glass powder and 35 parts of carrier in terms of mass.

[0046] The glass powder is composed of 32 parts of SiO2, 22 parts of H3BO3, 8 parts of Al2O3, 1 part of ZnO and 0.5 parts of SrO;

[0047] The preparation method of the carrier is as follows: beryllium oxide and an additive are mixed in a mass ratio of 1:1.5, and the mixture is placed in a mixer and blended for 2 hours;

[0048] The additive consists of 0.3 parts of polyamide, 0.1 parts of isooctyl alcohol, 0.05 parts of polydimethylsiloxane and 0.03 parts of terpineol.

[0049] Example 2

[0050] This embodiment provides a slurry, which comprises 52 parts of glass powder and 41 parts of carrier in terms of mass.

[0051] The glass powder is composed of 36 parts of SiO2, 30 parts of H3BO3, 10 parts of Al2O3, 3 parts of ZnO and 3 parts of SrO;

[0052] The preparation method of the carrier is as follows: beryllium oxide and an additive are mixed in a mass ratio of 1:2, placed in a mixer and blended for 6 hours;

[0053] The additive consists of 0.5 parts of polyamide, 0.2 parts of isooctyl alcohol, 0.1 parts of polydimethylsiloxane and 0.08 parts of terpineol.

[0054] Example 3

[0055] This embodiment provides a slurry, which comprises 50 parts of glass powder and 40 parts of carrier in terms of mass.

[0056] The glass powder is composed of 33 parts of SiO2, 26 parts of H3BO3, 9 parts of Al2O3, 2 parts of ZnO and 1 part of SrO;

[0057] The preparation method of the carrier is as follows: beryllium oxide and an additive are mixed in a mass ratio of 1:2, placed in a mixer and blended for 4 hours;

[0058] The additive consists of 0.4 parts of polyamide, 0.1 parts of isooctyl alcohol, 0.08 parts of polydimethylsiloxane and 0.05 parts of terpineol.

[0059] Example 4

[0060] This embodiment provides a method for preparing a slurry, which comprises the following steps:

[0061] 1) Preparation of glass powder

[0062] S11. After the glass powder components are evenly mixed, melted at a temperature of 1000-1100 ℃ for 1-2h, quenched in water, and cooled to solidify;

[0063] S12. The solidified mixture is sequentially crushed, ball-milled, sieved and dried to obtain a glass powder having a particle size of less than 5 μm;

[0064] 2) Preparation of the carrier: beryllium oxide and the additive are mixed in a mass ratio of 1:1.5-2, placed in a mixer and blended for 2-6 hours;

[0065] 3) Preparation of slurry: Ultrasonic dispersion of glass powder and carrier at a temperature of 50-60°C to obtain slurry.

[0066] Comparative Example 1

[0067] This comparative example is the same as Example 3, except that the polydimethylsiloxane in the additive is replaced by polyvinyl alcohol.

[0068] Comparative Example 2

[0069] This comparative example is the same as Example 3, except that the mass ratio of beryllium oxide to the additive is adjusted to 1:1.

[0070] Comparative Example 3

[0071] This comparative example is the same as Example 3, except that beryllium oxide is replaced by silicon dioxide.

[0072] Effect verification

[0073] Experimental objects: slurries prepared according to Example 4 in Examples 1-3 and Comparative Examples 1-3;

[0074] Experimental methods:

[0075] The slurries were screen-printed onto 1206-gauge alumina substrates, dried at 150°C for 13 min, and then cured at 200°C for 35 min to prepare samples, which were then tested for performance.

[0076] Corrosion resistance test: Soak the sample in 20% dilute sulfuric acid solution for 96 hours, then tear off the sample with 3M tape to see if any peeling occurs.

[0077] Thermal stability test: Rapidly heat the sample to 500°C, then quickly cool it down to observe whether the sample has cracks, deformation or falling off;

[0078] Breakdown voltage test: Apply gradually increasing voltage to the sample until it breaks down, record the breakdown voltage value, and evaluate the sample's voltage resistance;

[0079] Experimental results: as shown in Table 1.

[0080] Table 1 Performance test results of each group of samples

[0081]

[0082] In order to further demonstrate the effect of the present invention, the polyamide, isooctyl alcohol and terpineol in the additives of the present invention were replaced by other substances with similar properties, and the other conditions were consistent with those of Example 3. The results showed that the effect was equivalent to that of Comparative Example 1.

[0083] In order to further demonstrate the effect of the present invention, the mass ratio of beryllium oxide to additives in the present embodiment is adjusted to 1:2.5, and the other conditions are consistent with those in Example 3. The results show that the effect is equivalent to that of Comparative Example 2.

[0084] As can be seen from Table 1, the various properties of the samples made from the slurry of the present invention are relatively good. Specifically, with regard to corrosion resistance, the samples made from the slurry of the present invention have excellent corrosion resistance and no shedding occurs. However, the samples from Comparative Examples 1-3 all exhibited a large amount of shedding, which means that they cannot maintain sufficient durability in a corrosive environment. With regard to thermal stability, the samples made from the slurry of the present invention have excellent thermal stability, with no cracks, deformation, or shedding at 500°C. However, the samples from Comparative Examples 1-3 all exhibited a large degree of deformation and shedding. With regard to breakdown voltage, the breakdown voltage of the samples from the present invention can reach a relatively high level and is very stable. Among them, the breakdown voltage value of the sample from Example 3 is the highest, while the breakdown voltage of the samples from Comparative Examples 1-3 is lower. Therefore, compared with the slurry not using the formulation system of the present invention, the slurry using the formulation system of the present invention can be well used for the packaging and protection of various high-performance electronic devices. Among them, the corrosion resistance, thermal stability, and high-voltage resistance of the sample from Example 3 are superior.

[0085] Through the effect verification experiment, it can be seen that the formula system of the slurry provided by the present invention is a whole. Specifically, the various raw materials in the slurry support each other functionally and have an interactive relationship. It is precisely because the various raw materials support each other functionally and have an interactive relationship that the slurry of the formula system of the present invention can be well used for the packaging and protection of various high-performance electronic devices.

[0086] It should be understood that the present invention disclosed is not limited only to the specific method, scheme and material of description, because these all can change.It should also be understood that the term used herein is only for the purpose of describing specific embodiment scheme, rather than being intended to limit the scope of the present invention, and the scope of the present invention is only limited to the appended claims.

Claims

1. A method for preparing a slurry, characterized in that: The slurry comprises 46-52 parts of glass powder and 35-41 parts of carrier in terms of mass, wherein: The preparation method of the carrier is as follows: beryllium oxide and an additive are mixed in a mass ratio of 1:1.5-2, and the mixture is placed in a mixer and blended for 2-6 hours; The additive consists of 0.3-0.5 parts of polyamide, 0.1-0.2 parts of isooctyl alcohol, 0.05-0.1 parts of polydimethylsiloxane and 0.03-0.08 parts of terpineol in parts by mass; The glass powder is composed of 32-36 parts of SiO2, 22-30 parts of H3BO3, 8-10 parts of Al2O3, 1-3 parts of ZnO and 0.5-3 parts of SrO in parts by mass; The preparation method of the slurry comprises the following steps: 1) Preparation of glass powder S11. After the glass powder components are evenly mixed, melted at a temperature of 1000-1100 ℃ for 1-2h, quenched in water, and cooled to solidify; S12. The solidified mixture is sequentially crushed, ball-milled, sieved and dried to obtain a glass powder having a particle size of less than 5 μm; 2) Preparation of the carrier: beryllium oxide and the additive are mixed in a mass ratio of 1:1.5-2, placed in a mixer and blended for 2-6 hours; 3) Preparation of slurry: Ultrasonic dispersion of glass powder and carrier at a temperature of 50-60°C to obtain slurry.

2. Use of beryllium oxide in the method for preparing the slurry as claimed in claim 1.

3. A slurry with good stability, characterized in that: The slurry comprises 46-52 parts of glass powder and 35-41 parts of carrier in terms of mass, wherein: The glass powder is composed of 32-36 parts of SiO2, 22-30 parts of H3BO3, 8-10 parts of Al2O3, 1-3 parts of ZnO and 0.5-3 parts of SrO in parts by mass; The preparation method of the carrier is as follows: beryllium oxide and an additive are mixed in a mass ratio of 1:1.5-2, and the mixture is placed in a mixer and blended for 2-6 hours; The additive consists of 0.3-0.5 parts of polyamide, 0.1-0.2 parts of isooctyl alcohol, 0.05-0.1 parts of polydimethylsiloxane and 0.03-0.08 parts of terpineol in parts by mass; The preparation method of the slurry comprises the following steps: 1) Preparation of glass powder S11. After the glass powder components are evenly mixed, melted at a temperature of 1000-1100 ℃ for 1-2h, quenched in water, and cooled to solidify; S12. The solidified mixture is sequentially crushed, ball-milled, sieved and dried to obtain a glass powder having a particle size of less than 5 μm; 2) Preparation of the carrier: beryllium oxide and the additive are mixed in a mass ratio of 1:1.5-2, placed in a mixer and blended for 2-6 hours; 3) Preparation of slurry: Ultrasonic dispersion of glass powder and carrier at a temperature of 50-60°C to obtain slurry.

4. Use of the slurry according to claim 3 in improving the stability of electronic devices.

5. Use of the slurry according to claim 3 in improving the corrosion resistance of electronic devices.

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