Micro-nano electric field sensor and manufacturing method

Micro-nano electric field sensors designed through nanofabrication technology solve the problems of high cost, long cycles and easy introduction of impurities in the preparation process of traditional electric field sensors, and achieve higher resolution, smaller size and higher performance sensors.

CN119716277APending Publication Date: 2025-03-28ELECTRIC POWER RES INST OF GUANGXI POWER GRID CO LTD
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Patent Information

Application Number
CN202411619893.8
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2024-11-13
Publication Date
2025-03-28

AI Technical Summary

Technical Problem

The preparation process of traditional electric field sensors is costly, has a long cycle, and is prone to introduce impurities or defects, which affects performance and stability.

Method used

Nanomanufacturing technology is used to design and manufacture micro-nano electric field sensors, including three electrodes, leads and insulating layers. The conductivity and corrosion resistance are improved through gold wire bonding machine bonding technology, and the electric field independence and signal accuracy are ensured through the insulating layer.

Benefits of technology

It realizes higher resolution and smaller size electric field sensors, reduces manufacturing costs and cycles, improves sensor performance and stability, and is suitable for high-precision and integrated applications.

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Abstract

The invention discloses a micro-nano electric field sensor, which comprises three electrodes including a cathode, an extraction electrode and a collector, the three electrodes are connected with an external control circuit through leads, and an insulating layer is arranged among the cathode, the extraction electrode and the collector and is used for separating the three electrodes so as to ensure the independence of an electric field and the accuracy of a signal. By means of the advanced nanometer manufacturing technology, the problems that in the traditional electric field sensor manufacturing process, cost is high, the period is long, and doping is prone to occurring can be solved, the performance of the electric field sensor can be effectively improved, the reliability and stability of the electric field sensor are improved, and the device meets the increasing technical requirements for miniaturization and integration.
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