Copper-aluminum composite material circuit etching processing technology

Abstract

The invention relates to the technical field of circuit processing technologies, and particularly discloses a copper-aluminum composite material circuit etching processing technology, which comprises the following steps of: 1, preparing a base material, namely preparing a copper-aluminum composite base material, a copper etching solution and an aluminum etching solution; 2, etching the metal copper, namely etching and forming the metal copper on the copper-aluminum composite base material by adopting an aluminum inhibitor etching liquid medicine to form a required shape and a preset size; and 3, etching the metal aluminum, namely etching and forming the metal aluminum on the copper-aluminum composite base material by adopting a copper inhibitor etching liquid medicine to form a required shape and a preset size. According to the method, the copper-aluminum composite material is etched twice, when one kind of metal is etched, the other kind of metal is not affected, liquid medicine corrosion reaction is avoided, the problems that a traditional laser cutting process is low in efficiency, cut edges are carbonized and the like are solved, meanwhile, compared with conventional etching forming, step suspension cannot be formed, quality control can be better carried out, and the production cost is reduced. The production requirements are met.

Description

Technical Field

[0001] The invention relates to the technical field of circuit processing technology, and in particular to a circuit etching processing technology for copper-aluminum composite materials. Background Art

[0002] Copper-aluminum composite materials are new materials in the circuit industry. The current common copper-aluminum composite materials are formed by rolling two metals, copper and aluminum, with no AD medium in the middle. The metal copper is on the top, the metal aluminum is in the middle, and the bottom is in contact with the metal aluminum and bonded with a yellow covering film to form a composite material.

[0003] The copper-aluminum composite material forming methods used in the market include: laser processing technology cutting forming lines and conventional etching forming. The current laser cutting process has problems such as low efficiency and carbonization of cutting edges, especially edge carbonization, which will cause poor functionality and cannot meet the use requirements.

[0004] In conventional etching, due to the influence of the density of copper and aluminum, the etching rates of the two metals are different. Under the same etching solution conditions, the etching rate of aluminum is faster than that of copper. Figure 1 As shown, the edges of the two metals form steps and are suspended in the air, which easily leads to residual chemicals and poor functionality. At the same time, due to its characteristics, metal aluminum reacts with both acids and alkalis. It is difficult to control the processing during etching and cannot meet production needs. Summary of the invention

[0005] In view of the defects of the above-mentioned prior art, the present invention provides a copper-aluminum composite material circuit etching processing technology. By etching the copper-aluminum composite material twice, when etching one of the metals, there is no effect on the other metal and no chemical corrosion reaction will occur, thereby solving the problems of low efficiency and carbonization of cutting edges in traditional laser cutting process. At the same time, compared with conventional etching molding, no suspended steps are formed, the quality is stable, and quality control can be better carried out to meet production needs.

[0006] To achieve the above object, the technical solution adopted by the present invention is:

[0007] The copper-aluminum composite material circuit etching process comprises the following steps:

[0008] The first step is to prepare a substrate, a copper-aluminum composite substrate, an aluminum inhibitor, a copper inhibitor, a copper etching solution and an aluminum etching solution;

[0009] The second step is etching of metal copper, wherein an aluminum inhibitor is added to the copper etching solution to form an aluminum inhibitor etching solution, and the aluminum inhibitor etching solution is used to etch the metal copper on the copper-aluminum composite substrate to form a desired shape and a predetermined size;

[0010] The third step is to clean the residue, clean the copper-aluminum composite substrate through-line after the metal copper etching is completed, and clean the residual solution on the copper-aluminum composite substrate;

[0011] The fourth step is etching of metal aluminum. A copper inhibitor is added to the aluminum etching solution to form a copper inhibitor etching solution. The copper inhibitor etching solution is used to etch the metal aluminum on the copper-aluminum composite substrate to form a desired shape and a predetermined size.

[0012] In the above description, preferably, the first step also includes trimming and shaping the substrate, cutting the copper-aluminum composite substrate into the full-plate size required for etching.

[0013] In the above description, preferably, after the second step, a pre-treatment is further included, in which the copper-aluminum composite substrate is subjected to a wet pre-treatment to clean its surface.

[0014] In the above description, preferably, the pre-treatment further includes applying LDI photosensitive ink, and the LDI photosensitive ink is evenly applied on the copper-aluminum composite substrate after the pre-treatment.

[0015] In the above description, as a preference, applying LDI photosensitive ink also includes drying and curing, and the substrate coated with the ink is placed in an oven for drying to remove the solvent and allow the ink to solidify to a certain extent.

[0016] In the above description, preferably, after applying the LDI photosensitive ink, it also includes exposure and development, using ultraviolet rays to expose the copper-aluminum composite substrate coated with the LDI photosensitive ink. After the exposure, the photosensitive material is dissolved and removed under the action of the developer, thereby exposing the etched circuit.

[0017] In the above description, preferably, after the fourth step, a film stripping treatment is also included, in which a film stripping solution is used to strip the LDI photosensitive ink on the surface of the copper-aluminum composite substrate.

[0018] In the above description, preferably, the stripping solution is a neutral stripping solution.

[0019] In the above description, preferably, the ratio of the aluminum inhibitor to the copper etching solution in the aluminum inhibitor etching solution is 1:10.

[0020] In the above description, preferably, the ratio of the copper inhibitor to the aluminum etching solution in the copper inhibitor etching solution is 1:10.

[0021] The beneficial effects of the present invention are as follows: first, the metal copper on the copper-aluminum composite substrate is etched and formed by using an aluminum inhibitor etching solution. Since the aluminum inhibitor is added to the etching solution, the aluminum ions in the etching solution tend to be saturated and do not react with the metal aluminum to form corrosion. After the metal copper is etched to form a desired shape and a predetermined size, the metal aluminum on the copper-aluminum composite substrate is etched and formed by using a copper inhibitor etching solution to form a desired shape and a predetermined size. Since the copper inhibitor is added to the etching solution, the copper ions in the etching solution tend to be saturated and do not react with the metal copper on the upper layer of the metal aluminum to form corrosion. After two etchings, the entire copper-aluminum composite material circuit is formed. This process ensures that when etching one of the metals, there is no effect on the other metal and no corrosion reaction of the etching solution will be generated. This solves the problems of low efficiency and carbonization of the cutting edge in the traditional laser cutting process. At the same time, compared with conventional etching forming, no suspended steps will be formed, the quality is stable, and better quality control can be performed to meet production needs. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 : It is a schematic diagram of a conventional etching molding structure in the background technology;

[0023] Figure 2 : is a schematic diagram of a flow chart of an embodiment of the present invention;

[0024] Figure 3 : is a schematic structural diagram of an embodiment of the present invention; DETAILED DESCRIPTION

[0025] In order to more clearly explain the structural features, technical means and specific purposes and functions achieved by the present invention, the present invention is further described in detail below in conjunction with the accompanying drawings and specific embodiments:

[0026] This embodiment: Figure 2 As shown, the copper-aluminum composite material circuit etching process includes the following steps:

[0027] The first step is to prepare a substrate, a copper-aluminum composite substrate, an aluminum inhibitor, a copper inhibitor, a copper etching solution and an aluminum etching solution;

[0028] The second step is to trim and shape the substrate, cutting the copper-aluminum composite substrate into the required etching size. Manual cutting or mechanical cutting can be used for cutting.

[0029] The third step is pre-treatment, which is to perform wet pre-treatment on the trimmed copper-aluminum composite substrate to clean its surface;

[0030] The fourth step is to apply LDI photosensitive ink, evenly apply the LDI photosensitive ink on the pre-treated copper-aluminum composite substrate, and put the substrate coated with ink into an oven for drying to remove the solvent and solidify the ink to a certain extent;

[0031] The fifth step is exposure and development. The copper-aluminum composite substrate coated with LDI photosensitive ink is exposed using ultraviolet light. The unexposed part of the photosensitive material after exposure is dissolved and removed by the developer, thereby exposing the etching circuit.

[0032] Step 6: Metal copper etching: adding aluminum inhibitor to copper etching solution to form aluminum inhibitor etching solution. The ratio of aluminum inhibitor to copper etching solution is 1:10. The temperature of aluminum inhibitor etching solution is controlled at 47±2°C. During the process, the over-temperature of the solution is controlled by condensed water circulation. The aluminum inhibitor etching solution is used to etch the metal copper on the copper-aluminum composite substrate after exposure and development to form the required shape and predetermined size. Since aluminum inhibitor is added to the etching solution, the aluminum ions in the etching solution tend to be saturated, reducing the possibility of its reaction with metal aluminum, achieving a more precise etching profile, and avoiding side etching and biting of metal aluminum;

[0033] Step 7: Clean the residues. Clean the copper-aluminum composite substrate after the metal copper etching is completed, and clean the residual medicine on the copper-aluminum composite substrate to prevent the residual medicine from affecting the next process.

[0034] Step 8: Metal aluminum etching: copper inhibitor is added to aluminum etching solution to form copper inhibitor etching solution. The ratio of copper inhibitor to aluminum etching solution is 1:10. The temperature of copper inhibitor etching solution is controlled at 25±2℃. During the process, the over-temperature of the solution is controlled by circulating the ice machine. The metal aluminum on the cleaned copper-aluminum composite substrate is etched and formed with copper inhibitor etching solution to form the required shape and predetermined size. Since copper inhibitor is added to the etching solution, the copper ions in the etching solution tend to be saturated, reducing the possibility of its reaction with the metal copper on the upper layer of the metal aluminum, achieving a more accurate etching profile, and avoiding the formation of side corrosion and bite corrosion of metal copper;

[0035] The ninth step is to use neutral film stripping solution to remove the LDI photosensitive ink on the surface of the copper-aluminum composite substrate after metal aluminum etching, and use clean water to thoroughly clean the copper-aluminum composite substrate to remove the residual film stripping solution. Finally, the copper-aluminum composite substrate is dried to complete the circuit forming of the entire copper-aluminum composite material.

[0036] like Figure 3 As shown, this process etches the copper-aluminum composite material twice, ensuring that when etching one of the metals, there is no impact on the other metal and no chemical corrosion reaction occurs. This solves the problems of low efficiency and carbonization of cutting edges in traditional laser cutting processes. At the same time, compared with conventional etching molding, no steps are formed, the quality is stable, and better quality control can be performed to meet production needs.

[0037] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Therefore, any modification, equivalent replacement, improvement, etc. made to the above embodiment based on the technical solution of the present invention still falls within the scope of the technical solution of the present invention.

Claims

1. A copper-aluminum composite material circuit etching process, characterized in that: The following steps are involved: The first step is to prepare a substrate, a copper-aluminum composite substrate, an aluminum inhibitor, a copper inhibitor, a copper etching solution and an aluminum etching solution; The second step is etching of metal copper, wherein an aluminum inhibitor is added to the copper etching solution to form an aluminum inhibitor etching solution, and the aluminum inhibitor etching solution is used to etch the metal copper on the copper-aluminum composite substrate to form a desired shape and a predetermined size; The third step is to clean the residue, clean the copper-aluminum composite substrate through-line after the metal copper etching is completed, and clean the residual solution on the copper-aluminum composite substrate; The fourth step is etching of metal aluminum. A copper inhibitor is added to the aluminum etching solution to form a copper inhibitor etching solution. The copper inhibitor etching solution is used to etch the metal aluminum on the copper-aluminum composite substrate to form a desired shape and a predetermined size.

2. The copper-aluminum composite material circuit etching process according to claim 1, characterized in that: The first step also includes substrate trimming and shaping, cutting the copper-aluminum composite substrate into the full-plate size required for etching.

3. The copper-aluminum composite material circuit etching process according to claim 1, characterized in that: After the second step, a pre-treatment is also included, in which the copper-aluminum composite substrate is subjected to a wet pre-treatment to clean its surface.

4. The copper-aluminum composite material circuit etching process according to claim 3, characterized in that: The pre-treatment also includes coating LDI photosensitive ink, and the LDI photosensitive ink is evenly coated on the copper-aluminum composite substrate after the pre-treatment.

5. The copper-aluminum composite material circuit etching process according to claim 4, characterized in that: Applying LDI photosensitive ink also includes drying and curing. The substrate coated with ink is placed in an oven for drying to remove the solvent and allow the ink to cure to a certain degree.

6. The copper-aluminum composite material circuit etching process according to claim 4, characterized in that: After applying the LDI photosensitive ink, it also includes exposure and development. Ultraviolet rays are used to expose the copper-aluminum composite substrate coated with the LDI photosensitive ink. After the exposure, the unexposed part of the photosensitive material is dissolved and removed under the action of the developer, thereby exposing the etched circuit.

7. The copper-aluminum composite material circuit etching process according to claim 1, characterized in that: After the fourth step, the film stripping process is also included, in which the LDI photosensitive ink on the surface of the copper-aluminum composite substrate is stripped using a film stripping solution.

8. The copper-aluminum composite material circuit etching process according to claim 7, characterized in that: The film stripping solution is a neutral film stripping solution.

9. The copper-aluminum composite material circuit etching process according to claim 1, characterized in that: The ratio of aluminum inhibitor to copper etching solution in the aluminum inhibitor etching solution is 1:

10.

10. The copper-aluminum composite material circuit etching process according to claim 1, characterized in that: The ratio of copper inhibitor to aluminum etching solution in copper inhibitor etching solution is 1:10.

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